Substrate processing apparatus and substrate processing method

Abstract

This invention provides a substrate processing apparatus and a substrate processing method that can improve the throughput of the substrate processing apparatus. [Solution] The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus 1 comprises an indexer section 2, a slider section 3, a bridge section 4, a first front section 5, and a first rear section 6. The indexer section 2, the slider section 3, and the bridge section 4 are arranged in the front-to-back direction X in this order. The first front section 5, the bridge section 4, and the first rear section 6 are arranged in the front-to-back direction X in this order. The slider section 3 transports the substrate W between the indexer section 2 and the bridge section 4. The bridge section 4 transports the substrate W between the slider section 3 and the first front section 5. The bridge section 4 transports the substrate W between the slider section 3 and the first rear section 6. The first front section 5 comprises a plurality of processing units 50. The first front section 5 comprises a transport mechanism 55. The first rear section 6 comprises a plurality of processing units 60. The first rear section 6 comprises a transport mechanism 65. In a plan view, the slider section 3 overlaps with the processing unit 50.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate and a substrate processing method. The substrate is, for example, any one of a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, and a substrate for a solar cell.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus. Hereinafter, the reference numerals described in Patent Document 1 are represented in parentheses. The substrate processing apparatus includes a carrier block (S1), a first processing block (S2), a transfer block (S3), a second processing block (S4), and shuttle arms (G1, G2). The first processing block (S2) includes a processing unit and a main arm (A11). The second processing block (S3) includes a processing unit and a main arm (A21). The shuttle arm (G1) is disposed above the main arm (A11). The shuttle arm (G2) is disposed above the main arm (A12).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] There is a demand for further improving the throughput of the substrate processing apparatus.

[0005] This invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus and a substrate processing method that can improve the throughput of the substrate processing apparatus. [Means for solving the problem]

[0006] To achieve this objective, the present invention has the following configuration. That is, the present invention is a substrate processing apparatus comprising an indexer section, a slider section, a bridge section, a first front section, and a first rear section, wherein the indexer section, the slider section, and the bridge section are arranged in this order in a first direction, the first direction is horizontal, the first front section, the bridge section, and the first rear section are arranged in this order in a first direction, the slider section transports the substrate between the indexer section and the bridge section, and the bridge section transports the substrate between the slider section and the first rear section The substrate processing apparatus transports substrates between the front section and between the slider section and the first rear section, the first front section comprising a plurality of processing units and a first front transport mechanism for transporting substrates to the processing units of the first front section, the first rear section comprising a plurality of processing units and a first rear transport mechanism for transporting substrates to the processing units of the first rear section, and the slider section is a substrate processing apparatus that overlaps with the processing units of the first front section in a plan view.

[0007] The substrate processing apparatus comprises an indexer section, a slider section, a bridge section, a first front section, and a first rear section. The indexer section, slider section, and bridge section are arranged in this order in the first direction. The first direction is horizontal. The first front section, bridge section, and first rear section are arranged in this order in the first direction. The slider section transports the substrate between the indexer section and the bridge section. The bridge section transports the substrate between the slider section and the first front section. The bridge section transports the substrate between the slider section and the first rear section. The first front section comprises a plurality of processing units. The first front section comprises a first front transport mechanism. The first front transport mechanism transports the substrate to the processing units of the first front section. The first rear section comprises a plurality of processing units. The first rear section comprises a first rear transport mechanism. The first rear transport mechanism transports the substrate to the processing units of the first rear section.

[0008] Here, the slider section overlaps with the processing unit of the first front section in a plan view. Therefore, it is easy to improve the throughput of the first front section. In other words, it is easy to efficiently process the substrate in the first front section.

[0009] In summary, this substrate processing device makes it easy to improve throughput.

[0010] In this substrate processing apparatus, it is preferable that the slider portion does not overlap with the first rear portion in a plan view. Therefore, it is easy to improve the throughput of the first rear portion.

[0011] In this substrate processing apparatus, when a substrate is transported from the indexer section to the first front section, it is preferable that the substrate always passes through the slider section and the bridge section, and when a substrate is transported from the first front section to the indexer section, it is preferable that the substrate always passes through the slider section and the bridge section. Therefore, the substrate is efficiently transported between the indexer section and the first front section. Thus, it is easy to improve the throughput of the substrate processing apparatus.

[0012] In this substrate processing apparatus, when a substrate is transported from the indexer section to the first rear section, it is preferable that the substrate always passes through the slider section and the bridge section, and when a substrate is transported from the first rear section to the indexer section, it is preferable that the substrate always passes through the slider section and the bridge section. Therefore, the substrate is efficiently transported between the indexer section and the first rear section. Thus, it is easy to improve the throughput of the substrate processing apparatus.

[0013] In this substrate processing apparatus, it is preferable that the first front transport mechanism is configured to move to the same height position as the slider. Therefore, it is easy to increase the range of motion of the first front transport mechanism in the vertical direction. Thus, it is easy to improve the throughput of the first front section.

[0014] In this substrate processing apparatus, the processing unit of the first front section includes a first processing unit and a plurality of second processing units, and it is preferable that the first processing unit of the first front section and the slider section are arranged vertically, the second processing units of the first front section are arranged vertically, and at least one of the second processing units of the first front section is positioned at the same height as the slider section. The processing unit of the first front section includes a first processing unit. The first processing unit of the first front section and the slider section are arranged vertically. Therefore, it is easy for the slider section to overlap with the processing unit of the first front section in a plan view.

[0015] The processing unit of the first front section includes a plurality of second processing units. The second processing units of the first front section are arranged vertically. At least one of the second processing units of the first front section is positioned at the same height as the slider section. Therefore, it is easy to increase the number of second processing units of the first front section. Thus, it is easy to improve the throughput of the first front section.

[0016] In this substrate processing apparatus, the first processing unit, the first front transport mechanism, and the second processing unit of the first front section are preferably arranged in this order in the second direction, and the second direction is horizontal and perpendicular to the first direction. Therefore, the first front transport mechanism efficiently transports the substrate to the first processing unit of the first front section. The first front transport mechanism efficiently transports the substrate to the second processing unit of the first front section. Thus, it is easy to improve the throughput of the first front section.

[0017] In this substrate processing apparatus, it is preferable that the first processing unit of the first front section performs a non-liquid treatment on the substrate, and the second processing unit of the first front section performs a liquid treatment on the substrate. Therefore, it is easy to perform both non-liquid and liquid treatments on the substrate in the first front section.

[0018] In this substrate processing apparatus, the processing unit of the first front section includes a third processing unit, and it is preferable that the third processing unit of the first front section and the first front transport mechanism are aligned in the first direction. The processing unit of the first front section includes a third processing unit. Therefore, it is easy to increase the number of processing units of the first front section.

[0019] The third processing unit and the first front transport mechanism in the first front section are aligned in the first direction. Therefore, the first front transport mechanism efficiently transports the substrate to the third processing unit in the first front section.

[0020] In this substrate processing apparatus, a second front section is provided above the first front section, the second front section comprises a plurality of processing units and a second front transport mechanism for transporting substrates to the processing units of the second front section, the slider section overlaps with the processing units of the second front section in a plan view, and the slider section is preferably provided between the first front section and the second front section. The substrate processing apparatus comprises a second front section. The second front section comprises a plurality of processing units. The second front section comprises a second front transport mechanism. The second front transport mechanism transports substrates to the processing units of the second front section. Therefore, it is easy to improve the throughput of the substrate processing apparatus.

[0021] In a plan view, the slider section overlaps with the processing unit of the second front section. Therefore, improving the throughput of the second front section is easy.

[0022] The slider section is positioned between the first front section and the second front section. Therefore, the slider section and the first front section are adjacent to each other. The slider section and the second front section are adjacent to each other. Thus, it is easy for the bridge section to transport the substrate between the slider section and the first front section. It is also easy for the bridge section to transport the substrate between the slider section and the second front section.

[0023] In this substrate processing apparatus, the slider portion has a lower part and an upper part located above the lower part of the slider portion, and it is preferable that the first front transport mechanism is configured to move to the same height position as the lower part of the slider portion, and the second front transport mechanism is configured to move to the same height position as the upper part of the slider portion. The slider portion has a lower part. The first front transport mechanism is configured to move to the same height position as the lower part of the slider portion. Therefore, it is easy to increase the range of motion of the first front transport mechanism in the vertical direction. Thus, it is easy to improve the throughput of the first front portion.

[0024] The slider part has an upper portion. The upper portion of the slider part is located above the lower portion of the slider part. The second front transfer mechanism is configured to move to the same height position as the upper portion of the slider part. Therefore, it is easy to expand the movable range of the second front transfer mechanism in the vertical direction. Thus, it is easy to improve the throughput of the second front part.

[0025] In this substrate processing apparatus, the processing unit of the second front part includes a first processing unit and a plurality of second processing units. The first processing unit of the second front part is disposed above the first processing unit of the first front part. The slider part is disposed above the first processing unit of the first front part and below the first processing unit of the second front part. The second processing units of the second front part are disposed above the second processing units of the first front part. The second processing units of the second front part are arranged in the vertical direction. At least one of the second processing units of the first front part is disposed at the same height position as the lower portion of the slider part. It is preferable that at least one of the second processing units of the second front part is disposed at the same height position as the upper portion of the slider part. The processing unit of the second front part includes a first processing unit. The first processing unit of the second front part is disposed above the first processing unit of the first front part. The slider part is disposed above the first processing unit of the first front part and below the first processing unit of the second front part. Therefore, it is easy for the slider part to overlap with the processing unit of the first front part in plan view. It is easy for the slider part to overlap with the processing unit of the second front part in plan view. It is easy to dispose the slider part between the first front part and the second front part.

[0026] The processing unit of the second front part includes a plurality of second processing units. The second processing units of the second front part are arranged vertically. At least one of the second processing units of the second front part is arranged at the same height position as the slider part. Therefore, it is easy to increase the number of second processing units of the second front part. Thus, it is easy to improve the throughput of the second front part.

[0027] In this substrate processing apparatus, the indexer unit includes a first transfer mechanism, the slider unit includes a second transfer mechanism, the bridge unit includes a third transfer mechanism, the first transfer mechanism and the second transfer mechanism transfer a substrate to each other, the second transfer mechanism and the third transfer mechanism transfer a substrate to each other, the first transfer mechanism includes a first support part for supporting a substrate, the second transfer mechanism includes a second support part for supporting a substrate, the third transfer mechanism includes a third support part for supporting a substrate, and when the first transfer mechanism and the second transfer mechanism transfer a substrate to each other, it is preferable that the second support part overlaps with the processing unit of the first front part in a plan view. The indexer unit includes a first transfer mechanism. The slider unit includes a second transfer mechanism. The bridge unit includes a third transfer mechanism. The first transfer mechanism and the second transfer mechanism transfer a substrate to each other. The second transfer mechanism and the third transfer mechanism transfer a substrate to each other. Therefore, it is easy for the slider unit to transfer a substrate between the indexer unit and the bridge unit.

[0028] The first transfer mechanism includes a first support part for supporting a substrate. The second transfer mechanism includes a second support part for supporting a substrate. The third transfer mechanism includes a third support part for supporting a substrate. Therefore, it is easy for the first transfer mechanism and the second transfer mechanism to transfer a substrate to each other. It is easy for the second transfer mechanism and the third transfer mechanism to transfer a substrate to each other.

[0029] When the first transfer mechanism and the second transfer mechanism transfer a substrate to each other, the second support part overlaps with the processing unit of the first front part in a plan view. Therefore, the transfer distance of the substrate in the slider unit is short. Thus, the slider unit efficiently transfers a substrate between the indexer unit and the bridge unit.

[0030] In this substrate processing apparatus, when the second transport mechanism and the third transport mechanism transfer a substrate to each other, it is preferable that the second support portion overlaps with the processing unit of the first front portion in a plan view. Therefore, the transport distance of the substrate in the slider portion is short. Thus, the slider portion efficiently transports the substrate between the indexer portion and the bridge portion.

[0031] In this substrate processing apparatus, it is preferable that the first transport mechanism and the second transport mechanism transfer multiple substrates to each other at once, and that the second transport mechanism and the third transport mechanism transfer multiple substrates to each other at once. The first transport mechanism and the second transport mechanism transfer multiple substrates to each other at once. Therefore, the first transport mechanism and the second transport mechanism efficiently transfer substrates to each other.

[0032] The second and third transport mechanisms transfer multiple substrates to each other simultaneously. Therefore, the second and third transport mechanisms efficiently transfer substrates to each other.

[0033] In this substrate processing apparatus, it is preferable that the first support section comprises a plurality of first hands, each of which supports one substrate; the second support section comprises a plurality of second hands, each of which supports one substrate; and the third support section comprises a plurality of third hands, each of which supports one substrate. Therefore, it is easy for the first transport mechanism and the second transport mechanism to transfer multiple substrates to each other at once. It is also easy for the second transport mechanism and the third transport mechanism to transfer multiple substrates to each other at once.

[0034] In this substrate processing apparatus, the second transport mechanism preferably includes a guide that guides the second support portion, the guide having a closed curved shape, and the second support portion preferably moves circumferentially along the guide. The slider portion efficiently transports the substrate between the indexer portion and the bridge portion.

[0035] In this substrate processing apparatus, it is preferable that the slider section includes a detection unit for detecting the substrate supported by the second support section. Therefore, monitoring the transport of the substrate in the slider section is easy.

[0036] In this substrate processing apparatus, the detection unit is immovable, and it is preferable that the detection unit detects the substrate supported by the second support when the second transport mechanism transports the substrate. The detection unit is immovable. Therefore, it is easy to install the detection unit.

[0037] When the second transport mechanism transports the substrate, the detection unit detects the substrate supported by the second support unit. As the second transport mechanism transports the substrate, the relative position between the substrate and the detection unit changes. Therefore, even if the detection unit is immobile, it is easy for the detection unit to detect the substrate supported by the second support unit.

[0038] In this substrate processing apparatus, it is preferable to include a control unit that controls at least one of the first transport mechanism, the second transport mechanism, and the third transport mechanism based on the detection result of the detection unit. Therefore, the second support unit properly supports the substrate. Thus, the slider unit properly transports the substrate between the indexer unit and the bridge unit.

[0039] In this substrate processing apparatus, it is preferable that the slider section includes an inspection section for inspecting the substrate supported by the second support section. Therefore, it is easy to improve the throughput of the substrate processing apparatus.

[0040] In this substrate processing apparatus, the inspection unit is immovable, and when the second transport mechanism transports a substrate, it is preferable that the inspection unit inspects the substrate supported by the second support unit. The inspection unit is immovable. For this reason, it is easy to install the inspection unit.

[0041] When the second transport mechanism transports a substrate, the inspection unit inspects the substrate supported by the second support unit. As the second transport mechanism transports the substrate, the relative position between the substrate and the inspection unit changes. Therefore, even if the inspection unit is immobile, it is easy for the inspection unit to detect the substrate supported by the second support unit.

[0042] The present invention relates to a substrate processing method comprising: a first step of transporting a substrate from an indexer section to a slider section; a second step of transporting a substrate from the slider section to a bridge section; a third step of transporting a substrate from the bridge section to a first front section; a fourth step of transporting a substrate from the bridge section to a first rear section; a front transport step of transporting a substrate to the processing unit of the first front section, which overlaps with the slider section in a plan view, by a first front transport mechanism of the first front section; and a rear transport step of transporting a substrate to the processing unit of the first rear section by a first rear transport mechanism of the first rear section.

[0043] The substrate processing method comprises a first step, a second step, a third step, a fourth step, a front transport step, and a rear transport step. In the first step, the substrate is transported from the indexer section to the slider section. In the second step, the substrate is transported from the slider section to the bridge section. In the third step, the substrate is transported from the bridge section to the first front section. In the fourth step, the substrate is transported from the bridge section to the first rear section. In the front transport step, the first front transport mechanism in the first front section transports the substrate to the processing unit in the first front section. In the rear transport step, the first rear transport mechanism in the first rear section transports the substrate to the processing unit in the first rear section.

[0044] Here, the processing unit of the first front section overlaps with the slider section in a plan view. Therefore, it is easy to improve the throughput of the first front section. In other words, it is easy to efficiently process the substrate in the first front section.

[0045] When a substrate is transported from the indexer section to the first front section, the first, second, and third processes are executed. Therefore, the substrate is efficiently transported from the indexer section to the first front section. Thus, improving the throughput of the first front section is easy.

[0046] When a substrate is transported from the indexer section to the first rear section, the first, second, and fourth steps are executed. Therefore, the substrate is efficiently transported from the indexer section to the first rear section. Thus, improving the throughput of the first rear section is easy.

[0047] In summary, this substrate processing method makes it easy to improve throughput.

[0048] In this substrate processing method, it is preferable to include a fifth step of transporting the substrate from the first front section to the bridge section, a sixth step of transporting the substrate from the first rear section to the bridge section, a seventh step of transporting the substrate from the bridge section to the slider section, and an eighth step of transporting the substrate from the slider section to the indexer section.

[0049] The substrate processing method comprises a fifth, sixth, seventh, and eighth step. In the fifth step, the substrate is transported from the first front section to the bridge section. In the sixth step, the substrate is transported from the first rear section to the bridge section. In the seventh step, the substrate is transported from the bridge section to the slider section. In the eighth step, the substrate is transported from the slider section to the indexer section.

[0050] Here, when the substrate is transported from the first front section to the indexer section, steps 5, 7, and 8 are executed. Therefore, the substrate is efficiently transported from the first front section to the indexer section. Thus, improving the throughput of the first front section is easy.

[0051] When the substrate is transported from the first rear section to the indexer section, steps 6, 7, and 8 are executed. Therefore, the substrate is efficiently transported from the first rear section to the indexer section. Thus, improving the throughput of the first rear section is easy.

[0052] In summary, this substrate processing method makes it easy to improve throughput. [Effects of the Invention]

[0053] With this substrate processing apparatus and substrate processing method, it is easy to improve throughput. [Brief explanation of the drawing]

[0054] [Figure 1] This is a schematic side view of the substrate processing apparatus according to the embodiment. [Figure 2] This is a control block diagram of a substrate processing unit. [Figure 3] This diagram schematically shows the transport path for the substrate. [Figure 4] This is a plan view of a substrate processing device. [Figure 5] This is a plan view of a substrate processing device. [Figure 6] This is a plan view of a substrate processing device. [Figure 7] This is a first side view of the substrate processing device. [Figure 8] This is a second side view of the substrate processing device. [Figure 9] This is a front view of the indexer section. [Figure 10] This is a front view of the slider section, the first front section, and the second front section. [Figure 11] This is a front view of the bridge section. [Figure 12] These are front views of the first and second rear sections. [Figure 13] This is a detailed front view of the indexer section. [Figure 14] This is a detailed plan view of the slider section. [Figure 15]This is a detailed plan view of a portion of the bridge section. [Figure 16] This diagram schematically shows the transport path for the substrate. [Figure 17] This is a schematic side view illustrating an example of the operation of a substrate processing device. [Figure 18] This is a front view of the bridge section of the modified embodiment. [Figure 19] This is a side view of the slider portion of the modified embodiment. [Figure 20] This is a plan view of the slider portion of the modified embodiment. [Figure 21] This is a side view of the slider portion of the modified embodiment. [Figure 22] This is a plan view of the slider portion of the modified embodiment. [Figure 23] This is a plan view of the slider portion of the modified embodiment. [Figure 24] This is a plan view of the slider portion of the modified embodiment. [Modes for carrying out the invention]

[0055] The substrate processing apparatus and substrate processing method of the present invention will be described below with reference to the drawings.

[0056] <1. Overview of substrate processing equipment> Figure 1 is a schematic side view of the substrate processing apparatus 1 of the embodiment. The substrate processing apparatus 1 processes the substrate W.

[0057] The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, an organic electroluminescence (EL) substrate, a flat panel display (FPD) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or a solar cell substrate. The substrate W has a thin, flat shape. The substrate W has a roughly circular shape in plan view.

[0058] The substrate processing apparatus 1 comprises an indexer unit 2, a slider unit 3, and a bridge unit 4. The indexer unit 2, slider unit 3, and bridge unit 4 are arranged in this order in the front-to-back direction X.

[0059] The front-to-back direction X is horizontal. In this specification, the direction from the bridge section 4 to the slider section 3 within the front-to-back direction X is referred to as "front". The direction opposite to the front is referred to as "rear". The width direction Y is horizontal. The width direction Y is perpendicular to the front-to-back direction X. One direction in the width direction Y is referred to as the "first side". The direction opposite to the first side is referred to as the "second side". The vertical direction Z is perpendicular to the front-to-back direction X. The vertical direction Z is perpendicular to the width direction Y. In each figure, FRONT, REAR, FIRST SIDE, SECOND SIDE, UP, and DOWN are shown as appropriate for reference.

[0060] The front-to-back direction X is an example of the first direction of the present invention. The width direction Y is an example of the second direction of the present invention.

[0061] The slider section 3 is positioned behind the indexer section 2. The slider section 3 is positioned in front of the bridge section 4. The slider section 3 is positioned between the indexer section 2 and the bridge section 4. The slider section 3 extends in the front-rear direction X.

[0062] The substrate processing apparatus 1 comprises a first front section 5 and a first rear section 6. The first front section 5, the bridge section 4, and the first rear section 6 are arranged in the front-to-back direction X in this order. The first front section 5 is positioned in front of the bridge section 4. The first rear section 6 is positioned behind the bridge section 4. The first rear section 6 is positioned at the same height as the first front section 5. The bridge section 4 is positioned between the first front section 5 and the first rear section 6.

[0063] More specifically, the indexer section 2, the first front section 5, the bridge section 4, and the first rear section 6 are arranged in this order in the front-to-back direction X. The first front section 5 is positioned behind the indexer section 2.

[0064] The indexer section 2, slider section 3, bridge section 4, and first rear section 6 are arranged in this order in the front-to-back direction X. Slider section 3 does not extend beyond the first rear section 6.

[0065] The substrate processing apparatus 1 comprises a second front section 7 and a second rear section 8. The second front section 7, the bridge section 4, and the second rear section 8 are arranged in the front-to-back direction X in this order. The second front section 7 is positioned in front of the bridge section 4. The second rear section 8 is positioned behind the bridge section 4. The second rear section 8 is positioned at the same height as the second front section 7. The bridge section 4 is positioned between the second front section 7 and the second rear section 8.

[0066] More specifically, the indexer section 2, the second front section 7, the bridge section 4, and the second rear section 8 are arranged in this order in the front-to-back direction X. The second front section 7 is positioned behind the indexer section 2.

[0067] The indexer section 2, slider section 3, bridge section 4, and second rear section 8 are arranged in this order in the front-to-back direction X. Slider section 3 does not extend beyond the second rear section 8.

[0068] The first front section 5, the slider section 3, and the second front section 7 are arranged in this order in the vertical direction Z. The first front section 5 is positioned below the slider section 3. The second front section 7 is positioned above the first front section 5. The second front section 7 is positioned above the slider section 3. The slider section 3 is positioned between the first front section 5 and the second front section 7.

[0069] The first front section 5 is one layer. The second front section 7 is another layer.

[0070] The first rear section 6 and the second rear section 8 are aligned in the vertical direction Z. The second rear section 8 is positioned above the first rear section 6.

[0071] The first rear section 6 is one layer. The second rear section 8 is another layer.

[0072] The slider unit 3 is connected to the indexer unit 2. The slider unit 3 is connected to the bridge unit 4.

[0073] The slider unit 3 transports the substrate W between the indexer unit 2 and the bridge unit 4. For example, the slider unit 3 transports the substrate W from the indexer unit 2 to the bridge unit 4. The slider unit 3 transports the substrate W from the bridge unit 4 to the indexer unit 2.

[0074] The bridge section 4 is connected to the slider section 3. The bridge section 4 is connected to the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8. The bridge section 4 transports the substrate W between the slider section 3, the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8.

[0075] The bridge unit 4 transports the substrate W between the slider unit 3 and the first front unit 5. For example, the bridge unit 4 transports the substrate W from the slider unit 3 to the first front unit 5. The bridge unit 4 transports the substrate W from the first front unit 5 to the slider unit 3.

[0076] Similarly, the bridge unit 4 transports the substrate W between the slider unit 3 and the first rear unit 6. For example, the bridge unit 4 transports the substrate W from the slider unit 3 to the second rear unit 6. The bridge unit 4 then transports the substrate W from the second rear unit 6 back to the slider unit 3.

[0077] The bridge unit 4 transports the substrate W between the slider unit 3 and the second front unit 7. For example, the bridge unit 4 transports the substrate W from the slider unit 3 to the second front unit 7. The bridge unit 4 transports the substrate W from the second front unit 7 to the slider unit 3.

[0078] The bridge unit 4 transports the substrate W between the slider unit 3 and the second rear unit 8. For example, the bridge unit 4 transports the substrate W from the slider unit 3 to the second rear unit 8. The bridge unit 4 transports the substrate W from the second rear unit 8 to the slider unit 3.

[0079] The bridge unit 4 performs "intake," "distribution," "recovery," and "discharge."

[0080] "Taking in" refers to taking the substrate W from the slider unit 3 and transporting the substrate W from the slider unit 3 to the bridge unit 4.

[0081] "Distribution" refers to transporting the substrate W from the bridge section 4 to the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8, and then placing the substrate W on the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8.

[0082] "Recovery" refers to taking the substrate W from the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8, and transporting the substrate W from the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8 to the bridge section 4.

[0083] "Dispensing" refers to transporting the substrate W from the bridge section 4 to the slider section 3 and placing the substrate W on the slider section 3.

[0084] The indexer unit 2 and the first front unit 5 are configured so that the substrate W cannot be directly transferred between them. The slider unit 3 and the first front unit 5 are configured so that the substrate W cannot be directly transferred between them. When the substrate W is transported from the indexer unit 2 to the first front unit 5, the substrate W must pass through the slider unit 3 and the bridge unit 4. When the substrate W is transported from the first front unit 5 to the indexer unit 2, the substrate W must pass through the slider unit 3 and the bridge unit 4.

[0085] The indexer section 2 and the first rear section 6 are configured so that the substrate W cannot be directly transferred between them. The slider section 3 and the first rear section 6 are configured so that the substrate W cannot be directly transferred between them. When the substrate W is transported from the indexer section 2 to the first rear section 6, the substrate W must pass through the slider section 3 and the bridge section 4. When the substrate W is transported from the first rear section 6 to the indexer section 2, the substrate W must pass through the slider section 3 and the bridge section 4.

[0086] The indexer unit 2 and the second front unit 7 are configured so that the substrate W cannot be directly transferred between them. The slider unit 3 and the second front unit 7 are configured so that the substrate W cannot be directly transferred between them. When the substrate W is transported from the indexer unit 2 to the second front unit 7, the substrate W must pass through the slider unit 3 and the bridge unit 4. When the substrate W is transported from the second front unit 7 to the indexer unit 2, the substrate W must pass through the slider unit 3 and the bridge unit 4.

[0087] The indexer section 2 and the second rear section 8 are configured so that the substrate W cannot be directly transferred between them. The slider section 3 and the second rear section 8 are configured so that the substrate W cannot be directly transferred between them. When the substrate W is transported from the indexer section 2 to the second rear section 8, the substrate W must pass through the slider section 3 and the bridge section 4. When the substrate W is transported from the second rear section 8 to the indexer section 2, the substrate W must pass through the slider section 3 and the bridge section 4.

[0088] The first front section 5 processes the substrate W. The first rear section 6 processes the substrate W. The second front section 7 processes the substrate W. The second rear section 8 processes the substrate W.

[0089] The processing performed on the substrate W in the first front section 5 includes "liquid processing". The processing performed on the substrate W in the first front section 5 further includes "non-liquid processing". Similarly, the processing performed on the substrate W in the first rear section 6 includes "liquid processing". The processing performed on the substrate W in the first rear section 6 further includes "non-liquid processing". The processing performed on the substrate W in the second front section 7 includes "liquid processing". The processing performed on the substrate W in the second front section 7 further includes "non-liquid processing". The processing performed on the substrate W in the second rear section 8 includes "liquid processing". The processing performed on the substrate W in the second rear section 8 further includes "non-liquid processing".

[0090] "Liquid treatment" is a process performed on a substrate W by supplying a treatment liquid to the substrate W. "Liquid treatment" includes, for example, at least one of coating, developing, etching, and cleaning. "Treatment liquid" includes, for example, at least one of a coating material, a developer, an etching solution, and a cleaning solution.

[0091] "Non-liquid treatment" is a treatment or inspection performed on a substrate W without supplying a treatment liquid to the substrate W. "Non-liquid treatment" includes, for example, at least one of heat treatment and inspection.

[0092] The processing performed on the substrate W in the first rear section 6 is the same as the processing performed on the substrate W in the first front section 5. The processing performed on the substrate W in the second rear section 8 is the same as the processing performed on the substrate W in the second front section 7.

[0093] The processing performed on the substrate W in the second front section 7 is the same as the processing performed on the substrate W in the first front section 5. The processing performed on the substrate W in the second rear section 8 is the same as the processing performed on the substrate W in the first front section 5.

[0094] The first front section 5 comprises multiple processing units 50 and one transport mechanism 55. The transport mechanism 55 transports substrates W to the multiple processing units 50. The multiple processing units 50 process multiple substrates W in parallel. Similarly, the first rear section 6 comprises multiple processing units 60 and one transport mechanism 65. The second front section 7 comprises multiple processing units 70 and one transport mechanism 75. The second rear section 8 comprises multiple processing units 80 and one transport mechanism 85.

[0095] The conveying mechanism 55 is an example of the first front conveying mechanism of the present invention. The conveying mechanism 65 is an example of the first rear conveying mechanism of the present invention. The conveying mechanism 75 is an example of the second front conveying mechanism of the present invention. The conveying mechanism 85 is an example of the second rear conveying mechanism of the present invention.

[0096] Figure 2 is a control block diagram of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 10. The control unit 10 controls the indexer unit 2, the slider unit 3, the bridge unit 4, the first front unit 5, the first rear unit 6, the second front unit 7, and the second rear unit 8. Specifically, the control unit 10 controls the processing units 50, 60, 70, 80 and the transport mechanisms 55, 65, 75, 85.

[0097] The control unit 10 is implemented by, for example, a central processing unit (CPU), random access memory (RAM), and a storage medium. The central processing unit performs arithmetic processing. The random access memory functions as a workspace for arithmetic processing. The storage medium is, for example, a hard disk. The control unit 10 has various types of information pre-stored in the storage medium. The information held by the control unit 10 includes, for example, transport information and processing information. The transport information defines the procedure for transporting the substrate W. The processing information defines the procedure for processing the substrate W. The processing information is also called a processing recipe.

[0098] Figure 3 schematically shows the transport path of the substrate W. An example of the operation of the substrate processing apparatus 1 will be explained. The substrate processing method will be explained.

[0099] The substrate W is transported from the indexer section 2 to the slider section 3. The substrate W is transported from the slider section 3 to the bridge section 4. The substrate W is distributed from the bridge section 4 to the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8. The substrate W is processed in parallel in the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8. The substrate W is collected from the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8 and returned to the bridge section 4. The substrate W is transported from the bridge section 4 to the slider section 3. The substrate W is transported from the slider section 3 to the indexer section 2.

[0100] Refer to Figure 1. An example of the operation of the substrate processing apparatus 1 will be explained. The substrate processing method will be explained. For convenience, multiple substrates W will be referred to as substrates Wa, Wb, Wc, and Wd to distinguish them.

[0101] The slider unit 3 transports the substrates Wa, Wb, Wc, and Wd from the indexer unit 2 to the bridge unit 4.

[0102] The bridge unit 4 performs intake and distribution. As a result, the bridge unit 4 transports substrate Wa from the slider unit 3 to the first front unit 5. Similarly, the bridge unit 4 transports substrate Wb from the slider unit 3 to the first rear unit 6. The bridge unit 4 transports substrate Wc from the slider unit 3 to the second front unit 7. The bridge unit 4 transports substrate Wd from the slider unit 3 to the second rear unit 8.

[0103] The first front section 5 processes substrate Wa. The first rear section 6 processes substrate Wb. The second front section 7 processes substrate Wc. The second rear section 8 processes substrate Wd.

[0104] The bridge unit 4 performs retrieval and dispensing. As a result, the bridge unit 4 transports substrate Wa from the first front unit 5 to the slider unit 3. Similarly, the bridge unit 4 transports substrate Wb from the first rear unit 6 to the slider unit 3. The bridge unit 4 transports substrate Wc from the second front unit 7 to the slider unit 3. The bridge unit 4 transports substrate Wd from the second rear unit 8 to the slider unit 3.

[0105] The slider unit 3 transports the substrates Wa, Wb, Wc, and Wd from the bridge unit 4 to the indexer unit 2.

[0106] <2. Indexer Section 2> Figures 4, 5, and 6 are plan views of the substrate processing apparatus 1, respectively. Figure 4 shows the first front section 5 and the first rear section 6. Figure 5 shows the slider section 3, the first front section 5, and the first rear section 6. Figure 6 shows the second front section 7 and the second rear section 8. Figure 7 is the first side view of the substrate processing apparatus 1. Figure 8 is the second side view of the substrate processing apparatus 1. Figure 9 is the front view of the indexer section 2. Figure 10 is the front view of the slider section 3, the first front section 5, and the second front section 7. Figure 11 is the front view of the bridge section 4. Figure 12 is the front view of the first rear section 6 and the second rear section 8.

[0107] The indexer unit 2 comprises multiple (for example, four) carrier stages 11. One carrier C is placed on each carrier stage 11.

[0108] Carrier C accommodates multiple substrates W. Carrier C is, for example, a FOUP (Front Opening Unified Pod), SMIF (Standard Mechanical Interface), or OC (Open Cassette). Carrier C is transported to the substrate processing apparatus 1 by a carrier transport mechanism (not shown).

[0109] The indexer unit 2 includes a transport mechanism 12. The transport mechanism 12 transports the substrate W to the carrier C. The transport mechanism 12 transports the substrate W between the carrier C and the slider unit 3.

[0110] The transport mechanism 12 comprises a support column 13, a lifting section 14, a rotating section 15, and a support section 16. In Figure 9, for convenience, the support column 13 is shown with a dashed line. The support column 13 is fixedly installed. The support column 13 extends in the vertical direction Z. The lifting section 14 is supported by the support column 13. The lifting section 14 moves in the vertical direction Z relative to the support column 13. The rotating section 15 is supported by the lifting section 14. The rotating section 15 rotates around the rotation axis A15 relative to the lifting section 14. The rotation axis A15 is shown in Figure 8. The rotation axis A15 extends in the vertical direction Z. The rotation axis A15 passes through, for example, the rotating section 15. The support section 16 is supported by the rotating section 15. The support section 16 moves back and forth relative to the rotating section 15. More specifically, the support portion 16 reciprocates in one direction determined by the orientation of the rotating portion 15. The "one direction determined by the orientation of the rotating portion 15" is the radial direction of the rotation axis A15. The radial direction of the rotation axis A15 is horizontal. The support portion 16 supports the substrate W.

[0111] The support section 16 supports multiple substrates W at once. The transport mechanism 12 transports multiple substrates W at once.

[0112] The support unit 16 comprises a multi-joint arm 17 and a plurality of hands 18. The multi-joint arm 17 is directly supported by the rotating unit 15. The hands 18 are directly supported by the multi-joint arm 17. The multi-joint arm 17 bends and extends. As a result, the hands 18 move forward and backward relative to the rotating unit 15. Each hand 18 supports one substrate W.

[0113] Each hand 18 supports the substrate W in a horizontal position. Each hand 18 contacts the back surface of the substrate W. Each hand 18 contacts the peripheral edge of the back surface of the substrate W. Each hand 18 has a Y-shape in plan view.

[0114] Figure 13 is a detailed front view of the indexer section 2. The carrier C supports the substrates W in a horizontal position. In the carrier C, multiple substrates W are arranged in the vertical direction Z. The distance between two adjacent substrates W in the vertical direction Z is called the pitch B1. The pitch B1 is, for example, 10 mm.

[0115] Multiple hands 18 are aligned in the vertical direction Z. The distance between two adjacent hands 18 in the vertical direction Z is called the pitch B2. Pitch B2 is twice the pitch B1. For example, pitch B2 is 20 mm.

[0116] The substrates W within carrier C are called substrates W1, W2, W3, W4, W5, W6, W7, and W8. Substrates W1, W2, W3, W4, W5, W6, W7, and W8 are arranged in this order in the vertical direction Z. The transport mechanism 12 takes substrates W1, W3, W5, and W7 from carrier C on carrier stage 11 all at once. The transport mechanism 12 places substrates W1, W3, W5, and W7 into carrier C on carrier stage 11 all at once. Similarly, the transport mechanism 12 transports substrates W2, W4, W6, and W8 into carrier C on carrier stage 11 all at once.

[0117] At least one hand 18 may move relative to the rotating part 15 independently of the other hands 18. In this case, the transport mechanism 12 can easily transport one substrate W at a time.

[0118] For example, the articulated arm 17 comprises articulated arms 17a and 17b. Articulated arm 17b operates independently of articulated arm 17a. Articulated arms 17a and 17b are each directly supported by the rotating part 15. Articulated arm 17a supports one hand 18. Articulated arm 17b supports the other three hands 18.

[0119] For convenience, one hand 18 supported by the articulated arm 17a will be called "hand 18a". A hand 18 supported by the articulated arm 17b will be called "hand 18b". The articulated arm 17a moves hand 18a forward and backward relative to the rotating part 15. The articulated arm 17b moves hand 18b forward and backward relative to the rotating part 15. Hand 18b moves independently of hand 18a.

[0120] For example, when the transport mechanism 12 transports one substrate W, only the articulated arm 17a moves the hand 18a, and the articulated arm 17b does not move the hand 18b. When the transport mechanism 12 transports one substrate W, only the hand 18a supports the substrate W, and the hand 18b does not support the substrate W.

[0121] For example, when the transport mechanism 12 transports multiple substrates W, the articulated arms 17a and 17b may move the hands 18a and 18b in synchronous motion. When the transport mechanism 12 transports multiple substrates W, the hands 18a and 18b may each support the substrates W simultaneously.

[0122] The transport mechanism 12 is an example of the first transport mechanism of the present invention. The support part 16 of the transport mechanism 12 is an example of the first support part of the present invention. The hand 18 of the transport mechanism 12 is an example of the first hand of the present invention.

[0123] <3. Bridge section 4> Refer to Figure 4-12. The bridge section 4 will be explained.

[0124] The bridge section 4 includes a mounting section 21. Multiple (e.g., eight) substrates W are mounted on the mounting section 21 at one time. The mounting section 21 supports the substrates W in a horizontal position. The multiple substrates W on the mounting section 21 are aligned in the vertical direction Z. Although not shown in the figures, the mounting section 21 includes, for example, at least one of a horizontal plate, support pins, and a shelf.

[0125] The bridge section 4 includes a mounting section 22. The mounting section 22 has the same structure as the mounting section 21.

[0126] Mounting section 21 is an example of the first intermediate mounting section of the present invention. Mounting section 22 is an example of the second intermediate mounting section of the present invention.

[0127] The bridge section 4 is equipped with a transport mechanism 23. The transport mechanism 23 performs the aforementioned "intake," "distribution," "recovery," and "discharge."

[0128] For example, the transport mechanism 23 is composed of multiple transport mechanisms. The transport mechanism 23 includes transport mechanisms 24, 25, and 26. Transport mechanism 24 performs "receiving," "recovering," and "discharging." Transport mechanisms 25 and 26 each perform a part of "distribution." Transport mechanism 25 performs distribution related to the first front section 5 and the first rear section 6. Transport mechanism 26 performs distribution related to the second front section 7 and the second rear section 8.

[0129] Transport mechanisms 24 and 25 transfer substrates W to each other via the mounting section 21. Transport mechanisms 24 and 26 transfer substrates W to each other via the mounting section 22. For example, transport mechanism 24 distributes substrates W to mounting sections 21 and 22. Transport mechanism 24 distributes substrates W to transport mechanisms 25 and 26 via mounting sections 21 and 22.

[0130] The structure of the transport mechanism 24 will now be described. The transport mechanism 24 has the same structure as the transport mechanism 12 of the indexer unit 2. In this specification, when different elements have a common structure, a common reference numeral is used for that structure, and a detailed explanation is omitted. For example, the transport mechanism 24 includes a support column 13, a lifting section 14, a rotating section 15, and a support section 16. The support section 16 includes a multi-joint arm 17 and a plurality of hands 18.

[0131] The structure of the transport mechanism 25 will now be described. The transport mechanism 25 comprises a support column 33, a lifting section 34, a rotating section 35, and a support section 36. The support column 33 is fixedly installed. The support column 33 extends in the vertical direction Z. The lifting section 34 is supported by the support column 33. The lifting section 34 moves in the vertical direction Z relative to the support column 33. The rotating section 35 is supported by the lifting section 34. The rotating section 35 rotates around the rotation axis A35 relative to the lifting section 34. The rotation axis A35 is shown in Figure 10. The rotation axis A35 extends in the vertical direction Z. The rotation axis A35 passes through, for example, the rotating section 35. The support section 36 is supported by the rotating section 35. The support section 36 moves forward and backward relative to the rotating section 35. More specifically, the support portion 36 reciprocates in one direction determined by the orientation of the rotating portion 35. The "one direction determined by the orientation of the rotating portion 35" is the radial direction of the rotation axis A35. The radial direction of the rotation axis A35 is horizontal. The support portion 36 supports the substrate W.

[0132] The support section 36 supports multiple substrates W at once. The transport mechanism 25 transports multiple substrates W at once.

[0133] The support section 36 comprises a plurality (e.g., two) of hands 38. Each hand 38 is directly supported by the rotating section 35. Each hand 38 slides relative to the rotating section 35. Each hand 38 supports one substrate W.

[0134] Each hand 38 supports the substrate W in a horizontal position. Each hand 38 contacts the back surface of the substrate W. Each hand 38 contacts the peripheral edge of the back surface of the substrate W. Each hand 38 has a Y-shape in plan view.

[0135] Multiple hands 38 are aligned in the vertical direction Z.

[0136] Multiple hands 38 may move independently of each other relative to the rotating part 35.

[0137] The structure of the conveying mechanism 26 will now be described. The conveying mechanism 26 has the same structure as the conveying mechanism 25. For example, the conveying mechanism 26 includes a support column 33, a lifting section 34, a rotating section 35, and a support section 36. The support section 36 is equipped with multiple hands 38.

[0138] The transport mechanism 23 is an example of the third transport mechanism of the present invention.

[0139] The transport mechanism 24 is an example of the first recovery mechanism of the present invention. The transport mechanism 25 is an example of the first distribution mechanism of the present invention. The transport mechanism 26 is an example of the second distribution mechanism of the present invention.

[0140] The support portion 16 of the transport mechanism 24 is an example of the third support portion of the present invention. The support portion 36 of the transport mechanism 25 is an example of the third support portion of the present invention. The support portion 36 of the transport mechanism 26 is an example of the third support portion of the present invention.

[0141] The hand 18 of the conveying mechanism 24 is an example of the third hand of the present invention. The hand 38 of the conveying mechanism 25 is an example of the third hand of the present invention. The hand 38 of the conveying mechanism 26 is an example of the third hand of the present invention.

[0142] <4. Slider section 3> Refer to Figure 5. The slider section 3 includes a transport mechanism 41. The transport mechanism 41 transports the substrate W.

[0143] The transport mechanism 41 includes a guide 42 and a support portion 43. The guide 42 is fixedly installed. The guide 42 extends linearly. The guide 42 extends in the front-rear direction X. The support portion 43 is attached to the guide 42. The support portion 43 is guided by the guide 42. The support portion 43 slides relative to the guide 42. The support portion 43 moves parallel to the guide 42. The support portion 43 moves linearly along the guide 42. The support portion 43 moves in the front-rear direction X along the guide 42. The support portion 43 moves back and forth along the guide 42. The support portion 43 supports the substrate W.

[0144] The transport mechanism 41 does not reach the indexer section 2. The guide 42 does not reach the indexer section 2. The transport mechanism 41 does not enter the indexer section 2. The support section 43 does not enter the indexer section 2.

[0145] The transport mechanism 41 does not reach the bridge section 4. The guide 42 does not reach the bridge section 4. The transport mechanism 41 does not enter the bridge section 4. The support section 43 does not enter the bridge section 4.

[0146] The support portion 43 does not move in the width direction Y relative to the guide 42. For example, the support portion 43 does not extend or contract relative to the guide 42.

[0147] The support section 43 supports multiple substrates W at once. The transport mechanism 41 transports multiple substrates W at once.

[0148] The support unit 43 comprises a movable element 44 and a plurality (e.g., 8) of hands 45. The movable element 44 is directly supported by the guide 42. The hands 45 are directly supported by the movable element 44. The movable element 44 slides relative to the guide 42. As a result, the hands 45 move relative to the guide 42. Each hand 45 supports one substrate W.

[0149] Each hand 45 supports the substrate W in a horizontal position. Each hand 45 contacts the back surface of the substrate W. Each hand 45 contacts the center of the back surface of the substrate W. Each hand 45 has a T-shape in plan view.

[0150] Multiple hands 45 are aligned in the vertical direction Z.

[0151] Some of the hands 45 may move relative to the guide 42 independently of the other hands 45. In this case, the transport mechanism 41 can easily transport many substrates W efficiently.

[0152] For example, the movable element 44 comprises movable elements 44a and 44b. Movable element 44b operates independently of movable element 44a. Each movable element 44a and 44b is directly supported by the guide 42. Each movable element 44a and 44b supports multiple (four) hands 45.

[0153] For convenience, the hand 45 supported by the movable element 44a will be called "hand 45a". The hand 45 supported by the movable element 44b will be called "hand 45b". The movable element 44a moves hand 45a relative to the guide 42. The movable element 44b moves hand 45b relative to the guide 42. Hand 45b moves independently of hand 45a.

[0154] For example, hands 45a and 45b may each transport the substrate W in only one direction. Hand 45a transports the substrate W from the indexer unit 2 to the bridge unit 4, but does not transport the substrate W from the bridge unit 4 to the indexer unit 2. Hand 45b transports the substrate W from the bridge unit 4 to the indexer unit 2, but does not transport the substrate W from the indexer unit 2 to the bridge unit 4.

[0155] Alternatively, hands 45a and 45b may each transport the substrate W in both directions. Hand 45a transports the substrate W from the indexer unit 2 to the bridge unit 4, and transports the substrate W from the bridge unit 4 to the indexer unit 2. Hand 45b transports the substrate W from the indexer unit 2 to the bridge unit 4, and transports the substrate W from the bridge unit 4 to the indexer unit 2.

[0156] The structure of the transport mechanism 41 will now be described. Although not shown in the diagram, the transport mechanism 41 includes a drive mechanism. The drive mechanism moves the support portion 43 relative to the guide 42.

[0157] The drive mechanism is provided, for example, on the guide 42. The drive mechanism comprises, for example, a pair of drive pulleys, a driven pulley, a belt, and a motor. The belt is stretched over the drive pulleys and the driven pulleys. The belt extends along the guide 42. The support 43 is attached to the belt. For example, the movable element 44 is attached to the belt. The motor is connected to the drive pulleys. The motor rotates the drive pulleys in the forward and reverse directions. When the drive pulleys rotate, the belt rotates between the drive pulleys and the driven pulleys, and the support 43 reciprocates between the drive pulleys and the driven pulleys.

[0158] Alternatively, the drive mechanism may be provided on the support portion 43. The drive mechanism may include a ball screw mechanism. The drive mechanism may include an air cylinder.

[0159] The transport mechanism 41 is an example of the second transport mechanism of the present invention. The support part 43 is an example of the second support part of the present invention. The hand 45 is an example of the second hand of the present invention.

[0160] Figure 14 is a detailed plan view of the slider section 3. The hand 45 has one or more (e.g., three) contact sections 46. The contact sections 46 contact the back surface of the substrate W. The contact sections 46 contact the central part of the back surface of the substrate W. The contact sections 46 have, for example, a pin shape or a pad shape.

[0161] The contact portion 46 may also adhere to the back surface of the substrate W.

[0162] The hand 45 is equipped with one or more (for example, four) guards 47. The guards 47 are positioned slightly outside the substrate W. The guards 47 are capable of contacting the peripheral edge of the substrate W. For example, if the substrate W shifts significantly relative to the hand 45, the guards 47 will contact the peripheral edge of the substrate W. The guards 47 then prevent the substrate W from falling out of the hand 45.

[0163] The guard 47 is positioned outside the contact portion 46.

[0164] Guard 47 includes guard 47a and guard 47b. Guard 47a, contact portion 46, and guard 47b are arranged in this order in the front-to-back direction X. Guard 47a is positioned in front of the contact portion 46. Guard 47b is positioned behind the contact portion 46. The contact portion 46 is positioned between guard 47a and guard 47b.

[0165] The transport mechanism 12 and the transport mechanism 41 transfer substrates W to each other. The transport mechanism 12 and the transport mechanism 41 may transfer multiple substrates W at once to each other.

[0166] When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, a part of the transport mechanism 12 enters the slider section 3. When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the support section 16 of the transport mechanism 12 enters the slider section 3.

[0167] When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the support part 43 is located at the first position P1. The first position P1 is located within the slider part 3.

[0168] When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the support part 43 remains stationary. The transport mechanism 12 places the substrate W on the transport mechanism 41. The transport mechanism 12 takes the substrate W from the transport mechanism 41.

[0169] When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the contact portion 46 does not interfere with the transport mechanism 12. When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the contact portion 46 does not overlap with the hand 18 of the transport mechanism 12 in a plan view. When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the hand 18 of the transport mechanism 12 is located outside the contact portion 46 in a plan view.

[0170] When transport mechanism 12 and transport mechanism 41 transfer the substrate W to each other, the guard 47 does not interfere with transport mechanism 12. When transport mechanism 12 and transport mechanism 41 transfer the substrate W to each other, the guard 47 does not overlap with the hand 18 of transport mechanism 12 in a plan view. When transport mechanism 12 and transport mechanism 41 transfer the substrate W to each other, the hand 18 of transport mechanism 12 is located inside the guard 47 in a plan view. When transport mechanism 12 and transport mechanism 41 transfer the substrate W to each other, the hand 18 of transport mechanism 12 is located between guard 47a and contact portion 46, and between guard 47b and contact portion 46 in a plan view.

[0171] The transport mechanism 24 and the transport mechanism 41 transfer substrates W to each other. The transport mechanism 24 and the transport mechanism 41 may transfer multiple substrates W to each other at once.

[0172] When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, a part of the transport mechanism 24 enters the slider section 3. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the support section 16 of the transport mechanism 24 enters the slider section 3.

[0173] When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the support part 43 is located at the second position P2. The second position P2 is located within the slider part 3.

[0174] When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the support part 43 remains stationary. The transport mechanism 24 places the substrate W on the transport mechanism 41. The transport mechanism 24 takes the substrate W from the transport mechanism 41.

[0175] When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the contact portion 46 does not interfere with the transport mechanism 24. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the contact portion 46 does not overlap with the hand 18 of the transport mechanism 24 in a plan view. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the hand 18 of the transport mechanism 24 is located outside the contact portion 46.

[0176] When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the guard 47 does not interfere with the transport mechanism 24. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the guard 47 does not overlap with the hand 18 of the transport mechanism 24 in a plan view. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the hand 18 of the transport mechanism 24 is located inside the guard 47. When the transport mechanism 24 and the transport mechanism 41 transfer the substrate W to each other, the hand 18 of the transport mechanism 24 is located between the guard 47a and the contact portion 46, and between the guard 47b and the contact portion 46 in a plan view.

[0177] <5. First front section 5, first rear section 6, second front section 7, second rear section 8> Refer to Figure 4. As described above, the first front section 5 includes a processing unit 50 and a transport mechanism 55. Furthermore, the first front section 5 includes a mounting section 54. The transport mechanism 55 transports the substrate W to the processing unit 50 and the mounting section 54. The processing unit 50 includes a plurality of first processing units 51, a plurality of second processing units 52, and a plurality of third processing units 53. The plurality of first processing units 51 process a plurality of substrates W in parallel. The plurality of second processing units 52 process a plurality of substrates W in parallel. The plurality of third processing units 53 process a plurality of substrates W in parallel.

[0178] The first rear section 6, the second front section 7, and the second rear section 8 each have a configuration similar to that of the first front section 5.

[0179] As described above, the first rear section 6 includes a processing unit 60 and a transport mechanism 65. Furthermore, the first rear section 6 includes a mounting section 64. The transport mechanism 65 transports the substrate W to the processing unit 60 and the mounting section 64. The processing unit 60 includes a plurality of first processing units 61, a plurality of second processing units 62, and a plurality of third processing units 63.

[0180] Refer to Figure 6. As described above, the second front section 7 includes a processing unit 70 and a transport mechanism 75. Furthermore, the second front section 7 includes a mounting section 74. The transport mechanism 75 transports the substrate W to the processing unit 70 and the mounting section 74. The processing unit 70 includes a plurality of first processing units 71, a plurality of second processing units 72, and a plurality of third processing units 73.

[0181] As described above, the second rear section 8 includes a processing unit 80 and a transport mechanism 85. Furthermore, the second rear section 8 includes a mounting section 84. The transport mechanism 85 transports the substrate W to the processing unit 80 and the mounting section 84. The processing unit 80 includes a plurality of first processing units 81, a plurality of second processing units 82, and a plurality of third processing units 83.

[0182] Mounting section 54 is an example of the first front mounting section of the present invention. Mounting section 64 is an example of the first rear mounting section of the present invention. Mounting section 74 is an example of the second front mounting section of the present invention. Mounting section 84 is an example of the second rear mounting section of the present invention.

[0183] Processing units 50, 60, 70, and 80 each process substrate W. Processing units 50, 60, 70, and 80 each process one substrate W at a time.

[0184] The first processing unit 51 will now be described. The first processing unit 51 performs a non-liquid treatment on the substrate W.

[0185] Refer to Figure 7. For example, some of the first processing units 51 are classified as adhesion strengthening processing units PAHP. The adhesion strengthening processing unit PAHP performs adhesion strengthening processing. The adhesion strengthening processing is for improving the adhesion between the substrate W and the coating film. For example, the adhesion strengthening processing unit PAHP supplies hexamethyldisilase (HMDS) to the substrate W and adjusts the substrate W to a predetermined temperature. Other first processing units 51 are classified as heating and cooling units PHP. The heating and cooling unit PHP heats the substrate W and then cools the substrate W.

[0186] Refer to Figure 4. Each first processing unit 51 comprises one or two support members 91. The support members 91 support the substrate W in a horizontal position. The support members 91 include, for example, at least one of a horizontal plate and a vertical pin. Each first processing unit 51 may also include a heating unit (not shown). The heating unit heats the substrate W on the support members 91. Each first processing unit 51 may also include a cooling unit (not shown). The cooling unit cools the substrate W on the support members 91. If the first processing unit 51 comprises two support members 91, the first processing unit 51 may further include a local transport mechanism (not shown). The local transport mechanism transports the substrate W between the two support members 91.

[0187] The first processing unit 61 has the same structure as the first processing unit 51. Similarly, the first processing units 71 and 81 each have the same structure as the first processing unit 51.

[0188] The second processing unit 52 will now be described. The second processing unit 52 performs liquid treatment on the substrate W. The second processing unit 52 supplies the processing liquid to the substrate W.

[0189] For example, the second processing unit 52 forms a coating film on the substrate W. For example, the second processing unit 52 supplies a resist solution to the substrate W and forms a resist film on the substrate W.

[0190] The second processing unit 52 includes a holding part 92a and a cup 92b. The holding part 92a holds the substrate W in a horizontal position. The holding part 92a holds the substrate W. The holding part 92a, for example, adsorbs the back surface of the substrate W. The holding part 92a holds only the center of the back surface of the substrate W with vacuum suction force. The holding part 92a is, for example, a vacuum chuck. The substrate W held by the holding part 92a takes a horizontal position. The holding part 92a is configured to allow the substrate W to rotate. The cup 92b surrounds the holding part 92a. The cup 92b has a cylindrical shape. The cup 92b receives liquid splashed from the substrate W.

[0191] The second processing unit 52 comprises one or more nozzles 92c and a nozzle transport mechanism 92d. The nozzles 92c discharge processing liquid. For example, the nozzles 92c are shared by multiple (e.g., two) second processing units 62. Multiple second processing units 52 are installed in a single chamber without partitions between them. The nozzle transport mechanism 92d moves the nozzles 92c between a standby position and a processing position. The standby position is outside the cup 92b. The processing position is above the substrate W held by the retaining material 92a. When the nozzles 92c are in the processing position, they discharge processing liquid onto the substrate W.

[0192] The second processing unit 62 has the same structure as the second processing unit 52. Similarly, the second processing units 72 and 82 each have the same structure as the second processing unit 52.

[0193] The third processing unit 53 will now be described. The third processing unit 53 performs a non-liquid treatment on the substrate W.

[0194] For example, the third processing unit 53 is classified as a cooling unit CP. The cooling unit CP cools the substrate W.

[0195] Each third processing unit 53 includes one support member 93. The support member 93 supports the substrate W in a horizontal position. The support member 93 includes, for example, at least one of a horizontal plate and a vertical pin. Each third processing unit 53 includes a cooling unit (not shown). The cooling unit cools the substrate W on the support member 93.

[0196] The third processing unit 63 has the same structure as the third processing unit 53. Similarly, the third processing units 73 and 83 each have the same structure as the third processing unit 53.

[0197] The mounting section 54 will now be described. Multiple (for example, four) substrates W are placed on the mounting section 54 at one time. The mounting section 54 supports the substrates W in a horizontal position. The multiple substrates W on the mounting section 54 are arranged in the vertical direction Z. Although not shown in the figures, the mounting section 54 includes, for example, at least one of a horizontal plate, support pins, and a shelf.

[0198] The mounting section 64 has the same structure as the mounting section 54. Similarly, the mounting sections 74 and 84 each have the same structure as the mounting section 54.

[0199] The conveying mechanism 55 will now be described. The conveying mechanism 55 has the same structure as the conveying mechanism 25. For example, the conveying mechanism 55 includes a support column 33, a lifting section 34, a rotating section 35, and a support section 36. The support section 36 is equipped with multiple hands 38.

[0200] The transport mechanism 55 does not extend into the indexer section 2. The support section 36 of the transport mechanism 55 does not enter the indexer section 2.

[0201] The transport mechanism 55 does not extend to the slider section 3. The support section 36 of the transport mechanism 55 does not enter the slider section 3.

[0202] The transport mechanism 55 does not extend to the bridge section 4. The support section 36 of the transport mechanism 55 does not enter the bridge section 4.

[0203] The conveying mechanism 65 has the same structure as the conveying mechanism 55. Similarly, the conveying mechanisms 75 and 85 each have the same structure as the conveying mechanism 55.

[0204] <6. Cabinet Section> Refer to Figure 4. The substrate processing apparatus 1 further comprises a cabinet section 9. The cabinet section 9 supplies processing liquid to the first front section 5, the first rear section 6, the second front section 7, and the second rear section 8. The cabinet section 9 supplies processing liquid to processing units 50, 60, 70, and 80. The cabinet section 9 supplies processing liquid to second processing units 52, 62, 72, and 82. The cabinet section 9 supplies processing liquid to nozzles 92c.

[0205] The cabinet section 9 includes, for example, one or more processing liquid containers 101. The processing liquid containers 101 store the processing liquid. The processing liquid containers 101 supply the processing liquid to the nozzle 92c.

[0206] Refer to Figure 2. The control unit 10 further controls the transport mechanism 12 of the indexer unit 2. The control unit 10 controls the transport mechanism 41 of the slider unit 3. The control unit 10 controls the transport mechanism 23 of the bridge unit 4. Specifically, the control unit 10 controls the transport mechanisms 24, 25, and 26.

[0207] <7. Placement> Refer to Figure 9. For convenience, to distinguish between the multiple carrier stages 11, we will call them carrier stages 11a, 11b, 11c, and 11d. Carrier stage 11a is located on the first side of the transport mechanism 12 in the width direction Y. Carrier stage 11b is located on the second side of the transport mechanism 12 in the width direction Y. Carrier stage 11c is located on the first side of the transport mechanism 12 in the width direction Y. Carrier stage 11c is located above carrier stage 11a in the vertical direction Z. Carrier stage 11d is located on the second side of the transport mechanism 12 in the width direction Y. Carrier stage 11d is located above carrier stage 11b in the vertical direction Z.

[0208] Refer to Figure 4. The carrier stage 11 and the transport mechanism 12 are aligned in the width direction Y. The carrier stage 11a, the transport mechanism 12, and the carrier stage 11b are aligned in the width direction Y in this order. The carrier stage 11a and the carrier stage 11b face each other.

[0209] The carrier stage 11 and the transport mechanism 12 are not aligned in the front-to-back direction X. The carrier stage 11 is not positioned in front of the transport mechanism 12 in the front-to-back direction X.

[0210] The first processing unit 51, the transport mechanism 55, and the second processing unit 52 are arranged in this order in the width direction Y. The first processing unit 51 is positioned on the first side of the transport mechanism 55. The second processing unit 52 is positioned on the second side of the transport mechanism 55.

[0211] The third processing unit 53, the transport mechanism 55, and the mounting section 54 are arranged in this order in the front-to-back direction X. The third processing unit 53 is positioned in front of the transport mechanism 55. The mounting section 54 is positioned behind the transport mechanism 55.

[0212] The bridge section 4 and the cabinet section 9 are aligned in the width direction Y. The cabinet section 9 is positioned on the second side of the bridge section 4.

[0213] The mounting section 21, the transport mechanism 24, and the transport mechanism 25 are arranged in a triangular shape in a plan view. The mounting section 21, the transport mechanism 24, and the transport mechanism 25 are each located at the vertices of a virtual triangle (specifically, an acute triangle) in a plan view.

[0214] The mounting section 21 and the transport mechanism 25 are aligned in the width direction Y. The transport mechanism 25 is positioned on the first side of the mounting section 21.

[0215] The conveying mechanisms 24 and 25 are aligned in the width direction Y. The conveying mechanism 25 is positioned on the first side of the conveying mechanism 24.

[0216] The transport mechanism 24 and the mounting section 21 are aligned in the front-to-back direction X. The mounting section 21 is positioned behind the transport mechanism 24.

[0217] The first processing unit 61, the transport mechanism 65, and the second processing unit 62 are arranged in this order in the width direction Y. The first processing unit 61 is positioned on the first side of the transport mechanism 65. The second processing unit 62 is positioned on the second side of the transport mechanism 65.

[0218] The mounting section 64, the transport mechanism 65, and the third processing unit 63 are arranged in this order in the front-to-back direction X. The mounting section 64 is positioned in front of the transport mechanism 65. The third processing unit 63 is positioned behind the transport mechanism 65.

[0219] The indexer section 2, the first front section 5, the bridge section 4, and the first rear section 6 are arranged in this order in the front-to-back direction X. The indexer section 2, the first front section 5, the bridge section 4, and the first rear section 6 are arranged in a single line.

[0220] The transport mechanism 12, the third processing unit 53, the transport mechanism 55, the mounting section 54, the transport mechanism 24, the mounting section 21, the mounting section 64, the transport mechanism 65, and the third processing unit 63 are arranged in this order in the front-to-back direction X.

[0221] The carrier stage 11a, the first processing unit 51, the transport mechanism 25, and the first processing unit 61 are arranged in this order in the front-to-back direction X.

[0222] The carrier stage 11b, the second processing unit 52, the cabinet section 9, and the second processing unit 62 are arranged in this order in the front-to-back direction X.

[0223] The length of the bridge section 4 in the width direction Y is smaller than the length of the first front section 5 in the width direction Y.

[0224] The length of the bridge section 4 in the width direction Y is smaller than the length of the first rear section 6 in the width direction Y.

[0225] The overall length of the bridge section 4 and the cabinet section 9 in the width direction Y is equal to the length of the first front section 5 in the width direction Y.

[0226] The total length of the bridge section 4 and the cabinet section 9 in the width direction Y is equal to the length of the first rear section 6 in the width direction Y.

[0227] The length of the bridge section 4 in the width direction Y is longer than the length of the cabinet section 9 in the width direction Y.

[0228] The length of the bridge section 4 in the front-to-back direction X is equal to the length of the cabinet section 9 in the front-to-back direction X.

[0229] Refer to Figure 5. The slider unit 3, the transport mechanism 55, and the second processing unit 52 are arranged in this order in the width direction Y. The slider unit 3 is positioned on the first side of the transport mechanism 55.

[0230] The indexer section 2, slider section 3, bridge section 4, and first rear section 6 are arranged in this order in the front-to-back direction X. The indexer section 2, slider section 3, bridge section 4, and first rear section 6 are arranged in a single line.

[0231] The carrier stage 11a, the slider section 3, and the transport mechanism 25 are arranged in this order in the front-to-back direction X.

[0232] The slider section 3 is positioned behind the transport mechanism 12 and on the first side of the transport mechanism 12.

[0233] The slider section 3 is positioned in front of the transport mechanism 24 and on the first side of the transport mechanism 24.

[0234] The slider section 3 is positioned in front of the transport mechanism 25.

[0235] The length of the slider section 3 in the width direction Y is smaller than the length of the bridge section 4 in the width direction Y. Therefore, the length of the slider section 3 in the width direction Y is smaller than the length of the first front section 5 in the width direction Y. The length of the slider section 3 in the width direction Y is smaller than the length of the first rear section 6 in the width direction Y.

[0236] Refer to Figure 6. The carrier stage 11c, the transport mechanism 12, and the carrier stage 11d are arranged in this order in the width direction Y. The carrier stage 11c and the carrier stage 11d face each other.

[0237] The first processing unit 71, the transport mechanism 75, and the second processing unit 72 are arranged in this order in the width direction Y. The first processing unit 71 is positioned on the first side of the transport mechanism 75 in the width direction Y. The second processing unit 72 is positioned on the second side of the transport mechanism 75 in the width direction Y.

[0238] The third processing unit 73, the transport mechanism 75, and the mounting section 74 are arranged in this order in the front-to-back direction X. The third processing unit 73 is positioned in front of the transport mechanism 75. The mounting section 74 is positioned behind the transport mechanism 75.

[0239] The mounting section 22, the transport mechanism 24, and the transport mechanism 26 are arranged in a triangular shape in a plan view. The mounting section 22, the transport mechanism 24, and the transport mechanism 26 are each located at the vertices of a virtual triangle (specifically, an acute triangle) in a plan view.

[0240] The mounting section 22 and the transport mechanism 26 are aligned in the width direction Y. The transport mechanism 26 is positioned on the first side of the mounting section 22.

[0241] The conveying mechanisms 24 and 26 are aligned in the width direction Y. The conveying mechanism 26 is positioned on the first side of the conveying mechanism 24.

[0242] The transport mechanism 24 and the mounting section 22 are aligned in the front-to-back direction X. The mounting section 22 is positioned behind the transport mechanism 24.

[0243] The first processing unit 81, the transport mechanism 85, and the second processing unit 82 are arranged in this order in the width direction Y. The first processing unit 81 is positioned on the first side of the transport mechanism 85 in the width direction Y. The second processing unit 82 is positioned on the second side of the transport mechanism 85 in the width direction Y.

[0244] The mounting section 84, the transport mechanism 85, and the third processing unit 83 are arranged in this order in the front-to-back direction X. The mounting section 84 is positioned in front of the transport mechanism 85. The third processing unit 83 is positioned behind the transport mechanism 85.

[0245] The indexer section 2, the second front section 7, the bridge section 4, and the second rear section 8 are arranged in this order in the front-to-back direction X. The indexer section 2, the second front section 7, the bridge section 4, and the second rear section 8 are arranged in a single line.

[0246] The transport mechanism 12, the third processing unit 73, the transport mechanism 75, the mounting section 74, the transport mechanism 24, the mounting section 22, the mounting section 84, the transport mechanism 85, and the third processing unit 83 are arranged in this order in the front-to-back direction X.

[0247] The carrier stage 11c, the first processing unit 71, the transport mechanism 26, and the first processing unit 81 are arranged in this order in the front-to-back direction X.

[0248] The carrier stage 11d, the second processing unit 72, the cabinet section 9, and the second processing unit 82 are arranged in this order in the front-to-back direction X.

[0249] The length of the bridge section 4 in the width direction Y is smaller than the length of the second front section 7 in the width direction Y. The length of the bridge section 4 in the width direction Y is smaller than the length of the second rear section 8 in the width direction Y.

[0250] As described above, the length of the slider section 3 in the width direction Y is smaller than the length of the bridge section 4 in the width direction Y. Therefore, the length of the slider section 3 in the width direction Y is smaller than the length of the second front section 7 in the width direction Y. The length of the slider section 3 in the width direction Y is smaller than the length of the second rear section 8 in the width direction Y.

[0251] The total length of the bridge section 4 and the cabinet section 9 in the width direction Y is equal to the length of the second front section 7 in the width direction Y. The total length of the bridge section 4 and the cabinet section 9 in the width direction Y is equal to the length of the second rear section 8 in the width direction Y.

[0252] Refer to Figure 4-6. Career stages 11a and 11c overlap in a plan view. Career stages 11b and 11d overlap in a plan view.

[0253] The mounting section 21 and the mounting section 22 overlap in a plan view. The transport mechanism 25 and the transport mechanism 26 overlap in a plan view.

[0254] The first front section 5 and the second front section 7 overlap in a plan view. Specifically, the processing unit 50 and the processing unit 70 overlap in a plan view. The first processing unit 51 and the first processing unit 71 overlap in a plan view. The second processing unit 52 and the second processing unit 72 overlap in a plan view. The third processing unit 53 and the third processing unit 73 overlap in a plan view. The mounting section 54 and the mounting section 74 overlap in a plan view. The transport mechanism 55 and the transport mechanism 75 overlap in a plan view.

[0255] Similarly, the first rear section 6 and the second rear section 8 overlap in a plan view.

[0256] In a plan view, the slider section 3 overlaps with the first front section 5.

[0257] In a plan view, the slider section 3 overlaps with the processing unit 50. The entire slider section 3 overlaps with the processing unit 50 in a plan view.

[0258] In a plan view, the slider section 3 overlaps with the first processing unit 51. The entire slider section 3 overlaps with the first processing unit 51 in a plan view.

[0259] In a plan view, the slider section 3 does not overlap with the second processing unit 52. In a plan view, the slider section 3 does not overlap with the third processing unit 53. In a plan view, the slider section 3 does not overlap with the mounting section 54. In a plan view, the slider section 3 does not overlap with the transport mechanism 55.

[0260] In a plan view, the slider section 3 overlaps with the second front section 7.

[0261] In a plan view, the slider section 3 overlaps with the processing unit 70. The entire slider section 3 overlaps with the processing unit 70 in a plan view.

[0262] In a plan view, the slider section 3 overlaps with the first processing unit 71. The entire slider section 3 overlaps with the first processing unit 71 in a plan view.

[0263] In a plan view, the slider section 3 does not overlap with the second processing unit 72. In a plan view, the slider section 3 does not overlap with the third processing unit 73. In a plan view, the slider section 3 does not overlap with the mounting section 74. In a plan view, the slider section 3 does not overlap with the transport mechanism 75.

[0264] In a plan view, the slider section 3 does not overlap with the indexer section 2.

[0265] In a plan view, the slider section 3 does not overlap with the bridge section 4.

[0266] In a plan view, the slider section 3 does not overlap with the first rear section 6. In a plan view, the slider section 3 does not overlap with the processing unit 60. In a plan view, the slider section 3 does not overlap with the mounting section 64.

[0267] In a plan view, the slider section 3 does not overlap with the second rear section 8. In a plan view, the slider section 3 does not overlap with the processing unit 80. In a plan view, the slider section 3 does not overlap with the mounting section 84.

[0268] In a plan view, the indexer section 2 does not overlap with the bridge section 4.

[0269] In a plan view, the indexer section 2 does not overlap with the first front section 5. In a plan view, the indexer section 2 does not overlap with the first rear section 6. In a plan view, the indexer section 2 does not overlap with the second front section 7. In a plan view, the indexer section 2 does not overlap with the second rear section 8.

[0270] In a plan view, the bridge section 4 does not overlap with the first front section 5. In a plan view, the bridge section 4 does not overlap with the first rear section 6. In a plan view, the bridge section 4 does not overlap with the second front section 7. In a plan view, the bridge section 4 does not overlap with the second rear section 8.

[0271] Refer to FIG. 14. When the transfer mechanism 12 and the transfer mechanism 41 transfer the substrate W to each other, the support portion 43 overlaps with the processing unit 50 in a plan view. When the transfer mechanism 12 and the transfer mechanism 41 transfer the substrate W to each other, the support portion 43 overlaps with the first processing unit 51 in a plan view.

[0272] When the support portion 43 is located at the first position P1, the support portion 43 overlaps with the processing unit 50 in a plan view. When the support portion 43 is located at the first position P1, the support portion 43 overlaps with the first processing unit 51 in a plan view.

[0273] When the transfer mechanism 24 and the transfer mechanism 41 transfer the substrate W to each other, the support portion 43 overlaps with the processing unit 50 in a plan view. When the transfer mechanism 24 and the transfer mechanism 41 transfer the substrate W to each other, the support portion 43 overlaps with the first processing unit 51 in a plan view.

[0274] When the support portion 43 is located at the second position P2, the support portion 43 overlaps with the processing unit 50 in a plan view. When the support portion 43 is located at the second position P2, the support portion 43 overlaps with the first processing unit 51 in a plan view.

[0275] The first position P1 and the second position P2 are arranged in the front-rear direction X. The second position P2 is arranged behind the first position P1.

[0276] The support portion 43 reciprocates between the first position P1 and the second position P2.

[0277] FIG. 14 shows the transfer distance L. The transfer distance L is the transfer distance of the substrate W in the slider portion 3. The transfer distance L is, for example, the distance in the front-rear direction X between the first position P1 and the second position P2.

[0278] The transfer distance L is relatively short.

[0279] Figure 14 shows distance K. Distance K is the distance in the front-rear direction X between the indexer section 2 and the bridge section 4. Distance K corresponds to the distance in the front-rear direction X of the first front section 5. The transport distance L is shorter than distance K.

[0280] Figure 15 is a detailed plan view of the bridge section 4. The transport mechanism 25 is positioned at the center of the bridge section 4 in the front-rear direction X. For example, the rotation axis A35 of the transport mechanism 25 is positioned at the center of the bridge section 4 in the front-rear direction X.

[0281] Figure 15 shows distances Da and Db. Distance Da is the distance in the longitudinal direction X between the transport mechanism 25 and the first front section 5. Distance Db is the distance in the longitudinal direction X between the transport mechanism 25 and the first rear section 6. Distance Da is equal to distance Db.

[0282] The conveying mechanism 24 is positioned in front of the conveying mechanism 25. For example, the rotation axis A15 of the conveying mechanism 24 is positioned in front of the rotation axis A35 of the conveying mechanism 25.

[0283] In the front-to-back direction X, the transport mechanism 24 is closer to the slider section 3 than to the center of the bridge section 4. In the front-to-back direction X, the transport mechanism 24 is closer to the slider section 3 than to the transport mechanism 25.

[0284] Figure 15 shows distance Dc. Distance Dc is the distance in the front-rear direction X between the transport mechanism 24 and the slider part 3. Distance Da corresponds to the distance in the front-rear direction X between the center of the bridge part 4 and the slider part 3. Distance Da corresponds to the distance in the front-rear direction X between the transport mechanism 25 and the slider part 3. Distance Dc is smaller than distance Da.

[0285] The mounting section 21 is positioned behind the transport mechanism 25. For example, the mounting section 21 is positioned behind the rotation axis A35 of the transport mechanism 25. In the front-rear direction X, the mounting section 21 is closer to the first rear section 6 than to the center of the bridge section 4.

[0286] Figure 15 shows the distance Dd. Distance Dd is the distance in the longitudinal direction X between the mounting section 21 and the first rear section 6. Distance Db corresponds to the distance in the longitudinal direction X between the center of the bridge section 4 and the first rear section 6. Distance Dd is smaller than distance Db.

[0287] The mounting section 21 is close to the first rear section 6. The substrate W placed on the mounting section 21 overlaps with the first rear section 6 in a plan view. A portion of the substrate W placed on the mounting section 21 overlaps with the first rear section 6 in a plan view. The mounting section 21 does not overlap with the first rear section 6 in a plan view.

[0288] The distance Dd is smaller than the radius of the substrate W.

[0289] The mounting section 21 is closer to the first rear section 6 than to the first front section 5 in the front-rear direction X.

[0290] Figure 15 shows the distance De. Distance De is the distance in the front-rear direction X between the mounting section 21 and the first front section 5. Distance Dd is smaller than distance De.

[0291] The mounting section 64 is close to the bridge section 4. In a plan view, the substrate W placed on the mounting section 64 overlaps with the bridge section 4. In a plan view, a portion of the substrate W placed on the mounting section 64 overlaps with the bridge section 4. In a plan view, the mounting section 64 does not overlap with the bridge section 4.

[0292] Figure 15 shows the distance Df. Distance Df is the distance in the front-to-back direction X between the mounting section 64 and the bridge section 4. Distance Df is smaller than the radius of the substrate W.

[0293] The mounting section 64 is closer to the bridge section 4 than the mounting section 54.

[0294] Figure 15 shows the distance Dg. Distance Dg is the distance in the front-rear direction X between the mounting section 54 and the bridge section 4. Distance Df is smaller than distance Dg.

[0295] The substrate W placed on the placement unit 54 does not overlap with the bridge portion 4 in a plan view. The placement unit 54 does not overlap with the bridge portion 4 in a plan view. The distance Dg is larger than the radius of the substrate W.

[0296] The placement unit 21 is close to the placement unit 64. The substrate W placed on the placement unit 21 overlaps with the substrate W placed on the placement unit 64 in a plan view. A part of the substrate W placed on the placement unit 21 overlaps with a part of the substrate W placed on the placement unit 64 in a plan view.

[0297] FIG. 15 shows the distance Ea. The distance Ea is the distance in the front-rear direction X between the placement unit 21 and the placement unit 64. The distance Ea is shorter than the diameter of the substrate W.

[0298] The placement unit 21 is closer to the placement unit 64 than the placement unit 54. The substrate W placed on the placement unit 21 does not overlap with the substrate W placed on the placement unit 54 in a plan view.

[0299] FIG. 15 shows the distance Eb. The distance Eb is the distance in the front-rear direction X between the placement unit 21 and the placement unit 54. The distance Ea is smaller than the distance Eb. The distance Eb is larger than the diameter of the substrate W.

[0300] The substrate W placed on the placement unit 54 does not overlap with the substrate W placed on the placement unit 64 in a plan view.

[0301] The transfer mechanism 26 is arranged at the same position as the transfer mechanism 25 in a plan view. The placement unit 22 is arranged at the same position as the placement unit 21 in a plan view. The placement unit 74 is arranged at the same position as the placement unit 54 in a plan view. The placement unit 84 is arranged at the same position as the placement unit 64 in a plan view.

[0302] Refer to FIG. 7. The processing unit 70 is arranged above the processing unit 50.

[0303] The processing unit 50, the slider unit 3, and the processing unit 70 are arranged in this order in the vertical direction Z. The processing unit 50 is positioned below the slider unit 3. The processing unit 70 is positioned above the slider unit 3. The slider unit 3 is positioned between the processing unit 50 and the processing unit 70.

[0304] The first processing units 51 and 71 are aligned in the vertical direction Z. The first processing unit 71 is positioned above the first processing unit 51.

[0305] Multiple first processing units 51 are arranged in the front-to-back direction X and the vertical direction Z. Multiple first processing units 71 are arranged in the front-to-back direction X and the vertical direction Z.

[0306] The first processing unit 51, the slider unit 3, and the first processing unit 71 are arranged in this order in the vertical direction Z. The first processing unit 51 is positioned below the slider unit 3. The first processing unit 71 is positioned above the slider unit 3. The slider unit 3 is positioned between the first processing unit 51 and the first processing unit 71.

[0307] The conveying mechanisms 25 and 26 are aligned in the vertical direction Z. Conveying mechanism 26 is positioned above conveying mechanism 25.

[0308] The transport mechanism 25 is positioned at the same height as the first front section 5. The transport mechanism 25 is positioned at the same height as the first rear section 6.

[0309] The transport mechanism 26 is positioned at the same height as the second front section 7. The transport mechanism 26 is positioned at the same height as the second rear section 8.

[0310] The processing unit 80 is positioned above the processing unit 60.

[0311] The first processing units 61 and 81 are aligned in the vertical direction Z. The first processing unit 81 is positioned above the first processing unit 61.

[0312] Multiple first processing units 61 are arranged in the front-to-back direction X and the vertical direction Z. Multiple first processing units 81 are arranged in the front-to-back direction X and the vertical direction Z.

[0313] At least one of the first processing units 51 is in contact with the bridge section 4. For example, the adhesion strengthening processing unit PAHP of the first processing unit 51 is in contact with the bridge section 4.

[0314] At least one of the first processing units 51 is adjacent to the transport mechanism 25. For example, the adhesion strengthening processing unit PAHP of the first processing unit 51 is adjacent to the transport mechanism 25.

[0315] At least one of the first processing units 61 is in contact with the bridge section 4. For example, the adhesion strengthening processing unit PAHP of the first processing unit 61 is in contact with the bridge section 4.

[0316] At least one of the first processing units 61 is adjacent to the transport mechanism 25. For example, the adhesion strengthening processing unit PAHP of the first processing unit 61 is adjacent to the transport mechanism 25.

[0317] At least one of the first processing units 71 is in contact with the bridge section 4. For example, the adhesion strengthening processing unit PAHP of the first processing unit 71 is in contact with the bridge section 4.

[0318] At least one first processing unit 71 is adjacent to the transport mechanism 26. For example, the adhesion strengthening processing unit PAHP of the first processing unit 71 is adjacent to the transport mechanism 26.

[0319] At least one of the first processing units 81 is in contact with the bridge section 4. For example, the adhesion strengthening processing unit PAHP of the first processing unit 71 is in contact with the bridge section 4.

[0320] At least one of the first processing units 81 is adjacent to the transport mechanism 26. For example, the adhesion strengthening processing unit PAHP of the first processing unit 81 is adjacent to the transport mechanism 26.

[0321] Refer to Figure 8.

[0322] The second processing units 52 and 72 are aligned in the vertical direction Z. The second processing unit 72 is positioned above the second processing unit 52.

[0323] Multiple second processing units 52 are arranged in the front-to-back direction X and the vertical direction Z. Multiple second processing units 72 are arranged in the front-to-back direction X and the vertical direction Z.

[0324] The second processing units 62 and 82 are aligned in the vertical direction Z. The second processing unit 82 is positioned above the second processing unit 62.

[0325] Multiple second processing units 62 are arranged in the front-to-back direction X and the vertical direction Z. Multiple second processing units 82 are arranged in the front-to-back direction X and the vertical direction Z.

[0326] At least one second processing unit 52 is in contact with the cabinet section 9.

[0327] At least one second processing unit 62 is in contact with the cabinet section 9.

[0328] At least one second processing unit 72 is in contact with the cabinet section 9.

[0329] At least one second processing unit 82 is in contact with the cabinet section 9.

[0330] Refer to Figure 9. For convenience, the slider section 3 is shown with a dashed line in Figure 9. In a front view, the slider section 3 is positioned on the first side of the transport mechanism 12. In a front view, the slider section 3 does not overlap with the rotating section 15 of the transport mechanism 12. In a front view, the slider section 3 does not overlap with the rotation axis A15 of the transport mechanism 12.

[0331] In a front view, the carrier stage 11a, the slider section 3, and the carrier stage 11c are aligned in the vertical Z direction in this order. In a front view, the carrier stage 11a is positioned below the slider section 3. In a front view, the carrier stage 11c is positioned above the slider section 3. In a front view, the slider section 3 is positioned between the carrier stage 11a and the carrier stage 11c. In a front view, the slider section 3 does not overlap with the carrier stage 11.

[0332] Refer to Figure 10. The movable elements 44a and 44b are aligned in the vertical direction Z. Movable element 44b is positioned above movable element 44a.

[0333] The conveying mechanisms 55 and 75 are aligned in the vertical direction Z. The conveying mechanism 75 is positioned above the conveying mechanism 55.

[0334] The transport mechanism 55 is configured to move to the same height position as the slider section 3.

[0335] For example, the slider section 3 includes a lower section 3a. The movable element 44a is positioned on the lower section 3a. The transport mechanism 55 is configured to move to the same height position as the lower section 3a.

[0336] The first processing unit 51 and the slider section 3 are aligned in the vertical direction Z. Multiple second processing units 52 are aligned in the vertical direction Z. At least one of the second processing units 52 is positioned at the same height as the slider section 3.

[0337] The second processing unit 52 includes a second processing unit 52H. The second processing unit 52H is positioned at the highest position among the multiple second processing units 52. The second processing unit 52H is positioned at the same height as the lower part 3a. For this reason, the number of second processing units 52 is relatively large.

[0338] As described above, the transport mechanism 55 is configured to move to the same height position as the slider section 3. Therefore, it is easy for the transport mechanism 55 to transport the substrate W to the second processing unit 52H.

[0339] The transport mechanism 75 is configured to move to the same height position as the slider section 3.

[0340] For example, the slider section 3 includes an upper section 3b. The upper section 3b is located above the lower section 3a. The movable element 44b is positioned on the upper section 3b. The transport mechanism 75 is configured to move to the same height as the upper section 3b.

[0341] The first processing unit 71 and the slider section 3 are aligned in the vertical direction Z. Multiple second processing units 72 are aligned in the vertical direction Z. At least one of the second processing units 72 is positioned at the same height as the slider section 3.

[0342] The second processing unit 72 includes a second processing unit 72L. The second processing unit 72L is positioned at the lowest position among the multiple second processing units 72. The second processing unit 72L is positioned at the same height as the upper part 3b. For this reason, the number of second processing units 72 is relatively large.

[0343] As described above, the transport mechanism 75 is configured to move to the same height position as the slider section 3. Therefore, it is easy for the transport mechanism 75 to transport the substrate W to the second processing unit 72L.

[0344] The mounting sections 54 and 74 are aligned in the vertical direction Z. Mounting section 74 is positioned above mounting section 54.

[0345] The mounting section 54 is positioned below the slider section 3. The mounting section 74 is positioned above the slider section 3.

[0346] Although not shown in the diagram, the third processing units 53 and 73 are aligned in the vertical direction Z. The third processing unit 73 is positioned above the third processing unit 53.

[0347] Refer to Figure 11. The mounting sections 21 and 22 are aligned in the vertical direction Z. Mounting section 22 is positioned above mounting section 21.

[0348] In Figure 11, for convenience, the slider section 3 is shown with a dashed line. The mounting section 21 is positioned below the slider section 3. The mounting section 22 is positioned above the slider section 3.

[0349] In Figure 11, for convenience, mounting sections 54 and 74 are shown with dashed lines. Mounting section 21 is positioned above mounting section 54. Mounting section 21 is positioned below mounting section 74.

[0350] The mounting section 22 is positioned above the mounting section 74.

[0351] Figure 11 shows mounting sections 64 and 84 with dashed lines for convenience. Mounting section 64 is positioned at the same height as mounting section 54. Mounting section 64 overlaps with mounting section 54 in a front view. Mounting section 84 is positioned at the same height as mounting section 74. Mounting section 84 overlaps with mounting section 64 in a front view.

[0352] The mounting section 21 is positioned above the mounting section 64. The mounting section 21 is positioned below the mounting section 84.

[0353] The mounting section 22 is positioned above the mounting section 84.

[0354] Refer to Figure 12. The transport mechanisms 65 and 85 are aligned in the vertical direction Z. Transport mechanism 85 is positioned above transport mechanism 65.

[0355] The mounting sections 64 and 84 are aligned in the vertical direction Z. Mounting section 84 is positioned above mounting section 64.

[0356] Although not shown in the diagram, the third processing units 63 and 83 are aligned in the vertical direction Z. The third processing unit 83 is positioned above the third processing unit 63.

[0357] <8. Example of operation> An example of the operation of the substrate processing device 1 will be explained. The substrate processing method will be explained.

[0358] Figure 16 is a schematic diagram showing the transport path of the substrate W. In Figure 16, the path through which multiple substrates W are transported at once is shown by double lines. However, one substrate W may be transported at a time along the path shown by the double lines. Figure 17 is a schematic side view showing an example of the operation of the substrate processing apparatus 1. Figure 17 shows the transport operation T1-T20.

[0359] Transport operation T1 The transport mechanism 12 picks up multiple substrates W of carrier C on the carrier stage 11 at once.

[0360] Transport operation T2 The transport mechanism 12 transports multiple substrates W from the indexer section 2 to the slider section 3 at once. The transport mechanism 12 also places multiple substrates W onto the transport mechanism 41 at once.

[0361] Through transport operations T1 and T2, the transport mechanism 12 transports multiple substrates W from the carrier C to the transport mechanism 41 at once.

[0362] Transport operation T3 The transport mechanism 41 transports multiple substrates W from the first position P1 to the second position P2 at once. In this way, the transport mechanism 41 transports multiple substrates W from the indexer section 2 to the bridge section 4 at once. In other words, the transport mechanism 41 transports multiple substrates W from the transport mechanism 12 to the transport mechanism 24 at once.

[0363] Transport operation T4 The transport operation T4 corresponds to the "grabbing" described above. The transport mechanism 24 picks up multiple substrates W from the transport mechanism 41 at once. The transport mechanism 24 transports multiple substrates W from the slider section 3 to the bridge section 4 at once.

[0364] Transport operations T5a, T5b The transport mechanism 24 places multiple substrates W on the mounting section 21 at once. The transport mechanism 24 also places multiple substrates W on the mounting section 22 at once.

[0365] During transport operations T4 and T5a, the transport mechanism 24 transports multiple substrates W from the transport mechanism 41 to the mounting section 21 at once. During transport operations T4 and T5b, the transport mechanism 24 transports multiple substrates W from the transport mechanism 41 to the mounting section 22 at once.

[0366] Transport operation T6a The transport mechanism 25 picks up one substrate W from the mounting section 21 at once.

[0367] Transport operation T6b The transport mechanism 26 picks up one substrate W from the mounting section 22 at once.

[0368] Transport operations T4, T5a, and T6a cause transport mechanism 24 to transport substrate W from transport mechanism 41 to transport mechanism 25. Transport operations T4, T5b, and T6b cause transport mechanism 24 to transport substrate W from transport mechanism 41 to transport mechanism 26.

[0369] Conveyor operations T7a, T7b The transport operations T7a and T7b correspond to the "distribution" described above. The transport mechanism 25 transports the substrate W from the bridge section 4 to the first front section 5. A part of the transport mechanism 25 enters the first front section 5. The support section 36 of the transport mechanism 25 enters the first front section 5. The transport mechanism 25 places the substrate W on one of the first processing units 51. Specifically, the transport mechanism 25 places the substrate W on the adhesion strengthening processing unit PAHP of the first processing unit 51. Similarly, the transport mechanism 25 transports the substrate W from the bridge section 4 to the first rear section 6. A part of the transport mechanism 25 enters the first rear section 6. The support section 36 of the transport mechanism 25 enters the first rear section 6. The transport mechanism 25 places the substrate W on one of the first processing units 61. Specifically, the transport mechanism 25 places the substrate W on the adhesion strengthening processing unit PAHP of the first processing unit 61.

[0370] Conveyor operation T7c, T7d The transport operations T7c and T7d correspond to the "distribution" described above. The transport mechanism 26 transports the substrate W from the bridge section 4 to the second front section 7. A part of the transport mechanism 26 enters the second front section 7. The support section 36 of the transport mechanism 26 enters the second front section 7. The transport mechanism 26 places the substrate W on one of the first processing units 71. Specifically, the transport mechanism 26 places the substrate W on the adhesion strengthening processing unit PAHP of the first processing unit 71. Similarly, the transport mechanism 26 transports the substrate W from the bridge section 4 to the second rear section 8. A part of the transport mechanism 26 enters the second rear section 8. The support section 36 of the transport mechanism 26 enters the second rear section 8. The transport mechanism 26 places the substrate W on one of the first processing units 81. Specifically, the transport mechanism 26 places the substrate W on the adhesion strengthening processing unit PAHP of the first processing unit 81.

[0371] In transport operations T5a, T6a, and T7a, the transport mechanism 25 transports the substrate W from the transport mechanism 24 to the first processing unit 51. In transport operations T5a, T6a, and T7b, the transport mechanism 25 transports the substrate W from the transport mechanism 24 to the first processing unit 61.

[0372] In transport operations T5b, T6b, and T7c, the transport mechanism 26 transports the substrate W from the transport mechanism 24 to the first processing unit 71. In transport operations T5b, T6b, and T7d, the transport mechanism 26 transports the substrate W from the transport mechanism 24 to the first processing unit 81.

[0373] The operation of the first front section 5 will now be described. The adhesion strengthening treatment unit PAHP performs adhesion strengthening treatment on the substrate W. The transport mechanism 55 takes the substrate W from the adhesion strengthening treatment unit PAHP (transport operation T8a). The transport mechanism 55 places the substrate W on the second processing unit 52 (transport operation T9a). The second processing unit 52 performs liquid treatment on the substrate W. The transport mechanism 55 takes the substrate W from the second processing unit 52 (transport operation T10a). The transport mechanism 55 places the substrate W on the heating and cooling unit PHP (transport operation T11a). The heating and cooling unit PHP heats the substrate W, and then cools the substrate W. The transport mechanism 55 takes the substrate W from the heating and cooling unit PHP (transport operation T12a). The transport mechanism 55 places the substrate W on the third processing unit 53 (transport operation T13a). The third processing unit 53 cools the substrate W. The transport mechanism 55 takes the substrate W from the third processing unit 53 (transport operation T14a). The transport mechanism 55 places the substrate W on the mounting section 54 (transport operation T15a).

[0374] Each time the first front section 5 repeats the transport operation T15a, the number of substrates W placed on the mounting section 54 increases by one.

[0375] The operation of the first rear section 6 is the same as the operation of the first front section 5. The operations of the second front section 7 and the second rear section 8 are also the same as the operation of the first front section 5.

[0376] Transport operations T16a, T16b, T16c, T16d The transport operations T16a, T16b, T16c, and T16d correspond to the "recovery" described above. Part of the transport mechanism 24 enters the first front section 5. The support section 16 of the transport mechanism 24 enters the first front section 5. The transport mechanism 24 picks up multiple substrates W from the mounting section 54 at once. The transport mechanism 24 transports multiple substrates W from the first front section 5 to the bridge section 4 at once. Similarly, part of the transport mechanism 24 enters the first rear section 6. The support section 16 of the transport mechanism 24 enters the first rear section 6. The transport mechanism 24 picks up multiple substrates W from the mounting section 64 at once. The transport mechanism 24 transports multiple substrates W from the first rear section 6 to the bridge section 4 at once. Part of the transport mechanism 24 enters the second front section 7. The support section 16 of the transport mechanism 24 enters the second front section 7. The transport mechanism 24 picks up multiple substrates W from the mounting section 74 at once. The transport mechanism 24 transports multiple substrates W from the second front section 7 to the bridge section 4 at once. Part of the transport mechanism 24 enters the second rear section 8. The support section 16 of the transport mechanism 24 enters the second rear section 8. The transport mechanism 24 picks up multiple substrates W from the mounting section 84 at once. The transport mechanism 24 transports multiple substrates W from the second rear section 8 to the bridge section 4 at once.

[0377] Transport operation T17 The transport operation T17 corresponds to the "dispensing" described above. Part of the transport mechanism 24 enters the slider section 3. The support section 16 of the transport mechanism 24 enters the slider section 3. The transport mechanism 24 transports multiple substrates W from the bridge section 4 to the slider section 3 at once. The transport mechanism 24 places multiple substrates W onto the transport mechanism 41 at once (transport operation T17).

[0378] In transport operations T16a and T17, the transport mechanism 24 transports multiple substrates W from the mounting section 54 to the transport mechanism 41 at once. In transport operations T16b and T17, the transport mechanism 24 transports multiple substrates W from the mounting section 64 to the transport mechanism 41 at once. In transport operations T16c and T17, the transport mechanism 24 transports multiple substrates W from the mounting section 74 to the transport mechanism 41 at once. In transport operations T16d and T17, the transport mechanism 24 transports multiple substrates W from the mounting section 84 to the transport mechanism 41 at once.

[0379] Transport operation T18 The transport mechanism 41 transports multiple substrates W from the second position P2 to the first position P1 at once. In this way, the transport mechanism 41 transports multiple substrates W from the bridge section 4 to the indexer section 2 at once. In other words, the transport mechanism 41 transports multiple substrates W from the transport mechanism 24 to the transport mechanism 12 at once.

[0380] Transport operation T19 The transport mechanism 12 picks up multiple substrates W from the transport mechanism 41 at once. The transport mechanism 12 transports multiple substrates W from the slider section 3 to the indexer section 2 at once.

[0381] Transport operation T20 The transport mechanism 12 places multiple substrates W on the carrier C on the carrier stage 11 at once.

[0382] Through transport operations T19 and T20, the transport mechanism 12 transports multiple substrates W from the transport mechanism 41 to the carrier C at once.

[0383] When transport operations T1-T20 are not distinguished, they are collectively referred to as transport operation T. The number of transport operations T for substrate processing apparatus 1 is, for example, 20. The number of transport operations T for transport mechanism 12 is 4. The number of transport operations T for transport mechanism 41 is 2. The number of transport operations T for transport mechanism 23 is 14. The number of transport operations T for transport mechanism 24 is 8. The number of transport operations T for transport mechanism 25 is 3. The number of transport operations T for transport mechanism 26 is 3. The number of transport operations T for transport mechanism 55 is 8. The number of transport operations T for transport mechanism 65 is 8. The number of transport operations T for transport mechanism 75 is 8. The number of transport operations T for transport mechanism 85 is 8.

[0384] The conveying process T2 is an example of the first process of the present invention. The conveying processes T3 and T4 are examples of the second process of the present invention.

[0385] The conveying processes T5a, T6a, and T7a are examples of the third process of the present invention. The conveying processes T5a, T6a, and T7b are examples of the fourth process of the present invention.

[0386] The conveying process T7a is an example of the front loading process of the present invention. The conveying process T7b is an example of the rear loading process of the present invention.

[0387] Conveying processes T8a-T15a are examples of the front conveying process of the present invention. Conveying processes T8b-T15b are examples of the rear conveying process of the present invention.

[0388] Conveying process T16a is an example of the front acquisition process of the present invention. Conveying process T16b is an example of the rear acquisition process of the present invention.

[0389] Conveying process T16a is an example of the fifth process of the present invention. Conveying process T16b is an example of the sixth process of the present invention. Conveying process T17 is an example of the seventh process of the present invention. Conveying processes T18 and T19 are examples of the eighth process of the present invention.

[0390] <9. Effects of the Embodiment> The substrate processing apparatus 1 comprises an indexer section 2, a slider section 3, a bridge section 4, a first front section 5, and a first rear section 6. The indexer section 2, slider section 3, and bridge section 4 are arranged in this order in the front-to-back direction X. The first front section 5, bridge section 4, and first rear section 6 are arranged in this order in the front-to-back direction X. The slider section 3 transports the substrate W between the indexer section 2 and the bridge section 4. The bridge section 4 transports the substrate W between the slider section 3 and the first front section 5. The bridge section 4 transports the substrate W between the slider section 3 and the first rear section 6. The first front section 5 comprises a plurality of processing units 50. The first front section 5 comprises a transport mechanism 55. The transport mechanism 55 transports the substrate W to the processing units 50. The first rear section 6 comprises a plurality of processing units 60. The first rear section 6 comprises a transport mechanism 65. The transport mechanism 65 transports the substrate W to the processing unit 60.

[0391] Here, the slider section 3 overlaps with the processing unit 50 in a plan view. Therefore, it is easy to improve the throughput of the first front section 5. In other words, it is easy to efficiently process the substrate W in the first front section 5.

[0392] In summary, with the substrate processing device 1, it is easy to improve throughput.

[0393] In a plan view, the slider section 3 does not overlap with the first rear section 6. Therefore, it is easy to improve the throughput of the first rear section 6.

[0394] When a substrate W is transported from the indexer unit 2 to the first front unit 5, the substrate W always passes through the slider unit 3 and the bridge unit 4. When a substrate W is transported from the first front unit 5 to the indexer unit 2, the substrate W always passes through the slider unit 3 and the bridge unit 4. Therefore, the substrate W is efficiently transported between the indexer unit 3 and the first front unit 5. Thus, it is easy to improve the throughput of the substrate processing device 1.

[0395] When a substrate W is transported from the indexer unit 2 to the first rear unit 6, the substrate W always passes through the slider unit 3 and the bridge unit 4. When a substrate W is transported from the first rear unit 6 to the indexer unit 2, the substrate W always passes through the slider unit 3 and the bridge unit 4. Therefore, the substrate W is efficiently transported between the indexer unit 3 and the first rear unit 6. Thus, it is easy to improve the throughput of the substrate processing device 1.

[0396] The transport mechanism 55 is configured to move to the same height position as the slider section 3. Therefore, it is easy to increase the range of motion of the transport mechanism 55 in the vertical Z direction. Thus, it is easy to improve the throughput of the first front section 5.

[0397] The processing unit 50 includes a first processing unit 51. The first processing unit 51 and the slider unit 3 are aligned in the vertical direction Z. Therefore, it is easy for the slider unit 3 to overlap with the processing unit 50 in a plan view.

[0398] The processing unit 50 includes a plurality of second processing units 52. The second processing units 52 are arranged in the vertical direction Z. At least one of the second processing units 52 is positioned at the same height as the slider unit 3. Therefore, it is easy to increase the number of second processing units 52. Thus, it is easy to improve the throughput of the first front unit 5.

[0399] The first processing unit 51, the transport mechanism 55, and the second processing unit 52 are arranged in this order in the width direction Y. Therefore, the transport mechanism 55 efficiently transports the substrate W to the first processing unit 51. The transport mechanism 55 efficiently transports the substrate W to the second processing unit 52. Thus, it is easy to improve the throughput of the first front section 5.

[0400] The first processing unit 51 performs a non-liquid treatment on the substrate W. The second processing unit 52 performs a liquid treatment on the substrate W. Therefore, it is easy to perform both non-liquid and liquid treatments on the substrate W in the first front section 5.

[0401] The processing unit 50 includes a third processing unit 53. Therefore, it is easy to increase the number of processing units 50.

[0402] The third processing unit 53 and the transport mechanism 55 are aligned in the front-to-back direction X. Therefore, the transport mechanism 55 efficiently transports the substrate W to the third processing unit 53.

[0403] The substrate processing apparatus 1 includes a second front section 7. The second front section 7 includes a plurality of processing units 70. The second front section 7 includes a transport mechanism 75. The transport mechanism 75 transports the substrate W to the processing units 70. Therefore, it is easy to improve the throughput of the substrate processing apparatus 1.

[0404] In a plan view, the slider section 3 overlaps with the processing unit 70. Therefore, it is easy to improve the throughput of the second front section 7.

[0405] The slider section 3 is positioned between the first front section 5 and the second front section 7. Therefore, the slider section 3 and the first front section 5 are adjacent to each other. The slider section 3 and the second front section 7 are adjacent to each other. Thus, it is easy for the bridge section 4 to transport the substrate W between the slider section 3 and the first front section 5. It is also easy for the bridge section 4 to transport the substrate W between the slider section 3 and the second front section 7.

[0406] The slider section 3 has a lower part 3a. The transport mechanism 55 is configured to move to the same height position as the lower part 3a. Therefore, it is easy to increase the range of motion of the transport mechanism 55 in the vertical direction Z. Thus, it is easy to improve the throughput of the first front section 5.

[0407] The slider section 3 has an upper part 3b. The upper part 3b is located above the lower part 3a. The transport mechanism 75 is configured to move to the same height position as the upper part 3b. Therefore, it is easy to increase the range of motion of the transport mechanism 75 in the vertical direction Z. Thus, it is easy to improve the throughput of the second front section 7.

[0408] The processing unit 70 includes a first processing unit 71. The first processing unit 71 is positioned above the first processing unit 51. The slider unit 3 is positioned above the first processing unit 51 and below the first processing unit 71. Therefore, it is easy for the slider unit 3 to overlap with the processing unit 50 in a plan view. It is easy for the slider unit 3 to overlap with the processing unit 70 in a plan view. It is easy to position the slider unit 3 between the first front unit 5 and the second front unit 7.

[0409] The processing unit 70 includes a plurality of second processing units 72. The second processing units 72 are arranged in the vertical direction Z. At least one of the second processing units 72 is positioned at the same height as the slider unit 3. Therefore, it is easy to increase the number of second processing units 72. Thus, it is easy to improve the throughput of the second front unit 7.

[0410] The indexer unit 2 includes a transport mechanism 12. The slider unit 3 includes a transport mechanism 41. The bridge unit 4 includes a transport mechanism 23. Transport mechanisms 12 and 41 transfer the substrate W to each other. Transport mechanisms 41 and 23 transfer the substrate W to each other. Therefore, it is easy for the slider unit 3 to transport the substrate W between the indexer unit 2 and the bridge unit 4.

[0411] The transport mechanism 12 includes a support section 16. The transport mechanism 41 includes a support section 43. The transport mechanism 24 includes a support section 16. Therefore, it is easy for the transport mechanism 12 and the transport mechanism 41 to transfer the substrate W to each other. It is also easy for the transport mechanism 41 and the transport mechanism 23 to transfer the substrate W to each other.

[0412] When the transport mechanism 12 and the transport mechanism 41 transfer the substrate W to each other, the support section 43 overlaps with the processing unit 50 in a plan view. Therefore, the transport distance L is short. Thus, the slider section 3 efficiently transports the substrate W between the indexer section 2 and the bridge section 4.

[0413] When the transport mechanism 41 and the transport mechanism 23 transfer the substrate W to each other, the support section 43 overlaps with the processing unit 50 in a plan view. Therefore, the transport distance L is short. Consequently, the slider section 3 efficiently transports the substrate W between the indexer section 2 and the bridge section 4.

[0414] The transport mechanism 12 and the transport mechanism 41 transfer multiple substrates W to each other at once. Therefore, the transport mechanism 12 and the transport mechanism 41 efficiently transfer substrates W to each other.

[0415] The transport mechanism 41 and the transport mechanism 23 transfer multiple substrates W to each other at once. Therefore, the transport mechanism 41 and the transport mechanism 23 efficiently transfer substrates W to each other.

[0416] The support section 16 of the transport mechanism 12 is equipped with multiple hands 18. Each hand 18 of the transport mechanism 12 supports one substrate W. The support section 43 is equipped with multiple hands 45. Each hand 45 supports one substrate W. The support section 16 of the transport mechanism 24 is equipped with multiple hands 18. Each hand 18 of the transport mechanism 24 supports one substrate W. Therefore, it is easy for the transport mechanism 12 and the transport mechanism 41 to transfer multiple substrates W to each other at once. It is also easy for the transport mechanism 41 and the transport mechanism 23 to transfer multiple substrates W to each other at once.

[0417] The substrate processing method of this embodiment comprises a first step, a second step, a third step, a fourth step, a front transport step, and a rear transport step. The first step is the transport step T2. In the first transport step, the substrate W is transported from the indexer section 2 to the slider section 3. The second step is the transport steps T3 and T4. In the second step, the substrate W is transported from the slider section 3 to the bridge section 4. The third step is the transport steps T5a, T6a, and T7a. In the third step, the substrate W is transported from the bridge section 4 to the first front section 5. The fourth step is the transport steps T5a, T6a, and T7b. In the fourth step, the substrate W is transported from the bridge section 4 to the first rear section 6. The front transport step is the transport steps T8a-T15a. In the front transport step, the transport mechanism 55 of the first front section 5 transports the substrate W to the processing unit 50 of the first front section 5. The rear transport process consists of transport processes T8b-T15b. In the rear transport process, the transport mechanism 65 of the first rear section 6 transports the substrate W to the processing unit 60 of the first rear section 6.

[0418] Here, the processing unit 50 of the first front section 5 overlaps with the slider section 3 in a plan view. Therefore, it is easy to improve the throughput of the first front section 5. In other words, it is easy to efficiently process the substrate W in the first front section 5.

[0419] When the substrate W is transported from the indexer unit 2 to the first front unit 5, the first, second, and third processes are executed. When the substrate W is transported from the indexer unit 2 to the first front unit 5, transport processes T2, T3, T4, T5a, T6a, and T7a are executed. Therefore, the substrate W is efficiently transported from the indexer unit 2 to the first front unit 5. Thus, it is easy to improve the throughput of the first front unit 5.

[0420] When the substrate W is transported from the indexer unit 2 to the first rear unit 6, the first, second, and fourth steps are executed. When the substrate W is transported from the indexer unit 2 to the first rear unit 6, transport steps T2, T3, T4, T5a, T6a, and T7b are executed. Therefore, the substrate W is efficiently transported from the indexer unit 2 to the first rear unit 6. Thus, it is easy to improve the throughput of the first rear unit 6.

[0421] In summary, according to the substrate processing method of the embodiment, it is easy to improve throughput.

[0422] The substrate processing method comprises the fifth, sixth, seventh, and eighth steps. The fifth step is the transport step T16a. In the fifth step, the substrate W is transported from the first front section 5 to the bridge section 4. The sixth step is the transport step T16b. In the sixth step, the substrate W is transported from the first rear section 6 to the bridge section 4. The seventh step is the transport step T17. In the seventh step, the substrate W is transported from the bridge section 4 to the slider section 3. The eighth steps are T18 and T19. In the eighth step, the substrate W is transported from the slider section 3 to the indexer section 2.

[0423] Here, when the substrate W is transported from the first front section 5 to the indexer section 2, steps 5, 7, and 8 are executed. When the substrate W is transported from the first front section 5 to the indexer section 2, transport steps T16a, T17, T18, and T19 are executed. Therefore, the substrate W is efficiently transported from the first front section 5 to the indexer section 2. Thus, it is easy to improve the throughput of the first front section 5.

[0424] When the substrate W is transported from the first rear section 6 to the indexer section 2, steps 6, 7, and 8 are executed. When the substrate W is transported from the first rear section 6 to the indexer section 2, transport steps T16b, T17, T18, and T19 are executed. Therefore, the substrate W is efficiently transported from the first rear section 6 to the indexer section 2. Thus, it is easy to improve the throughput of the first rear section 6.

[0425] In summary, it is easy to improve throughput depending on the substrate processing method.

[0426] <10. Modified Embodiments> This invention is not limited to the embodiments described below and can be modified and implemented as follows.

[0427] (1) In addition to "distribution" with respect to the first front section 5 and the first rear section 6, the transport mechanism 25 may also perform "distribution" with respect to the second front section 7 and the second rear section 8.

[0428] In the modified embodiment of (1) above, the transport mechanism 26 may be omitted. The configuration of the bridge section 4 is simplified.

[0429] (2) In addition to "distribution", the transport mechanisms 25 and 26 may also perform at least one of "receiving" and "discharging". Three modified embodiments will be described below.

[0430] (2-1) The transport mechanisms 25 and 26 take the substrate W from the slider section 3. The transport mechanism 24 places the substrate W on the slider section 3. According to the modified embodiment of (2-1) above, it is easy for the bridge section 4 to take the substrate W from the slider section 3. It is easy for the bridge section 4 to place the substrate W on the slider section 3.

[0431] (2-2) Transport mechanisms 25 and 26 place the substrate W on the slider section 3. Transport mechanism 24 takes the substrate W from the slider section 3. According to the modified embodiment of (2-2) above, it is easy for the bridge section 4 to take the substrate W from the slider section 3. It is easy for the bridge section 4 to place the substrate W on the slider section 3.

[0432] (2-3) The transport mechanisms 25 and 26 take the substrate W from the slider section 3 and place the substrate W on the slider section 3. According to the modified embodiment of (2-3) above, it is easy for the bridge section 4 to take the substrate W from the slider section 3. It is easy for the bridge section 4 to place the substrate W on the slider section 3.

[0433] (3) The transport mechanisms 25 and 26 may perform "recovery" in addition to "distribution".

[0434] For example, the transport mechanism 25 takes the substrate W from the first front section 5. Therefore, the number of transport operations T of the transport mechanism 55 is small. For example, the transport mechanism 55 does not perform transport operation T16a. Thus, it is easy to improve the throughput of the first front section 5.

[0435] For example, the transport mechanism 25 takes the substrate W from the first rear section 6. Therefore, the number of transport operations T of the transport mechanism 65 is small. Thus, it is easy to improve the throughput of the first rear section 6.

[0436] For example, the transport mechanism 26 takes the substrate W from the second front section 7. Therefore, the number of transport operations T of the transport mechanism 75 is small. Thus, it is easy to improve the throughput of the second front section 7.

[0437] For example, the transport mechanism 26 takes the substrate W from the second rear section 8. Therefore, the number of transport operations T of the transport mechanism 85 is small. Thus, it is easy to improve the throughput of the second rear section 8.

[0438] (4) The transport mechanisms 25 and 26 may perform "collection," "intake," and "dispensing" in addition to "distribution."

[0439] In the modified embodiment of (4) above, the transport mechanism 24 may be omitted. The configuration of the bridge section 4 is simplified.

[0440] (5) The transport mechanism 24 may perform "distribution" in addition to "collection," "intake," and "discharge."

[0441] The transport mechanism 24 places the substrate W on the first front section 5. Therefore, the number of transport operations T of the transport mechanism 55 is small. For example, the transport mechanism 55 does not perform transport operations T6a and T7a. Thus, it is easy to improve the throughput of the first front section 5.

[0442] The transport mechanism 24 places the substrate W on the first rear section 6. Therefore, the number of transport operations T of the transport mechanism 65 is small. Thus, it is easy to improve the throughput of the first rear section 6.

[0443] The transport mechanism 24 places the substrate W on the second front section 7. Therefore, the number of transport operations T of the transport mechanism 75 is small. Thus, it is easy to improve the throughput of the second front section 7.

[0444] The transport mechanism 24 places the substrate W on the second rear section 8. Therefore, the number of transport operations T of the transport mechanism 85 is small. Thus, it is easy to improve the throughput of the second rear section 8.

[0445] In the modified embodiment of (5) above, the transport mechanisms 25 and 26 may be omitted. The configuration of the bridge section 4 is simplified.

[0446] In the modified embodiment of (5) above, the transport mechanism 24 is an example of the first distribution mechanism of the present invention. The transport mechanism 24 is also an example of the second distribution mechanism of the present invention.

[0447] (6) Recovery may be performed using two transport mechanisms.

[0448] Figure 18 is a front view of the bridge section 4 of a modified embodiment. The bridge section 4 further includes a transport mechanism 27. The transport mechanism 27 is positioned above the transport mechanism 24. The transport mechanism 27 has the same structure as the transport mechanism 24.

[0449] For example, the transport mechanism 24 takes the substrate W from the first front section 5 and the substrate W from the first rear section 6. That is, the transport mechanism 24 performs transport operations T16a and T16b.

[0450] For example, the transport mechanism 27 takes the substrate W from the second front section 7 and the substrate W from the second rear section 8. That is, the transport mechanism 27 performs transport operations T16c and T16d.

[0451] Even with the modified embodiment described in (6) above, it is easy to improve the throughput of the first front section 5 and the first rear section 6. It is also easy to improve the throughput of the second front section 7 and the second rear section 8.

[0452] The transport mechanism 27 is an example of the second recovery mechanism of the present invention.

[0453] (7) The transport mechanism 25 may place the substrate W on the mounting section 54. Therefore, the number of transport operations T of the transport mechanism 55 is small. For example, the transport mechanism 55 does not perform transport operation T6a. Thus, it is easy to improve the throughput of the first front section 5.

[0454] Similarly, the transport mechanism 25 may place the substrate W on the mounting section 64. Therefore, the number of transport operations T of the transport mechanism 65 is small. For example, the transport mechanism 65 does not perform transport operation T6a. Thus, it is easy to improve the throughput of the first rear section 6.

[0455] (8) The transport mechanism 26 may place the substrate W on the mounting section 74. Therefore, the number of transport operations T of the transport mechanism 75 is small. For example, the transport mechanism 75 does not perform transport operation T6b. Thus, it is easy to improve the throughput of the first front section 7.

[0456] Similarly, the transport mechanism 26 may place the substrate W on the mounting section 84. Therefore, the number of transport operations T of the transport mechanism 85 is small. For example, the transport mechanism 85 does not perform transport operation T6b. Thus, it is easy to improve the throughput of the second rear section 8.

[0457] (9) The transport mechanism 24 may take the substrate W of the processing unit 50. For example, the transport mechanism 24 may take the substrate W of the first processing unit 51. Therefore, the number of transport operations T of the transport mechanism 55 is small. For example, the transport mechanism 55 does not perform transport operations T14a and T15a. Thus, it is easy to improve the throughput of the first front section 5.

[0458] The first processing unit 51 preferably includes a processing unit 50 that performs the final processing in the first front section 5. If the cooling unit CP is the processing unit 50 that performs the final processing in the first front section 5, then it is preferable that at least a portion of the processing unit 51 be classified as the cooling unit CP.

[0459] Similarly, the transport mechanism 24 may take the substrate W of the processing unit 60. For example, the transport mechanism 24 may take the substrate W of the first processing unit 61. Therefore, the number of transport operations T of the transport mechanism 65 is small. For example, the transport mechanism 65 does not perform transport operations T14b and T15b. Thus, it is easy to improve the throughput of the first rear section 6.

[0460] The transport mechanism 24 may take the substrate W of the processing unit 70. For example, the transport mechanism 24 may take the substrate W of the first processing unit 71. Therefore, the number of transport operations T of the transport mechanism 75 is small. For example, the transport mechanism 75 does not perform transport operations T14c and T15c. Thus, it is easy to improve the throughput of the second front section 7.

[0461] The transport mechanism 24 may take the substrate W of the processing unit 80. For example, the transport mechanism 24 may take the substrate W of the first processing unit 81. Therefore, the number of transport operations T of the transport mechanism 85 is small. For example, the transport mechanism 85 does not perform transport operations T14d and T15d. Thus, it is easy to improve the throughput of the second rear section 8.

[0462] (10) The second front section 7 may be omitted.

[0463] (11) The second rear section 8 may be omitted.

[0464] (12) The shape of the guide 42 may be changed as appropriate.

[0465] Figure 19 is a side view of the slider section 3 of a modified embodiment. The transport mechanism 41 includes a guide 111. The guide 111 has a closed curved shape. The guide 111 has, for example, an elliptical shape. The guide 111 has a rounded rectangle shape.

[0466] The support unit 43 moves in a circular motion along the guide 111. The support unit 43 comprises, for example, a plurality of movable elements 44. Each movable element 44 moves in a circular motion along the guide 111. Each movable element 44 supports a hand 45 (not shown).

[0467] The effects of the modified embodiment described in (12) above will now be explained. The slider section 3 efficiently transports the substrate W between the indexer section 2 and the bridge section 4.

[0468] It is easy to increase the number of movable elements 44. Even when the slider section 3 is narrow, it is easy to increase the number of movable elements 44. Therefore, it is easy to increase the number of hands 45.

[0469] (13) The slider unit 3 may further detect the substrate W.

[0470] Figure 20 is a plan view of the slider section 3 of the modified embodiment. Figure 21 is a side view of the slider section 3 of the modified embodiment. For convenience, Figures 20 and 21 show a simplified representation of the transport mechanism 41. The slider section 3 includes a detection unit 113. The detection unit 113 detects the substrate W supported by the support unit 43. The detection unit 113 detects the substrate W supported by the support unit 43 without contacting the substrate W supported by the support unit 43.

[0471] The detection unit 113 may individually detect each substrate W supported by the support unit 43. Alternatively, the detection unit 113 may detect multiple substrates W supported by the support unit 43 collectively.

[0472] For example, the detection unit 113 includes at least one of a photoelectric sensor and an imaging unit. For example, the photoelectric sensor may be classified as a transmissive type. Alternatively, the photoelectric sensor may be classified as a reflective type. The imaging unit images the substrate W and acquires an image of the substrate W. The image may be a one-dimensional image. The image may be a two-dimensional image. The imaging unit includes, for example, at least one of a camera and a line sensor.

[0473] For example, the detection unit 113 includes a plurality of light-emitting units 114 and a plurality of light-receiving units 115. The light-emitting units 114 and light-receiving units 115 are arranged to face each other. The light-emitting unit 114 is positioned above a substrate W supported by a support unit 43, for example. The light-receiving unit 115 is positioned below a substrate W supported by a support unit 43, for example. The light-emitting unit 114 irradiates light toward the light-receiving unit 115. The light-receiving unit 115 receives the light from the light-emitting unit 114.

[0474] When the substrate W is not located between the light-emitting unit 114 and the light-receiving unit 115, the substrate W does not obstruct the light from the light-emitting unit 114, and the light-receiving unit 115 receives the light from the light-emitting unit 114. When the light-receiving unit 115 receives the light from the light-emitting unit 114, the detection unit 113 detects that the substrate W is not present between the light-emitting unit 114 and the light-receiving unit 115.

[0475] When the substrate W is positioned between the light-emitting unit 114 and the light-receiving unit 115, the substrate W blocks the light from the light-emitting unit 114, and the light-receiving unit 115 does not receive the light from the light-emitting unit 114. When the light-receiving unit 115 does not receive the light from the light-emitting unit 114, the detection unit 113 detects that the substrate W is present between the light-emitting unit 114 and the light-receiving unit 115.

[0476] For example, the detection unit 113 is immovable. The detection unit 113 is fixedly installed. When the transport mechanism 41 transports the substrate W, the detection unit 113 detects the substrate W supported by the support unit 43.

[0477] Figure 22 is a plan view of the slider section 3 of the modified embodiment. For convenience, the transport mechanism 41 is not shown in Figure 22. The substrate W is moved by the transport mechanism 41 between positions Fa, Fb, Fc, Fd, and Fe. When the substrate W moves between positions Fa and Fb, the detection unit 113 does not detect the substrate W. When the substrate W moves between positions Fb, Fc, and Fd, the detection unit 113 detects the substrate W. When the substrate W moves between positions Fd and Fe, the detection unit 113 does not detect the substrate W.

[0478] The detection unit 113 detects the substrate W moving between position Fb and position Fd. The detection unit 113 detects the timing of the substrate W moving between position Fb and position Fd. The detection unit 113 monitors the substrate W moving between position Fb and position Fd.

[0479] The detection unit 113 outputs the detection result to the control unit 10 described above.

[0480] The control unit 10 acquires the detection result from the detection unit 113. Based on the detection result from the detection unit 113, the control unit 10 may acquire the position of the substrate W relative to the support unit 43.

[0481] Figure 23 is a plan view of the slider section 3 of the modified embodiment. The procedure for obtaining the position of the substrate W relative to the support section 43 will be explained.

[0482] The detection unit 113 is positioned at positions G1 and G2. Positions G1 and G2 are known.

[0483] The control unit 10 obtains times H1 and H2 (not shown) based on the detection results of the detection unit 113. Times H1 and H2 are the times when the detection unit 113 detected the periphery of the substrate W. For example, at time H1, the substrate W is at position Fb. At time H2, the substrate W is at position Fd.

[0484] The control unit 10 acquires positions J1 and J2 (not shown) based on times H1 and H2. For example, position J1 is the position of the center M of the hand 45 at time H1. Position J2 is the position of the center M of the hand 45 at time H2. When acquiring positions J1 and J2, the control unit 10 may refer to at least one of the commands input to the transport mechanism 41 and the detection results of a sensor that detects the amount of movement of the transport mechanism 41. The sensor is, for example, an encoder.

[0485] The control unit 10 obtains positions N1 and N2 relative to the center M based on positions J1 and G1 and G2. The control unit 10 obtains positions N3 and N4 relative to the center M based on positions J2 and G1 and G2. Positions N1-N4 are points on the periphery of the substrate W.

[0486] The control unit 10 obtains the position of the center Q of the substrate W relative to the center M based on the positions M and N1-N4.

[0487] The control unit 10 obtains the distance R between the center M and the center Q based on the positions M and Q. When the center Q coincides with the center M, the distance R is zero. When the center Q does not coincide with the center M, the distance R is greater than zero.

[0488] When the distance R is small, the support of the substrate W by the support part 43 is appropriate. When the distance R is large, the support of the substrate W by the support part 43 is not appropriate.

[0489] The control unit 10 may control at least one of the transport mechanisms 12, 41, and 24 based on the detection result of the detection unit 113.

[0490] For example, the control unit 10 may adjust the amount of movement of the transport mechanism 12 when the transport mechanism 12 picks up the substrate W from the transport mechanism 41. For example, the control unit 10 may adjust the amount of movement of the transport mechanism 12 when the transport mechanism 24 picks up the substrate W from the transport mechanism 41.

[0491] For example, the control unit 10 may change the movement speed of the transport mechanism 41. For example, the control unit 10 may stop the transport mechanism 41.

[0492] For example, when the transport mechanism 12 places a new substrate W on the transport mechanism 41, the control unit 10 may change the amount of movement of the transport mechanism 12. For example, when the transport mechanism 12 places a new substrate W on the transport mechanism 41, the control unit 10 may change the first position P1 of the support part 43. For example, when the transport mechanism 24 places a new substrate W on the transport mechanism 41, the control unit 10 may change the amount of movement of the transport mechanism 12. For example, when the transport mechanism 24 places a new substrate W on the transport mechanism 41, the control unit 10 may change the second position P2 of the support part 43.

[0493] The effects of the modified embodiment described in (13) above will now be explained. The slider unit 3 includes a detection unit 113. The detection unit 113 detects the substrate W supported by the support unit 43. Therefore, it is easy to monitor the transport of the substrate W in the slider unit 3.

[0494] The detection unit 113 is immovable. Therefore, it is easy to install the detection unit 113.

[0495] When the transport mechanism 41 transports the substrate W, the detection unit 113 detects the substrate W supported by the support unit 43. As the transport mechanism 41 transports the substrate W, the relative position between the substrate W and the detection unit 113 changes. Therefore, even if the detection unit 113 is immobile, it is easy for the detection unit 113 to detect the substrate W supported by the support unit 43.

[0496] The substrate processing apparatus 1 includes a control unit 10. Based on the detection result of the detection unit 113, the control unit 10 controls at least one of the transport mechanism 12, transport mechanism 43, and transport mechanism 24. As a result, the support unit 43 properly supports the substrate W. Therefore, the slider unit 3 properly transports the substrate W between the indexer unit 2 and the bridge unit 4.

[0497] (14) The slider unit 3 may further inspect the substrate W.

[0498] Figure 24 is a side view of the slider part 3 of the modified embodiment.

[0499] The slider unit 3 includes an inspection unit 117. The inspection unit 117 inspects the substrate W supported by the support unit 43. For example, the inspection by the inspection unit 117 includes at least one of measuring the shape of the surface of the substrate W, identifying the condition of the surface of the substrate W, and detecting defects on the surface of the substrate W. The surface of the substrate W may include at least one of a pattern and a coating. Measuring the shape of the surface of the substrate W includes, for example, measuring the thickness of the coating formed on the surface of the substrate W.

[0500] The inspection unit 117, for example, images the surface of the substrate W. The inspection unit 117 acquires an image of the surface of the substrate W. The image may be a one-dimensional image. The image may be a two-dimensional image.

[0501] For example, the inspection unit 117 includes an imaging unit. The imaging unit includes, for example, at least one of a camera and a line sensor.

[0502] For example, the inspection unit 117 is immovable. The inspection unit 117 is fixedly installed. When the transport mechanism 41 transports the substrate W, the detection unit 117 detects the substrate W supported by the support unit 43.

[0503] The effects of the modified embodiment described in (14) above will now be explained. The slider section 3 includes an inspection section 117. The inspection section 117 inspects the substrate W supported by the support section 43. Therefore, the substrate processing apparatus 1 inspects the substrate W without increasing the number of transport operations T of the substrate processing apparatus 1. Thus, it is easy to improve the throughput of the substrate processing apparatus 1.

[0504] The inspection unit 117 is immovable. Therefore, installing the inspection unit 117 is easy.

[0505] When the transport mechanism 41 transports the substrate W, the inspection unit 117 inspects the substrate W supported by the support unit 43. As the transport mechanism 41 transports the substrate W, the relative position between the substrate W and the inspection unit 117 changes. Therefore, even if the inspection unit 117 is immobile, it is easy for the inspection unit 117 to detect the substrate W supported by the support unit 43.

[0506] (15) The embodiments and each modified embodiment described in (1) to (14) above may be further modified as appropriate by substituting or combining each component with the components of other modified embodiments. [Explanation of Symbols]

[0507] 1 ... Substrate processing equipment 2… Indexer section 3… Slider part 4… Bridge section 5… First Front Section 6… First rear section 7… Second Front Section 8… Second rear section 9… Cabinet section 10 ... Control Unit 11… Career Stages C... Career 12… Conveying mechanism (First conveying mechanism) 16... Support part (first support part, third support part) 18… Hand (1st hand, 3rd hand) 21 ... Mounting section (first intermediate mounting section) 22 ... Mounting section (second intermediate mounting section) 23… Conveying mechanism (third conveying mechanism) 24… Conveying mechanism (first recovery mechanism) 25… Conveying mechanism (first distribution mechanism) 26… Conveying mechanism (second distribution mechanism) 27… Conveying mechanism (second recovery mechanism) 36 … Support part (3rd support part) 38… Hand (3rd hand) 41… Conveying mechanism (second conveying mechanism) 42… Guide 43 … Support part (second support part) 45… Hand (2nd hand) 50… Processing unit (processing unit of the first front section) 51 … First Processing Unit 52 ... Second processing unit 53 … Third Processing Unit 54 ... Mounting section (first front mounting section) 55 ... Conveying mechanism (first front conveying mechanism) 60 ... Processing unit (Processing unit for the first rear section) 61 … First Processing Unit 62 … Second Processing Unit 63 … Third Processing Unit 64 ... Mounting section (first rear mounting section) 65… Conveying mechanism (first rear conveying mechanism) 70… Processing unit (processing unit of the second front section) 71 … First Processing Unit 72 … Second Processing Unit 73 … Third Processing Unit 74 ... Mounting section (second front mounting section) 75… Conveying mechanism (second front conveying mechanism) 80 ... Processing unit (processing unit for the second rear section) 81 … First Processing Unit 82 ... Second Processing Unit 83 … Third Processing Unit 84 ... Mounting section (second rear mounting section) 85… Conveying mechanism (second rear conveying mechanism) 111… Guide 113 ... Detection unit 117 … Inspection Department L... Transport distance of the substrate in the slider section K... Distance in the front-to-back direction between the indexer section and the bridge section P1 … 1st position P2 … 2nd position T…Transportation process T2… Conveying process (first process) T3, T4…Transportation process (2nd process) T5a, T6a, T7a... Conveying process (third process) T7a ... Conveying process (front mounting process) T5a, T6a, T7b…Transportation process (4th process) T7b ... Conveying process (rear loading process) T8a-T15a ... Conveying process (front conveying process) T8b-T15b ... Conveying process (rear conveying process) T16a ... Conveying process (5th process, front acquisition process) T16b ... Conveying process (6th process, rear acquisition process) T17… Conveying process (7th process) T18, 19... Conveying process (8th process) W… Circuit board X…Anteroposterior direction (first direction) Y… Width direction (second direction) Z ... Vertical direction

Claims

1. A substrate processing apparatus, The indexer section, Slider part, The bridge section, The first front section and, The first rear section and, Equipped with, The indexer section, the slider section, and the bridge section are arranged in this order in the first direction. The first direction is horizontal, The first front section, the bridge section, and the first rear section are arranged in this order in the first direction. The slider section transports the substrate between the indexer section and the bridge section. The bridge section transports the substrate between the slider section and the first front section, and transports the substrate between the slider section and the first rear section. The first front section is, Multiple processing units, A first front transport mechanism for transporting a substrate to the processing unit of the first front section, Equipped with, The first rear section is, Multiple processing units, A first rear transport mechanism for transporting substrates to the processing unit in the first rear section, Equipped with, In a plan view, the slider portion overlaps with the processing unit of the first front portion. Circuit board processing equipment.

2. In the substrate processing apparatus according to claim 1, The slider portion does not overlap with the first rear portion in a plan view. Circuit board processing equipment.

3. In the substrate processing apparatus according to claim 1, When the substrate is transported from the indexer section to the first front section, the substrate must pass through the slider section and the bridge section. When the substrate is transported from the first front section to the indexer section, the substrate always passes through the slider section and the bridge section. Circuit board processing equipment.

4. In the substrate processing apparatus according to claim 1, When the substrate is transported from the indexer section to the first rear section, the substrate must pass through the slider section and the bridge section. When the substrate is transported from the first rear section to the indexer section, the substrate always passes through the slider section and the bridge section. Circuit board processing equipment.

5. In the substrate processing apparatus according to claim 1, The first front transport mechanism is configured to move to the same height position as the slider portion. Circuit board processing equipment.

6. In the substrate processing apparatus according to claim 1, The processing unit of the first front section is, First processing unit and Multiple second processing units, Includes, The first processing unit and the slider section of the first front section are aligned vertically, The second processing units of the first front section are arranged vertically, At least one of the second processing units of the first front section is positioned at the same height as the slider section. Circuit board processing equipment.

7. In the substrate processing apparatus according to claim 6, The first processing unit of the first front section, the first front transport mechanism, and the second processing unit of the first front section are arranged in this order in the second direction. The second direction is horizontal and perpendicular to the first direction. Circuit board processing equipment.

8. In the substrate processing apparatus according to claim 6, The first processing unit of the first front section performs a non-liquid treatment on the substrate. The second processing unit of the first front section performs liquid processing on the substrate. Circuit board processing equipment.

9. In the substrate processing apparatus according to claim 6, The processing unit of the first front section includes a third processing unit, The third processing unit and the first front transport mechanism of the first front section are arranged in the first direction. Circuit board processing equipment.

10. In the substrate processing apparatus according to claim 6, The second front portion is positioned above the first front portion, The second front section is, Multiple processing units, The second front transport mechanism transports the substrate to the processing unit of the second front section, Equipped with, In a plan view, the slider portion overlaps with the processing unit of the second front portion. The slider portion is positioned between the first front portion and the second front portion. Circuit board processing equipment.

11. In the substrate processing apparatus according to claim 10, The slider part is, The bottom and, The upper part located above the lower part of the slider section, It has, The first front transport mechanism is configured to move to the same height position as the lower part of the slider section. The second front transport mechanism is configured to move to the same height position as the upper part of the slider. Circuit board processing equipment.

12. In the substrate processing apparatus according to claim 11, The processing unit of the second front section is First processing unit and Multiple second processing units, Includes, The first processing unit of the second front section is positioned above the first processing unit of the first front section. The slider portion is positioned above the first processing unit in the first front portion and below the first processing unit in the second front portion. The second processing unit of the second front section is positioned above the second processing unit of the first front section. The second processing units of the second front section are arranged vertically, At least one of the second processing units of the first front section is positioned at the same height as the lower part of the slider section. At least one of the second processing units of the second front section is positioned at the same height as the upper part of the slider section. Circuit board processing equipment.

13. In the substrate processing apparatus according to claim 1, The indexer section is equipped with a first transport mechanism, The slider section is equipped with a second transport mechanism, The bridge section is equipped with a third transport mechanism, The first transport mechanism and the second transport mechanism transfer the substrate to each other. The second transport mechanism and the third transport mechanism transfer the substrate to each other. The first transport mechanism includes a first support portion that supports the substrate, The second transport mechanism includes a second support portion that supports the substrate, The third transport mechanism includes a third support portion that supports the substrate, When the first transport mechanism and the second transport mechanism transfer the substrate to each other, the second support portion overlaps with the processing unit of the first front portion in a plan view. Circuit board processing equipment.

14. In the substrate processing apparatus according to claim 13, When the second transport mechanism and the third transport mechanism transfer the substrate to each other, the second support portion overlaps with the processing unit of the first front portion in a plan view. Circuit board processing equipment.

15. In the substrate processing apparatus according to claim 13, The first transport mechanism and the second transport mechanism transfer multiple substrates to each other at once. The second transport mechanism and the third transport mechanism transfer multiple substrates to each other at once. Circuit board processing equipment.

16. In the substrate processing apparatus according to claim 15, The first support section comprises a plurality of first hands, Each of the first hands supports one circuit board, The second support section comprises a plurality of second hands, Each of the second hands supports one circuit board, The third support section comprises a plurality of third hands, Each of the three hands supports a single circuit board. Circuit board processing equipment.

17. In the substrate processing apparatus according to claim 13, The second transport mechanism includes a guide for guiding the second support portion, The aforementioned guide has a closed curved shape, The second support portion moves in a circular motion along the guide. Circuit board processing equipment.

18. In the substrate processing apparatus according to claim 13, The slider portion includes a substrate position sensor that detects the position of the substrate supported by the second support portion. Circuit board processing equipment.

19. In the substrate processing apparatus according to claim 18, The aforementioned substrate position sensor is immovable, When the second transport mechanism transports the substrate, the substrate position sensor detects the position of the substrate supported by the second support. Circuit board processing equipment.

20. In the substrate processing apparatus according to claim 18, The system includes a control unit that controls at least one of the first transport mechanism, the second transport mechanism, and the third transport mechanism based on the detection result of the substrate position sensor. Circuit board processing equipment.

21. In the substrate processing apparatus according to claim 13, The slider section includes an inspection section for inspecting the substrate supported by the second support section. Circuit board processing equipment.

22. In the substrate processing apparatus according to claim 21, The inspection unit is immovable, When the second transport mechanism transports the substrate, the inspection unit inspects the substrate supported by the second support unit. Circuit board processing equipment.

23. A substrate processing method, The first step involves transporting the substrate from the indexer section to the slider section, A second step involves transporting the substrate from the slider section to the bridge section, A third step involves transporting the substrate from the bridge section to the first front section, A fourth step involves transporting the substrate from the bridge section to the first rear section, The processing unit of the first front portion, which overlaps with the slider portion in a plan view, includes a front transport step in which a substrate is transported by the first front transport mechanism of the first front portion, A rear transport process in which a substrate is transported to the processing unit of the first rear section by the first rear transport mechanism of the first rear section, Equipped with Substrate processing method.

24. In the substrate processing method described in claim 23, A fifth step involves transporting the substrate from the first front section to the bridge section, A sixth step involves transporting the substrate from the first rear section to the bridge section, A seventh step involves transporting the substrate from the bridge section to the slider section, An eighth step involves transporting the substrate from the slider section to the indexer section, Equipped with Substrate processing method.

Images