Sensor device and method for manufacturing sensor device

Abstract

To provide a sensor device and a method of manufacturing the sensor device.SOLUTION: At least one double-sided printed circuit board (2), wherein the circuit board (2) has an upper surface (2a) and a lower surface (2b), and at least one first solder pad (3) and at least one second solder pad (4) are respectively disposed on the upper surface (2a) and the lower surface (2b). A sensor arrangement (1) for measuring a temperature is described, comprising at least one double-sided printed circuit board (2), at least one sensor component (6) which is mechanically and electrically connected directly to the 2a (top side) of the circuit board (2), and an insulation (5) which completely encloses at least the sensor component (6) on the 2a (top side) of the circuit board (2). In addition, a method for producing a sensor device is described.SELECTED DRAWING: Figure 1b

Description

[Technical Field]

[0001] The present invention relates to a sensor arrangement, preferably a temperature sensor arrangement. The present invention further relates to a method for manufacturing a sensor arrangement, preferably a plurality of sensor arrangements. Summary of the Invention

[0002] The object of the present invention is to describe a sensor device with improved properties.

[0003] This object is solved by a sensor device and a method for manufacturing a plurality of sensor devices according to the independent claims.

[0004] According to one aspect, a sensor device is described. The sensor device is constructed and arranged to measure temperature. The sensor device is a temperature sensor device. The sensor device is particularly configured to measure the temperature of a surface.

[0005] The sensor device includes at least one double-sided printed circuit board. The circuit board can have one layer or multiple layers connected to each other. Thus, the circuit board has a varying thickness.

[0006] The circuit board can have multiple shapes, for example, rectangular, square, or block-shaped. The shape of the circuit board, and therefore the shape of the entire sensor device, can be adapted to specific customer requirements. The same applies to the thickness of the circuit board. Thus, a very user-friendly sensor device is provided that is flexible in use.

[0007] The circuit board has a top side and a bottom side. The bottom side is the side of the circuit board that will be electrically connected to a user application. At least one first solder pad and at least one second solder pad are disposed on the bottom side. Furthermore, at least one first solder pad and at least one second solder pad are disposed on the top side. The solder pads on the top side are electrically connected to the solder pads on the bottom side by vias.

[0008] The sensor arrangement further includes at least one sensor device having a temperature dependent electrical resistance, which may include an SMD (surface mounted device) NTC (negative temperature coefficient) or chip NTC component.

[0009] The sensor device has first and second external electrodes that are constructed and arranged to be in direct electrical and mechanical communication with the first and second solder pads on the top surface of the circuit board, and the first and second external electrodes are disposed on an outer surface of the sensor device, for example, on the bottom and / or side surfaces of the sensor device.

[0010] The sensor device is mechanically and electrically connected directly to the top surface of the circuit board. In particular, the sensor device / external electrodes of the sensor device are directly connected to first and second solder pads on the top surface of the circuit board. The sensor device can be soldered, press-fit, or wire-bonded to the top surface of the circuit board.

[0011] The term "directly connected" means that there are no further / intermediate components, such as metal pins / additional metal pads / terminals, between the sensor device (especially its external electrodes) and the circuit board (especially its solder pads) to establish a connection. Therefore, due to the specific structure of the sensor device, at least one connection (e.g., a connection between the sensor device and an intermediate component and / or a connection between the intermediate component and the circuit board) can be reduced compared to the prior art. Therefore, a cost-effective and compact sensor device is provided.

[0012] The sensor device further comprises an insulator disposed on a top surface of the sensor device, the sensor device being configured to measure the temperature of a surface in (direct) contact with the insulator.

[0013] The material of the insulator may comprise an epoxy or plastic material, such as a thermoplastic or insulating adhesive. The insulator protects the sensor arrangement, in particular the sensor device, from external influences.

[0014] The insulator completely covers at least the sensor device on the top surface of the circuit board. The sensor device is overmolded by the insulator. The bottom surface of the sensor device is free of insulator material. By encapsulating the soldered sensor device with the insulator material, the solder joints are not exposed to the environment.

[0015] By using a double-sided printed circuit board on which the SMD NTC or Chip NTC is mounted and protected with epoxy or plastic material as an insulator, a cost optimized solution is provided with the same features and functionality as current state-of-the-art designs.

[0016] According to one embodiment, the insulator completely covers the top surface of the circuit board. In other words, the entire top surface, including the sensor device, is covered by the insulator, not just the sensor device. In this way, the top surface of the sensor device can be better protected from external influences. Furthermore, the contact area of ​​the surface whose temperature is to be measured is larger than if the insulator only covered the sensor device. This can also help to improve the accuracy of the sensor device.

[0017] According to a further aspect, a method for manufacturing a plurality of sensor devices is described. The sensor devices manufactured by this method may correspond to the sensor devices described above. All features described in relation to the sensor devices also apply to this method, and vice versa.

[0018] The method includes the following steps:

[0019] A) A substrate is provided for obtaining a plurality of double-sided printed circuit boards. Each circuit board has a top surface and a bottom surface, and at least one first solder pad and at least one second solder pad are disposed on the top surface and the bottom surface, respectively. The connection from the top surface solder pad to the bottom surface solder pad is a through via. The substrate has a thickness / height that can be adapted to specific customer requirements.

[0020] B) electrically and mechanically connecting a plurality of sensor devices to the top surface, each sensor device being soldered, press-fit, or wire-bonded to first and second solder pads on the top surface of each circuit board;

[0021] Each sensor device may include an SMD NTC or chip NTC component. Each sensor device includes an upper surface and a lower surface, and a first external electrode and a second external electrode are disposed on the lower surface of each sensor device.

[0022] C) Providing an insulating material to form an insulator. The insulating material includes epoxies or plastics such as thermoplastic or insulating adhesives. The choice of material depends on the temperature and thermal property requirements. The insulator completely encases at least each sensor device. In particular, each sensor device is overmolded with the insulating material. Alternatively, the entire top surface of the final (i.e., singulated) circuit board can be completely overmolded with the insulating material.

[0023] D) Dividing the substrate into single parts to obtain a plurality of final sensor devices. In particular, the shaped circuit board is diced / broken at the scoring breaking point into single parts. The shape of the final sensor device / circuit board can be adapted to customer requirements. Thus, for example, rectangular, square or block-shaped circuit boards can be singulated in this step.

[0024] For example, double-sided printed circuit boards, used instead of state-of-the-art connector blocks, are a cost-effective solution and can be directly manufactured in one large sheet. This simplifies processing, thus providing a very effective and cost-effective method.

[0025] By adapting the shape and thickness of the circuit board, and therefore the shape and thickness of the final sensor device, it is possible to provide a sensor device that is very user-friendly and flexibly usable. [Brief explanation of the drawings]

[0026] The drawings described below are not intended to be to scale, rather individual dimensions may be enlarged, reduced, or distorted for better representation.

[0027] Elements that are similar or perform the same function are designated with the same reference numerals.

[0028] [Figure 1a]FIG.

[0029] [Figure 1b] FIG.

[0030] [Figure 2a] FIG. 10 is a perspective view of a sensor device according to a second embodiment during assembly.

[0031] [Figure 2b] 2b shows a perspective view of the sensor device according to FIG. 2a during assembly.

[0032] [Figure 2c] 2a and 2b, a perspective view of the completed sensor device;

[0033] [Figure 3] FIG. 1 is a perspective view of an exemplary sensor device. DETAILED DESCRIPTION OF THE INVENTION

[0034] Figures 1a and 1b show a sensor device 1. The sensor device 1 is configured to measure a temperature, for example the temperature of a surface. The sensor device 1 is a temperature sensor device.

[0035] The sensor device 1 has an upper surface 1a and a lower surface 1b. The lower surface 1b is the surface (side) of the sensor device 1 that will be electrically connected to an external application when the sensor device 1 is finally installed.

[0036] The upper surface 1a is the surface (side) that comes into direct contact with the surface whose temperature will be measured when the sensor device 1 is finally installed.

[0037] The sensor device 1 has a circuit board 2. The circuit board 2 is a double-sided printed circuit board 2. The circuit board 2 has an upper surface 2a and a lower surface 2b. The lower surface 2b of the circuit board 2 is also the lower surface 1b of the sensor device 1. The upper surface 2a of the circuit board 2 is configured and arranged to be directly mechanically and electrically connected to a sensor device 6, in particular a temperature sensor device 6 (see Figures 1b and 3).

[0038] The shape of the circuit board 2 can be changed depending on the customer's implementation situation. In this embodiment, the circuit board 2 has a rectangular shape, but of course, various shapes are possible, such as a square shape, a circular shape, a block shape, etc. The circuit board 2 can have a single layer or multiple layers connected to each other. Therefore, not only the shape of the circuit board 2 but also the thickness of the entire sensor device 1 can be adapted according to the customer's requirements.

[0039] The circuit board 2 has first and second solder pads 3, 4. The first solder pads 3 and the second solder pads 4 are arranged on the top surface 2a for direct electrical and mechanical connection with the sensor device 6. Additionally, the first solder pads 3 and the second solder pads 4 are arranged on the bottom surfaces 1b, 2b for electrical connection between the sensor apparatus 1 and an external application.

[0040] Connection to external applications is made by soldering, wire bonding or pin connection via the solder pads 3, 4. Electrical connections between the solder pads 3, 4 on the top surface 1a and the solder pads 3, 4 on the bottom surfaces 1b, 2b are established by vias (not explicitly shown in the figures).

[0041] The sensor device 6 (see exemplary sensor device 6 in FIGS. 1b and 3) includes an SMD NTC sensor or a chip NTC sensor device. The use of an SMDT NTC sensor device 6 or a chip NTC sensor device 6 depends on the RT curve requirements. The NTC chip sensor device 6 requires additional connection means, such as wire bonding or pin connection, to connect one pole to the other.

[0042] The sensor device 6 has an upper surface 6 a and a lower surface 6 b and opposing side surfaces 6 c. The connecting elements, in particular the external electrodes (first external electrode 7 and second external electrode 8), are arranged on the lower surface 6 b. In alternative embodiments (not explicitly shown), the external electrodes 7, 8 may be arranged, for example, on the opposing side surfaces 6 c or on the upper surface 6 a.

[0043] The first external electrode 7 is directly connected, for example, soldered, press-fitted or wire-bonded, to the first solder pad 3 on the upper surface 2 a of the circuit board 2. The second external electrode 8 is directly connected, for example, soldered, press-fitted or wire-bonded, to the second solder pad 4 on the upper surface 2 a of the circuit board 2.

[0044] No intermediate components, such as pins / terminals / metal layers, are arranged between the external electrodes 7 , 8 of the sensor device 6 and the solder pads 3 , 4 of the circuit board 2 .

[0045] The sensor device 6 shown in Figures 1b and 6 is only an exemplary embodiment of a sensor device 6 connected to a circuit board 2. Of course, any kind of SMD NTC or chip NTC sensor device is conceivable.

[0046] As can be seen in Figures 1a and 1b, the sensor device 6 is completely surrounded by the insulator 5. The sensor device 6 is overmolded with the material of the insulator 5. The insulator comprises a plastic material or an epoxy.

[0047] 1a and 1b, the insulator 5 also completely covers the top surface 1a of the sensor apparatus 1. In particular, the complete top surface 1a of the sensor apparatus 1, including the sensor device 6, is overmolded by the insulator 5. This means that the sensor device 6 is arranged inside the sensor apparatus 1. In other words, the sensor device 6 is completely integrated into the sensor apparatus 1.

[0048] The sensor device 6 measures the temperature of the surface in contact with the insulator 5 .

[0049] 2a to 2c show a sensor device 1 according to a second embodiment or intermediate states thereof.

[0050] The sensor device 1 comprises a double-sided printed circuit board 2. In this embodiment, the circuit board 2 has a block shape. In particular, it has a greater thickness than the circuit board 2 shown in Figures 1a and 1b. The thickness of the circuit board 2 can be adapted to a particular implementation situation by providing the circuit board 2 with multiple layers, which are connected to each other.

[0051] Again, the circuit board 2 has first and second solder pads 3, 4 on its top surface 2a (FIG. 2a). The sensor device 6 described in relation to FIGS. 1a, 1b and 3 is directly connected to the first and second solder pads 3, 4, for example by soldering, press-fitting or wire bonding (FIG. 2b). No intermediate components, such as metal pins, are disposed between the sensor device 6 and the circuit board 2.

[0052] The sensor apparatus 1 may include an SMD NTC component or a chip NTC component. Furthermore, the sensor device 6 is fully embedded / overmolded by an insulator 5 (FIG. 2c). By encapsulating the soldered sensor device 6, no solder joints are exposed to the environment.

[0053] In this embodiment, the insulator 5 covers only a portion of the top surface 2a of the circuit board 2, as can be seen from Figure 2c. In other words, the top surface 2a of the circuit board 2 remains free of insulating material except in the area where the sensor device 6 will be placed on the circuit board 2.

[0054] In the following, a method for manufacturing a sensor device 1, in particular a plurality of sensor devices 1, is described. Preferably, such a sensor device 1 is manufactured by this method. Therefore, all features described in connection with the sensor device 1 also apply to this method and vice versa.

[0055] The method includes the following steps:

[0056] In a first step A), a substrate is provided. The substrate constitutes the base of a plurality of double-sided printed circuit boards 2 having an upper surface 2a and a lower surface 2b. Each circuit board 2 has a first solder pad 3 and a second solder pad 4 arranged on the upper surface 2a and the lower surface 2b, respectively.

[0057] In a next step B), a plurality of sensor devices 6 are electrically and mechanically connected directly to the top surface 2a, in particular to the first and second solder pads 3, 4 on the top surface 2a of the substrate. The sensor devices 6 are soldered, press-fit or wire-bonded to the solder pads 3, 4 (see FIG. 2a).

[0058] In a next step C), an insulating material, for example plastic or epoxy, is provided to form the insulator 5. The insulator 5 completely encases at least each sensor device 6 (Fig. 2c). In an alternative embodiment, the insulator 5 encases the entire top surface 1a of the final (i.e. separated) sensor apparatus 1 (Figs. 1a, 1b).

[0059] In a final step D), the substrate is separated into single parts in order to obtain a plurality of final sensor devices 1.

[0060] The description of the subject matter disclosed herein is not limited to individual specific embodiments, but rather the features of the individual embodiments can be combined with each other in any way that makes technical sense. [Explanation of symbols]

[0061] 1. Sensor device 1a Top surface 1b Bottom side 2 double-sided printed circuit boards 2a Top surface of the board 2b Bottom of the board 3 First solder pad 4 Second solder pad 5. Insulators 6 Sensor Devices 6a Top of the sensor device 6b Bottom of the sensor device 6c Side of the sensor device 7 First external electrode 8 Second external electrode

Claims

1. 1. A sensor device for measuring temperature comprising: at least one double-sided printed circuit board, the circuit board having a top surface and a bottom surface, at least one first solder pad and at least one second solder pad disposed on the top surface and the bottom surface, respectively; at least one sensor device mechanically and electrically connected directly to the top surface of the circuit board; an insulator completely encasing at least the sensor device on the top surface of the circuit board; having Sensor device.

2. the insulator completely covers the top surface of the circuit board; The sensor device according to claim 1 .

3. the sensor device has a temperature dependent electrical resistance; The sensor device according to claim 1 .

4. the sensor device has first and second external electrodes in direct electrical and mechanical contact with the first and second solder pads on the top surface of the circuit board; The sensor device according to claim 1 .

5. the first external electrode and the second external electrode are disposed on a bottom surface and / or an opposing side surface of the sensor device, and the bottom surface of the sensor device is free of the insulator material; The sensor device according to claim 4 .

6. the first and second solder pads disposed on the lower surface of the circuit board are constructed and arranged to electrically connect the sensor device to an external application; the first and second solder pads disposed on the top surface of the circuit board are constructed and arranged to electrically connect the circuit board with the sensor device. The sensor device according to claim 1 .

7. the sensor device is soldered, press-fit, or wire-bonded directly to the top surface of the circuit board; The sensor device according to claim 1 .

8. the first and second solder pads disposed on the upper surface of the circuit board are electrically connected to the first and second solder pads on the lower surface by vias; The sensor device according to claim 1 .

9. The sensor device includes an SMD NTC or a chip NTC; The sensor device according to claim 1 .

10. The insulator material includes epoxy or plastic. The sensor device according to claim 1 .

11. The geometry of the sensor device can be adapted to specific customer requirements; The sensor device according to claim 1 .

12. 1. A method for manufacturing a plurality of sensor devices, comprising the steps of: A) providing a substrate for a plurality of double-sided printed circuit boards, each of the circuit boards having a top surface and a bottom surface, at least one first solder pad and at least one second solder pad disposed on the top surface and the bottom surface, respectively; B) electrically and mechanically connecting a plurality of sensor devices to the top surface; C) providing an insulating material to form an insulator, the insulator completely enclosing at least each of the sensor devices; D) separating the substrate into single components to obtain a plurality of final sensor devices; A method comprising:

13. In step C), at least each of the sensor devices is overmolded with the insulating material. The method of claim 12.

14. In step C), the top surface of the circuit board is completely overmolded with the insulating material. The method of claim 12.

15. The insulating material includes epoxy or plastic. The method of claim 12.

16. the sensor device is soldered, press-fit, or wire-bonded to the first and second solder pads on the top surface; 16. The method of any one of claims 12 to 15.

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