Water supply device

Abstract

The present invention aims to provide a water supply system that can easily achieve miniaturization of the entire system by uniformly supplying the airflow from a cooling fan, after cooling the driver, to the next heat-generating device to be cooled, without loss, thereby providing uniform cooling. [Solution] The water supply device includes a heat sink for cooling the driver. The heat sink includes a rotatable flow rectifier having multiple fins.

Description

Technical Field

[0001] The present invention relates to a water supply device.

Background Art

[0002] A water supply device including a control panel in which a control device is housed and an inverter case in which an inverter device is housed is known (see, for example, Patent Document 1). In such a water supply device, the control panel and the inverter case each have elements that generate heat. However, since the elements constituting the inverter device are vulnerable to heat, they are arranged at different locations spaced apart from each other in order to avoid the influence from the heat-generating elements of the control panel.

[0003] In addition, the pump provided below the inverter case is equipped with a cooling fan that blows an air flow toward the lower surface of the inverter case to cool the inverter case. When the pump is driven, the cooling fan rotates and blows the surrounding air against the lower surface of the inverter case to cool the inverter case from the outside.

[0004] When the control panel and the inverter case are arranged at different locations, the overall size of the water supply device increases. Therefore, in order to achieve miniaturization of the water supply device, it is conceivable to integrate the control panel and the inverter case.

[0005] However, in this case, the components that are heat sources of the control device and the components that are heat sources of the inverter device are mixed in the same housing. In particular, when heat-generating devices such as drivers, reactors, and noise filters, which are major heat sources, are arranged in the same housing, the entire inside of the housing will have a temperature rise.

[0006] Furthermore, the driver has a relatively low temperature tolerance level. Therefore, in order to reduce the size of the housing, if heat-generating devices such as drivers, reactors, and noise filters are arranged close to each other, the driver may experience a temperature rise due to their heat generation, and in the worst case, the driver may malfunction.

[0007] Therefore, instead of simply blowing cooling air from a cooling fan onto the outside of the enclosure as has been done in the past, it is conceivable to drill holes in the bottom of the enclosure where heat-generating devices such as drivers, reactors, and noise filters are located, and blow cooling air from a cooling fan directly onto these heat-generating devices inside the enclosure through these holes. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2017-115888 [Patent Document 2] Japanese Patent Publication No. 2002-21129 [Patent Document 3] Japanese Patent Publication No. 2018-145873 [Patent Document 4] Japanese Patent Publication No. 2021-25479 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] Figure 1 is a schematic diagram showing an example of such a water supply system. As shown in Figure 1, the water supply system 1 comprises multiple pump systems, each consisting of a pump 2 and a motor 3. The water supply system 1 includes a suction pipe 10 connected to the suction port of each pump system's pump 2, and a discharge pipe 8 connected to the discharge port of each pump 2.

[0010] The suction pipe 10 includes a suction connecting pipe 9 that connects the inlet pipe 5 and the backflow prevention device 15, and a suction header pipe 18 that branches and connects to the backflow prevention device 15 and each pump 2. The discharge pipe 8 includes a discharge connecting pipe 27 connected to the discharge port of each pump 2, and a discharge manifold pipe 34 connected to the discharge connecting pipe 27. The discharge manifold pipe 34 is connected to the water distribution pipe 7.

[0011] The water supply system 1 includes a discharge manifold pipe 34, a pressure tank 28 that stores a portion of the transported liquid pressurized by the pump 2, and an electrical equipment unit 21 (integrating the control panel and inverter case) consisting of a control device and an inverter device. Within the same housing of the electrical equipment unit 21 are heat-generating devices such as drivers, reactors, and noise filters, which are the main heat sources.

[0012] The water supply system 1 encloses these components within a cabinet 30. Water is supplied from outside the cabinet via an inlet pipe 5, and the water discharged by the pump 2 is supplied to the outside of the cabinet via a distribution pipe 7. Miniaturization of the water supply system can be understood as reducing the volume enclosed by the cabinet 30, or reducing the installation area of ​​the cabinet 30.

[0013] Figure 2 is a front view of the electrical equipment section of Figure 1. Figure 3 is an enlarged view of Figure 2. The electrical equipment section 21 includes an inverter device for variable-speed driving of the pump device (more specifically, the motor 3) and a control device for controlling the operation of the pump device via the inverter device.

[0014] The inverter device includes a driver 120 as one of its components. The driver 120 receives control signals from the control device, converts them into electrical signals, and controls the operation of the motor 3, such as its rotational speed. The driver 120 is the heat source of the inverter device and has relatively low heat resistance. A heat sink 140 is attached to the underside of the driver 120.

[0015] The control device includes a control board 150 equipped with an electronic circuit for controlling the motor 3 as one of its components. The electrical equipment section 21 includes heat-generating devices 130 such as reactors and noise filters (hereinafter referred to as "heat-generating devices"). The heat-generating devices 130 are also heat sources, but have higher heat resistance than the driver 120.

[0016] The driver 120 and the heat-generating device 130 are housed adjacent to each other in a box-shaped housing 110 in order to miniaturize the water supply device 1. The housing 110 is positioned opposite the heat sink 140 and has an opening 113 formed in its bottom 111.

[0017] The heatsink 140 comprises a base 141 that supports the driver 120 and a plurality of fin plates 142 that extend from the base 141 toward the opening 113. The base 141 is larger in size than the opening 113 and is positioned above the opening 113 by a spacer 145.

[0018] Below the housing 110 are two pump units, and on the rotating shaft of the motor 3 of each pump unit, a cooling fan 105 is provided, facing the housing 110, to form an airflow that cools the driver 120 corresponding to the pump unit being driven.

[0019] However, even if the water supply system is made smaller, control equipment such as drivers for driving the pump 2 often prioritize reliability, making it difficult to replace them with smaller, different components. Therefore, while using equipment with conventional specifications, the internal components of the electrical equipment section 21 must be placed closer together, and the resulting lack of flexibility in placement may lead to insufficient cooling.

[0020] Figure 4 is a plan view of the electrical equipment section illustrating such an example, and also shows the airflow for cooling the driver and heat-generating device. The air sent into the housing 110 first comes into contact with the heat sink 140 facing the cooling fan 105, cooling the driver 120. Since the air sent by the cooling fan 105 is unheated air, it can efficiently cool the driver 120 by coming into contact with the heat sink 140.

[0021] FIG. 5 is a diagram showing the flow of air for cooling the driver and the reactor. Ideally, as shown in FIG. 5, the air that has cooled the driver 120 flows toward the adjacent reactor 130 to cool the heat-generating device 130. Thus, if the air can be made to flow, the driver 120 of the heat source and the heat-generating device 130 can be efficiently cooled.

[0022] However, in the situation of FIG. 4, the direction of the rectification of the heat sink 140 combined with the conventional specification driver 120 is not directed toward the direction in which the heat-generating device 130 is located (i.e., the right direction of the driver 120), but is directed toward the far right direction. For this reason, the air flow does not evenly hit the entire heat-generating device 130, and the air flow only hits a partially biased portion (the back side in FIG. 4).

[0023] That is, although a part of the heat-generating device 130 can be cooled by the air flow directed by the heat sink 140, other portions (for example, the front side in FIG. 4) are not sufficiently hit by the air flow and thus are not cooled and become hot. The heat-generating device is arranged close to the driver 120, and the driver is more heat-sensitive than the heat-generating device. Therefore, the heat generation of the heat-generating device may damage the driver.

[0024] Also, as shown in FIG. 3, the air flow hits the heat sink 140 provided in the driver 120 through the opening 113 formed in the bottom 111 of the housing 110 by the cooling fan 105 provided on the rotating shaft 100 of the motor 3. However, a part of the air flow that has hit the heat sink 140 dissipates without flowing toward the heat-generating device 130. That is, the blowing effect of the cooling fan 105 provided on the rotating shaft 100 of the motor 3 is not fully utilized.

[0025] Therefore, the present invention provides a configuration of a driver and its heat sink that can evenly blow the air flow after cooling the driver with the air flow from a cooling fan to the heat-generating device of the next cooling target without loss, cool it evenly, and avoid local overheating of the cooling target. At the same time, even if it is difficult to layout the electronic devices and control devices inside the housing, the cooling air from the cooling fan can be efficiently supplied to the driver and the heat-generating device, and a water supply device that can realize the miniaturization of the housing, and thus the entire water supply device without difficulty is provided.

Means for Solving the Problems

[0026] In one aspect, a water supply device is provided. The water supply device includes a pump device, a driver as a component of an inverter device for driving the pump device, and a heat sink for cooling the driver, and the heat sink includes a rectifying device that is rotatable and has a plurality of fins.

[0027] In one aspect, the rectifying device includes a heat sink base disposed below the base of the heat sink and a plurality of fin plates attached to the heat sink base. In one aspect, the base and the rectifying device are fastened by a fastener. In one aspect, the heat sink base is fitted into a hole of a heat sink base holder of the heat sink and is fixed by being sandwiched between the base and the heat sink base holder.

[0028] In one aspect, a water supply device is provided. The water supply device includes a pump device, a driver as a component of an inverter device for driving the pump device, a housing for housing the driver, a cooling fan for forming an air flow from outside the housing into the housing, and a heat sink for cooling the driver. The housing has an opening disposed in the direction of the cooling fan, and a rectifying device for rectifying the air flow entering the housing from the opening toward the heat sink is provided in the opening.

[0029] In one embodiment, the rectifier is a duct that covers from the opening to the heat sink. In one embodiment, the rectifier is a hood that changes the direction of the air supplied through the opening towards the heat sink.

[0030] In one embodiment, a water supply device is provided. The water supply device comprises a pump device, a driver as a component of an inverter device for driving the pump device, a heat-generating device separate from the driver, a housing for housing the driver and the heat-generating device separate from the driver, a cooling fan that forms an airflow from outside the housing toward inside the housing, and a heat sink for cooling the driver, wherein the heat sink is equipped with a flow rectifier having a plurality of fins, the plurality of fins are inclined toward the heat-generating device separate from the driver, and a reflector is provided on the side of the plurality of fins opposite to the direction toward the heat-generating device separate from the driver that is open toward the heat-generating device separate from the driver. [Effects of the Invention]

[0031] After cooling the driver with airflow from a cooling fan, the remaining airflow is evenly distributed to the next target of cooling, a heat-generating device, thus preventing localized overheating of the target. Therefore, even if the layout of electronic and control equipment inside the enclosure is difficult, cooling air from the cooling fan can be efficiently supplied to the driver and heat-generating device, making it possible to easily achieve miniaturization of the enclosure and, consequently, the entire water supply system. [Brief explanation of the drawing]

[0032] [Figure 1] This is a schematic diagram showing an example of a water supply system. [Figure 2] Figure 1 is a front view of the electrical equipment section. [Figure 3] This is an enlarged view of Figure 2. [Figure 4] This is a plan view of the electrical equipment section, and also shows the airflow for cooling the driver and heat-generating devices. [Figure 5] This diagram shows the airflow for cooling the driver and reactor. [Figure 6A] This figure shows one example of a driver and heatsink assembly used in a water supply system. [Figure 6B] This figure shows one example of a driver and heatsink assembly used in a water supply system. [Figure 7] Figures 6A and 6B show a plan view of the electrical components of the driver and heatsink, which are equipped with the rectifier described in Figures 6A and 6B. [Figure 8A] This figure shows another embodiment of a driver and heatsink assembly used in a water supply system. [Figure 8B] This figure shows another embodiment of a driver and heatsink assembly used in a water supply system. [Figure 9] Figures 8A and 8B show a plan view of the electrical components of the driver and heatsink, which are equipped with the rectifier described in Figures 8A and 8B. [Figure 10] This is a plan view of the electrical components of the driver and heatsink. [Figure 11] This is a side view of the electrical equipment section (particularly the rectifier). [Figure 12] This is a plan view of the electrical equipment section, which includes a driver and a heatsink. [Figure 13] This is a side view of the electrical equipment section (particularly the rectifier). [Modes for carrying out the invention]

[0033] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted. In the multiple embodiments described below, the configuration of one embodiment that is not specifically described is the same as that of the other embodiments, so redundant descriptions are omitted.

[0034] Figures 6A and 6B show one embodiment of a driver and heatsink assembly used in a water supply device. Figure 6B shows a cross-section along line AA in Figure 6A. The heatsink 140 is fixed to the bottom 111 of the housing 110 by a base 141 that supports the driver 120 and a spacer 145 that supports the base 141. The housing 110 is positioned opposite the heatsink 140 and has an opening 113 formed in the bottom 111.

[0035] A rectifier 500 is attached to the underside of the base 141, comprising a rectangular, flat plate-shaped heat sink base 200 and a plurality of fin plates 142 aligned perpendicularly to one side of the plane of the heat sink base 200. The heat sink base 200 is positioned below the base 141.

[0036] The heat sink base 200 is configured to be rotatable. Specifically, multiple fin plates 142 extend toward the opening 113. A screw hole 141a is drilled in the approximate center of the lower surface of the base 141, and a hole 200a is drilled in the approximate center of the heat sink base 200 of the rectifier 500.

[0037] The base 141 and the flow rectifier 500 are fastened together with a screw BT, which is an example of a fastener. The lower surface of the base 141 and the surface of the flow rectifier 500 can be brought into close contact by fastening with the screw BT, thus minimizing obstruction to heat flow between them. It is preferable to apply a heat transfer grease (not shown) to promote heat transfer between the lower surface of the base 141 and the surface of the flow rectifier 500.

[0038] Thus, because the base 141 and the rectifier 500 are detachable, and furthermore, because they are fastened together at one point with a screw BT or the like at approximately the center of each, the rectifier 500 can be attached in any direction relative to the position of the base 141 by fastening with a screw BT or the like, as shown in Figure 6B.

[0039] Therefore, even if a target object (for example, a heat-generating device 130) to which air should be blown after the heat sink 140 is placed at any position within the housing 110, the orientation of the multiple fin plates 142 of the rectifier 500 can be adjusted and fastened to the base 141 so that the airflow hits the target object evenly and without bias.

[0040] Figure 7 is a plan view of the electrical components of the driver and heatsink, equipped with the rectifier described in Figures 6A and 6B. Figure 7 shows the airflow for cooling the driver and reactor. There is an opening 113 in the bottom 111 of the housing 110 directly below the heatsink 140, and there are no airflow intake holes directly above the cooling fan 105.

[0041] The air sent into the enclosure 110 first comes into contact with the heatsink 140 facing the cooling fan 105, cooling the driver 120. Since the air sent by the cooling fan 105 is not heated, it can efficiently cool the driver 120 by coming into contact with the heatsink 140.

[0042] In the situation shown in Figure 7, the heat sink 140, which is combined with the conventional driver 120, has a rectifier 500 fastened to it with the direction of rectification adjusted to face the heat-generating device 130. As a result, airflow is evenly distributed over the entire heat-generating device 130, and there is no situation where airflow is concentrated on a part of the heat-generating device 130.

[0043] Therefore, the heat-generating device 130 is cooled overall by the airflow directed by the heat sink 140, and there is no risk of only a part of it becoming overheated without being cooled. Consequently, even if the driver 120 is placed in close proximity, there is no risk of damage to the driver due to localized overheating of the heat-generating device 130.

[0044] Figures 8A and 8B show another embodiment of a driver and heatsink assembly used in a water supply device. The heatsink 140 is fixed to the bottom 111 of the housing 110 by a base 141 that supports the driver 120, a heatsink base holder 210 that supports the base 141, and a spacer 145 that supports the heatsink base holder 210. The housing 110 is positioned opposite the heatsink 140 and has an opening 113 formed in the bottom 111.

[0045] A rectifier 500 is attached to the underside of the base 141, which includes a circular, flat heat sink base 220 and a plurality of fin plates 142 that are vertically aligned on one side of the plane of the heat sink base 220.

[0046] Multiple fin plates 142 extend toward the opening 113. The heat sink base holder 210 has coaxial holes 210a and 210b, one on the contact surface with the base 141 with a diameter larger than the outer diameter of the heat sink base 220, and the other on the contact surface with the spacer 145 with a diameter smaller than the outer diameter of the heat sink base 220. The depth of hole 210a, which has a diameter larger than the outer diameter of the heat sink base 220 on the contact surface with the base 141, is equal to or slightly shorter than the thickness of the heat sink base 220.

[0047] The heat sink base 220 is fitted into a hole 210a in the heat sink base holder 210, which is drilled to a diameter larger than the outer diameter of the heat sink base 220. The base 141, the heat sink base holder 210, and the spacer 145 are then secured by fastening them together with screws BT or the like, sandwiching them between the base 141 and the heat sink base holder 210. In this state, the lower surface of the base 141 and the surface of the heat sink base 220 can be in close contact, thus minimizing obstruction to heat flow between them. It is preferable to apply thermal grease (not shown) to promote heat transfer between the lower surface of the base 141 and the surface of the rectifier 500.

[0048] Thus, because the base 141 and the rectifier 500 are detachable, and furthermore, because the heat sink base 220 of the rectifier 500 is flat and can be in close contact with the lower surface of the base 141, and because the heat sink base 220 is fitted into the hole 210a of the heat sink base holder 210, which is drilled to a diameter larger than the outer diameter of the heat sink base 220, and the base 141, the heat sink base holder 210, and the spacer 145 are fastened together with screws BT or the like, the rectifier 500 can be mounted in any direction relative to the position of the base 141, as shown in Figure 8B.

[0049] Therefore, even if a target object (for example, a heat-generating device 130) to which air should be blown after the heat sink 140 is placed at any position within the housing 110, the orientation of the multiple fin plates 142 of the flow straightener can be adjusted so that the airflow hits the target object evenly and without bias, and then fastened to the base 141.

[0050] Figure 9 is a plan view of the electrical components of the driver and heatsink, equipped with the rectifier described in Figures 8A and 8B. Figure 9 shows the airflow for cooling the driver and heat-generating devices. There is an opening 113 in the bottom 111 of the housing 110 directly below the heatsink 140, and there are no airflow intake holes directly above the cooling fan 105.

[0051] The air sent into the enclosure 110 first comes into contact with the heatsink 140 facing the cooling fan 105, cooling the driver 120. Since the air sent by the cooling fan 105 is not heated, it can efficiently cool the driver 120 by coming into contact with the heatsink 140.

[0052] In the situation shown in Figure 9, the heat sink 140, which is combined with the conventional driver 120, has a rectifier that is fastened to it with the direction of the rectifier directed toward the heat-generating device 130. As a result, airflow is evenly distributed over the entire heat-generating device 130, and there is no situation where airflow is concentrated on a part of the heat-generating device 130. Therefore, the heat-generating device 130 is cooled overall by the airflow directed by the heat sink 140, and there is no risk of only a part becoming overheated without being cooled. Consequently, even if the driver 120 is placed in close proximity, there is no risk of damage to the driver 120 due to localized overheating of the heat-generating device 130.

[0053] Figure 10 is a plan view of the electrical components of the driver and heatsink. Figure 10 shows the airflow for cooling the driver and heat-generating devices. Figure 11 is a side view of the electrical components (particularly the rectifier). The opening 113 in the bottom 111 of the housing 110 is not fully open directly below the heatsink 140. The opening 113 for introducing airflow is fully open directly above the cooling fan 105.

[0054] A rectifier (duct) 300 is provided to direct the air supplied by the cooling fan 105 from the opening 113 to the heatsink 140 so that the air supplied into the housing 110 through the opening 113 comes into contact with the heatsink 140 and cools the driver 120. The rectifier 300, acting as a duct, does not necessarily need to cover the entire area from the opening 113 to the heatsink 140. The rectifier 300 could also be a hood that redirects the supplied air at the opening 113 toward the heatsink 140.

[0055] In this way, air sent into the interior of the housing 110 through the opening 113 is effectively directed to the heatsink 140 by a duct (an example of a rectifier 300) that passes from the opening 113 to the heatsink 140, or by a hood (an example of a rectifier 300) that changes the direction of the air sent through the opening 113 towards the heatsink 140. This ensures that even if the installation position of the heatsink 140 on the driver 120 differs from the position of the opening 113 at the bottom 111 of the housing 110, the air can be effectively directed to the heatsink 140 and cooled.

[0056] Figure 12 is a plan view of the electrical equipment section, which includes a driver and a heatsink. Figure 12 shows the airflow for cooling the driver and reactor. Figure 13 is a side view of the electrical equipment section (particularly the rectifier). An opening 113 is fully open in the bottom 111 of the housing 110 directly below the heatsink 140, while an opening 113 for airflow introduction is not fully open directly above the cooling fan 105.

[0057] A reflector 400 is provided on the back of the heatsink 140 opposite to the direction in which the cooling air is to be directed, so that the air blown into the interior of the housing 110 through the opening 113 by the cooling fan 105 does not flow in the opposite direction to the intended direction after it has come into contact with the heatsink 140 and cooled the driver 120.

[0058] In this way, by providing the reflector 400, the air sent into the housing 110 through the opening 113 does not dissipate elsewhere, and after hitting the heat sink 140, the air sent from the opening 113 is effectively blown in the desired direction.

[0059] As described above, the present invention provides a water supply device 1 that uses a cooling fan 105 provided on the pump 2 in the water supply device 1 to cool heat-generating equipment inside a housing 110 which houses control equipment for operating the pump 2 of the water supply device 1. Regardless of the position of the opening 113 in the housing 110 that takes in cooling air from the cooling fan 105 and the arrangement of heat-generating equipment inside the housing 110, the present invention provides a rotatable assembly that allows the mounting direction of the heat sink 140 provided on the heat-generating element to be arbitrarily set.

[0060] Therefore, the cooling air directed at the heatsink 140 can be directed towards the next heat-generating device 130 or other equipment to be cooled. Furthermore, since a rectifier 300 (for example, a duct or hood) is provided at the opening 113 in the housing 110 that takes in the cooling air from the cooling fan 105, the cooling air taken into the housing 110 can be guided to the heatsink 140 on the heat-generating element without loss for cooling.

[0061] Furthermore, to prevent the cooling air directed at the heatsink 140 from dissipating elsewhere, a reflector 400 is placed in the opposite direction to the heat-generating device 130 or other equipment that needs to be cooled next. The opening direction of the reflector 400 is directed towards the heat-generating device 130 or other equipment that needs to be cooled next. This reduces the loss of cooling air, allowing it to be directed towards the heat-generating device 130 or other equipment that needs to be cooled next, thereby enabling effective cooling.

[0062] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications and combinations of the above embodiments are naturally possible for those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of symbols]

[0063] 1 Water supply device 2 pumps 3 motors 5 Introductory tube 7 Water pipe 8 Discharge pipe 9. Suction connection pipe 10 Suction pipe 15 Backflow prevention device 18 Suction header pipe 21 Electrical Equipment Department 27 Discharge connection pipe 28 Pressure Tank 30 cabinets 34 Discharge collecting pipe 100 Rotation axis 105 Cooling Fan 110 cabinets 111 Bottom 113 Aperture 120 Drivers 130 Heat-generating devices 140 Heatsink 141 Base 141a Screw hole 142 fin plate 145 Spacer 150 Control board 200 Heatsink Base 200a hole 210 Heatsink Base Holder 210a,210b hole 220 Heatsink Base 300 Rectifier 400 Reflector 500 Rectifier BT Screw

Claims

1. A water supply device, Pumping device, A driver as a component of an inverter device for driving the aforementioned pump device, The driver comprises a heatsink for cooling the driver, The heat sink is equipped with a rectifier that is rotatable and has multiple fins, and is a water supply device.

2. The rectifier device is, A heat sink base positioned below the base of the heat sink, The water supply device according to claim 1, comprising a plurality of fin plates attached to the heat sink base.

3. The water supply device according to claim 2, wherein the base and the rectifier are fastened together by fasteners.

4. The water supply device according to claim 2, wherein the heat sink base is fitted into a hole in the heat sink base holder of the heat sink and is fixed by being sandwiched between the base and the heat sink base holder.

5. A water supply device, Pumping device, A driver as a component of an inverter device for driving the aforementioned pump device, A housing for the aforementioned driver, A cooling fan that forms an airflow from the outside of the enclosure toward the inside of the enclosure, The driver comprises a heatsink for cooling the driver, The housing has an opening positioned in the direction of the cooling fan, A water supply device is provided in the opening, which is equipped with a flow straightening device that straightens the airflow entering the housing from the opening toward the heat sink.

6. The water supply device according to claim 5, wherein the rectifier is a duct that covers from the opening to the heat sink.

7. The water supply device according to claim 5, wherein the rectifier is a hood that changes the direction of the air supplied at the opening toward the heat sink.

8. A water supply device, Pumping device, A driver as a component of an inverter device for driving the aforementioned pump device, A heat-generating device separate from the aforementioned driver, A housing that houses the aforementioned driver and a heat-generating device separate from the aforementioned driver, A cooling fan that forms an airflow from the outside of the enclosure toward the inside of the enclosure, The driver comprises a heatsink for cooling the driver, The heat sink is equipped with a rectifier having multiple fins, The aforementioned multiple fins are tilted toward a heat-generating device separate from the driver, A water supply device wherein a reflector is provided on the plurality of fins in the direction opposite to the direction of a heat-generating device other than the driver, and the reflector is open in the direction of the heat-generating device other than the driver.

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