Protection circuit module, method for manufacturing a protection circuit module, and secondary battery including a protection circuit module

Abstract

The present invention provides a protective circuit module, a method for manufacturing the protective circuit module, and a secondary battery including the protective circuit module. [Solution] A protective circuit module 200 according to one embodiment of the present disclosure may include a substrate 210 electrically connected to a battery cell, a plurality of components 220 mounted on a mounting area on the substrate 210, a first insulating layer 230 formed on the substrate 210 in an area other than the mounting area, a second insulating layer 240 formed on the first insulating layer 230 and spaced apart from the plurality of components 220, and a coating layer 250 formed on the first insulating layer 230 and surrounding the plurality of components 220.

Description

Technical Field

[0001] The present disclosure relates to a protection circuit module, a method for manufacturing a protection circuit module, and a secondary battery including the protection circuit module.

Background Art

[0002] A secondary battery is a battery that can be charged and discharged, unlike a primary battery that cannot be charged. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, laptop computers, digital cameras, and camcorders (registered trademark), and high-capacity secondary batteries are widely used as power sources for motor drive and batteries for power storage, such as in hybrid vehicles and electric vehicles. Such secondary batteries include an electrode assembly composed of a positive electrode and a negative electrode, a case that houses the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] Generally, a secondary battery is provided with a protection circuit module (PCM; protective circuit module) together to protect the battery from overcharging, over-discharging, and over-current. As a result, the secondary battery is used in the form of a battery pack in which the protection circuit module is coupled to a battery cell.

[0004] Various components are mounted on the substrate of the protection circuit module. A coating liquid is applied to insulate the components mounted on the protection circuit module and protect them from external impacts. However, in the process of applying the coating liquid, there is a problem that the coating liquid may flow into other adjacent components or the like outside the area where the coating is required.

[0005] In addition, with the miniaturization of electronic devices and the like, in order to miniaturize the battery pack, it is required to make the substrate of the protection circuit module thinner. When the substrate of the protection circuit module becomes thinner, there is a problem that the substrate is easily damaged by external impacts or the like.

[0006] The aforementioned information disclosed in the background art of such inventions is solely for the purpose of improving understanding of the background of the present invention, and therefore may include information that does not constitute prior art. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Korean Published Patent Publication No. 10-2017-0048000 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] This disclosure provides a protective circuit module and a method for manufacturing the protective circuit module to solve the aforementioned problems.

[0009] However, the technical problems that this invention aims to solve are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description of the invention below. [Means for solving the problem]

[0010] According to one embodiment of the present invention, the protective circuit module may include a substrate electrically connected to a battery cell, a plurality of components mounted on a mounting area on the substrate, a first insulating layer formed on the substrate in an area other than the mounting area, a second insulating layer formed on the first insulating layer and spaced apart from the plurality of components, and a coating layer formed on the first insulating layer and surrounding the plurality of components.

[0011] According to another embodiment of the present invention, a method for manufacturing a protective circuit module may include the steps of: forming a first insulating layer on a substrate in an area other than the mounting area on which components are mounted; forming a second insulating layer on the first insulating layer along the edge of the first insulating layer; mounting a plurality of components in the mounting area; and forming a coating layer on the first insulating layer so as to surround the plurality of components.

[0012] According to one embodiment of the present invention, a secondary battery may include an electrode assembly, a case housing the electrode assembly, and a protection circuit module connected to the electrode assembly. The protection circuit module may include a substrate electrically connected to the electrode assembly, a plurality of components mounted on a mounting area on the substrate, a first insulating layer formed on the substrate in an area other than the mounting area, a second insulating layer formed on the first insulating layer and spaced apart from the plurality of components, and a coating layer formed on the first insulating layer and surrounding the plurality of components.

[0013] According to one embodiment, the second insulating layer may be formed along the edge of the first insulating layer. [Effects of the Invention]

[0014] According to some embodiments of the present invention, by forming an insulating layer along the edge of the substrate at a height higher than the height to which the coating layer is applied, it is possible to prevent the coating layer from flowing out to the outside of the substrate of the protective circuit module.

[0015] Furthermore, according to some embodiments of the present invention, the mounting strength can be increased by forming a single coating layer that surrounds all of the multiple components mounted on the substrate of the protection circuit module.

[0016] The effects of this disclosure are not limited thereto, and other effects not mentioned herein should be clearly understood by those skilled in the art from the following description. [Brief explanation of the drawing]

[0017] The following drawings and the like attached to this application illustrate preferred embodiments of the present invention and, together with the detailed description of the invention to be described later, serve to further understand the technical idea of the present invention. Therefore, the present invention should not be construed as being limited only to the matters described in such drawings. [Figure 1] It is a diagram showing a state in which an electrode assembly and a case according to an embodiment of the present invention are coupled. [Figure 2] It is a diagram showing a battery cell according to an embodiment of the present invention. [Figure 3] It is a diagram showing a battery cell and a protection circuit module according to an embodiment of the present invention. [Figure 4] It is a diagram showing the upper surface of a protection circuit module according to an embodiment of the present invention. [Figure 5] It is a diagram showing a cross-section of a region along A-A' in FIG. 4. [Figure 6] It is a diagram showing another embodiment of FIG. 5. [Figure 7] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 8] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 9] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 10] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 11] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 12] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 13] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 14] It is a diagram for explaining the manufacturing process of a protection circuit module according to an embodiment of the present invention. [Figure 15]This is a diagram illustrating the manufacturing process of a protection circuit module according to one embodiment of the present invention. [Figure 16] This flowchart shows the manufacturing process of a protective circuit module according to one embodiment of the present invention. [Modes for carrying out the invention]

[0018] <Summary of the Invention> According to one embodiment, the second insulating layer may be formed along the edge of the first insulating layer.

[0019] According to one embodiment, the first insulating layer may be formed over the entire area of ​​the substrate except for the mounting area. The second insulating layer may be formed at a position corresponding to the edge of the substrate.

[0020] According to one embodiment, the second insulating layer may have a closed contour. Multiple components may be located within the closed contour.

[0021] According to one embodiment, the coating layer may be located in a region other than the mounting region within the closed contour.

[0022] According to one embodiment, the second insulating layer may be formed to be thicker than the first insulating layer.

[0023] According to one embodiment, the height of the second insulating layer can be lower than the highest height among the multiple components.

[0024] According to one embodiment, the height of the second insulating layer can be lower than the lowest height among the heights of multiple components.

[0025] According to one embodiment, the coating layer may be formed lower than the second insulating layer.

[0026] According to one embodiment, the coating layer may be formed lower than multiple components.

[0027] According to one embodiment, the first insulating layer and the second insulating layer may contain PSR (Photo Solder Resist) ink.

[0028] According to one embodiment, the coating layer may include an underfill coating material.

[0029] According to one embodiment, the step of forming the first insulating layer may include forming the first insulating layer over the entire area of ​​the substrate other than the mounting area. The step of forming the second insulating layer may include forming the second insulating layer at a position corresponding to the edge of the substrate.

[0030] According to one embodiment, the step of forming a second insulating layer may include forming the second insulating layer such that it has a closed contour. The step of forming a coating layer may include forming the coating layer such that it is located in a region other than the mounting region within the closed contour.

[0031] According to one embodiment, the step of forming a second insulating layer may include forming the second insulating layer to be thicker than the thickness of the first insulating layer.

[0032] According to one embodiment, the step of forming a second insulating layer may include forming the second insulating layer at a height lower than the lowest height among the multiple components to be mounted.

[0033] According to one embodiment, the step of forming the coating layer may include the step of forming the coating layer lower than the second insulating layer.

[0034] According to one embodiment, the second insulating layer may be formed along the edge of the first insulating layer.

[0035] <Detailed description of the invention> Preferred embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. First, terms and words used in this specification and in the claims should not be interpreted in a manner limited to their ordinary and dictionary meanings, but rather in a manner consistent with the technical idea of ​​the present invention, in accordance with the principle that inventors may define the concepts of terms as appropriate to best describe their invention. Accordingly, it should be understood that the embodiments and configurations shown in the drawings described herein represent only a selection of preferred embodiments of the present invention and do not represent the entirety of the technical idea of ​​the present invention, and that there may be a variety of equivalents and modifications that can substitute for them at the time of filing this application.

[0036] Furthermore, as used herein, “comprise,” “comprising,” “include,” and “including” specify the presence of the shapes, figures, steps, actions, members, elements, and / or groups mentioned, and do not exclude the presence or addition of one or more other shapes, figures, actions, members, elements, and / or groups.

[0037] Furthermore, to aid in understanding the invention, the accompanying drawings may not be shown to actual scale, and the dimensions of some components may be exaggerated. Also, the same component will be assigned the same reference numeral in different embodiments.

[0038] The statement that two comparison objects are "identical" means that they are "substantially identical." Therefore, being substantially identical may include having deviations that are considered low in this industry, for example, deviations of 5% or less. Furthermore, the uniformity of a parameter within a given domain can mean uniformity in terms of the average.

[0039] While terms like "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another, and unless otherwise stated, the first component can be the second component.

[0040] Throughout the specification, unless otherwise stated, each component may be singular or plural.

[0041] When we say that any component is placed "above (or below)" or "above (or below)" a component, it means not only that the component is placed in contact with the top (or bottom) surface of the component, but also that other components may be interposed between the component and any component placed above (or below) it.

[0042] Furthermore, when it is stated that one component is "connected," "bonded," or "linked" to another component, it must be understood that these components can be directly connected, bonded, or linked to one another, but they can also be "interposed" between other components, or each component can be "connected," "bonded," or "linked" through other components. Also, when it is said that one part is electrically coupled to another part, this includes not only cases where they are directly connected, but also cases where they are connected with another element in between.

[0043] Throughout the specification, when we refer to "A and / or B," unless otherwise specified, this means A, B, or A and B. That is, "and / or" includes all combinations or any combination of the listed items. When we refer to "C through D," unless otherwise specified, this means C or greater and D or less.

[0044] The terms used herein are for the purpose of describing the embodiments of this disclosure and are not intended to limit this disclosure.

[0045] Figure 1 shows the state in which the electrode assembly and case according to one embodiment of the present invention are joined together. Figure 2 shows the battery cell according to one embodiment of the present invention. Figure 3 shows the battery cell and protection circuit module according to one embodiment of the present invention.

[0046] The secondary battery 1 according to one embodiment of the present invention is not limited to the pouch-type battery shown in Figures 1 to 3. However, for the sake of convenience, the following description will be based on the pouch-type battery.

[0047] Referring to Figures 1 to 3, a secondary battery 1 according to one embodiment of the present invention may include an electrode assembly 110, a case 120, and a protection circuit module 200.

[0048] According to one embodiment, the electrode assembly 110 may include a first electrode plate 111, a second electrode plate 112, and a separator 113. The first electrode plate 111 may be a negative electrode plate and the second electrode plate 112 may be a positive electrode plate. Alternatively, the first electrode plate 111 may be a positive electrode plate and the second electrode plate 112 may be a negative electrode plate.

[0049] According to one embodiment, the electrode assembly 110 may be formed by winding or stacking a laminate of a first electrode plate 111, a separator 113, and a second electrode plate 112, which are formed in the form of thin plates or thin films. If the electrode assembly 110 is a wound laminate, the winding axis may be parallel to the long axis of the case 120. The electrode assembly 110 may also be a stacked type rather than a wound type, but the shape of the electrode assembly 110 is not limited in this disclosure.

[0050] According to one embodiment, the first electrode plate 111 may be formed by coating a current collector plate made of a metal foil such as copper, a copper alloy, nickel, or a nickel alloy with an active material such as graphite or carbon. The first electrode plate 111 may include a first blank area, which is an area where no active material is coated. The first blank area may be connected to a separately formed first electrode tab 111a, or a portion of the first blank area may be punched out to form the first electrode tab 111a.

[0051] According to one embodiment, the second electrode plate 112 may be formed by coating a current collector plate made of a metal foil such as aluminum or an aluminum alloy with an active material such as a transition metal oxide. The second electrode plate 112 may include a second blank area in which the active material is not coated. The second blank area may be connected to a separately formed second electrode tab 112a, or a portion of the second blank area may be punched out to form the second electrode tab 112a.

[0052] According to one embodiment, the separator 113 may be located between the first electrode plate 111 and the second electrode plate 112. The separator 113 insulates the first electrode plate 111 and the second electrode plate 112 and can exchange lithium ions between the first electrode plate 111 and the second electrode plate 112. The separator 113 may have sufficient length so that the first electrode plate 111 and the second electrode plate 112 are completely insulated even if the electrode assembly 110 contracts or expands during the charging and discharging process of the secondary battery 1.

[0053] In one embodiment, a first electrode tab 111a and a second electrode tab 112a may be provided on one side of the electrode assembly 110. The first electrode tab 111a and the second electrode tab 112a correspond to a first electrode plate 111 and a second electrode plate 112, respectively, and may protrude from the first electrode plate 111 and the second electrode plate 112 to one side, respectively. The first electrode tab 111a may be electrically connected to the first electrode, and the second electrode tab 112a may be electrically connected to the second electrode.

[0054] According to one embodiment, the film portion 115 may be provided on the first electrode tab 111a and the second electrode tab 112a, respectively. The film portion 115 may be provided on one side of the first electrode tab 111a and the second electrode tab 112a, or it may surround both sides of the first electrode tab 111a and the second electrode tab 112a. The film portion 115 can prevent the first electrode tab 111a and the second electrode tab 112a from coming into contact with the metal layer exposed from the cross section of the seal portion 122 of the case 120 and causing a short circuit. The film portion 115 may be thermally fused with the seal portion 122, so that the first electrode tab 111a and the second electrode tab 112a and the seal portion 122 are firmly bonded together.

[0055] According to one embodiment, the case 120 can form the external appearance of the secondary battery 1. The case 120 can have a rectangular parallelepiped shape, as shown in Figures 1 to 3, but is not limited to this.

[0056] According to one embodiment, the case 120 may include a housing portion 121 and a sealing portion 122.

[0057] According to one embodiment, the housing section 121 has an internal space larger than the size of the electrode assembly 110 and can accommodate the electrode assembly 110 and the electrolyte. With the electrode assembly 110 housed in the housing section 121, the cover of the case 120 can be placed over it to seal the electrode assembly 110.

[0058] In one embodiment, the sealing portion 122 may be provided along the end of the case 120. With the electrode assembly 110 housed, the sealing portion 122 provided at the end of the case 120 can be sealed. At this time, parts of the first electrode tab 111a and the second electrode tab 112a are exposed to the outside of the case 120, and the film portion 115 may be located between the upper and lower parts of the case 120 corresponding to the sealing portion 122.

[0059] According to one embodiment, the sealing portion 122 may be made of a heat-sealable material and have a structure in which heat-sealable layers are bonded to each other to seal. For example, since heat-sealable materials generally have weak adhesion to metals, the film portion 115 may be attached to the first electrode tab 111a and the second electrode tab 112a in the form of a thin film and welded to the case 120.

[0060] According to one embodiment, the protection circuit module 200 can protect the battery cells from overcharging, over-discharging, and overcurrent of the secondary battery 1.

[0061] According to one embodiment, the protection circuit module 200 can be electrically connected to the electrode assembly 110. The protection circuit module 200 can be electrically connected to the electrode assembly 110 housed in the case 120. As shown in Figure 3, the protection circuit module 200 can be connected to the first electrode tab 111a and the second electrode tab 112a exposed to the outside of the case 120.

[0062] The specific configuration of the protection circuit module 200 according to one embodiment of the present invention will be described later with reference to Figures 4 to 6.

[0063] Figure 4 shows the top surface of a protection circuit module according to one embodiment of the present invention. Figure 5 shows a cross-section of the region along A-A' in Figure 4. Figure 6 shows another embodiment of Figure 5.

[0064] Referring to Figures 4 to 6, the protection circuit module 200 may include a substrate 210, a plurality of components 220 mounted on the substrate 210, a first insulating layer 230, a second insulating layer 240, and a coating layer 250.

[0065] In one embodiment, the substrate 210 can be electrically connected to a battery cell. The substrate 210 can support the configuration of a protection circuit module 200. The substrate 210 is equipped with various electrical circuits and components that can control the operation of the electrode assembly 110. Components mounted on the substrate 210 can communicate with an external control device, etc., via wired / wireless connections. The substrate 210 may be a PCB (Printed Circuit Board). The substrate 210 may be formed from one or more of FR-1, FR-4, CEM-1, CEM-3, TEFLON, ceramic, and / or metal. The substrate 210 may be a Flexible Printed Circuit Board. The substrate 210 may include a metal layer 210a so that electrical signals can be transmitted between components. For example, the metal layer 210a may be, but is not limited to, a copper layer containing copper. The metal layer 210a has been shown to be formed over the entire substrate, but the disclosure is not limited to this. The metal layer 210a is a configuration for electrical connections that enable the components to operate, and may be formed only over a portion of the substrate.

[0066] According to one embodiment, multiple components 220 can be mounted on a mounting area (see Figure 7) 222 on a substrate 210. Each of the multiple components 220 can transmit and receive electrical signals via a metal layer 210a. Multiple components 220 can be mounted on a mounting area 222 on the substrate 210 where a first insulating layer 230 is not formed. Multiple components 220 are mounted on the mounting area 222 and surrounded by a coating layer 250. Corresponding to the mounting area 222 formed on the substrate 210, the multiple components 220 can be mounted spaced apart from each other.

[0067] In one embodiment, multiple components 220 can be in contact with the first insulating layer 230 at their lower ends adjacent to the substrate 210. Multiple components 220 may be located within the closed contour of a second insulating layer 240 formed along the edge of the first insulating layer 230. Multiple components 220 are mounted within the closed contour of the second insulating layer 240 and surrounded by a coating layer 250 formed on the first insulating layer 230.

[0068] According to one embodiment, the plurality of components 220 may include any one of a battery protection element, a charge / discharge switching element, an electrode identification element, and a plurality of passive elements. The plurality of components 220 may also include connecting terminals that connect to the first electrode tab 111a and the second electrode tab 112a, and external terminals that connect to an external load.

[0069] As shown in Figure 6, according to one embodiment, multiple components 220 can be mounted on the substrate 210, each with a different height. Multiple components 220 can be mounted on the substrate 210 with different heights according to their respective specifications. For example, the height (h1) on which the charge / discharge switching element 220a is mounted can be higher than the height (h2) on which the connecting terminal 220b connected to the second electrode tab 112a is mounted.

[0070] According to one embodiment, the first insulating layer 230 may be formed in areas other than the mounting area 222 on the substrate 210. The first insulating layer 230 may be formed in all areas of the substrate 210 other than the mounting area 222.

[0071] According to one embodiment, the first insulating layer 230 can insulate a plurality of components 220 from the outside of the substrate 210. The first insulating layer 230 can be formed using an insulating material. The first insulating layer 230 may, but is not limited to, contain PSR (Photo Solder Resist) ink. For example, the first insulating layer 230 can be formed by printing and drying an insulating material containing PSR ink.

[0072] In one embodiment, the second insulating layer 240 is positioned on the first insulating layer 230 and may extend along the edge of the first insulating layer 230 (i.e., the edge of the substrate 210). The coating layer 250 may be positioned inside the second insulating layer 240 or surrounded by the second insulating layer 240. The second insulating layer 240 may have a closed contour and be formed along the edge of the first insulating layer 230.

[0073] According to one embodiment, the second insulating layer 240 may be formed at a position corresponding to the edge of the substrate 210. The second insulating layer 240 may be formed on the first insulating layer 230 at a position corresponding to the edge of the substrate 210.

[0074] In one embodiment, the second insulating layer 240 is formed on the first insulating layer 230, surrounding the edges of the substrate 210, and the coating layer 250 can be formed inside the area surrounded by the second insulating layer 240. During the process of applying the coating layer 250, the second insulating layer 240 can prevent the coating layer 250 from flowing out of the substrate 210.

[0075] According to one embodiment, the thickness (t2) of the second insulating layer 240 can be thicker than the thickness (t1) of the first insulating layer 230. If the second insulating layer 240 is not formed to a sufficient thickness, it will not be possible to prevent the coating layer 250 from flowing out of the substrate 210.

[0076] As shown in Figure 6, according to one embodiment, the height (h3) of the second insulating layer 240, that is, the height (h3) of the second insulating layer 240 relative to the substrate 210, can be made higher than the height (h4) of the coating layer 250. This is to prevent the coating layer 250 from flowing out of the substrate 210 by forming the second insulating layer 240 higher than the coating layer 250.

[0077] In one embodiment, the height (h3) of the second insulating layer 240 can be lower than the height (h1) of the tallest mounted component 220a among the multiple components 220. This is to prevent the second insulating layer 240 from increasing the overall thickness of the protective circuit module 200.

[0078] In one embodiment, the height (h3) at which the second insulating layer 240 is formed can be lower than the height (h2) of the lowest mounted component 220b among the multiple components 220. This is to prevent the second insulating layer 240, which is formed surrounding the edges of the substrate 210, from acting as a barrier during the process of connecting the first electrode tab 111a and the second electrode tab 112a with the connecting terminal mounted on the protection circuit module 200.

[0079] According to one embodiment, the second insulating layer 240 may be formed using an insulating material. The second insulating layer 240 may, but is not limited to, include PSR (Photo Solder Resist) ink. For example, the second insulating layer 240 may be formed by printing and drying an insulating material containing PSR ink.

[0080] According to one embodiment, the coating layer 250 may be formed on the first insulating layer 230. The coating layer 250 may be formed on the first insulating layer 230 so as to surround a plurality of components 220. The coating layer 250 may be formed as a single layer surrounding the outer surfaces of the plurality of components 220.

[0081] According to one embodiment, the coating layer 250 may be formed within a closed contour surrounded by the second insulating layer 240. Within the closed contour surrounded by the second insulating layer 240, a plurality of components 220 may be located in the mounting region 222, and the coating layer 250 may be located in a region other than the mounting region 222.

[0082] According to one embodiment, the coating layer 250 may be formed lower than the second insulating layer 240. The height (h4) at which the coating layer 250 is formed may be lower than the height (h3) at which the second insulating layer 240 is formed. As described above, in order to prevent the coating layer 250 from flowing out of the substrate 210, the coating layer 250 must be formed lower than the second insulating layer 240.

[0083] According to one embodiment, the coating layer 250 may be formed lower than the multiple components 220. The height (h4) at which the coating layer 250 is formed can be lower than the height (h1) of the tallest mounted component among the multiple components 220. This is to prevent the coating layer 250 from increasing the overall thickness of the protection circuit module 200.

[0084] According to one embodiment, the coating layer 250 may include an underfill coating material. The coating member to which the coating layer 250 is applied may be an underfill coating material. The underfill coating material may be an insulating resin. Since the coating layer 250 containing the underfill coating material has excellent diffusion properties, the thickness of the coating layer 250 applied to the first insulating layer 230 can be formed uniformly.

[0085] Figures 7 to 15 are diagrams illustrating the manufacturing process of a protection circuit module according to one embodiment of the present invention. Figure 16 is a flowchart illustrating the manufacturing process of a protection circuit module according to one embodiment of the present invention.

[0086] In the following, each step of the manufacturing method for a protection circuit module 200 according to one embodiment of the present invention will be described in detail with reference to Figures 7 to 15.

[0087] In step S1100 of Figure 16, according to one embodiment, a mounting area 222 can be formed on the substrate 210. The substrate 210 can be electrically connected to the battery cell. The substrate 210 can support the configuration of the protection circuit module 200. The substrate 210 may be a PCB (Printed Circuit Board). The substrate 210 can be formed from one or more of FR-1, FR-4, CEM-1, CEM-3, TEFLON, ceramic and / or metal. The substrate 210 may include a metal layer 210a so that electrical signals are transmitted between components.

[0088] According to one embodiment, a circuit that performs an operation capable of protecting the battery cell can be realized on the substrate 210, and a mounting area 222 can be set. Multiple components 220 can be mounted in each of the mounting areas 222. The multiple components 220 may include any one of a battery protection element, a charge / discharge switching element, an electrode identification element, and multiple passive elements. In addition, the multiple components 220 may include connecting terminals that are connected to the first electrode tab 111a and the second electrode tab 112a, and external terminals that are connected to an external load.

[0089] In step S1200 of Figure 16, according to one embodiment, a first insulating layer 230 can be formed on the substrate 210 in an area other than the mounting area 222.

[0090] Referring to Figures 7 and 8, in one embodiment, the first insulating mask 232 can be placed on the mounting area 222 on the substrate 210. The first insulating mask 232 can expose only the areas on the substrate 210 other than the mounting area 222. The first insulating material can be applied to the entire area of ​​the substrate 210 to form the first insulating layer 230. The first insulating mask 232 can prevent the first insulating material from being applied to the mounting area 222. The first insulating layer 230 can be formed on the entire area of ​​the substrate 210 other than the mounting area 222. After the first insulating layer 230 is formed, the first insulating mask 232 can be removed.

[0091] According to one embodiment, the first insulating member forming the first insulating layer 230 may, but is not limited to, a PSR (Photo Solder Resist) ink.

[0092] For example, a first insulating layer 230 can be formed by printing and drying a first insulating member containing PSR ink. The first insulating member containing PSR ink can be deposited onto the substrate 210 to a thickness of approximately 10 μm to 15 μm during the first printing. After the first insulating member has undergone a drying process, it can be deposited onto the substrate 210 to a thickness of approximately 20 μm to 30 μm during the second printing. This forms the first insulating layer 230. The method for forming the first insulating layer 230 described above is merely an example, and this disclosure is not limited thereto.

[0093] In step S1300 of Figure 16, according to one embodiment, a second insulating layer 240 can be formed on the first insulating layer 230 along the edge of the first insulating layer 230.

[0094] Referring to Figures 9 to 12, in one embodiment, a second insulating mask 242 can be placed on the first insulating layer 230. The second insulating mask 242 can expose only the area on the first insulating layer 230 corresponding to the edge of the substrate 210. A second insulating layer 240 can be formed at a position corresponding to the edge of the substrate 210 by applying a second insulating material. The second insulating layer 240 is formed at a position corresponding to the edge of the substrate 210 and can have a closed contour. After forming the second insulating layer 240, the second insulating mask 242 can be removed. The second insulating layer 240 has a closed contour and can be formed along the edge of the first insulating layer 230.

[0095] According to one embodiment, the thickness (t2) of the second insulating layer 240 can be thicker than the thickness (t1) of the first insulating layer 230. If the second insulating layer 240 is not formed to a sufficient thickness, it will not be possible to prevent the coating layer 250 from flowing out of the substrate 210.

[0096] According to one embodiment, the second insulating member forming the second insulating layer 240 may, but is not limited to, contain PSR (Photo Solder Resist) ink.

[0097] More specifically, for example, a second insulating layer 240 can be formed by printing and drying a second insulating member containing PSR ink. The second insulating member containing PSR ink can be deposited on the first insulating layer 230 to a thickness of approximately 10 μm to 15 μm during the first printing. After the drying process, printing can be repeated. The printing process can be repeated so that the second insulating member has a thickness of approximately 50 μm or more to form the second insulating layer 240. The method for forming the second insulating layer 240 described above is merely an example, and this disclosure is not limited thereto.

[0098] In step S1400 of Figure 16, according to one embodiment, multiple components 220 can be mounted in the mounting area 222.

[0099] Referring to Figures 13 and 14, in one embodiment, multiple components 220 can be mounted in a mounting area 222 on a substrate 210. Each of the multiple components 220 can transmit and receive electrical signals via the metal layer 210a. Multiple components 220 can be mounted in a mounting area 222 on the substrate 210 where the first insulating layer 230 is not formed. Corresponding to the mounting area 222 formed on the substrate 210, the multiple components 220 can be mounted spaced apart from each other.

[0100] In one embodiment, multiple components 220 can be in contact with the first insulating layer 230 at their lower ends adjacent to the substrate 210. Multiple components 220 may be located within the closed contour of the second insulating layer 240 formed along the edge of the first insulating layer 230. Multiple components 220 can be mounted within the closed contour of the second insulating layer 240.

[0101] According to one embodiment, multiple components 220 can be mounted on the substrate 210, each having a different height. Multiple components 220 can be mounted on the substrate 210, each having a different height according to their respective specifications.

[0102] In step S1500 of Figure 16, according to one embodiment, a coating layer 250 can be formed on the first insulating layer 230 so as to surround a plurality of components 220.

[0103] Referring to Figure 15, according to one embodiment, the coating layer 250 may be formed on the first insulating layer 230. The coating layer 250 may be formed on the first insulating layer 230 so as to surround a plurality of components 220. The coating layer 250 may be formed as a single layer surrounding the outer surfaces of the plurality of components 220.

[0104] According to one embodiment, the coating layer 250 may be formed within a closed contour surrounded by the second insulating layer 240. Within the closed contour surrounded by the second insulating layer 240, a plurality of components 220 may be located in the mounting region 222, and the coating layer 250 may be located in a region other than the mounting region 222.

[0105] According to one embodiment, the coating layer 250 may be formed lower than the second insulating layer 240. The height (h4) at which the coating layer 250 is formed may be lower than the height (h3) at which the second insulating layer 240 is formed. As described above, in order to prevent the coating layer 250 from flowing out of the substrate 210, the coating layer 250 must be formed lower than the second insulating layer 240.

[0106] According to one embodiment, the coating layer 250 may include an underfill coating material. The coating member to which the coating layer 250 is applied may be an underfill coating material. The underfill coating material may be an insulating resin. Since the coating layer 250 containing the underfill coating material has excellent diffusion properties, the thickness of the coating layer 250 applied to the first insulating layer 230 can be formed uniformly.

[0107] The coating layer 250 formed in this manner is surrounded by the second insulating layer 240 and does not flow out to the outside of the substrate 210. By surrounding the entirety of multiple components 220 as a single coating layer 250, the mounting strength of the components can be increased.

[0108] Although the present invention has been described above with reference to limited embodiments and drawings, it is not limited thereto, and of course, a wide range of modifications and variations are possible within the equivalent scope of the technical concept and claims of the present invention by persons with ordinary skill in the art to which the present invention pertains. [Explanation of Symbols]

[0109] 1 Secondary battery 110 Electrode assembly 111a First electrode tab 112a Second electrode tab 115 Film section 120 cases 200 Protection Circuit Modules 210 circuit boards 220 Multiple parts 230 First insulating layer 240 Second insulating layer 250 coating layers

Claims

1. A circuit board electrically connected to the battery cell, Multiple components mounted on the mounting area on the aforementioned substrate, A first insulating layer formed on the substrate in a region other than the mounting region, A second insulating layer is formed on the first insulating layer and is formed separately from the plurality of components, A protective circuit module comprising: a coating layer formed on the first insulating layer and surrounding the plurality of components.

2. The protective circuit module according to claim 1, wherein the second insulating layer is formed along the edge of the first insulating layer.

3. The first insulating layer is formed on the substrate in all areas other than the mounting area. The protective circuit module according to claim 2, wherein the second insulating layer is formed at a position corresponding to the edge of the substrate.

4. The second insulating layer has a closed contour, The protection circuit module according to claim 3, wherein the plurality of components are located within the closed contour.

5. The protective circuit module according to claim 4, wherein the coating layer is located in a region other than the mounting region within the closed contour.

6. The protective circuit module according to claim 1, wherein the second insulating layer is formed to be thicker than the first insulating layer.

7. The protection circuit module according to claim 1, wherein the height of the second insulating layer is lower than the highest height among the multiple components.

8. The protection circuit module according to claim 1, wherein the height of the second insulating layer is lower than the lowest height among the multiple components.

9. The protective circuit module according to claim 1, wherein the coating layer is formed lower than the second insulating layer.

10. The protective circuit module according to claim 1, wherein the coating layer is formed lower than the plurality of components.

11. The protective circuit module according to claim 1, wherein the first insulating layer and the second insulating layer contain PSR ink.

12. The protective circuit module according to claim 1, wherein the coating layer includes an underfill coating material.

13. The steps include forming a first insulating layer on a substrate in an area other than the mounting area where components are mounted, The steps include forming a second insulating layer on the first insulating layer along the edge of the first insulating layer, The steps include mounting multiple components in the aforementioned mounting area, A method for manufacturing a protective circuit module, comprising the step of forming a coating layer on the first insulating layer so as to surround the plurality of components.

14. The step of forming the first insulating layer includes forming the first insulating layer on the substrate in all areas other than the mounting area, The method for manufacturing a protective circuit module according to claim 13, wherein the step of forming the second insulating layer includes forming the second insulating layer at a position corresponding to the edge of the substrate.

15. The step of forming the second insulating layer includes the step of forming the second insulating layer such that it has a closed contour, The method for manufacturing a protective circuit module according to claim 14, wherein the step of forming the coating layer includes forming the coating layer so that it is located in a region other than the mounting region within the closed contour.

16. The method for manufacturing a protective circuit module according to claim 13, wherein the step of forming the second insulating layer includes the step of forming the second insulating layer to be thicker than the thickness of the first insulating layer.

17. The method for manufacturing a protective circuit module according to claim 13, wherein the step of forming the second insulating layer includes forming the second insulating layer at a height lower than the lowest height among the multiple components to be mounted.

18. The method for manufacturing a protective circuit module according to claim 13, wherein the step of forming the coating layer includes the step of forming the coating layer lower than the second insulating layer.

19. Electrode assembly and A case for housing the electrode assembly, Includes a protection circuit module connected to the electrode assembly, The aforementioned protection circuit module is A substrate electrically connected to the electrode assembly, Multiple components mounted on the mounting area on the aforementioned substrate, A first insulating layer formed on the substrate in a region other than the mounting region, A second insulating layer is formed on the first insulating layer and is formed separately from the plurality of components, A secondary battery comprising a coating layer formed on the first insulating layer and surrounding the plurality of components.

20. The secondary battery according to claim 19, wherein the second insulating layer is formed along the edge of the first insulating layer.

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