Transport system and transport method

Abstract

A transport system and a transport method are provided that can prevent foreign matter such as processing chips from adhering to or adhering to a transported object. [Solution] The object (100) has a first surface (110), a second surface (120) opposite the first surface, and a third surface (130) connecting the first and second surfaces. The surface tension pad (220) includes a holding surface (222) facing the first surface of the object and holds the object on the holding surface via liquid. Liquid supply units (194, 230, 231, 232) supply liquid to the first surface and / or the holding surface of the object. Movement units (228, 229) move at least the surface tension pad.

Description

[Technical Field]

[0001] The present invention relates to a transport system and a transport method, and more particularly to a transport system and a transport method that are mounted on a processing device that processes at least a part of an object to be transported and transport the object. [Background technology]

[0002] In recent years, cutting machines that transport objects using Bernoulli pads have become known. For example, Patent Document 1 describes an alignment mechanism that includes a wafer capturing means, a wafer rotating means, and a wafer positioning means. The wafer capturing means captures the wafer in a non-contact manner using an airflow. The wafer rotating means rotates the wafer captured in a non-contact manner by the wafer capturing means. The wafer positioning means detects the shape of the outer periphery of the wafer rotated by the wafer rotating means, and positions the wafer in the rotational direction based on the detection results. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-191464 Summary of the Invention [Problem to be solved by the invention]

[0004] However, according to the inventor's extensive research, the Bernoulli pads described in Patent Document 1, which hold the transported object while supplying compressed air to it, can dry out the surface of the transported object, potentially causing problems when applied to cutting machines. In cutting machines, there is a need to prevent the surface of the transported object from drying out before cleaning to prevent cutting chips from adhering to the transported object. However, using a Bernoulli pad to transport the transported object from the cutting process to the cleaning process dries out the surface of the transported object due to the nature of holding the transported object while supplying compressed air to it, which makes it impossible to meet this need. Furthermore, the use of a Bernoulli pad can attract particles from around the transported object and cause them to adhere to the transported object, or the air sprayed from the Bernoulli pad can become contaminated with oil or impurities, which can then adhere to the transported object, resulting in an unavoidable risk of contaminating the transported object.

[0005] The above-mentioned problems (technical issues) are not limited to cutting devices that transport objects using Bernoulli pads, but apply to all transport systems and transport methods that are mounted on processing devices that process at least a portion of the objects and transport the objects. In other words, there is room for improvement in the prior art from the perspective of preventing foreign matter such as processing chips from adhering to or adhering to the objects when transporting the objects in processing devices.

[0006] An object of the present invention is to provide a transport system and a transport method that can prevent foreign matter such as processing chips from adhering to or adhering to a transported object. [Means for solving the problem]

[0007] A transport system according to one aspect of the present invention is a transport system mounted on a processing device that processes at least a portion of a transported object and transports the transported object, the transport system including a holding surface facing the first surface of the transported object, the holding surface having a first surface, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface, a surface tension pad that holds the transported object on the holding surface via a liquid, a liquid supply unit that supplies liquid to the first surface and / or the holding surface of the transported object, and a moving unit that moves at least the surface tension pad.

[0008] The liquid supply portion does not have to move with the movement of the surface tension pad by the moving portion.

[0009] the conveying system includes a storage section for storing the object to be conveyed; a loading / unloading section for removing the object stored in the storage section from the storage section and for conveying the object to the storage section; a first holding section for holding the object with the first surface exposed; a cutting section for cutting the object held in the first holding section with a rotating cutting blade; a second holding section for holding the object with the first surface exposed; a cleaning section for cleaning the object held in the second holding section; a first conveying section for transporting the object from the first holding section to the second holding section; and a second conveying section for transporting the object from the loading / unloading section to the first holding section and from the second holding section to the loading / unloading section, and the first conveying section may include the surface tension pad, the liquid supplying section, and the moving section.

[0010] the first conveying unit comprises the surface tension pad and the moving unit, and the liquid supply unit is provided at or near the first holding unit and does not move in association with the movement of the surface tension pad by the moving unit.

[0011] The second transport section may have a suction and hold pad that suction-holds the first surface of the object in a non-contact manner.

[0012] The second conveying section may further include a second regulating member provided adjacent to the third surface of the transported object, and a second moving section that brings the second regulating member into contact with and separates it from the third surface of the transported object.

[0013] The first conveying section may further include a first regulating member provided adjacent to the third surface of the transported object, and a first moving section that brings the first regulating member into contact with and separates it from the third surface of the transported object.

[0014] The second transport section may move above the first transport section when transporting the object from the second holding section to the carry-in / out section.

[0015] The first transport unit may move below the second transport unit when transporting the object from the first holding unit to the second holding unit.

[0016] The first conveying section may move below the second conveying section when conveying the object from the first holding section to the second holding section, and the second conveying section may move above the first conveying section when conveying the object from the second holding section to the loading / unloading section.

[0017] The transport system may further include a liquid removal unit that removes liquid adhering to the holding surface of the first transport unit and / or the second surface of the object to be transported.

[0018] A transport method according to one aspect of the present invention includes a carry-out step of carrying out an object stored in a storage section by a carry-in / out unit, the object having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface; a first transport step of transporting the object carried out in the carry-out step from the carry-in / out unit to a first holding unit by a second transport unit having a suction holding pad that suction-holds the first surface of the object without contact, a second regulating member provided adjacent to the third surface of the object, and a second moving unit that brings the second regulating member into contact with and separates from the third surface of the object; a processing step of processing the object held in the first holding unit; and a second moving unit that moves the object processed in the processing step to the second surface of the object. a second conveying step of conveying the object from the first holding part to the second holding part by a first conveying part having a surface tension pad which includes a holding surface facing a first surface of the object and which applies surface tension between the first surface of the object and the holding surface by a liquid supplied to the holding surface, a first restricting member provided adjacent to the third surface of the object, and a first moving part which brings the first restricting member into contact with the third surface of the object and then moves it away from the third surface of the object; a cleaning step of cleaning the object held in the second holding part; a third conveying step of conveying the object which has undergone the cleaning step from the second holding part to the carry-in / out part by the second conveying part; and a carry-in step of storing the object conveyed in the third conveying step in the storage part by the carry-in / out part.

[0019] The second conveying process may include a holding surface approaching process of bringing the holding surface of the first conveying section close to the object held in the first holding section, and a liquid supplying process of supplying the liquid from a liquid supplying section, and may also include a surface tension applying process of applying surface tension to the first surface of the object, a lifting process of separating the object from the first holding section while surface tension is applied to the object by the surface tension applying process, and a positioning process of contacting the first regulating member with the third surface of the object separated from the first holding section by the lifting process.

[0020] The support surface of the second holding portion that supports the transported object is formed so that at least a portion of the second surface of the transported object is exposed, and in the third transport step, the second regulating member of the second transport portion is brought into contact with the transported object, and the suction force of the suction holding pad does not have to be applied to the transported object. [Effects of the Invention]

[0021] According to the above aspects, it is possible to provide a transport system and a transport method that can prevent foreign matter such as processing chips from adhering to or adhering to the transported object. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a perspective view illustrating an example of a configuration of a transport system according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view showing an example of a configuration of a cassette placed on a cassette table and wafers stored in the cassette. [Figure 3] FIG. 10 is a diagram showing a first example of the configuration of a first transport pad of a first transport part when a wafer is not being held. [Figure 4] 10A and 10B are diagrams illustrating a first example of the configuration of a first transport pad of a first transport unit in a state where a wafer is held. [Figure 5] FIG. 10 is a diagram showing a second example of the configuration of the first transport pad of the first transport part when the wafer is not being held. [Figure 6] FIG. 10 is a diagram showing a second example of the configuration of the first transport pad of the first transport part in the wafer holding state. [Figure 7] FIG. 10 is a diagram showing an example of the configuration of a second transport pad of the second transport part when the wafer is not being held. [Figure 8] FIG. 10 is a diagram showing an example of the configuration of a second transport pad of the second transport unit in a state where a wafer is held. [Figure 9] FIG. 10 is a diagram showing an example of the configuration of a liquid removal unit that removes liquid adhering to the holding surface of the first transport unit and / or the second surface of the wafer. DETAILED DESCRIPTION OF THE INVENTION

[0023] The term "transport system" as used herein refers to a system mounted on a processing device that processes at least a portion of a transported object and transports the transported object. The processing device may be used to refer to any (all) types of processing device, such as a cutting device that cuts a workpiece (transported object) with an annular cutting blade, a laser processing device that processes a workpiece (transported object) with a laser beam, a polishing device that polishes a workpiece (transported object) with a polishing pad, or a grinding device that grinds a workpiece (transported object) with a grinding wheel.

[0024] The "liquid supply unit" in this specification may be any unit capable of supplying liquid to the first surface (front surface, upper surface) of the object to be transferred and / or the holding surface of the surface tension pad (both described below). For example, the "liquid supply unit" may be incorporated as a component of the transfer unit (first transfer unit) that transfers the object from the first holding unit that holds the object in the cutting unit (processing unit) to the second holding unit that holds the object in the cleaning unit. Alternatively, the "liquid supply unit" may be provided in or near the cutting unit (processing unit) that cuts (processes) the object to be transferred.

[0025] The term "transported object" in this specification may refer to, for example, any object that can be transported by the transport system and transport method of this embodiment, and may be interpreted as a workpiece, a target workpiece, a transported workpiece, a transport target workpiece, a transport target object, etc. The term "transported object" in this specification may be defined as, for example, a frame unit in which a wafer is fixed to a frame via tape, or a frame unit in which a wafer is positioned in an opening of the frame and the frame and wafer are integrated by tape. The term "transported object" in this specification may be, for example, a wafer fixed to a support substrate of the same shape or approximately the same shape as the wafer, or a combination of a wafer and a support substrate. The term "transported object" in this specification may be defined as a single wafer separated (unrelated) from the tape, frame, and frame unit.

[0026] In this specification, when the "transported object" is a frame unit, the surface (top surface) of the wafer, frame, and tape may correspond to the "first surface," the back surface (bottom surface) of the wafer, frame, and tape may correspond to the "second surface," and the side surface (outer peripheral surface, outer edge) of the frame may correspond to the "third surface."

[0027] In this specification, when the "transported object" is a single wafer, the front surface (top surface) of the wafer may correspond to the "first surface," the back surface (bottom surface) of the wafer may correspond to the "second surface," and the side surface (outer peripheral surface, outer peripheral edge) of the wafer may correspond to the "third surface."

[0028] The term "wafer" in this specification may refer to, for example, a "semiconductor wafer" that is the base of a semiconductor integrated circuit. A semiconductor wafer may be realized as a disk obtained by slicing a single crystal pillar made by growing silicon (Si), silicon carbide (SiC), or the like to an appropriate thickness. Furthermore, the term "wafer" is not limited to semiconductor components, but may also refer to wafer-shaped workpieces made of various materials such as silicon (Si), silicon carbide (SiC), glass, and resin. In this specification, when simply referring to a "wafer," this term may be used in a broader sense to include not only semiconductor wafers but also wafer-shaped workpieces that are not limited to semiconductor components. Furthermore, the terms "wafer" and "semiconductor wafer" may be used interchangeably (especially when referring to a semiconductor wafer, this may also be interpreted as referring to a wafer-shaped workpiece that is not limited to semiconductor components).

[0029] The "storage unit" in this specification may be, for example, a cassette that houses a plurality of frame units (frame unit groups) as "transported objects" and / or a cassette that houses a plurality of individual wafers (single wafer groups) as "transported objects," or may be a cassette table (cassette placement unit) on which the cassette is placed. Alternatively, the "storage unit" may be, for example, a mobile storage unit mounted on a rooftop transport system, or may be a component of a system in which a plurality of transport robots move on the rooftop of a manufacturing device such as a cutting device and supply transported objects (wafers) through a supply unit such as an elevator. In other words, there is a degree of freedom in the form of the "storage unit," and various design changes are possible.

[0030] Fig. 1 is a perspective view showing an example of the configuration of a conveyance system 10 of this embodiment. In Fig. 1, a three-dimensional space is defined, and mutually orthogonal X-axis, Y-axis, and Z-axis directions are defined. The plane defined by the X-axis and Y-axis directions (the plane including the X-axis and Y-axis directions) may form a horizontal plane, and the Z-axis direction may be vertical.

[0031] The transport system 10 includes a cutting device and a cleaning device (works in cooperation with the cutting device and the cleaning device), and while transporting (so-called direct transport) a single wafer (transported object) 100, performs various processes (cutting process by the cutting device and cleaning process by the cleaning device) on the wafer 100. In a broader sense, the transport system 10 is mounted on a processing device and transports transported objects such as wafers 100.

[0032] The transport system 10 has a rectangular cassette table (cassette placement unit) 20 that can be raised and lowered in the Z-axis direction, and a cassette table lifting unit (not shown) that raises and lowers the cassette table 20 in the Z-axis direction. The cassette table lifting unit may have a ball screw that is connected to the cassette table 20 and extends in the Z-axis direction, and a motor that rotates the ball screw.

[0033] 2 is a perspective view showing an example of the configuration of a cassette 30 placed on a cassette table 20 and wafers 100 stored (contained) in the cassette 30. A wafer group (single wafer group) made up of a plurality of wafers 100 is stored (contained) in the cassette 30, stacked in the vertical direction (Z-axis direction). Note that FIG. 2 exemplarily illustrates only one wafer 100 included in the wafer group (single wafer group).

[0034] The cassette 30 constitutes a "storage section" that directly stores a plurality of wafers 100 (a group of wafers, a group of individual wafers), and the cassette table 20 constitutes a "storage section" that indirectly stores a plurality of wafers 100 (a group of wafers, a group of individual wafers) via the cassette 30.

[0035] The wafer 100 may be, for example, a semiconductor wafer that is the base of a semiconductor integrated circuit, and has a disk shape made of silicon or the like. The wafer 100 has a first surface (front surface, upper surface) 110, a second surface (back surface, lower surface) 120 opposite to the first surface 110, and a third surface (side surface, outer peripheral surface, outer peripheral edge) 130 that connects the first surface 110 and the second surface 120.

[0036] The first surface 110 of the wafer 100 is divided into a plurality of rectangular regions by grid-like dividing lines (streets) 111, and devices (chips) 112 such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in each of the rectangular regions. A notch 131 indicating the crystal orientation of the wafer 100 is formed in the third surface 130 of the wafer 100.

[0037] The transfer system 10 has a transfer unit 140 that, when the cassette 30 is placed on the cassette table 20, pulls out (transfers out one by one) a single wafer 100 from the cassette 30 among a plurality of wafers 100 (a group of wafers, a group of single wafers), and returns (transfers in one by one) the single wafers 100 to the cassette 30 after various processes (cutting processes, cleaning processes) have been completed in the transfer system 10. This transfer unit 140 has the function of transferring the wafers 100 stored in the storage unit (cassette 30, cassette table 20) out of the storage unit (cassette 30, cassette table 20) and transferring the wafers 100 into the storage unit (cassette 30, cassette table 20).

[0038] The loading / unloading unit 140 has a casing 141 extending in the Y-axis direction and a support piece 142 supported by the casing 141 so as to be movable in the Y-axis direction. The support piece 142 is supported by the casing 141 so as to be movable in the Y-axis direction between a non-operating position in one direction in the Y-axis direction (the positive side of the Y-axis direction depicted in FIG. 1 ) and an operating position in the other direction in the Y-axis direction (the negative side of the Y-axis direction depicted in FIG. 1 ). A U-shaped portion (bifurcated branch portion) 143 is formed at the tip of the support piece 142, and a plurality of suction holes connected to a flow path and a suction portion (not shown) are formed on the upper surface of the U-shaped portion 143. The loading / unloading unit 140 (U-shaped portion 143) configured in this manner functions as a "suction pad" that penetrates the underside of the wafer 100 and suction-holds (vacuums) the second surface 120 of the wafer 100.

[0039] The loading / unloading unit 140 is configured to be moved in the Y-axis direction by a Y-axis movement mechanism (including, for example, a Y-axis movable member 211 and a Y-axis feed unit 212) of the first transport unit 210, which will be described later, and to be moved in the Z-axis direction by a Z-axis movement mechanism (including, for example, a Z-axis movable member 215) of the first transport unit 210, which will be described later. Note that the transport system 10 may be provided with a movement mechanism that moves the loading / unloading unit 140 in the Y-axis direction and the Z-axis direction, separate from the Y-axis movement mechanism (including, for example, a Y-axis movable member 211 and a Y-axis feed unit 212) and the Z-axis movement mechanism (including, for example, a Z-axis movable member 215) of the first transport unit 210.

[0040] In the loading / unloading unit 140, when the cassette 30 is placed on the cassette table 20, the support piece 142 is positioned at the operating position, and the U-shaped portion 143 of the support piece 142 is positioned below one of the target wafers 100 stored in the cassette 30 via a Y-axis movement mechanism (including, for example, a Y-axis movable member 211 and a Y-axis feed unit 212) and a Z-axis movement mechanism (including, for example, a Z-axis movable member 215) of the first transport unit 210, which will be described later. Thereafter, a suction force is generated on the upper surface of the U-shaped portion 143, thereby enabling the wafer 100 to be suction-supported. The loading / unloading unit 140 moves in the Y-axis direction using the Y-axis movement mechanism (including, for example, a Y-axis movable member 211 and a Y-axis feed unit 212) of the first transport unit 210, which will be described later, thereby moving the wafer 100 suction-supported by the U-shaped portion 143 in the Y-axis direction and withdrawing it from the cassette 30.

[0041] Here, we have described the configuration and operation when a single wafer 100 among a plurality of wafers 100 (a group of wafers, a group of single wafers) is pulled out (transported out one by one) from the cassette 30 by the load / unload unit 140. By performing the reverse operation, the single wafers 100 can be returned (transported in one by one) to the cassette 30 using the same (common) load / unload unit 140 after various processes (cutting process, cleaning process) have been completed in the transfer system 10.

[0042] 1, the transfer system 10 has a temporary placement mechanism 150 on which the wafer 100 drawn out (carried out) by the carry-in / out unit 140 is temporarily placed. The temporary placement mechanism 150 has a rectangular parallelepiped base 151 fixed via a bracket (not shown), a circular temporary placement table 152 rotatably mounted on the base 151, and a temporary placement table motor (not shown) that rotates the temporary placement table 152. A suction groove (not shown) connected to a suction unit (not shown) via a flow path (not shown) is formed on the upper surface of the temporary placement table 152. In the temporary placement mechanism 150, the suction unit generates a suction force on the upper surface of the temporary placement table 152, thereby suction-holding the wafer 100 on the temporary placement table 152. The diameter of the temporary placement table 152 is smaller than the dimension between the tips of the U-shaped portion 143 of the loading / unloading section 140, so that the underside of the wafer 100 can be brought into contact with the upper surface of the temporary placement table 152 while the underside of the wafer 100 is supported by suction by the U-shaped portion 143.

[0043] The temporary placement mechanism 150 also includes a detection unit (not shown) that detects the crystal orientation of the wafer 100. This detection unit is equipped with a line sensor (not shown) having a light-emitting element and a light-receiving element that are positioned facing each other in the vertical direction. In the temporary placement mechanism 150, the temporary placement table 152 that holds the wafer 100 by suction is rotated by a temporary placement table motor, and the line sensor of the detection unit detects the position of the notch 131 in association with the rotation angle of the temporary placement table 152, thereby detecting the crystal orientation of the wafer 100.

[0044] The transport system 10 has a second transport section 160 that holds a single wafer 100 positioned in the temporary placement mechanism 150 and transports it to a chuck table (first holding section) 180 described later (transports the wafer 100 from the loading / unloading section 140 to the chuck table 180).

[0045] The second transport unit 160 includes a Y-axis movable member 162 supported on a gate-shaped support frame 161 so as to be movable in the Y-axis direction, a Y-axis feed unit 163 that moves the Y-axis movable member 162 in the Y-axis direction, a Z-axis movable member 166 supported on the lower end of the Y-axis movable member 162 so as to be movable up and down in the Z-axis direction, and a Z-axis feed unit (not shown) that raises and lowers the Z-axis movable member 166 in the Z-axis direction. The Y-axis feed unit 163 includes a ball screw 164 extending in the Y-axis direction and a motor 165 that rotates the ball screw 164, and a nut portion (not shown) of the ball screw 164 is connected to the Y-axis movable member 162. The Y-axis feed unit 163 converts the rotational motion of the motor 165 by the ball screw 164 into linear motion and transmits it to the Y-axis movable member 162, moving the Y-axis movable member 162 in the Y-axis direction along a pair of guide rails 167 provided on the support frame 161. The Z-axis feed section (not shown) of the second transport section 160 may have a configuration including a ball screw connected to the Z-axis movable member 166 and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0046] A second transport pad (a dual-purpose Bernoulli / clamp pad) 170 is coupled (fixed) to the lower end of the Z-axis movable member 166 of the second transport unit 160. The configuration of the second transport pad 170 will be described in detail later with reference to FIGS. 5 and 6. The second transport pad 170 has the function of suction-holding the wafer 100 temporarily placed on the temporary placement mechanism 150 and transporting the wafer 100 to a chuck table (first holding unit) 180 (described later). The second transport pad 170 also has the function of suction-holding the wafer 100 after various processes (cutting process, cleaning process) have been completed in the transport system 10, and returning the wafer 100 to the temporary placement mechanism 150 and further to the transfer unit 140. FIG. 1 exemplarily illustrates a state in which the second transport pad 170 suction-holds the wafer 100.

[0047] Here, there is a degree of freedom in the manner in which the second transport unit 160 (second transport pad 170) receives the wafer 100 from the load / unload unit 140, and various design modifications are possible. For example, the wafer 100 may be temporarily placed on the temporary placement mechanism 150 from the load / unload unit 140, and the second transport unit 160 (second transport pad 170) may directly pick up the temporarily placed wafer 100. Alternatively, after the wafer 100 is temporarily placed and aligned on the temporary placement mechanism 150, the load / unload unit 140 (U-shaped portion 143) may hold the wafer 100 again and transfer the wafer 100 from the load / unload unit 140 (U-shaped portion 143) to the second transport unit 160 (second transport pad 170).

[0048] The transport system 10 has a chuck table (first holding unit) 180 that holds the wafer 100 with the first surface 110 of the wafer 100 exposed, and a cutting unit 190 that cuts the wafer 100 held on the chuck table 180 with a rotating cutting blade.

[0049] Chuck table 180 includes, as related components, a pair of guide rails 181 extending in the X-axis direction at a distance in the Y-axis direction, an X-axis movable member 182 mounted on the pair of guide rails 181 so as to be movable in the X-axis direction, and an X-axis feed unit 183 that moves X-axis movable member 182 in the X-axis direction. X-axis feed unit 183 has a ball screw 184 connected to X-axis movable member 182 and extending in the X-axis direction, and a motor 185 that rotates ball screw 184.

[0050] The chuck table 180 is rotatably mounted on the upper end of the X-axis movable member 182, and a chuck table motor (not shown) for rotating the chuck table 180 is built into the X-axis movable member 182. A circular porous suction chuck (not shown) connected to a suction unit (not shown) is disposed on the upper surface of the chuck table 180. The suction unit generates a suction force on the upper surface of the suction chuck, thereby suction-holding the wafer 100 with the suction chuck.

[0051] The cutting units (cutting blades) 190 are supported by the support frame 161, and a pair of cutting units 190 are provided spaced apart in the Y-axis direction. Each of the pair of cutting units 190 has a spindle housing 191 supported by the support frame 161 so as to be movable in the Y-axis and Z-axis directions, a Y-axis feed unit 192 that moves the spindle housing 191 in the Y-axis direction, and a Z-axis feed unit 193 that moves the spindle housing 192 in the Z-axis direction. The Y-axis feed unit 192 has a ball screw connected to the spindle housing 191 and extending in the Y-axis direction, and a motor that rotates the ball screw. The Z-axis feed unit 193 has a ball screw connected to the spindle housing 191 and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0052] Continuing the explanation of the cutting unit (cutting blade) 190, a spindle is supported in a spindle housing 191 so as to be rotatable about an axis extending in the Y-axis direction, and a spindle motor is provided to rotate the spindle. An annular cutting blade is fixed to the tip of the spindle. The cutting blade is rotated at high speed together with the spindle by the spindle motor, and then the spindle housing 191 is lowered by a Z-axis feed unit 193. The high-speed rotating cutting unit (cutting blade) 190 cuts into the wafer 100 held on the chuck table 180, and the X-axis feed unit 183 feeds the chuck table 180 in the X-axis direction at a predetermined processing feed rate, thereby cutting the wafer 100.

[0053] The cutting process of the wafer 100 by the cutting unit (cutting blade) 190 may be performed as an incomplete cut (half-cut dicing) that requires accurate (precise) control of the cutting depth of the wafer 100. That is, it is assumed that a technique called pre-dicing is performed in which a cut groove having a depth corresponding to the thickness of the device chip is formed along the planned dividing lines of a single wafer, and then a protective tape is attached to the front surface of the wafer and the back surface of the wafer is ground until the cut groove is exposed on the back surface, thereby dividing the wafer into individual device chips. In this case, the cutting device may form a cut groove having a depth corresponding to the thickness of the device chip along the planned dividing lines, and the wafer may be cut incompletely.

[0054] A liquid supply unit 194 that supplies a liquid (e.g., pure water) to the cutting position (cutting point) of the wafer 100 is provided at or near or adjacent to the cutting unit (cutting blade) 190, or at or near or adjacent to the chuck table 180. In FIG. 1, for convenience of illustration, the liquid supply unit 194 is depicted as a simple block connected to the cutting unit (cutting blade) 190. By supplying a liquid (e.g., pure water) from the liquid supply unit 194 to the cutting position (cutting point) before, during, and after cutting of the wafer 100 by the cutting unit (cutting blade) 190, it is possible to maintain the cleanliness of the wafer 100 before and after cutting, and to blow away cutting debris (processing debris). In this embodiment, the liquid supply unit 194 may be a pure water nozzle (pure water supply unit) that supplies liquid (e.g., pure water) to the first surface 110 of the wafer 100 after cutting (processing) and / or to the holding surface 222 of the first transport pad (surface tension pad, interfacial tension pad) 220 described below.

[0055] Here, the liquid supply unit 194 that supplies liquid to the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad (surface tension pad, interfacial tension pad) 220 is not limited to the pure water nozzle described above, but may be composed of a water curtain arranged to straddle the base of the chuck table 180. For example, the water curtain has a gate-like shape that straddles the base of the chuck table 180, and is configured so that the portion of this gate-like shape facing the first surface 110 of the wafer 100 held by the chuck table 180 can supply liquid (e.g., pure water) to the first surface 110 by spraying or dripping.

[0056] The transfer system 10 has a cleaning unit 200 that holds the wafer 100 that has been cut by a cutting unit (cutting blade) 190 and cleans the wafer 100.

[0057] Cleaning unit 200 has a cylindrical casing 201, a spinner table 202 arranged inside casing 201 so as to be rotatable and movable up and down in the Z-axis direction, a spinner table motor (not shown) that rotates spinner table 202, and a spinner table lifting unit (not shown) that lifts and lowers spinner table 202 in the Z-axis direction between an upper attachment / detachment position for attaching and detaching wafer 100 and a lower cleaning position for cleaning wafer 100. The spinner table lifting unit may be configured to have an air cylinder or an electric cylinder.

[0058] A porous circular suction chuck (second holding portion, support surface) 203 connected to a suction portion (not shown) is disposed on the upper surface of the spinner table 202. The suction chuck 203 holds the wafer 100 with the first surface 110 of the wafer 100 exposed, and the cleaning portion 200 cleans the wafer 100 held by the suction chuck 203. In the spinner table 202, the suction portion (not shown) generates a suction force on the upper surface of the suction chuck 203, so that the wafer 100 is suction-held by the suction chuck 203.

[0059] The cleaning unit 200 has a cleaning water nozzle 204 that sprays cleaning water onto the upper surface (first surface 110) of the wafer 100 held on the spinner table 202 (suction chuck 203), and an air nozzle 205 that sprays dry air onto the upper surface (first surface 110) of the wafer 100 held on the spinner table 202 (suction chuck 203). Each of the cleaning water nozzle 204 and the air nozzle 205 may be selectively positioned at an operating position above the spinner table 202 positioned at the lower cleaning position, and at a non-operating position spaced apart from above the spinner table 202.

[0060] In the cleaning section 200, the spinner table 202 holding the wafer 100 is lowered from the upper attachment / detachment position to the lower cleaning position by the spinner table lifting section, and the cleaning water nozzle 204 is positioned in the operating position.The spinner table 202 is then rotated by the spinner table motor, and cleaning water is sprayed from the cleaning water nozzle 204 toward the wafer 100 held by the spinner table 202, thereby cleaning the wafer 100 and removing the cleaning water from the upper surface (first surface 110) of the wafer 100 by the centrifugal force caused by the rotation of the spinner table 202.

[0061] In addition, in the cleaning section 200, the cleaning water nozzle 204 is positioned in a non-operating position, and the air nozzle 205 is positioned in an operating position, and then dry air is sprayed from the air nozzle 205 toward the wafer 100 held on the spinner table 202, thereby removing cleaning water from the upper surface (first surface 110) of the wafer 100 that could not be completely removed by the centrifugal force caused by the rotation of the spinner table 202, and drying the upper surface (first surface 110) of the wafer 100.

[0062] The suction chuck 203 (the support surface of the second holding unit that supports the wafer 100) on the upper surface of the spinner table 202 of the cleaning unit 200 is formed so that at least a portion of the second surface 120 of the wafer 100 is exposed. That is, when compared in plan view, the circular (approximately circular) shape of the suction chuck 203 on the upper surface of the spinner table 202 of the cleaning unit 200 is set to be smaller than the circular (approximately circular) shape of the second surface 120 of the wafer 100, so that when the wafer 100 is held by the suction chuck 203, the peripheral portion of the wafer 100 extends beyond the peripheral portion of the suction chuck 203. The peripheral portion of the wafer 100 extending beyond the peripheral portion of the suction chuck 203 can be clamped and supported by a second transfer pad (a dual-purpose Bernoulli / clamp pad) 170, which will be described later.

[0063] Alternatively, the suction chuck 203 may be set larger (with a larger diameter) than the planar view shape (outer shape) of the second surface 120, and a notch shape may be provided in the suction chuck 203 to allow the second regulating members (contact pin 177 and retaining pin 178) of the second transport pad 170 described later to enter (this may make it possible to achieve clamp support).

[0064] By setting the suction chuck 203 to be smaller (smaller diameter) than the second surface 120 of the wafer 100, it is possible to simplify the shape of the suction chuck 203 and reduce processing costs. By setting the suction chuck 203 to be larger (larger diameter) than the second surface 120 of the wafer 100 and providing a notch shape for inserting second regulating members (contact pins 177 and holding pins 178) of the second transfer pad 170 (described later), it is possible to increase the range in which the second surface 120 of the wafer 100 can be reliably supported, thereby enabling stable cleaning by the cleaning unit 200.

[0065] The transport system 10 has a first transport unit 210 that transports a wafer 100, which is held by a chuck table (first holding unit) 180 and cut by a cutting unit (cutting blade) 190, from the chuck table (first holding unit) 180 to an adsorption chuck (second holding unit, support surface) 203 of the cleaning unit 200.

[0066] The first transport unit 210 includes a Y-axis movable member 211 supported on a gate-shaped support frame 161 so as to be movable in the Y-axis direction, a Y-axis feed unit 212 that moves the Y-axis movable member 211 in the Y-axis direction, a Z-axis movable member 215 supported on a lower end of the Y-axis movable member 211 so as to be movable up and down in the Z-axis direction, and a Z-axis feed unit that raises and lowers the Z-axis movable member 215 in the Z-axis direction. The Y-axis feed unit 212 includes a ball screw 213 extending in the Y-axis direction and a motor 214 that rotates the ball screw 213, and a nut portion (not shown) of the ball screw 213 is connected to the Y-axis movable member 211. The Y-axis feed unit 212 converts the rotational motion of the motor 214 by the ball screw 213 into linear motion and transmits it to the Y-axis movable member 211, moving the Y-axis movable member 211 in the Y-axis direction along a pair of guide rails 216 provided on the support frame 161. Furthermore, the Z-axis feed section of the second transport section 210 may have a configuration including a ball screw that is connected to the Z-axis movable member 215 and extends in the Z-axis direction, and a motor that rotates the ball screw.

[0067] The above-mentioned loading / unloading unit 140 (casing 141, support piece 142, U-shaped portion 143) is fixed to a middle position in the up-down direction (Z-axis direction) of Z-axis movable member 215. A first transport pad (surface tension pad) 220 is fixed to a lower position in the up-down direction (Z-axis direction) of Z-axis movable member 215, i.e., below loading / unloading unit 140 (casing 141, support piece 142, U-shaped portion 143). This first transport pad (surface tension pad) 220 keeps wafer 100 in a wet state when first transport unit 210 transports wafer 100 from chuck table (first holding unit) 180 to suction chuck (second holding unit, support surface) 203 of cleaning unit 200, thereby preventing foreign matter such as cutting chips from adhering to or adhering to wafer 100 (details will be described later with reference to FIGS. 3 and 4, etc.).

[0068] As described above, the second transfer pad (Bernoulli / clamp combination pad) 170 of the second transfer unit 160 transfers the wafer 100 from the load / unload unit 140 (temporary placement mechanism 150) to the chuck table (first holding unit) 180. In addition, the second transfer pad (Bernoulli / clamp combination pad) 170 of the second transfer unit 160 transfers the wafer 100, which has been subjected to the cutting process and cleaning process and is held by the suction chuck (second holding unit) 203 of the cleaning unit 200, from the suction chuck (second holding unit) 203 of the cleaning unit 200 to the load / unload unit 140 (temporary placement mechanism 150).

[0069] Moreover, the second transport pad (Bernoulli / clamp dual-purpose pad) 170 of the second transport section 160 transports the wafer 100 by the "Bernoulli effect" when transporting the wafer 100 from the loading / unloading section 140 (temporary placement mechanism 150) to the chuck table (first holding section) 180, and transports the wafer 100 by the "clamping effect" when transporting the wafer 100 from the suction chuck (second holding section) 203 of the cleaning section 200 to the loading / unloading section 140 (temporary placement mechanism 150) (transportation based on different effects is performed on the way there and back (details will be described later)).

[0070] Next, the configuration of the first transport pad (surface tension pad) 220 of the first transport unit 210 will be described in detail with reference to FIGS. 3 and 4. FIGS. 3A to 3C are diagrams showing a first example of the configuration of the first transport pad (surface tension pad) 220 of the first transport unit 210 when the wafer 100 is not being held. FIGS. 4A to 4C are diagrams showing a first example of the configuration of the first transport pad (surface tension pad) 220 of the first transport unit 210 when the wafer 100 is being held. FIGS. 3A and 4A are plan views, FIGS. 3B and 4B are side views viewed from the top and bottom of FIGS. 3A and 4A, and FIGS. 3C and 4C are side views viewed from the left and right of FIGS. 3A and 4A.

[0071] At least some of the components of the first transfer pad 220 may be made of, for example, carbon fiber composite material (CFRP: Carbon Fiber Reinforced Plastics) or various transparent resins.

[0072] The first transfer pad 220 has a base 221 that is generally circular in plan view. A holding surface 222 that faces the first surface (front surface, top surface) 110 of the wafer 100 is formed on the lower surface (negative surface in the Z-axis direction) of the base 221.

[0073] A guide arm 223 is provided on the upper surface (the surface on the positive side in the Z-axis direction) of the base 221, extending in the diameter direction through the center of the base 221. A pair of separable opposing arms 224 is supported on both ends of the guide arm 223, extending in a direction intersecting (orthogonal to) the extension direction of the guide arm 223. A set of a pair of contact pins 225 and a holding pin 226 is provided on the lower surface (the surface on the negative side in the Z-axis direction) of each of the pair of separable opposing arms 224, each pair being located on both ends in the extension direction of the respective arm. A pair of contact pins 225 is provided on the outer side in the extension direction of the separable opposing arm 224, and a pair of holding pins 226 is provided on the inner side in the extension direction of the separable opposing arm 224 (the outer contact pin 225 and the inner holding pin 226 are adjacent to each other on both sides in the extension direction of the separable opposing arm 224). The contact pin 225 and the holding pin 226 are supported on the lower surface (negative surface in the Z-axis direction) of the separating / attaching opposing arm 224 via a cylinder mechanism that is extendable (movable forward and backward, height adjustable) relative to the separating / attaching opposing arm 224.

[0074] The guide arm 223 is provided with a pair of moving mechanisms 227 that move the pair of separating and retracting opposing arms 224 toward or away from each other in correspondence with the pair of separating and retracting opposing arms 224 supported by the guide arm 223. When the pair of separating and retracting opposing arms 224 are moved toward or away from each other by the pair of moving mechanisms 227, the contact pin 225 and the holding pin 226 provided on the separating and retracting opposing arms 224 also move toward or away from each other.

[0075] The first transport pad (surface tension pad) 220 has (is connected to) a Y-axis movement mechanism 228 that moves the first transport pad 220 in the Y-axis direction, and a Z-axis movement mechanism 229 that moves the first transport pad 220 in the Z-axis direction. The Y-axis movement mechanism 228 may be configured to include, for example, the Y-axis movable member 211 and the Y-axis feed unit 212 shown in FIG. 1. The Z-axis movement mechanism 229 may be configured to include, for example, the Z-axis movable member 215 shown in FIG. 1. The Y-axis movement mechanism 228 and the Z-axis movement mechanism 229 constitute a "moving unit" that moves at least the first transport pad (surface tension pad) 220.

[0076] 3B and 3C , a holding surface 222 formed on the lower surface (negative surface in the Z-axis direction) of the base 221 and facing the first surface (front surface, top surface) 110 of the wafer 100 is supplied with liquid from a liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 of the cutting unit (cutting blade) 190. That is, after cutting by the cutting unit (cutting blade) 190, liquid is supplied (placed) on the first surface (front surface, top surface) 110 of the wafer 100 from the liquid supply unit (e.g., a pure water nozzle or a water curtain) 194. Therefore, when the holding surface 222 of the first transfer pad 220 and the first surface 110 of the wafer 100 are brought face to face (approach each other), the liquid is positioned between them, and the first surface 110 of the wafer 100 is held on the holding surface 222 of the first transfer pad 220 by the action of surface tension via the liquid.

[0077] In this manner, the first transfer pad (surface tension pad) 220 of the first transfer unit 210 holds the first surface 110 of the wafer 100 on the holding surface 222 via liquid supplied from a liquid supply unit (e.g., a pure water nozzle or a water curtain) 194. The liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 has a function of supplying liquid to the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad (surface tension pad) 220. In this case, the liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 is provided at or near or adjacent to the cutting unit (cutting blade) 190, or at or near or adjacent to the chuck table (first holding unit) 180, and does not move in conjunction with the movement of the first transfer pad (surface tension pad) 220 by the moving unit (e.g., including a Y-axis moving mechanism 228 and a Z-axis moving mechanism 229). In other words, the first transport pad (surface tension pad) 220 does not need to have a "liquid supply section," which avoids the hassle of routing a tube for transporting the liquid inside the device and the complexity of the structure, and also eliminates disadvantages such as the risk of water leakage due to deterioration caused by deformation of the tube as it moves inside the device.

[0078] The contact pin 225 and the holding pin 226 constitute a "first regulating member" provided adjacent to the third surface (side surface, outer peripheral surface, outer edge) 130 of the wafer 100. Furthermore, the moving mechanism 227 constitutes a "first moving part" that brings the first regulating member (contact pin 225 and holding pin 226) into contact with and separates from the third surface (side surface, outer peripheral surface, outer edge) 130 of the wafer 100.

[0079] As shown in Figures 3A to 3C, when the first regulating member (contact pin 225 and holding pin 226) is moved away from the third surface 130 of the wafer 100 by the first moving part (moving mechanism 227), the first regulating member (contact pin 225 and holding pin 226) does not contribute to positional regulation (clamping) of the wafer 100 (the wafer is not depicted in Figures 3A to 3C).

[0080] As shown in FIGS. 4A to 4C , when the first movement unit (movement mechanism 227) brings the first regulating members (contact pin 225 and pressure pin 226) into contact with the third surface 130 of the wafer 100, the contact pin 225 contacts the third surface 130 of the wafer 100 to regulate (clamp) its position, and the pressure pin 226 contacts the third surface 130 of the wafer 100 to regulate (clamp) its position. The contact pin 225 and the pressure pin 226 each contact the third surface 130 of the wafer 100, and may also contact at least one of the first surface 110 and the second surface 120 of the wafer 100 while straddling the first surface 110 and the second surface 120 of the wafer 100. For example, the contact pin 225 may contact both the third surface 130 and the second surface 120 of the wafer 100, or may contact only the third surface 130 of the wafer 100. Furthermore, the retaining pins 226 may be in contact across the third surface 130 and the first surface 110 of the wafer 100, or may be in contact only with the first surface 110 of the wafer 100. In this way, the wafer 100 is held on the first transport pad (surface tension pad) 220 by a combination of the action of surface tension caused by the liquid supplied between the first surface 110 of the wafer 100 and the holding surface 222 of the first transport pad (surface tension pad) 220 and the action of position regulation (clamp support) by the first regulating members (contact pins 225 and retaining pins 226).

[0081] Here, the wafer 100 can be held on the first transport pad (surface tension pad) 220 and transported solely by the action of surface tension of the liquid supplied between the first surface 110 of the wafer 100 and the holding surface 222 of the first transport pad (surface tension pad) 220, without (omit) positional regulation (clamping) by the first regulating members (contact pins 225 and holding pins 226) (clamping may be a secondary or sub-function). Furthermore, the holding pins 226 may also serve the role (function) of maintaining an appropriate distance (e.g., 0.2 mm) between the first surface 110 of the wafer 100 and the holding surface 222 of the first transport pad (surface tension pad) 220.

[0082] The first transport pad (surface tension pad) 220 maintains the wafer 100 in a moist state (wet state) when the wafer 100 is transported by the first transport unit 210 from the chuck table (first holding unit) 180 to the suction chuck (second holding unit, support surface) 203 of the cleaning unit 200, thereby preventing foreign matter such as cutting chips from adhering or adhering to the wafer 100.

[0083] Modifications of the first transport pad (surface tension pad) 220 will be described in detail with reference to FIGS. 5 and 6. FIGS. 5A to 5C are diagrams showing a second example of the configuration of the first transport pad (surface tension pad) 220 of the first transport unit 210 when the wafer 100 is not being held. FIGS. 6A to 6C are diagrams showing a second example of the configuration of the first transport pad (surface tension pad) 220 of the first transport unit 210 when the wafer 100 is being held. FIGS. 5A and 6A are plan views, FIGS. 5B and 6B are side views viewed from the top and bottom of FIGS. 5A and 6A, and FIGS. 5C and 6C are side views viewed from the left and right of FIGS. 5A and 6A. Parts common to the first example in FIGS. 3 and 4 are designated by the same reference numerals, and redundant explanations will be omitted.

[0084] 3 and 4, a liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 that does not move with the movement of the first transfer pad (surface tension pad) 220 by the moving unit (Y-axis moving mechanism 228 and Z-axis moving mechanism 229) is used as a "liquid supply unit" that supplies liquid to the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad (surface tension pad) 220. In other words, the liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 is not a component of the first transfer pad (surface tension pad) 220. For this reason, the first transfer unit 210 has the first transfer pad (surface tension pad) 220 and moving units (Y-axis moving mechanism 228 and Z-axis moving mechanism 229) that move it, and the liquid supply unit (e.g., a pure water nozzle or a water curtain) 194 is provided on or near the chuck table (first holding unit) 180.

[0085] 5 and 6, a "liquid supply unit" is provided as a component of the first transfer pad (surface tension pad) 220, supplying liquid to the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad (surface tension pad) 220. More specifically, as shown in FIGS. 5B and 6B, a liquid supply source 230 is provided as a component of the first transfer pad 220, and a tube 231 for transporting liquid from the liquid supply source 230 is disposed so as to penetrate the base 221 and the guide arm 223 in the vertical direction (Z-axis direction). A liquid supply hole 232 is provided in or near the center of the holding surface 222, supplying liquid from the liquid supply source 230 and the tube 231 to the holding surface 222 and ultimately to the first surface 110 of the wafer 100 (between the holding surface 222 and the first surface 110). That is, the liquid supply source 230, the tube 231, and the liquid supply hole 232 work together to form a "liquid supply unit." In this way, the first transfer unit 210 includes the first transfer pad (surface tension pad) 220 and a moving unit (Y-axis moving mechanism 228 and Z-axis moving mechanism 229) that moves it, as well as a liquid supply unit (liquid supply source 230, tube 231, and liquid supply hole 232) that supplies liquid to the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad (surface tension pad) 220.

[0086] Next, the configuration of the second transport pad (combined Bernoulli / clamp pad) 170 of the second transport unit 160 will be described in detail with reference to FIGS. 7 and 8. FIGS. 7A to 7C are diagrams showing an example of the configuration of the second transport pad (combined Bernoulli / clamp pad) 170 of the second transport unit 160 when the wafer 100 is not being held. FIGS. 8A to 8C are diagrams showing an example of the configuration of the second transport pad (combined Bernoulli / clamp pad) 170 of the second transport unit 160 when the wafer 100 is being held. FIGS. 7A and 8A are plan views, FIGS. 7B and 8B are side views as viewed from above and below in FIGS. 7A and 8A, and FIGS. 7C and 8C are side views as viewed from below and right and left in FIGS. 7A and 8A.

[0087] The second transport pad (Bernoulli / clamp dual-purpose pad) 170 has a base 171 that is rectangular (rectangular) in plan view. A pair of holding blocks 172 are formed on the underside (negative side in the Z-axis direction) of the base 171, located on both sides of the extension direction of the base 171. As shown in FIGS. 7B and 8B , the second transport pad 170 is provided with an air supply source 173, and an air supply path 174 that supplies air from the air supply source 173 is provided so as to penetrate the base 171 and the pair of holding blocks 172 in the vertical direction (Z-axis direction). The air supplied from the air supply source 173 and the air supply path 174 is supplied from air supply holes 175 formed on the underside (negative side in the Z-axis direction) of each of the pair of holding blocks 172.

[0088] In the second transport pad (Bernoulli / clamp dual-purpose pad) 170, by operating the air supply source 173, air is blown toward the first surface 110 of the wafer 100 temporarily placed on the temporary placement mechanism 150 via the air supply path 174 and the air supply holes 175, thereby generating a negative pressure at the lower ends of the pair of holding blocks 172 (air supply holes 175) by the Bernoulli effect, and the wafer 100 is sucked and held in a non-contact manner. In other words, the second transport pad 170 of the second transport unit 160 functions as a "suction holding pad" that sucks and holds the first surface 110 of the wafer 100 in a non-contact manner.

[0089] A pair of contact and separation opposing arms 176 extending in a direction intersecting (orthogonal to) the extension direction of the base 171 are supported on both ends of the base 171, which has a rectangular (rectangular) shape in a plan view. A set of a contact pin 177 and a holding pin 178 is provided on the lower surface (the surface on the negative side in the Z-axis direction) of each of the pair of contact and separation opposing arms 176, respectively, located on both ends in the extension direction of the pair of contact and separation opposing arms 176. A pair of contact pins 177 is provided on the outer side in the extension direction of the contact and separation opposing arm 176, and a pair of holding pins 178 is provided on the inner side in the extension direction of the contact and separation opposing arm 176 (the contact pin 177 on the outer side and the holding pin 178 on the inner side are adjacent to each other on both sides in the extension direction of the contact and separation opposing arm 176). The contact pins 177 and the holding pins 178 are supported on the lower surface (the surface on the negative side in the Z-axis direction) of the contact and separation opposing arm 176 via a cylinder mechanism that is extendable (movable forward and backward, height adjustable) relative to the contact and separation opposing arm 176.

[0090] The base 171 is provided with a pair of movement mechanisms 179 that move the pair of separable opposing arms 176 toward or away from each other in correspondence with the pair of separable opposing arms 176 supported by the base 171. When the pair of separable opposing arms 176 are moved toward or away from each other by the pair of movement mechanisms 179, abutment pins 177 and holding pins 178 provided on the separable opposing arms 176 also move toward or away from each other.

[0091] The second transport pad (combined Bernoulli / clamp pad) 170 has (is connected to) a Y-axis movement mechanism 1701 that moves the second transport pad 170 in the Y-axis direction, and a Z-axis movement mechanism 1702 that moves the second transport pad 170 in the Z-axis direction. The Y-axis movement mechanism 1701 may be configured to include, for example, the Y-axis movable member 162 and the Y-axis feed unit 163 illustrated in FIG. 1. The Z-axis movement mechanism 1702 may be configured to include, for example, the Z-axis movable member 166 illustrated in FIG. 1. The Y-axis movement mechanism 1701 and the Z-axis movement mechanism 1702 constitute a "moving unit" that moves at least the second transport pad (combined Bernoulli / clamp pad) 170.

[0092] The contact pin 177 and the holding pin 178 constitute a "second regulating member" provided adjacent to the third surface (side surface, outer peripheral surface, outer edge) 130 of the wafer 100. Furthermore, the moving mechanism 179 constitutes a "second moving unit" that brings the second regulating member (contact pin 177 and holding pin 178) into contact with and separates from the third surface (side surface, outer peripheral surface, outer edge) 130 of the wafer 100.

[0093] As shown in Figures 7A to 7C, when the second regulating member (contact pin 177 and holding pin 178) is moved away from the third surface 130 of the wafer 100 by the second moving section (moving mechanism 179), the second regulating member (contact pin 177 and holding pin 178) does not contribute to positional regulation (clamping) of the wafer 100 (the wafer is not depicted in Figures 7A to 7C).

[0094] As shown in FIGS. 8A to 8C , when the second movement unit (movement mechanism 179) brings the second regulating members (contact pins 177 and holding pins 178) into contact with the third surface 130 of the wafer 100, the contact pins 177 contact the third surface 130 of the wafer 100 to regulate (clamp) its position, and the holding pins 178 contact the third surface 130 of the wafer 100 to regulate (clamp) its position. The contact pins 177 and the holding pins 178 each contact the third surface 130 of the wafer 100, and may also contact at least one of the first surface 110 and the second surface 120 of the wafer 100 while straddling the first surface 110 and the second surface 120 of the wafer 100. For example, the contact pin 177 may contact both the third surface 130 and the second surface 120 of the wafer 100, or may contact only the third surface 130 of the wafer 100. Furthermore, the retaining pin 178 may be in contact across the third surface 130 and the first surface 110 of the wafer 100, or may be in contact only with the first surface 110 of the wafer 100.

[0095] In this way, the second transport pad (Bernoulli / clamp combination pad) 170 blows air toward the first surface 110 of the wafer 100 via the air supply source 173, air supply path 174, and air supply hole 175, thereby generating negative pressure at the lower ends of the pair of holding blocks 172 (air supply hole 175) by the Bernoulli effect, and suction-holds the wafer 100 without contact (hereinafter, this effect may be referred to as "holding by the Bernoulli function"). Also, the second transport pad (Bernoulli / clamp combination pad) 170 holds the wafer 100 on the lower surface (the surface on the negative side in the Z-axis direction) of the second transport pad 170 by position regulation (clamp support) using the second regulating members (contact pin 177 and holding pin 178) (hereinafter, this effect may be referred to as "holding by the clamp function").

[0096] The second transport pad (Bernoulli / clamp dual-purpose pad) 170 transports the wafer 100 from the loading / unloading section 140 (temporary placement mechanism 150) to the chuck table (first holding section) 180 via a Y-axis movement mechanism 1701 and a Z-axis movement mechanism 1702, and also transports the wafer 100 from the suction chuck (second holding section) 203 of the cleaning section 200 to the loading / unloading section 140 (temporary placement mechanism 150).

[0097] The second transport pad (Bernoulli / clamp dual-purpose pad) 170 holds the wafer 100 by combining the above-mentioned "holding by the Bernoulli function" and "holding by the clamp function" when transporting the wafer 100 from the loading / unloading section 140 (temporary placement mechanism 150) to the chuck table (first holding section) 180 (first (outbound) transport route).

[0098] When transporting the wafer 100 from the suction chuck (second holding section) 203 of the cleaning section 200 to the loading / unloading section 140 (temporary placement mechanism 150) (second (return) transport route), the second transport pad (Bernoulli / clamp dual-purpose pad) 170 does not perform the above-mentioned "holding by the Bernoulli function," but instead holds the wafer 100 only by the above-mentioned "holding by the clamping function."

[0099] In "holding by the Bernoulli function," the wafer 100 is held while compressed air is supplied to it, which can cause the surface of the wafer 100 to dry out, can attract particles from around the wafer 100 and cause them to adhere to the wafer 100, or can cause oil or impurities to be mixed into the air ejected from the second transfer pad (Bernoulli pad) 170 and adhere to the wafer 100, making it impossible to avoid the risk of contaminating the wafer 100. Therefore, when transferring the wafer 100 after the cutting and cleaning processes are completed, the "holding by the Bernoulli function" is not performed, and the wafer 100 is held only by the "holding by the clamping function" so that the air generated by the Bernoulli effect does not hit the wafer 100.

[0100] 1, the first transfer pad (surface tension pad) 220 of the first transfer unit 210 is provided at a lower position (a position on the negative side in the Z-axis direction) than the second transfer pad (combined Bernoulli / clamp pad, suction holding pad) 170 of the second transfer unit 160. Therefore, the second transfer pad 170 of the second transfer unit 160 moves above the first transfer pad 220 of the first transfer unit 210 when transferring the wafer 100 from the suction chuck (second holding unit) 203 of the cleaning unit 200 to the load / unload unit 140 (temporary placement mechanism 150). In addition, the first transfer pad 220 of the first transfer unit 210 moves below the second transfer pad 170 of the second transfer unit 160 when transferring the wafer 100 from the chuck table (first holding unit) 180 to the suction chuck (second holding unit) 203 of the cleaning unit 200. This prevents liquid from dripping from the first transport pad 220 or the wafer 100 onto the second transport pad 170 and causing adverse effects when the first transport pad 220 of the first transport section 210 transports the wafer 100 while maintaining it in a moist (wet) state.

[0101] The transfer system 10 includes a liquid removal unit 240 that removes liquid adhering to the holding surface 222 of the first transfer pad (surface tension pad) 220 of the first transfer unit 210 and / or the second surface 120 of the wafer 100. FIG. 9 illustrates an example of the configuration of the liquid removal unit 240. Although not illustrated in FIG. 1, the liquid removal unit 240 may be located, for example, directly below the transfer path of the wafer 100 from the chuck table (first holding unit) 180 to the suction chuck (second holding unit) 203 of the cleaning unit 200 by the first transfer pad 220 of the first transfer unit 210. Alternatively, the liquid removal unit 240 may remove liquid adhering to the holding surface 222 of the first transfer pad 220 of the first transfer unit 210 while the wafer 100 is being transferred and returning (while moving from the positive side to the negative side in the Y-axis direction). In addition, the liquid removal section 240 may remove liquid adhering to the holding surface 222 of the first transport pad 220 of the first transport section 210 and / or the second surface 120 of the wafer 100 during transport of the wafer 100 (while moving from the negative side to the positive side in the Y-axis direction).

[0102] 9, the liquid removal unit 240 has a base 242 on which an opposing surface 241 is formed that faces the holding surface 222 of the first transport pad 220 of the first transport unit 210. An air supply path 244 that communicates with a plurality of air blowing holes 243 formed in the opposing surface 241 is formed (extending throughout) inside the base 242, and air supplied from an air supply source 245 passes through the air supply path 244 and is blown out from the plurality of air blowing holes 243 to remove (blow off) liquid adhering to the holding surface 222 of the first transport pad 220 of the first transport unit 210 that moves directly above the liquid removal unit 240 (moves from the positive side to the negative side in the Y-axis direction). Alternatively, the liquid adhering to the holding surface 222 of the first transport pad 220 of the first transport section 210, which moves directly above the liquid removal section 240 (moves from the negative side to the positive side in the Y-axis direction), and / or the second surface 120 of the wafer 100, is removed (blows off, blows away).

[0103] Here, the explanation has been given assuming that the liquid removal section 240 is fixed and the first transport pad 220 of the first transport section 210 moves, but the first transport pad 220 of the first transport section 210 may be stopped temporarily and the liquid removal section 240 (blow side) may be moved, or both the first transport pad 220 of the first transport section 210 and the liquid removal section 240 (blow side) may be moved.

[0104] Furthermore, there is a degree of freedom in the configuration of the liquid removal unit, and it is possible to perform vacuuming (suction) while blowing by air to prevent the liquid and small foreign matter from scattering, or to add a function to remove static electricity from the object (the holding surface of the first transport pad), or to add a filter to collect the vacuumed (sucked) liquid and small foreign matter. Also, a scraper (rubber plate) may be installed on the movement path between the first transport pad 220 of the first transport unit 210 and the liquid removal unit 240 (blow side).

[0105] Next, a description will be given of a transfer method using the transfer system 10 of this embodiment. The steps described below do not necessarily have to be performed in this order, and may be performed simultaneously or in a different order as appropriate.

[0106] <Export process> A wafer 100 having a first surface 110, a second surface 120, and a third surface 130 stored in a storage section (cassette table 20, cassette 30) is carried out from the storage section (cassette table 20, cassette 30) by a carry-in / out section 140.

[0107] <First conveying process> The wafer 100 removed in the removal process is transported from the loading / unloading section 140 to the first holding section (chuck table 180) by a second transport section 160 having a suction holding pad (second transport pad 170) that suction-holds the first surface 110 of the wafer 100 without contact, a second regulating member (contact pin 177 and holding pin 178) provided adjacent to the third surface 130 of the wafer 100, and a second moving section (moving mechanism 179) that brings the second regulating member (contact pin 177 and holding pin 178) into contact with and separates from the third surface 130 of the wafer 100.

[0108] <Processing process> The wafer 100 held by the first holding part (chuck table 180) is processed (for example, cut by a cutting part (cutting blade) 190).

[0109] <Second conveying process> The wafer 100 processed in the processing step is transported from the first holding unit (chuck table 180) to the second holding unit (adsorption chuck 203 of cleaning unit 200) by a first transport unit 210 having a surface tension pad (first transport pad 220) that includes a holding surface 222 facing the first surface 110 of the wafer 100 and that applies surface tension between the first surface 110 of the wafer 100 and the holding surface 222 by a liquid supplied to the holding surface 222, a first regulating member (contact pin 225 and pressure pin 226) provided adjacent to the third surface 130 of the wafer 100, and a first moving unit (moving mechanism 227) that brings the first regulating member (contact pin 225 and pressure pin 226) into contact with and separates from the third surface 130 of the wafer 100.

[0110] More specifically, the second transport step includes the following surface tension action step, lifting step, and positioning step.

[0111] ≪Surface tension action process≫ A surface tension application step is performed to apply surface tension to the first surface 110 of the wafer 100. This surface tension application step includes a holding surface approach step in which the holding surface 222 of the first transfer pad 220 of the first transfer unit 210 is brought close to the wafer 100 held by the first holding unit (chuck table 180), and a liquid supply step in which liquid is supplied from a liquid supply unit (a liquid supply unit (e.g., a pure water nozzle or water curtain) 194 in the first example of FIGS. 3 and 4, and a liquid supply source 230, a tube 231, and a liquid supply hole 232 in the second example of FIGS. 5 and 6). The liquid supply destination in the liquid supply step may be the first surface 110 of the wafer 100 and / or the holding surface 222 of the first transfer pad 220.

[0112] In the surface tension acting step, whether or not the wafer 100 is being held by the first transport pad 220 may be detected through the first transport pad 220 using a reflective fiber sensor. For example, if irradiated light (detection light) is emitted from the holding surface 222 and the irradiated light is reflected and detected by the first surface 110, it is determined that the wafer 100 is being held by the first transport pad 220, and if the reflected light of the irradiated light is not detected, it is determined that the wafer 100 is not being held by the first transport pad 220. Note that the sensor that detects whether or not the wafer 100 is being held by the first transport pad 220 has a degree of freedom, and various design modifications are possible. For example, various sensors other than the reflective fiber sensor described above, such as a proximity sensor, may be applied.

[0113] The supply of liquid in the liquid supplying step may be performed, for example, so as to fill (fill) a clearance of a predetermined distance (for example, 0.2 mm) between the holding surface 222 of the first transfer pad 220 and the first surface 110 of the wafer 100. The supply of liquid in the liquid supplying step may be controlled, for example, by whether or not to supply (ON / OFF only), or may be controlled by a specific supply amount (for example, a concept including large, medium, small, and zero supply amounts).

[0114] <Lifting process> The wafer 100 is separated from the first holding part (chuck table 180) while surface tension is acting on the wafer 100 through the surface tension acting step.

[0115] <Positioning process> The first restricting members (contact pins 225 and holding pins 226) are brought into contact with the third surface 130 of the wafer 100 that has been separated from the first holding portion (chuck table 180) by the lifting step.

[0116] After the above lifting step is performed, it may be detected whether the wafer 100 is being held by the first transport pad 220, and if it is detected that the wafer 100 is being held by the first transport pad 220, the above positioning step (clamping with the first regulating member (contact pin 225 and retaining pin 226)) may be performed.

[0117] <Cleaning process> The wafer 100 held by the second holding unit (the suction chuck 203 of the cleaning unit 200) is cleaned in the cleaning unit 200.

[0118] <Third conveying process> After the cleaning process is completed, the wafer 100 is transferred from the second holder (the suction chuck 203 of the cleaning unit 200) to the transfer unit 140 by the second transfer unit 160 (the second transfer pad 170).

[0119] More specifically, in the third transfer step, the second regulating members (contact pins 177 and holding pins 178) of the second transfer pad 170 of the second transfer unit 160 are brought into contact with the wafer 100, and the suction force of the second transfer pad 170 of the second transfer unit 160 is not applied to the wafer 100. In other words, the above-mentioned "holding by the Bernoulli function" by the second transfer pad (Bernoulli / clamp dual-purpose pad) 170 is not performed, and the wafer 100 is held only by "holding by the clamping function."

[0120] In order to hold the wafer 100 held by the second holding unit (the suction chuck 203 of the cleaning unit 200) only by "holding by the clamping function" without "holding by the Bernoulli function," the suction chuck 203 (the support surface of the second holding unit that supports the wafer 100) on the upper surface of the spinner table 202 of the cleaning unit 200 is formed so that at least a part of the second surface 120 of the wafer 100 is exposed. That is, when compared in plan view, the circular (approximately circular) shape of the suction chuck 203 on the upper surface of the spinner table 202 of the cleaning unit 200 is set to be smaller than the circular (approximately circular) shape of the second surface 120 of the wafer 100, so that when the wafer 100 is held by the suction chuck 203, the peripheral edge of the wafer 100 protrudes from the peripheral edge of the suction chuck 203. The peripheral edge of the wafer 100 that protrudes beyond the peripheral edge of the suction chuck 203 can be clamped and supported by a second transfer pad (a dual-purpose Bernoulli / clamp pad) 170.

[0121] <Delivery process> The wafers 100 transferred in the third transfer step are stored in the storage section (cassette table 20, cassette 30) by the transfer section 140.

[0122] The transport system of this embodiment is a transport system mounted on a processing device that processes at least a portion of a transported object and transports the transported object, and includes a holding surface facing the first surface of the transported object, which has a first surface, a second surface opposite the first surface, and a third surface connecting the first surface and the second surface, a surface tension pad that holds the transported object on the holding surface via a liquid, a liquid supply unit that supplies liquid to the first surface and / or the holding surface of the transported object, and a moving unit that moves at least the surface tension pad.

[0123] This makes it possible to prevent foreign matter such as processing chips (e.g., cutting chips) from adhering to or adhering to the transported object by maintaining the transported object in a moist (wet) state during the transport process of the processing device (e.g., the transport process from the processing section to the cleaning section).

[0124] The conveying system of this embodiment includes a storage unit that stores a transported object having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface, a carry-in / out unit that carries the transported object stored in the storage unit out of the storage unit and carries the transported object into the storage unit, a first holding unit that holds the transported object with the first surface exposed, a cutting unit that cuts the transported object held in the first holding unit with a rotating cutting blade, and a second holding unit that holds the transported object with the first surface exposed. a holding section, a cleaning section that cleans the transported object held in the second holding section, a first transport section that transports the transported object from the first holding section to the second holding section, and a second transport section that transports the transported object from the loading / unloading section to the first holding section and from the second holding section to the loading / unloading section, the first transport section including a holding surface facing the first surface of the transported object and a liquid supply section that supplies liquid to the holding surface, and having a surface tension pad that holds the transported object on the holding surface via the liquid.

[0125] This allows the transported object to be kept moist (wet) throughout the transport process from the first holding section corresponding to the cutting section to the second holding section corresponding to the cleaning section, thereby preventing foreign matter such as cutting chips from adhering or adhering to the transported object.

[0126] In the illustrated embodiment described above, the transported object is primarily a single wafer. However, the transported object may also be a frame unit in which a wafer is fixed to a frame via tape, or a frame unit in which a wafer is positioned in an opening in the frame and the frame and wafer are integrated via tape. When the transported object is a frame unit, for example, the loading / unloading section that loads and unloads the frame unit into and out of the storage section may be configured as a combination of a frame clamping mechanism that holds the frame unit and a rail that moves this frame clamping mechanism. The applicant filed a patent application (JP Patent Publication No. 2020-096035) and obtained a patent (JP Patent Publication No. 7184620) for technology that enables complete cutting of wafers in a frame unit and incomplete cutting of a single wafer using a single cutting device. In such a cutting device, a surface tension pad such as that in this embodiment can be used as the transport unit (first transport unit) that transports the object from the first holding unit corresponding to the cutting unit to the second holding unit corresponding to the cleaning unit. This surface tension pad includes a holding surface facing the first surface of the object and a liquid supply unit that supplies liquid to the holding surface, and holds the object on the holding surface via the liquid. This can be applied to both single wafers and frame units, and by maintaining the object in a wet state throughout the transport process from the first holding unit corresponding to the cutting unit to the second holding unit corresponding to the cleaning unit, it is possible to prevent foreign matter such as cutting chips from adhering to the object.

[0127] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0128] The present invention can be applied to a transfer system and a transfer method in a cutting machine. [Explanation of symbols]

[0129] 10:Transportation system 20: Cassette table (cassette placement area, storage area) 30: Cassette (storage section) 100: Wafer (carried object) 110: 1st surface (front, top) 120: 2nd side (back side, bottom side) 130: Third surface (side, outer surface, outer edge) 140: Loading and unloading area 143: U-shaped part (suction pad) 150:Temporary placement mechanism 160: Second conveying section 170: Second transfer pad (Bernoulli / clamp dual-purpose pad, suction holding pad) 177: Contact pin (second restricting member) 178: Retaining pin (second restricting member) 179: Moving mechanism (second moving part) 180: Chuck table (first holding part) 190: Cutting part (cutting blade) 194: Liquid supply unit (pure water nozzle, water curtain, pure water supply unit) 200: Cleaning section 203: Adsorption chuck (second holding part, support surface) 210: First conveying section 220: First transport pad (surface tension pad, interfacial tension pad) 222: Holding surface 225: Contact pin (first restricting member) 226: Retaining pin (first restricting member) 227: Moving mechanism (first moving part) 228:Y-axis movement mechanism (moving part) 229:Z-axis movement mechanism (moving part) 230:Liquid supply source (liquid supply section) 231: Tube (liquid supply part) 232: Liquid supply port (liquid supply section) 240: Liquid Removal Section

Claims

1. A conveyance system mounted on a processing device that processes at least a part of a conveyed object and conveys the conveyed object, a surface tension pad including a holding surface facing the first surface of the object to be transported, the holding surface having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface, and holding the object to the holding surface via a liquid; a liquid supply unit that supplies liquid to the first surface and / or the holding surface of the object; a moving unit that moves at least the surface tension pad; A transport system comprising:

2. the liquid supply unit does not move in conjunction with the movement of the surface tension pad by the moving unit; 2. The transport system according to claim 1.

3. a storage section for storing the transported object; a carry-in / out unit that carries the transported object stored in the storage unit out of the storage unit and carries the transported object into the storage unit; a first holding portion that holds the object with the first surface exposed; a cutting unit that cuts the object held by the first holding unit with a rotating cutting blade; a second holding portion that holds the object with the first surface exposed; a cleaning unit that cleans the transported object held by the second holding unit; a first conveying unit that conveys the object from the first holding unit to the second holding unit; a second conveying section that conveys the object from the loading / unloading section to the first holding section and also conveys the object from the second holding section to the loading / unloading section; Equipped with the first transport unit includes the surface tension pad, the liquid supply unit, and the moving unit; 2. The transport system according to claim 1.

4. a storage section for storing the transported object; a carry-in / out unit that carries the transported object stored in the storage unit out of the storage unit and carries the transported object into the storage unit; a first holding portion that holds the object with the first surface exposed; a cutting unit that cuts the object held by the first holding unit with a rotating cutting blade; a second holding portion that holds the object with the first surface exposed; a cleaning unit that cleans the transported object held by the second holding unit; a first conveying unit that conveys the object from the first holding unit to the second holding unit; a second conveying section that conveys the object from the loading / unloading section to the first holding section and also conveys the object from the second holding section to the loading / unloading section; Equipped with the first transport unit includes the surface tension pad and the moving unit; the liquid supply unit is provided on or near the first holding unit, and does not move in accordance with the movement of the surface tension pad by the moving unit; 2. The transport system according to claim 1.

5. the second transport unit has a suction-holding pad that suction-holds the first surface of the transported object in a non-contact manner; 5. The transport system according to claim 3 or 4.

6. The second conveying section includes: a second restricting member provided adjacent to the third surface of the transported object; a second moving unit that brings the second regulating member into contact with and separates it from the third surface of the transported object; Further comprising:

6. The transport system according to claim 5.

7. The first conveying section includes: a first restricting member provided adjacent to the third surface of the object; a first moving unit that brings the first restricting member into contact with and separates it from the third surface of the object; Further comprising:

5. The transport system according to claim 3 or 4.

8. the second conveying unit moves above the first conveying unit when conveying the object from the second holding unit to the carry-in / out unit; 5. The transport system according to claim 3 or 4.

9. the first transport unit moves below the second transport unit when transporting the object from the first holding unit to the second holding unit; 5. The transport system according to claim 3 or 4.

10. the first transport unit moves below the second transport unit when transporting the object from the first holding unit to the second holding unit; the second conveying unit moves above the first conveying unit when conveying the object from the second holding unit to the carry-in / out unit; 5. The transport system according to claim 3 or 4.

11. the transport system further includes a liquid removal unit that removes liquid adhering to the holding surface of the first transport unit and / or the second surface of the transported object.

5. The transport system according to claim 3 or 4.

12. a carrying-out step of carrying out, from the storage section by the carry-in / out section, a transported object stored in the storage section, the transported object having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface; a first conveying step of conveying the object conveyed in the unloading step from the carry-in / out section to a first holding section by a second conveying section having a suction holding pad that suction-holds the first surface of the object without contact, a second regulating member provided adjacent to the third surface of the object, and a second moving section that brings the second regulating member into contact with and separates it from the third surface of the object; a processing step of processing the transported object held by the first holding unit; a second conveying step of conveying the object processed in the processing step from the first holding unit to a second holding unit by a first conveying unit having a surface tension pad including a holding surface facing the first surface of the object and causing surface tension to act between the first surface of the object and the holding surface by a liquid supplied to the holding surface, a first restricting member provided adjacent to the third surface of the object, and a first moving unit that brings the first restricting member into contact with and separates it from the third surface of the object; a cleaning step of cleaning the transported object held by the second holding unit; a third conveying step of conveying the object, for which the cleaning step has been completed, from the second holding part to the carry-in / out part by the second conveying part; a carry-in step of storing the object transported in the third transport step in the storage section by the carry-in / out section; Equipped with A transport method characterized by:

13. The second conveying step includes: a surface tension application step of applying surface tension to the first surface of the object to be transported, the surface tension application step including a holding surface approach step of bringing the holding surface of the first transport unit close to the object to be transported held by the first holding unit, and a liquid supply step of supplying the liquid from a liquid supply unit; a lifting step of separating the transported object from the first holding part while surface tension is acting on the transported object by the surface tension acting step; a positioning step of bringing the first restricting member into contact with the third surface of the transported object separated from the first holding portion by the lifting step; having 13. The method of claim 12.

14. a support surface of the second holding portion that supports the object to be transferred is formed so that at least a portion of the second surface of the object to be transferred is exposed; In the third conveying step, the second regulating member of the second conveying section is brought into contact with the conveyed object, and the suction force of the suction hold pad is not applied to the conveyed object.

14. The transport method according to claim 12 or 13.

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