Management method for processing apparatus

Abstract

To provide a management method of a processing device capable of stabilizing processing quality in a plurality of processing devices in which respective exhaust ports communicate with a common suction source.SOLUTION: A management method of a processing apparatus includes a measurement step of measuring an exhaust amount of each of a plurality of processing apparatuses while operating a suction source so that each of the plurality of processing apparatuses is exhausted through an exhaust port, and an adjustment step of adjusting an operation environment of at least one of the plurality of processing apparatuses so that a difference between exhaust amounts of a processing apparatus having the largest exhaust amount and a processing apparatus having the smallest exhaust amount among the plurality of processing apparatuses is equal to or less than a threshold value when the difference exceeds the threshold value with reference to the exhaust amounts measured in the measurement step.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for managing processing devices, which adjusts the operating environment of at least one of a plurality of processing devices, each having an exhaust port connected to a common suction source. [Background technology]

[0002] Semiconductor device chips, such as integrated circuits (ICs), which are essential components in various electronic devices such as mobile phones and personal computers, are manufactured through a semiconductor manufacturing process that includes a front-end process in which multiple semiconductor devices, each containing numerous circuit elements, are formed on a wafer, and a back-end process in which the wafer is processed to manufacture multiple chips.

[0003] In the post-processing, various types of processing equipment are used, such as a grinding equipment for thinning the wafer, a polishing equipment for planarizing the surface of the wafer, and a cutting equipment for dividing the wafer. Furthermore, in mass production lines for carrying out the post-processing, a plurality of processing equipment of the same and / or different types are usually arranged side by side. These processing equipment may be capable of communicating with each other, for example, so that processing conditions for each can be transmitted and received (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-235443 Summary of the Invention [Problem to be solved by the invention]

[0005] When a wafer is processed, the wafer is heated and processing debris is generated. Therefore, in processing equipment, the wafer is generally processed while supplying a processing liquid such as water to the processing point to cool the wafer and wash away the processing debris. However, when wafers are processed while supplying the processing liquid in this way, the processing liquid turns into mist and fills the processing equipment.

[0006] Therefore, it is common for the processing equipment to be provided with an exhaust port that communicates with a suction source, and for the processing equipment to be evacuated through this exhaust port while the suction source is operating, but providing a suction source for each processing equipment tends to increase the footprint.

[0007] In consideration of this, mass production lines for carrying out post-processing often have a common suction source that communicates with the exhaust ports of multiple processing devices. However, when the exhaust ports of multiple processing devices communicate with a common suction source, differences in the flow rates (exhaust volumes) of gases exhausted through the exhaust ports of the multiple processing devices are likely to occur depending on factors such as the distance of the exhaust path between the exhaust port of each processing device and the common suction source.

[0008] In view of this, an object of the present invention is to provide a method for managing processing devices that can stabilize the processing quality of multiple processing devices whose exhaust ports are connected to a common suction source. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a method for managing processing devices, which adjusts the operating environment of at least one of a plurality of processing devices, each of whose exhaust ports is connected to a common suction source, and which comprises: a measurement step of measuring the exhaust volume of each of the plurality of processing devices while operating the suction source so that each of the plurality of processing devices exhausts through its exhaust port; and an adjustment step of, when the difference in exhaust volume between the processing devices with the largest and smallest exhaust volumes among the plurality of processing devices exceeds a threshold value, by referring to the exhaust volume measured in the measurement step, adjusting the operating environment of at least one of the plurality of processing devices so that the difference is equal to or less than the threshold value.

[0010] Preferably, each of the plurality of processing devices has an exhaust port shielding member for shielding a portion of the exhaust port and / or an exhaust fan for promoting exhaust through the exhaust port, and the operating environment is the proportion of the exhaust port that is shielded by the exhaust port shielding member and / or the rotation speed of the exhaust fan. Furthermore, it is preferable that the plurality of processing devices are capable of communicating with each other.

[0011] According to another aspect of the present invention, there is provided a method for managing processing equipment, wherein the method adjusts the operating environment of at least one of three or more processing equipment, each of whose exhaust ports is connected to a common suction source, the method comprising: a measurement step of measuring the exhaust volume of each of the three or more processing equipment while operating the suction source so that each of the three or more processing equipment exhausts through its exhaust port; a determination step of determining whether each of the three or more processing equipment is operating; and an adjustment step of, when it is determined in the determination step that two or more processing equipment are operating and at least one processing equipment is not operating, and the difference in exhaust volume between the largest and smallest of the two or more processing equipment exceeds a threshold value by referring to the exhaust volumes measured in the measurement step, reducing the exhaust volume of the at least one processing equipment to be smaller than the exhaust volumes of the two or more processing equipment, and adjusting the operating environment of at least one of the three or more processing equipment so that the difference is equal to or less than the threshold value. [Effects of the Invention]

[0012] In the present invention, when the difference in displacement between the largest and smallest of the plurality of processing devices exceeds a threshold value, the operating environment of at least one of the plurality of processing devices is adjusted so that the difference is equal to or less than the threshold value, thereby making it possible to stabilize the processing quality of the plurality of processing devices. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a block diagram that schematically shows a plurality of (here, three) processing devices each of which is exhausted by a common suction source. [Figure 2] FIG. 2 is a block diagram schematically showing components included in the operating environment adjustment unit shown in FIG. [Figure 3] FIG. 3 is a flowchart schematically illustrating an example of a processing device management method for adjusting the operating environment of at least one of a plurality of processing devices. [Figure 4] FIG. 4 is a flowchart schematically illustrating an example of a processing device management method for adjusting the operating environment of at least one of three or more processing devices. DETAILED DESCRIPTION OF THE INVENTION

[0014] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a block diagram schematically showing a plurality of (here, three) processing devices 4a, 4b, and 4c, each of which is exhausted by a common suction source 2. In Fig. 1, components that can communicate with each other are connected via double lines, and components that can communicate with each other are connected via dotted lines.

[0015] The suction source 2 is, for example, a vacuum pump, and is connected to the exhaust ports 6a, 6b, and 6c of the processing devices 4a, 4b, and 4c, respectively. When the suction source 2 is operated, each of the processing devices 4a, 4b, and 4c is evacuated. However, the amount of air exhausted when evacuating the processing devices 4a, 4b, and 4c may differ for each of the processing devices 4a, 4b, and 4c.

[0016] Specifically, the distances of the exhaust paths provided between each of the exhaust ports 6a, 6b, and 6c and the suction source 2 are different. For example, the exhaust path provided between the exhaust port 6b and the suction source 2 is shorter than the exhaust path provided between the exhaust port 6a and the suction source 2, but is longer than the exhaust path provided between the exhaust port 6c and the suction source 2.

[0017] The suction force acting on each exhaust port 6a, 6b, 6c when the suction source 2 is operated may be inversely proportional to the distance of the exhaust path. As a result, when the suction source 2 is used to exhaust air from the processing devices 4a, 4b, 4c, the amount of air exhausted from one of the processing devices 4a, 4b, 4c with a long exhaust path to the suction source 2 may be smaller than the amount of air exhausted from another device with a short exhaust path.

[0018] Each of the processing devices 4a, 4b, and 4c is capable of supplying a processing liquid such as water to a processing point when processing a wafer therein, and is, for example, a grinding device, a polishing device, or a cutting device. Although not shown in Figure 1, each of the processing devices 4a, 4b, and 4c is provided with components necessary for processing the wafer in this manner.

[0019] Specifically, such components include a holding table for holding a wafer, a processing unit for processing the wafer held by the holding table, and a processing liquid supply unit for supplying processing liquid to the processing point when the wafer is processed by the processing unit.

[0020] Furthermore, the processing devices 4a, 4b, and 4c are provided with flow meters 8a, 8b, and 8c for measuring the amount of exhaust air, and operating environment adjustment units 10a, 10b, and 10c for adjusting the operating environment.

[0021] Each of the flow meters 8a, 8b, and 8c is provided close to the exhaust ports 6a, 6b, and 6c, for example, inside or outside the exhaust ports 6a, 6b, and 6c, so that the exhaust volume can be measured. Also, the operating environment conditioning units 10a, 10b, and 10c include components for increasing or decreasing the exhaust volume, for example.

[0022] 2 is a block diagram showing the components included in each of the operating environment adjustment units 10a, 10b, and 10c. Each of the operating environment adjustment units 10a, 10b, and 10c includes an exhaust port shielding member 12 for shielding a portion of the exhaust ports 6a, 6b, and 6c, and an exhaust fan 14 for promoting exhaust through the exhaust ports 6a, 6b, and 6c.

[0023] The exhaust port shielding member 12 is, for example, a plate-like structure that can slide inside or outside the exhaust ports 6a, 6b, 6c to cover or open the exhaust ports 6a, 6b, 6c. In each of the processing devices 4a, 4b, 4c, the amount of exhaust air can be reduced by increasing the proportion of the exhaust ports 6a, 6b, 6c that are shielded by the exhaust port shielding member 12.

[0024] The exhaust fan 14 is provided near the exhaust ports 6a, 6b, and 6c so as to generate an airflow from the inside to the outside of the processing devices 4a, 4b, and 4c through the exhaust ports 6a, 6b, and 6c. In each of the processing devices 4a, 4b, and 4c, the exhaust volume can be increased by increasing the rotation speed of the exhaust fan 14.

[0025] In addition, as shown in FIG. 1, each processing apparatus 4a, 4b, 4c is provided with controllers 16a, 16b, 16c for controlling components necessary for processing wafers, flow meters 8a, 8b, 8c, and operating environment adjustment units 10a, 10b, 10c.

[0026] Each of the controllers 16a, 16b, and 16c includes a memory and a processor. The memory is configured, for example, by a volatile memory such as a dynamic random access memory (DRAM) or a static random access memory (SRAM), and a non-volatile memory such as a solid state drive (SSD) (NAND flash memory) or a hard disk drive (HDD) (magnetic storage device). The processor is configured, for example, by a central processing unit (CPU).

[0027] The memory stores data, programs, etc. used by the processor. The processor uses the data stored in the memory while reading and executing the programs stored in the memory.

[0028] The data includes, for example, processing conditions for processing the wafers, and the program includes a program for controlling components required for processing the wafers so that the wafers are processed in accordance with the processing conditions, a program for controlling flow meters 8a, 8b, and 8c to measure the exhaust volume, and a program for controlling operating environment adjustment units 10a, 10b, and 10c to increase or decrease the exhaust volume.

[0029] Furthermore, the controllers 16a, 16b, and 16c can communicate with each other and with the master controller 18. Furthermore, the master controller 18 can communicate with the suction source 2. Note that this communication may be either wireless or wired.

[0030] The master controller 18 includes a master memory and a master processor. The master memory is composed of, for example, a volatile memory and a nonvolatile memory, similar to the memories of the controllers 16 a, 16 b, and 16 c. The master processor is composed of, for example, a CPU, similar to the processors of the controllers 16 a, 16 b, and 16 c.

[0031] The master memory stores data, programs, etc. used in the master processor. The master processor reads and executes the programs stored in the master memory while using the data stored in the master memory.

[0032] This data includes a threshold value for the difference in displacement between the largest and smallest of the multiple processing devices 4a, 4b, and 4c. The master memory also stores a program for implementing a processing device management method that adjusts the operating environment of at least one of the multiple processing devices 4a, 4b, and 4c to stabilize the processing quality of the devices.

[0033] 3 is a flow chart showing an example of a management method for adjusting the operating environment of at least one of the processing tools 4a, 4b, and 4c. In this method, first, the exhaust volume of each of the processing tools 4a, 4b, and 4c is measured while operating the suction source 2 so that each of the processing tools 4a, 4b, and 4c exhausts air through the exhaust ports 6a, 6b, and 6c (measurement step S1).

[0034] In this measurement step S1, the master processor sends a signal (exhaust instruction signal) to the suction source 2 instructing it to evacuate the multiple processing devices 4a, 4b, and 4c, and also sends a signal (measurement instruction signal) to the controllers 16a, 16b, and 16c instructing it to measure the exhaust volume of each of the multiple processing devices 4a, 4b, and 4c.

[0035] In addition, if evacuation of the multiple processing devices 4a, 4b, and 4c has begun prior to the measurement step S1 (for example, if wafer processing has begun in one of the multiple processing devices 4a, 4b, and 4c prior to the measurement step S1, and an evacuation instruction signal is sent from the master processor to the suction source 2 when this processing begins), the sending of the evacuation instruction signal from the master processor to the suction source 2 in the measurement step S1 may be omitted.

[0036] When a measurement instruction signal is received in each of the controllers 16a, 16b, 16c, the processor controls the flow meters 8a, 8b, 8c to measure the exhaust volume, and then the processor sends a signal indicating the measured exhaust volume to the master controller 18. When the master controller 18 receives a signal indicating the exhaust volume of each of the plurality of processing devices 4a, 4b, 4c, the master controller calculates the difference in exhaust volume between the largest and smallest of the plurality of processing devices 4a, 4b, 4c, and then compares the calculated difference in exhaust volume with a threshold value stored in the master memory.

[0037] If the difference in displacement between the largest and smallest of the processing devices 4a, 4b, and 4c exceeds the threshold value (step S2: YES), the operating environment of at least one of the processing devices 4a, 4b, and 4c is adjusted so that the difference in displacement is equal to or less than the threshold value (adjustment step S3). In this adjustment step S3, the master processor transmits a signal to the controllers 16a, 16b, and 16c instructing at least one of the processing devices 4a, 4b, and 4c to change the operating environment.

[0038] For example, in adjustment step S3, a signal (exhaust volume reduction instruction signal) is sent to the processing device 4a, 4b, 4c with the largest exhaust volume, instructing it to reduce the exhaust volume; specifically, a signal instructing it to increase the proportion of the exhaust ports 6a, 6b, 6c that are blocked by the exhaust port shielding members 12a, 12b, 12c and / or to reduce the rotation speed of the exhaust fans 14a, 14b, 14c.

[0039] Alternatively, in the adjustment step S3, a signal (exhaust volume increase instruction signal) may be sent to the processing device 4a, 4b, 4c with the smallest exhaust volume, instructing it to increase the exhaust volume, specifically, a signal instructing it to reduce the proportion of the exhaust ports 6a, 6b, 6c that are blocked by the exhaust port shielding members 12a, 12b, 12c and / or to increase the rotation speed of the exhaust fans 14a, 14b, 14c.

[0040] Alternatively, in the adjustment step S3, a displacement decrease instruction signal may be sent to the machining device 4a, 4b, 4c with the largest displacement, and a displacement increase instruction signal may be sent to the machining device 4a, 4b, 4c with the smallest displacement.

[0041] When a signal instructing to change the operating environment is received in at least one of the controllers 16a, 16b, 16c of the processing machines 4a, 4b, 4c, the processor controls the operating environment adjustment units 10a, 10b, 10c in accordance with the instruction, so that the difference in displacement between the largest and smallest of the processing machines 4a, 4b, 4c becomes equal to or smaller than the threshold value.

[0042] 3, the control method for processing devices 4a, 4b, and 4c is performed by referring to the displacements of the processing devices 4a, 4b, and 4c measured in the measurement step S1. If the difference in displacement between the largest and smallest of the processing devices 4a, 4b, and 4c exceeds a threshold, the operating environment of at least one of the processing devices 4a, 4b, and 4c is adjusted so that this difference is equal to or less than the threshold. This method makes it possible to stabilize the processing quality of the processing devices 4a, 4b, and 4c.

[0043] The above is one embodiment of the present invention, and the present invention is not limited to the above. For example, the number of processing devices 4a, 4b, and 4c evacuated by a common suction source 2 in the present invention is not limited to three, and may be two, or four or more.

[0044] Furthermore, in the present invention, each of the operating environment adjustment units 10a, 10b, and 10c may include either the exhaust port shielding member 12 or the exhaust fan 14, but not the other. Alternatively, each of the operating environment adjustment units 10a, 10b, and 10c may include components other than the exhaust port shielding member 12 and the exhaust fan 14.

[0045] Components other than the exhaust port shielding member 12 and the exhaust fan 14 included in each operating environment adjustment unit 10a, 10b, 10c include, for example, an intake port shielding member for shielding part of the intake port provided in each processing device 4a, 4b, 4c, and an intake fan for promoting intake through this intake port.

[0046] The air intake port shielding member is, for example, a plate-like structure that can slide inside or outside the air intake port to cover or open the air intake port. In each of the processing devices 4a, 4b, and 4c, the flow rate of gas drawn in through the air intake port (intake volume) can be reduced by increasing the proportion of the exhaust ports 6a, 6b, and 6c that are covered by the air intake port shielding member. Furthermore, reducing the intake volume of each of the processing devices 4a, 4b, and 4c suppresses an increase in their internal pressure, thereby reducing the exhaust volume of each of the processing devices 4a, 4b, and 4c.

[0047] The intake fan is installed near the intake port so as to generate an airflow from the outside to the inside of the processing devices 4a, 4b, and 4c through the intake port. The intake volume of each processing device 4a, 4b, and 4c can be increased by increasing the rotation speed of the intake fan. Increasing the intake volume of each processing device 4a, 4b, and 4c also promotes an increase in the internal pressure, thereby increasing the exhaust volume of each processing device 4a, 4b, and 4c.

[0048] Furthermore, in the present invention, the controllers 16a, 16b, 16c of any of the plurality of processing devices 4a, 4b, 4c may have the function of the master controller 18. That is, the method of managing the processing devices shown in Fig. 3 may be implemented by transmitting appropriate signals from any of the controllers 16a, 16b, 16c of the plurality of processing devices 4a, 4b, 4c to the suction source 2 and the other processing devices 4a, 4b, 4c, instead of the master controller 18.

[0049] Furthermore, the processing device management method of the present invention is not limited to that shown in Fig. 3. Fig. 4 is a flowchart schematically showing an example of a processing device management method different from the processing device management method shown in Fig. 3. Specifically, Fig. 4 is a flowchart schematically showing an example of a processing device management method that adjusts the operating environment of at least one of three or more processing devices 4a, 4b, and 4c.

[0050] In this method, first, the exhaust volumes of the three or more processing devices 4a, 4b, and 4c are measured while operating the suction source 2 so that the three or more processing devices 4a, 4b, and 4c exhaust air through the exhaust ports 6a, 6b, and 6c, respectively (measurement step S1'). This measurement step S1' is performed in the same manner as the above-mentioned measurement step S1, and therefore a detailed description thereof will be omitted.

[0051] After the measurement step S1', it is determined whether each of the three or more machining devices 4a, 4b, and 4c is operating (determination step S4). In this determination step S4, for example, the master processor transmits to the controllers 16a, 16b, and 16c a signal (reply request signal) requesting an answer as to the operating status of the machining liquid supply unit in each of the machining devices 4a, 4b, and 4c, specifically, whether the machining liquid is being supplied.

[0052] When each of the controllers 16a, 16b, and 16c receives the response request signal, the processor checks the operating status of the machining liquid supply unit, and then the processor transmits a signal indicating the checked operating status of the machining liquid supply unit to the master controller 18.

[0053] When the master controller 18 receives a signal indicating the operating status of the processing liquid supply unit in each of three or more processing devices 4a, 4b, 4c, the master controller 18 determines that the processing devices 4a, 4b, 4c whose processing liquid supply units are operating are the processing devices 4a, 4b, 4c in operation, and determines that the processing devices 4a, 4b, 4c whose processing liquid supply units are not operating are the processing devices 4a, 4b, 4c that are not operating.

[0054] Then, if it is determined that two or more processing devices 4a, 4b, 4c are operating and at least one of the processing devices 4a, 4b, 4c is not operating (step 5: YES), and the difference in displacement between the largest and smallest of the three or more processing devices 4a, 4b, 4c exceeds a threshold value (step S2': YES), the displacement of the at least one processing device 4a, 4b, 4c is made smaller than the displacement of the two or more processing devices 4a, 4b, 4c, and the operating environment of at least one of the three or more processing devices 4a, 4b, 4c is adjusted so that the difference in displacement between the largest and smallest of the two or more processing devices 4a, 4b, 4c is equal to or less than the threshold value (adjustment step S3').

[0055] In this adjustment step S3', the master processor sends a signal to the controllers 16a, 16b, 16c instructing at least one of the three or more processing devices 4a, 4b, 4c to change the operating environment.

[0056] For example, in the adjustment step S3', a signal is sent to at least one of the processing devices 4a, 4b, 4c to maximize the percentage of the exhaust ports 6a, 6b, 6c that are covered and to stop the rotation of the exhaust fans 14a, 14b, 14c, and an exhaust volume decrease instruction signal is sent to the processing device with the largest exhaust volume among the two or more processing devices 4a, 4b, 4c, and an exhaust volume increase instruction signal is sent to the processing device with the smallest exhaust volume among them.

[0057] When a signal instructing to change the operating environment is received in at least one controller 16a, 16b, 16c of the three or more processing devices 4a, 4b, 4c, the processor controls the operating environment adjustment unit 10a, 10b, 10c in accordance with the instruction. As a result, the displacement of the at least one processing device 4a, 4b, 4c becomes smaller than the displacement of the two or more processing devices 4a, 4b, 4c, and the difference in displacement between the largest and smallest of the two or more processing devices 4a, 4b, 4c becomes equal to or smaller than a threshold value.

[0058] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0059] 2: Suction source 4a,4b,4c: Processing equipment 6a, 6b, 6c: Exhaust port 8a, 8b, 8c: Flowmeter 10a, 10b, 10c: Operating environment adjustment unit 12: Exhaust port shielding member 14: Exhaust fan 16a, 16b, 16c: Controller 18: Master Controller

Claims

1. 1. A method for managing processing devices, which adjusts the operating environment of at least one of a plurality of processing devices, each having an exhaust port connected to a common suction source, comprising: a measuring step of measuring the exhaust volume of each of the plurality of processing devices while operating the suction source so that each of the plurality of processing devices is exhausted through the exhaust port; an adjusting step of adjusting the operating environment of at least one of the plurality of processing devices so that the difference in displacement between the largest and smallest of the plurality of processing devices is equal to or less than the threshold value when the difference exceeds a threshold value, with reference to the displacement measured in the measuring step; A management method for a processing device comprising:

2. each of the plurality of processing devices has an exhaust port shielding member for shielding a part of the exhaust port; 2. The method for managing a processing device according to claim 1, wherein the operating environment is a ratio of the exhaust port shielding member to the ratio of the exhaust port shielding member to the ratio of the air outlet shielding member to the air outlet shielding member.

3. each of the plurality of processing devices has an exhaust fan for promoting exhaust through the exhaust port; 2. The method for managing a processing device according to claim 1, wherein the operating environment is a rotation speed of the exhaust fan.

4. each of the plurality of processing devices has an exhaust port shielding member for shielding a portion of the exhaust port and an exhaust fan for promoting exhaust through the exhaust port; 2. The method for managing a processing device according to claim 1, wherein the operating environment is a ratio of the exhaust port covered by the exhaust port covering member and a rotation speed of the exhaust fan.

5. 5. The method for managing processing devices according to claim 1, wherein the plurality of processing devices are capable of communicating with each other.

6. A method for managing processing devices, which adjusts the operating environment of at least one of three or more processing devices, each having an exhaust port connected to a common suction source, comprising: a measuring step of measuring the exhaust volume of each of the three or more processing devices while operating the suction source so that each of the three or more processing devices is exhausted through the exhaust port; a determining step of determining whether each of the three or more processing devices is operating; an adjustment step of, when it is determined in the determination step that two or more processing devices are operating and at least one processing device is not operating, and the difference in exhaust volume between the largest and smallest of the two or more processing devices exceeds a threshold value by referring to the exhaust volumes measured in the measurement step, making the exhaust volume of the at least one processing device smaller than the exhaust volumes of the two or more processing devices, and adjusting the operating environment of at least one of the three or more processing devices so that the difference becomes equal to or less than the threshold value; A management method for a processing device comprising:

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