Electronic components

The electronic component design ensures orientation confirmation through equal face lengths and distinct surface features, addressing mounting defects by enhancing visual differentiation.

JP2026057154APending Publication Date: 2026-04-02TDK CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-20
Publication Date
2026-04-02

AI Technical Summary

Technical Problem

It is difficult to determine the orientation of electronic components with identical shapes of first and second side faces, leading to potential mounting defects during assembly.

Method used

The electronic component design features equal lengths of end and side faces with distinct surface colors and surface roughness, allowing for easy orientation confirmation.

Benefits of technology

Facilitates accurate orientation verification, reducing mounting defects by visually distinguishing between different side faces.

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Abstract

To provide an electronic component that makes it easy to check the orientation. [Solution] The electronic component 1 comprises a base body 2 and a pair of outer conductors located on the base body 2. The base body 2 includes a pair of end faces 2a, 2b facing each other in direction D1, a pair of side faces 2c, 2d facing each other in direction D2, and a pair of side faces 2e, 2f facing each other in direction D3. Direction D2 is perpendicular to direction D1. Direction D3 is perpendicular to both direction D1 and direction D2. The lengths of the end faces 2a, 2b in direction D2 are equal to the lengths of the end faces 2a, 2b in direction D3. The surface color of one side face 2e of the pair of side faces 2e, 2f is different from the surface color of the other side face 2f of the pair of side faces 2e, 2f, and the respective surface colors of the pair of side faces 2c, 2d.
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Description

Technical Field

[0001] The present invention relates to electronic components.

Background Art

[0002] Known electronic components include a body, a pair of external conductors located on the body, a coil located within the body, and a pair of internal conductors connecting the coil and the external conductors. The body has a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction orthogonal to the first direction, and a pair of second side faces facing each other in a third direction orthogonal to the first and second directions. The coil is positioned such that the coil axis of the coil intersects the pair of second side faces.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] It is difficult to determine the orientation of an electronic component in which the shapes of each of the first side face and the second side face are the same from the appearance. For example, if the orientation of the electronic component cannot be confirmed when the electronic component is housed in a carrier tape or mounted on an electronic device, mounting defects may occur.

[0005] One aspect of the present invention aims to provide an electronic component that facilitates confirmation of the orientation.

Means for Solving the Problems

[0006] An electronic component according to one aspect of the present invention comprises a base body and a pair of external conductors located on the base body. The base body includes a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction. The second direction is perpendicular to the first direction. The third direction is perpendicular to both the first and second directions. The lengths of each of the pair of end faces in the second direction and the lengths of each of the pair of end faces in the third direction are equal. The surface color of one of the pair of second sides is different from the surface color of the other of the pair of second sides, and the respective surface colors of the pair of first sides.

[0007] In the above embodiment, the second and third directions are orthogonal to each other, and the second and third directions are orthogonal to each other to the first direction. Therefore, the lengths of the pair of first surfaces facing each other in the second direction are equal to the lengths of the pair of second surfaces facing each other in the third direction. Since the first and second directions are mutually orthogonal, and the first and second directions are mutually orthogonal to the third direction, the lengths of each of a pair of end faces facing each other in the first direction in the third direction are equal to the lengths of each of a pair of first sides facing each other in the second direction. Since the first and third directions are mutually orthogonal, and the first and third directions are mutually orthogonal to the second direction, the lengths of each of a pair of end faces facing each other in the first direction in the second direction are equal to the lengths of each of a pair of second sides facing each other in the third direction in the second direction. Therefore, the lengths of the end face and the first side face in the third direction are equal, and the lengths of the end face and the second side face in the second direction are equal. As a result, in a configuration where the lengths of a pair of end faces facing each other in the first direction in the second direction are equal to the lengths of a pair of end faces facing each other in the first direction in the third direction, the length of the first side face in the third direction is equal to the length of the second side face in the second direction. Since the lengths of the sides defining the first side face and the lengths of the sides defining the second side face are equal, the shapes of the first side face and the second side face are the same. In the above embodiment, the surface color of one of the pair of second sides is different from the surface color of the other second side of the pair, and from the surface colors of each of the pair of first sides. Therefore, even if the shapes of the first and second sides are the same, the surface color of one second side is different from the surface color of the other side, making it easy to confirm the orientation of the electronic component. [Effects of the Invention]

[0008] One aspect of the present invention provides an electronic component that facilitates orientation verification. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of an electronic component according to one embodiment. [Figure 2] Figure 2 is a perspective view of the electronic component according to this embodiment. [Figure 3] Figure 3 is a plan view of the electronic component according to this embodiment, seen from one side. [Figure 4] Figure 4 is a plan view of the electronic component according to this embodiment, seen from one end face. [Figure 5] Figure 5 is a plan view of the electronic component according to this embodiment, viewed from another side. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described below with reference to the drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant explanations are omitted as appropriate.

[0011] The configuration of the electronic component according to this embodiment will be described with reference to Figures 1 to 5. Figures 1 and 2 are perspective views of the electronic component according to this embodiment. Figure 3 is a plan view of the electronic component according to this embodiment as seen from side 2c shown in Figure 1. Figure 4 is a plan view of the electronic component according to this embodiment as seen from end face 2b shown in Figure 1. Figure 5 is a plan view of the electronic component according to this embodiment as seen from side 2e shown in Figure 1. The electronic component 1 according to this embodiment is solder-mounted in an electronic device. The electronic device includes, for example, a circuit board or an electronic component. As shown in Figures 1 to 5, the electronic component 1 comprises a body 2, an outer conductor 3, an outer conductor 4, a coil 5, an inner conductor 6, and an inner conductor 7. The electronic component 1 is a coil component comprising the coil 5.

[0012] Body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and edges are chamfered and rounded. Body 2 includes opposing end faces 2a and 2b, opposing side faces 2c and 2d, and opposing side faces 2e and 2f. Side faces 2c, 2d and side faces 2e, 2f connect end faces 2a and 2b. Side faces 2c, 2d and side faces 2e, 2f are adjacent to each other via corners or edges. The pair of end faces 2a and 2b face each other in direction D1. The pair of side faces 2c and 2d face each other in direction D2. The pair of side faces 2e and 2f face each other in direction D3. Direction D2 is perpendicular to direction D1. Direction D3 is perpendicular to both direction D1 and direction D2. For example, direction D1 includes the first direction, direction D2 includes the second direction, and direction D3 includes the third direction. For example, a pair of sides 2c, 2d includes a pair of first sides, and a pair of sides 2e, 2f includes a pair of second sides.

[0013] Referring to Figure 4, the lengths d2 of the pair of end faces 2a and 2b in each direction D2 are equivalent to the lengths d3 of the pair of end faces 2a and 2b in each direction D3. "Equivalent" means that in addition to being equal, the values ​​may also include slight differences or manufacturing tolerances within a predetermined range. For example, if the difference between lengths d2 and d3 falls within ±5% of the length d2 or length d3, then lengths d2 and d3 are defined as equivalent. In one example, the difference between the lengths of the pair of end faces 2a and 2b in each direction D2 and the lengths of the pair of end faces 2a and 2b in each direction D3 is 20 μm or less. The end faces 2a and 2b are each square in shape. The lengths of the sides 2c and 2d in each direction D3 are equal to the lengths of the sides 2e and 2f in each direction D2. The lengths of the sides 2c and 2d in each direction D1 are equal to the lengths of the sides 2e and 2f in each direction D1. Each of the sides 2c, 2d and 2e, 2f may have a rectangular shape with the longer side aligned with direction D1. Since the lengths of the sides defining each of sides 2c, 2d and each of sides 2e, 2f are equal, the shapes of sides 2c, 2d and sides 2e, 2f are the same.

[0014] The substrate 2 includes a plurality of electrically insulating insulating layers 20. As shown in Figure 1, in this embodiment, the substrate 2 includes a plurality of insulating layers 20 stacked along direction D3. In the actual substrate 2, the plurality of insulating layers 20 are integrated to such an extent that their boundaries are not visible to each other. The plurality of insulating layers 20 include an outer layer 21 located at one end in direction D3. The outer layer 21 constitutes a side surface 2e. Each of the plurality of insulating layers 20 exhibits, for example, a rectangular shape when viewed from direction D3. For example, side surface 2e includes one side surface.

[0015] Each insulating layer 20 is composed of, for example, a sintered ceramic green sheet containing a ferrite material. The ferrite material includes, for example, a Ni-Cu-Zn ferrite material, a Ni-Cu-Zn-Mg ferrite material, or a Ni-Cu ferrite material. Each insulating layer 20 may also contain an Fe alloy. Each insulating layer 20 may also contain a non-magnetic material. The non-magnetic material includes, for example, a glass ceramic material or a dielectric material. Each insulating layer 20 may also contain a resin material. The resin material includes, for example, at least one selected from liquid crystal polymers, polyimide resins, crystalline polystyrene, epoxy resins, acrylic resins, bismalade resins, and fluororesins. The resin material may include, for example, a filler. The filler may include, for example, an inorganic filler. The inorganic filler includes silica. The resin material does not have to contain a filler. Each insulating layer 20 may contain a colorant, pigment, or dye.

[0016] The surface color of side 2e is different from the surface color of side 2f, and the respective surface colors of sides 2c and 2d. Surface color indicates the color of reflected light reflected from the surface of an object. Surface color includes the intrinsic color of the object and the color due to the surface condition of the object. The color due to the surface condition of the object includes the structural color of the object and the color due to the surface roughness of the object. Surface color is also indicated by values ​​in color space. For example, the value in color space of side 2e is different from the value in color space of side 2f, and the respective color values ​​of sides 2c and 2d. The difference between the value in color space of side 2e, the value in color space of side 2f, and the respective color values ​​of sides 2c and 2d may be greater than a predetermined threshold. As shown in Figure 1, in this embodiment, the surface color of the outer layer 21 is different from the surface colors of the multiple insulating layers 20 excluding the outer layer 21.

[0017] The surface color over the entire surface of side 2e may be different from the surface colors of side 2f and the respective surface colors of sides 2c and 2d. The surface color in at least 10% or more of the range of side 2e may be different from the surface colors of side 2f and the respective surface colors of sides 2c and 2d. The surface color in the range including the center of side 2e may be different from the surface colors of side 2f and the respective surface colors of sides 2c and 2d.

[0018] Side 2e is colored with a surface color different from the surface colors of side 2f and the respective surface colors of sides 2c and 2d. For example, side 2e is colored with a surface color in which at least one selected from the group consisting of lightness, hue, and chroma is different from the surface colors of side 2f and the respective surface colors of sides 2c and 2d. Side 2e may be colored with a dye. Side 2e may be colored by heat treatment.

[0019] As shown in FIG. 4, the surface roughness Sa1 of side 2e may be different from the surface roughness Sa3 of side 2f and the respective surface roughnesses Sa2 of sides 2c and 2d. The surface roughness may include the arithmetic mean height Sa. The surface color and the surface roughness are correlated. When the surface roughness is large, the influence of specularly reflected light on the surface color decreases, and the influence of diffusely reflected light on the surface color increases. The surface roughness Sa1 of side 2e may be smaller than the surface roughness Sa3 of side 2f and the respective surface roughnesses Sa2 of sides 2c and 2d. The surface roughness Sa1 of side 2e may be larger than the surface roughness Sa3 of side 2f and the respective surface roughnesses Sa2 of sides 2c and 2d.

[0020] The outer layer 21 is colored with a surface color different from the surface color of each of the plurality of insulator layers 20 excluding the outer layer 21. For example, the outer layer 21 is colored with a surface color in which at least one selected from the group consisting of lightness, hue, and chroma is different from the surface color of each of the plurality of insulator layers 20 excluding the outer layer 21. For example, each of the outer layer 21 or the plurality of insulator layers 20 excluding the outer layer 21 is colored with a colorant, pigment, dye, or filler. The outer layer 21 may contain a colorant, pigment, or dye. Each of the plurality of insulator layers 20 excluding the outer layer 21 may contain a colorant, pigment, or dye. The amount of filler contained in the outer layer 21 and the amount of filler contained in each of the plurality of insulator layers 20 excluding the outer layer 21 may be different. The amount of filler contained in the outer layer 21 may be more than the amount of filler contained in each of the plurality of insulator layers 20 excluding the outer layer 21. The amount of filler contained in the outer layer 21 may be less than the amount of filler contained in each of the plurality of insulator layers 20 excluding the outer layer 21.

[0021] The pair of external conductors 3, 4 are located on the element body 2. In the present embodiment, the pair of external conductors 3, 4 are located on the side surface 2f. When the electronic component 1 is soldered to an electronic device, the external conductors 3, 4 are connected to the terminals of the electronic device. For example, the side surface 2f includes the other second side surface of the pair of second side surfaces. When the electronic component 1 is soldered to an electronic device, the side surface 2f faces the electronic device to be soldered.

[0022] The external conductors 3, 4 are arranged side by side at a distance in the direction D1. The external conductor 3 is located near the end surface 2a, and the external conductor 4 is located near the end surface 2b. In the present embodiment, the pair of external conductors 3, 4 are located only on the side surface 2f. The external conductors 3, 4 are respectively located in a pair of depressions formed on the side surface 2f. When viewed from the direction D3, the external conductors 3, 4 are away from the outer edge of the side surface 2f. When viewed from the direction D3, the external conductors 3, 4 have a rectangular shape. The long sides of the external conductors 3, 4 are along the direction D2, and the short sides are along the direction D1.

[0023] The outer conductors 3 and 4 include a conductive material. The conductive material includes, for example, Ag, Pd, Cu, or Al. The conductive material includes, for example, an Ag-Pd alloy, an Ag-Cu alloy, an Ag-Au alloy, or an Ag-Pt alloy. The outer conductors 3 and 4 include, for example, a Ni plating film, an Sn plating film, a Cu plating film, or an Au plating film. The outer conductors 3 and 4 may have a multilayer structure of the above-mentioned plating films, and may include a Ni plating film and an Sn plating film formed on the Ni plating film. The plating film is formed, for example, by an electrolytic plating method or an electroless plating method.

[0024] Coil 5 is located within the base body 2. Coil 5 is positioned such that its coil axis AX intersects a pair of sides 2c and 2d. In this embodiment, the coil axis AX of coil 5 is aligned with direction D2. Coil 5 has a helical shape centered on the coil axis AX. Coil 5 has multiple wires positioned to form a helical shape centered on the coil axis AX. Coil 5 has wires 51, 52, 53, 54, 55, and 56. As shown in Figure 3, when viewed from direction D2, coil 5 has a rectangular shape. Coil 5 contains the conductive material described above. Coil 5, internal conductors 6 and 7, and external conductors 3 and 4 are electrically connected.

[0025] Wiring 51 is adjacent to side 2f. Wiring 51 includes at least one conductor. Wiring 51 includes conductors 51a, 51b, 51c, and 51d. Conductors 51a, 51b, 51c, and 51d extend along direction D1. Conductors 51a, 51b, 51c, and 51d are aligned in direction D2. Conductor 51a is located at the end closest to side 2c in direction D2, and conductor 51d is located at the end closest to side 2d in direction D2.

[0026] Wiring 52 is adjacent to side 2e. Wiring 52 includes multiple conductors. Wiring 52 includes conductors 52a, 52b, 52c, 52d, and 52e. Conductors 52a, 52b, 52c, 52d, and 52e each extend along direction D1. Conductors 52a, 52b, 52c, 52d, and 52e are aligned in direction D2. Conductor 52a is located at the end closer to side 2c in direction D2, and conductor 52e is located at the end closer to side 2d in direction D2. For example, wiring 52 includes one wire.

[0027] Wiring 53 connects conductor 52a and internal conductor 6. Wiring 53 is connected to external conductor 3 via internal conductor 6. Wiring 53 is adjacent to end face 2a. Wiring 53 extends along direction D3. In coil 5, wiring 53 is located at the end closest to side face 2c in direction D2.

[0028] The wiring 55 connects conductor 52e and the inner conductor 7. The wiring 55 is connected to the outer conductor 4 via the inner conductor 7. The wiring 55 is adjacent to the end face 2b. The wiring 55 extends along direction D3. In coil 5, the wiring 55 is located at the end closest to side 2d in direction D2.

[0029] Wiring 54 connects wiring 51 and wiring 52. Wiring 54 is adjacent to end face 2a. Wiring 54 includes at least one conductor. Wiring 54 includes conductors 54a, 54b, 54c, and 54d. As shown in Figure 4, the shortest distance between conductors 54a, 54b, 54c, 54d and end face 2a and the shortest distance between outer conductor 3 and end face 2a may be equal to each other. Conductors 54a, 54b, 54c, 54d extend along direction D3. Conductors 54a, 54b, 54c, 54d are aligned in direction D2. Conductor 54d is located at the end closest to end face 2b. Conductor 54a is adjacent to wiring 53 in direction D2.

[0030] Wiring 56 connects wiring 51 and wiring 52. Wiring 56 is adjacent to end face 2b. Wiring 56 includes at least one conductor. Wiring 56 includes conductors 56a, 56b, 56c, and 56d. As shown in Figure 4, the shortest distance between conductors 56a, 56b, 56c, 56d and end face 2b and the shortest distance between outer conductor 4 and end face 2b may be equal to each other. Conductors 56a, 56b, 56c, 56d extend along direction D3. Conductors 56a, 56b, 56c, 56d are aligned in direction D2. Conductor 56a is located at the end closest to end face 2a. Conductor 56d is adjacent to wiring 55 in direction D2.

[0031] Wiring 53 connects the internal conductor 6 to conductor 52a. Conductor 56a connects conductor 52a to conductor 51a. Conductor 54a connects conductor 51a to conductor 52b. Conductor 56b connects conductor 52b to conductor 51b. Conductor 54b connects conductor 51b to conductor 52c. Conductor 56c connects conductor 52c to conductor 51c. Conductor 54c connects conductor 51c to conductor 52d. Conductor 56d connects conductor 52d to conductor 51d. Conductor 54d connects conductor 51d to conductor 52e. Wiring 55 connects conductor 52e to the internal conductor 7.

[0032] The shortest distance between side 2e and coil 5 may be smaller than the shortest distance between at least one of the pair of side 2c, 2d and coil 5. As shown in Figure 4, the shortest distance between side 2e and coil 5 may be smaller than the shortest distance between each of the pair of side 2c, 2d and coil 5. The shortest distance between side 2e and coil 5 may be smaller than the shortest distance between side 2f and coil 5.

[0033] As shown in Figure 4, coil 5 defines a central space S of the helical shape. The coil axis AX of coil 5 passes through space S. Space S is located in the center when viewing electronic component 1 from sides 2c and 2d. In electronic component 1, a portion of the element 2 is located within the region of space S.

[0034] As shown in Figure 3, the distance t1 in direction D3 between the side surface 2e and the wiring 52 is smaller than the thickness t2 of the wiring 52. The outer layer 21 constitutes the part of the base body 2 from the side surface 2e to the wiring 52. The outer layer 21 is in contact with the wiring 52. The distance t1 in direction D3 between the side surface 2e and the wiring 52 corresponds to the thickness of the outer layer 21. The thickness t2 of the wiring 52 may be the maximum thickness of the multiple conductors 52a to 52e included in the wiring 52. The thickness t2 of the wiring 52 may be equal to the thickness of the insulating layer 20 adjacent to the outer layer 21 among the multiple insulating layers 20. In one example, the distance t1 in direction D3 between the side surface 2e and the wiring 52 is 15 μm or less. The distance t1 in direction D3 between the side surface 2e and the wiring 52 may be 15 μm or less and 2 μm or more. The outer layer 21 can be seen from a direction perpendicular to direction D3.

[0035] A pair of internal conductors 6 and 7 connect a pair of external conductors 3 and 4 to the coil 5. Internal conductor 6 is located between external conductor 3 and coil 5 in direction D3. Specifically, internal conductor 6 is located between external conductor 3 and the wiring 53 of coil 5 in direction D3. Internal conductor 6 connects external conductor 3 and the wiring 53 of coil 5. In the actual electronic component 1, the wiring 53 and internal conductor 6 are integrated to the extent that their boundaries are not visible to each other. Internal conductor 7 is located between external conductor 4 and coil 5 in direction D3. Specifically, internal conductor 7 is located between external conductor 4 and the wiring 55 of coil 5 in direction D3. Internal conductor 7 connects external conductor 4 and the wiring 55 of coil 5. In the actual electronic component 1, the wiring 55 and internal conductor 7 are integrated to the extent that their boundaries are not visible to each other.

[0036] As described above, the lengths of the pair of sides 2c and 2d facing each other in direction D2 in direction D1 are equivalent to the lengths of the pair of sides 2e and 2f facing each other in direction D3 in direction D1. The lengths of the pair of end faces 2a and 2b facing each other in direction D1 in direction D3 are equivalent to the lengths of the pair of sides 2c and 2d facing each other in direction D2 in direction D3. The lengths of the pair of end faces 2a and 2b facing each other in direction D1 in direction D2 are equivalent to the lengths of the pair of sides 2e and 2f facing each other in direction D3 in direction D2. Therefore, the lengths of the end faces 2a, 2b and the sides 2c, 2d in direction D3 are equal, and the lengths of the end faces 2a, 2b and the sides 2e, 2f in direction D2 are equal. As a result, in a configuration where the lengths d2 of a pair of end faces 2a, 2b facing each other in direction D3 are equal to the lengths d3 of a pair of end faces 2a, 2b facing each other in direction D3, the lengths of the sides 2c, 2d in direction D3 are equal to the lengths of the sides 2e, 2f in direction D2. Since the lengths of the sides defining sides 2c, 2d and the lengths of the sides defining sides 2e, 2f are equal, the shapes of sides 2c, 2d and sides 2e, 2f are the same.

[0037] In one of the above embodiments, the surface color of side 2e is different from the surface color of side 2f, and the respective surface colors of sides 2c and 2d. Therefore, even if the shapes of sides 2e, 2f and sides 2c and 2d are the same, the surface color of side 2e is different from the respective surface colors of sides 2f, 2c, and 2d, making it easy to confirm the orientation of the electronic component 1.

[0038] The base body 2 has a plurality of insulating layers 20 stacked along direction D3. The plurality of insulating layers 20 include an outer layer 21 located at one end in direction D3. The outer layer 21 constitutes the side surface 2e. The surface color of the outer layer 21 is different from the surface color of each of the plurality of insulating layers 20 excluding the outer layer 21. According to electronic component 1, side 2e, which has a different surface color from the other sides 2f, 2c, and 2d, is composed of the outer layer 21. Therefore, the surface color of side 2e can be different from that of the other sides 2f, 2c, and 2d.

[0039] Side 2e is colored with a different surface color than sides 2f, 2c, and 2d. Since the inherent color of side 2e changes through coloring, the influence of the surface condition of side 2e on the surface color of side 2e can be reduced.

[0040] The outer layer 21 is colored with a surface color different from the surface colors of the other multiple insulating layers 20 excluding the outer layer 21. Since the inherent color of the outer layer 21 changes through coloring, the influence of the surface condition of the outer layer 21 on the surface color of the outer layer 21 can be reduced.

[0041] The surface roughness Sa1 of side surface 2e is different from the surface roughness Sa3 of side surface 2f, and the respective surface roughness Sa2 of sides 2c and 2d. Surface color and surface roughness are correlated. The color of the surface, which depends on the surface condition, changes according to the surface roughness. Therefore, the surface color of side 2e can be changed by changing the surface roughness.

[0042] The electronic component 1 further comprises a coil 5 located within the body 2. The distance t1 in direction D3 between the side surface 2e and the wiring 52 is smaller than the thickness t2 of the wiring 52 in direction D3. In one example, the distance t1 in direction D3 between the side surface 2e and the wiring 52 is 15 μm or less. The smaller the distance t1 in direction D3 between side 2e and wiring 52, the easier it is to increase the inner diameter of coil 5. The distance t1 in direction D3 between side 2e and wiring 52 should be such that the surface color of side 2e differs from the surface colors of the other sides 2f, 2c, and 2d.

[0043] The present invention has been described in detail above based on its embodiments. However, the present invention is not limited to the above embodiments. The present invention can be modified in various ways without departing from its spirit.

[0044] The element 2 may be transparent to visible light. In one example, the element 2 may be semi-transparent. The total light transmittance of the outer layer 21 may differ from the total light transmittance of each of the multiple insulating layers 20 excluding the outer layer 21. The total light transmittance of the outer layer 21 may be less than the total light transmittance of each of the multiple insulating layers 20 excluding the outer layer 21. The total light transmittance of the outer layer 21 may be greater than the total light transmittance of each of the multiple insulating layers 20 excluding the outer layer 21. The surface roughness Sa1 of side surface 2e may be 0.4 μm or less. The surface roughness Sa1 of side surface 2e may be 0.4 μm or less and 0.01 μm or more. Electronic component 1 does not necessarily have to include coil 5. Electronic component 1 is not limited to coil components.

[0045] As can be seen from the descriptions of the embodiments described above, this specification includes disclosures of the following embodiments. (Note 1) A base body comprising a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction perpendicular to the first direction, and a pair of second side faces facing each other in a third direction perpendicular to the first and second directions, A pair of external conductors located on the aforementioned body, The lengths of each of the pair of end faces in the second direction and the lengths of each of the pair of end faces in the third direction are equal. The surface color of one of the pair of second sides is different from the surface color of the other of the pair of second sides, and the surface colors of each of the pair of first sides. Electronic components. (Note 2) The aforementioned second side is colored with a surface color different from the surface color of the other second side of the pair of second sides, and the surface colors of each of the pair of first sides. Electronic components as described in Appendix 1. (Note 3) The surface roughness of one of the pair of second sides is different from the surface roughness of the other of the pair of second sides, and the surface roughness of each of the pair of first sides. Electronic components as described in Appendix 1 or 2. (Note 4) The aforementioned substrate has a plurality of insulating layers stacked along the third direction, The plurality of insulating layers include an outer layer located at one end in the third direction, The outer layer constitutes one of the second sides, The surface color of the outer layer is different from the surface color of each of the multiple insulating layers excluding the outer layer. An electronic component listed in any one of the appendices 1 to 3. (Note 5) At least one of the outer layer and the plurality of insulating layers excluding the outer layer is colored such that the surface color of the outer layer and the surface color of each of the plurality of insulating layers excluding the outer layer are different from each other. Electronic components as described in Appendix 4. (Note 6) The above body further comprises a coil located within it. The coil has a wiring adjacent to the first second side, The distance in the third direction between the first second side surface and the first wiring is smaller than the thickness of the first wiring in the third direction. An electronic component listed in any one of the appendices 1 to 5. (Note 7) The above body further comprises a coil located within it. The coil has a wiring adjacent to the first second side, The distance in the third direction between the first second side surface and the first wiring is 15 μm or less. An electronic component listed in any one of the appendices 1 to 6. [Explanation of Symbols]

[0046] 1...Electronic component, 2...Base body, 2a,2b...End face, 2c,2d,2e,2f...Side surface, 3,4...Outer conductor, 5...Coil, d2,d3...Length, Sa1,Sa2,Sa3...Surface roughness.

Claims

1. A base body comprising a pair of end faces facing each other in a first direction, a pair of first side faces facing each other in a second direction perpendicular to the first direction, and a pair of second side faces facing each other in a third direction perpendicular to the first and second directions, A pair of external conductors located on the aforementioned body, The lengths of each of the pair of end faces in the second direction and the lengths of each of the pair of end faces in the third direction are equal. The surface color of one of the pair of second sides is different from the surface color of the other of the pair of second sides, and the surface colors of each of the pair of first sides. Electronic components.

2. The aforementioned second side is colored with a surface color different from the surface color of the other second side of the pair of second sides, and the surface colors of each of the pair of first sides. The electronic component according to claim 1.

3. The surface roughness of one of the pair of second sides is different from the surface roughness of the other of the pair of second sides, and the surface roughness of each of the pair of first sides. The electronic component according to claim 1.

4. The aforementioned substrate has a plurality of insulating layers stacked along the third direction, The plurality of insulating layers include an outer layer located at one end in the third direction, The outer layer constitutes one of the second sides, The surface color of the outer layer is different from the surface color of each of the multiple insulating layers excluding the outer layer. The electronic component according to any one of claims 1 to 3.

5. At least one of the outer layer and the plurality of insulating layers excluding the outer layer is colored such that the surface color of the outer layer and the surface color of each of the plurality of insulating layers excluding the outer layer are different from each other. The electronic component according to claim 4.

6. The above body further comprises a coil located within it. The coil has a wiring adjacent to one of the second sides, The distance in the third direction between the first second side surface and the first wiring is smaller than the thickness of the first wiring in the third direction. The electronic component according to any one of claims 1 to 3.

7. The above body further comprises a coil located within it. The coil has a wiring adjacent to one of the second sides, The distance in the third direction between the first second side surface and the first wiring is 15 μm or less. The electronic component according to any one of claims 1 to 3.

Citation Information

Patent Citations

  • Multilayer chip coil

    WO2015016079A1