Sensor module

Abstract

To provide sensor modules, etc., that can solve the challenges of environmental loggers, such as miniaturization, cost reduction, or low power consumption. [Solution] The sensor module 600 includes a sensor 200 for detecting environmental information of the target on which the sensor module 600 is mounted, an oscillator 300, an integrated circuit device 100, and a package 500 that houses the sensor 200, the oscillator 300, and the integrated circuit device 100. The integrated circuit device 100 includes an oscillation circuit 110 that generates a clock signal CK using the oscillator 300, a real-time clock circuit 120 that generates time information TMD based on the clock signal CK, and a processing circuit 130 that associates output environmental information based on the output signal SQ of the sensor 200 with the time information TMD from the real-time clock circuit 120 and outputs it as log information LGD.

Description

Technical Field

[0001] The present invention relates to a sensor module and the like.

Background Art

[0002] Patent Document 1 discloses a shock detection device. The shock detection device houses a clock, an acceleration sensor, a control unit, a storage unit, a wireless communication unit, a battery, and a housing in a semi-transparent or transparent resin housing. The control unit compares the acceleration measured by the acceleration sensor with a threshold value, and generates shock data in which the acceleration when the threshold value is exceeded and the measurement date and time are associated. The storage unit stores the shock data. The wireless communication unit transmits the shock data stored in the storage unit to a mobile terminal.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Document 1 does not disclose a specific structure as an environmental logger during transportation or the like. For example, when a sensor such as an acceleration sensor and a timekeeping function such as a real-time clock are prepared as separate components and modularized, various problems occur as an environmental logger. For example, there are problems such as an increase in the product size as an environmental logger, an increase in power consumption, or an increase in cost.

Means for Solving the Problems

[0005] One aspect of the present disclosure relates to a sensor module that includes a sensor for detecting environmental information of a target on which a sensor module is mounted, a vibrator, an integrated circuit device, and a package housing the sensor, the vibrator, and the integrated circuit device, wherein the integrated circuit device includes an oscillation circuit that generates a clock signal using the vibrator, a real-time clock circuit that generates time information based on the clock signal, and a processing circuit that associates output environmental information based on the output signal of the sensor with the time information from the real-time clock circuit and outputs it as log information. [Brief explanation of the drawing]

[0006] [Figure 1] External perspective view of a sensor module that detects environmental information. [Figure 2] First example of sensor module installation. [Figure 3] A second example of sensor module installation. [Figure 4] An example of the first circuit block configuration of the sensor module. [Figure 5] An example of the second circuit block configuration for the sensor module. [Figure 6] Detailed configuration example of sensor and detection circuit. [Figure 7] A first configuration example for reducing power consumption of the detection circuit and processing circuit. [Figure 8] A second configuration example for reducing power consumption of the detection circuit and processing circuit. [Figure 9] An example of the acceleration signal waveform when a single impact is applied to the sensor module. [Figure 10] Diagram illustrating the damage boundary curve. [Figure 11] Example of log information. [Figure 12] Examples of event detection methods. [Figure 13] A first structural example of a sensor module. [Figure 14] A first structural example of a sensor module. [Figure 15] A second example of the sensor module structure. [Figure 16] A third structural example of a sensor module. [Figure 17] A third structural example of a sensor module. [Figure 18] First example of battery placement. [Figure 19] A second example of battery placement. [Modes for carrying out the invention]

[0007] Preferred embodiments of this disclosure will be described in detail below. Note that these embodiments are not intended to unduly limit the scope of the claims, and not all configurations described in these embodiments are necessarily essential.

[0008] Figure 1 is an external perspective view of the sensor module 600 that detects environmental information. The three mutually orthogonal directions are defined as the x, y, and z directions. The z direction can also be called the height direction.

[0009] The sensor module 600 includes a package 500, which houses a sensor, an oscillator, and an integrated circuit device. The package 500 is roughly rectangular in shape, with each side of the rectangular parallelepiped aligned with the x, y, or z axis. The bottom surface of the package 500 is provided with a number of external connection terminals TM for connecting the integrated circuit device housed in the package 500 to the outside of the package 500. Figure 1 shows external connection terminals TM that wrap around from the side to the bottom surface of the package 500, but the shape of the external connection terminals TM is not limited to this. The external connection terminals TM may be, for example, bump terminals provided on the bottom surface of the package 500, or lead terminals extending outward from the outer circumference of the bottom surface of the package 500.

[0010] As the package 500, for example, a ceramic package used for an oscillator or a sensor using a crystal oscillator is assumed. Such a ceramic package can be considered as a single component mounted on a printed circuit board or the like, and is very small compared to a general electronic device in which a plurality of components are combined and housed in a casing. As an example, in the package 500, the length WD of the longest side is 20 mm or less. FIG. 1 shows an example in which the length of the side in the x direction is the largest, but the length of the side in the y direction or the z direction may be the largest. Thus, by configuring the sensor module 600 with the small package 500, an environment logger that is very small compared to the impact detection device as in Patent Document 1 can be realized. Note that the package 500 is not limited to a ceramic package, and may be various packages such as a resin package. Further, although the sensor module 600 has an external connection terminal TM, it does not necessarily have to be mounted on a substrate as long as power is supplied.

[0011] An installation example of the sensor module 600 will be described. The sensor module 600 is used for sensing and recording environmental information in the logistics process. That is, it will be installed on the article to be transported or around the article. Here, the logistics process may include not only transportation but also packing, unpacking, or installation of the transported goods before and after transportation. Further, the sensor module 600 may be used in a part of packing, transportation, unpacking, and installation.

[0012] FIG. 2 shows a first installation example of the sensor module 600. The sensor module 600 is mounted on the substrate 11 of the electronic device 10. Various components such as ICs, resistors, capacitors, or connectors for realizing the functions of the electronic device 10 may be mounted on the substrate 11. The electronic device 10 can be various types, and as an example, it can be a printer, a projector, a television device, a camera, a personal computer, a display, a game machine, a smartphone, a smartwatch, a head-mounted display, or an audio device, etc. The electronic device 10 is housed in the packaging material 1 and transported. The sensor module 600 senses the environmental information during the logistics process of the electronic device 10 to be mounted. The environmental information is, for example, shock, acceleration, angular velocity, temperature, dew point, humidity, odor, gas, force, or pressure, etc. The sensor module 600 detects one or more of these.

[0013] FIG. 3 shows a second installation example of the sensor module 600. The sensor module 600 is built into an environmental logger 30 separate from the electronic device 20. The sensor module 600 is mounted on a substrate inside the environmental logger 30, for example. The electronic device 20 is housed in the packaging material 1, and the environmental logger 30 is arranged inside the packaging material 1. By sensing the environmental information of the environmental logger 30 to be mounted, the sensor module 600 will also sense the environmental information of the electronic device 20 housed in the same packaging material 1.

[0014] Note that the electronic device 10 and the environmental logger 30 are examples of the objects to be mounted with the sensor module 600, and the sensor module 600 may be mounted on various articles. Also, the installation position of the environmental logger 30 is not limited to inside the packaging material 1. For example, the environmental logger 30 may be arranged inside an article that is a non-electronic device. Or, the environmental logger 3 may be arranged inside the cargo compartment of an automobile, a railway, a ship, or an aircraft that transports the article, or may be mounted inside a container that stores the article during transportation, etc.

[0015] Figure 4 shows an example of the first circuit block configuration of the sensor module 600. The package 500 is not shown here. The sensor module 600 includes an integrated circuit device 100, a sensor 200, a vibrator 300, and an external connection terminal TM.

[0016] Sensor 200 detects environmental information and outputs the resulting output signal SQ. A specific example of sensor 200 will be described later. Figure 4 shows an example where sensor module 600 has one sensor, but sensor module 600 may have multiple sensors.

[0017] The oscillator 300 is an element that generates mechanical vibrations in response to an electrical signal. The oscillator 300 can be realized using a vibrating element such as a quartz crystal vibrator. For example, the oscillator 300 is a tuning fork type quartz crystal vibrator. Alternatively, the oscillator 300 may be a quartz crystal vibrator that vibrates with a thickness shear, such as an AT cut or SC cut. Alternatively, the oscillator 300 may be any vibrating element other than a tuning fork type or a thickness shear vibrator, or a piezoelectric vibrator made of a material other than quartz. For example, the oscillator 300 may be a SAW resonator, or a MEMS oscillator as a silicon oscillator formed using a silicon substrate. SAW stands for Surface Acoustic Wave, and MEMS stands for Micro Electro Mechanical Systems.

[0018] The integrated circuit device 100 includes an oscillator circuit 110, a real-time clock circuit 120, a processing circuit 130, a detection circuit 140, a memory circuit 150, and an interface circuit 160. The integrated circuit device 100 is, for example, a semiconductor substrate on which multiple circuit elements are integrated.

[0019] The oscillation circuit 110 drives the resonator 300 to cause it to oscillate, and generates a clock signal CK based on the oscillation signal. One example of the oscillation circuit 110 is a Colpitts oscillator, but it is not limited to this. Also, if the sensor 200 uses a resonator, the resonator of the sensor 200 may be used as the resonator 300, and the drive circuit that drives the resonator of the sensor 200 may be the oscillation circuit 110. Specific examples of this will be described later along with specific examples of the sensor 200.

[0020] The real-time clock circuit 120 is a circuit that has a clock function and generates time information TMD representing the current time by counting operation based on a clock signal CK. The real-time clock circuit 120 includes, for example, a frequency divider circuit that divides the clock signal CK and a time counter that counts the current time using the divided clock signal. The time information TMD may be, for example, the count value data of the time counter itself, or it may be data representing all or part of the year, month, day, hour, minute, and second.

[0021] The detection circuit 140 performs detection processing on the output signal SQ of the sensor 200 and outputs sensor detection information SSD as a result. The output signal SQ is, for example, an analog signal such as charge, current, or voltage. The sensor detection information SSD is, for example, digital data that can be handled by a subsequent logic circuit. The digital data is not limited to multi-bit data, but may also include a 1-bit binary signal. The detection circuit 140 includes, for example, an A / D conversion circuit that performs A / D conversion on the output signal SQ and outputs sensor detection information SSD. Alternatively, the detection circuit 140 may include an amplifier circuit that amplifies the output signal SQ and an A / D conversion circuit that performs A / D conversion on the output signal of the amplifier circuit and outputs sensor detection information SSD. Alternatively, if the output signal SQ includes a carrier signal and a detection signal, the detection circuit 140 may include a detection circuit that detects the detection signal from the output signal SQ and an A / D conversion circuit that performs A / D conversion on the detected detection signal and outputs sensor detection information SSD. Alternatively, if the sensor detection information SSD is a binary output, the detection circuit 140 may include a comparator that compares the output signal SQ with a reference voltage corresponding to a threshold.

[0022] The processing circuit 130 associates output environment information based on sensor detection information SSD with time information TMD and outputs it as log information LGD. The output environment information may be the sensor detection information SSD itself, or it may be information obtained by performing calculations on the sensor detection information SSD. The calculations may include various operations such as addition, subtraction, multiplication, division, differentiation, integration, or statistical operations. The processing circuit 130 may output log information LGD at all times, or it may output log information LGD when an environment information detection event is detected. Specific examples of log information LGD will be described later. The processing circuit 130 may include, for example, a DSP that performs calculations on the sensor detection information SSD. DSP stands for Digital Signal Processor. The processing circuit 130 may also include a control circuit. The control circuit may control some or all of the detection circuit 140, the real-time clock circuit 120, the oscillation circuit 110, the memory circuit 150, and the interface circuit 160. The arrow lines related to this control are not shown in the illustration. The DSP, control circuit, and real-time clock circuit 120 may be configured as a single logic circuit, either partially or entirely, by automatic placement and routing or the like.

[0023] The memory circuit 150 stores the log information LGD from the processing circuit 130. The memory circuit 150 is a semiconductor memory, and is either RAM or non-volatile memory. RAM is, for example, SRAM or DRAM. SRAM stands for Static Random Access Memory, and DRAM stands for Dynamic Random Access Memory. Non-volatile memory can be any electrically writable ROM, for example, EEPROM. EEPROM stands for Electrically Erasable Programmable Read Only Memory.

[0024] The interface circuit 160 is a circuit that communicates with the outside of the sensor module 600 via an external connection terminal TM. The interface circuit 160 outputs log information LGD stored in the memory circuit 150 to the outside. For example, the interface circuit 160 reads the log information LGD from the memory circuit 150 and outputs it to the outside in response to a read command from the outside. Alternatively, the interface circuit 160 may output the log information LGD output by the processing circuit 130 to the outside without going through the memory circuit 150. The interface circuit 160 may be an inter-circuit communication interface circuit of various standards. For example, the interface circuit 160 is an SPI or I2C serial communication interface circuit. SPI stands for Serial Peripheral Interface, and I2C stands for Inter-Integrated Circuit.

[0025] Figure 5 shows an example of a second circuit block configuration of the sensor module 600. In this configuration, the integrated circuit device 100 includes the sensor 200. This configuration is also possible if the sensor 200 can be formed on a semiconductor substrate. The configuration and operation of each element are the same as in the first circuit block configuration example. In this example, the integrated circuit device 100 including the sensor 200 is housed in the package 500, so the sensor 200 and the integrated circuit device 100 are housed in the package 500.

[0026] Let's explain a specific example of sensor 200. (1) Accelerometer: Sensor 200 is, for example, a capacitive accelerometer made of silicon MEMS. MEMS is an abbreviation for Micro Electro Mechanical Systems. Alternatively, sensor 200 may be an accelerometer using a quartz crystal oscillator, or an accelerometer using a piezoelectric element, etc. Sensor module 600 equipped with an accelerometer can be used, for example, as an impact logger. That is, sensor module 600 detects and records the impact applied to the mounted object as environmental information using the accelerometer.

[0027] (2) Dew point sensor: Sensor 200 is a sensor that detects the presence or absence of condensation. Sensor 200 may directly detect whether or not condensation is present, or it may indirectly detect the presence or absence of condensation by detecting whether or not the humidity has reached 100%.

[0028] (3) Odor sensor: Sensor 200 is, for example, a gas sensor, which detects odors by detecting gases in the air.

[0029] (4) Force sensor: Sensor 200 is, for example, a load sensor using a quartz crystal oscillator. Sensor 200 includes a double tuning fork type quartz crystal oscillator and a cantilever, and is configured such that the tension of the double tuning fork type quartz crystal oscillator changes when a force is applied to the cantilever. The change in tension changes the vibration frequency of the double tuning fork type quartz crystal oscillator, and by detecting this change, force can be detected. Alternatively, sensor 200 may be a force sensor or pressure sensor using silicon MEMS.

[0030] (5) Temperature sensor: The sensor 200 is, for example, a thermistor, thermocouple, or resistance thermometer. Alternatively, the sensor 200 may be a temperature sensor that measures temperature using the temperature characteristics of the forward voltage of a PN junction. Such a temperature sensor may be built into the integrated circuit device 100 as shown in Figure 5. The integrated circuit device 100 may include, for example, a temperature sensor and a temperature compensation circuit that uses the detection signal of the temperature sensor to temperature-compensate the oscillation frequency of the oscillation circuit 110. The temperature sensor used for this temperature compensation may also be used as the sensor 200.

[0031] (6) Angular velocity sensor: Sensor 200 is a gyro sensor using a quartz crystal oscillator or a MEMS oscillator. For example, a quartz crystal oscillator has a drive arm and a detection arm, and a drive circuit drives the drive arm to vibrate it. When a Coriolis force is generated by the angular velocity, the vibration state of the detection arm changes, and the angular velocity can be detected by detecting this change. This quartz crystal oscillator may also be used as an oscillator 300 for generating a clock signal CK. In that case, the drive circuit that drives the drive arm corresponds to the oscillation circuit 110.

[0032] By using the sensor 200 described above to detect environmental information and recording it together with time information from the real-time clock circuit 120, an environmental logger for the logistics process can be constructed. The recording of time information makes it possible to retrospectively determine, for example, the time when a specific event occurred. By comparing this log information with information on the timing of each stage of logistics, it becomes possible to infer at which stage of logistics a particular event occurred.

[0033] Furthermore, by housing the sensor 200, integrated circuit device 100, and vibrator 300 as shown in Figure 4 or Figure 5 in a package 500 as shown in Figure 1 to constitute a sensor module 600, the challenges of an environmental logger can be solved. For example, a small and inexpensive environmental logger, or a small, inexpensive, and low-power environmental logger, can be constructed. The size and price of objects transported in logistics vary. Environmental loggers that are relatively large or relatively expensive relative to the objects being transported are difficult to use. In this respect, the sensor module 600 of this embodiment is small and inexpensive, making it easy to use for any object being transported. Also, since the logistics process requires a certain amount of time, a power supply is needed to operate the environmental logger during that period. The higher the power consumption, the larger and heavier the battery required, but since the sensor module 600 of this embodiment can be powered by a small capacity and light battery can be used.

[0034] The following describes a detailed configuration and operation example using an impact logger with a MEMS acceleration sensor as an example. Figure 6 shows a detailed configuration example of the sensor 200 and the detection circuit 140.

[0035] The sensor 200 includes an x-axis accelerometer element 211, a y-axis accelerometer element 212, and a z-axis accelerometer element 213. While this example shows the sensor 200 as a 3-axis accelerometer, the sensor 200 may also be a 1-axis or 2-axis accelerometer. The sensor 200 has a roughly plate-like shape parallel to the xy-plane. In a specific example, the sensor 200 includes a support substrate having a bottom surface parallel to the xy-plane and a lid joined to the support substrate. The x-axis accelerometer element 211, the y-axis accelerometer element 212, and the z-axis accelerometer element 213 are configured on the support substrate and covered by the lid.

[0036] The x-axis acceleration sensor element 211 includes a comb-shaped fixed electrode fixed to a support substrate, a movable part configured to move relative to the support substrate, and a comb-shaped movable electrode fixed to the movable part. Each tooth of the fixed electrode and each tooth of the movable electrode are arranged to face each other in the x-direction. When acceleration in the x-direction is applied to the x-axis acceleration sensor element 211, the movable part moves in the x-direction, changing the distance between the comb teeth, and thus changing the capacitance between the comb teeth. The detection circuit 140 detects the acceleration in the x-direction as sensor detection information SSD by detecting this change in capacitance. The y-axis acceleration sensor element 212 has a similar configuration.

[0037] The z-axis acceleration sensor element 213 includes a comb-shaped fixed electrode fixed to a support substrate, a movable part that can swing on a rotation axis parallel to the xy plane, and a comb-shaped movable electrode fixed to the movable part. Each comb tooth of the fixed electrode and each comb tooth of the movable electrode are arranged to face each other in the x or y direction. When acceleration in the z direction is applied, the movable part swings, changing the overlapping area between the comb teeth, and thus changing the capacitance between the comb teeth. The detection circuit 140 detects the acceleration in the z direction as sensor detection information SSD by detecting this change in capacitance.

[0038] The detection circuit 140 includes an amplification circuit 141 and an A / D conversion circuit 142. Alternatively, the amplification circuit 141 and the A / D conversion circuit 142 may be provided for each of the x-axis acceleration sensor element 211, the y-axis acceleration sensor element 212, and the z-axis acceleration sensor element 213. Alternatively, the detection circuit 140 may include a selector, which time-divisionally selects the output signals of the x-axis acceleration sensor element 211, the y-axis acceleration sensor element 212, and the z-axis acceleration sensor element 213 and outputs them to the amplification circuit 141.

[0039] The detection circuit 140 includes an amplification circuit 141 and an A / D conversion circuit 142. Here, SQ is assumed to be the output signal of the x-axis accelerometer element 211, but the same applies to the output signals of the y-axis accelerometer element 212 and the z-axis accelerometer element 213.

[0040] The amplification circuit 141 converts the output signal SQ of the x-axis acceleration sensor element 211 into a charge-to-voltage (Q / V) conversion and also amplifies it. The A / D conversion circuit 142 converts the output signal of the amplification circuit 141 into a digital signal and outputs the resulting x-axis acceleration data as sensor detection information SSD.

[0041] Figure 7 shows a first configuration example where the detection circuit 140 and the processing circuit 130 are power-efficient. The integrated circuit device 100 further includes a monitoring circuit 170.

[0042] The monitoring circuit 170 monitors whether the output signal SQ of the sensor 200 has reached a predetermined value, and when the output signal SQ reaches a predetermined value, it switches the detection circuit 140 and the processing circuit 130 from low-power mode to normal operation mode. For example, when the output signal SQ reaches a second predetermined value after reaching a predetermined value, or when a certain period of time has elapsed after the output signal SQ has reached a predetermined value, the monitoring circuit 170 switches the detection circuit 140 and the processing circuit 130 from normal operation mode to low-power mode. The monitoring circuit 170 includes, for example, a comparator that compares the output signal SQ with a predetermined value. At least one of the detection circuit 140 and the processing circuit 130 may be in low-power mode. Also, at least a part of the detection circuit 140 may be in low-power mode. The predetermined value is determined according to what kind of environmental information should be detected when log information LGD should be recorded. If log information LGD is to be recorded when environmental information exceeding a predetermined level is detected, the monitoring circuit 170 only needs to detect whether the output signal SQ has exceeded a predetermined value. Alternatively, if log information LGD is to be recorded when environmental information below a predetermined level is detected, the monitoring circuit 170 only needs to detect whether or not the output signal SQ has fallen below a predetermined value.

[0043] The low-power mode is a mode in which the power consumption of the circuit is lower than that of the circuit in the normal operating mode. In the low-power mode of the amplification circuit 141, for example, the bias current of the amplifier circuit included in the amplification circuit 141 is stopped or reduced to a low current. In the low-power mode of the A / D conversion circuit 142, for example, the bias current of the amplifier circuit included in the A / D conversion circuit 142 is stopped or reduced to a low current. Alternatively, the clock signal input to the A / D conversion circuit 142 is stopped. In the low-power mode of the processing circuit 130, the input of sensor detection information SSD to the processing circuit 130 is stopped. Alternatively, the clock signal input to the processing circuit 130 is stopped.

[0044] Figure 8 shows a second configuration example where the detection circuit 140 and the processing circuit 130 are power-efficient. The integrated circuit device 100 further includes a monitoring circuit 170. The monitoring circuit 170 here is a logic circuit and may be provided separately from the real-time clock circuit 120 and the processing circuit 130, or it may be included in the real-time clock circuit 120 or the processing circuit 130.

[0045] The monitoring circuit 170, based on the time information TMD generated by the real-time clock circuit 120, switches the detection circuit 140 and the processing circuit 130 from low-power mode to normal operation mode, or from normal operation mode to low-power mode, when a predetermined time is reached. Alternatively, the monitoring circuit 170 may, based on the time information TMD, set the detection circuit 140 and the processing circuit 130 to normal operation mode for a predetermined period, and set them to low-power mode outside of that period.

[0046] Figure 9 shows an example of the acceleration signal waveform when the sensor module 600 is subjected to a single impact. The acceleration signal waveform when an impact is applied is, for example, a waveform called a half-sine wave. Let α be the peak acceleration of the signal waveform and ΔV be the velocity change. The velocity change ΔV corresponds to the area obtained by integrating the signal waveform. The event occurrence time TE and the predetermined period PRC will be described later.

[0047] Figure 10 is an explanatory diagram of the damage boundary curve. The damage boundary curve is sometimes abbreviated as DBC. The damage boundary curve 5 shown in Figure 10 is defined in a plane where the horizontal axis is velocity change ΔV and the vertical axis is peak acceleration α. ​​The damage boundary curve 5 has a roughly L-shape. Of the regions demarcated by the damage boundary curve 5, the region on the side where the velocity change ΔV and peak acceleration α are large is the damaged region RD, and the region on the side where the velocity change ΔV and peak acceleration α are small is the undamaged region RND. If the velocity change ΔV and peak acceleration α belonging to the damaged region RD are applied to an object, that object may be damaged. The damage boundary curve 5 is determined, for example, by evaluating whether or not damage occurred when an impact was applied to the object.

[0048] The sensor module 600 detects impact information using an acceleration sensor and records the impact information and time information TMD as log information. Using this log information, it is possible to verify whether an impact exceeding the damage boundary curve 5 was applied to the transported object, that is, whether a velocity change ΔV and peak acceleration α belonging to the damage region RD were applied to the object. Furthermore, if an impact exceeding the damage boundary curve 5 was applied to the transported object, the time of that impact can be determined, and it is possible to infer at what stage of logistics the impact occurred.

[0049] Figure 11 shows an example of log information LGD. As shown in the "Continuous Recording" table, the processing circuit 130 may continuously record the acceleration detected in time series along with the time information in the storage circuit 150. In this case, the processing circuit 130 records time t1 in association with the acceleration a1 detected at time t1, time t2 in association with the acceleration a2 detected at time t2, time t3 in association with the acceleration a3 detected at time t3, and so on. Times t1, t2, t3, ... are time series in which acceleration is detected, for example, time series at equal intervals.

[0050] As shown in the two tables under "Recording at Event Time," the processing circuit 130 may record log information LGD in the storage circuit 150 in association with the event occurrence time TE. As shown in the table in (Example 1), the processing circuit 130 records acceleration during a predetermined period PRC based on the event occurrence time TE. Figure 9 shows an example of a predetermined period PRC, which is a period of predetermined length centered on the event occurrence time TE. The method for detecting the occurrence of an event will be described later. The predetermined period PRC is not limited to the example in Figure 9; for example, the event occurrence time TE may be included at any timing within the predetermined period PRC. Alternatively, the predetermined period PRC may be a period starting at the event occurrence time TE, or a period ending at the event occurrence time TE. The predetermined period PRC includes times t1 to tn, and accelerations a1 to an are detected at each time. The processing circuit 130 records each time in association with the acceleration detected at each time. Note that the event occurrence time TE may be omitted from the log information, or times t1 to tn may be omitted.

[0051] As shown in the table in (Example 2), the processing circuit 130 associates the event occurrence time TE with the information used for impact determination by DBC and records it in the memory circuit 150. The processing circuit 130 uses the acceleration signal waveform around the event occurrence time TE to obtain the information used for impact determination by DBC. Specifically, the processing circuit 130 obtains the peak acceleration α by performing peak detection on the signal waveform, obtains the velocity change ΔV by integrating the signal waveform, and records the peak acceleration α and velocity change ΔV as information used for impact determination by DBC.

[0052] Figure 12 shows an example of an event detection method. As shown in Example 1, the processing circuit 130 determines whether or not the acceleration exceeds a threshold, and the time at which it is determined that the acceleration has exceeded the threshold is defined as the event occurrence time TE.

[0053] As shown in Example 2, the processing circuit 130 obtains the peak acceleration α and velocity change ΔV from the detected acceleration and determines whether the peak acceleration α and velocity change ΔV have reached the damage region RD of the DBC. The processing circuit 130 defines the time at which it determines that the peak acceleration α and velocity change ΔV have reached the damage region RD as the event occurrence time TE.

[0054] As shown in Example 3, the processing circuit 130 calculates the velocity change ΔV from the detected acceleration and determines whether the velocity change ΔV exceeds a threshold. The processing circuit 130 sets the time at which it determines that the velocity change ΔV has exceeded the threshold as the event occurrence time TE.

[0055] As shown in Example 4, the processing circuit 130 calculates the peak acceleration α from the detected acceleration and determines whether the peak acceleration α exceeds a threshold. The processing circuit 130 sets the time at which it determines that the peak acceleration α exceeds the threshold as the event occurrence time TE.

[0056] Figures 13 and 14 show a first structural example of the sensor module 600. Figure 13 is a plan view of the sensor module 600 as seen in the -z direction, and Figure 14 is a cross-sectional view of the AA section in the plan view as seen in the -x direction. In the following, the external connection terminals TM and the internal wiring of the package are omitted from the illustration. Also, in the plan view, the lid 520 of the package 500 is omitted from the illustration. Furthermore, the +z direction may be referred to as up, and the -z direction as down.

[0057] The package 500 includes a base 510 having a recess and a lid 520 which is a cover for the base 510. The bottom surface SFa of the base 510 is parallel to the xy plane, and the recess of the base 510 opens upward. The integrated circuit device 100, the sensor 200, and the vibrator 300 are sealed within the package 500 by the lid 520 covering the recess such that its edge joins the edge of the recess of the base 510.

[0058] The recess of the base 510 has a bottom surface SFb and a stepped surface SFc provided above the bottom surface SFb. An integrated circuit device 100 is placed on the bottom surface SFb, and a sensor 200 is placed on top of it. The integrated circuit device 100 is, for example, a bare chip. The sensor 200 is, for example, a roughly rectangular parallelepiped. The integrated circuit device 100 and the sensor 200 are arranged so that their thickness direction is the z direction. The resonator 300 is, for example, a quartz resonator, and is configured on a quartz relay substrate 310. The resonator 300 is housed in the base 510 by joining the edges of the relay substrate 310 to the stepped surface SFc. Figures 13 and 14 show an example in which the relay substrate 310 is placed on the -x side of the center of the base 510, and three sides of the relay substrate 310 are joined to the stepped surface SFc. In a plan view, the oscillator 300 may overlap the integrated circuit device 100 and the sensor 200, or it may overlap only the integrated circuit device 100.

[0059] The integrated circuit device 100 and the sensor 200 are connected by internal package wiring. This internal package wiring includes bonding wires or wiring provided inside or on the inner surface of the base 510 structure. For example, the integrated circuit device 100 has a pad made of the top layer metal, and the sensor 200 has terminals for wiring connections. The pad of the integrated circuit device 100 and the terminals of the sensor 200 may be connected by bonding wires, or they may be connected via wiring in the base 510. In the latter case, the pad of the integrated circuit device 100 and the terminals of the sensor 200 may be connected to the wiring in the base 510 by bonding wires or bumps. Similarly, the integrated circuit device 100 and the oscillator 300 are connected by internal package wiring.

[0060] Figure 15 shows a second structural example of the sensor module 600. The plan view is the same as in Figure 13, and Figure 15 shows a cross-sectional view of the AA cross section in the plan view when viewed in the -x direction. In this example, the sensor 200 is placed on the bottom surface SFb, and the integrated circuit device 100 is placed on top of it.

[0061] Figures 16 and 17 show a third structural example of the sensor module 600. Figure 16 is a plan view of the sensor module 600 as seen in the -z direction, and Figure 17 is a cross-sectional view of the BB cross section in the plan view as seen in the +y direction. The differences from the first structural example will now be explained.

[0062] The recess of the base 510 has a bottom surface SFd. The integrated circuit device 100 is placed on the bottom surface SFd, and the sensor 200 is placed on top of it. The vibrator 300 is placed on the bottom surface SFd of the recess at a position that does not overlap with the integrated circuit device 100 in a plan view. Figures 16 and 17 show an example in which the vibrator 300 is placed on the +x direction side of the integrated circuit device 100. Alternatively, the sensor 200 may be placed on the bottom surface SFd of the recess, and the integrated circuit device 100 may be placed on top of it.

[0063] Figure 18 shows a first example of battery configuration. The sensor module 600 includes a sensor 200, an oscillator 300, an integrated circuit device 100, and a battery 50.

[0064] The battery 50 is housed in the package 500 together with the sensor 200, the oscillator 300, and the integrated circuit device 100. The terminals of the battery 50 are connected to the power terminals of the integrated circuit device 100 by internal wiring in the package. The battery 50 stores electrical energy chemically or electrically, and is, for example, a primary battery, a secondary battery, or a capacitor. A primary battery could be, for example, a small button battery. A secondary battery could be, for example, a lithium-ion battery. The capacitor could be an electrolytic capacitor or a so-called supercapacitor.

[0065] Figure 19 shows a second example of battery arrangement. The sensor module 600 and the battery 50 are mounted on the circuit board 70. The circuit board 70 is a circuit board that is built into the device on which the sensor module 600 is mounted. The device on which it is mounted is the electronic device 10 in Figure 2 or the environmental logger 30 in Figure 3, etc. The terminals of the battery 50 are connected to the external connection terminals TM provided on the package 500 of the sensor module 600. These external connection terminals TM are connected to the power terminals of the integrated circuit device 100 by internal wiring within the package.

[0066] In this embodiment, the sensor module 600 includes a sensor 200, an oscillator 300, an integrated circuit device 100, and a package 500. The sensor 200 detects environmental information of the object on which the sensor module 600 is mounted. The package 500 houses the sensor 200, the oscillator 300, and the integrated circuit device 100. The integrated circuit device 100 includes an oscillator circuit 110, a real-time clock circuit 120, and a processing circuit 130. The oscillator circuit 110 generates a clock signal CK using the oscillator 300. The real-time clock circuit 120 generates time information TMD based on the clock signal CK. The processing circuit 130 associates the output environmental information based on the output signal SQ of the sensor 200 with the time information TMD from the real-time clock circuit 120 and outputs it as log information LGD.

[0067] According to this embodiment, an environmental logger for the logistics process can be constructed by detecting environmental information using the sensor 200 and recording it together with time information from the real-time clock circuit 120. By comparing this log information with information on when each stage of logistics took place, it becomes possible to understand the environmental information at each stage of logistics. Furthermore, by housing the sensor 200, integrated circuit device 100, and vibrator 300 in a package 500 to construct a sensor module 600, various challenges for an environmental logger can be solved. For example, a small, low-power, and inexpensive environmental logger can be constructed. That is, because the sensor module 600 of this embodiment can be constructed small and inexpensively, it is easy to use for transported objects of any size or price. In addition, because the sensor module 600 of this embodiment can be powered by low power, it is possible to keep the sensor module 600 running during transport even with a small-capacity and light battery.

[0068] In this embodiment, the package 500 also has external connection terminals TM for mounting onto the substrate to be mounted.

[0069] According to this embodiment, the sensor 200, the integrated circuit device 100, and the vibrator 300 are housed in a small package 500 that can be mounted on a circuit board. Such a package 500 can be considered as a single component mounted on a printed circuit board or the like, and is extremely small compared to typical electronic devices that combine multiple components and house them in a casing.

[0070] In this embodiment, the package 500 may also include a base 510 and a lid 520. The base 510 houses the sensor 200, the transducer 300, and the integrated circuit device 100, and may be provided with external connection terminals TM. The lid 520 may be bonded to the base 510.

[0071] According to this embodiment, the sensor module 600 can be constructed using a small package 500, such as a ceramic package used in an oscillator or sensor using a quartz crystal oscillator.

[0072] In this embodiment, the external connection terminal TM may also be a terminal that outputs log information LGD to the outside of the sensor module 600.

[0073] In this embodiment, the integrated circuit device 100 may also include an interface circuit 160 for outputting log information LGD to the outside of the sensor module 600 via an external connection terminal TM.

[0074] According to this embodiment, the sensor module 600 can output log information LGD to the outside via the external connection terminal TM. For example, the processor of an electronic device or environmental logger on which the sensor module 600 is mounted can read the log information LGD from the sensor module 600 via the external connection terminal TM.

[0075] In this embodiment, the sensor 200, the vibrator 300, and the integrated circuit device 100 may be connected by internal wiring within the package 500.

[0076] In this embodiment, the internal wiring of the package may also include bonding wires.

[0077] According to this embodiment, a compact sensor module 600 can be realized by housing the sensor 200, the vibrator 300, and the integrated circuit device 100 in a package 500 and connecting them with internal wiring within the package.

[0078] In this embodiment, the package 500 may have a maximum side length WD of 20 mm or less.

[0079] By making the package 500 this size, the sensor module 600 can be easily mounted on a circuit board, or the sensor module 600 can be used for transporting objects of various sizes.

[0080] In this embodiment, the sensor 200 may also be a sensor that detects impact information received by the mounted object as environmental information.

[0081] According to this embodiment, the sensor module 600 is an impact logger and can record log information LGD by associating output environment information based on impact information with time information TMD. By referring to the log information LGD, it becomes possible to know when an impact was applied to the mounted object, or when and what kind of impact was applied to the mounted object.

[0082] In this embodiment, the output environmental information may also be information used for impact determination using the damage boundary curve.

[0083] According to this embodiment, by referring to the log information LGD, which associates output environment information and time information TMD, it becomes possible to determine that an impact exceeding the damage boundary curve has been applied, and at what time that impact occurred.

[0084] In this embodiment, the environmental information may also be environmental information related to at least one of the following processes: packaging, transportation, unpacking, and installation of the object to be mounted.

[0085] According to this embodiment, by referring to the time information TMD recorded in the log information LGD and the record of the time when at least one of packing, transporting, unpacking, and installation was performed, it becomes possible to grasp environmental information at each of the at least one stages of packing, transporting, unpacking, and installation.

[0086] In this embodiment, the sensor 200 may also be a temperature sensor that detects temperature information as environmental information.

[0087] In this embodiment, the temperature sensor may also be included in the integrated circuit device 100.

[0088] According to this embodiment, the sensor module 600 is a temperature logger and can record log information LGD by associating output environmental information based on temperature information with time information TMD. By referring to the log information LGD, it becomes possible to know the ambient temperature at each time, or when changes in ambient temperature occurred.

[0089] In this embodiment, when an environmental information detection event occurs, the processing circuit 130 may associate the output environmental information with the time information TMD and output it as log information LGD.

[0090] According to this embodiment, when an environmental information detection event occurs, log information LGD is output, and by referring to this log information LGD, it becomes possible to determine the time when a specific detection event occurred. By referring to the time when the detection event occurred and the time when packaging, transportation, unpacking, and installation were performed, it becomes possible to determine at which stage of packaging, transportation, unpacking, or installation the detection event occurred.

[0091] In this embodiment, the processing circuit 130 may also output log information LGD, which includes output environment information within a predetermined period PRC based on the time TE at which the detection event occurred.

[0092] According to this embodiment, only the log information LGD around the time TE when the detection event occurred is recorded, so the storage capacity of the memory circuit 150 can be significantly reduced compared to continuous recording. By saving storage capacity, the integrated circuit device 100 can be made smaller, and the sensor module 600 can be miniaturized.

[0093] In this embodiment, the integrated circuit device 100 may also include a detection circuit 140 that performs detection processing on the output signal SQ of the sensor 200 and outputs sensor detection information SSD. The processing circuit 130 may acquire the sensor detection information SSD as output environment information, or it may calculate the sensor detection information SSD to acquire output environment information.

[0094] According to this embodiment, the log information LGD may be the sensor detection information SSD itself, associated with the time information TMD, or processed information from the sensor detection information SSD, associated with the time information TMD. The log information LGD should be recorded in a format that suits the data usage.

[0095] In this embodiment, the integrated circuit device 100 may also include a detection circuit 140 and a storage circuit 150. The detection circuit 140 may perform detection processing on the output signal SQ of the sensor 200 and output sensor detection information SSD. The processing circuit 130 may associate output environment information based on the sensor detection information SSD with time information TMD and store it in the storage circuit 150 as log information LGD.

[0096] According to this embodiment, log information LGD can be stored in the memory circuit 150, and the log information LGD can be read from the memory circuit 150 by accessing it from outside the sensor module 600 afterwards.

[0097] In this embodiment, at least a portion of the detection circuit 140 and the processing circuit 130 may switch from the low-power mode to the normal operation mode when the output signal SQ of the sensor 200 reaches a predetermined value.

[0098] According to this embodiment, at least a portion of the detection circuit 140 and the processing circuit 130 can be switched to normal operation mode for a predetermined period of time only when the environmental information reaches a value that should be detected. In this way, the sensor module 600 can be switched to low power consumption mode when there is no need to detect environmental information, thus reducing power consumption compared to when it is always in normal operation mode.

[0099] In this embodiment, at least a portion of the detection circuit 140 and the processing circuit 130 may transition from the low-power mode to the normal operation mode based on the time information TMD from the real-time clock circuit 120.

[0100] According to this embodiment, at a predetermined time, at least a portion of the detection circuit 140 and the processing circuit 130 can be switched from low-power mode to normal operation mode. Alternatively, at least a portion of the detection circuit 140 and the processing circuit 130 can be kept in normal operation mode and low-power mode for a predetermined period of time. In this way, the sensor module 600 can be switched to low-power mode when there is no need to detect environmental information, thus reducing power consumption compared to when it is always in normal operation mode.

[0101] In this embodiment, the integrated circuit device 100 may also operate based on power from a battery 50 housed in the package 500, or from a battery 50 provided on the mounting object.

[0102] According to this embodiment, by supplying power to the sensor module 600 from the battery 50, the sensor module 600 can continue to record log information LGD during the logistics process.

[0103] Although this embodiment has been described in detail above, it will be readily apparent to those skilled in the art that many modifications are possible without substantially departing from the novelty and effects of this disclosure. Therefore, all such modifications are included within the scope of this disclosure. For example, any term that appears at least once in the specification or drawings together with a broader or synonymous term may be replaced with that different term anywhere in the specification or drawings. Furthermore, all combinations of this embodiment and its modifications are also included within the scope of this disclosure. In addition, the configuration and operation of the detection circuit, real-time clock circuit, oscillator circuit, processing circuit, memory circuit, interface circuit, integrated circuit device, sensor, vibrator, package, external connection terminal, electronic equipment, environmental logger, and sensor module are not limited to those described in this embodiment, and various modifications are possible. [Explanation of Symbols]

[0104] 1…Packaging material, 5…Damage boundary curve, 10…Electronic equipment, 11…Circuit board, 20…Electronic equipment, 30…Environmental logger, 50…Battery, 70…Circuit board, 100…Integrated circuit device, 110…Oscillator circuit, 120…Real-time clock circuit, 130…Processing circuit, 140…Detection circuit, 141…Amplifier circuit, 142…A / D conversion circuit, 150…Memory circuit, 160…Interface circuit, 170…Monitoring circuit, 200…Sensor, 211…x-axis accelerometer element, 212…y-axis Accelerometer element, 213…z-axis accelerometer element, 300…vibrator, 310…intermediate board, 500…package, 510…base, 520…lid, 600…sensor module, CK…clock signal, LGD…log information, PRC…specified period, RD…damaged area, RND…undamaged area, SQ…sensor output signal, SSD…sensor detection information, TE…event occurrence time, TM…external connection terminal, TMD…time information, ΔV…velocity change, α…peak acceleration

Claims

1. A sensor that detects environmental information for the target environment of the sensor module, The oscillator and, Integrated circuit device, A package housing the sensor, the vibrator, and the integrated circuit device, Includes, The aforementioned integrated circuit device is An oscillator circuit that generates a clock signal using the oscillator, A real-time clock circuit that generates time information based on the aforementioned clock signal, A processing circuit that associates output environment information based on the output signal of the sensor with the time information from the real-time clock circuit and outputs it as log information, A sensor module characterized by including the following.

2. In the sensor module described in claim 1, The package is a sensor module characterized by having external connection terminals for mounting on the substrate to be mounted.

3. In the sensor module described in claim 2, The aforementioned package is A base housing the sensor, the vibrator, and the integrated circuit device, and on which the external connection terminals are provided, A lid joined to the base, A sensor module characterized by including the following.

4. In the sensor module described in claim 2, The sensor module is characterized in that the external connection terminal is a terminal for outputting the log information to the outside of the sensor module.

5. In the sensor module described in claim 4, The sensor module is characterized in that the integrated circuit device includes an interface circuit for outputting the log information to the outside of the sensor module via the external connection terminal.

6. In the sensor module described in claim 1, A sensor module characterized in that the sensor, the vibrator, and the integrated circuit device are connected by internal wiring within the package.

7. In the sensor module described in claim 6, The sensor module is characterized in that the internal wiring of the package includes bonding wires.

8. In the sensor module described in claim 1, The package is a sensor module characterized by having a maximum side length of 20 mm or less.

9. In the sensor module described in claim 1, The sensor module is characterized in that the sensor detects impact information received by the mounted object as environmental information.

10. In the sensor module described in claim 9, The sensor module is characterized in that the output environment information is information used for impact determination using a damage boundary curve.

11. In the sensor module described in claim 1, The sensor module is characterized in that the environmental information is environmental information in at least one of the packaging, transportation, unpacking, and installation of the object on which it is mounted.

12. In the sensor module described in claim 1, The sensor module is characterized in that the sensor is a temperature sensor that detects temperature information as environmental information.

13. In the sensor module described in claim 12, The temperature sensor is included in the integrated circuit device, characterized in that it is part of the sensor module.

14. In the sensor module described in claim 1, The sensor module is characterized in that, when an environmental information detection event occurs, it associates the output environmental information with the time information and outputs it as log information.

15. In the sensor module described in claim 14, The sensor module is characterized in that the processing circuit outputs the log information, which includes the output environment information, within a predetermined period based on the time the detection event occurred.

16. In the sensor module described in claim 1, The integrated circuit device includes a detection circuit that performs detection processing on the output signal of the sensor and outputs sensor detection information. The processing circuit is characterized by acquiring the sensor detection information as output environment information, or by calculating the sensor detection information to acquire the output environment information.

17. In the sensor module described in claim 1, The aforementioned integrated circuit device is A detection circuit that performs detection processing on the output signal of the aforementioned sensor and outputs sensor detection information, Memory circuits and, Includes, The sensor module is characterized in that the processing circuit associates the output environment information based on the sensor detection information with the time information and stores it in the storage circuit as log information.

18. In the sensor module described in claim 17, A sensor module characterized in that at least a portion of the detection circuit and the processing circuit transitions from a low-power mode to a normal operating mode when the output signal of the sensor reaches a predetermined value.

19. In the sensor module described in claim 17, A sensor module characterized in that at least a portion of the detection circuit and the processing circuit transitions from a low-power mode to a normal operating mode based on the time information from the real-time clock circuit.

20. In the sensor module described in claim 1, The aforementioned integrated circuit device is A sensor module characterized by operating based on power from a battery housed in the package, or power from a battery provided on the object on which it is mounted.

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