Catalyzed metal foil and use thereof

Abstract

To provide an improved method, system, and device for easily, efficiently, and inexpensively patterning a catalyst on a substrate to form an electrical circuit, and to provide a method of manufacturing such a circuit therefrom.SOLUTION: Contemplated metal foils have a bottom surface that is preferably roughened to an arithmetic average roughness of at least 0.1 μm and that supports a catalyst material. The metal foil is etchable, is typically aluminum or a derivative thereof, and is less than 500 μm thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalytic material bearing surface of the metal foil is applied to a substrate while being laminated with a thermoset or thermoplastic resin or with an organic material that first coats the catalyzed material. The metal foil is removed to expose the catalytic material and a conductor is plated on the catalytic material.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The field of the invention relates to methods and systems for producing conductive patterns. [Background technology]

[0002] The following description contains information that will be helpful in understanding the present invention. No admission is made that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.

[0003] As competition in the manufacturing of electrical circuits continues to reduce profit margins, improvements in the simplicity, efficiency, and cost-effectiveness of manufacturing protocols are necessary to remain competitive in the market. For example, U.S. Patent No. 6,299,499 to Brummett et al. teaches the use of Mylar film immersed in an electroless plating catalyst solution to thermally transfer the catalyst onto a substrate for electroless deposition. However, transporting pre-immersed Mylar film presents problems, such as the Mylar material degrading over time, creating additional storage stability, transportation, and durability issues. Mylar also has a low melting and decomposition temperature and does not retain its original shape at temperatures above 150°C. This limits the use of this material and technology to thermoplastic materials, which typically have curing temperatures above 150°C. Furthermore, requiring users to immerse Mylar in a catalyst solution is unnecessarily complicated and limits the market user base for the product.

[0004] All publications identified herein are incorporated by reference to the same extent as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference. In the event that a definition or use of a term in an incorporated reference contradicts or contradicts the definition of that term provided herein, the definition of that term provided herein shall apply and the definition of that term in the reference shall not apply.

[0005] Partially addressing durability, U.S. Patent No. 6,269,999 to Ogawa et al. teaches applying electroless plating catalyst cores to metal foils to improve product durability. However, U.S. Patent No. 6,269,999 does not teach, for example, using metal foils as sacrificial transfer media and using such foils to transfer catalysts to substrates for plating. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] U.S. Patent No. 4,006,047 [Patent Document 2] U.S. Patent No. 7,740,936 Summary of the Invention [Problem to be solved by the invention]

[0007] Thus, there remains a need for improved methods, systems, and devices for simply, efficiently, and inexpensively patterning catalysts onto substrates to form electrical circuits, and methods for fabricating such circuits therefrom. [Means for solving the problem]

[0008] The present subject matter provides systems, methods, and devices related to catalyzed metal foils, as well as their uses and devices therefrom. The metal foils have a bottom surface with a catalytic material disposed on at least a portion of the bottom surface of the metal foil, and that portion of the bottom surface is typically roughened, for example, via etching or dendritic growth, or in some embodiments, oxidized, or a combination thereof. The metal foils are etchable or otherwise removable and are preferably composed of aluminum, anodized aluminum, copper, tin, or one of their alloys. The metal foils are preferably less than 500 μm thick, e.g., less than 400 μm, 300 μm, 200 μm, 100 μm, 80 μm, 60 μm, 50 μm, or 10 μm thick. In some embodiments, a portion of the bottom surface (e.g., a portion roughened by dendritic growth, a portion roughened by etching, etc.) has an arithmetic mean roughness (Ra) of at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm.

[0009] In some embodiments, the catalytic material includes a catalyst precursor for at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. Alternatively, or in combination, the catalytic material includes at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh. The catalyzed material is typically deposited as an ink (e.g., as a metal ink, reduced metal ink, thermally reduced metal ink, etc.) utilizing an organometallic precursor such as an organometallic compound, as a layer having a thickness between the atomic radius of the component of the catalyzed material (e.g., the catalyzed metal, such as Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh) and 500 μm. The organometallic compound can be stabilized by chelation or interaction with a counteranion. Alternatively, or in combination, the catalyzed material is arranged as a plurality of particles (e.g., metal ink, reduced metal ink, chemically reduced metal ink, etc.) having an average radius between the atomic radius of the catalyzed material's components (e.g., catalyzed metal, Ag, Au, Pt, Pd, Cu, Ni, Co, Rh, etc.) and 100 nm. In some embodiments, the ink includes several metal particles (of one or more metals) that provide relatively broad applicability of the ink or catalyst precursor, for example, by avoiding unstable catalyst precursor conditions due to high concentrations of precursor in the ink.

[0010] The catalyst layer may also be deposited by sputtering, by evaporation, or by chemical vapor deposition. The present subject matter further contemplates systems and methods for forming electrical circuits, as well as circuits formed therefrom. A method for forming an electrical circuit is contemplated using a metal foil having a surface with a catalytic material. The catalytic material-bearing surface of the metal foil is applied to the surface of a substrate, and the metal foil is laminated to the substrate. The metal foil (preferably an etchable or removable metal foil) is then removed (e.g., by etching) to expose the catalytic material on the surface of the substrate. A first conductor is then electrolessly metal plated onto the exposed catalytic material. Further conductors can be plated (e.g., electrolytically plated), and additional metal foils can be laminated to the conductors and etched as required for the electrical circuit pattern. Metal foils containing such layers are the subject of the present invention, as described below.

[0011] In some embodiments, the surface of the metal foil bearing the catalytic material is coated with a coating layer of either a B-stage (curable) thermosetting resin (e.g., epoxy resin, polyimide precursor, urethane resin, acrylic resin) or a thermoplastic material, or a combination thereof, referred to herein as a resin-coated catalyst foil (RCCF™). In some embodiments, the coating layer is a lamination material (e.g., a conventional resin used in lamination, such as an epoxy resin for FR4, a conventional resin used in resin-coated foils (RCF), such as R-FR10 (Panasonic), and a conventional resin used in bonding films, such as ABF (Ajinomoto Fine-Techno)). The resin-coated metal foil is then laminated to a substrate so that the coating layer is adjacent to the substrate. The metal foil (preferably an etchable or removable metal foil) is then removed (e.g., etched, etc.) to expose the catalytic material on the surface of the coating layer (e.g., if the coating layer is a B-stage resin, the lamination is cured to a C-stage resin, etc.). A first conductor is then electrolessly metal plated onto the exposed catalytic material. Further conductors can be plated (eg, by electrolytic plating) and additional metal foils can be laminated to the conductors and etched as required for the electrical circuit pattern.

[0012] In some embodiments, the catalytic material is (i) a catalyst precursor to at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh, or a combination thereof. In some methods using a catalyst precursor, the catalyst precursor is reduced to a catalyst (e.g., thermal reduction, chemical reduction, etc.) before applying the surface of a metal foil to the surface of a substrate, or in some embodiments after the metal foil has been etched. The metal foil is typically made of one of aluminum, anodized aluminum, copper, tin, and alloys thereof. In some embodiments, an adhesive layer is applied between the surface of the metal foil bearing the catalytic material and the surface of the substrate.

[0013] In some embodiments, preceramic polymers, ceramic or composite metal oxides, polymer or metal oxide particles, nitride borides, etc. are coated onto the surface of the metal foil, onto the surface of the catalyst layer, or both. The coating layer can be a further coating layer deposited on the catalyst material to a thickness not exceeding 500 μm, 100 μm, 10 μm, or 1 μm. The thickness will vary depending on the coating material.

[0014] A layer of organic material can be further disposed on the catalyst material layer with a thickness of 10 μm, 5 μm, 1 μm, 0.5 μm, or 0.1 μm or less. The catalyst material layer preferably has a thickness of 500 nm, 100 nm, 50 nm, or 20 nm or less. The organic material is preferably a copolymer of an alkali-reactive polymer portion and an alkali-non-reactive polymer portion. In a preferred embodiment, the copolymer further contains a functional group having a lone electron pair or otherwise contains at least one of nitrogen or sulfur. A preferred alkali-reactive polymer portion has at least one polyimide, amide, ester, or thioester. Generally, the copolymer has a composition of alkali-reactive polymer portion and alkali-non-reactive polymer portion between 5%:95% and 95%:5% by molecular weight, respectively.

[0015] The organic material is preferably selected to protect the catalytic material from diffusion (e.g., during thermal processes, lamination, etc.) or otherwise from migration or damage to the catalytic material or its catalyzing activity. In some embodiments, the organic material is selected to improve the bond strength of the catalytic material to the substrate or to absorb mechanical stresses between the catalytic layer and the substrate due to temperature changes. The organic material is selected to have at least 25%, 50%, 75%, or 100% greater adhesion (e.g., mechanical, chemical, dispersive, diffusive, electrostatic, etc.) to the substrate than the catalytic material has to the substrate.

[0016] The method may further include applying a plating resist in a negative circuit pattern onto the exposed catalytic material prior to the electroless metal plating step. The plating resist is then preferably removed (e.g., etched, etc.) after the electroless metal plating step. It is also contemplated to apply an etching resist in a positive circuit pattern onto the exposed catalytic material prior to the electroless metal plating step. The catalytic material not covered by the etching resist is then removed (e.g., etched, etc.), and the etching resist is preferably subsequently removed. In some embodiments, a plating resist is further applied onto the first conductor in a negative circuit pattern, and a second conductor is electrolytically deposited on the exposed portions of the first conductor. The plating resist is preferably removed, and the portions of the first conductor not covered by the second conductor are further removed.

[0017] In some embodiments, a permanent plating resist is further applied to the exposed catalytic material in a negative circuit pattern prior to the electroless metal plating step. After electroless plating, a second conductor is electrolytically attached to the first conductor, and an etching resist is applied to the second conductor in a positive circuit pattern. Preferably, the first and second conductors not covered by the etching resist are removed in the same manner as the etching resist.

[0018] In some embodiments, metal is plated onto the surface of a substrate. An etch resist layer is further applied onto the metal-plated surface in the pattern of the circuit, or at least a portion of the pattern. The metal not covered by the etch resist layer is etched from the surface. The etch resist is then removed from the surface, leaving behind the plated metal in the shape of the pattern or a portion of the pattern.

[0019] Systems and methods for manufacturing metal foils are also contemplated. A portion of the metal foil is coated with a catalyst ink, the catalyst ink coating having a precursor dissolved in a solvent. The catalyst ink coating is then dried on the metal foil, and the catalyst precursor is subsequently reduced (e.g., thermally, chemically, etc.) to deposit a catalyst (e.g., active, etc.) on the portion of the metal foil, which is preferably etchable or otherwise removable. The metal foil is typically aluminum, anodized aluminum, copper, tin, or one of their alloys, and preferably has a thickness of less than 500 μm, e.g., less than 200 μm, 100 μm, 80 μm, 50 μm, 30 μm, 20 μm, or 10 μm. In some embodiments, the portion of the metal foil coated with the catalyst ink is roughened, for example, by etching, dendrite growth, oxidation, or a combination thereof. Alternatively, or in combination, the portion of the metal foil has an Ra of at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm. In some embodiments, the precursor ink includes metal particles, or one or more metals.

[0020] The catalyst is typically at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, and is optionally disposed as a layer having a thickness between the atomic radius of the catalyst component (e.g., catalyzed metal, Ag, Au, Pt, Pd, Cu, Ni, Co, Rh, etc.) and 500 μm. Alternatively, or in combination, the catalyst is disposed as a plurality of particles having an average radius between the atomic radius of the catalyst component and 100 nm. The catalyst ink is typically coated onto the metal foil by at least one of dip coating, roller coating, spray coating, spinner coating, bar coating, curtain coating, blade coating, air knife coating, cast coating, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, or a combination thereof. In some embodiments, the portion of the metal foil coated with the metal ink is one complete surface (e.g., one complete side) of the metal foil.

[0021] Various objects, features, aspects and advantages of the present subject matter will become more apparent from the following detailed description of preferred embodiments, taken in conjunction with the accompanying drawings in which like numerals represent like elements. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 shows a flow chart for manufacturing the catalyzed metal foil of the present subject matter. [Figure 2A] 1 illustrates the catalyzed metal foil of the present subject matter. [Figure 2B] 1 illustrates another catalyzed metal foil of the present subject matter. [Figure 3A] 1 illustrates steps of the subject method of the present invention. [Figure 3B] FIG. 3B illustrates a further step in the method of FIG. 3A. [Figure 3C] Same as above. [Figure 3D] Same as above. [Figure 4A] 3A-3C illustrate steps of another method of the present subject matter. [Figure 4B] FIG. 4B illustrates a further step in the method of FIG. 4A. [Figure 4C] Same as above. [Figure 4D] Same as above. [Figure 5] 4A-4C illustrate steps of yet another method of the present subject matter. [Figure 6] 4A-4C illustrate steps of yet another method of the present subject matter. [Figure 7A] 3A-3C illustrate steps of another method of the present subject matter. [Figure 7B] FIG. 7B illustrates a further step in the method of FIG. 7A. [Figure 7C] Same as above. [Figure 7D] Same as above. [Figure 8] 4A-4C illustrate steps of yet another method of the present subject matter. [Figure 9A] 3A-3C illustrate steps of another method of the present subject matter. [Figure 9B] FIG. 9B illustrates a further step in the method of FIG. 9A. [Figure 9C] Same as above. [Figure 9D] Same as above. [Figure 10] FIG. 1 shows a flowchart of the process of the present subject matter. [Figure 11] FIG. 10 shows a flowchart of another process of the present subject matter. DETAILED DESCRIPTION OF THE INVENTION

[0023] The present subject matter provides systems, methods, and devices relating to catalyzed metal foils, as well as the use of such foils to form electrical circuits and circuits formed therefrom.

[0024] FIG. 1 shows a flow chart for producing the catalyzed metal foil of the present subject matter. FIG. 2A illustrates a catalyzed metal foil 200A of the present inventive subject matter. Catalyzed metal foil 200 includes a metal foil 210, which is etchable or removable and is typically aluminum, anodized aluminum, copper, tin, or one of their alloys, and has a surface 212. Catalyst 220 is typically deposited on surface 212 by coating surface 212 with a catalyst ink having a precursor of catalyst 220 and reducing the catalyst ink to deposit catalyst 220 on surface 212. Surface 212 is preferably roughened, e.g., having an Ra of at least 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, or at least 0.5 μm. In some embodiments, optional layer 230A can be further coated on catalyst 220 (or on the catalyst ink, etc., prior to reduction). The optional layer(s) may be one or more polymers described herein, or may be a preceramic polymer, a metal oxide ceramic or composite, a polymer, a metal oxide particle, a nitride, or a boride (e.g., titanium dioxide, zirconium dioxide, cerium dioxide, yttrium oxide, or composites thereof with a perceramic polymer, an epoxy that may be A-staged, B-staged, or C-staged). In some embodiments that include optional layer 230A, for example, when optional layer 230A includes one or more preceramic polymers, metal oxide ceramics, or composites, an additional optional layer 240 can be further coated on top of optional layer 230A. In such embodiments, additional optional layer 240 typically includes one or more polymers.

[0025] FIG. 2B shows one embodiment of catalyzed metal foil 200A, labeled 200B, where an optional layer is organic material layer 230B. Organic material 230B is a copolymer including an alkali-reactive polymer and an alkali-non-reactive polymer, typically 1 μm to 0.1 μm or less in thickness. In some embodiments, the copolymer further includes a functional group with a lone electron pair, such as nitrogen or sulfur. Preferred alkali-reactive polymers have at least one polyimide, amide, ester, or thioester. Typically, the copolymer has a composition of alkali-reactive polymer to alkali-non-reactive polymer between 5%:95% and 95%:5% by molecular weight, respectively.

[0026] 3A shows a method 300 for manufacturing a catalyzed substrate 360A using a catalyzed metal foil 310. In step 330, surface 314 (bearing catalyst 316) of catalyzed metal foil 310 is laminated to surface 322 of substrate 320 (e.g., prepreg, curable film, thermoplastic substrate) to produce intermediate material 340. In step 350, removable metal foil 312 is removed (e.g., by etching, etc.) from intermediate material 340 to form catalyzed substrate 360A having catalyst 316 deposited on substrate 320. In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, including optional layer 230A or additional optional layer 240, for example, as described. In such embodiments, catalyzed foil 360A appears as catalyzed foil 360B including optional layer 230A as shown in Figure 3B, or as catalyzed foil 360C including optional layer 230A and further optional layer 240 as shown in Figure 3C. In the embodiment of Figure 3D, catalyzed foil 200B including catalyzed foil 360D with organic material layer 230B as described above is used in place of catalyzed foil 310.

[0027] FIG. 4A illustrates a method 400 for fabricating a partial circuit 460A using the catalyst substrate 310 of FIG. 3A. In step 410, a temporary resist layer 430 is formed across the catalyst 422 and deposited on a substrate 420 (e.g., a dielectric substrate). The temporary resist layer 430 is formed to expose portions 422a of the catalyst 422, leaving a negative pattern 432 in the form of the partial circuit. In step 440, conductors 424 are electrolytically plated onto the exposed portions 422a of the catalyst 422, with the temporary resist layer 430 preventing electrolytic plating on any portions of the catalyst 422 covered by the layer 430. In step 450, the temporary resist layer 430 is stripped (e.g., chemically stripped) from the catalyst 422, exposing the catalyst 422 and leaving the conductors 424 plated on portions 422a and the substrate 420, forming the partial circuit 460A. In optional step 470, catalyst 422 is further removed (eg, etched, etc.) from substrate 420 to yield sub-circuit 460A.

[0028] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or further optional layer 240, as described. In such embodiments, partial circuit 460A appears as partial circuit 460B including optional layer 230A, as shown in Figure 4B, or partial circuit 460C including optional layer 230A and further optional layer 240, as shown in Figure 4C. In the embodiment of Figure 4D, catalyzed metal foil 200B is used in place of catalyzed metal foil 310 and includes organic material layer 230B.

[0029] FIG. 5 illustrates a method 500 for fabricating a sub-circuit 580 using the catalyst substrate 310 of FIG. 3. In step 510, a temporary resist layer 530 is formed across the catalyst 522 and deposited on a substrate 520 (e.g., a dielectric substrate). As shown, the temporary resist layer 530 is formed while leaving portions of the catalyst 522a exposed. In step 540, the exposed portions of the catalyst 522a are removed (e.g., by etching), leaving only the covered portions of the catalyst 522b covered by the temporary resist layer 530. In step 550, the temporary resist layer 530 is stripped, exposing the remaining portions of the catalyst 522b. In step 560, a conductor 570 is electroplated onto the catalyst 522b to produce the sub-circuit 580.

[0030] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or further optional layer 240 as described. In such embodiments, partial circuit 580 appears as partial circuit 460B including optional layer 230A, as shown in FIG. 4B, or as partial circuit 460C including optional layer 230A and further optional layer 240, as shown in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 580 appears as partial circuit 460D including organic material 230B, as shown in FIG. 4D.

[0031] FIG. 6 illustrates a method 600 for fabricating a sub-circuit 680 using the catalyzed substrate 310 of FIG. 3. In step 610, conductors 624 are electrolessly plated onto a catalyst 622 deposited on the substrate 620. The conductors 624 are typically plated to a thickness of less than 500 μm, 400 μm, 300 μm, 200 μm, 100 μm, or 50 μm, or at least a minimum thickness that propagates the electrolytic plating of the conductors. In step 630, a temporary resist layer 640 is formed on the conductors 624, and a negative pattern 642 leaves portions 624 a of the conductors 624 exposed to the negative pattern of the circuit portion. In step 650, conductors 626 are electrolytically plated onto portions 624 a of the conductors 624. In step 660, the temporary resist layer 640 is stripped, exposing the conductors 624. In step 670, the exposed portions of conductor 624 and underlying portions of catalyst 622 are removed (eg, etched, etc.) to create sub-circuit 680.

[0032] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or additional optional layer 240 as described. In such embodiments, partial circuit 680 appears as partial circuit 460B including optional layer 230A, as shown in FIG. 4B, or partial circuit 460C including optional layer 230A and additional optional layer 240, as shown in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 680 appears as partial circuit 460D including organic material 230B, as shown in FIG. 4D.

[0033] 7A shows a method 700 for fabricating a partially embedded circuit 750A using the catalyzed substrate 310 of FIG. 3. In step 710, a permanent resist layer 730 is formed on a catalyst 722 deposited on a substrate 720. The permanent resist layer 730 is formed such that a negative pattern 732 exposes portions 722a of the catalyst 722. In step 740, a conductor 724 is electroplated onto the exposed portions 722a of the catalyst 722 to produce the partially embedded circuit 750A.

[0034] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or further optional layer 240, as described. In such embodiments, partial circuit 750A appears as partial circuit 750B including optional layer 230A, as shown in Figure 7B, or as partial circuit 750C including optional layer 230A and further optional layer 240, as shown in Figure 7C. In the embodiment of Figure 7D, catalyzed metal foil 200B is used in place of catalyzed metal foil 310 including organic material layer 230B.

[0035] FIG. 8 illustrates a method 800 for fabricating a subcircuit 880 using the catalyzed substrate 310 of FIG. 3. In step 810, conductors 824 are electrolessly plated onto a catalyst 822 deposited on a substrate 820. The conductors 824 are typically plated to a thickness of less than 500 μm, 400 μm, 300 μm, 200 μm, 100 μm, or 50 μm, or at least a minimum thickness that propagates the electrolytic plating of the conductors. In step 810, conductors 826 are electrolytically plated onto the conductors 824, typically to a thickness of at least 2, 3, 4, 5, 6, 7, 8, 9, 10, or 20 or more times the thickness of the conductors 824. In step 840, a temporary resist layer 840 is formed on the conductors 826 in the pattern of the circuit, leaving exposed portions 826a of the conductors 826. In step 860, exposed portions 826a of conductors 826 and portions of catalyst 822 beneath portions 826a are removed (e.g., by etching), leaving portions 826b of conductors 826 and portions 822b of underlying catalyst 822 covered by temporary resist layer 850. In step 870, temporary resist layer 850 is stripped, exposing portions 826b of conductors 826 in the pattern of the circuit, producing partial circuit 880.

[0036] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or additional optional layer 240 as described. In such embodiments, partial circuit 880 appears as partial circuit 460B including optional layer 230A, as shown in FIG. 4B, or partial circuit 460C including optional layer 230A and additional optional layer 240, as shown in FIG. 4C. In some embodiments, catalyzed metal foil 200B can be used in place of catalyzed metal foil 310. Partial circuit 880 appears as partial circuit 460D including organic material 230B, as shown in FIG. 4D.

[0037] 9A shows a method 900 for manufacturing a catalyzed substrate 970A using a catalyzed metal foil 910. In step 920, a surface 913 of the catalyzed metal foil 910 (on which the catalyst 914 is deposited) is coated with a B-stage resin 916. In step 930, the B-stage resin 916, along with the catalyst 914 and the metal foil 912, is laminated to a surface 944 of a substrate 942 (e.g., a prepreg, a curable film, a thermoplastic substrate) to produce an intermediate material 950. During the lamination step, the B-stage resin 916 is cured to form a C-stage resin 917. In step 960, the removable metal foil 912 is etched from the intermediate material 950 to form a catalyzed substrate 970 having the catalyst 914 deposited on the cured C-stage resin 917 that is deposited on the substrate 942.

[0038] While Figure 9A illustrates the use of B-stage and C-stage resins, it is contemplated that other materials or resins can be used. For example, a polymer, combination of polymers, or specially formulated polymers can be used to provide a beneficial effect or no effect on the function or performance of the substrate 942. If the substrate 942 contains electrical circuitry, a polymer that bonds or adheres well to the substrate is used, preferably one that does not alter the performance of the circuitry at all or beyond a desired tolerance. Layer 916 or 917 is preferably thin, less than 100 μm, 50 μm, 20 μm, 10 μm, 5 μm, or less than 0.5 μm. In preferred embodiments, such polymer or resin layers are 0.5 μm to 0.1 μm thick, but can be less than 100 nm, less than 50 nm, or less than 10 nm, if practical or preferred.

[0039] In some embodiments, catalyzed metal foil 200A can be used in place of catalyzed metal foil 310, for example, including optional layer 230A or further optional layer 240, as described. In such embodiments, catalyzed substrate 970A appears as catalyzed substrate 970B including optional layer 230A, as shown in Figure 9B, or as catalyzed substrate 970C including optional layer 230A and further optional layer 240, as shown in Figure 9C. In the embodiment of Figure 9D, catalyzed metal foil 200B is used in catalytic substrate 970D instead of catalytic metal foil 310 including organic material layer 230B.

[0040] 10 shows a flowchart of a process 1000 including a starting material 1010, an intermediate material 1020, an intermediate material 1030, and a finished material 1040. The starting material 1010 includes a removable material 1012 (e.g., an etchable metal, etchable aluminum, etchable copper, a removable plastic film, etc.) and a catalyst layer 1014 deposited on the surface of the removable metal 1012. A polymer layer 1016 is deposited on the surface of the catalyst layer 1014. Preferably, the content of the polymer layer 1016 is specifically selected, designed, or formulated to advantageously bond or adhere to the catalyst layer, to the surface of a bonding sheet 1022 (e.g., a prepreg, a bonding film, an adhesive sheet), or both. For example, the polymer layer 1016 can comprise a single polymer variant with high strength or bonding specificity for the bonding sheet 1022, or it can comprise multiple polymer variants with desirable bonding or adhesive properties, physical resistance (temperature resistance, flexibility, durability, etc.), electrical properties (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or be doped with other materials to imbue the polymer layer 1016 with such desirable properties. Furthermore, in preferred embodiments, the polymer layer 1016 is between 1 μm and 0.01 μm, but can be less than 500 nm, less than 100 nm, or less than 50 nm, if practical or preferred. Reducing the separation between the catalyst layer 1014 and the bonding sheet 1022, or even between the catalyst layer 1014 and the substrate 1024, is absolutely critical in some embodiments.

[0041] Intermediate material 1020 includes removable metal 1012, catalyst layer 1014, and polymer layer 1016, and further includes bonding sheet 1022 and substrate 1024. As mentioned, the content of polymer layer 1016 is preferably selected to maintain a strong bond or adhesion between catalyst layer 1014 and the surface of bonding sheet 1022. Similarly, bonding sheet 1022 is selected to maintain a strong bond or adhesion between bonding sheet 1022 and the surface of substrate 1024. In some embodiments, polymer layer 1016 is selected to maintain a strong bond or adhesion to a broad class of bonding sheets, bonding sheet 1022 is selected to maintain a strong bond or adhesion to a broad class of substrates, or both.

[0042] Intermediate material 1030 includes removable metal 1012, catalyst layer 1014, polymer layer 1016, bonding sheet 1022, and substrate 1024 adhered or bonded (e.g., laminated) together as shown. The finished material results from removing etchable metal 1012 and exposing the surface of catalyst layer 1014. It is contemplated that finished material 1040 can be further processed, for example, to plate conductors (electrolessly, electrolytically, various combinations thereof, etc.) in a pattern, in bulk, or both, into finished material 1040. Such methods are useful, for example, for adding power lines, circuit patterns, new or improved RF performance or functionality, etc. to substrate 1024 or finished material 1040A when substrate 1024 already includes electrical circuitry or various electronic components with rated, approved, evaluated, or certified performance tolerances or characteristics.

[0043] While FIG. 10 illustrates a method and device for single-sided application of a catalyst layer or catalyst-coated etchable or removable metal layer to a substrate, it is further contemplated that such teachings may be applied to apply a catalyst layer or catalyst-coated etchable or removable metal layer to more than a portion of a substrate, for example, multiple portions on a single side of a substrate, more portions on one side of a substrate, or multiple portions on multiple sides of a substrate.

[0044] 11 shows a flowchart of process 1100, including starting material 1110, intermediate material 1120, intermediate material 1130, intermediate material 1140, and finished material 1150. Starting material 1110 includes removable material 1112 (e.g., etchable metal, etchable aluminum, etchable copper, removable plastic film, etc.) and catalyst layer 1114 deposited on the surface of removable metal 1112. Metal oxide layer 1116 is deposited on the surface of catalyst layer 1114. Preferably, metal oxide layer 1116 is specially selected, designed, or formulated to advantageously bond or adhere to catalyst layer 1114. Additionally, metal oxide layer 1116 preferably protects subsequent polymer layer 118 from diffusion and promotes good adhesion of metal oxide layer 1116, and thereby of starting material 1110, to polymer layer 1118.

[0045] The intermediate material 1120 further includes a polymer layer 1118 deposited on the surface of the metal oxide layer 1116. Preferably, the content of the polymer layer 1118 is specifically selected, designed, or formulated to advantageously bond or adhere to the catalyst layer 1116, to the surface of the bonding sheet 1122 (e.g., prepreg, bonding film, adhesive sheet), to the metal oxide layer 1116, or a combination thereof. For example, the polymer layer 1118 can include a variant of a single polymer that has high strength or high bonding specificity for the bonding sheet 1122, can include multiple polymer variants with desirable bonding or adhesive properties, physical resistance (temperature resistance, flexibility, durability, etc.), or electrical properties (e.g., EM insulation, conductivity, resistivity, dielectric, etc.), or can be doped with other materials to imbue the polymer layer 1118 with such desirable properties. Furthermore, in preferred embodiments, the combined thickness of the metal oxide layer 1116 and polymer layer 1118 is between 1.0 μm and 0.01 μm, but can be less than 500 nm, less than 100 nm, or less than 50 nm, where practical or preferred. Reducing the separation between the catalyst layer 1114 and the bonding sheet 1122, or even between the catalyst layer 1114 and the substrate 1124, is absolutely critical in some embodiments.

[0046] Intermediate material 1130 includes removable metal 1112, catalyst layer 1114, metal oxide layer 1116, and polymer layer 1118, and further includes a bonding sheet 1122 and a substrate 1124. As mentioned, the content of polymer layer 1118 is preferably selected to maintain a strong bond or adhesion between metal oxide layer 1116 (and thereby, catalyst layer 1114 and removable metal 1112) and the surface of bonding sheet 1122. Similarly, bonding sheet 1122 is selected to maintain a strong bond or adhesion between bonding sheet 1122 and the surface of substrate 1124. In some embodiments, polymer layer 1118 is selected to maintain a strong bond or adhesion to a broad class of bonding sheets, bonding sheet 1122 is selected to maintain a strong bond or adhesion to a broad class of substrates, or both.

[0047] Intermediate material 1140 includes removable metal 1112, catalyst layer 1114, metal oxide layer 1116, polymer layer 1118, binder sheet 1122, and substrate 1124 adhered or bonded (e.g., laminated) together as shown. Finished material 1150 results from removing removable metal 1112 and exposing the surface of catalyst layer 1114. It is contemplated that finished material 1140 can be further processed, for example, to plate conductors (electrolessly, electrolytically, various combinations thereof, etc.) in a pattern, in bulk, or both, into finished material 1150. Such methods are useful, for example, for adding power lines, circuit patterns, new or improved RF performance or functionality, etc., to substrate 1124 or finished material 1150 when substrate 1124 already includes electrical circuitry or various electronic components with rated, approved, evaluated, or certified performance tolerances or characteristics.

[0048] While FIG. 11 illustrates a method and device for single-sided application of a catalyst layer or catalyst-coated or removable metal layer to a substrate, it is further contemplated that such teachings may be applied to apply a catalyst layer or catalyst-coated or removable metal layer to more than a portion of a substrate, for example, multiple portions of a single side of a substrate, multiple portions of more than one side of a substrate, or multiple portions of multiple sides of a substrate.

[0049] The following discussion provides many exemplary embodiments of the inventive subject matter. While each embodiment represents a single combination of the inventive elements, it is believed that the inventive subject matter includes all possible combinations of the disclosed elements. Thus, if one embodiment includes elements A, B, and C and a second embodiment includes elements B and D, it is believed that the inventive subject matter also includes other remaining combinations of A, B, C, or D, even if not explicitly disclosed.

[0050] As used herein, unless the context dictates otherwise, the term "coupled to" is intended to include both direct coupling (where the two elements coupled to each other touch each other) and indirect coupling (where at least one additional element is disposed between the two elements). Thus, the terms "coupled to" and "coupled with" are used synonymously.

[0051] In some embodiments, numbers expressing properties such as amounts and concentrations of ingredients, reaction conditions, and the like, used to describe and claim particular embodiments of the present invention are understood to be modified in some cases by the term "about." Accordingly, in some embodiments, the numerical parameters set forth in the specification and appended claims are approximations that may vary depending upon the desired properties sought to be obtained by a particular embodiment. In some embodiments, the numerical parameters should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of some embodiments of the present invention are approximations, the numerical values ​​set forth in the specific examples are reported as precisely as possible. The numerical values ​​presented in some embodiments of the present invention may contain certain errors necessarily resulting from the standard deviation found in their respective testing measurements.

[0052] Unless the context dictates to the contrary, all ranges set forth herein should be construed to be inclusive of their endpoints, and open-ended ranges should be construed to include only commercially practical values. Similarly, all lists of values ​​should be deemed to include intermediate values ​​unless the context dictates to the contrary.

[0053] As used throughout this specification and the claims that follow, the meanings of "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Also, as used in this description, the meaning of "in" includes "in" and "on," unless the context clearly dictates otherwise.

[0054] All methods described herein can be performed in any suitable order unless otherwise indicated herein or clearly contradicted by context. The use of any and all examples or exemplary language (e.g., "etc.") provided with respect to specific embodiments herein is intended merely to further clarify the invention and does not limit the scope of the invention as otherwise claimed. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the invention.

[0055] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limiting. The elements of each group may be referenced and claimed individually or in any combination with other elements of the group or other elements found herein. One or more elements of a group may be included in, or deleted from, a group for reasons of convenience and / or patentability. When such inclusion or deletion occurs, the specification is deemed to include the modified group and, therefore, fulfills the recitation of all Markush groups used in the appended claims.

[0056] It will be apparent to those skilled in the art that many variations beyond those already described are possible without departing from the concept of the present invention. Accordingly, the subject matter of the present invention should not be limited except by the spirit of the appended claims. Moreover, in interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. In particular, the terms "comprises" and "comprising" should be interpreted to refer to elements, components, or steps in a non-exclusive manner, indicating that the referenced elements, components, or steps may be present, utilized, or combined. When a claim of the specification refers to at least one selected from the group consisting of A, B, C, ..., and N, the text should be interpreted as requiring only one element from the group, not A+N, or B+N, etc. (Configuration example) [Configuration example 1] A metal foil having a surface, a layer of catalytic material disposed on a portion of the surface of the metal foil, the metal foil being removable; The metal foil. [Configuration example 2] The metal foil according to configuration example 1, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration example 3] The metal foil according to Configuration Example 1, wherein the portion of the surface of the metal foil is oxidized or roughened. [Configuration example 4] The metal foil according to Configuration Example 1, wherein the metal foil has a thickness of less than 500 μm. [Configuration example 5] The metal foil according to Configuration Example 1, wherein the portion of the surface has an arithmetic mean roughness (Ra) of at least 0.1 μm. [Configuration example 6] 10. The metal foil of claim 1, wherein the catalytic material comprises a catalyst precursor to one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. [Configuration Example 7] 2. The metal foil according to configuration example 1, wherein the catalyst material is at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh. [Configuration example 8] 10. The metal foil of claim 1, wherein the catalytic material is disposed as a layer having a thickness between the atomic radius of a component of the catalyzed material and 500 μm. [Configuration Example 9] 10. The metal foil of claim 1, wherein the catalytic material is arranged as a plurality of particles having an average radius between the atomic radius of the components of the catalyzed material and 100 nm. [Configuration Example 10] 10. The metal foil of claim 1, wherein the catalytic material is made from one or more catalyzed precursors. [Configuration Example 11] 11. The metal foil of embodiment 10, wherein the one or more catalyzed precursors are applied in ink form. [Configuration example 12] 10. The metal foil of claim 1, wherein the catalyst layer is deposited by CVD (chemical vapor deposition), by PVD (physical vapor deposition), or by a vacuum deposition technique. [Configuration Example 13] The metal foil according to configuration example 1, wherein the catalyst layer is coated with a preceramic polymer or a ceramic material. [Configuration Example 14] 14. The metal foil of claim 13, wherein the catalyst layer is further coated with an adhesive material. [Configuration Example 15] 10. The metal foil of claim 1, wherein a coating layer comprising at least one of a B-stage epoxy or a thermoplastic material is disposed on the catalytic material. [Configuration Example 16] 10. The metal foil of claim 1, wherein a coating layer comprising a laminate material is disposed on the catalyst material. [Configuration Example 17] 17. The metal foil of claim 16, wherein the laminate material comprises at least one of an epoxy resin, a resin-coated foil, or a bonding film resin. [Configuration Example 18] 10. The metal foil of claim 1, further comprising a polymer layer disposed on a portion of the catalytic material, the polymer layer having a thickness of 500 μm or less. [Configuration Example 19] 20. The metal foil of embodiment 18, wherein the polymer layer is selected to have at least one of a strong binding affinity to the catalytic material or a strong binding affinity to a binder sheet. [Configuration Example 20] 10. The metal foil of claim 1, further comprising a layer of a preceramic polymer, ceramic, metal oxide composite, polymer, metal oxide particle, nitride, or boride disposed over a portion of the catalytic material. [Configuration Example 21] 21. The metal foil of configuration example 20, further comprising a polymer layer disposed on a portion of the layer deposited on the catalytic material, wherein the polymer layer has a thickness of 500 μm or less. [Configuration Example 22] The metal foil according to Configuration Example 3, further comprising a layer of an organic material having a thickness of 1 μm or less disposed on the catalyst material layer, wherein the surface of the metal foil is roughened. [Configuration Example 23] 23. The metal foil according to Configuration Example 22, wherein the surface of the metal foil is roughened by etching. [Configuration Example 24] 23. The metal foil of claim 22, wherein the catalytic material is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or a combination thereof. [Configuration Example 25] 23. The metal foil according to configuration example 22, wherein the catalyst material layer has a thickness of 100 nm or less. [Configuration Example 26] 23. The metal foil according to claim 22, wherein the organic material is a copolymer containing an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 27] 27. The metal foil according to Configuration Example 26, wherein the copolymer has a functional group with a lone electron pair. [Configuration Example 28] 28. The metal foil of claim 27, wherein the functional group includes one of nitrogen or sulfur. [Configuration Example 29] 27. The metal foil of claim 26, wherein the alkali-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester. [Configuration Example 30] 27. The metal foil according to Configuration Example 26, wherein the copolymer has a composition of the alkali-reactive polymer to the alkali-non-reactive polymer of between 5%:95% and 95%:5% by molecular weight, respectively. [Configuration Example 31] 23. The metal foil of claim 22, wherein the organic material is selected to (i) protect the catalyst material layer from diffusion of the catalyst material, (ii) improve the bonding strength of the catalyst material to the substrate, or (iii) absorb mechanical stress between the catalyst layer and the substrate due to temperature changes. [Configuration Example 32] 23. The metal foil of claim 22, wherein the organic material is selected to have at least 30% greater adhesion to the substrate than the catalytic material has to the substrate. [Configuration Example 33] 1. A method for forming an electrical circuit using a metal foil having a surface carrying a catalytic material, comprising: applying the surface of the metal foil carrying the catalytic material to a surface of a substrate; laminating the metal foil to the substrate; Etching the metal foil to expose the catalytic material; electrolessly metal plating a first conductor onto the exposed catalytic material; The metal foil is removable. The method. [Configuration Example 34] 34. The method of claim 33, wherein the catalytic material is (i) a catalyst precursor to at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh. [Configuration Example 35] 35. The method of claim 34, wherein the catalyst precursor is reduced to a catalyst prior to applying the surface of the metal foil to the surface of the substrate. [Configuration Example 36] 35. The method of claim 34, wherein the catalyst precursor is reduced to a catalyst after etching the metal foil. [Configuration Example 37] 34. The method of configuration example 33, further comprising applying a plating resist in a negative circuit pattern over the exposed catalytic material prior to the electroless metal plating step, and removing the plating resist after the electroless metal plating step. [Configuration Example 38] Before the electroless metal plating step, applying an etch resist in a positive circuit pattern over the exposed catalytic material; Etching catalytic material not covered by the etch resist; removing the etching resist; The method of example 33, further comprising: [Configuration Example 39] applying a plating resist onto the first conductor in a negative circuit pattern; electrolytically depositing a second conductor onto the exposed portion of the first conductor; removing the plating resist; removing the portion of the first conductor not covered by the second conductor; The method of example 33, further comprising: [Configuration Example 40] 34. The method of configuration example 33, further comprising the step of applying a permanent plating resist in a negative circuit pattern over the exposed catalytic material prior to the step of electroless metal plating. [Configuration Example 41] After the electroless plating step, electrolytically depositing a second conductor onto the first conductor; applying an etch resist in a positive circuit pattern over the second conductor; Etching the first conductor and the second conductor that are not covered by the etching resist; removing the etching resist; The method of example 33, further comprising: [Configuration Example 42] 34. The method of claim 33, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 43] 34. The method of configuration example 33, further comprising applying an adhesive layer between the surface of the metal foil supporting the catalytic material and the surface of the substrate. [Configuration Example 44] 34. The method of configuration example 33, further comprising applying a polymer layer over a surface of the catalytic material and bonding the polymer layer to the substrate. [Configuration Example 45] 45. The method of example 44, further comprising bonding a bonding sheet to at least one of the surface of the polymer layer or the surface of the substrate. [Configuration Example 46] 45. The method of claim 44, wherein the polymer layer has a thickness of 500 μm or less. [Configuration Example 47] The method of aspect 33, further comprising applying a layer of a preceramic polymer, ceramic, metal oxide composite, polymer, metal oxide particle, nitride, or boride. [Configuration Example 48] 45. The method of configuration example 44, further comprising applying a metal oxide layer on the surface of the catalytic material before applying the polymer layer. [Configuration Example 49] 34. The method of claim 33, further comprising applying a layer of organic material having a thickness of 1 μm or less to the catalyst material before applying the metal foil to the substrate, wherein the surface of the metal foil is roughened. [Configuration Example 50] 50. The method of claim 49, wherein the surface of the metal foil is roughened by etching. [Configuration Example 51] 50. The method of claim 49, wherein the catalytic material is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or a combination thereof. [Configuration Example 52] 50. The method of aspect 49, wherein the catalyst material is 100 nm or less in thickness. [Configuration Example 53] 51. The method of aspect 50, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 54] The method of embodiment 53, wherein the copolymer has a functional group with a lone pair of electrons. [Configuration Example 55] 55. The method of embodiment 54, wherein the functional group includes one of nitrogen or sulfur. [Configuration Example 56] 54. The method of claim 53, wherein the alkali-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester. [Configuration Example 57] 54. The method of claim 53, wherein the copolymer has a composition of the alkali-reactive polymer to the alkali-non-reactive polymer of between 5%:95% and 95%:5% by molecular weight, respectively. [Configuration Example 58] 50. The method of claim 49, wherein the organic material is selected to (i) protect the catalytic material layer from diffusion of the catalytic material, (ii) improve the bonding strength of the catalytic material to the substrate, or (iii) absorb mechanical stress between the catalytic layer and the substrate due to temperature changes. [Configuration Example 59] 50. The method of claim 49, wherein the organic material is selected to have at least 30% greater adhesion to the substrate than the catalytic material has to the substrate. [Configuration Example 60] coating a portion of a metal foil with a catalyst ink, the catalyst ink comprising a precursor dissolved in a solvent; drying the catalyst ink coating; reducing the catalyst precursor to deposit a catalyst on the portion of the metal foil, the metal foil being removable; A method for producing a metal foil, comprising: [Configuration Example 61] 61. The method of claim 60, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 62] 61. The method of claim 60, wherein the portion of the metal foil is oxidized. [Configuration Example 63] 61. The method of claim 60, wherein the metal foil has a thickness of less than 500 μm. [Configuration Example 64] 61. The method of claim 60, wherein the portion of the metal foil has an Ra of at least 0.1 μm. [Configuration Example 65] 61. The method of claim 60, wherein the catalyst is at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh. [Configuration Example 66] 61. The method of aspect 60, wherein the catalyst is disposed as a layer having a thickness between the atomic radius of the catalyst components and 500 μm. [Configuration Example 67] 61. The method of aspect 60, wherein the catalyst is arranged as a plurality of particles having an average radius between the atomic radius of the catalyst components and 500 nm. [Configuration Example 68] 61. The method of claim 60, wherein the step of coating the catalyst ink includes at least one of dip coating, roller coating, spray coating, spinner coating, gravure coating, flexographic coating, bar coating, comma coating, inkjet printing, curtain coating, slot die coating, or screen printing. [Configuration Example 69] 61. The method of claim 60, wherein the portion of the metal foil is one complete surface of the metal foil. [Configuration Example 70] The method of embodiment 60, further comprising applying a polymer layer on top of the dried catalyst ink coating. [Configuration Example 71] 61. The method of embodiment 60, further comprising applying a polymer layer over the surface of the catalyst. [Configuration Example 72] 72. The method of claim 71, wherein the polymer layer has a thickness of 500 μm or less. [Configuration Example 73] 61. The method of configuration example 60, further comprising applying a metal oxide layer on a surface of the catalyst. [Configuration Example 74] The method of example 71, further comprising applying a metal oxide layer on a surface of the polymer layer. [Configuration Example 75] 61. The method of aspect 60, further comprising applying an organic material to the catalyst having a thickness of 1 μm or less, wherein the portion of the metal foil is roughened. [Configuration Example 76] 76. The method of claim 75, wherein the portion of the metal foil is roughened by etching. [Configuration Example 77] 76. The method of embodiment 75, wherein the catalyst is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or a combination thereof. [Configuration Example 78] 76. The method of aspect 75, wherein the catalyst is 100 nm or less in thickness. [Configuration Example 79] 76. The method of claim 75, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 80] The method of embodiment 79, wherein the copolymer has a functional group with a lone pair of electrons. [Configuration Example 81] 81. The method of embodiment 80, wherein the functional group includes one of nitrogen or sulfur. [Configuration Example 82] 80. The method of claim 79, wherein the alkali-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester. [Configuration Example 83] 80. The method of claim 79, wherein the copolymer has a composition of the alkali-reactive polymer to the alkali-non-reactive polymer of between 5%:95% and 95%:5% by molecular weight, respectively. [Configuration Example 84] 76. The method of claim 75, wherein the organic material is selected to (i) protect the catalytic material layer from diffusion of the catalytic material, (ii) improve the bonding strength of the catalytic material to the substrate, or (iii) absorb mechanical stress between the catalytic layer and the substrate due to temperature changes. [Configuration Example 85] 76. The method of aspect 75, wherein the organic material limits the diffusion of the catalyst. [Configuration Example 86] 76. The method of claim 75, wherein the organic material is selected to have at least 30% greater adhesion to the substrate than the catalyst. [Configuration Example 87] 1. A method for forming an electrical circuit using a metal foil having a surface carrying a catalytic material, comprising: depositing a coating layer on the surface of the metal foil supporting the catalytic material; applying the surface of the metal foil carrying the catalytic material and the coating layer to a surface of a substrate; laminating the metal foil to the substrate; Etching the metal foil to expose the catalytic material; electrolessly metal plating a first conductor onto the exposed catalytic material; The metal foil is removable. The method. [Configuration Example 88] 88. The method of claim 87, wherein the coating layer comprises at least one of a B-stage epoxy or a thermoplastic material. [Configuration Example 89] 88. The method of claim 87, wherein the catalytic material is (i) a catalyst precursor to at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh. [Configuration Example 90] 90. The method of example 89, wherein the catalyst precursor is reduced to a catalyst prior to applying the surface of the metal foil to the surface of the substrate. [Configuration Example 91] 90. The method of claim 89, wherein after the step of etching the metal foil, the catalyst precursor is reduced to a catalyst. [Configuration Example 92] applying a plating resist in a negative circuit pattern onto the exposed catalytic material prior to the electroless metal plating step; a step of removing the plating resist after the electroless metal plating step; 88. The method of example 87, further comprising: [Configuration Example 93] Before the electroless metal plating step, applying an etch resist in a positive circuit pattern over the exposed catalytic material; Etching catalytic material not covered by the etch resist; removing the etching resist; 88. The method of example 87, further comprising: [Configuration Example 94] applying a plating resist onto the first conductor in a negative circuit pattern; electrolytically depositing a second conductor onto the exposed portion of the first conductor; removing the plating resist; removing the portion of the first conductor not covered by the second conductor; 88. The method of example 87, further comprising: [Configuration Example 95] 88. The method of configuration example 87, further comprising the step of applying a permanent plating resist in a negative circuit pattern over the exposed catalytic material prior to the step of electroless metal plating. [Configuration Example 96] After the electroless plating step, electrolytically depositing a second conductor onto the first conductor; applying an etch resist in a positive circuit pattern over the second conductor; Etching the first conductor and the second conductor that are not covered by the etching resist; removing the etching resist; 88. The method of example 87, further comprising: [Configuration Example 97] 88. The method of claim 87, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof. [Configuration Example 98] 88. The method of example 87, further comprising applying an adhesive layer between the surface of the metal foil carrying the catalytic material and the surface of the substrate. [Configuration Example 99] 88. The method of claim 87, wherein the coating layer comprises a polymer. [Configuration Example 100] 88. The method of claim 87, wherein the step of laminating the metal foil to the substrate includes laminating the coating layer to a bonding sheet. [Configuration Example 101] 88. The method of claim 87, wherein the coating layer has a thickness of 500 μm or less. [Configuration Example 102] 88. The method of claim 87, wherein the coating layer comprises a preceramic polymer, a ceramic or composite of a metal oxide, a polymer, metal oxide particles, a nitride, or a boride. [Configuration Example 103] The method of example 102, comprising further coating the coating layer with a polymer layer. [Configuration Example 104] 88. The method of claim 87, wherein the coating layer comprises an organic material having a thickness of 1 μm or less, and the surface of the metal foil is roughened. [Configuration Example 105] 105. The method of aspect 104, wherein the surface of the metal foil is roughened by etching. [Configuration Example 106] 105. The method of aspect 104, wherein the catalyst is selected from the group consisting of Pd, Pt, Ru, Rh, Ag, Au, or a combination thereof. [Configuration Example 107] 105. The method of aspect 104, wherein the catalytic material is 100 nm or less in thickness. [Configuration Example 108] 105. The method of claim 104, wherein the organic material is a copolymer comprising an alkali-reactive polymer and an alkali-non-reactive polymer. [Configuration Example 109] The method of embodiment 108, wherein the copolymer has a functional group with a lone pair of electrons. [Configuration Example 110] 110. The method of embodiment 109, wherein the functional group includes one of nitrogen or sulfur. [Configuration Example 111] 19. The method of claim 108, wherein the alkali-reactive polymer comprises at least one of a polyimide, an amide, an ester, or a thioester. [Configuration Example 112] 19. The method of claim 108, wherein the copolymer has a composition of the alkali-reactive polymer to the alkali-non-reactive polymer of between 5%:95% and 95%:5% by molecular weight, respectively. [Configuration Example 113] The method described in configuration example 104, wherein the organic material is selected to (i) protect the catalytic material layer from diffusion of the catalytic material, (ii) improve the bonding strength of the catalytic material to the substrate, or (iii) absorb mechanical stress between the catalytic layer and the substrate due to temperature changes. [Configuration Example 114] 106. The method of aspect 105, wherein the organic material is selected to have at least 30% greater adhesion to the substrate than the catalytic material has to the substrate.

Claims

1. 1. A method for forming an electrical circuit using a metal foil having a surface carrying a catalytic material, comprising: applying the surface of the metal foil carrying the catalytic material to a surface of a substrate; laminating the metal foil to the substrate; Etching the metal foil to expose the catalytic material; electrolessly metal plating a first conductor onto the exposed catalytic material; The metal foil is removable. The method.

2. 1. A method for forming an electrical circuit using a metal foil having a surface carrying a catalytic material, comprising: depositing a coating layer on the surface of the metal foil supporting the catalytic material; applying the surface of the metal foil carrying the catalytic material and the coating layer to a surface of a substrate; laminating the metal foil to the substrate; Etching the metal foil to expose the catalytic material; electrolessly metal plating a first conductor onto the exposed catalytic material; The metal foil is removable. The method.

3. 3. The method of claim 1 or claim 2, wherein the catalytic material is (i) a catalyst precursor to at least one of Ag, Au, Pt, Pd, Cu, Ni, Co, or Rh, or (ii) at least one of catalyzed Ag, catalyzed Au, catalyzed Pt, catalyzed Pd, catalyzed Cu, catalyzed Ni, catalyzed Co, or catalyzed Rh.

4. The method of claim 3 , wherein the catalyst precursor is reduced to a catalyst prior to applying the surface of the metal foil to the surface of the substrate.

5. The method of claim 3 , wherein the catalyst precursor is reduced to a catalyst after etching the metal foil.

6. 3. The method of claim 1 or claim 2, further comprising the steps of applying a plating resist in a negative circuit pattern over the exposed catalytic material prior to the electroless metal plating step, and removing the plating resist after the electroless plating step.

7. 3. The method of claim 1 or claim 2, wherein the metal foil is selected from the group consisting of aluminum, anodized aluminum, copper, tin, and alloys thereof.

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