Substrate processing apparatus, substrate processing method, transport apparatus, transport method, program, and storage medium

Abstract

We propose a substrate processing device and transport device that can properly handle situations where there is a malfunction in the sensor used to detect whether an object, such as a substrate, is properly positioned. [Solution] The substrate processing apparatus includes a controller configured to accept a predetermined external input when the substrate is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect that the substrate is properly positioned in the first holding mechanism, and to permit processing or transporting the substrate using the first holding mechanism regardless of the detection by the first sensor based on the predetermined external input.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a substrate processing method, a transfer apparatus, a transfer method, a program, and a storage medium.

Background Art

[0002] In the manufacture of semiconductor devices, a chemical mechanical polishing (CMP) apparatus is used to planarize the surface of a substrate. Substrates used in the manufacture of semiconductor devices are often disc-shaped. In addition, not only semiconductor devices, but also the demand for flatness when planarizing the surfaces of rectangular substrates such as CCL substrates (Copper Clad Laminate substrates), PCB (Printed Circuit Board) substrates, photomask substrates, and display panels is increasing. In addition, the demand for planarizing the surface of a package substrate on which an electronic device such as a PCB substrate is arranged is also increasing.

[0003] Generally, such a substrate processing apparatus includes a top ring for holding a substrate and pressing it against a polishing surface, and a transfer stage for transferring the substrate between the top ring and transporting the substrate. In addition, a substrate processing apparatus including a sensor for detecting that the substrate has been properly transferred from the top ring to the transfer stage is known (see, for example, Patent Document 1). In the apparatus described in Patent Document 1, it is detected whether or not the substrate is properly seated on the transfer stage by a plurality of sensors for detecting different locations of the substrate. When it is not detected that the substrate is properly seated on the transfer stage when the substrate is transferred from the top ring to the transfer stage, the processing of the substrate is stopped. Then, the user checks for defects in the substrate, and the processing is restarted by discarding or replacing the substrate, or by repositioning the substrate.

Prior Art Documents

[0004]

Patent Document 1

[0005] In the aforementioned substrate processing apparatus, if a malfunction occurs in the sensor used to detect that a substrate has been properly handed over, the processing will be stopped even if there is no problem with the substrate processing until the malfunction is resolved, such as by replacing the sensor. In the aforementioned substrate processing apparatus, the substrates placed on the transport stage are wet with a liquid such as pure water for polishing, and if this continues for a long time, it may cause corrosion or other deterioration of the substrate, potentially leading to the need to discard the substrate.

[0006] Furthermore, regardless of the substrate processing device, transfer devices that move objects from the second mechanism to the first mechanism face similar challenges. Specifically, when an object is transferred from the second mechanism to the first mechanism, if a sensor malfunction prevents the first mechanism from detecting that the object is properly positioned, the process will stop even though there is no problem with the object's transfer.

[0007] This invention has been made in view of the above-mentioned problems, and one of its objectives is to propose a substrate processing apparatus and a transport apparatus that can properly process objects such as substrates even when there is a malfunction in the sensor used to detect whether the object is properly positioned. [Means for solving the problem]

[0008] According to one embodiment of the present invention, a substrate processing apparatus is proposed comprising: a first holding mechanism for holding a substrate; a second holding mechanism for holding a substrate, configured to be able to transfer a substrate to and from the first holding mechanism; a first sensor for detecting whether the substrate is properly positioned in the first holding mechanism; and a controller configured to accept a predetermined external input when the substrate is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect whether the substrate is properly positioned in the first holding mechanism, and to permit processing or transporting the substrate using the first holding mechanism regardless of the detection by the first sensor based on the predetermined external input being made.

[0009] According to one embodiment of the present invention, a substrate processing method is proposed for a substrate processing apparatus comprising: a first holding mechanism for holding a substrate; a second holding mechanism for holding a substrate, configured to be able to transfer a substrate to and from the first holding mechanism; and a first sensor for detecting whether the substrate is properly positioned in the first holding mechanism. The method includes detecting whether the substrate is properly positioned in the first holding mechanism using the first sensor when the substrate is transferred from the second holding mechanism to the first holding mechanism; and if it is not detected that the substrate is properly positioned in the first holding mechanism, receiving a predetermined external input to the substrate processing apparatus, and, based on the predetermined external input, permitting to process or transport the substrate using the first holding mechanism regardless of the detection by the first sensor.

[0010] According to one embodiment of the present invention, a program is proposed to cause a computer to execute a substrate processing method in a substrate processing apparatus, wherein the method includes detecting by a first sensor whether the substrate is properly positioned in the first holding mechanism when the substrate is transferred from the second holding mechanism to the first holding mechanism, and if it is not detected that the substrate is properly positioned in the first holding mechanism, the program accepts a predetermined external input to the substrate processing apparatus, and, based on the predetermined external input, permits processing or transporting the substrate using the first holding mechanism regardless of the detection by the first sensor.

[0011] According to one embodiment of the present invention, a transport device is proposed comprising: a first holding mechanism for holding an object; a second holding mechanism for holding an object, the second holding mechanism configured to be able to transfer the object to and from the first holding mechanism; a first sensor for detecting whether the object is properly positioned in the first holding mechanism; and a controller configured to accept a predetermined external input when the object is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect whether the object is properly positioned in the first holding mechanism, and to permit processing or transporting the object using the first holding mechanism regardless of the detection by the first sensor based on the predetermined external input being made.

[0012] According to one embodiment of the present invention, a transport method is proposed for a transport device comprising: a first holding mechanism for holding an object; a second holding mechanism for holding an object, configured to be able to transfer the object to and from the first holding mechanism; and a first sensor for detecting whether the object is properly positioned in the first holding mechanism, wherein when the object is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects whether the object is properly positioned in the first holding mechanism; if it is not detected that the object is properly positioned in the first holding mechanism, the transport device receives a predetermined external input, and based on the predetermined external input, permits the transport device to process or transport the object using the first holding mechanism regardless of the detection by the first sensor.

[0013] According to one embodiment of the present invention, a program is proposed to cause a computer to execute a transport method in a transport device, wherein the method includes detecting by a first sensor whether the object is properly positioned in the first holding mechanism when the object is transferred from the second holding mechanism to the first holding mechanism, and if it is not detected that the object is properly positioned in the first holding mechanism, the program accepts a predetermined external input to the transport device, and, based on the predetermined external input, permits the use of the first holding mechanism to process or transport the object regardless of the detection by the first sensor. [Brief explanation of the drawing]

[0014] [Figure 1] This is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment of the present invention. [Figure 2] This is a schematic perspective view showing the first polishing apparatus of this embodiment. [Figure 3] This is a schematic cross-sectional view of a top ring that constitutes a substrate holding device, which holds the wafer to be polished and presses it against the polishing surface on the polishing table. [Figure 4]This is a perspective view showing the transfer robot in this embodiment. [Figure 5] This is a plan view schematically showing an example of the first linear transporter. [Figure 6] This is a flowchart showing an example of the substrate transfer process of this embodiment executed by the controller. [Figure 7] This is a flowchart showing an example of the substrate transfer process of the second embodiment executed by the controller. [Figure 8] This is a flowchart showing an example of the substrate transfer process of the third embodiment executed by the controller. [Figure 9] This is a diagram schematically showing an example of the transfer of the wafer between the transfer robot and the transfer unit. [Figure 10] This is a schematic diagram showing the schematic configuration of the transfer device according to the fourth embodiment. [[ID=XX]] [Figure 11] This is a flowchart showing an example of the object transfer process of the fourth embodiment executed by the controller.

Embodiments for Carrying out the Invention

[0015] Hereinafter, embodiments of a substrate processing apparatus, a substrate processing method, a transfer apparatus, a transfer method, a program, and a storage medium according to the present invention will be described together with the accompanying drawings. In the accompanying drawings, the same or similar elements are denoted by the same or similar reference numerals, and redundant descriptions regarding the same or similar elements in the description of each embodiment may be omitted. Also, the features shown in each embodiment are applicable to other embodiments as long as they do not conflict with each other.

[0016] <(0000089)>(First Embodiment) FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 10 in the present embodiment includes a housing having a substantially rectangular shape in plan view, and the interior of the housing is partitioned by a partition wall into a load port 11, a polishing module 12, and a cleaning module 13. These load port 11, polishing module 12, and cleaning module 13 are each independently assembled and exhausted independently. The substrate processing apparatus also has a controller 15 for controlling the substrate processing operation.

[0017] The load port 11 includes a plurality (four in this embodiment) of front load portions 113 on which wafer cassettes (an example of a substrate) W storing a large number of wafers are placed. These front load portions 113 are arranged adjacent to each other in the width direction (a direction perpendicular to the longitudinal direction) of the substrate processing apparatus 10. The front load portions 113 can be mounted with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). In the present embodiment, a circular semiconductor wafer is used as an example of the substrate for description, but it is not limited to such an example, and for example, a rectangular substrate may be used. Although described using it, it is not limited to such examples, and for example, a rectangular substrate may be used.

[0018] Furthermore, the load port 11 is provided with a traveling mechanism 112 that extends along the arrangement direction of the front load section 113. A transport robot 111, which can move along the arrangement direction of the front load section 113, is installed on this traveling mechanism 112. The transport robot 111 can access the wafer cassette mounted on the front load section 113 by moving along the traveling mechanism 112. In this embodiment, the transport robot 111 has two hands, one above the other. For example, the transport robot 111 uses the upper hand to return the processed wafer W to the wafer cassette and the lower hand to transport the wafer W before polishing. However, it is not limited to this example, and the wafer W may be transported with only a single hand. In addition, in this embodiment, a transport module 14 is provided for transporting the wafer before polishing from the load port 11 to the polishing module 12. The transport module 14 is provided so as to extend along the longitudinal direction of the substrate processing apparatus 10. As the transport module 14, for example, a motor drive mechanism using a ball screw or an air cylinder can be used.

[0019] The polishing module 12 is the area where the wafer W is polished, and includes a first polishing module 20a, a second polishing module 20b, and a polishing unit transport mechanism 22. The first polishing module 20a includes a first polishing device 21a and a second polishing device 21b, and the second polishing module 20b includes a third polishing device 21c and a fourth polishing device 21d. The polishing unit transport mechanism 22 is arranged adjacent to the transport module 14 and to each of the first polishing module 20a and the second polishing module 20b. The polishing unit transport mechanism 22 is arranged in the width direction of the substrate processing apparatus 10 between the cleaning module 13 and the first polishing module 20a and the second polishing module 20b. The first to fourth polishing devices 21a to 21d are arranged along the longitudinal direction of the substrate processing apparatus 10. Note that one, two, three, or five or more polishing devices may be provided.

[0020] The top ring 25a of the first polishing apparatus 21a moves between the polishing position and the first substrate transport position TP1 by the swinging motion of the top ring head. Wafer transfer to the first polishing apparatus 21a takes place at the first substrate transport position TP1. Similarly, the top rings of the second to fourth polishing apparatuses 21b to 21d move between the polishing position and the second to fourth substrate transport positions TP2 to TP4, respectively, by the swinging motion of the top ring head, and wafer transfer to the second to fourth polishing apparatuses 21b to 21d takes place at the second to fourth substrate transport positions TP2 to TP4.

[0021] The polishing section transport mechanism 22 includes a first linear transporter 24a for transporting wafers W to the first polishing module 20a, and a second linear transporter 24b for transporting wafers W to the second polishing module 20b. The polishing section transport mechanism 22 also includes a transport robot 23 positioned between the first linear transporter 24a and the second linear transporter 24b. In the illustrated example, the transport robot 23 is positioned approximately in the center of the housing of the substrate processing apparatus 10. The transport robot 23 transfers wafers between the first linear transporter 24a, the second linear transporter 24b, the transport module 14, and the cleaning module 13. Alternatively, a swing transporter for transporting wafers W may be provided instead of, or in addition to, the transport robot 23.

[0022] Figure 2 is a schematic perspective view of the first polishing apparatus 21a. Since the second to fourth polishing apparatuses 21b to 21d have the same configuration as the first polishing apparatus 21a, the first polishing apparatus 21a will be described below. The first polishing apparatus 21a comprises a polishing table 101a to which a polishing pad 102a is attached, and a top ring 25a that holds the wafer W and presses it against the polishing pad 102a on the polishing table 101a. The top ring 25a and the polishing table 101a are configured to rotate around their axes, as indicated by the arrows in Figure 2. Furthermore, above the polishing table 101a, there is a polishing liquid supply nozzle 104a for supplying polishing liquid (also called slurry) and dressing liquid (e.g., pure water) to the polishing pad 102a, a dresser (not shown) for dressing the polishing surface of the polishing pad 102a, and an atomizer (not shown) for spraying a mixture of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) in a mist onto the polishing surface. During polishing, polishing liquid is supplied from the polishing liquid supply nozzle 104a to the polishing surface of the polishing pad 102a, and the wafer W to be polished is pressed against the polishing surface by the top ring 25a and polished.

[0023] Next, the top ring (substrate holding device) 25a will be described in more detail. Figure 3 is a schematic cross-sectional view of the top ring 25a, which constitutes a substrate holding device that holds the wafer W, the object to be polished, and presses it against the polishing surface on the polishing table. In Figure 3, only the main components that make up the top ring 25a are shown.

[0024] As shown in Figure 3, the top ring 25a comprises a top ring body 202 that presses the wafer W against the polishing pad 102a, and a retainer ring 203 that directly presses the polishing pad 102a. The top ring body 202 is made of a generally disc-shaped member, and the retainer ring 203 is attached to the outer circumference of the top ring body 202. The top ring body 202 is made of a resin such as engineering plastic (e.g., PEEK). A membrane (elastic film) 204 that contacts the back surface of the wafer is attached to the lower surface of the top ring body 202. The membrane 204 defines a pressure chamber and also defines a substrate holding surface whose lower surface contacts the wafer W. The membrane 204 is made of a rubber material with excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, or silicone rubber.

[0025] As an example, in the example shown in Figure 3, the membrane 204 has a plurality of concentric partitions 204a, and these partitions 204a form a circular center chamber 205, an annular ripple chamber 206, an annular outer chamber 207, and an annular edge chamber 208 between the upper surface of the membrane 204 and the lower surface of the top ring body 202. That is, the center chamber 205 is formed in the center of the top ring body 202, and the ripple chamber 206, outer chamber 207, and edge chamber 208 are formed concentrically in sequence from the center toward the outer periphery. The membrane 204 has a plurality of holes 204h that penetrate in the thickness direction of the elastic film for wafer adsorption in the ripple area (ripple chamber 206). In the example shown in Figure 3, the holes 204h are provided in the ripple area, but they may be provided in other areas. Furthermore, in the example shown in Figure 3, the membrane 204 is provided with a plurality of concentric partitions 204a, but the example is not limited to this, and partitions may be provided to divide multiple regions in the circumferential direction, or the membrane may not have partitions 204a at all.

[0026] Within the top ring body 202, there are channels 211 communicating with the center chamber 205, 212 communicating with the ripple chamber 206, 213 communicating with the outer chamber 207, and 214 communicating with the edge chamber 208. Each of these channels 211 to 214 is connected via a rotary joint 225 to channels 221 to 224, which are connected to a vacuum source and a pressure adjustment unit (not shown). Pressure sensors P1 to P4 are provided in channels 221 to 224, and the detection signals from these pressure sensors P1 to P4 are input to the controller 15.

[0027] Furthermore, a retainer ring pressurizing chamber 209 made of an elastic membrane is formed directly above the retainer ring 203, and the retainer ring pressurizing chamber 209 is connected to a flow path 226 via a flow path 215 and a rotary joint 225 formed within the top ring body (carrier) 202. The flow path 226 is connected to a vacuum source and a pressure adjustment unit (not shown). A pressure sensor P5 is provided in the flow path 226, and the detection signals from these pressure sensors P5 are controlled by the control system. This is input to the Torola 15.

[0028] In this top ring 25a, the pressure inside the center chamber 205, ripple chamber 206, outer chamber 207, edge chamber 208, and retainer ring pressurizing chamber 209 can be independently adjusted by the vacuum source and pressure adjustment unit. With this structure, the pressing force that presses the wafer W against the polishing pad 102a can be adjusted for each region of the wafer W, and the pressing force that the retainer ring 203 presses against the polishing pad 102a can also be adjusted.

[0029] Figure 4 is a perspective view showing the transport robot 23. As shown in Figure 4, the transport robot 23 includes a hand 231 for holding the wafer W, an inversion mechanism 234 for inverting the hand 231, an extendable arm 232 for supporting the wafer W, and a robot body 233 including an arm vertical movement mechanism for moving the arm 232 up and down and an arm rotation mechanism for rotating the arm 232 around a vertical axis. The robot body 233 is mounted so as to be suspended from the ceiling frame of the polishing module 12. The transport robot 23 is also equipped with a sensor 235 for detecting whether the wafer W is properly positioned in the hand 231. The sensor 235 may consist of a single sensor or multiple sensors. As an example, the sensor 235 can be a sensor that detects the load applied to the gripping mechanism for gripping the wafer W. In addition, various sensors can be used as the sensor 235, such as distance sensors (laser sensors, infrared sensors, X-ray sensors, etc.), image sensors, ultrasonic sensors, and contact sensors (mechanical sensors, etc.).

[0030] In this embodiment, the hand 231 is able to access the transport module 14. The hand 231 is also able to access the first linear transporter 24a and the second linear transporter 24b of the polishing module 12. Therefore, wafers W that are continuously transported from the transport module 14 to the polishing module 12 are distributed to the first linear transporter 24a and the second linear transporter 24b by the transport robot 23. Since the first linear transporter 24a and the second linear transporter 24b have similar configurations, the first linear transporter 24a will be described below.

[0031] Figure 5 is a schematic plan view showing an example of a first linear transporter 24a. The first linear transporter 24a includes a transport hand 2300 for holding a wafer W, a vertical movement mechanism 2301 for moving the transport hand 2300 vertically, a horizontal movement mechanism 2302 for moving the transport hand 2300 and the vertical movement mechanism 2301 along the alignment direction of the first to fourth polishing machines 21a to 21d, and retainer ring stations 2303 provided at each position (first to fourth substrate transport positions TP1 to TP4) for transferring the wafer W between the top ring 25a and the transporter. The first and second linear transporters 24a and 24b are configured by providing multiple sets of the transport hand 2300, vertical movement mechanism 2301 and horizontal movement mechanism 2302, with each set comprising these sets.

[0032] The transport hand 2300 has a shape that supports a portion of the outer circumference of the lower surface of the wafer W. The retainer ring station 2303 is positioned opposite the retainer ring 203 of the top ring 25a and is equipped with a plurality of push-up pins 2303a that push up the retainer ring 203. The retainer ring station 2303 is installed in a position that does not interfere with the transport hand 2300 when the transport hand 2300 is positioned below the retainer ring station 2303 by the horizontal movement mechanism 2302 and raised by the vertical movement mechanism 2301. The retainer ring station 2303 may also be equipped with a release nozzle that supplies fluid for releasing the wafer W.

[0033] Although the specific configurations of the vertical movement mechanism 2301 and the horizontal movement mechanism 2302 are omitted in Figure 5, the vertical movement mechanism 2301 and the horizontal movement mechanism 2302 are configured by appropriately combining, for example, actuators such as motors and air cylinders, driving force transmission mechanisms such as linear guides, ball screws, gears, couplings, belts, and bearings, and sensors such as linear sensors, encoder sensors, and limit sensors. Furthermore, the first and second linear transporters 24a and 24b do not have a vertical movement mechanism 2301, and instead the substrate processing apparatus 10 may be equipped with a pusher or the like for transferring wafers W between the linear transporters 24a and 24b and the top ring 25a.

[0034] Furthermore, the transport hand 2300 of this embodiment is provided with three sensors 811 to 813 for detecting when a wafer W has been handed over. These sensors 811 to 813 are provided to detect whether the wafer W is properly positioned in the first and second linear transporters 24a and 24b. The sensors 811 to 813 are spaced apart in the circumferential direction of the wafer W so as to detect different parts of the wafer W from each other. The detection signals from the sensors 811 to 813 are input to the controller 15. The transport hand 2300 may be provided with one, two, or four or more sensors for detecting when a wafer W has been handed over. As sensors 811 to 813, optical sensors can be used that have a light-emitting unit and a light-receiving unit, and detect the wafer W based on whether the light-receiving unit can receive light from the light-emitting unit. Furthermore, when the wafer W is placed between the light-emitting unit and the light-receiving unit, the light from the light-emitting unit is blocked by the wafer W, and the light-receiving unit no longer detects light, thereby detecting that the wafer W is properly positioned. However, sensors 811 to 813 are not limited to these examples, and various sensors can be used, such as distance sensors (laser sensors, infrared sensors, X-ray sensors, etc.), image sensors, ultrasonic sensors, and contact sensors (mechanical sensors, etc.).

[0035] Refer to Figure 1 again. The cleaning module 13 is an area for cleaning the polished wafers and includes a wafer station 33a as a temporary stand for temporarily placing the substrates, four cleaning modules 311a to 314a (hereinafter sometimes referred to as primary to fourth cleaning modules) for cleaning the polished substrates, and a stage 32a for holding and transporting the wafers between the wafer station 33a and the cleaning modules 311a to 314a. The wafer station 33a and the multiple cleaning modules 311a to 314a are arranged in series along the longitudinal direction of the substrate processing apparatus 10.

[0036] For the primary cleaning module 311a and the secondary cleaning module 312a, for example, a roll-type cleaning machine can be used that rotates roll-shaped sponges positioned above and below and presses them against the front and back surfaces of the wafer to clean them. For the tertiary cleaning module 313a, for example, a pencil-type cleaning machine can be used that rotates a hemispherical sponge and presses it against the wafer to clean it. For the quaternary cleaning module 314a, for example, the back surface of the wafer can be rinsed, and the front surface of the wafer can be cleaned using a pencil-type cleaning machine that rotates a hemispherical sponge and presses it against the wafer to clean it. The cleaning machine for this quaternary cleaning module 314a is equipped with a stage that rotates the chucked wafer at high speed and has a function (spin-dry function) to dry the wafer after cleaning by rotating the wafer at high speed. In addition to the roll-type and pencil-type cleaning machines described above, each cleaning module 311a to 314a may also be provided with a megasonic-type cleaning machine that applies ultrasonic waves to the cleaning solution for cleaning.

[0037] The controller 15 is provided to control each component of the substrate processing apparatus 10. The controller 15 may be configured as a microcomputer that includes a CPU, memory 15a, display device 15c, etc., and uses software to realize predetermined functions, or it may be dedicated It may be configured as a hardware circuit that performs the calculation processing. Memory 15a is an example of a storage medium and stores a program 15b for implementing the method according to one embodiment of the present invention. Display device 15c is a device for displaying information to the user and is configured as a display device located outside the substrate processing device 10, for example. In addition, the display device 15c of this embodiment has the function of an input device that enables external input by the user. However, the substrate processing device 10 may be equipped with both a display device 15c and an input device.

[0038] The normal operation of the substrate processing apparatus 10 will now be described. In the substrate processing apparatus 10, first, the wafer W before polishing is taken out from the wafer cassette in the front load section 113 by the transport robot 111 in the load port 11 and transferred to the transport module 14. Next, the wafer W is transferred from the transport module 14 to the transport robot 23, and the inversion mechanism 234 of the transport robot 23 inverts the wafer W together with the hand 231. This aligns the processing surface of the wafer W downwards. Next, the wafer W is transferred from the transport robot 23 to the first linear transporter 24a or the second linear transporter 24b, and the wafer W is transported from the first linear transporter 24a or the second linear transporter 24b to the first to fourth polishing apparatuses 21a to 21d. Then, in the first to fourth polishing apparatuses 21a to 21d, the wafer W is held by suction on the top ring 25a and polished by contact with the polishing pad 102a.

[0039] After the polishing of the wafer W is completed, the polished wafer W is transferred from the first polishing apparatus 21a to 21d to the transfer robot 23 via the first linear transporter 24a or the second linear transporter 24b. Subsequently, the inversion mechanism 234 of the transfer robot 23 inverts the wafer W together with the hand 231. This aligns the processing surface of the wafer W upwards. The wafer W is then transferred from the transfer robot 23 to the cleaning module 13, where it is cleaned and dried. After the cleaning and drying process in the cleaning module 13 is completed, the wafer W is removed from the cleaning module 13 to the load port 11, and the substrate processing in the substrate processing apparatus 10 is completed.

[0040] Furthermore, substrate processing, or processing of the wafer W, refers to processing performed on the wafer W in the substrate processing apparatus 10, and may include the transport of the wafer W. In other words, in this specification, for ease of understanding, the expression "processing or transport" may or may not be used, but "processing" may or may not include transport.

[0041] Next, the operation of transferring a wafer W from the top ring 25a to the first and second linear transporters 24a and 24b (hereinafter, the first linear transporter 24a as a representative) in the substrate processing apparatus 10 of this embodiment will be described. Figure 6 is a flowchart of an example of the substrate transfer process of this embodiment executed by the controller. The process shown in Figure 6 is started when the polishing process of the wafer W is completed in the first to fourth polishing apparatuses 21a to 21b (hereinafter, the first polishing apparatus 21a as a representative). In the example shown in Figure 6, sensors 811 to 813 of the linear transporter 24a are an example of the "first sensor".

[0042] When the polishing process of the wafer W is completed, the top ring 25a that holds the wafer W moves above the first substrate transport position TP1. Subsequently, the top ring 25a releases the wafer W, and the wafer W is transferred from the top ring 25a to the transport hand 2300 of the first linear transporter 24a (step S102). At this time, sensors 811 to 813 of the first linear transporter 24a detect whether the wafer W has been properly transferred to the transport hand 2300 (step S104). In this embodiment, when the wafer W is detected by all three sensors 811 to 813, the controller 15 determines that the wafer W is properly positioned in the first linear transporter 24a and has been properly transferred. If the wafer W is not detected by at least one of the three sensors, the controller 15 determines that the wafer W is not properly positioned in the first linear transporter 24a and is not being properly handed over.

[0043] When sensors 811-813 detect that the wafer W is properly positioned in the first linear transporter 24a (S104: Yes), the controller 15 then performs normal processing on the wafer W (step S120). Normal processing is processing in accordance with the normal operation of the substrate processing apparatus 10 described above. For example, the wafer W is transferred from the first linear transporter 24a to the wafer station 33a of the cleaning module 13 via the transport robot 23. After the cleaning and drying processes are completed, the wafer W is removed to the load port 11 via the stage 32a of the cleaning module 13. The substrate processing in the substrate processing apparatus 10 is then completed when the wafer W is stored in the front load section 113.

[0044] On the other hand, if sensors 811-813 do not detect that the wafer W is properly positioned in the first linear transporter 24a (S104: No), the controller 15 determines that there is a possibility that the wafer W has not been properly delivered. In this case, the controller 15 stops processing the wafer W in question, issues an error (step S106), and requests a predetermined external input (step S108). Here, as an example of the error notification, it is preferable to notify that the wafer W has not been properly detected by sensors 811-813 using a display device 15c, a lamp (not shown), or a buzzer. The predetermined external input is an input that allows the user to authorize the continuation of processing regardless of detection by sensors 811-813 when the wafer W is not properly detected by sensors 811-813. Specifically, the controller 15 displays a message on the display device 15c asking whether or not to continue transporting. For example, the user may visually inspect the inside of the substrate processing apparatus 10, that is, the first linear transporter 24a and the wafer W, to confirm that the wafer W is properly positioned, and then make a predetermined external input. Alternatively, for example, the user may look at an image taken by a camera (not shown) installed inside the substrate processing apparatus 10 and displayed on the display device 15c to confirm that the wafer W is properly positioned, and then make a predetermined external input. This allows the user to authorize the continuation of processing by external input when it is determined that the wafer W is properly positioned and that there is a malfunction in sensors 811-813. In this way, the user can confirm that the wafer W is properly positioned and determine that there is a malfunction in sensors 811-813. Then, the user operates the display device 15c to make an (external) input to authorize the continuation of transport. Such predetermined external inputs may be input by the user operating an input unit (not shown) provided in the substrate processing apparatus 10, or they may be input from the outside via wired or wireless communication. In addition, the predetermined external inputs may be made available in conjunction with the issuance of an error alarm, for example.Furthermore, the controller 15 may notify the user using a display device 15c or the like to perform a predetermined external input when an error is reported, and request the user to perform the predetermined external input.

[0045] When a predetermined external input is made by the user (S108: Yes), the controller 15 continues processing the wafer W using the first linear transporter 24a regardless of detection by sensors 811 to 813 (step S122). In this case, holding and transporting the wafer W by the first linear transporter 24a is permitted regardless of detection by sensors 811 to 813. In this case, as an example, the processing may be carried out in the same way as the normal processing in step S120 described above. Alternatively, as another example, the controller 15 may execute a predetermined sensor failure processing that differs from the normal processing, for when sensors 811 to 813 malfunction. As an example, in the sensor failure processing, the time until the wafer W is stored in the front load unit 113 is shorter than in the normal processing. This may also be done. As a specific example, the processing in the cleaning module 13 may be partially simplified or partially omitted so that the processing is completed in a short time without degrading the quality of the wafer W. In this way, the quality of the wafer W that was being processed is prevented from degrading, and at least a part of the substrate processing apparatus 10 can be stopped until maintenance processing such as replacing sensors 811 to 813 is performed.

[0046] On the other hand, if the user does not provide a predetermined external input (S108: No), the controller 15 determines that a transfer abnormality has occurred when the wafer W is transferred from the top ring 25a to the first linear transporter 24a, and executes a predetermined transfer abnormality processing (step S124). Here, "when a predetermined external input is not provided" may include when the user does not provide a predetermined external input for a predetermined time (e.g., several minutes), and when the user provides an external input indicating that processing of the wafer W is not permitted. In the transfer abnormality processing, the controller 15 may prohibit the first linear transporter 24a from holding and transporting the wafer W. In addition, in the transfer abnormality processing, the controller 15 may use a display device 15c, a lamp (not shown), or a buzzer to signal that a transfer abnormality of the wafer W has occurred.

[0047] The substrate transfer process described above discloses the control by the controller 15 when the wafer W is transferred from the top ring 25a (an example of the second holding mechanism) to the first linear transporter 24a (an example of the first holding mechanism). In other words, when sensors 811 to 813 do not detect that the wafer W is properly positioned, the controller 15 accepts a predetermined external input from the user. Based on the predetermined external input, the controller 15 permits processing of the wafer W using the first linear transporter 24a, regardless of the detection by sensors 811 to 813. This control allows for appropriate response even if there is a malfunction in sensors 811 to 813.

[0048] (Second Embodiment) Next, the wafer transfer operation in the substrate processing apparatus 10 of the second embodiment will be described. The substrate processing apparatus 10 of the second embodiment has the same apparatus configuration as the substrate processing apparatus 10 of the first embodiment. Figure 7 is a flowchart showing an example of the substrate transfer process of the second embodiment executed by the controller 15. The process shown in Figure 7 is the same as the process in Figure 6, except that steps S110 to S116 are executed instead of step S108, so redundant explanations will be omitted. In the example shown in Figure 7, sensors 811 to 813 of the linear transporter 24a are an example of "first sensors", and pressure sensors P1 to P4 of the top ring 25a are an example of "second sensors".

[0049] If sensors 811-813 do not detect that the wafer W is properly positioned in the first linear transporter 24a (S104: No), the controller 15 stops processing the wafer W in question, issues an error (step S106), and requests an external input for a return operation (step S110). Here, the external input for a return operation is an example of a "predetermined external input". The user may also visually inspect the inside of the substrate processing device 10 or use captured images to obtain the external input for a return operation. Alternatively, the user may obtain the external input for a return operation when they cannot visually inspect the inside of the substrate processing device 10 or use captured images. If no external input for a return operation is received (S110: No), the controller 15 executes a predetermined transport abnormality processing (step S124). Furthermore, "when no external input for the return operation is made" may include cases where the user does not make an external input for a predetermined time (e.g., several minutes), and cases where the user makes an external input indicating that the return operation of wafer W is not permitted.

[0050] When an external input for a return operation is received by the controller 15 (S110: Yes), the controller 15 returns the wafer W from the first linear transporter 24a to the top ring 25a (step S112). Specifically, negative pressure is generated in the lines (flow channels 211~214) leading to a predetermined membrane area so that the wafer W is adsorbed and held by the membrane 204 of the top ring 25a. Then, the controller 15 notifies the user whether the returned wafer W is properly positioned in the top ring 25a (step S114) and requests an external input to continue processing (step S116). In this embodiment, whether the returned wafer W is properly positioned is determined by whether the detected values ​​of the pressure sensors P1~P4 fall within a predetermined appropriate range. As an example, when the detected values ​​of the pressure sensors P1~P4 indicate a sufficiently small pressure, it is considered that the wafer W is properly held by the top ring 25a and sufficient negative pressure is formed. Furthermore, the fact that the wafer W is properly held by the top ring 25a indicates that the wafer W was originally properly positioned in the linear transporter 24a and that the wafer W was properly returned from the linear transporter 24a. However, the system is not limited to this example, and the top ring 25a may be equipped with various other sensors, such as optical sensors, for detecting the wafer W, and it may be determined whether or not the wafer W is properly positioned based on detection signals from other sensors, either in place of or in addition to the pressure sensors P1 to P4. In addition, in the process of step S114, it is preferable that the user be notified by a display device 15c, for example. In the process of step S114, the detection values ​​of the pressure sensors P1 to P4 may be notified, or the determination result of the controller 15 regarding whether or not the wafer W is properly positioned may be notified. In addition, an external input for continuing processing is an example of a "predetermined external input". In the process of step S114, the user can confirm that the returned wafer W is properly positioned and make an external input for continuing processing.As described above, this is based on the assumption that when the wafer W is properly returned from the first linear transporter 24a to the top ring 25a, the wafer W was originally properly positioned in the linear transporter 24a, and the transfer of the wafer W between the top ring 25a and the first linear transporter 24a is considered normal. In other words, in the second embodiment, instead of or in addition to visually inspecting or taking images of the inside of the substrate processing apparatus 10, the normal transfer of the wafer W between the top ring 25a and the first linear transporter 24a is confirmed by the wafer return operation.

[0051] Then, when the user provides an external input to continue processing (S116: Yes), the controller 15 continues processing using the first linear transporter 24a (step S122). In this case, the wafer W is again transferred from the top ring 25a to the first linear transporter 24a, and the first linear transporter 24a is permitted to hold and transport the wafer W regardless of detection by sensors 811 to 813. On the other hand, when the controller 15 does not provide an external input to continue processing (S116: No), it executes a predetermined transport abnormality processing (step S124). Note that "when the external input to continue processing is not provided" may include when the user does not provide an external input for a predetermined time (e.g., several minutes), and when the user provides an external input indicating that the continuation of processing of the wafer W is not permitted.

[0052] According to the substrate transfer process of the second embodiment described above, when sensors 811-813 do not detect that the wafer W is properly positioned, the controller 15 receives an external input for a return operation. Based on the external input for a return operation, the controller 15 returns the wafer W from the first linear transporter 24a to the top ring 25a. The controller 15 notifies whether the returned wafer W is properly positioned in the top ring 25a and receives an external input for continuing the process. Based on the external input for continuing the process, the controller 15 permits the first linear transporter 24a to hold and transport the wafer W regardless of detection by sensors 811-813. This control prevents malfunctions in sensors 811-813. Even in such situations, we can respond appropriately.

[0053] (Variation 1) In the second embodiment described above, the controller 15 accepts an external input for a return operation and an external input for continuing processing as predetermined external inputs. However, the controller 15 may request only one of the external inputs for a return operation or continuing processing as predetermined external inputs. For example, if the sensors 811-813 do not detect that the wafer W is properly positioned, the controller 15 may automatically perform a return operation to the top ring 25a without requesting an external input for a return operation. In this case, based on the external input for continuing processing after the return operation, processing of the wafer W using the first linear transporter 24a will be permitted regardless of detection by the sensors 811-813. Also, as an example, if the controller 15 determines that the returned wafer W is properly positioned in the top ring 25a, it may automatically continue processing of the wafer W using the first linear transporter 24a without requesting an external input for continuing processing, regardless of detection by the sensors 811-813. In this case, processing of the wafer W using the first linear transporter 24a is permitted based on the external input for the return operation and the determination that the returned wafer W is properly positioned in the top ring 25a. Furthermore, the controller 15 may perform the return operation without requesting a predetermined external input and permit the continuation of processing of the wafer W regardless of detection by sensors 811-813, based on the determination that the returned wafer W is properly positioned in the top ring 25a. This allows subsequent processing to be performed automatically when a malfunction occurs in sensors 811-813.

[0054] (Modification 2) In the process shown in Figure 7 above, the controller 15 notifies whether the wafer W returned to the top ring 25a is properly positioned (S122) and requests an external input to continue processing. However, the controller 15 may request an external input to continue processing when it determines that the wafer W returned to the top ring 25a is properly positioned, and perform a predetermined transport abnormality processing (S124) without requesting an external input to continue processing when the wafer W returned to the top ring 25a is not properly positioned.

[0055] (Variation 3) In the first and second embodiments described above, when the wafer W is not detected by at least one of the three sensors 811 to 813, the controller 15 allows the continuation of processing of the wafer W based on a predetermined external input. However, the controller 15 may allow the continuation of processing of the wafer W based on a predetermined external input when only one of the three sensors 811 to 813 does not detect the wafer W, and may not allow the continuation of processing of the wafer W when two or more sensors do not detect the wafer W. This is based on the idea that when two or more sensors do not detect the wafer W, it is not a malfunction of the sensors 811 to 813, but rather an abnormality in the transfer of the wafer W. For example, when two or more sensors do not detect the wafer W in the processing of step S104, the controller 15 may determine that the wafer W was not properly transferred from the top ring 25a to the linear transporter 24a and execute the transfer abnormality processing (step S124).

[0056] (Modification 4) In the second embodiment described above, when the wafer W received back in the top ring 25a is properly positioned, the first linear transporter 24a is permitted to hold and transport the wafer W regardless of detection by sensors 811 to 813. However, The controller 15 may change its control based on the detection by sensors 811 to 813 when the wafer W is transferred again from the top ring 25a to the first linear transporter 24a. As a specific example, when the wafer W is transferred again from the top ring 25a to the first linear transporter 24a, if the same sensors as when the wafer W was transferred the first time (steps S102, S104) do not detect the wafer W, or if the same detection is made by sensors 811 to 813, the controller 15 may determine that there is a malfunction in the sensors and execute the processing in step S122. Also, as an example, when the wafer W is transferred again from the top ring 25a to the first linear transporter 24a, if a different sensor than the one that detected the wafer W the first time does not detect the wafer W, the controller 15 may determine that there is an abnormality in the transfer of the wafer W and execute the transport abnormality processing in step S124. Furthermore, as an example, when the wafer W is transferred again from the top ring 25a to the first linear transporter 24a, the controller 15 may determine that a temporary sensor malfunction has occurred and execute the normal processing of step S120 if the wafer W is properly detected in the first linear transporter 24a.

[0057] (Variation 5) In the first and second embodiments described above, when the controller 15 permits the first linear transporter 24a to hold and transport the wafer W regardless of detection by sensors 811 to 813, it may also disable detection by sensors 811 to 813 when processing another wafer W. This allows subsequent processing to be carried out efficiently when a malfunction occurs in sensors 811 to 813. In this case, the controller 15 may also disable detection by sensors 811 to 813 until a predetermined timing, and then enable detection by sensors 811 to 813 thereafter. When detection by sensors 811 to 813 is enabled, the processing shown in Figure 6 or Figure 7 may be executed again. Here, the predetermined timing can be when a predetermined time has elapsed (for example, several minutes, several tens of minutes, etc.). Alternatively, the predetermined timing can be when a predetermined number of wafers W (for example, several wafers, etc.) have been processed, or when the currently processed batch of wafers has been completed. This allows for efficient processing when a malfunction occurs in sensors 811-813, and prevents sensor malfunctions from being overlooked for extended periods.

[0058] (Experimental variation 6) In the first and second embodiments, sensors 811 to 813 of the linear transporter 24a are examples of "first sensors," and pressure sensors P1 to P4 of the top ring 25a are examples of "second sensors." However, the first sensors only need to be capable of detecting that the wafer W is properly positioned in the linear transporter 24a, and sensors other than sensors 811 to 813 may be used as the first sensors. Similarly, the second sensors only need to be capable of detecting that the wafer W is properly positioned in the top ring 25a, and sensors other than pressure sensors P1 to P4 may be used as the second sensors. Furthermore, the first sensors and second sensors are not limited to those provided in the first linear transporter 24a and the top ring 25a, respectively, but may also be attached to other modules or frames of the substrate processing apparatus 10 (not shown).

[0059] (Third embodiment) Next, the wafer transfer operation in the substrate processing apparatus 10 of the third embodiment will be described. The substrate processing apparatus 10 of the third embodiment has the same apparatus configuration as the substrate processing apparatus 10 of the first and second embodiments. Figure 8 is a flowchart showing an example of the substrate transfer process of the third embodiment executed by the controller 15. The process shown in Figure 8 of the third embodiment is, for example, to transport the wafer W before polishing to the polishing apparatus 21a, using a transport robot 2 This process is executed when the wafer W is transferred from 3 to the linear transporters 24a and 24b (hereinafter, the first linear transporter 24a is used as a representative example). In the example shown in Figure 8, sensors 811 to 813 of the linear transporter 24a are examples of "first sensors," and sensor 235 of the transport robot 23 is an example of "second sensors."

[0060] When the wafer W is transferred from the transport robot 23 to the first linear transporter 24a (step S102A), sensors 811-813 detect whether the wafer W is properly positioned in the first linear transporter 24a (step S104). The process in step S104 may be the same as the process in step S104 of Figure 6 described above. When sensors 811-813 detect that the wafer W is properly positioned in the transport robot 23 (S104: Yes), the controller 15 then performs normal processing on the wafer W (step S120A). Normal processing is a process that follows the normal operation of the substrate processing apparatus 10 described above, and the wafer W is transported to the polishing apparatus 21a or the like for polishing.

[0061] On the other hand, if sensors 811 to 813 do not detect that the wafer W is properly positioned in the first linear transporter 24a (S104: No), the controller 15 determines that there is a possibility that the wafer W has not been properly handed over. In this case, the controller 15 stops processing the wafer W in question and issues an error report (step S106), and requests an external input for a return operation (step S110). When an external input for a return operation is received (S110: Yes), the controller 15 has the wafer W returned from the first linear transporter 24a to the transport robot 23 (step S112A). Then, the sensor 235 of the transport robot 23 detects and reports whether or not the returned wafer W is properly positioned in the transport robot 23 (step S114A).

[0062] Next, the controller 15 requests an external input to continue processing (step S116). The user can confirm that the returned wafer W is properly positioned in the process of step S114A and then provide an external input to continue processing. When the controller 15 receives an external input from the user to continue processing (S116: Yes), it continues processing the wafer W using the first linear transporter 24a (step S122A). In this case, the wafer W is again transferred from the transport robot 23 to the first linear transporter 24a, and the first linear transporter 24a is permitted to hold and transport the wafer W regardless of detection by sensors 811 to 813.

[0063] On the other hand, when the user does not provide an external input for a return operation (S110: No), and when the user does not provide an external input for continuing processing (S116: No), the controller 15 executes a predetermined transport abnormality processing (step S124).

[0064] The substrate transfer process described above discloses the control by the controller 15 when the wafer W is transferred from the transport robot 23 (an example of the second holding mechanism) to the first linear transporter 24a (an example of the first holding mechanism). In this case as well, similar to the first embodiment, it is possible to respond appropriately even if a malfunction occurs in the sensors 811 to 813.

[0065] (Example 7) In the first to third embodiments, the operation when the wafer W is transferred to the first linear transporter 24a was described. However, the controller 15 may perform the processing shown in Figures 6 to 8 when the wafer W is transferred to another wafer holding or transporting mechanism instead of or in addition to the linear transporters 24a and 24b. The controller 15 may also perform the processing shown in Figures 6 to 8 when the wafer W is transferred to another wafer holding or transporting mechanism instead of or in addition to the top ring 25a or transport robot 23. When a wafer W is transferred from a holding or transporting mechanism, the processing shown in Figures 6 to 8 may be performed. In other words, the controller 15 may accept a predetermined external input if it does not detect that the wafer W is properly positioned in the first holding mechanism when the wafer W is transferred from the second holding mechanism to the first holding mechanism. The controller 15 may also return the wafer W from the first holding mechanism to the second holding mechanism if it does not detect that the wafer W is properly positioned in the first holding mechanism when the wafer W is transferred from the second holding mechanism to the first holding mechanism. Here, the first holding mechanism and the second holding mechanism can each be one of the following: a transport robot 23, a transport module 14, linear transporters 24a, 24b, a top ring 25a, a wafer station 33a, and a stage 32a.

[0066] As an example, we will describe a case in which the stage 32a in the cleaning module 13 corresponds to the first holding mechanism and the transport robot 23 corresponds to the second holding mechanism. Figure 9 is a schematic diagram showing an example of wafer transfer between the transport robot 23 and the transport unit 32. Note that in Figure 9, the cleaning mechanism for cleaning the wafer W in the cleaning module 13 is not shown. In the example shown in Figure 9, the cleaning module 13 includes a stage 32a having a chuck for holding the wafer W, and a sensor 328 for detecting when the wafer W is positioned on the stage 32a. The cleaning module 13 is also provided with a shutter 324 that opens when the wafer W is transported. Note that the stage 32a may be referred to as a "substrate holding section" or "substrate chuck".

[0067] When the shutter 324 is opened and the wafer W is transferred from the transport robot 23 to the stage 32a, the controller 15 determines whether the wafer W is properly positioned on the stage 32a based on the detection by the sensor 328. For example, the sensor 328 may be an optical sensor having a light-emitting unit 328a and a light-receiving unit 328b. This sensor 328 is an example of the "first sensor". However, instead of or in addition to the sensor 328, the determination of whether the wafer W is properly positioned on the stage 32a may be made based on detection signals from various other sensors not shown. Also, the chuck of the stage 32a may be provided with a mechanism for determining whether the wafer W is properly positioned. If it is not detected that the wafer W is properly positioned on the stage 32a, the controller 15 accepts a predetermined external input. Then, based on the predetermined external input, the controller 15 permits processing of the wafer W using the stage 32a, regardless of the detection by the sensor 328. As a result, regardless of detection by the sensor 328, the cleaning process in the cleaning module 13 will continue on the wafer W held in the stage 32a. Alternatively, as described in the second embodiment, a return operation from the stage 32a to the transport robot 23 may be performed.

[0068] (Fourth Embodiment) Figure 10 is a schematic diagram showing the configuration of a transport device according to the fourth embodiment. The transport device in the fourth embodiment is configured to transport various objects 3000 such as substrates, manufactured goods, bags, and boxes such as cardboard boxes. As shown in Figure 10, the transport device includes a first holding mechanism 1000 and a second holding mechanism 2000 for holding or transporting the objects 3000. The first holding mechanism 1000 and the second holding mechanism 2000 are configured to transfer the objects 3000 to each other. Each of the first holding mechanism 1000 and the second holding mechanism 2000 can be any known configuration that can hold or transport the objects 3000, such as a conveyor belt, a moving mechanism that can move the objects 3000 horizontally or vertically, a transport robot such as a robot hand, or a stage for performing a predetermined process on the objects 3000. Furthermore, although not limited, in the transport device, the first holding mechanism 1000 may be a holding mechanism downstream of the second holding mechanism 2000.

[0069] Furthermore, the transport device includes a first sensor 1002 for detecting that the object 3000 is properly positioned in the first holding mechanism 1000, and a second sensor 2002 for detecting that the object 3000 is properly positioned in the second holding mechanism 2000. The first sensor 1002 and the second sensor 2002 can each be any sensor capable of detecting that the object 3000 is properly positioned, and various types of sensors can be used, such as weight sensors, distance sensors (laser sensors, infrared sensors, X-ray sensors, etc.), image sensors, ultrasonic sensors, and contact sensors (mechanical sensors, etc.).

[0070] The transport device also includes a controller 4000 for controlling the entire transport device. The controller 4000 may be configured as a microcomputer that includes a CPU, memory 4000a, display device 4000c, etc., and implements predetermined functions using software, or it may be configured as a hardware circuit that performs dedicated arithmetic processing. Memory 4000a is an example of a storage medium and stores a program 4000b for implementing a method according to one embodiment of the present invention. The display device 4000c is a device for displaying information to the user, similar to the display device 15c in the first embodiment. The controller 4000 can transmit control commands to the first holding mechanism 1000 and the second holding mechanism 2000. Detection signals from the first sensor 1002 and the second sensor 2002 are also input to the controller 4000.

[0071] Figure 11 is a flowchart showing an example of the object transfer process of the fourth embodiment performed by the controller 4000. First, the controller 4000 controls the second and first holding mechanisms 2000 and 1000 to transfer the object 3000 from the second holding mechanism 2000 to the first holding mechanism 1000 (step S102B). When the object 3000 is transferred from the second holding mechanism 2000 to the first holding mechanism 1000, the first sensor 1002 detects whether the object 3000 is properly positioned in the first holding mechanism 1000 (step S104B). If the first sensor 1002 detects that the object 3000 is properly positioned in the first holding mechanism 1000 (S104B: Yes), the controller 4000 then performs normal processing (step S120B). During normal processing, the object 3000 is held or transported using the first holding mechanism 1000. As a result, the object 3000, which was transferred from the second holding mechanism 2000 to the first holding mechanism 1000, is then held or transported by the first holding mechanism 1000 while undergoing predetermined processing or being transported to another location.

[0072] On the other hand, if the first sensor 1002 does not detect that the object 3000 is properly positioned in the first holding mechanism 1000 (S104B: No), the controller 4000 determines that there is a possibility that the object 3000 has not been properly handed over. In this case, the controller 4000 stops processing the object 3000 in question and issues an error (step S106B), and requests an external input for a return operation (step S110B). Here, the external input for the return operation is an example of a predetermined external input. The predetermined external input is an input that allows the user to process the object 3000 without relying on detection by the first sensor 1002 when the object 3000 is not properly detected by the first sensor 1002. The predetermined external input may be input by the user operating an input unit (not shown) provided on the transport device, or it may be input from the outside via wired or wireless communication. In addition, the predetermined external input may be configured to become available in conjunction with the issuance of an error, as an example. Furthermore, the controller 4000 may notify the user using a display device 4000c or the like to perform a predetermined external input when an error is reported, and request the user to perform the predetermined external input.

[0073] When an external input for a return operation is received (S110B: Yes), the controller 4000 causes the object 3000 to be returned from the first holding mechanism 1000 to the second holding mechanism 2000. Step S112B). Then, the second sensor 2002 of the second holding mechanism 2000 detects and notifies whether the wafer W that has been returned to the second holding mechanism 2000 is in the correct position (Step S114B).

[0074] Next, the controller 4000 requests an external input to continue processing (step S116B). The user can confirm that the returned object 3000 is properly positioned in the processing of step S114B and then provide an external input to continue processing. When the controller 4000 receives an external input from the user to continue processing (S116B: Yes), it continues processing using the first holding mechanism 1000 (step S122B). In this case, the object 3000 is again transferred from the second holding mechanism 2000 to the first holding mechanism 1000, and the first holding mechanism 1000 is permitted to hold or transport the object 3000 regardless of detection by the first sensor 1002.

[0075] On the other hand, the controller 4000 executes a predetermined transport abnormality processing (step S124B) when no external input for a return operation is received from the user (S110B: No), and when no external input for continuing processing is received from the user (S116B: No). In the transport abnormality processing, the controller 4000 may prohibit the first holding mechanism 1000 from holding or transporting the object 3000. In addition, in the transport abnormality processing, the controller 4000 may use a display device 4000c, a lamp (not shown), or a buzzer to signal that there may be an abnormality with the object 3000.

[0076] The conveying device described above discloses the control by the controller 4000 when the object 3000 is transferred from the second holding mechanism 2000 to the first holding mechanism 1000. Specifically, when the first sensor 1002 does not detect that the object 3000 is properly positioned, the controller 4000 accepts a predetermined external input. Based on the predetermined external input, the controller 4000 returns the object 3000 from the first holding mechanism 1000 to the second holding mechanism 2000. Then, when the object 3000 returned to the second holding mechanism 2000 is properly positioned, the controller 4000 permits the first holding mechanism 1000 to hold and transport the object 3000 regardless of detection by the first sensor 1002. This control allows for appropriate response even if there is a malfunction in the first sensor 1002.

[0077] (Variation 8) In the fourth embodiment, if the first sensor 1002 does not detect that the object 3000 is properly positioned, the transfer operation of the object 3000 is performed, similar to the second embodiment. Alternatively, if the first sensor 1002 does not detect that the object 3000 is properly positioned, the transport device may accept a predetermined external input, similar to the first embodiment, and based on the predetermined external input, permit the processing of the object 3000 using the first holding mechanism 1000 regardless of detection by the first sensor 1002. Furthermore, the above-described modifications 1 to 6 can be combined with the third and fourth embodiments. As an example, the first sensor 1002 may have multiple sensors, and the controller 4000 may perform control based on detection by the multiple sensors, as described in modifications 3 and 4.

[0078] The present invention can also be described in the following forms. [Embodiment 1] According to Embodiment 1, a first holding mechanism for holding a substrate, a second holding mechanism for holding a substrate configured to be able to transfer a substrate to the first holding mechanism, a first sensor for detecting that the substrate is properly positioned in the first holding mechanism, and when the substrate is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects that the substrate is properly positioned in the first holding mechanism. A substrate processing apparatus is proposed that includes, when none exists, a controller configured to accept a predetermined external input and, based on the fact that the predetermined external input has been made, permit the processing or transport of the substrate using the first holding mechanism regardless of detection by the first sensor. According to Embodiment 1, even if there is a malfunction in the first sensor used to detect whether the substrate is properly positioned, the system can still process the issue appropriately.

[0079] [Form 2] According to Form 2, in Form 1, a second sensor is provided for detecting that the substrate is properly positioned in the second holding mechanism, and the controller is configured to allow processing or transporting the substrate using the first holding mechanism regardless of detection by the first sensor, based on the fact that a predetermined external input has been made, the substrate has been returned from the first holding mechanism to the second holding mechanism, and the second sensor has detected that the returned substrate is properly positioned in the second holding mechanism. According to Embodiment 2, even if a malfunction occurs in the first sensor, appropriate processing can be performed based on the second sensor.

[0080] [Embodiment 3] According to Embodiment 3, in Embodiment 1 or 2, one of the first holding mechanism and the second holding mechanism is a top ring for holding the substrate and pressing it against the polishing surface, and the other of the first holding mechanism or the second holding mechanism is a transport mechanism for transporting the substrate.

[0081] [Embodiment 4] According to Embodiment 4, in Embodiment 2, one of the first holding mechanism and the second holding mechanism is a stage on which a substrate is placed, and the other of the first holding mechanism and the second holding mechanism is a transport mechanism for transferring the substrate between the stage and the other.

[0082] [Embodiment 5] According to Embodiment 5, in Embodiments 1 to 4, when the controller permits processing or transporting the substrate using the first holding mechanism regardless of detection by the first sensor, it is configured to disable detection by the first sensor until a predetermined time has elapsed, and to enable detection by the first sensor after the predetermined time has elapsed. According to Embodiment 5, when a malfunction occurs in the first sensor, it is possible to suppress repeated stopping of processing while also suppressing the overlooking of the malfunction in the first sensor over a long period of time.

[0083] [Embodiment 6] According to Embodiment 6, a substrate processing method is proposed for a substrate processing apparatus comprising: a first holding mechanism for holding a substrate; a second holding mechanism for holding a substrate, configured to be able to transfer a substrate to and from the first holding mechanism; and a first sensor for detecting whether the substrate is properly positioned in the first holding mechanism. The method includes detecting whether the substrate is properly positioned in the first holding mechanism using the first sensor when the substrate is transferred from the second holding mechanism to the first holding mechanism, and if it is not detected that the substrate is properly positioned in the first holding mechanism, receiving a predetermined external input to the substrate processing apparatus, and, based on the predetermined external input, allowing the first holding mechanism to process or transport the substrate regardless of the detection by the first sensor. According to Embodiment 6, even if there is a malfunction in the first sensor used to detect whether the substrate is properly positioned, the system can still process the issue appropriately.

[0084] [Form 7] According to Form 7, a program causes a computer to execute a substrate processing method in a substrate processing apparatus, wherein the method includes detecting whether the substrate is properly positioned in the first holding mechanism using a first sensor when the substrate is transferred from the second holding mechanism to the first holding mechanism, and detecting whether the substrate is properly positioned in the first holding mechanism When not known, a program is proposed that includes accepting a predetermined external input to the substrate processing apparatus and, based on the fact that the predetermined external input has been made, permitting the processing or transport of the substrate using the first holding mechanism regardless of detection by the first sensor. According to Embodiment 7, even if there is a malfunction in the first sensor used to detect whether the substrate is properly positioned, the system can still process the issue appropriately.

[0085] [Form 8] According to Form 8, a computer-readable storage medium is proposed that stores the program described in Form 7.

[0086] [Form 9] According to Form 9, a transport device is proposed comprising: a first holding mechanism for holding an object; a second holding mechanism for holding an object, configured to be able to transfer the object to and from the first holding mechanism; a first sensor for detecting whether the object is properly positioned in the first holding mechanism; and a controller configured to accept a predetermined external input when the object is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect whether the object is properly positioned in the first holding mechanism, and to permit processing or transporting the object using the first holding mechanism regardless of the detection by the first sensor based on the predetermined external input being made. According to the 9th form, even if there is a malfunction in the first sensor used to detect whether the object is properly positioned, the process can be handled appropriately.

[0087] [Embodiment 10] According to embodiment 10, a transport method is proposed for a transport device comprising: a first holding mechanism for holding an object; a second holding mechanism for holding an object, configured to be able to transfer the object to and from the first holding mechanism; and a first sensor for detecting whether the object is properly positioned in the first holding mechanism. The transport method includes detecting whether the object is properly positioned in the first holding mechanism using the first sensor when the object is transferred from the second holding mechanism to the first holding mechanism; and if it is not detected that the object is properly positioned in the first holding mechanism, receiving a predetermined external input to the transport device, and, based on the predetermined external input, allowing the transport device to process or transport the object using the first holding mechanism regardless of the detection by the first sensor. According to Embodiment 10, even if there is a malfunction in the first sensor used to detect whether the object is properly positioned, the process can be handled appropriately.

[0088] [Embodiment 11] According to embodiment 11, a program is proposed to cause a computer to execute a transport method in a transport device, wherein the method includes detecting by a first sensor whether the object is properly positioned in the first holding mechanism when the object is transferred from the second holding mechanism to the first holding mechanism, and if it is not detected that the object is properly positioned in the first holding mechanism, the program accepts a predetermined external input to the transport device, and based on the predetermined external input being made, permits the first holding mechanism to process or transport the object regardless of the detection by the first sensor. According to Embodiment 11, even if there is a malfunction in the first sensor used to detect whether the object is properly positioned, the system can still process the situation appropriately.

[0089] [Embodiment 12] According to embodiment 12, a computer-readable storage medium is proposed that stores the program described in embodiment 11.

[0090] The embodiments of the present invention have been described above, but the embodiments of the invention described above are... This is intended to facilitate understanding of the invention and does not limit it. The present invention can be modified and improved without departing from its spirit, and of course, its equivalents are included. Furthermore, any combination of embodiments and modifications is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved, and any combination or omission of each component described in the claims and specification is possible. [Explanation of Symbols]

[0091] 10... Circuit board processing equipment 11…Load port 12… Polishing module 13…Cleaning module 14…Transport Module 15…Controller 15a...Memory (storage medium) 15b...Program 15c…Display device 23… Transport robots 21a~21d...polishing equipment 24a...First linear transporter 24b... Second linear transporter 25a... Top ring 32a... Stage 33a... Wafer Station 101a... Polishing table 102a... Polishing pad 111... Transport robot 235...Sensor 811~813…Sensor 2300... Conveyor Hand 1000...First holding mechanism 1002...First sensor 2000…Second holding mechanism 2002...Second sensor 3000...Target object P1~P5... Pressure sensors W...wafer

Claims

1. A first holding mechanism for holding the substrate, A second holding mechanism for holding a substrate, the second holding mechanism configured to be able to transfer the substrate to the first holding mechanism, The first holding mechanism includes a first sensor for detecting that the substrate is properly positioned, A controller configured to accept a predetermined external input when the substrate is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect that the substrate is properly positioned in the first holding mechanism, and to permit processing or transporting the substrate using the first holding mechanism regardless of detection by the first sensor based on the predetermined external input, A substrate processing apparatus equipped with the following:

2. The second holding mechanism is equipped with a second sensor for detecting that the substrate is properly positioned. The controller is configured to allow processing or transporting the substrate using the first holding mechanism, regardless of detection by the first sensor, based on the fact that a predetermined external input has been made, the substrate has been returned from the first holding mechanism to the second holding mechanism, and the second sensor has detected that the returned substrate is properly positioned in the second holding mechanism. The substrate processing apparatus according to claim 1.

3. One of the first and second holding mechanisms is a top ring for holding the substrate and pressing it against the polishing surface. The other of the first holding mechanism or the second holding mechanism is a transport mechanism for transporting the substrate. The substrate processing apparatus according to claim 1.

4. One of the first holding mechanism and the second holding mechanism is a stage on which a substrate is placed, The other of the first holding mechanism and the second holding mechanism is a transport mechanism for transferring the substrate between it and the stage. The substrate processing apparatus according to claim 1.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein the controller is configured to disable detection by the first sensor until a predetermined time has elapsed, and to enable detection by the first sensor after the predetermined time has elapsed, when it permits processing or transporting the substrate using the first holding mechanism regardless of detection by the first sensor.

6. A substrate processing method in a substrate processing apparatus comprising: a first holding mechanism for holding a substrate; a second holding mechanism for holding a substrate, configured to be able to transfer a substrate to and from the first holding mechanism; and a first sensor for detecting that the substrate is properly positioned in the first holding mechanism, When the substrate is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects whether the substrate is properly positioned in the first holding mechanism. When the first holding mechanism does not detect that the substrate is properly positioned, it receives a predetermined external input to the substrate processing device. Based on the aforementioned predetermined external input, the first holding mechanism is permitted to process or transport the substrate regardless of detection by the first sensor. A substrate processing method that includes the following.

7. A program that causes a computer to execute a substrate processing method in a substrate processing apparatus, wherein the method is: When the substrate is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects whether the substrate is properly positioned in the first holding mechanism. When the first holding mechanism does not detect that the substrate is properly positioned, it receives a predetermined external input to the substrate processing device. Based on the aforementioned predetermined external input, the first holding mechanism is permitted to process or transport the substrate regardless of detection by the first sensor. A program that includes the following.

8. A computer-readable storage medium storing the program described in claim 7.

9. A first holding mechanism for holding an object, A second holding mechanism for holding an object, comprising the first holding mechanism and the second holding mechanism configured to be able to transfer the object, The first holding mechanism includes a first sensor for detecting whether the object is properly positioned, A controller configured to accept a predetermined external input when the object is transferred from the second holding mechanism to the first holding mechanism and the first sensor does not detect that the object is properly positioned in the first holding mechanism, and to permit processing or transporting the object using the first holding mechanism regardless of detection by the first sensor based on the predetermined external input, A conveying device equipped with the following features.

10. A transport method in a transport device comprising: a first holding mechanism for holding an object; a second holding mechanism for holding an object, configured to be able to transfer the object to and from the first holding mechanism; and a first sensor for detecting that the object is properly positioned in the first holding mechanism, When the object is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects whether the object is properly positioned in the first holding mechanism. If the first holding mechanism does not detect that the object is properly positioned, it accepts a predetermined external input to the transport device. Based on the aforementioned predetermined external input, permission is granted to process or transport the object using the first holding mechanism, regardless of detection by the first sensor. A transport method that includes the following.

11. A program that causes a computer to execute a transport method in a transport device, wherein the method is: When the object is transferred from the second holding mechanism to the first holding mechanism, the first sensor detects whether the object is properly positioned in the first holding mechanism. If the first holding mechanism does not detect that the object is properly positioned, it accepts a predetermined external input to the transport device. Based on the aforementioned predetermined external input, permission is granted to process or transport the object using the first holding mechanism, regardless of detection by the first sensor. A program that includes the following.

12. A computer-readable storage medium storing the program described in claim 11.

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