Production floor management system and instruction list creation method

Abstract

A production floor management system and an instruction list creation method that can appropriately set storage capacity and data communication volume are provided. [Solution] In the instruction list creation method, the control device collects operation data of the component mounting devices (ST1) and sends it to the analysis device (ST2), the analysis device analyzes the planning data 45 of the component mounting line, the instruction data stored in the second instruction database, and the acquired operation data (ST3), the analysis device creates instruction data from the analysis results (ST4) and sends it to the control device (ST5), the control device updates the first instruction database based on the instruction data acquired from the analysis device (ST6), and the control device creates an instruction list including instruction data for each component mounting device based on the instruction data stored in the first instruction database (ST7).

Description

[Technical Field]

[0001] The present disclosure relates to a production floor management system and an instruction list creation method that creates instructions related to a component mounting device that mounts components on a board. [Background technology]

[0002] On a production floor equipped with multiple component mounting machines that mount components on boards, various data is collected, and instructions for production and production preparation are created and sent to the component mounting machines. Patent Document 1 discloses an electronic component mounting system that includes a processing device and individual data storage provided for each component mounting line equipped with multiple component mounting machines, and a common data server and system processing device connected to the multiple individual data storages via a communication network.

[0003] Patent Document 1 discloses that a common data server stores component data relating to all combinations of feeders and components arranged on the production floor, each individual data storage acquires component data relating to the feeders and components used on each component mounting line from the common data server and stores it, and each processing device executes a process to identify the components accommodated in the feeder attached to the component mounting device based on the component data stored in the individual data storage. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2015 / 118632 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional technologies including Patent Document 1, the individual data storages arranged for each component mounting line store the same data as that stored in the common data server, which poses the following problem: The same data is stored twice throughout the entire system, which poses the problem that as the scale of the production floor increases, enormous amounts of storage capacity and data communication volume are required. Therefore, there is room for further improvement in order to reduce storage capacity and data communication volume and configure an inexpensive system.

[0006] Therefore, an object of the present disclosure is to provide a production floor management system and an instruction list creation method that can appropriately set storage capacity and data communication volume. [Means for solving the problem]

[0007] The production floor management system disclosed herein includes a control device that collects operation data of component mounting devices that mount components onto boards provided on a component mounting line, and creates an instruction list including the instruction data for each component mounting device based on the instruction data related to the component mounting device stored in a first instruction database; and an analysis device that analyzes the stored plan data for the component mounting line, the instruction data related to the component mounting device stored in a second instruction database, and the operation data acquired from the control device, wherein the analysis device creates the instruction data related to the component mounting device provided on the component mounting line from the analysis results and sends it to the control device, and the control device updates the first instruction database based on the sent instruction data.

[0008] The instruction list creation method of the present disclosure includes a control device provided in a component mounting line collecting operation data of component mounting devices that mount components onto boards provided in the component mounting line and transmitting the collected data to an analysis device, the analysis device analyzing plan data for the component mounting line, instruction data related to the component mounting devices stored in a second instruction database, and the operation data acquired from the control device, the analysis device creating the instruction data related to the component mounting devices provided in the component mounting line from the analysis results and transmitting the created instruction data to the control device, the control device updating a first instruction database based on the instruction data acquired from the analysis device, and the control device creating an instruction list including the instruction data for each component mounting device based on the instruction data related to the component mounting devices stored in the first instruction database. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to appropriately set the storage capacity and the amount of data communication. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating a configuration of a production system according to an embodiment of the present disclosure. [Figure 2] 1 is a configuration explanatory diagram of a component mounting device provided in a component mounting line according to an embodiment of the present disclosure; [Figure 3] FIG. 1 is a configuration explanatory diagram of an inspection device provided in a component mounting line according to an embodiment of the present disclosure. [Figure 4] FIG. 1 is a block diagram showing a configuration of a production system according to an embodiment of the present disclosure. [Figure 5] FIG. 10 is an explanatory diagram showing an example of operation data collected by a control device provided in a component mounting line according to an embodiment of the present disclosure. [Figure 6] FIG. 10 is an explanatory diagram of a process for creating instruction data in the production system according to an embodiment of the present disclosure. [Figure 7] 1A and 1B are explanatory diagrams showing examples of instruction lists created by a management device according to an embodiment of the present disclosure. [Figure 8]1A and 1B are explanatory diagrams showing examples of instruction lists created by a management device according to an embodiment of the present disclosure. [Figure 9] 1A and 1B are explanatory diagrams showing examples of instruction lists created by a management device according to an embodiment of the present disclosure. [Figure 10] 1A and 1B are explanatory diagrams showing examples of instruction lists created by a management device according to an embodiment of the present disclosure. [Figure 11] 1 is a flow diagram of an instruction list creation method according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the production system, component mounting line, component mounting device, inspection device, control device, and analysis device. Corresponding elements in all drawings will be denoted by the same reference numerals below, and duplicated explanations will be omitted. In FIG. 2 and some of the following descriptions, two axes perpendicular to each other in a horizontal plane are shown: an X-axis in the substrate transport direction (a direction perpendicular to the paper surface in FIG. 2 ), and a Y-axis perpendicular to the substrate transport direction (a left-right direction in FIG. 2 ). In FIG. 2 and some of the following descriptions, a Z-axis (a vertical direction in FIG. 2 ) is shown as a height direction perpendicular to the horizontal plane.

[0012] First, the configuration of the production system 1 will be described with reference to Figure 1. The production system 1 is composed of a customer's production floors F1 to F3 and a support center S that supports the customer's production activities. Each production floor F1 to F3 is equipped with component mounting lines L1 to L2 that produce mounted circuit boards as production lines for producing products. The support center S is established in a location away from the production floors F1 to F3, such as inside or outside the customer's factory. A support center S may be established for each customer, or may be established to support multiple customers collectively. The functions of the support center S may also be configured using cloud computing.

[0013] Hereinafter, production floor F1 will be referred to as the "first production floor F1," production floor F2 as the "second production floor F2," and production floor F3 as the "third production floor F3." Furthermore, component mounting line L1 will be referred to as the "first component mounting line L1," and component mounting line L2 as the "second component mounting line L2." In FIG. 1, the configuration of the production floors F1-F3 will be explained using the first production floor F1 as an example. Furthermore, the support center S will be explained using an example of a configuration in which data is collected from component mounting lines L1-L2 equipped on multiple production floors F1-F3 and analyzed.

[0014] In Fig. 1, two component mounting lines L1-L2 are installed on the first production floor F1, each of which is configured by connecting multiple production devices, such as component mounting devices M1, M2 and inspection device M3. The component mounting lines L1-L2 have the function of sequentially mounting components onto boards using the component mounting devices M1, M2, and inspecting the condition of the components mounted on the board using inspection device M3 to produce mounted boards. The component mounting lines L1-L2 installed on the first production floor F1 do not need to be two, and may be one, or three or more. Furthermore, the component mounting devices M1, M2 configuring the component mounting lines L1-L2 do not need to be two, and may be one, or three or more.

[0015] In Fig. 1, each production device in component mounting lines L1-L2 is connected to an in-house communication network 2, such as a LAN (Local Area Network), and is connected to a control device 3 via an internal communication unit 4. The control device 3 has the function of creating data and parameters necessary for the operation of the production devices provided in component mounting lines L1-L2 and transmitting them to each production device. The control device 3 also has the function of collecting operation data including the operating status of each production device, work history, and information on events that have occurred in the production devices. The control device 3 also has the function of issuing instructions in response to events that have occurred in the production devices.

[0016] The control devices 3 may be installed corresponding to each of the component mounting lines L1 to L2, or one control device 3 may be configured to collectively control multiple component mounting lines L1 to L2. In the following, an example will be described in which a control device 3 is installed for each of the component mounting lines L1 to L2.

[0017] In FIG. 1, an analytical device 7 is installed in a support center S. Each of the production floors F1 to F3 is equipped with an external communication unit 5 connected to a control device 3. The support center S also has an external communication unit 8 connected to the analytical device 7. The external communication units 5 and 8 are connected to an off-premise communication network 6 such as the Internet or a mobile communication line. This configuration allows the control device 3 and the analytical device 7 to exchange information via the off-premise communication network 6. The analytical device 7 has the function of acquiring operation data and the like of the production devices from the control device 3 of each of the production floors F1 to F3, analyzing the acquired operation data, creating instruction data related to the production devices, and sending it to the control device 3.

[0018] The control device 3 and the analytical device 7 are not limited to a configuration in which they directly exchange information via the off-premise communication network 6, and may exchange information via the cloud. That is, information sent from each device may be stored in the cloud, and the information may be sent from the cloud to each device upon request. Information may also be sent and received using communication tools such as email or data communication lines.

[0019] Next, the detailed configuration of component mounting devices M1 to M2 equipped on component mounting lines L1 to L2 will be described with reference to Fig. 2. Fig. 2 schematically shows component mounting devices M1 to M2. A board transport mechanism 12 is arranged in the center of base 11 along the X-axis, which is the board transport direction. Board transport mechanism 12 transports board B transported from upstream to the mounting work position, positions it, and holds it. Board transport mechanism 12 also transports board B downstream after component mounting work has been completed. A board support mechanism 13 is arranged between board transport mechanisms 12 on the upper surface of base 11 to support board B from below that has been transported to the mounting work position.

[0020] 2, a carriage 14 is attached to one side of the board transport mechanism 12, with multiple tape feeders 15 arranged along the X-axis on its upper surface. The tape feeders 15 are detachable from the carriage 14. The tape feeders 15 feed the component tape containing the components D (reel components) at a pitch feed in a direction from the outside toward the board transport mechanism 12, thereby supplying the components D to a pickup position where the mounting head 17 picks up the components D. The tape feeder 15 supplies the components D by attaching new component tape to the tape feeder 15. The tape feeder 15 also supplies the components D by splicing new component tape to the end of the component tape being pitch fed.

[0021] A tray feeder 16 is attached to one side of the board transport mechanism 12, and supplies components D (tray components) arranged on a tray to the suction position of the mounting head 17. The tray feeder 16 is detachable from the component mounting devices M1 to M2. The tray feeder 16 replenishes (supplies) components D by replacing an empty tray with a tray on which components D are mounted. In this way, the tape feeder 15 and the tray feeder 16 are component supply devices that are detachable from the component mounting devices M1 to M2 and supply components D (reel components, tray components) to the component mounting devices M1 to M2.

[0022] In FIG. 2, a head moving mechanism 18 is arranged along the Y axis perpendicular to the board transport direction on a frame portion (not shown) supported by a base 11. A mounting head 17 is attached to the head moving mechanism 18 via a moving member 17a. The mounting head 17 is detachable from the moving member 17a. A nozzle 17b that sucks and holds a component D is attached to the bottom of the mounting head 17. The nozzle 17b is detachable from the mounting head 17. By driving the head moving mechanism 18, the mounting head 17 moves in the X axis direction and the Y axis direction.

[0023] The mounting head 17 moves between the substrate B positioned and held at the mounting work position and the tape feeder 15 and tray feeder 16 (component supply device), and uses the nozzle 17b attached to the bottom to pick up the component D supplied to the suction position from the tape feeder 15 or tray feeder 16, and mounts the removed component D on the substrate B.

[0024] In FIG. 2, a mounting control unit 10 built into a base 11 controls each unit of the component mounting devices M1 to M2 to perform component mounting work. The mounting control unit 10 also counts the remaining number of components D supplied by the tape feeder 15 and the tray feeder 16. The mounting control unit 10 also acquires measurement results from various sensors equipped in the component mounting devices M1 to M2, detects the occurrence of events such as errors in each unit, and executes processing such as error stop. The mounting control unit 10 also executes automatic recovery work to recover after an error stop, in accordance with instructions from the control device 3 or operations by the operator. The mounting control unit 10 appropriately transmits operation data of the component mounting devices M1 to M2 to the control device 3.

[0025] Maintenance is performed on the mounting heads 17, nozzles 17b, and component supply devices (tape feeders 15, tray feeders 16) that are attached to and detached from the component mounting devices M1 to M2 at predetermined intervals (every predetermined number of uses, every predetermined amount of time of use, etc.).

[0026] Next, the inspection device M3 provided on the component mounting lines L1-L2 will be described in detail with reference to Figure 3. Figure 3 shows the inspection device M3. On the upper surface of a base 21, a board transport unit 22 is arranged along the X-axis, which is the board transport direction. The board transport unit 22 transports a board B to be inspected and measured, which has been transported from upstream, to an inspection and measurement operation position by an inspection head 23, which will be described below, and positions and holds the board. The inspection head 23 moves horizontally along the X-axis and Y-axis by an inspection head moving mechanism 24 consisting of an XY table. The inspection head 23 includes a built-in camera 25 with its imaging direction facing downward, and a built-in illumination unit 26 that illuminates the object to be imaged by the camera 25.

[0027] The inspection control unit 20 built into the base 21 controls each unit of the inspection device M3 to perform board transport operations, image capture processing, image recognition processing of the captured images, and inspection and measurement processing based on the images. The inspection control unit 20 stores information about the mounting position of component D on the board B to be inspected, information about lighting conditions, information about judgment thresholds, etc. Based on the stored mounting position, the inspection control unit 20 controls the inspection head moving mechanism 24 to move the inspection head 23, irradiates light from the lighting unit 26 based on the lighting conditions, and images the component D to be inspected with the camera 25. The inspection control unit 20 then performs recognition processing on the captured image and judges the pass / fail of the mounting state of component D mounted on board B and the pass / fail of the mounted board based on the judgment threshold.

[0028] Furthermore, the inspection control unit 20 changes the judgment threshold in accordance with instructions from the control device 3. Specifically, when an instruction to increase the judgment threshold is received, the inspection control unit 20 increases the stored judgment threshold. This increases the tolerance for misalignment of the component D, etc., and improves the erroneous judgment of a component being judged as defective when it is not. Furthermore, when an instruction to decrease the judgment threshold is received, the inspection control unit 20 decreases the stored judgment threshold. This narrows the tolerance for misalignment of the component D, etc., and improves the erroneous judgment of a component not being judged as defective when it is.

[0029] Next, the configuration of the production system 1 equipped with the control device 3 and the analysis device 7 will be described with reference to Figure 4. Here, the description will focus on the configuration of the control device 3 and the analysis device 7 as a production floor management system that, in addition to the multiple functions they have, collects operation data from component mounting devices M1 and M2, analyzes the operation data to create instruction data, and creates an instruction list including the instruction data. The control devices 3 installed on each of the component mounting lines L1-L2 installed on the production floors F1-F3 have the same configuration, and here, the first component mounting line L1 installed on the first production floor F1 will be used as an example.

[0030] An internal communication unit 4, an external communication unit 5, an input unit 35, and a display unit 36 ​​are connected to the control device 3 of the first component mounting line L1 installed on the first production floor F1. The input unit 35 is an input device such as a keyboard, touch panel, or mouse, and is used for inputting operation commands and data. The display unit 36 ​​is a display device such as a liquid crystal panel, and displays various data stored in the control memory unit 30, as well as various information such as an operation screen and input screen for operation by the input unit 35.

[0031] 4, the control device 3 includes a control memory unit 30, a data collection unit 31, an update processing unit 32, a list creation unit 33, a display processing unit 34, and a device control unit (not shown). The processing units such as the data collection unit 31, the update processing unit 32, the list creation unit 33, the display processing unit 34, and the device control unit are realized by, for example, a memory that stores the control programs executed by each processing unit, and a processor that executes the control programs. The device control unit controls the entire control device 3.

[0032] The control storage unit 30 is a storage device that stores various types of information, and stores production information 30a, collected operation data 30b, a first instruction database 30c, an instruction list 30d, etc. The control storage unit 30 is realized by, for example, a flash memory or an HDD (Hard Disk Drive).

[0033] 4, production information 30a stores production data used in the production of mounted boards by component mounting devices M1 and M2 for each production model name of the mounted board. The production data includes the component name specifying the component D to be mounted on board B, the mounting position, the mounting angle, the position of tape feeder 15 that supplies component D, the component layout indicating the position of the trays stored in tray feeder 16, information specifying mounting head 17, information specifying nozzle 17b attached to mounting head 17, layout information of nozzle 17b, etc.

[0034] The production information 30a also stores inspection condition data, including a judgment threshold value used in the inspection of mounted boards by the inspection device M3, for each manufactured model of mounted board. The production information 30a also stores maintenance information, such as the number of times each mounting head 17, nozzle 17b, tape feeder 15, and tray feeder 16 used on the first component mounting line L1 has been used, the duration of use, and maintenance records. The production information 30a also stores a production plan, such as the number of mounted boards to be produced on the first component mounting line L1, the scheduled production start date and time, and the scheduled production completion date and time.

[0035] 4, the data collection unit 31 collects operation data from the component mounting devices M1, M2 and the inspection device M3 on the first component mounting line L1, stores the collected operation data 30b in the control storage unit 30, and transmits the collected operation data 30b to the analysis device 7. The operation data includes information on events that occurred in the component mounting devices M1, M2, such as work mistakes or device errors, information on executed instruction data and its results, and information on the progress of the production work, such as the number of mounted boards that have been produced and the number of components D that have been mounted on board B.

[0036] The operation data also includes information relating to the inspection results of the mounting board inspected by the inspection device M3. The data collection unit 31 may not only sequentially transmit the collected operation data to the analysis device 7, but may also transmit one day's or one week's worth of operation data during non-operational times. The data collection unit 31 may also delete the operation data transmitted to the analysis device 7. This makes it possible to reduce the storage capacity of the control storage unit 30.

[0037] An example of operation data collected by the data collection unit 31 will now be described with reference to FIG. 5. Here, an example of operation data including executed instruction data 64 and a result 65 will be described. The operation data includes an instruction target 61, date and time 62, status 63, instruction data 64, result 65, etc. The instruction target 61 is information that identifies the component mounting devices M1, M2, mounting head 17, nozzle 17b, tape feeder 15, etc. to which the instruction data 64 is instructed. The date and time 62 is information related to the date and time when the instruction data 64 is executed. The status 63 is the status of the component mounting devices M1, M2, inspection device M3, etc. immediately before the instruction data 64 is instructed. The result 65 is the result (OK, NG) of the instruction data 64 being executed.

[0038] For example, from the operation data shown in Figure 5, it can be seen that the work corresponding to the "cleaning instruction" (instruction data 64) instructed to the "component mounting device #2" (instruction target 61), where the "device error (31)" (status 63) occurred, was executed at "June 1, 2024, 10:31" (date and time 62), but the device error was not resolved (the result 65 is "NG").

[0039] Whether the equipment error has not been resolved is determined based on whether an error has occurred in the instruction target 61 or a related instruction target within a predetermined period of time after the instruction data 64 was executed. In FIG. 5, a cleaning instruction was issued to the nozzle 17b provided in the "component mounting device #2" (instruction target 61), and then another "equipment error (04)" (status 63) occurred in the "component mounting device #2" (instruction target 61), and therefore it is determined that the equipment error has not been resolved (result 65 is "NG"). Note that a related instruction target is something related to the instruction target 61, such as the tape feeder 15, mounting head 17, or nozzle 17b, which is associated in advance and used to mount one component D on the board B.

[0040] In Figure 5, it can be seen that the work corresponding to the "operator response instructions" (instruction data 64) was then performed at "June 1, 2024, 11:12" (date and time 62), and the "equipment error (04)" (status 63) was resolved (result 65 is "OK").

[0041] The control device 3 determines that a difference between the planned and actual results has occurred based on these two statuses 63, instruction data 64, and result 65, and performs a cause analysis (status analysis) or creates a countermeasure plan. As the cause analysis (status analysis), it determines that the work corresponding to the "cleaning instruction" (instruction data 64) was ineffective, and updates the instruction list 30d as described below so that the work corresponding to the "operator response instruction" (instruction data 64) is executed with priority. As a countermeasure plan, if the operator response instruction (instruction data 64) is maintenance of the nozzle 17b, a maintenance plan is created so that maintenance of the nozzle 17b is executed during an unused period before the predetermined period before the error occurs.

[0042] 4, the update processing unit 32 adds the instruction data 64 transmitted from the analysis device 7 to the first instruction database 30c to update it. The list creation unit 33 creates an instruction list 30d for each component mounting device M1, M2 based on the production information 30a (production data, production plan, etc.) and the first instruction database 30c (instruction data 64, etc.), the instruction list 30d including instruction data 64 corresponding to various events that will occur during the production of the mounting boards to be produced, and stores the list in the control storage unit 30. The created instruction list 30d is used to create instructions to be sent to the component mounting devices M1, M2 and operators in response to events that will occur during the production of the mounting boards.

[0043] The display processing unit 34 executes a display process to display the instruction list 30d on the display unit 36. The display processing unit 34 also executes a creation process to display the instruction data 64 contained in the first instruction database 30c on the display unit 36, accepts input of the administrator's selection of instruction data 64 from the input unit 35, and creates the instruction list 30d from the selected instruction data 64. That is, the instruction list 30d can be created by the list creation unit 33 according to a predetermined algorithm, or it can be created by the administrator based on experience or the like using the instruction data 64 contained in the first instruction database 30c.

[0044] 4, the analysis device 7 installed in the support center S has the function of acquiring operation data of component mounting devices M1, M2 and inspection device M3 from the control device 3, analyzing it, creating instruction data 64, and transmitting it to the control device 3. The analysis device 7 may collect only operation data of specific component mounting lines L1-L2 to create the instruction data 64, collect operation data from multiple production floors F1-F3 of a specific customer to create the instruction data 64, or collect operation data from the production floors F1-F3 of multiple customers to create the instruction data 64. Here, an example will be described in which operation data is collected from multiple production floors F1-F3 and instruction data 64 corresponding to the first component mounting line L1 on the first production floor F1 is created.

[0045] 4, an external communication unit 8 and a storage device 40 are connected to the analysis device 7. The storage device 40 stores a second instruction database 41, acquired operation data 42, plan difference data 43, a trained model 44, plan data 45, etc. The storage device 40 is realized by, for example, a flash memory or an HDD.

[0046] The analysis device 7 includes information processing devices such as an acquisition unit 50, a learning unit 51, an instruction data creation unit 52, an output unit 53, and an analysis control unit (not shown). Each information processing device is realized by an independent hardware asset, or by a memory that stores a control program executed by each information processing device, and a processor that executes the control program. The analysis control unit controls the entire analysis device 7. Furthermore, the analysis device 7 does not need to be configured as a single computer, but may be configured as multiple devices. For example, the storage device 40 and all or part of the information processing devices may be provided in the cloud via a server.

[0047] In FIG. 4, the acquisition unit 50 acquires operation data of component mounting devices M1, M2 and inspection device M3 from each control device 3 installed on component mounting lines L1 to L2 of multiple production floors F1 to F3 via the external communication unit 8, and stores the data in the storage device 40 as acquired operation data 42 in association with information identifying the source production floors F1 to F3, component mounting lines L1 to L2, etc.

[0048] Plan difference data 43 is data relating to the difference between the production plan and the actual results of mounted boards produced on component mounting lines L1 and L2 on production floors F1 to F3, and includes the difference in the number of boards produced, the difference in production time, etc. Plan data 45 is the production plan for mounted boards to be produced in the future on component mounting lines L1 to L2 on production floors F1 to F3, and includes the number of mounted boards to be produced, the planned production start date and time, the planned production completion date and time, as well as information such as the configuration of component mounting lines L1 to L2.

[0049] 4, the learning unit 51 uses instruction data 64 related to the component mounting devices M1, M2 and the inspection device M3 contained in the second instruction database 41, the operation data of the component mounting devices M1, M2 and the inspection device M3 contained in the acquired operation data 42, and the production plan and actual results contained in the plan difference data 43 as learning data, and generates a trained model 44 that generates instruction data 64 related to the component mounting devices M1, M2 and the inspection device M3 by a learning algorithm using machine learning, etc. The learning unit 51 also analyzes the occurrence frequency of the executed instruction data 64 from the operation data, and generates a trained model 44 that generates instruction data 64 including a priority order.

[0050] The learning algorithm may be a neural network (including deep learning using a multi-layer neural network), genetic programming, a decision tree, a Bayesian network, a support vector machine (SVM), etc. The generated trained model 44 is stored in the storage device 40.

[0051] 4, the instruction data creation unit 52 creates instruction data 64 related to the component mounting devices M1 and M2 and the inspection device M3 based on the generated trained model 44, the plan data 45, and information related to the component mounting devices M1 and M2 and the inspection device M3. The created instruction data 64 is stored in the second instruction database 41 and is also transmitted by the output unit 53 to the control devices 3 of the component mounting lines L1 to L2 corresponding to the instruction data 64. When it is possible to create multiple pieces of the same type of instruction data 64, the instruction data creation unit 52 creates instruction data 64 including a priority order.

[0052] In this way, the analysis device 7 analyzes the occurrence frequency of the instruction data 64 from the acquired operation data of the component mounting devices M1, M2, and creates the instruction data 64 including the priority order. By having the analysis device 7 create the instruction data 64, the control device 3 can respond to events that occur due to the instruction data 64, even if it does not have an application that analyzes events that occur in the component mounting devices M1, M2 and instructs measures to take. Therefore, the control device 3 can be configured with a processing device with low hardware specifications such as HDD capacity and CUP processing power.

[0053] 6, a process from creating instruction data 64 in the analysis device 7 to storing it in the first instruction database 30c of the control device 3 will be described. The acquired operation data 42 stores operation data acquired from a plurality of control devices 3. The learning unit 51 generates a trained model 44 by machine learning using the instruction data 64 included in the second instruction database 41, the operation data included in the acquired operation data 42, and the production plan and actual results included in the plan difference data 43 as training data. The instruction data creation unit 52 creates the instruction data 64 based on the created trained model 44 and the production plan included in the plan data 45. The created instruction data 64 is stored in the second instruction database 41.

[0054] Furthermore, the output unit 53 of the analysis device 7 transmits the created instruction data 64 to the control device 3. The update processing unit 32 of the control device 3 updates the first instruction database 30c based on the transmitted instruction data 64. In this way, the analysis device 7 acquires operation data from the control devices 3 provided in each of the multiple component mounting lines L1-L2, and transmits the instruction data 64 created based on the plan data 45 for the first component mounting line L1 to the first component mounting line L1. By creating the instruction data 64 by analyzing (machine learning) a large amount of operation data acquired from the multiple component mounting lines L1-L2 on the multiple production floors F1-F3, it is possible to create highly effective instruction data 64 even for component mounting lines L1-L2 or component mounting devices M1, M2 with little production experience.

[0055] The acquired operation data 42 stored in the storage device 40 installed in the support center S is sequentially accumulated with operation data acquired from multiple component mounting lines L1-L2 on multiple production floors F1-F3, and is used for analysis such as machine learning. Meanwhile, the operation data in the collected operation data 30b stored in the control storage unit 30 of the control device 3 is sequentially deleted after a predetermined period (e.g., one month) has elapsed. This reduces the storage capacity of the control storage unit 30 of the control device 3. In this way, by differentiating the storage policies for operation data between the support center S and the control device 3, the control storage unit 30 of the control device 3 can have an appropriate storage capacity. Furthermore, by having the high-performance CPU of the analysis device 7 share the computationally intensive analysis such as machine learning, the processing power of the CPU of the control device 3 can be reduced.

[0056] 7 to 10, an example of instruction list 30d created by list creation unit 33 will be described. Instruction list 30d includes status 63 and instruction data 64 corresponding to status 63. When an event occurs in component mounting devices M1, M2 or inspection device M3 during production of mounted boards, instruction data 64 that matches status 63 at the time the event occurred is specified based on the stored instruction list 30d.

[0057] 7(a) is an example of an instruction list 30d created based on multiple pieces of instruction data 64 related to the operation of the component mounting devices M1, M2 during a predetermined period, which are contained in the first instruction database 30c. The instruction list 30d includes instruction data 64 for an "operation instruction for component mounting devices M1, M2" corresponding to the status 63 of "production preparation complete," instruction data 64 for a "stop instruction" corresponding to the status 63 of "production completed," instruction data 64 for a "recovery instruction from error stop" corresponding to the status 63 of "error stop during production," and instruction data 64 for a "production switching instruction" corresponding to the status 63 of "production completed."

[0058] 7(b) is an example of an instruction list 30d created based on a plurality of instruction data 64 contained in the first instruction database 30c and related to the attachment and detachment of the mounting head 17 to be attached to and detached from the component mounting devices M1 and M2, the nozzle 17b to be attached to and detached from the mounting head 17, and the component supply device (tape feeder 15) to be attached and detached from the component mounting devices M1 and M2 during a predetermined period. The instruction list 30d includes instruction data 64 for "attaching the mounting head 17 to the target component mounting device M1 or M2," "attaching the nozzle 17b to the target component mounting device M1 or M2," and "attaching the tape feeder 15 to the target component mounting device M1 or M2," which correspond to the status 63 of "ready for use completed."

[0059] In addition, the instruction list 30d includes instruction data 64 corresponding to the status 63 of "End of use", such as "Instruction to remove the mounting head 17 from the target component mounting device M1, M2", "Instruction to remove the nozzle 17b from the target component mounting device M1, M2", and "Instruction to remove the tape feeder 15 from the target component mounting device M1, M2".

[0060] 8(a) is an example of an instruction list 30d created based on multiple pieces of instruction data 64 contained in the first instruction database 30c and related to the supply of components to the component supply devices (tape feeder 15, tray feeder 16) attached to component mounting devices M1 and M2 during a predetermined period. The instruction list 30d includes instruction data 64 for "supplying reel components to tape feeder 15" corresponding to the status 63 of "zero remaining reel components," instruction data 64 for "splicing a component tape that stores reel components into tape feeder 15" corresponding to the status 63 of "the remaining number of reel components is a predetermined number or less," and instruction data 64 for "supplying tray components to tray feeder 16" corresponding to the status 63 of "zero remaining tray components."

[0061] 8(b) is an example of an instruction list 30d created based on a plurality of instruction data 64 included in the first instruction database 30c and related to maintenance of the mounting head 17 attached to and detached from the component mounting devices M1 and M2, the nozzle 17b attached to and detached from the mounting head 17, and the component supply device (tape feeder 15) attached to and detached from the component mounting devices M1 and M2 during a predetermined period. The instruction list 30d includes instruction data 64 for "maintenance instruction for mounting head 17," "maintenance instruction for nozzle 17b," and "maintenance instruction for tape feeder 15," which correspond to the status 63 of "exceeding maintenance threshold."

[0062] 9(a) is an example of an instruction list 30d created based on a plurality of instruction data 64 related to troubleshooting for component mounting devices M1, M2 during a predetermined period, which are contained in the first instruction database 30c. The instruction list 30d includes instruction data 64 for "instruction to automatically recover component mounting devices M1, M2" corresponding to the status 63 of "an automatically recoverable device error has occurred," instruction data 64 for "instruction to perform pickup position teaching" corresponding to the status 63 of "pickup error rate has increased," and instruction data 64 for "instruction to change the operating parameters of component mounting devices M1, M2" corresponding to the status 63 of "an error related to the operating parameters has occurred."

[0063] The instruction list 30d also includes instruction data 64 for a "cleaning instruction" and an "instruction to stop the component mounting devices M1, M2 and have an operator take action (operator response instruction)" corresponding to the status 63 of "an equipment error has occurred." Furthermore, the instruction data 64 for the "cleaning instruction" includes a priority 66 of "A," and the instruction data 64 for the "operator response instruction" includes a priority 66 of "B." Therefore, when an event of "an equipment error has occurred" occurs, the instruction data 64 for the "cleaning instruction" is given priority over the instruction data 64 for the "operator response instruction."

[0064] 9(b) is an example of an instruction list 30d created based on a plurality of instruction data 64 related to the inspection device M3 installed in the component mounting lines L1-L2 including the component mounting devices M1 and M2 during a predetermined period, which are included in the first instruction database 30c. The instruction list 30d includes instruction data 64 of "an instruction to increase the judgment threshold for judging the object to be judged by the inspection device M3" corresponding to the status 63 of "increased number of over-judgments of the object to be judged" and instruction data 64 of "an instruction to lower the judgment threshold for judging the object to be judged by the inspection device M3" corresponding to the status 63 of "a predetermined number of defective boards have occurred after passing the inspection."

[0065] 10(a) and 10(b) show examples of an instruction list 30d created based on a plurality of instruction data 64 related to maintenance of the mounting heads 17, nozzles 17b, and component supply devices (tape feeders 15) that are attached to and detached from component mounting devices M1 and M2, which are included in the first instruction database 30c. The instruction list 30d includes instruction data 64 for a "maintenance instruction" corresponding to the status 63 of "latest measurement value exceeds the maintenance threshold," instruction data 64 for a "maintenance instruction" corresponding to the status 63 of "the increase rate of the measurement value is equal to or greater than a predetermined value," instruction data 64 for a "replacement instruction" corresponding to the status 63 of "latest measurement value exceeds the replacement threshold," and instruction data 64 for a "replacement instruction" corresponding to the status 63 of "the increase rate of the measurement value is equal to or greater than a predetermined value."

[0066] Furthermore, the instruction list 30d includes a "maintenance instruction", which includes instruction data 64 for "instruction to create a maintenance plan to perform maintenance during unused time" corresponding to the status 63 of "there will be unused time longer than the maintenance time after production is completed", and instruction data 64 for "instruction to create a maintenance plan to perform maintenance during unused time" and "instruction to create a maintenance plan to replace the target unit" corresponding to the status 63 of "continued use after production is completed". Furthermore, the instruction data 64 for the "instruction to create a maintenance plan to perform maintenance during unused time" includes a priority 66 of "A", and the instruction data 64 for the "instruction to create a maintenance plan to replace the target unit" includes a priority 66 of "B".

[0067] As indicated by the arrow in FIG. 10, if an event occurs during the production of a mounting board where "the latest measurement value exceeds the maintenance threshold" and the maintenance target "continues to be used even after production is completed," instruction data 64 for "instruction to create a maintenance plan to perform maintenance during non-use hours" takes priority over instruction data 64 for "instruction to create a maintenance plan to replace the target unit."

[0068] In this way, the control device 3 collects operation data of the component mounting devices M1, M2 that mount components D on the boards B provided on the component mounting lines L1 to L2, and creates an instruction list 30d including instruction data 64 for each of the component mounting devices M1, M2 based on the collected operation data (collected operation data 30b) and instruction data 64 related to the component mounting devices M1, M2 stored in the first instruction database 30c.

[0069] Next, a method for creating an instruction list by the production system 1 (production floor management system) equipped with the control device 3 and the analysis device 7 will be described with reference to the flow in Fig. 11. First, the data collection unit 31 of the control device 3 equipped on the component mounting lines L1-L2 collects operation data of the component mounting devices M1, M2 equipped on the component mounting lines L1-L2 (ST1: operation data collection step) and transmits the operation data to the analysis device 7 (ST2: operation data transmission step). Next, the learning unit 51 of the analysis device 7 analyzes (machine learning) the plan data 45 of the component mounting lines L1-L2, the instruction data 64 related to the component mounting devices M1, M2 stored in the second instruction database 41, and the operation data (acquired operation data 42) acquired from the control device 3 (ST3: analysis step).

[0070] Next, the instruction data creation unit 52 of the analysis device 7 creates instruction data 64 related to the component mounting devices M1, M2 provided on the component mounting lines L1-L2 from the analysis results (ST4: instruction data creation step), and the output unit 53 transmits the instruction data 64 to the control device 3 (ST5: instruction data transmission step). Next, the update processing unit 32 of the control device 3 updates the first instruction database 30c based on the instruction data 64 acquired from the analysis device 7 (ST6: first instruction database update step). Next, the list creation unit 33 of the control device 3 creates an instruction list 30d including instruction data 64 for each component mounting device M1, M2 based on the instruction data 64 related to the component mounting devices M1, M2 stored in the first instruction database 30c (ST7: instruction list creation step).

[0071] In this way, by dividing the collection and storage of operation data and the creation of instruction data 64 between the control device 3 and the analysis device 7, it is possible to appropriately set the storage capacities of the control device 3 and the analysis device 7 and the amount of data communication between the control device 3 and the analysis device 7. Note that in the above example, the analysis device 7 analyzes operation data using machine learning to create instruction data 64, but the analysis of operation data and the creation of instruction data 64 are not limited to this example. For example, the analysis device 7 may analyze instruction data 64 executed in the past and its success rate, and create instruction data 64 with a high success rate.

[0072] As described above, the present disclosure discloses the following technical ideas.

[0073] (Technology 1) a control device 3 that collects operation data of component mounting devices M1, M2 that mount components D on boards B provided on the component mounting lines L1 to L2, and creates an instruction list 30d including instruction data 64 for each of the component mounting devices M1, M2 based on instruction data 64 related to the component mounting devices M1, M2 stored in a first instruction database 30c; an analysis device (7) that analyzes the stored plan data (45) of the component mounting lines (L1-L2), the instruction data (64) related to the component mounting devices (M1, M2) stored in the second instruction database (41), and the operation data acquired from the control device (3); The analysis device 7 creates instruction data 64 related to the component mounting devices M1 and M2 provided in the component mounting lines L1 to L2 based on the analysis results, and transmits the data to the control device 3. The control device 3 updates the first instruction database 30c based on the transmitted instruction data 64. Production floor management system (production system 1).

[0074] This allows the storage capacities of the control device 3 and the analysis device 7 and the amount of data communication between the control device 3 and the analysis device 7 to be set appropriately.

[0075] (Technology 2) The operation data includes executed instruction data 64 and the results thereof (FIG. 5). The production floor management system (production system 1) described in Technology 1.

[0076] This allows the analysis device 7 to appropriately analyze the operation data and create appropriate instruction data 64.

[0077] (Technology 3) The production floor management system (production system 1) described in Technology 1 or 2, wherein the analysis device 7 analyzes the frequency of occurrence of instruction data 64 from the acquired operation data of the component mounting devices M1, M2, and creates instruction data 64 including a priority order 66.

[0078] This allows more appropriate instruction data 64 to be specified even when an event with the same status 63 occurs.

[0079] (Technology 4) The analysis device 7 is Acquires operation data from the control devices 3 provided in each of the multiple component mounting lines L1 to L2, The production floor management system (production system 1) according to any one of techniques 1 to 3, wherein instruction data 64 created based on plan data 45 for the first component mounting line L1 is transmitted to the first component mounting line L1.

[0080] As a result, even if the component mounting devices M1, M2 of the component mounting lines L1 to L2 have a poor production track record, highly effective instruction data 64 can be created by analyzing the operation data of the component mounting devices M1, M2 of the other component mounting lines L1 to L2.

[0081] (Technology 5) The first instruction database 30c includes at least one of operation instructions, stop instructions, instructions to recover from an error stop, and production switch instructions for the component mounting devices M1, M2, which are multiple instruction data 64 related to the operation of the component mounting devices M1, M2 during a specified period, and the instruction list 30d is created using at least one instruction data 64 (Figure 7(a)). A production floor management system (production system 1) described in any of techniques 1 to 4.

[0082] This allows appropriate instruction data 64 to be instructed when an event related to the operation of the component mounting apparatuses M1 and M2 occurs.

[0083] (Technology 6) The first instruction database 30c includes at least one of a plurality of instruction data 64 related to the attachment and detachment of the mounting head 17 attached to and detached from the component mounting devices M1 and M2, the nozzle 17b attached to and detached from the mounting head 17, and the component supply device (tape feeder 15) that supplies the components D attached to and detached from the component mounting devices M1 and M2 during a predetermined period, including instructions to attach the mounting head 17, the nozzle 17b, or the component supply device to the target component mounting device M1 and M2, and instructions to remove the mounting head 17, the nozzle 17b, or the component supply device from the target component mounting device M1 and M2, and the instruction list 30d is created using at least one instruction data 64 (Figure 7(b)). A production floor management system (production system 1) described in any of techniques 1 to 5.

[0084] This allows appropriate instruction data 64 to be issued when an event occurs relating to the attachment / detachment of the mounting head 17, the nozzle 17b, or the component supply device to / from the component mounting devices M1 and M2.

[0085] (Technology 7) The first instruction database 30c includes at least one of a plurality of instruction data 64 related to the supply of components to component supply devices (tape feeders 15, tray feeders 16) that supply components D to be mounted on component mounting devices M1, M2 during a predetermined period, including an instruction to supply reel components to the component supply device, an instruction to supply tray components to the component supply device, and an instruction to splice component tapes that store reel components to the component supply device, and the instruction list 30d is created using at least one instruction data 64 (Figure 8(a)). A production floor management system (production system 1) described in any of techniques 1 to 6.

[0086] This allows appropriate instruction data 64 to be instructed when an event occurs related to component supply to the component supply devices attached to the component mounting devices M1 and M2.

[0087] (Technology 8) The first instruction database 30c includes at least one of maintenance instructions for the mounting head 17, the nozzle 17b, or the component supply device, which is a plurality of instruction data 64 related to the maintenance of the mounting head 17 attached to and detached from the component mounting devices M1 and M2, the nozzle 17b attached to and detached from the mounting head 17, and the component supply device (tape feeder 15) that supplies the components D attached to and detached from the component mounting devices M1 and M2 during a predetermined period, and the instruction list 30d is created using at least one instruction data 64 (Figure 8(b)). A production floor management system (production system 1) described in any of techniques 1 to 7.

[0088] This allows appropriate instruction data 64 to be issued when an event occurs related to maintenance of the mounting head 17, nozzle 17b, or component supply device that is detachable from the component mounting devices M1 and M2.

[0089] (Technology 9) The first instruction database 30c includes, for a predetermined period of time, a plurality of instruction data 64 related to troubleshooting for the component mounting devices M1, M2, at least one of an instruction to automatically recover the component mounting devices M1, M2, an instruction to change the operating parameters of the component mounting devices M1, M2, or an instruction to stop the component mounting devices M1, M2 and have an operator take action, and the instruction list 30d is created using at least one instruction data 64 (Figure 9(a)), a production floor management system described in any of techniques 1 to 8.

[0090] This allows appropriate instruction data 64 to be instructed when an event related to troubleshooting occurs for the component mounting devices M1 and M2.

[0091] (Technology 10) The production floor management system according to any one of techniques 1 to 9, wherein the first instruction database 30c includes at least one of an instruction to increase the threshold value for determining the object to be determined by the inspection device M3 and an instruction to decrease the threshold value for determining the object to be determined by the inspection device M3, which is a plurality of instruction data 64 related to the inspection device M3 provided on the component mounting lines L1 to L2 including the component mounting devices M1 and M2 during a predetermined period (FIG. 9(b)), and the instruction list 30d is created using at least one instruction data 64.

[0092] This allows appropriate instruction data 64 to be instructed when an event related to the inspection device M3 occurs.

[0093] (Technology 11) The control device 3 provided on the component mounting lines L1 to L2 collects (ST1) operation data of the component mounting devices M1 and M2 that mount components D on the boards B provided on the component mounting lines L1 to L2, and transmits the data to the analysis device 7 (ST2); The analysis device 7 analyzes the plan data 45 of the component mounting lines L1 to L2, the instruction data 64 related to the component mounting devices M1 and M2 stored in the second instruction database 41, and the operation data acquired from the control device 3 (ST3). The analysis device 7 creates instruction data 64 related to the component mounting devices M1 and M2 provided on the component mounting lines L1 to L2 based on the analysis results (ST4) and transmits this to the control device 3 (ST5). The control device 3 updates the first instruction database 30c based on the instruction data 64 acquired from the analysis device 7 (ST6). The instruction list creation method includes the control device 3 creating (ST7) an instruction list 30d including instruction data 64 for each component mounting device M1, M2 based on instruction data 64 related to the component mounting devices M1, M2 stored in the first instruction database 30c (Figure 11).

[0094] The storage capacities of the control device 3 and the analysis device 7 and the amount of data communication between the control device 3 and the analysis device 7 can be set appropriately. [Industrial Applicability]

[0095] The production floor management system and instruction list creation method of the present disclosure has the effect of being able to appropriately set storage capacity and data communication volume, and is useful in the field of mounting components onto circuit boards. [Explanation of symbols]

[0096] 1 Production system (production floor management system) 3. Control device 7 Analyzer 15 Tape feeder (parts supply device) 16 Tray feeder (parts supply device) 17 Mounting head 17b nozzle B board D parts L1~L2 component mounting line M1, M2 component mounting equipment M3 Inspection Equipment

Claims

1. a control device that collects operation data of component mounting devices that mount components on boards provided in a component mounting line, and creates an instruction list including the instruction data for each component mounting device based on the instruction data related to the component mounting device stored in a first instruction database; an analysis device that analyzes the stored plan data of the component mounting line, the instruction data related to the component mounting device stored in a second instruction database, and the operation data acquired from the control device, the analysis device creates the instruction data related to the component mounting device provided in the component mounting line based on the analysis result, and transmits the instruction data to the control device; The control device updates the first instruction database based on the transmitted instruction data.

2. The production floor management system according to claim 1 , wherein the operation data includes the instruction data that has been executed and the results thereof.

3. The production floor management system according to claim 1 , wherein the analysis device analyzes the frequency of occurrence of the instruction data from the acquired operation data of the component mounting device, and creates the instruction data including a priority order.

4. The analysis device acquiring the operation data from the control devices provided in each of the plurality of component mounting lines; 2. The production floor management system according to claim 1, wherein the instruction data created based on plan data for a first component mounting line is transmitted to the first component mounting line.

5. 2. The production floor management system according to claim 1, wherein the first instruction database includes at least one of a plurality of instruction data related to the operation of the component mounting device during a predetermined period, which are an operation instruction, a stop instruction, an instruction to recover from an error stop, and an instruction to switch production for the component mounting device, and the instruction list is created using at least one of the instruction data.

6. 2. The production floor management system according to claim 1, wherein the first instruction database includes at least one of a plurality of instruction data related to the attachment and detachment of a mounting head to be attached to or detached from the component mounting device, a nozzle to be attached to or detached from the mounting head, and a component supply device that supplies components to or detached from the component mounting device during a predetermined period, the plurality of instruction data being instructions to attach the mounting head, the nozzle, or the component supply device to the target component mounting device, and instructions to remove the mounting head, the nozzle, or the component supply device from the target component mounting device, and the instruction list is created using at least one of the instruction data.

7. 2. The production floor management system according to claim 1, wherein the first instruction database includes at least one of a plurality of instruction data related to component supply to a component supply device that supplies components to be mounted on the component mounting device during a predetermined period, an instruction to supply reel components to the component supply device, an instruction to supply tray components to the component supply device, and an instruction to splice a component tape that stores reel components to the component supply device, and the instruction list is created using at least one of the instruction data.

8. 2. The production floor management system according to claim 1, wherein the first instruction database includes at least one of a plurality of instruction data relating to maintenance of a mounting head that is attached to or detached from the component mounting device, a nozzle that is attached to or detached from the mounting head, and a component supply device that supplies components that are attached to or detached from the component mounting device, during a predetermined period, the plurality of instruction data including maintenance instructions for the mounting head, the nozzle, or the component supply device, and the instruction list is created using at least one of the instruction data.

9. 2. The production floor management system according to claim 1, wherein the first instruction database includes, for a predetermined period of time, a plurality of pieces of instruction data related to troubleshooting for the component mounting device, at least one of an instruction to automatically restore the component mounting device, an instruction to change operating parameters of the component mounting device, or an instruction to stop the component mounting device and have an operator take action, and the instruction list is created using at least one piece of instruction data.

10. 2. The production floor management system according to claim 1, wherein the first instruction database includes, for a predetermined period of time, a plurality of pieces of instruction data related to an inspection device provided on the component mounting line including the component mounting device, at least one of an instruction to increase a threshold value for judging an object to be judged by the inspection device and an instruction to decrease a threshold value for judging an object to be judged by the inspection device, and the instruction list is created using at least one piece of instruction data.

11. a control device provided in the component mounting line collects operational data of a component mounting device that mounts components on a board provided in the component mounting line and transmits the collected data to an analysis device; the analysis device analyzes plan data of the component mounting line, instruction data related to the component mounting device stored in a second instruction database, and the operation data acquired from the control device; the analysis device creates instruction data related to the component mounting device provided in the component mounting line based on the analysis result, and transmits the instruction data to the control device; the control device updates a first instruction database based on the instruction data acquired from the analysis device; An instruction list creation method including the control device creating an instruction list including the instruction data for each component mounting device based on the instruction data related to the component mounting device stored in the first instruction database.

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