Optical connectors and optical waveguide components

Abstract

An optical connector and an optical waveguide component are provided that facilitate alignment between an optical waveguide and an optical fiber. [Solution] The optical connector comprises a block having a first surface and in which a first opening and a second opening reaching the first surface are formed, an optical fiber provided within the first opening and having a first end face exposed to the first surface, and a resin material provided within the second opening, wherein a recess having a wall surface continuous with the first surface is formed in the resin material.

Description

[Technical Field]

[0001] The present disclosure relates to optical connectors and optical waveguide components. [Background technology]

[0002] Various techniques have been proposed for optically coupling an optical fiber to an optical waveguide provided on a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-326602 [Patent Document 2] Special Publication No. 2022-509356 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional techniques, alignment between the optical waveguide and the optical fiber is complicated.

[0005] An object of the present disclosure is to provide an optical connector and an optical waveguide component that allow easy alignment between an optical waveguide and an optical fiber. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided an optical connector comprising: a block having a first surface and in which a first opening and a second opening reaching the first surface are formed; an optical fiber provided within the first opening and having a first end face exposed to the first surface; and a resin material provided within the second opening, wherein a recess having a wall surface continuous with the first surface is formed in the resin material. [Effects of the Invention]

[0007] According to the present disclosure, alignment between an optical waveguide and an optical fiber can be easily performed. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating an optical waveguide component according to a first embodiment. [Figure 2] FIG. 2 is an exploded plan view illustrating the optical waveguide component according to the first embodiment. [Figure 3] 1 is a cross-sectional view illustrating an optical waveguide component according to a first embodiment. [Figure 4] 2 is a side view illustrating an optical connector included in the optical waveguide part according to the first embodiment. FIG. [Figure 5] 4A to 4C are side views (part 1) illustrating a method for manufacturing an optical connector included in the optical waveguide part according to the first embodiment. [Figure 6] 6A to 6C are side views (part 2) illustrating a method for manufacturing an optical connector included in the optical waveguide part according to the first embodiment. [Figure 7] 4A to 4C are cross-sectional views (part 1) illustrating a method for manufacturing an optical connector included in the optical waveguide part according to the first embodiment. [Figure 8] 5A and 5B are cross-sectional views (part 2) illustrating a method for manufacturing an optical connector included in the optical waveguide part according to the first embodiment. [Figure 9] 10A to 10C are cross-sectional views illustrating a method for forming a convex portion. [Figure 10] 10 is a plan view illustrating an example of an optical waveguide substrate included in the optical waveguide component according to the second embodiment. FIG. [Figure 11] FIG. 10 is a cross-sectional view illustrating an example of an optical waveguide substrate included in an optical waveguide component according to a second embodiment. [Figure 12] 10A to 10C are cross-sectional views illustrating a method for manufacturing an optical waveguide substrate included in the optical waveguide component according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description may be omitted.

[0010] (First embodiment) A first embodiment will be described. The first embodiment relates to an optical waveguide component. The optical waveguide component includes an optical waveguide substrate and an optical connector.

[0011] [Structure of optical waveguide components] The structure of the optical waveguide component according to the first embodiment will be described. FIG. 1 is a plan view illustrating the optical waveguide component according to the first embodiment. FIG. 2 is an exploded plan view illustrating the optical waveguide component according to the first embodiment. FIG. 3 is a cross-sectional view illustrating the optical waveguide component according to the first embodiment. FIG. 4 is a side view illustrating an optical connector included in the optical waveguide component according to the first embodiment. FIG. 3(a) corresponds to the cross-sectional view taken along line IIIa-IIIa in FIG. 1. FIG. 3(b) corresponds to the cross-sectional view taken along line IIIb-IIIb in FIG. 1.

[0012] As shown in FIGS. 1 to 4, the optical waveguide component 1 according to the first embodiment includes an optical waveguide substrate 91 and an optical connector 40. As shown in FIG.

[0013] The optical waveguide substrate 91 includes a substrate 15, an optical waveguide 10, an optical semiconductor chip 18, and two protrusions 30.

[0014] The substrate 15 is, for example, a wiring substrate, and has a wiring pattern (not shown) and electrodes (not shown). The optical waveguide 10 and the optical semiconductor chip 18 are provided on one main surface 16 of the substrate 15.

[0015] In this embodiment, for convenience, the optical waveguide 10 and optical semiconductor chip 18 side will be referred to as the upper side or one side, and the opposite side will be referred to as the lower side or other side, with respect to the substrate 15. The upper surface of each part will be referred to as the one side or top surface, and the lower surface will be referred to as the other side or bottom surface. However, the optical waveguide component 1 can be used upside down or positioned at any angle. Furthermore, a planar view refers to viewing an object from the normal direction of the main surface 16 of the substrate 15, and a planar shape refers to the shape of the object viewed from the normal direction of the main surface 16 of the substrate 15.

[0016] The optical waveguide 10 has a plurality of core layers 11 and a clad 12. The clad 12 is provided around the core layers 11. The clad 12 has a first clad layer 13 and a second clad layer 14. The optical waveguide 10 is a polymer waveguide.

[0017] The first cladding layer 13 is provided on the substrate 15. The material of the first cladding layer 13 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the first cladding layer 13 is, for example, about 10 μm to 30 μm.

[0018] The core layers 11 are provided in a strip shape on the first clad layer 13. The material of the core layers 11 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The core layers 11 extend along a first axis. For example, the cross-sectional shape of the core layers 11 perpendicular to the extension direction is rectangular. To obtain a single-mode optical waveguide, the core layers 11 may have a very small cross-sectional area. For example, the width of the core layers 11 is 5 μm to 10 μm, and the height is 5 μm to 10 μm. The core layers 11 have second end faces 82 exposed on the fourth surface 24. For example, the second end face 82 is flush with the fourth surface 24. The core layers 11 are an example of a first core.

[0019] The second cladding layer 14 is provided on the first cladding layer 13 and the plurality of core layers 11. The second cladding layer 14 covers the plurality of core layers 11. The material of the second cladding layer 14 is, for example, an organic resin such as an epoxy resin or a polyimide resin. The thickness of the second cladding layer 14 is, for example, about 10 μm to 30 μm.

[0020] In the optical waveguide 10, the refractive index of the core layer 11 is higher than the refractive indexes of the first cladding layer 13 and the second cladding layer 14.

[0021] The optical semiconductor chip 18 includes an optical element (not shown) and is mounted on the substrate 15. The optical semiconductor chip 18 has a plurality of electrodes 19 and is flip-chip mounted on the substrate 15. The optical semiconductor chip 18 is provided on the main surface 16. The optical semiconductor chip 18 is disposed on one side of the core layer 11 in the extension direction, and the optical element is optically coupled to the optical waveguide 10. The optical element may be either a light-receiving element or a light-emitting element. The optical semiconductor chip 18 may also include both a light-receiving element and a light-emitting element.

[0022] The clad 12 has a fourth surface 24 on the other side in the extension direction of the core layer 11. The fourth surface 24 intersects with the first axis, and is preferably perpendicular to the first axis. For example, the fourth surface 24 is a flat surface.

[0023] Two protrusions 30 are provided on the fourth surface 24. The protrusions 30 protrude from the fourth surface 24 along the first axis. The protrusions 30 have a truncated cone shape. The diameter of the protrusions 30 continuously decreases toward the tip. For example, the wall surface of the protrusions 30 is inclined at about 7° from the first axis. The material of the protrusions 30 is an organic resin such as epoxy resin or polyimide resin. The diameter of the protrusions 30 on the fourth surface 24 is, for example, 30 μm to 200 μm. The height of the protrusions 30 is, for example, 100 μm to 300 μm.

[0024] The optical connector 40 includes a block 50, a plurality of optical fibers 60, and an adhesive layer 70.

[0025] The block 50 has a substrate 51 and a lid member 56. The block 50 has a first surface 21 that faces the fourth surface 24 of the cladding 12. For example, the first surface 21 is a flat surface.

[0026] The substrate 51 includes glass. The substrate 51 may be made of glass. The substrate 51 has a second surface 22. The second surface 22 intersects with the first surface 21 and is preferably perpendicular to the first surface 21. A plurality of first grooves 52 and two second grooves 53 are formed on the second surface 22. The number of first grooves 52 is equal to the number of core layers 11. The first grooves 52 and the second grooves 53 extend along a first axis. The first grooves 52 are adjacent to each other, and one second groove 53 is adjacent to each of the two outermost first grooves 52. The cross-sectional shape of the first grooves 52 and the second grooves 53 perpendicular to the first axis is V-shaped, and each of the first grooves 52 and the second grooves 53 is defined by two wall surfaces. The angle between the two wall surfaces is, for example, approximately 60°. For example, the wall surfaces are flat.

[0027] The optical fibers 60 are arranged one by one in the first grooves 52. For example, the optical fibers 60 are bare fibers, and the diameter of the optical fibers 60 is approximately 125 μm. A portion of each optical fiber 60 is located above the second surface 22. The optical fibers 60 have a first end face 81 exposed on the first surface 21. For example, the first end face 81 is flush with the first surface 21. The first end face 81 faces the second end face 82.

[0028] The lid material 56 includes glass. The lid material 56 may be made of glass. The lid material 56 has a third surface 23. The third surface 23 intersects with the first surface 21 and is preferably perpendicular to the first surface 21. The third surface 23 faces the second surface 22. For example, the third surface 23 is a flat surface.

[0029] A first opening 57 is defined by the wall surface 54 of the first groove 52 and the third surface 23 of the lid member 56, and a second opening 58 is defined by the wall surface 55 of the second groove 53 and the third surface 23 of the lid member 56. The first opening 57 and the second opening 58 reach the first surface 21 and are continuous with the first surface 21. The first opening 57 and the second opening 58 extend along the first axis. The cross sections of the first opening 57 and the second opening 58 perpendicular to the first axis are substantially triangular. In this cross section, the length of the wall surface 54 and the length of the wall surface 55 are, for example, 200 μm to 300 μm. Parts of two adjacent first openings 57 may be connected to each other, or parts of two adjacent first openings 57 and second openings 58 may be connected to each other. An optical fiber 60 is provided in the first opening 57. The optical fiber 60 contacts the wall surface of the first groove 52 and the third surface 23 of the lid member 56.

[0030] An adhesive layer 70 is provided between the substrate 51 and the lid member 56. The adhesive layer 70 bonds the substrate 51 and the lid member 56 to each other. The adhesive layer 70 contains an organic resin. For example, the adhesive layer 70 is formed of an ultraviolet curing resin. The adhesive layer 70 is also provided inside the first opening 57 and the second opening 58. The adhesive layer 70 has a resin material 71 provided inside the second opening 58.

[0031] A recess 72 is formed in the resin material 71. The recess 72 has a wall surface 73 that is continuous with the first surface 21. The recess 72 extends along the first axis. The diameter of the recess 72 continuously decreases toward the bottom. That is, the area of ​​the recess 72 in a cross section perpendicular to the first axis decreases with increasing distance from the first surface 21. For example, the wall surface 73 of the recess 72 is inclined at about 7° from the first axis. The depth of the recess 72 is equal to or greater than the height of the protrusion 30, and is, for example, 200 μm to 300 μm.

[0032] [Optical connector manufacturing method] Next, a method for manufacturing the optical connector 40 will be described. Figures 5 and 6 are side views illustrating an example of the method for manufacturing the optical connector 40. Figures 7 and 8 are cross-sectional views illustrating an example of the method for manufacturing the optical connector 40. Figures 7(a) to 7(d) correspond to cross-sectional views taken along line VII-VII in Figures 5(a) to 5(d), respectively. Figures 8(a) to 8(c) correspond to cross-sectional views taken along line VIII-VIII in Figures 6(a) to 6(c), respectively.

[0033] As shown in FIGS. 5(a) and 7(a), a substrate 51 having a first groove 52 and a second groove 53 formed therein is prepared.

[0034] 5(b) and 7(b), the optical fiber 60 is placed in the first groove 52. At this time, the optical fiber 60 is placed so that the tip thereof protrudes from the first groove 52 along the first axis.

[0035] 5(c) and 7(c), adhesive 74 is applied to the second surface 22. For example, the material of the adhesive 74 is an ultraviolet curing resin. The adhesive 74 is also provided in the first groove 52 and the second groove 53.

[0036] Next, as shown in Figures 5(d) and 7(d), the lid member 56 is placed. At this time, a load is applied from above the lid member 56 to spread the adhesive 74. Then, the adhesive 74 is temporarily cured.

[0037] 6(a) and 8(a), the substrate 51 and the lid member 56 are polished to form a block 50 having a first surface 21 from the substrate 51 and the lid member 56. At this time, the optical fiber 60 and the adhesive 74 are also polished to form a first end surface 81 on the optical fiber 60. The block 50 has a first opening 57 and a second opening 58. The adhesive 74 is then cured to obtain the adhesive layer 70.

[0038] 6(b) and 8(b), laser light L1 is irradiated onto the resin material 71, which is the portion of the adhesive layer 70 inside the second opening 58. For example, excimer laser light is used as the laser light L1.

[0039] 6(c) and 8(c), by irradiation with laser light L1, a recess 72 having a wall surface 73 is formed in the resin material 71. When excimer laser light as laser light L1 is irradiated perpendicularly to the first surface 21, the angle between the first axis and the wall surface 73 is approximately 7°.

[0040] In this manner, the optical connector 40 can be manufactured.

[0041] [Method of forming convex parts] Next, a description will be given of a method for forming the protrusions 30. Fig. 9 is a cross-sectional view illustrating an example of a method for forming the protrusions 30.

[0042] As shown in FIG. 9(a), a cylindrical protrusion 31 is formed in the region of the fourth surface 24 of the optical waveguide 10 where the convex portion 30 is to be formed.

[0043] 9(b), a laser beam L2 is irradiated onto the outer periphery of the protrusion 31. For example, an excimer laser beam is used as the laser beam L2.

[0044] 9(c), the irradiation of the laser light L2 removes the region of the protrusion 31 irradiated with the laser light L2, and a convex portion 30 having a truncated cone shape is formed on the fourth surface 24. When the excimer laser light as the laser light L2 is irradiated perpendicularly to the fourth surface 24, the angle between the first axis and the wall surface of the convex portion 30 is about 7°.

[0045] In this manner, the protrusions 30 can be formed.

[0046] The optical waveguide component 1 is used by connecting the optical waveguide substrate 91 and the optical connector 40 to each other. When connecting, the optical connector 40 is pressed against the optical waveguide 10 while fitting the convex portion 30 into the concave portion 72. At this time, the optical connector 40 can be fixed to the optical waveguide 10 by providing an adhesive between the optical waveguide substrate 91 and the optical connector 40. For example, the optical connector 40 may be detachably fixed to the optical waveguide 10 using a latch mechanism or the like.

[0047] In the first embodiment, a recess 72 is formed in the optical connector 40, and a protrusion 30 is provided on the fourth surface 24 of the optical waveguide substrate 91, and the protrusion 30 fits into the recess 72. The recess 72 can be formed with high positional accuracy by, for example, irradiation with laser light L1, and the protrusion 30 can be formed with high positional accuracy by, for example, irradiation with laser light L2.

[0048] As described above, in the first embodiment, the optical waveguide 10 and the optical fiber 60 can be easily aligned with each other. For example, the optical waveguide 10 and the optical fiber 60 can be aligned with an accuracy of within 4 μm. In other words, they can be optically coupled with high positional accuracy without performing alignment.

[0049] (Second embodiment) A second embodiment will be described. The second embodiment differs from the first embodiment mainly in the configuration of the optical waveguide substrate. FIG. 10 is a plan view illustrating an optical waveguide substrate included in the optical waveguide component according to the second embodiment. FIG. 11 is a cross-sectional view illustrating an optical waveguide substrate included in the optical waveguide component according to the second embodiment. FIG. 11 corresponds to a cross-sectional view taken along line XI-XI in FIG. 10.

[0050] The optical waveguide component according to the second embodiment has an optical waveguide substrate 92 instead of the optical waveguide substrate 91. The optical waveguide component according to the second embodiment has an optical connector 40, similar to the first embodiment.

[0051] As in the first embodiment, the optical waveguide substrate 92 includes a substrate 15, an optical waveguide 10, and an optical semiconductor chip 18. The optical waveguide substrate 92 further includes two alignment members 110 and an adhesive portion 150.

[0052] The cladding 12 has a fifth surface 25 continuous with the fourth surface 24, and a sixth surface 26 opposite the fifth surface 25. The fifth surface 25 is the upper surface, and the sixth surface 26 is the lower surface. The sixth surface 26 faces the main surface 16 of the substrate 15 and is in contact with the main surface 16. In the optical waveguide substrate 92, a third opening 130 and a fourth opening 140 are formed in the optical waveguide 10.

[0053] The third opening 130 has a wall surface 131 that is continuous with the fourth surface 24. The third opening 130 extends along the first axis. The diameter of the third opening 130 continuously decreases toward the bottom. That is, the area of ​​the third opening 130 in a cross section perpendicular to the first axis decreases with increasing distance from the fourth surface 24. For example, the wall surface 131 of the third opening 130 is inclined at about 7° from the first axis.

[0054] The fourth opening 140 has a wall surface 141 that is continuous with the fifth surface 25. The fourth opening 140 extends perpendicular to the first axis. The fourth opening 140 is connected to the third opening 130. The fourth opening 140 has a hole 146 that penetrates the first cladding layer 13 and a hole 147 that penetrates the second cladding layer 14. In a plan view, the hole 146 is located inside the hole 147.

[0055] The alignment member 110 has a protrusion 30 and a support portion 120. The alignment member 110 is made of, for example, metal. The protrusion 30 is provided on the fourth surface 24 and protrudes from the fourth surface 24, as in the first embodiment. On the fourth surface 24, the diameter of the third opening 130 is smaller than the diameter of the protrusion 30. The support portion 120 is connected to the protrusion 30 and extends through the third opening 130 into the fourth opening 140.

[0056] The support portion 120 has a first portion 121 within the third opening 130 and a second portion 122 within the fourth opening 140. The second portion 122 has a third portion 123 connected to the first portion 121 and a fourth portion 124 separated from the first portion 121. The third portion 123 is located between the first portion 121 and the fourth portion 124.

[0057] The first portion 121 extends along the first axis. The first portion 121 has a truncated cone shape. The diameter of the first portion 121 continuously decreases as it moves away from the protrusion 30. For example, the wall surface of the first portion 121 is inclined at about 7° from the first axis.

[0058] The third portion 123 and the fourth portion 124 have a cylindrical shape. The diameter of the third portion 123 is smaller than the diameter of the fourth portion 124. The diameter of the fourth portion 124 is also smaller than the minimum diameter of the third opening 130.

[0059] For example, the axes of the protrusion 30, the first portion 121, the third portion 123, and the fourth portion 124 are aligned.

[0060] The adhesive portion 150 is provided in the fourth opening 140. The adhesive portion 150 bonds the support portion 120 to the clad 12. The material of the adhesive portion 150 is, for example, an organic resin such as an epoxy resin or a polyimide resin.

[0061] The other configuration of the optical waveguide substrate 92 is the same as that of the optical waveguide substrate 91 .

[0062] [Method for manufacturing optical waveguide substrate] Next, a method for manufacturing the optical waveguide substrate 92 will be described.

[0063] 12(a), an optical waveguide 10 having a first cladding layer 13, a core layer 11, and a second cladding layer 14 is formed on a substrate 15. When the first cladding layer 13 is formed, a hole 146 is formed by exposure and development, and when the second cladding layer 14 is formed, a hole 147 is formed by exposure and development.

[0064] 12(b), a third opening 130 is formed in the cladding 12. The third opening 130 can be formed by, for example, irradiating with laser light in the same manner as the formation of the recess 72.

[0065] 12(c), the alignment member 110 is inserted into the third opening 130. The alignment member 110 can be formed, for example, by machining a metal wire or bar using a lathe or the like. The alignment member 110 may also be formed by casting. When the alignment member 110 is inserted into the third opening 130 with the fourth portion 124 at the front, the fourth portion 124 and the third portion 123 pass through the third opening 130, and the wall surface of the first portion 121 fits into the third opening 130.

[0066] 12(d), an adhesive is inserted into the fourth opening 140 and cured to form the adhesive portion 150. The adhesive portion 150 bonds the support portion 120 of the alignment member 110 to the cladding 12.

[0067] Although not shown, the optical semiconductor chip 18 is flip-chip mounted on the substrate 15 .

[0068] In this manner, the optical waveguide substrate 92 can be manufactured.

[0069] As in the first embodiment, the second embodiment also facilitates alignment between the optical waveguide 10 and the optical fiber 60. Furthermore, because the adhesive 150 bonds the support 120 of the alignment member 110 to the clad 12, it is possible to prevent the protrusion 30 from falling off. Furthermore, because the diameter of the third opening 130 decreases with increasing distance from the fourth surface 24, it is easy to stabilize the position of the first portion 121 in a plane perpendicular to the first axis. Furthermore, because the diameter of the third portion 123 is smaller than the diameter of the fourth portion 124, the adhesive 150 exists between the clad 12 and the fourth portion 124 around the third portion 123. Therefore, even if a force acts on the alignment member 110 in a direction away from the fourth surface 24, the adhesive 150 between the clad 12 and the fourth portion 124 resists the force, preventing the alignment member 110 from being pulled out.

[0070] The material of the alignment member 110 is not limited to metal, but may be engineering plastic, etc. The alignment member 110 may be formed by injection molding or by using a 3D printer.

[0071] Although the preferred embodiments have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0072] 1. Optical waveguide components 10 Optical waveguide 11 Core layer 12 Clad 13 First cladding layer 14 Second cladding layer 21 Page 1 22 Side 2 23 Page 3 24 Page 4 25 Page 5 26 Page 6 30 Convex part 40 Optical Connector 50 blocks 51 PCB 52 First groove 53 Second groove 54, 55 Wall 56 Lid material 57 First Opening 58 Second Opening 60 Optical Fiber 70 Adhesive layer 71 Resin material 72 recess 73 Wall 81 1st end face 82 Second end face 91, 92 Optical waveguide substrate 110 Alignment member 120 Support part 150 Adhesive part

Claims

1. a block having a first surface and having a first opening and a second opening formed therein and reaching the first surface; an optical fiber provided in the first opening and having a first end face exposed to the first surface; a resin material provided in the second opening; and The optical connector has a recess formed in the resin material, the recess having a wall surface that is continuous with the first surface.

2. 2. The optical connector according to claim 1, wherein the diameter of the recessed portion continuously decreases toward the bottom.

3. The block is a substrate having a second surface in which a first groove constituting the first opening and a second groove constituting the second opening are formed; a lid member having a third surface opposite to the second surface; 3. The optical connector according to claim 1, wherein:

4. 4. The optical connector according to claim 3, wherein each of the first groove and the second groove is defined by two wall surfaces.

5. 3. The optical connector according to claim 1, wherein the block comprises glass.

6. The optical connector according to claim 1 or 2; an optical waveguide substrate; and The optical waveguide substrate comprises: a first core having a second end face opposite to the first end face; a clad provided around the first core and having a fourth surface facing the first surface; a protrusion protruding from the fourth surface and fitted into the recess; An optical waveguide component having:

7. 7. The optical waveguide component according to claim 6, wherein the diameter of the convex portion continuously decreases toward the tip.

8. the cladding has a fifth surface continuous with the fourth surface, The cladding includes: a third opening having a wall surface continuous with the fourth surface; a fourth opening including a wall surface connected to the fifth surface and communicating with the third opening; is formed, the optical waveguide substrate has an alignment member and an adhesive portion; The alignment member includes: The convex portion; a support portion connected to the protrusion, passing through the third opening, and extending into the fourth opening; and The optical waveguide component according to claim 6 , wherein the adhesive portion is provided in the fourth opening and adheres the support portion to the cladding.

9. 9. The optical waveguide component according to claim 8, wherein the diameter of the third opening continuously decreases with increasing distance from the fourth surface.

10. The support portion is a first portion within the third opening; a second portion within the fourth opening; and and The second portion is a third portion connected to the first portion; a fourth portion spaced from the first portion; and the third portion is between the first portion and the fourth portion; 9. The optical waveguide component according to claim 8, wherein the diameter of the third portion is smaller than the diameter of the fourth portion.

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