Fabric and method for manufacturing fabric

Abstract

We offer higher quality leather-like fabric. [Solution] A fabric is provided that has a pattern expressed by embossing, comprising a fabric layer and a resin film layer laminated on the fabric layer. The fabric layer and the resin film layer may be embossed. In the above fabric, the melting point of the resin film layer may be lower than the melting point of the fabric layer. A method for manufacturing the fabric is provided, comprising the steps of preparing a woven or knitted fabric layer, laminating a resin film layer on the fabric layer, and embossing the fabric layer and the resin film layer.

Description

Technical Field

[0001] The present invention relates to a fabric and a method for manufacturing the fabric.

Background Art

[0002] Patent Document 1 discloses an embossed "leather-like non-woven fabric". [Prior Art Document] [Patent Document] Patent Document 1 Japanese Patent Application Laid-Open No. 11-241277

[0003] To provide a higher-quality leather-like fabric. General Disclosure

[0004] In a first aspect of the present invention, there is provided a fabric of a woven or knitted fabric with a pattern expressed by embossing, the fabric comprising a fabric layer and a resin film layer laminated on the fabric layer. The fabric layer and the resin film layer may be embossed.

[0005] In the above fabric, the melting point of the resin film layer may be lower than the melting point of the fabric layer.

[0006] In any of the above fabrics, the melting point of the resin film layer may be 80°C or higher and 160°C or lower.

[0007] In any of the above fabrics, the film thickness of the resin film layer may be 10 μm or more and 100 μm or less.

[0008] In any of the above fabrics, the material of the resin film layer may include at least one of polyester, polyurethane, olefin resin, EVA (ethylene vinyl acetate) resin, or polyamide.

[0009] In any of the above fabrics, the resin film layer may have a first layer laminated in contact with the fabric layer and a second layer laminated in contact with the first layer.

[0010] In any of the above fabrics, the second layer may have an opening for exposing the first layer.

[0011] In any of the above fabrics, the resin film layer may be laminated on the surface side of the fabric layer.

[0012] In any of the above fabrics, the resin film layer may be laminated on the back side of the fabric layer.

[0013] In any of the above fabrics, the single yarns in the fabric layer may have a single yarn decitex of 0.05 or more and 0.7 or less.

[0014] In any of the above fabrics, the thread density of the warp threads in the fabric layer may be 200 or more and 300 or less.

[0015] In any of the above fabrics, the thickness of the fabric layer may be 0.3 mm or more and 1.5 mm or less.

[0016] In any of the above fabrics, the total thickness of the fabric layer and the resin film layer may be 0.3 mm or more and 1.5 mm or less.

[0017] In any of the above fabrics, the embossing depth of the fabric may be 50 μm or more and 400 μm or less.

[0018] In any of the above fabrics, the fabric may meet at least one evaluation criterion of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, or JIS L0842.

[0019] A second embodiment of the present invention provides a method for manufacturing fabric, comprising the steps of: preparing a woven or knitted fabric layer; laminating a resin film layer onto the fabric layer; and embossing the fabric layer and the resin film layer.

[0020] In the method for manufacturing the above-mentioned fabric, the embossing step may include placing a release paper on the upper surface of the resin film layer and embossing the fabric layer and the resin film layer from above the release paper.

[0021] In the method for manufacturing any of the above-mentioned fabrics, the embossing step may include placing a release paper on the lower surface of the resin film layer and embossing the fabric layer and the resin film layer from above the fabric layer.

[0022] In the method for manufacturing any of the above-mentioned fabrics, the film thickness of the release paper may be 30 μm or more and 100 μm or less.

[0023] In the method for manufacturing any of the above-mentioned fabrics, a step of performing a surface treatment to impart a release effect to the release paper may be provided.

[0024] In the method for manufacturing any of the above-mentioned fabrics, a step of embossing the release paper may be provided.

[0025] In the method for manufacturing any of the above-mentioned fabrics, the material of the release paper may include at least one of paper, polyethylene, polypropylene, or epoxy resin.

[0026] In the method for manufacturing any of the above-mentioned fabrics, a step of heating the resin film layer at a temperature equal to or higher than the melting point of the resin film layer may be provided.

[0027] In the method for manufacturing any of the above-mentioned fabrics, the step of heating the resin film layer may be performed after the step of laminating the resin film layer on the fabric layer and before the step of embossing the fabric layer and the resin film layer.

[0028] In the method for manufacturing any of the above-mentioned fabrics, the step of heating the resin film layer may be performed when embossing the fabric layer and the resin film layer.

[0029] Note that the above summary of the invention does not enumerate all the features of the present invention. Also, sub-combinations of these feature groups can also be inventions.

Brief Description of the Drawings

[0030] [Figure 1] It is a photograph of the surface of the fabric 100. [Figure 2A] It is a schematic diagram of the cross-section of the fabric 100 before embossing. [Figure 2B] It is a schematic diagram of the cross-section of the fabric 100 after embossing. [Figure 2C] An example of a flowchart for manufacturing the fabric 100 is shown. [Figure 3] An example of the structure of the warp yarn 10 is shown. [Figure 4] An example of the processing yarn used for the warp yarn 510 according to the comparative example is shown. [Figure 5] An example of a manufacturing method of the fabric 100 is shown. [Figure 6A] A modified example of the fabric 100 is shown. [Figure 6B] An example of a manufacturing method of the fabric 100 is shown. [Figure 7A] A modified example of the fabric 100 is shown. [Figure 7B] An example of a manufacturing method of the fabric 100 is shown.

Modes for Carrying Out the Invention

[0031] Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the claims. Also, not all combinations of features described in the embodiments are essential for the solution means of the invention.

[0032] FIG. 1 is a photograph of the surface of the fabric 100. The fabric 100 is a woven or knitted fabric provided with a pattern expressed by embossing. The fabric 100 in this example has a leather-like design realized by embossing.

[0033] Fabric 100 may be made from at least one of polyester, nylon, acrylic, linen, cotton, silk, rayon, or wool. Fabric 100 may have a texture and gloss similar to genuine leather or synthetic leather. In this example, fabric 100 can achieve a leather-like texture without providing a backing fabric such as nonwoven fabric on the back side. However, a backing fabric such as polyurethane or nonwoven fabric may be provided on the back side of fabric 100.

[0034] Fabric 100, a leather-like fabric made of polyester, can reduce its weight by more than 50% compared to fabrics made of genuine leather or polyvinyl chloride (PVC). Furthermore, unlike fabrics made of genuine leather or PVC, Fabric 100 does not become excessively hot in summer and does not become excessively cold in winter. The finish of Fabric 100 can be improved by using a steam iron. Recyclability is improved if Fabric 100 is composed solely of polyester.

[0035] Fabric 100 may be used for vehicle seat covers that require high strength, wrinkle resistance, and flame retardancy. Fabric 100 may be water-repellent and flame-retardant. Fabric 100 may meet at least one evaluation criterion of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, or JIS L0842. However, the application of fabric 100 is not particularly limited.

[0036] Figure 2A is a schematic diagram of the cross-section of the fabric 100 before embossing. The fabric 100 comprises a fabric layer 110 and a resin film layer 120.

[0037] The fabric layer 110 may be a woven fabric composed of warp and weft threads, as described later. The material of the fabric layer 110 may include at least one of polyester, nylon, acrylic, linen, cotton, silk, rayon, or wool. In this example, the material of the fabric layer 110 is polyester. The fabric layer 110 in this example does not have a lining, but it may have one. The film thickness of the fabric layer 110 may be 0.3 mm or more and 1.5 mm or less. For example, the film thickness of the fabric layer 110 is 0.8 mm.

[0038] The resin film layer 120 is laminated onto the fabric layer 110. In this example, the resin film layer 120 is provided on the surface side of the fabric layer 110, but it may also be provided on the back side of the fabric layer 110. The resin film layer 120 may be bonded to the fabric layer 110. The resin film layer 120 may be attached to the fabric layer 110 or coated onto it.

[0039] The material of the resin film layer 120 may include at least one of polyester, polyurethane, olefin resin, EVA (ethylene vinyl acetate) resin, or polyamide. The material of the resin film layer 120 may include polyester, or may be entirely polyester. In this example, the resin film layer 120 is a polyester film.

[0040] The fabric layer 110 and the resin film layer 120 may be made of the same material. Recyclability is improved by making each layer of the fabric 100 from the same material. The fabric layer 110 and the resin film layer 120 may have different compositions even if they are made of the same material. For example, the fabric layer 110 and the resin film layer 120 may be polyesters with different compositions. The fabric layer 110 and the resin film layer 120 may have different melting points due to their different compositions.

[0041] The melting point of the resin film layer 120 may be lower than that of the fabric layer 110. By heating the fabric 100 and melting the resin film layer 120, the resin film layer 120 can be bonded onto the fabric layer 110. The melting point of the resin film layer 120 may be between 80°C and 160°C. In one example, the melting point of the fabric layer 110 is 220°C, and the melting point of the resin film layer 120 is 110°C.

[0042] The thickness of the resin film layer 120 may be thinner than the thickness of the fabric layer 110. The thickness of the resin film layer 120 may be 10 μm or more and 100 μm or less.

[0043] The resin film layer 120 may be transparent or colored. By coloring the resin film layer 120, the color of the fabric 100 can be adjusted. The resin film layer 120 may be water-repellent and may be flame-retardant.

[0044] The fabric 100 can be given a glossy finish by adding a resin film layer 120, achieving a design that resembles genuine leather. The resin film layer 120 can coat the dense fibers of the fabric layer 110, thereby improving scratch resistance. The resin film layer 120 can fill the gaps between the fibers of the fabric layer 110, thereby improving the embossed texture compared to the fabric layer 110 alone.

[0045] Figure 2B is a schematic diagram of the cross-section of the fabric 100 after embossing. In this example, the fabric layer 110 and the resin film layer 120 are embossed.

[0046] The fabric layer 110 and the resin film layer 120 have irregularities formed by embossing. In this example, the fabric layer 110 and the resin film layer 120 are laminated together, and deep irregularities can be achieved by embossing both the fabric layer 110 and the resin film layer 120. The embossing depth De of the fabric 100 may be 50 μm or more and 400 μm or less. The embossing depth De may be the maximum difference between the convex and concave parts of the embossed resin film layer 120.

[0047] Here, the fabric layer 110 may have single yarns with a single yarn decitex of 0.05 or more and 0.7 or less. By making the single yarns thinner in this way, the rigidity of the single yarns is reduced, making it possible to achieve deep embossing. Furthermore, by making the single yarns thinner, it is possible to eliminate the threads and create a high-quality leather-like fabric with improved texture expression.

[0048] The total film thickness T of the fabric layer 110 and the resin film layer 120 may be the thickness between the raised portion of the embossing and the back surface of the fabric layer 110. The total film thickness T of the fabric layer 110 and the resin film layer 120 may be 0.3 mm or more and 1.5 mm or less. As described later, the fabric 100 can be made to have a larger film thickness by including shrinkable yarn to give the yarn volume.

[0049] In this example, the fabric 100 is constructed by laminating a resin film layer 120 onto a fabric layer 110 composed of woven or knitted material, and then applying an embossed finish. This allows for more stable physical properties compared to nonwoven fabrics with varying densities. As a result, a fabric 100 with uniform tensile strength and elasticity is obtained. Achieving uniform embossing results in a higher quality leather-like fabric 100.

[0050] Figure 2C shows an example flowchart for manufacturing dough 100. This flowchart is just one example of a method for manufacturing dough 100, and is not limited to this.

[0051] In step S100, a woven or knitted fabric layer 110 is prepared. A backing material such as polyurethane or nonwoven fabric may be attached to the back of the fabric layer 110. Even if a backing material is attached to the back of the fabric layer 110, the fabric layer 110 and the resin film layer 120 can be easily recycled by peeling off the backing material.

[0052] In step S120, a resin film layer 120 is laminated onto the fabric layer 110. The resin film layer 120 may be attached to the fabric layer 110 or applied to it. The resin film layer 120 may be attached to the surface of the fabric layer 110 or to the back surface.

[0053] In step S140, the fabric layer 110 and the resin film layer 120 are embossed. Embossing the fabric layer 110 and the resin film layer 120 means that irregularities are formed on both the fabric layer 110 and the resin film layer 120. In this example, the fabric layer 110 and the resin film layer 120 may be embossed while they are laminated together.

[0054] Here, the resin film layer 120 may be bonded to the fabric layer 110 by heating. The manufacturing method of the fabric 100 may include a step of heating the resin film layer 120 to a temperature above its melting point. The timing of heating the resin film layer 120 may be arbitrary. The step of heating the resin film layer 120 may be performed after the step of laminating the resin film layer 120 onto the fabric layer 110, and before the step of embossing the fabric layer 110 and the resin film layer 120. The step of heating the resin film layer 120 may be performed when embossing the fabric layer 110 and the resin film layer 120. The time when embossing the fabric layer 110 and the resin film layer 120 may be simultaneous with the embossing.

[0055] Furthermore, the process may include steps to impart functionality to the fabric 100, such as water-repellent or flame-retardant properties. Functionality may be imparted to the fabric layer 110, to the resin film layer 120, or to both the fabric layer 110 and the resin film layer 120. Different functions may be imparted to the fabric layer 110 and the resin film layer 120. For example, the fabric 100 may be given functionality such as water repellency by dipping it with a functional agent such as a water-repellent agent. The functional agent may have any desired function, such as flame retardancy. The fabric 100 may be immersed in a combination of multiple functional agents at once.

[0056] Figure 3 shows an example of the structure of the warp threads 10. In this example, the warp threads 10 have a predetermined first shrinkage yarn 11 and a second shrinkage yarn 12 that is different from the first shrinkage yarn 11. In the warp threads 10 of this example, the first shrinkage yarn 11 and the second shrinkage yarn 12 are blended together. That is, the first shrinkage yarn 11 and the second shrinkage yarn 12 are mixed together to form a single warp thread 10. The first shrinkage yarn 11 and the second shrinkage yarn 12 may have different heat shrinkage properties. In this example, the case in which the warp threads 10 include shrinkage yarns is described, but they may not include shrinkage yarns.

[0057] The warp threads 10, by containing shrinkage threads, can spread the crimp laterally and eliminate the visible threads. In this example, the warp threads 10 can be made even less visible by using different shrinkage threads, such as the first shrinkage thread 11 and the second shrinkage thread 12. The warp threads 10 may also use three or more shrinkage threads. The fabric 100 can be made thicker by adding shrinkage threads, which gives the threads more volume. Adding shrinkage threads increases the voids in the fabric 100, making it easier to press the fabric 100 with a mold and making it easier to create the unevenness of the embossed surface.

[0058] Furthermore, the surface gloss of the fabric 100 can be arbitrarily adjusted by adjusting the crimp of the first shrinkage yarn 11 and the second shrinkage yarn 12. Thus, the warp threads 10, which include any shrinkage yarn, may be selected from the viewpoint of surface gloss and embossing of the fabric 100. Similarly, multiple different shrinkage yarns may be used for the weft threads.

[0059] By increasing the thread density of the warp threads 10, the gaps in the fabric 100 are reduced, making the weft threads less visible. This results in a flatter fabric layer 110, making it easier to achieve a high-quality leather-like fabric. Thread density refers to the number of single threads per inch. The thread density of the warp threads 10 may be between 200 and 300 threads. For example, skipping five or more face threads in the weft can cause lateral shrinkage, thereby increasing the thread density of the warp threads 10.

[0060] Here, if the single yarns of the fabric layer 110 are made thinner, there is a risk of yarn breakage due to embossing. In this example, by increasing the yarn density of the warp threads 10 and increasing the total number of threads, even if the single yarns of the fabric layer 110 are made thinner, it is possible to provide a fabric layer 110 that is less prone to yarn breakage by distributing the embossing pressure. By laminating the resin film layer 120 onto the fabric layer 110, the resin film layer 120 follows the unevenness after embossing, causing the fibers to solidify together and improving resistance to damage.

[0061] Figure 4 shows an example of processed yarn used in the warp yarn 510 of the comparative example. Unlike the warp yarn 10 of the example, the warp yarn 510 does not contain multiple shrinkage yarns. In the warp yarn 510, the false twist shape of the yarn is visible, making the threads easier to identify. Therefore, when a fabric is formed using the warp yarn 510, threads may remain in the fabric.

[0062] Figure 5 shows an example of a method for manufacturing the dough 100. In this example, steps S142 to S146 for producing the dough 100 using an embossing machine 200 will be described. Steps S142 to S146 in this example are an example of step S140 in Figure 2C. The embossing machine 200 in this example includes a mold 210 and a stand 220.

[0063] The mold 210 may be a roll-shaped or plate-shaped mold having irregularities corresponding to the embossing pattern to be applied to the base material 100. The mold 210 may be heated for embossing the base material 100. The heating temperature for embossing using the mold 210 may be below the glass transition temperature of the base material layer 110. The heating temperature for embossing using the mold 210 may be above the melting point of the resin film layer 120. However, the heating temperature of the mold 210 is not limited to these.

[0064] The mold 210 may have various shapes or depths depending on the dimensions of the embossed protrusions and recesses. When using a roll-shaped mold 210, the embossing depth De may be controlled by adjusting conditions such as the temperature, pressure, and conveyor speed of the mold 210. When using a plate-shaped mold 210, the embossing depth De may be controlled by adjusting conditions such as the temperature, pressure, and holding time during processing of the mold 210.

[0065] The support frame 220 supports the fabric 100 during embossing. The support frame 220 may have a low-density material that is lower in density than the fabric 100. The low-density material of the support frame 220 may be polyurethane. The support frame 220 may have a material of higher density than the low-density material below the low-density material.

[0066] In step S142, the release paper 300 is placed on the resin film layer 120. In this example, the release paper 300 is placed between the mold 210 and the resin film layer 120. The release paper 300 may be placed between the mold 210 and the resin film layer 120 while adhered to the resin film layer 120, or it may be placed between the mold 210 and the resin film layer 120 without being adhered to the resin film layer 120.

[0067] The release paper 300 prevents the resin film layer 120 from adhering to the embossing machine 200. In this example, the release paper 300 is the same size as the fabric 100, but it may be larger than the fabric 100. The material of the release paper 300 may include at least one of paper, polyethylene, polypropylene, or epoxy resin. The film thickness of the release paper 300 should be such that it does not interfere with the embossing of the fabric 100. The film thickness of the release paper 300 may be 30 μm or more and 100 μm or less.

[0068] The resin film layer 120 may be attached to the fabric layer 110 before embossing. The resin film layer 120 may be attached to the fabric layer 110 with the release paper 300 attached. The resin film layer 120 may be attached to the fabric layer 110 using a laminating machine. The resin film layer 120 may be applied to the fabric layer 110.

[0069] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the release paper 300. That is, the fabric 100 is embossed with the release paper 300 sandwiched between the fabric 100 and the mold 210. The fabric 100 may be embossed with the stand 220 placed below the fabric 100. The embossing machine 200 may heat the fabric 100 using the mold 210. Here, surface heating refers to heating a wider surface area, rather than applying high frequency to the fabric to process only a part of it, as in a high-frequency welder. The resin film layer 120 may be bonded to the fabric layer 110 by the heating during embossing.

[0070] In step S146, the embossed fabric 100 is removed from the embossing machine 200. By peeling the release paper 300 off the fabric 100, the embossed fabric 100 is obtained. The resin film layer 120 is separated from the release paper 300 and can maintain the embossed shape that follows the fabric layer 110. By using the release paper 300, it is possible to prevent the resin film layer 120 from adhering to the mold 210. In this way, by devising the embossing method, a high-quality leather-like texture fabric 100 with improved relief expression can be obtained.

[0071] The manufacturing method for the dough 100 may include a step of performing a surface treatment on the release paper 300 to provide a release effect. For example, a material that provides a release effect, such as silicone, may be applied to the release paper 300. The surface treatment of the release paper 300 may be performed before placing the release paper 300 on the dough 100, or after placing the release paper 300 on the dough 100.

[0072] The manufacturing method for the fabric 100 may include a step of applying a textured finish to the release paper 300. By applying a textured finish to the release paper 300, scratches can be made on the surface of the resin film layer 120, causing diffuse reflection and reducing the glossiness. The glossiness of the fabric 100 can be adjusted by adjusting the degree of texture on the resin film layer 120.

[0073] Figure 6A shows a modified example of fabric 100. Fabric 100 in this example differs from fabric 100 in Figure 2B in that the resin film layer 120 is attached to the back side of the fabric layer 110. In this example, the differences from fabric 100 in Figure 2B will be explained in particular.

[0074] The resin film layer 120 is laminated on the back side of the fabric layer 110. In this example, both the fabric layer 110 and the resin film layer 120 are embossed. By providing the resin film layer 120 on the back side of the fabric layer 110, the fibers on the back side of the fabric layer 110 are solidified, eliminating the fraying of threads that occurs during cutting, which is characteristic of woven fabrics. The resin film layer 120 attached to the back side follows the unevenness after embossing, thus improving resistance to damage from the surface. The embossing depth De and total film thickness T of the fabric 100 may be the same as those of the fabric 100 in Figure 2C.

[0075] Figure 6B shows an example of a method for manufacturing the dough 100. This example shows the method for manufacturing the dough 100 shown in Figure 6A. The method for manufacturing the dough 100 in this example differs from the method in Figure 5 in that the resin film layer 120 is provided on the back surface of the dough layer 110 and the release paper 300 is provided on the bottom surface of the dough 100. In this example, the differences from the method for manufacturing the dough 100 shown in Figure 5 will be explained in particular.

[0076] In step S142, release paper 300 is placed on the lower surface of the resin film layer 120. In this example, release paper 300 is provided between the frame 220 and the resin film layer 120. The release paper 300 may be provided between the frame 220 and the resin film layer 120 while adhered to the resin film layer 120, or it may be provided between the frame 220 and the resin film layer 120 without being adhered to the resin film layer 120.

[0077] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the fabric layer 110. In this example, the fabric 100 is embossed with release paper 300 sandwiched between the fabric 100 and the stand 220. The embossing machine 200 may heat the fabric 100 from the fabric layer 110 side using a mold 210. The resin film layer 120 may be bonded to the fabric layer 110 by the heating during embossing.

[0078] Figure 7A shows a modified example of fabric 100. Fabric 100 in this example differs from fabric 100 in Figure 2B in that the resin film layer 120 has a laminated structure. In this example, the differences from fabric 100 in Figure 2B will be explained in particular. The resin film layer 120 in this example has a first layer 121 and a second layer 122.

[0079] The first layer 121 is laminated in contact with the fabric layer 110. In this example, the resin film layer 120 is laminated on the surface side of the fabric layer 110. In this example, the first layer 121 is provided over the entire surface of the fabric layer 110, but it may also be provided on a part of the surface side of the fabric layer 110. The first layer 121 has an uneven shape formed by embossing.

[0080] The second layer 122 is laminated in contact with the first layer 121. The second layer 122 may be located on the convex portions of the uneven shape of the first layer 121, or on the concave portions. The second layer 122 may also be located across the unevenness of the first layer 121.

[0081] The second layer 122 may have an opening 125 for exposing the first layer 121. The second layer 122 has a region that covers the first layer 121 and a region that exposes the first layer 121 through the opening 125. The opening 125 may expose the convex portion of the first layer 121 or the concave portion of the first layer 121. The opening 125 may be provided across the uneven portion of the first layer 121. The thickness of the resin film layer 120 can be changed by selectively providing the second layer 122. The thickness of the second layer 122 may be the same as or different from that of the first layer 121.

[0082] The fabric 100 in this example can be made into any color and pattern by comprising a first layer 121 and a second layer 122. The fabric 100 may have a first layer 121 and a second layer 122 of different colors. Any pattern can be achieved by changing the color and shape of the first layer 121 and the second layer 122.

[0083] The resin film layer 120 in this example has a two-layer structure consisting of a first layer 121 and a second layer 122, but it may also have a laminated structure of three or more layers. The resin film layer 120 in this example can create a difference in film thickness on the fabric 100 through its laminated structure. Furthermore, the resin film layer 120 can provide additional steps in addition to embossing through its laminated structure. The laminated structure of the resin film layer 120 may be formed when the first layer 121 and the second layer 122 are heated above their melting points and become one. Note that the resin film layer 120 may also have steps on its surface by methods other than a laminated structure.

[0084] In this example, the fabric 100 can reproduce an antique feel by changing the color, shape, and thickness of the resin film layer 120. The shade of the fabric 100 can also be adjusted by creating differences in the thickness of the resin film layer 120.

[0085] Figure 7B shows an example of a method for manufacturing the dough 100. This example shows the method for manufacturing the dough 100 shown in Figure 7A. The method for manufacturing the dough 100 in this example differs from the method for manufacturing the dough 100 in Figure 5 in that the resin film layer 120 has a laminated structure. In this example, the differences from the method for manufacturing the dough 100 shown in Figure 5 will be explained in particular.

[0086] In step S142, release paper 300 is provided on the upper surface of the resin film layer 120. The upper surface of the resin film layer 120 may be the surface of the resin film layer 120 that faces the surface of the fabric 100. In this example, release paper 300 is provided between the mold 210 and the resin film layer 120. If the resin film layer 120 is provided on the back surface of the fabric layer 110, release paper 300 may be provided on the lower surface of the resin film layer 120.

[0087] In step S144, the fabric layer 110 and the resin film layer 120 are embossed from above the release paper 300. In this example, both the first layer 121 and the second layer 122 may be embossed. The positions of the first layer 121 and the second layer 122 and the embossed areas may be aligned to achieve any desired positional relationship.

[0088] In step S146, the embossed fabric 100 is removed from the embossing machine 200. This makes it possible to manufacture fabric 100 having a laminated structure on the resin film layer 120.

[0089] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. It will be clear from the claims that such modified or improved forms may also be included in the technical scope of the present invention.

[0090] It should be noted that the execution order of operations, procedures, steps, and stages in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not explicitly stated as "before," "prior to," etc., and that these can be performed in any order unless the output of a previous process is used in a later process. Even if the operation flow in the claims, specifications, and drawings is described using phrases such as "first," "next," etc. for convenience, this does not mean that it is mandatory to perform the operations in that order. [Explanation of symbols]

[0091] 10...Warp threads, 11...First shrinkage thread, 12...Second shrinkage thread, 100...Fabric, 110...Fabric layer, 120...Resin film layer, 121...First layer, 122...Second layer, 125...Opening, 200...Embossing machine, 210...Mold, 220...Stand, 300...Release paper, 510...Warp threads

Claims

1. A woven or knitted fabric with an embossed pattern, The fabric layer, A resin film layer laminated on the aforementioned fabric layer, Equipped with, The fabric layer and the resin film layer are embossed. material.

2. The melting point of the resin film layer is lower than that of the fabric layer. The fabric according to claim 1.

3. The melting point of the resin film layer is 80°C or higher and 160°C or lower. The fabric according to claim 1.

4. The thickness of the resin film layer is 10 μm or more and 100 μm or less. The fabric according to claim 1.

5. The material of the resin film layer includes at least one of polyester, polyurethane, olefin resin, EVA (ethylene vinyl acetate) resin, or polyamide. The fabric according to claim 1.

6. The resin film layer comprises a first layer laminated in contact with the fabric layer and a second layer laminated in contact with the first layer. The fabric according to claim 1.

7. The second layer has an opening to expose the first layer. The fabric according to claim 6.

8. The resin film layer is laminated on the surface side of the fabric layer. The fabric according to any one of claims 1 to 7.

9. The resin film layer is laminated on the back side of the fabric layer. The fabric according to any one of claims 1 to 7.

10. The single yarns of the aforementioned fabric layer have a decitex of 0.05 or more and 0.7 or less. The fabric according to any one of claims 1 to 7.

11. The warp thread density of the aforementioned fabric layer is 200 or more and 300 or less. The fabric according to any one of claims 1 to 7.

12. The thickness of the aforementioned fabric layer is 0.3 mm or more and 1.5 mm or less. The fabric according to any one of claims 1 to 7.

13. The total thickness of the fabric layer and the resin film layer is 0.3 mm or more and 1.5 mm or less. The fabric according to any one of claims 1 to 7.

14. The embossing depth of the aforementioned fabric is 50 μm or more and 400 μm or less. The fabric according to any one of claims 1 to 7.

15. The aforementioned fabric meets at least one of the evaluation criteria of JIS L1091, JIS L1092, JIS L1093, JIS L1096, JIS L1076, JIS L0860, JIS L0849, JIS L0844, or JIS L0842. The fabric according to any one of claims 1 to 7.

16. The stage of preparing a woven or knitted fabric layer, The steps include laminating a resin film layer onto the aforementioned fabric layer, The steps include embossing the aforementioned fabric layer and the aforementioned resin film layer, Equipped with A method for manufacturing dough.

17. The aforementioned embossing step is, The steps include: placing release paper on the upper surface of the resin film layer; The steps include: embossing the fabric layer and the resin film layer from above the release paper, A method for producing dough according to claim 16, having the following characteristics:

18. The aforementioned embossing step is, The steps include: placing release paper on the lower surface of the resin film layer; Steps include: embossing the fabric layer and the resin film layer from above the fabric layer, A method for producing dough according to claim 16, having the following characteristics:

19. The thickness of the release paper is 30 μm or more and 100 μm or less. The method for producing the dough according to claim 17 or 18.

20. The method includes a step of performing a surface treatment on the aforementioned release paper to provide a release effect. The method for producing the dough according to claim 17 or 18.

21. The process includes a step of applying a textured finish to the aforementioned release paper. The method for producing the dough according to claim 17 or 18.

22. The material of the release paper includes at least one of paper, polyethylene, polypropylene, or epoxy resin. The method for producing the dough according to claim 17 or 18.

23. The method includes a step of heating the resin film layer to a temperature above the melting point of the resin film layer. The method for producing the dough according to claim 16.

24. The step of heating the resin film layer is performed after the step of laminating the resin film layer onto the fabric layer, and before the step of embossing the fabric layer and the resin film layer. The method for producing the dough according to claim 23.

25. The step of heating the resin film layer is performed when embossing the fabric layer and the resin film layer. The method for producing the dough according to claim 23.

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