Wiring sheet

Abstract

To provide a wiring sheet in which warping is suppressed. [Solution] A wiring sheet 100 comprising a wiring sheet body 10 and a sealing sheet 70 that seals the ends of the wiring sheet body 10. The wiring sheet body 10 comprises a first base material 1, a first resin layer 2, a wiring body 3 comprising a conductive linear body 31, a pair of electrodes 4, and a second resin layer 5, arranged in this order in the thickness direction. The sealing sheet 70 comprises a sealing base material 71 and a sealing resin layer 72, arranged in this order in the thickness direction. The storage modulus of the second resin layer 5 and the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶, respectively. 4 Pa or higher, 5.0×10 6 The pressure is less than or equal to Pa. The second resin layer 5 and the sealing resin layer 72 are made of either the same material or different materials.

Description

[Technical Field]

[0001] This invention relates to a wiring sheet. [Background technology]

[0002] Wiring sheets equipped with wiring are known. These wiring sheets can be used, for example, as materials for heat-generating textiles, as components for generating heat in various articles, and as heating elements in heating devices applied to sensors, etc.

[0003] Patent Document 1 proposes a film heater in which a conductive pattern made of conductive wires is provided on one side of a support sheet made of a transparent thermoplastic resin sheet. The conductive pattern disclosed in Patent Document 1 is provided as a continuous linear pattern made of a single conductive wire, consisting of a connection terminal portion, a lead wire extending from the connection terminal portion, and a heater portion continuing from the lead wire. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2019-169417 [Overview of the project] [Problems that the invention aims to solve]

[0005] One application where wiring sheets can be used is in surface heaters. Wiring sheets are sometimes required to suppress the occurrence of electrical leakage. For example, even in film heaters such as those described in Patent Document 1, it is sometimes required to suppress the occurrence of electrical leakage. In one embodiment of a wiring sheet equipped with wiring bodies, when at least a part of the wiring bodies is exposed from the edge of the wiring sheet, the wiring sheet tends to be more prone to electrical leakage than when at least a part of the wiring bodies is not exposed from the edge of the wiring sheet.

[0006] As a means for suppressing leakage current of a wiring sheet, for example, it is conceivable to provide a sealing member at an end portion of the wiring sheet. However, when a sealing member is provided at the end portion of the wiring sheet, warpage may occur immediately after the production of the wiring sheet due to curing shrinkage of the sealing member, thermal deformation amount, and the like.

[0007] An object of the present invention is to provide a wiring sheet in which warpage is suppressed in a wiring sheet provided with a sealing member.

Means for Solving the Problems

[0008] [1] A wiring sheet body, A sealing sheet for sealing an end portion of the wiring sheet body, The wiring sheet body A wiring body including a conductive linear body, A pair of electrodes directly contacting the conductive linear body, A first resin layer directly or indirectly supporting the wiring body, A first base material directly or indirectly supporting the first resin layer, A second resin layer provided at a location different from the side where the first resin layer is disposed and directly or indirectly supporting the wiring body, The first base material, the first resin layer, the wiring body, the electrode, and the second resin layer are provided in this order in the thickness direction, The sealing sheet A sealing resin layer, A sealing base material directly or indirectly supporting the sealing resin layer, The storage elastic moduli of the second resin layer and the sealing resin layer at 23°C are respectively 4 Pa or more and 6 Pa or less, The second resin layer and the sealing resin layer are made of the same material as each other or are made of different materials from each other, Wiring sheet.

[0009] [2] In the wiring sheet according to [1], A second substrate that directly or indirectly supports the wiring assembly, The second resin layer is directly or indirectly supported by the second substrate, The first substrate, the first resin layer, the wiring body, the electrode, the second substrate, and the second resin layer are arranged in this order in the thickness direction. The second substrate and the sealing substrate are either made of the same material or made of different materials. Wiring sheet.

[0010] [3] In the wiring sheet described in [1] or [2], The second resin layer and the sealing resin layer are made of the same material and are composed of the same composition. Wiring sheet.

[0011] [4] In the wiring sheet described in any one of items [1] to [3], The sealing sheet is provided in a region outside the electrode. Wiring sheet.

[0012] [5] In the wiring sheet described in any one of items [1] to [4], The wiring body has a structure in which a plurality of the conductive linear bodies are arranged at intervals. Wiring sheet.

[0013] In the wiring sheet described in any one of the items [6] [2] to [5], The second substrate and the sealing substrate are made of the same material. Wiring sheet.

[0014] In the wiring sheet described in any one of the items [7] [2] to [6], The second substrate and the sealing substrate are made of the same thickness. Wiring sheet.

[0015] In the wiring sheet described in any one of the items [8] [2] to [7], The sealing resin layer is provided toward the first substrate and the second substrate, respectively. The sealing substrate, the sealing resin layer, the first substrate, the first resin layer, the wiring body, the electrode, the second substrate, and the second resin layer are arranged in this order in the thickness direction in a first region, The sealing substrate, the sealing resin layer, the second substrate, and the second resin layer are provided in this order in the thickness direction, including a second region. Wiring sheet. [Effects of the Invention]

[0016] According to one aspect of the present invention, a wiring sheet equipped with a sealing member can be provided in which the occurrence of warping is suppressed. [Brief explanation of the drawing]

[0017] [Figure 1] This is a schematic perspective view showing an example of a wiring sheet according to the first embodiment. [Figure 2] This is a cross-sectional view showing the II-II section in Figure 1. [Figure 3] This is a cross-sectional view showing the section III-III in Figure 1. [Figure 4] This is a schematic perspective view showing an example of a wiring sheet according to the second embodiment. [Figure 5] This is a schematic plan view showing an example of a wiring sheet according to the third embodiment. [Modes for carrying out the invention]

[0018] [Embodiment] The present invention will be described below with reference to embodiments, based on the drawings. The present invention is not limited to the embodiments. Note that some parts of the drawings have been enlarged or reduced in size for the purpose of facilitating explanation.

[0019] [First Embodiment] <Wiring Sheet> As shown in Figures 1, 2, and 3, the wiring sheet 100 according to the first embodiment comprises a wiring sheet body 10 and sealing sheets 70 that seal the first end E11 and the second end E12 of the wiring sheet body 10, respectively.

[0020] The wiring sheet body 10 comprises a wiring body 3 having a conductive linear body 31, a pair of electrodes 4 that directly contact the conductive linear body 31, a first resin layer 2 that directly or indirectly supports the wiring body 3, a first base material 1 that directly or indirectly supports the first resin layer 2, and a second resin layer 5 provided at a location different from the side on which the first resin layer 2 is located, and that directly or indirectly supports the wiring body 3. The wiring sheet body 10 is arranged in the order of the first base material 1, the first resin layer 2, the wiring body 3, the electrodes 4, and the second resin layer 5 in the thickness direction. Here, "directly or indirectly supported" includes both direct contact and support through any layer. Therefore, in this specification, "provided in this order in the thickness direction" does not necessarily mean that there are no layers between each layer, and there may be any layers between at least one of each layer that is "directly or indirectly supported".

[0021] The sealing sheet 70 comprises a sealing resin layer 72 and a sealing substrate 71 that directly or indirectly supports the sealing resin layer 72. The storage modulus of the second resin layer 5 and the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶, respectively. 4 Pa or higher, 5.0×10 6 The pressure is less than or equal to Pa. The second resin layer 5 and the sealing resin layer 72 are either made of the same material or made of different materials.

[0022] The inventors of this invention surmise that the above configuration of the wiring sheet 100 suppresses the occurrence of warping of the wiring sheet 100, as follows: Regardless of whether the second resin layer 5 and the sealing resin layer 72 are made of the same material or different materials, the storage modulus at 23°C is 1.0 × 10⁻⁶, respectively.4 Pa or higher, 5.0×10 6 By being within the range of Pa or less, the characteristics such as the amount of thermal deformation are thought to become similar, thus suppressing the occurrence of warping of the wiring sheet 100. If the storage modulus of the second resin layer 5 and the sealing resin layer 72 at 23°C are within the above range, it is thought that the occurrence of warping immediately after manufacturing the wiring sheet 100 will be more easily suppressed. Furthermore, if the second resin layer 5 and the sealing resin layer 72 are made of the same material, it is thought that the characteristics such as the amount of thermal deformation will become more similar, thus further suppressing the occurrence of warping of the wiring sheet 100. Moreover, if the second resin layer 5 and the sealing resin layer 72 are made of the same material and have the same composition, it is thought that the characteristics such as the amount of thermal deformation will become even closer, thus further suppressing the occurrence of warping of the wiring sheet 100. For this reason, if the second resin layer 5 and the sealing resin layer 72 are made of the same material, or are made of the same material and have the same composition, it is thought that the occurrence of warping immediately after manufacturing the wiring sheet 100 will be more easily suppressed, and that the occurrence of warping will be more easily suppressed over time.

[0023] Here, for two layers to be composed of the "same material," it is not necessary for the composition of the components that make up each layer to be the same. For example, if the most abundant component in each layer is considered the main component, and the active ingredients containing that main component are composed of the same components, then both layers are considered to be composed of the "same material." On the other hand, for example, if the main component material of both layers is resin, even if the resin as the main component in both layers is the same, if the additives included as active ingredients are different, then the two layers are not considered to be composed of the "same material." Here, "active ingredient" refers to the components contained in the composition in question, excluding, for example, diluent solvents. For example, specifically, if the main components of both layers are acrylic polymers, and one layer contains only a specific crosslinking agent as an additive among the active ingredients, while the other layer contains a specific crosslinking agent as well as a curable component that can be cured by at least one of heat and light, then the two layers are not considered to be composed of the "same material."

[0024] Furthermore, if, for example, the ratio of the main components and additives in the active ingredients of both layers is the same, then both layers are considered to be composed of the "same composition" and are also considered to be composed of the "same material." Specifically, if the active ingredients constituting both layers are acrylic polymers and specific crosslinking agents, and these components are present in the same ratio, then both layers are considered to be composed of the "same composition" and are also considered to be composed of the "same material." Additionally, if the active ingredients constituting both layers include acrylic polymers, specific crosslinking agents, and any additives, and all of these components are present in the same ratio, then both layers are considered to be composed of the "same composition" and are also considered to be composed of the "same material."

[0025] [Wiring sheet main body] As described above, in this embodiment, the wiring sheet body 10 comprises a first base material 1, a first resin layer 2, a wiring body 3, an electrode 4, and a second resin layer 5.

[0026] (First base material) The first base material 1 can directly or indirectly support the first resin layer 2. Furthermore, the first base material 1 can protect one side of the wiring sheet body 10.

[0027] The material of the first base material 1 is not particularly limited. From the viewpoint of the strength of the wiring sheet 100 and handling properties, the material of the first base material 1 is preferably resin.

[0028] If the material of the first base material 1 is a resin, it is preferable that the resin is at least one selected from the group consisting of thermoplastic resins and thermoplastic elastomers, and more preferably a thermoplastic elastomer. Specifically, examples of the resin include polyolefins, polyesters, polystyrenes, and polyurethanes, and it is preferable that the resin is one or more of these resins, and more preferably polyurethane. Polyurethane is a material with excellent flexibility and transparency. If the material of the first base material 1 is polyurethane in particular, it has excellent transparency and can be applied to, for example, heaters for optical sensors, and specifically, it can be suitably used as a heater for optical sensors such as LiDAR sensors.

[0029] When the first substrate 1 is in the form of a film, the thickness of the first substrate 1 is not particularly limited. The thickness of the first substrate 1 is preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 50 μm or more. Furthermore, the thickness of the first substrate 1 is preferably 1 mm or less, more preferably 500 μm or less, and even more preferably 300 μm or less. If the thickness of the first substrate 1 is 10 μm or more, the strength of the wiring sheet 100 is excellent.

[0030] (First resin layer and second resin layer) The first resin layer 2 can support the wiring body 3 directly or indirectly. Further, the second resin layer 5 is provided at a location different from the side where the first resin layer 2 is disposed, and can support the wiring body 3 directly or indirectly. The second resin layer 5 is provided so as to cover the wiring body 3. The first resin layer 2 and the second resin layer 5 are preferably layers containing an adhesive. If the first resin layer 2 is a layer containing an adhesive, for example, when forming the wiring body 3 on the first resin layer 2, the adhesive facilitates the attachment of the conductive linear body 31 to the first resin layer 2. Also, if the second resin layer 5 is a layer containing an adhesive, the wiring sheet 100 can be adhered to the adherend by the second resin layer 5.

[0031] The storage elastic modulus of the second resin layer 5 at 23°C is 1.0×10 4 Pa or more and 5.0×10 6 Pa or less. The storage elastic modulus of the second resin layer 5 at 23°C is preferably 2.0×10 4 Pa or more, and more preferably 3.0×10 4 Pa or more. The storage elastic modulus of the second resin layer 5 at 23°C is preferably 1.0×10[[ID=1​​​​​​​​​​​​​​​​It is more preferable that it be less than or equal to Pa, 3.0 × 10 5 It is even more preferable that it be Pa or less. The storage modulus can be measured by the method described in the examples below.

[0033] The thickness of the first resin layer 2 is not particularly limited. The thickness of the first resin layer 2 may be greater than or equal to the diameter D of the conductive wire 31 (see Figure 2), or it may be less than the diameter D of the conductive wire 31. If the thickness of the first resin layer 2 is greater than or equal to the diameter D of the conductive wire 31, the wiring 3 can be contained within the first resin layer 2. If the thickness of the first resin layer 2 is less than the diameter D of the conductive wire 31, the wiring 3 will be exposed from the first resin layer 2. Also, if the wiring 3 is exposed from the first resin layer 2, the wiring 3 may be exposed on the side of the first substrate 1, or on the opposite side of the first substrate 1. The thickness of the first resin layer 2 is preferably 5 μm or more, more preferably 7 μm or more, and even more preferably 10 μm or more. The thickness of the first resin layer 2 is preferably 100 μm or less, more preferably 70 μm or less, and even more preferably 50 μm or less. If the thickness of the first resin layer 2 is within the range of 5 μm or more and 100 μm or less, the conductive linear body 31 can be sealed in the resin, making it easier to ensure electrical insulation.

[0034] The thickness of the second resin layer 5 is not particularly limited. The thickness of the second resin layer 5 is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 20 μm or more. The thickness of the second resin layer 5 is preferably 1000 μm or less, more preferably 500 μm or less, even more preferably 300 μm or less, even more preferably 100 μm or less, even more preferably 70 μm or less, and even more preferably 50 μm or less. If the thickness of the second resin layer 5 is within the range of 5 μm or more and 1000 μm or less, the occurrence of warping of the wiring sheet 100 is easily suppressed. Also, if the thickness range of the second resin layer 5 is the same as the thickness range of the first resin layer 2, the occurrence of warping of the wiring sheet 100 is easily suppressed.

[0035] The first resin layer 2 and the second resin layer 5 may be layers formed from a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive. The pressure-sensitive adhesive is not particularly limited. For example, examples of pressure-sensitive adhesives include acrylic adhesives, urethane adhesives, rubber adhesives, polyester adhesives, silicone adhesives, and polyvinyl ether adhesives. Among these, the pressure-sensitive adhesive is preferably at least one selected from the group consisting of acrylic adhesives, urethane adhesives, and rubber adhesives, and more preferably an acrylic adhesive.

[0036] Examples of acrylic adhesives include polymers containing structural units derived from alkyl (meth)acrylates having linear or branched alkyl groups, and acrylic polymers containing structural units derived from (meth)acrylates having a cyclic structure. Here, "(meth)acrylate" is used to refer to both "acrylate" and "methacrylate," and the same applies to other similar terms.

[0037] When the acrylic polymer is a copolymer, the form of copolymerization is not particularly limited. The acrylic copolymer may be a block copolymer, a random copolymer, or a graft copolymer.

[0038] The first resin layer 2 and the second resin layer 5 are preferably formed from a pressure-sensitive adhesive composition containing, for example, a (meth)acrylic acid ester polymer (A) and a crosslinking agent (B), from the viewpoint of having excellent performance as resin layers formed from a pressure-sensitive adhesive composition and from the viewpoint of easily adjusting the storage modulus at 23°C to within the above range.

[0039] The (meth)acrylic acid ester polymer (A) preferably contains an alkyl (meth)acrylic acid ester and, if necessary, other monomers as monomer units constituting this polymer.

[0040] The (meth)acrylic acid ester polymer (A) can exhibit desirable tackiness by containing an alkyl (meth)acrylic acid ester as a monomer unit constituting the polymer. The alkyl (meth)acrylic acid ester is preferably one in which the alkyl group has 1 to 20 carbon atoms, and more preferably one in which the alkyl group has 4 to 20 carbon atoms. The alkyl group may be linear, branched, or have a cyclic structure.

[0041] The alkyl (meth)acrylate ester with 4 to 20 carbon atoms in the alkyl group is preferably n-butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, and isobornyl acrylate, and more preferably n-butyl acrylate, 2-ethylhexyl acrylate, and isobornyl acrylate from the viewpoint of obtaining excellent adhesiveness.

[0042] Other monomers constituting the (meth)acrylic acid ester polymer when the (meth)acrylic acid ester polymer is a copolymer include, for example, carboxyl group-containing vinyl monomers, hydroxyl group-containing vinyl monomers, vinyl ether monomers, nitrogen-containing vinyl monomers, aromatic vinyl monomers, and vinyl ester monomers. These other monomers may be used individually from the same group or in combination of two or more. These other monomers may be used individually from different groups or in combination of two or more. In this specification, when the (meth)acrylic acid ester polymer is a copolymer, the copolymer is also referred to as an acrylic copolymer.

[0043] Examples of carboxyl group-containing vinyl monomers include (meth)acrylic acid, maleic acid, itaconic acid, monomethyl maleic acid, monomethyl citraconic acid, 2-carboxyethyl acrylate, 2-carboxyethyl methacrylate, mono(2-acryloyloxyethyl) succinate, and mono(2-methacryloyloxyethyl) succinate. Examples of hydroxyl group-containing vinyl monomers include hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Examples of vinyl ether monomers include hydroxybutyl vinyl ether. Examples of nitrogen-containing vinyl monomers include monomethylaminoethyl (meth)acrylate, acrylamide, and acryloylmorpholine. Examples of aromatic vinyl monomers include olefins such as ethylene and propylene, as well as styrene. Examples of vinyl ester monomers include vinyl acetate.

[0044] The weight-average molecular weight of the (meth)acrylic acid ester polymer (A) is preferably 200,000 or more, more preferably 300,000 or more, and even more preferably 400,000 or more. If the weight-average molecular weight of the (meth)acrylic acid ester polymer (A) is 200,000 or more, the durability of the first resin layer 2 and the second resin layer 5 is excellent.

[0045] Furthermore, the weight-average molecular weight of the (meth)acrylic acid ester polymer (A) is preferably 2 million or less, more preferably 1.5 million or less, even more preferably 1 million or less, and even more preferably 800,000 or less. If the weight-average molecular weight of the (meth)acrylic acid ester polymer (A) is 2 million or less, the adhesion and bonding properties of the first resin layer 2 to the first substrate 1 and the wiring body 3 are better. Furthermore, if the weight-average molecular weight of the (meth)acrylic acid ester polymer (A) is 2 million or less, the adhesion and bonding properties of the second resin layer 5 to the wiring body 3 and the adherend are better.

[0046] The crosslinking agent (B) is not particularly limited and includes, for example, isocyanate-based crosslinking agents, epoxy-based crosslinking agents, amine-based crosslinking agents, melamine-based crosslinking agents, aziridine-based crosslinking agents, hydrazine-based crosslinking agents, aldehyde-based crosslinking agents, oxazoline-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, and ammonium salt-based crosslinking agents. Among these, the crosslinking agent is preferably a metal chelate-based crosslinking agent. Examples of metal chelate-based crosslinking agents include acetylacetone-coordinate compounds of polyvalent metals and acetoacetate-ester-coordinate compounds of polyvalent metals. Examples of polyvalent metals include at least one selected from the group consisting of aluminum, nickel, chromium, iron, titanium, zinc, cobalt, manganese, and zirconium. Among these, the metal chelate-based crosslinking agent is preferably an aluminum chelate compound. From the viewpoint of having excellent performance as a resin layer formed from a pressure-sensitive adhesive composition, the aluminum chelate compound is preferably at least one of an aluminum acetylacetone-coordinate compound and an acetoacetate ester-coordinate compound, and more preferably aluminum tris(acetylacetonate).

[0047] The content of the crosslinking agent (B) in the pressure-sensitive adhesive composition is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and even more preferably 0.1 parts by mass or more, per 100 parts by mass of the (meth)acrylic acid ester polymer (A). Furthermore, the content of the crosslinking agent (B) in the pressure-sensitive adhesive composition is preferably 3 parts by mass or less, more preferably 2 parts by mass or less, and even more preferably 1 part by mass or less. When the content of the crosslinking agent (B) is in the range of 0.01 parts by mass or more and 3 parts by mass or less, the degree of crosslinking becomes appropriate, and the storage modulus of the first resin layer 2 and the second resin layer 5 can be easily adjusted to a suitable value.

[0048] The pressure-sensitive adhesive composition may contain other components. Examples of other components include additives such as organic solvents, coupling agents, flame retardants, tackifiers, UV absorbers, antioxidants, preservatives, fungicides, plasticizers, defoamers, and wettability modifiers.

[0049] (Wiring) The wiring body 3 comprises conductive linear bodies 31. In the wiring sheet 100, the wiring body 3 has a structure in which conductive linear bodies 31 are arranged. In addition, in the wiring sheet 100, the wiring body 3 has a structure in which a plurality of conductive linear bodies 31 are arranged parallel to each other in a direction intersecting the axial direction of the conductive linear bodies 31. In the wiring sheet 100, the wiring body 3 has a structure in which a plurality of conductive linear bodies 31 are arranged with intervals between them, but the wiring sheet 100 according to this embodiment is a preferred example and is not limited thereto. The wiring body 3 does not have to have a structure in which a plurality of conductive linear bodies 31 are arranged with intervals between them.

[0050] In the wiring sheet 100, the conductive linear body 31 is linear in a plan view of the wiring sheet 100. However, it is not limited to this, and the conductive linear body 31 may have a wave shape in a plan view of the wiring sheet 100. Examples of wave shapes include sine waves, square waves, triangular waves, and sawtooth waves. For example, if the wiring body 3 has such a wave shape, it is possible to suppress the disconnection of the conductive linear body 31 when the wiring sheet 100 is stretched in the axial direction of the conductive linear body 31.

[0051] The volume resistivity of the conductive linear body 31 is 1.0 × 10⁻⁶. -9 It is preferable that it be Ω·m or greater, and 3.0 × 10 -9 It is more preferable that it be Ω·m or greater, and 1.0 × 10 -8 It is even more preferable that the resistivity is Ω·m or greater. Furthermore, the volume resistivity of the conductive linear body 31 is 1.0 × 10⁻⁶. -3 It is preferable that it be Ω·m or less, and 1.0 × 10 -4 It is more preferable that it be Ω·m or less, and 5.0 × 10 -5 It is even more preferable that it be Ω·m or less. When the volume resistivity of the conductive linear body 31 is within the above range, the surface resistance of the wiring body 3 tends to decrease. The volume resistivity of the conductive wire 31 is measured as follows: Silver paste is applied to the end of the conductive wire 31 and to a portion 40 mm from the end, and the resistance of the end and the portion 40 mm from the end is measured. Then, the volume resistivity of the conductive wire 31 is measured (unit: m²). 2 Multiply the above resistance value by ( ) and divide the resulting value by the above measured length (0.04 m) to calculate the volume resistivity of the conductive wire 31.

[0052] The cross-sectional shape of the conductive wire 31 is not particularly limited and can be polygonal, flattened, elliptical, or circular. From the viewpoint of compatibility with the first resin layer 2, the cross-sectional shape of the conductive wire 31 is preferably elliptical or circular.

[0053] When the cross-section of the conductive wire 31 is circular, the diameter D of the conductive wire 31 (see Figure 2) is preferably 3 μm or more and 200 μm or less. From the viewpoint of suppressing the increase in sheet resistance and improving the heat generation efficiency and dielectric breakdown resistance characteristics of the wiring sheet 100, the diameter D of the conductive wire 31 is more preferably 4 μm or more, and even more preferably 5 μm or more. The diameter D of the conductive wire 31 is more preferably 150 μm or less, even more preferably 100 μm or less, even more preferably 50 μm or less, and still most preferably 20 μm or less. If the cross-section of the conductive wire 31 is elliptical, it is preferable that the major axis is within the same range as the diameter D described above.

[0054] The diameter D of the conductive linear body 31 is determined by observing the conductive linear body 31 using a digital microscope, measuring the diameter of the conductive linear body 31 at five randomly selected locations, and taking the average value of these measurements.

[0055] In the case of a wiring body 3 having a structure in which a plurality of conductive linear bodies 31 are arranged with intervals between them, the interval L of the conductive linear bodies 31 (see Figure 2) is preferably 0.3 mm or more, more preferably 0.5 mm or more, even more preferably 0.8 mm or more, and even more preferably 1.5 mm or more. Furthermore, the interval L of the conductive linear bodies 31 is preferably 50 mm or less, more preferably 30 mm or less, even more preferably 20 mm or less, and even more preferably 5 mm or less. If the spacing between the conductive wires 31 is within the above range, the conductive wires 31 are densely packed to a certain extent, which improves the function of the wiring sheet 100, such as maintaining a low resistance for the wiring 3.

[0056] The form of the conductive linear body 31 is not particularly limited and can be manufactured by methods such as etching, screen printing, and inkjet printing. Preferably, the conductive linear body 31 is a linear body containing a metal wire (hereinafter also referred to as "metal wire linear body"). Metal wires have high thermal conductivity, high electrical conductivity, and high handling properties. Metal wire linear bodies can significantly reduce resistance, and even if the diameter of the metal wire linear body is made extremely small, current can be conducted with the current necessary for heating the wiring sheet 100. This makes the conductive linear body 31 difficult to see. In other words, by applying a metal wire linear body as the conductive linear body 31, the resistance value of the wiring body 3 is reduced while light transmittance is easily improved. In addition, the wiring sheet 100 is more likely to heat up quickly. Furthermore, as mentioned above, it is easier to obtain a linear body with a small diameter. Examples of conductive linear bodies 31 include not only metal wire linear bodies, but also linear bodies containing carbon nanotubes and linear bodies in which a conductive coating is applied to a thread.

[0057] The metal wire may be a wire made of a single metal wire, or it may be a wire made by twisting together multiple metal wires. Examples of metal wires include those containing metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals such as stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron nickel, nichrome, nickel titanium, Kanthal, Hastelloy, and rhenium tungsten. Furthermore, the metal wire may be plated with gold, tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder, or its surface may be coated with carbon materials or polymers, as described later. In particular, wires containing one or more metals selected from tungsten, molybdenum, and alloys containing these are preferred from the viewpoint of low volume resistivity. Metal wires can also be those coated with carbon material. When metal wires are coated with carbon material, their metallic luster is reduced, making it easier to make the metal wires less noticeable. In addition, metal corrosion is suppressed when metal wires are coated with carbon material. Carbon materials used to coat metal wires include carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and amorphous carbon such as carbon fiber; graphite, fullerene, graphene, and carbon nanotubes.

[0058] The conductive linear body 31 may be a linear body in which a conductive coating is applied to a thread. Examples of threads include threads spun from resins such as nylon or polyester. Other examples of threads include metal fibers, carbon fibers, or ionic conductive polymer fibers. Examples of conductive coatings include coatings of metal, conductive polymer, or carbon material. The conductive coating can be formed by plating, vapor deposition, or the like. A linear body in which a conductive coating is applied to a thread can improve the conductivity of the linear body while maintaining the flexibility of the thread. In other words, it becomes easier to reduce the resistance of the wiring body 3.

[0059] (electrode) Electrodes 4 are used to supply current to the conductive wire 31. Electrodes 4 come in a pair. Electrodes 4 are in direct contact with the conductive wire 31. Electrodes 4 are electrically connected to both ends of the conductive wire 31. Electrode 4 can be formed using known electrode materials. Examples of electrode materials include conductive pastes such as silver paste; metal foils such as copper foil; and metal wires. When the electrode material is a metal wire, there may be one wire, but it is preferable to have two or more wires.

[0060] When the electrode material is a metal foil or metal wire, the metal of the metal foil or metal wire may be metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold; or alloys containing two or more metals such as stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron nickel, nichrome, nickel titanium, Kanthal, Hastelloy, and rhenium tungsten. Furthermore, the metal foil or metal wire may be plated with gold, tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder.

[0061] Of the electrodes 4, the width of at least one electrode is preferably 10 mm or less, and more preferably 5 mm or less, in a plan view of the wiring sheet 100. Furthermore, the width of this electrode is preferably 0.1 mm or more. When at least one electrode is a metal wire, the width of the electrode is the diameter of the metal wire. When two or more metal wires are used, the width of one electrode refers to the sum of the diameters of the individual metal wires when the wires are arranged side by side, and the major axis of the bundle in a plan view when the metal wires are bundled.

[0062] Of the electrodes 4, the length of at least one electrode is preferably 30 cm or less, more preferably 10 cm or less, and more preferably 5 cm or less, in a plan view of the wiring sheet 100. Furthermore, the length of this electrode is preferably 0.5 cm or more, and more preferably 1 cm or more. In this embodiment, since the number of conductive wires 31 is small, the length of the electrodes 4 can be shortened.

[0063] The thickness of electrode 4 is preferably 2 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more. The thickness of electrode 4 is preferably 200 μm or less, more preferably 150 μm or less, even more preferably 100 μm or less, and even more preferably 75 μm or less. If the thickness of electrode 4 is within the above range, the electrical conductivity will be high and the resistance will be low, and the resistance value with respect to the wiring body 3 can be kept low. In addition, sufficient strength as an electrode can be obtained. If the electrode is a metal wire, the thickness of the electrode is the diameter of the metal wire.

[0064] Electrode 4 is preferably gold-plated. This gold plating can suppress migration of electrode 4.

[0065] [Sealing sheet] The wiring sheet 100 is sealed at its first end E11 and second end E12 by two sealing sheets 70. The sealing sheets 70 are provided at the ends of the wiring sheet body 10 located in the direction in which the conductive linear body 31 extends, that is, at the ends located in the direction along the axial direction of the conductive linear body 31. The ends located in the direction along the axial direction of the conductive linear body 31 are the ends located in the direction of Y1 shown in Figure 3. The first end E11 and second end E12 of the wiring sheet body 10 include at least the first end face F11 and the second end face F12 of the wiring sheet body 10 and the first end face F51 and the second end face F52 of the second resin layer 5, and include the area where the sealing sheets 70 are provided. In Figure 3, when referring to the first end face F11 and the second end face F12 of the wiring sheet body 10, for convenience, the first end face F11 and the second end face F12 represent the end faces of the second resin layer 5 excluding the first end face F51 and the second end face F52. In Figure 4, described later, the first end face and the second end face of the wiring sheet body 11 refer, for convenience, to the end faces of the second base material 6 and the second resin layer 5 excluding both end faces.

[0066] The two sealing sheets 70 are provided in a region outside the electrodes 4 of the wiring sheet body 10. The region outside the electrodes 4 is the region on the side of arrow Y1 shown in Figure 3, in the direction along the axial direction of the conductive wire 31, from the position where the electrodes 4 are arranged. From the viewpoint of suppressing leakage current of the wiring sheet 100 and suppressing the occurrence of warping of the wiring sheet 100, the sealing sheets 70 are preferably provided in a region outside the electrode 4 side, in the direction along the axial direction of the conductive wire 31, toward the center of the wiring sheet body 10, within a range of 15 mm or less, more preferably within a range of 10 mm or less, and even more preferably within a range of 5 mm or less, starting from the first end face F11 and the second end face F12 of the wiring sheet body 10, respectively. The direction toward the center of the wiring sheet body 10 in the direction along the axial direction of the conductive wire 31 is the direction of Y2 shown in Figure 3. Furthermore, as shown in Figure 5 described later, when the conductive wire 31 is arranged in a direction that follows an arc shape along its axial direction, the direction toward the center of the wiring sheet body 10 in the direction along the axial direction of the conductive wire 31 will be the direction that follows the arc shape.

[0067] Furthermore, from a similar viewpoint, the proportion of sealing sheets 70 provided on each side of the first end E11 and the second end E12 is preferably 0.1% or more, more preferably 0.3% or more, and even more preferably 0.5% or more, relative to the distance from the first end face F11 to the second end face F12 of the wiring sheet body 10. In a similar view, the proportion of sealing sheets 70 provided on each side of the first end E11 and the second end E12 is preferably 20% or less per end, more preferably 15% or less, even more preferably 10% or less, and particularly preferably 5% or less, relative to the distance from the first end face F11 to the second end face F12 of the wiring sheet body 10. In Figures 1, 2, and 3, the wiring sheet body 10 is rectangular. However, if the wiring sheet body 10 has an arc shape between the first end face F11 and the second end face F12, as shown in Figure 5 below, the distance from the first end face F11 to the second end face F12 of the wiring sheet body 10 will be the distance along the arc shape.

[0068] As shown in Figure 3, the sealing resin layer 72 of the sealing sheet 70 is provided facing the surface of the first substrate 1, the first end face F11 and the second end face F12 of the wiring sheet body 10, and the surface of the second resin layer 5, respectively. The wiring sheet 100 includes a first region 70A and a second region 70B in the area where the sealing sheet 70 sealing the first end E11 and the second end E12 is located.

[0069] The first region 70A is the region from the first end face F11 of the wiring sheet body 10 to the first end face F71A of the sealing sheet 70 on the first end E11 side, and the region from the second end face F12 of the wiring sheet body 10 to the first end face F72A of the sealing sheet 70 on the second end E12 side, and is the region in which the sealing base material 71, sealing resin layer 72, first base material 1, first resin layer 2, wiring body 3, electrode 4, and second resin layer 5 are provided in this order in the thickness direction. The second region 70B is the region from the second end face F71B of the sealing sheet 70 on the first end E11 side to the first end face F11 of the wiring sheet body 10, and the region from the second end face F12 of the wiring sheet body 10 to the second end face F72B of the sealing sheet 70 on the second end E12 side, in which the sealing substrate 71, sealing resin layer 72, and second resin layer 5 are provided in this order in the thickness direction. If the sealing sheet 70 is provided in the manner shown in Figures 1, 2, and 3, leakage current of the wiring sheet 100 is easily suppressed. Furthermore, since the wiring sheet body 10 can be sealed without being attached to the first end face F51 and the second end face F52 of the second resin layer 5, it is cost-effective. The manner in which the sealing sheet 70 is provided is not limited to the manner shown in Figures 1, 2, and 3. Any manner in which the sealing sheet 70 is provided on the wiring sheet 100 is acceptable as long as leakage current of the wiring sheet 100 and warping are suppressed.

[0070] (Sealing base material) The sealing substrate 71 can directly or indirectly support the sealing resin layer 72. The material of the sealing substrate 71 is not particularly limited. Preferably, the material of the sealing substrate 71 is a resin. If the material of the sealing substrate 71 is a resin, the resin described in the first substrate 1 is an example. From the viewpoint of suppressing warping of the wiring sheet 100, it is preferable that the material of the sealing substrate 71 is the same as the material of the first substrate 1. From a similar viewpoint, the material of the first substrate 1 is preferably a thermoplastic elastomer, and more preferably polyurethane.

[0071] When the sealing substrate 71 is in the form of a film, the thickness of the sealing substrate 71 is not particularly limited. The thickness of the sealing substrate 71 is preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 50 μm or more. Also, the thickness of the sealing substrate 71 is preferably 1 mm or less, more preferably 500 μm or less, and even more preferably 300 μm or less. From the viewpoint of suppressing warping of the wiring sheet 100, the range of the thickness of the sealing substrate 71 is preferably the same as the range of the thickness of the first substrate 1. Similarly, the range of the thickness of the sealing substrate 71 is preferably within ±10% of the thickness of the first substrate 1, and more preferably the same as the thickness of the first substrate 1. Here, within ±10% of the thickness of the first substrate 1 means that the positive thickness range is up to +10% and the negative thickness range is up to -10% of the thickness of the first substrate 1.

[0072] (Sealing resin layer) The sealing resin layer 72 has a storage modulus of 1.0 × 10⁻⁶ at 23°C. 4 Pa or higher, 5.0×10 6 It is less than or equal to Pa. The storage modulus of the sealing resin layer 72 at 23°C is 2.0 × 10⁻⁶. 4 It is preferable that it be Pa or higher, 3.0 × 10 4 It is more preferable that the storage modulus of the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶. 6 It is preferable that it is less than or equal to Pa, 3.0 × 10 5 It is more preferable that the pressure is Pa or less. The sealing resin layer 72 is preferably a layer containing an adhesive. If the sealing resin layer 72 is a layer containing an adhesive, for example, it becomes easier to attach the sealing resin layer 72 toward the wiring sheet body 10. The sealing resin layer 72 is preferably a layer formed from a pressure-sensitive adhesive composition. The sealing resin layer 72 can be made from the materials described in the sections on the first resin layer 2 and the second resin layer 5. From the viewpoint of suppressing warping of the wiring sheet 100, it is preferable that the sealing resin layer 72 and the second resin layer 5 are made of the same material, and it is more preferable that they are made of the same material and have the same composition. The sealing resin layer 72 may be made of the same material as the first resin layer 2, or it may be made of different materials. From the viewpoint of suppressing warping of the wiring sheet 100, it is preferable that the sealing resin layer 72 is made of the same material as the first resin layer 2 and the second resin layer 5, and more preferably that it is made of the same material and has the same composition as the first resin layer 2 and the second resin layer 5.

[0073] If the sealing resin layer 72 is made of a different material from the first resin layer 2, the storage modulus of the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶. 4 Pa or higher, 5.0×10 6Within the range of Pa or less, the sealing resin layer 72 may be formed from an energy-ray curable adhesive composition. That is, the sealing resin layer 72 may be a cured product of an energy-ray curable adhesive. When the sealing resin layer 72 is formed from an energy-ray curable adhesive composition, the storage modulus of the sealing resin layer 72 at 23°C is the storage modulus of the cured product of the energy-ray curable adhesive. When the sealing resin layer 72 is formed from an energy-ray curable adhesive composition, the storage modulus of the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶. 4 Pa or higher, 5.0×10 6 Within the range of Pa or less, the curing shrinkage of the sealing sheet 70 is easily suppressed, making it easier to suppress the warping of the wiring sheet 100. Examples of energy rays include ultraviolet rays, visible energy rays, infrared rays, and electron beams.

[0074] In this specification, when no distinction is made between pressure-sensitive adhesive compositions and energy-ray-curable adhesive compositions, both may be referred to as adhesive compositions.

[0075] When the storage modulus of the second resin layer 5 at 23°C is G'2 and the storage modulus of the sealing resin layer 72 at 23°C is G'3, from the viewpoint of making it easier to suppress the warping of the wiring sheet 100, in the relationship between the ratio of the storage modulus of the second resin layer 5 at 23°C G'2 and the storage modulus of the sealing resin layer 72 at 23°C G'3, if G'3 is greater than G'2, it is preferable that the value of (G'3 / G'2), and if G'2 is greater than G'3, the value of (G'2 / G'3), be close to 1 in both cases. If the value of the above ratio is greater than 1, it is preferable that it be 50 or less, more preferably 10 or less, and even more preferably 2 or less. From the viewpoint of making it easier to suppress the warping of the wiring sheet 100, it is more preferable that G'3 and G'2 are the same, that is, that the ratio of (G'3 / G'2) or (G'2 / G'3) is 1.

[0076] The energy-ray curable adhesive composition preferably comprises the aforementioned (meth)acrylic acid ester polymer (A) and the aforementioned crosslinking agent (B), and further preferably includes an energy-ray curable resin as an energy-ray curable component (C).

[0077] The crosslinking agent included in the energy-ray curable adhesive composition is preferably an isocyanate-based crosslinking agent among the aforementioned crosslinking agents. Examples of isocyanate-based crosslinking agents include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; trimethylolpropane-modified aromatic polyisocyanates such as trimethylolpropane-modified tolylene diisocyanate; aliphatic polyisocyanates such as hexamethylene diisocyanate; alicyclic polyisocyanates such as isophorone diisocyanate and hydrogenated diphenylmethane diisocyanate; their biuret forms, isocyanurate forms, and adduct forms which are reaction products with low molecular weight active hydrogen-containing compounds such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, and castor oil.

[0078] The crosslinking agent content is preferably 0.01 parts by mass or more and 1.0 part by mass or less, more preferably 0.05 parts by mass or more and 0.5 parts by mass or less, and even more preferably 0.1 parts by mass or more and 0.8 parts by mass or less, per 100 parts by mass of (meth)acrylic acid ester polymer.

[0079] Examples of energy-ray curable resins included in energy-ray curable adhesive compositions include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth)acryloyl group are preferred.

[0080] Examples of acrylate compounds include (meth)acrylates containing a chain-like aliphatic skeleton such as dicyclopentadiene diacrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate; dicyclopentanyl di(meth)acrylate. Examples include cyclic aliphatic skeleton-containing (meth)acrylates such as T; polyalkylene glycol (meth)acrylates such as polyethylene glycol di(meth)acrylate; (meth)acrylates having an isocyanurate structure within the molecule, such as ε-caprolactone-modified tris-(2-(meth)acryloxyethyl) isocyanurate; oligoester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy-modified (meth)acrylates, polyether (meth)acrylates other than polyalkylene glycol (meth)acrylates, tris(acryloxyethyl) isocyanurate, and itaconic acid oligomers.

[0081] The weight-average molecular weight (Mw) of the energy-ray curable resin is preferably 100 or more, and more preferably 300 or more. Furthermore, this weight-average molecular weight is preferably 30,000 or less, and more preferably 10,000 or less. In this specification, the weight-average molecular weight is the value on a standard polystyrene basis measured by gel permeation chromatography (GPC).

[0082] Energy-ray curable resins may be used by one type only, or by two or more types. If two or more energy-ray curable resins are used, their combinations and ratios can be arbitrarily selected.

[0083] When using energy ray-curable resins, it is preferable to use a photopolymerization initiator (D). By using a photopolymerization initiator, the polymerization reaction of the curable resin can be easily initiated, and the curing reaction can be easily controlled.

[0084] Examples of photopolymerization initiators include photoradical polymerization initiators such as benzophenone, acetophenone, benzoin, benzoin methyl ether, 2,4-diethylthioxanthone, 1-hydroxycyclohexylphenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloranthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenyl-phosphine oxide. Photoradical polymerization initiators can be used individually or in combination of two or more.

[0085] In addition to photoradical polymerization initiators, photocationic polymerization initiators can also be used as photopolymerization initiators. Photocationic polymerization initiators are compounds that generate cation species when irradiated with energy rays, thereby initiating the curing reaction of cationic curable compounds. They consist of a cation part that absorbs energy rays and an anion part that is a source of acid.

[0086] Examples of photocationic polymerization initiators include sulfonium salt compounds, iodonium salt compounds, phosphonium salt compounds, ammonium salt compounds, antimonate salt compounds, diazonium salt compounds, selenium salt compounds, oxonium salt compounds, and bromine salt compounds. Among these, sulfonium salt compounds are preferred from the viewpoint of excellent compatibility and excellent storage stability of the resulting adhesive, and aromatic sulfonium salt compounds having aromatic groups are more preferred. Photocationic polymerization initiators can be used alone or in combination of two or more.

[0087] When a crosslinked structure is formed using a photopolymerization initiator, the amount used is preferably 0.1 parts by mass or more and 30 parts by mass or less, more preferably 0.3 parts by mass or more and 20 parts by mass or less, and particularly preferably 0.5 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of the energy ray curable resin.

[0088] In this embodiment, the energy-ray curable adhesive composition may contain a silane coupling agent to improve the adhesion of the sealing resin layer 72 to the wiring sheet body 10. Examples of the silane coupling agent (E) include organosilicon compounds having at least one alkoxysilyl group in the molecule.

[0089] Examples of silane coupling agents include, specifically, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2-aminoethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, (3-ureidopropyl)triethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfan, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane.

[0090] The amount of silane coupling agent (E) used is preferably 0.01 parts by mass or more and 1 part by mass or less, more preferably 0.05 parts by mass or more and 0.5 parts by mass or less, and even more preferably 0.1 parts by mass or more and 0.3 parts by mass or less, per 100 parts by mass of (meth)acrylic acid ester polymer.

[0091] The curable adhesive composition may contain other components. Examples of other components include well-known additives such as organic solvents, flexibility modifiers, flame retardants, tackifiers, UV absorbers, antioxidants, preservatives, fungicides, plasticizers, defoamers, and wettability modifiers.

[0092] The thickness of the sealing resin layer 72 is not particularly limited, as long as it can seal the first end E11 and the second end E12 of the wiring sheet body 10. The thickness of the sealing resin layer 72 is preferably 5 μm or more, more preferably 10 μm or more, and even more preferably 20 μm or more. The thickness of the sealing resin layer 72 is preferably 1000 μm or less, more preferably 500 μm or less, even more preferably 300 μm or less, even more preferably 100 μm or less, even more preferably 70 μm or less, and even more preferably 50 μm or less. If the thickness of the sealing resin layer 72 is 5 μm or more and 1000 μm or less, it becomes easier to seal the first end E11 and the second end E12 of the wiring sheet body 10. From the viewpoint of suppressing warping of the wiring sheet 100, it is preferable that the thickness range of the sealing resin layer 72 is the same as the thickness range of the second resin layer 5. Similarly, it is preferable that the thickness of the sealing resin layer 72 is within ±10% of the thickness of the second resin layer 5, and more preferably the same as the thickness of the second resin layer 5.

[0093] [Flatness of wiring sheet] From the viewpoint of suppressing warping of the wiring sheet 100, the flatness of the wiring sheet 100 is preferably 0 mm, but may exceed 0 mm. Similarly, the flatness of the wiring sheet 100 is preferably 0.25 mm or less, more preferably 0.20 mm or less, even more preferably 0.15 mm or less, even more preferably 0.10 mm or less, and still more preferably 0.05 mm or less. The flatness can be measured by the method described in the examples later.

[0094] [Method for manufacturing wiring sheets] Next, a method for manufacturing the wiring sheet 100 according to this embodiment will be described. The method for manufacturing the wiring sheet 100 according to this embodiment is not particularly limited. The method for manufacturing the wiring sheet 100 according to this embodiment is just one example of a method that can produce the aforementioned wiring sheet 100. The wiring sheet 100 can be manufactured, for example, by the following steps.

[0095] First, a process is carried out to manufacture a wiring film equipped with wiring bodies 3. In this process, a first resin layer 2 is formed on a first substrate 1. If the first resin layer 2 is formed with an adhesive, the adhesive for forming the first resin layer 2 is applied to the first substrate 1 to form a coating film. Next, the coating film is dried to create an adhesive layer as the first resin layer 2. Next, conductive wires 31 are arranged on the adhesive layer to form the wiring bodies 3. For example, with the adhesive layer with the first substrate 1 attached placed on the outer surface of a drum member, the conductive wires 31 are wound spirally around the adhesive layer while the drum member is rotated. Then, the bundle of spirally wound conductive wires 31 is cut along the axial direction of the drum member. This forms the wiring bodies 3 and places them on the adhesive layer. In this way, a wiring film is obtained in which wiring bodies 3 are formed on an adhesive layer with the first substrate 1. According to this method, for example, by rotating the drum member and moving the feed-out portion of the conductive wire 31 along a direction parallel to the axis of the drum member, it is easy to adjust the spacing L between adjacent conductive wires 31 in the wiring body 3.

[0096] Next, a pair of electrodes 4 are provided at both ends of the wiring body 3 of the wiring film prepared above.

[0097] Next, a step is performed to form the second resin layer 5. In this step, the second resin layer 5 is formed on the release film. If the second resin layer 5 is formed with an adhesive, the adhesive for forming the second resin layer 5 is applied to the release film to form a coating. Next, the coating is dried to create an adhesive layer as the second resin layer 5, and an adhesive film, also called an adhesive film, is obtained with an adhesive layer formed on the release film. Next, a step is performed to bond the adhesive film to the wiring film on which the pair of electrodes 4 are provided. In this step, the adhesive layer of the adhesive film is bonded to the wiring film on which the pair of electrodes 4 are provided to obtain the wiring sheet body 10.

[0098] On the other hand, a process is carried out to produce a sealed sheet 70 comprising a sealing substrate 71 and a sealing resin layer 72. In this process, the sealing resin layer 72 is formed on the sealing substrate 71. If the sealing resin layer 72 is formed with an adhesive, the adhesive for forming the sealing resin layer 72 is applied to the sealing substrate 71 to form a coating film. Next, the coating film is dried to obtain a sealed sheet 70 in which an adhesive layer as the sealing resin layer 72 is formed on the sealing substrate 71. Next, the produced sealed sheets 70 are bonded to the first end E11 and second end E12 of the wiring sheet body 10 produced above to produce a wiring sheet 100.

[0099] The release film provided with the above adhesive film can protect the second resin layer 5, which acts as an adhesive layer, until the wiring sheet 100 is used. By peeling off the release film, the second resin layer 5 can be attached to the substrate.

[0100] (Uses of wiring sheets, etc.) The wiring sheet 100 according to this embodiment can be suitably used as, for example, a planar heater. In this case, examples of applications for the planar heater include window defoggers and defrosters. Furthermore, the wiring sheet 100 according to this embodiment can be used as a heater for optical sensors. In this case, it can be used as a heater for optical sensors such as LiDAR sensors. The wiring sheets according to the second and third embodiments described later can also be applied to similar applications.

[0101] (Effects of the first embodiment) According to this embodiment, the following effects can be achieved. (1) According to this embodiment, since the first end E11 and the second end E12 of the wiring sheet body 10 are provided with sealing sheets 70, leakage current of the wiring sheet 100 can be suppressed. (2) According to this embodiment, the storage modulus of the second resin layer 5 at 23°C and the storage modulus of the sealing resin layer 72 at 23°C are, each, 1.0 × 10 4 Pa or higher, 5.0×10 6 Since the pressure is less than or equal to Pa, warping of the wiring sheet 100 can be suppressed even when a sealing sheet 70 is provided. (3) According to this embodiment, if the material of the second resin layer 5 and the material of the sealing resin layer 72 are made of the same material, the warping of the wiring sheet 100 is more easily suppressed. Furthermore, if the material of the second resin layer 5 and the material of the sealing resin layer 72 are made of the same material and have the same composition, the warping of the wiring sheet 100 is even more easily suppressed. (4) According to this embodiment, if the thickness range of the second resin layer 5 and the thickness range of the sealing resin layer 72 are the same, or if the difference between the thickness of the second resin layer 5 and the thickness of the sealing resin layer 72 is within ±10%, or if the thicknesses of both are the same, the warping of the wiring sheet 100 can be more easily suppressed. (5) According to this embodiment, sealing can be easily performed by attaching the sealing sheet 70 to the wiring sheet body 10 such that it has a first region 70A in which the sealing substrate 71, sealing resin layer 72, first substrate 1, first resin layer 2, wiring body 3, electrode 4, and second resin layer 5 are provided in this order in the thickness direction, and a second region 70B in which the sealing substrate 71, sealing resin layer 72, and second resin layer 5 are provided in this order in the thickness direction.

[0102] [Second Embodiment] <Wiring Sheet> Next, a second embodiment of the present invention will be described based on the drawings. The present invention is not limited to the contents of this embodiment. Note that in the drawings, some parts have been enlarged or reduced in size for the purpose of facilitating the explanation. The second embodiment differs from the first embodiment in that the wiring sheet body includes a second base material. The following description will primarily focus on the differences from the first embodiment, and redundant explanations will be omitted or simplified. Components similar to those in the first embodiment will be denoted by the same reference numerals, and their explanations will be omitted or simplified.

[0103] The wiring sheet 110 according to the second embodiment, as shown in Figure 4, comprises a wiring sheet body 11 and a sealing sheet 70 that seals the two ends of the wiring sheet body 11, the first end E11 and the second end E12. The sealing sheet 70 comprises a sealing resin layer 72 and a sealing substrate 71 that directly or indirectly supports the sealing resin layer 72.

[0104] The wiring sheet body 11 comprises a wiring body 3 having a conductive linear body 31, a pair of electrodes 4 that directly contact the conductive linear body 31, a first resin layer 2 that directly or indirectly supports the wiring body 3, a first base material 1 that directly or indirectly supports the first resin layer 2, a second base material 6 that directly or indirectly supports the wiring body 3, and a second resin layer 5 that is directly or indirectly supported by the second base material 6. The second base material 6 is provided at a location different from the side on which the first base material 1 is arranged. The wiring sheet body 11 is arranged in the thickness direction in this order: first base material 1, first resin layer 2, wiring body 3, electrodes 4, second base material 6, and second resin layer 5. The storage modulus of the second resin layer 5 and the sealing resin layer 72 at 23°C is 1.0 × 10⁻⁶, respectively. 4 Pa or higher, 5.0×10 6 The pressure is less than or equal to Pa. The second resin layer 5 and the sealing resin layer 72 are made of either the same material or different materials. In the wiring sheet 110, the presence of the second base material 6 in the wiring sheet body 11 further helps to suppress warping of the wiring sheet 110. In Figure 4, the entire region in which the sealing sheet 70 is provided, including both ends of the first and second end faces of the second resin layer 5, both ends of the first and second end faces of the second base material 6, and both ends of the first and second end faces of the wiring sheet body 11, is included at the end of the wiring sheet body 11.

[0105] The wiring sheet 110, similar to the wiring sheet 100 described in the first embodiment, has a first region and a second region in the area where the sealing sheet 70 is provided. In the wiring sheet 110, the first region is an area in which the sealing substrate 71, sealing resin layer 72, first substrate 1, first resin layer 2, wiring body 3, electrode 4, second substrate 6, and second resin layer 5 are provided in this order in the thickness direction, and the second region is an area in which the sealing substrate 71, sealing resin layer 72, second substrate 6, and second resin layer 5 are provided in this order in the thickness direction.

[0106] In the wiring sheet body 11, specific examples of the first base material 1, the first resin layer 2, the wiring body 3, the electrodes 4, and the second resin layer 5 are as described in the first embodiment. In the sealing sheet 70, specific examples of the sealing base material 71 and the sealing resin layer 72 are as described in the first embodiment.

[0107] (Second base material) The material of the second base material 6 is not particularly limited. From the viewpoint of the strength and handling of the wiring sheet 110, the material of the second base material 6 is preferably resin. If the material of the second base material 6 is resin, the resin can be exemplified by the resin described in the first base material 1. The material of the second base material 6 and the material of the sealing base material 71 may be made of different materials or the same material. If the material of the second base material 6 and the material of the sealing base material 71 are made of the same material, it is thought that their characteristics, such as the amount of thermal deformation, will be similar. For this reason, from the viewpoint of further suppressing the warping of the wiring sheet 110, it is preferable that the material of the second base material 6 and the material of the sealing base material 71 are made of the same material. For example, if the material of the second base material 6 and the material of the sealing base material 71 are both made of resin, it is preferable that they be the same type of resin.

[0108] When the second substrate 6 is in the form of a film, the thickness of the second substrate 6 is not particularly limited. The thickness of the second substrate 6 is preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 50 μm or more. Furthermore, the thickness of the second substrate 6 is preferably 1 mm or less, more preferably 500 μm or less, and even more preferably 300 μm or less. From the viewpoint of further suppressing the warping of the wiring sheet 110, it is preferable that the thickness range of the second substrate 6 is the same as the thickness range of the sealing substrate 71. From a similar viewpoint, it is preferable that the thickness of the second substrate 6 is within ±10% of the thickness of the sealing substrate 71. From a similar viewpoint, it is more preferable that the second substrate 6 and the sealing substrate 71 are made of the same thickness as each other.

[0109] [Method for manufacturing wiring sheets] The method for manufacturing the wiring sheet 110 according to this embodiment differs from the method for manufacturing the wiring sheet 100 described in the first embodiment in that it differs in the step of forming the second resin layer 5 and the step of bonding the adhesive layer with a release film to the wiring body film on which a pair of electrodes 4 are provided.

[0110] In the process of forming the second resin layer 5, the second resin layer 5 is formed on the second substrate 6. When the second resin layer 5 is formed with an adhesive, the adhesive for forming the second resin layer 5 is applied to the second substrate 6 to form a coating film. Next, the coating film is dried to create an adhesive layer which will be the second resin layer 5. Next, a release film is attached to the adhesive layer to obtain an adhesive film, also called an adhesive film with a release film, in which the adhesive layer is formed on the second substrate 6. Next, the second substrate 6 of the adhesive film is bonded to a wiring film on which a pair of electrodes 4 are provided. In this process, the wiring sheet body 11 is created by bonding the second substrate 6 of the adhesive film to a wiring film on which a pair of electrodes 4 are provided.

[0111] (Effects of the second embodiment) According to this embodiment, the effects (1) to (5) of the first embodiment can be achieved. Furthermore, according to this embodiment, the following effects can also be achieved. (6) According to this embodiment, the presence of the second base material 6 makes it easier to suppress the warping of the wiring sheet 110. (7) According to this embodiment, if the material of the second substrate 6 and the material of the sealing substrate 71 are made of the same material, the warping of the wiring sheet 110 can be further suppressed. (8) According to this embodiment, if the thickness range of the second substrate 6 and the thickness range of the sealing substrate 71 are the same, or if the difference between the thickness of the second substrate 6 and the thickness of the sealing substrate 71 is within ±10%, or if the thicknesses of both are the same, the warping of the wiring sheet 110 is more easily suppressed.

[0112] [Third Embodiment] Next, a third embodiment of the present invention will be described based on the drawings. The present invention is not limited to the contents of this embodiment. Note that in the drawings, some parts have been enlarged or reduced in size for the purpose of facilitating the explanation. The third embodiment differs from the second embodiment in that the wiring sheet body is formed in a fan-shaped trapezoidal form, and the conductive linear body 31 is formed in a corrugated shape. The other layer configurations are the same as those of the wiring sheet 110 described in the second embodiment. The following description will primarily focus on the differences between the first and second embodiments, omitting or simplifying redundant explanations. Components similar to those in the first and second embodiments will be denoted by the same reference numerals, and their descriptions will be omitted or simplified.

[0113] The wiring sheet 112 according to the second embodiment, as shown in Figure 5, comprises a wiring sheet body 12 and a sealing sheet 70 that seals the two ends of the wiring sheet body 12, the first end E11 and the second end E12. The wiring sheet body 12 is formed in a fan-shaped trapezoidal form such that the side connecting the first end E11 and the second end E12 is arc-shaped. The sealing sheet 70 comprises a sealing resin layer 72 and a sealing substrate 71 that directly or indirectly supports the sealing resin layer 72. Specific examples of the location where the sealing sheet 70 is provided are as described in the first and second embodiments, and the area where the sealing sheet 70 is provided has a first region and a second region, and is formed in the layer configuration at the first end E11 and E12 shown in Figure 4.

[0114] The wiring sheet body 12 comprises a wiring body 3 having a conductive linear body 31 formed in a corrugated shape, a pair of electrodes 4 that directly contact the conductive linear body 31, a first resin layer (not shown) that directly or indirectly supports the wiring body 3, a first base material 1 that directly or indirectly supports the first resin layer (not shown), a second base material (not shown) that directly or indirectly supports the wiring body 3, and a second resin layer (not shown) that is directly or indirectly supported by the second base material. The wiring sheet body 12 is arranged in the thickness direction in the order of the first base material 1, the first resin layer, the wiring body 3, the electrodes 4, the second base material, and the second resin layer. The conductive linear body 31 is arranged to conform to the shape of the wiring sheet body 12. In the wiring sheet body 12, specific examples of the first base material 1, the first resin layer, the wiring body 3, the electrodes 4, and the second resin layer are as described in the first embodiment, and specific examples of the second base material are as described in the second embodiment.

[0115] (Effects of the third embodiment) According to this embodiment, the effects (1) to (5) of the first embodiment and the effects (6) to (8) of the second embodiment can be achieved.

[0116] [Variations of the Embodiment] The present invention is not limited to the embodiments described above, and any modifications or improvements that can achieve the objectives of the present invention are included in the present invention.

[0117] For example, in the wiring sheet 100 of the first embodiment, the second resin layer 5 extends outward along the axial direction of the conductive linear body 31, beyond the first base material 1, the first resin layer 2, and the wiring body 3, and in the wiring sheet 110 of the second embodiment, the second base material 6 and the second resin layer 5 extend outward along the axial direction of the conductive linear body 31, beyond the first base material 1, the first resin layer 2, and the wiring body 3, but the invention is not limited to these. Taking the wiring sheet 110 of the second embodiment as an example, the end faces of each component, the first base material 1, the first resin layer 2, the wiring body 3, the second base material 6, and the second resin layer 5, may be aligned. In this case, the sealing resin layer 72 of the sealing sheet 70 may be attached toward the end faces of each component, the first base material 1, the first resin layer 2, the wiring body 3, the second base material 6, and the second resin layer 5, but not attached to the end faces of the second base material 6 and the second resin layer 5, and may be attached to the end faces of the first base material 1, the first resin layer 2, and the wiring body 3.

[0118] Furthermore, in the wiring sheets 100, 110, and 112, both ends of the wiring sheet bodies 10, 11, and 12 are sealed, but depending on the arrangement of the wiring body 3, for example, only one end may be sealed, as long as leakage current is suppressed and warping is suppressed.

[0119] Furthermore, in the wiring sheets 100, 110, and 112, for example, the sealing sheet 70 is provided only at both ends on the axial side of the conductive wire 31 in the wiring sheet bodies 10, 11, and 12. However, it is not limited to this, and the sealing sheet 70 may also be provided at both ends on the axial side of the conductive wire 31 in the wiring sheet bodies 10, 11, and 12, and, if necessary, at least one end in a direction intersecting the axial direction of the conductive wire 31. [Examples]

[0120] The present invention will be described in more detail below with reference to examples. The present invention is not limited to these examples.

[0121] The wiring sheets prepared in each example were evaluated as follows.

[0122] [Flatness] For each example, the wiring sheet immediately after fabrication was placed on a granite precision surface plate conforming to JIS standard Class 0 (JIS B7513:1992). The flatness (unit: mm) was measured using the maximum deflection type flatness measurement method (measuring device: Teclock Co., Ltd., "PG-02J"), where a constant pressure thickness gauge manufactured by Teclock Co., Ltd. was applied at the positions indicated by arrows V1 and V2 in Figure 5, and the deflection range of the thickness gauge reading was recorded. A wiring sheet with a small flatness indicates that warping has been suppressed.

[0123] [Measurement of storage modulus] A cylindrical test sample with a diameter of 8 mm and a thickness of 1 mm was prepared from the same composition as the composition forming the layer to be measured. The storage modulus of the test sample was measured using a viscoelasticity measuring device (Anton Paar, device name "MCR300") with an 8 mm diameter parallel plate as the measuring fixture, under the conditions of a test temperature of 23°C, a shear strain of 0.05%, and a frequency of 1 Hz.

[0124] The wiring sheets for each example were prepared as follows. Unless otherwise specified, the mixing ratios refer to the solid content ratio.

[0125] [Preparation Example 1] 100 parts by mass of an acrylic copolymer (2-ethylhexyl acrylate (2EHA) / vinyl acetate (VAc) / acrylic acid (AA) = 74 / 24 / 2 (mass ratio), weight-average molecular weight (Mw): 600,000) was mixed with 0.15 parts by mass of aluminum tris(acetylacetonate) as a crosslinking agent. Then, the mixture was diluted with toluene and uniformly stirred to obtain a coating solution of the adhesive composition.

[0126] [Preparation Example 2] 100 parts by mass of an acrylic copolymer (2-ethylhexyl acrylate (2EHA) / 4-acryloylmorpholine (ACMO) / isobornyl acrylate (IBXA) / 2-hydroxyethyl acrylate (HEA) = 65 / 5 / 15 / 15 (mass ratio), weight-average molecular weight (Mw): 500,000) was mixed with 0.18 parts by mass of trimethylolpropane-modified tolylene diisocyanate as a crosslinking agent, 7.0 parts by mass of ε-caprolactone-modified tris-(2-acryloxyethyl) isocyanurate as an energy-ray curing component, 0.7 parts by mass of a mixture of benzophenone and 1-hydroxycyclohexyl phenyl ketone in a 1:1 mass ratio as photopolymerization initiators, and 0.28 parts by mass of 3-glycidoxypropyltrimethoxysilane as a silane coupling agent. The mixture was then diluted with methyl ethyl ketone and uniformly stirred to obtain a coating solution for an adhesive composition.

[0127] [Preparation Example 3] 100 parts by mass of an acrylic copolymer (n-butyl acrylate (BA) / 2-ethylhexyl acrylate (2EHA) / 4-acryloylmorpholine (ACMO) / isobornyl acrylate (IBXA) / 2-hydroxyethyl acrylate (HEA) = 25 / 30 / 5 / 15 / 25 (mass ratio), weight-average molecular weight (Mw): 600,000) was mixed with 0.2 parts by mass of trimethylolpropane-modified tolylene diisocyanate as a crosslinking agent, 8.0 parts by mass of ε-caprolactone-modified tris-(2-acryloxyethyl) isocyanurate as an energy-ray curing component, 0.8 parts by mass of 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide as a photopolymerization initiator, and 0.2 parts by mass of 3-glycidoxypropyltrimethoxysilane as a silane coupling agent. The mixture was then diluted with methyl ethyl ketone and uniformly stirred to obtain a coating solution for an adhesive composition.

[0128] [Preparation Example 4] A thermosetting adhesive was obtained by blending 100 parts by mass of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "YX7200B35") with 170 parts by mass of a polyfunctional hydrogenated bisphenol A diglycidyl ether epoxy compound (manufactured by Mitsubishi Chemical Corporation, product name "YX8000"), 0.2 parts by mass of a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-4803"), 2 parts by mass of a thermal cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., product name "San-Aid SI-B3"), and 2 parts by mass of a thermal cationic polymerization initiator (manufactured by Sanshin Chemical Industry Co., Ltd., product name "San-Aid SI-B7").

[0129] [Example 1] A 150 μm thick first substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") was coated with the adhesive composition solution obtained in Preparation Example 1 to a thickness of 10 μm to form an adhesive layer as the first resin layer. A roll of adhesive film measuring 400 mm wide x 1000 M long with a 10 μm thick adhesive layer was prepared, and a gold-plated tungsten wire (diameter: 12 μm) was prepared as the wire. The wire wound on a bobbin was attached to the surface of the adhesive layer of the adhesive film located near the end of the drum member. The wire was pressed with a nip roll while being fed out, and a wire wiring film with a wave-shaped pattern as shown in Figure 5 was formed by adjusting the movement distance in the drum axis direction, movement speed, and acceleration. Subsequently, electrodes (thickness: 60 μm, width: 5 mm, length: 3 cm) were attached to the wire wiring film. A second substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") with a thickness of 150 μm was coated with the adhesive composition solution obtained in Preparation Example 1 to a thickness of 45 μm to form an adhesive layer as a second resin layer. A release film (manufactured by Lintec Corporation, "SP-381031") with a thickness of 38 μm was placed on this adhesive layer to prepare an adhesive film. The wiring sheet body was prepared by laminating a wire wiring film onto the substrate surface of the adhesive film with the release film using a laminator. Separately, a sealing sheet was prepared by applying the adhesive composition solution obtained in Preparation Example 1 to a thickness of 45 μm onto a 150 μm thick sealing substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") to form an adhesive layer as a sealing resin layer. Next, in the region outside the electrodes, in the area outside the electrodes, a wiring sheet was fabricated by laminating an adhesive layer with a sealing sheet thickness of 45 μm onto both ends of the wire wiring film in the wiring sheet body fabricated above, from above the first substrate, toward the first substrate using a laminator. The sealing sheet is positioned such that, in the direction along the axial direction of the wire in the wiring sheet body, the length of the sealing sheet at one end is 5% or less of the total length of the wire wiring film from one end to the other. The storage moduli of the second resin layer and the sealing resin layer at 23°C are 1.4 × 10⁻⁶, respectively. 5 It was Pa.

[0130] [Example 2] A sealing sheet was prepared by applying the adhesive composition solution obtained in Preparation Example 2 to a 150 μm thick sealing substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") to form a 45 μm thick adhesive layer, thereby creating an adhesive layer that serves as a sealing resin layer. Using this sealing sheet, after laminating the sealing sheet, ultraviolet light with a wavelength of 365 nm was applied at an irradiance of 200 mW / cm². 2 , light intensity 1000mJ / cm 2 A wiring sheet was prepared in the same manner as in Example 1, except that it was irradiated under the specified conditions. The storage modulus of the sealing resin layer at 23°C is 1.1 × 10⁻⁶. 5 It was Pa.

[0131] [Example 3] A sealing sheet was prepared by applying the adhesive composition solution obtained in Preparation Example 3 to a 150 μm thick sealing substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") to form a 45 μm thick adhesive layer, thereby creating an adhesive layer that serves as a sealing resin layer. Using this sealing sheet, after laminating the sealing sheet, ultraviolet light with a wavelength of 365 nm was applied at an irradiance of 200 mW / cm². 2 , light intensity 1000mJ / cm 2 A wiring sheet was prepared in the same manner as in Example 1, except that it was irradiated under the specified conditions. The storage modulus of the sealing resin layer at 23°C is 3.8 × 10⁻⁶. 5 It was Pa.

[0132] [Comparative Example 1] A sealing sheet was prepared by applying the thermosetting adhesive obtained in Preparation Example 4 to a thickness of 45 μm onto a 150 μm thick sealing substrate (manufactured by Nippon Matai Co., Ltd., "Esmar URSPPX#15PFT50X") to form an adhesive layer as a sealing resin layer. Using this sealing sheet, a wiring sheet was prepared in the same manner as in Example 1, except that the sealing sheet was laminated and then heated at 120°C, 0.5 MPa, and for 30 minutes. The storage modulus of the sealing resin layer at 23°C is 2.2 × 10⁻⁶. 9 It was Pa.

[0133] [Table 1]

[0134] As shown in Table 1, the storage modulus of the second resin layer and the sealing resin layer at 23°C was 1.0 × 10⁻⁶, respectively. 4 Pa or higher, 5.0×10 6 The wiring sheets obtained in each embodiment that met the range of Pa or less had low flatness and good evaluation of warpage. On the other hand, the storage modulus of the sealing resin layer at 23°C is 1.0 × 10⁻⁶. 4 Pa or higher, 5.0×10 6The wiring sheet obtained in Comparative Example 1, which was outside the range of Pa or less, had high flatness and warping occurred.

[0135] From the above results, it was confirmed that the wiring sheet according to the present invention can suppress the occurrence of warping even when it is equipped with a sealing sheet as a sealing member. [Explanation of Symbols]

[0136] 1...First base material, 2...First resin layer, 3...Wiring body, 31...Conductive wire, 4...Electrode, 5...Second resin layer, 6...Second base material, 10,11,12...Wiring sheet body, 70...Sealing sheet, 71...Sealing base material, 72...Sealing resin layer, 100,110,112...Wiring sheet, E11...First end, E12...Second end, F11...First end face (Wiring sheet body), F12...Second end face (Wiring sheet body), F51...First end face (Second resin layer), F52...Second end face (Second resin layer), F71A, F72A...First end face (Sealing sheet), F71B, F72B...Second end face (Sealing sheet), 70A...First region, 70B...Second region.

Claims

1. The wiring sheet itself, The wiring sheet body comprises a sealing sheet that seals the end of the wiring sheet body, The aforementioned wiring sheet body, A wiring body comprising a conductive linear body, A pair of electrodes in direct contact with the conductive linear body, A first resin layer that directly or indirectly supports the wiring assembly, A first substrate that directly or indirectly supports the first resin layer, The wiring body is provided with a second resin layer located at a different location from the side on which the first resin layer is provided, and which directly or indirectly supports the wiring body. The first substrate, the first resin layer, the wiring body, the electrode, and the second resin layer are arranged in this order in the thickness direction. The aforementioned sealing sheet, A sealing resin layer, The device comprises a sealing substrate that directly or indirectly supports the sealing resin layer, The storage modulus at 23°C of the second resin layer and the sealing resin layer is 1.0 × 10⁻⁶, respectively. ４ Pa or more, 5.0×10 ６ It is less than or equal to Pa, The second resin layer and the sealing resin layer are either made of the same material or made of different materials. Wiring sheet.

2. In the wiring sheet according to claim 1, A second substrate that directly or indirectly supports the wiring assembly, The second resin layer is directly or indirectly supported by the second substrate, The first substrate, the first resin layer, the wiring body, the electrode, the second substrate, and the second resin layer are arranged in this order in the thickness direction. The second substrate and the sealing substrate are either made of the same material or made of different materials. Wiring sheet.

3. In the wiring sheet according to claim 1 or claim 2, The second resin layer and the sealing resin layer are made of the same material and are composed of the same composition. Wiring sheet.

4. In the wiring sheet according to claim 1 or claim 2, The sealing sheet is provided in a region outside the electrode. Wiring sheet.

5. In the wiring sheet according to claim 1 or claim 2, The wiring body has a structure in which a plurality of the conductive linear bodies are arranged at intervals. Wiring sheet.

6. In the wiring sheet according to claim 2, The second substrate and the sealing substrate are made of the same material. Wiring sheet.

7. In the wiring sheet according to claim 2, The second substrate and the sealing substrate are made of the same thickness. Wiring sheet.

8. In the wiring sheet according to claim 2, The sealing resin layer is provided toward the first substrate and the second substrate, respectively. The sealing substrate, the sealing resin layer, the first substrate, the first resin layer, the wiring body, the electrode, the second substrate, and the second resin layer are arranged in this order in the thickness direction in a first region, The sealing substrate, the sealing resin layer, the second substrate, and the second resin layer are provided in this order in the thickness direction, including a second region. Wiring sheet.

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