Electronic components
By electrically connecting shields on opposite sides of the electronic component through a shield connecting conductor, the grounding of the shield is strengthened, effectively reducing electromagnetic interference and enhancing the component's performance.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2026-03-17
AI Technical Summary
Existing electronic components face challenges in effectively reducing the influence of external electromagnetic fields on their characteristics, necessitating improved grounding of shield layers.
The electronic component incorporates a shield connecting conductor that electrically connects shields on opposite sides of the component, forming an electrical path between the shields and ground terminals, thereby strengthening the ground connection and reducing electromagnetic interference.
This configuration enhances the grounding of the shield, leading to improved attenuation of electromagnetic interference and reduced influence of external electromagnetic fields on the component's performance.
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Figure 2026048299000001_ABST
Abstract
Description
Technical Field
[0006] , , , ,
[0001] This disclosure relates to electronic components.
Background Art
[0002] Patent Document 1 discloses an electronic component including an input terminal, a first output terminal, a ground terminal, a first capacitor and a second capacitor electrically connected in series in a path between the input terminal and the first output terminal, a first inductor connected between any part of the path between the input terminal and the first output terminal and the ground terminal, a second inductor electrically connected in parallel with the second capacitor, and a first sub-path, wherein the second inductor and the first sub-path form a first directional coupler by electromagnetic coupling.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In an electronic component, in order to reduce the influence of an external electromagnetic field or the like on the characteristics of the electronic component, a shield (shield layer) is provided on the outer surface of the element body. The shield is electrically connected to a ground terminal connected to the ground. In electronic components, strengthening of the ground of the shield is required.
[0005] One aspect of this disclosure aims to provide an electronic component capable of strengthening the ground of the shield.
Means for Solving the Problems
[0006] (1) An electronic component relating to one aspect of the present disclosure comprises a body having a mounting surface and a main surface facing each other, and four sides connecting a pair of main surfaces; a shield covering the four sides of the body; a ground terminal disposed on the mounting surface and connected to ground; an inductor conductor and a capacitor conductor disposed within the body; a first connecting conductor electrically connecting a shield disposed on one of the four sides and a shield disposed on another side different from the one side; and a second connecting conductor electrically connecting the first connecting conductor and the ground terminal.
[0007] An electronic component relating to one aspect of this disclosure includes a first connecting conductor that electrically connects a shield located on one of the four sides with a shield located on a different side. The first connecting conductor is electrically connected to a ground terminal by a second connecting conductor. In this way, in the electronic component, the shield located on the side is electrically connected by the first connecting conductor, and the first connecting conductor constitutes an electrical path between the ground terminal and the shield. This allows the electronic component to strengthen the ground of the shield.
[0008] (2) In the electronic component described in (1) above, one side and the other side are arranged opposite each other, and the first connecting conductor may electrically connect the shields located on the pair of sides that are arranged opposite each other. In this configuration, the first connecting conductor electrically connects the shields located on the pair of sides that are separated (not adjacent) to each other. As a result, in the electronic component, the shields located on each of the pair of sides are directly electrically connected by the first connecting conductor. Therefore, the ground of the shields can be strengthened in the electronic component.
[0009] (3) In the electronic component described in (1) or (2) above, the first connecting conductor may electrically connect to each of the shields located on at least three of the four sides. This configuration further enhances the grounding.
[0010] (4) Any one of the electronic components described in (1) to (3) above may have a portion in which the capacitor conductor and the first connecting conductor overlap when viewed from the direction opposite to the mounting surface and the main surface. In this configuration, the capacitance of the capacitor, which includes the capacitor conductor, can be adjusted.
[0011] (5) In any one of the electronic components described in (1) to (4) above, the first connecting conductor is positioned between the inductor conductor and the capacitor conductor in the direction opposite to the mounting surface and the main surface, and the distance between the inductor conductor and the first connecting conductor in the opposite direction may be longer than the distance between the capacitor conductor and the first connecting conductor in the opposite direction. In this configuration, the capacitance of the capacitor, which includes the capacitor conductor, can be adjusted. In addition, since a distance is ensured between the inductor conductor and the first connecting conductor, electrical interference between the inductor conductor and the first connecting conductor can be suppressed.
[0012] (6) In any one of the electronic components described in (1) to (4) above, the first connecting conductor may be positioned between the main surface and the inductor conductor in the direction opposite to the mounting surface and the main surface. This configuration can suppress electrical interference between the first connecting conductor and the other conductors.
[0013] (7) In any one of the electronic components described in (1) to (6) above, a plurality of inductor conductors may be provided, and the first connecting conductor may have a first part that electrically connects a shield located on one side with a shield located on the other side and is electrically connected to one inductor conductor, a second part that electrically connects a shield located on one side with a shield located on the other side and is electrically connected to another inductor conductor, and a third part that electrically connects the first part and the second part. In this configuration, in a configuration in which a plurality of resonators comprising inductors are provided, the ground of the shield can be strengthened.
[0014] (8)In any one of the electronic components (1) to (7) above, a plurality of first connection conductors may be arranged. With this configuration, the ground of the shield can be strengthened.
Advantages of the Invention
[0015] According to one aspect of the present disclosure, the ground of the shield can be strengthened.
Brief Description of the Drawings
[0016] [Figure 1] FIG. 1 is a perspective view of an electronic component according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of the electronic component shown in FIG. 1. [Figure 3] FIG. 3 is a view of the electronic component shown in FIG. 1 as seen from the main surface side. [Figure 4] FIG. 4 is a view of the electronic component shown in FIG. 1 as seen from the side surface side. [Figure 5] FIG. 5 is a view of the electronic component shown in FIG. 1 as seen from one end face side. [Figure 6] FIG. 6 is a view of the electronic component shown in FIG. 1 as seen from the other end face side. [Figure 7] FIG. 7 is an exploded perspective view of the electronic component shown in FIG. 1. [Figure 8] FIG. 8 is a plan view showing the shield connection conductor. [Figure 9] FIG. 9 is an equivalent circuit diagram of the electronic component shown in FIG. 1. [Figure 10] FIG. 10 is a diagram showing the relationship between frequency and attenuation amount. [Figure 11] FIG. 11 is a perspective view of an electronic component according to the second embodiment. [Figure 12] FIG. 12 is a perspective view of the electronic component shown in FIG. 11. [Figure 13] FIG. 13 is a view of the electronic component shown in FIG. 11 as seen from the side surface side. [Figure 14] FIG. 14 is a view of the electronic component shown in FIG. 11 as seen from one end face side. [Figure 15]FIG. 15 is a view of the electronic component shown in FIG. 11 as seen from the other end face side. [Figure 16] FIG. 16 is a perspective view of an electronic component according to the third embodiment. [Figure 17] FIG. 17 is a perspective view of the electronic component shown in FIG. 16. [Figure 18] FIG. 18 is a view of the electronic component shown in FIG. 16 as seen from the side face side. [Figure 19] FIG. 19 is a view of the electronic component shown in FIG. 16 as seen from one end face side. [Figure 20] FIG. 20 is a view of the electronic component shown in FIG. 16 as seen from the other end face side. [Embodiments for Carrying Out the Invention]
[0017] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[0018] [First Embodiment] FIG. 1 is a perspective view of an electronic component according to the first embodiment. FIG. 2 is a perspective view of the electronic component shown in FIG. 1. FIG. 3 is a view of the electronic component shown in FIG. 1 as seen from the main surface side. FIG. 4 is a view of the electronic component shown in FIG. 1 as seen from the side face side. FIG. 5 is a view of the electronic component shown in FIG. 1 as seen from one end face side. FIG. 6 is a view of the electronic component shown in FIG. 1 as seen from the other end face side. As shown in FIGS. 1 to 6, the electronic component 1 includes a body 2, a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8, a resonator 9, and a shield E. In FIGS. 1 to 3, the illustration of the shield E is omitted.
[0019] Body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped with chamfered corners and edges, and a rectangular parallelepiped with rounded corners and edges. Body 2 has a pair of end faces (sides) 2a, 2b, a pair of main faces 2c, 2d, and a pair of side faces 2e, 2f as its outer surface. The end faces 2a, 2b face each other. The main faces 2c, 2d face each other. The side faces 2e, 2f face each other. Hereinafter, the opposing direction of the end faces 2a, 2b will be referred to as the first direction D1, the opposing direction of the main faces 2c, 2d as the second direction D2, and the opposing direction of the side faces 2e, 2f as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately orthogonal to each other.
[0020] The end faces 2a and 2b extend in the second direction D2 to connect the main faces 2c and 2d. The end faces 2a and 2b also extend in the third direction D3 to connect the side faces 2e and 2f. The main faces 2c and 2d extend in the first direction D1 to connect the end faces 2a and 2b. The main faces 2c and 2d also extend in the third direction D3 to connect the side faces 2e and 2f. The side faces 2e and 2f extend in the first direction D1 to connect the end faces 2a and 2b. The side faces 2e and 2f also extend in the second direction D2 to connect the main faces 2c and 2d.
[0021] The main surface 2d is the mounting surface, and is the surface that faces other electronic devices (e.g., circuit boards or multilayer electronic components) when mounting electronic component 1 to other electronic devices not shown. The end surfaces 2a and 2b are surfaces that are continuous with the mounting surface (i.e., the main surface 2d).
[0022] The length of the base body 2 in the first direction D1 is longer than the length of the base body 2 in the second direction D2 and the length of the base body 2 in the third direction D3. The length of the base body 2 in the second direction D2 is shorter than the length of the base body 2 in the third direction D3. That is, in this embodiment, the end faces 2a, 2b, main faces 2c, 2d and side faces 2e, 2f are rectangular in shape. The length of the base body 2 in the second direction D2 may be equal to the length of the base body 2 in the third direction D3, or it may be longer than the length of the base body 2 in the third direction D3.
[0023] In this embodiment, "equivalent" means not only being equal, but also including slight differences or manufacturing tolerances within a predetermined range. For example, if multiple values fall within ±5% of the average of those multiple values, then those multiple values are defined as equivalent.
[0024] The base body 2 is formed by stacking multiple insulating layers 10 (see Figure 7) in the second direction D2. In other words, the stacking direction of the base body 2 is the second direction D2. In the actual base body 2, the multiple insulating layers 10 may be integrated to the extent that the boundaries between the layers are not visible, or they may be integrated so that the boundaries between the layers are visible.
[0025] The insulating layer 10 is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, at least one selected from BaTiO3-based materials, Ba(Ti,Zr)O3-based materials, (Ba,Ca)TiO3-based materials, glass materials, or alumina materials.
[0026] The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are each provided on the base body 2. The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are each positioned on the main surface 2d of the base body 2. The first terminal electrode 3, second terminal electrode 4, and third terminal electrode 5 are positioned closer to the side surface 2e. The fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are positioned closer to the side surface 2f.
[0027] The first terminal electrode 3 is located on the end face 2a side, and the third terminal electrode 5 is located on the end face 2b side. The second terminal electrode 4 is located between the first terminal electrode 3 and the third terminal electrode 5 in the first direction D1. The fourth terminal electrode 6 is located on the end face 2a side, and the sixth terminal electrode 8 is located on the end face 2b side. The fifth terminal electrode 7 is located between the fourth terminal electrode 6 and the sixth terminal electrode 8 in the first direction D1. The first terminal electrode 3 and the fourth terminal electrode 6 are positioned opposite each other in the third direction D3. The second terminal electrode 4 and the fifth terminal electrode 7 are positioned opposite each other in the third direction D3. The third terminal electrode 5 and the sixth terminal electrode 8 are positioned opposite each other in the third direction D3.
[0028] Each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 has a rectangular shape. Each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 is positioned so that each side is aligned with the first direction D1 or the third direction D3. The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 protrude beyond the main surface 2d. That is, in this embodiment, the surfaces of each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are not flush with the main surface 2d. The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are made of a conductive material (for example, Cu).
[0029] Each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 may be provided with a plating layer (not shown) containing, for example, Ni, Sn, Au, etc., by electroplating or electroless plating. The plating layer may have, for example, a Ni plating film containing Ni that covers the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8, and an Au plating film containing Au that covers the Ni plating film.
[0030] Shield E is provided to reduce the influence of external electromagnetic fields on the electronic component 1. Shield E is located on the end faces 2a, 2b, the main surface 2c, and the side surfaces 2e, 2f. Shield E integrally covers the entire surface of each of the end faces 2a, 2b, the main surface 2c, and the side surfaces 2e, 2f. Shield E is made of a conductive material (e.g., Cu). Shield E may be a single layer or a multi-layer structure. The thickness of Shield E may be, for example, in the range of 0.1 to 10 μm.
[0031] Figure 7 is an exploded perspective view of the electronic component 1 shown in Figure 1. As shown in Figures 1 to 7, the resonator 9 consists of a first conductor 11, a second conductor 12, a third conductor 13, a fourth conductor 14, an inductor conductor 15, an inductor conductor 16, an inductor conductor 17, an inductor conductor 18, a shield connecting conductor (first connecting conductor) 19, a connecting conductor (second connecting conductor) 20, a connecting conductor (second connecting conductor) 21, a connecting conductor (second connecting conductor) 22, a connecting conductor (second connecting conductor) 23, a capacitor conductor 24, a connecting conductor (second connecting conductor) 25, a connecting conductor (second connecting conductor) 26, a connecting conductor (second connecting conductor) 27, a connecting conductor (second connecting conductor) 28, a capacitor conductor 29, a capacitor conductor 30, a capacitor conductor 31, a capacitor conductor 32, a connecting conductor (second connecting conductor) 33, a connecting conductor (second connecting conductor) 34, a connecting conductor (second connecting conductor) 36, and The resonator comprises a capacitor conductor 37, a capacitor conductor 38, a connecting conductor (second connecting conductor) 39, a connecting conductor (second connecting conductor) 40, a connecting conductor 41, a connecting conductor 42, a connecting conductor (second connecting conductor) 43, a connecting conductor (second connecting conductor) 44, an inductor conductor 45, an inductor conductor 46, a capacitor conductor 47, a capacitor conductor 48, a connecting conductor 49, a connecting conductor 50, a connecting conductor (second connecting conductor) 51, a connecting conductor (second connecting conductor) 52, a connecting conductor (second connecting conductor) 53, a connecting conductor (second connecting conductor) 54, a ground conductor 55, an inductor conductor 56, an inductor conductor 57, a connecting conductor 58, a connecting conductor 59, a connecting conductor 60, a connecting conductor 61, a connecting conductor 62, a connecting conductor 63, a connecting conductor 64, a connecting conductor 65, a connecting conductor 66, and a connecting conductor 67. In this embodiment, the resonator 9 includes two resonators.
[0032] Each conductor may contain a conductive material (e.g., Ag or Pd). Each conductor may be constructed as a sintered body of a conductive paste containing a conductive material (e.g., Ag powder or Pd powder).
[0033] The first conductor 11 extends along the second direction D2. The first conductor 11 may be composed of multiple via conductors B1. One end of the first conductor 11 (the end on the main surface 2c side) is connected to the inductor conductor 15 and the inductor conductor 17. The other end of the first conductor 11 (the end on the main surface 2d side) is connected to the capacitor conductor 29.
[0034] The second conductor 12 extends along the second direction D2. The second conductor 12 may be composed of multiple via conductors B2. One end of the second conductor 12 (the end on the main surface 2c side) is connected to the inductor conductor 15 and the inductor conductor 17. The other end of the second conductor 12 (the end on the main surface 2d side) is connected to the shield connection conductor 19.
[0035] The third conductor 13 extends along the second direction D2. The third conductor 13 may be composed of multiple via conductors B3. One end of the third conductor 13 (the end on the main surface 2c side) is connected to inductor conductors 16 and 18. The other end of the third conductor 13 (the end on the main surface 2d side) is connected to capacitor conductor 30.
[0036] The fourth conductor 14 extends along the second direction D2. The fourth conductor 14 may be composed of multiple via conductors B4. One end of the fourth conductor 14 (the end on the main surface 2c side) is connected to inductor conductors 16 and 18. The other end of the fourth conductor 14 (the end on the main surface 2d side) is connected to shield connection conductor 19.
[0037] The connecting conductors 20, 25, 33, 39, and 51 electrically connect the shield connecting conductor 19 and the ground conductor 55. The connecting conductors 21, 26, 34, 40, and 52 electrically connect the shield connecting conductor 19 and the ground conductor 55.
[0038] The connecting conductors 22, 27, 35, 43, and 53 electrically connect the shield connecting conductor 19 to the ground conductor 55. The connecting conductors 23, 28, 36, 44, and 54 electrically connect the shield connecting conductor 19 to the ground conductor 55.
[0039] The connecting conductor 41 electrically connects the capacitor conductor 29 and the capacitor conductor 47. The connecting conductor 42 electrically connects the capacitor conductor 30 and the capacitor conductor 48.
[0040] The connecting conductor 49 is electrically connected to the ground conductor 55. The connecting conductor 49 has a roughly L-shape. One end of the connecting conductor 49 is exposed on the end face 2a and connected to the shield E. The other end of the connecting conductor 49 is exposed on the side surface 2f and connected to the shield E. The connecting conductor 50 is electrically connected to the ground conductor 55. The connecting conductor 50 has a roughly L-shape. One end of the connecting conductor 50 is exposed on the end face 2b and connected to the shield E. The other end of the connecting conductor 50 is exposed on the side surface 2f and connected to the shield E.
[0041] Inductor conductor 45 and inductor conductor 56 are electrically connected. Inductor conductor 46 and inductor conductor 57 are electrically connected.
[0042] The connecting conductor 58 electrically connects the inductor conductor 56 and the first terminal electrode 3. The connecting conductors 59 and 60 electrically connect the ground conductor 55 and the second terminal electrode 4. The connecting conductor 61 electrically connects the inductor conductor 57 and the third terminal electrode 5.
[0043] Connecting conductors 62 and 63 electrically connect the ground conductor 55 and the fourth terminal electrode 6. Connecting conductors 64 and 65 electrically connect the ground conductor 55 and the fifth terminal electrode 7. Connecting conductors 66 and 67 electrically connect the ground conductor 55 and the sixth terminal electrode 8.
[0044] Figure 8 is a plan view showing the shield connecting conductor 19. As shown in Figure 8, the shield connecting conductor 19 has a first portion 19A, a second portion 19B, and a third portion 19C. The first portion 19A, the second portion 19B, and the third portion 19C may be formed integrally. The first portion 19A extends in the third direction D3. The second portion 19B extends in the third direction D3. The first portion 19A and the second portion 19B are spaced apart in the first direction D1.
[0045] One end of the first part 19A is exposed on the side surface 2e and connected to the shield E. The other end of the first part 19A is exposed on the side surface 2f and connected to the shield E. The first part 19A electrically connects the shield E located on side surface 2e and the shield E located on side surface 2f. That is, the first part 19A forms an electrical path between the shield E located on side surface 2e and the shield E located on side surface 2f. The second conductor 12 is connected to the first part 19A.
[0046] One end of the second section 19B is exposed on the side surface 2e and connected to the shield E. The other end of the second section 19B is exposed on the side surface 2f and connected to the shield E. The fourth conductor 14 is connected to the second section 19B. In other words, the second section 19B forms an electrical path between the shield E located on the side surface 2e and the shield E located on the side surface 2f.
[0047] The third section 19C extends in the first direction D1. The third section 19C connects the first section 19A and the second section 19B.
[0048] A portion of the shielding conductor 19 overlaps with the capacitor conductor 24 when viewed from the second direction D2. In other words, when viewed from the second direction D2, the shielding conductor 19 and the capacitor conductor 24 have an overlapping portion.
[0049] As shown in Figure 3, the shielding conductor 19 is positioned between the inductor conductors 17 and 18 and the capacitor conductor 24. The distance K1 between the shielding conductor 19 and the inductor conductor 17 is longer than the distance K2 between the shielding conductor 19 and the capacitor conductor 24 (K1 > K2). In other words, the distance K2 between the shielding conductor 19 and the capacitor conductor 24 is shorter than the distance K1 between the shielding conductor 19 and the inductor conductor 17.
[0050] Figure 9 is an equivalent circuit diagram of the electronic component 1 shown in Figure 1. As shown in Figure 1, the electronic component 1 includes an input port P1, an output port P2, a ground Gnd, inductors L1, L2, L3, L4, capacitors C1, C2, C3, C4, C5, C6, C7, and C8.
[0051] The input port P1 is formed by the third terminal electrode 5. The output port P2 is formed by the first terminal electrode 3. The ground Gnd is formed by the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8.
[0052] Inductor L1 is composed of inductor conductors 45 and 56. Inductor L2 is composed of inductor conductors 46 and 57. Inductor L3 is composed of inductor conductors 15 and 17. Inductor L4 is composed of inductor conductors 16 and 18.
[0053] Capacitor C1 is composed of capacitor conductors 29 and 37. Capacitor C2 is composed of capacitor conductors 24 and 29. Capacitor C3 is composed of capacitor conductors 24 and 31.
[0054] Capacitor C4 is composed of capacitor conductors 30 and 38. Capacitor C5 is composed of capacitor conductors 24 and 30. Capacitor C6 is composed of capacitor conductors 24 and 32.
[0055] Capacitor C7 is composed of a capacitor conductor 47 and a ground conductor 55. Capacitor C8 is composed of a capacitor conductor 48 and a ground conductor 55.
[0056] As described above, the electronic component 1 according to this embodiment includes a shield connecting conductor 19 that electrically connects the shield E located on the side surface 2e to the shield E located on the side surface 2f. The shield connecting conductor 19 is electrically connected to the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 via a ground conductor 55 by connecting conductors 20, 21, 22, 23, 25, 26, 27, 28, 33, 34, 35, 36, 39, 40, 43, 44, 51, 52, 53, and 54. Thus, in electronic component 1, the shield E located on sides 2e and 2f is electrically connected by the shield connecting conductor 19, and the shield connecting conductor 19 forms an electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 (ground terminal) and the shield E. As a result, the ground of the shield E can be strengthened in electronic component 1. Consequently, the influence of external electromagnetic fields on electronic component 1 can be reduced.
[0057] Figure 10 shows the relationship between frequency and attenuation. In Figure 10, the horizontal axis represents the frequency band [MHz] and the vertical axis represents the attenuation [dB]. In Figure 10, the results for electronic component 1 are shown by the solid line G1, and the results for the comparative electronic component without the shield connecting conductor 19 are shown by the dashed line G2. As shown in Figure 10, in electronic component 1, the attenuation in the high frequency band (area enclosed by the dashed line) is improved compared to the comparative electronic component by strengthening the ground of shield E. Also, in electronic component 1, the attenuation due to magnetic coupling relaxation (area enclosed by the dashed line) is improved compared to the comparative electronic component by strengthening the ground of shield E.
[0058] In the electronic component 1 according to this embodiment, the shield connecting conductor 19 electrically connects the shields E located on opposite sides 2e and 2f. Thus, in the electronic component 1, the shield connecting conductor 19 electrically connects the shields E located on sides 2e and 2f that are far apart (not adjacent). As a result, in the electronic component 1, the shields E located on sides 2e and 2f are directly electrically connected by the shield connecting conductor 19. Therefore, the ground connection of the shields E can be strengthened in the electronic component 1.
[0059] In the electronic component 1 according to this embodiment, the shield connecting conductor 19 has a first portion 19A, a second portion 19B, and a third portion 19C. The first portion 19A and the second portion 19B each electrically connect the shield E located on side surface 2e and the shield E located on side surface 2f. The third portion 19C connects the first portion 19A and the second portion 19B. In this configuration, the first portion 19A and the second portion 19B constitute an electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 and the shield E. Therefore, the electronic component 1 can further enhance the grounding.
[0060] In the electronic component 1 according to this embodiment, the capacitor conductor 24 overlaps when viewed from the second direction D2. That is, in the electronic component 1, the shield connection conductor 19 and the capacitor conductor 24 have an overlapping portion when viewed from the second direction D2. In this configuration, the capacitance of the capacitor, which includes the capacitor conductor 24, can be adjusted.
[0061] In the electronic component 1 according to this embodiment, the shielding conductor 19 is positioned between the inductor conductors 17 and 18 and the capacitor conductor 24. The distance K1 between the shielding conductor 19 and the inductor conductor 17 is longer than the distance K2 between the shielding conductor 19 and the capacitor conductor 24 (K1 > K2). In other words, the distance K2 between the shielding conductor 19 and the capacitor conductor 24 is shorter than the distance K1 between the shielding conductor 19 and the inductor conductor 17. In this configuration, the capacitance of the capacitor, which includes the capacitor conductor 24, can be adjusted. Furthermore, since a distance is ensured between the inductor conductors 17 and 18 and the shielding conductor 19, electrical interference between the inductor conductors 17 and 18 and the shielding conductor 19 can be suppressed.
[0062] [Second Embodiment] Next, a second embodiment will be described. Figure 11 is a perspective view of an electronic component according to the second embodiment. Figure 12 is a perspective view of the electronic component shown in Figure 11. Figure 13 is a view of the electronic component shown in Figure 11 from the side. Figure 14 is a view of the electronic component shown in Figure 11 from one end face. Figure 15 is a view of the electronic component shown in Figure 11 from the other end face.
[0063] As shown in Figures 11 to 15, electronic component 1A comprises a base body 2, a first terminal electrode 68, a second terminal electrode 69, a third terminal electrode 70, a fourth terminal electrode 71, a fifth terminal electrode 72, a sixth terminal electrode 73, a seventh terminal electrode 74, an eighth terminal electrode 75, and a ninth terminal electrode 76, a resonator 77, and a shield E. In Figure 11, the shield E is not shown.
[0064] Each of the first terminal electrode 68, second terminal electrode 69, third terminal electrode 70, fourth terminal electrode 71, fifth terminal electrode 72, sixth terminal electrode 73, seventh terminal electrode 74, eighth terminal electrode 75, and ninth terminal electrode 76 is provided on the base body 2. Each of the first terminal electrode 68, second terminal electrode 69, third terminal electrode 70, fourth terminal electrode 71, fifth terminal electrode 72, sixth terminal electrode 73, seventh terminal electrode 74, eighth terminal electrode 75, and ninth terminal electrode 76 is positioned on the main surface 2d of the base body 2.
[0065] The first terminal electrode 68 constitutes an input terminal to which a signal is input. The seventh terminal electrode 74 and the ninth terminal electrode 76 constitute output terminals to which a signal is output. The second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 constitute ground terminals.
[0066] As shown in Figures 11, 12 to 15, the resonator 77 comprises a first conductor (second connecting conductor) 78, a second conductor (second connecting conductor) 79, a third conductor (second connecting conductor) 80, a fourth conductor (second connecting conductor) 81, a fifth conductor (second connecting conductor) 82, a sixth conductor (second connecting conductor) 83, and a shield connecting conductor (first connecting conductor) 84. The resonator 77 further comprises a plurality of inductor conductors and a plurality of capacitor conductors.
[0067] The shielding conductor 84 is positioned between the main surface 2c and the inductor conductor in the second direction D2. The shielding conductor 84 has a portion that extends along the first direction D1 and a portion that extends along the third direction D3. The shielding conductor 84 is exposed on each of the end faces 2a, 2b, side surfaces 2e and 2f and is connected to the shield E. The shielding conductor 84 electrically connects the shield E, which is positioned on each of the end faces 2a, 2b, side surfaces 2e and 2f.
[0068] The first conductor 78, the second conductor 79, the third conductor 80, the fourth conductor 81, the fifth conductor 82, and the sixth conductor 83 are electrically connected to the shield connecting conductor 84 and to the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75.
[0069] As described above, the electronic component 1A according to this embodiment includes a shielding conductor 84 that electrically connects the shield E located on the end face 2a, the shield E located on the end face 2b, the shield E located on the side surface 2e, and the shield E located on the side surface 2f. The shielding conductor 84 is electrically connected to the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 by the first conductor 78, the second conductor 79, the third conductor 80, the fourth conductor 81, the fifth conductor 82, and the sixth conductor 83. In this way, in the electronic component 1A, the shield E located on the end faces 2a, 2b and the side surfaces 2e, 2f are electrically connected by the shielding conductor 84, and thus the shielding conductor 84 constitutes an electrical path between the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 (ground terminal) and the shield E. This allows for strengthening the ground of shield E in electronic component 1A. As a result, the influence of external electromagnetic fields on electronic component 1A can be reduced.
[0070] In the electronic component 1A according to this embodiment, the shield connecting conductor 84 is positioned between the main surface 2c and the inductor conductor in the second direction D2. This configuration makes it possible to suppress electrical interference between the shield connecting conductor 84 and other conductors.
[0071] [Third Embodiment] Next, a third embodiment will be described. Figure 16 is a perspective view of an electronic component according to the third embodiment. Figure 17 is a perspective view of the electronic component shown in Figure 16. Figure 18 is a view of the electronic component shown in Figure 16 from the side. Figure 19 is a view of the electronic component shown in Figure 16 from one end face. Figure 20 is a view of the electronic component shown in Figure 16 from the other end face. As shown in Figures 16 to 20, the electronic component 1B comprises a base body 2, a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8, a resonator 9A, and a shield E. In Figures 16 and 17, the shield E is not shown.
[0072] The resonator 9A includes a shielding conductor (first connecting conductor) 90. The shielding conductor 90 has a first conductor 90A, a second conductor 90B, and a third conductor 90C. The first conductor 90A, the second conductor 90B, and the third conductor 90C may be integrally formed. The shielding conductor 90 forms an electrical path between the shields E located on the end face 2a, the shields E located on the end face 2b, the shields E located on the side surface 2e, and the shields E located on the side surface 2f.
[0073] The first conductor 90A is composed of a first portion 90Aa, a second portion 90Ab, a third portion 90Ac, and a fourth portion 90Ad. The first portion 90Aa, the second portion 90Ab, the third portion 90Ac, and the fourth portion 90Ad may be formed integrally. The first conductor 90A has a frame shape when viewed from the second direction D2.
[0074] The first portion 90Aa extends along the third direction D3. One end of the first portion 90Aa is exposed on the side surface 2e and connected to the shield E. The other end of the first portion 90Aa is exposed on the side surface 2f and connected to the shield E. The second portion 90Ab extends along the third direction D3. One end of the second portion 90Ab is exposed on the side surface 2e and connected to the shield E. The other end of the second portion 90Ab is exposed on the side surface 2f and connected to the shield E. The end of the second portion 90Ab on the end surface 2a side is exposed on the end surface 2a and connected to the shield E.
[0075] The third section 90Ac connects the first section 90Aa and the second section 90Ab. The end of the third section 90Ac on side 2e is exposed to side 2e and connected to shield E. The fourth section 90Ad connects the first section 90Aa and the second section 90Ab. The end of the fourth section 90Ad on side 2f is exposed to side 2f and connected to shield E.
[0076] The second conductor 90B is composed of a first portion 90Ba, a second portion 90Bb, a third portion 90Bc, and a fourth portion 90Bd. The first portion 90Ba, the second portion 90Bb, the third portion 90Bc, and the fourth portion 90Bd may be formed integrally. The second conductor 90B has a frame shape when viewed from the second direction D2.
[0077] The first portion 90Ba extends along the third direction D3. One end of the first portion 90Ba is exposed on the side surface 2e and connected to the shield E. The other end of the first portion 90Ba is exposed on the side surface 2f and connected to the shield E. The second portion 90Bb extends along the third direction D3. One end of the second portion 90Bb is exposed on the side surface 2e and connected to the shield E. The other end of the second portion 90Bb is exposed on the side surface 2f and connected to the shield E. The end of the second portion 90Bb on the end surface 2a side is exposed on the end surface 2a and connected to the shield E.
[0078] The third section 90Bc connects the first section 90Ba and the second section 90Bb. The end of the third section 90Bc on side 2e is exposed to side 2e and connected to shield E. The fourth section 90Bd connects the first section 90Ba and the second section 90Bb. The end of the fourth section 90Bd on side 2f is exposed to side 2f and connected to shield E.
[0079] The third conductor 90C extends in the first direction D1. The third conductor 90C connects the first conductor 90A and the second conductor 90B.
[0080] As described above, the electronic component 1B according to this embodiment includes a shield connecting conductor 90 that electrically connects the shield E located on the end face 2a, the shield E located on the end face 2b, the shield E located on the side surface 2e, and the shield E located on the side surface 2f. The shield connecting conductor 90 is electrically connected to the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 via a ground conductor 55 by connecting conductors 20, 21, 22, 23, 25, 26, 27, 28, 33, 34, 35, 36, 39, 40, 43, 44, 51, 52, 53, and 54. Thus, in electronic component 1B, the shields E located on the end faces 2a, 2b and the sides 2e, 2f are electrically connected by the shield connecting conductor 90. As a result, the shield connecting conductor 90 forms an electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 (ground terminal) and the shields E. This allows for strengthening the ground of the shields E in electronic component 1B. Consequently, the influence of external electromagnetic fields on electronic component 1B can be reduced.
[0081] While embodiments of this disclosure have been described above, this disclosure is not necessarily limited to the embodiments described above, and various modifications are possible without departing from its essence.
[0082] In the above embodiment, a configuration in which the shield connecting conductor 19, shield connecting conductor 84, and shield connecting conductor 90 are one was described as an example. However, multiple shield connecting conductors may be arranged.
[0083] In the above embodiment, a configuration in which the shield E is arranged on the end faces 2a, 2b, main face 2c, and side faces 2e, 2f of the base body 2 was described as an example. However, the shield only needs to be arranged on at least the end faces 2a, 2b and side faces 2e, 2f.
[0084] In the first embodiment described above, a configuration was described in which the shield connecting conductor 19 electrically connects the shield E located on side surface 2e and the shield E located on side surface 2f. However, the shield connecting conductor only needs to connect the shield E located on two of the four surfaces: end surfaces 2a, 2b and sides 2e, 2f.
[0085] In the second embodiment described above, one example was described in which the shield connecting conductor 84 electrically connects the shield E located on the end face 2a, the shield E located on the end face 2b, the shield E located on the side surface 2e, and the shield E located on the side surface 2f. However, the shield connecting conductor may electrically connect the shield E located on three surfaces: the shield E located on the end face 2a or the end face 2b, the shield E located on the side surface 2e, and the shield E located on the side surface 2f. [Explanation of symbols]
[0086] 1, 1A, 1B... Electronic component, 2... Base body, 2a, 2b... End face (side), 2c, 2d... Main face, 2e, 2f... Side, 4... Second terminal electrode (ground terminal), 6... Fourth terminal electrode (ground terminal), 7... Fifth terminal electrode (ground terminal), 8... Sixth terminal electrode (ground terminal), 15, 16, 17, 18... Inductor conductor, 19, 84, 90... Shield connection conductor (first connection conductor), 19A... First part, 19B... Second part, 19C... Third part ,20,21,22,23,25,26,27,28,33,34,36,39,40,43,44,51,52,53,54...connecting conductor (second connecting conductor), 24...capacitor conductor, 78...first conductor (second connecting conductor), 79...second conductor (second connecting conductor), 80...third conductor (second connecting conductor), 81...fourth conductor (second connecting conductor), 82...fifth conductor (second connecting conductor), 83...sixth conductor (second connecting conductor), E...shield, K1,K2...distance.
Claims
1. A base body having a mounting surface and a main surface facing each other, and four side surfaces connecting a pair of the main surfaces, The shields covering the four sides of the aforementioned body, The aforementioned mounting surface is located on a ground terminal that is connected to ground, The inductor conductor and capacitor conductor arranged within the aforementioned body, A first connecting conductor electrically connects the shield located on one of the four sides and the shield located on another side different from the one side, An electronic component comprising a second connecting conductor that electrically connects the first connecting conductor and the ground terminal.
2. One of the aforementioned sides and the other aforementioned side are arranged opposite each other, The electronic component according to claim 1, wherein the first connecting conductor electrically connects the shields, which are arranged on a pair of sides facing each other.
3. The electronic component according to claim 1 or 2, wherein the first connecting conductor electrically connects each of the shields, which are located on at least three of the four sides.
4. The electronic component according to claim 1 or 2, wherein, when viewed from the direction opposite to the mounting surface and the main surface, the capacitor conductor and the first connecting conductor overlap.
5. The first connecting conductor is positioned between the inductor conductor and the capacitor conductor in the direction opposite to the mounting surface and the main surface. The electronic component according to claim 1 or 2, wherein the distance between the inductor conductor and the first connecting conductor in the opposing direction is longer than the distance between the capacitor conductor and the first connecting conductor in the opposing direction.
6. The electronic component according to claim 1 or 2, wherein the first connecting conductor is disposed between the main surface and the inductor conductor in the direction opposite to the mounting surface and the main surface.
7. The inductor comprises multiple inductor conductors, The first connecting conductor is A first portion electrically connects the shield located on one of the aforementioned sides with the shield located on the other aforementioned side, and is electrically connected to one of the aforementioned inductor conductors, A second portion electrically connects the shield located on one side with the shield located on the other side, and is also electrically connected to the other inductor conductor, The electronic component according to claim 1 or 2, further comprising a third portion electrically connecting the first portion and the second portion.
8. The electronic component according to claim 1 or 2, wherein a plurality of the first connecting conductors are arranged.
Citation Information
Patent Citations
Electronic component
JP2016012770A