Probes and electrical connection devices

Abstract

The present invention provides a probe and an electrical connection device that allow for easy fixing of the probe to the electrical connection device while aligning it with the electrode position of the object being inspected. [Solution] The probe 10 has a columnar shape in which a main body portion 11 and a base portion 12 are connected in the axial direction, and a flange 100 protruding from the side surface of the base portion 12 is formed at a position spaced apart from the end face of the base portion 12 in the direction toward the main body portion 11. The flange 100 includes a tapered region in which the portion that protrudes axially toward the end face of the base portion 12 gradually becomes lower.

Description

Technical Field

[0001] The present invention relates to a probe and an electrical connection device used for inspecting the electrical characteristics of an inspection object.

Background Art

[0002] In order to inspect the electrical characteristics of an inspection object such as a semiconductor integrated circuit in a wafer state, an electrical connection device including a probe that contacts the inspection object is used. The electrical connection device further includes a probe guide that supports the probe and a wiring board on which internal wiring for electrically connecting the probe and the inspection device is arranged. In an inspection using a probe, one end (hereinafter also referred to as the "tip end") of the probe contacts the electrode of the inspection object. And the other end (hereinafter also referred to as the "base end") of the probe contacts a probe pad arranged on the wiring board. The probe pad is electrically connected to an inspection device such as a tester via the internal wiring of the wiring board.

[0003] The probe is held by the electrical connection device in a state of passing through a through-hole (hereinafter referred to as a "guide hole") formed in the probe guide, for example. The guide holes are arranged in the probe guide so as to correspond to the arrangement of the electrodes of the inspection object. Therefore, in order to accurately inspect the electrical characteristics of the inspection object, the probe is fixed to the electrical connection device so that the tip end of the probe and the electrode of the inspection object are accurately aligned.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] A certain gap (clearance) is provided between the guide hole and the probe to account for manufacturing variations, or the corners of the guide hole are rounded off, so that there is a certain distance between the inner wall of the guide hole and the side of the probe. On the other hand, if the distance between the inner wall of the guide hole and the side of the probe becomes too wide, problems arise such as the probe shifting position or becoming distorted inside the guide hole. As a result, misalignment occurs between the tip of the probe and the electrode of the object being inspected.

[0006] The present invention aims to provide a probe and an electrical connection device that allow for easy fixing of the probe to an electrical connection device while the tip is aligned with the electrode position of the object to be inspected. [Means for solving the problem]

[0007] A probe according to one aspect of the present invention has a columnar shape in which a main body portion and a base portion are connected in the axial direction, and a flange is formed protruding from the side surface of the base portion. The flange includes a tapered region in which the portion protruding in the axial direction toward the end face of the base portion gradually becomes lower. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a probe and an electrical connection device that make it easy to fix the probe to the electrical connection device while aligning it with the position of the electrode of the object to be inspected. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic diagram showing the configuration of a probe according to an embodiment. [Figure 2] Figure 2 is a schematic, enlarged view of the portion of the probe according to the embodiment in which the flange is formed. [Figure 3] Figure 3 is a schematic top view showing the configuration of the probe according to this embodiment. [Figure 4] Figure 4 is a schematic diagram showing the configuration of an electrical connection device according to an embodiment. [Figure 5]Figure 5 is a schematic enlarged view showing the contact points between the probe and the probe guide according to the embodiment. [Figure 6] Figure 6 is a cross-sectional view showing an example of the clearance between the probe and the guide hole. [Figure 7] Figure 7 is a schematic diagram illustrating the inclination of the probe in the comparative example. [Figure 8] Figure 8 is a schematic top view showing the clearance between the probe and the guide hole in an electrical connection device according to an embodiment. [Figure 9] Figure 9 is a schematic top view showing an example of the arrangement of guide holes in an electrical connection device according to an embodiment. [Figure 10] Figure 10 is a schematic top view showing an example of the arrangement of guide holes and flanges of an electrical connection device according to an embodiment. [Figure 11] Figure 11 is a schematic top view showing another example of the arrangement of guide holes and flange configuration of an electrical connection device according to an embodiment. [Figure 12] Figure 12 is a schematic diagram showing the contact points between the probe and probe guide of an electrical connection device according to a modified embodiment. [Figure 13] Figure 13 is a schematic diagram showing the shape of the flange of a probe according to a modified embodiment. [Figure 14] Figure 14 is a schematic diagram showing the position of the probe flange according to another modification of the embodiment. [Figure 15] Figure 15 is a schematic diagram showing the shape of the flange of a probe according to yet another modification of the embodiment. [Figure 16] Figure 16 is a schematic top view showing the shape of the flange of the probe shown in Figure 15. [Figure 17] Figure 17 is a schematic diagram showing the configuration of a probe according to another embodiment. [Modes for carrying out the invention]

[0010] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the ratios of the thicknesses of the respective parts are different from the actual ones. Also, it is a matter of course that there are portions where the dimensional relationships and ratios are different between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, etc. of the constituent parts as those described below.

[0011] The probe 10 according to the embodiment shown in FIG. 1 is used for inspecting the electrical characteristics of an inspection object. The probe 10 has a columnar shape in which a base end portion 12 is connected to one end portion of a main body portion 11, and a tip end portion 13 is connected to the other end portion. In other words, the tip end portion 13, the main body portion 11, and the base end portion 12 are connected in the axial direction. In the inspection of the inspection object, the base end portion 12 of the probe 10 is connected to the probe pad of the electrical connection device, and the tip end portion 13 is connected to the inspection object. The probe 10 has conductivity, and for example, nickel (Ni), nickel alloy, palladium (Pd), palladium alloy, rhodium (Rh), rhodium alloy, tungsten (W), etc. may be used as the material of the probe 10.

[0012] In the description of the embodiment, as shown in FIG. 1, the axial direction of the probe 10 is defined as the Z direction, the left - right direction in FIG. 1 is defined as the X direction, and the depth direction in FIG. 1 is defined as the Y direction. Also, the direction in which the base end portion 12 is located when viewed from the tip end portion 13 along the Z direction is defined as upward, and the direction in which the tip end portion 13 is located when viewed from the base end portion 12 is defined as downward.

[0013] As shown in FIG. 1, the probe 10 has a flange 100 protruding from the side surface of the base end portion 12 formed at a position spaced apart from the end surface of the base end portion 12 in the direction toward the main body portion 11. The flange 100 includes a tapered region in which the portion gradually protruding along the axial direction toward the end surface of the base end portion 12 becomes lower. FIG. 2 shows an enlarged view including the flange 100 of the probe 10. The outer diameter of the base end portion 12 where the flange 100 is not formed may be approximately the same as the outer diameter of the main body portion 11.

[0014] Hereinafter, the probe 10 whose cross section perpendicular to the axial direction of the proximal end portion 12 is rectangular will be described. The flange 100 is disposed on at least one side surface of the proximal end portion 12.

[0015] FIG. 3 shows an example of a top view of the probe 10 as viewed from the end face direction of the proximal end portion 12. In the probe 10 shown in FIG. 3, the flanges 100 are respectively disposed on two side surfaces of the proximal end portion 12 facing opposite directions. More specifically, the flange 100 is formed over the entire region in the Y direction on the side surface of the proximal end portion 12 facing the X direction.

[0016] The probe 10 is used, for example, in the electrical connection device 1 shown in FIG. 4. The electrical connection device 1 is used for measuring the electrical characteristics of an object to be inspected. The electrical connection device 1 includes a probe 10, a probe guide 20, a probe pad 30, a wiring board 40, and a printed board 50. As shown in FIG. 1, the probe guide 20, the wiring board 40, and the printed board 50 are laminated in order along the Z direction.

[0017] The probe 10 is held by the probe guide 20 in which a guide hole into which the probe 10 is inserted is disposed. The probe 10 is inserted into the guide hole of the probe guide 20 from the side of the proximal end portion 12. As shown in FIG. 4, the probe 10 is held by the probe guide 20 in a state where the tapered region of the flange 100 contacts the edge of the opening of the guide hole 200.

[0018] The wiring board 40 has a structure including a thin film 41 disposed on the surface facing the probe guide 20 and a substrate 42 laminated on the thin film 41. Recesses are formed on the surface of the thin film 41, and the probe pads 30 are disposed at the bottoms of the recesses. The end face of the proximal end portion 12 of the probe 10 that has passed through the guide hole of the probe guide 20 is connected to the conductive probe pads 30. The probe pads 30 may be made of a metal material such as gold (Au) or copper (Cu), for example.

[0019] The wiring board 40 includes internal wirings (not shown) that are electrically connected to the probe pads 30. The thin film 41 and the substrate 42 may have a laminated structure in which the internal wirings are arranged in a plurality of wiring layers. One end of the internal wiring is connected to the probe pad 30, and the other end is connected to electrode terminals (not shown) of a printed board 50 disposed on the upper surface of the substrate 42. For example, the terminals of the internal wirings of the wiring board 40 may be connected to the electrode terminals of the printed board 50 via pogo pins or the like. The electrode terminals of the printed board 50 are electrically connected to an inspection device such as an IC tester via the wirings of the printed board 50.

[0020] The wiring board 40 may be, for example, a space transformer that widens the interval between the electrode terminals of the printed board 50 more than the interval between the probe pads 30. The thin film 41 may be, for example, a resin film. The substrate 42 may be, for example, a ceramic substrate or an MLO (Multi-Layer Organic) substrate.

[0021] FIG. 5 shows an enlarged view including the contact portion between the probe 10 and the probe guide 20. The inner diameter D0 of the guide hole 200 is wider than the outer diameter of the base end portion 12 in the region where the flange 100 is not formed (hereinafter referred to as "the first outer diameter D1"). And the inner diameter D0 of the guide hole 200 is narrower than the outer diameter of the probe 10 in the region where the flange 100 protrudes most from the side surface of the base end portion 12 (hereinafter referred to as "the second outer diameter D2"). That is, the relationship is D1 < D0 < D2. Further, the flange 100 has a tapered region in which the outer diameter gradually widens from the portion of the first outer diameter D1 to the portion of the second outer diameter D2. For this reason, the tapered region of the flange 100 contacts the edge of the opening of the guide hole 200, and the probe 10 is held by the probe guide 20 in a state where the region closer to the end face of the base end portion 12 than the region where the flange 100 is formed is inserted into the guide hole 200.

[0022] As shown in Figure 6, a clearance is provided between the guide hole 200 and the probe 10. Figure 6 is a cross-sectional view along the VI-VI direction in Figure 5. The clearance is, for example, about 2 to 3 μm on one side. By providing an appropriate clearance between the guide hole 200 and the probe 10, manufacturing variations in the guide hole 200 and the probe 10 can be absorbed, and the base end 12 of the probe 10 can be inserted into the guide hole 200. In addition, as shown in Figure 6, by rounding the corners of the guide hole 200 when viewed from the axial direction, cracks due to stress concentration can be prevented. The guide hole 200 may be formed by machining or laser processing.

[0023] By providing a clearance between the guide hole and the probe, and by rounding the corners of the guide hole, the distance between the inner wall surface of the guide hole and the side surface of the probe is increased. As a result, as shown in Figure 7, the comparative probe without a flange 100 (hereinafter referred to as "comparative probe 10M") may tilt inside the guide hole 200.

[0024] The guide holes 200 are positioned in the probe guide 20 to correspond to the arrangement of electrodes on the object being inspected. Therefore, if the comparison probe 10M is fixed to the probe guide 20 in an inclined position, it is not possible to accurately align the electrodes of the object being inspected with the tip of the comparison probe 10M. As a result, the electrical characteristics of the object being inspected cannot be accurately examined.

[0025] In contrast, with a probe 10 having a flange 100, the flange 100, including the tapered region, can be brought into contact with the edge of the opening of the guide hole 200 to adjust the position of the probe 10 relative to the guide hole 200, and it is possible to prevent the probe 10 from being positioned on the probe guide 20 at an angle. For example, the probe 10 can be mounted on the probe guide 20 with its central axis aligned with the central axis of the guide hole 200. As a result, the electrode of the object being inspected and the tip of the probe 10 can be accurately aligned.

[0026] In the manufacturing of the electrical connection device 1, the probe 10 may be fixed by a reflow process. Specifically, solder is applied to a probe pad 30 placed on the surface of a thin film 41 on a wiring board 40, and the probe 10, which is mounted on a probe guide 20, is heated while pressed against the probe pad 30 to melt the solder. This allows the probe 10 to be fixed to the probe guide 20 with its tip 13 aligned with the electrode position of the object to be inspected. In the reflow process, appropriate pressure (for example, about 2 gf) may be applied to the probe 10 to bring the tapered region of the flange 100 into contact with the edge of the opening of the guide hole 200.

[0027] Incidentally, one possible method for fixing the probe to the probe guide is to fix the probe to the inner wall surface of the guide hole and the side surface of the probe with a bonding material such as solder (hereinafter referred to as the "comparative fixing method"). However, with the comparative fixing method, there is a risk that the probe may be fixed to the probe guide in a state where the central axis of the probe and the central axis of the guide hole do not precisely coincide due to misalignment of the probe relative to the guide hole or variations in the thickness of the bonding material.

[0028] In contrast, in the manufacturing of the electrical connection device 1, when the probe 10 is inserted into the guide hole 200 and the end face of the base end 12 is brought into contact with the probe pad 30, the probe 10 is guided to the appropriate position along the inclination of the tapered region of the flange 100. Then, with the central axis of the probe 10 and the central axis of the guide hole 200 aligned, the probe 10 can be fixed to the probe guide 20 by a reflow process or the like, which joins the end face of the base end 12 and the probe pad 30. This allows the probe 10 to be fixed while maintaining the position of the tip 13 aligned with the electrode of the object to be inspected. Therefore, according to the manufacturing method of the electrical connection device 1 described above, accurate positioning of the probe 10 can be easily achieved, resulting in a reduction in manufacturing time and an improvement in yield.

[0029] The flange 100 has rigidity so that it does not collapse and deform when the tapered region is brought into contact with the edge of the opening of the guide hole 200. In other words, the flange 100 does not deform and enter the inside of the guide hole 200. Therefore, the position and orientation of the probe 10 are stable. For example, the flange 100 may be integrally molded with the base end 12.

[0030] As described above, the probe 10 according to the embodiment provides a probe 10 and an electrical connection device 1 that can be easily fixed to the electrical connection device 1 with the tip aligned with the electrode position of the object to be inspected.

[0031] Furthermore, the electrical connection device 1, including the probe 10, can suppress the tilting of the probe 10 toward the side where the flange 100 is not formed. Normally, considering the rounded chamfering of the corner portion of the guide hole 200, it is necessary to provide a wide clearance in both the X and Y directions. In contrast, the electrical connection device 1, including the probe 10, can reduce the clearance between the side of the probe 10 where the flange 100 is not formed and the inner wall surface of the guide hole 200, as shown in Figure 8, for example. For example, in the case of a probe 10 with a flange 100 formed on the side facing the X direction, the clearance in the Y direction can be narrowed. This suppresses the tilting of the probe 10 in the Y direction.

[0032] The guide holes 200 are formed in the probe guide 20 in accordance with the arrangement of electrodes on the object being inspected. For example, as shown in Figure 9, multiple guide holes 200 are arranged in a matrix when viewed from the Z direction. In other words, the guide holes 200 are arranged along a first direction (e.g., the X direction) and a second direction (e.g., the Y direction), respectively. In this case, multiple probes 10 are arranged and held in a matrix on the probe guide 20.

[0033] The following describes an example of the side surface on which the flange 100 is positioned when a plurality of guide holes 200 are arranged along the first direction in the probe guide 20, with the first direction being the X direction and the second direction being the Y direction, referring to Figure 10. In the example shown in Figure 10, probes 10 with flanges 100 formed on the side surface facing the first direction and probes 10 with flanges 100 formed on the side surface facing the second direction perpendicular to the first direction are arranged alternately along the first direction.

[0034] As shown in Figure 10, by arranging the probes 10, short circuits between adjacent probes 10 in the first direction via the flanges 100 can be suppressed. Therefore, the spacing between the guide holes 200 can be narrowed, making it possible to reduce the pitch of the probes 10. The same applies whether the guide holes 200 on the probe guide 20 are arranged along the Y direction or whether the guide holes 200 are arranged in a matrix. In other words, by arranging probes 10 adjacent to each other with sides where the flanges 100 are formed on different surfaces, the spacing between the probes 10 can be narrowed.

[0035] Figure 10 shows a case where the guide hole 200 is approximately square when viewed from the Z direction, but the guide hole 200 may also be rectangular. As shown in Figure 11, for rectangular guide holes 200, they are arranged so that the long side of one adjacent guide hole 200 faces the short side of the other guide hole 200. Then, similar to the arrangement shown in Figure 10, probes 10 with flanges 100 formed on the side facing the X direction and probes 10 with flanges 100 formed on the side facing the Y direction are arranged alternately along the X direction. Also, probes 10 with flanges 100 formed on the side facing the X direction and probes 10 with flanges 100 formed on the side facing the Y direction are arranged alternately along the Y direction. By arranging the guide holes 200 so that their long and short sides are alternately adjacent as shown in Figure 11, short circuits between probes 10 are suppressed, and the distance between guide holes 200 is increased, making it possible to increase the wall thickness of the guide holes 200. This improves the mechanical strength of the probe guide 20.

[0036] <Variation> As shown in Figure 12, the electrical connection device 1 may have a taper on the edge of the opening of the guide hole 200 so as to make surface contact with the tapered region of the flange 100. In this case, the angle that the tapered region of the flange 100 makes with the Z direction is made to coincide with the angle that the taper on the edge of the opening of the guide hole 200 makes with the Z direction. As a result, the surface of the tapered region of the flange 100 and the edge of the opening of the guide hole 200 make surface contact. Therefore, the position and orientation of the probe 10 can be made more stable, and the probe 10 can be attached to the probe guide 20.

[0037] The above description exemplifies a probe 10 in which the flange 100 includes a tapered region and a region parallel to the axial direction, and the flange 100 is positioned on each of the two sides of the base end 12 that face in opposite directions. However, the shape and arrangement of the flange 100 are not limited to those described above.

[0038] For example, as shown in Figure 13, the flange 100 may include only the tapered region. Alternatively, as shown in Figure 14, the flange 100 may be placed on only one surface of the base end 12. Even if the probe 10 has only one flange 100, the probe 10 can be mounted on the probe guide 20 with greater stability in position and orientation than the comparison probe 10M which does not have a flange 100.

[0039] Furthermore, the flanges 100 may be positioned on each of the four sides of the base end portion 12. For example, as shown in Figures 15 and 16, the region of the probe 10 on which the flanges 100 are formed may have a truncated square pyramidal shape with the surface facing the main body portion 11 as its base. Figure 16 is a top view showing the shape of the flange 100 of the probe 10 shown in Figure 15 as seen from the Z direction. The surface facing the end face of the base end portion 12 of the tapered region is the truncated surface of the truncated square pyramidal shape. With the probe 10 having the flanges 100 shown in Figure 15, the tapered regions of the flanges 100 formed on the four sides contact the four edges of the opening of the guide hole 200. This further stabilizes the position and orientation of the probe 10.

[0040] If a taper is applied to the edge of the opening of the guide hole 200, it may be applied in accordance with the arrangement of the flange 100 of the probe 10. For example, if the flange 100 is placed on only one face of the base end 12, the edge of the opening of the guide hole 200 only needs to be tapered on the side that contacts the tapered region of the flange 100. If the flange 100 is placed on each of the four sides of the base end 12, the edges of the opening of the guide hole 200 should be tapered on all four sides.

[0041] (Other embodiments) Although the present invention has been described above by embodiments, the descriptions and drawings that constitute part of this disclosure should not be understood as limiting the invention. Various alternative embodiments, examples, and operational techniques will become apparent to those skilled in the art from this disclosure.

[0042] For example, the probe 10 may have an axially elastic structure. An example of an axially elastic probe 10 is shown in Figure 17. The probe 10 shown in Figure 17 includes a rectangular coil spring whose main body 11 has four sides when viewed from the axial direction. The main body 11 has a configuration in which a non-elastic connecting portion 110 is placed between two spring portions that form a helical spring. The probe 10 shown in Figure 17 is rectangular when viewed from the axial direction, and the ends of the beams that make up each side of the spring portion are connected to the ends of the beams of the adjacent sides. In the probe 10 including the coil spring, when an axial load is applied, the spacing between the beams that make up the spring portion narrows, generating an axial elastic force.

[0043] Thus, the present invention naturally includes various embodiments not described above. Therefore, the technical scope of the present invention is defined solely by the inventive features relating to the claims that are reasonable based on the above description. [Explanation of Symbols]

[0044] 1. Electrical connection device 10 probes 11 Main body 12 Proximal end 13 Tip 20 Probe Guide 30 probe pads 40 Wiring board 50 Printed circuit boards 100 flange 200 guide holes

Claims

1. A probe used for testing the electrical characteristics of an object being tested, It has a columnar shape in which the main body and the base are connected in the axial direction. A flange is formed that protrudes from the side surface of the base end. The flange includes a tapered region in which the portion that gradually protrudes in the axial direction toward the end face of the base end becomes lower, probe.

2. The cross-section of the base end perpendicular to the axial direction is rectangular, The flange is positioned on at least one side of the base end, The probe according to claim 1.

3. The probe according to claim 2, wherein the flanges are arranged on two sides of the base end facing opposite directions.

4. The probe according to claim 2, wherein the flanges are arranged on each of the four sides of the base end.

5. The probe according to claim 1, wherein the flange is integrally molded with the base end.

6. The probe according to claim 1, wherein the main body portion is elastic in the axial direction.

7. A probe according to any one of claims 1 to 6, A probe guide having a guide hole formed therein into which the probe is inserted from the base end side, Equipped with, The inner diameter of the guide hole is narrower than the outer diameter of the probe in the region where the flange protrudes most from the side surface of the base end. The probe is held in the probe guide with the tapered region of the flange in contact with the edge of the opening of the guide hole, and the region of the base end closer to the end face than the region where the flange is formed inserted into the guide hole. Electrical connection device.

8. The electrical connection device according to claim 7, wherein the corner portion of the guide hole is rounded off when viewed from the axial direction.

9. The electrical connection device according to claim 7, wherein the edge of the opening of the guide hole is tapered so as to make surface contact with the tapered region of the flange.

10. The electrical connection device according to claim 7, further comprising a wiring board laminated on the probe guide and on which probe pads are arranged to connect to the end face of the base end of the probe that has passed through the guide hole.

11. The probe guide has a plurality of guide holes arranged along the first direction, The probes, each having a flange formed on a side facing the first direction and each having a flange formed on a side facing a second direction perpendicular to the first direction, are arranged alternately along the first direction. The electrical connection device according to claim 7.

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