Electronic control unit

Abstract

This design ensures high bandwidth communication rates between boards and ease of flat cable assembly, while also preventing degradation of the flat cables and avoiding a decrease in the heat dissipation performance of circuit elements. [Solution] The electronic control device 1 comprises a first substrate 2 and a second substrate 3 facing each other, a first connector 5 disposed on the first substrate, and a second connector 9 disposed on the second substrate. A through hole 11 is formed in the second substrate, and the first connector and the second connector are electrically connected via a flat cable 6 passing through the through hole. At least one or more circuit elements 12, 13 and an auxiliary component 14 that does not form a circuit are disposed on the second substrate directly below the flat cable. The height dimension of the auxiliary component is greater than the height dimension of the circuit element, and the flat cable may come into contact with the auxiliary component without coming into contact with the circuit element.

Description

Technical Field

[0001] The present invention relates to an electronic control device.

Background Art

[0002] For example, the performance of a function-integrated ECU (Electronic Control Unit) that aggregates domain control such as autonomous driving, infotainment, and body functions has been improving. Along with this, the amount of data such as image data transmitted and received between SoCs (System On Chip) that control each domain has also become enormous. Therefore, a higher bandwidth for the communication rate between SoCs is required. For example, it is expected that a bandwidth of 32 Gbps or more represented by PCIe (Peripheral Component Interconnect-Express) Gen5 will be required around 2030.

[0003] In 32 Gbps NRZ (Non-Return to Zero) communication, the fundamental frequency is 16 GHz. However, when it exceeds several GHz, the transmission loss in the board wiring increases rapidly, which is a major factor leading to deterioration of communication quality. Since the transmission loss is proportional to the transmission line length, it has become difficult to establish long-distance inter-SoC communication required for large products such as function-integrated ECUs using board wiring. In particular, the FR4 (Flame Retardant Type 4) board generally used in in-vehicle ECUs has a large transmission loss, and in the case of PCIe Gen5 communication, it is expected to be possible for only about 150 mm.

[0004] As countermeasures, methods such as using low-dielectric substrates that have lower transmission loss compared to FR4 substrates, or using devices that recover transmission loss, such as redrivers / retirers, have been proposed. However, both of these methods have the problem of leading to a significant increase in cost. Furthermore, the latter method involves interposing semiconductor devices in the communication path, which also increases the risk of failure. For this reason, solutions using flexible flat cables (hereinafter referred to as FFCs (Flexible Flat Cables)), which are cheaper than low-dielectric substrates and redrivers / retirers and can realize low-loss transmission paths, are attracting attention in the automotive field. For example, Patent Document 1 discloses a configuration in which opposing first and second substrates are electrically connected via an FFC (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Patent No. 5660076 [Overview of the project] [Problems that the invention aims to solve]

[0006] When opposing first and second substrates are electrically connected via FFCs, a configuration where the connector for connecting the FFCs is located at the edge of the substrate results in longer substrate wiring between the connector and the SoC, leading to transmission loss and a decrease in communication quality. On the other hand, a configuration where the connector is located near the SoC results in a small clearance between substrates due to the thickness constraints of the product unit, leading to a decrease in ease of assembly when attaching the FFCs to the connector.

[0007] To solve these problems, a configuration is envisioned in which a first substrate and a second substrate are arranged facing each other, a first connector is placed on the first substrate, and a second connector is placed on the second substrate, with a through-hole formed in the second substrate, and the first and second connectors are electrically connected via an FFC passing through the through-hole. With the above configuration, the first and second connectors can be placed near their respective SoCs, so the substrate wiring between the first and second connectors and their corresponding SoCs can be shortened to reduce transmission loss and avoid the risk of reduced communication quality. In addition, since the FFC can be connected to the first connector via the through-hole, the risk of reduced ease of assembly when assembling the FFC to the first connector can be avoided.

[0008] However, considering noise reduction and heat dissipation, the SoC on the first substrate and the SoC on the second substrate need to be placed a certain distance apart. Also, in order to avoid increasing the overall size of the device, it may be necessary to place circuit elements directly beneath the FFC on the second substrate. As a result, when circuit elements are placed directly beneath the FFC, a new problem arises in which the FFC comes into contact with the circuit elements due to vehicle vibrations, etc., and deteriorates due to wear. In addition, the clearance between the FFC and the circuit elements becomes small, which reduces the heat dissipation of the circuit elements and also creates a new problem in which the transmission characteristics of the FFC deteriorate due to the heat generated by the circuit elements.

[0009] The present invention has been made in view of the above circumstances, and its object is to provide an electronic control device in which a first connector on a first substrate and a second connector on a second substrate are electrically connected via a flat cable passing through a through hole formed in the second substrate, while ensuring a high bandwidth communication rate between the substrates and ease of assembly of the flat cable, while preventing deterioration of the flat cable and preventing a decrease in the heat dissipation performance of the circuit elements. [Means for solving the problem]

[0010] The invention described in claim 1 is an electronic control device (1,21,31) comprising opposing first substrates (2) and second substrates (3), a first connector (5) disposed on the first substrate, and a second connector (9) disposed on the second substrate, wherein a through hole (11) is formed in the second substrate, and the first connector and the second connector are electrically connected via a flat cable (6) passing through the through hole, wherein at least one or more circuit elements (12,13) ​​and auxiliary components (14,22,32,33) that do not form a circuit are disposed on the second substrate directly below the flat cable, the height dimension of the auxiliary components is greater than the height dimension of the circuit elements, and the flat cable may come into contact with the auxiliary components without coming into contact with the circuit elements.

[0011] According to the invention described in claim 1, an auxiliary component is placed on the second substrate, the height dimension of which is greater than the height dimension of the circuit element, so that the flat cable may come into contact with the auxiliary component without coming into contact with the circuit element. By using a flat cable, it is possible to ensure a high bandwidth communication rate between the substrates. By connecting the flat cable to the first connector through a through hole, ease of assembly can be ensured. By placing the auxiliary component so that the flat cable does not come into contact with the circuit element, deterioration of the flat cable can be prevented, as can a decrease in the heat dissipation of the circuit element. As a result, it is possible to ensure a high bandwidth communication rate between substrates and ease of assembly of the flat cable, while preventing deterioration of the flat cable and preventing a decrease in the heat dissipation of the circuit element. [Brief explanation of the drawing]

[0012] [Figure 1] A longitudinal cross-sectional side view showing the overall configuration of the first embodiment. [Figure 2] Perspective view of the first printed circuit board [Figure 3] Perspective view of the second printed circuit board. [Figure 4] A longitudinal cross-sectional side view showing the overall structure of the comparison object. [Figure 5] A longitudinal cross-sectional side view showing the overall configuration of the second embodiment. [Figure 6] A longitudinal cross-sectional side view showing the overall configuration of the third embodiment. [Modes for carrying out the invention]

[0013] Hereinafter, several embodiments of the present invention applied to, for example, a functional integrated ECU will be described with reference to the drawings. In the embodiments described later, descriptions of parts identical to those in the prior embodiments may be omitted. The functional integrated ECU is an ECU that aggregates domain controls such as autonomous driving, infotainment, and body functions. However, the domain controls aggregated are not limited to the above-mentioned autonomous driving, infotainment, and body functions.

[0014] (First Embodiment) The first embodiment will be described with reference to Figures 1 to 4. As shown in Figure 1, the functional integrated ECU (hereinafter referred to as ECU) 1 comprises a first printed circuit board 2 (corresponding to the first board) and a second printed circuit board (corresponding to the second board) 3. The first printed circuit board 2 and the second printed circuit board 3 are arranged facing each other in a vertical direction, with the first printed circuit board 2 positioned on the lower side and the second printed circuit board 3 positioned on the upper side.

[0015] As shown in Figure 2, the upper surface 2a of the first printed circuit board 2, that is, the surface 2a facing the second printed circuit board 3, is where the first SoC (corresponding to the first processor) 4 and the first connector 5 are located. The first connector 5 is rectangular in shape, and is positioned on the first printed circuit board 2 such that the cable connection portion 5a, which connects to the FFC 6 (corresponding to the flat cable), is on the upper side, and the circuit connection portion 5b, which connects to the first SoC 4, is on the lower side. In other words, the first connector 5 is positioned on the first printed circuit board 2 with its longitudinal direction being vertical.

[0016] The first SoC 4 and the first connector 5 are electrically connected via board wiring 7 formed on the first printed circuit board 2. In this case, since a longer board wiring 7 would lead to a decrease in communication quality due to the resulting transmission loss, the length of the board wiring 7 is made as short as possible, taking into consideration factors such as the allowable transmission loss and constraints on the placement of circuit elements. That is, the first connector 5 is located in the vicinity of the first processor 4. "Nearby" means that there are no other circuit elements interposed between the first connector 5 and the first processor 4. Note that in Figure 2, the FFC 6 and board wiring 7 are omitted from the illustration.

[0017] As shown in Figure 3, the second SoC (corresponding to the second processor) 8 is located on the lower side 3b of the second printed circuit board 3, that is, on the side 3b facing the first printed circuit board 2. The second connector 9 is located on the upper side 3a of the second printed circuit board 3. That is, the second connector 9 is located on the side 3a of the second printed circuit board 3 that is opposite to the first printed circuit board 2. The second connector 9 is rectangular in shape, and is located on the second printed circuit board 3 such that the cable connection part 9a, which connects to the FFC 6, is on the left side, and the circuit connection part 9b, which connects to the second SoC 8, is on the right side. That is, the second connector 9 is located on the second printed circuit board 3 such that its longitudinal direction is horizontal.

[0018] The second SoC 8 and the second connector 9 are electrically connected via board wiring 10 formed on the second printed circuit board 3. In this case as well, since longer board wiring 10 leads to transmission loss and a decrease in communication quality, the length of board wiring 10 is made as short as possible, taking into consideration factors such as the allowable transmission loss and constraints on the placement of circuit elements, similar to the board wiring 7 on the first printed circuit board 2 described above. That is, the second connector 9 is located near the second processor 8. Nearby means that there are no other circuit elements interposed between the second connector 9 and the second processor 8. Note that in Figure 3, the FFC 6 and board wiring 10 are omitted from the illustration.

[0019] The first SoC 4 and the second SoC 8 are separately arranged, for example, in domain units. The first SoC 4 is a processor that performs, for example, domain control for autonomous driving, and the second SoC 8 is a processor that performs, for example, domain control for infotainment. A domain can also be referred to as an application.

[0020] A through-hole 11 is formed at a predetermined position on the second printed circuit board 3. The cable connection portion 5a, which is the upper end portion of the first connector 5, is located in the through-hole 11, and the entire cable connection portion 5a can be easily seen through the through-hole 11 from above. One end portion of the FFC 6 is connected to the cable connection portion 5a of the first connector 5 through the through-hole 11, and the other end portion of the FFC 6 is connected to the cable connection portion 9a of the second connector 9. Thus, the first connector 5 and the second connector 9 are electrically connected, and data communication between the first SoC 4 and the second SoC 8 via the FFC 6 and the board wirings 7, 10 is enabled.

[0021] Incidentally, the procedure for assembling the FFC 6 to the first connector 5 and the second connector 9 is, for example, to arrange the first connector 5 on the first printed circuit board 2 and the second connector 9 on the second printed circuit board 3, and then fit the other end side of the FFC 6 into the second connector 9 and the one end side of the FFC 6 into the first connector 5. Alternatively, for example, first fit the other end side of the FFC 6 into the second connector 9, arrange the first connector 5 on the first printed circuit board 2, arrange the second connector 9 with the other end side of the FFC 6 fitted therein on the second printed circuit board 3, and then fit the one end side of the FFC 6 into the first connector 5.

[0022] In the configuration described above, the SoC4 on the first printed circuit board 2 and the SoC8 on the second printed circuit board 3 are positioned a certain distance apart, taking into consideration noise reduction and heat dissipation. On the other hand, as described above, the first connector 5 is positioned near the first SoC4 and the second connector 9 is positioned near the second SoC8, so a certain amount of space is provided on the upper surface 3a of the second printed circuit board 3 between the second connector 9 and the through-hole 11. In this case, in order to avoid increasing the overall size of the device, the circuit elements 12 and 13 are positioned in the aforementioned space, that is, directly below the FFC6. Figure 1 shows two circuit elements 12 and 13 as an example, but the number of circuit elements positioned directly below the FFC6 is not limited to two.

[0023] In this embodiment, an auxiliary component 14 is positioned in the aforementioned space near the through-hole 11. The auxiliary component 14 is a resin-molded insulating component, or an electronic component such as a coil that is not electrically connected to either of the circuit elements 12 or 13, and does not form a circuit. The auxiliary component 14 can also be called a dummy component. The upper end portion 14a of the auxiliary component 14 is planar, and its height is greater than the height of either of the circuit elements 12 or 13, and also greater than the height of the second connector 9. That is, the FFC 6 is supported by the auxiliary component 14 by contacting the upper end portion 14a of the auxiliary component 14, and does not come into contact with either of the circuit elements 12 or 13.

[0024] Figure 4 shows a comparative configuration in which the auxiliary component 14 is omitted. In the comparative configuration, because the auxiliary component 14 is omitted, there is a risk that the FFC 6 may come into contact with the circuit elements 12 and 13 due to vehicle vibration, etc., and that the FFC 6 may deteriorate due to wear. In addition, the clearance between the FFC 6 and the circuit elements 12 and 13 becomes smaller, which reduces the heat dissipation of the circuit elements 12 and 13, and there is also the problem that the transmission line characteristics of the FFC 6 will deteriorate due to the heat generated by the circuit elements 12 and 13.

[0025] In contrast, in the configuration of this embodiment in which the auxiliary component 14 is arranged, the FFC 6 is supported by the auxiliary component 14 and does not come into contact with the circuit elements 12 and 13, thereby preventing deterioration of the FFC 6 and preventing a decrease in the heat dissipation performance of the circuit elements 12 and 13. In other words, in the configuration of this embodiment, by employing an FFC 6 that can realize a low-loss transmission path, a high bandwidth of communication rate between SoCs is ensured, and by connecting the FFC 6 to the first connector 5 via the through hole 11, ease of assembly is ensured, while preventing deterioration of the FFC 6 and preventing a decrease in the heat dissipation performance of the circuit elements 12 and 13.

[0026] Furthermore, although the above example illustrates a configuration in which the second SoC8 is located on the lower surface 3b of the second printed circuit board 3, the second SoC8 may also be located on the upper surface 3a of the second printed circuit board 3. In other words, the second connector 9 may be located near the second SoC8 on the upper surface 3a of the second printed circuit board 3. Also, the FFC6 does not need to be in constant contact with the upper end 14a of the auxiliary component 14; it is sufficient that the FFC6 is in contact with the upper end 14a of the auxiliary component 14 while not in contact with the circuit elements 12 and 13. In other words, it is sufficient that the FFC6 is in contact with the upper end 14a of the auxiliary component 14 and supported by the auxiliary component 14, thereby preventing it from coming into contact with the circuit elements 12 and 13.

[0027] As described above, the first embodiment provides the following advantages and benefits. In the ECU1, an auxiliary component 14 is placed on the second printed circuit board 3, the height dimension of which is greater than the height dimension of either the circuit elements 12 or 13, so that the FFC 6 does not come into contact with the circuit elements 12 or 13 by contacting the upper end portion 14a of the auxiliary component 14. By using the FFC 6, a high bandwidth communication rate between SoCs can be ensured. By connecting the FFC 6 to the first connector 5 through the through hole 11, ease of assembly can be ensured. This ensures a high bandwidth communication rate between SoCs and ease of assembly of the FFC 6, while preventing degradation of the FFC 6 and preventing a decrease in the heat dissipation performance of the circuit elements 12 or 13.

[0028] Since the first connector 5 is located near the first SoC 4, transmission loss due to board wiring 7 can be suppressed. Since the second connector 9 is located near the first SoC 8, transmission loss due to board wiring 10 can be suppressed.

[0029] By placing the auxiliary component 14 near the through-hole 11, the FFC6 is supported as far away as possible from the cable connection portion 9a of the second connector 9, thereby ensuring adequate clearance between the FFC6 and the second printed circuit board 3. Furthermore, the stress acting on the FFC6 in the area close to the second connector 9 can be reduced. In other words, if the auxiliary component 14 were placed near the second connector 9, there is a risk that the FFC6 would have to be bent excessively, which could result in an inadequate clearance between the FFC6 and the second printed circuit board 3, or an increase in the stress acting on the FFC6 in the area close to the second connector 9. However, by placing the auxiliary component 14 near the through-hole 11, such risks can be avoided.

[0030] Since the second connector 9 is positioned on the upper surface 3a of the second printed circuit board 3, the workability when assembling the FFC 6 to the second connector 9 while the second connector 9 is positioned on the second printed circuit board 3 can be improved. In addition, the clearance between the first printed circuit board 2 and the second printed circuit board 3 can be reduced, allowing for a miniaturization of the entire device.

[0031] By making the height dimension of the auxiliary component 14 larger than the height dimension of the second connector 9, an appropriate clearance can be secured between the FFC 6 and the second printed circuit board 3.

[0032] (Second Embodiment) A second embodiment will be described with reference to Figure 5. The second embodiment differs from the first embodiment in the shape of the auxiliary component. In the ECU 21, the auxiliary component 22 is positioned directly below the FFC 6 and near the through hole 11. The auxiliary component 22 differs from the auxiliary component 14 described in the first embodiment only in that its upper end portion 22a is arc-shaped. Its height is greater than the height of either the circuit elements 12 and 13, and also greater than the height of the second connector 9. That is, the FFC 6 is supported by the auxiliary component 22 by contacting its upper end portion 22a, and does not come into contact with either the circuit elements 12 or 13.

[0033] As described above, the second embodiment provides the following advantages and benefits. In the ECU21, an auxiliary component 22 is placed on the second printed circuit board 3, the height dimension of which is greater than the height dimension of either the circuit elements 12 or 13, so that the FFC6 does not come into contact with the circuit elements 12 or 13 by contacting the upper end portion 22a of the auxiliary component 22. The same advantages and benefits as in the first embodiment can be obtained, ensuring a high bandwidth communication rate between SoCs and ease of assembly of the FFC6, while preventing degradation of the FFC6 and preventing a decrease in the heat dissipation performance of the circuit elements 12 or 13.

[0034] Furthermore, since the upper end portion 22a of the auxiliary part 22 is made into an arc shape, wear of the FFC6 is appropriately reduced at the part where the FFC6 and the auxiliary part 22 come into contact, and the contact area is increased, thereby allowing the FFC6 to be properly supported.

[0035] (Third embodiment) The third embodiment will be described with reference to Figure 6. The third embodiment differs from the second embodiment in the number of auxiliary components. In the ECU 31, an auxiliary component 32 is positioned directly below the FFC 6 and near the through hole 11, and an auxiliary component 33 is positioned between the circuit element 12 and the circuit element 13. Similar to the auxiliary component 22 described in the second embodiment, the upper end portion 32a of the auxiliary component 32 is arc-shaped, and its height is greater than the height of the nearby circuit element 12 and greater than the height of the second connector 9. Similar to the auxiliary component 22 described in the second embodiment, the upper end portion 33a of the auxiliary component 33 is arc-shaped, and its height is greater than the height of either of the nearby circuit elements 12 and 13 and greater than the height of the second connector 9.

[0036] As described above, the third embodiment provides the following advantages and benefits. In the ECU 31, auxiliary components 32 and 33 are placed on the second printed circuit board 3, the height dimension of which is greater than the height dimension of either of the circuit elements 12 and 13, so that the FFC 6 does not come into contact with the circuit elements 12 and 13 by contacting the upper ends 32a and 33a of the auxiliary components 32 and 33. The same advantages and benefits as in the first embodiment can be obtained, ensuring a high bandwidth communication rate between SoCs and ease of assembly of the FFC 6, while preventing degradation of the FFC 6 and preventing a decrease in the heat dissipation performance of the circuit elements 12 and 13.

[0037] Furthermore, by arranging multiple auxiliary components 32 and 33 and setting the height dimension of each to the minimum necessary so that the FFC6 does not come into contact with adjacent circuit elements, the upward protrusion of the FFC6 due to the arrangement of the auxiliary components 32 and 33 can be suppressed, thereby reducing the overall height dimension of the device. In addition, since the upper ends 32a and 33a of the auxiliary components 32 and 33 are made into an arc shape, wear of the FFC6 is reduced at the parts in contact with the FFC6 and auxiliary components 32 and 33, and the contact area is increased, thereby allowing the FFC6 to be properly supported.

[0038] This disclosure includes, in addition to the claims, the following disclosures: [1] An electronic control device (1,21,31) comprising opposing first substrates (2) and second substrates (3), a first connector (5) disposed on the first substrate, and a second connector (9) disposed on the second substrate, wherein a through hole (11) is formed in the second substrate, and the first connector and the second connector are electrically connected via a flat cable passing through the through hole, On the second substrate, directly beneath the flat cable, at least one or more circuit elements (12, 13) and auxiliary components (14, 22, 32, 33) that do not form a circuit are arranged. The height dimension of the auxiliary component is greater than the height dimension of the circuit element. The aforementioned flat cable may come into contact with the auxiliary component without coming into contact with the circuit element in an electronic control device.

[0039] [2] A first processor (4) is placed on the first substrate, The first connector is located near the first processor and is electrically connected to the first processor, as described in [1].

[0040] [3] A second processor (8) is placed on the second substrate, The electronic control unit described in [1] or [2] is located near the second processor and is electrically connected to the second processor, wherein the second connector is located near the second processor.

[0041] [4] The auxiliary component is an electronic control device as described in any one of items [1] to [3], which is located near the through hole.

[0042] [5] The electronic control device described in any one of the items [1] to [4], wherein the second connector is located on the second substrate on the side opposite to the first substrate.

[0043] [6] An electronic control device as described in any one of the items [1] to [5], wherein the height dimension of the auxiliary component is greater than the height dimension of the second connector.

[0044] [7] The auxiliary component is an electronic control device as described in any one of the items [1] to [6], wherein the surface that contacts the flat cable is arc-shaped.

[0045] [8] The aforementioned auxiliary parts are multiple, An electronic control device as described in any one of the items [1] to [7], wherein the height dimension of each auxiliary component is greater than the height dimension of the nearby circuit element.

[0046] (Other embodiments) This disclosure is described in accordance with the embodiments, but it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the equivalence. In addition, various combinations and forms, as well as other combinations and forms that include one, more, or fewer of those elements, fall within the scope and concept of this disclosure.

[0047] This configuration is not limited to applications to a function-integrated ECU; it can also be applied to ECUs that perform individual functions, such as a meter ECU that controls the meters or an engine ECU that controls the engine.

[0048] Although the example illustrates a configuration in which the first printed circuit board 2 and the second printed circuit board 3 are arranged facing each other in a vertical direction, the method may also be applied to a configuration in which the first printed circuit board 2 and the second printed circuit board 3 are arranged facing each other in a horizontal direction. Furthermore, the relationship between the first printed circuit board 2 and the second printed circuit board 3 may be inverted vertically.

[0049] It is also possible to have a configuration in which multiple connectors corresponding to the first connector 5 are arranged on the first printed circuit board 2, and multiple connectors corresponding to the second connector 9 are arranged on the second printed circuit board 3, thereby providing multiple relationships between the FFC 6 and the auxiliary component 14 as described above.

[0050] In a configuration having three or more opposing printed circuit boards, there may be multiple relationships between the first printed circuit board 2 and the second printed circuit board 3. [Explanation of Symbols]

[0051] In the drawing, 1, 21, and 31 are integrated ECUs (electronic control units), 2 is the first printed circuit board (first board), 3 is the second printed circuit board (second board), 4 is the first SoC (first processor), 5 is the first connector, 6 is an FFC (flat cable), 8 is the second SoC (second processor), 9 is the first connector, 11 is a through hole, and 14, 22, 32, and 33 are auxiliary components.

Claims

1. An electronic control device (1, 21, 31) comprising opposing first substrates (2) and second substrates (3), a first connector (5) disposed on the first substrate, and a second connector (9) disposed on the second substrate, wherein a through hole (11) is formed in the second substrate, and the first connector and the second connector are electrically connected via a flat cable (6) passing through the through hole, On the second substrate, directly beneath the flat cable, at least one or more circuit elements (12, 13) and auxiliary components (14, 22, 32, 33) that do not form a circuit are arranged. The height dimension of the auxiliary component is greater than the height dimension of the circuit element. The aforementioned flat cable may come into contact with the auxiliary component without coming into contact with the circuit element in an electronic control device.

2. A first processor (4) is placed on the first substrate, The electronic control device according to claim 1, wherein the first connector is located near the first processor and is electrically connected to the first processor.

3. A second processor (8) is placed on the second substrate, The electronic control device according to claim 1, wherein the second connector is located near the second processor and is electrically connected to the second processor.

4. The electronic control device according to claim 1, wherein the auxiliary component is located near the through hole.

5. The electronic control device according to claim 1, wherein the second connector is located on the second substrate on the side opposite to the first substrate.

6. The electronic control device according to claim 1, wherein the height dimension of the auxiliary component is greater than the height dimension of the second connector.

7. The electronic control device according to any one of claims 1 to 6, wherein the auxiliary component has an arc-shaped surface that contacts the flat cable.

8. The aforementioned auxiliary parts are multiple, An electronic control device according to any one of claims 1 to 6, wherein the height dimension of each auxiliary component is greater than the height dimension of the nearby circuit element.

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