Mold apparatus

Abstract

To provide a technique capable of accurately measuring the surface temperature of a molded article made of a resin.SOLUTION: The mold device 1 includes a mold 2 having a molding space S into which a resin is injection-supplied and a first through-hole 16 penetrating between the molding space S and the outside, a radiation thermometer 4 having a light receiving surface 20a provided in the first through-hole 16 so as to face the molding space S side, and a metallic thin film member 30 provided in an opening portion 16a of the first through-hole 16 opened to the molding space S. The metallic thin film member 30 has a first surface 30a facing the forming space S and a second surface 30a opposite to the first surface 20a and facing the light receiving surface 30b.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mold apparatus. [Background technology]

[0002] Patent Document 1 discloses a temperature sensor pin provided in a mold. The temperature sensor pin is inserted into a through-hole in the mold and is used to measure the temperature of an object to be measured within the mold. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-113738 Summary of the Invention [Problem to be solved by the invention]

[0004] The sensor pin is inserted into a through hole provided in the mold and receives infrared light emitted from an object to be measured inside the mold. The sensor pin has a light-transmitting body and an optical fiber provided at the tip of the sensor pin. Infrared light from the object to be measured passes through the light-transmitting body and is guided to the outside of the mold by the optical fiber. In this way, the sensor pin receives infrared light emitted from the object to be measured.

[0005] Here, when the object to be measured is a resin, the infrared light emitted from the molded product made from the resin is affected by the light transmittance of the resin, so it may be difficult to accurately measure the temperature of the molded product surface (the interface between the mold and the molded product). Therefore, a method is desired that can measure the temperature of the surface of a molded resin product with high accuracy. [Means for solving the problem]

[0006] The mold device according to one embodiment includes a mold having a molding space into which a resin is injected and a through hole that passes between the molding space and the outside, a radiation thermometer having a light-receiving surface provided within the through hole so as to face the molding space, and a metal thin film member provided at an opening of the through hole that opens into the molding space. The metal thin film member has a first surface facing the molding space and a second surface opposite the first surface and facing the light-receiving surface. [Effects of the Invention]

[0007] According to the present disclosure, the temperature of the surface of a molded article made of resin can be measured with high accuracy. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a mold device according to a first embodiment. [Figure 2] FIG. 2 is a plan view of the main part of the mold mating surface of the second mold part. [Figure 3] FIG. 3 is a plan view showing a main part of the first inner surface. [Figure 4] FIG. 4 is a graph schematically showing the temperature measurement value of the first radiation thermometer and the pressure measurement value of the pressure sensor. [Figure 5] FIG. 5 is a cross-sectional view of a mold device according to the second embodiment. [Figure 6] FIG. 6 is a plan view of the main part of the mold mating surface of the second mold part of the test mold device. [Figure 7] Figure 7 shows the measured temperature values ​​when injection molding was performed using Resin 1, where Figure 7(a) shows the measured temperature values ​​when injection molding was performed using a comparative mold device, and Figure 7(b) shows the measured temperature values ​​when injection molding was performed using a test mold device. [Figure 8] Figure 8 shows the measured temperature values ​​when injection molding was performed using resin 2, where Figure 8(a) shows the measured temperature values ​​when injection molding was performed using a comparative mold device, and Figure 8(b) shows the measured temperature values ​​when injection molding was performed using a test mold device. DETAILED DESCRIPTION OF THE INVENTION

[0009] First, the contents of the embodiment will be listed and explained. [Outline of the embodiment] (1) A mold apparatus according to an embodiment includes a mold having a molding space into which a resin is injected and a through-hole penetrating between the molding space and the outside, a radiation thermometer having a light-receiving surface provided within the through-hole so as to face the molding space, and a metal thin film member provided at an opening of the through-hole that opens into the molding space. The metal thin film member has a first surface facing the molding space and a second surface opposite the first surface and facing the light-receiving surface. According to the above configuration, the first surface of the metal thin film member faces the molding space, so the metal thin film member is heated to a temperature similar to that of the molded product surface or mold in the molding space. The light-receiving surface of the radiation thermometer faces the second surface of the metal thin film member. Therefore, the radiation thermometer can measure the temperature of the metal thin film member as the temperature of the molded product surface or mold. As a result, the temperature of the surface of the molded product can be measured with high accuracy without being affected by the transmittance of the resin.

[0010] (2) In the mold device of (1) above, if a pressure sensor having a sensor surface for detecting the pressure acting on the inner surface of the molding space is further provided, the position of the sensor surface may be the same as or a nearby position to the position of the through hole in the flow direction of the resin within the molding space. In this case, the pressure detected by the pressure sensor can be considered as pressure from the resin acting on the light receiving surface. The pressure detected by the pressure sensor indicates the state of the resin in the molding space. As a result, the temperature measurement results obtained by the radiation thermometer and the state of the resin can be correlated with each other.

[0011] (3) In the mold device of (2) above, when the inner surface includes a first inner surface and a second inner surface opposite to the first inner surface, and the through hole is provided on the first inner surface, the sensor surface may be provided on the second inner surface. In this case, the position of the sensor surface when the first inner surface and the second inner surface are viewed from above can be made to coincide with the position of the through-hole. As a result, the pressure detected by the pressure sensor is a value that can be regarded as pressure from the resin acting on the light receiving surface.

[0012] (4) In any one of the mold devices (1) to (3) above, the radiation thermometer may include an optical fiber that is inserted into the through hole and guides the light received by the light-receiving surface to the outside of the mold, and a main body that determines the temperature based on the light guided by the optical fiber.

[0013] [Details of the embodiment] Preferred embodiments will now be described with reference to the drawings.

[0014] [Regarding the first embodiment] FIG. 1 is a cross-sectional view showing an example of a mold device according to a first embodiment. The mold device 1 has a function of forming a molded product made of resin by injection molding. The mold device 1 includes a mold 2 , a first radiation thermometer 4 , and a pressure sensor 6 .

[0015] The mold 2 is made of steel. The mold 2 has a molding space S. The molding space S is a space in which a molded product is formed. Resin is injected into the molding space S. The molded product is formed by the resin injected into the molding space S. The mold 2 has a first mold portion 2a and a second mold portion 2b. A molding space S is provided between the first mold portion 2a and the second mold portion 2b.

[0016] In the following description, three mutually orthogonal directions in each drawing are defined as the X direction, Y direction, and Z direction. The first side of the X direction is defined as the X1 direction, and the second side of the X direction is defined as the X2 direction. The first side of the Y direction is defined as the Y1 direction, and the second side of the Y direction is defined as the Y2 direction. The first side of the Z direction is defined as the Z1 direction, and the second side of the Z direction is defined as the Z2 direction. In this embodiment, the mating surfaces of the first mold part 2a and the second mold part 2b are along the XY plane. The second mold portion 2b is fixed, and the first mold portion 2a is movable, so that the first mold portion 2a is movable in the Z direction relative to the fixed second mold portion 2b.

[0017] The mating surface 2b1 of the second mold part 2b has an abutting surface 8 and a cavity 10. The abutting surface 8 is a surface that abuts against the mating surface of the first mold part 2a. The cavity 10 is a portion that is recessed in the Z2 direction relative to the abutting surface 8. The cavity 10 forms a molding space S together with the mating surface of the first mold part 2a.

[0018] FIG. 2 is a plan view of the main part of the mold mating surface 2b1 of the second mold part 2b. In Figure 2, the cavity 10 has an elongated shape extending along the X direction. The cavity 10 has a first wide portion 10a, a second wide portion 10b, and a narrow portion 10c. The first wide portion 10a and the second wide portion 10b are aligned along the X direction. The narrow portion 10c has a groove shape extending along the X direction. The narrow portion 10c connects the first wide portion 10a and the second wide portion 10b. The molded product formed by the mold 2 is a strip-like, elongated member having the outline of the cavity 10 shown in FIG.

[0019] The mold mating surface 2b1 further has a gate portion 12 and a runner portion 14. The gate portion 12 and the runner portion 14, together with the mold mating surface of the first mold part 2a, form a gate and a runner. An injection molding machine (not shown) supplies resin to a runner (runner portion 14) through a sprue (not shown). The resin passes through the runner and then through a gate (gate portion 12) to be supplied to the molding space S. Therefore, the resin supplied to the molding space S (cavity 10) flows from the first wide portion 10a side toward the second wide portion 10b side. In other words, the flow direction of the resin in the molding space S is the X1 direction. The resin flows through the first wide portion 10a, the narrow portion 10c, and the second wide portion 10b in this order, and is filled into the molding space S.

[0020] FIG. 1 shows a cross section of the mold 2 taken along the YZ plane including the line AA in FIG. As shown in FIG. 1, the first radiation thermometer 4 and the pressure sensor 6 are provided in the second wide portion 10b of the second mold portion 2b. The second mold portion 2b has a first through hole 16 and a second through hole 18. The first through hole 16 and the second through hole 18 are cylindrical holes that communicate between the molding space S and the outside of the mold 2.

[0021] The first through hole 16 and the second through hole 18 penetrate the second mold part 2b along the Z direction. The first through hole 16 and the second through hole 18 are aligned in the Y direction. An opening 16a on the Z1 direction side of the first through hole 16 opens to the first inner surface 11. An opening 18a on the Z1 direction side of the second through hole 18 also opens to the first inner surface 11. The first inner surface 11 is an inner surface of the cavity 10 that is parallel to the XY plane in the second wide portion 10b. Therefore, the first inner surface 11 faces the molding space S. The opening 16a is provided in the center in the Y direction of the first inner surface 11. The opening 18a is provided on the Y1 direction side of the opening 16a.

[0022] The pressure sensor 6 has a sensor portion 6a and an output device 6b. The sensor portion 6a is provided inside the second through-hole 18. The sensor portion 6a covers the opening 18a of the second through-hole 18. The sensor portion 6a has a sensor surface 6a1 facing the molding space S. The sensor portion 6a detects the pressure acting on the sensor surface 6a1 and provides an output indicating the detected result to the output device 6b. The sensor surface 6a1 and the first inner surface 11 are flush with each other. The sensor surface 6a1 faces the molding space S. The position of the sensor surface 6a1 is aligned in the Y direction with respect to the first through-hole 16. As described above, the flow direction of the resin in the molding space S is the X1 direction. Therefore, the position of the sensor surface 6a1 is the same as or close to the position of the first through-hole 16 in the flow direction of the resin in the molding space S. The output device 6b determines and outputs the pressure based on the detection result given by the sensor section 6a.

[0023] The first radiation thermometer 4 has a light receiving part 4a and a main body part 4b. The light receiving part 4a is provided inside the first through-hole 16. The light receiving unit 4a has a window cover 20 and an optical fiber 22. The window cover 20 is a disk-shaped member provided inside the first through-hole 16. The window cover 20 is made of a material that can transmit infrared light. An example of a material that can transmit infrared light is sapphire glass. The window cover 20 covers the opening 16a of the first through-hole 16.

[0024] The optical fiber 22 is inserted into the first through hole 16. A first end 22a of the optical fiber 22 is connected to the window cover 20. The first end 22a is one of both ends of the optical fiber 22 that is located inside the first through hole 16. A second end 22b of the optical fiber 22 is connected to the main body 4b. The second end 22b is the end opposite to the first end 22a. The light receiving section 4a receives light through a light receiving surface 20a of the window cover 20. The light receiving surface 20a and the first inner surface 11 are flush with each other. The light received by the light receiving surface 20a is guided by the optical fiber 22 to the main body 4b. The main body 4b determines and outputs the temperature based on the received light.

[0025] The mold device 1 further includes a metal thin film member 30. The metal thin film member 30 is provided at the opening 16a of the first through-hole 16. The metal thin film member 30 is provided along the first inner surface 11. 3 is a plan view showing a main part of the first inner surface 11. FIG. 3 shows a metal thin film member 30 provided on the first inner surface 11. As shown in FIG. 3, the metal thin film member 30 is a member having a circular outline. The metal thin film member 30 is a thin film member made of, for example, stainless steel. The thickness of the metal thin film member 30 is several microns. 3 and 1, the metal thin film member 30 has a first surface 30a and a second surface 30b. The first surface 30a faces the molding space S. The second surface 30b is the surface opposite to the first surface 30a. The second surface 30b faces the light-receiving surface 20a.

[0026] The outer diameter of the metal thin film member 30 is larger than the inner diameter of the first through hole 16. The center of the metal thin film member 30 coincides with the center of the first through hole 16. Therefore, the second surface 30b has a surface portion 30b1 facing the first inner surface 11 and a surface portion 30b2 facing the light receiving surface 20a. The surface portion 30b1 is located on the periphery of the second surface 30b and faces the periphery of the opening 16a in the first inner surface 11.

[0027] An adhesive layer is provided between the surface portion 30b1 and the first inner surface 11. The metal thin film member 30 is fixed to the first inner surface 11 by this adhesive layer so as to close the first through-hole 16. Furthermore, the surface portion 30b2 abuts against the light receiving surface 20a. Therefore, the light receiving portion 4a receives the light emitted from the second surface 30b of the metal thin film member 30.

[0028] [Temperature measurement using mold device 1] The mold device 1 can measure the temperature with the first radiation thermometer 4 and can also measure the pressure acting on the first inner surface 11 with the pressure sensor 6 during the process of injection molding a molded product. First, the first mold part 2a and the second mold part 2b are clamped together, and measurements by the first radiation thermometer 4 and the pressure sensor 6 are started.

[0029] Next, the resin is supplied to the sprue, and the resin passes through the runner and the gate and is supplied into the molding space S. FIG. 4 is a graph schematically showing the temperature measurement value of the first radiation thermometer 4 and the pressure measurement value of the pressure sensor 6. In FIG. 4, the upper part shows the temperature measurement value of the first radiation thermometer 4. In the upper diagram, the vertical axis represents the temperature measurement value, and the horizontal axis represents time. In the upper diagram of FIG. 4, graph g1 is a graph showing the temperature measurement value of the first radiation thermometer 4 of this embodiment, and graph g10 is a graph showing the temperature measurement value of the first radiation thermometer 4 measured when only the metal thin film member 30 is removed from the configuration of this embodiment. The lower part of Fig. 4 is a graph showing the pressure measurement values ​​of the pressure sensor 6. In the lower graph, the vertical axis represents pressure and the horizontal axis represents time. In Fig. 4, the pressure measurement values ​​of the pressure sensor 6 are shown by graph g2. The horizontal axis in the upper part corresponds to the horizontal axis in the lower part.

[0030] 4, before time T1, the pressure sensor 6 detects the pressure of the atmosphere in contact with the sensor surface 6a1. Therefore, graph g2 shows that the resin has not reached the pressure sensor 6 before time T1. The temperature measured by the first radiation thermometer 4 before time T1 represents the temperature of the mold 2.

[0031] After time T1 has passed, the pressure measurement value measured by the pressure sensor 6 starts to rise. The start of the rise in the pressure measurement value indicates that the resin has reached the sensor surface 6a1. Furthermore, after time T1 has passed, the temperature measured by the first radiation thermometer 4 also begins to rise. The start of the rise in the temperature measurement value also indicates that the resin has reached the sensor surface 6a1 in the molding space S.

[0032] Then, at time T2, the measured pressure value reaches its maximum value. At time T2, the injection molding machine stops filling the molding space S with resin. From time T2 until time T3, the state of the injection molding machine and mold device 1 is in a pressure holding state. Time T2 is the boundary time between filling and pressure holding. From time T2 to time T3, the temperature of the molded part decreases and the measured pressure gradually decreases as the molded part shrinks. At time T3, the molded product shrinks, causing the surface of the molded product to separate from the first inner surface 11. In this embodiment, the mold device 1 is designed so that when the surface of the molded product separates from the first inner surface 11, the temperature of the surface of the molded product is approximately the same as the temperature of the mold. When the surface of the molded product separates from the first inner surface 11, the pressure sensor 6 no longer detects the pressure applied to the resin, and instead measures the atmospheric pressure.

[0033] In this way, the start of the increase in the pressure measurement value indicates that the flowing resin has come into contact with the sensor surface 6a1. Thereafter, the return of the pressure measurement value to the value at which the increase began indicates that the resin is no longer in contact with the sensor surface 6a1. That is, the pressure measurement value indicates whether or not the resin is in contact with the sensor surface 6a1. When the molded product is formed, the pressure measurement value of the pressure sensor 6 indicates that the resin is in contact with the first inner surface 11 from time T1 to time T3.

[0034] As described above, after time T1, a sudden rise in the measured temperature is observed in both graph g1 and graph g10. The measured temperature quickly reaches a maximum value. The measured temperature values ​​shown in graph g1 decrease from a maximum value over time. Shortly after time T2, the measured temperature values ​​in graph g1 converge to a constant value. The measured temperature values ​​converge to approximately the same temperature as the temperature of the mold before time T1. This shows that the measured temperature values ​​in graph g1 represent a temperature closer to the surface temperature of the molded product. This is because, between time T1 and time T3, the surface of the molded product is in contact with the first inner surface 11, and therefore the temperature of the surface of the molded product, which is higher than the temperature of the mold 2, is thought to affect the temperature of the small-volume metal thin film member 30.

[0035] On the other hand, the measured temperature value shown by graph g10 gradually decreases from its maximum value between time T2 and time T3. This is because the first radiation thermometer 4 receives radiant light emitted from inside the molded product, causing the measured temperature value shown by graph g10 to be higher than the surface temperature and the decrease in the measured temperature to be gradual. The heat inside the molded product is not easily transferred to the surrounding resin, and the temperature decrease is gradual because the mold 2 is not in direct contact with the mold 2, which is a good thermal conductor. Thus, the temperature measurement values ​​shown in graph g10, which were measured without using the metal thin film member 30, do not accurately represent the surface temperature of the molded product.

[0036] In contrast, according to this embodiment, which shows the measured temperature values ​​indicated by graph g1, the first surface 30a of the metal thin film member 30 faces the molding space S. The metal thin film member 30 has good thermal conductivity and is quickly heated to a temperature similar to that of the molded product surface or the mold 2 in the molding space S. The light-receiving surface 20a of the first radiation thermometer 4 faces the second surface 30b of the metal thin film member 30. Therefore, the first radiation thermometer 4 can measure the temperature of the metal thin film member 30 by regarding it as the temperature of the molded product surface (the interface between the mold 2 and the molded product) or the mold 2. As a result, the temperature of the surface of the molded product can be measured with higher accuracy without being affected by the transmittance of the resin.

[0037] The mold apparatus 1 of this embodiment also includes a pressure sensor 6. The position of a sensor surface 6a1 of the pressure sensor 6 is the same as the position of the first through-hole 16 in the flow direction of the resin in the molding space S. As a result, the measured value of the pressure detected by the pressure sensor 6 can be regarded as the pressure from the resin acting on the light receiving surface 20a. Furthermore, the measured value of the pressure detected by the pressure sensor 6 represents the state of the resin, as described above. As a result, the temperature measurement value by the first radiation thermometer 4 and the state of the resin can be correlated with each other.

[0038] [Regarding the second embodiment] FIG. 5 is a cross-sectional view of a mold device 1 according to the second embodiment. This embodiment differs from the first embodiment in that a sensor portion 6a of a pressure sensor 6 is provided in a first mold portion 2a. The first mold part 2a of this embodiment has a third through hole 38. The third through hole 38 is a cylindrical hole that connects the molding space S with the outside of the mold 2.

[0039] The third through-hole 38 penetrates the first mold portion 2a along the Z direction. An opening 38a on the Z2 direction side of the third through hole 38 opens to the second inner surface 36. The second inner surface 36 is the surface of the mold mating surface 2a1 of the first mold part 2a that faces the molding space S. The second inner surface 36 faces the first inner surface 11. The center of the third through hole 38 coincides with the center of the first through hole 16. Therefore, the position of the opening 38a coincides with the position of the opening 16a of the first through hole 16 when the first inner surface 11 and the second inner surface 36 are viewed in plan.

[0040] The sensor portion 6a of the pressure sensor 6 is provided inside the third through-hole 38. The sensor portion 6a closes the opening 38a of the third through-hole 38. A sensor surface 6a1 of the sensor portion 6a and the second inner surface 36 are flush with each other. The sensor surface 6a1 faces the molding space S.

[0041] According to this embodiment, the position of the sensor surface 6a1 when the first inner surface 11 and the second inner surface 36 are viewed from above coincides with the position of the first through-hole 16 (light receiving surface 20a). As a result, the measured value of the pressure detected by the pressure sensor 6 is a value that can be regarded as pressure from the resin acting on the light receiving surface 20a.

[0042] In addition, the first mold portion 2a in this embodiment is movable, so that the sensor portion 6a can move in the Z direction together with the first mold portion 2a. Here, let us assume that the light receiving unit 4a of the first radiation thermometer 4 is provided in the first mold part 2a. In this case, since the light receiving unit 4a and the main body part 4b are connected by the optical fiber 22, there is a risk that the relative movement of the light receiving unit 4a with respect to the main body part 4b may be restricted by the optical fiber 22. The sensor unit 6a and the output device 6b are electrically connected by a lead wire etc. Because the lead wire is easily deformed, the mold device 1 of this embodiment prevents the sensor unit 6a from being restricted in its relative movement with respect to the output device 6b by providing the sensor unit 6a in the first mold unit 2a.

[0043] [About verification testing] Next, a verification test conducted on the mold apparatus 1 of this embodiment will be described. For the test, a test mold apparatus and a comparative mold apparatus were used, each having a radiation thermometer provided in the first wide portion 10a of the second mold portion 2b of the mold apparatus 1 of the above embodiment. FIG. 6 is a plan view of the main part of the mold mating surface 2b1 of the second mold part 2b of the test mold device. A second radiation thermometer 40 is provided in the first wide portion 10a of the experimental mold apparatus 100. The experimental mold apparatus 100 has the same configuration as the mold apparatus 1 described above, except that the second radiation thermometer 40 is added. The second radiation thermometer 40 has the same configuration as the first radiation thermometer 4 provided in the second wide portion 10b. However, the experimental mold device 100 does not have a metal thin film member provided at the opening of the through-hole into which the second radiation thermometer is inserted. Therefore, the light-receiving surface 40a of the second radiation thermometer 40 is exposed to the molding space S. The light-receiving surface 40a of the second radiation thermometer 40 receives infrared light radiated from within the molding space S.

[0044] The comparative mold apparatus differs from the test mold apparatus 100 only in that it does not have the metal thin film member 30 that abuts against the light receiving surface 20a of the first radiation thermometer 4 of the test mold apparatus 100 and is provided at the opening 16a of the first through hole 16. In other words, the comparative mold apparatus does not have any metal thin film member. Therefore, the light receiving surfaces 20a, 40a of the radiation thermometers 4, 40 in the comparative mold apparatus receive infrared light emitted from within the molding space S.

[0045] The following two types of resins were used in the verification test. Resin 1: Polyamide 66 (PA66, uncolored) Resin 2: Polyamide 66 containing 50% by mass of glass fiber relative to the mass of polyamide 66 (PA66+GF50)

[0046] The external color of Resin 2 is black. Therefore, the transmittance of Resin 2 is lower than that of Resin 1. Resin 1 and Resin 2 were each injection molded using an injection molding machine, a test mold device, and a comparative mold device, and temperature measurements were obtained using first radiation thermometer 4 and second radiation thermometer 40. The injection molding conditions using the injection molding machine and the test mold device and the comparative mold device were the same for all injection molding experiments.

[0047] Fig. 7 shows the measured temperature values ​​when injection molding was performed using Resin 1, with Fig. 7(a) showing the measured temperature values ​​when injection molding was performed using the comparative mold apparatus, and Fig. 7(b) showing the measured temperature values ​​when injection molding was performed using the test mold apparatus 100. The vertical axis of Fig. 7(a) and Fig. 7(b) shows the measured temperature values, and the horizontal axis shows time. 7(a) and 7(b) show the filling period and the pressure holding period. The filling period is the time from when the injection molding machine starts to flow the flowing resin to when the injection molding machine starts to apply pressure to the resin filled in mold apparatus 1. The pressure holding period is the time from when the injection molding machine starts to apply pressure to the resin filled in mold apparatus 1 to when the surface of the molded product, which is the resin filled in mold apparatus 1, separates from first inner surface 11. The boundary between the filling period and the pressure holding period was obtained from the pressure measured by the pressure sensor 6. The timing when the pressure measured by the pressure sensor 6 reached its maximum was determined as the boundary between the filling period and the pressure holding period.

[0048] Graph R1 in Figure 7(a) is a graph showing the temperature measurement value of the second radiation thermometer 40 of the comparative mold device, and graph R2 is a graph showing the temperature measurement value of the first radiation thermometer 4 of the comparative mold device. Graph R3 in Figure 7(b) is a graph showing the temperature measurement value of the second radiation thermometer 40 of the test mold device 100, and graph E1 is a graph showing the temperature measurement value of the first radiation thermometer 4 of the test mold device 100. Therefore, in FIG. 7, only the graph E1 shows the measured temperature value through the metal thin film member 30.

[0049] In Figure 7(a), graphs R1 and R2 show a sudden rise in the mold temperature measurement from the point at which the resin is thought to have arrived, and then the temperature measurement gradually decreases during the pressure holding period. Graphs R1 and R2 have almost the same profile, but the measured temperature value of graph R1 starts to rise earlier than the measured temperature value of graph R2. This is because graph R1 is the measured temperature value of second radiation thermometer 40, which is located upstream of first radiation thermometer 4 in the resin flow.

[0050] Looking at Fig. 7(b), graph R3 has almost the same profile as graph R1 in Fig. 7(a). Graphs R1 and R3 are both temperature measurements taken by second radiation thermometer 40, and the conditions for resin flow and the position of second radiation thermometer 40 are the same. For this reason, graphs R1 and R3 have almost the same profile.

[0051] In Figure 7(b), graph E1 also shows a sudden rise in the mold temperature measurement at the point where the resin appears to have reached the mold temperature. The temperature measurement in graph E1 then reaches a maximum value and then suddenly drops. The change during the dwell period shows the mold temperature dropping to a temperature slightly higher than the mold temperature before the sudden rise in temperature measurement began, and then gradually decreasing. Furthermore, the maximum value of the temperature measurement value during the rise in graph E1 is very small compared to the maximum values ​​of graphs R1 to R3. The sudden drop in the temperature measurement value in graph E1 occurs because the surface of the molded product is cooled by mold 2. In other words, the sudden drop in the temperature measurement value in graph E1 indicates that graph E1 is the result of measuring the temperature of the molded product surface (the interface between the mold and the molded product).

[0052] Thus, the change over time in the measured temperature values ​​of graph E1 is completely different from the change over time in the measured temperature values ​​of graphs R1 to R3. The reason why the measured temperature does not decrease quickly after rising from the measured mold temperature, as shown in graphs R1 to R3, is because the first radiation thermometer 4 and the second radiation thermometer 40 receive radiant light from inside the molded product. Temperature measurements using the first radiation thermometer 4 and the second radiation thermometer 40 without using the metal thin film member 30 cannot accurately measure the surface temperature of the molded product. In contrast, the mold device of this embodiment, which shows the temperature measurement values ​​seen in graph E1, can accurately measure the temperature of the molded product surface without being affected by the transmittance of the resin by measuring the temperature of the resin flowing through the metal thin film member 30.

[0053] Figure 8 shows the measured temperature values ​​when injection molding was performed using Resin 2, with Figure 8(a) showing the measured temperature values ​​when injection molding was performed using the comparative mold apparatus, and Figure 8(b) showing the measured temperature values ​​when injection molding was performed using the test mold apparatus 100. The vertical axis of Figure 8(a) and Figure 8(b) shows the measured temperature values, and the horizontal axis shows time.

[0054] Graph R4 in Figure 8(a) is a graph showing the temperature measurement values ​​of the second radiation thermometer 40 of the comparative mold device, and graph R5 is a graph showing the temperature measurement values ​​of the first radiation thermometer 4 of the comparative mold device. Graph R6 in Figure 8(b) is a graph showing the temperature measurement value of the second radiation thermometer 40 of the test mold device 100, and graph E2 is a graph showing the temperature measurement value of the first radiation thermometer 4 of the test mold device 100. Therefore, in FIG. 8, only graph E2 shows the measured temperature value through the metal thin film member 30.

[0055] In Figure 8(a), graphs R4 and R5 show the start of a rapid rise in the mold temperature measurement at the point when the resin is thought to have reached the mold. The temperature then drops relatively rapidly to about half of the previous temperature value, followed by a gradual drop during the subsequent holding pressure period. Graphs R4 and R5 differ from graphs R1 to R3 in Figure 7 in that the temperature measurement drops relatively rapidly from the maximum value. This is thought to be because Resin 2 is black and has lower transmittance than Resin 1, so there is less radiation from areas inside the molded product that are relatively far from the surface, and the radiation thermometer receives radiation from areas relatively close to the surface. Graphs R4 and R5 have almost the same profile, but as in the case of FIG. 7, the timing of the rise in the measured temperature value of graph R4 is earlier than the timing of the rise in the measured temperature value of graph R5.

[0056] Looking at Fig. 8(b), graph R6 has almost the same profile as graph R4 in Fig. 8(a). This is because graphs R4 and R6 are both temperature measurements taken by second radiation thermometer 40, and the conditions for the resin flow and the position of second radiation thermometer 40 are the same.

[0057] In Figure 8(b), graph E2 also shows a sudden rise in the mold temperature measurement at the point where the resin appears to have reached the mold temperature. The temperature measurement in graph E2 then reaches a maximum value and then suddenly drops. The change in the holding pressure period shows the mold temperature dropping to a temperature slightly higher than the mold temperature before the sudden rise in temperature measurement began, and then the temperature measurement gradually drops. Furthermore, the maximum value of the rising temperature measurement value in graph E2 is very small compared to the maximum values ​​in graphs R4 to R6. Thus, the embodiment of FIG. 8 also provides results similar to those of the embodiment of FIG.

[0058] From the above verification test results, it is clear that measuring the temperature through the metal thin film member 30 allows the temperature of the molded product surface (the interface between the mold and the molded product) to be measured with high accuracy without being affected by the transmittance of the resin.

[0059] 〔others〕 The embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is not limited to the above-described embodiments, but includes all modifications within the scope of equivalents to the configurations described in the claims. [Explanation of symbols]

[0060] 1. Mold equipment 2. Mold 4 1st radiation thermometer 6 Pressure Sensors 6a Sensor section 6a1 Sensor surface 11 First inner surface 16 First through hole 16a opening 20a Photosensitive surface 22 Optical Fiber 30 Metallic thin film components 30a 1st page 30b 2nd side 36 Second inner surface S molding space

Claims

1. a mold having a molding space into which a resin is injected and a through hole extending between the molding space and the outside; a radiation thermometer having a light receiving surface provided in the through hole so as to face the molding space; a metal thin film member provided at an opening of the through hole that opens into the molding space, The metal thin film member has a first surface facing the molding space and a second surface opposite the first surface and facing the light receiving surface. Mold equipment.

2. a pressure sensor having a sensor surface for detecting a pressure acting on an inner surface of the molding space; The position of the sensor surface is the same as or close to the position of the through hole in the flow direction of the resin in the molding space. The mold apparatus according to claim 1 .

3. the inner surface includes a first inner surface and a second inner surface opposite to the first inner surface, the through hole is provided in the first inner surface, The sensor surface is provided on the second inner surface. The mold apparatus according to claim 2 .

4. The radiation thermometer is an optical fiber that is inserted into the through hole and guides the light received by the light receiving surface to the outside of the mold; a main body that determines a temperature based on the light guided by the optical fiber; The mold apparatus according to claim 1 .

Images