Inspection device, shell structure, and inspection method

Abstract

This technology provides a way to properly inspect photonic devices. [Solution] The inspection device inspects a substrate in the form of a shell structure in which contact fixtures are stacked on one side of the substrate. The substrate comprises a photonic device having an optical coupler on one side and electrode pads on the other side opposite to the first side. The contact fixture has a first optical coupler and a second optical coupler, and includes an optical waveguide that optically connects the first optical coupler and the second optical coupler. The inspection device includes a stage on which the contact fixture is placed, a probe card having probes that contact the electrode pads, and a tester capable of transmitting or receiving electrical signals to or from the substrate via the probe card. The stage has a stage-side optical coupler that is optically connected to the second optical coupler and capable of outputting or inputting optical signals.

Description

Technical Field

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[0001] The present disclosure relates to an inspection apparatus, a shell structure, and an inspection method.

Background Art

[0002] In Patent Document 1, a manufacturing method is disclosed in which a contact jig (contact substrate) is joined to suppress the needle pressure applied to a substrate from a probe of an inspection apparatus, thereby forming a shell structure. The inspection apparatus contacts a probe with an electrode of the contact jig of the formed shell structure to transmit an electrical signal to a plurality of semiconductor devices on the substrate and inspect the electrical characteristics of each semiconductor device.

[0003] In recent years, the development of an inspection apparatus capable of inspecting a photonics substrate having photonics devices has been underway.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a technique capable of satisfactorily inspecting photonics devices.

Means for Solving the Problems

[0006] According to one aspect of the present disclosure, an inspection apparatus is provided for inspecting a substrate in the form of a shell structure in which a contact jig is laminated on one side of the substrate, wherein the substrate comprises a photonic device having an optical coupler on the one side and an electrode pad on the other side opposite to the one side, the contact jig has a first optical coupler on a first side which is optically connected to the optical coupler in the form of the shell structure and a second optical coupler on a second side opposite to the first side, and comprises an optical waveguide which optically connects the first optical coupler and the second optical coupler internally, the inspection apparatus includes a stage on which the contact jig of the shell structure is placed, a probe card having a probe that contacts the electrode pad exposed from the other side of the substrate of the shell structure, and a tester capable of transmitting or receiving electrical signals to or from the substrate via the probe card, the stage having a stage-side optical coupler which is optically connected to the second optical coupler and capable of outputting or inputting optical signals. [Effects of the Invention]

[0007] According to one embodiment, photonic devices can be inspected effectively. [Brief explanation of the drawing]

[0008] [Figure 1] This diagram schematically shows the overall configuration of the inspection apparatus according to the embodiment. [Figure 2] Figure 2(A) is a cross-sectional view showing the substrate and contact jig separated. Figure 2(B) is a cross-sectional view showing the shell structure with the substrate and contact jig joined together. [Figure 3] This is a magnified cross-sectional view showing the inspection of a shell structure in an inspection device. [Figure 4] Figure 4(A) is a flowchart showing a method for manufacturing a shell structure. Figure 4(B) is a flowchart showing an inspection method according to an embodiment. [Figure 5] This is a cross-sectional view showing the state of inspecting the shell structure related to the modified example. [Modes for carrying out the invention]

[0009] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0010] As shown in Figure 1, the inspection apparatus 1 according to this embodiment inspects a substrate W having one or more devices under test (DUTs). The devices under test on the substrate W are devices having either an optical circuit or an optical functional element that transmits optical signals, or a combination thereof, so-called silicon photonic devices. Hereinafter, silicon photonic devices will also be simply referred to as devices SP (see Figure 2). Device SP may form an optical integrated circuit on a single chip, or it may form an interface portion of an optical integrated circuit.

[0011] The substrate W according to this embodiment is formed on a wafer on which a plurality of devices SP are arranged in a matrix. The substrate W may be made of silicon, compound semiconductors (SiC, GaAs, SiC, GaN, InP, etc.), etc. The type of substrate W is not particularly limited and may be a carrier on which devices SP are arranged, a glass substrate, a single chip, an electronic circuit board, etc.

[0012] The inspection device 1 is configured to inspect the substrate W in the form of a shell structure 100 having a substrate W having multiple devices SP and a contact jig 110 stacked on one side Wa of the substrate W. The specific configuration of the contact jig 110 and the shell structure 100 will be described in detail later.

[0013] The inspection device 1 comprises an inspection unit 10 that actually performs the inspection, a loader 13 installed adjacent to the inspection unit 10, and a tester 20 installed above the inspection unit 10. Furthermore, the inspection device 1 has a controller 90 that controls the operation of the inspection unit 10, the loader 13, and the tester 20.

[0014] The inspection unit 10 comprises a rectangular parallelepiped housing 11, and has an inspection chamber 12 inside this housing 11. The inspection chamber 12 houses a stage 30 on which a shell structure 100 is placed and which transports the shell structure 100 to a desired three-dimensional coordinate position.

[0015] The loader 13 is equipped with containers such as FOUPs (Front-Opening Unified Pods) for holding multiple shell structures 100. The loader 13 is equipped with a transport device (not shown) that removes the shell structures 100 from the containers and delivers them to the stage 30 in the inspection chamber 12. The loader 13 also receives the inspected shell structures 100 from the stage 30 using the transport device and places them into the containers.

[0016] The inspection unit 10 is equipped with a probe card 21 above the inspection chamber 12, which is connected to the tester 20 via an interface 23. The probe card 21 has a plurality of probes 22 facing the substrate W of the shell structure 100. Each probe 22 makes contact with the electrode pads PD (see Figure 2) (see Figure 2) of each device SP on the substrate W when the shell structure 100 is moved by the stage 30. As a result, the tester 20 outputs power and various electrical signals to each device SP via the probe card 21 and interface 23, and receives electrical signals transmitted from each device SP via the probe card 21 and interface 23.

[0017] The tester 20 includes a motherboard (not shown) connected to interface 23. The motherboard has multiple test boards (not shown) mounted on it and is connected to controller 90. The tester determines the quality of each semiconductor device based on the electrical signals transmitted from each semiconductor device on the substrate W on the motherboard and each test board. By appropriately changing the test boards, the tester 20 can perform multiple types of tests.

[0018] The stage 30 installed in the inspection room 12 has a mounting table 31 with a flat mounting surface 30s capable of supporting the substrate W, a moving part 32 for moving the mounting table 31, and a stage control unit, a motor driver unit, etc. Further, the stage 30 may be provided with a stage-side camera 19 that images the mounting state of the probe card 21 or images the contact state between each probe 22 and the substrate W.

[0019] The mounting table 31 is configured by laminating a bottom plate supported by the moving part 32 and a structure such as a chuck top having the mounting surface 30s. The mounting table 31 of the stage 30 and its peripheral devices have a structure corresponding to the above-described silicon photonics device, and the specific configuration will be described in detail later.

[0020] The moving part 32 conveys the substrate W placed on the mounting surface 30s to appropriate three-dimensional coordinate positions (X-axis direction, Y-axis direction, Z-axis direction) and around the vertical axis (θ-axis direction) in the inspection room 12. For example, the moving part 32 adjusts the horizontal position of the substrate W by moving horizontally (X-axis - Y-axis direction) between a position near or inside the loader 13 and a position facing the probe card 21. Further, the moving part 32 adjusts the circumferential position of the substrate W by rotating the mounting table 31 around the vertical axis. Furthermore, the moving part 32 adjusts the lifting position of the substrate W by moving up and down in the vertical direction (Z-axis direction) at the opposing position between the probe card 21 and the substrate W.

[0021] The stage control unit of the stage 30 is connected to the controller 90 of the inspection apparatus 1, controls the motor driver unit based on the commands of the controller 90, and operates the stage 30. The stage control unit has, for example, a main control unit that controls the operation of the entire stage 30, a PLC that controls the operation of the moving part 32, a temperature controller that controls the temperature control module, a lighting control unit, a power supply unit, etc.

[0022] The controller 90 of the inspection device 1 is a computer having a processor, memory, input / output interface, and communication interface. The processor is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), and circuits consisting of multiple discrete semiconductors, and executes programs stored in memory. The memory includes a main memory device consisting of semiconductor memory, and an auxiliary memory device consisting of disks, drives, semiconductor memory (flash memory), etc.

[0023] Next, the configuration of the shell structure 100, which includes the substrate W to be inspected by the inspection device 1 described above, will be explained with reference to Figures 2(A) and 2(B). As described above, the shell structure 100 includes a substrate W having a plurality of devices SP and a contact jig 110 stacked on one side Wa of the substrate W, and is formed by joining the two. This shell structure 100 is a structure created for the inspection of the substrate W and disassembled after the inspection of the substrate W.

[0024] The substrate W comprises a plate-shaped substrate body Wm formed in a perfectly circular shape in plan view. The diameter of the substrate body Wm is set to, for example, 30 cm. The substrate body Wm has a plurality of devices SP inside or on the surface of the plate. This substrate body Wm has one side Wa facing the contact jig 110, and the other side Wb which is the opposite side.

[0025] Multiple devices SP formed on the substrate body Wm each have multiple optical couplers C on one side Wa and multiple electrode pads PD on the other side Wb. In Figure 2(A), each optical coupler C of the device SP is shown protruding from one side Wa, but the substrate W is not limited to this configuration, and may form a flat surface where each optical coupler C and one side Wa are flush and continuous. Also, in Figure 2(A), each electrode pad PD of the device SP is shown flush and continuous with the other side Wb, but the substrate W is not limited to this configuration, and may have each electrode pad PD protruding from the other side Wb.

[0026] As an example, device SP has a pair of optical couplers C. In this case, one of the pair of optical couplers C may be configured as a light-receiving coupler Ca, and the other optical coupler C may be configured as a light-emitting coupler Cb. The light-receiving coupler Ca receives an optical signal transmitted from the outside and inputs the optical signal to device SP. The light-emitting coupler Cb outputs the optical signal generated or mediated in device SP to the outside.

[0027] Furthermore, each electrode pad PD of device SP is formed from a conductive metal material such as aluminum (Al) or copper (Cu) and is electrically connected to device SP. Each electrode pad PD has functions such as receiving power from an external source and outputting electrical signals generated within device SP to the outside. For example, device SP may have a function to output an electrical signal from an appropriate electrode pad PD when an optical signal is input to the light-receiving coupler Ca. Note that the electrode pads PD may also be solder bumps or metal-plated.

[0028] On the other hand, the contact jig 110 is detachably bonded to one surface Wa of the substrate W. This contact jig 110 includes a jig body 111, a plurality of first optical couplers 112, and a plurality of second optical couplers 113.

[0029] The jig body 111 is formed in a circular shape with approximately the same diameter as the substrate body Wm, and constitutes a base that is joined to the substrate body Wm. The jig body 111 also has a recess 111s on the inside of its annular outer circumference 111a. The recess 111s is open on the side of the jig body 111 facing the substrate body Wm, 111s1 (first surface). The jig body 111 may have a different shape from the substrate W; for example, it may be formed in a circular shape or a polygonal shape such as a square, with a larger diameter than the substrate W.

[0030] To suppress displacement between the substrate W and the contact jig 110 during temperature changes of the shell structure 100, the jig body 111 is made of a material having a thermal expansion coefficient equivalent to that of the substrate body Wm. For example, the jig body 111 can be made of a contact substrate formed from the same material as the substrate body Wm. Alternatively, the jig body 111 may be made of a glass substrate having a thermal expansion coefficient equivalent to that of the substrate W, or a substrate formed by laminating a semiconductor substrate and a glass substrate.

[0031] Multiple first optical couplers 112 are provided in recesses 111s of the jig body 111 and protrude from the bottom surface of the recesses 111s. The protruding end face of each first optical coupler 112 is optically connected to the optical coupler C by joining the substrate W and the contact jig 110. For this reason, each first optical coupler 112 is positioned on the substrate W so as to face each optical coupler C. In this specification, "optically connected" refers to a connection configuration that enables the transmission of optical signals (optical communication) from one coupler to the other.

[0032] Each first optical coupler 112 of the contact jig 110 and each optical coupler C of the substrate W only need to be capable of transmitting optical signals, and may be in physical contact with each other or separated by a gap. In this embodiment, a configuration is shown in which the protruding end faces of each first optical coupler 112 and each optical coupler C come into contact with each other, thereby connecting the optical paths within their respective protrusions. One or both of the first optical couplers 112 and optical couplers C may be fitted with lenses that magnify and / or parallelize light (such as a SELFOC lens®). Furthermore, each first optical coupler 112 and each optical coupler C may be connected to each other by a mechanical coupling mechanism. For example, the coupling mechanism may be formed in a cylindrical shape that circumfers the outer circumference of each first optical coupler 112, and the optical coupler C of the substrate W may be inserted into the cylinder when the substrate W and the contact jig 110 are joined. In this embodiment, the first optical coupler 112 is shown protruding from the bottom of the jig body 111, but the first optical coupler 112 may be in a form that is flush with and continuous with the jig body 111.

[0033] Furthermore, each first optical coupler 112 forms a group at the bottom of the jig body 111 corresponding to the device SP on the substrate W. Each first optical coupler 112 includes a first light-emitting coupler 112a connected to a light-receiving coupler Ca on the substrate W, and a first light-receiving coupler 112b connected to a light-emitting coupler Cb on the substrate W. The first light-emitting coupler 112a and the first light-receiving coupler 112b may have the same configuration or different configurations.

[0034] Multiple light-emitting first couplers 112a and multiple light-receiving first couplers 112b are connected to multiple second optical couplers 113 formed on the opposite side 111s2 (second side) of the jig body 111 via optical waveguides 114 formed within the jig body 111.

[0035] Multiple second optical couplers 113 are optically connected to external optical couplers on the opposite surface 111s2 of the jig body 111. For example, the planar shape (area) of each second optical coupler 113 is formed to be larger than the planar shape (area) of the optical coupler C on the substrate W. In this embodiment, the second optical couplers 113 are shown protruding from the opposite surface 111s2 of the jig body 111, but the contact jig 110 is not limited to this, and each second optical coupler 113 and the opposite surface 111s2 may form a continuous flat surface flush with each other.

[0036] Each second optical coupler 113 includes a light-receiving second coupler 113a and a light-emitting second coupler 113b. The light-receiving second coupler 113a and the light-emitting second coupler 113b may be provided as one on the jig body 111, or as multiple on the jig body 111. The light-receiving second coupler 113a and the light-emitting second coupler 113b may have the same configuration or different configurations.

[0037] The second light-receiving coupler 113a is optically connected to the first light-emitting coupler 112a via an optical waveguide 114. As shown in the illustrated example, the number of second light-receiving couplers 113a may be less than the number of first light-emitting couplers 112a. The second light-emitting coupler 113b is optically connected to the first light-receiving coupler 112b via an optical waveguide 114. The number of second light-emitting couplers 113b may also be less than the number of first light-receiving couplers 112b.

[0038] Multiple optical waveguides 114 are provided within the jig body 111 and are channel waveguides for transmitting optical signals. Each optical waveguide 114 is not particularly limited in its configuration as long as it can transmit light with low loss; for example, it may be a fiber optic cable or a cavity capable of reflecting light. For example, if silicon is used as the material for the jig body 111, each optical waveguide 114 can be formed by using a silicon layer as the core and a silicon dioxide layer as the cladding.

[0039] Furthermore, each optical waveguide 114 independently comprises a first optical waveguide 115 connecting a first light-emitting coupler 112a and a second light-receiving coupler 113a, and a second optical waveguide 116 connecting a first light-receiving coupler 112b and a second light-emitting coupler 113b. The fleshy part of the jig body 111 shields the space between the first optical waveguide 115 and the second optical waveguide 116.

[0040] The first optical waveguide 115 branches into multiple paths within the jig body 111 and is connected to each first light-emitting coupler 112a. The first optical waveguide 115 is capable of splitting the optical signal received from the second light-receiving coupler 113a and transmitting it to each first light-emitting coupler 112a. The second optical waveguide 116 also branches into multiple paths within the jig body 111 and is connected to each first light-receiving coupler 112b. The second optical waveguide 116 is capable of merging the optical signals received from the first light-receiving coupler 112b and transmitting them to each second light-emitting coupler 113b.

[0041] A joint portion 110g is formed on the outer periphery 111a of the joining surface of the contact jig 110. The outer periphery 111a protrudes from the bottom surface of the recess 111s and forms an annular portion, and the joint portion 110g is formed on the entire protruding end face of the outer periphery 111a. This joint portion 110g may be formed with an adhesive, or it may be a modified layer obtained by modifying the surface of the jig body 111.

[0042] The bonding surface of the contact jig 110 is bonded to one side Wa of the substrate W via the bonding portion 110g, thereby creating a sealed space within the recess 111s. Each first optical coupler 112 and each optical coupler C are arranged in this space. The substrate W and the contact jig 110 may be bonded in an atmospheric environment or in a vacuum (reduced pressure) environment. By bonding the substrate W and the contact jig 110 in a vacuum environment, the pressure inside the recess 111s can be reduced, and the shell structure 100 can be formed by the differential pressure with the outside.

[0043] The inspection device 1 has a configuration on the stage 30 for inspecting the shell structure 100 described above. Next, the configuration of the inspection device 1 for inspecting the shell structure 100 will be explained with reference to Figure 3.

[0044] Specifically, the inspection device 1 places the contact jig 110 of the shell structure 100 on the mounting surface 30s of the stage 30 (mounting table 31). That is, the shell structure 100 is arranged with the contact jig 110 and the substrate W in that order, facing upward in the vertical direction, with the other side Wb of the substrate W facing the probe card 21. As a result, each probe 22 of the probe card 21 comes into contact with each electrode pad PD of the substrate W, which has been moved and aligned by the moving part 32 of the stage 30.

[0045] The stage 30 is equipped with a plurality of optical couplers 33 (stage-side optical couplers) on its mounting surface 30s, which are capable of transmitting optical signals between the stage 30s and each second optical coupler 113 of the contact fixture 110 of the shell structure 100. For example, the mounting base 31 has recessed portions 31a that are recessed from the mounting surface 30s and accommodate each of the plurality of optical couplers 33. As a result, each optical coupler 33 is installed so as not to protrude from the mounting surface 30s. The installation configuration of each optical coupler 33 can be adopted according to the configuration of the second optical coupler 113 of the shell structure 100. For example, if the second optical coupler 113 is formed flush with the opposite surface 111s2 of the contact fixture 110, the optical coupler 33 may also be formed flush with the mounting surface 30s.

[0046] Each optical coupler 33 is formed to be larger than, for example, the first optical coupler 112 of the shell structure 100. The optical coupler 33 of the mounting base 31 and each second optical coupler 113 of the shell structure 100 only need to be optically connected, they may be in physical contact with each other, or they may be separated from each other by a gap. In this embodiment, a configuration is shown in which the protruding end faces of each optical coupler 33 and the protruding end faces of each second optical coupler 113 come into contact with each other, thereby creating communication between the optical paths within their respective protrusions.

[0047] Each optical coupler 33 includes a light-emitting coupler 33a connected to a light-receiving second coupler 113a of the shell structure 100, and a light-receiving coupler 33b connected to a light-emitting second coupler 113b of the shell structure 100. The light-emitting coupler 33a and the light-receiving coupler 33b may have the same configuration or different configurations.

[0048] The light-emitting coupler 33a is connected to an optical signal generator 37 located outside the mounting base 31 via an optical waveguide 35 located inside the mounting base 31. The optical signal generator 37 is connected to a controller 90 and outputs an optical signal whose frequency and amplitude are appropriately adjusted based on commands from the controller 90. The optical signal output from the optical signal generator 37 is transmitted via a fiber optic cable to the optical waveguide 35 in the mounting base 31, and further transmitted to the light-emitting coupler 33a. As a result, the light-emitting coupler 33a can output an optical signal to the second light-receiving coupler 113a of the opposing shell structure 100.

[0049] On the other hand, the light-receiving coupler 33b is connected to an optical signal measuring instrument 38 located outside the mounting base 31 via an optical waveguide 36 located inside the mounting base 31. The optical signal measuring instrument 38 measures and analyzes the optical signal received from the light-receiving coupler 33b via the optical waveguide 36 and fiber optic cable, and transmits the information to the controller 90.

[0050] Furthermore, the mounting table 31 includes a suction mechanism 39 for fixing the shell structure 100, and a temperature control mechanism 40 for adjusting the temperature of the substrate W (shell structure 100) during inspection.

[0051] The suction mechanism 39 applies suction pressure (negative pressure) to the mounting surface 30s to adsorb the shell structure 100 (contact jig 110). For example, the mounting surface 30s of the mounting table 31 has multiple annular grooves 31b formed on it in a plan view, which are concentrically circulating around the center of the mounting surface 30s. The suction mechanism 39 has multiple suction tubes 391 that communicate with each groove 31b inside the stage 30, a suction path 392 that communicates with each suction tube 391 and extends outside the stage 30, and a suction pump 393 provided in the suction path 392.

[0052] The adsorption mechanism 39 applies adsorption pressure to the groove 31b via the suction path 392 and each suction tube 391 by driving the suction pump 393 based on the control of the controller 90. As a result, the stage 30 firmly fixes the shell structure 100, allowing the movement and inspection of the shell structure 100 to be performed stably.

[0053] The temperature control mechanism 40 adjusts the temperature of the substrate W of the shell structure 100 placed on the mounting surface 30s to a target temperature. The temperature control mechanism 40 according to this embodiment includes a heater 41 for heating the shell structure 100 and a refrigerant flow path 42 for cooling the shell structure 100 by circulating a refrigerant. Furthermore, the stage 30 has a temperature sensor inside for detecting the temperature of the mounting surface 30s.

[0054] The heater 41, which may be an electric heating element, a sheet heater, etc., is installed inside the mounting base 31 so as to overlap substantially the entire mounting surface 30s. This heater 41 is connected to a temperature control driver outside the stage 30 and, based on the control of the controller 90, is supplied with power to heat the shell structure 100 and adjust it to the target temperature. Note that the heater 41 may be installed not only inside the mounting base 31, but also outside the mounting base 31, such as on the underside of the mounting base 31.

[0055] Furthermore, the temperature control mechanism 40 is provided with a refrigerant path 43 communicating with the refrigerant flow path 42 located outside the stage 30, and also includes a chiller 44 located midway along the refrigerant path 43 for adjusting the temperature and pumping the refrigerant. For example, when testing the low-temperature performance of the substrate W, the temperature control mechanism 40 drives the chiller 44 based on the control of the controller 90 to circulate the temperature-adjusted refrigerant through the refrigerant path 43 to the refrigerant flow path 42. At this time, the controller 90 adjusts the temperature of the refrigerant in the chiller 44 based on the temperature detected by the temperature sensor so that the temperature of the shell structure 100 reaches the target temperature. As a result, the temperature control mechanism 40 can effectively lower the temperature of the shell structure 100 to the target temperature.

[0056] The inspection apparatus 1 and shell structure 100 according to this embodiment are basically configured as described above, and their operation (manufacturing method of the shell structure 100, inspection method) will be explained below with reference to Figures 4(A) and 4(B).

[0057] When manufacturing the shell structure 100, the contact jig 110 and the substrate W are prepared separately. In the manufacturing method, in order to join the contact jig 110 and the substrate W, first an adhesive is applied to the outer periphery 111a (protruding end face) of the contact jig 110 (step S101). This adhesive is not particularly limited, and for example, a UV-curing resin may be used. Alternatively, when hydrophilic bonding is performed between the contact jig 110 and the substrate W, the outer periphery 111a of the contact jig 110 and one side Wa of the substrate W may be treated to make them hydrophilic.

[0058] Next, in the manufacturing method, the contact jig 110 and the substrate W are loaded into a bonding device (not shown), and the horizontal position of the contact jig 110 and the substrate W is aligned by the moving part of the bonding device (step S102). As a result, within the bonding device, each first optical coupler 112 of the contact jig 110 and each optical coupler C of the substrate W face each other. Note that the bonding of the contact jig 110 and the substrate W may be performed manually by the user without using the bonding device.

[0059] In the joining method, the joining device moves one or both of the contact jig 110 and the substrate W in the vertical direction, bringing the outer periphery 111a of the contact jig 110 into contact with the outer periphery of the substrate W to form a shell structure 100 (step S103). When joining the contact jig 110 and the substrate W, the contact jig 110 and the substrate W are moved relative to each other in the vertical direction, allowing for a stable connection between each of the opposing first optical couplers 112 and each optical coupler C. While precision is required for the connection between each of the first optical couplers 112 and each optical coupler C, a joining device with high alignment capabilities can ensure a stable connection between both couplers. If a UV-curing resin is used as the adhesive, the adhesive can be cured by irradiating the contact area between the contact jig 110 and the substrate W with UV light to form the joint 110g. The shell structure 100 can firmly bond the contact jig 110 and the substrate W with the joint portion 110g, and can also shield the inner recess 111s from light from the outside.

[0060] The manufacturing method allows for the easy production of the shell structure 100 by following the steps described above. The manufactured shell structure 100 enables the contact jig 110 and the substrate W to be handled as a single unit. After the shell structure 100 is placed in a container such as a FOUP, the container is set on the loader 13 of the inspection device 1, and the process moves on to inspection by the inspection device 1.

[0061] In the inspection method of inspection device 1, controller 90 controls the processing flow of steps S111 to S116 shown in Figure 4(B). First, controller 90 controls the transport device of loader 13 to remove the shell structure 100 from the container and place the shell structure 100 on the mounting table 31 of stage 30 (S111). At this time, the transport device of inspection device 1 lowers the shell structure 100 after aligning the horizontal coordinates of the shell structure 100. This optically connects each second optical coupler 113 of the contact jig 110 to each optical coupler 33 of the mounting table 31. The alignment of each second optical coupler 113 and each optical coupler 33 at this time can be rougher than the alignment of each first optical coupler 112 and each optical coupler C, due to the large planar shapes of the two. In other words, inspection device 1 can place the shell structure 100 on the mounting surface 30s with rough alignment.

[0062] Furthermore, after the shell structure 100 is placed, the stage 30 operates the suction mechanism 39 to fix the shell structure 100 to the mounting base 31. In addition, the stage 30 operates the temperature control mechanism 40 to adjust the temperature of the shell structure 100 (substrate W).

[0063] Next, the controller 90 controls the moving part 32 of the stage 30 to move the mounting table 31 horizontally, aligning the substrate W of the shell structure 100 with the opposite position of the probe card 21 (step S112). As a result of this alignment, each electrode pad PD of any device SP provided on the substrate W and each probe 22 of the probe card 21 face each other.

[0064] Subsequently, the controller 90 controls the moving unit 32 to raise the mounting base 31 of the stage 30 vertically upward, bringing each probe 22 of the probe card 21 into contact with each electrode pad PD of the substrate W (step S113). This electrically connects each device SP of the substrate W to the tester 20 via the probe card 21.

[0065] In this state, the controller 90 controls the tester 20, optical signal generator 37, and optical signal measuring instrument 38, etc., to perform electrical and optical inspections on each device SP on the substrate W (step S114).

[0066] For example, as shown in Figure 3, the inspection device 1 outputs an optical signal from the optical signal generator 37, which then outputs the optical signal from the light-emitting coupler 33a to the light-receiving second coupler 113a via the optical waveguide 35 of the mounting stage 31. As a result, the shell structure 100 transmits the optical signal in the following order: second optical coupler 113, optical waveguide 114, first optical coupler 112, and light-receiving coupler Ca of the device SP. The device SP then outputs an electrical signal based on the optical signal from an appropriate electrode pad PD. The tester 20 receives the electrical signal via the probe card 21 and performs electrical testing, such as determining the electrical characteristics of each device SP on the substrate W, or determining whether it is normal or abnormal.

[0067] Furthermore, each device SP on the substrate W may transmit an optical signal to the light-emitting coupler Cb when an optical signal is input from each light-emitting first coupler 112a to the light-receiving coupler Ca. The optical signal output from the light-emitting coupler Cb is input to the light-receiving first coupler 112b of the shell structure 100. The shell structure 100 then transmits the optical signal to the light-receiving first coupler 112b, the second optical waveguide 116, and each light-emitting second coupler 113b. In addition, the inspection device 1 transmits the optical signal from each light-emitting second coupler 113b to the light-receiving coupler 33b of the stage 30, and outputs the optical signal to the optical signal measuring instrument 38 via the optical waveguide 36 and fiber optic cable. The optical signal measuring instrument 38 then analyzes the acquired optical signal and transmits the information to the controller 90 to perform an optical inspection of the device SP.

[0068] Furthermore, during inspection, the inspection device 1 may generate an optical signal within the device SP by supplying power from the tester 20 to each electrode pad PD of the substrate W according to the type of device SP, and output this optical signal from the light-emitting coupler Cb. In this case as well, the optical signal output from the light-emitting coupler Cb to the first light-receiving coupler 112b is transmitted in the following order: first light-receiving coupler 112b, second optical waveguide 116, each second light-emitting coupler 113b, and then to the light-receiving coupler 33b of the stage 30. The optical signal input to the light-receiving coupler 33b is then output to the optical signal measuring instrument 38 in the same manner as described above. The optical signal measuring instrument 38 can perform an optical inspection of the device SP by analyzing the acquired optical signal and transmitting the information to the controller 90.

[0069] Returning to Figure 4(B), the controller 90 determines whether all of the devices SP on the substrate W have been inspected during the inspection (step S115). If the inspection of each device SP is not complete (step S115: NO), the process returns to step S112, and the same processing flow is repeated. That is, the inspection device 1 inspects some of the devices SP on the substrate W with each probe 22 of the probe card 21, then lowers the substrate W to release the contact between each probe 22 and each device SP, and then changes the position of the device SP facing each probe 22 by moving the moving part 32, and then inspects the device SP again, repeating this process. In this way, the inspection device 1 can inspect all of the devices SP on the substrate W. Note that if all of the devices SP on the substrate W can be inspected at once, it is not necessary to repeatedly make and release contact between each probe 22 and each device SP.

[0070] If the inspection of each device SP is completed (step S115: YES), the process proceeds to step S116. In step S116, the controller 90 controls the moving unit 32 to unload the shell structure 100 from the inspection unit 10. In unloading the shell structure 100, the inspected shell structure 100 is placed in a container by performing the reverse of the processing flow described above.

[0071] The inspected shell structure 100 is transported to, for example, a peeling device (not shown), where it is separated from the substrate W and the contact jig 110. After separation, the substrate W and the contact jig 110 may be cleaned at the joint. The separated contact jig 110 is then reused for inspecting another substrate W.

[0072] In the inspection method described above, the inspection device 1 can effectively inspect the substrate W of the shell structure 100 via the contact jig 110. In particular, since the inspection device 1 can output or input optical signals from the stage 30 (mounting table 31) side, it can stably contact each probe 22 with each electrode pad PD on the substrate W side above, and smoothly transmit or receive electrical signals to each device SP on the substrate W.

[0073] It should be noted that the inspection apparatus 1, shell structure 100, and inspection method according to this disclosure are not limited to the embodiments described above and can be modified in various ways. For example, the contact jig 110 according to the embodiment has a configuration that includes a recess 111s that integrally houses a plurality of first optical couplers 112, but is not limited to this and may have a configuration that includes a plurality of recesses that individually house each first optical coupler 112.

[0074] Furthermore, the modified inspection device 1A shown in Figure 5 differs from the inspection device 1 described above in that it is configured to inspect a substrate W having a device SP that receives an optical signal via an optical coupler C and outputs an electrical signal from an electrode pad PD. In this case, the contact jig 110 only needs to include a first optical coupler 112 corresponding to each optical coupler C, a second optical coupler 113 provided on the opposite side of each first optical coupler 112 in fewer numbers than the first optical couplers 112, and a first optical waveguide 115. In addition, the stage 30 only needs to include an optical coupler 33 corresponding to the second optical coupler 113, an optical waveguide 35, and an optical signal generator 37.

[0075] Thus, the inspection apparatus 1, 1A and the contact jig 110 can adopt an appropriate structure depending on the configuration of the device SP on the substrate W to be inspected. Furthermore, the stage 30 on which the shell structure 100 is placed may not be limited to the configuration shown in Figure 5, but may also adopt the configuration shown in Figure 3. This allows for the application of a common device to the inspection apparatus 1 while changing the configuration of the contact jig 110 during inspection. In other words, by adopting the form of the shell structure 100 (contact jig 110), the inspection apparatus 1 can use a common structure for the stage 30 for various devices SP. Since a stage 30 with a different structure is unnecessary, the inspection apparatus 1 can significantly reduce inspection costs.

[0076] The technical concept and effects of this disclosure, as described in the embodiments above, are described below.

[0077] A first aspect of this disclosure is an inspection apparatus 1 for inspecting a substrate W in the form of a shell structure 100 in which a contact jig 110 is laminated on one side Wa of the substrate W, wherein the substrate W comprises a photonic device (device SP) having an optical coupler C on one side Wa and an electrode pad PD on the other side Wb opposite to the one side Wa, and the contact jig 110 has a first optical coupler 112 on its first surface that is optically connected to the optical coupler C in the form of a shell structure 100, and a second optical coupler 113 on its second surface opposite to the first surface, and the first optical coupler The inspection apparatus 1 includes an optical waveguide 114 that optically connects the plastic 112 and the second optical coupler 113, a stage 30 on which a contact jig 110 of the shell structure 100 is placed, a probe card 21 having probes 22 that contact electrode pads PD exposed from the other side Wb of the substrate W of the shell structure 100, and a tester 20 capable of transmitting or receiving electrical signals to or from the substrate W via the probe card 21, the stage 30 having a stage-side optical coupler (optical coupler 33) that is optically connected to the second optical coupler 113 and capable of outputting or inputting optical signals.

[0078] As described above, the inspection device 1 can inspect the substrate W in the form of a shell structure 100 of the substrate W and the contact jig 110, thereby enabling good inspection of the photonic device (device SP). Specifically, the inspection device 1 can set up optical signal wiring in the contact jig 110 and transmit the optical signal to the device SP on the substrate W via the contact jig 110 mounted on the stage 30. This simplifies the structure installed on the stage 30 (stage-side optical coupler, etc.), and allows for easy installation of structures such as the adsorption mechanism 39 and the temperature control mechanism 40 on the stage 30. This makes it possible to perform inspections on the substrate W under various conditions.

[0079] Furthermore, during the inspection, the stage 30 is moved to bring the electrode pad PD of the shell structure 100 into contact with the probe 22, and an optical signal is output from the stage-side optical coupler (optical coupler 33) to the second optical coupler 113. The optical signal is then transmitted in the order of the second optical coupler 113, optical waveguide 114, first optical coupler 112, and the optical coupler C of the photonic device (device SP). The electrical signal output from the electrode pad PD of the photonic device is received by the tester 20 to perform an electrical inspection. As a result, the inspection device 1 can reliably perform electrical inspections of the photonic device.

[0080] Furthermore, during the inspection, the stage 30 is moved to bring the electrode pad PD of the shell structure 100 into contact with the probe 22, and an electrical signal is transmitted from the tester 20 to the electrode pad PD, causing the optical coupler C of the photonic device (device SP) to output an optical signal to the first optical coupler 112. The optical signal is then transmitted in the order of the first optical coupler 112, optical waveguide 114, second optical coupler 113, and stage-side optical coupler (optical coupler 33), and an optical inspection is performed based on the optical signal from the stage-side optical coupler. As a result, the inspection device 1 can stably perform optical inspection of the photonic device.

[0081] Furthermore, the substrate W is equipped with multiple photonic devices (device SP), and the contact jig 110 has the same number of first optical couplers 112 as the number of optical couplers C of the multiple photonic devices, while having fewer second optical couplers 113 than the number of first optical couplers 112. This allows the inspection apparatus 1 to further simplify the configuration of the stage 30 that outputs the optical signal.

[0082] Furthermore, the optical waveguide 114 branches or merges inside the contact jig 110 to optically connect multiple first optical couplers 112 and a smaller number of second optical couplers 113 than the number of first optical couplers 112. As a result, the shell structure 100 can reliably transmit optical signals between the two couplers even if the number of first optical couplers 112 and second optical couplers 113 differs.

[0083] Furthermore, the substrate W and the contact jig 110 are bonded in a detachable manner. This allows the inspection device 1 to easily detach the substrate W from the contact jig 110 after inspection. The contact jig 110 can then be reused on another substrate W.

[0084] Furthermore, the contact jig 110 has a recess 111s that accommodates the optical coupler C and the first optical coupler 112 in the form of a shell structure 100, and the shell structure 100 has a joint portion 110g on the outer circumference of the recess 111s to which the contact jig 110 and the substrate W are joined. As a result, the shell structure 100 can easily join the contact jig 110 and the substrate W while effectively shielding the connection portion between the optical coupler C and the first optical coupler 112 from light.

[0085] Furthermore, the planar shape of the second optical coupler 113 is larger than that of the first optical coupler 112. This allows the inspection device 1 to connect the second optical coupler 113 and the stage-side optical coupler (optical coupler 33) with simple positional adjustment (rough alignment), thereby improving inspection efficiency.

[0086] Furthermore, the stage 30 has a temperature control mechanism 40 that adjusts the temperature of the placed shell structure 100. This allows the inspection device 1 to inspect the shell structure 100 (substrate W), which is temperature-controlled by the temperature control mechanism 40, under various temperature conditions.

[0087] Furthermore, the stage 30 has a suction mechanism 39 that attracts the contact fixture 110 of the placed shell structure 100. This allows the inspection device 1 to stably hold the shell structure 100 on the stage 30 and perform inspection.

[0088] Furthermore, a second aspect of this disclosure is a shell structure 100 formed by stacking a contact jig 110 on one side Wa of a substrate W, and the substrate W is inspected by an inspection device 1, wherein the substrate W comprises a photonic device (device SP) having an optical coupler C on one side Wa and an electrode pad PD on the other side Wb opposite to the one side Wa, and the contact jig 110 has a first optical coupler 112 on its first surface that is optically connected to the optical coupler C in the form of the shell structure 100, and a second optical coupler 113 on its second surface opposite to the first surface, Furthermore, the shell structure 100 includes an optical waveguide 114 that optically connects the first optical coupler 112 and the second optical coupler 113 internally. During inspection, when the contact jig 110 is placed on the stage 30 of the inspection device 1, the second optical coupler 113 is optically connected to the stage-side optical coupler (optical coupler 33) that can output or input optical signals from the stage 30. The probe 22 of the probe card 21 is then in contact with the electrode pad PD exposed from the other side Wb of the substrate W, and an electrical signal is transmitted or received between the tester 20 and the substrate W via the probe card 21. Even in this case, the shell structure 100 can effectively inspect the photonic device.

[0089] Furthermore, a third aspect of this disclosure is an inspection method for inspecting a substrate W in the form of a shell structure 100 in which a contact jig 110 is laminated on one side Wa of the substrate W, wherein the substrate W comprises a photonic device (device SP) having an optical coupler C on one side Wa and an electrode pad PD on the other side Wb opposite to the one side Wa, and the contact jig 110 has a first optical coupler 112 on its first surface which is optically connected to the optical coupler C in the form of a shell structure 100, and a second optical coupler 113 on its second surface opposite to the first surface, and internally the first optical coupler 112 and the second The inspection method includes an optical waveguide 114 that optically connects the optical couplers 113, and comprises the steps of: placing the contact jig 110 of the shell structure 100 on the stage 30 to optically connect the stage-side optical coupler (optical coupler 33) of the stage 30 with the second optical coupler 113; bringing the probe 22 of the probe card 21 into contact with the electrode pad PD exposed from the other side Wb of the substrate W of the shell structure 100; and performing inspection by outputting or inputting an optical signal from the stage-side optical coupler and transmitting or receiving an electrical signal from the tester 20 to the substrate W via the probe card 21. Even in this case, the inspection method can inspect the photonic device well.

[0090] The inspection apparatus 1, shell structure 100, and inspection method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner. [Explanation of symbols]

[0091] 1. Inspection device 20 Tester 21 Probe Card 22 probes 30 stages 33 Optical Coupler 100 Shell Structures 110 Contact jig 112 First Optical Coupler 113. Second Optical Coupler 114 Optical waveguide C Optical Coupler PD electrode pads SP Device W board Wa One side Wb Other side

Claims

1. An inspection device for inspecting a substrate in the form of a shell structure in which contact jigs are stacked on one side of the substrate, The substrate comprises a photonic device having an optical coupler on one side and electrode pads on the other side opposite to the one side. The contact jig has a first optical coupler on its first surface that is optically connected to the optical coupler in the form of the shell structure, and a second optical coupler on its second surface opposite to the first surface, and includes an optical waveguide that optically connects the first optical coupler and the second optical coupler internally. The inspection device, A stage on which the contact fixture of the shell structure is placed, A probe card having a probe that contacts the electrode pad exposed from the other side of the substrate of the shell structure, The probe card includes a tester capable of transmitting or receiving electrical signals to or from the substrate, The stage is optically connected to the second optical coupler and has a stage-side optical coupler capable of outputting or inputting optical signals. Inspection device.

2. In the inspection described above, the stage is moved to bring the electrode pads of the shell structure and the probe into contact, and the optical signal is output from the stage-side optical coupler to the second optical coupler, and the optical signal is transmitted in the order of the second optical coupler, the optical waveguide, the first optical coupler, and the optical coupler of the photonics device. The electrical signal output from the electrode pad of the photonic device is received by the tester and an electrical test is performed. The inspection apparatus according to claim 1.

3. In the inspection, the stage is moved to bring the electrode pads of the shell structure into contact with the probe, and the electrical signal is transmitted from the tester to the electrode pads, causing the optical signal to be output from the optical coupler of the photonic device to the first optical coupler, and the optical signal is transmitted in the order of the first optical coupler, the optical waveguide, the second optical coupler, and the stage-side optical coupler. An optical inspection is performed based on the optical signal from the stage-side optical coupler. The inspection apparatus according to claim 1.

4. The substrate comprises a plurality of the photonic devices, The contact jig has the same number of first optical couplers as the number of optical couplers of the plurality of photonic devices, while having fewer second optical couplers than the number of first optical couplers. The inspection apparatus according to any one of claims 1 to 3.

5. The optical waveguide optically connects a plurality of first optical couplers and a number of second optical couplers that is less than the number of first optical couplers by branching or merging within the contact jig. The inspection apparatus according to claim 4.

6. The substrate and the contact jig are joined in a peelable manner. The inspection apparatus according to any one of claims 1 to 3.

7. The contact jig has a recess in the form of the shell structure that accommodates the optical coupler and the first optical coupler, The shell structure has a joint portion on the outer periphery of the recess where the contact jig and the substrate are joined. The inspection apparatus according to claim 6.

8. The planar shape of the second optical coupler is larger than the planar shape of the first optical coupler. The inspection apparatus according to any one of claims 1 to 3.

9. The stage has a temperature control mechanism that adjusts the temperature of the shell structure on which it is placed. The inspection apparatus according to any one of claims 1 to 3.

10. The stage has a suction mechanism for adsorbing the contact fixture of the placed shell structure. The inspection apparatus according to any one of claims 1 to 3.

11. A shell structure formed by stacking contact jigs on one side of a substrate, wherein the substrate is inspected by an inspection device, The substrate comprises a photonic device having an optical coupler on one side and electrode pads on the other side opposite to the one side. The contact jig has a first optical coupler on its first surface that is optically connected to the optical coupler in the form of the shell structure, and a second optical coupler on its second surface opposite to the first surface, and includes an optical waveguide that optically connects the first optical coupler and the second optical coupler internally. In the inspection described above, the contact jig is placed on the stage of the inspection apparatus, the second optical coupler is optically connected to a stage-side optical coupler capable of outputting or inputting optical signals from the stage, and the probe of the probe card is in contact with the electrode pad exposed from the other side of the substrate, and an electrical signal is transmitted or received between the tester and the substrate via the probe card. Shell structure.

12. An inspection method for inspecting a substrate in the form of a shell structure in which contact jigs are stacked on one side of the substrate, The substrate comprises a photonic device having an optical coupler on one side and electrode pads on the other side opposite to the one side. The contact jig has a first optical coupler on its first surface that is optically connected to the optical coupler in the form of the shell structure, and a second optical coupler on its second surface opposite to the first surface, and includes an optical waveguide that optically connects the first optical coupler and the second optical coupler internally. The aforementioned inspection method is A step of placing the contact jig of the shell structure on the stage and optically connecting the stage-side optical coupler of the stage and the second optical coupler, A step of bringing the probe of the probe card into contact with the electrode pad exposed from the other side of the substrate of the shell structure, The process includes outputting or inputting an optical signal from the stage-side optical coupler, and transmitting or receiving an electrical signal from the tester to the substrate via the probe card to perform testing. Testing method.

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