Method for manufacturing a transformer with a build-up film
Using build-up film to fill gaps between transformer components under heat and pressure addresses air gap issues, enhancing performance and stability while simplifying manufacturing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TEXAS INSTRUMENTS INC
- Filing Date
- 2026-01-05
- Publication Date
- 2026-04-10
AI Technical Summary
Current transformer assembly manufacturing techniques leave residual air gaps due to inadequate application of die attach material, leading to low voltage breakdown, poor insulation performance, and mechanical instability, and require multiple time-consuming curing steps.
Use of build-up film, such as polymer prepreg film, between magnetic members to fill gaps by melting under heat and pressure, eliminating air gaps and simplifying the manufacturing process.
Transformers with superior performance and mechanical stability are produced with minimal gaps, reducing manufacturing complexity and cost by eliminating redundant curing steps.
Smart Images
Figure 2026062902000001_ABST
Abstract
Description
Technical Field
[0001] A semiconductor die is typically housed within a package that protects the die from harmful environmental effects such as heat, moisture, and debris. The packaged die communicates with external electronic devices through conductive terminals such as leads that are exposed on the outer surface of the package. The package may include components other than the circuitry formed on the semiconductor die. For example, a transformer assembly can be housed within the package, and the terminals of the transformer coil are coupled to appropriate electrical connections (e.g., bond wires, leads of a lead frame) within the package so that the transformer assembly can be used as needed (e.g., by circuitry formed on a semiconductor die housed within the package).
Summary of the Invention
[0002] In some examples, a method of manufacturing a transformer device includes providing a first magnetic member and providing a laminated member that includes primary and secondary transformer windings wound around an orifice that extends through the laminated member. The method further includes disposing a build-up film in contact with the laminated member. The method also includes disposing at least a portion of a second magnetic member within the orifice. The method further includes heat pressing at least one of the first and second magnetic members such that the distance between the first and second magnetic members is reduced and the build-up film is melted, thereby creating the transformer device.
[0003] In some examples, a semiconductor device includes a first magnetic member, a second magnetic member, and a laminated member positioned between the first magnetic member and the second magnetic member. The laminated member includes primary and secondary transformer windings. The package also includes a build-up film material disposed between the first and second magnetic members and in contact with the laminated member.
[0004] For a detailed description of the various examples, reference is now made to the accompanying drawings.
Brief Description of the Drawings
[0005] [Figure 1] A flowchart shows a method for manufacturing a semiconductor package containing a transformer with a build-up film, according to various embodiments.
[0006] [Figure 2A] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples. [Figure 2B] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples. [Figure 2C] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples. [Figure 2D] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples. [Figure 2E] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples. [Figure 2F] This shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film, following various examples.
[0007] [Figure 2G] A side view of the manufacturing of a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 2H] Perspective views of the manufacturing of a semiconductor package containing a transformer with a build-up film, following various examples, are shown.
[0008] [Figure 3A] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3B] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3C] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3D] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3E] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3F] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples. [Figure 3G] This is a top view of the manufacturing process for a semiconductor package containing a transformer with a build-up film, following various examples.
[0009] [Figure 4A] The image shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film and alternative magnetic components, according to various embodiments. [Figure 4B] The image shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film and alternative magnetic components, according to various embodiments.
[0010] [Figure 5A] The image shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film and alternative magnetic components, according to various embodiments. [Figure 5B] The image shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film and alternative magnetic components, according to various embodiments.
[0011] [Figure 6A] The image shows a front cross-sectional view of the manufacturing of a semiconductor package containing a transformer, including a build-up film and alternative magnetic components, according to various embodiments. [Figure 6B]A front cross-sectional view of the manufacture of a semiconductor package containing a transformer including a build-up film and an alternative magnetic member according to various embodiments is shown.
[0012] [Figure 7A] A front cross-sectional view of the manufacture of a semiconductor package containing a transformer including a build-up film and an alternative magnetic member according to various embodiments is shown. [Figure 7B] A front cross-sectional view of the manufacture of a semiconductor package containing a transformer including a build-up film and an alternative magnetic member according to various embodiments is shown.
Embodiments for Carrying out the Invention
[0013] Some transformer assemblies are formed using coils disposed between a plurality of magnetic members. For example, the space within the transformer assembly between the magnetic member and the coil is filled with a suitable die attach material. The die attach material provides mechanical support and moisture resistance and serves various functional purposes (e.g., current conduction, heat dissipation). However, current techniques for applying the die attach material are not satisfactory because they leave residual air gaps (e.g., air bubbles) in the space where the die attach material is to be deposited. This causes many problems including low voltage breakdown and greatly affects the insulation performance of the transformer. Also, the remaining air gaps can negatively affect the mechanical stability and reliability of the transformer assembly. Further, multiple curing steps may be required to manufacture the transformer assembly, which is time-consuming, complex, and can substantially increase the manufacturing cost.
[0014] This disclosure describes novel transformer devices and various examples of methods for manufacturing novel transformer devices. Instead of using die mounting material to fill the space within the transformer device, the transformer device is formed using build-up film (e.g., polymer prepreg film such as AJINOMOTO® ABF® build-up film). Build-up film serves a similar purpose to the die mounting material described above, but is superior to die mounting material because, due to its physical properties described below, when melted, it leaves virtually no gaps, if any. The build-up film is placed between a pair of magnetic members, close to a laminated member containing coils. The laminated member and the build-up film are placed between the magnetic members, and then the magnetic members are heated and pressed to melt the build-up film, causing them to flow and fill the gap between the magnetic members and the laminated member. This technique minimizes or eliminates the size and number of air gaps in the transformer assembly compared to existing transformer assembly manufacturing techniques, thereby producing a transformer assembly with superior performance and mechanical stability. Furthermore, redundant and expensive curing processes are eliminated from the manufacturing process.
[0015] Figure 1 shows a flowchart of Method 100 for manufacturing a semiconductor package containing a transformer with a build-up film, following various examples. Method 100 is described below in conjunction with Figures 2A to 3G. Therefore, Figures 2A to 3G will be briefly introduced here, followed by a detailed explanation of Figures 1 to 3G.
[0016] Figures 2A to 2F show front cross-sectional views of the manufacturing of a semiconductor package containing a transformer with a build-up film, according to various examples. Figures 2G and 2H show side and perspective views, respectively, of the manufacturing of a semiconductor package containing a transformer with a build-up film, according to various examples. Figures 3A to 3G are top views of the manufacturing of a semiconductor package containing a transformer with a build-up film, according to various examples.
[0017] Referring together to Figures 1 to 3G, Method 100 begins by providing a first magnetic member (Step 102). In some examples, the first magnetic member includes a high-permeability ferrite member (e.g., a ferrite magnetic sheet having a permeability range up to 150). In some examples, the first magnetic member includes a rectangular prism with exemplary dimensions of 5 mm width × 5 mm length × 270 μm thickness. Other permeability ranges, shapes, and sizes of magnetic members are possible and are within the scope of the disclosure. Figure 2A shows a front section view of an exemplary magnetic member 200, and Figure 3A shows a top view of an exemplary magnetic member 200.
[0018] Method 100 is followed by positioning a first build-up film in contact with the first magnetic member (step 104). In some examples, the first build-up film includes a polymer material such as AJINOMOTO® ABF® build-up film. In some examples, the first build-up film has certain properties such as a generally low coefficient of thermal expansion in the range of 46 ppm over a temperature range of 25 to 150°C, a glass transition temperature of about 170°C, a generally low dielectric constant around 3, and a sufficiently high level of insulation reliability. Other types of build-up films may be used, as long as their behavior with respect to temperature and pressure (e.g., viscosity) is similar to that of the first build-up film described herein. In some examples, the first build-up film, when positioned according to step 102, is solid or semi-solid and has a rectangular prism shape. In some examples, the dimensions of the first build-up film are 5 mm in length, 6 mm in width, and 25 μm in thickness. Other shapes and dimensions are also conceivable and are included within the scope of this disclosure. Figure 2A shows a front cross-sectional view of an exemplary build-up film 202 positioned on and in contact with the first magnetic member 200. Figure 3B shows a top view of an exemplary build-up film 202 positioned on and in contact with the first magnetic member 200. As shown, in some examples, the build-up film 202 has a smaller volume than the first magnetic member 200. In some examples, multiple build-up films 202 can be used, as will be described in detail below.
[0019] Method 100 further comprises arranging a laminated member in contact with a first build-up film, the laminated member comprising primary and secondary transformer windings (step 106). In some examples, the laminated member comprises a prepreg and / or BT CORELAYER®, both of which are polymer matrix materials. In some examples, the laminated member has exemplary dimensions of 5 mm in length, 6 mm in width, and 388 μm in thickness. In some examples, the laminated member is a rectangular prism. The scope of this disclosure is not limited to the use of laminated members of any particular dimensions, shape, or configuration. In some examples, the laminated member comprises an orifice (e.g., a cylindrical orifice) extending through part or all of the thickness of the laminate. In some examples, the primary transformer winding is wound around the orifice and contained within the laminated member. In some examples, the secondary transformer winding is wound around the orifice and contained within the laminated member. Figure 2C shows a front cross-sectional view of an exemplary laminate 204 having an orifice 210 extending through the thickness of the laminate 204. As also shown in Figure 2C, the laminate 204 includes a primary transformer winding 206 wound around the orifice 210 and a secondary transformer winding 208 wound around the orifice 210. Figure 3C shows a top view of the laminate 204 positioned on and in contact with the build-up film 202. In some examples, the laminate 204 has a larger volume than the build-up film 202 but a smaller volume than the first magnetic member 200. In addition, as shown in Figure 3C, the primary transformer winding 206 includes terminals 226 on the opposing ends of the primary transformer winding 206, and these terminals are exposed on the top surface of the laminate 204. Similarly, the secondary transformer winding 208 includes terminals 211 on opposite ends of the secondary transformer winding 208, and these terminals are also exposed on the top surface of the laminated member 204.
[0020] Method 100 is followed by positioning a second build-up film in contact with the laminate (step 108). In some examples, multiple second build-up films can be used, as will be described in detail below. In some examples, the second build-up film includes a polymer material such as AJINOMOTO® ABF® build-up film. In some examples, the second build-up film has the specific properties described above with respect to the first build-up film. Other types of build-up films may be used, as long as their behavior with respect to temperature and pressure (e.g., viscosity) is similar to that of the second build-up film described herein. In some examples, the second build-up film, when positioned according to step 102, is solid or semi-solid and has a rectangular prism shape. In some examples, the dimensions of the second build-up film are 5 mm in length, 6 mm in width, and 25 μm in thickness. Other shapes and dimensions are also possible and are included in the scope of this disclosure. In some examples, the second build-up film includes an orifice that aligns with orifice 210 (Figure 2C). Figure 2D shows a front cross-sectional view of an exemplary build-up film 212 positioned on and in contact with the laminated member 204. Figure 3D shows a top view of an exemplary build-up film 212 positioned on and in contact with the laminated member 204. As shown, in some examples, the build-up film 212 has a smaller volume than the laminated member 204. Figures 2D and 3D show one build-up film 212, but additional build-up films 212 may be used in some examples. Regardless of the number of build-up films 212 used, the configuration of the build-up films 212 must not block orifice 210 so that the second magnetic member can be positioned inside the orifice, as described below. For example, the build-up film 212 includes a cylindrical orifice 213 that can be aligned with orifice 210.
[0021] Method 100 continues with step 110, which involves positioning a second magnetic member in contact with the second build-up film. In some examples, the second magnetic member has a similar composition to the first magnetic member. In some examples, the length and width dimensions of the second magnetic member are similar to (i.e., within 10%) those of the first magnetic member. In some examples, the thickness of the second magnetic member varies because the second magnetic member includes multiple vertical extensions. Figure 2E shows a front cross-sectional view of the second magnetic member 214 adjacent to the second build-up film 212. The second magnetic member 214 has extensions 214A, 214B, and 214C, as shown. In some examples, the thickness of the second magnetic member 214 in the portion including extensions 214A, 214B, or 214C is approximately 658 μm. In some examples, the thickness of the second magnetic member 214 in the portion not including the extensions 214A, 214B, or 214C is approximately 270 μm. In some examples, the extension 214B is located inside the orifice 210, and the extensions 214A and 214C are located laterally relative to the laminated member 204. Figure 3E shows a top view of the second magnetic member 214 arranged as described above.
[0022] Method 100 further includes melting the first and second build-up films (step 112) and arranging the first and second magnetic members closer to each other to form a transformer device (step 114). In some examples, the build-up film may be melted by applying heat and pressure to the second magnetic member 214. In some examples, the build-up film may be melted by applying heat and pressure to the first magnetic member 200. In some examples, the build-up film may be melted by applying heat to the second magnetic member 214 and applying pressure to the first magnetic member 200. In some examples, the build-up film may be melted by applying heat to the first magnetic member 200 and applying pressure to the second magnetic member 214. Other configurations for applying heat and pressure are also possible and are included in the scope of this disclosure. Figure 2F shows the application of a heating press 216 to the second magnetic member 214. Figure 3F similarly shows the application of a heating press 216. In some examples, the temperature (e.g., 200 degrees Celsius) and pressure (e.g., 5-10 MPa) of the heating press 216 depend on the material composition of the build-up films 202, 212 and their melting points. In some examples, the build-up films 202, 212 melt to form a molten build-up film 205 that fills all the spaces (including the orifice 210) between the laminate 204 and the first and second magnetic members 200, 214, as shown in the figure. In such examples, there is no air gap remaining in the area between the laminate 204 and the first and second magnetic members 200, 214, thereby mitigating the challenges associated with the current state of the art, as described above. The applied pressure causes the first and second magnetic members 200, 214 to move toward each other, so that they come into contact, as shown in Figure 2F, thereby generating the transformer device 218. Figure 3F shows an illustrative top view.
[0023] Method 100 also includes mounting the transformer device on a lead frame pad, such as a die pad (step 116). Figure 2G shows a side view of the transformer device 218 positioned on the lead frame pad 220. A bond wire 224 connects terminals 226 to balls 228 on conductive terminals 222 of a lead frame (e.g., package leads). Other terminals of the transformer device 218 can be connected to other conductive terminals as appropriate. Figure 3G shows a top view of the assembly of Figure 2G, where one of the terminal portions 226 is connected to ball 228 on conductive terminal portion 222, another of the terminal portions 226 is connected to ball 227 on conductive terminal portion 223 via a bond wire 237, one of the terminal portions 211 is connected to ball 229 on conductive terminal portion 225 via a bond wire 235, and another of the terminal portions 211 is connected to ball 231 on conductive terminal portion 232 via a bond wire 233.
[0024] Method 100 further includes encapsulating the transformer device and lead frame pads within a molding (step 118) in order to manufacture a semiconductor package. Figure 2H shows a perspective view of the semiconductor package 230 having conductive terminals 222, 223, 225, and 232 exposed on one or more surfaces of the semiconductor package 230.
[0025] The first and second magnetic members 200 and 214 are referred to as I and E core members, respectively, because in the front views of Figures 2E and 2F, they resemble the capital English letters "I" and "E" rotated by 90 degrees. In some examples, magnetic members of other shapes may be used. For example, Figure 4A shows an assembly in which the first magnetic member 400 is an E core member and the second magnetic member 402 is an I core member. When heat and pressure are applied, as indicated by the arrows in Figure 4A, the first and second magnetic members 400 and 402 come into contact with each other, and the build-up films 202 and 212 melt to form a build-up film 406 (which can be said to include the build-up films 202 and 212), forming a transformer device 404 (Figure 4B). In some examples, the build-up film 406 fills all areas between the laminated member 204, which includes the orifice 210, and the first and second magnetic members 400 and 402, without leaving any air gaps. The first magnetic member 400 includes extensions 400A, 400B, and 400C, where extension 400B is positioned within the orifice 210 as shown in the figure, and extensions 400A and 400C are positioned laterally relative to the laminated member 204.
[0026] In another example, Figure 5A shows an assembly in which the first magnetic member 500 is a T-core member (because the first magnetic member 500 resembles an upside-down capital letter "T") and the second magnetic member 502 is a U-core member (because the second magnetic member 502 resembles an upside-down capital letter "U"). When heat and pressure are applied, as indicated by the arrows in Figure 5A, the first and second magnetic members 500, 502 come into contact with each other, and the build-up films 202, 212 melt to form a build-up film 506 (which can be said to include the build-up films 202, 212) forming a transformer device 504 (Figure 5B). In some examples, the build-up film 506 fills all areas between the laminated member 204 and the first and second magnetic members 500, 502, including an orifice 210. The first magnetic member 500 includes an extension 500A that is positioned within the orifice 210, as shown. The second magnetic member 502 includes extensions 502A and 502B that are positioned laterally relative to the laminated member 204.
[0027] In another example, Figure 6A shows an assembly in which the first magnetic member 600 is a U-core member and the second magnetic member 602 is a T-core member. When heat and pressure are applied, as indicated by the arrows in Figure 6A, the first and second magnetic members 600, 602 come into contact with each other, and the build-up films 202, 212 melt to form a build-up film 606 (which can be said to include the build-up films 202, 212) forming a transformer device 604 (Figure 6B). In some examples, the build-up film 606 fills all areas between the laminated member 204 and the first and second magnetic members 600, 602, including an orifice 210. The first magnetic member 600 includes extensions 600A, 600B positioned laterally relative to the laminated member 204, and the second magnetic member 602 includes an extension 602A positioned within the orifice 210.
[0028] In yet another example, Figure 7A shows an assembly in which the first magnetic member 700 is an I-core member and the second magnetic member 702 is also an I-core member. Additional magnetic members 701, 703, and 705 (sometimes referred to herein as "pillars") are included and are made of a high-permeability ferrite material having similar properties to the first and second magnetic members described above. Magnetic members 701 and 705 are positioned laterally with respect to the laminated member 204, and magnetic member 703 is positioned within the orifice 210. A build-up film 707 is located between the laminated member 204 and the second magnetic member 702, and a build-up film 709 is located between the laminated member 204 and the first magnetic member 700. As indicated by the arrows in Figure 7A, the application of heat and pressure brings the first and second magnetic members 700 and 702, respectively, into contact with the magnetic members 701, 703, and 705, causing the build-up films 707 and 709 to melt and form a build-up film 706 (which can be said to include the build-up films 707 and 709), resulting in the formation of a transformer device 704 (Figure 7B). In some examples, the build-up film 706 fills all areas between the laminated member 204 and the magnetic members 700, 702, 701, and 705, including the orifice 210.
[0029] In the example above, the application of heat and pressure melts and flows the build-up film. The flow of the molten build-up film can be controlled by applying heat and pressure in light of the viscosity and other appropriate properties of the build-up film (for example, preventing flow to undesirable areas).
[0030] The terms "first" and "second" are used herein to refer to various components such as magnetic members and build-up films. These names (e.g., "first," "second," etc.) are for illustrative purposes only and do not necessarily indicate any particular functional or structural importance to the component to which they belong.
[0031] The above description is intended to be illustrative of the principles and various embodiments described herein. A number of modifications and variations will become apparent to those skilled in the art upon full understanding of the above disclosure. The claims set forth below are intended to be construed as including such modifications and variations. Unless otherwise specified, “about,” “approximately,” “similar,” or “substantially” preceding any given value means + / 10% of that value.
Claims
1. A method for manufacturing a transformer device, To provide a first magnetic member, To provide a laminated member, the laminated member comprising primary and secondary transformer windings wound around an orifice extending through the laminated member, The build-up film is placed in contact with the laminated member, Placing at least a portion of the second magnetic member within the orifice, The method involves heating and pressing at least one of the first and second magnetic members such that the distance between them decreases and the build-up film melts, thereby generating a transformer device. Methods that include...
2. The method according to claim 1, A method wherein the first and second magnetic members are brought into contact with each other by heating and pressing, the first magnetic member includes a T-core member, and the second magnetic member includes a U-core member.
3. The method according to claim 1, A method wherein, by heating and pressing, at least a portion of the build-up film is placed inside the orifice.
4. The method according to claim 1, A method wherein one of the first and second magnetic members includes an E-core member, and the other of the first and second magnetic members includes an I-core member.
5. The method according to claim 1, A method wherein the build-up film comprises a polymer material.
6. The method according to claim 1, A method further comprising housing the transformer device within a semiconductor package.
7. A method for manufacturing semiconductor packages, To provide a first magnetic member, The first build-up film is placed in contact with the first magnetic member, The laminated member, which includes primary and secondary transformer windings, is placed in contact with the first build-up film. A second build-up film is placed in contact with the laminated member, The second magnetic member is placed in contact with the second build-up film, The first build-up film and the second build-up film are melted together. The first magnetic member and the second magnetic member are brought into contact with each other to form a transformer device, The transformer device is mounted on the surface of the lead frame, The transformer device and the lead frame surface are covered with molding to manufacture a semiconductor package. Methods that include...
8. The method according to claim 7, A method wherein the first magnetic member includes a high-permeability ferrite member.
9. The method according to claim 7, A method in which a portion of the second magnetic member is placed within the orifice of the laminated member.
10. The method according to claim 9, A method comprising melting the first build-up film and the second build-up film to place at least a portion of the first build-up film, the second build-up film, or both the first and second build-up films within the orifice.
11. The method according to claim 7, A method wherein the second magnetic member includes an E core member, and the first magnetic member includes an I core member.
12. The method according to claim 7, A method wherein one of the first and second magnetic members includes a T-core member, and the other of the first and second magnetic members includes a U-core member.
13. It is a semiconductor device, The first magnetic member and A second magnetic member and A laminated member located between the first and second magnetic members, including primary and secondary transformer windings, A build-up film material is disposed between the first magnetic member and the second magnetic member and in contact with the laminated member, Semiconductor devices, including those mentioned above.
14. A semiconductor device according to claim 13, A semiconductor device in which the first magnetic member includes a high-permeability ferrite member.
15. A semiconductor device according to claim 13, A semiconductor device in which the second magnetic member includes an E-core member and the first magnetic member includes an I-core member.
16. A semiconductor device according to claim 13, A semiconductor device in which the second magnetic member includes an I-core member and the first magnetic member includes an E-core member.
17. A semiconductor device according to claim 13, A semiconductor device in which the second magnetic member includes a T-shaped core member and the first magnetic member includes a U-shaped core member.
18. A semiconductor device according to claim 13, A semiconductor device in which the second magnetic member includes a U-core member and the first magnetic member includes a T-core member.
19. A semiconductor device according to claim 13, A semiconductor device in which the first and second magnetic members include an I-core member, and the semiconductor device further includes a plurality of magnetic pillars.
20. A semiconductor device according to claim 19, A semiconductor device in which the first magnetic pillar of the plurality of magnetic pillars is arranged inside the orifice of the laminated member.
21. A semiconductor device according to claim 13, A semiconductor device in which a portion of one of the first and second magnetic members is arranged inside the orifice of the laminated member.
22. A semiconductor package, The first magnetic member and A second magnetic member and A laminated member located between the first and second magnetic members, including primary and secondary transformer windings, A build-up film material is disposed between the first magnetic member and the second magnetic member and in contact with the laminated member, The first magnetic member, the second magnetic member, the laminated member, and the mold material covering the build-up film, A semiconductor package that includes this.
23. A semiconductor package according to claim 22, A semiconductor package in which the first magnetic member includes a high-permeability ferrite member.
24. A semiconductor package according to claim 22, A semiconductor package in which the second magnetic member includes an E-core member and the first magnetic member includes an I-core member.
25. A semiconductor package according to claim 22, A semiconductor package in which the second magnetic member includes an I-core member and the first magnetic member includes an E-core member.
26. A semiconductor package according to claim 22, A semiconductor package in which the second magnetic member includes a T-shaped core member and the first magnetic member includes a U-shaped core member.
27. A semiconductor package according to claim 22, A semiconductor package in which the second magnetic member includes a U-core member and the first magnetic member includes a T-core member.
28. A semiconductor package according to claim 22, A semiconductor package in which the first and second magnetic members include an I-core member, and the semiconductor package further includes a plurality of magnetic pillars.
29. A semiconductor package according to claim 28, A semiconductor package in which the first magnetic pillar of the plurality of magnetic pillars is arranged inside the orifice of the laminated member.
30. A semiconductor package according to claim 22, A semiconductor package in which a portion of one of the first and second magnetic members is arranged inside the orifice of the laminated member.