Resin, resin composition, molded article, and method for manufacturing a molded article

Abstract

The present invention provides a resin that possesses low dielectric constant, low dielectric loss tangent, high heat resistance, and high mechanical strength. [Solution] A resin comprising two or more structural units represented by formula (a1), wherein the proportion of each structural unit to the total content of the structural units is 0.01 mol% or more, and the weight-average molecular weight as defined by GPC is 70,000 to 1,000,000. TIFF2026058130000039.tif69170

Description

[Technical Field]

[0001] The present invention relates to a resin, a resin composition, a molded article, and a method for manufacturing a molded article. [Background technology]

[0002] Among resin materials, aromatic polyethers are widely used in the automotive and machinery sectors as so-called engineering resins because they have excellent heat resistance and relatively good mechanical strength. Furthermore, development is underway to create new structures for engineering resins that achieve both superior heat resistance and thermal stability.

[0003] Patent Document 1 discloses a phenyltriazine compound bonded to an aryl group. This technology aims to provide an aromatic polyether resin that is excellent in heat resistance and thermal stability, as well as in mechanical strength, and can be advantageously used as an engineering resin.

[0004] Meanwhile, as society's communication infrastructure transitions to 5G, high-frequency electromagnetic waves such as microwaves and millimeter waves used in electronic devices are attracting attention, and research into their applications in the communications field and vehicle radar is progressing. In devices that use high-frequency electromagnetic waves, low dielectric constant and low dielectric loss tangent are required for components such as substrates, resonators, filters, and antennas. Patent document 2 describes a resin composition containing a compound having a specific structural unit that possesses low dielectric constant, low dielectric loss tangent, and high heat resistance. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 6-184300 [Patent Document 2] International Publication No. 2022 / 202886 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, conventional resins still had room for further improvement in terms of mechanical strength.

[0007] As a result of diligent research, the inventors discovered that a resin containing a combination of two or more specific structural units possesses not only low dielectric constant, low dielectric loss tangent, and high heat resistance, but also excellent mechanical strength, thus completing the present invention.

[0008] The object of the present invention is to provide a resin, a resin composition, a molded article, and a method for manufacturing a molded article that possess low dielectric constant, low dielectric loss tangent, and high heat resistance, in addition to high mechanical strength. [Means for solving the problem]

[0009] According to the present invention, the following resins and the like are provided. 1. Containing two or more structural units represented by formula (a1), The proportion of each structural unit to the total content of the two or more structural units represented by formula (a1) is 0.01 mol% or more. A resin with a weight-average molecular weight of 70,000 to 1,000,000, as defined by gel permeation chromatography. [ka] [In equation (a1), Ar1 is a group selected from the group consisting of groups represented by the following formulas (Ar-1) to (Ar-3). [ka] (In equations (Ar-1) to (Ar-3), *1 and *2 are bonded to the two oxygen atoms to which Ar1 is bonded, respectively. R 221 ~R 224 One of them, and R 225 ~R 228 One or more pairs consisting of one of the following are Combine with each other to form a substituted or unsubstituted monocyclic ring, or Combine with each other to form a substituted or unsubstituted condensed ring, or Do not combine with each other. R that do not combine with each other 221 ~R 228 , and R 201 ~R 218 and R p are each independently a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 50 carbon atoms, a substituted or unsubstituted alkynyl group having 2 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 ring-forming carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 ring-forming carbon atoms, or a substituted or unsubstituted monovalent oxygen-containing group. Ring p is an aliphatic hydrocarbon ring having (q + 1) ring-forming carbon atoms. q is an integer from 2 to 19. The 2q R p may be the same as or different from each other.) R 11 ~R 23 are each independently a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 50 carbon atoms, a substituted or unsubstituted alkenyl group having 2 to 50 carbon atoms, <0000二十九9>a substituted or unsubstituted alkynyl group having 2 to 50 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 50 ring-forming carbon atoms, a substituted or unsubstituted aryl group having 6 to 50 ring-forming carbon atoms, or a substituted or unsubstituted monovalent oxygen-containing group. When it is "substituted or unsubstituted", the substituent is an unsubstituted alkyl group having 1 to 50 carbon atoms, an unsubstituted alkenyl group having 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and Selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring. 2. The resin according to paragraph 1, wherein the two or more structural units represented by formula (a1) include a structural unit represented by the following formula (a11). [ka] [In equation (a11), R 11 ~R 23 This is as defined in equation (a1) above. R 101 ~R 104 One of them, and R 105 ~R 108 One or more pairs consisting of one of the following are They combine with each other to form a monoring, either substituted or unsubstituted, They bond to each other to form substituted or unsubstituted fused rings, or They do not combine with each other. R that does not bond to each other 101 ~R 108 , and R 111 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. 10 R 111 They may be the same or they may be different. 3. The resin according to 1 or 2 above, wherein the substituent in the case of "substituted or unsubstituted" is a methyl group, an ethyl group, an isopropyl group, a cyclohexyl group, or a phenyl group. 4. A resin according to any one of 1 to 3 above, wherein the structural units represented by two or more of the above formulas (a1) include the structural unit represented by the following formula (a1-1). [ka] 5. The resin according to any one of 1 to 4, wherein the two or more structural units represented by formula (a1) include one or more structural units selected from the group consisting of structural units represented by the following formulas (a2-1) to (a2-15). [ka] [ka] [ka] [ka] 6. The resin described in item 1 above, represented by the following formula (1). [ka] [In equation (1), Ar1 and R 11 ~R 23 This is as defined in equation (a1) above. Ar2 is a group selected from the group consisting of the groups represented by the formulas (Ar-1) to (Ar-3) above. However, Ar1 and Ar2 are distinct from each other. R 31 ~R 43 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups with 1 to 50 carbon atoms, Unsubstituted alkenyl groups with 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and The group is selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring. m ranges from 0.001 to 0.999. n is between 1 and 400. If there are multiple structures within parentheses relating to n, the m within each of the parentheses relating to n may be the same or different from each other. 7. The resin described in item 1 above, represented by the following formula (1-1). [ka] [In equation (1-1), Ar1 and R 11 ~R 23 This is as defined in equation (a1) above. Ar2 is a group selected from the group consisting of the groups represented by the formulas (Ar-1) to (Ar-3) above. However, Ar1 and Ar2 are distinct from each other. R 31 ~R 43 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups with 1 to 50 carbon atoms, Unsubstituted alkenyl groups with 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and The group is selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring. m ranges from 0.001 to 0.999. However, there are multiple types of Ar1, Ar2, R 11 ~R 23 , and R 31 ~R 43 Each of them is identical. 8. A resin according to any one of items 1 to 7 above, wherein the weight-average molecular weight as defined by gel permeation chromatography is 100,000 or more and 1,000,000 or less. 9. A resin according to any one of items 1 to 8 above, wherein the dielectric constant is 2.7 or less, the dielectric loss tangent is 0.002 or less, and the glass transition temperature is 250°C or higher. 10. A resin composition comprising the resin described in any of items 1 to 9 above. 11. The resin composition according to 10, further comprising one or more resins selected from the group consisting of epoxy resins, bismaleimide resins, and cyanate resins. 12. The resin composition according to 10 or 11, further comprising one or more selected from the group consisting of inorganic fillers, modifiers, and flame retardants. 13. A molded article obtained by molding a resin according to any one of items 1 to 9 above, or a resin composition according to any one of items 10 to 12 above. 14. The molded article according to 13, which is in the shape of a film or a sheet. 15. The molded body according to 13 or 14 above, used in equipment that transmits and receives electromagnetic waves with a frequency of 0.1 to 500 GHz. 16. A method for producing a molded article according to any one of items 13 to 15, comprising the step of heating and melting the resin or resin composition. 17. A method for manufacturing equipment that transmits and receives electromagnetic waves with a frequency of 0.1 to 500 GHz using the molded body described in 13 or 14 above. 18. Printed wiring boards, flexible printed wiring boards, sheets for laminated substrates, laminated substrates comprising two or more sheets for laminated substrates, encapsulants for electronic components, resist inks, conductive pastes, insulating materials, or insulating boards, comprising a resin according to any of items 1 to 9 above, or a resin composition according to any of items 10 to 12 above. [Effects of the Invention]

[0010] According to the present invention, a resin, a resin composition, a molded article, and a method for manufacturing a molded article can be provided that possess low dielectric constant, low dielectric loss tangent, and high heat resistance, in addition to high mechanical strength. [Modes for carrying out the invention]

[0011] The resin, resin composition, molded article, and method for manufacturing the molded article of the present invention will be described in detail below. In this specification, "x~y" represents a numerical range of "greater than or equal to x and less than or equal to y". The upper and lower limits specified for the numerical range can be combined in any way. Furthermore, it is possible to combine two or more non-conflicting embodiments of the embodiments of the present invention described below, and an embodiment that combines two or more embodiments is also an embodiment of the embodiments of the present invention.

[0012] 1. Resin A resin according to one aspect of the present invention (hereinafter sometimes referred to as the "first resin") includes two or more structural units represented by formula (a1), The proportion of each structural unit to the total content of the two or more structural units represented by the above formula (a1) is 0.01 mol% or more (or 0.1 mol% or more, or 1.0 mol% or more), The weight-average molecular weight, as defined by gel permeation chromatography, is between 70,000 and 1,000,000. [ka] [In equation (a1), Ar1 is a group selected from the group consisting of groups represented by the following formulas (Ar-1) to (Ar-3). [ka] (In equations (Ar-1) to (Ar-3), *1 and *2 are bonded to the two oxygen atoms to which Ar1 is bonded, respectively. R 221 ~R 224 One of them, and R 225 ~R 228 One or more pairs consisting of one of the following are They combine with each other to form a monoring, either substituted or unsubstituted, They bond to each other to form substituted or unsubstituted fused rings, or They do not combine with each other. R that does not bond to each other 221 ~R 228 , and R 201 ~R 218 and R p Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. Ring p is an aliphatic hydrocarbon ring with (q+1) ring-forming carbon atoms. q is an integer between 2 and 19. 2q R p They may be the same or different from each other. R 11 ~R 23 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups with 1 to 50 carbon atoms, Unsubstituted alkenyl groups with 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and Selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring.

[0013] Here, in equation (Ar-3), "R 221 ~R 224 One of them, and R 225 ~R 228 This section describes the case where "one or more pairs of elements, each consisting of one of the elements, combine to form a monoring of substitution or non-substitution." "R 221 ~R 224 One of them, and R 225 ~R 228 As for a set consisting of one of the following, R 221 and R 225 The group, R 221 and R 226 The group, R 221 and R 227 The group, R 221 and R 228 The group, R 222 and R 225 The group, R 222 and R 226 The group, R 222 and R 227 The group, R 222 and R 228 The group, R 223 and R 225 The group, R 223 and R 226 The group, R223 and R 227 group, R 223 and R 228 group, R 224 and R 225 group, R 224 and R 226 group, R 224 and R 227 group, R 224 and R 228 groups include. These groups form a ring with only a plurality of atoms of the mother skeleton or with a plurality of atoms of the mother skeleton and one or more arbitrary atoms.

[0014] Two or more of these groups may independently bond to each other to form a substituted or unsubstituted monocyclic ring, or may independently bond to each other to form a substituted or unsubstituted condensed ring. For example, R 221 and R 228 groups bond to each other to form a substituted or unsubstituted monocyclic ring, and at the same time, R 224 and R 225 groups may bond to each other to form a substituted or unsubstituted condensed ring. Also, for example, R 223 and R 224 groups bond to each other to form a substituted or unsubstituted monocyclic ring, and at the same time, R 224 and R 225 groups may bond to each other to form a substituted or unsubstituted monocyclic ring. In this case, R 223 and R 224 ring formed by the group and R 224 and R 225 ring formed by the group share the carbon atom to which R 224 is bonded.

[0015] For example, when the group of R 224 and R 225 bond to each other to form an unsubstituted monocyclic ring with "only a plurality of atoms of the mother skeleton", the group represented by the formula (Ar-3) is the group represented by the following formula (Ar-3-E1). [[ID=​​​

[0016] Also, for example, R 224 and R 225 When these groups bond to each other to form an unsubstituted monoring "with multiple atoms of the parent skeleton and one additional oxygen atom," the group represented by formula (Ar-3) is the same as the group represented by formula (Ar-3-E2). [ka]

[0017] In equation (Ar-3), "R 221 ~R 224 One of them, and R 225 ~R 228 In the case where "one or more pairs of these pairs combine to form a substituted or unsubstituted fused ring," the only difference is that the formed ring is a fused ring, "R 221 ~R 224 One of them, and R 225 ~R 228 The same explanation can be applied as in the case where "one or more pairs of elements, each consisting of one of the elements, can combine to form a substituted or unsubstituted monoring."

[0018] In this specification, "low dielectric constant" means, for example, a dielectric constant of 3.00 or less. In one embodiment, the resin according to one aspect of the present invention has a dielectric constant of 3.00 or less, preferably 2.90 or less, 2.85 or less, 2.80 or less, 2.75 or less, 2.70 or less, 2.65 or less, or 2.60 or less. The dielectric constant of the resin can be measured by the method described in the examples.

[0019] The chemical structures of the resin (first resin) and the second resin described later in this embodiment are determined by infrared spectroscopy (FT-IR), nuclear magnetic resonance (NMR), for example. 1 H-NMR, 13 C-NMR, 19 It can be identified by 1F-NMR or elemental analysis, etc.

[0020] The resin according to this embodiment possesses low dielectric constant, low dielectric loss tangent, and high heat resistance, as well as high mechanical strength, particularly excellent flexural strength. Furthermore, the resin according to this embodiment may also possess high transparency and high solubility. The reason for such effects is not always clear, but as explained by the Clausius-Mosotti relation, a low dielectric constant is achieved due to a small polarizability per unit volume caused by the molecular structure. The dielectric loss tangent depends on the mobility of the dipole within the molecule, which is the origin of the polarizability; the less the dipole moves, the lower the dielectric loss tangent. Heat resistance and mechanical strength are determined by the higher-order structure of the molecular aggregate, but intermolecular interactions and rigidity determined by the primary structure of the molecule may also be involved.

[0021] In this specification, "low dielectric loss tangent" means, for example, that the dielectric loss tangent is 0.0050 or less. In one embodiment, the resin according to one aspect of the present invention has a dielectric loss tangent of 0.0050 or less, preferably 0.0020 or less, 0.0018 or less, 0.0016 or less, 0.0014 or less, 0.0012 or less, or 0.0010 or less. The dielectric loss tangent of the resin can be measured by the method described in the examples.

[0022] In this specification, "high heat resistance" means, for example, a glass transition temperature (T g ) is 250℃ or higher, and the temperature at which the 5% weight loss occurs in air (T in air) d5 ) is 445°C or higher, and the 5% weight loss temperature in a nitrogen atmosphere (T in nitrogen) d5 This means that the temperature is 445°C or higher.

[0023] In one embodiment, the resin according to one aspect of the present invention has a glass transition temperature of 250°C or higher, preferably 255°C or higher, 260°C or higher, 265°C or higher, 270°C or higher, 275°C or higher, 280°C or higher, or 285°C or higher. The upper limit of the glass transition temperature is not particularly limited, but for example, it may be 500°C, 450°C, 400°C, or 350°C.

[0024] In one embodiment, the resin according to one aspect of the present invention has a 5% weight loss temperature in air of 445°C or higher, preferably a 5% weight loss temperature in air of more than 445°C, 450°C or higher, 455°C or higher, 460°C or higher, 465°C or higher, 470°C or higher, 475°C or higher, or 480°C or higher. The upper limit of the 5% weight loss temperature in air is not particularly limited, but is, for example, 800°C, 700°C, or 600°C.

[0025] In one embodiment, the resin according to one aspect of the present invention has a 5% weight loss temperature in a nitrogen atmosphere of 445°C or higher, preferably 450°C or higher, 460°C or higher, 470°C or higher, 480°C or higher, 490°C or higher, or 500°C or higher. The upper limit of the 5% weight loss temperature in a nitrogen atmosphere is not particularly limited, but is, for example, 800°C, 700°C, or 600°C.

[0026] The glass transition temperature of the resin, the 5% weight loss temperature in air, and the 5% weight loss temperature in a nitrogen atmosphere can each be measured by the methods described in the examples.

[0027] In this specification, "having high mechanical strength" means, for example, that the folded portion does not break or shatter in a 360° bending test. A 360° bending test can be performed using the method described in the examples.

[0028] In one embodiment, the resin according to one aspect of the present invention has a number-average molecular weight (Mn) of 20,000 or more and 1,000,000 or less, as defined by gel permeation chromatography.

[0029] The upper limit of the number-average molecular weight may be 1,000,000, 900,000, 800,000, 700,000, 600,000, 500,000, 400,000, 300,000, 200,000, 100,000, 90,000, 80,000, 70,000, 60,000, or 50,000.

[0030] The lower limit of the number-average molecular weight may be 20,000, 22,000, 24,000, 26,000, 28,000, or 30,000.

[0031] In one embodiment, the resin according to one aspect of the present invention has a weight-average molecular weight (Mw) of 70,000 or more and 1,000,000 or less, as defined by gel permeation chromatography. Materials with a weight-average molecular weight (Mw) of 70,000 or higher tend to possess excellent mechanical strength. When the weight-average molecular weight (Mw) is 1,000,000 or less, it is easier to obtain a resin that is desirable in terms of fluidity and solubility.

[0032] The upper limit of the weight-average molecular weight may be 1,000,000, 900,000, 800,000, 700,000, 600,000, 500,000, 400,000, 300,000, 200,000, or 100,000.

[0033] The lower limit of the weight-average molecular weight may be 70,000, 75,000, 80,000, 85,000, 90,000, 95,000, 100,000, 105,000, 110,000, 115,000, or 120,000.

[0034] In one embodiment, the resin according to one aspect of the present invention has a number-average molecular weight defined by gel permeation chromatography of 20,000 or more and 1,000,000 or less. In one embodiment, the resin according to one aspect of the present invention has a weight-average molecular weight defined by gel permeation chromatography of 100,000 or more and 1,000,000 or less. In one embodiment, the resin according to one aspect of the present invention has a number-average molecular weight defined by gel permeation chromatography of 20,000 to 1,000,000, and a weight-average molecular weight of 100,000 to 1,000,000.

[0035] In one embodiment, the resin according to one aspect of the present invention has a molecular weight distribution (Mw / Mn) of 1.0 to 10.0.

[0036] The upper limit of the molecular weight distribution may be 10.0, 9.0, 8.0, 7.0, 6.0, 5.0, 4.0, or 3.0.

[0037] The lower limit of the molecular weight distribution may be 1.0, 1.2, 1.4, 1.6, 1.8, 2.0, 2.2, 2.4, 2.6, 2.8, or 3.0.

[0038] The number-average molecular weight, weight-average molecular weight, and molecular weight distribution can be measured by the method described in the examples.

[0039] The monovalent oxygen-containing group in formula (a1) is not particularly limited as long as it contains oxygen, but examples include groups obtained by oxidizing a substituted or unsubstituted C1-C50 alkyl group, a substituted or unsubstituted C2-C50 alkenyl group, a substituted or unsubstituted C2-C50 alkynyl group, a substituted or unsubstituted ring-forming C3-C50 cycloalkyl group, or a substituted or unsubstituted ring-forming C6-C50 aryl group, to which an oxygen atom is bonded.

[0040] In one embodiment, Ar1 is a group represented by formula (Ar-3).

[0041] In one embodiment, when Ar1 is a group represented by formula (Ar-3), q is 2 to 15, 3 to 13, or 4 to 11.

[0042] In one embodiment, the two or more structural units represented by formula (a1) include a structural unit represented by the following formula (a11). [ka] [In equation (a11), R 11 ~R 23 This is as defined in equation (a1) above. R 101 ~R 104 One of them, and R 105 ~R 108 One or more pairs consisting of one of the following are They combine with each other to form a monoring, either substituted or unsubstituted, They bond to each other to form substituted or unsubstituted fused rings, or They do not combine with each other. R that does not bond to each other 101 ~R 108 , and R 111 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. 10 R 111 They may be the same or they may be different.

[0043] Here, R 101 ~R 104 One of them, and R 105 ~R 108 When one or more pairs consisting of one of the above combine to form a substituted or unsubstituted monoring or fused ring, the "R" in formula (Ar-3) 221 ~R 224 One of them, and R 225 ~R 228The same explanation can be applied to cases where "one or more pairs of one of these forms a monoring or fused ring."

[0044] In one embodiment, R 101 ~R 108 and R 111 Each of them operates independently. Hydrogen atom, or These are substituted or unsubstituted alkyl groups with 1 to 5 carbon atoms.

[0045] In one embodiment, R 11 ~R 23 It is a hydrogen atom.

[0046] In one embodiment, the substituent in formula (a1) when it is referred to as "substituted or unsubstituted" is: Unsubstituted alkyl groups with 1 to 5 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 10 carbon atoms, and It is selected from the group consisting of unsubstituted aryl groups with 6 to 18 carbon atoms forming a ring.

[0047] In one embodiment, the substituent in formula (a1) when referred to as "substituted or unsubstituted" is a methyl group, an ethyl group, an isopropyl group, a cyclohexyl group, or a phenyl group.

[0048] In one embodiment, the structural unit represented by formula (a1) includes the structural unit represented by the following formula (a1-1). [ka]

[0049] In one embodiment, the two or more structural units represented by formula (a1) include one or more structural units selected from the group consisting of structural units represented by the following formulas (a2-1) to (a2-15). [ka] [ka] [ka] [ka]

[0050] In one embodiment, the resin according to one aspect of the present invention comprises a structural unit represented by formula (a1-1) and one or more structural units selected from the group consisting of structural units represented by formulas (a2-1) to (a2-15).

[0051] In one embodiment, the resin according to one aspect of the present invention is represented by the following formula (1). [ka] [In equation (1), Ar1 and R 11 ~R 23 This is as defined in equation (a1) above. Ar2 is a group selected from the group consisting of the groups represented by the formulas (Ar-1) to (Ar-3) above. However, Ar1 and Ar2 are distinct from each other. R 31 ~R 43 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups with 1 to 50 carbon atoms, Unsubstituted alkenyl groups with 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and The group is selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring. m ranges from 0.001 to 0.999. n is between 1 and 400. If there are multiple structures within parentheses relating to n, the m within each of the parentheses relating to n may be the same or different from each other.

[0052] In equation (1), the structure within the parentheses relating to n is: In addition to the case where a block consisting of m consecutive structural units within the parentheses related to m is combined with a block consisting of (1-m) consecutive structural units within the parentheses related to (1-m), When a block with j1 consecutive structural units in parentheses related to m is combined with a block with k1 consecutive structural units in parentheses related to (1-m), a block with j2 consecutive structural units in parentheses related to m, a block with k2 consecutive structural units in parentheses related to (1-m), a block with j3 consecutive structural units in parentheses related to m, and a block with k3 consecutive structural units in parentheses related to (1-m) (provided that m = j1 + j2 + j3 and (1-m) = k1 + k2 + k3), This includes cases where m structural units within parentheses relating to m and (1-m) structural units within parentheses relating to (1-m) are randomly arranged and combined.

[0053] The statement "Ar1 and Ar2 are different" includes cases where their chemical structural formulas (frameworks) are different, cases where their chemical structural formulas (frameworks) are the same but their steric relationships and atomic bonding order are different (they are isomers), and cases where their chemical structural formulas (frameworks) are the same but they contain different isotopes, etc.

[0054] For example, if Ar1 is a group represented by formula (Ar-1) and Ar2 is a group represented by formula (Ar-2), then Ar1 and Ar2 are different from each other.

[0055] Furthermore, for example, when both Ar1 and Ar2 are groups represented by formula (Ar-1), R in Ar1 201 and R in Ar2 201 If they are not the same, R in Ar1 202 and R in Ar2 202 If they are not the same, R in Ar1 203 and R in Ar2 203 If they are not the same, R in Ar1 204 and R in Ar2 204 If they are not the same, R in Ar1 205 and R in Ar2 205 If they are not the same, R in Ar1 206 and R in Ar2 206 If they are not the same, R in Ar1 207 and R in Ar2 207 If they are not the same, R in Ar1 208 and R in Ar2 208 If they are not the same, R in Ar1 209 and R in Ar2 209 If they are not the same, R in Ar1 210 and R in Ar2 210 If they are not the same, then Ar1 and Ar2 are different from each other.

[0056] If Ar1 and Ar2 are different from each other, then R in Ar1 201 ~R 218 , R 221 ~R 228 , and R p And, R in Ar2 201 ~R 218 , R 221 ~R 228 , and R p These elements may be identical to each other, or they may be different.

[0057] The lower limit of m in equation (1) may be 0.001, 0.002, 0.005, 0.010, 0.020, 0.050, 0.100, 0.200, 0.300, 0.400, or 0.500. The upper limit of m in equation (1) may be 0.999, 0.998, 0.995, 0.990, 0.980, 0.950, 0.900, 0.800, 0.700, 0.600, or 0.500.

[0058] In equation (1), n ​​represents the average degree of polymerization in the resin.

[0059] In this specification, "average degree of polymerization" means the average value of the degree of polymerization of the structural units contained in the resin. The upper limit of n may be 400, 350, 300, 250, or 200. The lower limit of n may be 1, 2, 5, 10, 20, or 50. The average degree of polymerization can be measured by the method described in the examples.

[0060] In one embodiment, the resin according to one aspect of the present invention is represented by the following formula (1-1). [ka] [In equation (1-1), Ar1 and R 11 ~R 23 This is as defined in equation (a1) above. Ar2 is a group selected from the group consisting of the groups represented by the formulas (Ar-1) to (Ar-3) above. However, Ar1 and Ar2 are distinct from each other. R 31 ~R 43 Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups with 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups with 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, or It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups with 1 to 50 carbon atoms, Unsubstituted alkenyl groups with 2 to 50 carbon atoms, Unsubstituted alkynyl groups with 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, and The group is selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring. m is between 0.001 and 0.999.

[0061] In equation (1-1), "there are multiple Ar1, Ar2, R 11 ~R 23 , and R 31 ~R 43 "Each of them is identical" means, Multiple instances of Ar1 are identical. Multiple existing Ar2 molecules are identical. Multiple Rs exist 11 They are identical, Multiple Rs exist 12 They are identical, Multiple Rs exist 13 They are identical, Multiple Rs exist 14 They are identical, Multiple Rs exist 15 They are identical, Multiple Rs exist 16 They are identical, Multiple Rs exist 17 They are identical, Multiple Rs exist 18 They are identical, Multiple Rs exist 19 They are identical, Multiple Rs exist 20 They are identical, Multiple Rs exist 21 They are identical, Multiple Rs exist 22 They are identical, Multiple Rs exist 23 They are identical, Multiple Rs exist 31 They are identical, Multiple Rs exist 32 They are identical, Multiple Rs exist 33 They are identical, Multiple Rs exist 34 They are identical, Multiple Rs exist 35 They are identical, Multiple Rs exist 36 They are identical, Multiple Rs exist 37 They are identical, Multiple Rs exist 38 They are identical, Multiple Rs exist 39 They are identical, Multiple Rs exist 40 They are identical, Multiple Rs exist 41 They are identical, Multiple Rs exist 42 They are identical, and Multiple Rs exist 43 "Same" means identical.

[0062] The lower limit of m in equation (1-1) may be 0.001, 0.002, 0.005, 0.010, 0.020, 0.050, 0.100, 0.500, 0.800, or 0.900. The upper limit of m in equation (1-1) may be 0.999, 0.995, 0.990, 0.950, 0.900, 0.800, 0.700, 0.600, 0.500, 0.200, 0.100, or 0.010.

[0063] In one embodiment, 50% or more by mass of the resin according to one aspect of the present invention, 60% or more by mass, 70% or more by mass, 80% or more by mass, 90% or more by mass, 95% or more by mass, 98% or more by mass, 99% or more by mass, or substantially 100% by mass is a structural unit represented by formula (a1). Furthermore, if it is "substantially 100% by mass," it may contain unavoidable impurities.

[0064] In one embodiment, 50% or more by mass of a resin according to one aspect of the present invention is 60% or more by mass, 70% or more by mass, 80% or more by mass, 90% or more by mass, 95% or more by mass, 98% or more by mass, 99% or more by mass, or substantially 100% by mass is one or more structural units selected from the group consisting of structural units represented by formula (a1-1) and structural units represented by formulas (a2-1) to (a2-15).

[0065] In one embodiment, a resin according to one aspect of the present invention can be synthesized by following the examples and using known alternative reactions or raw materials suited to the target product.

[0066] 2.Resin composition A resin composition according to one aspect of the present invention further comprises, in addition to the resin according to one aspect of the present invention described above (the first resin), one or more selected from the group consisting of a second resin and additives. The second resin may be one or more resins selected from the group consisting of epoxy resins, bismaleimide resins, and cyanate resins. Examples of additives include one or more selected from the group consisting of inorganic fillers, modifiers, flame retardants, coupling agents, mold release agents, organic solvents, pigments, talc, fillers, and curing accelerators.

[0067] While there are no particular limitations on the epoxy resin, examples of epoxy resins that yield molded articles with excellent heat resistance include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol sulfide type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, polyhydroxynaphthalene type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, biphenyl novolac type epoxy resin, and naphthol novolac. Epoxy resins such as naphthol aralkyl epoxy resins, naphthol-phenol copolymer novolac epoxy resins, naphthol-cresol copolymer novolac epoxy resins, biphenyl-modified phenol epoxy resins (polyvalent phenol epoxy resins in which a phenol skeleton and a biphenyl skeleton are linked by a bismethylene group), biphenyl-modified naphthol epoxy resins (polyvalent naphthol epoxy resins in which a naphthol skeleton and a biphenyl skeleton are linked by a bismethylene group), alkoxy-group-containing aromatic ring-modified novolac epoxy resins (compounds in which a glycidyl group-containing aromatic ring and an alkoxy-group-containing aromatic ring are linked by formaldehyde), phenylene ether epoxy resins, naphthylene ether epoxy resins, aromatic hydrocarbon formaldehyde resin-modified phenol resin epoxy resins, or xanthene epoxy resins may be used. These may be used individually or in combination of two or more types. When epoxy resin is included, it is easier to obtain a resin composition with excellent heat resistance, mechanical properties, and dielectric properties.

[0068] The bismaleimide resin is not particularly limited, but in terms of obtaining a molded article with excellent heat resistance, for example, diphenylmethane-type bismaleimide resin, metaphenylene-type bismaleimide resin, bisphenol A diphenyl ether-type bismaleimide resin, diphenyl ether-type bismaleimide resin, diphenyl sulfone-type bismaleimide resin, diphenoxybenzene-type bismaleimide resin, or aniline novolac-type bismaleimide resin may be used. These may be used individually or in combination of two or more types.

[0069] While the cyanate resin is not particularly limited, for example, bisphenol A type cyanate resin, tetramethylbisphenol F type cyanate resin, hexafluorobisphenol A type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, novolac type cyanate resin, cyclopentadienylbisphenol type cyanate resin, etc., may be used, as they provide molded articles with excellent heat resistance. These may be used individually or in combination of two or more types.

[0070] Examples of inorganic fillers include fused silica, crystalline silica, alumina, silicon nitride, aluminum hydroxide, or magnesium hydroxide. When the resin composition is used for applications such as conductive pastes or conductive films, conductive fillers such as silver powder or copper powder can be used as inorganic fillers.

[0071] As a modifier, for example, phenoxy resin, polyamide resin, polyimide resin, polyetherimide resin, polyethersulfone resin, polyphenylene ether resin, polyphenylene sulfide resin, polyester resin, polystyrene resin, or polyethylene terephthalate resin, cycloolefin resin, fluororesin, etc. may be used.

[0072] Examples of flame retardants that can be used include halogen compounds, phosphorus-containing compounds, nitrogen-containing compounds, or inorganic flame retardants. For example, halogen compounds such as tetrabromobisphenol A type epoxy resin and brominated phenol novolac type epoxy resin; phosphate esters such as trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri-2-ethylhexyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, tris(2,6-dimethylphenyl) phosphate, and resorcinol diphenyl phosphate; phosphorus atom-containing compounds such as ammonium polyphosphate, polyphosphate amide, red phosphorus, guanidine phosphate, and dialkylhydroxymethylphosphonate condensed phosphoric acid or ester compounds; nitrogen atom-containing compounds such as melamine; and inorganic flame retardants such as aluminum hydroxide, magnesium hydroxide, zinc borate, or calcium borate may be used.

[0073] Examples of coupling agents that can be used include silane coupling agents, titanate coupling agents, zirconate coupling agents, chlorosilane coupling agents, vinyl acetate coupling agents, and fluorine-based coupling agents.

[0074] Examples of release agents that can be used include silicone-based release agents, fluorine-based release agents, wax-based release agents, surfactant-based release agents, water-soluble release agents, oil-based release agents, powder release agents, polymer-based release agents, and semi-permanent release agents.

[0075] As the organic solvent, any solvent capable of dissolving the resin or resin composition according to one aspect of the present invention and forming a varnish can be appropriately selected. For example, known organic solvents such as alcoholic solvents, ketones, acetate esters, carbitols, aromatic hydrocarbons, dimethylformamide, dimethylacetamide, or N-methylpyrrolidone can be used. Among these, propylene glycol monomethyl ether acetate, cyclohexanone, or methyl ethyl ketone can be used. When an organic solvent is mixed in, the resin or resin composition according to one aspect of the present invention becomes varnish-like, making it easier to apply to other components. The amount of organic solvent added can be appropriately adjusted depending on the composition of the resin or resin composition according to one aspect of the present invention, but for example, a range in which the non-volatile content is 50 to 70% by mass relative to the total mass of the resin or resin composition according to one aspect of the present invention is possible.

[0076] Examples of pigments that can be used include various inorganic pigments, various organic pigments, and special pigments (fluorescent pigments, metallic pigments, pearl pigments).

[0077] Examples of talc that can be used include natural talc, finely ground talc, reinforced talc, and coated talc.

[0078] Examples of fillers that can be used include various inorganic fillers, various organic fillers, carbon black, metal fillers, and nanofillers.

[0079] As a curing accelerator, any compound capable of accelerating the curing of a resin or resin composition according to one aspect of the present invention can be used as appropriate. For example, imidazoles, tertiary amines, acid anhydrides, or tertiary phosphines can be used. When a curing accelerator is mixed in, the curing reaction of the resin or resin composition according to one aspect of the present invention proceeds rapidly, making it easier to manufacture molded articles. The amount of curing accelerator added can be appropriately adjusted depending on the composition of the resin or resin composition according to one aspect of the present invention, but for example, it can be in the range of 0.01 to 2% by mass relative to the total mass of the resin or resin composition according to one aspect of the present invention.

[0080] In one embodiment, a resin composition according to one aspect of the present invention contains a first resin and a second resin and / or additive in an amount of 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass. Furthermore, if it is "substantially 100% by mass," it may contain unavoidable impurities.

[0081] In one embodiment, a resin composition according to one aspect of the present invention contains 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, 95% by mass or more, 98% by mass or more, or 99% by mass or more of the first resin.

[0082] Resins and resin compositions according to one aspect of the present invention are preferably used in printed circuit boards, flexible printed circuit boards, sheets for laminated substrates, laminated substrates comprising two or more sheets for laminated substrates, encapsulants for electronic components, resist inks, conductive pastes, insulating materials, or insulating boards. Resins and resin compositions according to one aspect of the present invention have sufficiently low dielectric constant and dielectric loss tangent, making them suitable for use in these components. Furthermore, they are particularly suitable for use in these components in equipment that uses high-frequency electromagnetic waves.

[0083] More specifically, the resin and resin composition according to one aspect of the present invention can be used as a resin composition for copper-clad laminates, an interlayer insulating material for build-up printed circuit boards, or a build-up film. It can also be used as a resin composition for encapsulating electronic components, a resin composition for resist inks, a binder for friction materials, a conductive paste, a resin casting material, an adhesive, or a coating material such as an insulating paint.

[0084] The resin and resin composition according to one aspect of the present invention are preferably used as insulating materials between layers of a laminated substrate.

[0085] In one embodiment, the resin and resin composition according to one aspect of the present invention are in the form of a film or a sheet. The film-shaped resin and resin composition can be used, for example, as a laminated substrate.

[0086] The laminated substrate film of this embodiment has an insulating material containing a resin or resin composition according to one aspect of the present invention on at least one surface. Multiple of these laminated substrate films can be laminated together to form a laminated substrate.

[0087] In one embodiment, the film for the laminated substrate consists of a film layer, described later, and an insulating layer having an insulating material. The insulating layer is provided on at least one surface of the film layer by a manufacturing method described later.

[0088] The film layer can be constructed using appropriately selected film materials, such as resin films or metal films. Specifically, it can be formed using polyethylene, polypropylene, polyvinyl chloride, polycycloolefin, polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polyimide, release paper, copper foil, aluminum foil, etc.

[0089] The thickness of the film for the laminated substrate in this embodiment is not particularly limited, but can be selected from a range of 10 to 150 μm, and is preferably in the range of 25 to 50 μm.

[0090] The laminated substrate film of this embodiment may further have a protective film on its surface. The protective film prevents dust and other debris from adhering to the surface of the film layer and insulating layer before use, and prevents scratches from occurring, thereby preventing a decrease in performance such as insulation before use. The constituent material of the protective film may be selected from the same materials as those used for the film layer described above. The thickness of the protective film may be in the range of 1 to 40 μm.

[0091] Furthermore, the film for the laminated substrate and the protective film may be treated with a matte finish, corona treatment, or release treatment.

[0092] Furthermore, when a laminated substrate is a conductive laminated substrate or a build-up printed circuit board, and a conductive layer made of a conductor such as metal and an insulating layer are laminated together, the combination of the conductive layer and the insulating layer may constitute the film for the laminated substrate.

[0093] The resin and resin composition according to one aspect of the present invention possess low dielectric constant, low dielectric loss tangent, and high heat resistance, as well as high mechanical strength, making them extremely useful as interlayer insulating materials for laminated substrates comprising two or more laminated substrate films. Such insulating materials particularly include the resin according to one aspect of the present invention (first resin) and an epoxy resin, bismaleimide resin, or cyanate resin (second resin), and can be manufactured by further incorporating organic solvents and curing accelerators as needed.

[0094] (Method of manufacturing film for laminated substrates) In one embodiment, a method for manufacturing a laminated substrate film includes the step of applying an insulating material containing a resin or resin composition according to one aspect of the present invention to at least one surface of a resin film. This makes it possible to obtain a laminated substrate film containing a resin or resin composition according to one aspect of the present invention.

[0095] Specifically, a varnish-like resin or resin composition, prepared using the aforementioned organic solvent, is applied to at least one surface of a resin film. Then, the organic solvent is evaporated by heating or blowing hot air to form an insulating layer, thereby enabling the manufacturing process.

[0096] Here, it is preferable that the varnish-like resin or resin composition has a non-volatile content of 30 to 60% by mass excluding volatile components such as organic solvents. When it is within this range, the coating property of the above-mentioned formulation onto the film and the moldability of the film for a laminated substrate are likely to be excellent.

[0097] The thickness of the formed insulating layer is preferably equal to or greater than the thickness of the conductor layer of the circuit board on which the laminated substrate is to be installed, which will be described later. Assuming that the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the resin or resin composition layer preferably has a thickness of 10 to 100 μm.

[0098] (Method for manufacturing a laminated substrate) [[ID=**10**]]In one embodiment, the method for manufacturing a laminated substrate includes a step of laminating two or more of the above-mentioned films for a laminated substrate. Thereby, a laminated substrate including the resin or resin composition according to one aspect of the present invention can be obtained.

[0099] When manufacturing a printed wiring board using the laminated substrate obtained in this embodiment, if the film for the laminated substrate is protected by a protective film, after peeling these, for example, by laminating on one or both sides of the circuit board by a vacuum lamination method or the like so that the layer is directly in contact with the circuit board. The lamination method may be a batch type or a continuous type using a roll. Also, the film and the circuit board may be heated (preheated) as necessary before performing the lamination.

[0100] When manufacturing a conductor laminated substrate, it may be formed by the following procedure. That is, a varnish-like resin or resin composition is impregnated into a fiber base material and heated at a heating temperature according to the type of solvent used, preferably 50 to 170 °C, to obtain an insulating layer of a prepreg that is a cured product. As the fiber base material, paper, glass cloth, glass non-woven fabric, aramid paper, aramid cloth, matted glass, or glass roving cloth can be used. At this time, the blending ratio of the resin or resin composition used and the fiber base material is usually preferably adjusted so that the resin content in the prepreg is 20 to 60% by mass.

[0101] The obtained prepregs are laminated, and a film of a material that will become a conductive layer, such as copper foil, is then layered on top and heat-pressed to obtain the desired conductive plate laminate substrate. Specifically, the heat-pressing method is performed under pressure of 1 to 10 MPa at a temperature of 170 to 250°C. Furthermore, it is preferable to perform the heat-pressing for 10 minutes to 3 hours.

[0102] When using the above-mentioned laminated substrate film as a build-up printed circuit board, the laminated substrate and printed circuit board may be formed by the following procedure. That is, a resin or resin composition is applied to a wiring board with a circuit formed on it using a spray coating method or a curtain coating method, and then cured. Next, holes such as predetermined through-holes are drilled as needed, then the surface is treated with a roughening agent, and the surface is washed with hot water to form irregularities, and then plated with a metal such as copper. Electroless plating or electrolytic plating is preferred as the plating method. As a roughening agent, an oxidizing agent, alkali, or organic solvent can be used. By repeating this operation sequentially as desired, an insulating layer and a conductor layer of a predetermined circuit pattern can be alternately built up to obtain a build-up substrate. However, it is preferable to drill through-holes after the formation of the outermost insulating layer. Furthermore, it is also possible to create a roughened surface and omit the plating process by heating and pressing a resin-coated copper foil, which has been partially cured with the resin or resin composition on a copper foil, onto a wiring board with a circuit formed on it at 170 to 250°C, thereby producing a build-up substrate.

[0103] (Method of manufacturing encapsulating material for electronic components) In one embodiment, a method for manufacturing an electronic component encapsulant includes a step of mixing a resin according to one aspect of the present invention (first resin), an epoxy resin, a bismaleimide resin, or a cyanate resin (second resin), and other additives such as coupling agents and / or release agents, or inorganic fillers, which are added as needed. This makes it possible to obtain an electronic component encapsulant containing a resin or resin composition according to one aspect of the present invention.

[0104] To obtain an encapsulant for electronic components, for example, one method involves pre-mixing a resin according to one aspect of the present invention (first resin), an epoxy resin, bismaleimide resin, or cyanate resin (second resin), and other additives such as coupling agents and / or release agents, as well as inorganic fillers, as needed, and then thoroughly mixing them using an extruder, kneader, rolls, etc., until uniform. When used as a tape-shaped encapsulant for semiconductors, one method involves heating the resin or resin composition to produce a semi-cured sheet, forming an encapsulant tape, placing this encapsulant tape on a semiconductor chip, heating it to 100-150°C to soften and mold it, and then completely curing it at 170-250°C.

[0105] (Method for producing resist ink composition) In one embodiment, the method for producing a resist ink composition includes a step of mixing a resin according to one aspect of the present invention (first resin), an epoxy resin, a bismaleimide resin, or a cyanate resin (second resin), and further an organic solvent, a pigment, talc, or a filler. This yields a resist ink composition containing a resin or resin composition according to one aspect of the present invention. The resulting resist ink can be applied to a printed circuit board, for example, by a screen printing method, to obtain a cured resist ink product.

[0106] Examples of organic solvents used here include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, cyclohexanone, dimethyl sulfoxide, dimethylformamide, dioxolane, tetrahydrofuran, propylene glycol monomethyl ether acetate, or ethyl lactate.

[0107] (Method of manufacturing insulating material) In one embodiment, a method for manufacturing an insulating material includes the steps of mixing a resin according to one aspect of the present invention (first resin) with an epoxy resin, a bismaleimide resin, or a cyanate resin (second resin) with a curing accelerator and a silane coupling agent, and applying the resulting mixture.

[0108] The method for applying the mixture is not particularly limited, and conventionally known methods can be used. For example, spin coating is one such method.

[0109] This provides an insulating material containing a resin or resin composition according to one aspect of the present invention. For example, it can be used as an insulating material between layers of a semiconductor. In this case, since the cured coating film will be in direct contact with the semiconductor, it is preferable to make the coefficient of thermal expansion of the insulating material as close as that of the semiconductor to prevent cracks from occurring due to differences in coefficient of thermal expansion in high-temperature environments.

[0110] (Method of manufacturing conductive paste) In one embodiment, the method for producing a conductive paste includes the step of dispersing fine conductive particles in a resin or resin composition according to one aspect of the present invention. This yields a conductive paste containing a resin or resin composition according to one aspect of the present invention. The resulting anisotropic conductive film composition can be used, for example, as a circuit connection paste resin composition or anisotropic conductive adhesive that is liquid at room temperature.

[0111] 3. Molded body A molded article according to one aspect of the present invention is formed by molding a resin or resin composition according to one aspect of the present invention.

[0112] The method for molding a resin or resin composition according to one aspect of the present invention is not particularly limited, and conventionally known methods can be used. In one embodiment, a method for molding a resin or resin composition according to one aspect of the present invention includes a step of heating and melting the resin or resin composition according to one aspect of the present invention. For example, when a heat-melted resin or resin composition is subjected to extrusion molding, press molding, or the like, a molded body having a film shape, a sheet shape, or the like can be produced.

[0113] The molded body according to this aspect can be used, for example, in devices that transmit and receive electromagnetic waves with a frequency of 0.1 to 500 GHz. Specifically, the molded body according to this aspect is preferably used in devices that transmit and receive electromagnetic waves of microwaves or millimeter waves. Here, generally, microwaves refer to electromagnetic waves with a frequency of 0.25 to 100 GHz, and millimeter waves refer to electromagnetic waves with a frequency of 30 to 300 GHz.

[0114] The molded body according to this aspect can also be suitably used in devices that use electromagnetic waves with frequencies such as 60 GHz used in wireless LAN and 75 to 79 GHz used in vehicle radars.

[0115] The molded body according to this aspect has a sufficiently low dielectric constant and dielectric loss tangent, and is particularly suitable for use with high-frequency electromagnetic waves.

[0116] Further, the molded body according to this aspect may be included in a printed wiring board, a flexible printed wiring board, a sheet for a laminated substrate, a laminated substrate having two or more sheets for a laminated substrate, a sealing material for electronic components, a resist ink, a conductive paste, an insulating material, or an insulating board.

[0117] 4. Method for manufacturing a molded body A method for manufacturing a molded body according to an aspect of the present invention (also referred to as "manufacturing method according to an aspect of the present invention" or "manufacturing method according to this aspect") includes a step of heating and melting a resin or resin composition according to an aspect of the present invention.

[0118] For example, when a heat-melted resin or resin composition is subjected to extrusion molding, press molding, or the like, a molded body having a film shape, a sheet shape, or the like can be produced.

[0119] Regarding the molded body manufactured by the manufacturing method according to this aspect, the matters described for the molded body according to an aspect of the present invention described above can be applied. For example, a molded article manufactured by the manufacturing method according to this embodiment can be used to manufacture equipment that transmits and receives electromagnetic waves with frequencies of 0.1 to 500 GHz. [Examples]

[0120] The following describes embodiments of the present invention, but the present invention is not limited to these embodiments.

[0121] (Example 1) 1. Manufacturing of resins (1) Synthesis of triazine monomer (2,4-bis(4-fluorophenyl)-2-phenyl-1,3,5-triazine) In a three-necked flask (100 mL) equipped with a stirring bar and a nitrogen gas inlet tube, 7.460 g of 4-fluorobenzamidine hydrochloride, 42.73 mmol of benzylideneaniline, 3.625 g of benzylideneaniline, 3.781 g of sodium bicarbonate, and 35 mL of N,N-dimethylformamide (DMF) were added. The mixture was gradually heated to 85°C and reacted at 85°C for 96 hours. After that, it was allowed to cool to room temperature. The resulting reaction solution was added to distilled water, and chloroform was added. The chloroform solution was washed three times with distilled water using a separatory funnel. The recovered chloroform solution was concentrated using an evaporator, then added to methanol (500 mL) to precipitate the crude product. The precipitated crude product was collected by suction filtration, washed under reflux with methanol, and dried under reduced pressure at room temperature to obtain a crude product of brown needle-shaped crystals (1.61 g, 23.3%). The obtained crude product was recrystallized in a mixed solvent of chloroform and methanol, and dried under reduced pressure at 80°C for 24 hours to obtain the target product.

[0122] The obtained target product had the following characteristics: shape: white needle-shaped crystals, yield: 1.46 g, yield: 21.1%, melting point: 258-259°C.

[0123] The analysis results for this object are: FT-IR (KBr, cm) -1):3051(Ar-H), 1603(C=C), 1522(C=N), 1508(C=C), 1370(C=N), 1228(Ar-F) 1 H-NMR (CDCl3, ppm): 8.78~8.73(m, 6H), 7.61(t, 1H), 7.57(t, 2H), 7.26~7.23(m, 4H) 13 C-NMR (CDCl3, ppm): 171.74, 170.75, 165.93, 136.06, 132.78, 132.35, 131.38, 128.89, 115.83 19 F-NMR (CDCl3, ppm): 108.41 Elemental analysis (C 21 H 13 F2N3): Calculated values ​​were C=73.03%, H=3.79%, N=12.17%. Measured values ​​were C=73.02%, H=3.89%, N=12.40%.

[0124] Based on the analysis results, the target product obtained was identified as the following triazine monomer (2,4-bis(4-fluorophenyl)-2-phenyl-1,3,5-triazine). [ka]

[0125] (2) Synthesis of resins In a two-necked flask (100 mL) equipped with a stirring bar and a nitrogen gas inlet tube, the triazine monomer synthesized in (1) above (3.4535 g, 10.0 mmol) and 3,3,5-trimethyl-1,1-bis(4-hydroxyphenyl)cyclohexane (bisphenol monomer 1: molecular weight 310.44, 1.5522 g, 5.00 mmol) and 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (bisphenol monomer 2: molecular weight 270.37, 1.3519 g, 5.00 mmol) were added as bisphenol monomers. Potassium carbonate (1.6670 g, 12.0 mmol), N-methyl-2-pyrrolidone (NMP, 25 mL) as a polar solvent, and toluene (50 mL) as an inert solvent were added to obtain the raw material mixture.

[0126] The structure of the 3,3,5-trimethyl-1,1-bis(4-hydroxyphenyl)cyclohexane used is shown below. [ka]

[0127] The structure of 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl used is shown below. [ka]

[0128] A Dean-Stark trap and a Liebig condenser were attached to a two-necked flask, and the flask was subjected to a nitrogen gas atmosphere. The raw material mixture was gradually heated to 150°C while stirring, and toluene was refluxed at 150°C for 2 hours to remove water using the Dean-Stark trap. The mixture was then heated to 190°C and stirred for 1 hour to remove toluene. The mixture was then stirred at 190°C for 3 hours to carry out the polymerization reaction. The reaction mixture was allowed to cool to room temperature to obtain a brown, viscous polymerization solution. The polymerization solution was poured into methanol to precipitate the polymer, which was then collected, washed with hot methanol, and dried under reduced pressure at room temperature to obtain the crude product (crude yield: 6.2554 g, crude yield: 105%). The obtained crude product was dissolved in NMP and re-precipitated by pouring into methanol to precipitate a white, flaky resin. After collecting the precipitated resin, it was dried under reduced pressure at room temperature to obtain the purified product (yield: 5.8979 g, yield: 99%).

[0129] (3) Analysis of resins (i) Number average molecular weight, weight average molecular weight, molecular weight distribution The molecular weight of the obtained purified product was measured by gel permeation chromatography (GPC). The specific procedure is as follows: 5 mg of the purified product was mixed with 10 mL of NMP solution containing 0.01 M LiBr and stirred. The stirred solution was filtered through a 0.45 μm aperture filter, and the resulting filtrate was used as the measurement solution.

[0130] GPC measurements were performed using two Shodex GPC KF-806M columns manufactured by Resonaq Corporation under the following conditions. [GPC measurement conditions] Eluent: NMP solution containing 0.01M LiBr Flow rate: 0.7mL / min Column temperature: 60℃ Injection volume: 100μL UV detection wavelength: 270nm

[0131] For molecular weight, calibration curves were created using standard polystyrene at more than 10 levels in the molecular weight range of 500 to 4,500,000, and the weight-average molecular weight (Mw), number-average molecular weight (Mn), and molecular weight distribution (Mw / Mn) were calculated in polystyrene equivalent.

[0132] The purified product obtained had a number-average molecular weight (Mn) of 34,600, a weight-average molecular weight (Mw) of 121,600, and a molecular weight distribution (Mw / Mn) of 3.51.

[0133] (ii) Average degree of polymerization The average degree of polymerization n in equation (1) was calculated for the obtained purified product as follows.

[0134] In the synthesis of the above resin, a polymerization reaction was carried out using triazine monomer (10.0 mmol) and the bisphenol monomers 3,3,5-trimethyl-1,1-bis(4-hydroxyphenyl)cyclohexane (5.00 mmol) and 4,4'-dihydroxy-2,2',3,3',5,5'-hexamethylbiphenyl (5.00 mmol). Therefore, it was estimated that the following structural unit (A), corresponding to the structural unit in parentheses related to m in formula (1), and the following structural unit (B), corresponding to the structural unit in parentheses related to (1-m) in formula (1), are contained in the purified product in a 1:1 ratio. [ka]

[0135] Therefore, the molecular weight of the repeating units in the purified product was estimated as follows, based on the molecular weight of structural unit (A) of 615.78, the molecular weight of structural unit (B) of 575.71, and the ratio of repeating structural units, m = 0.5. (615.78 × 0.5) + (575.71 × 0.5) = 595.75

[0136] Therefore, by dividing the weight-average molecular weight (Mw) of the purified product, which is 121,600, by the molecular weight of the repeating unit, which is 595.75, the average degree of polymerization n of the purified product, converted to weight-average molecular weight, was determined to be 204.

[0137] 2. Evaluation of resins Using the obtained purified product, a sample for performance evaluation was prepared by the following method, and the dielectric properties of the resin (dielectric constant, dielectric loss tangent) and heat resistance (glass transition temperature: T) were evaluated. g , 5% weight loss Temperature: T in air d5 ,T in nitrogen d5 Performance was evaluated using a mechanical strength test (360-degree bending test). The results are shown in Table 1.

[0138] (1) Preparation of evaluation samples The obtained purified product was vacuum-dried at 200°C for 12 hours, and then pressed at 350°C in a vacuum press to produce sheets measuring 10 cm × 10 cm × 100-200 μm in thickness. The prepared sheets were used as evaluation samples for the following evaluations.

[0139] (2) Dielectric properties evaluation After pre-measuring the film thickness of the evaluation sample with a micrometer, the dielectric constant and dielectric loss tangent were measured using the TM mode (10 GHz) of a dielectric constant / dielectric loss tangent measuring device (cavity resonator type) manufactured by AET Co., Ltd.

[0140] (3) Heat resistance evaluation by differential scanning calorimetry (DSC) (T g ) Measurements were taken using a differential scanning calorimeter DSC7000 manufactured by Hitachi High-Tech Science Corporation, under a nitrogen atmosphere, at a heating rate of 20°C.

[0141] (4) Heat resistance evaluation by thermogravimetric analysis (TGA) (in air) d5 ,T in nitrogen d5 ) Measurements were taken using a differential thermogravimetric analyzer (TG / DTA7220) manufactured by Hitachi High-Tech Science Corporation, at a heating rate of 10°C, under both an air atmosphere and a nitrogen atmosphere.

[0142] (5) Mechanical strength (360-degree bending test) The evaluation sample was folded 180 degrees in the center, then the folded portion was folded in the opposite direction (360 degrees), and it was visually observed whether the folded portion was cut or destroyed, or whether the folded portion only whitened and was not destroyed.

[0143] (Examples 2-6) The resin was produced and evaluated in the same manner as in Example 1, except that the type of bisphenol monomer, the amount used, the polymerization solvent, and the polymerization time were changed as shown in Table 1. The results obtained are shown in Table 1. In Table 1, DMPU refers to dimethylpropylene urea.

[0144] (Comparative Examples 1-4) In Example 1, the resin was produced and evaluated in the same manner as in Example 1, except that the type of bisphenol monomer, the amount used, the polymerization solvent, and the polymerization time were changed as shown in Table 2. In Table 2, DMPU refers to dimethylpropylene urea. In Comparative Examples 1 and 2, the crude products produced during resin synthesis were insoluble in the polymerization solvent, making it impossible to obtain purified products (i.e., resins). In Comparative Examples 3 and 4, resins were successfully produced. The results are shown in Table 2.

[0145] [Table 1] [Table 2]

[0146] The resins of Examples 1 to 6, which contained two or more structural units represented by formula (a1), possessed low dielectric constant, low dielectric loss tangent, and high heat resistance, in addition to high mechanical strength.

[0147] In the production of the resins of Comparative Examples 1 and 2, which contained only one type of structural unit represented by formula (a1), the solubility of the crude product was low, and a purified product could not be obtained. In the production of the resins of Examples 1 to 2 and 5 to 6, which contained the same structural unit as in Comparative Examples 1 and 2 (bisphenol monomer 2) and yet another structural unit (bisphenol monomer 1), the crude product could be dissolved, and a purified product could be obtained.

[0148] Furthermore, the resins of Examples 1 to 6, which contained two or more structural units represented by formula (a1), exhibited particularly superior mechanical strength compared to Comparative Examples 3 and 4, which contained only one structural unit.

Claims

1. It includes two or more structural units represented by formula (a1), The proportion of each structural unit to the total content of the two or more structural units represented by the formula (a1) is 0.01 mol% or more. A resin having a weight-average molecular weight of 70,000 to 1,000,000 as defined by gel permeation chromatography. 【Chemistry 27】 [In equation (a1), Ar １ This is a group selected from the group consisting of groups represented by the following formulas (Ar-1) to (Ar-3). 【Chemistry 28】 (In equations (Ar-1) to (Ar-3), *1 and *2 are Ar １ It bonds to each of the two oxygen atoms to which it is bonded. R ２２１ ~R ２２４ One of them, and R ２２５ ~R ２２８ One or more sets consisting of one of the following are They combine with each other to form a monoring, either substituted or unsubstituted, They bond to each other to form substituted or unsubstituted fused rings, or They do not combine with each other. R that do not combine with each other ２２１ ~R ２２８ and R ２０１ ~R ２１８ and R ｐ are each independently hydrogen atom, Substituted or unsubstituted alkyl groups having 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, It is a substituted or unsubstituted monovalent oxygen-containing group. Ring p is an aliphatic hydrocarbon ring with (q+1) ring-forming carbon atoms. q is an integer between 2 and 19. 2q R ｐ They may be the same or different from each other. R １１ ~R ２３ Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups having 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups having 1 to 50 carbon atoms, Unsubstituted alkenyl groups having 2 to 50 carbon atoms, Unsubstituted alkynyl groups having 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups having 3 to 50 carbon atoms, and Selected from the group consisting of unsubstituted aryl groups with 6 to 50 carbon atoms forming a ring.

2. The resin according to claim 1, wherein the two or more structural units represented by formula (a1) include a structural unit represented by the following formula (a11). 【Chemistry 29】 [In formula (a11), R １１ ~R ２３ This is as defined in formula (a1) above. R １０１ ~R １０４ One of them, and R １０５ ~R １０８ One or more sets consisting of one of the following are They combine with each other to form a monoring, either substituted or unsubstituted, They bond to each other to form substituted or unsubstituted fused rings, or They do not combine with each other. R that do not bond to each other １０１ ~R １０８ , and R １１１ Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups having 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, It is a substituted or unsubstituted monovalent oxygen-containing group. 10 R １１１ They may be the same or they may be different.

3. The resin according to claim 1 or 2, wherein the substituent in the phrase "substituted or unsubstituted" is a methyl group, an ethyl group, an isopropyl group, a cyclohexyl group, or a phenyl group.

4. The resin according to any one of claims 1 to 3, wherein the two or more structural units represented by formula (a1) include a structural unit represented by the following formula (a1-1). 【Transformation 30】

5. The resin according to any one of claims 1 to 4, wherein the two or more structural units represented by formula (a1) include one or more structural units selected from the group consisting of structural units represented by the following formulas (a2-1) to (a2-15). 【Chemistry 31】 【Chemistry 32】 【Transformation 33】 【Transformation 34】

6. The resin according to claim 1, represented by the following formula (1). 【Chemistry 35】 [In equation (1), Ar １ and R １１ ~R ２３ This is as defined in formula (a1) above. Ar ２ is a group selected from the group consisting of groups represented by the above formulas (Ar-1) to (Ar-3). However, Ar １ And, Ar ２ These are different from each other. R ３１ ~R ４３ Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups having 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups having 1 to 50 carbon atoms, Unsubstituted alkenyl groups having 2 to 50 carbon atoms, Unsubstituted alkynyl groups having 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups having 3 to 50 carbon atoms, and It is selected from the group consisting of unsubstituted aryl groups having 6 to 50 carbon atoms in a ring-forming structure. m ranges from 0.001 to 0.

999. n is between 1 and 400. If there are multiple structures within parentheses relating to n, the m within each of the parentheses relating to n may be the same or different from each other.

7. The resin according to claim 1, represented by the following formula (1-1). 【Transformation 36】 [In equation (1-1), Ar １ and R １１ ~R ２３ This is as defined in formula (a1) above. Ar ２ is a group selected from the group consisting of groups represented by the above formulas (Ar-1) to (Ar-3). However, Ar １ And, Ar ２ These are different from each other. R ３１ ~R ４３ Each of them operates independently. hydrogen atom, Substituted or unsubstituted alkyl groups having 1 to 50 carbon atoms, Substituted or unsubstituted alkenyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted alkynyl groups having 2 to 50 carbon atoms, Substituted or unsubstituted ring-forming cycloalkyl groups with 3 to 50 carbon atoms, A substituted or unsubstituted ring-forming aryl group having 6 to 50 carbon atoms, It is a substituted or unsubstituted monovalent oxygen-containing group. When we say "substituted or unsubstituted," the substituent is: Unsubstituted alkyl groups having 1 to 50 carbon atoms, Unsubstituted alkenyl groups having 2 to 50 carbon atoms, Unsubstituted alkynyl groups having 2 to 50 carbon atoms, Unsubstituted ring-forming cycloalkyl groups having 3 to 50 carbon atoms, and It is selected from the group consisting of unsubstituted aryl groups having 6 to 50 carbon atoms in a ring-forming structure. m ranges from 0.001 to 0.

999. However, there are multiple Ar １ Ar ２ , R １１ ~R ２３ , and R ３１ ~R ４３ Each of them is identical.

8. The resin according to any one of claims 1 to 7, wherein the weight-average molecular weight, as defined by gel permeation chromatography, is 100,000 or more and 1,000,000 or less.

9. The resin according to any one of claims 1 to 8, wherein the dielectric constant is 2.7 or less, the dielectric loss tangent is 0.002 or less, and the glass transition temperature is 250°C or higher.

10. A resin composition comprising the resin described in any one of claims 1 to 9.

11. The resin composition according to claim 10, further comprising one or more resins selected from the group consisting of epoxy resins, bismaleimide resins, and cyanate resins.

12. Furthermore, the resin composition according to claim 10 or 11 further comprises one or more selected from the group consisting of inorganic fillers, modifiers, and flame retardants.

13. A molded article obtained by molding a resin according to any one of claims 1 to 9, or a resin composition according to any one of claims 10 to 12.

14. The molded article according to claim 13, which is in the shape of a film or a sheet.

15. A molded body according to claim 13 or 14, used in equipment that transmits and receives electromagnetic waves with a frequency of 0.1 to 500 GHz.

16. A method for producing a molded article according to any one of claims 13 to 15, comprising the step of heating and melting the resin or resin composition.

17. A method for manufacturing equipment that transmits and receives electromagnetic waves with a frequency of 0.1 to 500 GHz, using a molded body according to claim 13 or 14.

18. A printed circuit board, a flexible printed circuit board, a sheet for a laminated substrate, a laminated substrate comprising two or more sheets for a laminated substrate, a sealing material for electronic components, a resist ink, a conductive paste, an insulating material, or an insulating board, comprising a resin according to any one of claims 1 to 9, or a resin composition according to any one of claims 10 to 12.

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