Membrane and substrate polishing apparatus containing the same

Abstract

The present invention provides a membrane and a substrate polishing apparatus containing the same. [Solution] A substrate polishing apparatus according to one embodiment may include a carrier head; a membrane connected to the carrier head; and a retainer ring connected to the carrier head so as to surround the outside of the membrane. The membrane may include an annularly formed side wall; a bottom flap extending inward from the lower end of the side wall and being a portion for direct contact with the substrate; and an upper flap extending from the upper end of the side wall and being a portion for connection with the carrier head.

Description

Technical Field

[0001] The following embodiments relate to a membrane and a substrate polishing device (MEMBRANE AND SUBSTRATE POLISHING DEVICE COMPRISING THE SAME) including the same.

Background Art

[0002] In the manufacture of semiconductor devices, CMP (chemical mechanical polishing) operations including polishing, buffing and cleaning are required. Semiconductor devices are in the form of a multilayer structure, and transistor elements with diffusion regions are formed in the substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming functional elements. As is well known, the patterned conductive layer is insulated from other conductive layers by an insulating material such as silicon dioxide. Further, as more metal layers and related insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the manufacture of additional metal layers becomes substantially more difficult due to many variations in the surface morphology. Also, the metal line pattern is formed of an insulating material, and the metal CMP operation will remove excess metal.

[0003] With the development of technology, the importance of back side polishing of the substrate has emerged. On the other hand, when polishing the back side of the substrate, since the membrane directly contacts the pattern surface of the substrate, there is a possibility that the pattern surface may be damaged by particles, defects, scratches and / or static electricity. Therefore, in reality, a structure capable of minimizing damage to the pattern surface during back side polishing of the substrate is required.

[0004] The background art described above is what the inventor possessed or acquired in the process of deriving the disclosure of the present application, and is not necessarily prior art publicly disclosed to the general public before the present application.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The objective of one embodiment is to provide a membrane that can minimize the contact area between the membrane and the substrate.

[0006] The objective of one embodiment is to provide a membrane that can transmit pressure to the substrate through an internal pressure chamber while only contacting the outermost part of the substrate. [Means for solving the problem]

[0007] A substrate polishing apparatus according to one embodiment may include a carrier head; a membrane connected to the carrier head; and a retainer ring connected to the carrier head so as to surround the outside of the membrane. The membrane may include an annularly formed side wall; a bottom flap extending inward from the lower end of the side wall and being a portion for direct contact with the substrate; and an upper flap extending from the upper end of the side wall and being a portion for connection with the carrier head.

[0008] In one embodiment, the bottom flap may extend a predetermined length from the lower end of the side wall toward the center of the membrane such that a hollow is formed on the bottom surface of the membrane.

[0009] In one embodiment, a pressure chamber can be formed between the lower surface of the carrier head, the upper flap, the side wall, the bottom flap, and the upper surface of the substrate, with reference to the state in which the substrate is in contact with the lower surface of the bottom flap.

[0010] In one embodiment, the pressurized chamber may be formed as a single chamber.

[0011] In one embodiment, the substrate polishing apparatus may further include a first pressurizing unit configured to adjust the internal pressure of the pressurizing chamber in order to adjust the downward pressure applied to the substrate.

[0012] In one embodiment, the bottom flap may include a projection that protrudes upward from its inner end.

[0013] In one embodiment, the upper flap may include a first upper flap extending upward from the upper end of the side wall, and a second upper flap extending inward from the upper end of the side wall.

[0014] In one embodiment, an upper chamber can be formed between the first upper flap, the second upper flap, and the carrier head, with reference to the state in which the first upper flap and the second upper flap are connected to the carrier head.

[0015] In one embodiment, the substrate polishing apparatus may further include a second pressurizing unit configured to adjust the internal pressure of the upper chamber in order to adjust the position of the bottom flap along the vertical direction or the degree to which the bottom flap contacts the substrate.

[0016] In one embodiment, the length of the bottom flap extending inward from the lower end of the side wall may be smaller than the length of the second upper flap extending inward from the upper end of the side wall.

[0017] In one embodiment, the first upper flap may include a folded portion that is formed by folding so as to be able to expand and contract vertically.

[0018] A membrane for connection to a carrier head according to one embodiment may include an annularly formed side wall; a bottom flap extending inward from the lower end of the side wall and in direct contact with the substrate; and an upper flap extending from the upper end of the side wall and for connection to the carrier head.

[0019] In one embodiment, the bottom flap may extend a predetermined length from the lower end of the side wall toward the center of the membrane such that a hollow is formed on the bottom surface of the membrane.

[0020] In one embodiment, the bottom flap may include a protrusion protruding upward from the inner end.

[0021] In one embodiment, the upper flap may include a first upper flap extending in an upward direction from the upper end of the side wall; and a second upper flap extending in an inner direction from the upper end of the side wall.

[0022] In one embodiment, the length by which the bottom flap extends in an inner direction from the lower end of the side wall may be smaller than the length by which the second upper flap extends in an inner direction from the upper end of the side wall.

[0023] In one embodiment, the first upper flap may include a bent portion formed by being bent so as to be vertically expandable and contractible.

Advantages of the Invention

[0024] According to one embodiment, the contact area between the membrane and the substrate can be minimized, and damage that may occur on the pattern surface of the substrate during back grinding of the substrate can be minimized.

[0025] According to one embodiment, the membrane and the substrate contact each other only at the outermost contour portion, and pressure can be transmitted to the substrate through a pressurization chamber formed between the membrane and the substrate.

[0026] The effects of the membrane according to one embodiment and the substrate polishing apparatus including the same are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

Brief Description of the Drawings

[0027] [Figure 1] It is a schematic perspective view of a substrate polishing apparatus according to one embodiment. [Figure 2] It is a schematic cross-sectional view of a substrate polishing apparatus according to one embodiment. [Figure 3] It is a perspective view of a membrane according to one embodiment. [Figure 4] This is a partial cross-sectional view of a substrate polishing apparatus according to one embodiment, and is a cross-sectional view of the position corresponding to part B in Figure 2. [Figure 5] This is a partial cross-sectional view of a substrate polishing apparatus according to one embodiment, and is a cross-sectional view of the position corresponding to part B in Figure 2. [Modes for carrying out the invention]

[0028] Examples are described in detail below with reference to the attached drawings. However, since various modifications can be made to the examples, the scope of the patent application is not limited or restricted by such examples. All modifications, equivalents, or substitutions to the examples should be understood to be included within the scope of the patent.

[0029] The terms used in the examples are for illustrative purposes only and should not be interpreted as limiting. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “includes” or “having” are intended to specify the existence of features, figures, stages, operations, components, parts, or combinations thereof described in the specification, and should not be understood as preemptively excluding the possibility of the existence or addition of one or more other features, figures, stages, operations, components, parts, or combinations thereof.

[0030] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person of ordinary skill in the art to which the examples belong. Terms as defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not as ideal or overly formal unless expressly defined herein.

[0031] Furthermore, when explaining with reference to the attached drawings, the same reference numerals will be used for the same components regardless of the reference numerals in the drawings, and redundant explanations will be omitted. When describing embodiments, if it is determined that a specific explanation of related prior art may unnecessarily obscure the gist of the embodiment, such detailed explanation will be omitted.

[0032] Furthermore, when describing the components of the embodiments, terms such as 1st, 2nd, A, B, (a), (b), etc., may be used. Such terms are merely for distinguishing a component from other components, and do not limit the nature, order, or sequence of the component in question. When it is stated that a component is “connected,” “joined,” or “connected” to another component, it should be understood that while that component may be directly connected or connected to other components, other components may also be “connected,” “joined,” or “connected” between each component.

[0033] Components included in any one embodiment and components with common functions will be described using the same names in the other embodiments. Unless otherwise stated, the descriptions in any one embodiment may also apply to the other embodiments, and specific descriptions will be omitted to the extent of duplication.

[0034] Figure 1 is a schematic perspective view of a substrate polishing apparatus according to one embodiment.

[0035] Referring to Figure 1, the substrate polishing apparatus (1) according to one embodiment may be an apparatus for polishing a substrate. For example, the substrate polishing apparatus (1) may be used in the CMP (Chemical Mechanical Polishing) process of a substrate.

[0036] In one embodiment, the substrate may be a silicon wafer for semiconductor device manufacturing. However, the type of substrate is not limited thereto. For example, the substrate may include glass for flat panel display devices (FPDs) such as LCDs (liquid crystal displays) or PDPs (plasma display panels).

[0037] In one embodiment, the substrate polishing apparatus (1) may include a substrate carrier (10), a platen (20), a first pressurizing section (e.g., 31 in Figure 2), and a second pressurizing section (e.g., 32 in Figure 2).

[0038] In one embodiment, the substrate carrier (10) can grip a substrate. The substrate carrier (10) can chucking and grip the substrate and move the gripped substrate upward toward the polishing pad (P). The substrate carrier (10) can perform polishing of the substrate by bringing the substrate, which has been moved upward toward the polishing pad (P), into contact with the polishing pad (P). The substrate carrier (10) can adjust the degree of polishing of the substrate by adjusting the frictional force between the substrate and the polishing pad (P) by applying pressure to the substrate that is in contact with the polishing pad (P).

[0039] In one embodiment, the substrate carrier (10) can adjust the position of the substrate. The substrate carrier (10) can rotate about an axis perpendicular to the surface of the polishing pad (P). The substrate held by the substrate carrier (10) can be polished while rotating in contact with the polishing pad (P) due to the rotation of the substrate carrier (10).

[0040] In one embodiment, the substrate carrier (10) can move the substrate horizontally. By moving the substrate carrier (10) horizontally, the substrate can be transported to or removed from the polishing position.

[0041] In one embodiment, the substrate carrier (10) can move the substrate vertically relative to the ground. The substrate carrier (10) can move vertically relative to the substrate support for chucking / dechucking the substrate, or vertically relative to the polishing pad (P) for polishing the substrate.

[0042] In one embodiment, a polishing pad (P) can be attached to the platen (20). For example, the polishing pad (P) can be attached to the upper part of the platen (20). The platen (20) can polish the surface of the substrate that is in contact with the polishing pad (P) while rotating around its axis.

[0043] Figure 2 is a schematic cross-sectional view of a substrate polishing apparatus according to one embodiment. Figure 3 is a perspective view of a membrane according to one embodiment. Figures 4 and 5 are partial cross-sectional views of a substrate polishing apparatus according to one embodiment, and are cross-sectional views of the position corresponding to part B in Figure 2.

[0044] Referring to Figures 2 to 5, the substrate carrier (10) according to one embodiment may include a carrier head (11), a retainer ring (13), and a membrane (40).

[0045] In one embodiment, the carrier head (11) can form at least a portion of the appearance of the substrate carrier (10). Various components of the substrate carrier (10) can be connected to and / or arranged on the carrier head (11). The carrier head (11) may be configured to be rotatable with respect to a central axis (A).

[0046] In one embodiment, the retainer ring (13) may be connected to the bottom of the carrier head (11) so as to surround the membrane (40) from the outside. The retainer ring (13) can surround the substrate (W) held by the membrane (40) from the outside. The retainer ring (13) can prevent the substrate (W) from detaching from its gripped position. For example, the retainer ring (13) can support the sides of the substrate (W) so as not to detach the substrate (W) from the substrate carrier (10) due to vibrations and / or friction that occur during the polishing process.

[0047] In one embodiment, the membrane (40) may be connected to the lower part of the carrier head (11). The membrane (40) may be configured to grip the substrate (W). The membrane (40) may be made of an elastically deformable material. For example, the membrane (40) may be used to grip the substrate (W) when polishing the rear surface of the substrate (W). The rear surface of the substrate (W) may mean the surface opposite the patterned surface of the substrate (W).

[0048] In one embodiment, the membrane (40) may include side walls (41), a bottom flap (42), and an upper flap (43). The membrane (40) may be configured to contact only a portion of the substrate (W). For example, the membrane (40) may be formed in a ring shape with a hollow (O) in the center so as to contact only the outermost portion of the substrate (W).

[0049] In one embodiment, the side wall (41) may be formed in an annular shape. The side wall (41) may be formed to have a substantially vertical orientation. Support rings (50) may be coupled to the inside and / or outside of the side wall (41). For example, an inner support ring (51) may be coupled to the inside of the side wall (41). For example, an outer support ring (52) may be coupled to the outside of the side wall (41). Grooves may be formed in the side wall (41) for coupling the inner support ring (51) and / or the outer support ring (52).

[0050] In one embodiment, the bottom flap (42) may extend substantially inward from the lower end of the side wall (41). For example, the bottom flap (42) may extend substantially horizontally. The bottom flap (42) may be a portion for direct contact with the substrate (W). The bottom flap (42) may extend a predetermined length from the lower end of the side wall (41) toward the center of the membrane (40) so as to form a hollow on the bottom surface of the membrane (40). For example, the length of the bottom flap (42) extending inward from the lower end of the side wall (41) may be less than the length of the second upper flap (45), described later, extending inward from the upper end of the side wall (41). The bottom flap (42) may be in contact with the outermost portion of the substrate (W), as shown in Figure 5. The bottom flap (42) may include an upwardly projecting projection (421) at its inner end.

[0051] In one embodiment, the upper flap (43) may extend from the upper end of the side wall (41). The upper flap (43) may be a portion for connection with the carrier head (11). The upper flap (43) may include a first upper flap (44) and a second upper flap (45).

[0052] In one embodiment, the first upper flap (44) may extend substantially upward (e.g., vertically) from the upper end of the side wall (41). The second upper flap (45) may extend substantially inward (e.g., horizontally) from the upper end of the side wall (41). The first upper flap (44) and the second upper flap (45) may each include projections (441, 451) formed projecting from their ends. The membrane (40) may be connected to the carrier head (11) by fitting the projections (441, 451) of the first upper flap (44) and the second upper flap (45) into grooves formed in the carrier head (11).

[0053] In one embodiment, the first upper flap (44) may include a bent portion (442) that is formed by folding so as to be expandable and contractible in the vertical direction. The bent portion (442) may be formed by folding a portion of the first upper flap (44) substantially horizontally. For example, the bent portion (442) may include a first bent portion (4421) and a second bent portion (4422). The first bent portion (4421) may be the portion of the first upper flap (44) that is folded inward from the side wall (41), and the second bent portion (4422) may be the portion of the first upper flap (44) that is folded outward from the first bent portion (4421). The first upper flap (44) may expand and contract substantially vertically by moving the vertical distance between the first bent portion (4421) and the second bent portion (4422) closer together or further apart.

[0054] In one embodiment, as shown in Figures 4 and 5, an upper chamber (C2) may be formed between the first upper flap (44), the second upper flap (45), and the carrier head (11), with the first upper flap (44) and the second upper flap (45) connected to the carrier head (11). The upper chamber (C2) may mean the space enclosed by the first upper flap (44), the second upper flap (45), and the carrier head (11). However, this is merely illustrative, and the configuration surrounding the upper chamber (C2) is not limited thereto, and some configurations may be added or some of the above-described configurations may be omitted. The second pressurizing section (32) may be configured to adjust the internal pressure of the upper chamber (C2). By adjusting the internal pressure of the upper chamber (C2) with the second pressurizing section (32), the vertical position of the bottom flap (42) and / or the degree to which the bottom flap (42) contacts the substrate (W) can be adjusted. For example, when the internal pressure of the upper chamber (C2) is in its initial state, the bottom flap (42) may be positioned above the substrate (W), as shown in Figure 4. As the internal pressure of the upper chamber (C2) increases, the bottom flap (42) may move substantially downward, as the first upper flap (44) and the second upper flap (45) are deformed, as shown in Figure 5. Therefore, by adjusting the internal pressure of the upper chamber (C2), the bottom flap (42) can be moved downward and brought into contact with the substrate (W), and consequently, the degree to which the bottom flap (42) contacts the substrate (W) can be adjusted.

[0055] In one embodiment, as shown in Figures 2 and 5, a pressure chamber (C1) may be formed between the lower surface of the carrier head (11), the upper flap (43) (e.g., the second upper flap (45)), the side wall (41), the bottom flap (42), and the upper surface of the substrate (W), with reference to the state in which the substrate (W) is in contact with the lower surface of the bottom flap (42). The pressure chamber (C1) may mean the space enclosed by the lower surface of the carrier head (11), the upper flap (43) (e.g., the second upper flap (45)), the side wall (41), the bottom flap (42), and the upper surface of the substrate (W). However, this is merely illustrative, and the configuration surrounding the pressure chamber (C1) is not limited to this, and some configurations may be added or some of the above configurations may be omitted. The pressure chamber (C1) may be a single chamber. As the degree to which the bottom flap (42) contacts the substrate (W) increases, the space between the bottom flap (42) and the substrate (W) is sealed, allowing the pressurizing chamber (C1) to form a closed space substantially isolated from the outside space. The first pressurizing section (31) may be configured to adjust the internal pressure of the pressurizing chamber (C1). By adjusting the internal pressure of the pressurizing chamber (C1) with the first pressurizing section (31), the downward pressure applied to the substrate (W) can be adjusted. For example, in the state shown in Figure 5, by adjusting the internal pressure of the pressurizing chamber (C1), the pressure pressing the substrate (W) downward against the polishing pad (P) can be adjusted non-contactually. Thus, by adjusting the internal pressure of the pressurizing chamber (C1), the degree to which the substrate (W) is pressed downward against the polishing pad (P) can be adjusted non-contactually, and the degree to which the substrate (W) is polished can be adjusted. Furthermore, as the internal pressure of the pressurizing chamber (C1) increases, the degree to which the bottom flap (42) pressurizes the substrate (W) increases, thereby strengthening the sealing between the bottom flap (42) and the substrate (W).

[0056] With this structure, when polishing the rear surface of the substrate (W), the contact area between the membrane (40) and the substrate (W) is minimized, thereby minimizing damage to the pattern surface of the substrate (W). Furthermore, the degree to which the substrate (W) is pressed against the polishing pad (P) can be adjusted by adjusting the internal pressure of the pressure chamber (C1) and / or the upper chamber (C2), thereby adjusting the degree of polishing of the substrate (W).

[0057] As described above, although the embodiments are illustrated with limited drawings, a person with ordinary skill in the relevant art can apply a variety of technical modifications and variations based on the foregoing. For example, the described techniques may be performed in a different order than described, and / or the components of the described systems, structures, devices, circuits, etc. may be combined or assembled in a different manner than described, or substituted or replaced by other components or equivalents, and still the appropriate results may be achieved.

[0058] Therefore, other embodiments, other embodiments, and those equivalent to the claims described below also fall within the scope of the claims. [Explanation of Symbols]

[0059] 1 Substrate polishing equipment 10 substrate carriers 11 Career Head 13 Retainer Rings 40 membranes 41 Side wall 42 Bottom flap 43. Top flap

Claims

1. Career head; A membrane connected to the carrier head; and Includes a retainer ring connected to the carrier head so as to surround the outside of the membrane, The aforementioned membrane is Ring-shaped side walls; A bottom flap that extends inward from the lower end of the side wall and is a portion for direct contact with the substrate; and A substrate polishing apparatus, including an upper flap which extends from the upper end of the side wall and is connected to the carrier head.

2. The substrate polishing apparatus according to claim 1, wherein the bottom flap extends for a predetermined length from the lower end of the side wall toward the center of the membrane such that a hollow is formed on the bottom surface of the membrane.

3. The substrate polishing apparatus according to claim 2, wherein a pressure chamber is formed between the lower surface of the carrier head, the upper flap, the side wall, the bottom flap, and the upper surface of the substrate, based on the state in which the substrate is in contact with the lower surface of the bottom flap.

4. The substrate polishing apparatus according to claim 3, wherein the pressure chamber is formed as a single chamber.

5. The substrate polishing apparatus according to claim 3, further comprising a first pressurizing unit configured to adjust the internal pressure of the pressurizing chamber in order to adjust the downward pressure applied to the substrate.

6. The substrate polishing apparatus according to claim 1, wherein the bottom flap includes a projection that protrudes upward from its inner end.

7. The aforementioned upper flap is A first upper flap extending upward from the upper end of the side wall; and The substrate polishing apparatus according to claim 1, further comprising a second upper flap extending inward from the upper end of the side wall.

8. The substrate polishing apparatus according to claim 7, wherein an upper chamber is formed between the first upper flap, the second upper flap, and the carrier head, with reference to the state in which the first upper flap and the second upper flap are connected to the carrier head.

9. The substrate polishing apparatus according to claim 8, further comprising a second pressurizing unit configured to adjust the internal pressure of the upper chamber in order to adjust the position of the bottom flap along the vertical direction or the degree to which the bottom flap contacts the substrate.

10. The substrate polishing apparatus according to claim 7, wherein the length of the bottom flap extending inward from the lower end of the side wall is smaller than the length of the second upper flap extending inward from the upper end of the side wall.

11. The substrate polishing apparatus according to claim 7, wherein the first upper flap includes a bent portion formed by bending it so as to be able to extend and retract in the vertical direction.

12. In a membrane for connection to a carrier head, Ring-shaped side walls; A bottom flap that extends inward from the lower end of the side wall and is a portion for direct contact with the substrate; and A membrane including an upper flap which extends from the upper end of the side wall and is connected to a carrier head.

13. The membrane according to claim 12, wherein the bottom flap extends for a predetermined length from the lower end of the side wall toward the center of the membrane such that a hollow is formed on the bottom surface of the membrane.

14. The membrane according to claim 12, wherein the bottom flap includes a projection that protrudes upward from the inner end.

15. The aforementioned upper flap is A first upper flap extending upward from the upper end of the side wall; and The membrane according to claim 12, further comprising a second upper flap extending inward from the upper end of the side wall.

16. The membrane according to claim 15, wherein the length of the bottom flap extending inward from the lower end of the side wall is smaller than the length of the second upper flap extending inward from the upper end of the side wall.

17. The membrane according to claim 15, wherein the first upper flap includes a folded portion formed by folding so as to be expandable and contractible in the vertical direction.

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