Manufacturing methods for electronic components

Abstract

To provide a method for manufacturing electronic components that ensures stable quality. [Solution] The method for manufacturing an electronic component comprises the steps of: immersing a plurality of base body parts 110, including a base body part 110A, in a single conductive paste layer 51 which is a precursor of an external electrode, from the first end 115 side of each base body part, spaced apart from one another; pulling them out after being immersed in the conductive paste layer from the first end face side; and moving them relative to each other in the in-plane direction of the first end face while connected by the stretched conductive paste 53. In the state of being immersed in the conductive paste layer, the component includes a first region in which one base body part 110A is immersed, a second region in which the other base body parts are immersed, and a third region excluding the first and second regions. In the step of moving each base body part relative to the in-plane direction of the first end face, one base body part is moved relative to the conductive paste layer such that the conductive paste passes within the ranges of the first region and the third region.

Description

Technical Field

[0006] , ,

[0005] , , ,

[0001] The present disclosure relates to a method for manufacturing an electronic component.

Background Art

[0002] Conventionally, an electronic component including a substantially rectangular parallelepiped body portion in which a plurality of dielectric layers and internal electrode layers are alternately laminated, and external electrodes provided on a pair of end faces in the length direction of the body portion is known. Japanese Patent Application Laid-Open No. 2006-319272 (Patent Document 1) discloses a method for manufacturing a multilayer capacitor as an example of such an electronic component.

[0003] In the method for manufacturing an electronic component disclosed in Patent Document 1, the body portion is immersed in a conductive paste layer, which is a precursor of the external electrode, from the end face side, and then pulled up from the conductive paste layer after the immersion. Thereby, an external electrode is formed on the end face of the body portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] From the viewpoint of stabilizing the quality of the manufactured electronic component, it is important to suppress the occurrence of so-called bubble entrainment in which bubbles are entrapped in the gap between the end face and the external electrode when the external electrode is formed on the end face of the body portion. This is because if bubble entrainment occurs, there is a risk that the manufactured electronic component will not have the desired performance.

[0006] Furthermore, as mentioned above, when the base part is lifted from the conductive paste layer, the base part and the conductive paste layer may become connected to each other by the conductive paste stretched from the conductive paste layer. If this stretched conductive paste is unintentionally torn off, the torn portion of the conductive paste may distort the shape of the external electrode, which is undesirable from the standpoint of stabilizing the quality of electronic components.

[0007] Therefore, this disclosure has been made to solve the above-mentioned problems and aims to provide a method for manufacturing electronic components with stable quality. [Means for solving the problem]

[0008] The present disclosure is a method for manufacturing electronic components, which simultaneously manufactures a plurality of electronic components, each comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and an external electrode provided on each of the first end face and the second end face. The present disclosure is a method for manufacturing electronic components, which comprises the steps of: immersing the plurality of base body bodies, spaced apart from each other, in a single conductive paste layer which is a precursor of the external electrode, from the first end face side of each of the plurality of base body bodies; pulling the plurality of base body bodies out of the conductive paste layer after they have been immersed in the conductive paste layer from the first end face side of each of the plurality of base body bodies; and moving the plurality of base body bodies relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body bodies with respect to the conductive paste layer, while the plurality of base body bodies and the conductive paste layer are connected to each other by conductive paste stretched from the conductive paste layer as a result of the plurality of base body bodies being pulled out of the conductive paste layer. In a state in which the plurality of base parts are immersed in the conductive paste layer, the conductive paste layer includes a first region in which one of the plurality of base parts is immersed, a second region in which the other base parts are immersed, and a third region excluding the first region and the second region. In a step in which the plurality of base parts are moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base parts, one of the plurality of base parts is moved relative to the conductive paste layer such that the conductive paste connecting the one base part and the conductive paste layer passes within the range of the first region and the third region.

[0009] In the method for manufacturing electronic components according to the above disclosure, when the plurality of base parts are immersed in the conductive paste layer, the plurality of base parts may be arranged in a linear fashion along a first direction perpendicular to the longitudinal direction at a first pitch interval, across multiple rows located at a second pitch interval in the longitudinal direction and a second direction perpendicular to the first direction, and may be arranged in a staggered pattern with spacing between them along the second direction.

[0010] In the method for manufacturing electronic components according to the above disclosure, the plurality of rows may consist of A-rows and B-rows that are alternately located in the second direction. In this case, the position of the base body in the B-row may be offset from the position of the base body in the A-row by half the first pitch interval in the first direction. In this case, in the step in which the plurality of base body parts are moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body parts, each of the plurality of base body parts may be moved by a distance of half the first pitch interval or more and less than the first pitch interval along the first direction, or by a distance of second pitch interval or more and less than twice the second pitch interval along the second direction.

[0011] In the method for manufacturing an electronic component according to the above disclosure, in the step of moving the plurality of base parts relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base parts, each of the plurality of base parts may be moved along the first direction by a distance of half the dimension of the first pitch spacing and less than the dimension of the first pitch spacing, and then moved along the second direction by a distance of second the dimension of the second pitch spacing and less than twice the dimension of the second pitch spacing, or moved along the second direction by a distance of second the dimension of the second pitch spacing and less than twice the dimension of the second pitch spacing, and then moved along the first direction by a distance of half the dimension of the first pitch spacing and less than the dimension of the first pitch spacing.

[0012] In the method for manufacturing an electronic component according to the above disclosure, in the step in which the plurality of base parts are moved relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base parts, the plurality of base parts may be moved back and forth relative to the conductive paste layer along the in-plane direction. [Effects of the Invention]

[0013] According to this disclosure, it is possible to provide a method for manufacturing electronic components with stabilized quality. [Brief explanation of the drawing]

[0014] [Figure 1] This is a schematic perspective view showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method for multilayer ceramic capacitors according to the embodiment. [Figure 2] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 3] Figure 1 is a schematic cross-sectional view of a multilayer ceramic capacitor. [Figure 4] This is a flowchart showing the manufacturing method of a multilayer ceramic capacitor according to an embodiment. [Figure 5] Figure 4 is a detailed flow chart of step S8 in the manufacturing flow shown. [Figure 6] Figure 5 is a schematic side view illustrating processes S811 and S812 of the manufacturing flow shown. [Figure 7] This is a schematic side view illustrating step S812 of the manufacturing flow shown in Figure 5. [Figure 8] These are schematic plan views illustrating the arrangement of the multiple structural components shown in Figures 6 and 7. [Figure 9] This is a schematic side view illustrating step S813 of the manufacturing flow shown in Figure 5. [Figure 10] This is a schematic side view illustrating step S814 of the manufacturing flow shown in Figure 5. [Figure 11] Figure 10 is a schematic plan view illustrating the movement of multiple structural components. [Figure 12] This is a schematic side view illustrating step S814 of the manufacturing flow shown in Figure 5. [Figure 13] This is a schematic side view illustrating step S814 of the manufacturing flow shown in Figure 5 in the manufacturing method of the multilayer ceramic capacitor according to the first comparative example. [Figure 14]It is a schematic side view for explaining step S814 of the manufacturing flow shown in FIG. 5 in the method for manufacturing a multilayer ceramic capacitor according to the first comparative example. [Figure 15] It is a schematic plan view for explaining step S814 shown in FIG. 5 in the method for manufacturing a multilayer ceramic capacitor according to the first modification example. [Figure 16] It is a schematic plan view for explaining the arrangement of a plurality of element bodies in step S812 shown in FIG. 5 in the method for manufacturing a multilayer ceramic capacitor according to the second modification example. [Figure 17] It is a schematic plan view for explaining the movement of a plurality of element bodies in step S814 shown in FIG. 5 in the method for manufacturing a multilayer ceramic capacitor according to the second modification example. [Figure 18] It is a schematic side view for explaining the movement of the element body shown in FIG. 17. [Figure 19] It is a schematic side view for explaining step S813 shown in FIG. 5 in the method for manufacturing a multilayer ceramic capacitor according to the third modification example.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below exemplify a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Note that the method for manufacturing an electronic component according to the present embodiments shown below is also applicable to methods for manufacturing a multilayer ceramic inductor, a multilayer ceramic thermistor, or the like.

[0016] In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated. In the drawings, the length direction of the element body is indicated by L, the width direction of the element body is indicated by W, and the stacking direction of the element body is indicated by T. The element body will be described in detail later.

[0017] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> Figure 1 is a schematic perspective view showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of a multilayer ceramic capacitor according to this embodiment. Figure 2 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in Figure 1 along the line II-II. Figure 3 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in Figure 1 along the line III-III. First, the configuration of the multilayer ceramic capacitor 100 manufactured according to the manufacturing method of a multilayer ceramic capacitor according to this embodiment will be described with reference to Figures 1 to 3.

[0018] As shown in Figures 1 to 3, the multilayer ceramic capacitor 100 according to this embodiment comprises a base body 110 and external electrodes.

[0019] The base body 110 has a substantially rectangular parallelepiped shape. The base body 110 has a first side surface 111 and a second side surface 112 that are opposite to the stacking direction T, a third side surface 113 and a fourth side surface 114 that are opposite to the width direction W which is perpendicular to the stacking direction T, and a first end surface 115 and a second end surface 116 that are opposite to the length direction L which is perpendicular to the stacking direction T and the width direction W.

[0020] The dimensions of the base body 110 are, for example, 0.1 mm to 3.2 mm in the length direction L, 0.05 mm to 1.6 mm in the width direction W, and 0.05 mm to 1.6 mm in the stacking direction T. Tolerances are also taken into account in addition to the above dimensions.

[0021] The external electrode consists of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is provided on the first end face 115. The second external electrode 130 is provided on the second end face 116.

[0022] The first external electrode 120 includes an end-face side first external electrode 121 and a side-side first external electrode 122. The end-face side first external electrode 121 is a portion provided across the entire first end face 115. The side-side first external electrode 122 is a portion extending from the first end face 115 to the first side surface 111, the second side surface 112, the third side surface 113, and the fourth side surface 114, respectively.

[0023] The second external electrode 130 includes an end-face side second external electrode 131 and a side-side second external electrode 132. The end-face side second external electrode 131 is a portion provided across the entire second end face 116. The side-side second external electrode 132 is a portion extending from the second end face 116 to the first side 111, the second side 112, the third side 113, and the fourth side 114, respectively.

[0024] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0025] The base electrode layer 160 includes at least one of a baked layer, a resin layer, and a thin film layer. In this embodiment, the base electrode layer 160 is composed of a baked layer.

[0026] The baked layer contains, for example, a metal component and a glass component. The metal component consists of one metal component selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal; for example, an alloy of Ag and Pd can be used. The glass component contains at least one of Si and Zn.

[0027] The baked layer may consist of a single layer or multiple stacked layers. The baked layer may be a layer baked after the conductive paste 53 is applied to the base part 110, or a layer fired simultaneously with the internal electrode layer 118. If the baked layer is a layer baked after the conductive paste 53 is applied to the base part 110, it is preferable that the baked layer contains a glass component. If the baked layer is a layer fired simultaneously with the internal electrode layer 118, it is preferable that the baked layer contains a dielectric. The conductive paste 53 and the internal electrode layer 118 will be described later.

[0028] The plating layer 170 is placed on the under electrode layer 160. The material constituting the plating layer 170 can be one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing this metal. As an example, the plating layer 170 can be made up of a layer of Ni and a layer of Sn laminated together.

[0029] Furthermore, a resin layer containing a metal filler may be provided between the base electrode layer 160, which is composed of a baked layer, and the plating layer 170. This resin layer can be formed by going through the same process as the process in which the base electrode layer 160 is formed in the manufacturing method of the multilayer ceramic capacitor according to this embodiment, which will be described in detail later (see steps S811 to S815 in Figure 5 later).

[0030] The base body 110 has a plurality of internal electrode layers 118 and a plurality of dielectric layers 119 that are alternately stacked along the stacking direction T.

[0031] The multiple internal electrode layers 118 include multiple first internal electrode layers 118a and multiple second internal electrode layers 118b. The multiple first internal electrode layers 118a and multiple second internal electrode layers 118b are stacked alternately in the stacking direction T.

[0032] The first internal electrode layer 118a is drawn out to the first end face 115. The first end face 115 is covered by the first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn out to the second end face 116. The second end face 116 is covered by the second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0033] Although Figures 2 and 3 show examples in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, the number of each of the first internal electrode layers 118a and second internal electrode layers 118b is not particularly limited to seven.

[0034] The plurality of dielectric layers 119 includes an outer-layer dielectric layer located between the internal electrode layer 118 positioned closest to the first side surface 111 in the stacking direction T and the first side surface 111, and between the internal electrode layer 118 positioned closest to the second side surface 112 in the stacking direction T and the second side surface 112, and an inner-layer dielectric layer located between adjacent internal electrode layers 118 in the stacking direction T.

[0035] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as a main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain a dielectric material of the same composition system as the ceramic contained in the dielectric layer 119. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0036] Each of the plurality of dielectric layers 119 is composed of, for example, a dielectric ceramic material mainly composed of a perovskite compound containing Ba and Ti. The dielectric layer 119 may contain at least one selected from the group consisting of Si, Mg, Mn, V, Cr, and rare earths as an additive.

[0037] The body portion 110 includes an inner layer portion C. The inner layer portion C has a capacitance by laminating, in the stacking direction T, the first internal electrode layer 118a at a portion facing the second internal electrode layer 118b adjacent in the stacking direction T and the second internal electrode layer 118b at a portion facing the first internal electrode layer 118a adjacent in the stacking direction T.

[0038] <B. Method for manufacturing a multilayer ceramic capacitor> Figure 4 is a flow chart showing a method for manufacturing a multilayer ceramic capacitor according to this embodiment. Figure 5 is a detailed flow chart of step S8 of the manufacturing flow shown in Figure 4. Figures 6, 7, 9, 10, and 12 are schematic side views illustrating each step of the manufacturing flow shown in Figure 5. Figure 8 is a schematic plan view illustrating the arrangement of the multiple component parts shown in Figures 6 and 7. Figure 11 is a schematic plan view illustrating the movement of the multiple component parts shown in Figure 10. The method for manufacturing the multilayer ceramic capacitor 100 according to this embodiment will be described below with reference to Figures 4 to 12. Note that the holding part 20 is not shown in Figures 8 and 11 (the same applies to Figures 15 to 17, which will be described later).

[0039] The manufacturing method for the multilayer ceramic capacitor 100 according to this embodiment involves simultaneously manufacturing multiple multilayer ceramic capacitors 100.

[0040] First, as shown in Figure 4, a ceramic dielectric slurry is prepared (step S1). Specifically, ceramic dielectric powder, additive powder, binder resin, and dissolving solution are dispersed and mixed. This prepares the ceramic dielectric slurry.

[0041] The ceramic dielectric powder is, for example, perovskite dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder consists of, for example, at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or aqueous polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These may be used individually or in mixtures of two or more. The ceramic dielectric slurry may be solvent-based or water-based. When the ceramic dielectric slurry is a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with dielectric raw materials dissolved in water.

[0042] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or microgravure coater and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0043] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet so as to have a predetermined pattern. This forms a mother sheet on which a predetermined internal electrode pattern is provided on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, and a binder, and is prepared to have a constant viscosity. PVA or PVB can be used as the binder. Screen printing, inkjet printing, or gravure printing can be used as methods for applying the conductive paste. From the viewpoint of miniaturizing and increasing the capacitance of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm to 0.8 μm. In addition to the mother sheet with the internal electrode pattern, a ceramic dielectric sheet that has not undergone step S3 is also prepared.

[0044] Next, multiple mother sheets are stacked (step S4). Specifically, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked so that the thickness is, for example, between 10 μm and 30 μm. On top of that, a predetermined number of mother sheets with an internal electrode pattern are stacked. The number of stacked mother sheets with an internal electrode pattern is, for example, between 1 and 1000. Furthermore, a predetermined number of mother sheets consisting only of ceramic dielectric sheets and without an internal electrode pattern are stacked on top of that so that the thickness is, for example, between 10 μm and 30 μm. This constitutes a group of mother sheets.

[0045] Next, the mother sheets are pressed together to form a dielectric block (step S5). Specifically, the mother sheets are pressed together in the stacking direction by hydrostatic pressing or rigid pressing. This forms a dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, causing them to adhere closely to each other. In addition, a ceramic dielectric sheet of a certain thickness is placed and pressed as the outermost layer in the stacking direction. This protects the dielectric sheet on which the internal electrode pattern is formed.

[0046] Next, the dielectric block is divided to form chips (step S6). Specifically, the dielectric block is divided into multiple chips by cutting, dicing, or laser cutting to form a matrix. When dividing the dielectric block, it may be heated and softened before division.

[0047] Next, the chip is fired (step S7). Specifically, the heating of the chip causes the dielectric material and conductive material contained in the chip to be fired, forming the base body 110. The firing temperature is, for example, 900°C to 1300°C. The firing temperature is set appropriately in accordance with the dielectric material and conductive material.

[0048] Next, the external electrodes are formed (step S8). As shown in Figure 5, step S8 includes steps S81 to S83, which will be described below.

[0049] First, the first external electrode 120 is formed (step S81). Step S81 further includes steps S811 to S816, which will be described below.

[0050] First, as shown in Figures 5 and 6, a single conductive paste layer 51, which is a precursor to the external electrode, is formed on the main surface of the flat plate portion 60 (step S811).

[0051] The conductive paste layer 51 is formed by a conductive paste 53 in which conductive particles are mixed with a binder, solvent, and dispersant, etc., and arranged in layers. The flat plate portion 60 is made of, for example, a metal material. The surface of the main surface of the flat plate portion 60 extends in the horizontal direction.

[0052] Next, as shown in Figures 5 to 8, multiple base body parts 110 are immersed in the conductive paste layer 51 (step S812).

[0053] In detail, first, as shown in Figure 6, the multiple base body parts 110 are held by the holding part 20 such that each of the first end faces 115 of the multiple base body parts 110 faces the conductive paste layer 51. The holding part 20 is for holding the base body parts 110 such that one of the pair of end faces of the base body part 110 faces downward in the vertical direction.

[0054] As shown in Figure 8, the multiple base parts 110 are arranged in a staggered pattern. More specifically, the multiple base parts 110 are arranged in a straight line along a first direction X perpendicular to the length direction L with a first pitch interval p1, and are positioned across multiple rows at a second pitch interval p2 in a second direction Y perpendicular to the length direction L and the first direction X, with spacing between them along the second direction Y.

[0055] The above multiple rows consist of A-row section Ra and B-row section Rb, which are positioned alternately in the second direction Y. The position of the base body section 110 in B-row section Rb is shifted in the first direction X by half the first pitch interval p1 from the position of the base body section 110 in A-row section Ra.

[0056] In Figure 8, ten basic body parts 110 are shown, but the number of basic body parts 110 is not limited to ten.

[0057] In the following explanation, for the sake of clarity, one of the multiple base body parts 110 will also be referred to as base body part 110A, and each process may be described focusing on base body part 110A.

[0058] The holding portion 20 includes a base layer 21 and an adhesive layer 22 provided on the main surface of the base layer 21. The base layer 21 is made of, for example, a metal material. The adhesive layer 22 is made of, for example, silicone rubber. In this embodiment, the base portion 110 is held by the holding portion 20 such that the second end face 116 of the base portion 110 is attached to the adhesive layer 22, causing the first end face 115 to face downward in the vertical direction.

[0059] An actuator 23 is attached to the holding part 20. Based on a signal from the control unit 90, the actuator 23 can move the holding part 20 in any direction. Specifically, the actuator 23 is driven so that the holding part 20 can move in three orthogonal axes: the length direction L, the width direction W, and the stacking direction T. The actuator 23 is composed of, for example, a servo motor, a stepping motor, or a robot cylinder, but the type of actuator 23 is not particularly limited to these.

[0060] The control unit 90 controls the operation of the actuator 23. The control unit 90 mainly consists of a CPU (Central Processing Unit) 91, a memory 92, and input / output devices (not shown) for inputting and outputting various signals. Note that the actuator 23, control unit 90, CPU 91, and memory 92 are not shown in Figures 7, 9, 10, 12 to 14, 18, and 19.

[0061] The CPU 91 is responsible for executing programs. Memory 92 includes ROM (Read Only Memory) and RAM (Random Access Memory). ROM stores data non-volatilely. RAM stores data generated by the execution of programs by the CPU 91 volatilely.

[0062] Each component of the control unit 90 is connected to the others by a data bus. Processing in the CPU 91 is realized by each piece of hardware and software executed by the CPU 91. Such software is pre-stored in ROM / RAM. The control unit 90 is powered by an internal power supply (not shown) or an external power supply (not shown). For connection to the external power supply, for example, an AC adapter (not shown) is used.

[0063] As shown in Figures 6 and 7, the control unit 90 drives the actuator 23 so that the multiple base parts 110 are immersed in the conductive paste layer 51 from their respective first end faces 115 sides, while maintaining a distance between them (see arrow AR1 in Figure 6). As a result, as shown in Figure 8, the conductive paste layer 51 includes a first region R1, which is the area overlapping the base part 110A when the main surface of the flat plate portion 60 is viewed from above, when the base part 110A, in which the conductive paste 53 is not attached to the first end face 115, moves vertically and the entire first end face of the base part 110A is immersed in the conductive paste layer 51; a second region R2, in which the other base parts 110 of the multiple base parts 110 are immersed; and a third region R3, which excludes the first region R1 and the second region R2. Here, the arrangement of the multiple base parts 110 in the state immersed in the conductive paste layer 51 is a staggered arrangement as described above.

[0064] Next, as shown in Figures 5 and 9, multiple base body parts 110 are pulled up from the conductive paste layer 51 (step S813).

[0065] In detail, as shown in Figure 9, the control unit 90 drives the actuator 23, causing the multiple base parts 110 to be moved so that they are pulled vertically upward from the conductive paste layer 51 (see arrow AR2 in Figure 9).

[0066] As the base body 110 is lifted from the conductive paste layer 51, the base body 110 and the conductive paste layer 51 become connected to each other by the conductive paste 53 stretched from the conductive paste layer 51. In the following, the conductive paste 53 in the portion connecting the base body 110 and the conductive paste layer 51 will also be referred to as connecting paste 53a.

[0067] Next, as shown in Figure 5 and Figures 10 to 12, the multiple base parts 110 are moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (step S814).

[0068] In detail, as shown in Figures 10 and 11, the control unit 90 drives the actuator 23 when the base body 110 and the conductive paste layer 51 are connected to each other by the connecting paste 53a. As a result, the multiple base body 110s are moved relative to the conductive paste layer 51 along the second direction Y (along the direction of arrow AR3 in Figure 10).

[0069] The base body 110A is moved relative to the conductive paste layer 51 such that the connecting paste 53a that connects it to the conductive paste layer 51 passes through the ranges of the first region R1 and the third region R3 of the conductive paste layer 51. In other words, the base body 110A is moved relative to the conductive paste layer 51 such that the connecting paste 53a does not pass through the range of the second region R2 of the conductive paste layer 51.

[0070] As shown in Figure 12, the connecting paste 53a is torn off when the base body 110A is moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115.

[0071] Furthermore, when the base body 110A is moved along the second direction Y, it is preferable that the base body 110A is moved by a distance greater than or equal to the second pitch spacing p2 and less than twice the second pitch spacing p2. This ensures that the connecting paste 53a can be reliably torn off.

[0072] On the other hand, when the base body 110A is moved along the first direction X, it is preferable that the base body 110A is moved by a distance of at least half the dimension of the first pitch interval p1 and less than the dimension of the first pitch interval p1. This ensures that the connecting paste 53a can be reliably torn off.

[0073] In this embodiment, the base body 110A is moved along the second direction Y by a distance equal to the second pitch interval p2. The same applies to the other base body 110s among the multiple base body 110s.

[0074] Here, as described above, by moving the base body 110A relative to the conductive paste layer 51 so that the connecting paste 53a passes within a predetermined area of ​​the conductive paste layer 51, the risk of the connecting paste 53a being unintentionally torn off can be effectively suppressed, but this point will be explained in detail later.

[0075] Next, as shown in Figure 5, the conductive paste 53 is baked (step S815). Specifically, the conductive paste 53 applied to the first end face 115 and its surrounding area is heated, for example, in a drying oven, to form a baked layer that constitutes the base electrode layer 160. The baking temperature is, for example, 700°C to 900°C. Note that the baking temperature can be appropriately changed depending on the dielectric material and conductive material.

[0076] Next, as shown in Figure 5, a plating layer 170 (see Figure 2, etc.) is provided on the surface of the baked layer (step S816). This provides the first external electrode 120 on the first end face 115.

[0077] Next, as shown in Figure 5, the multiple base parts 110 are inverted (step S82). In detail, first, a holding part 20 is prepared that has a configuration that is generally the same as the holding part 20 that holds the multiple base parts 110, but is constructed separately from the holding part 20. For the sake of explanation, the holding part 20 that holds the multiple base parts 110 will also be referred to as the first holding part, and the holding part 20 constructed separately from the first holding part will also be referred to as the second holding part.

[0078] Next, the second retaining part is positioned relative to the first retaining part so that the adhesive layer 22 of the second retaining part faces the first external electrode 120. Then, the first retaining part is moved relative to the second retaining part so that the first retaining part and the second retaining part are closer to each other. As a result, the first external electrode 120 is pressed against the adhesive layer 22 of the second retaining part.

[0079] Next, the first holding part, the second holding part, and the base body part 110 are inverted together so that their top and bottom are reversed.

[0080] Next, the first retaining part is moved relative to the second retaining part so that the first retaining part and the second retaining part are separated from each other. Here, the adhesive force of the adhesive layer 22 of the second retaining part is set to be stronger than the adhesive force of the adhesive layer 22 of the first retaining part. As a result, the base part 110 to which the first external electrode 120 is attached to the adhesive layer 22 of the second retaining part is peeled off from the adhesive layer 22 of the first retaining part.

[0081] As a result, multiple base parts 110 are held by the second holding part such that the second end face 116 faces downward in the vertical direction.

[0082] Next, as shown in Figure 5, a second external electrode 130 is formed on the second end face 116 (step S83). Step S83 further includes steps corresponding to steps S811 to S816 described above. Since the contents of these steps are basically the same as those of steps S811 to S816, their explanation will be omitted.

[0083] Next, as shown in FIG. 4, the multilayer ceramic capacitor 100 is recovered (step S9). The recovery of the multilayer ceramic capacitor 100 is realized, for example, by inserting the tip of a recovery blade into the gap between the adhesive layer 22 of the second holding part and the first external electrode 120 to remove the multilayer ceramic capacitor 100 from the second holding part.

[0084] By going through the steps described above, a plurality of multilayer ceramic capacitors 100 can be manufactured simultaneously according to the manufacturing method of the multilayer ceramic capacitor according to the present embodiment.

[0085] <C. Parentheses> In the manufacturing method of the multilayer ceramic capacitor according to the present embodiment, as described above, when the first external electrode 120 is provided on the element body 110, the plurality of element bodies 110 are pulled up from the conductive paste layer 51, and the element body 110 and the conductive paste layer 51 are connected to each other by the connection paste 53a. In this state, the plurality of element bodies 110 are relatively moved in the in-plane direction of the first end face 115 of each of the plurality of element bodies 110 with respect to the conductive paste layer 51 (see FIGS. 10 and 11).

[0086] Thereby, it is possible to effectively suppress the occurrence of air bubble entrainment, in which air bubbles are entrapped in the gap between the first end face 115 and the conductive paste 53 of the portion that becomes the first external electrode 121 on the end face side. This is because the air bubbles unintentionally entrapped in the gap are pushed out of the gap toward the outside by the relative movement of the element body 110 with respect to the conductive paste layer 51. The effect of suppressing the occurrence of this air bubble entrainment has been confirmed by the verification test described later.

[0087] Also, when the element body 110 relatively moves with respect to the conductive paste layer 51 as described above, the element body 110A relatively moves with respect to the conductive paste layer 51 so that the connection paste 53a connecting the element body 110 and the conductive paste layer 51 passes through the ranges on the first region R1 and the third region R3 of the conductive paste layer 51.

[0088] This effectively prevents the connection paste 53a from being unintentionally torn off. The following will explain this effect by comparing the manufacturing method of the multilayer ceramic capacitor according to this embodiment with the manufacturing method of the multilayer ceramic capacitor according to the first comparative example. Figures 13 and 14 are schematic side views illustrating step S814 of the manufacturing flow shown in Figure 5 in the manufacturing method of the multilayer ceramic capacitor according to the first comparative example. In order to distinguish it from the manufacturing method of the multilayer ceramic capacitor according to this embodiment, the base part of the manufacturing method of the multilayer ceramic capacitor according to the first comparative example is denoted by reference numeral 110X.

[0089] The manufacturing method for a multilayer ceramic capacitor according to the first comparative example differs from the manufacturing method for a multilayer ceramic capacitor according to this embodiment described above only in step S814, where, when the base body 110X moves relative to the conductive paste layer 51, the base body 110X moves relative to the conductive paste layer 51 such that the connecting paste 53a that connects it to the conductive paste layer 51 passes not only over the first region R1 and the third region R3 of the conductive paste layer 51, but also over the second region R2.

[0090] In other words, in the manufacturing method of the multilayer ceramic capacitor according to the first comparative example, the base body portion 110X is moved toward the conductive paste layer 51 in the in-plane direction of the first end face 115, in the portion where the other base body portions 110 of the plurality of base body portions 110 were immersed (see arrow AR4 in Figure 13).

[0091] Here, as shown in Figure 13, the thickness of the second region R2 (see dimension t1 in Figure 13) is smaller than the thickness of the third region R3 (see dimension t2 in Figure 13). This is because, as the base body 110, which was positioned in the second region R2, moves relative to the conductive paste layer 51 as described above, a portion of the conductive paste 53 that was located in the second region R2 is pushed out by the base body 110 toward the downstream side in the direction of movement of the base body 110.

[0092] Then, as the base body 110X moves from the third region R3 to the second region R2, the connecting paste 53a is unintentionally torn off, as shown in Figure 14. This is because, due to the difference in the thickness of the conductive paste layer 51 mentioned above, the position of the end of the connecting paste 53a on the conductive paste layer 51 side changes rapidly downward in the vertical direction.

[0093] If the connecting paste 53a is unintentionally torn off in this way, the connecting paste 53a may stretch like a string, forming a string-shaped area on the external electrode, or the connecting paste 53a may spring up, forming the external electrode on an unintended part of the side of the base body 110A.

[0094] In this regard, the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above effectively suppresses the unintentional tearing of the connecting paste 53a. This is because, as the connecting paste 53a passes through the ranges of the first region R1 and the third region R3 of the conductive paste layer 51, it is possible to avoid the position of the end of the connecting paste 53a on the conductive paste layer 51 side changing rapidly downward in the vertical direction during the movement of the base body 110A, as described above.

[0095] Thus, by using the manufacturing method for multilayer ceramic capacitors according to this embodiment, it is possible to suppress the distortion of the shape of the external electrodes due to the connection paste 53a being unintentionally torn off.

[0096] Therefore, by configuring it as described above, a method for manufacturing electronic components with stable quality can be achieved.

[0097] In the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, in step S814, the case where a plurality of element bodies 110 are moved along the second direction Y has been exemplified and described. However, the plurality of element bodies 110 may be moved along the first direction X. Further, the plurality of element bodies 110 may be moved along the first direction X after being moved along the second direction Y, or may be moved along the second direction Y after being moved along the first direction X.

[0098] In the method for manufacturing a multilayer ceramic capacitor according to the present embodiment, the case where the holding portion 20 including the base layer 21 and the adhesive layer 22 is used has been exemplified. However, instead of the holding portion 20 having such a configuration, a holding portion including a base layer in which a plurality of through holes are arranged in a lattice pattern and a substantially cylindrical adhesive portion inserted into each of the plurality of through holes may be used.

[0099] In this case, the plurality of element bodies 110 are held by the holding portion by being inserted into each of the plurality of adhesive portions. Further, in this case, by pushing out the plurality of multilayer ceramic capacitors 100 from the through holes by pins or the like, the plurality of multilayer ceramic capacitors 100 can be transferred to a holding portion configured separately from the holding portion, or the plurality of multilayer ceramic capacitors 100 can be recovered. ​​​​​​​​The manufacturing method for the multilayer ceramic capacitor according to the second comparative example differs from the manufacturing method for the multilayer ceramic capacitor according to this embodiment only in that it does not include the above-described step S814 (see Figure 5), and is otherwise identical. That is, in the manufacturing method for the multilayer ceramic capacitor according to the second comparative example, the connecting paste 53a is torn off by pulling up the base part 110 from the conductive paste layer 51 in step S813.

[0102] The base body of the multilayer ceramic capacitor according to the example and the second comparative example has dimensions of 1.0 mm in length, 0.5 mm in width, and 0.5 mm in thickness, excluding tolerances.

[0103] To check for the presence or absence of air bubbles, the multilayer ceramic capacitor was first polished so that the LT cross-section of the capacitor located in the center of the width direction W was exposed. Next, the cross-section was observed using an electron microscope or the like to check for the presence or absence of air bubbles. If air bubbles were present, a gap was created between the exposed part of the capacitor and the external electrode.

[0104] The sample size for the multilayer ceramic capacitors in the Example and the second Comparative Example is 100 units each. The occurrence rate of bubble lock in the multilayer ceramic capacitors in the Example is the value obtained by dividing the total number of samples in which bubble lock occurred by 100. The same applies to the occurrence rate of bubble lock in the multilayer ceramic capacitors in the second Comparative Example.

[0105] The results of this verification test showed that the occurrence rate of bubbles in the multilayer ceramic capacitor according to the second comparative example was 3%. On the other hand, the occurrence rate of bubbles in the multilayer ceramic capacitor according to the example was 0%. From these results, it was confirmed that the occurrence of bubbles can be dramatically suppressed by manufacturing a multilayer ceramic capacitor based on the manufacturing method of the multilayer ceramic capacitor according to this embodiment.

[0106] (First variation) Figure 15 is a schematic plan view illustrating step S814 shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the first modified example. The manufacturing method of a multilayer ceramic capacitor according to the first modified example based on the above-described embodiment will now be explained with reference to Figure 15.

[0107] The manufacturing method for a multilayer ceramic capacitor according to this modified example differs from the manufacturing method for a multilayer ceramic capacitor according to the embodiment described above in that the direction of movement of the base body 110 in step S814 is different.

[0108] In detail, in this modified example, as shown in Figure 15, multiple base parts 110 are reciprocated relative to the conductive paste layer 51 along the second direction Y, and then reciprocated relative to the conductive paste layer 51 along the first direction X. Note that in Figure 15, only one of the multiple base parts 110A is shown.

[0109] The multiple base parts 110 may be moved back and forth relative to the conductive paste layer 51 along the first direction X, and then moved back and forth relative to the conductive paste layer 51 along the second direction Y.

[0110] By moving the base body 110 in this manner, it becomes possible to sufficiently apply the conductive paste 53 to all four sides of the base body 110.

[0111] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, effects similar to those described in the above-described embodiment can be obtained, and a method for manufacturing electronic components with stabilized quality can be achieved.

[0112] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, the case in step S814 was described as in which a plurality of elemental parts 110 are moved back and forth along both the first direction X and the second direction Y. However, the plurality of elemental parts 110 may also be moved back and forth only along the first direction X, or only along the second direction Y.

[0113] (Second variation) Figure 16 is a schematic plan view illustrating the arrangement of multiple elemental parts in step S812 shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the second modified example. Figure 17 is a schematic plan view illustrating the movement of multiple elemental parts in step S814 shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the second modified example. Figure 18 is a schematic side view illustrating the movement of the elemental parts shown in Figure 17. More specifically, Figure 18 is a schematic side view viewed from the direction of arrow XVIII shown in Figure 17. Hereinafter, the manufacturing method of a multilayer ceramic capacitor according to the second modified example based on the above-described embodiment will be explained with reference to Figures 16 to 18.

[0114] The manufacturing method of the multilayer ceramic capacitor according to this modified example differs from the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above in the arrangement of the multiple elemental parts 110 held by the holding part 20.

[0115] More specifically, in the manufacturing method of the multilayer ceramic capacitor according to the embodiment described above, the elemental portion 110 constituting the B-row Rb is arranged so as not to overlap with the elemental portion 110 constituting the A-row Ra in the first direction X (see Figure 7). In contrast, in this modified example, as shown in Figure 16, the elemental portion 110 constituting the B-row Rb is arranged such that a part of it overlaps with the elemental portion 110 constituting the A-row Ra in the first direction X.

[0116] In this modified example, as shown in Figures 17 and 18, in step S814 described above, the multiple base body parts 110 are moved relative to the conductive paste layer 51 along the second direction Y, with the base body parts 110 and the conductive paste layer 51 connected to each other by the connecting paste 53a.

[0117] Here, as shown in Figure 17, during the movement of the base body 110A, a portion of the outer shape of the base body 110A overlaps with the second region R2 when viewed from above. On the other hand, as shown in Figure 18, the connecting paste 53a that connects the base body 110A and the conductive paste layer 51 is moved relative to the conductive paste layer 51 so as to pass through the ranges of the first region R1 and the third region R3 of the conductive paste layer 51. In other words, the base body 110A is moved relative to the conductive paste layer 51 so that the connecting paste 53a does not pass through the range of the second region R2 of the conductive paste layer 51.

[0118] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, effects similar to those described in the above-described embodiment can be obtained, and a method for manufacturing electronic components with stabilized quality can be achieved.

[0119] (Third variation) Figure 19 is a schematic side view illustrating step S813 shown in Figure 5 in the manufacturing method of a multilayer ceramic capacitor according to the third modified example. The manufacturing method of a multilayer ceramic capacitor according to the third modified example based on the above-described embodiment will now be explained with reference to Figure 19.

[0120] The method for manufacturing a multilayer ceramic capacitor according to this modified example differs from the method for manufacturing a multilayer ceramic capacitor according to the embodiment described above in that the direction of movement of the base body 110 in step S813 is different, and that step S814 is not included.

[0121] In detail, in this modified example, as shown in Figure 19, the multiple base parts 110 are moved relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 while being pulled up from the conductive paste layer 51 (see arrow AR5 in Figure 19).

[0122] Even when the base body 110 is moved in this manner, the base body 110 can be moved relative to the conductive paste layer 51 such that the connecting paste 53a that connects the base body 110 and the conductive paste layer 51 passes through the ranges of the first region R1 and the third region R3 of the conductive paste layer 51.

[0123] In the manufacturing method of the multilayer ceramic capacitor according to this modified example, effects similar to those described in the above-described embodiment can be obtained, and a method for manufacturing electronic components with stabilized quality can be achieved.

[0124] (Other forms, etc.) In the embodiments and modifications of the present disclosure described above, a multilayer ceramic capacitor was used as an example of an electronic component, and its manufacturing method was explained. However, the manufacturing method of the electronic component shown in these embodiments and modifications may also be applied to the manufacturing of other electronic components, such as a multilayer ceramic inductor or a multilayer ceramic thermistor. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic and the internal electrodes are made of coil-shaped conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layer is made of semiconductor ceramic.

[0125] Furthermore, the shape, configuration, size, number, material, etc., of each part shown in the embodiments and modified examples of the present disclosure described above can be modified in various ways, as long as they do not deviate from the spirit of the present disclosure.

[0126] Furthermore, the characteristic configurations shown in the embodiments and modifications of the present disclosure described above can naturally be combined with each other without departing from the spirit of the present disclosure.

[0127] Thus, the embodiments and their variations disclosed herein are illustrative in all respects and not restrictive. The technical scope of the present invention is defined by the claims and includes all modifications within the meaning and scope equivalent to the claims. [Explanation of Symbols]

[0128] 20 Holding part, 21 Base layer, 22 Adhesive layer, 23 Actuator, 51 Conductive paste layer, 53 Conductive paste, 53a Connecting paste, 60 Flat plate part, 90 Control unit, 91 CPU, 92 Memory, 100 Multilayer ceramic capacitor, 110, 110A, 110X Base body part, 111 First side, 112 Second side, 113 Third side, 114 Fourth side, 115 First end face, 116 Second end face, 118 Internal electrode layer, 118a First internal electrode layer, 118b Second internal electrode layer, 119 Dielectric layer, 120 First external electrode, 121 End face side first external electrode, 122 Side side first external electrode, 130 Second external electrode, 131 End face side second external electrode, 132 Side side second external electrode, 160 Underlay electrode layer, 170 Plating layer, C inner layer, p1 first pitch spacing, p2 second pitch spacing, R1 first region, R2 second region, R3 third region, Ra A-row region, Rb B-row region.

Claims

1. A method for manufacturing electronic components, comprising a base body having a first end face and a second end face opposite to each other in the longitudinal direction, and an external electrode provided on each of the first end face and the second end face, wherein multiple electronic components are manufactured simultaneously. The process involves immersing the plurality of base body parts, while maintaining a distance between them, in a single conductive paste layer which is a precursor of the external electrode, from the first end face side of each of the plurality of base body parts, The process involves immersing the plurality of base parts in the conductive paste layer from the first end face side of each of the plurality of base parts, and then pulling the plurality of base parts out of the conductive paste layer. The process includes the step of moving the plurality of base parts relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base parts with respect to the conductive paste layer, in a state where the plurality of base parts and the conductive paste layer are connected to each other by conductive paste stretched from the conductive paste layer, such that the plurality of base parts are pulled up from the conductive paste layer. In the state in which the plurality of base parts are immersed in the conductive paste layer, the conductive paste layer includes a first region in which one of the plurality of base parts is immersed, a second region in which the other base parts are immersed, and a third region excluding the first region and the second region. A method for manufacturing an electronic component, comprising the step of moving the plurality of base body portions relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body portions, wherein one of the plurality of base body portions is moved relative to the conductive paste layer such that the conductive paste connecting the one base body portion and the conductive paste layer passes within the ranges of the first region and the third region.

2. The method for manufacturing an electronic component according to claim 1, wherein, in a state in which the plurality of base body parts are immersed in the conductive paste layer, the plurality of base body parts are arranged in a linear manner at a first pitch interval along a first direction perpendicular to the longitudinal direction, and are positioned in a staggered pattern with spacing between them along the second direction, with spacing between them.

3. The aforementioned multiple rows are composed of A-row sections and B-row sections that are alternately located in the second direction. The position of the base body in row B is offset from the position of the base body in row A by half the first pitch interval in the first direction, The method for manufacturing an electronic component according to claim 2, wherein in the step of moving the plurality of base body portions relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body portions, each of the plurality of base body portions is moved by a distance of at least half the dimension of the first pitch spacing and less than the dimension of the first pitch spacing along the first direction, or by a distance of at least the dimension of the second pitch spacing and less than twice the dimension of the second pitch spacing along the second direction.

4. A method for manufacturing an electronic component according to claim 3, wherein in the step of moving the plurality of base body portions relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body portions, each of the plurality of base body portions is moved along the first direction by a distance of at least half the dimension of the first pitch spacing and less than the dimension of the first pitch spacing, and then moved along the second direction by a distance of at least the dimension of the second pitch spacing and less than twice the dimension of the second pitch spacing, or is moved along the second direction by a distance of at least half the dimension of the first pitch spacing and less than twice the dimension of the second pitch spacing, and then moved along the first direction by a distance of at least half the dimension of the first pitch spacing and less than the dimension of the first pitch spacing.

5. A method for manufacturing an electronic component according to any one of claims 1 to 4, wherein, in the step of moving the plurality of base body portions relative to the conductive paste layer in the in-plane direction of the first end face of each of the plurality of base body portions, the plurality of base body portions are reciprocated relative to the conductive paste layer along the in-plane direction.

Images