Manufacturing methods for electronic components

Abstract

To provide a method for manufacturing electronic components that can be miniaturized. [Solution] A method for manufacturing an electronic component comprising a base body 110 having a first end face and a second end face opposite to each other in the longitudinal direction, and four sides connecting the first end face and the second end face, and external electrodes provided on each of the first end face and the second end face, comprising the steps of: immersing the base body 110 in a conductive paste layer 51 which is a precursor of the external electrodes from the first end face side; pulling the base body 110 out of the conductive paste layer 51 after it has been immersed in the conductive paste layer 51 from the first end face side; and moving the base body 110 relative to the conductive paste layer 51 in the in-plane direction of the first end face with respect to the conductive paste layer 51, with the first end face and the portions of the four sides near the first end face and the conductive paste layer 51 connected to each other by conductive paste 53 stretched from the conductive paste layer 51 as a result of the base body 110 being pulled out of the conductive paste layer 51.

Description

Technical Field

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[0001] This disclosure relates to a method for manufacturing electronic components.

Background Art

[0002] Conventionally, an electronic component including a substantially rectangular parallelepiped body portion in which a plurality of dielectric layers and internal electrode layers are alternately laminated, and external electrodes is known. The external electrodes are provided on a pair of end faces in the length direction of the body portion and on a part of each of the four side faces connecting the pair of end faces to each other. Japanese Patent Application Laid-Open No. 2006-319272 (Patent Document 1) discloses a method for manufacturing a multilayer ceramic capacitor as an example of such an electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, in electronic components such as multilayer ceramic capacitors, miniaturization has become an important issue. From the viewpoint of miniaturizing electronic components, it is required to configure the thickness of the external electrodes to be as small as possible.

[0005] Here, as an example of a method for reducing the thickness of the external electrodes provided on the four side faces of the above-described body portion, there is a method of precisely adjusting the viscosity of the conductive paste, which is a precursor of the external electrodes, and the wetting rate of the conductive paste with respect to the body portion. However, it is not easy to perform such precise adjustment.

[0006] Therefore, this disclosure has been made to solve the above-described problems, and an object thereof is to provide a method for manufacturing an electronic component capable of achieving miniaturization. [Means for solving the problem]

[0007] A method for manufacturing an electronic component according to the present disclosure is a method for manufacturing an electronic component comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and four sides connecting the first end face and the second end face, and external electrodes provided on each of the first end face and the second end face. The method for manufacturing an electronic component according to the present disclosure comprises the steps of: immersing the base body in a conductive paste layer which is a precursor of the external electrodes from the first end face side; pulling the base body out of the conductive paste layer after it has been immersed in the conductive paste layer from the first end face side; and moving the base body relative to the conductive paste layer in the in-plane direction of the first end face with respect to the conductive paste layer, with respect to the conductive paste layer, in a state where the first end face and the portions of the four sides closest to the first end face and the conductive paste layer are connected to each other by conductive paste stretched from the conductive paste layer. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a method for manufacturing electronic components that can be miniaturized. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method for multilayer ceramic capacitors according to the embodiment. [Figure 2] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 3] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 4] This is a flowchart showing the manufacturing method of a multilayer ceramic capacitor according to an embodiment. [Figure 5] Figure 4 is a detailed flow chart of step S8 in the manufacturing flow shown. [Figure 6]Figure 5 is a schematic front view illustrating steps S811 and S812 of the manufacturing flow shown. [Figure 7] This is a schematic front view illustrating step S812 of the manufacturing flow shown in Figure 5. [Figure 8] This is a schematic front view illustrating step S813 of the manufacturing flow shown in Figure 5. [Figure 9] This is a schematic front view illustrating step S814 of the manufacturing flow shown in Figure 5. [Figure 10] This is a schematic front view illustrating step S814 of the manufacturing flow shown in Figure 5. [Figure 11] This is a schematic plan view illustrating the direction of movement of the raw material in step S814 of the manufacturing flow shown in Figure 5. [Figure 12] This table shows the test results from the verification test. [Figure 13] This is a schematic plan view illustrating the direction of movement of the base body in the manufacturing method of a multilayer ceramic capacitor according to the first modified example. [Figure 14] This is a schematic front view illustrating step S813 of the manufacturing flow shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the second modified example. [Figure 15] This is a detailed flowchart of step S8 of the manufacturing flow shown in Figure 4, in the manufacturing method for a multilayer ceramic capacitor according to the third modified example. [Figure 16] This is a schematic front view illustrating process S814A of the manufacturing flow shown in Figure 15. [Modes for carrying out the invention]

[0010] The embodiments of this disclosure will be described in detail below with reference to the figures. The embodiments shown below exemplify a method for manufacturing multilayer ceramic capacitors as a method for manufacturing electronic components. The method for manufacturing electronic components according to the embodiments shown below can also be applied to the manufacturing of multilayer ceramic inductors or multilayer ceramic thermistors, etc.

[0011] In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and their descriptions are not repeated. In the drawings, the length direction of the body part is denoted by L, the width direction of the body part is denoted by W, and the stacking direction of the body part is denoted by T. The body part will be described in detail later.

[0012] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> FIG. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III of the multilayer ceramic capacitor shown in FIG. 1. First, referring to FIGS. 1 to 3, the configuration of the multilayer ceramic capacitor 100 manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the present embodiment will be described.

[0013] As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 100 according to the present embodiment includes a body part 110 and external electrodes.

[0014] The body part 110 has a substantially rectangular parallelepiped shape. The body part 110 has a first side surface 111 and a second side surface 112 that face each other in the stacking direction T, a third side surface 113 and a fourth side surface 114 that face each other in the width direction W orthogonal to the stacking direction T, and a first end surface 115 and a second end surface 116 that face each other in the length direction L orthogonal to the stacking direction T and the width direction W. These four side surfaces (that is, the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114) connect the first end surface 115 and the second end surface 116 to each other.

[0015] The size of the body part 110 is, for example, the dimension in the length direction L is 0.1 mm or more and 3.2 mm or less, the dimension in the width direction W is 0.05 mm or more and 1.6 mm or less, and the dimension in the stacking direction T is 0.05 mm or more and 1.6 mm or less. Note that the tolerance is taken into account in the above sizes.

[0016] The external electrode consists of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is provided on the first end face 115. The second external electrode 130 is provided on the second end face 116.

[0017] The first external electrode 120 includes an end-face side first external electrode 121 and a side-side first external electrode 122. The end-face side first external electrode 121 is a portion provided across the entire first end face 115. The side-side first external electrode 122 is a portion extending from the first end face 115 to the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114, respectively.

[0018] The second external electrode 130 includes an end-face side second external electrode 131 and a side-side second external electrode 132. The end-face side second external electrode 131 is a portion provided across the entire second end face 116. The side-side second external electrode 132 is a portion extending from the second end face 116 to the first side 111, the second side 112, the third side 113, and the fourth side 114, respectively.

[0019] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0020] The base electrode layer 160 includes at least one of a baked layer, a resin layer, and a thin film layer. In this embodiment, the base electrode layer 160 is composed of a baked layer.

[0021] The baked layer contains, for example, a metal component and a glass component. The metal component consists of one metal component selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal; for example, an alloy of Ag and Pd can be used. The glass component contains at least one of Si and Zn.

[0022] The baked layer may consist of a single layer or multiple stacked layers. The baked layer may be a layer baked after the conductive paste 53 is applied to the base part 110, or a layer fired simultaneously with the internal electrode layer 118. If the baked layer is a layer baked after the conductive paste 53 is applied to the base part 110, it is preferable that the baked layer contains a glass component. If the baked layer is a layer fired simultaneously with the internal electrode layer 118, it is preferable that the baked layer contains a dielectric. The conductive paste 53 and the internal electrode layer 118 will be described later.

[0023] The plating layer 170 is placed on the under electrode layer 160. The material constituting the plating layer 170 can be one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing this metal. As an example, the plating layer 170 can be made up of a layer of Ni and a layer of Sn laminated together.

[0024] Furthermore, a resin layer containing a metal filler may be provided between the base electrode layer 160, which is composed of a baked layer, and the plating layer 170. This resin layer can be formed by going through the same process as the process in which the base electrode layer 160 is formed in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, which will be described in detail later (see steps S811 to S815 in Figure 5 later).

[0025] The base body 110 has a plurality of internal electrode layers 118 and a plurality of dielectric layers 119 that are alternately stacked along the stacking direction T.

[0026] The multiple internal electrode layers 118 include multiple first internal electrode layers 118a and multiple second internal electrode layers 118b. The multiple first internal electrode layers 118a and multiple second internal electrode layers 118b are stacked alternately in the stacking direction T.

[0027] The first internal electrode layer 118a is drawn out to the first end face 115. The first end face 115 is covered by the first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn out to the second end face 116. The second end face 116 is covered by the second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0028] Although Figures 2 and 3 show examples in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, the number of each of the first internal electrode layers 118a and second internal electrode layers 118b is not particularly limited to seven.

[0029] The multiple dielectric layers 119 consist of an outer dielectric layer located between the first side surface 111 and the inner electrode layer 118 located on the first side surface 111 side in the stacking direction T, and between the second side surface 112 and the inner dielectric layer 118 located on the second side surface 112 side in the stacking direction T, and an inner dielectric layer located between adjacent inner electrode layers 118 in the stacking direction T.

[0030] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as its main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain a dielectric material of the same composition as the ceramic contained in the dielectric layer 119. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0031] Each of the multiple dielectric layers 119 is composed of a dielectric ceramic material, for example, a perovskite compound containing Ba and Ti as its main component. The dielectric layer 119 may also contain at least one additive selected from the group consisting of Si, Mg, Mn, V, Cr, and rare earth elements.

[0032] The base body portion 110 includes an inner layer portion C. The inner layer portion C has a capacitance by laminating in the lamination direction T a first internal electrode layer 118a at a portion facing a second internal electrode layer 118b adjacent in the lamination direction T and a second internal electrode layer 118b at a portion facing a first internal electrode layer 118a adjacent in the lamination direction T.

[0033] <B. Method for manufacturing a multilayer ceramic capacitor> FIG. 4 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. FIG. 5 is a detailed flowchart of step S8 in the manufacturing flow shown in FIG. 4. FIGS. 6 to 10 are schematic front views for explaining each step of the manufacturing flow shown in FIG. 5. FIG. 11 is a schematic plan view for explaining the moving direction of the base body portion in step S814 of the manufacturing flow shown in FIG. 5. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 100 according to the present embodiment will be described with reference to FIGS. 4 to 11.

[0034] First, as shown in FIG. 4, a ceramic dielectric slurry is prepared (step S1). Specifically, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving solution, etc. are dispersed and mixed. Thereby, a ceramic dielectric slurry is prepared.

[0035] The ceramic dielectric powder is, for example, perovskite dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder consists of, for example, at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or aqueous polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used individually or in mixtures of two or more. The ceramic dielectric slurry may be solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with dielectric raw materials dissolved in water.

[0036] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or microgravure coater and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0037] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet so as to have a predetermined pattern. This forms a mother sheet on which a predetermined internal electrode pattern is provided on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, and a binder, and is prepared to have a constant viscosity. PVA or PVB can be used as the binder. Screen printing, inkjet printing, or gravure printing can be used as methods for applying the conductive paste. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm to 0.8 μm. In addition to the mother sheet with the internal electrode pattern, a ceramic dielectric sheet that has not undergone step S3 is also prepared.

[0038] Next, multiple mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked so that the thickness is, for example, between 10 μm and 30 μm. On top of that, a predetermined number of mother sheets with an internal electrode pattern are stacked. The number of stacked mother sheets with an internal electrode pattern is, for example, between 1 and 1000. Furthermore, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked on top of that so that the thickness is, for example, between 10 μm and 30 μm. This constitutes a group of mother sheets.

[0039] Next, the mother sheets are pressed together to form a dielectric block (step S5). Specifically, the mother sheets are pressed together in the stacking direction by hydrostatic pressing or rigid pressing. This forms a dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, causing them to adhere closely to each other. In addition, a ceramic dielectric sheet of a certain thickness is placed and pressed as the outermost layer in the stacking direction. This protects the dielectric sheet on which the internal electrode pattern is formed.

[0040] Next, the dielectric block is divided to form chips (step S6). Specifically, the dielectric block is divided into multiple chips by cutting, dicing, or laser cutting to form a matrix. When dividing the dielectric block, it may be heated and softened before division.

[0041] Next, the chip is fired (step S7). Specifically, the heating of the chip causes the dielectric material and conductive material contained in the chip to be fired, forming the base body 110. The firing temperature is, for example, 900°C to 1300°C. The firing temperature is set appropriately in accordance with the dielectric material and conductive material.

[0042] Next, the external electrodes are formed (step S8). As shown in Figure 5, step S8 includes steps S81 to S83, which will be described below.

[0043] First, the first external electrode 120 is formed (step S81). Step S81 further includes steps S811 to S816, which will be described below.

[0044] First, as shown in Figures 5 and 6, a conductive paste layer 51, which is a precursor to the external electrode, is formed on the main surface of the flat plate portion 60 (step S811).

[0045] The conductive paste layer 51 is formed by a conductive paste 53 in which conductive particles are mixed with a binder, solvent, and dispersant, etc., and arranged in layers. The flat plate portion 60 is made of, for example, a metal material. The surface of the main surface of the flat plate portion 60 extends in the horizontal direction.

[0046] Next, as shown in Figures 5 to 7, the base body 110 is immersed in the conductive paste layer 51 (step S812).

[0047] In detail, first, the multiple base body parts 110 are held by the holding part 20 such that the first end face 115 of each base body part 110 faces the conductive paste layer 51. The holding part 20 is for holding the base body parts 110 such that one of the pair of end faces of the base body part 110 faces downward in the vertical direction. Note that in Figure 7 and Figures 8 to 10 described later, only one of the multiple base body parts 110 is shown.

[0048] The holding portion 20 includes a base layer 21 and an adhesive layer 22 provided on the main surface of the base layer 21. The base layer 21 is made of, for example, a metal material. The adhesive layer 22 is made of, for example, silicone rubber. In this embodiment, the base portion 110 is held by the holding portion 20 such that the second end face 116 of the base portion 110 is attached to the adhesive layer 22, causing the first end face 115 to face downward in the vertical direction.

[0049] An actuator 23 is attached to the holding part 20. Based on a signal from the control unit 90, the actuator 23 can move the holding part 20 in any direction. Specifically, the actuator 23 is driven so that the holding part 20 can move in three orthogonal axes: the length direction L, the width direction W, and the stacking direction T. The actuator 23 is composed of, for example, a servo motor, a stepping motor, or a robot cylinder, but the type of actuator 23 is not particularly limited to these.

[0050] The control unit 90 controls the operation of the actuator 23. The control unit 90 mainly consists of a CPU (Central Processing Unit) 91, a memory 92, and input / output devices (not shown) for inputting and outputting various signals. Note that the actuator 23, control unit 90, CPU 91, and memory 92 are not shown in Figure 7 and Figures 8 to 10 described later.

[0051] The CPU 91 is responsible for executing programs. Memory 92 includes ROM (Read Only Memory) and RAM (Random Access Memory). ROM stores data non-volatilely. RAM stores data generated by the execution of programs by the CPU 91 volatilely.

[0052] Each component of the control unit 90 is connected to the others by a data bus. Processing in the CPU 91 is realized by each piece of hardware and software executed by the CPU 91. Such software is pre-stored in ROM / RAM. The control unit 90 is powered by an internal power supply (not shown) or an external power supply (not shown). For connection to the external power supply, for example, an AC adapter (not shown) is used.

[0053] As shown in Figures 6 and 7, the control unit 90 drives the actuator 23 to immerse the base body 110 in the conductive paste layer 51 from the first end face 115 side (see arrow AR1 in Figure 6).

[0054] Next, as shown in Figures 5 and 8, the base body 110 is lifted from the conductive paste layer 51 (step S813).

[0055] In detail, the control unit 90 drives the actuator 23, causing the base body 110 to move so that it is lifted from the conductive paste layer 51 (see arrow AR2 in Figure 8).

[0056] As the base body 110 is pulled up from the conductive paste layer 51, as shown in Figure 8, the first end face 115 and the portions of the four sides near the first end face 115, and the conductive paste layer 51 are connected to each other by the conductive paste 53 stretched from the conductive paste layer 51.

[0057] The dimension w2 (see Figure 8) of the conductive paste 53 (hereinafter also referred to as "connecting paste 53a") connecting the first end face 115 and the portions of the four sides near the first end face 115 with the conductive paste layer 51 is preferably 80% to 120% of the dimension w1 (see Figure 8), which is the larger of the width direction W dimension and the stacking direction T dimension of the base body 110. Dimension w2 is measured by the method described below.

[0058] First, the connecting paste 53a is imaged from a direction perpendicular to the first side surface 111 of the base body 110. Next, the external dimensions of the connecting paste 53a in a direction perpendicular to the longitudinal direction L of the base body 110 are measured based on the imaged image. The external dimensions of the connecting paste 53a measured here refer to the external dimensions of the connecting paste 53a at a distance h (see Figure 8) from both the surface of the conductive paste layer 51 and the first end surface 115 in the longitudinal direction L of the base body 110.

[0059] Next, the external dimensions of the connecting paste 53a described above are measured in the same manner from directions perpendicular to the second side surface 112, the third side surface 113, and the fourth side surface 114. The largest of the four external dimensions of the connecting paste 53a measured in this way is considered to be the dimension w2 of the connecting paste 53a described above. It is preferable that the imaging of the connecting paste 53a from these four directions be performed simultaneously.

[0060] Next, as shown in Figure 5 and Figures 9 to 11, the base body 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (step S814).

[0061] In detail, as shown in Figure 9, the control unit 90 drives the actuator 23 when the first end face 115 and the portions of the four sides near the first end face 115 and the conductive paste layer 51 are connected to each other by the connecting paste 53a. As a result, the base body 110 is moved relative to the conductive paste layer 51 in the direction from the first side 111 to the second side 112 (in the direction of arrow AR3 in Figure 9).

[0062] As shown in Figure 11, the base body 110 moves alternately in the T direction and the W direction, causing it to move in a circular path within the WT plane, tracing a rectangular (square in this embodiment) trajectory. In other words, the movement trajectory of the base body 110 when viewed along the length direction L is ring-shaped.

[0063] Here, the amount of movement of the base body 110 in the T direction (see dimension d1) is greater than the maximum length of the first end face 115 within its plane. Also, the amount of movement of the base body 110 in the W direction (see dimension d1) is greater than the maximum length of the first end face 115 within its plane. In this embodiment, the first end face 115 has a substantially square shape. Therefore, the above maximum length corresponds to the length of the diagonal of the first end face 115 (see dimension d2).

[0064] Thus, after the base portion 110 is lifted from the conductive paste layer 51, the base portion 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115, causing the connecting paste 53a to become thinner than the connecting paste 53a in the state before this movement (see Figures 8 to 10). In other words, in the WT plane, the outer shape of the connecting paste 53a becomes smaller than the outer shape of the connecting paste 53a in the state before this movement.

[0065] Then, as the base body 110 moves relative to the conductive paste layer 51 in this manner, the connecting paste 53a is torn off. In this embodiment, the connecting paste 53a is torn off while the base body 110 moves relative to the conductive paste layer 51 in the direction from the third side surface 113 to the fourth side surface 114 (in the direction of arrow AR4 in Figure 10).

[0066] Next, as shown in Figure 5, the conductive paste 53 is baked (step S815). Specifically, the conductive paste 53 applied to the first end face 115 and its surrounding area is heated, for example, in a drying oven, to form a baked layer that constitutes the base electrode layer 160. The baking temperature is, for example, 700°C to 900°C. Note that the baking temperature can be appropriately changed depending on the dielectric material and conductive material.

[0067] Next, as shown in Figure 5, a plating layer 170 (see Figure 2, etc.) is provided on the surface of the baked layer (step S816). This provides the first external electrode 120 on the first end face 115.

[0068] Next, as shown in Figure 5, the base body 110 is inverted (step S82). More specifically, first, a holding part 20 is prepared that has a configuration that is generally the same as the holding part 20 that holds the base body 110, but is constructed separately from the holding part 20. For the sake of explanation, the holding part 20 that holds the base body 110 will also be referred to as the first holding part, and the holding part 20 constructed separately from the first holding part will also be referred to as the second holding part.

[0069] Next, the second retaining part is positioned relative to the first retaining part so that the adhesive layer 22 of the second retaining part faces the first external electrode 120. Then, the first retaining part is moved relative to the second retaining part so that the first retaining part and the second retaining part are closer to each other. As a result, the first external electrode 120 is pressed against the adhesive layer 22 of the second retaining part.

[0070] Next, the first holding part, the second holding part, and the base body part 110 are inverted together so that their top and bottom are reversed.

[0071] Next, the first holding part is relatively moved with respect to the second holding part so that the first holding part and the second holding part are separated from each other. Here, the adhesive force of the adhesive layer 22 of the second holding part is configured to be stronger than the adhesive force of the adhesive layer 22 of the first holding part. As a result, the element body part 110 to which the first external electrode 120 is attached to the adhesive layer 22 of the second holding part is peeled off from the adhesive layer 22 of the first holding part.

[0072] As a result, the element body part 110 is held by the second holding part so that the second end face 116 faces the lower side in the vertical direction.

[0073] Next, as shown in FIG. 5, a second external electrode 130 is formed on the second end face 116 (step S83). Step S83 further includes steps corresponding to the above-described steps S811 to S816. Since the contents of these steps are basically the same as those of steps S811 to S816, the description thereof is omitted.

[0074] Next, as shown in FIG. 4, the multilayer ceramic capacitor 100 is recovered (step S9). The recovery of the multilayer ceramic capacitor 100 is realized, for example, by inserting the tip of a recovery blade into the gap between the adhesive layer 22 of the second holding part and the first external electrode 120 to remove the multilayer ceramic capacitor 100 from the second holding part.

[0075] By going through the steps described above, the multilayer ceramic capacitor 100 can be manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the present embodiment.

[0076] <C. Parentheses> In the manufacturing method of the multilayer ceramic capacitor according to this embodiment, as described above, when the first external electrode 120 is provided on the base body 110, the base body 110 is pulled up from the conductive paste layer 51, so that the portions of the four sides near the first end face 115 and the conductive paste layer 51 are connected to each other by the connecting paste 53a, and the base body 110 is moved relative to the conductive paste layer 51 in the direction from the first side face 111 toward the second side face 112 (see Figure 9).

[0077] As a result, the thickness of the first external electrode 120 provided on the second side surface 112 can be made smaller compared to the case where the first external electrode 120 is provided on the base body 110 without going through the process of moving the base body 110 in the in-plane direction of the first end face 115 as described above. This is because a portion of the conductive paste 53 applied to the second side surface 112 is scraped off towards the conductive paste layer 51 via the connecting paste 53a (see arrow DR in Figure 9).

[0078] In this way, a portion of the conductive paste 53 applied to the side of the base body 110 located downstream of the base body 110 in the direction of movement of the base body 110 is scraped off along the connecting paste 53a toward the conductive paste layer 51, thereby making it possible to reduce the thickness of the external electrode provided on that side.

[0079] Therefore, by configuring it as described above, it is possible to create a method for manufacturing electronic components that can be miniaturized.

[0080] Furthermore, as described above, by moving the base body 110 relative to the conductive paste layer 51 in the direction from the first side surface 111 to the second side surface 112, the thickness of the first external electrode 120 provided on the first end surface 115 can be made smaller compared to the case where the first external electrode 120 is provided on the base body 110 without going through the process of moving the base body 110 in the in-plane direction of the first end surface 115. This is because a portion of the conductive paste 53 applied to the first end surface 115 is scraped off toward the conductive paste layer 51 via the connecting paste 53a.

[0081] Therefore, by using the manufacturing method of the multilayer ceramic capacitor according to this embodiment, it becomes possible to make the thickness of the external electrodes provided on the pair of end faces of the base body 110 smaller.

[0082] Furthermore, the effects achieved by the manufacturing method of the multilayer ceramic capacitor according to this embodiment, as described above, have been confirmed by verification tests described later.

[0083] Furthermore, in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, as described above, when the base body 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115, the movement trajectory of the base body 110 when viewed along the length direction L becomes annular.

[0084] By moving the base body 110 in this way, it becomes possible to make the thickness of the external electrodes provided on the four sides uniformly small.

[0085] In the manufacturing method of the multilayer ceramic capacitor according to this embodiment, when the base body 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115, the example given is that the movement trajectory of the base body 110 when viewed along the length direction L is annular. However, the movement trajectory of the base body 110 when viewed along the length direction L may be a straight line perpendicular to one of the four sides.

[0086] In the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, as described above, when the base body 110 is lifted from the conductive paste layer 51, the first end face 115 and the portions of the four side faces near the first end face 115 are connected to the conductive paste layer 51 by the connection paste 53a. However, the present embodiment is not limited thereto, and it is sufficient that at least one of the portions of the four side faces of the base body 110 near the first end face 115 is connected to the conductive paste layer 51 by the connection paste 53a.

[0087] Furthermore, in the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, the case where the holding portion 20 including the base layer 21 and the adhesive layer 22 is used is exemplified. However, instead of the holding portion 20 having such a configuration, a holding portion including a base layer in which a plurality of through holes are arranged in a lattice pattern and a substantially cylindrical adhesive portion inserted into each of the plurality of through holes may be used.

[0088] In this case, the plurality of base bodies 110 are held by the holding portion by being inserted into each of the plurality of adhesive portions. Further, in this case, by pushing out the plurality of multilayer ceramic capacitors 100 from the through holes by pins or the like, the plurality of multilayer ceramic capacitors 100 can be transferred to a holding portion configured separately from the holding portion, or the plurality of multilayer ceramic capacitors 100 can be recovered.

[0089] <D. Verification Test> In this verification test, in order to clarify the effects achieved by the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, a verification was performed by comparing the thickness of the external electrodes in a multilayer ceramic capacitor manufactured based on the method for manufacturing a multilayer ceramic capacitor according to the present embodiment (hereinafter, also referred to as the multilayer ceramic capacitor according to the example) with the thickness of the external electrodes in a multilayer ceramic capacitor manufactured based on the method for manufacturing a multilayer ceramic capacitor according to the comparative example (hereinafter, also referred to as the multilayer ceramic capacitor according to the comparative example).

[0090] The manufacturing method of the multilayer ceramic capacitor according to the comparative example differs from the manufacturing method of the multilayer ceramic capacitor according to this embodiment only in that it does not include step S814 (see Figure 5) described above, and is otherwise identical. That is, the manufacturing method of the multilayer ceramic capacitor according to the comparative example does not include a step in which the base body portion 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115.

[0091] In this verification test, multilayer ceramic capacitors according to Examples 1 to 6, each with different test conditions, were prepared. In Examples 1 to 6, the ratio of the dimension w2 of the connecting paste 53a in step S813 to the dimension w1 of the base part 110 (i.e., w2 / w1) is different for each (see Figure 8).

[0092] The base body of the multilayer ceramic capacitors in the examples and comparative examples has dimensions of 1.0 mm in length, 0.5 mm in width, and 0.5 mm in thickness, excluding tolerances. The number of samples for each of the multilayer ceramic capacitors in the examples and comparative examples is 5.

[0093] In this verification test, the thickness dimensions of the first external electrode on the side and the thickness dimensions of the first external electrode on the end face of each multilayer ceramic capacitor in the example and comparative example were confirmed.

[0094] In detail, first, the multilayer ceramic capacitor was polished so that the LT cross-section of the central part in the width direction W was exposed, and the thickness dimension of the first external electrode on the side of the thickest part of that cross-section was measured. This measurement was performed for all samples, and the average of the five measured thickness dimensions was adopted as the thickness dimension of the first external electrode on the side. The same procedure was followed for the thickness dimension of the first external electrode on the end face.

[0095] Then, the thinning ratio on the side and the thinning ratio on the end face of the external electrodes of the multilayer ceramic capacitors according to each embodiment were calculated. The thinning ratio on the side is obtained by subtracting the thickness dimension of the first external electrode on the side in the multilayer ceramic capacitor according to the embodiment from the thickness dimension of the first external electrode on the side in the multilayer ceramic capacitor according to the comparative example, and then dividing the resulting value by the thickness dimension of the first external electrode on the side in the multilayer ceramic capacitor according to the comparative example. The same procedure is followed for the thinning ratio on the end face.

[0096] Figure 12 is a table showing the test results in this verification test. In Figure 12, the evaluation is "Good" when the thinning rate on the side is greater than 0%. Among these, the evaluation is "Excellent" when the thinning rate on the side is 40% or more and the thinning rate on the end face is 20% or more. From the test results shown in Figure 12, it was confirmed that in all of the examples of multilayer ceramic capacitors, the thickness dimensions of the first external electrode on the side and the first external electrode on the end face can be reduced compared to the multilayer ceramic capacitor of the comparative example.

[0097] Furthermore, the test results shown in Figure 12 confirm that when w2 / w1 is between 80% and 120%, the thickness dimensions of the side-side first external electrode and the end-face side first external electrode can be reduced in particular. This is presumed to be because, when w2 / w1 is less than 80%, the effect of a portion of the conductive paste applied to the side of the base body being scraped off towards the conductive paste layer via the connecting paste in step S814 is smaller compared to when w2 / w1 is 80% or more, and when w2 / w1 is greater than 120%, the effect of a portion of the conductive paste applied to the end face of the base body being scraped off towards the conductive paste layer via the connecting paste is smaller due to insufficient pulling up from the conductive paste layer of the base body, etc.

[0098] In the verification test described above, the thickness dimension of the external electrode was measured by exposing the LT cross-section of the multilayer ceramic capacitor located in the center in the width direction W. However, the thickness dimension of the external electrode may also be measured by exposing the LW cross-section of the multilayer ceramic capacitor located in the center in the stacking direction T.

[0099] (First variation) Figure 13 is a schematic plan view illustrating the direction of movement of the base body in the manufacturing method of a multilayer ceramic capacitor according to the first modified example. The manufacturing method of a multilayer ceramic capacitor according to the first modified example based on the above-described embodiment will now be explained with reference to Figure 13.

[0100] As shown in Figure 13, the manufacturing method of the multilayer ceramic capacitor according to the first modified example differs from the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above in that the direction of movement of the base body 110 in step S814 is different.

[0101] More specifically, as shown in Figure 13, in the first modified example, the base body 110 moves in a circular path within the WT plane. In other words, the trajectory of the base body 110 when viewed along the length direction L is circular.

[0102] Even with this configuration, effects similar to those described in the above-described embodiment can be obtained, making it possible to manufacture electronic components in a way that allows for miniaturization.

[0103] (Second variation) Figure 14 is a schematic front view illustrating step S813 of the manufacturing flow shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the second modified example. The manufacturing method of a multilayer ceramic capacitor according to the second modified example based on the above-described embodiment will now be explained with reference to Figure 14.

[0104] The manufacturing method for the multilayer ceramic capacitor according to this modified example differs from the manufacturing method for the multilayer ceramic capacitor according to the above-described embodiment in that the direction of movement of the base body 110 in step S813 is different.

[0105] In detail, in this modified example, as shown in Figure 14, while the base body 110 is being pulled up from the conductive paste layer 51, the base body 110 is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (see arrow AR5 in Figure 14).

[0106] By moving the base body 110 in this manner, not only in step S814 but also in step S813, a portion of the conductive paste 53 applied to the side of the base body 110 located downstream of the base body 110 in the direction of movement of the base body 110 is scraped off along the connecting paste 53a toward the conductive paste layer 51. Therefore, by using the manufacturing method of the multilayer ceramic capacitor according to this modified example, the effect of reducing the thickness of the external electrodes on the side of the base body described above is more pronounced.

[0107] Even with this configuration, effects similar to those described in the above-described embodiment can be obtained, making it possible to manufacture electronic components in a way that allows for miniaturization.

[0108] (Third variation) Figure 15 is a detailed flowchart of step S8 of the manufacturing flow shown in Figure 4 in the manufacturing method of a multilayer ceramic capacitor according to the third modified example. Figure 16 is a schematic front view illustrating step S814A of the manufacturing flow shown in Figure 15. Hereinafter, the manufacturing method of a multilayer ceramic capacitor according to the third modified example based on the above-described embodiment will be explained with reference to Figures 15 and 16.

[0109] As shown in Figure 15, the manufacturing method of the multilayer ceramic capacitor according to this modified example differs from the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above in that step S814A is performed between steps S814 and S815.

[0110] In detail, in this modified example, as shown in Figure 16, after the base body 110 has been moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (i.e., after step S814), the base body 110 is pulled up so as to move further away from the conductive paste layer 51, while the first end face 115 and the portions of the four sides closer to the first end face 115 and the conductive paste layer 51 are connected to each other by the connecting paste 53a (see arrow AR6 in Figure 16). This makes it possible to tear off the connecting paste 53a more reliably.

[0111] Even with this configuration, effects similar to those described in the above-described embodiment can be obtained, making it possible to manufacture electronic components in a way that allows for miniaturization.

[0112] (Note) The characteristic configuration of the method for manufacturing electronic components disclosed in the above-described embodiments and their modified examples can be summarized as follows:

[0113] [Note 1] A method for manufacturing an electronic component comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and four sides connecting the first end face and the second end face, and external electrodes provided on each of the first end face and the second end face, The above-mentioned base body is immersed in a conductive paste layer which is a precursor of the external electrode from the first end face side, The process involves immersing the above-mentioned base body in the conductive paste layer from the first end face side, followed by the process of pulling the base body out of the conductive paste layer, A method for manufacturing an electronic component, comprising the step of moving the base body relative to the conductive paste layer in the in-plane direction of the first end face with respect to the conductive paste layer, such that the base body is pulled up from the conductive paste layer, so that the first end face and the portions of the four sides near the first end face and the conductive paste layer are connected to each other by the conductive paste stretched from the conductive paste layer.

[0114] [Note 2] The method for manufacturing an electronic component according to Appendix 1, wherein, while the base portion is being pulled up from the conductive paste layer, the base portion is moved relative to the conductive paste layer in the in-plane direction of the first end face.

[0115] [Note 3] A method for manufacturing an electronic component according to Appendix 1 or 2, wherein, in the step of moving the base body relative to the conductive paste layer in the in-plane direction of the first end face, the amount of movement of the base body is greater than the maximum length of the first end face in the plane of the first end face.

[0116] [Note 4] A method for manufacturing an electronic component according to any one of the appendices 1 to 3, wherein, in the step of moving the above-mentioned base body relative to the conductive paste layer in the in-plane direction of the first end face, the movement trajectory of the base body when viewed along the length direction is a straight line or annular shape perpendicular to one of the four side surfaces.

[0117] [Note 5] A method for manufacturing an electronic component according to any one of the appendices 1 to 4, wherein, after the base body is lifted from the conductive paste layer, the base body is moved relative to the conductive paste layer in the in-plane direction of the first end face, and in this step, the conductive paste is torn off.

[0118] (Other forms, etc.) In the embodiments and modifications of the present disclosure described above, a multilayer ceramic capacitor was used as an example of an electronic component, and its manufacturing method was explained. However, the manufacturing method of the electronic component shown in these embodiments and modifications may also be applied to the manufacturing of other electronic components, such as a multilayer ceramic inductor or a multilayer ceramic thermistor. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic and the internal electrodes are made of coil-shaped conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layer is made of semiconductor ceramic.

[0119] Furthermore, the shape, configuration, size, number, material, etc., of each part shown in the embodiments and modified examples of the present disclosure described above can be modified in various ways, as long as they do not deviate from the spirit of the present disclosure.

[0120] Furthermore, the characteristic configurations shown in the embodiments and modifications of the present disclosure described above can naturally be combined with each other without departing from the spirit of the present disclosure.

[0121] Thus, the embodiments and their variations disclosed herein are illustrative in all respects and not restrictive. The technical scope of the present invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the claims. [Explanation of Symbols]

[0122] 20 Holding part, 21 Base layer, 22 Adhesive layer, 23 Actuator, 51 Conductive paste layer, 53 Conductive paste, 53a Connecting paste, 60 Flat plate part, 90 Control unit, 91 CPU, 92 Memory, 100 Multilayer ceramic capacitor, 110 Base body part, 111 First side, 112 Second side, 113 Third side, 114 Fourth side, 115 First end face, 116 Second end face, 118 Internal electrode layer, 118a First internal electrode layer, 118b Second internal electrode layer, 119 Dielectric layer, 120 First external electrode, 121 First external electrode on the end face side, 122 First external electrode on the side side, 130 Second external electrode, 131 Second external electrode on the end face side, 132 Second external electrode on the side side, 160 Underlay electrode layer, 170 Plating layer, C Inner layer part.

Claims

1. A method for manufacturing an electronic component comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and four sides connecting the first end face and the second end face, and external electrodes provided on each of the first end face and the second end face, The process involves immersing the base body portion in a conductive paste layer which is a precursor of the external electrode, starting from the first end face side. The process involves immersing the base body portion in the conductive paste layer from the first end face side, followed by the step of removing the base body portion from the conductive paste layer, A method for manufacturing an electronic component, comprising the step of moving the base body relative to the conductive paste layer in the in-plane direction of the first end face with respect to the conductive paste layer, such that the base body is pulled up from the conductive paste layer, so that the first end face and the portions of the four sides near the first end face and the conductive paste layer are connected to each other by the conductive paste stretched from the conductive paste layer.

2. The method for manufacturing an electronic component according to claim 1, wherein the base portion is moved relative to the conductive paste layer in the in-plane direction of the first end face while the base portion is being pulled up from the conductive paste layer.

3. The method for manufacturing an electronic component according to claim 1, wherein in the step of moving the base body relative to the conductive paste layer in the in-plane direction of the first end face, the amount of movement of the base body is greater than the maximum length of the first end face in the plane of the first end face.

4. The method for manufacturing an electronic component according to claim 1, wherein, in the step of moving the base body relative to the conductive paste layer in the in-plane direction of the first end face, the movement trajectory of the base body when viewed along the length direction is a straight line or annular shape perpendicular to one of the four sides.

5. A method for manufacturing an electronic component according to any one of claims 1 to 4, wherein, after the base portion is lifted from the conductive paste layer, the base portion is moved relative to the conductive paste layer in the in-plane direction of the first end face, and in this step, the conductive paste is torn off.

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