Capacitor and method for manufacturing the same

Abstract

The present invention provides a capacitor with improved lead terminal bending accuracy and vibration resistance, as well as a method for manufacturing the same. [Solution] The capacitor 2 includes an outer case 4, a capacitor element 6, a sealing member 8, a lead terminal 12 extending from the end face of the capacitor element, and a bending portion 14 for bending the lead terminal in a specific direction. It includes an inner notch portion 18 provided inside the bending portion and an outer notch portion 16 provided outside the bending portion. The depth W3 of the inner notch portion and the depth W4 of the outer notch portion are set to the same value, and the bending force is set according to the depth of the notch.

Description

Technical Field

[0001] The technology of the present disclosure relates to a manufacturing technology of a capacitor whose terminals can be bent at a predetermined angle and direction.

Background Art

[0002] When mounting a capacitor on a circuit board, the mounting state of the capacitor can be stabilized by increasing the contact area of the terminals with respect to the mounting surface of the board as much as possible.

[0003] Regarding a capacitor in which a part of the terminal is bent in this way, there is one in which a thin portion is formed in a part of the terminal and the terminal is bent around this thin portion as a rotation center (for example, Patent Documents 1 and 2). Also, there is one in which the terminal is formed in a flat strip shape and a wedge-shaped groove is formed in a part thereof to weaken the spring-back force (for example, Patent Document 3).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] Incidentally, terminals are soldered to the mounting surface of the circuit board while bent at a set bending angle (for example, 90 degrees) to increase the contact area and ensure mounting stability. Therefore, if the bending angle is insufficient compared to the target bending angle, or conversely, if the terminal is bent too much, it becomes difficult to achieve a large contact area between the terminal and the mounting surface of the circuit board. In the bending process of terminals, the elastic force of the material causes it to try to return to its original shape, known as springback, which is one of the reasons why it becomes difficult to bend the terminal to the set angle. With capacitors, for example, to connect the terminals to the circuit board, measures such as applying a high amount of solder are necessary, which leads to increased solder usage and a greater workload for mounting the capacitors. Also, if the bending process is insufficient, attempting to increase the contact area with the circuit board will widen the placement area of ​​the capacitor body, potentially causing contact with other components on the board or making mounting impossible, thus reducing the mountability of the capacitor. Therefore, there is a challenge in that capacitors require terminal structures that minimize springback.

[0006] Furthermore, capacitors used in automobiles are subject to irregular and significant vibrations acting on the mounted circuit board. In this case, the bent portion of the terminal is particularly susceptible to external vibrations because it is the boundary between the part fixed to the circuit board by soldering and the load-bearing part of the capacitor body. Terminals with weak bent portions may break due to metal fatigue caused by vibration, making it difficult for them to function properly. Therefore, there is a need for terminals with a structure that is resistant to breakage even under vibrational conditions.

[0007] The inventors of the technology disclosed herein have found that, in relation to the manufacturing process of a capacitor in which a part of the terminal is bent and mounted on a substrate, by providing a notch portion with conditions such as an opening angle in the bent portion of the terminal, based on an analysis of the terminal material and the mechanics acting on the material during bending, it is possible to suppress springback and prevent a decrease in the vibration resistance of the capacitor.

[0008] Patent documents 1-3 neither disclose nor suggest any solutions to these problems, and the configurations disclosed in these documents cannot solve them.

[0009] Therefore, based on these challenges and findings, the technology disclosed herein provides a capacitor that improves the bending accuracy of its terminals and has vibration resistance, as well as a method for manufacturing the same. [Means for solving the problem]

[0010] To achieve the above objective, one aspect of the capacitor of this disclosure includes a capacitor body, terminals attached to the capacitor body, and a bending portion for bending the terminals in a specific direction, the bending portion including an inner notch portion provided on the inside of the bending portion and an outer notch portion provided on the outside of the bending portion.

[0011] In the capacitor described above, the opening angle of the inner notch before bending the terminal is set to be greater than or equal to the bending angle of the terminal, and the opening angle of the outer notch before bending the terminal is set to a value smaller than the bending angle of the terminal. In the above capacitor, the inner notch and the outer notch are formed on both sides of the terminal with respect to the central axis of the bent portion. In the capacitor described above, the inner notch and the outer notch are formed in the bent portion such that the length of either or both of the inner notch and the outer notch is equal to the thickness of the terminal.

[0012] To achieve the above objective, one aspect of the method for manufacturing a capacitor according to the present disclosure includes the steps of: manufacturing a capacitor body by attaching terminals; forming an inner notch and an outer notch in a bent portion set on a part of the terminal with respect to the bending direction; and bending the terminal in the bending direction at the bent portion.

[0013] In the method for manufacturing the capacitor, the method includes a step of forming the inner notch portion having an opening angle equal to or greater than the bending angle of the terminal on a side surface of the terminal that becomes the bending portion, and a step of forming the outer notch portion having an opening angle smaller than the bending angle of the terminal on the other side surface of the terminal that becomes the bending portion.

Advantages of the Invention

[0014] According to the present disclosure, any one of the following effects can be obtained.

[0015] (1) By forming notch portions on both side surfaces of the bent portion of the terminal corresponding to the bending direction, springback of the terminal can be prevented or suppressed, and bending processing becomes easier, thereby improving processing accuracy.

[0016] (2) By forming notch portions on both side surfaces of the bent portion of the terminal to suppress springback and not applying excessive stress to the terminal during bending processing, processing accuracy is improved, and large plastic deformation does not occur in the bent portion and its peripheral portion, preventing a decrease in the vibration resistance of the terminal.

[0017] (3) By adjusting the opening angles of the inner notch portion and the outer notch portion according to the bending angle of the terminal, suppression of springback during bending processing and maintenance of the vibration resistance of the terminal can be achieved.

[0018] (4) By providing a notch portion on the terminal to improve the processing accuracy of the bent portion, the mounting state with respect to the substrate is stabilized, thereby reducing the amount of solder used during mounting and reducing the load of the mounting operation.

Brief Description of the Drawings

[0019] [Figure 1] It is a diagram showing an example of a capacitor before bending processing according to an embodiment. [Figure 2] It is a diagram showing an example of a capacitor after bending processing. [Figure 3] It is a figure showing an example of a simulation result showing the result of the bending process of the capacitor according to the embodiment. [Figure 4] It is a figure showing a simulation result of the stress distribution during the bending process.

Mode for Carrying Out the Invention

[0020] 〔One Embodiment〕 <Capacitor and Its Manufacturing Method> FIG. 1 is a capacitor before the bending process according to one embodiment, and FIG. 2 shows the capacitor after the bending process. The configurations shown in FIGS. 1 and 2 are examples, and the technology of the present disclosure is not limited to such configurations. In this one embodiment, based on FIGS. 1 and 2, the configuration of the capacitor of the present disclosure and its manufacturing method will be described.

[0021] <Capacitor 2> This capacitor 2 is, for example, as shown in A of FIG. 1, an example of a capacitor using a wound element, and includes a solid electrolytic capacitor using a solid electrolyte as the electrolyte, an aluminum electrolytic capacitor using an electrolytic solution as the electrolyte, a so-called hybrid capacitor using both a solid electrolyte and an electrolytic solution as the electrolyte, and the like. This capacitor 2 has a capacitor element 6 housed in a storage portion of an exterior case 4, and an opening side of the storage portion is sealed with a sealing member 8. The capacitor body of the present disclosure is shown as being composed of, for example, only the capacitor element 6, or a capacitor element 6 housed in the exterior case 4 and sealed with the sealing member 8. The sealing member 8 is composed of an elastically deformable material such as rubber or a resin material, and seals the storage portion in close contact with the inner wall of the exterior case 4. The exterior case 4 is, for example, a bottomed cylindrical container formed of aluminum, and although not shown, a safety valve for preventing rupture of the capacitor body due to gas generated inside the capacitor body may be provided on the bottom surface portion. Then, after the capacitor element 6 and sealing member 8 are inserted into the outer case 4, a crimping process is performed on the outer case 4 by pressing the outer periphery with a jig or the like at a predetermined position from the opening 10 side relative to the position where the sealing member 8 is placed, thereby ensuring a tight seal between the inner wall surface of the outer case 4 and the outer periphery of the sealing member 8.

[0022] <Capacitor element 6> The capacitor element 6 is constructed by stacking and winding a separator between an anode foil and a cathode foil. The anode foil is made of a base foil made of valve metal, and a dielectric oxide film is formed on this base foil by a surface expansion treatment. The surface expansion treatment of the base foil is a treatment that expands the surface of the base foil, for example, by etching the base foil, depositing a vapor-deposited body by depositing valve metal powder on the surface of the base foil, or forming a sintered layer by molding valve metal powder on the surface of the base foil and sintering it. After this surface expansion treatment, the anode foil is formed by generating a dielectric oxide film on the surface of the expanded layer of the base foil by a chemical conversion treatment. The cathode foil, like the anode foil, is a base foil formed of the valve metal described above, and may be subjected to a surface expansion treatment as needed. An oxide film may or may not be formed on the surface expansion layer of the cathode foil. The separator is wound together with the anode and cathode foils. The separator is made of cellulose or synthetic fibers. The separator is wider than the anode and cathode foils and provides insulation between them.

[0023] <Drawer terminal 12> The lead terminal 12 is an example of a terminal of the present disclosure and includes, for example, an anode-side terminal connected to the anode foil of the capacitor element 6 and a cathode-side terminal connected to the cathode foil. The lead terminal 12 is drawn out from the end face of the capacitor element 6. The lead terminal 12 is made of, for example, a highly conductive metal, such as aluminum. The lead terminal 12 is composed of, for example, an aluminum wire and a lead portion formed in the shape of a cylinder, which is a solderable metal wire. In this case, the lead portion is connected to the substrate. The aluminum wire and the metal wire that will become the external terminal are connected by arc welding or the like. The aluminum wire has a roughly cylindrical round bar portion and a flat portion formed by press working or the like on the round bar portion, and the round bar portion has an inclined portion on the flat portion side where the thickness decreases linearly to the thickness of the flat portion. The flat portion is electrically connected to the anode foil or cathode foil by a connection method such as stitch connection. The lead portion protrudes from the opening 10 of the outer casing 4. Alternatively, the lead portion may be absent, and a cylindrical rod portion may protrude from the opening 10 of the outer casing 4. In this case, the cylindrical rod portion protruding from the opening 10 connects to the substrate.

[0024] The lead terminal 12 is formed in at least a columnar shape, and a portion of it becomes a bent portion 14 that is bent in a set direction. The lead terminal 12 has a bending direction set to be the same direction or different directions for the bent portions 14 on the cathode side and anode side. For example, during the manufacturing of the capacitor 2, the lead terminal 12 is bent by applying an external bending force FP according to the set bending direction.

[0025] The bent portion 14 has, for example, as shown in Figure 1B, an outer notch portion 16 on the circumferential surface of the lead terminal 12 on the side where the bending force FP is applied, with the central axis O of the lead terminal 12 as the reference, and an inner notch portion 18 on the opposite side of the outer notch portion 16 via the central axis O. The outer notch portion 16 and the inner notch portion 18 are, for example, opening grooves cut out from the outer circumference of the lead terminal 12 toward the center, and are formed in a wedge shape with a wider opening width on the outer circumference side and an acute angle closer to the central axis O. The outer notch portion 16 and the inner notch portion 18 guide the bending of the lead terminal 12 by changing the opening width in accordance with the bending of the lead terminal 12. In other words, the portion of the lead terminal 12 that is thinned by the outer notch portion 16 and the inner notch portion 18 becomes the bent portion 14 and deforms.

[0026] The outer notch portion 16 and the inner notch portion 18 are formed with opening angles θx1 and θy1, respectively, based on the bending angle θb of the lead terminal 12 (B in Figure 2), and the relationship between these angles is set, for example, as shown in equation (1) below. θx1 < θb ≤ θy1 ···(1) In other words, the lead terminal 12 before bending has an opening angle θy1 of the inner notch portion 18 that is on the inside of the bend, and an opening angle θx1 of the outer notch portion 16 that is on the outside, with respect to the target bending angle θb.

[0027] Furthermore, the outer diameter W2 of the bent portion 14 before bending is such that, for example, with respect to the outer diameter W1 of the lead terminal 12, the depth W3 of the inner notch portion 18 and the depth W4 of the outer notch portion 16 in the direction of the central axis O from the outer circumference of the terminal are related by the following equation (2). W2 = W1 - W3 - W4 ... (2) Furthermore, by setting the depth W3 of the inner notch 18 and the depth W4 of the outer notch 16 to the same value, the center of the bent portion 14 can be positioned on or near the central axis O. In this way, the rigidity of the lead terminal 12 can be adjusted by setting the degree of thinning of the bent portion 14, for example, by the depths of the outer notch 16 and the inner notch 18, and the magnitude of the bending force FP added during the bending process can be set.

[0028] <Manufacturing process for Capacitor 2> In the manufacturing process of capacitor 2, for example, after processes such as anode foil / cathode foil / separator cutting, lead terminal 12 connection, capacitor element 6 winding, chemical conversion, electrolyte impregnation, sealing, exterior processing, and aging, the lead terminal 12 is bent. In addition, the lead terminal 12 may have an outer notch 16 or an inner notch 18 formed in advance at a set position of the lead terminal 12 by means of cutting or other means before the terminal connection process, or it may be formed after the assembly of capacitor 2 and before the bending process. Furthermore, in the bending process of the lead terminal 12, for example, a set bending angle θb and bending force FP may be applied using a jig (not shown) based on a set bending portion 14.

[0029] The capacitor 2 that has undergone the bending process is bent at the bending portion 14, for example, as shown in Figure 2A, so that the tip of the lead terminal 12 is bent at a target bending angle θb. The formation position of the bending portion 14, that is, the formation positions of the outer notch portion 16 and the inner notch portion 18 of the lead terminal 12, may be set, for example, based on the length of the tip of the lead terminal 12 to be bent.

[0030] In the bent portion 14 after the bending process, as shown in Figure 2B, for example, the tip side of the lead terminal 12 is displaced in the direction of the bending angle θb, causing the outer notch portion 16 to widen to an opening angle θx2 and the inner notch portion 18 to decrease to an opening angle θy2. This outer notch portion 16 reduces the tensile stress generated outside the stress center axis of the bending of the lead terminal 12 in relation to the bending. The inner notch portion 18 reduces the compressive stress generated inside the bending center axis. By setting the opening angle θy1 of the inner notch portion 18 to be equal to or larger than the bending angle θb, the inner wall surfaces are in contact or separated in a state where no repulsive force is generated between them due to the bending process, or only a small repulsive force is generated. These tensile and compressive stresses are generated according to the width (thickness) of the bent portion 14 of the lead terminal 12 and the length from the stress center axis to the circumferential surface of the lead terminal 12. The rigidity and elastic force of the lead terminal 12 rebound against these stresses, causing springback and hindering bending to the set bending angle θb.

[0031] In contrast, the capacitor 2 of this disclosure has an outer notch portion 16 and an inner notch portion 18 of predetermined depth formed on the outer and inner sides of the lead terminal 12 in the bending direction, thereby setting the position of the bent portion 14 and thinning it down. This reduces the compressive and tensile stresses in the bent portion 14, as well as the repulsive force against these stresses. Furthermore, by making the bent portion 14 thinner than the outer diameter of the lead terminal 12, the center of bending stress is set to be the same as or close to the central axis O of the lead terminal 12 when a bending force FP is applied from the outside. This suppresses the occurrence of springback and allows for precise bending.

[0032] In addition, in the capacitor 2 of this disclosure, for example, the outer notch portion 16 formed with an opening angle θx1 corresponding to the bending angle θb on the lead terminal 12 suppresses the generation of tensile stress during bending, thereby suppressing the generation of large plastic strain, mainly on the outer side, of the bent portion 14. This plastic strain can weaken the thinned bent portion 14 and affect the vibration resistance of the substrate and the mounting portion of the capacitor 2 against externally applied vibrations. Furthermore, in the capacitor 2 of this disclosure, the bent portion 14 is thinned by forming the outer notch portion 16 and the inner notch portion 18, and the occurrence of springback during bending is suppressed, eliminating the need to bend at an angle larger than the set bending angle or to apply a stronger bending force FP to weaken the elastic deformation during bending. By preventing bending at such excessive angles or with bending force FP, large plastic strain is not generated in the bent portion 14, and the weakening of the bent portion 14 of the lead terminal 12 is prevented.

[0033] [Effects of one embodiment] With this configuration, one of the following effects can be obtained. (1) By forming an outer notch portion 16 and an inner notch portion 18 at predetermined positions on the lead terminal 12, springback can be prevented or suppressed in the bent portion 14 during the bending process, thereby improving the bending accuracy of the lead terminal 12.

[0034] (2) Notches are formed on both sides of the lead terminal 12 to guide the bending process and suppress springback, and by not applying excessive force to the lead terminal 12 during the bending process, the processing accuracy is improved, and large plastic strain does not occur in the bent part or its surrounding area, thereby preventing a decrease in the vibration resistance of the lead terminal 12.

[0035] (3) By setting the opening angles θx1 and θy1 of the outer notch portion 16 and the inner notch portion 18 according to the bending angle θb of the lead terminal 12, it is possible to suppress springback during bending and prevent a decrease in the vibration resistance of the lead terminal 12.

[0036] (4) By providing a notch on the lead terminal 12 and improving the processing accuracy of the bent portion 14, the mounting state on the circuit board is stabilized, thereby reducing the amount of solder used during mounting and reducing the workload of mounting work. [Examples]

[0037] In this embodiment, by setting multiple different opening angles θx1 and θy1 for the outer notch portion 16 and the inner notch portion 18, the occurrence of springback and vibration resistance of the bent portion 14 of the lead terminal 12 when the bending process is performed were verified. In verifying this embodiment, a computer analysis program was used to perform simulations using CAE (Computer-Aided Engineering) analysis.

[0038] <Analysis conditions> In this analysis, a prismatic material is used as the analysis model for all lead terminals 12, and the formation positions of the outer notch 16 and inner notch 18, terminal length, width, bending angle θb, and material are standardized. The analysis model is made of aluminum with a Young's modulus of 68.5 [GPa], a Poisson's ratio of 0.34, an initial yield stress of 350 MPa, a strain hardening rate of 1.0 [GPa], a thickness of 0.6 [mm], a width of 1.0 [mm], and a total length of 6.0 [mm]. Furthermore, the analysis model has a bend 14 at or near the center in the length direction, and with the central axis along the length direction as a reference, an outer notch 16 is formed at one end in the thickness direction and an inner notch 18 at the other end, both with a depth of 0.2 [mm]. In other words, in this analysis model, the outer notch portion 16 and the inner notch portion 18 are formed perpendicular to the central axis, and the width of the bent portion 14 is set to 1 / 3 of the thickness of the lead terminal 12 in the thickness direction.

[0039] In this analysis process, for example, a predetermined length on one end of the analysis model in the longitudinal direction is treated as a fixed surface, and a bending force FP is applied to the surface on which the outer notch portion 16 is formed on a predetermined range on the other end. The simulation then analyzes the bending portion 14 and the generation of internal stress and strain around it. In the analysis process, the bending angle θb is set to 15 degrees.

[0040] <Setting conditions for the analysis model> In this analysis process, six types of conditions (1)-(6) are set for the opening angles θx1 and θy1 of the outer notch portion 16 and inner notch portion 18 of the analysis model, as shown in Table 1 below. In the table, the terms indicating magnitude relationships are as follows: "Inner" refers to the opening angle θx1 of the inner notch, "Bent" refers to the bending angle θb, and "Outer" refers to the opening angle θy1 of the outer notch, showing the magnitude relationship between the angles.

[0041] [Table 1]

[0042] Under these settings, as shown in Table 1, for the opening angle θy1 of the inner notch portion 18, conditions (1), (2), and (6) set the bending angle θb to be small, while conditions (3), (4), and (5) set it to be larger than the bending angle θb. Furthermore, regarding the opening angle θx1 of the outer notch portion 16, under conditions (2), (5), and (6), it is set to be smaller than the bending angle θb, whereas under conditions (1), (3), and (4), it is set to be larger than the bending angle θb.

[0043] <Results of analysis> The analysis results of the bending process simulation show the amount of springback (A in Figure 3) and the plastic strain value (B in Figure 3) that occur in the bent portion 14.

[0044] As shown in Figure 3A, the results of the springback analysis show that under conditions (3), (4), and (5), where the opening angle θy1 of the inner notch 18 is set to be greater than the bending angle θb, the springback amount is approximately 0.15 mm. In contrast, under conditions (1), (2), and (6), where the opening angle θy1 of the inner notch 18 is set to be smaller than the bending angle θb, the springback amount is approximately 0.25 mm or more. Since the amount of springback is the reversal force that causes the material to return to its original shape after being processed at a set bending angle θb, a smaller amount of springback indicates higher bending accuracy.

[0045] It can be estimated that the amount of springback occurring under the set conditions is greatly influenced by the opening angle θy1 of the inner notch portion 18. That is, in the inner notch portion 18 that folds inward when the lead terminal 12 is bent, if the opening angle θy1 is smaller than the bending angle θb, the inner wall surfaces come into contact with each other during the bending process. At this time, a pressing force proportional to the bending force FP acts on the inner wall surfaces, generating a repulsive force. As a result, the lead terminal 12 experiences springback due to the repulsive force acting in the opposite direction to the bending direction, along with the elastic restoring force of the material. At this time, in the bent portion 14 of the analysis model, it was found that when the bending force FP is released, for example as shown in Figure 4B, the residual stress 30b around the inner notch portion 18 inside the central axis O is distributed over a wide area (width L2). It can be analyzed that the residual stress widely dispersed within the bent portion 14 also acts on the repulsive force Fq, resulting in a large springback.

[0046] On the other hand, by forming the opening angle θy1 of the inner notch portion 18 wider than the bending angle θb, it is possible to prevent the inner wall surfaces from contacting each other during bending. As a result, in the bent portion 14 of the analysis model, for example, as shown in A of FIG. 4, when the bending force FP is released, residual stress 30a is limitedly distributed in a narrow range (width L1 (<L2)) in the vicinity around the inner notch portion 18 inside the central axis O. It has been found that the state is like this. Thus, it can be inferred that by widening the opening angle θy1 of the inner notch portion 18, the bending force FP and the residual stress inside the lead-out terminal 12 can be prevented from affecting springback.

[0047] In addition, when the opening angle θy1 is set to the same value as the bending angle θb, in the bending process, the inner wall surfaces of the inner notch portion 18 only come into contact with each other, and since the repulsive force Fq between the inner wall surfaces becomes 0 or very small due to the bending force FP, it can be inferred that there is a certain effect in suppressing the occurrence of springback.

[0048] Next, as shown in B of FIG. 3, the results of the analysis process of the plastic strain value generated in this bent portion 14 are such that among those in which the opening angle θx1 of the outer notch portion 16 is set smaller than the bending angle θb, the plastic strain value of condition (5) is about 0.62 [mm], and the plastic strain value of condition (6) is about 0.61 [mm]. On the other hand, in conditions (1), (3), and (4) where the opening angle θx1 is set larger than the bending angle θb, the plastic strain value becomes about 0.66 [mm] or more. In addition, in condition (2) where both the opening angles θx1 and θy1 are made smaller than the bending angle θb, it has been found that the plastic strain value becomes a large value of about 0.66 [mm]. This plastic strain value is the strain generated in the bent portion 14 by the bending force FP. As this value increases, the bent portion 14 becomes vulnerable, and the possibility of breakage due to vibration applied to the mounted substrate increases. Therefore, by generating the lead-out terminal 12 based on processing conditions that reduce such a plastic strain value, the vibration resistance of the capacitor 2 can be maintained.

[0049] In the bending process of the lead terminal 12, for example, if an excessive bending force FP is applied, the stress acting on the lead terminal 12 increases, causing excessive plastic deformation to occur in the bending of the lead terminal 12, resulting in large plastic strain. In the capacitor 2 of this disclosure, it is determined that the plastic strain caused by bending can be adjusted by forming an outer notch portion 16 and an inner notch portion 18 with opening angles θx1 and θy1 corresponding to the bending angle θb at the position of the bent portion 14 on a part of the lead terminal 12.

[0050] From the above analysis results, the optimal setting condition (5) for the lead terminal 12 is one that satisfies both an opening angle θy1 that reduces the amount of springback and an opening angle θx1 that reduces the plastic strain value. In other words, as shown in equation (1), setting condition (5) is to increase the opening angle θy1 of the inner notch portion 18 and decrease the opening angle θx1 of the outer notch portion 16 with respect to the bending angle θb.

[0051] [Other embodiments and examples] The technologies disclosed herein include the following variations:

[0052] (1) The lead terminal 12 shown in the above embodiment and example is connected to the capacitor element 6 and functions as an electrode for storing energy and supplying power between the capacitor 2 and the substrate, but the technology of this disclosure is not limited to such a configuration. For example, one end of the lead terminal 12 may be connected to the capacitor element 6 or the outer case 4 or sealing member 8, and the other end may protrude toward the opening 10 side of the outer case 4 and be an auxiliary terminal for supporting the capacitor 2 by contacting the substrate or the like.

[0053] (2) In the above embodiment and example, the case of the lead terminal 12 which is an external terminal of the capacitor 2 is shown, but the invention is not limited thereto. The technology of the present disclosure is a device or component equipped with a lead terminal 12 which is mounted by soldering to a substrate or the like, and a part of the terminal is bent.

[0054] (3) In the above embodiment and example, the tips of the outer notch portion 16 and the inner notch portion 18 formed in the bent portion 14 are formed on orthogonal axes via the central axis O of the lead terminal 12, but the invention is not limited thereto. At least the inner notch portion 18 may be formed such that the intersection angle between the tip portion and the central axis O is changed according to the bending direction and bending angle θb with respect to the central axis O before processing. In this case, the inner notch portion 18 may be formed by, for example, increasing the length of the wall surface of the opening surface closer to the tip side of the lead terminal 12 that shifts during the bending process, or by changing the angle in proportion to the bending angle. Thus, in the bending process of the lead terminal 12, the tip side of the lead terminal 12 is bent, and the ease of bending the lead terminal may be improved by displacing the outer notch portion 16 and the inner notch portion 18.

[0055] As described above, the most preferred embodiments of this disclosure have been described. This disclosure is not limited to those described above. Various modifications and changes are possible for those skilled in the art based on the gist of this disclosure as described in the claims or disclosed in the forms for carrying out the invention. It goes without saying that such modifications and changes are within the scope of this disclosure. [Industrial applicability]

[0056] The technology disclosed herein is useful because, by having a predetermined opening angle with respect to the bending angle θb on a part of the circumferential surface of the lead terminal, or by providing an inner notch portion 18, it is possible to prevent or suppress springback of the lead terminal 12, making bending easier and thus improving processing accuracy. [Explanation of Symbols]

[0057] 2 Capacitors 4. Outer case 6 Capacitor elements 8 Sealing material 10 Openings 12. Outlet terminals 14. Folded section 16 Outer notch section 18 Inner notch section 30a, 30b Residual stress

Claims

1. The capacitor body and The terminals attached to the capacitor body, The terminal is provided with a bending portion for bending it in a specific direction, an inner notch portion provided on the inside of the bending portion, and an outer notch portion provided on the outside of the bending portion, A capacitor, including

2. The capacitor according to claim 1, wherein the opening angle of the inner notch before bending the terminal is set to be greater than or equal to the bending angle of the terminal, and the opening angle of the outer notch before bending the terminal is set to a value smaller than the bending angle of the terminal.

3. The capacitor according to claim 1, wherein the inner notch and the outer notch are formed on both sides of the terminal with respect to the central axis of the bent portion.

4. The capacitor according to claim 1, wherein the inner notch portion and the outer notch portion are formed such that the length of either or both of the inner notch portion and the outer notch portion is equal to the thickness of the terminal.

5. The process of attaching terminals and manufacturing the capacitor body, A step of forming an inner notch portion and an outer notch portion in the bending portion set in a part of the terminal, The process of bending the terminal in the bending direction at the aforementioned bending portion, A method for manufacturing capacitors, including the manufacturing method itself.

6. The process of forming an inner notch portion on the side surface of the terminal which will be the bent portion, the opening angle of which is greater than or equal to the bending angle of the terminal, The process of forming an outer notch on the other side of the terminal that will become the bent portion, the opening angle of which is smaller than the bending angle of the terminal, A method for manufacturing a capacitor according to claim 5, including the method described in claim 5.

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