Induction heating conditioning device

Abstract

To provide an induction heating cooking device that can easily accommodate power supply from various AC power sources. [Solution] The induction heating cooking apparatus according to this disclosure comprises a pot, a heating unit for heating the pot, a first circuit board supplied with power from an external AC power source, and a second circuit board connected to the heating unit and also connected to the first circuit board. The second circuit board is supplied with power from the first circuit board. The second circuit board has an inverter circuit for outputting a high-frequency current to the heating unit.

Description

Technical Field

[0001] The present disclosure relates to an induction heating cooking apparatus having an inverter circuit.

Background Art

[0002] Patent Document 1 discloses, as an example of an induction heating cooking apparatus having an inverter circuit, a rice cooker. In the rice cooker, the inverter circuit is mounted on an inverter substrate together with a rectifier circuit, a smoothing capacitor, and an inverter drive circuit. Further, a high voltage section supplied with power from a commercial power supply is mounted on the inverter substrate. The rice cooker operates by being supplied with power from a commercial power supply.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide an induction heating cooking apparatus that can easily cope with power supply from various AC power supplies.

Means for Solving the Problems

[0005] To achieve the above object, the present disclosure is configured as follows. An induction heating cooking apparatus according to an aspect of the present disclosure includes a pot, a heating unit that heats the pot, a first substrate supplied with power from an external AC power supply, and a second substrate connected to the heating unit and the first substrate and supplied with power from the first substrate, the second substrate having an inverter circuit that outputs a high-frequency current to the heating unit.

Effects of the Invention

[0006] According to this disclosure, it is possible to provide an induction heating cooking device that can easily accommodate power supply from various AC power sources. [Brief explanation of the drawing]

[0007] [Figure 1] A perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with the lid closed, viewed from diagonally above. [Figure 2] A perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with the lid open, viewed from diagonally above. [Figure 3] A perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with a filter inserted, viewed from diagonally below. [Figure 4] A perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with the filter extended, viewed from diagonally below. [Figure 5] A cross-sectional view showing the VV section in Figure 1. [Figure 6] An exploded perspective view of the first circuit board, the second circuit board, the support section, the cover, and the electromagnetic shielding member. [Figure 7] A bottom view of the first and second substrates supported by the support structure, seen from below. [Figure 8] A schematic circuit diagram of an induction heating cooking apparatus according to an embodiment of the present disclosure. [Figure 9] A schematic side view showing the main board, sub-board, and controller. [Figure 10] A schematic side view showing an example of mounting a sub-board on the second board. [Modes for carrying out the invention]

[0008] (Background leading to this disclosure) Typically, induction heating cookers are compatible with a pre-configured type of commercial power supply. The induction heating cooker is connected to this pre-configured commercial power supply and receives power from it.

[0009] As the uses of induction heating cooking appliances diversify, the types of commercial power supplies to which they are connected may also diversify. For example, induction heating cooking appliances used in homes may be modified for commercial use. In this case, for instance, a home-use induction heating cooking appliance may be powered by a single-phase power supply, while a commercial-use induction heating cooking appliance may be powered by a three-phase power supply. Furthermore, for example, the voltage of the commercial power supply may differ depending on the country in which the induction heating cooking appliance is used.

[0010] In the rice cooker disclosed in Patent Document 1, the high-voltage section, rectifier circuit, smoothing capacitor, and inverter drive circuit are mounted on a single inverter board. In this case, for example, the inverter board of a household rice cooker connected to a single-phase power supply will be equipped with a high-voltage section and rectifier circuit compatible with a single-phase power supply. Similarly, for example, the inverter board of a commercial rice cooker connected to a three-phase power supply will be equipped with a high-voltage section and rectifier circuit compatible with a three-phase power supply. On the other hand, the smoothing capacitor and inverter drive circuit can be the same regardless of the specifications.

[0011] When a rice cooker designed for home use is modified for commercial use, the rice cooker is equipped with an inverter board that supports a three-phase power supply, replacing the inverter board with a high-voltage section and rectifier circuit compatible with a single-phase power supply. In other words, the inverter board is changed from one designed for a single-phase power supply to one designed for a three-phase power supply. This means replacing the entire inverter board, including the smoothing capacitor and inverter drive circuit, which can be used regardless of the power supply specifications. As a result, the effort required for this replacement may increase, and the cost of this replacement may also increase.

[0012] Therefore, the present inventors have found a configuration for an induction heating cooking apparatus that can suppress the increased effort and cost of replacing the substrate, leading to this disclosure.

[0013] (Embodiment) Hereinafter, an example of the present disclosure will be described with reference to the accompanying drawings. The following description is merely illustrative in nature and is not intended to limit the present disclosure, its applications, or its uses. The drawings are schematic, and the ratios of the respective dimensions do not necessarily match the actual ones. In the following description, terms indicating a specific direction or position (for example, terms including "up", "down", "right", "left", "front", and "rear") may be used as necessary. In this specification and the drawings, the vertical direction is the direction perpendicular to the placement surface when the rice cooker is placed on a placement surface such as a table. Also, in this specification and the drawings, "up" and "down" are defined as follows. That is, in the rice cooker, the side where the lid is provided is "up", and the side where the filter is provided is "down". The use of the terms indicating the specific direction or position described above is for facilitating the understanding of the present disclosure with reference to the drawings, and the technical scope of the present disclosure is not limited by the meanings of those terms.

[0014] An induction heating cooking apparatus according to an aspect of the present disclosure is a rice cooker. In the rice cooker, the rice is cooked by heating a pot containing rice and water. The pot is heated by induction heating of a heating unit supplied with high-frequency power. Note that the induction heating cooking apparatus 10 is not limited to a rice cooker, and any object to be cooked may be heated by a heating unit that performs induction heating. When the induction heating cooking apparatus 10 is not a rice cooker, the object to be cooked may be other than rice, for example, meat, fish, or the like.

[0015] FIG. 1 is a perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, as seen obliquely from above with the lid closed. FIG. 2 is a perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, as seen obliquely from above with the lid open.

[0016] As shown in FIGS. 1 and 2, the induction heating cooking apparatus 10 includes a housing 20, a lid portion 21, a pot 30, and an operation unit 80.

[0017] The housing 20 is roughly cylindrical with a bottom and is open at the top. The lid 21 is attached to the top of the housing 20 via a hinge 21A. The lid 21 opens and closes the opening 20A of the housing 20 (see Figure 2) by rotating around the hinge 21A. In other words, the lid 21 is rotatable between a position that closes the opening 20A of the housing 20 as shown in Figure 1 and a position that opens the opening 20A of the housing 20 as shown in Figure 2.

[0018] As shown in Figure 2, the pot 30 can be housed inside the housing 20. The pot 30 can be removed from inside the housing 20. The pot 30 can hold food to be cooked, such as rice or water.

[0019] The control unit 80 is the part of the induction heating cooking device 10 that is operated by the user. For example, the control unit 80 may include a physically operated part such as a button or lever, and a display unit such as an LCD panel that displays various information. Alternatively, for example, the control unit 80 may include a touch panel. By operating the control unit 80, the user can turn the heating on and off for the food being cooked in the pot 30, select a heating mode, and adjust the heating power.

[0020] Figure 3 is a perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with the filter inserted, viewed from diagonally below. Figure 4 is a perspective view of an induction heating cooking apparatus according to an embodiment of the present disclosure, with the filter pulled out, viewed from diagonally below. Figure 5 is a cross-sectional view showing the VV section of Figure 1.

[0021] As shown in Figures 3 to 5, the induction heating cooking device 10 is equipped with a filter 22. The filter 22 is located on the bottom surface 20B of the housing 20. As shown in Figure 5, the filter 22 is located below the pot 30.

[0022] As shown in Figures 3 and 4, the filter 22 has a mesh-like membrane portion 221 that filters communication between the inside and outside of the housing 20. Because the membrane portion 221 is mesh-like, the entry of foreign matter such as dust from the outside to the inside of the housing 20 through the membrane portion 221 is reduced.

[0023] The filter 22 can be pulled out of the housing 20 as shown in Figure 4 by sliding it along the bottom surface 20B from the mounting position shown in Figure 3. The filter 22 can also be mounted into the housing 20 as shown in Figure 3 by sliding it.

[0024] As shown in Figures 3 and 4, the filter 22 is equipped with a gripping portion 222. The user of the induction heating cooking device 10 can grip the gripping portion 222 and slide the filter 22.

[0025] As shown in Figure 5, the induction heating cooking device 10 includes a heating unit 40 for heating the pot 30. The heating unit 40 is located below the pot 30. The heating unit 40 is opposed to the lower part of the pot 30 in the vertical direction 100. In this embodiment, the induction heating cooking device 10 includes a plurality of coils (two in this embodiment) as heating units 40A and 40B (see Figure 8). The heating units 40A and 40B are concentric coils, with heating unit 40A heating the side bottom of the pot and heating unit 40B heating the center of the pot. Heating unit 40A is a cylindrical coil with a lower diameter smaller than the upper diameter, and heating unit 40B is a disc-shaped coil. The plurality of coils are spaced apart along the circumferential direction around the center of the pot 30 when viewed along the vertical direction 100. In other words, when viewed along the vertical direction 100, the plurality of coils are arranged to surround the center of the pot 30. As will be described later, the heating units 40A and 40B are inductively heated by a high-frequency current flowing from the inverter circuit 61 (see Figure 8). As a result, the pot 30 is heated by the heating units 40A and 40B.

[0026] Figure 6 is an exploded perspective view of the first substrate, the second substrate, the support section, the cover, and the electromagnetic shielding member.

[0027] As shown in Figures 5 and 6, the induction heating cooking device 10 comprises a first substrate 50, a second substrate 60, a support portion 71, a cover 72, and an electromagnetic shielding member 73. The first substrate 50, the second substrate 60, the support portion 71, the cover 72, and the electromagnetic shielding member 73 are located inside the housing 20.

[0028] The first substrate 50 and the second substrate 60 are printed circuit boards. The first substrate 50 and the second substrate 60 are made of materials such as glass epoxy, paper phenol, and ceramic. Various electronic components are mounted on the first substrate 50 and the second substrate 60, and wiring patterns for electrically connecting these electronic components are formed on them. As a result, circuits for realizing predetermined functions are configured on the first substrate 50 and the second substrate 60. Further details about the first substrate 50, the second substrate 60, and the circuits configured on these substrates will be described later.

[0029] The support portion 71 supports the first substrate 50 and the second substrate 60. More specifically, the support portion 71 has a lower surface 71A that is perpendicular to the vertical direction 100 and faces downward, and the lower surface 71A supports the first substrate 50 and the second substrate 60. The lower surface 71A is an example of a support surface. The first substrate 50 and the second substrate 60 are fixed to the support portion 71 by, for example, screws. In other words, the first substrate 50 and the second substrate 60 are located below the support portion 71.

[0030] As shown in Figure 5, the support portion 71 is located below the heating portion 40 and above the first substrate 50 and the second substrate 60. In other words, the support portion 71 is provided between the heating portion 40 and the first substrate 50 and the second substrate 60 in the vertical direction 100.

[0031] As shown in Figures 5 and 6, the cover 72 is located below the support portion 71. The cover 72 covers the first substrate 50 and the second substrate 60, which are supported by the support portion 71. The cover 72 is made of a flame-retardant or non-combustible material, such as polyethylene terephthalate (PBT).

[0032] As shown in Figure 6, the electromagnetic shielding member 73 is supported on the upper surface 71B of the support portion 71. The upper surface 71B is perpendicular to the vertical direction 100 and faces upward, and is the back surface of the lower surface 71A. The electromagnetic shielding member 73 is provided between the heating portion 40 and the support portion 71 in the vertical direction 100. The electromagnetic shielding member 73 overlaps with at least a portion of the first substrate 50 and the second substrate 60 when viewed along the vertical direction 100. The electromagnetic shielding member 73 is made of a material that can shield electromagnetic waves, such as a metal such as iron, stainless steel, or aluminum.

[0033] Figure 7 is a bottom view of the first and second substrates supported by the support structure, viewed from below. In Figure 7, the first heat sink 53, first fan 54, second heat sink 65, and second fan 66, which are supported by the first substrate 50 and second substrate 60, are shown. On the other hand, other components supported by the first substrate 50 and second substrate 60 (for example, the coil 621 and capacitor 622 described later) and the wiring patterns formed on the first substrate 50 and second substrate 60 are not shown.

[0034] As shown in Figure 7, the first heatsink 53 and the first fan 54 are supported on the first substrate 50, and the second heatsink 65 and the second fan 66 are supported on the second substrate 60. In this embodiment, one first heatsink 53 and one first fan 54 are provided, and two second heatsinks 65 and two second fans 66 are provided. Note that the number of each of the first heatsink 53, first fan 54, second heatsink 65, and second fan 66 is not limited to the numbers mentioned above. At least one of each of the first heatsink 53, first fan 54, second heatsink 65, and second fan 66 is required. Furthermore, the first heatsink 53 and first fan 54 are not required, and the second heatsink 65 and second fan 66 are not required. The fins of the heatsinks are oriented in the same direction to reduce the influence of airflow on each other. Furthermore, the second heatsink has a heatsink containing a power semiconductor element that drives the internal coil, positioned on the AC power supply cord side (opposite the operating section 80 in Figure 1).

[0035] The first heatsink 53 and the second heatsink 65 are made of metal or the like, and cool the object to be cooled by absorbing heat from it. The first fan 54 and the second fan 66 are driven by a drive mechanism (not shown). The driven first fan 54 and the second fan 66 cool the object to be cooled by supplying cooling air to it. Known components can be used for the first heatsink 53 and the second heatsink 65, and known components can also be used for the first fan 54 and the second fan 66. However, the first fan 54 may also be used to cool heat-generating components on the first substrate 50 by placing them downwind.

[0036] In this embodiment, the object to be cooled by the first heatsink 53 and the first fan 54 is a rectifier circuit 51 (see Figure 8), which will be described later. The first heatsink 53 is supported on the first substrate 50 so as to be in contact with or near the electronic components constituting the rectifier circuit 51. The first fan 54 is supported on the first substrate 50 so as to cover the first heatsink 53.

[0037] In this embodiment, the objects to be cooled by the second heatsink 65 and the second fan 66 are power semiconductor elements 612 (see Figure 8). As will be described later, in this embodiment, two power semiconductor elements 612 are provided. One of the two second heatsinks 65 and second fan 66 cools one of the two power semiconductor elements 612, and the other of the two second heatsinks 65 and second fan 66 cools the other of the two power semiconductor elements 612. The second heatsink 65 is supported on the second substrate 60 so as to be in contact with or near the electronic components constituting the power semiconductor element 612 to be cooled. Each of the two second fans 66 is supported on the first substrate 50 so as to cover the corresponding second heatsink 65 (more specifically, the second heatsink 65 that cools the same power semiconductor element 612). However, the second fan 66 may also be positioned downwind to cool heat-generating components on the second substrate 60.

[0038] Figure 8 is a schematic circuit diagram of an induction heating cooking apparatus according to an embodiment of the present disclosure.

[0039] As shown in Figure 8, the first substrate 50 and the second substrate 60 are connected to each other via lead wires 74. The lead wires 74 are made of materials such as tin, iron, copper, or nickel, and are used with a diameter in the range of approximately 1 to 2 mm.

[0040] The first circuit board 50 includes a rectifier circuit 51, a first controller 52, and a heater drive circuit 55. The electronic components constituting the rectifier circuit 51, the first controller 52, and the heater drive circuit 55 are mounted on the first circuit board 50.

[0041] The first circuit board 50 is powered by an external AC power source 2, such as a commercial power source. The first circuit board 50 is configured according to the type of power supplied by the AC power source 2. For example, if the first circuit board 50 is powered by a single-phase AC power source 2, it is configured to accommodate single-phase power. Also, for example, if the first circuit board 50 is powered by a three-phase AC power source 2, it is configured to accommodate three-phase power. In this way, the first circuit board 50 is configured according to the type of AC power source 2 to which the induction heating cooking device 10 is connected.

[0042] In the example described above, when the induction heating cooking device 10 is connected to a single-phase AC power supply 2, the induction heating cooking device 10 includes a first circuit board 50 configured for single-phase power. Furthermore, when the induction heating cooking device 10 is connected to a three-phase AC power supply 2, the induction heating cooking device 10 includes a first circuit board 50 configured for three-phase power. In other words, the induction heating cooking device 10 includes either a first circuit board 50 for single-phase power or a first circuit board 50 for three-phase power. Of course, the induction heating cooking device 10 may also include a first circuit board 50 with other specifications. For example, the induction heating cooking device 10 may include a first circuit board 50 configured according to the power supply specifications of the country in which it is used (e.g., voltage values ​​set for each country).

[0043] The rectifier circuit 51 is supplied with AC power from the AC power supply 2. The rectifier circuit 51 rectifies the supplied AC power and outputs it from the high-potential output section 51A and the low-potential output section 51B, which are described below. The rectifier circuit 51 is, for example, composed of a diode bridge. In the case of a single-phase power supply, a diode bridge with two single-phase input terminals is used, and in the case of a three-phase power supply, a diode bridge with three input terminals is used. In either case, the output side consists of two parts: the high-potential output section 51A and the low-potential output section 51B.

[0044] The rectifier circuit 51 has two output sections. These two output sections are a high-potential output section 51A and a low-potential output section 51B, which is at a lower potential than the high-potential output section 51A. The high-potential output section 51A is connected to the filter circuit 62 via lead wires 74. The low-potential output section 51B is connected to the filter circuit 62 via lead wires 74 and a current sensing unit 63.

[0045] The heater drive circuit 55 drives the external heater 4 based on instruction signals from the first controller 52. The external heater 4 is connected to the electrical path between the external AC power supply 2 and the rectifier circuit 51. The heater drive circuit 55 is composed of, for example, a triac and a transistor. The heater 4 also has the function of evaporating condensation that adheres to the lid 21 during warming. In addition, the heater 4 has the function of adjusting the temperature of the sides of the pot 30 during warming to maintain the temperature of the rice contained in the pot 30 at a predetermined temperature.

[0046] The first controller 52 includes a microcomputer and the like. As described above, the first controller 52 drives the heater 4 by sending instruction signals to the heater drive circuit 55. In other words, the first controller 52 controls the heater drive circuit 55.

[0047] The first controller 52 receives temperature information from the pot temperature detection unit 31 of the induction heating cooking device 10. In other words, the first controller 52 receives temperature information from the pot temperature detection unit 31. The pot temperature detection unit 31 is located near the bottom of the pot 30 and detects the temperature of the bottom of the pot 30. Known devices such as infrared sensors and thermistors can be used as the pot temperature detection unit 31. For example, an infrared sensor detects the temperature of the bottom of the pot 30 based on infrared radiation emitted from the bottom of the pot 30. The pot temperature detection unit 31 outputs temperature information based on the detected temperature to the first controller 52.

[0048] The first controller 52 receives first abnormality information from the first abnormality detection unit 541 of the induction heating cooking device 10. The first abnormality detection unit 541 detects an abnormality in the first fan 54. The first abnormality detection unit 541 detects, for example, the rotation speed of the first fan 54. Based on the rotation speed received from the first fan 54, the first controller 52 determines whether the first fan 54 is rotating normally or not.

[0049] The first controller 52 receives a first synchronization signal synchronized with an external AC power supply 2. For example, the first synchronization signal is input to the first controller 52 from the electrical path between the AC power supply 2 and the rectifier circuit 51 on the first board 50, as shown by the dashed line in Figure 8. Alternatively, the first synchronization signal may be directly input to the first controller 52 from outside the first board 50 (for example, from the AC power supply 2). The AC / DC power supply unit 57 provided on the first board 50 is a switching power supply that converts the AC power supply to a DC 20V DC power supply and supplies power to drive the first fan 54, the second fan 66, and the power semiconductor elements 612 and 613. The AC / DC power supply unit 57 also supplies 20V to the DC / DC power supply unit 69 provided on the second board 60.

[0050] The first controller 52 generates a second synchronization signal based on the input first synchronization signal. In this embodiment, the first controller 52 generates the second synchronization signal by frequency-converting the first synchronization signal. In this embodiment, the period of the second synchronization signal is twice the period of the first synchronization signal. In other words, the frequency of the second synchronization signal is half the frequency of the first synchronization signal. Note that the period of the second synchronization signal is not limited to twice the period of the first synchronization signal. For example, the period of the second synchronization signal may be half the period of the first synchronization signal, or three times the period. Also, the period of the second synchronization signal may be one time the period of the first synchronization signal. In other words, the first controller 52 does not have to frequency-convert the first synchronization signal.

[0051] The first controller 52 is capable of communicating with the second controller 64. In this embodiment, the first controller 52 outputs a second synchronization signal to the second controller 64. Although not specifically shown in Figure 8, the first circuit board 50 is equipped with a current fuse that cuts off the current path from the AC power supply 2 to the first circuit board 50 in the event of an overcurrent, an across-line capacitor for noise reduction, and a common-mode coil. When the first circuit board 50 is compatible with a three-phase power supply, the configuration of the current fuse, across-line capacitor, common-mode coil, and diode bridge constituting the rectifier circuit 51 differs from that of a single-phase power supply.

[0052] The second circuit board 60 includes an inverter circuit 61, a filter circuit 62, a current detection unit 63, a second controller 64, a component temperature detection unit 67, and a DC-DC power supply unit 69. The electronic components constituting the inverter circuit 61, the filter circuit 62, the current detection unit 63, the second controller 64, and the component temperature detection unit 67 are mounted on the second circuit board 60.

[0053] The second board 60 is configured to operate normally even when the first board 50 has different configurations depending on the AC power supply 2 that provides it, and regardless of which of the multiple types of first boards 50 with different configurations it is connected to. For example, the second board 60 can operate normally whether it is connected to a single-phase first board 50 powered by a single-phase AC power supply 2, or a three-phase first board 50 powered by a three-phase AC power supply 2. The cable connecting the first board 50 to the second board 60 is common, and the first controller 52 communicates the specifications to the second controller 64, enabling operation at the power specified.

[0054] In this embodiment, the second substrate 60 includes two inverter circuits 61, two filter circuits 62, and two current detection units 63. The two inverter circuits 61 are inverter circuits 61A and 61B. The two filter circuits 62 are filter circuits 62A and 62B. The two current detection units 63 are current detection units 63A and 63B. Note that the number of inverter circuits 61, filter circuits 62, and current detection units 63 is not limited to two. The second substrate 60 may have one inverter circuit 61, one filter circuit 62, and one current detection unit 63, or it may have three or more of each.

[0055] In this embodiment, the two inverter circuits 61A and 61B have the same configuration, the two filter circuits 62A and 62B have the same configuration, and the two current detection units 63A and 63B have the same configuration. Therefore, in the following description of the configurations of the inverter circuit 61, the filter circuit 62, and the current detection unit 63, only the configurations of the inverter circuit 61A, the filter circuit 62A, and the current detection unit 63A will be described. On the other hand, the descriptions of the configurations of the inverter circuit 61B, the filter circuit 62B, and the current detection unit 63B will be omitted in principle and will be described as necessary.

[0056] The filter circuit 62A includes a coil 621 and a capacitor 622. The coil 621 is connected to the high-potential output section 51A of the rectifier circuit 51. The high-potential side 622A of the capacitor 622 is connected to the coil 621, and the low-potential side 622B of the capacitor 622 is connected to the current sensing section 63. Thus, the high-potential output section 51A of the rectifier circuit 51 is connected to the high-potential side 622A of the capacitor 622 via the coil 621, and the low-potential output section 51B of the rectifier circuit 51 is connected to the low-potential side 622B of the capacitor 622.

[0057] As described above, the filter circuit 62A smooths the output waveform of the rectifier circuit 51. More specifically, it smooths the voltage waveform to reduce the voltage ripple at the operating frequency of the inverter circuit 61. In inverters that drive IH, the capacitor is often a few μF and the coil is several hundred μH. With such a configuration, the output waveform of the filter circuit 62A changes depending on whether it is a single-phase or three-phase power supply. In this disclosure, the first controller 52 mounted on the first board 50 communicates to the second controller 64 whether it is a three-phase power supply board or a single-phase power supply board, and the second controller 64 can operate according to this communication, so it is possible to make the second board 60 the same regardless of the type of power supply.

[0058] The current detection unit 63A is provided in the electrical path connecting the low-potential output section 51B of the rectifier circuit 51 and the low-potential side 622B of the capacitor 622 of the filter circuit 62A.

[0059] The current detection unit 63A comprises a current detection element 631 and a current detection circuit 632. In this embodiment, the current detection element 631 is an electrical resistor that converts current into voltage. The current detection circuit 632 is composed of an amplification circuit using an operational amplifier IC, which amplifies the output value of the current detection element 631 and outputs it to the second controller 64. In this disclosure, the configuration of the current detection unit 63A is not limited to this, and for example, an IC utilizing a Hall element or a current transformer may be used.

[0060] The inverter circuit 61A is connected to the high-potential side 622A and the low-potential side 622B of the capacitor 622. As a result, the power supplied from the first board 50 to the second board 60 is supplied to the inverter circuit 61A via the filter circuit 62A. The inverter circuit 61A converts the supplied power into AC and outputs a high-frequency current to the heating unit 40B.

[0061] The inverter circuit 61A comprises an inverter drive circuit 611, two power semiconductor elements 612 and 613, and two resonant capacitors 614 and 615. In this embodiment, the power semiconductor elements are configured as a parallel circuit of an IGBT and an inverse diode.

[0062] In this embodiment, the inverter drive circuit 611 is composed of a transistor push-pull circuit or the like. Based on the instruction signal (PWM signal) from the second controller 64, the inverter drive circuit 611 sends drive signals to two power semiconductor elements 612 and 613, causing the two power semiconductor elements 612 and 613 to oscillate at a predetermined frequency. As a result, the inverter circuit 61A outputs a high-frequency current to the heating unit 40B.

[0063] The connection between power semiconductor elements 612 and 613 of the inverter circuit 61A is connected to one terminal of the coil constituting the heating section 40B, and the other terminal of the coil is connected to the connection between coil 621 and capacitor 622 constituting the filter circuit 62A.

[0064] As described above, in this embodiment, the second substrate 60 includes two inverter circuits 61 (inverter circuits 61A, 61B), two filter circuits 62 (filter circuits 62A, 62B), and two current detection units 63 (current detection units 63A, 63B).

[0065] The connections between the inverter circuit 61B, the filter circuit 62B, and the current detection unit 63B are the same as the connections between the inverter circuit 61A, the filter circuit 62A, and the current detection unit 63A.

[0066] The filter circuits 62A and 62B (i.e., multiple filter circuits 62) are connected to a common high-potential output section 51A. The current sensing sections 63A and 63B (i.e., multiple current sensing sections 63) are connected to a common low-potential output section 51B.

[0067] The connection between power semiconductor elements 612 and 613 of the inverter circuit 61B is connected to one terminal of the coil constituting the heating unit 40A, and the other terminal of the coil is connected to the connection between coil 621 and capacitor 622 constituting the filter circuit 62B. The inverter circuit 61B outputs a high-frequency current to the heating unit 40A.

[0068] The second controller 64 includes a microcomputer and the like. The second controller 64 controls the inverter circuit 61, as will be described later.

[0069] As described above, the second controller 64 sends an instruction signal (PWM signal) to the inverter drive circuit 611.

[0070] As described above, the second controller 64 receives a voltage corresponding to the current value from the current sensing units 63A and 63B. This current value is the value of the current flowing through the current sensing element 631 provided in each of the current sensing units 63A and 63B.

[0071] The second controller 64 receives temperature information from the component temperature detection unit 67. In other words, the second controller 64 receives temperature information from the component temperature detection unit 67. The component temperature detection unit 67 detects the temperature of the components that make up the inverter circuit 61 and is located near the components on the second circuit board 60. These components are, for example, power semiconductor elements 612 and 613. A known component temperature detection unit 67, such as a thermistor, can be used. The component temperature detection unit 67 outputs temperature information based on the detected temperature to the second controller 64.

[0072] If the number of inverter circuits 61 is increased, the number of component temperature detection units 67 is also increased accordingly. In this embodiment, when there are two inverter circuits 61A and 61B, the component temperature detection unit 67A detects the temperature of inverter circuit 61A, and the component temperature detection unit 67B detects the temperature of inverter circuit 61B, and outputs the results to the second controller 64.

[0073] The second controller 64 receives second abnormality information from the second abnormality detection unit 661 of the induction heating cooking device 10. The second abnormality detection unit 661 detects an abnormality in the second fan 66. The second abnormality detection unit 661 detects, for example, the rotation speed of the second fan 66. Based on the rotation speed received from the second fan 66, the second controller 64 determines whether the second fan 66 is rotating normally or not. In this embodiment, the second abnormality detection unit 661 is provided in correspondence to each of the two second fans 66. However, the second abnormality detection unit 661 may be provided in correspondence to only one of the two second fans 66.

[0074] The second controller 64 is capable of communicating with the first controller 52. In this embodiment, the second controller 64 receives a second synchronization signal from the first controller 52.

[0075] The DC-DC power supply unit 69 is a switching power supply that converts the 20V output of the AC-DC power supply unit 57 to a 5V output and supplies power to the microcomputer constituting the first controller 52, the microcomputer constituting the second controller 64, the operational amplifier constituting the current sensing circuit 632, the display operation unit, etc. In this embodiment, the low-potential side (0V side) of the AC-DC power supply unit 57, the low-potential side (0V side) of the DC-DC power supply unit 69, and the low-potential side (0V side) of the microcomputer are all connected to the electrical path 60P connected to the low-potential side output section 51B of the rectifier circuit 51.

[0076] As described above, the first circuit board 50 is equipped with components and connectors that are easy to connect to the AC power supply 2, and the second circuit board 60 is equipped with components used after rectification, such as the inverter circuit 61, so that components that are not needed are not connected to each other's boards.

[0077] The control of the inverter circuit 61 will be described below.

[0078] The second controller 64 operates in synchronization with the second synchronization signal input from the first controller 52. The second controller 64 receives the current values ​​detected by the current detection units 63A and 63B in synchronization with the second synchronization signal. The second controller 64 also outputs a high-frequency current to the heating unit 40. More specifically, the first controller 52 communicates to the second controller 64 which inverter circuit 61 (and heating unit 40) to operate with what current value, based on the heating setting selected in the operation unit 80. Based on this communication, the second controller 64 outputs a PWM signal to the inverter drive circuit 611 so that the current values ​​received from the current detection units 63A and 63B become the current values ​​instructed by the first controller 52. The inverter drive circuit 611 alternately drives the power semiconductor elements 613 and 612 that constitute the inverter circuit 61, thereby supplying a high-frequency current to the heating coil that constitutes the heating unit 40. The heating coil and the pot 30 are magnetically coupled, and when a high-frequency current flows, eddy currents flow in the pot 30, causing the pot to heat up.

[0079] The second controller 64 determines, based on the temperature information input from the component temperature detection unit 67, whether the temperature of the components constituting the inverter circuit 61 exceeds a preset heat resistance temperature. If the temperature of the components constituting the inverter circuit 61 exceeds the heat resistance temperature, the second controller 64 sends a stop signal to, for example, the inverter drive circuit 611 to stop the operation of the inverter circuit 61.

[0080] In this embodiment, the second controller 64 controls the inverter circuit 61 by receiving instructions from the first controller 52. For example, if the user instructs the heating of the pot 30 by operating the operation unit 80, the instruction is sent from the operation unit 80 to the first controller 52, and the first controller 52, having received the instruction from the operation unit 80, sends the instruction to the second controller 64.

[0081] The first controller 52 instructs the second controller 64 to control the inverter circuit 61 to start and stop heating the pot 30 by the heating unit 40. For example, when the operation unit 80 instructs the first controller 52 to start heating the pot 30, the first controller 52 instructs the second controller 64 to start heating the pot 30. Also, when the operation unit 80 instructs the first controller 52 to stop heating the pot 30, the first controller 52 instructs the second controller 64 to stop heating the pot 30.

[0082] The first controller 52 recognizes the temperature of the pot 30 based on the temperature information input from the pot temperature detection unit 31 and determines whether the temperature of the pot 30 is appropriate or not. If the temperature of the pot 30 is abnormal, it executes a control to stop heating the pot 30.

[0083] For example, if the first controller 52 determines that the temperature of the pot 30 is rising while it is outputting a signal to the second controller 64 instructing it to control the inverter circuit 61 to stop heating the pot 30 by the heating unit 40, it will perform the following actions. In this case, the first controller 52 will reset the second controller 64 by sending a reset signal to the second controller 64. Alternatively, the first controller 52 will stop supplying power to the second controller 64.

[0084] The first controller 52 detects that the first fan 54 is malfunctioning when it receives first malfunction information from the first malfunction detection unit 541. The second controller 64 detects that the second fan 66 is malfunctioning when it receives second malfunction information from the second malfunction detection unit 661. In this embodiment, if at least one of the first fan 54 and the second fan 66 is detected as malfunctioning, at least one of the first controller 52 and the second controller 64 will perform an action to address the malfunction. For example, the heating operation of the pot 30 will be stopped. Alternatively, for example, a message indicating that the fan is malfunctioning will be displayed on the display unit of the operation unit 80.

[0085] In this embodiment, the first controller 52 and the second controller 64 are integrated circuits equipped with a microcomputer or the like. The first controller 52, which is an integrated circuit, is mounted on the first substrate 50. The second controller 64, which is an integrated circuit, is mounted on the second substrate 60. Here, the first controller 52 may be directly mounted on the first substrate 50 or indirectly mounted. Similarly, the second controller 64 may be directly mounted on the second substrate 60 or indirectly mounted.

[0086] Figure 9 is a schematic side view showing a substrate, a sub-sub

[0087] Figure 10 is a schematic side view showing an example of a sub-board mounted on the second board. A microcomputer 996, which constitutes the second controller 64, is mounted on the sub-board 68, along with other small chip components (not shown). A connector 999 is mounted on the sub-board 68. A connector 998 corresponding to connector 999 is mounted on the second board 60. The second board 60 and the sub-board 68 are mechanically fixed and electrically connected by interlocking connectors 999 and 998. In this embodiment, since the two connectors are interlocked, the second board 60 and the sub-board 68 are detachable, and operation can be maintained by replacing only the sub-board 68 in the event of a sub-board failure or when the microcomputer is discontinued.

[0088] Based on the above, at least one of the first controller 52 and the second controller 64 may be mounted on the corresponding board among the first board 50 and the second board 60 via sub-boards 56 and 68.

[0089] The induction heating cooking device 10 according to this embodiment can provide the following effects.

[0090] According to this embodiment, the induction heating cooking device 10 can be made compatible with various power sources by changing only the first circuit board 50. For example, if the induction heating cooking device 10 is to be used in Japan, the induction heating cooking device 10 can be made compatible with Japanese commercial power sources by installing the first circuit board 50 compatible with Japanese commercial power sources. Also, for example, if the induction heating cooking device 10 is to be used in the United States, the induction heating cooking device 10 can be made compatible with US commercial power sources by installing the first circuit board 50 compatible with US commercial power sources. On the other hand, according to this embodiment, the induction heating cooking device 10 can be made compatible with various power sources without changing the second circuit board 60. In other words, the second circuit board 60 can be shared to accommodate various power source specifications. As a result, the man-hours required for development to make the induction heating cooking device 10 compatible with various power sources can be reduced. Furthermore, even when the induction heating cooking device 10 is made compatible with various power sources, the quality of the induction heating cooking device 10 can be stabilized. In addition, according to this embodiment, by dividing the circuit board at the connection point between the rectifier circuit and the filter circuit, a current with reduced ripple can be passed through the filter circuit, thereby reducing radiated noise from the lead wires.

[0091] According to this embodiment, if the configuration of the pot 30 or the heating unit 40 is changed, only the second substrate 60 needs to be changed, and the first substrate 50 does not need to be changed. In other words, the first substrate 50 can be shared to accommodate various specifications of the pot 30 and the heating unit 40.

[0092] According to this embodiment, the current output from the rectifier circuit 51 can be detected by the current detection unit 63 provided on the second circuit board 60. Therefore, the current control of the inverter circuit 61 can be completed solely by the second circuit board 60. Furthermore, even if the voltage in the rectifier circuit 51 changes due to a change in the first circuit board 50, the current control of the inverter circuit 61 can be performed based on the current value detected by the current detection unit 63 so that the inverter circuit 61 can output an appropriate value.

[0093] According to this embodiment, since multiple current detection units 63 are connected to a common low-potential output unit 51B, the potential at the points connected to the low-potential output unit 51B can be made common. Therefore, even if the induction heating cooking device 10 is equipped with multiple inverter circuits 61, the output values ​​of the inverter circuits 61 can be controlled by the second circuit board 60 alone.

[0094] According to this embodiment, a first synchronization signal synchronized with the AC power supply 2 is input to the first controller 52. The first synchronization signal is generated, for example, in a synchronization signal generation unit (not shown) provided on or outside the first board 50. Furthermore, according to this embodiment, the first controller 52 outputs a second synchronization signal generated based on the first synchronization signal to the second controller 64. The second controller 64 performs processes such as receiving current from the current detection unit 63 and controlling the inverter circuit 61 in synchronization with the second synchronization signal. Therefore, according to this embodiment, it is not necessary to newly provide a synchronization signal generation unit for sending the second synchronization signal to the second controller 64, separate from the synchronization signal generation unit for sending the first synchronization signal to the first controller 52. This reduces the complexity of the circuit configuration on the second board 60.

[0095] According to this embodiment, the processing performed on the first substrate 50 can be controlled by the first controller 52, and the processing performed on the second substrate 60 can be controlled by the second controller 64. This increases the independence of the first substrate 50 and the second substrate 60. As a result, when one of the first substrate 50 or the second substrate 60 is changed due to a change in the specifications of the induction heating cooking device 10, the impact on the other substrate can be kept to a minimum. Consequently, the specifications of the induction heating cooking device 10 can be easily changed by changing at least one of the first substrate 50 or the second substrate 60.

[0096] According to this embodiment, the second controller 64 provided on the second substrate 60 detects the temperature of the components constituting the inverter circuit 61 provided on the second substrate 60. Therefore, when changing the specifications of the induction heating cooking device 10 by changing the first substrate 50, it is not necessary to change the configuration of the second substrate 60.

[0097] According to this embodiment, if the heating stop of the pot 30 by the second controller 64 controlling the inverter circuit 61 is not performed as expected, the first controller 52 resets the second controller 64 or stops supplying electrodes to the second controller 64. In other words, even if the heating stop control of the pot 30 by the second controller 64 is not performed as expected, the heating stop of the pot 30 can be performed by the first controller 52 controlling the second controller 64. As a result, safety can be improved.

[0098] If the first controller 52 and the second controller 64 (hereinafter referred to as "controllers" in this paragraph) are directly mounted on the first board 50 and the second board 60 (hereinafter referred to as "boards" in this paragraph), the following problems may arise. In other words, if the controller model is changed, it may be necessary to make significant changes to the wiring of the board on which the controller is mounted. According to this embodiment, the controller is mounted on the board via sub-boards 56 and 68. Therefore, even if the controller model is changed, only the sub-boards 56 and 68 need to be changed. This makes it possible to minimize changes to the wiring of the board when the controller model is changed.

[0099] According to this embodiment, when the induction heating cooking device 10 is to be compatible with a single-phase power supply, the induction heating cooking device 10 can be made to be compatible with a single-phase power supply by mounting a first circuit board 50 compatible with a single-phase power supply. Furthermore, when the induction heating cooking device 10 is to be compatible with a three-phase power supply, the induction heating cooking device 10 can be made to be compatible with a three-phase power supply by mounting a first circuit board 50 compatible with a three-phase power supply.

[0100] If multiple fans are placed close to each other and no cover 72 is provided, the air inflow and outflow of the multiple fans may interfere with each other, potentially reducing intake efficiency. In this embodiment, since the first substrate 50 and the second substrate 60 are covered by the cover 72, the airflow between the inside and outside of the cover 72 is suppressed. Therefore, the reduction in intake air loss from the outside to the inside of the cover 72 can be suppressed, thereby improving cooling capacity.

[0101] According to this embodiment, noise to the first substrate 50 and the second substrate 60 can be reduced by the electromagnetic shielding member 73. This reduces the noise countermeasures that need to be taken when changing the first substrate 50 or the second substrate 60 due to a change in the specifications of the induction heating cooking device 10. As a result, it becomes easier to change the specifications of the induction heating cooking device 10 by changing the first substrate 50 or the second substrate 60.

[0102] If the system were configured to not detect an abnormality when only one of the first fan 54 or the second fan 66 fails while the other continues to operate, the system would continue to operate with reduced cooling performance, increasing the likelihood of circuit malfunctions and failures of the rectifier circuit 51 and power semiconductor element 612. In this embodiment, a first abnormality detection unit 541 for detecting abnormalities in the first fan 54 and a second abnormality detection unit 661 for detecting abnormalities in the second fan 66 are provided, allowing for individual detection of failures in the first fan 54 and the second fan 66. This prevents the system from continuing to operate with reduced cooling performance as described above. Therefore, the likelihood of circuit malfunctions and failures of the rectifier circuit 51 and power semiconductor element 612 can be reduced.

[0103] According to this embodiment, the filter 22 can be pulled out from the housing 20 without moving the housing 20, making maintenance of the filter 22 easy.

[0104] (Summary of the embodiment) (1) An induction heating cooking apparatus according to a first aspect of the present disclosure is A pot and A heating unit for heating the aforementioned pot, A first circuit board that is powered by an external AC power source, The heating unit and the second substrate, which is connected to the first substrate and supplied with power from the first substrate, include an inverter circuit that outputs a high-frequency current to the heating unit.

[0105] (2) In the induction heating cooking apparatus of (1), The first substrate may have a rectifier circuit that rectifies the AC power input from the AC power supply. The second substrate may have a filter circuit having a coil and a capacitor, and the rectifier circuit may be connected to the filter circuit. The inverter circuit may be connected to the capacitor of the filter circuit.

[0106] (3)(2) In the induction heating cooking apparatus, The rectifier circuit described above is The high-potential side output section of the filter circuit is connected to the high-potential side of the capacitor, The filter circuit may also include a low-potential output section connected to the low-potential side of the capacitor, The second substrate may include a current detection unit provided in the electrical path connecting the low-potential output unit and the low-potential side of the capacitor.

[0107] (4)(3) In the induction heating cooking apparatus, The second substrate is Multiple inverter circuits, A plurality of filter circuits provided corresponding to each of the plurality of inverter circuits, The system may also include a plurality of current sensing units, each of which is provided in accordance with the plurality of filter circuits. Multiple current sensing units may be connected to a common low-potential output unit.

[0108] (5)(3) or (4) In the induction heating cooking apparatus, The first board may have a first controller to which a first synchronization signal synchronized with the AC power supply is input. The second board may have a second controller that can communicate with the first controller. The first controller may output a second synchronization signal generated based on the first synchronization signal to the second controller. The second controller may, in synchronization with the second synchronization signal, receive the current value detected by the current detection unit and control the inverter circuit to output the high-frequency current to the heating unit.

[0109] (6) In any one of the induction heating cooking devices described in (1) to (4), The first board may have a first controller. The second board may have a second controller that can communicate with the first controller. The second controller may also control the inverter circuit. The first controller may control the inverter circuit in relation to the second controller to start and stop the heating of the pot by the heating unit.

[0110] (7)(5) or (6) induction heating cooking appliances are The pot may further include a pot temperature detection unit for detecting the temperature of the bottom of the pot. The second substrate may also include a component temperature detection unit for detecting the temperature of the components constituting the inverter circuit. The first controller may receive temperature information from the pot temperature detection unit. The second controller may receive temperature information from the component temperature detection unit.

[0111] (8) Any one of the induction heating cooking devices from (5) to (7) is The system may further include a pot temperature detection unit that detects the temperature of the bottom of the pot and outputs temperature information based on the detected temperature to the first controller. If the first controller is outputting a signal to the second controller instructing it to control the inverter circuit and stop heating the pot by the heating unit, and it determines that the temperature of the bottom of the pot is rising based on the temperature information from the pot temperature detection unit, it may reset the second controller or stop supplying power to the second controller.

[0112] In any one of the induction heating cooking devices described in (9)(5) to (8), At least one of the first controller and the second controller may be mounted on the corresponding board of the first board and the second board via a sub-board.

[0113] (10) In any one of the induction heating cooking devices from (1) to (9), The second board may be configured to operate normally when connected to either the first board for single-phase operation, which is powered by a single-phase AC power supply, or the first board for three-phase operation, which is powered by a three-phase AC power supply. The induction heating cooking device may be equipped with either the first circuit board for single-phase power or the first circuit board for three-phase power.

[0114] (11) Any one of the induction heating cooking devices from (1) to (10) is: A support portion that supports the first substrate and the second substrate, The system may further include a flame-retardant or non-combustible cover that covers the first and second substrates, which are supported by the support portion.

[0115] (12) Any one of the induction heating cooking devices from (1) to (11) is: A support portion is provided between the heating portion and the first substrate and the second substrate, and has a support surface that supports the first substrate and the second substrate, The system may further include an electromagnetic shielding member provided between the heating portion and the support portion, which overlaps with at least a portion of the first substrate and the second substrate when viewed in a direction perpendicular to the support surface.

[0116] (13) In any one of the induction heating cooking devices from (1) to (12), The first substrate may have a rectifier circuit that rectifies the AC input from the AC power supply into DC. Induction heating cooking devices are Supported on the first substrate, at least one first fan for cooling the rectifier circuit, The system may further include at least one second fan, supported on the second substrate, for cooling the power semiconductor elements of the inverter circuit.

[0117] In the induction heating cooking apparatus of (14)(13), A first abnormality detection unit that detects an abnormality in the first fan, The system may further include a second abnormality detection unit for detecting abnormalities in the second fan.

[0118] (15) Any one of the induction heating cooking devices from (1) to (14) is A housing for storing the aforementioned pot inside, The system may further include a filter located below the pot, which filters communication between the inside and outside of the housing. The filter may be retractable from the housing by sliding.

[0119] Furthermore, by appropriately combining any of the various embodiments described above, the effects of each embodiment can be achieved.

[0120] While this disclosure is adequately described in relation to preferred embodiments with reference to the drawings as appropriate, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims, as long as they do not fall outside that scope. [Explanation of Symbols]

[0121] 2 AC power supply 10 Induction heating cooking device 20 cabinets 22 filters 30 Pot 31 Pot temperature detection unit 40 Heating section 50 First substrate 51 Rectifier circuit 51A High-potential output section 51B Low-voltage output section 52 First Controller 54 First Fan 541 First Anomaly Detection Unit 56 Sub-board 60 Second board 60P Electrical Path 61 Inverter Circuit 612 Power Semiconductor Devices 62 Filter Circuits 621 Coil 622 Capacitors 622A High potential side 622B Low potential side 63 Current detection unit 64. Second Controller 66 Second Fan 661 Second Anomaly Detection Unit 67 Component temperature detection unit 68 Sub-board 71 Support part 71A Bottom side 72 Cover 73 Electromagnetic shielding components

Claims

1. A pot and A heating section for heating the aforementioned pot, A first circuit board that is powered by an external AC power source, An induction heating cooking apparatus comprising: a heating unit and a second substrate connected to the first substrate and supplied with power from the first substrate, the second substrate having an inverter circuit that outputs a high-frequency current to the heating unit.

2. The first substrate has a rectifier circuit that rectifies the AC power input from the AC power supply, The second substrate has a filter circuit having a coil and a capacitor, and the rectifier circuit is connected to the filter circuit. The induction heating cooking apparatus according to claim 1, wherein the inverter circuit is connected to the capacitor of the filter circuit.

3. The rectifier circuit described above is The high-potential side output section of the filter circuit is connected to the high-potential side of the capacitor, The filter circuit comprises a low-potential output section connected to the low-potential side of the capacitor, The induction heating cooking apparatus according to claim 2, wherein the second substrate includes a current detection unit provided in an electrical path connecting the low-potential output unit and the low-potential side of the capacitor.

4. The aforementioned second substrate is Multiple inverter circuits, A plurality of filter circuits provided corresponding to each of the plurality of inverter circuits, It comprises a plurality of current detection units provided corresponding to each of the plurality of filter circuits, The induction heating cooking apparatus according to claim 3, wherein the plurality of current sensing units are connected to a common low-potential output unit.

5. The first circuit board has a first controller to which a first synchronization signal synchronized with the AC power supply is input. The second board has a second controller that can communicate with the first controller, The first controller outputs a second synchronization signal generated based on the first synchronization signal to the second controller. The induction heating cooking apparatus according to claim 3 or 4, wherein the second controller receives the current value detected by the current detection unit in synchronization with the second synchronization signal and controls the inverter circuit to output the high-frequency current to the heating unit.

6. The first substrate has a first controller, The second board has a second controller that can communicate with the first controller, The second controller controls the inverter circuit, The induction heating cooking apparatus according to any one of claims 1 to 4, wherein the first controller controls the inverter circuit to the second controller to start and stop heating the pot by the heating unit.

7. The pot further includes a pot temperature detection unit that detects the temperature of the bottom of the pot, The second substrate includes a component temperature detection unit that detects the temperature of the components constituting the inverter circuit, The first controller receives temperature information from the pot temperature detection unit, The induction heating cooking apparatus according to claim 6, wherein the second controller receives temperature information from the component temperature detection unit.

8. The system further includes a pot temperature detection unit that detects the temperature of the bottom of the pot and outputs temperature information based on the detected temperature to the first controller. The induction heating cooking apparatus according to claim 6, wherein the first controller outputs a signal to the second controller instructing it to control the inverter circuit to stop heating the pot by the heating unit, and if it determines that the temperature of the bottom of the pot is rising based on temperature information from the pot temperature detection unit, it resets the second controller or stops supplying power to the second controller.

9. The induction heating cooking apparatus according to claim 6, wherein at least one of the first controller and the second controller is mounted on the corresponding board of the first board and the second board via a sub-board.

10. The second circuit board is configured to operate normally regardless of whether it is connected to the first circuit board for single-phase operation, which is powered by a single-phase AC power supply, or the first circuit board for three-phase operation, which is powered by a three-phase AC power supply. An induction heating cooking apparatus according to any one of claims 1 to 4, comprising either the first substrate for single-phase or the first substrate for three-phase.

11. A support portion that supports the first substrate and the second substrate, An induction heating cooking apparatus according to any one of claims 1 to 4, further comprising a flame-retardant or non-combustible cover covering the first substrate and the second substrate supported by the support portion.

12. A support portion is provided between the heating portion and the first substrate and the second substrate, and has a support surface for supporting the first substrate and the second substrate, An induction heating cooking apparatus according to any one of claims 1 to 4, further comprising: an electromagnetic shielding member provided between the heating section and the support section, which overlaps with at least a portion of the first substrate and the second substrate when viewed in a direction perpendicular to the support surface.

13. The first substrate has a rectifier circuit that rectifies the AC input from the AC power supply into DC, Supported on the first substrate, at least one first fan for cooling the rectifier circuit, The induction heating cooking apparatus according to any one of claims 1 to 4, further comprising: at least one second fan supported on the second substrate for cooling the power semiconductor elements of the inverter circuit.

14. A first abnormality detection unit that detects an abnormality in the first fan, The induction heating cooking apparatus according to claim 13, further comprising a second abnormality detection unit for detecting an abnormality in the second fan.

15. A housing for storing the aforementioned pot inside, The enclosure further comprises a filter provided below the pot for filtering communication between the inside and outside of the enclosure, The induction heating cooking apparatus according to any one of claims 1 to 4, wherein the filter is retractable by sliding relative to the housing.

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