Cover tape and packaging for electronic components

Abstract

To provide a cover tape for packaging electronic components that offers an improved balance between low haze characteristics and low tack force. [Solution] The system comprises a base layer and a sealant layer provided on one side of the base layer, with a sealant surface on the sealant layer side, and the arithmetic mean curvature Spc of the peak of the sealant surface, measured in accordance with ISO 25178-2:2012, is 6.0 × 10 2 / mm or more 1.7×10 3 A cover tape for packaging electronic components, wherein the thickness is less than or equal to / mm, and the level difference Sk of the core portion of the sealant surface, measured in accordance with ISO 25178-2:2012, is 0.5 μm or more and 1.8 μm or less.

Description

[Technical Field]

[0001] This invention relates to cover tapes for packaging electronic components and electronic component packaging bodies. [Background technology]

[0002] Electronic components such as transistors, diodes, capacitors, piezoelectric elements, and resistors are sometimes transported in the form of "electronic component packages," which are created by housing the electronic components in recesses formed in a carrier tape to prevent damage, and then heat-sealing a cover tape to the carrier tape to seal the electronic components within the recesses. These electronic component packages are often exported and imported across national borders by air or sea freight. When using packaged electronic components, the cover tape on the electronic component packaging is peeled off and the component is removed from the recess.

[0003] Patent Document 1 discloses an electronic component packaging that can reliably house electronic components and allows for the proper peeling of a cover tape, comprising: a carrier tape 10 having a main surface 11 and a plurality of housing recesses 12; a plurality of electronic components 40 each housed in the plurality of housing recesses 12; and a cover tape 20 joined to the main surface 11 so as to cover the plurality of housing recesses 12, wherein the joint portion 30 between the carrier tape 10 and the cover tape 20 is composed of two linear portions 31 spaced apart in the width direction of the carrier tape 10 with the plurality of housing recesses 12 in between, each extending in the longitudinal direction, and a plurality of intermediate portions 32 each located between adjacent housing recesses 12, and the peel resistance ratio α between the maximum and minimum peel resistance values ​​when the cover tape 20 is continuously peeled from the carrier tape 10 along the longitudinal direction is 1.0 or more and 2.0 or less.

[0004] Patent Document 2 discloses a heat seal film for packaging electronic components, with the aim of developing a heat seal film that can be cut into cover tape, has stable peel strength, excellent antistatic performance, does not contaminate electronic components, and has a transparent appearance, comprising: a base layer; at least one intermediate layer provided on the base layer, the intermediate layer comprising a mixture of 5 to 70% by weight of vinyl acetate copolymer, where the total weight of the intermediate layer is 100% by weight, and the vinyl acetate copolymer is composed of a vinyl acetate copolymer in which units derived from vinyl acetate constitute more than 10 mol% of the copolymer, 20 to 90% by weight of styrene butadiene copolymer, and 0 to 40% by weight of a conductive polymer; and at least one heat seal layer provided on the surface of the intermediate layer opposite to the base layer.

[0005] Patent Document 3 discloses a cover tape for taping packaging of electronic components, characterized in that it has stable heat-sealability to a carrier tape, good zip-up properties, and satisfies all functions of conductivity and transparency, and has a base film layer, a flexible material layer and a heat-adhesive layer laminated sequentially, the flexible material layer is linear low-density polyethylene, the heat-adhesive layer contains a thermoplastic resin and conductive fine particles, the content of conductive fine particles in the heat-adhesive layer is 150 to 500 by mass relative to 100 of the thermoplastic resin in the heat-adhesive layer, the thickness of the flexible material layer is 10 to 50 μm, and the thickness of the heat-adhesive layer is 0.05 to 1.9 μm. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2017-171393 [Patent Document 2] International Publication No. 2012 / 079258 [Patent Document 3] Japanese Patent Publication No. 2003-246358 [Overview of the project] [Problems that the invention aims to solve]

[0007] This invention provides a cover tape for packaging electronic components that offers an improved balance between low haze characteristics and low tack force. [Means for solving the problem]

[0008] The inventors diligently conducted research to achieve the above objectives. As a result, they found that the performance balance between low haze characteristics and low tack force is related to the surface shape of the cover tape for electronic component packaging. Based on this finding, the inventors further diligently conducted research and found that the performance balance between low haze characteristics and low tack force can be improved by setting the numerical value obtained when evaluating the surface shape of the cover tape for electronic component packaging with a specific surface roughness parameter within a predetermined range, thereby completing the present invention.

[0009] [1] The system comprises a base layer and a sealant layer provided on one side of the base layer. The sealant layer side has a sealant surface, The arithmetic mean curvature Spc of the ridge of the sealant surface, measured in accordance with ISO 25178-2:2012, is 6.0 × 10⁻⁶. 2 / mm or more 1.7×10 3 It is less than / mm, A cover tape for packaging electronic components, wherein the level difference Sk of the core portion of the sealant surface, measured in accordance with ISO 25178-2:2012, is 0.5 μm or more and 1.8 μm or less. [2] The cover tape for packaging electronic components according to [1], wherein the sealant layer comprises one or more selected from the group consisting of ethylene-vinyl acetate copolymer, (meth)acrylic resin, and styrene resin. [3] The cover tape for packaging electronic components according to [1] or [2], wherein the base material layer contains a polyester resin. [4] The cover tape for electronic component packaging according to any one of the above [1] to [3], further comprising an intermediate layer between the base material layer and the sealant layer. [5] The cover tape for electronic component packaging according to [4], wherein the intermediate layer contains one or more selected from the group consisting of a polyethylene-based resin and an ethylene-vinyl acetate copolymer. [6] The cover tape for electronic component packaging according to any one of the above [1] to [5], having an external haze of 74% or less measured by a light source D65 in accordance with JIS K 7136:2000. [7] The cover tape for electronic component packaging according to any one of the above [1] to [6], having a tack force by the following (Method 1) of 0 gf or more and 40 gf or less. (Method 1) A SUS probe with a contact area of 5 mmφ is pressed against the sealant surface of the cover tape for electronic component packaging at a pressing speed of 0.5 mm / second, then held for 20 seconds at a measurement temperature of 40°C and a pressing load of 2,500 gf, and then the measured value of the load when pulling up at a pulling speed of 10 mm / second is taken as the tack force (gf). [8] The cover tape for electronic component packaging according to any one of the above [1] to [7], used for a paper carrier. [9] Comprising a carrier having a recess, an electronic component housed in the recess, and the cover tape for electronic component packaging according to any one of the above [1] to [8], An electronic component package, wherein the sealant layer is adhered to the carrier so as to seal the electronic component.

[10] The electronic component package according to [9], wherein the carrier includes a paper carrier. [Advantages of the Invention] <​​​​​​

[0011] [Figure 1] This diagram schematically represents an example of the layer structure of cover tape. [Figure 2] This figure shows an example of the cover tape being adhered (heat-sealed) to the carrier tape. [Modes for carrying out the invention]

[0012] Embodiments of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and their descriptions are omitted where appropriate. Also, the drawings are schematic diagrams and do not correspond to the actual dimensional ratios. Furthermore, unless otherwise specified, the "~" indicating a numerical range represents "greater than or equal to" to "less than or equal to".

[0013] In this specification, the term "(meth)acrylic" refers to a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the surface of the cover tape on the sealant layer side may be referred to as the sealant surface. The surface of the cover tape on the substrate layer side may be referred to as the substrate surface.

[0014] [Cover tape for electronic component packaging] The cover tape for packaging electronic components of this embodiment (hereinafter also referred to simply as "cover tape" as appropriate) comprises a base layer and a sealant layer provided on one side of the base layer. The cover tape for packaging electronic components of this embodiment has a sealant surface on the sealant layer side. In the cover tape for packaging electronic components of this embodiment, the arithmetic mean curvature Spc of the peak of the sealant surface, measured in accordance with ISO 25178-2:2012 (hereinafter also referred to simply as "Spc" as appropriate), is 6.0 × 10⁻⁶. 2 / mm or more 1.7×10 3It is less than or equal to / mm. Furthermore, in the cover tape for packaging electronic components of this embodiment, the level difference Sk of the core portion of the sealant surface, measured in accordance with ISO 25178-2:2012 (hereinafter also referred to simply as "Sk" as appropriate), is 0.5 μm or more and 1.8 μm or less. By having the above configuration, we can provide a cover tape for electronic component packaging that has an improved performance balance between low haze characteristics and low tack force.

[0015] The reason for this is not entirely clear, but the following reasons can be inferred. The cover tape of this embodiment has a sealant surface Spc of 1.7 × 10 3 Because the thickness is less than / mm, it is thought that the surface irregularities of the sealant are rounded. Therefore, diffuse reflection of light that penetrates into the cover tape is less likely to occur, and the transparency (low haze characteristics) of the cover tape is thought to be improved. Furthermore, since the cover tape of this embodiment has a sealant surface Sk of 1.8 μm or less, it is considered that the height difference of the core portion in the unevenness of the sealant surface is not too large. Therefore, diffuse reflection of light that penetrates into the cover tape is less likely to occur, which is thought to contribute to the improvement of the transparency (low haze characteristics) of the cover tape. Furthermore, in the cover tape of this embodiment, if the Sk of the sealant surface is 0.5 μm or more and 1.8 μm or less, the height difference of the core portion in the unevenness of the sealant surface becomes of an appropriate size, which is thought to lead to a reduction in the tack force of the sealant layer.

[0016] Next, the specific structure of the cover tape for packaging electronic components according to this embodiment will be described with reference to the diagrams. Figure 1 schematically shows an example of the layer structure of the cover tape (cover tape 10) for packaging electronic components according to this embodiment. The cover tape 10 comprises a base layer 1 and a sealant layer 3 provided on at least one side of the base layer 1. Preferably, the cover tape 10 includes an intermediate layer 2 between the base layer 1 and the sealant layer 3. The cover tape 10 has a sealant surface facing the sealant layer 3. In Figure 1, the sealant surface corresponds to the upper surface of the sealant layer 3. In this embodiment, the sealant surface is the surface that is heat-sealed and faces the surface of the carrier. Examples of the sealant surface include the surface of the sealant layer 3, or the surface of another layer laminated on the surface of the sealant layer 3. If the other layer is an antistatic layer, the antistatic layer is thinner than the sealant layer 3, so the influence of the antistatic layer on the surface roughness parameter (e.g., Spc or Sk) on the sealant surface is small.

[0017] The overall thickness of the cover tape is preferably 1 μm to 100 μm, more preferably 10 μm to 90 μm, even more preferably 20 μm to 80 μm, even more preferably 30 μm to 70 μm, even more preferably 40 μm to 60 μm, and even more preferably 45 μm to 55 μm, from the viewpoint of improving the balance between strength and handling performance.

[0018] Next, specific examples of the components of the cover tape in this embodiment will be given.

[0019] <Base material layer> The material constituting the base layer is not particularly limited. Any film can be used as the base layer material, as long as it has sufficient mechanical strength to withstand the external forces applied to the cover tape and sufficient heat resistance to withstand the heat during heat sealing.

[0020] The base layer includes, for example, one or more materials selected from the group consisting of polyester resins, polyamide resins, polyolefin resins, (meth)acrylic resins, polyimide resins, polycarbonate resins, and ABS resins. From the viewpoint of improving the mechanical strength of the cover tape, the base layer preferably contains one or more selected from the group consisting of polyester resins and polyolefin resins, more preferably contains a polyester resin, and even more preferably contains polyethylene terephthalate.

[0021] The film used to form the base layer is, for example, a stretched film. From the viewpoint of improving the mechanical strength of the cover tape, the film used to form the base layer is preferably a film stretched in one or two axes.

[0022] The base layer may be a single layer or a multi-layer layer.

[0023] The base layer preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. Furthermore, an antistatic layer may be provided on the base material surface of the cover tape as one of the base material layers.

[0024] The thickness of the base layer is preferably 100 μm or less, more preferably 50 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, even more preferably 30 μm or less, even more preferably 28 μm or less, and even more preferably 26 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the possibility of the cover tape peeling off. Furthermore, the thickness of the base layer is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, even more preferably 15 μm or more, even more preferably 20 μm or more, even more preferably 22 μm or more, and even more preferably 24 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, the possibility of the cover tape breaking can be reduced even if the cover tape is peeled off from the carrier tape at high speed. The thickness of the base layer is preferably 1 μm to 100 μm, more preferably 5 μm to 50 μm, even more preferably 10 μm to 40 μm, even more preferably 15 μm to 35 μm, even more preferably 20 μm to 30 μm, even more preferably 22 μm to 28 μm, and even more preferably 24 μm to 26 μm, from the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape.

[0025] <Middle class> The intermediate layer is provided to improve the cushioning properties of the cover tape. Improved cushioning allows the pressure from the sealing iron to be more easily transferred to the cover tape during heat sealing. This improves the adhesion between the cover tape and the carrier tape. The intermediate layer is located between the substrate layer and the sealant layer.

[0026] The material of the intermediate layer is not particularly limited. Any material that can provide cushioning to the cover tape can be used without any particular restrictions.

[0027] The intermediate layer includes, for example, one or more selected from the group consisting of polyethylene resins, ethylene-vinyl acetate copolymers, (meth)acrylic resins, polyvinyl acetate derivatives, styrene resins, polyolefin resins, and cyclic olefin resins. The intermediate layer preferably comprises one or more materials selected from the group consisting of polyethylene resins and ethylene-vinyl acetate copolymers, from the viewpoint of improving the cushioning properties of the cover tape, and more preferably ethylene-vinyl acetate copolymer and low-density polyethylene (for example, density 880 kg / m³). 3 More than 930kg / m 3 It comprises one or more selected from the group consisting of polyethylene (less than 100%), and more preferably comprises an ethylene-vinyl acetate copolymer.

[0028] The intermediate layer may be a single layer or a multi-layered layer.

[0029] The thickness of the intermediate layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, even more preferably 4 μm to 50 μm, even more preferably 5 μm to 40 μm, even more preferably 8 μm to 25 μm, and even more preferably 10 μm to 20 μm, from the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing.

[0030] <Sealant layer> The sealant layer is provided on at least one side of the substrate layer. If an intermediate layer is present, the sealant layer is provided on the side of the intermediate layer opposite to the side in contact with the substrate layer. The sealant layer comes into contact with the carrier tape when the cover tape is heat-sealed to the carrier tape. Heating with a sealing iron softens or melts the sealant layer, causing it to adhere to the carrier tape.

[0031] The sealant layer includes, for example, a thermoplastic resin. The thermoplastic resin includes, for example, one or more selected from the group consisting of ethylene-vinyl acetate copolymer, (meth)acrylic resin, styrene resin, polyvinyl acetate derivative, olefin resin, urethane resin, and ester resin. The sealant layer preferably contains one or more selected from the group consisting of ethylene-vinyl acetate copolymer, (meth)acrylic resin, and styrene resin, and more preferably contains ethylene-vinyl acetate copolymer, from the viewpoint of improving heat sealability with the carrier tape.

[0032] The sealant layer may be a single layer or multiple layers.

[0033] From the viewpoint of improving heat sealability, the thickness of the sealant layer is preferably 0.1 μm to 100 μm, more preferably 0.5 μm to 50 μm, even more preferably 1 μm to 40 μm, even more preferably 2 μm to 30 μm, even more preferably 3 μm to 25 μm, and even more preferably 4 μm to 20 μm.

[0034] The sealant layer includes, for example, a tackifier. The tackifier includes, for example, one or more selected from the group consisting of petroleum resins, rosin resins, terpene resins, styrene resins, and coumarone-indene resins.

[0035] Examples of petroleum resin-based tackifiers include aliphatic petroleum resins, aromatic petroleum resins, and aliphatic-aromatic copolymer petroleum resins. Commercially available products include, for example, the "Alcon" series of hydrogenated petroleum resins manufactured by Arakawa Chemical Industries, Ltd.

[0036] Examples of commercially available styrene resin-based tackifiers include the "FTR" (registered trademark) series, an aromatic hydrocarbon resin manufactured by Mitsui Chemicals, Inc. The FTR series is a tackifier that contains styrene-containing block copolymers (such as styrene-olefin block copolymers and styrene-diene block copolymers) as components, such as styrene-isobutylene block rubber and styrene-butadiene block rubber.

[0037] When the sealant layer contains a tackifier, the content of the tackifier in the sealant layer is preferably 1% to 30% by mass, more preferably 2% to 25% by mass, even more preferably 4% to 20% by mass, even more preferably 6% to 15% by mass, and even more preferably 8% to 12% by mass, from the viewpoint of improving the balance between the resistance to adhesion of electronic components and the heat sealability to the carrier tape, when the entire sealant layer is considered as 100% by mass.

[0038] The sealant layer may contain any additives such as antistatic agents, antiblocking agents, slip agents, lubricants, plasticizers, antioxidants, UV absorbers, colorants, surfactants, and inorganic fillers, to the extent that they do not impair its properties. Furthermore, the surface of the sealant layer may be coated with these additives.

[0039] <Other layers> The cover tape may have additional layers in addition to the layers described above. For example, if the cover tape does not have an intermediate layer between the base layer and the sealant layer, the cover tape may have an adhesive layer between the base layer and the sealant layer. Also, if the cover tape has an intermediate layer between the base layer and the sealant layer, the cover tape may have an adhesive layer between the base layer and the intermediate layer or between the intermediate layer and the sealant layer. Furthermore, if the cover tape has an intermediate layer between the base layer and the sealant layer, the cover tape may have adhesive layers both between the base layer and the intermediate layer and between the intermediate layer and the sealant layer.

[0040] As the material for forming the adhesive layer, for example, various known solvent-based or water-based anchor coating agents can be used. The anchor coating agent includes, for example, one or more selected from the group consisting of isocyanate-based anchor coating agents, polyurethane-based anchor coating agents, polyester-based anchor coating agents, polyethyleneimine-based anchor coating agents, polybutadiene-based anchor coating agents, polyolefin-based anchor coating agents, and alkyl titanate-based anchor coating agents.

[0041] Furthermore, by performing corona treatment on the substrate layer, the adhesion between the substrate layer and other layers can be improved. This corona treatment can be carried out by appropriately selecting known conditions.

[0042] In addition, the cover tape for packaging electronic components according to this embodiment may further include an antistatic layer (conductive layer) separate from the base layer, intermediate layer, and sealant layer. The cover tape may further include an antistatic layer on, for example, the base surface, the sealant surface, or both the base surface and the sealant surface. The thickness of the antistatic layer is, for example, 1 μm or less.

[0043] <Shape of cover tape> The width and length of the cover tape can be set as appropriate, primarily according to the width and length of the carrier tape. The width of the cover tape is, for example, 1 mm or more and 100 mm or less. Also, the length of the cover tape is, for example, 100 m or more and 30,000 m or less.

[0044] <Physical properties of the cover tape> Next, the physical properties of the cover tape will be described.

[0045] Regarding the cover tape of this embodiment, the arithmetic mean curvature Spc of the peak points measured on the sealant surface in accordance with ISO 25178-2:2012 will be described.

[0046] The Spc of the cover tape of this embodiment is 6.0×10 2 / mm or more and 1.7×10 3 / mm or less from the viewpoint of improving the performance balance between low haze characteristics and low tack force, preferably 6.2×1— 2 / mm or more and 1.6×10 3 / mm or less, more preferably 6.4×10 2 / mm or more and 1.5×10 3 / mm or less, even more preferably 6.6×10 2 / mm or more and 1.4×10 3 / mm or less, even more preferably 6.8×10 2 / mm or more and 1.3×10 3 / mm or less.

[0047] Spc can be adjusted, for example, by adjusting the manufacturing conditions of the cover tape, the types of each layer of the cover tape, etc. Specifically, Spc can be adjusted, for example, by adjusting the surface roughness of the cooling roll used when forming the sealant layer, the magnitude of the pressing pressure (touch pressure), etc. Note that, for example, the method described in the examples can be adopted as the measurement method of Spc.

[0048] Regarding the cover tape of this embodiment, the level difference Sk of the core part measured on the sealant surface in accordance with ISO 25178-2:2012 will be described.

[0049] The Sk of the cover tape in this embodiment is 0.5 μm to 1.8 μm, preferably 0.7 μm to 1.8 μm, more preferably 0.8 μm to 1.8 μm, even more preferably 0.9 μm to 1.7 μm, and even more preferably 1.0 μm to 1.7 μm, from the viewpoint of improving the performance balance between low haze characteristics and low tack force.

[0050] Sk can be adjusted, for example, by adjusting the manufacturing conditions of the cover tape, the types of each layer of the cover tape, etc. Specifically, Sk can be adjusted, for example, by adjusting the surface roughness of the cooling roll used when forming the sealant layer, the magnitude of the pressing pressure (touch pressure), etc. For example, the method used in the examples can be employed for measuring Sk.

[0051] Regarding the cover tape of this embodiment, the external haze measured with a light source D65 in accordance with JIS K 7136:2000 will be described.

[0052] From the viewpoint of further improving the low-haze characteristics, the external haze of the cover tape in this embodiment is preferably 74% or less, more preferably 72% or less, even more preferably 70% or less, even more preferably 68% or less, even more preferably 66% or less, and even more preferably 64% or less. There are no particular restrictions on the lower limit of the external haze; for example, it may be 5% or more, 10% or more, 15% or more, or 20% or more. From the viewpoint of further improving the low-haze characteristics, the external haze of the cover tape in this embodiment is preferably 5% to 74%, more preferably 5% to 72%, even more preferably 5% to 70%, even more preferably 10% to 68%, even more preferably 15% to 66%, and even more preferably 20% to 64%. Furthermore, the method for measuring the external haze can be, for example, the method described in the examples.

[0053] The tack force of the cover tape of this embodiment will be explained below (Method 1).

[0054] The tack force of the cover tape in this embodiment is preferably 40 gf or less, more preferably 30 gf or less, even more preferably 25 gf or less, even more preferably 20 gf or less, even more preferably 18 gf or less, and even more preferably 16 gf or less, from the viewpoint of reducing the adhesion of electronic components to the cover tape. There are no particular restrictions on the lower limit of the tack force; for example, it may be 0gf or higher, 2gf or higher, or 4gf or higher. The tack force of the cover tape in this embodiment is preferably 0gf to 40gf, more preferably 0gf to 30gf, even more preferably 2gf to 25gf, even more preferably 2gf to 20gf, even more preferably 4gf to 18gf, and even more preferably 4gf to 16gf, from the viewpoint of reducing the adhesion of electronic components to the cover tape.

[0055] (Method 1) A SUS probe with a contact area of ​​5 mm in diameter is pressed against the sealant surface of the cover tape at a pressing speed of 0.5 mm / second. Then, it is held for 20 seconds at a measurement temperature of 40°C and a pressing load of 2,500 gf. Next, the measured load when lifting at a lifting speed of 10 mm / second is defined as the tack force (gf). More specifically, the method for measuring tack force can be the one described in the examples.

[0056] <Uses of cover tape> Next, I will explain the uses of cover tape. The cover tape of this embodiment can be used with various carriers because it improves the balance between low haze characteristics and low tack force. In particular, the cover tape of this embodiment can be used with paper carriers.

[0057] <How to manufacture cover tape> The method for manufacturing the cover tape of this embodiment is not particularly limited. For example, it can be manufactured by applying an extrusion method, a lamination method, a coating method, or the like. As an example, the cover tape of this embodiment can be manufactured by an extrusion lamination method.

[0058] More specifically, the cover tape of this embodiment can be manufactured by following the steps (1) to (4) below. Step (1): Prepare a film corresponding to the base layer. Step (2): A layer corresponding to the intermediate layer is formed on one side of the film prepared in Step (1) by extrusion lamination. This results in a two-layer film consisting of a base layer and an intermediate layer. Step (3): On the surface of the two-layer film obtained in step (2) where the intermediate layer is exposed, a layer corresponding to a sealant layer is formed by extrusion lamination. This results in a three-layer film. Step (4): If necessary, cut the resulting three-layer film to an appropriate length and width.

[0059] In the extrusion lamination of step (2), a layer corresponding to the intermediate layer is formed on one side of the film corresponding to the base layer using a molten resin material. The resin material includes, for example, the resins and various additives listed in the <Intermediate Layer> section. If the resin material contains two or more materials, it is preferable that they be properly mixed (in a molten state) before forming the layer corresponding to the intermediate layer.

[0060] In step (3), the extrusion lamination, a layer equivalent to a sealant layer is formed on the surface of the two-layer film where the intermediate layer is exposed, using a molten resin material. The resin material includes, for example, the resins and various additives listed in the <Sealant Layer> section. If the resin material contains two or more materials, it is preferable that they be properly mixed (in a molten state) before forming the layer equivalent to the sealant layer.

[0061] Furthermore, in the extrusion lamination of step (3), it is preferable to press the sealant layer against a cooling roll having protrusions on its surface to create irregularities on the surface of the sealant layer. This pressing can be done using a silicone rubber mat roll or the like, which is positioned opposite the cooling roll.

[0062] The maximum height Rz of the cooling roll surface, measured in accordance with JIS B 0601:2013 (hereinafter also referred to simply as "maximum height Rz" as appropriate), is preferably 3.5 μm or more and 6.0 μm or less.

[0063] The pressure applied (hereinafter also referred to as the touch pressure) is preferably 0.25 MPa or more and 0.35 MPa or less.

[0064] When the cooling roll is pressed against the surface, the temperature of the extruded sealant layer is preferably between 250°C and 350°C. Furthermore, the temperature of the cooling roll and the touch roll is preferably adjusted (cooled) to between 15°C and 25°C.

[0065] The extrusion temperature in steps (2) and (3) can be adjusted as appropriate. For example, it can be adjusted between 250°C and 350°C.

[0066] [Electronic component packaging] The electronic component packaging of this embodiment comprises a carrier having a recess, an electronic component housed in the recess, and the cover tape of this embodiment. In other words, the electronic component packaging of this embodiment comprises a carrier in which the electronic component is housed in the recess, and the cover tape of this embodiment. In the electronic component packaging of this embodiment, the sealant surface is adhered to the carrier so as to encapsulate the electronic component.

[0067] In this embodiment, the shape and material of the carrier in the electronic component packaging are not particularly limited. In the electronic component packaging of this embodiment, the carrier includes, for example, a carrier tape or a carrier sheet. Furthermore, in the electronic component packaging of this embodiment, the carrier includes a paper carrier.

[0068] For example, an electronic component package can be obtained from the cover tape of this embodiment and a carrier tape in which the electronic component is housed in a recess. This will be explained with reference to Figure 2.

[0069] In Figure 2, the cover tape 10 is used as a lid material for a strip-shaped carrier tape 20, which has a series of concave pockets 21 arranged to match the shape of electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereafter, the structure obtained by adhering the cover tape 10 and the carrier tape 20 will be referred to as the electronic component packaging 100.

[0070] The electronic component packaging 100 can be manufactured, for example, by following the procedure below. First, the electronic components are placed inside the pockets 21 of the carrier tape 20. Next, the cover tape 10 is heat-sealed to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is made to be in contact with the carrier tape 20 (that is, the heat sealing is performed so that the "back surface" of the cover tape 10 in Figure 2 becomes the sealant layer 3). The specific method or conditions for heat sealing are not particularly limited, as long as the cover tape 10 is sufficiently strongly adhered to the carrier tape 20. Heat sealing can be performed, for example, using a known heat sealing machine, within the range of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0071] As a result, a structure (electronic component packaging 100) in which electronic components are sealed and housed is obtained. This structure (electronic component packaging 100) can store electronic components until use, for example, while they are wound on a reel. Furthermore, the electronic component packaging 100, while wound on a reel, can be used to transport electronic components to remote locations by sea or air freight. Reels include, for example, metal reels, paper reels, plastic reels, and so on.

[0072] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the electronic components that were housed in it are removed. The electronic components housed within the electronic component packaging 100 are not particularly limited, but include, for example, semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and other components used in the manufacture of electrical and electronic equipment.

[0073] The embodiments of the present invention have been described above, but these are merely examples, and various other configurations can also be adopted. Furthermore, the present invention is not limited to the embodiments described above, and any modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention. [Examples]

[0074] This embodiment will be described in detail below with reference to examples and other relevant information. However, this embodiment is not limited in any way to the descriptions of these examples.

[0075] First, the materials used for the cover tape in each example are shown. Biaxially oriented polyester film: E7415 (manufactured by Toyobo Co., Ltd., film thickness 25 μm) (hereinafter also referred to as PET1). Low-density polyethylene: Sumikasen L705 (manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter also referred to as LDPE.) Ethylene-vinyl acetate copolymer: UltraCene 537 (manufactured by Tosoh Corporation, vinyl acetate group content: 6% by mass) (hereinafter also referred to as EVA1). Ethylene-vinyl acetate copolymer: UltraCene 625 (manufactured by Tosoh Corporation, vinyl acetate group content: 15% by mass) (hereinafter also referred to as EVA2). Tackifier: Alcon P-100 (manufactured by Arakawa Chemical Industries, Ltd.) Surfactant: Nonionic surfactant (Kao Corporation, Electro Stripper TS-7B) (hereinafter also referred to as surfactant 1).

[0076] Next, cover tapes for each example were manufactured using the following manufacturing method. The composition of the cover tapes was as shown in Table 1. <Example 1> The cover tape of Example 1 was manufactured by following the procedure below. A PET1 substrate with a thickness of 25 μm was prepared. An intermediate layer was formed on one side of this substrate by extrusion lamination, depositing EVA1 to a thickness of 20 μm at an extrusion temperature of 300°C. A laminated film was obtained in this manner. Next, 90 parts by mass of EVA1 and 10 parts by mass of a tackifier were prepared, and a molten mixture 1 was obtained by melting and mixing the EVA1 and the tackifier. Next, molten mixture 1 was extruded onto the formed intermediate layer using an extrusion lamination method at an extrusion temperature of 280°C to form a film with a thickness of 5 μm. Immediately afterward, the surface of the sealant layer was roughened by rotating the cooling rolls, which had protrusions with a maximum height Rz of 4.0 μm on the sealant layer side and a silicone rubber mat roll on the substrate layer side, while applying a touch pressure of 0.3 MPa. At this time, the temperature of the cooling rolls was set to 20°C. Next, a dispersion prepared by dispersing surfactant 1 at a solid content of 1% by mass (total volume of dispersion is 100% by mass, dispersion medium: ethanol) was dried with a gravure roll, and the coating amount after drying was 0.5 g / m². 2 To achieve this, an antistatic layer was formed by coating the surface of the sealant layer.

[0077] <Example 2> The cover tape of Example 2 was manufactured using the following procedure. A PET1 substrate with a thickness of 25 μm was prepared. An intermediate layer was formed on one side of this substrate by extrusion lamination, depositing EVA1 to a thickness of 11 μm at an extrusion temperature of 300°C. A laminated film was thus obtained. Next, 90 parts by mass of EVA2 and 10 parts by mass of a tackifier were prepared, and a molten mixture 2 was obtained by melting and mixing the EVA2 and the tackifier. Next, the molten mixture 2 was extruded onto the surface of the deposited intermediate layer by extrusion lamination at an extrusion temperature of 280°C, forming a film with a thickness of 16 μm. Immediately afterward, the surface of the sealant layer was roughened by rotating the cooling rolls, which had protrusions with a maximum height Rz of 5.5 μm on the sealant layer side and a silicone rubber mat roll on the substrate layer side, while applying a touch pressure of 0.3 MPa. At this time, the temperature of the cooling rolls was set to 20°C. Next, a dispersion prepared by dispersing surfactant 1 at a solid content of 1% by mass (total volume of dispersion is 100% by mass, dispersion medium: ethanol) was dried with a gravure roll, and the coating amount after drying was 0.5 g / m². 2 To achieve this, an antistatic layer was formed by coating the surface of the sealant layer.

[0078] <Comparative Example 1> The cover tape for Comparative Example 1 was manufactured using the following procedure. A PET1 substrate with a thickness of 25 μm was prepared. An intermediate layer was formed on one side of this substrate by extrusion lamination, depositing EVA1 to a thickness of 16 μm at an extrusion temperature of 300°C. A laminated film was thus obtained. Next, 90 parts by mass of EVA1 and 10 parts by mass of a tackifier were prepared, and a molten mixture 1 was obtained by melting and mixing the EVA1 and the tackifier. Next, molten mixture 1 was extruded onto the surface of the deposited intermediate layer by extrusion lamination at an extrusion temperature of 280°C to form a film with a thickness of 10 μm. Immediately afterward, the surface of the sealant layer was roughened by rotating the rolls while applying pressure of 0.3 MPa, using a cooling roll with protrusions of a maximum height Rz of 8.0 μm from the sealant layer side and a silicone rubber mat roll from the substrate layer side. The temperature of the cooling rolls was set to 20°C. Next, a dispersion prepared by dispersing surfactant 1 at a solid content of 1% by mass (total volume of dispersion is 100% by mass, dispersion medium: ethanol) was dried with a gravure roll, and the coating amount after drying was 0.5 g / m². 2 To achieve this, an antistatic layer was formed by coating the surface of the sealant layer.

[0079] <Comparative Example 2> The cover tape for Comparative Example 2 was manufactured using the following procedure. A PET1 substrate with a thickness of 25 μm was prepared. An intermediate layer was formed on one side of this substrate by extrusion lamination, depositing LDPE to a thickness of 20 μm at an extrusion temperature of 300°C. A laminated film was obtained in this manner. Next, 90 parts by mass of EVA2 and 10 parts by mass of a tackifier were prepared, and a molten mixture 2 was obtained by melting and mixing the EVA2 and the tackifier. Next, the molten mixture 2 was extruded onto the surface of the deposited intermediate layer by extrusion lamination at an extrusion temperature of 280°C, forming a film with a thickness of 5 μm. Immediately afterward, the surface of the sealant layer was roughened by rotating the cooling rolls, which had protrusions with a maximum height Rz of 2.0 μm on the sealant layer side and a silicone rubber mat roll on the substrate layer side, while applying a touch pressure of 0.2 MPa. At this time, the temperature of the cooling rolls was set to 20°C. Next, a dispersion prepared by dispersing surfactant 1 at a solid content of 1% by mass (total volume of dispersion is 100% by mass, dispersion medium: ethanol) was dried with a gravure roll, and the coating amount after drying was 0.5 g / m². 2 To achieve this, an antistatic layer was formed by coating the surface of the sealant layer.

[0080] <Comparative Example 3> The cover tape for Comparative Example 3 was manufactured using the following procedure. A PET1 substrate with a thickness of 25 μm was prepared. An intermediate layer was formed on one side of this substrate by extrusion lamination, depositing LDPE to a thickness of 15 μm at an extrusion temperature of 300°C. A laminated film was obtained in this manner. Next, 90 parts by mass of EVA1 and 10 parts by mass of a tackifier were prepared, and a molten mixture 1 was obtained by melting and mixing the EVA1 and the tackifier. Next, molten mixture 1 was extruded onto the formed intermediate layer using an extrusion lamination method at an extrusion temperature of 280°C to form a film with a thickness of 10 μm. Immediately afterward, the surface of the sealant layer was roughened by rotating the rolls while clamping it with a cooling roll equipped with protrusions with a maximum height Rz of 5.0 μm from the sealant layer side and a silicone rubber mat roll from the substrate layer side, with a touch pressure of 0.2 MPa. At this time, the temperature of the cooling rolls was set to 20°C. Next, a dispersion prepared by dispersing surfactant 1 at a solid content of 1% by mass (total volume of dispersion is 100% by mass, dispersion medium: ethanol) was dried with a gravure roll, and the coating amount after drying was 0.5 g / m². 2 To achieve this, an antistatic layer was formed by coating the surface of the sealant layer.

[0081] Next, the physical properties of the cover tape for each example were measured using the following method. The measurement results are shown in Table 1.

[0082] <Surface roughness of sealant surface> For each example of cover tape, the surface roughness of the sealant surface was measured using a Keyence VK-X3000 laser microscope. The analysis software included with the instrument was used. Specifically, the following indicators were measured to assess surface roughness. • Arithmetic mean curvature of the mountain peak measured in accordance with ISO 25178-2:2012 (Spc) • Core level difference (Sk) measured in accordance with ISO 25178-2:2012

[0083] <External haze of the cover tape> For each example of cover tape, external haze was measured using a Haze Meter NDH 2000 manufactured by Nippon Denshoku Kogyo Co., Ltd., with light source D65, in accordance with JIS K 7136:2000.

[0084] <Tackiness of cover tape> For each example of cover tape, the tack force of the sealant surface was measured using a tacking tester TAC-1000 manufactured by Resca Co., Ltd. A stainless steel (SUS) probe was pressed against the sealant surface under the following measurement conditions. The probe was then peeled vertically from the cover tape. The peak load applied during this peeling was used as the tack force.

[0085] The details of the measurement conditions are as follows. • Probe diameter: 5mmφ • Probe temperature: 40°C • Probe pressure speed: 0.5 mm / second • Load applied by the probe to the cover tape: 2,500 gf • Duration of pressure: 20 seconds • Probe removal speed: 10 mm / second [Table 1] [Explanation of Symbols]

[0086] 1 Base material layer 2. Middle Class 3. Sealant layer 10 Cover Tape 20 Carrier Tapes 21 pockets 100 Electronic component packaging

Claims

1. The system comprises a base layer and a sealant layer provided on one side of the base layer. The sealant layer side has a sealant surface, The arithmetic mean curvature Spc of the ridge of the sealant surface, measured in accordance with ISO 25178-2:2012, is 6.0 × 10⁻⁶. ２ / mm or more 1.7×10 ３ / mm or less, A cover tape for packaging electronic components, wherein the level difference Sk of the core portion of the sealant surface, measured in accordance with ISO 25178-2:2012, is 0.5 μm or more and 1.8 μm or less.

2. The cover tape for packaging electronic components according to claim 1, wherein the sealant layer comprises one or more selected from the group consisting of ethylene-vinyl acetate copolymer, (meth)acrylic resin, and styrene resin.

3. The cover tape for packaging electronic components according to claim 1 or 2, wherein the base layer contains a polyester resin.

4. The cover tape for packaging electronic components according to claim 1 or 2, further comprising an intermediate layer between the base material layer and the sealant layer.

5. The cover tape for packaging electronic components according to claim 4, wherein the intermediate layer comprises one or more selected from the group consisting of polyethylene resins and ethylene-vinyl acetate copolymers.

6. A cover tape for packaging electronic components according to claim 1 or 2, wherein the external haze measured with light source D65 in accordance with JIS K 7136:2000 is 74% or less.

7. The cover tape for packaging electronic components according to claim 1 or 2, wherein the tack force by the following method (Method 1) is 0 gf or more and 40 gf or less. (Method 1) A SUS probe with a contact area of ​​5 mmφ is pressed against the sealant surface of the electronic component packaging cover tape at a pressing speed of 0.5 mm / second. Then, it is held for 20 seconds at a measurement temperature of 40°C and a pressing load of 2,500 gf. The measured load when it is then pulled up at a pulling speed of 10 mm / second is defined as the tack force (gf).

8. A cover tape for packaging electronic components according to claim 1 or 2, used in a paper carrier.

9. The package comprises a carrier having a recess, an electronic component housed in the recess, and the cover tape for packaging electronic components according to claim 1 or 2. An electronic component package in which the sealant layer is bonded to the carrier to encapsulate the electronic component.

10. The electronic component packaging according to claim 9, wherein the carrier includes a paper carrier.

Images