Method for polishing a workpiece and apparatus for polishing a workpiece

Abstract

To simplify the equipment configuration and improve the accuracy of temperature control at the processing point by adjusting the temperature of the processing point. [Solution] In the workpiece polishing method of the present invention, the workpiece held on a holding table (12) is polished with a polishing pad (31). The workpiece polishing method of the present invention comprises a polishing step of polishing the workpiece while supplying a mixed fluid (M), which is a mixture of a polishing liquid and a gas, to the polishing pad; a temperature acquisition step of acquiring information related to the temperature of the processing point with a temperature sensor (25) during the polishing step; and an adjustment step of adjusting the temperature of the liquid or gas in the mixed fluid according to the temperature of the processing point.

Description

Technical Field

[0001] The present invention relates to a method for polishing a workpiece polished by a polishing pad and a polishing apparatus for a workpiece.

Background Art

[0002] Patent Document 1 discloses a polishing apparatus including a polishing table having a polishing pad attached to an upper surface thereof to form a polishing surface, and a top ring for holding a substrate above the polishing table. Further, the polishing apparatus of Patent Document 1 includes a polishing liquid supply nozzle for supplying a polishing liquid such as slurry from above the polishing table toward the polishing surface. In the polishing apparatus of Patent Document 1, when polishing the polished surface of the substrate, the polished surface of the substrate is brought into pressure contact with the polishing surface of the polishing table, and the polishing table and the top ring are rotated respectively while supplying the polishing liquid to the polishing surface by the polishing liquid supply nozzle to polish the polished surface.

[0003] The polishing apparatus of Patent Document 1 further includes a polishing surface temperature control means for controlling the polishing surface of the polishing table to a predetermined temperature distribution. The polishing surface temperature control means includes a blowing nozzle for blowing a gas toward the polishing surface of the polishing table and a thermography for measuring the temperature distribution of the polishing surface. The polishing surface temperature control means controls the blowing flow rate, temperature, and blowing position of the gas from the blowing nozzle based on the measurement result of the thermography when polishing the polished surface of the substrate. Thereby, the polishing surface of the polishing table is set to a predetermined temperature distribution, and the polishing rate on the polished surface of the substrate is made uniform.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 describes a system in which the abrasive fluid supplied from the abrasive fluid supply nozzle is a liquid, the abrasive fluid is not temperature-controlled, and a separate nozzle is provided to supply gas for temperature control to the polishing pad, in addition to the abrasive fluid supply nozzle. This system had room for improvement in terms of simplifying the device configuration and controlling the temperature of the processing point.

[0006] This invention has been made in view of the above, and one of its objectives is to provide a method for polishing a workpiece and a workpiece polishing apparatus that can simplify the apparatus configuration and improve the accuracy of temperature control at the processing point by adjusting the temperature of the processing point. [Means for solving the problem]

[0007] A method for polishing a workpiece according to one aspect of the present invention is a method for polishing a workpiece held on a holding table with a polishing pad, comprising: a polishing step of polishing the workpiece while supplying a mixed fluid of a liquid and a gas to at least one of the polishing pad or the workpiece; a temperature acquisition step of acquiring information related to the temperature of the processing point during the performance of the polishing step; and an adjustment step of adjusting the temperature of at least one of the liquid or the gas according to the temperature of the processing point.

[0008] Furthermore, a workpiece polishing apparatus according to one aspect of the present invention is a workpiece polishing apparatus that polishes a workpiece held on a holding table with a polishing pad, comprising: a polishing unit that polishes the workpiece held on the holding table with the polishing pad; a fluid supply unit that supplies a mixed fluid of liquid and gas to at least one of the polishing pad or the workpiece; a temperature acquisition unit that acquires information related to the temperature of the processing point while the workpiece is being polished by the polishing pad; and an adjustment unit that adjusts the temperature of at least one of the liquid or gas according to the temperature of the processing point. [Effects of the Invention]

[0009] According to the present invention, the temperature of the processing point can be adjusted via the mixed fluid by adjusting the temperature of at least one of the liquid and gas components in the polishing fluid, which is a mixed fluid containing a liquid and a gas. This simplifies the apparatus configuration compared to conventional configurations where the nozzle for blowing gas for temperature adjustment and the nozzle for supplying slurry are separate, and also improves the accuracy of temperature control at the processing point. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram of the polishing apparatus according to the embodiment. [Modes for carrying out the invention]

[0011] The polishing apparatus according to this embodiment will be described below with reference to the attached drawings. Note that the polishing apparatus according to this embodiment is not limited to the configuration shown below and can be modified as appropriate. In the following figures, some components have been omitted for the sake of clarity.

[0012] First, the configuration of the polishing apparatus will be described with reference to Figure 1. Figure 1 is a schematic diagram of the polishing apparatus according to an embodiment. As shown in Figure 1, the polishing apparatus 10 is configured to polish the workpiece W held on the holding table 12 with the polishing pad 31 of the polishing section 30.

[0013] In this embodiment, the workpiece W is made of a difficult-to-polish material such as gallium nitride (GaN), silicon carbide (SiC), or sapphire, which have a high processing load. However, there are no restrictions on the material, shape, structure, size, etc., of the workpiece W. In addition to silicon (Si), the workpiece W may also be made of semiconductor materials other than difficult-to-polish materials, such as glass or quartz. The upper surface of the workpiece W becomes the surface to be polished W1 and is polished with a polishing pad 31, while a protective tape (not shown) is attached to the lower surface and the workpiece is held on the holding table 12 via the protective tape. In other words, the workpiece W is held on the holding table 12 from below with the surface to be polished W1 facing upwards.

[0014] The polishing apparatus 10 comprises a holding table 12, a polishing section 30 having a polishing pad 31 positioned above the holding table 12, and a fluid supply section 50 that supplies a mixed fluid M, which is a mixture of liquid and gas, to the polishing pad 31.

[0015] The holding table 12 is configured with a holding surface 13 on its upper surface that holds the workpiece W. The holding surface 13 is made of a porous material such as ceramics, which has fine pores formed throughout. When this porous material is connected to a suction source (not shown), negative pressure is generated on the holding surface 13, and the lower side of the workpiece W is held by suction.

[0016] The holding table 12 is rotatably mounted on a vertical axis passing through the center of the holding surface 13 by a rotation mechanism 16 consisting of a shaft, motor, etc. Furthermore, the holding table 12 is mounted to be movable in the horizontal direction by a table moving mechanism 17. The table moving mechanism 17 can be exemplified by using a linear motion mechanism such as an air cylinder or a ball screw type feed mechanism.

[0017] Furthermore, the holding table 12 is provided with a cooling unit 20 for cooling the workpiece W held by the holding surface 13. The cooling unit 20 comprises a cooling passage 21 formed inside the holding table 12, a cooling water supply source 22 for supplying cooling water to the cooling passage 21, and a drain water recovery unit 23 for recovering the cooling water after heat exchange with the workpiece W in the cooling passage 21.

[0018] The cooling unit 20 cools the workpiece W held on the holding table 12 and the holding surface 13 by exchanging heat with the cooling water flowing through the cooling passage 21. The cooling water supply source 22 is equipped with a pump and a solenoid valve so as to be able to adjust the amount of cooling water supplied to the cooling passage 21. A temperature sensor 25, such as a thermocouple, which constitutes the temperature acquisition unit, is provided in the piping connecting the cooling passage 21 and the drain water recovery unit 23. The temperature sensor 25 measures the temperature of the cooling water that has risen in temperature by exchanging heat with the workpiece W as it flows through the cooling passage 21.

[0019] The temperature sensor 25, which constitutes the temperature acquisition unit, acquires temperature information related to the temperature of the polishing point of the workpiece W during polishing of the workpiece W by the polishing pad 31 by measuring the temperature as described above. Insofar as such temperature information can be acquired, the temperature acquisition unit can be composed of at least one of the following: the temperature sensor 25, a radiation thermometer 26 for measuring the temperature around the processing point, and a temperature sensor 27 embedded in the platen 39 (described later) for measuring the temperature of the polishing pad 31. When the temperature sensor 27 is embedded in the platen 39, an example configuration can be given in which multiple temperature sensors 27 are provided at predetermined angle intervals in the rotational direction of the polishing pad 31. In this embodiment, the case in which only the temperature sensor 25 is used as the temperature acquisition unit will be described.

[0020] The polishing unit 30 polishes the workpiece W held on the holding table 12 with a polishing pad 31. The polishing unit 30 is also provided to be movable in the vertical direction by a polishing feed mechanism 32 which constitutes a vertical movement mechanism. The polishing feed mechanism 32 can be exemplified by using a linear motion mechanism such as a ball screw drive mechanism.

[0021] The polishing unit 30 includes a polishing pad 31 and a spindle unit 34 supported by a polishing feed mechanism 32 via a holder or the like, which moves vertically when driven by the polishing feed mechanism 32. When the spindle unit 34 is moved upward by the drive of the polishing feed mechanism 32, the workpiece W held on the holding table 12 moves away from the polishing pad 31. When the spindle unit 34 is moved downward, the polishing pad 31 approaches and becomes able to contact the workpiece W held on the holding table 12.

[0022] The polishing pad 31 is attached to the spindle unit 34 with the polishing surface 35 facing the workpiece W side (lower side). The polishing surface 35 has a circular shape and is large enough to cover the entire upper surface of the workpiece W when it contacts the workpiece W. Further stated, in this embodiment, the radius of the circular polishing surface 35 is provided in a shape larger than the diameter of the workpiece W. Thus, by increasing the radius of the polishing surface 35 compared to the diameter of the workpiece W to enlarge the polishing surface 35, the relative movement speed between the polishing surface 35 and the polished surface W1 during polishing can be increased, and the polishing rate can be increased.

[0023] Also, the polishing pad 31 is provided such that the polishing surface 35 that contacts the workpiece W exhibits hydrophilicity. Such hydrophilicity can be imparted, for example, by a liquid impregnated after the fibers are pressed firmly in the manufacturing process of the polishing pad 31, and is exhibited by the polishing surface 35 having a chemical bond terminated by a hydroxyl group (OH group). When the polishing surface 35 exhibits hydrophilicity, it prevents the mixed fluid M from bouncing or bouncing and falling downward, and allows the polishing liquid to conform to the polishing pad 31.

[0024] The spindle unit 34 includes a spindle 36 that is a rotor rotatable around a vertical axis, a spindle housing 37 having a stator (not shown) that rotates the spindle 36, and a platen 39 fixed to a mount 38 at the lower end of the spindle 36. The polishing pad 31 is attached to the lower surface of the platen 39. When the spindle 36 rotates, the polishing pad 31 attached to the platen 39 rotates, and the workpiece W pressed by the polishing pad 31 is mechanically polished using a polishing liquid.

[0025] The fluid supply unit 50 includes a liquid supply source 51, a gas supply source 52, a mixing unit 53, and a nozzle 54.

[0026] The liquid supply source 51 consists of, for example, a tank for containing polishing fluid (liquid) and a liquid pump for sending the polishing fluid from the tank to the mixing unit 53. The gas supply source 52 consists of, for example, a cylinder for containing high-pressure nitrogen gas or air and a regulator for adjusting the pressure of the gas supplied from the cylinder to the mixing unit 53.

[0027] As the polishing fluid, either a polishing fluid that does not contain abrasive particles (free abrasive particles) or a polishing fluid that contains abrasive particles may be used. Examples of polishing fluids that do not contain abrasive particles include alkaline solutions containing sodium hydroxide, potassium hydroxide, etc., acidic solutions containing permanganate, etc., and pure water. Abrasive particles may also be added to the polishing pad 31 while using a polishing fluid that does not contain abrasive particles. Examples of polishing fluids that contain abrasive particles include chemical solutions (slurries) in which abrasive particles are dispersed.

[0028] The mixing unit 53 is connected to the liquid supply source 51 via the liquid supply passage 56 and to the gas supply source 52 via the gas supply passage 57. The mixing unit 53 mixes the polishing liquid supplied from the liquid supply source 51 with the gas supplied from the gas supply source 52 to produce a mixed fluid M in the form of a mist, which is then supplied to the nozzle 54. In Figure 1, the mixing unit 53 is shown as being built into the nozzle 54, but it may also be configured to be located outside the nozzle 54.

[0029] The nozzle 54 sprays and supplies the mixed fluid M, which has been mixed in the mixing unit 53, toward the polishing surface 35 of the polishing pad 31 above. The nozzle 54 is supported, for example, by a rotating arm (not shown) and is positioned below the polishing pad 31 so as to be adjustable in the horizontal direction, allowing adjustment of the position from which the mixed fluid M is sprayed toward the polishing surface 35 of the polishing pad 31.

[0030] Here, the gas supply passage 57 is provided with an adjustment section 58 that adjusts (heats and cools) the temperature of the gas supplied from the gas supply source 52 to the mixing section 53. The adjustment section 58 is composed of, for example, an air cooler or various heat exchangers, and is provided to be able to adjust the temperature of the gas passing through the adjustment section 58 to any desired temperature by heating or cooling it. When an air cooler is used in the adjustment section 58, the temperature of the gas can be adjusted by controlling the degree of valve opening.

[0031] The polishing apparatus 10 is equipped with a control unit 60 that provides overall control over each part of the apparatus. The control unit 60 consists of a processor and memory that perform various processes. The control unit 60 controls the operation of the polishing section 30 and the holding table 12 during polishing, temperature measurement by the temperature sensor 25, and the supply of the mixed fluid M by the fluid supply section 50, according to a control program stored in the memory.

[0032] In addition, unless otherwise specified, the operation of each part of the polishing apparatus 10 described below is controlled by a control signal sent from the control unit 60.

[0033] Next, a method for polishing the workpiece W using the polishing device 10 will be described. In this embodiment, the polishing method consists of a polishing step, a temperature acquisition step, and a temperature adjustment step (adjustment step). Here, as shown in Figure 1, the workpiece W is held on the holding table 12 with the polishing surface W1 facing upwards, and the polishing pad 31 is positioned above the workpiece W, with the left region in Figure 1 positioned from the center, and waiting.

[0034] In the polishing step, the rotating mechanism 16 is driven to rotate the holding table 12 and the workpiece W held by the holding table 12 around a vertical axis. Along with the rotation of the workpiece W, the spindle 36 of the polishing unit 30 is rotated, causing the polishing pad 31 to rotate around a vertical axis.

[0035] Furthermore, during the polishing step, a mixed fluid M containing polishing liquid is sprayed from the nozzle 54 of the fluid supply unit 50 to the area of ​​the polishing surface 35 of the rotating polishing pad 31 that extends beyond the holding table 12 when viewed from above (the right-hand area in Figure 1). This mixed fluid M is a two-fluid mixture obtained by mixing polishing liquid supplied from the liquid supply source 51 and gas supplied from the gas supply source 52 in the mixing unit 53.

[0036] Here, since the polishing surface 35 of the polishing pad 31 is hydrophilic, the polishing liquid contained in the mixed fluid M easily penetrates and is retained on the polishing pad 31, reaching the machining area that comes into contact with the workpiece.

[0037] In the polishing step, the polishing feed mechanism 32 is driven to lower the polishing unit 30 while the holding table 12 and polishing pad 31 are rotated and a mixed fluid M is sprayed (supplied) from the nozzle 54. This lowering presses the polishing surface 35 of the rotating polishing pad 31 against the polishing surface W1 of the rotating workpiece W, and the workpiece W is polished. Even during this polishing process, the mixed fluid M, which is a mixture of polishing fluid (liquid) and gas in the mixing unit 53, is sprayed (supplied) from the nozzle 54 onto the polishing surface 35 of the polishing pad 31. The spray position of the mixed fluid M from the nozzle 54 may be set near the center of the polishing surface 35 so that it is spread over the entire polishing surface 35 by the centrifugal force of the rotating polishing pad 31, or the nozzle 54 may be moved along the radius of the polishing surface 35 to spread it over the entire polishing surface 35.

[0038] In the polishing step, the workpiece W is cooled by the cooling unit 20 while it is being polished. More specifically, cooling water is supplied from the cooling water supply source 22 to the cooling passage 21 formed in the holding table 12, and the workpiece W is cooled by heat exchange between the cooling water and the workpiece W. The cooling water, whose temperature has risen after heat exchange with the workpiece W, is collected in the drainage recovery unit 23.

[0039] The temperature acquisition step is performed during the polishing step described above. In the temperature acquisition step, the temperature of the cooling water flowing from the cooling passage 21 of the cooling unit 20 to the drain water recovery unit 23 is measured by the temperature sensor 25 and output to the control unit 60. Therefore, the control unit 60 acquires information related to the temperature of the processing point of the workpiece W (the contact area between the polished surface 35 and the polished surface W1) by acquiring the temperature of the cooling water flowing to the drain water recovery unit 23.

[0040] The temperature adjustment step is performed during the polishing step and the temperature acquisition step described above. In the temperature adjustment step, the control unit 60 controls the operation of the adjustment unit 58 according to the temperature of the processing point output from the temperature sensor 25. If an air cooler is used in the adjustment unit 58, the control unit 60 can adjust the temperature of the gas passing through the adjustment unit 58 by controlling the degree of valve opening according to the temperature measured by the temperature sensor 25.

[0041] To give a specific example, the control unit 60 sets an allowable temperature range (for example, 30°C to 50°C) for the gas passing through the adjustment unit 58. The control unit 60 then controls the valve of the adjustment unit 58 to open more when the temperature exceeds the upper limit of the allowable temperature range (50°C), and to open less when the temperature falls below the lower limit of the allowable temperature range (30°C), thereby adjusting the temperature of the gas. As a result, the temperature of the gas that has passed through the adjustment unit 58 is adjusted, and the temperature of the mixed fluid M, which is a mixture of the gas and polishing liquid in the mixing unit 53, can be set to a predetermined value (predetermined range). In this embodiment, the adjustment unit 58 adjusts only the temperature of the gas and does not adjust the temperature of the polishing liquid.

[0042] Furthermore, since the temperature adjustment step is performed simultaneously with the polishing step and the temperature acquisition step, it becomes possible to adjust the temperature of the mixed fluid M to maintain a predetermined value (or range) during the polishing of the workpiece W in real time.

[0043] According to the above embodiment, the liquid supplied from the liquid supply source 51 can be used as polishing fluid, and this polishing fluid can be mixed with gas to form a mixed fluid M which can then be supplied to the polishing pad 31. This simplifies the device configuration by making the fluid supply unit 50 a single unit, compared to the conventional configuration in which a nozzle for blowing gas for temperature control and a nozzle for supplying slurry are separate. Furthermore, compared to the conventional configuration in which only liquid polishing fluid is supplied, it is possible to avoid the polishing fluid dripping in droplet form, and to reduce the amount of polishing fluid supplied to the mixed fluid M by preventing it from exceeding the flow rate required for processing.

[0044] Furthermore, in the temperature adjustment step, instead of supplying a separate gas for temperature adjustment, the temperature of the mixed fluid M containing the polishing fluid is adjusted. Therefore, during polishing, only the temperature-adjusted mixed fluid M can be supplied to the processing point. In contrast to conventional methods where the gas for temperature adjustment and the polishing fluid had to be supplied separately, this embodiment allows for temperature control at the processing point during polishing by adjusting the temperature of the mixed fluid M, without the need to supply a separate gas for temperature adjustment. This improves the accuracy of temperature control at the processing point in this embodiment, and consequently stabilizes the polishing rate.

[0045] Furthermore, since the temperature of the mixed fluid M is changed by adjusting only the temperature of the gas in the adjustment unit 58, the temperature can be adjusted in a short time with a simpler configuration compared to adjusting the temperature of a liquid such as polishing solution, thus simplifying temperature control.

[0046] By the way, in this embodiment, polishing is performed with the polishing surface 35 of the polishing pad 31 facing downwards and the polishing surface W1 of the workpiece W facing upwards. This positional relationship is the opposite of that in Patent Document 1. In Patent Document 1, the polishing surface facing downwards on the substrate is pressed into contact with the polishing surface facing upwards on the polishing table, and the substrate is held between the polishing table and the top ring. Therefore, if the top ring is rotated at high speed, the substrate will fly out due to centrifugal force and will no longer be able to be held, making it impossible to rotate the substrate at high speed. The polishing rate of the substrate is greatly affected by the rotation speed of the substrate, so in Patent Document 1, it is difficult to increase the polishing rate because the substrate cannot be rotated at high speed.

[0047] In this respect, in this embodiment, the workpiece W is held by the holding table 12 through suction, so even if the holding table 12 is rotated at high speed, it is possible to prevent the workpiece from flying off due to centrifugal force and maintain the held state. Therefore, this embodiment can increase the polishing rate by rotating the workpiece W at a higher speed compared to Patent Document 1, and can easily handle workpieces W that are difficult to polish. In other words, in a configuration where the substrate cannot be rotated at high speed, as in Patent Document 1, it is difficult to imagine that the substrate would be made of a difficult-to-polish material.

[0048] Furthermore, it is known that increasing the polishing rate can be achieved by increasing the rotational speed of the workpiece W, as well as increasing the pressure applied to the polishing pad 31 against the workpiece W. When the workpiece W is rotated at high speed and the polishing pad 31 is pressed against the workpiece W at high pressure, the temperature at the machining point rises. As a result, if there is insufficient polishing fluid, the polishing pad 31 dries out due to the vaporization of the polishing fluid, and the abrasive grains remain in powder form, leading to a problem of reduced polishing quality.

[0049] While this problem can be solved by increasing the supply of polishing fluid, this presents the problem of increased running costs for the polishing fluid. In this embodiment, however, the polishing fluid is sprayed onto the polishing pad 31 as a mixed fluid M, which is a mixture of polishing fluid and gas. Therefore, even if the amount of polishing fluid is increased, it is possible to suppress the amount of polishing fluid from exceeding the flow rate required for processing, thus keeping the increase in polishing fluid to a negligible amount. Thus, in this embodiment, it is possible to suppress the increase in polishing fluid while maintaining good polishing processing quality.

[0050] Furthermore, the present invention is not limited to the embodiments described above, and can be implemented with various modifications. In the embodiments described above, the size, shape, etc., shown in the accompanying drawings are not limited thereto, and can be appropriately modified within the scope that allows the present invention to exert its effects. In addition, the present invention can be implemented with appropriate modifications as long as it does not deviate from the scope of its objectives.

[0051] In the above embodiment, the mixed fluid M was supplied to the polishing pad 31, but the mixed fluid M may also be supplied to the workpiece W. For example, a polishing pad 31 with a polishing surface 35 smaller than the polished surface W1 of the workpiece W may be used, and the mixed fluid M may be sprayed (supplied) from the nozzle 54 of the fluid supply unit 50 onto the polished surface W1 that extends beyond the polishing pad 31. Alternatively, the mixed fluid M may be supplied to both the polishing pad 31 and the workpiece W. In the polishing step of the present invention, it is sufficient to supply the mixed fluid M to at least one of the polishing pad 31 or the workpiece W.

[0052] Furthermore, although the temperature of the gas was adjusted by the adjustment unit 58 in the temperature adjustment step, an adjustment unit capable of adjusting the temperature of the polishing solution (liquid) may be provided instead of the adjustment unit 58, or an additional adjustment unit capable of adjusting the temperature of the polishing solution (liquid) may be provided in addition to the adjustment unit 58 that adjusts the temperature of the gas. However, adjusting the temperature of the gas without adjusting the temperature of the liquid is advantageous in that it allows for easier temperature adjustment with a simpler configuration.

[0053] In addition, in the polishing apparatus 10, the polishing section 30 and the holding table 12 may be arranged such that the polishing surface 35 of the polishing pad 31 faces upward and the polishing surface W1 of the workpiece W faces downward.

[0054] Furthermore, in the temperature acquisition step, the temperature acquisition unit that acquires information related to the temperature of the processing point only needs to have at least one of the temperature sensor 25, radiation thermometer 26, and temperature sensor 27. Therefore, the information related to the temperature of the processing point can be obtained by determining the temperature of the processing point from the information measured by the temperature acquisition unit using various analyses and calculation formulas, or by estimating the temperature of the processing point and obtaining a value that can adjust the temperature of the mixed fluid M. [Industrial applicability]

[0055] As described above, the present invention has the effect of simplifying the apparatus configuration and improving the accuracy of temperature control at the processing point by adjusting the temperature of the processing point when polishing a workpiece held on a holding table with a polishing pad. [Explanation of symbols]

[0056] 10: Polishing equipment 12: Holding Table 25: Temperature sensor (temperature acquisition unit) 26: Radiation thermometer (temperature acquisition part) 27: Temperature sensor (temperature acquisition unit) 30: Polishing section 31: Polishing pad 35: Polished surface 50:Fluid supply section 58: Adjustment section M:Mixed fluid W: Workpiece

Claims

1. A method for polishing a workpiece, wherein the workpiece held on a holding table is polished with a polishing pad, A polishing step of polishing a workpiece while supplying a mixed fluid, which is a mixture of liquid and gas, to at least one of the polishing pad or the workpiece, During the polishing step, a temperature acquisition step is performed to acquire information related to the temperature of the processing point. A method for polishing a workpiece, comprising an adjustment step of adjusting the temperature of at least one of the liquid or gas according to the temperature of the processing point.

2. The method for polishing a workpiece according to claim 1, characterized in that the adjustment step adjusts the temperature of the gas without adjusting the temperature of the liquid.

3. The method for polishing a workpiece according to claim 1, characterized in that the polishing surface of the polishing pad that comes into contact with the workpiece is hydrophilic.

4. A workpiece polishing apparatus that polishes a workpiece held on a holding table with a polishing pad, A polishing unit that polishes a workpiece held on the holding table with the polishing pad, A fluid supply unit that supplies a mixed fluid of liquid and gas to at least one of the polishing pad or the workpiece, A temperature acquisition unit acquires information related to the temperature of the processing point while polishing the workpiece with the polishing pad, A workpiece polishing apparatus comprising an adjustment unit that adjusts the temperature of at least one of the liquid or gas according to the temperature of the processing point.

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