Press-fit terminals and semiconductor devices

Abstract

The insertion load and the withdrawal load can be controlled. [Solution] The press-fit terminal includes a conductive portion extending in the +Z direction and having an end on the +Z side, and a contact portion 32 connected to the end of the conductive portion, extending in the +Z direction, and press-fitted into the insertion hole. The contact portion 32 has an outer portion 32a that contacts the inner surface of the insertion hole and a recess 32b provided in the outer portion 32a. The recess 32b includes a first edge portion 32b3 farther from the end, a second edge portion 32b4 closer to the end, a first inner surface 32b1 connected to the first edge portion 32b3, and a second inner surface 32b2 connected to the second edge portion 32b4. Furthermore, the first inner surface 32b1 forms a first angle ε with respect to a first plane P1 perpendicular to the +Z direction and passing through the first edge portion 32b3, and the second inner surface 32b2 forms a second angle γ with respect to a second plane P2 perpendicular to the +Z direction and passing through the second edge portion 32b4. In this case, the absolute value of the second angle γ is greater than the absolute value of the first angle ε.

Description

Technical Field

[0001] The present invention relates to press-fit terminals and semiconductor devices.

Background Art

[0002] A semiconductor device includes a semiconductor chip, a press-fit terminal electrically connected to the semiconductor chip, and a substrate into which the press-fit terminal is press-fitted (see, for example, Patent Documents 1 to 5).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a press-fit terminal and a semiconductor device in which an insertion load and a pull-out load are controlled.

Means for Solving the Problems

[0005] According to one aspect of the present invention, a press-fit terminal is provided which is press-fitted into a through-hole penetrated by an electronic component, comprising: a conductive portion extending in a first direction and having an end on the side in the first direction; and a contact portion connected to the end of the conductive portion, extending in the first direction and press-fitted into the through-hole, wherein the contact portion has an outer portion that contacts the inner surface of the through-hole and a recess provided in the outer portion, the recess comprising a first edge portion further from the end, a second edge portion closer to the end, a first inner surface connected to the first edge portion, and a second inner surface connected to the second edge portion, wherein the first inner surface forms a first angle with respect to a first plane perpendicular to the first direction and passing through the first edge portion, and the second inner surface forms a second angle with respect to a second plane perpendicular to the first direction and passing through the second edge portion, and the absolute value of the second angle is greater than the absolute value of the first angle.

[0006] Furthermore, according to one aspect of the present invention, a press-fit terminal is provided which is press-fitted into an insertion hole penetrated through an electronic component, comprising: a conductive portion extending in a first direction and having an end on the side in the first direction; and a contact portion connected to the end of the conductive portion, extending in the first direction and press-fitted into the insertion hole, wherein the contact portion has an outer portion that contacts the inner surface of the insertion hole and a recess provided on the outer portion, and three or more of the recesses are formed along the first direction in a region of the outer portion that overlaps with the insertion hole.

[0007] Furthermore, according to one aspect of the present invention, a press-fit terminal is provided which is press-fitted into a through-hole penetrated in an electronic component, comprising: a conductive portion extending in a first direction and having an end on the side in the first direction; and a contact portion connected to the end of the conductive portion, extending in the first direction, and press-fitted into the through-hole, wherein the contact portion has an outer portion that contacts the inner surface of the through-hole and a recess provided in the outer portion, the recess comprising a first edge portion further from the end, a second edge portion closer to the end, a first inner surface connected to the first edge portion, and a second inner surface connected to the second edge portion, and when the outer portion is extended and a virtual plane virtually connecting the first edge portion and the second edge portion is considered, the first inner surface forms an obtuse angle with respect to the virtual plane, and the second inner surface forms an acute angle with respect to the virtual plane. Furthermore, according to one aspect of the present invention, a semiconductor device having the above-mentioned press-fit terminal is provided. [Effects of the Invention]

[0008] According to the disclosed technology, insertion load and extraction load can be controlled. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view of a semiconductor device. [Figure 2] This is a first side view of a semiconductor device. [Figure 3] This is a second side view of the semiconductor device. [Figure 4] This is a plan view of a semiconductor device equipped with a printed circuit board. [Figure 5] This is a side view of a semiconductor device equipped with a printed circuit board. [Figure 6] This is a cross-sectional view of the main part of a semiconductor device. [Figure 7] This diagram shows press-fit terminals. [Figure 8] This is a side view of the press-fit terminals attached to the printed circuit board. [Figure 9] This is a side view of a press-fit terminal to which a printed circuit board is attached. [Figure 10]It is a diagram showing the press - fit terminal of the first embodiment. [Figure 11] It is a side view of the main part of the contact portion of the press - fit terminal of the first embodiment. [Figure 12] It is a side view when attaching the press - fit terminal to the printed circuit board of the first embodiment. [Figure 13] It is an enlarged side view of the main part when attaching the press - fit terminal to the printed circuit board of the first embodiment. [Figure 14] It is a diagram showing the press - fit terminal to which the printed circuit board of the first embodiment is attached. [Figure 15] It is a diagram showing the press - fit terminal of the second embodiment. [Figure 16] It is a side view of the main part of the contact portion of the press - fit terminal of the second embodiment. [Figure 17] It is an enlarged side view of the main part when attaching to the press - fit terminal of the printed circuit board of the second embodiment. [Figure 18] It is a side view of the press - fit terminal of the third embodiment. [Figure 19] It is a side view of the press - fit terminal of the fourth embodiment.

Embodiments for Carrying out the Invention

[0010] The embodiments will be described below with reference to the drawings. In the following description, "front surface" and "top surface" refer to the XY plane facing upwards (+Z direction) in the semiconductor device 1 shown in the figure. Similarly, "up" refers to the upward direction (+Z direction) in the semiconductor device 1 shown in the figure. "Back surface" and "bottom surface" refer to the XY plane facing downwards (-Z direction) in the semiconductor device 1 shown in the figure. Similarly, "down" refers to the downward direction (-Z direction) in the semiconductor device 1 shown in the figure. The same directionality will be used in other drawings as needed. "High position" and "upper position" refer to the upper position (+Z direction) in the semiconductor device 1 shown in the figure. Similarly, "low position" and "lower position" refer to the lower position (-Z direction) in the semiconductor device 1 shown in the figure. "Front surface," "top surface," "up" and "back surface," "bottom surface," "down" and "side" are merely convenient expressions to specify the relative positional relationship and do not limit the technical concept of the present invention. For example, "up" and "down" do not necessarily mean the vertical direction relative to the ground. In other words, the directions "up" and "down" are not limited to the direction of gravity. Also, in the following explanation, "principal component" refers to a component containing 80 vol% or more. "Approximately identical" means that the difference is within ±10%. Furthermore, "perpendicular," "orthogonal," and "parallel" mean that the difference is within ±10°. In addition, in drawings, a component that has been assigned a reference numeral once may have its reference numeral omitted in subsequent drawings.

[0011] [First Embodiment] The semiconductor device will be described below. First, the external appearance of the semiconductor device will be described using Figures 1 to 3. Figure 1 is a plan view of the semiconductor device. Figures 2 and 3 are the first and second side views of the semiconductor device. Figures 2 and 3 show the side views of the semiconductor device 1 in Figure 1 when viewed in the +Y direction and the +X direction, respectively.

[0012] The semiconductor device 1 includes a heat sink 18 and a case 20 provided on the heat sink 18, which houses a semiconductor unit (explained in Figure 6) mounted on the heat sink 18. The heat sink 18 is exposed downwards (in the -Z direction) from the lower edge 25 of the case 20 of the semiconductor device 1. The case 20 has a rectangular shape in plan view. The case 20 includes side portions 21a, 21b, 21c, 21d and four fastening holes 23.

[0013] The side portions 21a, 21b, 21c, and 21d are integrally connected, sequentially surrounding the four sides of the opening 22 in a plan view. The case 20, through the side portions 21a, 21b, 21c, and 21d, surrounds the opening 22 and a storage area 26 (see Figure 6) in which the semiconductor unit is housed. The side portions 21a and 21c are aligned with the short side of the semiconductor device 1, and the side portions 21b and 21d are aligned with the long side of the semiconductor device 1. The connection points between the side portions 21a, 21b, the side portions 21b, 21c, the side portions 21c, 21d, and the side portions 21d, 21a are the four corners of the semiconductor device 1 in a plan view and may be rounded off.

[0014] The upper edges 21a1, 21b1, 21c1, 21d1, which are the upper surfaces of the side portions 21a, 21b, 21c, 21d, have multiple terminal openings 21a2, 21b2, 21c2, 21d2 provided along the upper edges 21a1, 21b1, 21c1, 21d1 in a plan view. The lower surfaces of the integrally connected side portions 21a, 21b, 21c, 21d include a continuous annular lower edge 25. Press-fit terminals 30a, 30b, 30c, 30d extend from the multiple terminal openings 21a2, 21b2, 21c2, 21d2 in the +Z direction. In this case, the press-fit terminals 30a, 30b, 30c, 30d extend from one or more of the multiple terminal openings 21a2, 21b2, 21c2, 21d2 as needed.

[0015] The press-fit terminals 30a, 30b, 30c, and 30d are embedded at their lower ends in the side portions 21a, 21b, 21c, and 21d, respectively. The upper ends of the press-fit terminals 30a, 30b, 30c, and 30d extend upward from the upper edges 21a1, 21b1, 21c1, and 21d1 of the side portions 21a, 21b, 21c, and 21d. Details of the press-fit terminals 30a, 30b, 30c, and 30d will be described later. When there is no need to distinguish between them, the press-fit terminals 30a, 30b, 30c, and 30d will be referred to as press-fit terminal 30.

[0016] Furthermore, the storage area 26 surrounded by the sides 21a, 21b, 21c, and 21d is sealed with a sealing member 24. In addition, a lid covering the sealing member 24 may be provided at the openings 22 of the sides 21a, 21b, 21c, and 21d. The sealing member 24 is made of a thermosetting resin. The sealing member 24 may further contain a filler. Examples of thermosetting resins include epoxy resin, phenolic resin, and maleimide resin. Examples of fillers include silicon oxide, aluminum oxide, boron nitride, or aluminum nitride.

[0017] The fastening holes 23 are integrally provided at each of the four corners of the case 20. That is, the fastening holes 23 are integrally connected to the connection points of the sides 21a, 21b, sides 21b, 21c, sides 21c, 21d, and sides 21d, 21a, respectively. The fastening holes 23 penetrate parallel to the ±Z direction.

[0018] Such a case 20 includes a press-fit terminal 30 and is formed integrally using resin. This resin is mainly composed of a thermoplastic resin. Examples of thermoplastic resins include polyphenylene sulfide resin, polybutylene terephthalate resin, polybutylene succinate resin, polyamide resin, or acrylonitrile butadiene styrene resin. The lid may also be formed separately from the same material.

[0019] The heat sink 18 is made of a material with excellent thermal conductivity, such as aluminum, iron, silver, copper, or an alloy containing at least one of these materials. Furthermore, to improve corrosion resistance, a material such as nickel may be formed on the surface of the heat sink 18 by plating or other means. Specifically, in addition to nickel, nickel-phosphorus alloys, nickel-boron alloys, etc., are also available. The heat sink 18 may also have through holes corresponding to the fastening holes 23.

[0020] The lower surface of the heat sink 18 may be positioned on the cooling surface of a cooler (not shown) via a connecting member and fastened to the cooling surface by screws that pass through the fastening holes 23 of the semiconductor device 1 (and through holes in the heat sink 18).

[0021] In this case, the cooler is made of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these materials, which have excellent thermal conductivity. Alternatively, a fin-type heat sink or one composed of multiple fins, as well as a water-cooled cooling device, can be used as the cooler. Furthermore, the heat sink 18 may be integrally constructed with such a cooler. In that case, it is made of aluminum, iron, silver, copper, or an alloy containing at least one of these materials, which have excellent thermal conductivity. To improve corrosion resistance, for example, a material such as nickel may be formed on the surface of the heat sink 18 integrated with the cooler by plating or other means. Specifically, in addition to nickel, nickel-phosphorus alloys, nickel-boron alloys, etc., can be used.

[0022] Furthermore, examples of joining members include brazing materials and thermal interface materials (TIMs). Brazing materials mainly consist of at least one of the following: aluminum alloys, titanium alloys, magnesium alloys, zirconium alloys, and silicon alloys. Thermal interface materials may also be used. TIMs include a variety of thermally conductive greases, elastomer sheets, RTV (Room Temperature Vulcanization) rubbers, gels, and phase-changing materials.

[0023] Furthermore, a printed circuit board may be provided on such a semiconductor device 1. A semiconductor device 1 with a printed circuit board will be described using Figures 4 and 5. Figure 4 is a plan view of the semiconductor device with a printed circuit board. Figure 5 is a side view of the semiconductor device with a printed circuit board. Note that the side view in Figure 5 is a side view taken in the +Y direction, similar to Figure 2.

[0024] The printed circuit board 2 is an example of an electronic component and may have a rectangular shape in plan view, including an upper surface 2b and a lower surface 2c. The size of the printed circuit board 2 in plan view may be larger than, for example, the size of the semiconductor device 1 in plan view. The printed circuit board 2 includes an upper circuit pattern, a lower circuit pattern, and insulating layers provided between these upper and lower circuit patterns, on the upper surface of the upper circuit pattern, and on the lower surface of the lower circuit pattern, respectively. Therefore, the printed circuit board 2 may be constructed by stacking an insulating layer including the lower surface 2c, the lower circuit pattern, an insulating layer, an upper circuit pattern, and an insulating layer including the upper surface 2b in that order from bottom to top.

[0025] The lower and upper circuit patterns are made of a metal with excellent conductivity. Such metals include, for example, copper, aluminum, silver, nickel, or alloys mainly composed of at least one of these. The insulating layer is made of, for example, polyimide resin, epoxy resin, etc. In some cases, it is also possible to impregnate the interior with glass cloth made of glass fibers.

[0026] Furthermore, the printed circuit board 2 has a plurality of through-holes 2a formed at predetermined positions, penetrating the upper surface 2b and the lower surface 2c. The interior of the plurality of through-holes 2a is plated with a conductive material such as copper or a copper alloy. As a result, the plurality of through-holes 2a are electrically connected to at least one of the upper circuit pattern and the lower circuit pattern.

[0027] Multiple through-holes 2a of the printed circuit board 2 are into which press-fit terminals 30 of the semiconductor device 1 are inserted. In this case, the press-fit terminals 30 are press-fitted into each of the multiple through-holes 2a. Note that the through-holes 2a are rectangular in shape when viewed from above (see Figure 14(A)). When viewed from above, the through-holes 2a include both a width in the longitudinal direction and a width in the short direction. For through-holes 2a formed along the long side of the printed circuit board 2, the longitudinal direction of the through-holes 2a is aligned with the longitudinal direction of the printed circuit board 2. For through-holes 2a formed along the short side of the printed circuit board 2, the longitudinal direction of the through-holes 2a is aligned with the short direction of the printed circuit board 2.

[0028] Next, the semiconductor unit containing semiconductor device 1 will be explained using Figure 6. Figure 6 is a cross-sectional view of the main part of the semiconductor device. Note that Figure 6 shows the main part of the cross-section along the dashed line II of semiconductor device 1 in Figure 1.

[0029] The semiconductor unit 10 is mounted on a heat sink 18, housed in a housing area 26 of a case 20 (not shown), and sealed by a sealing member 19. Such a semiconductor unit 10 includes an insulating circuit board 11 and a semiconductor chip 16.

[0030] The insulated circuit board 11 includes an insulating plate 12, a plurality of conductive circuit patterns (conductive circuit patterns 13a and 13b are shown in Figure 6), and a metal plate 14. The insulating plate 12 and the metal plate 14 are rectangular in plan view. The corners of the insulating plate 12 and the metal plate 14 may be rounded (R-chamfered) or chamfered (C-chamfered). The size of the metal plate 14 is smaller than the size of the insulating plate 12 in plan view, and it is formed inside the insulating plate 12.

[0031] The insulating plate 12 is made of a material that has insulating properties and excellent thermal conductivity. Such an insulating plate 12 may be made of ceramics or resin. Examples of ceramics include aluminum oxide, aluminum nitride, and silicon nitride. The resin may be made of a material that has low thermal resistance and high insulating properties. Examples of such resins include thermosetting resins. Thermosetting resins may further contain fillers. Examples of thermosetting resins include at least one of epoxy resins, cyanate resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, maleimide resins, acrylic resins, and polyamide resins. The filler is made of at least one of oxides and nitrides. Examples of fillers include silicon oxide, aluminum oxide, and silicon nitride.

[0032] Multiple conductive circuit patterns are formed on the front surface of the insulating plate 12. The multiple conductive circuit patterns are made of a metal with excellent conductivity. Such metals are, for example, copper, aluminum, or an alloy mainly composed of at least one of these. The surface of the multiple conductive circuit patterns, including the sides, is plated. The plating material used in this process is, for example, nickel, nickel-phosphorus alloy, or nickel-boron alloy. Note that the multiple conductive circuit patterns are just an example. The number, shape, size, and position of the conductive circuit patterns may be appropriately selected as needed.

[0033] The metal plate 14 is formed on the back surface of the insulating plate 12. The metal plate 14 is rectangular in shape. The area of ​​the metal plate 14 in plan view is smaller than the area of ​​the insulating plate 12, but larger than the area of ​​the region where multiple conductive circuit patterns are formed. The corners of the metal plate 14 may be rounded (R-chamfered) or chamfered (C-chamfered). The metal plate 14 is smaller than the size of the insulating plate 12 and is formed over the entire surface of the insulating plate 12, excluding the edges. The metal plate 14 is mainly composed of a metal with excellent thermal conductivity. The metal may be, for example, copper, aluminum, or an alloy containing at least one of these. The surface of the metal plate 14 may be plated. In this case, the plating material used may be, for example, nickel, nickel-phosphorus alloy, or nickel-boron alloy. Here, nickel is given as an example. The plated metal plate 14 has improved corrosion resistance.

[0034] As an insulating circuit board 11 having such a configuration, if the insulating plate 12 is made of ceramics, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazed) substrate may be used.

[0035] The semiconductor chip 16 includes a power device element made of silicon. The power device element is an RC (Reverse-Conducting)-IGBT (Insulated Gate Bipolar Transistor). An RC-IGBT is a semiconductor element in which an IGBT, which is a switching element, and an FWD (Free Wheeling Diode), which is a diode element, are configured in antiparallel within a single chip. The upper surface of such a semiconductor chip 16 is provided with a control electrode (gate electrode) and an output electrode (emitter electrode), which are not shown in the figure. The lower surface of the semiconductor chip 16 is provided with an input electrode (collector electrode), which are not shown in the figure.

[0036] Alternatively, the semiconductor chip 16 may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) made of silicon carbide. In the power MOSFET, the body diode may function as the FWD. Such a semiconductor chip 16 may have, for example, an input electrode (drain electrode) on its back surface (not shown), and an output electrode (source electrode) and a control electrode (gate electrode) on its front surface (not shown).

[0037] Alternatively, the semiconductor chip 16 may use a set of semiconductor chips that include a switching element and a diode element, each made of silicon, instead of an RC-IGBT and a power MOSFET. The switching element is, for example, an IGBT and a power MOSFET. Such a semiconductor chip has, for example, an input electrode (drain electrode or collector electrode) on its bottom surface and a control electrode (gate electrode) and an output electrode (source electrode or emitter electrode) on its top surface. The diode element is, for example, an SBD (Schottky Barrier Diode) or a PiN (P-intrinsic-N) diode used as the FWD. Such a semiconductor chip has an output electrode (cathode electrode) on its bottom surface and an input electrode (anode electrode) on its top surface.

[0038] In such a semiconductor unit 10, the conductive circuit patterns are electrically connected to each other, to the conductive circuit patterns and the semiconductor chip 16, to the press-fit terminals 30 and the conductive circuit patterns, and to the press-fit terminals 30 and the semiconductor chip 16 by wires 15. The wires 15 are mainly composed of a material with excellent conductivity. Such a material is, for example, made of gold, copper, aluminum, or an alloy containing at least one of these.

[0039] Next, a reference example of a press-fit terminal for the press-fit terminal 30 included in the semiconductor device 1 will be explained using Figure 7. Figure 7 is a diagram showing a press-fit terminal. Figure 7(A) is a side view of the contact portion 132 of the press-fit terminal 130 as seen in the +Y direction, and Figure 7(B) is a view of the contact portion 132 of the press-fit terminal 130 as seen in the -X direction.

[0040] The press-fit terminal 130, like the press-fit terminal 30, is made of a metal with excellent conductivity and includes a conductive portion 131 and a contact portion 132. The conductive portion 131 is a flat plate shape extending in the +Z direction (first direction). The conductive portion 131 is embedded in the sides 21a, 21b, 21c, and 21d of the case 20. The pair of contact portions 132 are integrally connected to the +Z end 131a of the conductive portion 131 with a predetermined gap between them, and extend in the +Z direction.

[0041] The pair of contact portions 132 are arc-shaped (arch-shaped) such that their approximate centers are separated outward (in the ±X direction) with respect to the center line C parallel to the +Z direction of the conductive portion 131. In this case, the distance W between the most protruding parts of the outer portions 132a of the pair of contact portions 132 in the ±X direction (wide portion) is smaller than the (longitudinal) width of the insertion hole 2a of the printed circuit board 2. The contact portion 132 also includes the outer portion 132a that forms a curved surface on the side portion 132c. The pair of outer portions 132a are planar and smooth. Such a pair of contact portions 132 have elasticity in the ±X direction starting from the connection point to the conductive portion 131. Such a press-fit terminal 130 may be flat overall.

[0042] The mounting of the printed circuit board 2 to the press-fit terminal 130 will be explained using Figures 8 and 9. Figure 8 is a side view of the press-fit terminal when the printed circuit board is mounted to it. Figure 9 is a side view of the press-fit terminal with the printed circuit board mounted to it.

[0043] First, the printed circuit board 2 is set on the semiconductor device 1 such that multiple through holes 2a face multiple press-fit terminals 130 on the semiconductor device 1. At this time, each of the multiple press-fit terminals 130 corresponds to one of the multiple through holes 2a on the printed circuit board 2 (Figure 8).

[0044] Next, the printed circuit board 2 (press-fit terminals 130 of the semiconductor device 1) is moved towards the semiconductor device 1 (printed circuit board 2), and the multiple press-fit terminals 130 are inserted into the multiple insertion holes 2a of the printed circuit board 2. During insertion, first, the tip of the contact portion 132 of the press-fit terminal 130 (the end in the +Z direction) enters the insertion hole 2a of the printed circuit board 2. As the printed circuit board 2 (press-fit terminals 130 of the semiconductor device 1) moves further toward the case 20 side (-Z direction side) (printed circuit board 2 side (+Z direction side)), the inner surface 2d of the insertion hole 2a of the printed circuit board 2 slides against the outer portion 132a of the pair of contact portions 132, pressing the pair of contact portions 132 inward (towards the center line C). At this time, the pair of contact portions 132 press the inner surface 2d of the insertion hole 2a of the printed circuit board 2 outward by elastic force. In this way, as shown in Figure 9, the pair of contact portions 132 of the press-fit terminal 130 are press-fitted into the insertion hole 2a of the printed circuit board 2. Then, the press-fit terminal 130 and the printed circuit board 2 are electrically connected.

[0045] However, depending on the curvature of the pair of contact portions 132, the friction coefficient of the outer portion 132a of the pair of contact portions 132, and the inner surface 2d of the insertion hole 2a of the printed circuit board 2, it may not be possible to sufficiently maintain the insertion load of the press-fit terminal 130 into the insertion hole 2a of the printed circuit board 2. In addition to the above, other reasons why the insertion load may not be sufficiently maintained include the material, shape, and thickness of the pair of contact portions 132. Furthermore, even if the press-fit terminal 130 is press-fitted into the printed circuit board 2, depending on the curvature and friction coefficient described above, the pull-out load may not be maintained, and the insertion hole 2a of the printed circuit board 2 may come out of the press-fit terminal 130. Note that the insertion load is the maximum value of the load in the ±Z direction that occurs from the start to the completion of insertion of the press-fit terminal 130 into the insertion hole 2a of the printed circuit board 2. The pull-out load is the maximum value of the load in the ±Z direction that occurs from the start to the completion of pull-out of the press-fit terminal 130 into the insertion hole 2a of the printed circuit board 2. The minimum and maximum values ​​of the insertion load and pull-out load, respectively, may be independently set based on the application, performance, and function of the press-fit terminal 130. The reason for setting the pull-out load is to prevent the press-fit terminal 130 from easily coming loose after insertion and while the device is in use.

[0046] Furthermore, the press-fit terminal 130 is also plated on its surface, similar to the press-fit terminal 30. When the insertion hole 2a of the printed circuit board 2 is inserted while sliding along the outer part 132a of the contact part 132 of the press-fit terminal 130, the plating film on the outer part 132a of the contact part 132 may be scraped off, and burrs B may be generated between the insertion hole 2a and the outer part 132a of the contact part 132 (see Figure 9). Depending on the length of the burrs B, they may come into contact with the press-fit terminal 130 or the components near the press-fit terminal 130, making it impossible to maintain insulation. Also, if the press-fit terminal 130 with burrs B generated in this way falls out of the insertion hole 2a, the burrs B may scatter onto other circuits, potentially causing a short circuit in the circuit wiring.

[0047] Here, the press-fit terminal 30 of the first embodiment will be described using Figures 10 and 11. Figure 10 is a diagram showing the press-fit terminal of the first embodiment. Figure 11 is a side view of the main part of the contact portion of the press-fit terminal of the first embodiment. Figure 10(A) is a side view of the vicinity of the contact portion 32 of the press-fit terminal 30 as seen in the +Y direction, and Figure 10(B) is a view of the vicinity of the contact portion 32 of the press-fit terminal 30 as seen in the -X direction. Figure 11 is an enlarged view of the portion enclosed by the dashed line in Figure 10. The press-fit terminal 30 shown in Figure 10 corresponds to the press-fit terminal 30d provided on the side portion 21d of the case 20. The press-fit terminals 30a, 30b, and 30c have the same configuration as the press-fit terminal 30 shown in Figure 10, except that the viewing direction is different.

[0048] The press-fit terminal 30 of the first embodiment also includes a conductive portion 31 and a pair of contact portions 32. The conductive portion 31 may include a portion extending in the +Z direction (first direction) and includes an end portion 31a on the +Z direction side. The conductive portion 31 may also be flat. In the first embodiment, the conductive portion 31 includes a portion extending in the +Z direction relative to the upper edges 21a1, 21b1, 21c1, 21d1 of the case 20. The conductive portion 31 is not necessarily entirely straight; for example, it may be L-shaped, with the end opposite the end portion 31a extending toward the housing area 26 of the case 20. Such a conductive portion 31 may be integrally molded with the side portions 21a, 21b, 21c, 21d of the case 20, for example, as shown by dashed lines in Figures 2 and 3.

[0049] The pair of contact portions 32, similar to the pair of contact portions 132 in Figure 8, are integrally connected to the end 31a of the conductive portion 31, extend in the +Z direction, and are press-fitted into the insertion hole 2a of the printed circuit board 2. The pair of contact portions 32 are also provided at equal intervals around a center line C parallel to the +Z direction of the end 31a of the conductive portion 31. Here, the pair of contact portions 32 are connected to the end 31a of the conductive portion 31 with a predetermined gap in the ±X direction. Such a pair of contact portions 32 also have an arc shape (arch shape) such that their approximate central parts are separated outward (in the ±X direction). The distance between the tops (wide part) of the arc-shaped pair of contact portions 32 is also W, and is set to be smaller than the (longitudinal) width of the insertion hole 2a of the printed circuit board 2. Furthermore, the length of the (±Y direction) width of the pair of contact portions 32 is set to be approximately equal to the (short direction) width of the insertion hole 2a of the printed circuit board 2.

[0050] Such a pair of contact portions 32 have recesses 32b formed in relation to the pair of contact portions 132. That is, the side surface 32c of the pair of contact portions 32 has an outer portion 32a that contacts the inner surface 2d of the insertion hole 2a of the printed circuit board 2, and a plurality of recesses 32b provided on the outer portion 32a. Such a plurality of recesses 32b may be formed, for example, on the outer portion 132a of the contact portion 132 shown in Figures 7 to 9 by press working.

[0051] Furthermore, as the pair of contact portions 32 form an arc shape, the outer portion 32a also forms an arc shape and a smooth surface, similar to the outer portion 132a in Figure 8. A recess 32b is formed in the arc shape of the outer portion 32a. Therefore, the portion of the outer portion 32a excluding the recess 32b forms an arc shape similar to the same portion of the outer portion 132a. Also, in the outer portion 32a, the imaginary line (imaginary surface) connecting the first edge 32b3 and the second edge 32b4 of the recess 32b forms an arc shape (curved surface) similar to the same portion of the outer portion 132a.

[0052] As shown in Figure 10, multiple recesses 32b are provided on the outer portion 32a along the ±Z direction. Note that the first embodiment merely illustrates the case where multiple recesses 32b are provided on the side surface 32c. Depending on the insertion depth of the press-fit terminal 30 into the insertion hole 2a, one recess 32b may be provided in the area of ​​the side surface 32c that overlaps with the insertion hole 2a. Therefore, one or more recesses 32b may be formed on the side surface 32c. Multiple recesses 32b are each formed on the outer portion 32a so as to cross the width direction (±Y direction). Therefore, the recesses 32b are parallel to the ±Y direction. Also, the length of the recesses 32b in the ±Z direction is shorter (smaller) than the thickness of the insertion hole 2a of the printed circuit board 2.

[0053] As shown in Figure 11, such a recess 32b includes a first edge 32b3 that is farther from the end 31a of the conductive portion 31, and a second edge 32b4 that is closer to the end 31a of the conductive portion 31. The first edge 32b3 and the second edge 32b4 are parallel to each other in the ±Y direction. The recess 32b further includes a first inner surface 32b1 connected to the first edge 32b3, and a second inner surface 32b2 connected to the second edge 32b4. The widths of the first inner surface 32b1 and the second inner surface 32b2 in the ±Y direction are equal to the width of the outer portion 32a in the same direction. That is, the first inner surface 32b1 and the second inner surface 32b2 are provided across the width direction of the outer portion 32a. The first inner surface 32b1 forms an obtuse angle α with respect to the first tangent line L1 (in a side view) that is tangent to the first edge 32b3. The obtuse angle α is the angle that the first inner surface 32b1 makes with respect to the first tangent line L1, with the first edge 32b3 as its vertex. That is, the first inner surface 32b1 in Figure 11 makes an angle with respect to the first tangent line L1 in one direction (in this case, the positive direction), with the first edge 32b3 as its vertex. The second inner surface 32b2 makes an acute angle β with respect to the second tangent line L2 (in a side view), which is tangent to the second edge 32b4. The acute angle β is the angle that the second inner surface 32b2 makes with respect to the second tangent line L2, with the second edge 32b4 as its vertex. That is, the second inner surface 32b2 in Figure 11 makes an angle with respect to the second tangent line L2 in one direction (in this case, the positive direction), with respect to the second edge 32b4 as its vertex.

[0054] The first tangent L1 corresponds to a side view of the first contact surface that contacts the first edge 32b3 of the outer portion 32a. The second tangent L2 corresponds to a side view of the second contact surface that contacts the second edge 32b4 of the outer portion 32a.

[0055] Therefore, the side view shape of the recess 32b is such that, for example, a notch is formed in the outer portion 32a when viewed from the side. As shown in Figure 11, the recess 32b includes a flat first inner surface 32b1 and a second inner surface 32b2. In the recess 32b, the bottom portion 32b5 to which the first inner surface 32b1 and the second inner surface 32b2 are connected is angular.

[0056] Furthermore, in such a recess 32b, the first inner surface 32b1 is perpendicular to the +Z direction (first direction) and forms a first angle ε with respect to the XY plane (first plane P1) passing through the first edge 32b3. The first angle ε is the angle that the first inner surface 32b1 makes with respect to the first plane P1, with the first edge 32b3 as its vertex. That is, the first inner surface 32b1 forms an angle in the ±Z direction (positive and negative directions, respectively) with respect to the first plane P1, with the first edge 32b3 as its vertex. Figure 11 shows the case where the first inner surface 32b1 forms an angle in the -Z direction with respect to the first plane P1, with the first edge 32b3 as its vertex. That is, it shows the case where the first angle ε forms a negative angle with respect to the first plane P1.

[0057] Furthermore, the second inner surface 32b2 is perpendicular to the +Z direction (first direction) and forms a second angle γ with respect to the XY plane (second plane P2) passing through the second edge 32b4. The second angle γ is the angle that the second inner surface 32b2 makes with respect to the second plane P2, with the second edge 32b4 as its vertex. That is, the second inner surface 32b2 in Figure 11 forms an angle with respect to the second plane P2 in one direction (this case is considered the positive direction), with the second edge 32b3 as its vertex. As previously described, the first inner surface 32b1 forms an obtuse angle α and the second inner surface 32b2 forms an acute angle β, so the absolute value of the second angle γ is greater than the absolute value of the first angle ε. However, it is desirable that the difference between the absolute value of the second angle γ and the absolute value of the first angle ε be greater than 30°. Note that Figure 11 shows the case where the first inner surface 32b1 is inclined downward (-Z direction) with respect to the first plane P1.

[0058] The recess 32b only needs to have a first inner surface 32b1 and a second inner surface 32b2. For example, the recess 32b may include three or more inner surfaces, including the first inner surface 32b1 and the second inner surface 32b2. Also, the recess 32b may include the first inner surface 32b1 and the second inner surface 32b2, and the bottom 32b5 may be bent (curved). Alternatively, the first inner surface 32b1 and the second inner surface 32b2 may rise from the first edge 32b3 and the second edge 32b4 at an obtuse angle α and an acute angle β, respectively, and may be curved rather than flat.

[0059] Furthermore, in such a recess 32b, the bottom portion 32b5 is located on the +Z side of the second edge portion 32b4, and the angle between the outer portion 32a connected to the first edge portion 32b3 and the first inner surface 32b1 is acute. Therefore, the first inner surface 32b1 and the second inner surface 32b2 form the obtuse angle α, acute angle β, first angle ε, and second angle γ described above.

[0060] Furthermore, in the first embodiment, the recess 32b is formed continuously with respect to the outer portion 32a along the ±Z direction. The recess 32b includes a first edge 32b3 and a second edge 32b4. Therefore, the second edge 32b4 of the recess 32b corresponds to the first edge 32b3 of the recess 32b adjacent to it.

[0061] Next, the attachment of the press-fit terminal 30 to the insertion hole 2a of the printed circuit board 2 will be explained using Figures 12 to 14. Figure 12 is a side view of the press-fit terminal attached to the printed circuit board in the first embodiment. Figure 13 is an enlarged side view of the main part attached to the press-fit terminal on the printed circuit board in the first embodiment. Figure 14 is a diagram showing the press-fit terminal with the printed circuit board attached in the first embodiment.

[0062] In Figure 13, the arrow labeled "IN" indicates the direction for inserting the press-fit terminal 30 into the insertion hole 2a of the printed circuit board 2. The arrow labeled "OUT" indicates the direction for withdrawing the press-fit terminal 30 from the insertion hole 2a of the printed circuit board 2. Furthermore, Figure 14(A) is a plan view of Figure 14(B) in the -Z direction, and Figure 14(B) is a cross-sectional view of Figure 14(A) along the dashed line II.

[0063] First, the printed circuit board 2 is set on the semiconductor device 1 so that multiple through holes 2a face multiple press-fit terminals 30 on the semiconductor device 1. In this case, as shown in Figure 12, the multiple press-fit terminals 30 correspond to the multiple through holes 2a on the printed circuit board 2. Note that Figure 12 shows the case where one through hole 2a on the printed circuit board 2 corresponds to one press-fit terminal 30.

[0064] Next, the printed circuit board 2 (press-fit terminals 30 of the semiconductor device 1) is moved to the semiconductor device 1 (printed circuit board 2) side, and the multiple press-fit terminals 30 are inserted into the multiple insertion holes 2a of the printed circuit board 2. When inserting, first the tip of the contact portion 32 of the press-fit terminal 30 (the end in the +Z direction) enters the insertion hole 2a of the printed circuit board 2.

[0065] The printed circuit board 2 (press-fit terminal 30) moves further toward the case 20 side (-Z direction side) (printed circuit board 2 side (+Z direction side)) (arrow in the "IN" direction in Figure 13). Since the longitudinal width of the insertion hole 2a of the printed circuit board 2 is narrower than the distance W between the pair of contact portions 32, the inner surface 2d of the insertion hole 2a presses the pair of contact portions 32 toward the center line C (see Figure 12) as the outer portion 32a and the first edge 32a3 and second edge 32a4 of the pair of contact portions 32 slide in the -Z direction. The pressed pair of contact portions 32 elastically press the inner surface 2d of the insertion hole 2a of the printed circuit board 2 toward the outside.

[0066] When the insertion hole 2a of the printed circuit board 2 moves in the -Z direction along the first edge 32a3 and second edge 32a4 of the pair of contact portions 32, the corner (second edge 32b4) formed by the second inner surface 32b2, which is inclined at an acute angle β, becomes friction (resistance) against the inner surface 2d of the insertion hole 2a. At this time, the insertion load can be set within a predetermined range by controlling the acute angle β of the second inner surface 32b2. The insertion load depends on the material of the press-fit terminal 30 and the curvature of the pair of contact portions 32, but if it is too small, the insertion hole 2a will easily come out of the press-fit terminal 30, and if it is too large, the press-fit terminal 30 will not be able to enter the insertion hole 2a. Therefore, the insertion load is preferably, for example, 40N or more and 110N or less. For example, if the insertion load is too large, the acute angle β of the second inner surface 32b2 can be reduced to weaken the resistance, and if the insertion load is too small, the acute angle β of the second inner surface 32b2 can be increased to strengthen the resistance. The insertion load also depends on the second angle γ shown in Figure 11. If the insertion load is too large, the second angle γ can be increased to weaken the resistance, and if the insertion load is too small, the second angle γ can be decreased to strengthen the resistance. In other words, as the acute angle β becomes larger or smaller, the second angle γ becomes smaller or larger.

[0067] In this case as well, as explained in Figure 9, the plating film on the outer portion 32a of the pair of contact portions 32 of the press-fit terminal 30 is scraped off by the insertion hole 2a of the printed circuit board 2 moving in the -Z direction. However, in the press-fit terminal 30, multiple depressions 32b are formed on the outer portion 32a on which the plating film is formed, so the plating film in the portions corresponding to the depressions 32b is removed. Therefore, the pair of contact portions 32 have less plating film than the press-fit terminal 130 in Figure 8, and the length of the resulting burr B does not exceed the length of the depression 32b (in the ±Z direction). Note that if the burr B is too long, it may affect the area around the press-fit terminal 30. The length of the burr B depends on the overall size of the semiconductor device 1, but it is preferably 650 μm or less. Therefore, the length of the burr B can be made 650 μm or less depending on the length of the depression 32b (in the ±Z direction). Therefore, even if burrs B occur, they are short, preventing them from coming into contact with the press-fit terminal 30 or the components near the press-fit terminal 30, thus maintaining insulation.

[0068] In this way, as shown in Figure 14, the pair of contact portions 32 of the press-fit terminal 30 are press-fitted into the insertion hole 2a of the printed circuit board 2. Then, the press-fit terminal 30 and the printed circuit board 2 are electrically connected.

[0069] On the other hand, when attempting to pull out the press-fit terminal 30 that has been press-fitted into the insertion hole 2a of the printed circuit board 2 (arrow in the "OUT" direction in Figure 13), the corner portion (first edge portion 32b3) formed by the first inner surface 32b1, which is inclined at an obtuse angle α, becomes friction (resistance) against the inner surface 2d of the insertion hole 2a. By controlling the obtuse angle α of the first inner surface 32b1, the pull-out load can be set to a predetermined range. The pull-out load is preferably, for example, 40N or more. For example, if the pull-out load is too small, the resistance can be increased by increasing the obtuse angle α of the first inner surface 32b1. Similarly, the pull-out load also depends on controlling the first angle ε shown in Figure 11. If the pull-out load is too small, if the first angle ε is in the negative direction with respect to the first plane P1, the first angle ε will be decreased, and if it is in the positive direction with respect to the first plane P1, the first angle ε will be increased to increase the resistance. In other words, as the obtuse angle α increases, the first angle ε in the negative direction relative to the first plane P1 decreases, and the first angle ε in the positive direction relative to the first plane P1 increases.

[0070] In such insertion and extraction loads, the extraction load should ideally be greater than the insertion load. Therefore, it is desirable that the absolute value of the second angle γ be greater than the absolute value of the first angle ε. However, if the first angle ε is too large, the extraction load becomes excessively large, making extraction difficult. For this reason, it is desirable that the difference between the second angle γ and the first angle ε be greater than 30°.

[0071] In the case of the press-fit terminal 130 shown in the example, in order to ensure that the insertion load and pull-out load fall within the desired range exemplified above, it is conceivable to change the shape, material, and thickness of the press-fit terminal 130. However, such changes would alter both the insertion load and the pull-out load. That is, even if the insertion load falls within the desired range, the pull-out load may not, and vice versa. Therefore, with the press-fit terminal 30, both the insertion load and the pull-out load can be brought within the desired range simply by changing the obtuse angle α and the acute angle β, respectively. Increasing the obtuse angle α increases the pull-out load, and decreasing it decreases the pull-out load. Increasing the acute angle β increases the insertion load, and decreasing it decreases the insertion load. In this way, the pull-out load and insertion load can be individually changed by individually changing the settings of the obtuse angle α and the acute angle β. In addition, the length of the burr B can be adjusted by setting the length of the outer part 32a and the second inner surface 32b2, and it can be kept within the required specifications.

[0072] The press-fit terminal 30 included in the semiconductor device 1 described above is press-fitted into a through-hole 2a that penetrates the printed circuit board 2. Such a press-fit terminal 30 includes a conductive portion 31 that extends in the +Z direction (first direction) and has an end 31a on the +Z direction side, and a contact portion 32 that is connected to the end 31a of the conductive portion 31, extends in the +Z direction, and is press-fitted into the through-hole 2a. The contact portion 32 has an outer portion 32a that contacts the inner surface 2d of the through-hole 2a and a recess 32b provided in the outer portion 32a. The recess 32b includes a first edge portion 32b3 that is farther from the end 31a, a second edge portion 32b4 that is closer to the end 31a, a first inner surface 32b1 connected to the first edge portion 32b3, and a second inner surface 32b2 connected to the second edge portion 32b4. Furthermore, the first inner surface 32b1 forms a first angle ε with respect to the XY plane (first plane P1) that is perpendicular to the +Z direction (first direction) and passes through the first edge 32b3, and the second inner surface 32b2 forms a second angle γ with respect to the XY plane (second plane P2) that is perpendicular to the +Z direction (first direction) and passes through the second edge 32b4. In this case, the absolute value of the second angle γ is greater than the absolute value of the first angle ε. With such a press-fit terminal 30, the insertion load and withdrawal load of the press-fit terminal 30 into the insertion hole 2a of the printed circuit board 2 can be freely controlled by controlling the second angle γ (acute angle β) of the second inner surface 32b2 and the first angle ε (obtuse angle α) of the first inner surface 32b1. As a result, the insertion load and withdrawal load can be controlled, and the press-fit terminal 30 can be press-fitted into the insertion hole 2a of the printed circuit board 2 with the optimal insertion load. Furthermore, the press-fit terminal 30, which is press-fitted into the insertion hole 2a of the printed circuit board 2, cannot be easily pulled out. In addition, the length of the burr B that is generated can be shortened, and contact with the press-fit terminal 30 and its surroundings can be prevented. A semiconductor device 1 including such a press-fit terminal 30 can reduce the assembly defect rate and suppress manufacturing costs.

[0073] Furthermore, since the length of the recess 32b in the ±Z direction is smaller than the thickness of the insertion hole 2a of the printed circuit board 2, when the press-fit terminal 30 is press-fitted into the insertion hole 2a, the first edge 32b3 and the second edge 32b4 come into contact with the inner surface 2d of the insertion hole 2a. For this reason, the corners of the first edge 32b3 and the second edge 32b4 function as resistance against the inner surface 2d of the insertion hole 2a of the printed circuit board 2. For this reason, it is necessary to include one or more recesses 32b in the region where the outer portion 32a of the pair of contact portions 32 overlaps with the insertion hole 2a of the printed circuit board 2.

[0074] [Second Embodiment] In the press-fit terminal 30 of the second embodiment, a plurality of recesses 32b are formed on the outer portion 32a of the pair of contact portions 32, with gaps between them. Such a press-fit terminal 30 will be explained with reference to Figures 15 and 16. Figure 15 is a diagram showing the press-fit terminal of the second embodiment. Figure 16 is a side view of the main part of the contact portion of the press-fit terminal of the second embodiment. Note that Figures 15 and 16 correspond to Figures 10 and 11 of the first embodiment. Figure 15(A) is a side view of the contact portion 32 of the press-fit terminal 30 as seen in the +Y direction, and Figure 15(B) is a view of the contact portion 32 of the press-fit terminal 30 as seen in the -X direction. Figure 16 is an enlarged view of the portion enclosed by the dashed line in Figure 15. The press-fit terminal 30 shown in Figure 15 also corresponds to the press-fit terminal 30d provided on the side portion 21d of the case 20. The press-fit terminals 30a, 30b, and 30c have the same configuration as the press-fit terminal 30 shown in Figure 15, except that the viewing direction is different.

[0075] The press-fit terminal 30 of the second embodiment includes a conductive portion 31 and a pair of contact portions 32, similar to the press-fit terminal 30 of the first embodiment. In the second embodiment, the side surface 32c of the pair of contact portions 32 has an outer portion 32a and a plurality of recesses 32b provided on the outer portion 32a with gaps in the ±Z direction. Therefore, the portion of the outer portion 32a excluding the recesses 32b forms an arc shape similar to the same portion of the outer portion 132a. Also, the portion between adjacent recesses 32b of the outer portion 32a forms an arc shape (curved surface) similar to the same portion of the outer portion 132a.

[0076] In the press-fit terminal 30 of this second embodiment, the length from the first edge 32b3 of the recess 32b to the second edge 32b4 of the adjacent recess 32b may be smaller than the thickness of the insertion hole 2a of the printed circuit board 2.

[0077] Next, the attachment of the press-fit terminal 30 to the insertion hole 2a of the printed circuit board 2 will be explained using Figure 17. Figure 17 is an enlarged side view of the main part when the press-fit terminal is attached to the printed circuit board in the second embodiment. Note that Figure 17 corresponds to Figure 13 of the first embodiment.

[0078] In the press-fit terminal 30 of the second embodiment, similar to the first embodiment, the insertion load can be set within a predetermined range by controlling the second angle γ (acute angle β) of the second inner surface 32b2, and the withdrawal load can be set within a predetermined range by controlling the first angle ε (obtuse angle α) of the first inner surface 32b1. Furthermore, in the press-fit terminal 30 of the second embodiment, the insertion load and withdrawal load can be increased by the outer portion 32a between the recesses 32b contacting the inner surface 2d of the through hole 2a. Also in this case, similar to the first embodiment, the length of the generated burr B is suppressed.

[0079] [Third Embodiment] In the third embodiment, a modified example of the press-fit terminal 30 of the first embodiment will be described using Figure 18. Figure 18 is a side view of the press-fit terminal of the third embodiment. Note that Figure 18 corresponds to Figure 10(A) of the first embodiment. The side surfaces 32c of the pair of contact portions 32 of the press-fit terminal 30 in Figure 18 have the same width (in the ±X direction) as the side surfaces 32c of the press-fit terminal 30 of the first and second embodiments. The press-fit terminal 30 shown in Figure 18 also corresponds to the press-fit terminal 30d provided on the side portion 21d of the case 20. The press-fit terminals 30a, 30b, and 30c have the same configuration as the press-fit terminal 30 shown in Figure 18, except that the viewing direction is different.

[0080] The press-fit terminal 30 of the third embodiment also includes a conductive portion 31 and a pair of contact portions 32, similar to the press-fit terminal 30 of the second embodiment. In the third embodiment, the side surface 32c of the pair of contact portions 32 has an outer portion 32a and a plurality of recesses 32b provided on the outer portion 32a with gaps in the ±Z direction.

[0081] The recess 32b has a first inner surface 32b1 and a second inner surface 32b2 that form a curved surface that bulges outward with respect to the center line C (curved outward). The first inner surface 32b1 and the second inner surface 32b2 are connected to form the recess 32b. With respect to this connection point, the rising angle of the first inner surface 32b1 is greater than the rising angle of the second inner surface 32b2. Furthermore, the outer portion 32a between the recesses 32b also forms a curved surface that bulges outward with respect to the center line C (curved outward). In other words, the outer portion 32a between the second inner surface 32b2 of recess 32b and the first inner surface 32b1 of the adjacent recess 32b is curved outward with respect to the center line C.

[0082] Even in such a recess 32b, as shown in Figure 18, it includes a first edge 32b3 that is farther from the end 31a of the conductive portion 31, and a second edge 32b4 that is closer to the end 31a of the conductive portion 31. The recess 32b further includes a first inner surface 32b1 connected to the first edge 32b3, and a second inner surface 32b2 connected to the second edge 32b4. Within the recess 32b, the first inner surface 32b1 and the second inner surface 32b2 are connected at the bottom 32b5. In the third embodiment, the first inner surface 32b1 is a curved surface. For this reason, for example, the first edge 32b3 may be an inflection point between the first inner surface 32b1 and the outer portion 32a (on the +Z side of the first inner surface 32b1). Similarly, the second edge 32b4 may be an inflection point between the second inner surface 32b2 and the outer surface 32a (on the -Z side of the second inner surface 32b2). The first inner surface 32b1 forms an obtuse angle α with respect to the first tangent line L1 (in a side view) that is tangent to the first edge 32b3. This obtuse angle α is the angle between the first tangent line L1 and the tangent line T1 that passes through the bottom 32b5 and is tangent to the surface rising from the bottom 32b5 of the first inner surface 32b1. The second inner surface 32b2 forms an acute angle β with respect to the second tangent line L2 (in a side view) that is tangent to the second edge 32b4. This acute angle β is the angle between the second tangent line L2 and the tangent line T2 that passes through the bottom 32b5 and is tangent to the surface rising from the bottom 32b5 of the second inner surface 32b2. Furthermore, in Figure 18, the acute angle β with respect to the second inner surface 32b2 is shown in the depression 32b adjacent to the depression 32b containing the first inner surface 32b1.

[0083] The first tangent L1 corresponds to a side view of the first contact surface that contacts the first edge 32b3 of the outer portion 32a. The second tangent L2 corresponds to a side view of the second contact surface that contacts the second edge 32b4 of the outer portion 32a.

[0084] In the press-fit terminal 30 of the third embodiment, similar to the second embodiment, the insertion load can be set within a predetermined range by controlling the acute angle β of the second inner surface 32b2, and the pull-out load can be set within a predetermined range by controlling the obtuse angle α of the first inner surface 32b1. Furthermore, in the press-fit terminal 30 of the second embodiment, since the outer portion 32a between the recesses 32b is curved outward with respect to the center line C, the insertion load and pull-out load can be increased by contacting the inner surface 2d of the insertion hole 2a. In addition, the length of the generated burr B is suppressed.

[0085] [Fourth Embodiment] In the fourth embodiment, a modified example of the press-fit terminal 30 of the first embodiment will be described with reference to Figure 19. Figure 19 is a side view of the press-fit terminal of the fourth embodiment. Note that Figure 19 corresponds to Figure 10(A) of the first embodiment. Also, the side surfaces 32c of the pair of contact portions 32 of the press-fit terminal 30 in Figure 19 have the same width (in the ±X direction) as the side surfaces 32c of the press-fit terminal 30 of the first to third embodiments.

[0086] The press-fit terminal 30 of the fourth embodiment also includes a conductive portion 31 and a pair of contact portions 32, similar to the press-fit terminals 30 of the first to third embodiments. In the fourth embodiment, the side surface 32c of the pair of contact portions 32 has an outer portion 32a and a plurality of recesses 32b provided with a gap between them and the outer portion 32a. The recesses 32b in the fourth embodiment are grooves that cross the outer portion 32a in the ±Y direction. In the fourth embodiment as well, the recesses 32b are formed continuously with respect to the outer portion 32a along the ±Z direction.

[0087] Such a recess 32b includes a first edge 32b3 that is farther from the end 31a of the conductive portion 31, and a second edge 32b4 that is closer to the end 31a of the conductive portion 31. The recess 32b further includes a first inner surface 32b1 connected to the first edge 32b3, and a second inner surface 32b2 connected to the second edge 32b4. The first inner surface 32b1 and the second inner surface 32b2 are formed parallel to the ±X direction. The recess 32b has a bottom surface (notation omitted) that connects the first inner surface 32b1 and the second inner surface 32b2 and is parallel to the ±Z direction. The height (recess width) of the recess 32b in the ±Z direction is determined by various factors such as the shape and material of the press-fit terminal 30. For example, for a press-fit terminal 30 with insufficient pull-out load, a groove is machined with a minimum recess width of about one-tenth of the ±Y width of the press-fit terminal 30, and the insertion load and pull-out load are measured. While checking whether the insertion load and pull-out load fall within the desired range, the recess width is gradually widened to find the optimal value.

[0088] Furthermore, the press-fit terminal 30 shown in Figure 19 also corresponds to the press-fit terminal 30d provided on the side portion 21d of the case 20. The press-fit terminals 30a, 30b, and 30c have the same configuration as the press-fit terminal 30 shown in Figure 19, except that they are viewed from a different direction.

[0089] Furthermore, the first inner surface 32b1 forms an obtuse angle α with respect to the first tangent line L1 (in a side view) that is tangent to the first edge 32b3. The second inner surface 32b2 forms an acute angle β with respect to the second tangent line L2 (in a side view) that is tangent to the second edge 32b4.

[0090] The first tangent L1 corresponds to a side view of the first contact surface that contacts the first edge 32b3 of the outer portion 32a. The second tangent L2 corresponds to a side view of the second contact surface that contacts the second edge 32b4 of the outer portion 32a.

[0091] Even in this fourth embodiment of the press-fit terminal 30, by forming an acute angle β of the second inner surface 32b2 and an obtuse angle α of the first inner surface 32b1, the insertion load and withdrawal load of the press-fit terminal 30 relative to the insertion hole 2a of the printed circuit board 2 can be increased compared to the press-fit terminal 130 of the reference example.

[0092] Furthermore, in the press-fit terminal 30 of the fourth embodiment, the length of the burr B generated when the press-fit terminal 30 is inserted into the insertion hole 2a of the printed circuit board 2 can also be shortened. However, the width of the recess 32b of the press-fit terminal 30 in the ±Z direction of the fourth embodiment is smaller than that of the first and second embodiments. For this reason, the area of ​​the pair of contact portions 32 of the press-fit terminal 30 that overlaps with the insertion hole 2a of the printed circuit board 2 requires, for example, three or more recesses 32b.

[0093] In the first to fourth embodiments, examples are given of cases in which various recesses 32b are formed on the press-fit terminal 130 shown in Figures 7 to 9. The press-fit terminal 130 on which the recesses 32b are formed is not limited to the cases shown in Figures 7 to 9. For example, the pair of contact portions 132 of the press-fit terminal 130 may have their ends connected in the +Z direction, and the contact portions may form an annular elliptical shape in side view. Alternatively, the pair of contact portions 132 of the press-fit terminal 130 may extend linearly in the +Z direction without forming an arc. Alternatively, two or more contact portions 132 may be formed at equal intervals on the conductive portion 131 with the center line C as the center in a plan view. For example, if there are three contact portions 132, the press-fit terminal 130 does not have to be flat, and the conductive portion 131 may be cylindrical, for example, with three contact portions 132 formed at equal intervals along the circumference with the center line C at the end of the cylindrical conductive portion 131. [Explanation of Symbols]

[0094] 1 Semiconductor device 2 Printed circuit boards 2a Through hole 2b Top surface 2c Bottom surface 2D interior 10 Semiconductor Units 11 Insulated circuit board 12 Insulating board 13a, 13b Conductive circuit patterns 14 Metal plate 15 wires 16 Semiconductor Chips 18 Heat sink 19 Sealing member 20 cases 21a, 21b, 21c, 21d Side view 21a1,21b1,21c1,21d1 Upper edge 21a2,21b2,21c2,21d2 Terminal port 22 Aperture 23 Fastening hole 24 Sealing member 25 Lower edge 26 Storage Areas 30, 30a, 30b, 30c, 30d Press-fit terminals 31 Conductive section 31a End 32 Contact area 32a outer part 32b depression 32b1 First inner surface 32b2 Second inner surface 32b3 1st edge 32b4 Second edge 32b5 bottom 32c side B Bali

Claims

1. A press-fit terminal that is pressed into a through-hole in an electronic component, A conductive portion extending in a first direction and having its end on the side in the first direction, A contact portion connected to the end of the conductive portion, extending in the first direction and press-fitted into the insertion hole, Includes, The contact portion has an outer portion that contacts the inner surface of the insertion hole and a recess provided in the outer portion. The recess includes a first edge portion further from the end portion, a second edge portion closer to the end portion, a first inner surface connected to the first edge portion, and a second inner surface connected to the second edge portion. With respect to a first plane perpendicular to the first direction and passing through the first edge, the first inner surface forms a first angle, With respect to a second plane that is perpendicular to the first direction and passes through the second edge, the second inner surface forms a second angle. The absolute value of the second angle is greater than the absolute value of the first angle. Press-fit terminals.

2. Multiple such contact points exist. Multiple contact portions are provided at equal intervals around a center line parallel to the first direction of the end portion. The press-fit terminal according to claim 1.

3. The contact portion is arc-shaped, spaced outward from the center line, and the outer portion, including the first and second edges of the contact portion, is arc-shaped. The press-fit terminal according to claim 2.

4. The outer portion of the contact portion has a plurality of recesses formed along the first direction. The press-fit terminal according to claim 2.

5. At least one of the plurality of recesses is formed in the region of the outer part of the contact portion that overlaps with the insertion hole of the electronic component. The press-fit terminal according to claim 4.

6. The multiple recesses are formed by being continuously connected without any gaps. The press-fit terminal according to claim 4.

7. Multiple recesses are formed with gaps between them, and multiple first and second edges exist. The press-fit terminal according to claim 4.

8. The outer portion of the gap is further curved outward with respect to the center line. The press-fit terminal according to claim 7.

9. The recess is formed on the outer part of the contact portion, extending across the width direction of the outer part perpendicular to the first direction. The press-fit terminal according to claim 1.

10. A press-fit terminal that is pressed into a through-hole in an electronic component, A conductive portion extending in a first direction and having its end on the side in the first direction, A contact portion connected to the end of the conductive portion, extending in the first direction and press-fitted into the insertion hole, Includes, The contact portion has an outer portion that contacts the inner surface of the insertion hole and a recess provided in the outer portion. In the region of the outer part that overlaps with the insertion hole, three or more recesses are formed along the first direction. Press-fit terminals.

11. A press-fit terminal that is pressed into a through-hole in an electronic component, A conductive portion extending in a first direction and having its end on the side in the first direction, A contact portion connected to the end of the conductive portion, extending in the first direction and press-fitted into the insertion hole, Includes, The contact portion has an outer portion that contacts the inner surface of the insertion hole and a recess provided in the outer portion. The recess includes a first edge portion further from the end portion, a second edge portion closer to the end portion, a first inner surface connected to the first edge portion, and a second inner surface connected to the second edge portion. When the outer portion is extended and a virtual surface is considered that virtually connects the first edge and the second edge, The first inner surface forms an obtuse angle with respect to the virtual surface, The second inner surface forms an acute angle with respect to the virtual surface. Press-fit terminals.

12. A press-fit terminal according to any one of claims 1 to 11, Semiconductor device.

Images