Power generation module and method for manufacturing the power generation module

By employing a dual sealing member system with varying transmittances and laser-irradiated adhesion, the power generation module addresses adhesion issues, ensuring secure sealing and efficient operation.

JP2026061717APending Publication Date: 2026-04-09PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2026-04-09

AI Technical Summary

Technical Problem

The adhesion of the sealing member in existing power generation modules is inadequate, leading to potential issues in sealing effectiveness.

Method used

A power generation module design with a first sealing member having a higher transmittance and a second sealing member with lower transmittance, both made of EVOH, are separately applied to respective substrates and joined using laser irradiation to enhance adhesion, reducing the risk of overheating the power generation element.

Benefits of technology

The improved adhesion between the sealing members and substrates enhances the sealing effectiveness and reduces the risk of overheating, ensuring secure sealing and efficient operation of the power generation module.

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Abstract

To provide a power generation module with improved adhesion of the sealing member. [Solution] The power generation module according to the present disclosure comprises a first substrate, a second substrate arranged opposite to the first substrate with a gap between them, a power generation element provided in the space between the first substrate and the second substrate and including a photoelectric conversion layer that converts light absorbed through the first substrate into photoelectric energy, and a sealing member that seals the space, wherein the sealing member has a first sealing member in contact with the first substrate and having a first transmittance for a first wavelength, and a second sealing member in contact with the second substrate, forming an interface with the first sealing member and having a second transmittance for a first wavelength, the second transmittance being lower than the first transmittance.
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Description

Technical Field

[0001] The present disclosure relates to a power generation module.

Background Art

[0002] For example, Patent Document 1 discloses a power generation module including two substrates, a power generation module, and a sealing member. The power generation module and the sealing member are disposed between the two substrates, and the sealing member seals the power generation module in the region between the two substrates.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the power generation module described in Patent Document 1, there is still room for improvement in terms of the adhesion of the sealing member.

[0005] An object of the present disclosure is to solve the above problems and provide a power generation module with improved adhesion of the sealing member.

Means for Solving the Problems

[0006] A power generation module according to an aspect of the present disclosure includes a first substrate, a second substrate disposed to face the first substrate with a gap therebetween, a power generation element provided in a space between the first substrate and the second substrate and including a photoelectric conversion layer that photoelectrically converts light absorbed through the first substrate, and a sealing member that seals the space. The sealing member has a first sealing member that is in contact with the first substrate and has a first transmittance with respect to a first wavelength, and a second sealing member that is in contact with the second substrate, forms an interface with the first sealing member, and has a second transmittance with respect to the first wavelength. The second transmittance is lower than the first transmittance.

[0007] A method for manufacturing a power generation module according to one aspect of the present disclosure includes: providing a first encapsulating member having a first transmittance for a first wavelength on a first substrate; providing a second encapsulating member having a second transmittance lower than the first transmittance for a first wavelength on a second substrate; providing a power generation element having a photoelectric conversion layer that converts light absorbed through the first substrate into photoelectric energy on either the first or second substrate; placing the first and second substrates opposite each other and bringing the first and second encapsulating members into contact; and irradiating the second encapsulating member with a laser through the first substrate and the first encapsulating member. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a power generation module in which the sealing member has improved adhesion. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic top view of a power generation module according to Embodiment 1 of this disclosure. [Figure 2] Schematic cross-sectional view of the power generation module along line II-II in Figure 1. [Figure 3] Schematic exploded perspective view of the power generation module shown in Figure 1. [Figure 4] Enlarged view of Figure 2 showing the sealing member [Figure 5A] Schematic diagram showing the manufacturing method of a power generation module. [Figure 5B] Schematic diagram showing the manufacturing method of a power generation module. [Figure 5C] Schematic diagram showing the manufacturing method of a power generation module. [Figure 5D] Schematic diagram showing the manufacturing method of a power generation module. [Figure 5E] Schematic diagram showing the manufacturing method of a power generation module. [Figure 6] A schematic top view of a power generation module according to Embodiment 2 of this disclosure. [Figure 7] A schematic cross-sectional view of a power generation module showing the sealing member and lead wires. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described below with reference to the drawings. However, this embodiment does not limit the disclosure. Furthermore, substantially identical components are denoted by the same reference numerals in the drawings. For illustrative purposes, the dimensions of elements in the drawings may be exaggerated and are not necessarily to scale. For reference, the drawings schematically show mutually orthogonal X, Y, and Z axes.

[0011] Furthermore, for the sake of clarity, the following terms indicating directions such as "up," "down," "right," "left," and "side" are used assuming the conditions of normal use, but this does not mean that the usage conditions of the power generation module relating to this disclosure are limited. In addition, in this specification, "orthogonal" means within a range of 90° ± 10°. "Parallel" means, for example, within a range of ± 5°.

[0012] In the diagrams described below, mutually orthogonal X, Y, and Z axes are schematically shown for reference. In the following description, when simply referred to as the X direction, Y direction, or Z direction, it refers to the respective axis direction, including the two opposite directions (e.g., -X direction and +X direction).

[0013] (Embodiment 1) The basic configuration of the power generation module according to Embodiment 1 of this disclosure will be described with reference to Figures 1 to 3. Figure 1 is a schematic top view of the power generation module according to Embodiment 1 of this disclosure. Figure 2 is a schematic cross-sectional view of the power generation module of Figure 1 along the line II-II. Figure 3 is a schematic exploded perspective view of the power generation module of Figure 1.

[0014] As shown in Figures 1 to 3, the power generation module 1 comprises a first substrate 11, a second substrate 12, a power generation element 100, and a sealing member 50.

[0015] In the following description, the power generation module 1 will be described as a power generation module that can be integrated with building materials such as building windows. The power generation module 1 can be used, for example, as a window disposed in a building such that external light enters from the side of the first substrate 11.

[0016] The Z direction (also referred to as the "first direction") shown in FIGS. 1 to 3 corresponds to the thickness direction of the power generation module 1. The thickness direction of the power generation module 1 is, for example, the stacking direction of the two substrates 11 and 12, or the stacking direction of the solar cell layers included in the power generation module 1. Also, in the plane orthogonal to the Z direction, the directions intersecting each other (here, orthogonal) are defined as the X direction and the Y direction. The Y direction is, for example, the height direction of the window, and the X direction may be, for example, the width direction of the window.

[0017] The first substrate 11 and the second substrate 12 have a third transmittance in a predetermined wavelength range. In this specification, the predetermined wavelength range includes the visible light and near infrared regions. The predetermined wavelength range includes a first wavelength, and the first wavelength is, for example, 1070 nm. The third transmittance is, for example, 50%, preferably 70%, more preferably 90% or more with respect to the first wavelength.

[0018] The first substrate 11 and the second substrate 12 are, for example, rectangular glass substrates (tempered glass substrates). The lower surface of the first substrate 11 and the upper surface of the second substrate 12 are flat. As shown in FIG. 1, in the top view of the power generation module 1 or a part thereof, the illustration of the first substrate 11 may be omitted for clarity.

[0019] As shown in FIG. 2, the first substrate 11 and the second substrate 12 are arranged to face each other in the Z direction. The first substrate 11 on the light-receiving side may be thinner than the second substrate 12.

[0020] The periphery of the first substrate 11 and the periphery of the second substrate 12 are sealed by a sealing member 50. In a plan view along the direction, the sealing member 50 is located outside the space 13 in which the power generation element 100 is arranged, and is positioned to surround the space 13. In this specification, "sealing" means restricting the inflow and outflow of fluid to and from the space 13. The space 13 may be filled with a fluid other than air or a solid.

[0021] In Embodiment 1, the main component of the sealing member 50 is EVOH. In this specification, "main component" means that other materials may be added. The ethylene content of the sealing member 50 may be, for example, 27 mol% or more and 48 mol% or less.

[0022] The power generation element 100 is a solar cell module having a solar cell (power generation unit). The power generation element 100 is, for example, a thin-film solar cell module such as a-Si or CIGS. The power generation element 100 is located in the space 13 between the first substrate 11 and the second substrate 12 and is provided on the second substrate 12. The power generation element 100 has, for example, a rectangular planar shape. In the example shown in Figure 1, the power generation element 100 is arranged in the space 13 surrounded by the first substrate 11, the second substrate 12 and the sealing member 50.

[0023] In Embodiment 1, the power generation element 100 has a power generation section. Specifically, the power generation section has a laminated structure in which a plurality of layers, including a solar cell layer, are stacked in the Z direction. The solar cell layer is a layer (photoelectric conversion layer) that converts light absorbed through the first substrate 11 into photoelectric energy. The solar cell layer includes, for example, a perovskite compound (peribskite semiconductor) as a photoelectric conversion material. The perovskite compound is a perovskite crystal structure represented by the chemical formula ABX3 and structures having similar crystals. A is a monovalent cation, B is a divalent cation, and X is a halogen anion.

[0024] A gap is formed between the first substrate 11 and the upper surface of the power generation element 100. The space between the first substrate 11 and the upper surface of the power generation element 100 may be filled with a filler. For example, a filler such as polyolefin (PO) can be used. The filler may also be provided between the second substrate 12 and the lower surface of the power generation element 100, filling the space 13 surrounded by the first substrate 11, the second substrate 12 and the sealing member 50. This suppresses the influence of air on the solar cell layer within the power generation element 100. A partial air layer may be formed in the above space.

[0025] The power generation module 1 further comprises a first wiring 41a and a second wiring 42a extending in the Y direction between the first substrate 11 and the second substrate 12. The first wiring 41a is located on one end side of the first substrate 11. The second wiring 42a is located on the other end side of the first substrate 11. The wirings 41a and 42a are electrically connected to the power generation section. These wirings may be metal wirings. In Embodiment 1, these wirings are copper wires covered with solder (tab wires).

[0026] The power generation module 1 further comprises a pair of lead wires (+ / - lead wires) 21 and 22. The lead wires 21 and 22 are, for example, metal wiring (e.g., tab wires). The lead wires 21 and 22 are electrically connected to the power generation element 100 within a space 13 enclosed by the first substrate 11, the second substrate 12, and the sealing member 50. The lead wires 21 and 22 are drawn out from within the space 13, through the sealing member 50 to the outside. The lead wires 21 and 22 pass through the vicinity of the center of the sealing member 50 in the Z direction and are spaced apart from the substrates 11 and 12 in the Z direction. This configuration makes it easy to connect the lead wires 21 and 22 to other components, such as a junction box located outside the space 13.

[0027] In the example shown in Figure 1, lead wire 21 is electrically connected to one end of the first wiring 41a. Lead wire 22 is electrically connected to one end of the second wiring 42a. Lead wire 21 may be an extension of the first wiring 41a, and lead wire 22 may be an extension of the second wiring 42a.

[0028] Next, the sealing member 50 will be described in more detail with reference to Figure 4. Figure 4 is an enlarged view of Figure 2 showing the sealing member 50.

[0029] As shown in Figure 4, the sealing member 50 has a first sealing member 51 and a second sealing member 52. The first sealing member 51 is provided on the first substrate 11, and the second sealing member 52 is provided on the second substrate 12. The sealing members 51 and 52 are in close contact with the substrates 11 and 12, respectively. Furthermore, the lower surface of the first sealing member 51 and the upper surface of the second sealing member 52 are also in close contact with each other. An interface 53 is formed between the sealing members 51 and 52. In Embodiment 1, the interface 53 extends in the direction along the substrates 11 and 12, that is, along the XY plane. On the other hand, the interface 53 may extend in a curved or bent shape when viewed from the X or Y direction.

[0030] The lead wires 21 and 22 may pass through only the first sealing member 51, only the second sealing member 52, or both sealing members 51 and 52.

[0031] In Embodiment 1, the main components of the sealing members 51 and 52 are EVOH, respectively. Therefore, it is difficult to make the surfaces of the sealing members 51 and 52 flat compared to the substrates 11 and 12. On the other hand, the sealing members 51 and 52 conduct heat more easily and have lower melting points than the substrates 11 and 12.

[0032] The sealing members 51 and 52 differ from each other in terms of transmittance. The first sealing member 51 has a first transmittance with respect to a first wavelength. The second sealing member 52 has a second transmittance with respect to a first wavelength that is lower than the first transmittance. The first transmittance is, for example, 50%, preferably 70%, and more preferably 90% or more with respect to the first wavelength. The second transmittance is, for example, 30%, preferably 20%, and more preferably 10% or less with respect to the first wavelength.

[0033] The third transmittance of substrates 11 and 12 is higher than the second transmittance of the second sealing member 52. The third transmittance of substrates 11 and 12 may also be higher than the first transmittance of the first sealing member 51.

[0034] In Embodiment 1, the second sealing member 52 contains a light absorber in addition to EVOH. The light absorber may be, for example, black fine particles, carbon, graphite, iron oxide, chromium oxide, manganese oxide, or titanium black fine particles or powder. The distribution of the light absorber in the second sealing member 52 may be uniform, or the distribution of the light absorber may change in the Z direction near the interface 53.

[0035] The thickness t1 of the first sealing member 51 is smaller than the thickness t2 of the second sealing member 52. For example, the thickness t1 of the first sealing member 51 is 1 / 2 times or less of the thickness t2 of the second sealing member 52.

[0036] The distance d1 in the Z direction between the first substrate 11 and the second substrate 12, i.e., the thickness of the sealing member 50, is, for example, 1 mm or more and 3 mm or less. On the other hand, the thickness of the power generation element 100 is, for example, 1 μm or less. Furthermore, by reducing the distance d2 in the X direction between the side surface of the power generation element 100 and the sealing member 50, the area of ​​the power generation element 100 can be increased, and the power generation efficiency of the power generation module 1 can be improved.

[0037] Next, the manufacturing method of the power generation module 1 will be explained with reference to Figures 5A to 5E. Figures 5A to 5E are schematic diagrams showing the manufacturing method of the power generation module 1.

[0038] As shown in Figures 5A and 5B, first, a first sealing member 51 is provided on the first substrate 11, and a second sealing member 52 is provided on the second substrate. Specifically, the sealing members 51 and 52 are heat-pressed onto the respective substrates 11 and 12. Through heat-pressing, the first sealing member 51 adheres closely to the first substrate 11, and the second sealing member 52 adheres closely to the second substrate 12.

[0039] Next, as shown in Figure 5C, the power generation element 100 is placed on the second substrate 12. Since the power generation element 100 is placed after thermocompression bonding, heating of the power generation element 100 is suppressed, and the risk of failure can be reduced. The sum of the thickness of the first sealing member 51 and the thickness of the second sealing member 52 is greater than the thickness of the power generation element 100.

[0040] Next, as shown in Figure 5D, the first substrate 11 and the second substrate 12 are placed facing each other. In this arrangement, the first sealing member 51 and the second sealing member 52 are in contact with each other. However, because irregularities are formed on the surfaces of the sealing members 51 and 52, a gap exists between the sealing members 51 and 52.

[0041] Next, as shown in Figure 5E, the first sealing member 51 and the second sealing member 52 are joined by laser irradiation. This joining process may also be called a laser welding process.

[0042] Specifically, a laser having a wavelength within a predetermined wavelength range is irradiated in the Z direction toward the upper surface of the second sealing member 52 through the first substrate 11 and the first sealing member 51. The entire upper surface of the second sealing member 52 is irradiated. Depending on the relationship between the area of ​​the second sealing member 52 and the laser spot diameter, spot irradiation may be performed, or the laser beam may be scanned relative to the second sealing member 52. Irradiation conditions such as the type of laser, laser energy, irradiation time, and scanning speed may be appropriately set according to the material and absorptivity of the second sealing member 52.

[0043] Upon laser irradiation, the light absorber in the second sealing member 52 absorbs laser energy and is heated. As a result, the second sealing member 52 (i.e., EVOH) surrounding the light absorber is also heated and melted. The first sealing member 51, which is in contact with the heated second sealing member 52, is also heated and melted. The melted sealing members 51 and 52 have fluidity and form an interface 53 where they are in contact with each other. When the laser irradiation ends or the laser beam is removed, the melted sealing members 51 and 52 solidify while in contact at the interface 53. Laser irradiation causes the sealing members 51 and 52 to adhere tightly to each other.

[0044] (Effect 1) The power generation module 1 and its manufacturing method according to Embodiment 1 can achieve the following effects.

[0045] The power generation module 1 of Embodiment 1 comprises a first substrate 11 and a second substrate 12 arranged opposite the first substrate 11 with a gap between them. The power generation module 1 further comprises a power generation element 100 provided in the space 13 between the first substrate 11 and the second substrate 12, including a photoelectric conversion layer that converts light absorbed through the first substrate 11 into photoelectric energy, and a sealing member 50 that seals the space 13. The sealing member 50 has a first sealing member 51 and a second sealing member 52. The first sealing member 51 is in contact with the first substrate 11 and has a first transmittance for a first wavelength. The second sealing member 52 is in contact with the second substrate 12 and forms an interface 53 with the first sealing member 51 and has a second transmittance for a first wavelength. The second transmittance is lower than the first transmittance.

[0046] With this configuration, by separately providing and joining the sealing members 51 and 52 to each substrate 11 and 12, it becomes possible to tightly adhere the sealing members 51 and 52 to each substrate 11 and 12 by thermocompression bonding or the like before attaching the power generation element 100 to the substrate. Even when using thermocompression bonding, the risk of the power generation element 100 overheating can be reduced. As a result, the adhesion between the sealing members 51 and 52 and the substrates 11 and 12 is improved.

[0047] In the power generation module 1 of Embodiment 1, the interface 53 extends in the direction (X direction, Y direction) along the first substrate 11.

[0048] This configuration improves the adhesion between the sealing members 51 and 52 and the substrates 11 and 12 in the Z direction.

[0049] In the power generation module 1 of Embodiment 1, the first sealing member 51 has a smaller thickness than the second sealing member 52.

[0050] With this configuration, when the second sealing member 52 is irradiated via the first sealing member 51, the laser can more easily reach the second sealing member 52.

[0051] In the power generation module 1 of Embodiment 1, the first substrate 11 and the second substrate 12 have a third transmittance that is higher than the second transmittance with respect to the first wavelength.

[0052] With this configuration, the power generation module 1 can be used as a power generation module applicable to building windows such as power-generating glass.

[0053] In the power generation module 1 of Embodiment 1, the first substrate 11 and the second substrate 12 are glass substrates, and the main component of the sealing member 50 is EVOH. The second sealing member 52 contains a light absorber.

[0054] This configuration allows for more secure sealing of the power generation module 1.

[0055] In the power generation module 1 of Embodiment 1, the power generation element 100 has a laminated structure including a photoelectric conversion layer. The photoelectric conversion layer contains a perovskite compound.

[0056] With this configuration, the power generation module 1 can be used as a power generation module applicable to building windows such as power-generating glass.

[0057] The manufacturing method for the power generation module 1 of Embodiment 1 includes providing a first sealing member 51 having a first transmittance for a first wavelength on a first substrate 11, and providing a second sealing member 52 having a second transmittance lower than the first transmittance for a first wavelength on a second substrate 12. The manufacturing method includes providing a power generation element 100 having a photoelectric conversion layer that converts light absorbed through the first substrate 11 into photoelectric energy on the first substrate 11 or the second substrate 12. The manufacturing method includes placing the first substrate 11 and the second substrate 12 facing each other and bringing the first sealing member 51 and the second sealing member 52 into contact, and irradiating the second sealing member 52 with a laser through the first substrate 11 and the first sealing member 51.

[0058] With this configuration, by separately providing and joining the sealing members 51 and 52 to each substrate 11 and 12, it becomes possible to tightly adhere the sealing members 51 and 52 to each substrate 11 and 12 by thermocompression bonding or the like before attaching the power generation element 100 to the substrate. Even when using thermocompression bonding, the risk of the power generation element 100 overheating can be reduced. As a result, the adhesion between the sealing members 51 and 52 and the substrates 11 and 12 is improved.

[0059] In the manufacturing method of the power generation module 1 of Embodiment 1, providing the first sealing member 51 on the first substrate 11 means that the first sealing member 51 is heat-pressed onto the first substrate 11. Providing the second sealing member 52 on the second substrate 12 means that the second sealing member 52 is heat-pressed onto the second substrate 12.

[0060] This configuration improves the adhesion between the substrates 11 and 12 and the sealing members 51 and 52.

[0061] In the manufacturing method of the power generation module 1 of Embodiment 1, a first sealing member 51 is provided on the first substrate 11, a second sealing member 52 is provided on the second substrate 12, and then a power generation element 100 is provided on either the first substrate 11 or the second substrate 12.

[0062] This configuration reduces the risk of the power generation element 100 overheating.

[0063] In Embodiment 1, an example was described in which the power generation element 100 is provided on the second substrate 12, but the invention is not limited to this. The power generation element 100 may also be provided on the first substrate 11.

[0064] In Embodiment 1, an example was described in which the main component of the sealing members 51 and 52 is EVOH, but the invention is not limited to this. The main component of the sealing members 51 and 52 may be a thermoplastic elastomer such as butyl rubber, epoxy resin, or other resin.

[0065] In Embodiment 1, an example was described in which the second sealing member 52 contains black fine particles, carbon, graphite, iron oxide, chromium oxide, manganese oxide, and titanium black fine particles or powder as light absorbers, but it is not limited to this. The second sealing member 52 may also contain a thermoplastic material such as butyl rubber. With such a configuration, the EVOH, which is the main component of the second sealing member 52, can suppress the entry of oxygen into the space 13, and the butyl rubber can suppress the entry of moisture into the space 13.

[0066] Furthermore, while we have described an example where the main component of substrates 11 and 12 is glass, the explanation is not limited to this. The main component of substrates 11 and 12 may be other materials such as sapphire or resin film.

[0067] In Embodiment 1, an example was described in which both substrates 11 and 12 have a third transmittance higher than the second transmittance, but the invention is not limited to this. The second substrate 12 may have a transmittance lower than the third transmittance in a predetermined wavelength range.

[0068] (Embodiment 2) The power generation module 201 according to Embodiment 2 of this disclosure will now be described. In Embodiment 2, the differences from Embodiment 1 will be mainly described, and explanations that overlap with Embodiment 1 will be omitted. In Embodiment 2, components that are the same as or equivalent to those in Embodiment 1 will be denoted by the same reference numerals.

[0069] Figure 6 is a schematic top view of the power generation module 201 according to Embodiment 2 of the present disclosure. Figure 7 is a schematic cross-sectional view of the power generation module 201 showing the sealing members 251, 252 and lead wires 21, 22. In Figure 6, the first substrate 11 is omitted for clarity.

[0070] As shown in Figure 6, the power generation module 201 comprises a first substrate 11, a second substrate 12, a plurality of power generation elements 100, a first sealing member 251, a second sealing member 252, and lead wires 21 and 22. In Embodiment 2, the power generation module 201 may be the same as the power generation module 1 of Embodiment 1, except that it comprises a first sealing member 251 and a second sealing member 252 instead of a sealing member 50.

[0071] The periphery of the first substrate 11 and the periphery of the second substrate 12 are sealed by sealing members 251 and 252. In a plan view along the Z direction, the sealing members 251 and 252 are located outside the space 13 in which the power generation element 100 is arranged.

[0072] Specifically, the first sealing member 251 is provided in a first region S1, which is outside the space 13 and away from the lead wires 21 and 22, and is in contact with both the first substrate 11 and the second substrate 12 (see Figure 7). The second sealing member 252 is provided in a second region S2, which surrounds the lead wires 21 and 22, and is in contact with both the first substrate 11 and the second substrate 12 (see Figure 7). As a result, the sides of the sealing members 251 and 252 are in close contact with each other, forming an interface 253. In Embodiment 2, the interface 253 extends along the Z direction.

[0073] The lead wires 21 and 22 are drawn out from within the space 13 between the substrates 11 and 12, passing through the second sealing member 252 to the outside.

[0074] In Embodiment 2, the first sealing member 251, like the first sealing member 51, has EVOH as its main component and has a first transmittance. The second sealing member 252, like the second sealing member 52, has EVOH as its main component, contains a light absorber, and has a second transmittance lower than the first transmittance.

[0075] Next, the manufacturing method of the power generation module 201 will be explained with reference to Figure 7.

[0076] After the power generation element 100 is placed on the second substrate 12, the first substrate 11 and the second substrate 12 are positioned facing each other, and molten sealing members 251 and 252 are injected into the space between the substrates 11 and 12 from a direction along the XY plane. Specifically, first, the first sealing member 251 is injected into a first region S1 away from the lead wires 21 and 22, and then cooled and solidified. After that, the second sealing member 252 is injected into a second region S2 surrounding the lead wires 21 and 22, and then cooled and solidified. By injecting the first sealing member 251 into the first region S1 and the second sealing member 252 into the second region S2 in sequence, the area filled by the second sealing member 252 can be reduced, and the lead wires 21 and 22 can be more reliably surrounded by the second sealing member 252. In other words, the adhesion between the lead wires 21 and 22 and the second sealing member 252 is improved.

[0077] Next, as shown in Figure 7, the first sealing member 251 and the second sealing member 252 are joined by laser irradiation.

[0078] Specifically, a laser having a wavelength within a predetermined wavelength range is irradiated through the first substrate 11 and the first sealing member 251 toward the side surface of the second sealing member 252. The entire side surface of the second sealing member 252 adjacent to the first sealing member 251 is irradiated. The laser may be incident at an angle with respect to the Z direction. By laser irradiation, an interface 253 is formed, and the sealing members 251 and 252 come into close contact with each other.

[0079] (Effect 2) The power generation module 201 according to Embodiment 1 can achieve the following effects.

[0080] The power generation module 201 of Embodiment 1 is connected to the power generation element 100 and further comprises lead wires 21 and 22 that penetrate the sealing member 50 and are drawn out from the space 13 when viewed from the thickness direction (Z direction) where the first substrate 11 and the second substrate 12 face each other. One of the first sealing member 251 or the second sealing member 252 is provided in the second region S2 surrounding the lead wires 21 and 22, and the other is provided in the first region S1 away from the lead wires 21 and 22.

[0081] This configuration allows the sealing members 251 and 252 to be injected sequentially, improving the adhesion between the lead wires 21 and 22 and the second sealing member 252. Furthermore, the adhesion between the sealing members 251 and 252 is also improved.

[0082] In Embodiment 2, an example was described in which the second sealing member 252 is provided in the second region S2 surrounding the lead wires 21 and 22, but the invention is not limited to this. The first sealing member 251 may be provided in the second region S2, and the second sealing member 252 may be provided in the first region S1.

[0083] In Embodiment 2, an example was described in which each of the sealing members 251 and 252 is in contact with both the first substrate 11 and the second substrate 12, but the invention is not limited to this. It is sufficient that the first sealing member 251 is in contact with at least the first substrate 11.

[0084] The power generation module in the first embodiment comprises a first substrate, a second substrate arranged opposite the first substrate with a gap between them, a power generation element provided in the space between the first substrate and the second substrate and including a photoelectric conversion layer that converts light absorbed through the first substrate into photoelectric energy, and a sealing member that seals the space, wherein the sealing member has a first sealing member in contact with the first substrate and having a first transmittance for a first wavelength, and a second sealing member in contact with the second substrate, forming an interface with the first sealing member and having a second transmittance for a first wavelength, the second transmittance being lower than the first transmittance.

[0085] In the second embodiment of the power generation module, the interface extends in a direction along the first substrate, as in the power generation module of the first embodiment.

[0086] In the third embodiment of the power generation module, the first sealing member has a smaller thickness than the second sealing member, as in the power generation module of the second embodiment.

[0087] As a power generation module in a fourth embodiment, the power generation module in the first embodiment further comprises lead wires connected to a power generation element and, when viewed from the thickness direction where the first substrate and the second substrate face each other, penetrating a sealing member and drawn out from space, wherein one of the first or second sealing member is provided in a region surrounding the lead wires, and the other of the first or second sealing member is provided in a region away from the lead wires.

[0088] As a power generation module in the fifth embodiment, in a power generation module in any of the first to fourth embodiments, the first substrate and the second substrate have a third transmittance that is higher than the second transmittance with respect to the first wavelength.

[0089] As a power generation module in the sixth embodiment, in a power generation module in any of the first to fifth embodiments, the first substrate and the second substrate are glass substrates, the main component of the sealing member is EVOH, and the second sealing member includes a light absorber.

[0090] As a power generation module in the seventh embodiment, in a power generation module in any of the first to sixth embodiments, the power generation element has a laminated structure including a photoelectric conversion layer, and the photoelectric conversion layer includes a perovskite compound.

[0091] A method for manufacturing a power generation module in the eighth aspect includes: providing a first encapsulating member having a first transmittance for a first wavelength on a first substrate; providing a second encapsulating member having a second transmittance lower than the first transmittance for a first wavelength on a second substrate; providing a power generation element having a photoelectric conversion layer that converts light absorbed through the first substrate into photoelectric energy on the first substrate or the second substrate; placing the first substrate and the second substrate facing each other and bringing the first encapsulating member and the second encapsulating member into contact; and irradiating the second encapsulating member with a laser through the first substrate and the first encapsulating member.

[0092] As a method for manufacturing a power generation module in the ninth aspect, in the method for manufacturing a power generation module in the eighth aspect, providing a first sealing member on a first substrate means thermocompressing the first sealing member onto the first substrate, and providing a second sealing member on a second substrate means thermocompressing the second sealing member onto the second substrate.

[0093] As a method for manufacturing a power generation module in the tenth embodiment, in the method for manufacturing a power generation module in the ninth embodiment, a first sealing member is provided on the first substrate, a second sealing member is provided on the second substrate, and then a power generation element is provided on the first substrate or the second substrate.

[0094] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims. [Industrial applicability]

[0095] The power generation module described herein is useful as a power generation module applicable to building windows, such as building-integrated solar cells or power-generating glass. [Explanation of Symbols]

[0096] 1. Power generation module 11. First circuit board 12 Second board 21, 22 Lead wires 50 Sealing member 51 First sealing member 52 Second sealing member 100 power generation element

Claims

1. First circuit board and A second substrate is positioned opposite the first substrate with a gap between them, A power generation element comprising a photoelectric conversion layer provided in the space between the first substrate and the second substrate, which converts light absorbed through the first substrate into photoelectric energy, The facility comprises a sealing member that seals the aforementioned space, The sealing member is A first sealing member having a first transmittance for a first wavelength is in contact with the first substrate, The second substrate is in contact with the second sealing member, forms an interface with the first sealing member, and has a second transmittance for the first wavelength, A power generation module in which the second transmittance is lower than the first transmittance.

2. The power generation module according to claim 1, wherein the interface extends in a direction along the first substrate.

3. The power generation module according to claim 2, wherein the first sealing member has a thickness smaller than that of the second sealing member.

4. The power generation element is connected to a lead wire that, when viewed from the thickness direction where the first substrate and the second substrate face each other, penetrates the sealing member and is drawn out from the space, The power generation module according to claim 1, wherein one of the first sealing member or the second sealing member is provided in a region surrounding the lead wire, and the other of the first sealing member or the second sealing member is provided in a region away from the lead wire.

5. The power generation module according to claim 1, wherein the first substrate and the second substrate have a third transmittance higher than the second transmittance with respect to the first wavelength.

6. The first substrate and the second substrate are glass substrates, The main component of the sealing member is EVOH, The power generation module according to claim 1, wherein the second sealing member includes a light absorber.

7. The power generation element has a laminated structure including the photoelectric conversion layer, The power generation module according to any one of claims 1 to 6, wherein the photoelectric conversion layer comprises a perovskite compound.

8. A first sealing member having a first transmittance for a first wavelength is provided on the first substrate, A second sealing member having a second transmittance lower than the first transmittance with respect to the first wavelength is provided on the second substrate, A power generation element having a photoelectric conversion layer that converts light absorbed through the first substrate into photoelectric energy is provided on the first substrate or the second substrate, The first substrate and the second substrate are placed facing each other, and the first sealing member and the second sealing member are brought into contact. A method for manufacturing a power generation module, comprising irradiating the second sealing member with a laser through the first substrate and the first sealing member.

9. Providing the first sealing member on the first substrate involves heat-pressing the first sealing member onto the first substrate. The method for manufacturing a power generation module according to claim 8, wherein providing the second sealing member on the second substrate comprises thermocompression bonding the second sealing member to the second substrate.

10. A method for manufacturing a power generation module according to claim 9, wherein the first sealing member is provided on the first substrate, the second sealing member is provided on the second substrate, and then the power generation element is provided on the first substrate or the second substrate.

Citation Information

Patent Citations

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