Light-emitting device

Abstract

The present invention provides a light-emitting device in which a wavelength converter that converts excitation light into fluorescence is in contact with a lens, while minimizing the load of the lens on the power supply member of the excitation light emission section. [Solution] The light-emitting device 1 comprises a solid-state light-emitting element 10 including an excitation light emission section 12 and a power supply member 13, a wavelength converter 20 that converts excitation light into fluorescence, a sealing resin 30 arranged to surround at least a portion of the side surface 23 of the wavelength converter 20 and covering at least a portion of the power supply member 13, and a lens 40 having a flat surface 41 that captures at least one of excitation light and fluorescence, wherein the fluorescence emission surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40 are in contact, and at least a portion of the surface of the sealing resin 30 facing the flat surface 41 of the lens 40 is not in contact with the lens 40.

Description

[Technical Field]

[0001] This invention relates to a light-emitting device. [Background technology]

[0002] In recent years, light-emitting devices combining light-emitting elements such as light-emitting diodes (LEDs) or laser diodes (LDs) with phosphors have become widespread. Such light-emitting devices are used as light sources for image display devices such as displays and projectors, as well as for lighting devices.

[0003] Patent Document 1 discloses a light source device having a light-emitting chip, a light conversion layer, and a lens layer. The lens layer is in contact with the light conversion layer such that light emitted from the light-emitting chip passes through the light conversion layer and then directly enters the lens layer. The light-emitting surface of the lens layer is formed in an arc shape, and the light emitted from the light-emitting chip diverges within the light conversion layer and the lens layer. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2014-232721 [Overview of the project] [Problems that the invention aims to solve]

[0005] Incidentally, conventional light source devices have conductive wires, which connect the light-emitting chip to electrodes connected to the circuit board. Power is supplied to the light-emitting chip via these conductive wires. However, in conventional light source devices, the load of the lens layer is applied to the conductive wires, which may easily cause stress on the conductive wires.

[0006] This invention has been made in view of the problems of the prior art described above. The object of this invention is to provide a light-emitting device in which a wavelength converter that converts excitation light into fluorescence is in contact with a lens, while the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting device. [Means for solving the problem]

[0007] To solve the above problems, an embodiment of the present invention includes a solid-state light-emitting element that includes an excitation light emitting section that emits excitation light, and a power supply member provided around the excitation light emitting section and supplying power to the excitation light emitting section. The light-emitting element is arranged in the direction in which excitation light is emitted from the excitation light emitting section, and includes a wavelength converter that converts the excitation light into fluorescence and has an excitation light incident surface into which the excitation light is incident, a fluorescence emission surface from which light containing fluorescence is emitted, and a side surface. The light-emitting element is arranged so as to surround at least a part of the side surface of the wavelength converter and includes a sealing resin that covers at least a part of the power supply member. The light-emitting element includes a lens having a flat surface that captures at least one of excitation light and fluorescence. The fluorescence emission surface of the wavelength converter and the flat surface of the lens are in contact. At least a part of the surface of the sealing resin facing the flat surface of the lens is not in contact with the lens. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a light-emitting device in which a wavelength converter that converts excitation light into fluorescence is in contact with a lens, while the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting device. [Brief explanation of the drawing]

[0009] [Figure 1] This is a side cross-sectional view showing an example of a light-emitting device according to one embodiment. [Figure 2] This is a side cross-sectional view showing an example of a light-emitting device according to another embodiment. [Figure 3] This is a side cross-sectional view showing an example of a light-emitting device according to another embodiment. [Figure 4] This is a side cross-sectional view showing an example of a light-emitting device according to another embodiment. [Figure 5] This is a side cross-sectional view showing an example of a light-emitting device according to another embodiment. [Modes for carrying out the invention]

[0010] The light-emitting device according to this embodiment will be described in detail below with reference to the drawings. Note that the dimensional ratios in the drawings are exaggerated for illustrative purposes and may differ from the actual ratios.

[0011] [First Embodiment] First, the light-emitting device 1 according to the first embodiment will be described with reference to Figure 1. As shown in Figure 1, the light-emitting device 1 according to this embodiment comprises a solid-state light-emitting element 10, a wavelength converter 20, a sealing resin 30, a frame 35, and a lens 40.

[0012] The solid-state light-emitting element 10 emits excitation light. The solid-state light-emitting element 10 may include a light-emitting diode (LED) or a laser diode (LD). The solid-state light-emitting element 10 includes a solid-state light-emitting element substrate 11, an excitation light emission unit 12, and a plurality of power supply members 13. The solid-state light-emitting element substrate 11 is a substrate on which the excitation light emission unit 12 is mounted, and may be a printed circuit board. The excitation light emission unit 12 and the plurality of power supply members 13 are connected to the solid-state light-emitting element substrate 11.

[0013] The excitation light emission unit 12 emits excitation light. The wavelength of the excitation light is not particularly limited, but the peak wavelength of the excitation light may be 430 nm or more and 460 nm or less, or 445 nm or more and 460 nm or less. By having a peak wavelength of excitation light of 430 nm or more, the color rendering of the light emitted by the light-emitting device 1 can be improved. By having a peak wavelength of excitation light of 460 nm or less, the luminous efficiency of the light-emitting device 1 can be improved. In this specification, "peak" refers to the point where the intensity of the spectrum is maximum. Furthermore, the excitation light is not limited to blue light, but may be ultraviolet light, violet light, green light, red light, or near-infrared light.

[0014] In this specification, an example is described in which the solid-state light-emitting element 10 includes one excitation light emitting unit 12. However, the solid-state light-emitting element 10 may include multiple excitation light emitting units 12. When the solid-state light-emitting element 10 includes multiple excitation light emitting units 12, the excitation light emitting units 12 may be arranged side by side in a planar direction on the solid-state light-emitting element substrate 11. The multiple excitation light emitting units 12 may each emit excitation light having the same wavelength, or they may each emit excitation light having different wavelengths. For example, the multiple excitation light emitting units 12 may emit excitation light that is a combination of at least two selected from excitation light emitting units 12 that emit ultraviolet light, violet light, blue light, green light, red light, and near-infrared light.

[0015] The power supply member 13 is provided around the excitation light emission unit 12 and supplies power to the excitation light emission unit 12. The power supply member 13 connects the solid-state light-emitting element substrate 11 and the excitation light emission unit 12, supplying power from the solid-state light-emitting element substrate 11 to the excitation light emission unit 12. One end of the power supply member 13, the first end, is connected to the excitation light emission unit 12, and the second end, opposite to the first end, is connected to the solid-state light-emitting element substrate 11. The second end of the power supply member 13 is provided around the excitation light emission unit 12 in a plan view. The power supply member 13 may include a linear conductive member. In this embodiment, the power supply member 13 is a metal wire such as a gold wire, but it may also be wiring provided on the solid-state light-emitting element substrate 11.

[0016] The wavelength converter 20 is positioned in a direction from which the excitation light is emitted to the excitation light emission section 12. The wavelength converter 20 may be laminated so as to be in direct contact with the light emission surface of each excitation light emission section 12, or it may be laminated via an adhesive layer. The adhesive layer for bonding the excitation light emission section 12 and the wavelength converter 20 is not particularly limited, but may include, for example, at least one of a light-transmitting inorganic adhesive and an organic adhesive.

[0017] The wavelength converter 20 converts excitation light into fluorescence. Specifically, the wavelength converter 20 converts excitation light into fluorescence, which has a different spectral distribution from the excitation light and a higher proportion of longer wavelength components than the excitation light. The wavelength converter 20 has an excitation light incident surface 21 into which the excitation light is incident, a fluorescence emission surface 22 from which light containing fluorescence is emitted, and a side surface 23 connecting the excitation light incident surface 21 and the fluorescence emission surface 22. The excitation light incident surface 21 is in contact with the excitation light emission section 12. The fluorescence emission surface 22 is in contact with the lens 40. The side surface 23 is in contact with the sealing resin 30.

[0018] The external dimensions of the wavelength converter 20 in a plan view are not particularly limited, but may be approximately the same as the external dimensions of the excitation light emission unit 12 in a plan view. With this configuration, the excitation light and fluorescence guided in a planar direction within the wavelength converter 20 are less likely to spread beyond the external dimensions of the excitation light emission unit 12. Therefore, a light-emitting device 1 with a high energy density of output light and high brightness can be provided. Note that "approximately the same" means that the external dimensions of the wavelength converter 20 in a plan view are -20% to +20%, -10% to +10%, -5% to +5%, or -3% to +3% relative to the external dimensions of the excitation light emission unit 12 in a plan view. Note that the external dimensions of the wavelength converter 20 in a plan view may be the external dimensions of the excitation light incident surface 21. Also, the external dimensions of the excitation light emission unit 12 in a plan view may be the external dimensions of the excitation light emission surface from which the excitation light of the excitation light emission unit 12 is emitted. In this specification, external dimensions may be interpreted as area.

[0019] The wavelength converter 20 may contain a phosphor. The phosphor may absorb the excitation light emitted from the excitation light emitting unit 12 and emit fluorescence having a longer wavelength than the excitation light. The phosphor may contain an inorganic phosphor. The phosphor may contain at least one phosphor selected from the group consisting of a violet phosphor, a blue phosphor, a green phosphor, a yellow phosphor, a red phosphor, and a near-infrared phosphor. When the wavelength converter 20 contains many types of phosphors, the output light emitted by the light emitting device 1 contains light of more wavelength components, so that when the light emitting device 1 is used in an inspection device such as a spectral imaging device for appearance inspection, accurate inspection results can be obtained.

[0020] The violet phosphor has an emission peak in the wavelength range of 400 nm or more and less than 440 nm. Examples of the violet phosphor include La3Si 8-x Al x N 11-x O 4+x (0 ≦ x ≦ 1.75):Ce 3+ and the like.

[0021] The blue phosphor has an emission peak in the wavelength range of 440 nm or more and less than 500 nm. Examples of the blue phosphor include BaMgAl 10 O 17 :Eu 2+ , CaMgSi2O6:Eu 2+ , Ba3MgSi2O8:Eu 2+ , Sr 10 (PO4)6Cl2:Eu 2+ and the like.

[0022] The green phosphor has an emission peak in the wavelength range of 500 nm or more and less than 540 nm. Examples of the green phosphor include Lu3Al5O 12 :Ce 3+ , (Lu,Y)3Al5O 12 :Ce 3+ , Y3(Al,Ga)5O 12 :Ce 3+ , (Ba,Sr)2SiO4:Eu 2+ , Ca8Mg(SiO4)4Cl2:Eu 2+Ca8Mg(SiO4)4Cl2:Eu 2+ ,Mn 2+ These are some examples.

[0023] Yellow phosphors have an emission peak in the wavelength range of 545 nm to 595 nm. Examples of yellow phosphors include (Sr,Ba)2SiO4:Eu 2+ , La3Si6N 11 :Ce 3+ Y3Al5O 12 :Ce 3+ (Y,Gd)3Al5O 12 :Ce 3+ Ca-α-SiAlON:Eu 2+ These are some examples.

[0024] The red phosphor has an emission peak in the wavelength range of 600 nm to less than 700 nm. The red phosphor may be excited by the excitation light emission unit 12 or by the emission light of at least one of the green phosphor and the yellow phosphor, and emit red light. An example of the red phosphor is Sr2Si5N8:Eu 2+ CaAlSiN3:Eu 2+ (CASN), (Ca,Sr)AlSiN3:Eu 2+ (SCASN), SrAlSi4N7:Eu 2+ CaS:Eu 2+ La2O2S:Eu 3+ Y3Mg2(AlO4)(SiO4)2:Ce 3+ These are some examples.

[0025] Near-infrared phosphors may have fluorescence peaks in the wavelength range of 700 nm to less than 1500 nm. Near-infrared phosphors may also be inorganic phosphors having fluorescence peaks in the wavelength range of 750 nm to less than 1500 nm, particularly 780 nm to less than 900 nm. Typical examples of such near-infrared phosphors include phosphors activated with transition metal ions and phosphors activated with rare earth ions. Specifically, near-infrared phosphors may include Ni 2+ Activating phosphor, Cr 3+It may be at least one selected from the group consisting of activating phosphors and rare earth activating phosphors. The rare earth activating phosphor is Tm 3+ Er 3+ , Nd 3+ and Yb 3+ The phosphor may be activated with at least one selected from the group consisting of the following. Furthermore, the near-infrared phosphor may be a phosphor co-activated with a transition metal ion and a rare earth ion, a phosphor co-activated with different types of transition metal ions, or a phosphor co-activated with different types of rare earth ions. Since such a co-activated phosphor can emit fluorescence containing light of more wavelength components with a single phosphor, a light-emitting device 1 that contains light of more wavelength components can be realized with a more compact configuration.

[0026] In near-infrared phosphors, preferred fluorescent ions are Cr 3+ It is. Cr as a fluorescent ion. 3+ By using this method, it becomes easy to obtain near-infrared phosphors that absorb blue light and convert it into near-infrared light components. Furthermore, it becomes easy to change the light absorption peak wavelength and / or fluorescence peak wavelength depending on the type of matrix, which is advantageous in changing the excitation spectral shape and fluorescence spectral shape.

[0027] Near-infrared phosphors are made of Cr 3+ It is preferable that the phosphor is composed of a metal composite oxide activated with Cr. Specifically, the near-infrared phosphor is based on at least one selected from the group consisting of borate, phosphate, silicate, aluminate, galliumate, germanate, tungstate, and metal oxide, and Cr 3+ It is preferable that the phosphor is activated with [a specific substance]. Examples of such near-infrared phosphors include CeSc3(BO3)4:Cr 3+ 、(La,Y,Sc)4(BO3)4:Cr 3+ LaSc3(BO3)4:Cr 3+ ,ScBO3:Cr 3+ ,KInP2O7:Cr 3+ Sr3InP3O 12 :Cr 3+ Sr9In(PO4)7:Cr 3+NaScSi2O6:Cr 3+ Mg2Al4Si5O 18 :Cr 3+ La3(Ga,Gd)5GeO 14 :Cr 3+ La3(Ga,Al)5SiO 14 :Cr 3+ LaMgGa 11 O 19 :Cr 3+ Mg3Ga2GeO8:Cr 3+ Li(In,Sc)Ge2O6:Cr 3+ Zn3(Ga,Al)Ge2O 10 :Cr 3+ LiMg2InGe2O8:Cr 3+ NaCa2GaGe5O 14 :Cr 3+ NaGdMgWO6:Cr 3+ (Ga,Sc)2O3:Cr 3+ LaLuO3:Cr 3+ Ba3Sc4O9:Cr 3+ Zn2SnO4:Cr 3+ LiIn2SbO6:Cr 3+ LiSrAlF6:Cr 3+ It may include at least one selected from the group consisting of the following.

[0028] The near-infrared phosphor is also preferably a phosphor having a garnet-type crystal structure, which has a proven track record in many practical applications. 3+ Phosphors having a garnet-type crystalline structure activated by this include, for example, RE3B'2(AlO4)3:Cr 3+ RE3B'2(GaO4)3:Cr 3+ It is represented by the general formula: RE is a rare earth element, and B' is at least one element selected from Al, Ga, and Sc.

[0029] The near-infrared phosphor is preferably at least one of rare-earth aluminum garnet phosphor and rare-earth gallium garnet phosphor. Specifically, the near-infrared phosphor is Y3Al2(AlO4)3:Cr 3+ La3Al2(AlO4)3:Cr3+ , Gd3Al2(AlO4)3:Cr 3+ , Y3Ga2(AlO4)3:Cr 3+ , La3Ga2(AlO4)3:Cr 3+ , Gd3Ga2(AlO4)3:Cr 3+ , Y3Sc2(AlO4)3:Cr 3+ , La3Sc2(AlO4)3:Cr 3+ , Gd3Sc2(AlO4)3:Cr 3+ , Y3Ga2(GaO4)3:Cr 3+ , La3Ga2(GaO4)3:Cr 3+ , Gd3Ga2(GaO4)3:Cr 3+ , Y3Sc2(GaO4)3:Cr 3+ , La3Sc2(GaO4)3:Cr 3+ , Gd3Sc2(GaO4)3:Cr 3+ It is preferably at least one selected from the group consisting of.

[0030] The wavelength converter 20 may contain a phosphor ceramic. With this configuration, the thermal conductivity of the wavelength converter 20 can be improved, and the heat of the wavelength converter 20 is more likely to be radiated to the outside. Therefore, it becomes possible to input excitation light with a high energy density to the wavelength converter 20, and furthermore, a high-output light-emitting device 1 can be provided. In addition, light containing various wavelength components can be output without unevenness. The phosphor ceramic may be, for example, plate-shaped.

[0031] The wavelength converter 20 may include a plurality of stacked phosphor layers. With this configuration, it is possible to provide a light-emitting device 1 that can output light containing various wavelength components without unevenness. Each of the plurality of phosphor layers may contain a phosphor that emits fluorescence with a different spectral distribution. As a result, the width of the spectrum of the fluorescence emitted by each phosphor layer becomes wider.

[0032] The wavelength converter 20 may include a phosphor layer in which phosphor particles are dispersed in a encapsulating material such as resin. In such a phosphor layer, the excitation light and fluorescence are easily scattered due to the difference between the refractive index of the encapsulating material and the refractive index of the phosphor particles. Therefore, it is possible to provide a light-emitting device 1 with less unevenness in the output light and high uniformity of the output light.

[0033] The wavelength converter 20 may include a phosphor layer made of phosphor ceramics and a phosphor layer in which phosphor particles are dispersed in a encapsulating material. By having such a configuration, it is possible to provide a light-emitting device 1 that combines both heat dissipation and uniformity of output light.

[0034] Among the multiple phosphor layers, the phosphor layer in contact with the flat surface 41 of the lens 40 may contain resin and phosphor powder. This configuration allows for more stable contact between the fluorescence emission surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40. As a result, heat from the wavelength converter 20 can be efficiently dissipated to the lens 40, and a light-emitting device 1 with even higher output can be provided.

[0035] The sealing resin 30 is arranged to surround the side surface 23 of the wavelength converter 20 and covers at least a portion of the power supply member 13. However, it is sufficient that the sealing resin 30 is arranged to surround at least a portion of the side surface 23 of the wavelength converter 20. This configuration allows the power supply member 13 and the wavelength converter 20 to be sealed and protected. The sealing resin 30 may be housed within a frame 35 provided on the solid-state light-emitting element substrate 11. The frame 35 is connected to the solid-state light-emitting element substrate 11. The frame 35 may be made of a metal such as aluminum. Inside the frame 35 are the excitation light emission section 12 and the wavelength converter 20.

[0036] The sealing resin 30 may cover a portion of the surface of the solid-state light-emitting element substrate 11, or it may surround and cover the periphery of the excitation light emission section 12 in the planar direction. The sealing resin 30 may also surround at least a portion of the power supply member 13. Furthermore, the sealing resin 30 may be in direct contact with the side surface 23 of the wavelength converter 20. In this embodiment, the wavelength converter 20 does not protrude from the sealing resin 30, and the entire side surface 23 of the wavelength converter 20 is in contact with the sealing resin 30.

[0037] The sealing resin 30 may include an electrically insulating thermosetting resin. The sealing resin 30 may include at least one selected from the group consisting of, for example, silicone resin, epoxy resin, and phenolic resin. By including these materials in the sealing resin 30, the power supply member 13 is more robustly protected. As a result, a highly reliable light-emitting device 1 can be provided.

[0038] The sealing resin 30 may reflect at least a portion of the excitation light or fluorescence. This configuration makes it difficult for the fluorescence emitted by the wavelength converter 20 to spread out from the side surface 23. As a result, a light-emitting device 1 that emits higher brightness output light can be provided. The sealing resin 30 may have light reflectivity that reflects at least one of visible light and near-infrared light. Specifically, the sealing resin 30 may contain a factor that scatters at least one of visible light and near-infrared light. The sealing resin 30 may contain, for example, at least one of pores (air) and metal oxide particles as a factor that scatters at least one of visible light and near-infrared light. These factors may be dispersed in the thermosetting resin. The metal oxide particles may include at least one selected from the group consisting of aluminum oxide (Al2O3) particles, titanium oxide (TiO2) particles, zirconium oxide (ZrO2) particles, and tantalum oxide (Ta2O5) particles.

[0039] The lens 40 takes in at least one of the excitation light and the fluorescence and emits output light containing at least one of the excitation light and the fluorescence. The lens 40 has a flat surface 41 and an output surface 42 which is the surface opposite to the flat surface 41. The flat surface 41 takes in at least one of the excitation light and the fluorescence. In this embodiment, the lens 40 is a convex lens, and the output surface 42 is curved so as to bulge outwards toward the opposite side of the flat surface 41.

[0040] The fluorescence-emitting surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40 are in contact. In this embodiment, the flat surface 41 of the lens 40 is in contact with the entire fluorescence-emitting surface 22 of the wavelength converter 20.

[0041] On the other hand, at least a portion of the surface of the sealing resin 30 facing the flat surface 41 of the lens 40 is not in contact with the lens 40. Specifically, as shown in Figure 1, the external dimensions of the flat surface 41 of the lens 40 in a plan view are smaller than the external dimensions of the sealing resin 30 in a plan view. Specifically, the flat surface 41 of the lens 40 is in contact with a portion of the sealing resin 30. Specifically, the flat surface 41 of the lens 40 is in contact with the wavelength converter 20, a portion of the sealing resin 30, and the boundary line between the wavelength converter 20 and the sealing resin 30, covering them.

[0042] The light-emitting device 1 may further include an adhesive layer provided on the fluorescence-emitting surface 22 of the wavelength converter 20. The fluorescence-emitting surface 22 and the flat surface 41 may be in contact via the adhesive layer. This configuration allows for more stable contact between the fluorescence-emitting surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40. As a result, heat from the wavelength converter 20 can be efficiently dissipated to the lens 40, providing a light-emitting device 1 with even higher output.

[0043] The lens 40 is formed from a light-transmitting material. The lens 40 may contain at least one of glass and resin. The thermal conductivity of typical glass is about 0.5 W / mK to about 2 W / mK, which is about 10 to 100 times higher than the thermal conductivity of air (0.0241 W / mK at 0°C). Therefore, if the lens 40 is made of glass, the heat from the wavelength converter 20 is more easily dissipated to the lens 40, and heat is also more easily dissipated in the direction of excitation light emission.

[0044] On the other hand, the thermal conductivity of typical resins is approximately 0.1 W / mK to 0.3 W / mK, which is about 10 times higher than the thermal conductivity of air (0.0241 W / mK at 0°C). Therefore, even when the lens 40 is made of resin, the heat from the wavelength converter 20 is easily dissipated to the lens 40, and heat is also easily dissipated in the direction of excitation light emission. Furthermore, resins are lightweight and resistant to cracking, making them easy to handle. The resin may contain at least one selected from the group consisting of acrylic resin, polyester, polycarbonate, and cyclic olefin polymer.

[0045] In this embodiment of the light-emitting device 1, the external dimensions of the flat surface 41 of the lens 40 in a plan view are larger than the external dimensions of the wavelength converter 20 in a plan view. However, the external dimensions of the flat surface 41 of the lens 40 in a plan view may be smaller than the external dimensions of the wavelength converter 20 in a plan view.

[0046] As described above, in the light-emitting device according to this embodiment, the fluorescence-emitting surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40 are in contact. Therefore, the heat from the wavelength converter 20 can be dissipated to the lens. In addition, because the distance between the wavelength converter 20 and the lens 40 is short, the fluorescence absorption efficiency is increased. Therefore, a light-emitting device 1 with high output can be provided.

[0047] Furthermore, in the light-emitting device 1 according to this embodiment, at least a portion of the surface of the sealing resin 30 facing the flat surface 41 of the lens 40 does not come into contact with the lens 40. This configuration reduces the area in contact between the lens 40 and the sealing resin 30. Therefore, the load on the sealing resin 30 can be reduced compared to the case where the lens 40 is in contact with the entire sealing resin 30. Consequently, the load on the power supply member 13 covered by the sealing resin 30 can be reduced, and the risk of wire breakage in the power supply member 13 can be reduced.

[0048] Therefore, even while the wavelength converter and the lens are in contact, the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting element, making it possible to provide a highly reliable light-emitting device.

[0049] As mentioned above, the wavelength converter 20 may include a plurality of stacked phosphor layers. For example, as shown in Figure 2, the wavelength converter 20 may include a first wavelength converter 24 and a second wavelength converter 25 in contact with the first wavelength converter 24. The first wavelength converter 24 is positioned between the solid-state light-emitting element 10 and the second wavelength converter 25. In this embodiment, the first wavelength converter 24 is in contact with the solid-state light-emitting element 10 and has an excitation light incident surface 21. The second wavelength converter 25 is positioned between the first wavelength converter 24 and the lens 40. In this embodiment, the second wavelength converter 25 has a fluorescence emission surface 22, and the fluorescence emission surface 22 of the second wavelength converter 25 is in contact with the flat surface 41 of the lens 40. The sealing resin 30 is positioned to surround the entire side surface 23 of the first wavelength converter 24. On the other hand, the sealing resin 30 is not positioned to surround the side surface of the second wavelength converter 25. Furthermore, at least a portion of the sealing resin 30 that faces the flat surface 41 of the lens 40 is not in contact with the lens 40.

[0050] The external dimensions of the first wavelength converter 24 in a plan view are approximately the same as those of the excitation light emission unit 12 in a plan view. This configuration makes it difficult for the excitation light and fluorescence guiding in a planar direction within the wavelength converter 20 to spread beyond the external dimensions of the excitation light emission unit 12. On the other hand, the external dimensions of the second wavelength converter 25 in a plan view are different from those of the excitation light emission unit 12 in a plan view. Specifically, the external dimensions of the second wavelength converter 25 in a plan view are larger than those of the excitation light emission unit 12 and the first wavelength converter 24 in a plan view. This configuration increases the surface area of ​​the contact interface between the wavelength converter 20 and the sealing resin 30. Therefore, heat can be dissipated from the wavelength converter 20 to the sealing resin 30, providing a light-emitting device 1 with even higher heat dissipation. Furthermore, the external dimensions of the second wavelength converter 25 in a plan view are preferably, for example, -30% to +300%, -30% to +100%, -30% to +50%, or -30% to +30% relative to the external dimensions of the excitation light emission section 12 in a plan view.

[0051] Although Figure 2 illustrates an example in which the wavelength converter 20 is stacked in two phosphor layers, the example is not limited to this. The wavelength converter 20 may include, for example, three or more phosphor layers.

[0052] [Second Embodiment] Next, the light-emitting device 1 according to the second embodiment will be described with reference to Figure 3. Note that the configuration of the light-emitting device 1 according to this embodiment, which is the same as that of the above embodiment, will not be described.

[0053] In the light-emitting device 1 according to this embodiment, the fluorescence-emitting surface 22 of the wavelength converter 20 is in contact only with the flat surface 41 of the lens 40. A portion of the wavelength converter 20 protrudes from the sealing resin 30. The flat surface 41 of the lens 40 is in contact only with the fluorescence-emitting surface 22 of the wavelength converter 20. The surface of the sealing resin 30 is not in contact with the lens 40. Furthermore, a portion of the side surface 23 of the wavelength converter 20 is in contact with the sealing resin 30, while a portion of the side surface 23 is exposed and not in contact with the sealing resin 30.

[0054] In the light-emitting device 1 according to this embodiment, the external dimensions of the flat surface 41 of the lens 40 in a plan view are larger than the external dimensions of the sealing resin 30 in a plan view. However, the external dimensions of the flat surface 41 of the lens 40 in a plan view may be smaller than the external dimensions of the sealing resin 30 in a plan view.

[0055] Furthermore, in the light-emitting device 1 according to this embodiment, the flat surface 41 of the lens 40 is not in contact with the frame 35. However, the flat surface 41 of the lens 40 may be in contact with the frame 35. Also, in the light-emitting device 1 according to this embodiment, the position of the upper surface of the sealing resin 30 is lower than the upper end of the frame 35. However, the position of the upper surface of the sealing resin 30 may be at the same height as the upper end of the frame 35. In this case, the flat surface 41 of the lens 40 may not be in contact with the frame 35, and a space may be left between them.

[0056] As described above, in the light-emitting device 1 according to this embodiment, the external dimensions of the flat surface 41 of the lens 40 in a plan view may be smaller than the external dimensions of the sealing resin 30 in a plan view. The fluorescence-emitting surface 22 of the wavelength converter 20 and the flat surface 41 of the lens 40 may be in contact. With this configuration, at least a portion of the surface of the sealing resin 30 facing the flat surface 41 of the lens 40 does not come into contact with the lens 40. Therefore, compared to the case where the lens 40 is in contact with the entire sealing resin 30, the load on the sealing resin 30 can be reduced, and the load on the power supply member 13 can be reduced.

[0057] [Third Embodiment] Next, the light-emitting device 1 according to the third embodiment will be described with reference to Figure 4. Note that the configuration of the light-emitting device 1 according to this embodiment, which is the same as that of the above embodiment, will not be described.

[0058] As shown in Figure 4, the light-emitting device 1 according to this embodiment further includes a lens fixing jig 50 and a heat dissipation substrate 60 in addition to the light-emitting device 1 according to the first embodiment.

[0059] The lens fixing jig 50 physically contacts the lens 40 to position the lens 40. One end of the lens fixing jig 50 is connected to the lens 40, and the other end is connected to the surface of the heat dissipation substrate 60. The lens fixing jig 50 may be made of metal.

[0060] The heat dissipation substrate 60 mounts the solid-state light-emitting element 10 and is in contact with the lens fixing jig 50. The solid-state light-emitting element 10, wavelength converter 20, sealing resin 30, and frame 35 are surrounded by the lens fixing jig 50 and the heat dissipation substrate 60. The shape of the heat dissipation substrate 60 is not particularly limited, and the heat dissipation substrate 60 may be a plate-shaped member. The heat dissipation substrate 60 may be a metal member with high thermal conductivity, such as aluminum.

[0061] As described above, the light-emitting device 1 may further include a lens fixing jig 50 that physically contacts the lens 40 to determine its position. With this configuration, the heat transferred from the wavelength converter 20 to the lens 40 is further transferred to the lens fixing jig 50, allowing the heat from the wavelength converter 20 to be efficiently dissipated to the lens 40. As a result, excitation light with a high energy density can be supplied to the wavelength converter 20, and a light-emitting device 1 with even higher output can be provided.

[0062] Furthermore, the light-emitting device 1 may also include a heat dissipation substrate 60 that mounts a solid-state light-emitting element 10 and is in contact with the lens fixing jig 50. With this configuration, the heat transferred from the lens 40 to the lens fixing jig 50 is further transferred to the heat dissipation substrate 60, allowing the heat from the wavelength converter 20 to be efficiently dissipated to the lens 40. As a result, excitation light with a high energy density can be supplied to the wavelength converter 20, and a light-emitting device 1 with even higher output can be provided.

[0063] In this embodiment, an example was described in which the light-emitting device 1 according to Figure 1 of the first embodiment is provided with a lens fixing jig 50 and a heat dissipation substrate 60. However, the light-emitting device according to Figure 2 of the first embodiment and the light-emitting device 1 according to the second embodiment in Figure 5 may also be provided with a lens fixing jig 50 and a heat dissipation substrate 60. Furthermore, although this embodiment described an example in which the light-emitting device 1 is provided with a lens fixing jig 50 and a heat dissipation substrate 60, for example, the light-emitting device 1 may be provided with only a lens fixing jig 50 and no heat dissipation substrate 60.

[0064] (Note) Based on the above description of embodiments, the following technologies are disclosed.

[0065] (Technical 1) A light-emitting device comprising: a solid-state light-emitting element including an excitation light emitting section that emits the excitation light; a power supply member provided around the excitation light emitting section and supplying power to the excitation light emitting section; a wavelength converter arranged in the direction from which the excitation light is emitted to the excitation light emitting section, which converts the excitation light into fluorescence and has an excitation light incident surface from which the excitation light is incident, a fluorescence emission surface from which light including fluorescence is emitted, and a side surface; a sealing resin arranged so as to surround at least a part of the side surface of the wavelength converter and covering at least a part of the power supply member; and a lens having a flat surface that captures at least one of the excitation light and the fluorescence, wherein the fluorescence emission surface of the wavelength converter and the flat surface of the lens are in contact, and at least a part of the surface of the sealing resin facing the flat surface of the lens is not in contact with the lens.

[0066] Thus, in the light-emitting device according to this embodiment, the fluorescence-emitting surface of the wavelength converter and the flat surface of the lens are in contact. Therefore, heat from the wavelength converter can be dissipated to the lens. In addition, because the distance between the wavelength converter and the lens is short, the fluorescence absorption efficiency is increased. As a result, a light-emitting device with high output can be provided.

[0067] Furthermore, in the light-emitting device according to this embodiment, at least a portion of the sealing resin surface facing the flat surface of the lens does not come into contact with the lens. This configuration reduces the area in contact between the lens and the sealing resin. Therefore, the load on the sealing resin can be reduced compared to the case where the lens is in contact with the entire sealing resin. Consequently, the load on the power supply member covered by the sealing resin can be reduced, and the risk of wire breakage in the power supply member can be reduced.

[0068] Therefore, even while the wavelength converter and the lens are in contact, the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting element, making it possible to provide a highly reliable light-emitting device.

[0069] (Technology 2) The light-emitting device according to Technology 1, wherein the external dimensions of the flat surface of the lens in a plan view are smaller than the external dimensions of the sealing resin in a plan view. This configuration reduces the load on the power supply member covered by the sealing resin. Therefore, even while the wavelength converter and the lens are in contact, the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting device.

[0070] (Technology 3) The light-emitting device according to Technology 1 or 2, wherein the fluorescence-emitting surface of the wavelength converter is in contact only with the flat surface of the lens. This configuration reduces the load on the power supply member covered with sealing resin. Therefore, even while the wavelength converter and the lens are in contact, the load of the lens is less likely to be applied to the power supply member of the solid-state light-emitting device.

[0071] (Technology 4) The light-emitting device according to any one of Technologies 1 to 3, wherein the external dimensions of the wavelength converter in a plan view are approximately the same as the external dimensions of the excitation light emission section in a plan view. With this configuration, the excitation light and fluorescence guided in a planar direction within the wavelength converter are less likely to spread beyond the external dimensions of the excitation light emission section. Therefore, a light-emitting device with a high energy density of output light and high brightness can be provided.

[0072] (Technology 5) The light-emitting device according to any one of Technologies 1 to 4, further comprising an adhesive layer provided on the fluorescence-emitting surface of the wavelength converter, wherein the fluorescence-emitting surface and the flat surface are in contact via the adhesive layer. With this configuration, the fluorescence-emitting surface of the wavelength converter and the flat surface of the lens are in more stable contact. As a result, the heat from the wavelength converter can be efficiently dissipated to the lens, and a light-emitting device with even higher output can be provided.

[0073] (Technology 6) The light-emitting device according to any one of Technologies 1 to 5, wherein the sealing resin reflects at least a portion of the excitation light or the fluorescence. This configuration prevents the fluorescence emitted by the wavelength converter from spreading out from the sides. Therefore, it is possible to provide a light-emitting device that emits output light with higher brightness.

[0074] (Technology 7) The light-emitting device according to any one of Technologies 1 to 6, wherein the wavelength converter includes a phosphor ceramic. This configuration improves the thermal conductivity of the wavelength converter, making it easier for the heat from the wavelength converter to be dissipated to the outside. As a result, it becomes possible to input excitation light with an even higher energy density into the wavelength converter, providing an even higher-output light-emitting device. In addition, it is possible to output light containing various wavelength components uniformly.

[0075] (Technical 8) The light-emitting device according to any one of Technical 1 to 7, wherein the wavelength converter includes a plurality of stacked phosphor layers. This configuration makes it possible to provide a light-emitting device that can uniformly output light containing various wavelength components.

[0076] (Technical 9) The light-emitting device according to Technical 8, wherein the phosphor layer in contact with the flat surface of the lens, among the plurality of phosphor layers, contains a resin and phosphor powder. With this configuration, the fluorescence emission surface of the wavelength converter and the flat surface of the lens make more stable contact. As a result, the heat from the wavelength converter can be efficiently dissipated to the lens, and a light-emitting device with even higher output can be provided.

[0077] (Technology 10) A light-emitting device according to any one of Technologies 1 to 9, further comprising a lens fixing jig that physically contacts the lens to determine its position. With this configuration, the heat transferred from the wavelength converter to the lens is further transferred to the lens fixing jig, allowing the heat from the wavelength converter to be efficiently dissipated to the lens. As a result, excitation light with an even higher energy density can be supplied to the wavelength converter, and a light-emitting device with even higher output can be provided.

[0078] (Technology 11) A light-emitting device according to any one of Technologies 1 to 10, further comprising a heat dissipation substrate mounted on the solid-state light-emitting element and in contact with the lens fixing jig. With this configuration, the heat transferred from the lens to the lens fixing jig is further transferred to the heat dissipation substrate, allowing the heat from the wavelength converter to be efficiently dissipated to the lens. As a result, excitation light with an even higher energy density can be supplied to the wavelength converter, and a light-emitting device with even higher output can be provided.

[0079] Although this embodiment has been described above, this embodiment is not limited to these, and various modifications are possible within the scope of the gist of this embodiment. [Explanation of Symbols]

[0080] 1. Light-emitting device 10 Solid-state light-emitting devices 12. Excitation light emission section 13 Power supply components 20 wavelength converter 21 Excitation light incident surface 22 Fluorescence-emitting surface 23 Side view 30 Sealing resin 40 lenses 41 Flat surface 50 Lens fixing jig 60 Heat dissipation boards

Claims

1. A solid-state light-emitting element includes an excitation light emitting section that emits excitation light, and a power supply member provided around the excitation light emitting section that supplies power to the excitation light emitting section. A wavelength converter is positioned in the direction from which the excitation light is emitted to the excitation light emission section, converts the excitation light into fluorescence, and has an excitation light incidence surface from which the excitation light is incident, a fluorescence emission surface from which light containing fluorescence is emitted, and a side surface. A sealing resin is arranged to surround at least a portion of the side surface of the wavelength converter and to cover at least a portion of the power supply member, A lens having a flat surface that captures at least one of the excitation light and the fluorescence, Equipped with, The fluorescence-emitting surface of the wavelength converter and the flat surface of the lens are in contact. A light-emitting device wherein at least a portion of the surface of the sealing resin facing the flat surface of the lens is not in contact with the lens.

2. The light-emitting device according to claim 1, wherein the external dimensions of the flat surface of the lens in a plan view are smaller than the external dimensions of the sealing resin in a plan view.

3. The light-emitting device according to claim 1 or 2, wherein the fluorescence-emitting surface of the wavelength converter is in contact only with the flat surface of the lens.

4. The light-emitting device according to claim 1 or 2, wherein the external dimensions of the wavelength converter in a plan view are substantially the same as the external dimensions of the excitation light emitting section in a plan view.

5. The wavelength converter further comprises an adhesive layer provided on the fluorescence-emitting surface, The light-emitting device according to claim 1 or 2, wherein the fluorescence-emitting surface and the flat surface are in contact via the adhesive layer.

6. The light-emitting device according to claim 1 or 2, wherein the sealing resin reflects at least a portion of the excitation light or the fluorescence.

7. The light-emitting apparatus according to claim 1 or 2, wherein the wavelength converter includes phosphor ceramics.

8. The light-emitting apparatus according to claim 1 or 2, wherein the wavelength converter includes a plurality of stacked phosphor layers.

9. The light-emitting device according to claim 8, wherein the phosphor layer in contact with the flat surface of the lens, among the plurality of phosphor layers, contains a resin and phosphor powder.

10. The light-emitting device according to claim 1 or 2, further comprising a lens fixing jig that physically contacts the lens to determine the position of the lens.

11. The light-emitting device according to claim 10, further comprising a heat dissipation substrate that is mounted on the solid-state light-emitting element and is in contact with the lens fixing jig.

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