Light-emitting module

Abstract

We provide a light-emitting module that realizes a small light-emitting module with consideration for ease of implementation. [Solution] The light-emitting module comprises a light-emitting device having one or more light-emitting elements and a substrate on which one or more light-emitting elements are arranged, and a wiring board having a mounting surface including a first region on which the light-emitting device is mounted, wherein the wiring board has a first fixing part and a second fixing part for fixing the wiring board to the substrate, a first electrode part to which the substrate is joined and which is electrically connected to one or more light-emitting elements, and a second electrode part to which a connecting member for electrically connecting the light-emitting device to the outside is joined and which is electrically connected to the first electrode part, and in a top view taken from a direction perpendicular to the mounting surface, the first region is located between the first fixing part and the second fixing part, and the second fixing part is located between the first electrode part and the second electrode part.

Description

Technical Field

[0001] The present invention relates to a light-emitting module.

Background Art

[0002] Patent Document 1 discloses a light-emitting module in which a light-emitting device is mounted on a wiring board. This light-emitting module has a structure that can be fixed to other members by using through holes provided in the wiring board as screw holes.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object is to realize a small light-emitting module that takes into account mountability.

Means for Solving the Problems

[0005] The light-emitting module disclosed in the embodiment includes a light-emitting device having one or more light-emitting elements and a substrate on which the one or more light-emitting elements are arranged, a wiring board having a mounting surface including a first region on which the light-emitting device is mounted, and is provided with The wiring board has a first fixing portion and a second fixing portion for fixing the wiring board, a first electrode portion to which the substrate is joined and which is electrically connected to the one or more light-emitting elements, and a second electrode portion to which a connection member that is electrically connected to the first electrode portion and electrically connects the light-emitting device to the outside is joined. and has In a top view taken from a direction perpendicular to the mounting surface, the first region is located between the first fixing portion and the second fixing portion, and the second fixing portion is located between the first electrode portion and the second electrode portion.

[0006] In at least one of the one or more inventions disclosed by the embodiments, a compact light-emitting module that is easy to implement can be provided. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a perspective view of a light-emitting module according to an embodiment. [Figure 2] Figure 2 is a top view of the light-emitting module according to the embodiment. [Figure 3] Figure 3 is a side view of the light-emitting module according to the embodiment. [Figure 4] Figure 4 is a perspective view of the light-emitting device according to the embodiment. [Figure 5] Figure 5 is a side view corresponding to Figure 4. [Figure 6A] Figure 6A is a top view of the light-emitting device according to the embodiment. [Figure 6B] Figure 6B is a cross-sectional view of the light-emitting device along the VIB-VIB line shown in Figure 6A. [Figure 7] Figure 7 is a perspective view of the package according to the embodiment. [Figure 8A] Figure 8A is a top view of the package according to the embodiment. [Figure 8B] Figure 8B is a cross-sectional view of the package along the line VIIIB-VIIIB in Figure 8A. [Figure 9] Figure 9 is a top view of the substrate according to the embodiment. [Figure 10] Figure 10 is a bottom view of the substrate according to the embodiment. [Figure 11] Figure 11 is a cross-sectional view of the substrate along the line XI-XI in Figure 9. [Figure 12] Figure 12 is a top view illustrating the internal structure of the light-emitting device according to the embodiment. [Figure 13A] FIG. 13A is a diagram in which a top view of a wiring board according to an embodiment and a wiring pattern are superimposed. [Figure 13B] FIG. 13B is a top view of a wiring board according to an embodiment. [Figure 13C] FIG. 13C is a diagram showing a wiring pattern of a wiring board according to an embodiment. [Figure 14] FIG. 14 is a perspective view of a light-emitting module according to another embodiment. [Figure 15A] FIG. 15A is a diagram in which a top view of a wiring board according to another embodiment and a wiring pattern are superimposed. [Figure 15B] FIG. 15B is a top view of a wiring board according to another embodiment. [Figure 15C] FIG. 15C is a diagram showing a wiring pattern of a wiring board according to another embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

[0008] In this specification or the claims, with regard to polygons such as triangles and quadrilaterals, shapes that have been processed such as rounding, chamfering, corner rounding, and rounding at the corners of the polygon are also included and shall be referred to as polygons. Also, not limited to the corners (ends of the sides), shapes that have been processed in the middle part of the sides shall likewise be referred to as polygons. That is, shapes that have been partially processed while leaving the polygon as a basis are included in the interpretation of "polygon" described in this specification and the claims.

[0009] Also, not limited to polygons, the same applies to words representing specific shapes such as trapezoids, circles, and concavities and convexities. The same also applies when dealing with each side forming the shape. That is, even if a side has been processed at a corner or in the middle part, the processed part is included in the interpretation of "side". When distinguishing "polygon" or "side" without partial processing from the processed shape, "strict" shall be added, for example, described as "strict quadrilateral", etc.

[0010] Furthermore, in this specification or the claims, descriptions such as up and down (up / down), left and right, front and back, front and back (front / back), and front and back merely describe relative positions, orientations, and directions, and do not necessarily correspond to the relationships during use.

[0011] Furthermore, directions such as the X, Y, and Z directions may be indicated in the drawings using arrows. The direction of these arrows is consistent across multiple drawings representing the same embodiment. In the drawings, the direction of arrows marked X, Y, and Z is considered the positive direction, and the opposite direction is considered the negative direction. For example, the direction indicated by an X at the end of the arrow is the X direction and is also the positive direction. In this specification, the direction that is both the X direction and the positive direction will be referred to as the "positive X direction," and the opposite direction will be referred to as the "negative X direction." When referring to the "X direction," both the positive and negative directions are included. The same applies to the Y and Z directions.

[0012] Furthermore, in this specification, when an object is identified as "one or more" and described accordingly, the form in which there is one object and the form in which there are multiple objects are described together. Accordingly, the description identifying an object as "one or more" supports any of the embodiments comprising one or more objects, embodiments comprising at least one object, and embodiments comprising multiple objects.

[0013] Furthermore, in this specification, descriptions describing "one or each" of an object are a combined description of one object in an embodiment having one object, one object in an embodiment having multiple objects, and each of the multiple objects in an embodiment having multiple objects. Accordingly, descriptions describing "one or each" of an object support any of the following: in an embodiment having one object, this one object provides the description; in an embodiment having multiple objects, at least one of these objects provides the description; in an embodiment having multiple objects, each of these multiple objects provides the description; and in an embodiment having one or more objects, all objects provide the description.

[0014] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. "Component" refers to an object that is treated as a single physical unit. An object that is treated as a single physical unit can also be an object that is treated as a single part in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily have to be treated as a single physical unit. For example, "part" is used when considering a part of one component, or when considering multiple components together as a single object.

[0015] Furthermore, the distinction between "component" and "part" as described above does not indicate an intention to consciously limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this alone does not mean that the applicant recognizes that treating this component as a physical unit is indispensable for the application of the present invention.

[0016] Furthermore, in this specification or the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Also, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same prefix as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0017] For example, if there are components designated as “First,” “Second,” and “Third” in this specification to distinguish them, and these components are described in the claims as “First” and “Third” in this specification, then for readability, the components may be distinguished in the claims as “First” and “Second.” In this case, the components designated as “First” and “Second” in the claims refer to the components designated as “First” and “Third” in this specification, respectively. This rule is not limited to components, but can be applied to other subjects in a reasonable and flexible manner.

[0018] The following describes embodiments for carrying out the present invention. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only forms in which the present invention is realized. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for the sake of ease of understanding.

[0019] <Embodiment> A light-emitting module 901 according to an embodiment will be described. Figures 1 to 3 are drawings illustrating an exemplary form of the light-emitting module 901. Figure 1 is a perspective view of the light-emitting module 901 according to an embodiment. Figure 2 is a top view of the light-emitting module 901 according to an embodiment. Figure 3 is a side view of the light-emitting module 901 according to an embodiment.

[0020] The light-emitting module 901 comprises multiple components. These components include one or more light-emitting devices 1, a wiring board 101, a connector 201, and a thermistor 301.

[0021] The light-emitting module 901 may also have other components. For example, the light-emitting module 901 may have a different light-emitting device than the light-emitting device 1. Also, the light-emitting module 901 may not have some of the components listed here.

[0022] The light-emitting module 901 may include a light-emitting device 1 having one or more light-emitting elements 20 and a substrate 11 on which one or more light-emitting elements 20 are arranged, and a wiring board 101 having a mounting surface including a first region 1A on which the light-emitting device 1 is mounted. A semiconductor laser element may be used as the light-emitting element 20. The wiring board 101 also has an electrode portion 101E for electrically connecting the light-emitting device 1 to the outside. A connector 201 or wires, etc., as connecting members are connected to the electrode portion 101E. The light-emitting module 901 may also be configured to include connecting members such as a connector 201 or wires. Furthermore, the light-emitting module 901 may include a thermistor 301 as a temperature measuring element for measuring temperature.

[0023] The components of the light-emitting module 901 will be described below.

[0024] (Light-emitting device 1) A light-emitting device 1 according to an embodiment will be described. Figures 4 to 12 are drawings illustrating an exemplary form of the light-emitting device 1. Figure 4 is a perspective view of the light-emitting device 1 according to an embodiment. Figure 5 is a side view corresponding to Figure 4. Figure 6A is a top view of the light-emitting device according to an embodiment. Figure 6B is a cross-sectional view of the light-emitting device along the line VIB-VIB in Figure 6A. Figure 7 is a perspective view of the package according to an embodiment. Figure 8A is a top view of the package according to an embodiment. Figure 8B is a cross-sectional view of the package along the line VIIIB-VIIIB in Figure 8A. Figure 9 is a top view of the substrate according to an embodiment. Figure 10 is a bottom view of the substrate according to an embodiment. Figure 11 is a cross-sectional view of the substrate along the line XI-XI in Figure 9. Figure 12 is a top view illustrating the internal structure of the light-emitting device according to an embodiment.

[0025] The light-emitting device 1 comprises multiple components. These multiple components include a package 10, one or more light-emitting elements 20, one or more submounts 30, one or more reflective members 40, multiple wirings 60, and an optical member 70.

[0026] Furthermore, the light-emitting device 1 may have other components. For example, the light-emitting device 1 may have additional light-emitting elements in addition to the one or more light-emitting elements 20. Also, the light-emitting device 1 may not have some of the components listed here.

[0027] The components of the light-emitting device 1 will now be described.

[0028] (Package 10) Package 10 comprises a base 11 and a lid 14. Package 10 is formed by joining the lid 14 to the base 11. Within package 10, an internal space is defined where other components are arranged. This internal space is a closed space surrounded by the base 11 and the lid 14. Furthermore, this internal space can be a space sealed in a vacuum or airtight state.

[0029] In a top view, the outer edge shape of package 10 is rectangular. This rectangle can have a long side and a short side. In the illustrated package 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of package 10 does not have to be rectangular in a top view.

[0030] In package 10, an internal space is formed where other components are arranged. The first upper surface 11A of package 10 is part of the region that defines the internal space. In addition, each inner surface 11E and the lower surface 14B of package 10 are part of the region that defines the internal space.

[0031] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0032] In a top view, the outer edge shape of the base 11 is rectangular. In a top view, the outer edge shape of the base 11 is the same as the outer edge shape of the package 10. In a top view, the outer edge shape of the first top surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first top surface 11A is parallel to the direction of the long side of the outer edge shape of the base 11. Note that in a top view, the outer edge shape of the first top surface 11A does not have to be rectangular.

[0033] In a top view, the first top surface 11A is surrounded by the second top surface 11C. The second top surface 11C is an annular surface that surrounds the first top surface 11A in a top view. The second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second top surface 11C is called the inner frame of the second top surface 11C, and the frame defined by the outer edge of the second top surface 11C is called the outer frame of the second top surface 11C.

[0034] The base 11 has a recess surrounded by a frame formed by the second upper surface 11C. The recess defines a portion of the base 11 that is recessed below the second upper surface 11C. The first upper surface 11A is part of the recess. One or more inner surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0035] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, each stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0036] Each of the stepped portions 11F is located inside the inner frame of the second upper surface 11C when viewed from above. Each of the stepped portions 11F is formed along part or all of the inner surface 11E when viewed from above. In the base body 11, the side surface 11H is an inner surface, but side surface 11H and inner surface 11E are different surfaces. Each of the inner surfaces 11E and each of the side surfaces 11H are perpendicular to the first upper surface 11A. Perpendicularity here allows for a difference of ±3 degrees.

[0037] One or more stepped sections 11F may include a first stepped section 11F1 and a second stepped section 11F2. The first stepped section 11F1 and the second stepped section 11F2 are provided at positions where their respective side surfaces 11H face each other. The first stepped section 11F1 and the second stepped section 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0038] One or more inner surfaces 11E may include a first inner surface 11E1 and a second inner surface 11E2 that face each other. The first upper surface 11A is provided between the first inner surface 11E1 and the second inner surface 11E2 in a top view. The first stepped portion 11F1 is provided on the side of the first inner surface 11E1. The second stepped portion 11F2 is provided on the side of the second inner surface 11E2.

[0039] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be made of different materials. The base 11 may be composed of a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0040] The base portion 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0041] The lower surface of the base portion 11M constitutes part or all of the area of ​​the lower surface 11B of the base body 11. If the lower surface of the base portion 11M constitutes part of the area of ​​the lower surface 11B of the base body 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base body 11.

[0042] The base body 11 has a plurality of wiring sections 12A. The plurality of wiring sections 12A include one or more first wiring sections 12A1 arranged in the internal space of the package 10 and one or more second wiring sections 12A2 provided on the outer surface of the package 10.

[0043] One or each of the first wiring sections 12A1 is provided on the upper surface 11G of the stepped section 11F. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the first stepped section 11F1. The base body 11 has one or more first wiring sections 12A1 provided on the upper surface 11G of the second stepped section 11F2.

[0044] One or each of the second wiring sections 12A2 is provided on the lower surface 11B of the package 10. One or each of the second wiring sections 12A2 is provided on the lower surface of the frame section 11N. The second wiring section 12A2 may be provided on an outer surface different from the lower surface 11B of the package 10.

[0045] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the first stepped portion 11F1 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the first stepped portion 11F1, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0046] When viewed from above, the base body 11 is divided into two regions by a virtual line passing through the side surface 11H of the second stepped portion 11F2 and parallel to this side surface 11H. In the region that includes the upper surface 11G of the second stepped portion 11F2, the base body 11 has one or more second wiring portions 12A2 provided on the lower surface 11B of the base body 11.

[0047] In the base 11, one or each of the first wiring sections 12A1 are electrically connected to a second wiring section 12A2. One or more first wiring sections 12A1 are electrically connected to different second wiring sections 12A2.

[0048] The base body 11 has a joining pattern 13A. The joining pattern 13A is provided on the second upper surface 11C. The joining pattern 13A is provided in an annular shape. The joining pattern 13A is provided in a rectangular annular shape. In a top view, the first upper surface 11A is surrounded by the joining pattern 13A.

[0049] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material for the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0050] Here, the main material refers to the material that accounts for the largest proportion in mass or volume of the object being considered. Furthermore, if the object is formed from a single material, that material is the main material. In other words, for a material to be the main material includes the possibility of that material accounting for 100% of the total.

[0051] The base body 11 may be formed using a base member and a frame member formed using different main materials. The base member can be formed using, for example, a metal or a composite containing a metal, graphite, diamond, or other material with excellent heat dissipation properties as the main material. Examples of metals that can be used as the main material of the base member include copper, aluminum, or iron. Examples of composites containing a metal that can be used as the main material of the base member include copper molybdenum or copper tungsten. The frame member can be formed using, for example, a ceramic as the main material, as mentioned above as the main material of the base body 11.

[0052] The wiring section 12A can be formed, for example, using a metal material as the main material. Examples of the metal material that serves as the main material for the wiring section 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring section 12A can be composed of, for example, one or more metal layers.

[0053] The bonding pattern 13A can be formed, for example, using a metallic material as the main material. Examples of metallic materials that can be used as the main material for the bonding pattern 13A include elemental metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 13A can be composed of, for example, one or more metallic layers.

[0054] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is constructed in the shape of a rectangular parallelepiped. However, the shape of the lid 14 does not have to be a rectangular parallelepiped.

[0055] The lid 14 is joined to the base 11. The lower surface 14B of the lid 14 is joined to the second upper surface 11C of the base 11. The lid 14 is joined to the joining pattern 13A of the base 11. The lid 14 is joined to the base 11 via adhesive.

[0056] The lid 14 is translucent, meaning it transmits light. Here, translucency means that the transmittance of light incident on the lid 14 is 80% or more. The lid 14 may also have a non-translucent region (a region that does not transmit light) in part.

[0057] The lid 14 can be formed, for example, using glass as the main material. The lid 14 can also be formed, for example, using sapphire as the main material.

[0058] (Light-emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has a long side and a short side. The external shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has a long side and a short side. However, the shape of the upper surface 21A and the external shape of the light-emitting element 20 when viewed from above are not limited to these.

[0059] The light-emitting element 20 has a light-emitting surface 22 that emits light. For example, a side surface 21C can be the light-emitting surface 22. The side surface 21C that becomes the light-emitting surface 22 intersects with the short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0060] For example, the light-emitting element 20 may be a light-emitting element that emits blue light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits green light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits red light. In addition, the light-emitting element 20 may be a light-emitting element that emits light of other colors or wavelengths.

[0061] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0062] Examples of light-emitting elements 20 that emit blue light or green light include light-emitting elements containing nitride semiconductors. Examples of nitride semiconductors include GaN-based semiconductors such as GaN, InGaN, and AlGaN. Examples of light-emitting elements 20 that emit red light include light-emitting elements containing InAlGaP-based, GaInP-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0063] The light-emitting element 20 can be, for example, a semiconductor laser element. Furthermore, the light-emitting element 20 can be a single-emitter semiconductor laser element consisting of one emitter. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element consisting of multiple emitters. Note that the light-emitting element 20 is not limited to a semiconductor laser element; it may also be a light-emitting diode or the like.

[0064] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20.

[0065] A semiconductor laser element emits directional laser light. Divergent light with a broad spread is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 22. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface of the semiconductor laser element.

[0066] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the FFP's light intensity distribution, is referred to as light traveling along the optical axis, or light passing through the optical axis. Furthermore, in the FFP's light intensity distribution, 1 / e is applied to the peak intensity value. 2 Light with the above intensity will be referred to as the main part of the light.

[0067] The shape of the FFP (Fiber Focused Plane) of the light emitted from the semiconductor laser element is an ellipse, with the stacking direction being longer than the direction perpendicular to the stacking direction, in a plane parallel to the light emission surface 22. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Furthermore, the major axis direction of the elliptical shape of the FFP can be called the speed axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction of the semiconductor laser element.

[0068] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light of a certain intensity spreads is defined as the divergence angle of the semiconductor laser element. Here, the divergence angle is calculated by dividing the light of peak intensity (light passing through the optical axis) by 1 / e of the peak intensity. 2 The angle of light divergence is expressed as the angle formed by light of intensity 1 / e of the peak light intensity. 2 In addition to the light intensity, it can also be determined from, for example, the light intensity at half the peak light intensity. In this specification, when we simply refer to the "angle of light divergence," we mean 1 / e of the peak light intensity. 2 This refers to the angle of light divergence at a given light intensity.

[0069] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered the mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A may have a short side and a long side. However, the shape of the upper surface 31A does not have to be rectangular.

[0070] The external shape of the submount 30 in a top view is rectangular. This rectangle of the submount 30 may have a short side and a long side. However, the external shape of the submount 30 in a top view does not have to be rectangular. In a top view, the submount 30 may have an external shape in which the length in one direction (hereinafter referred to as the short side direction of the submount 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same direction as the X direction, and the long side direction is the same direction as the Y direction.

[0071] For example, the length of the submount 30 in the short side direction is 500 μm or more and 1000 μm or less. Also, the length of the submount 30 in the long side direction is 1500 μm or more and 2500 μm or less. Furthermore, the difference between the length in the long side direction and the length in the short side direction of the submount 30 is 500 μm or more and 1000 μm or less.

[0072] (Reflective member 40) The reflective member 40 has a lower surface 41A and a light-reflecting surface 41B that reflects light. The light-reflecting surface 41B is inclined with respect to the lower surface 41A. The straight line connecting the lower end and upper end of the light-reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined with respect to the lower surface 41A is called the inclination angle of the light-reflecting surface 41B.

[0073] The light-reflecting surface 41B is flat. However, the light-reflecting surface 41B may be curved. The inclination angle of the light-reflecting surface 41B is 45 degrees. However, the inclination angle of the light-reflecting surface 41B does not have to be 45 degrees.

[0074] The main material of the reflective member 40 can be glass or metal. It is preferable to use a heat-resistant material as the main material of the reflective member 40. For example, the main material can be glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 can also be formed using Si as the main material.

[0075] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B with the main material, the general shape of the reflective member 40 may be formed with the main material, and the light-reflecting surface 41B may be formed on the surface of the general shape. In this case, the light-reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0076] The light-reflecting surface 41B has a reflectance of 90% or more with respect to the peak wavelength of light irradiated onto it. This reflectance may also be 95% or more. Furthermore, this reflectance may be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0077] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become connection points with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. The metal can be, for example, gold, aluminum, silver, copper, etc.

[0078] (Optical component 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical member 70 imparts an optical effect to light incident on it. The optical effects imparted to light by the optical member 70 include, for example, focusing, collimation, diffusion, polarization, diffraction, multiplexing, light guiding, reflection, and wavelength conversion.

[0079] The optical member 70 has an optical surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optical surface. Alternatively, the optical surface may be located at a position different from the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical surface may be formed inside the optical member 70 rather than on its surface.

[0080] The optical component 70 may have one or more lens surfaces 71D. The lens surface 71D is the optical working surface of the optical component 70. The optical component 70 having a lens surface 71D may also be called a lens component. Light that passes through the lens surface 71D and is emitted from the optical component 70 is subjected to optical effects such as focusing, diffusion, or collimation by the optical component 70. For example, the optical component 70 is a collimating lens that emits collimated light after light incident on the optical component 70.

[0081] In a top view, the outer shape of the optical element 70 is rectangular. However, the outer shape of the optical element 70 in a top view does not have to be rectangular. The bottom surface 71B is flat. No lens surface 71D is formed on the bottom surface 71B side of the optical element 70. The shape of the bottom surface 71B is rectangular. However, the shape of the bottom surface 71B does not have to be rectangular.

[0082] The optical member 70 may have a plurality of lens surfaces 71D formed in a continuous line in one direction. In a top view, the direction in which the plurality of lens surfaces 71D are aligned is called the lens connection direction. In the illustrated optical member 70, the connection direction is the same direction as the X direction.

[0083] The multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D lie on a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that this parallelism includes a difference of ±5 degrees.

[0084] The optical component 70 is translucent. The optical component 70 has a transmittance of 80% or more for the peak wavelength of light incident on it. The optical component 70 may have a translucent region and a non-translucent region (hereinafter referred to as the non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using glass such as BK7, for example.

[0085] Next, the light-emitting device 1 will be described.

[0086] (Light-emitting device 1) In the light-emitting device 1, one or more light-emitting elements 20 are arranged on the base body 11. The one or more light-emitting elements 20 are arranged on the first upper surface 11A. The light-emitting device 1 emits light from the one or more light-emitting elements 20 to the outside.

[0087] Each light-emitting element 20 emits light in the short-side direction of the substrate 11. In the illustrated light-emitting device 1, the short-side direction of the substrate 11 is the same direction as the short-side direction of the substrate 11, but since the outer edge shape of the substrate 11 is not limited to a rectangle, it is referred to as the short-side direction. The same applies to the "long-side direction of the substrate 11".

[0088] One or more light-emitting elements 20 may consist of multiple light-emitting elements 20. One or more light-emitting elements 20 may consist of multiple light-emitting elements 20 including one or more first light-emitting elements 20A and one or more second light-emitting elements 20B. Furthermore, the multiple light-emitting elements 20 may further include one or more third light-emitting elements 20C.

[0089] In the light-emitting device 1, one or more first light-emitting elements 20A emit light of a first color. One or more second light-emitting elements 20B emit light of a second color. One or more third light-emitting elements 20C emit light of a third color. The first color, the second color, and the third color are all different from each other.

[0090] In the example shown in Figure 12, the light-emitting device 1 includes a first light-emitting element 20A that emits red light as a first color, a second light-emitting element 20B that emits green light as a second color, and a third light-emitting element 20C that emits blue light as a third color.

[0091] Multiple light-emitting elements 20 are arranged in a line in one direction. In the illustrated light-emitting device 1, this direction is the same as the X direction. In the light-emitting device 1, the multiple light-emitting elements 20 are arranged in a line along the longitudinal direction of the substrate 11.

[0092] One or more light-emitting elements 20 are positioned between two first wiring sections 12A1 when viewed from above. These two first wiring sections 12A1 sandwich one or more light-emitting elements 20 in the longitudinal direction of the substrate 11. The direction of the slow axis of light emitted from one or each of the light-emitting elements 20 is the same as the longitudinal direction of the substrate 11.

[0093] One or more light-emitting elements 20 are arranged on one or more submounts 30. One or more light-emitting elements 20 are arranged on the substrate 11 via one or more submounts 30. One or each submount 30 has one light-emitting element 20.

[0094] In the light-emitting device 1, one or more reflective members 40 are arranged on the base body 11. The one or more reflective members 40 are arranged on the first upper surface 11A. The one or more reflective members 40 are positioned away from the one or more light-emitting elements 20 in a direction perpendicular to the light-emitting surface 22. The one or more reflective members 40 reflect the light emitted from the one or more light-emitting elements 20. The light reflected by the one or more reflective members 40 travels upward. In the FFP of the reflected light, the longitudinal direction of the base body 11 is the slow axis direction, and the short direction is the fast axis direction.

[0095] When the light-emitting device 1 is equipped with multiple light-emitting elements 20, the positions at which the optical axes of the light emitted from each light-emitting element 20 irradiate one or more reflective members 40 lie on a straight line when viewed from above. The alignment of the irradiation points of the optical axes on a straight line facilitates optical control.

[0096] In the light-emitting device 1, multiple wires 60 are used for the electrical connection of one or more light-emitting elements 20. By connecting an appropriate number of wires 60 to the package 10, the light-emitting elements 20, or the submount 30, one or more light-emitting elements 20 can be electrically connected to the package 10. This allows power to be supplied from an external power supply electrically connected to the package 10 to one or more light-emitting elements 20 arranged in the internal space of the package 10.

[0097] The wiring 60 that connects to the package 10 connects to the wiring section 12A located in the internal space of the package 10. The plurality of wirings 60 include one or more wirings 60 that connect to the first wiring section 12A1 provided on the first inner surface 11E1 side, and one or more wirings 60 that connect to the first wiring section 12A1 provided on the second inner surface 11E2 side. One or more light-emitting elements 20 are electrically connected to the first wiring section 12A1 of the substrate 11. The first inner surface 11E1 and the second inner surface 11E2 face each other in the longitudinal direction of the substrate 11.

[0098] In the light-emitting device 1, the light emitted from one or more light-emitting elements 20 is emitted from the top surface 14A of the package 10. Here, the light emitted from the light-emitting elements 20 is referred to as "light per element". One light-emitting element 20 emits light per element, and multiple light-emitting elements 20 emit light per element.

[0099] The light from the main portion of the light from one element of a particular light-emitting element 20 does not overlap with the light from the main portion of the light from any other element of any other light-emitting element 20 on the upper surface 14A. The light from each element is irradiated onto the upper surface 14A and emitted from the upper surface 14A, with the light from each main portion not overlapping with the others.

[0100] In the light-emitting device 1, the optical component 70 is fixed to the package 10. The optical component 70 is connected to the package 10. The optical component 70 is bonded to the package 10 via an adhesive. For example, an ultraviolet-curing adhesive can be used as the adhesive.

[0101] The optical element 70 is positioned above the package 10. Light emitted from the top surface 14A enters the optical element 70, is subjected to an optical effect, and then exits from the optical element 70. For example, the optical axes of the light from each element enter different lens surfaces, the light from each element is collimated, and then exits from the optical element 70.

[0102] (Wiring board 101) A wiring board 101 according to an embodiment will be described. Figure 13 is a drawing illustrating an exemplary form of the wiring board 101. Figure 13A is a diagram showing a top view of the wiring board 101 according to an embodiment with the wiring pattern superimposed. Figure 13B is the wiring pattern of the wiring board 101 according to an embodiment. Figure 13C is a top view of the wiring board 101 according to an embodiment.

[0103] The wiring board 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces 101C. The wiring board 101 has a plate-like shape. In a top view, the outer edge shape of the wiring board 101 is rectangular. This rectangle can be a rectangle with a long side and a short side.

[0104] The wiring board 101 is provided with one or more through holes 101H that serve as fixing points. The one or more through holes 101H include through holes 101H for fixing the wiring board 101 to other members (components). For example, the through holes 101H are through holes for screw fastening, and screws are fitted into the through holes 101H to fix the wiring board 101 to other members.

[0105] One or more through holes 101H include a first fixing portion 101H1 and a second fixing portion 101H2 for fixing the wiring board 101. A first screw 102A is screwed into the first fixing portion 101H1 and a second screw 102B is screwed into the second fixing portion 101H2 to fix the wiring board 101 to other components.

[0106] The wiring board 101 includes a heat dissipation section 101D, an electrode section 101E, and an insulating section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0107] The insulating portion 101F insulates the heat dissipation portion 101D from the electrode portion 101E. The insulating portion 101F is provided on the wiring board 101 to insulate the electrical connection between the heat dissipation portion 101D and the electrode portion 101E.

[0108] The upper surface 101A of the wiring board 101 has a heat dissipation section 101D, an electrode section 101E, and an insulating section 101F, with the region where the heat dissipation section 101D is located at the highest point (hereinafter referred to as the heat dissipation region of the upper surface 101A), the region where the electrode section 101E is located at the highest point (hereinafter referred to as the electrode region of the upper surface 101A), and the region where the insulating section 101F is located at the highest point (hereinafter referred to as the insulating region of the upper surface 101A). On the upper surface 101A, the heat dissipation region and the electrode region are separated by the insulating region.

[0109] The wiring board 101 comprises a heat dissipation member 111, a plurality of electrode members 121, and an insulating member 131. The heat dissipation section 101D includes the heat dissipation member 111, the electrode section 101E includes the plurality of electrode members 121, and the insulating section 101F includes the insulating member 131.

[0110] The wiring board 101 has a mounting surface that includes a first region 1A. The upper surface 101A of the wiring board 101 can be a mounting surface. The heat dissipation region and the electrode region are exposed from the insulating member 131 provided on the mounting surface. The first region 1A includes an electrode region. The first region 1A also includes a heat dissipation region. The first region 1A also includes an insulating region.

[0111] Of the electrode portion 101E, the portion that overlaps with the electrode region included in the first region 1A when viewed from above (a plan view taken from a direction perpendicular to the mounting surface) is called the first electrode portion 103A. Furthermore, of the electrode portion 101E, the portion that is electrically connected to the first electrode portion 103A and overlaps with the electrode region provided outside the first region 1A is called the second electrode portion 103B.

[0112] The multiple electrode members 121 include electrode members 121 having a first electrode portion 103A and a second electrode portion 103B. In other words, a part of one electrode member 121 may become the first electrode portion 103A, and another part may become the second electrode portion 103B.

[0113] The first electrode section 103A has two or more electrode members 121. Each electrode member 121 is partially included in the first electrode section 103A. The electrode region included in the first electrode section 103A can be divided into a plurality of first electrode regions 103A1 arranged in a unidirectional direction. The first electrode section 103A has a plurality of first electrode regions 103A1 that are not electrically connected to each other. In the illustrated wiring board 101, the plurality of first electrode regions 103A1 are arranged in the Y direction.

[0114] The second electrode section 103B has two or more electrode members 121. Each electrode member 121 is partially included in the second electrode section 103B. The electrode region included in the second electrode section 103B can be divided into a plurality of second electrode regions 103B1. The second electrode section 103B has a plurality of second electrode regions 103B1 that are not electrically connected to each other.

[0115] The width W1 at both ends of the first electrode portion 103A in the direction in which multiple first electrode regions 103A1 are aligned is greater than the width W2 at both ends of the second electrode portion 103B in the same direction. The width W1 at both ends of the first electrode portion 103A is the width W1 at the outermost ends of the two first electrode regions 103A1 located on both sides in the same direction. The width W2 at both ends of the second electrode portion 103B is the width W2 at the outermost ends of the two second electrode regions 103B1 located on both sides in the same direction.

[0116] The wiring board 101 may further have a junction 101J. The junction 101J is included in the first region 1A when viewed from above. The heat dissipation region is located between the junction 101J and the first electrode portion 103A when viewed from above. The junction 101J is located away from the first electrode portion 103A in the direction of the long side of the wiring board 101. When viewed from above, a virtual straight line L1 parallel to this direction of the long side passes through the junction 101J, the heat dissipation region, and the first electrode portion 103A. When viewed from above, the junction 101J has the same shape as the first electrode portion 103A. The junction 101J is not electrically connected to the electrode portion 101E.

[0117] In a top view, a virtual line L2 passing through both ends of the heat dissipation area in the short-side direction of the wiring board 101 does not pass through the electrode area. In a top view, the first electrode portion 103A and the junction portion 101J are positioned so that this virtual line L2 does not pass through them. In a top view, the electrode portion 101E is positioned so that this virtual line L2 does not pass through it. This makes it possible to reduce the width of the wiring board 101 in the short-side direction.

[0118] In a top view, the top surface 101A of the wiring board 101 is divided into three regions: a first end region, a second end region, and a central region sandwiched between the first and second end regions. This is done by a virtual straight line L3 passing through one end of the heat dissipation region in the long-side direction of the wiring board 101 and parallel to the short-side direction, and a virtual straight line L4 passing through the other end and parallel to the short-side direction. In this case, none of the electrode members 121 on the wiring board 101 pass through the central region and connect from the first end region to the second end region. This makes it possible to reduce the width of the wiring board 101 in the short-side direction.

[0119] In a top view, with respect to the long side direction of the wiring board 101, the midpoint M1 of the width of the heat dissipation region is located on the joint portion 101J side, relative to the midpoint M2 of the width of the top surface 101A. Here, the joint portion 101J side refers to the direction from the heat dissipation region toward the joint portion 101J, while the direction from the heat dissipation region toward the first electrode portion 103A is referred to as the first electrode portion 103A side. Both the joint portion 101J side and the first electrode portion 103A side can be parallel to the long side direction of the wiring board 101.

[0120] In a top view, the second electrode portion 103B is located on the side of the first electrode portion 103A relative to the midpoint M2. In a top view, the first electrode portion 103A is provided between the junction portion 101J and the second electrode portion 103B.

[0121] In the wiring board 101, in a top view, the first region 1A is located between the first fixing portion 101H1 and the second fixing portion 101H2. In a top view, the second fixing portion 101H2 is located between the first electrode portion 103A and the second electrode portion 103B. In a top view, the heat dissipation region is located between the first fixing portion 101H1 and the first electrode portion 103A. In a top view, the junction portion 101J is located between the first fixing portion 101H1 and the heat dissipation region.

[0122] In a top view, the first fixing part 101H1, the first region 1A, the second fixing part 101H2, and the second electrode part 103B are arranged in order along the long side of the wiring board 101. In a top view, a virtual straight line L parallel to the first direction X passes through the light-emitting device 1, the first fixing part 101H1, the second fixing part 101H2, and the second electrode part 103B. In a top view, the virtual straight line L may be a straight line passing through the midpoint of the width of the wiring board 101 in the short side direction.

[0123] A first fixing part 101H1 is provided at a predetermined distance from the midpoint M1 in the direction of the longer side, and a second fixing part 101H2 is provided at a position at the same distance from the midpoint M1 in the opposite direction. Here, "direction of the longer side" refers to the negative X direction in the illustrated light-emitting module 901, and "opposite direction" refers to the positive X direction in the illustrated light-emitting module 901.

[0124] With respect to the long side direction of the wiring board 101, the width of the wiring board 101 is 1.4 times or more and 3 times or less the distance from the first fixing part 101H1 to the second fixing part 101H2. Setting it to 1.4 times or more makes it easier to secure the area for providing the second electrode part 103B, and setting it to less than 3 times makes it possible to suppress the width of the wiring board 101 in the long side direction.

[0125] When viewed from above, if the top surface 101A is divided into two regions by an imaginary straight line passing through the midpoint M2 and parallel to the short side direction of the wiring board 101, a first fixing part 101H1 is provided in one region, and a second fixing part 101H2 is provided in the other region. The first fixing part 101H1 is located on the joint part 101J side of the midpoint M2, and the second fixing part 101H2 is located on the first electrode part 103A side of the midpoint M2. By providing the first fixing part 101H1 and the second fixing part 101H2 in this way, the width of the wiring board 101 in the long side direction can be reduced.

[0126] The heat dissipation member 111 can use a metallic material as its main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the heat dissipation member 111. It is preferable that the heat dissipation member 111 be formed from a material with excellent heat dissipation properties. The heat dissipation member 111 may be formed containing 95% by mass or more of copper.

[0127] The electrode member 121 can use a metallic material as its main material. For example, elemental metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the electrode member 121.

[0128] The insulating member 131 is formed of an insulating material. For example, polyimide can be used as the main material of the insulating member 131. Alternatively, the main material of the insulating member 131 can be glass epoxy, which is obtained by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and curing the thermosetting insulating resin, or liquid crystal polymer. Furthermore, a resist such as solder resist can be used in the insulating member.

[0129] (Connector 201) Connector 201 is an example of a connecting component that assists in electrical connections. By using connector 201, electrical connections can be made by inserting wiring terminals into connector 201.

[0130] The illustrated connector 201 has an insertion slot for the wiring terminals facing upwards. The terminals connected to the insertion slot extend in a planar direction, with the lower side serving as the bonding surface for connecting the terminals to other components. Note that the insertion slot may also face a side instead of upwards.

[0131] In a top view, the connector 201 has an external shape in which the width in one direction is greater than the width in the direction perpendicular to that direction. Here, "one direction" is the longitudinal direction of the connector 201, and "the other direction" is the short direction of the connector 201. In the illustrated connector 201, the short direction is the same direction as the X direction, and the longitudinal direction is the same direction as the Y direction.

[0132] (Thermistor 301) Thermistor 301 can be used as a temperature measuring element. Thermistor 301 is an example of a temperature measuring element.

[0133] Next, we will describe the light-emitting module 901.

[0134] (Light-emitting module 901) In the light-emitting module 901, the light-emitting device 1 is mounted on the wiring board 101. The light-emitting device 1 is mounted in the first region 1A of the wiring board 101. The light-emitting device 1 is mounted on the wiring board 101 such that the longitudinal direction of the base body 11 of the light-emitting device 1 is the same as the longitudinal direction of the wiring board 101. This reduces the width of the wiring board 101 in the short-side direction, contributing to the miniaturization of the light-emitting module 901. In the light-emitting module 901 shown in the diagram, the longitudinal direction of the wiring board 101 is the same as the long-side direction, and the short-side direction is the same as the short-side direction.

[0135] Here, the longitudinal direction of the wiring board 101 is defined as the first direction, and the short direction of the wiring board 101 is defined as the second direction. The longitudinal direction of the base body 11 is the first direction, and the short direction of the base body 11 can be the second direction. In the illustrated light-emitting module 901, the first direction is the same direction as the X direction, and the second direction is the same direction as the Y direction.

[0136] The substrate 11 of the light-emitting device 1 is bonded to the first electrode portion 103A of the wiring board 101. The first electrode portion 103A is electrically connected to the substrate 11 of the light-emitting device 1 and is electrically connected to one or more light-emitting elements 20.

[0137] The first electrode portion 103A is connected to the second wiring portion 12A2 of the base body 11. The first electrode portion 103A is also connected to the second wiring portion 12A2 provided on the first inner surface 11E1 side of the base body 11.

[0138] The first electrode portion 103A is a first wiring portion 12A1 that is electrically connected to the light-emitting element 20, and is joined to a second wiring portion 12A2 that is electrically connected to the first wiring portion 12A1 provided on the first inner surface 11E1 side, and is also a first wiring portion 12A1 that is electrically connected to the light-emitting element 20, and is joined to a second wiring portion 12A2 that is electrically connected to the first wiring portion 12A1 provided on the second inner surface 11E2 side. Each of the multiple first electrode regions 103A1 is joined to a different second wiring portion 12A2.

[0139] The base body 11 of the light-emitting device 1 is joined to the joint 101J of the wiring board 101. The joint 101J is joined to the second wiring section 12A2 of the base body 11. The joint 101J is also joined to the second wiring section 12A2 provided on the second inner surface 11E2 side of the base body 11. The joint 101J may be joined to a joint that replaces the second wiring section 12A2. In other words, the part of the base body 11 that is joined to the joint 101J does not have to be the part that is electrically connected to the first wiring section 12A1.

[0140] The first electrode portion 103A forms a current path for supplying power to one or more light-emitting elements 20. The junction portion 101J is not directly involved in the formation of the current path for supplying power to one or more light-emitting elements 20. In other words, the light-emitting device 1 can receive power from an external source even if it is not electrically connected to the junction portion 101J, as long as it is electrically connected to the first electrode portion 103A. This contributes to miniaturization of the wiring board 101.

[0141] The multiple first electrode regions 103A1 include two first electrode regions 103A1 that form a current path for supplying power to one or more first light-emitting elements 20A. Furthermore, the multiple first electrode regions 103A1 also include two first electrode regions 103A1 that form a current path for supplying power to one or more second light-emitting elements 20B. Note that one of the two electrodes on each of the first light-emitting elements 20A and 20B may be electrically connected to the same first electrode region 103A1. In this case, power can be supplied to the first light-emitting elements 20A and 20B by three first electrode regions 103A1.

[0142] The multiple first electrode regions 103A1 include two first electrode regions 103A1 that form a current path for supplying power to one or more third light-emitting elements 20C. One of the two electrodes of each of the first light-emitting element 20A, second light-emitting element 20B, and third light-emitting element 20C may be electrically connected to the same first electrode region 103A1. In this case, power can be supplied to the first light-emitting element 20A, second light-emitting element 20B, and third light-emitting element 20C by four first electrode regions 103A1.

[0143] The base 11 of the light-emitting device 1 is joined to the heat dissipation region of the wiring board 101. The heat dissipation region of the wiring board 101 is joined to the base portion 11M of the base 11, and the first electrode portion 103A and the joining portion 101J are joined to the frame portion 11N. By joining the base portion 11M to the heat dissipation region, heat emitted from one or more light-emitting elements 20 arranged on the first upper surface 11A can be dissipated.

[0144] In a top view, a first fixing part 101H1 is provided at a predetermined distance from the light-emitting device 1 in the longitudinal direction of the wiring board 101, and a second fixing part 101H2 is provided at the same distance away from the light-emitting device 1 in the opposite direction. By aligning the distances from the light-emitting device 1, for example, the heat dissipation effect of the light-emitting device 1 when the wiring board 101 is fixed to a heat sink can be improved.

[0145] In the light-emitting module 901, the connector 201 is mounted on the wiring board 101. The connector 201 is joined to the second electrode portion 103B. This electrically connects the connector 201 to the light-emitting device 1. The connector 201 is electrically connected to an external power supply and is used to supply power from the external power supply to the light-emitting device 1. The connector 201 can be described as a connecting member that electrically connects one or more light-emitting elements 20 to the outside.

[0146] In the light-emitting module 901, the connector 201 is mounted on the wiring board 101 such that, when viewed from above, the longitudinal direction of the connector 201 is the second direction and the short direction of the connector 201 is the first direction. The width of the connector 201 in the longitudinal direction is smaller than the width of the light-emitting device 1 in the short direction. Therefore, even when the connector 201 is mounted on the wiring board 101 in this way, the width of the wiring board 101 in the short direction does not increase, while the width in the longitudinal direction can be reduced.

[0147] In the light-emitting module 901, with respect to the second direction, the width of the wiring board 101 is greater than 100% of the width of the light-emitting device 1, but less than or equal to 150%. When multiple light-emitting modules 901 are arranged in a row in the second direction, the spacing between each light-emitting device 1 in the second direction can be shortened. In addition, advantages such as easier individual drive control due to the separation into units of light-emitting modules 901, and easier adjustment of the number of light-emitting devices 1 installed can be expected.

[0148] In a top view, a second fixing part 101H2 is provided between the light-emitting device 1 and the connector 201. For example, when wiring extends from a wiring terminal inserted into the insertion port of the connector 201 to an external power supply, it is conceivable to extend the wiring from the connector 201 toward the first electrode part 103A (positive X direction in the figure). However, since the second fixing part 101H2 is positioned toward the joint part 101J (negative X direction in the figure) from the connector 201, the risk of contact between the screw fixed to the second fixing part 101H2 and the wiring is improved. In this way, a light-emitting module 901 can be realized that takes into consideration ease of mounting when, for example, wiring is mounted on the light-emitting module 901.

[0149] In the light-emitting module 901, the thermistor 301 is mounted on the wiring board 101. The thermistor 301 is mounted on the upper surface 101A of the wiring board 101. The thermistor 301 is joined to the electrode portion 101E. The electrode portion 101E to which the thermistor 301 is joined is electrically connected to the second electrode portion 103B. The multiple electrode members 121 include electrode members 121 to which the thermistor 301 and connector 201 are joined.

[0150] In the light-emitting module 901, the thermistor 301 can be used to measure the temperature of the light-emitting device 1. The thermistor 301 can also be used to understand the temperature environment of the light-emitting element 20 provided by the light-emitting device 1. The "temperature environment of the light-emitting element 20" is not limited to the exact temperature of the light-emitting element 20, but may also refer to the state of the light-emitting element 20, such as whether its temperature has risen compared to when it is not operating, or by how much the temperature has risen.

[0151] In a top view, the thermistor 301 is positioned between the second fixed portion 101H2 and the second electrode portion 103B. In a top view, the second fixed portion 101H2 is provided between the thermistor 301 and the light-emitting device 1. When used to measure the temperature of the light-emitting device 1, it is desirable to position the thermistor 301 as close to the light-emitting device 1 as possible. However, since the electrode portion 101E that connects to the thermistor 301 is connected to the second electrode portion 103B, arranging the thermistor 301 in this way reduces the width of the wiring board 101 in the short-side direction, contributing to the miniaturization of the light-emitting module 901.

[0152] When viewed from above, the distance from the thermistor 301 to the light-emitting device 1 is preferably 10 mm or less. By keeping this distance to 10 mm or less, the thermistor 301 can be positioned so as not to interfere with understanding the temperature environment of the light-emitting device 1 or the light-emitting element 20. Note that this distance is greater than the width of the second fixing portion 101H2 in the first direction.

[0153] In the light-emitting module 901, the first fixing part 101H1, the light-emitting device 1, the second fixing part 101H2, and the connector 201 are provided or positioned at a location through which a virtual straight line L passes when viewed from above. The thermistor 301 is also positioned at a location through which the virtual straight line L passes when viewed from above.

[0154] (Other embodiments) Next, a light-emitting module 901 of another embodiment will be described. Figure 14 is a perspective view of a light-emitting module 901 according to another embodiment. Figure 15A is a diagram showing a top view of the wiring board 101 according to another embodiment with the wiring pattern superimposed. Figure 15B is a top view of the wiring board 101 according to another embodiment. Figure 15C is a diagram showing the wiring pattern of the wiring board 101 according to another embodiment. Hereinafter, the light-emitting module 901 of the other embodiment will be referred to as the second light-emitting module for convenience.

[0155] The second light-emitting module comprises a light-emitting device 1 and a wiring board 101. The second light-emitting module does not include a connector or a thermistor. However, the second light-emitting module is not prohibited from including a connector and a thermistor. Furthermore, the second light-emitting module may be equipped with wiring such as wires as connecting members instead of connectors. Other configurations may be the same as those of the embodiment shown in Figure 1.

[0156] The second light-emitting module does not include a thermistor, which allows for a reduction in the longitudinal width of the wiring board 101. In the second light-emitting module as well, the presence of a second fixing portion 101H2 between the first electrode portion 103A to which the light-emitting device 1 is joined and the second electrode portion 103B to which the wire as a connecting member is joined improves the aforementioned contact risk. This makes it possible to realize a light-emitting module 901 that takes into consideration ease of mounting, for example, when mounting a connecting member on the wiring board 101.

[0157] Although various embodiments of the present invention have been described above, the light-emitting module 901 according to the present invention is not strictly limited to the light-emitting device 1 of each embodiment. In other words, the present invention is not limited to the external form and structure of the light-emitting module 901 disclosed in each embodiment. The present invention can be applied without requiring all components to be present. For example, if some of the components of the light-emitting module 901 disclosed in the embodiment are not described in the claims, a degree of design freedom for those skilled in the art is permitted, such as substitution, omission, modification of shape, or change of material for those components, and the invention described in the claims is then specified to be applicable.

[0158] Through the information described herein so far, the following technical matters are disclosed: (Section 1) A light-emitting device having one or more light-emitting elements and a substrate on which the one or more light-emitting elements are arranged, A wiring board having a mounting surface including a first region on which the light-emitting device is mounted, Equipped with, The aforementioned wiring board is A first fixing part and a second fixing part for fixing the aforementioned wiring board, The substrate is joined to a first electrode portion which is electrically connected to the one or more light-emitting elements, A second electrode portion is electrically connected to the first electrode portion, and a connecting member is joined to electrically connect the light-emitting device to the outside, It has, In a top view taken from a direction perpendicular to the mounting surface, the first region is located between the first fixing portion and the second fixing portion, and the second fixing portion is located between the first electrode portion and the second electrode portion. Light-emitting module. (Section 2) The connecting member further comprises, The aforementioned connecting member is a connector. The light-emitting module described in item 1. (Section 3) In the above view, the substrate has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The connecting member, when viewed from above, has the first direction as the short direction and the second direction as the long direction. The light-emitting module described in item 2. (Section 4) In the above-viewed view, the wiring board has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The one or more light-emitting elements are composed of a plurality of semiconductor laser elements. In the above view, the substrate has the first direction as the longitudinal direction and the second direction as the short direction. The plurality of semiconductor laser elements are arranged along the longitudinal direction of the substrate. The light-emitting module described in item 1. (Section 5) In the above top view, a virtual straight line parallel to the first direction passes through the light-emitting device, the first fixing part, the second fixing part, and the second electrode part. Light-emitting module as described in item 3 or 4. (Section 6) The aforementioned virtual line is a line that, in the top view, passes through the midpoint of the width of the wiring board in the short direction. The light-emitting module according to claim 5. (Section 7) In the above-viewed view, the wiring board has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The aforementioned wiring board further comprises an insulating member provided on the mounting surface, The first electrode portion and the second electrode portion are exposed from the insulating member, The first electrode portion has a plurality of first electrode regions that are not electrically connected to each other. The second electrode portion has a plurality of second electrode regions that are not electrically connected to each other. The width of both ends of the first electrode portion in the second direction is greater than the width of both ends of the second electrode portion in the second direction. Light-emitting modules as described in items 1-6. (Section 8) The first and second fixing parts are through holes for screw fastening. Light-emitting modules as described in items 1-4. (Section 9) It further includes a temperature measuring element for measuring temperature, The temperature measuring element is installed on the mounting surface of the wiring board, between the second fixing portion and the second electrode portion in the top view, Light-emitting modules as described in items 1-8. [Industrial applicability]

[0159] The light-emitting device 1 described in the embodiment can be used in a projector. In other words, a projector can be considered one application of the present invention. However, the present invention is not limited to this and can be used in various applications such as lighting, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of Symbols]

[0160] 1. Light-emitting device 1A 1st area 10 packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11D External surface 11E Inside surface 11th floor step section 11F1 First step section 11F2 Second step section 11G top surface 11H side 11M Base 11N frame 12A wiring section 12A1 1st wiring section 12A2 2nd wiring section 13A Joint Pattern 14 Lid 14A Top 14B Bottom 14C side 20. Semiconductor laser elements (light-emitting elements) 21A Top 21B Bottom surface 21C side 22 Light exit surface 30 Submount 31A Top 31B Bottom surface 31C side 40 Reflective material 41A Bottom 41B Light reflective surface 60 Wiring 70 Optical components (lens components) 71A Top 71B Bottom side 71C side 71D Lens surface (optical surface) 72A Lens section 72B Non-lens section 101 Wiring board 101H Through hole 101H1 1st fixed part 101H2 2nd fixed part 102A First thread 102B Second screw 103A 1st electrode part 103A1 1st electrode area 103B 2nd electrode part 103B1 2nd electrode area 131 Insulating material 201 Connector (connecting component) 301 Thermistor (Temperature Measuring Element) 901 Light-emitting module L virtual line

Claims

1. A light-emitting device having one or more light-emitting elements and a substrate on which the one or more light-emitting elements are arranged, A wiring board having a mounting surface including a first region on which the light-emitting device is mounted, Equipped with, The aforementioned wiring board is A first fixing part and a second fixing part for fixing the aforementioned wiring board, The substrate is joined to a first electrode portion which is electrically connected to the one or more light-emitting elements, A second electrode portion is electrically connected to the first electrode portion, and a connecting member is joined to electrically connect the light-emitting device to the outside, It has, In a top view taken from a direction perpendicular to the mounting surface, the first region is located between the first fixing portion and the second fixing portion, and the second fixing portion is located between the first electrode portion and the second electrode portion. Light-emitting module.

2. The connecting member further comprises, The aforementioned connecting member is a connector. The light-emitting module according to claim 1.

3. In the above view, the substrate has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The connecting member, when viewed from above, has the first direction as the short direction and the second direction as the long direction. The light-emitting module according to claim 1.

4. In the above-viewed view, the wiring board has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The one or more light-emitting elements are composed of a plurality of semiconductor laser elements. The substrate, when viewed from above, has the first direction as the longitudinal direction and the second direction as the short direction. The plurality of semiconductor laser elements are arranged along the longitudinal direction of the substrate, The light-emitting module according to claim 1.

5. In the above top view, a virtual straight line parallel to the first direction passes through the light-emitting device, the first fixing part, the second fixing part, and the second electrode part. The light-emitting module according to claim 3 or 4.

6. The aforementioned virtual line is a line that, in the top view, passes through the midpoint of the width of the wiring board in the short direction. The light-emitting module according to claim 5.

7. In the above-viewed view, the wiring board has a first direction as the longitudinal direction and a second direction perpendicular to the first direction as the short direction. The aforementioned wiring board further comprises an insulating member provided on the mounting surface, The first electrode portion and the second electrode portion are exposed from the insulating member, The first electrode portion has a plurality of first electrode regions that are not electrically connected to each other. The second electrode portion has a plurality of second electrode regions that are not electrically connected to each other. The width of both ends of the first electrode portion in the second direction is greater than the width of both ends of the second electrode portion in the second direction. The light-emitting module according to claim 1.

8. The first and second fixing parts are through holes for screw fastening. The light-emitting module according to claim 1.

9. It further includes a temperature measuring element for measuring temperature, The temperature measuring element is installed on the mounting surface of the wiring board, between the second fixing portion and the second electrode portion in the top view. The light-emitting module according to claim 1.

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