Enclosure and probe

Abstract

The present invention provides a prober housing and a prober using this housing that can effectively reduce the effects of vibrations generated at each layer without causing a decrease in inspection throughput. [Solution] The housing 1 for the prober, which has a hierarchical structure in which multiple measuring units 30 are stacked in multiple stages, comprises a floor base 10 that constitutes the floor surface of each stage of the hierarchical structure, and a side frame body 20 that is positioned between the floor base 10 of one of the multiple stages and the floor base 10 of another stage located above the first stage, and is located on both sides of the measuring unit 30. The side frame body 20 has a first side frame 21 that is erected on the floor base 10 of one stage and supports the lower side of the floor base of the other stage, and a second side frame 22 that is erected on the floor base 10 of one stage and supports the measuring unit components that are arranged in the measuring unit 30.

Description

Technical Field

[0001] The present invention relates to a prober for inspecting the electrical characteristics of a plurality of semiconductor devices (chips) formed on a semiconductor wafer, particularly to a housing for a prober having a plurality of stacked measurement units in multiple stages, and a prober to which the housing is applied.

Background Art

[0002] The semiconductor manufacturing process has a number of processes, and various inspections are performed in various manufacturing processes for quality assurance and yield improvement. For example, at the stage where a plurality of chips of semiconductor devices are formed on a semiconductor wafer, the electrode pads of the semiconductor devices of each chip are connected to a test head, a power supply and a test signal are supplied from the test head, and the signal output from the semiconductor device is measured by the test head to electrically inspect whether it operates normally. Wafer-level inspection is being carried out.

[0003] Wafer-level inspection is performed using a prober that brings probes into contact with the electrode pads of each chip on the wafer. The probes are electrically connected to the terminals of the test head, and a power supply and a test signal are supplied from the test head to each chip through the probes, and the output signal from each chip is detected by the test head to measure whether it operates normally.

[0004] In the semiconductor manufacturing process, in order to reduce the manufacturing cost, the size of the wafer is increased and further miniaturized (integrated), and the number of chips formed on one wafer has become very large. Along with this, the time required for inspecting one wafer with a prober has become longer, and an improvement in throughput is required.

[0005] Therefore, to improve throughput, multiprobing is being employed, which involves setting up multiple probes to inspect multiple chips simultaneously. In recent years, the number of chips to be inspected simultaneously has been increasing, and attempts are being made to inspect all chips on a wafer simultaneously. As a result, the tolerance for alignment errors in the contact between the electrode pads and probes has become smaller, and there is a need to improve the positional accuracy of the probe's movement.

[0006] The simplest way to increase throughput is to increase the number of probers, but this creates the problem of increasing the footprint of the probers on the manufacturing line. Furthermore, increasing the number of probers also increases equipment costs. Therefore, there is a need to increase throughput while minimizing increases in footprint and equipment costs.

[0007] To address these problems, a prober having multiple measurement units stacked in a multi-stage configuration has been proposed (see, for example, Patent Documents 1 and 2). In this prober, since the multiple measurement units are stacked in a multi-stage configuration, wafer-level inspection can be performed for each measurement unit, thereby improving throughput while suppressing increases in installation area and equipment costs.

[0008] On the other hand, Patent Document 3 discloses a technology for an inspection apparatus in which multiple testers are arranged in a multi-stage configuration, wherein each stage is provided with a transport stage for transporting wafers to the testers at each stage, and a controller that controls the movement of the transport stages at each stage controls the operation of the transport stages at other stages when the transport stage at one of the multiple stages is in operation, thereby suppressing the effects of vibrations caused by the operation of the transport stages at other stages. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2017-028296 [Patent Document 2] Japanese Patent Publication No. 2016-181690 [Patent Document 3] Japanese Patent Publication No. 2021-052065 [Overview of the project] [Problems that the invention aims to solve]

[0010] Incidentally, in the probers disclosed in Patent Documents 1 and 2, an alignment device (moving stage) is provided for each layer to detachably hold the wafer chuck and perform relative alignment between the wafer held in the wafer chuck and the probe card. This alignment device is configured to be movable between multiple measuring units located on each layer. When such a prober is constructed by combining multiple frames that form multiple compartments into a single housing (integrated housing), the following problems arise.

[0011] In other words, in the above prober, each layer is equipped with an alignment device that can move between multiple measurement units. Therefore, when an alignment device is moved on one layer, the vibrations caused by the movement of that alignment device are easily transmitted through the frame that makes up the housing to the measurement units located on other layers. As a result, the accuracy of the alignment may deteriorate, making it impossible to ensure sufficient contact accuracy between the wafer and the probe on the probe card, which may lead to a decrease in inspection accuracy.

[0012] On the other hand, in the technology disclosed in Patent Document 3, if the transport stage of one of the multiple layers is in operation, the operation of the transport stages of the other layers is restricted. This increases the time required for the transport stages to move, which may reduce the inspection throughput.

[0013] Furthermore, the technology disclosed in Patent Document 3 is only effective against vibrations caused by the movement of the transport stage, and has the problem of not being effective against vibrations that occur steadily due to other causes, such as vibrations caused by abnormalities in test heads of other layers.

[0014] The present invention has been made in view of these circumstances, and aims to provide a housing for a prober having a hierarchical structure in which multiple measuring units are stacked in multiple stages, which can effectively reduce the effects of vibrations generated at each hierarchical level without causing a decrease in inspection throughput, and a prober to which this housing is applied. [Means for solving the problem]

[0015] To solve the above problems, the following invention is provided.

[0016] The housing for a probe according to the first embodiment is a housing for a probe having a hierarchical structure in which a plurality of measuring units are stacked in multiple stages, comprising: a floor base that constitutes the floor surface of each hierarchical structure; and a side frame body that is positioned between the floor base of one of the plurality of hierarchical structures and the floor base of another hierarchical structure located above the first hierarchical structure, and positioned on both sides of the measuring unit, wherein the side frame body comprises: a first side frame erected on the floor base of one hierarchical structure and supporting the lower side of the floor base of the other hierarchical structure; and a second side frame erected on the floor base of one hierarchical structure at a position different from the first side frame and supporting the measuring unit components arranged in the measuring unit.

[0017] In the second embodiment of the prober housing, the side frame body is arranged in the layers other than the top layer among the multiple layers in the first embodiment. By simplifying the configuration of the top layer compared to the other layers, the top layer can be made lighter and the overall structure of the housing can be stabilized.

[0018] The housing for the probe according to the third aspect has, in the second aspect, a head plate having a holding portion for holding the measurement unit constituent member, and the lower surface side of the head plate is supported by the second side frame.

[0019] The housing for the probe according to the fourth aspect is such that, in any one of the first to third aspects, the second side frame is arranged side by side at a position adjacent to the first side frame.

[0020] The housing for the probe according to the fifth aspect is such that, in any one of the first to fourth aspects, the measurement unit constituent member is a pogo frame, a probe card, or a test head.

[0021] The probe according to the sixth aspect includes the housing for the probe according to any one of the first to fifth aspects. In one layer, at least two or more measurement units are provided, and a moving stage capable of moving the wafer to be inspected to each of the measurement units arranged in one layer is provided.

Advantages of the Invention

[0022] According to the present invention, in a housing for a probe having a hierarchical structure in which a plurality of measurement units are stacked in multiple stages, it is possible to effectively reduce the influence of vibrations generated in each layer without causing a decrease in inspection throughput.

Brief Description of the Drawings

[0023] [Figure 1] It is an external view showing the overall configuration of the probe according to the present embodiment. [Figure 2] It is a plan view of the probe shown in FIG. 1. [Figure 3] It is a view (front view) showing the internal structure of the measurement unit of FIG. 1. [Figure 4] It is a view (side view) showing the internal structure of the measurement unit of FIG. 1. [Figure 5] It is a schematic view showing the configuration of the measurement unit. [Figure 6]This diagram shows the test head, pogo frame, probe card, and wafer chuck integrated into a single unit. [Figure 7] This is a diagram (front view) showing another example (comparative example) of the enclosure configuration. [Figure 8] This is a diagram (side view) showing another example (comparative example) of the enclosure configuration. [Figure 9] This figure illustrates the effects of the enclosure according to this embodiment. [Figure 10] This figure illustrates the effects of the enclosure according to this embodiment. [Figure 11] This figure (side view) shows a modified example of the housing according to this embodiment. [Modes for carrying out the invention]

[0024] A preferred embodiment of the present invention will be described below with reference to the attached drawings. The prober 100 according to this embodiment will be described first, followed by a description of the housing 1 applied to the prober 100.

[0025] [Prova] First, the configuration of the prober 100 will be explained using Figures 1 and 2. Figure 1 is an external view showing the overall configuration of the prober 100. Figure 2 is a plan view of the prober 100 shown in Figure 1.

[0026] As shown in Figures 1 and 2, the prober 100 according to this embodiment includes a loader unit 114 that supplies and retrieves wafers W (see Figure 5) to be inspected, and a measurement unit 112 arranged adjacent to the loader unit 114 and having a plurality of measurement units 30. The measurement unit 112 has a plurality of measurement units 30, and when wafers W (objects to be inspected) are supplied from the loader unit 114 to each measurement unit 30, each measurement unit 30 performs an inspection of the electrical characteristics of each chip of wafer W (wafer-level inspection). The wafers W inspected by each measurement unit 30 are then retrieved by the loader unit 114. The prober 100 also includes an operation panel 121, a control device (not shown) for controlling each unit, etc.

[0027] The loader unit 114 includes a load port 118 on which a wafer cassette 120 is placed, and a transport unit 122 that transports wafers W between each measuring unit 30 of the measuring unit 112 and the wafer cassette 120. The transport unit 122 is equipped with a transport unit drive mechanism (not shown) and is configured to be movable in the X and Z directions, and rotatable in the θ direction (around the Z direction). The transport unit 122 is also equipped with a transport arm 124, which can be extended and retracted forward and backward by the transport unit drive mechanism. A suction pad (not shown) is provided on the upper surface of the transport arm 124, and the transport arm 124 holds the wafer W by vacuum adsorption of the back surface of the wafer W with this suction pad. As a result, the wafer W in the wafer cassette 120 is removed by the transport arm 124 of the transport unit 122 and transported to each measuring unit 30 of the measuring unit 112 while being held on its upper surface. Furthermore, the inspected wafers W, once the inspection is complete, are returned to the wafer cassette 120 from each measurement unit 30 via the reverse path.

[0028] Figures 3 and 4 show the internal structure of the measurement unit 112 shown in Figure 1. Figure 3 is a view of the measurement unit 112 from the front (loader section 114 side), and Figure 4 is a view of the measurement unit 112 from the side.

[0029] As shown in Figures 3 and 4, the measuring unit 112 has a hierarchical structure (multi-stage structure) in which multiple measuring sections 30 are stacked in multiple stages, and each measuring section 30 is arranged two-dimensionally along the X and Z directions. In this embodiment, as an example, four measuring sections 30 are stacked in the X direction in three stages in the Z direction.

[0030] The measuring unit 112 includes a housing 1 that partitions and forms multiple measuring sections 30. The housing 1 has a grid shape formed by combining multiple frames in a grid pattern. The configuration of the housing 1 will be described in detail later.

[0031] Each measuring unit 30 has the same configuration and, as shown in Figure 5, comprises a head plate 44, a test head 43, a probe card 42, and a pogo frame 41 interposed between the test head 43 and the probe card 42.

[0032] The test head 43 is supported above the head plate 44 by a test head holder (not shown). The test head 43 is electrically connected to the probes 66 of the probe card 42 and supplies power and test signals to each chip for electrical testing, as well as detecting the output signals from each chip to measure whether they are operating correctly.

[0033] The head plate 44 is supported by the housing 1 and has a pogo frame mounting portion 53 which is a circular opening corresponding to the planar shape of the pogo frame 41. The pogo frame mounting portion 53 has positioning pins 63, and the pogo frame 41 is fixed to the pogo frame mounting portion 53 in a positioned state by the positioning pins 63. There are no particular limitations on the method of fixing the pogo frame 41, but for example, a preferred method is to fix the pogo frame 41 by vacuum adsorption to the support surface (adsorption surface) of the pogo frame mounting portion 53 using a suction means (not shown). In addition to vacuum adsorption, mechanical fixing means such as screws may also be used.

[0034] The pogo frame 41 is provided with numerous pogo pins (not shown) that electrically connect terminals formed on the lower surface of the test head 43 (the surface facing the pogo frame 41) to terminals formed on the upper surface of the probe card 42 (the surface facing the pogo frame 41). In addition, ring-shaped sealing members 60 and 62 are formed on the outer periphery of the upper surface (the surface facing the test head 43) and lower surface (the surface facing the probe card 42), respectively. Then, by a suction means (not shown), the space enclosed by the test head 43, the pogo frame 41 and the sealing member 60, and the space enclosed by the probe card 42, the pogo frame 41 and the sealing member 62 are depressurized, thereby integrating the test head 43, the pogo frame 41, and the probe card 42 (see Figure 6).

[0035] The probe card 42 has a number of probes 66 corresponding to the electrodes of each chip on the wafer W. Each probe 66 is formed to protrude downward from the lower surface of the probe card 42 (the surface facing the wafer chuck 150) and is electrically connected to each terminal provided on the upper surface of the probe card 42 (the surface facing the pogo frame 41). Therefore, when the test head 43, pogo frame 41, and probe card 42 are integrated, each probe 66 is electrically connected to each terminal of the test head 43 via the pogo frame 41. In this example, the probe card 42 is equipped with a number of probes 66 corresponding to the electrodes of all chips on the wafer W to be inspected, and each measurement unit 30 performs simultaneous inspection of all chips on the wafer W held in the wafer chuck 150.

[0036] The wafer chuck 150 holds and secures the wafer W by vacuum suction or the like. The wafer chuck 150 is detachably supported by an alignment device 13 (described later) and is movable in the X, Y, Z, and θ directions by the alignment device 13. A ring-shaped sealing member 64 is provided on the outer circumference of the upper surface (wafer mounting surface) of the wafer chuck 150. Then, by a suction means (not shown), the space surrounded by the probe card 42, the wafer chuck 150, and the sealing member 64 is depressurized, causing the wafer chuck 150 to be pulled toward the probe card 42. As a result, each probe 66 of the probe card 42 comes into contact with the electrode pads of each chip on the wafer W, making it possible to start the inspection.

[0037] Inside the wafer chuck 150, a heating / cooling mechanism (not shown) is provided as a heating / cooling source so that the chip can be electrically characterized at high temperatures (e.g., up to 150°C) or low temperatures (e.g., down to -40°C). As the heating / cooling mechanism, any known suitable heater / cooler can be used. For example, a double-layer structure consisting of a heating layer of a surface heater and a cooling layer with passages for a cooling fluid, or a single-layer heating / cooling device with a cooling tube embedded in a heat conductor wrapped around a heating element, are all possible. Furthermore, instead of electric heating, a system that circulates a thermal fluid may be used, or a Peltier element may be used.

[0038] The measurement unit 112 further includes an alignment device 13 that detachably supports the wafer chuck 150. The alignment device 13 is provided for each stage and is configured to move between multiple measurement units 30 located on each floor (each stage) by an alignment device drive mechanism (not shown). That is, the alignment device 13 is shared among multiple (four in this example) measurement units 30 located on the same floor (stage) and moves between multiple measurement units 30 located on the same floor. The alignment device 13 is an example of the "moving stage" of the present invention. When the alignment device 13 moves to each measurement unit 30, it is fixed to a positioning fixing device (not shown), and the aforementioned alignment device drive mechanism moves the wafer chuck 150 in the X, Y, Z, and θ directions to perform relative positioning between the wafer W held by the wafer chuck 150 and the probe card 42. Although not shown in the diagram, the alignment apparatus 13 includes a needle position detection camera and a wafer alignment camera to detect the relative positional relationship between the electrodes of the wafer W chip held in the wafer chuck 150 and the probe 66.

[0039] The alignment device 13 fixes the wafer chuck 150 by vacuum suction or the like, but any fixing means other than vacuum suction may be used to fix the wafer chuck 150, such as mechanical means. The alignment device 13 is also provided with a positioning member (not shown) to ensure that the relative positional relationship with the wafer chuck 150 remains constant at all times.

[0040] Next, an inspection method using the prober 100 according to this embodiment will be described.

[0041] When inspection is performed using the prober 100 according to this embodiment, in the loader unit 114, the wafer W in the wafer cassette 120 is removed by the transport arm 124 of the transport unit 122 and transported to each measuring section 30 of the measuring unit 112 while being held on the upper surface of the transport arm 124.

[0042] Meanwhile, in the measurement unit 112, the alignment device 13 provided for each layer (each stage) moves to a predetermined measurement section 30, and the wafer chuck 150 is positioned on the upper surface of the alignment device 13 and fixed by suction.

[0043] Next, the alignment device 13 moves the wafer chuck 150 to a predetermined transfer position. Then, when the wafer W is transferred from the transport unit 122 of the loader unit 114, the wafer W is held on the upper surface of the wafer chuck 150.

[0044] Next, the alignment apparatus 13 moves the wafer chuck 150 holding the wafer W to a predetermined alignment position, detects the relative positional relationship between the electrodes of the wafer W chip held in the wafer chuck 150 and the probe 66 using a needle position detection camera (not shown) and a wafer alignment camera, and moves the wafer chuck 150 in the X, Y, Z, and θ directions based on the detected positional relationship to perform relative alignment between the wafer W held in the wafer chuck 150 and the probe card 42.

[0045] After this alignment is performed, the alignment device 13 moves the wafer chuck 150 to a predetermined measurement position (a position facing the probe card 42) and raises the wafer chuck 150 until it reaches a predetermined height (specifically, a height at which the sealing member 64 formed on the upper surface of the wafer chuck 150 contacts the lower surface of the probe card 42 (the surface facing the wafer chuck 150)). At this time, it is preferable that suction by a suction means (not shown) is started before the sealing member 64 contacts the lower surface of the probe card 42 (i.e., before the space enclosed by the probe card 42, wafer chuck 150, and sealing member 64 becomes a sealed space). As a result, even when the wafer chuck 150 is raised, suction by the suction means is still active, making it possible to prevent the influence of reaction force due to compression of the space. Alternatively, suction by the suction means may be started at the same time that the sealing member 64 contacts the lower surface of the probe card 42.

[0046] Subsequently, the alignment device 13 releases the fixing of the wafer chuck 150. As a result, the wafer chuck 150 detaches from the alignment device 13. Then, the space surrounded by the probe card 42, wafer chuck 150, and sealing member 64 is depressurized by suction by the suction means, causing the wafer chuck 150 to be pulled toward the probe card 42. The probe card 42 and the wafer chuck 150 become tightly attached, and each probe 66 of the probe card 42 makes contact with the electrode pads of each chip on the wafer W with uniform contact pressure.

[0047] As a result, as shown in Figure 6, the measurement unit 30 becomes an integrated unit consisting of the test head 43, pogo frame 41, probe card 42, and wafer chuck 150, making it ready to begin wafer-level inspection.

[0048] Subsequently, power and test signals are supplied from the test head 43 to each chip on the wafer W, and electrical operation tests are performed by detecting the signals output from the chips.

[0049] In the following steps, the wafer W is supplied onto the wafer chuck 150 in the same manner for the other measurement units 30. After the alignment and contact operations are completed in each measurement unit 30, simultaneous inspection of each chip on the wafer W is performed sequentially. Specifically, in each measurement unit 30, power and test signals are supplied to each chip on the wafer W from the test head 43, and electrical operation tests are performed by detecting the signals output from the chips.

[0050] When inspection is completed in each measurement unit 30, the alignment device 13 is sequentially moved to each measurement unit 30 to retrieve the wafer chuck 150 holding the inspected wafer W.

[0051] In other words, when the alignment device 13 moves to the measurement unit 30 after the inspection is completed, the alignment device 13 rises to a position where its upper surface contacts the wafer chuck 150, and the pressure in the space surrounded by the probe card 42, wafer chuck 150, and sealing member 64 is released. The alignment device 13 then positions and fixes the wafer chuck 150 on its upper surface. Furthermore, the alignment device 13 moves the wafer chuck 150 to a predetermined transfer position, releases the inspected wafer W from the wafer chuck 150, and transfers it to the transport unit 122. The inspected wafer W transferred to the transport unit 122 is held by the transport arm 124 and returned to the wafer cassette 120 located in the loader unit 114.

[0052] In this embodiment, as shown in Figures 3 and 4, one wafer chuck 150 is assigned to each measuring unit 30, but the wafer chuck 150 may be shared among multiple measuring units 30. In this case, the alignment device 13 moves the wafer chuck 150 between multiple measuring units 30 that share the wafer chuck 150.

[0053] [Cabinet] Next, the configuration of the housing 1 applied to the prober 100 according to this embodiment will be described in detail. Housing 1 is an example of the "housing for a prober" of the present invention.

[0054] As shown in Figures 3 and 4, the housing 1 of this embodiment forms multiple sections corresponding to the measurement section 30 on each level by combining multiple frames in a grid pattern. In this housing 1, in order to effectively suppress vibrations generated in the prober 100 (such as vibrations caused by the movement of the alignment device 13 and vibrations that are constantly generated in each measurement section 30), the frames (side frame bodies 20) arranged on each level (excluding the top level in this embodiment) have a segmented frame structure. Specifically, as will be described in detail later, the side frame body 20 arranged on one level comprises a first side frame 21 that supports other levels arranged above it, and a second side frame 22 that supports the measurement section components (including the head plate 44, pogo frame 41, probe card 42, and test head 43) arranged in the measurement section 30 within that level. In the following description, in Figures 3 and 4, each level will be referred to from bottom to top as the first level, the second level, and the third level. In the examples shown in Figures 3 and 4, the first row is the bottom row, and the third row is the top row.

[0055] First, in the housing 1 of this embodiment, the configuration of the top level differs from that of the other levels for reasons to be explained later. First, the configuration of the levels other than the top level, that is, the first and second levels in Figures 3 and 4, will be explained.

[0056] Each level except the top level comprises a floor base 10 that constitutes the floor surface of each level in the hierarchical structure, and a plurality of side frame bodies 20 provided between the floor bases 10 of each level. The floor base 10 is elongated in the X direction (the X direction is the longitudinal direction) and is a flat plate parallel to the XY plane, and is preferably formed in common between measuring sections 30 (partitions) provided on one level.

[0057] Furthermore, preferably, in floors other than the topmost floor, the ceiling of a certain floor also serves as the floor base 10 of the floor directly below it. For example, in Figures 3 and 4, the floor base 10 of the third floor also serves as the ceiling of the floor base 10 of the second floor.

[0058] Preferably, guide rails (not shown) are provided on the upper surface of the floor base 10 of each level to guide the movement of the alignment device 13 in the X direction.

[0059] Multiple side frame bodies 20 are positioned between the floor base 10 of one floor and the floor base 10 of another floor located above that floor, and are positioned at both ends (both sides in the Y direction) of the floor base 10.

[0060] The side frame body 20 consists of two types: a first side frame 21 and a second side frame 22 which is provided separately from the first side frame 21.

[0061] The first side frame 21 is, for example, a columnar shape extending in the Z direction. One end of the first side frame 21 is positioned at, for example, the Y-direction end of the upper surface of the floor base 10 of a certain floor, and the other end is positioned at, for example, the Y-direction end of the lower surface of the floor base 10 of another floor located above that floor.

[0062] In other words, the first side frame 21 is erected on the upper side (the side on which the guide rail is formed) of the floor base 10 of a certain floor level, and supports the lower side (the side opposite to the side on which the guide rail is formed) of the floor base 10 of another floor level located above that floor level.

[0063] Referring to Figure 4, for example, the first side frame 21 of the second level supports the floor base 10 of the third (topmost) level. By connecting multiple floor bases 10 in the Z direction with multiple first side frames 21 in this way, a multi-tiered stacked structure is formed in the Z direction.

[0064] The second side frames 22 are erected on the upper surface of the floor base 10 of each level at a different position from the first side frames 21. For example, as shown in Figure 4, the second side frames 22 are installed side by side adjacent to the first side frames 21. The second side frames 22 are also arranged at regular intervals in the X direction, specifically between the measuring sections 30 and outside the measuring sections 30 at both ends in the X direction.

[0065] Each second side frame 22 is roughly gate-shaped, comprising, for example, two column sections 221 extending in the Z direction and a beam section 222 spanning between the two column sections 221 and extending in the Y direction. The shape of the beam section 222 is not necessarily a straight rod, but is appropriately changed according to the shape and desired arrangement of the measuring section components (described later). The two column sections 221 of the second side frame 22 are, for example, positioned near both ends of each measuring section 30 in the Y direction.

[0066] The measurement unit components arranged in each measurement unit 30 of each level except the top level include a head plate 44, a pogo frame 41, a probe card 42, and a test head 43. The head plate 44 is a flat plate-shaped member arranged in the measurement unit 30 and has a pogo frame mounting portion 53 (see Figure 5) as described above. The pogo frame 41 is fixed to the pogo frame mounting portion 53 of the head plate 44, and the test head 43 and probe card 42 are further integrated to the upper and lower surfaces of the pogo frame 41 by suction means (not shown). In other words, the head plate 44 is a member that directly or indirectly supports the measurement unit components, namely the pogo frame 41, the probe card 42, and the test head 43.

[0067] The head plate 44 configured in this way is supported by the second side frame 22 (more specifically, the beam portion 222). The support position of the head plate 44 by the second side frame 22 is preferably the lower surface of the head plate 44, but is not necessarily limited to this, and may be other positions (for example, the side of the head plate 44). As a result, the measuring section components arranged in each measuring section 30 of each level except the top level are directly or indirectly supported by the second side frame 22, and the above-described inspection is performed in each measuring section 30.

[0068] Thus, on floors other than the top floor, the first side frame 21 that supports the floor base 10 of the floor above and the second side frame 22 that supports the measuring unit components located on the floor itself are provided separately.

[0069] Next, the configuration of the topmost layer will be described. The topmost layer comprises a floor base 10, multiple topmost side frame bodies 23, and a frame section 24. In the topmost layer (the third layer in Figures 3 and 4), the topmost side frame body 23 may have the same configuration as the side frame body 20 of the other layers, as shown in the modified example described later (see Figure 11). However, since it does not need to support the floor base 10 of the upper layer, it is not necessary to configure the side frame body 20 with two different frames (first side frame 21 and second side frame 22) as in the other layers. Furthermore, simplifying the configuration of the topmost layer and making it lighter will stabilize the overall configuration of the housing 1.

[0070] For these reasons, the uppermost side frame 23 has a simpler configuration than the side frame 20 of the other levels. More specifically, the uppermost side frame 23 has both the function of supporting the ceiling (not shown) and the function of supporting the measuring section components. In other words, it performs the functions of the first side frame 21 and the second side frame 22 in the side frame 20 of the other levels.

[0071] As shown in Figures 3 and 4, the uppermost side frame body 23 is positioned in approximately the same location as the second side frame 22 and has substantially the same shape as the second side frame 22. In other words, the uppermost side frame body 23 is erected on the upper surface of the floor base 10 of the uppermost level, similar to the second side frame 22. Furthermore, the uppermost side frame bodies 23 are arranged at regular intervals in the X direction, specifically positioned between the measuring sections 30 and outside the measuring sections 30 at both ends in the X direction.

[0072] The uppermost side frame body 23 is roughly gate-shaped and comprises two column sections 231 extending in the Z direction and a beam section 232 extending in the Y direction, which is placed between the two column sections 231. The upper ends of the column sections 231 extend beyond the beam section 232 to the frame section 24 that constitutes the ceiling of the uppermost floor.

[0073] The shape of the beam section 232 is appropriately modified to match the shape and desired arrangement of the measuring section components. The two column sections 231 of the uppermost side frame body 23 are positioned, for example, near both ends of each measuring section 30 in the Y direction.

[0074] The measurement unit components located within each measurement unit 30 of the uppermost level include a head plate 44, a pogo frame 41, a probe card 42, and a test head 43, similar to the other levels. Furthermore, the head plate 44 of the uppermost level, similar to the other levels, is a component that directly or indirectly supports the measurement unit components, namely the pogo frame 41, the probe card 42, and the test head 43.

[0075] The head plate 44 of the uppermost level is supported by the uppermost side frame body 23 (more specifically, the beam portion 232). The support position of the head plate 44 by the uppermost side frame body 23 is preferably the lower surface of the head plate 44, but is not necessarily limited to this, and may be other positions (for example, the side of the head plate 44). As a result, the measuring section components arranged in each measuring section 30 of the uppermost level are each directly or indirectly supported by the uppermost side frame body 23.

[0076] The frame section 24 connects the upper ends in the Z direction of multiple uppermost side frame bodies 23, and the ceiling (not shown) is fixed to the frame section 24.

[0077] Figures 7 and 8 show another configuration example (comparative example) of the housing applied to the prober. Figure 7 is a front view of the housing according to the comparative example, and Figure 8 is a side view of the housing according to the comparative example. In the housing according to the comparative example shown in Figures 7 and 8, the side frame 50 of each level has an integrated frame structure that combines the function of supporting the floor base 10 of the upper level and the function of supporting the measuring section components.

[0078] Therefore, in the housing of the comparative example, if the alignment device 13 moves on a certain floor and vibration occurs in the floor base 10, that vibration is likely to propagate through the side frame 50 to the floor bases 10 of other floors located above and below that floor. As a result, even after the movement of the alignment device 13 is completed, there is a problem that the time it takes for the vibration caused by the movement of the alignment device 13 to settle down becomes long.

[0079] In addition, in the housing of the comparative example, vibrations from the floor base 10 of one floor are directly transmitted to the side frames 50 of other floors located above and below that floor. This causes the measuring unit components supported by the side frames 50 of the other floors to vibrate, which negatively affects the alignment accuracy and the results of wafer level inspection.

[0080] On the other hand, according to the housing 1 of this embodiment, a split frame structure is employed in which the first side frame 21 that supports the floor base 10 of the upper level and the second side frame 22 that supports the measuring unit components are composed separately. Therefore, if the alignment device 13 moves on a certain level and vibration occurs on the floor base 10, even if that vibration is transmitted through the first side frame 21 to the floor base 10 of another level, it is unlikely to be transmitted to the measuring unit components supported by the second side frame 22, which is separate from the first side frame 21.

[0081] This makes it possible to suppress the adverse effects on the results of wafer-level inspections and alignment accuracy in other layers located above and below the same layer, caused by vibrations generated by the movement of the alignment device 13 in a particular layer.

[0082] Furthermore, according to the housing 1 of this embodiment, since there is no need to restrict the operation of alignment devices 13 on other floors while one floor's alignment device 13 is operating, it is possible to effectively suppress the effects of vibrations caused by the movement of the alignment devices 13 without the disadvantage of a deterioration in wafer-level inspection throughput.

[0083] Furthermore, according to the housing 1 of this embodiment, by adopting the above-described segmented frame structure, even if vibration occurs due to a cause other than the movement of the alignment device 13, such as an abnormality in one of the components constituting the measurement unit 30 (e.g., the test head 43), it is possible to suppress the effect of such vibration on the measurement unit 30 at other levels.

[0084] Next, the effects realized by the housing 1 according to this embodiment will be explained in more detail using Figures 9 and 10. Figure 9 is a schematic graph showing the vibration of the side frame 50 of a floor located below a certain floor when a vibration of a certain amplitude is applied to the floor base 10 of a certain floor for a certain period of time in the housing according to the comparative example shown in Figures 7 and 8. Figure 10 is a schematic graph showing the vibration of the second side frame 22 of a floor located below a certain floor when a vibration of a certain amplitude is applied to the floor base 10 of the housing 1 according to this embodiment for a certain period of time, similar to the comparative example. The graphs in Figures 9 and 10 show the output waveform of the vibration meter. In these graphs, the horizontal axis represents time in seconds, and the vertical axis represents the output voltage (corresponding to the amplitude of vibration) in mV.

[0085] In the graphs shown in Figures 9 and 10, the difference between the maximum and minimum values ​​of the output voltage corresponds to the amplitude of vibration generated in the measurement component of a lower level of the hierarchy as vibrations generated in one level propagate.

[0086] In the graph shown in Figure 9, the difference between the maximum and minimum values ​​of the vibration meter's output voltage is approximately 129 mV, which corresponds to the amplitude of vibration in the second side frame 22 of the lower layer in the housing of the comparative example. On the other hand, in the graph shown in Figure 10, the difference between the maximum and minimum values ​​of the vibration meter's output voltage is approximately 71.656 mV, which corresponds to the amplitude of vibration in the second side frame 22 of the lower layer in the housing 1 of this embodiment. Comparing the amplitudes of both, it can be seen that the housing 1 of this embodiment can reduce the amplitude by more than 40%, i.e., the magnitude of vibration, compared to the housing of the comparative example.

[0087] [Differentiation] In the above embodiment, we described a case where the configuration of the top layer was simplified compared to the other layers in order to lighten the top layer and stabilize the overall structure of the housing 1. However, the configuration of the top layer may be the same as that of the other layers. Figure 11 shows a schematic configuration diagram (side view) of a measurement unit 112 to which a housing 2 having the same configuration as the other layers is applied as a modified example. The front view of the housing 2 according to this modified example is the same as in Figure 3 and is therefore omitted. Naturally, the housing 2 according to this modified example can also achieve the above effects.

[0088] Furthermore, in the above embodiment, the number of layers in the measurement unit 112 and the number of measurement units 30 are not limited to the examples shown in Figures 3 and 4.

[0089] [effect] As described above, according to the housing 1 of this embodiment, the side frame body 20 employs a split frame structure in which the first side frame 21 that supports the floor base 10 of the upper level and the second side frame 22 that supports the measuring unit components are constructed separately. As a result, even if the alignment device 13 moves on a certain level and vibrations are generated in the floor base 10, and these vibrations are transmitted to the floor bases 10 of the upper and lower levels via the first side frame 21, these vibrations are less likely to be transmitted to the measuring unit components supported by the second side frame 22, which is separate from the first side frame 21, on the upper and lower levels.

[0090] Consequently, the influence of vibrations caused by the movement of the alignment device 13 on a certain floor on the alignment accuracy and wafer level inspection results in the floors located above and below that floor can be suppressed.

[0091] According to the housing 1 of this embodiment, since the movement of the alignment device 13 is not restricted, it is possible to maintain good throughput of wafer-level inspection by the prober while suppressing the impact of vibration on alignment accuracy and wafer-level inspection results.

[0092] According to the housing 1 of this embodiment, the effects of vibration are reduced by employing a segmented frame structure. Therefore, even if vibration occurs due to a cause other than the movement of the alignment device 13, such as a malfunction of the measuring unit 30, the above effects can be achieved.

[0093] Although embodiments of the present invention have been described above, the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the spirit of the present invention. [Explanation of symbols]

[0094] 1,2…Housing, 10…Floor base, 13…Alignment device, 20…Side frame body, 21…First side frame, 22…Second side frame, 23…Uppermost side frame body, 24…Frame part, 30…Measurement part, 41…Pogo frame, 42…Probe card, 43…Test head, 44…Head plate, 50…Side frame, 53…Pogo frame mounting part, 60,62,64…Sealing member, 63…Positioning pin, 66…Probe, 221…Column part, 222…Beam part, 231…Column part, 232…Beam part, 100…Prober, 112…Measurement unit, 114…Loader part, 118…Load port, 120…Wafer cassette, 121…Operation panel, 122…Transport unit, 124…Transport arm, 150…Wafer chuck, W…Wafer

Claims

1. A housing for a prober having a hierarchical structure in which multiple measuring units are stacked in multiple stages, The floor bases that constitute the floor surface of each level of the aforementioned hierarchical structure, The side frame bodies are positioned on both sides of the measuring section and are located between the floor base of one of the multiple levels and the floor base of another level located above the first level, Equipped with, The aforementioned side frame body is A first side frame erected on the floor base of the first floor and supporting the lower surface of the floor base of the other floor, A second side frame erected on the floor base of the first layer and supporting the measuring section components arranged in the measuring section, A housing for a prober having [a certain feature].

2. The side frame body is arranged in one of the multiple layers, except for the uppermost layer. Housing for a prober according to claim 1.

3. The head plate has a holding portion that holds the measuring unit components, The lower surface of the head plate is supported by the second side frame. Housing for a prober according to claim 2.

4. The second side frame is arranged side by side in a position adjacent to the first side frame. Housing for a prober according to any one of claims 1 to 3.

5. The measurement unit components are a pogo frame, a probe card, or a test head. Housing for a prober according to any one of claims 1 to 4.

6. A housing for a prober according to any one of claims 1 to 5, The first layer is provided with at least two or more of the measuring units, The wafer to be inspected is provided with a movable stage that can move to each of the measurement units arranged in the first layer, Prova.

Images