Lead storage device

The lead storage device addresses reed deformation by using a holding section and pressing mechanism to maintain the reed's shape, enhancing performance through deformation correction.

JP2026067179APending Publication Date: 2026-04-20YAMAHA CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
YAMAHA CORP
Filing Date
2024-10-08
Publication Date
2026-04-20

AI Technical Summary

Technical Problem

Existing reed dehumidifying devices and reed cases do not effectively correct deformation that occurs during the use of wind instrument reeds, which can interfere with performance.

Method used

A lead storage device with a lead holding section and a pressing section that presses against the vamp of the reed to correct deformation, using elastic members and optionally a heat source to further enhance correction.

Benefits of technology

The device effectively corrects reed deformation by maintaining the reed's shape during storage, improving performance by reducing interference and enhancing stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

Correct the creep deformation of the lead. [Solution] A reed storage device is provided, which includes a reed holding part for holding a reed, the reed holding part having a bottom surface on which the facing of the reed is positioned when the reed is held, and a pressing part for contacting at least a portion of the vamp of the reed and pressing toward the bottom surface. When the reed holding part holds a reed, the vamp of the reed is pressed by the pressing part, thereby correcting the deformation of the vamp.
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Description

Technical Field

[0001] The present invention relates to a technique for correcting the shape of a deformed reed.

Background Art

[0002] The reed of a wind instrument is deformed, such as warping, with use. Using a deformed reed may interfere with performance. To prevent such deformation of the reed, for example, Patent Document 1 discloses a reed dehumidifying device, and Patent Document 2 discloses a reed case for maintaining a certain humidity.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the reed dehumidifying device described in Patent Document 1 and the reed case described in Patent Document 2 can suppress deformation of the stored reed, but do not assume correcting the deformation of the reed. Therefore, it is expected to correct the deformation of the reed that occurs during use.

[0005] One object of the present invention is to correct the deformation that occurs in the reed.

Means for Solving the Problems

[0006] A lead storage device according to one embodiment includes a lead holding section for holding leads, the lead holding section having a bottom surface on which the facing of the lead is positioned when the lead is held, and a pressing section for contacting at least a portion of the vamp of the lead and pressing toward the bottom surface. [Effects of the Invention]

[0007] According to the present invention, deformations that occur in the lead can be corrected. [Brief explanation of the drawing]

[0008] [Figure 1] This is an external view showing a lead storage device according to one embodiment. [Figure 2] This figure shows the state when the lead holding section of the lead storage device shown in Figure 1 is holding a lead. [Figure 3] This is a schematic diagram of the lead holding section as seen from the second direction. [Figure 4] This is a schematic diagram of the lead holding section as viewed from the first direction. [Figure 5] This diagram illustrates the state of a deformed lead placed on a horizontal plane. [Figure 6] This is a schematic diagram of the lead holder when the lead is held in the lead holder. [Figure 7] This is a schematic diagram of the lead holder when the lead is held in the lead holder. [Figure 8] This diagram illustrates the state when a lead is held in the lead holder. [Figure 9] This diagram illustrates the area of ​​the vamp that is pressed by the pressing part. [Figure 10] This figure shows the external appearance of a lead storage device according to one embodiment. [Figure 11] This is a schematic diagram of the lead holding section as seen from the second direction when the top cover is closed. [Figure 12] This is a schematic diagram of the lead viewed from a second direction, illustrating the state in which the deformed lead is placed on the bottom surface with the top cover open. [Figure 13] A schematic diagram of the lead holding part and the lead as seen from the second direction when the lead holding part holds the lead. [Figure 14] A diagram showing the appearance of a lead storage device according to an embodiment. [Figure 15] A diagram showing an example of a heating element in a heat source part. [Figure 16] A block diagram showing an example of the configuration of a heat source part. [Figure 17] A diagram showing an example of the shape of a pressing part. [Figure 18] A diagram showing the appearance of a lead storage device according to a modification.

Mode for Carrying Out the Invention

[0009] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The following embodiments are examples, and the present invention is not construed as being limited to these embodiments. In the drawings referred to in this embodiment, the same parts or parts having the same function are denoted by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. The drawings may be schematically described such that the dimensional ratios are different from the actual ratios or a part of the configuration is omitted from the drawings in order to clarify the description.

[0010] The lead of a wind instrument, particularly the vamp part, undergoes deformation (so-called creep deformation) during performance. This deformation can occur when the lead is fixed to the mouthpiece by a ligature and the tip of the vamp part is pressed toward the mouthpiece side by the player's lips. Such deformation of the lead may interfere with the performance.

[0011] In the present disclosure, a lead storage device is provided that corrects the deformation that occurs in the lead during storage. The lead storage device has a pressing part that presses against at least a part of the vamp of the lead to correct the deformation. By pressing the deformed part with the pressing part, the deformation that has occurred in the lead can be corrected.

[0012] [First Embodiment] FIG. 1 is a diagram showing the appearance of a lead storage device 1 according to the first embodiment of the present invention. The lead storage device 1 includes a housing 10 and a lead holding portion 20.

[0013] In the present embodiment, the housing 10 includes an upper lid 11 and a bottom portion 12. In the present embodiment, the upper lid 11 is connected to the bottom portion 12 via a hinge 13 so as to be openable and closable about a predetermined rotation axis. However, the present invention is not limited to this, and the upper lid 11 and the bottom portion 12 may not be connected to each other. The material of the housing 10 may be a plastic material or a metal, but is not limited thereto.

[0014] In the present embodiment, an opening 14 is provided at one end of the upper lid 11 of the housing 10, and a claw portion 15 is provided at one end of the bottom portion 12. When the upper lid 11 rotates via the hinge 13 and overlaps the bottom portion 12, the claw portion 15 provided on the bottom portion 12 engages with the opening 14 provided on the upper lid 11. As a result, the claw portion 15 engages with the opening 14. In the present embodiment, when the claw portion 15 engages with the opening 14, the inside of the housing 10 may be blocked from the outside. The inside of the housing 10 being blocked from the outside means that the inside of the housing 10 is sealed. However, the structure of the housing 10 is not limited to this, and at least a part of the housing 10 may be open to the outside in a state where the claw portion 15 engages with the opening 14.

[0015] The lead holding portion 20 is a structure for holding a lead. In the present embodiment, the lead holding portion 20 is rotatably attached to the upper lid 11 about one side of the upper lid 11. However, the present invention is not limited to this, and the lead holding portion 20 may be fixed to the bottom portion 12 or may be separable from the upper lid 11 and the bottom portion 12. The upper lid 11 is openable and closable with respect to the bottom surface 21 about a predetermined rotation axis.

[0016] The reed holder 20 has a bottom surface 21 and a pressing portion (correcting portion) 22 provided on the upper part of the bottom surface 21, separated from the bottom surface 21 and facing the bottom surface 21. When the reed holder 20 holds a reed, the facing of the reed is positioned on the bottom surface 21. Here, the facing of the reed is the surface that contacts the mouthpiece when the reed is attached to the mouthpiece of a wind instrument.

[0017] The lead holding section 20 has a plurality of guides 23 that restrict the movement of the lead in the width direction perpendicular to the longitudinal direction of the lead when it is held. In other words, two adjacent guides 23 define an area for holding one lead. In this embodiment, six guides 23 are arranged in a row on the bottom surface 21. In Figure 1, the direction in which each of the plurality of guides 23 extends is shown as the first direction D1, the direction in which the plurality of guides 23 are arranged in a row is shown as the second direction D2, and the direction perpendicular to the first direction D1 and the second direction D2, and toward the pressing section 22 from the bottom surface 21 is shown as the third direction (vertical direction) D3. The guides 23 are protrusions that project from the bottom surface 21 in the vertical direction D3, but the shape of the guides 23 is not limited to this. In this embodiment, the lead holding section 20 can hold up to five leads along the second direction D2.

[0018] In this embodiment, at least a portion of the pressing portion 22 is connected to a part of the guide 23 located on the outermost side in the second direction D2. In other words, the bottom surface 21 and the pressing portion 22 are integral. The pressing portion 22 includes an elastic member. When the lead is held, the pressing portion 22 contacts at least a portion of the vamp of the lead and presses at least a portion of the vamp toward the bottom surface 21.

[0019] The pressing portion 22 includes a connecting portion 22a, a plurality of branch portions 22b, and an end portion 22c. The connecting portion 22a extends along a second direction D2. The plurality of branch portions 22b extend from the connecting portion 22a in the direction opposite to the first direction D1. The plurality of branch portions 22b are spaced apart from each other. The end portion 22c is the end of the branch portion 22b in the direction opposite to the first direction D1. Two branch portions 22b are present in a region defined by two adjacent guides 23. When the lead holding portion 20 holds a lead, the branch portions 22b press at least two spaced-apart regions of the vamp of the lead toward the bottom surface 21.

[0020] Figure 2 shows the state when the lead is held by the lead holding part 20 of the lead storage device 1 shown in Figure 1. In this embodiment, the lead 100 is made of a viscoelastic resin material.

[0021] The lead 100 includes a base portion 101 and a vamp 103. The base portion 101 includes an upper surface portion 111, a facing 113, and a heel 115. The upper surface portion 111 is provided on one side of the base portion 101. The facing 113 is on the side opposite to the upper surface portion 111. The vamp 103 extends from the base portion 101 on the side opposite to the heel 115. That is, the vamp 103 is located at one end of the lead 100 in the longitudinal direction, and its thickness gradually decreases towards its tip.

[0022] When storing the lead 100 in the lead storage device 1, as shown in Figure 2, the user places the lead 100 on the bottom surface 21 of the lead holding part 20 so that the facing 113 of the lead 100 faces the bottom surface 21 of the lead holding part 20, inserts the tip of the vamp 103 between the bottom surface 21 and the pressing part 22, and inserts it from the front side (opposite side of the first direction D1 in Figure 2) to the back side (towards the first direction D1 in Figure 2) of the lead holding part 20. At this time, when the lead 100 is pushed to a predetermined position toward the back side (towards the first direction D1) of the lead holding part 20, the end 22c of the pressing part 22 comes into contact with at least a part of the vamp 103 of the lead 100 and is pushed upward in the third direction D3, causing the branch portion 22b to elastically deform. The restoring force of the branch portion 22b at this time becomes the pressing force toward the bottom surface 21. Furthermore, at the predetermined position, the end portion 22c of the pressing portion 22 presses against the lead 100, thereby restricting the movement of the lead 100 in the first direction D1.

[0023] In this embodiment, at least two mutually separated regions of the vamp 103 are pressed by the pressing portion 22. The two regions to be pressed are located on one end and the other end of the vamp 103 with respect to the center in the width direction perpendicular to the longitudinal direction of the lead. Here, the longitudinal direction of the lead 100 corresponds to the first direction D1, and the width direction of the lead 100 corresponds to the second direction D2.

[0024] Figure 3 is a schematic diagram of the lead holding portion 20 as viewed from the second direction D2. Figure 4 is a schematic diagram of the lead holding portion 20 as viewed from the first direction D1. As shown in Figures 3 and 4, the pressing portion 22 is inclined toward the bottom surface 21 from the connecting portion 22a to the end portion 22c. The pressing portion 22 is provided at a predetermined distance from the bottom surface 21 in the third direction D3. The distance between the bottom surface 21 and the pressing portion 22 may vary depending on the type of lead 100 held by the lead holding portion 20.

[0025] For example, if the reed 100 held in the reed holder 20 is a clarinet reed, the distance d1 between the bottom surface 21 and the end 22c of the pressing portion 22, as shown in Figure 4, is preferably about 0.75 mm or more and about 1.75 mm or less, and particularly preferably about 1.25 mm. If the reed 100 held in the reed holder 20 is an alto saxophone reed, the distance d1 is preferably about 0.85 mm or more and about 1.85 mm or less, and particularly preferably about 1.35 mm. If the reed 100 held in the reed holder 20 is a tenor saxophone reed, the distance d1 is preferably about 0.95 mm or more and about 1.55 mm or less, and particularly preferably about 1.45 mm.

[0026] Figure 5 illustrates the state of a deformed reed 100 when placed on a horizontal plane. While the reed 100 is fixed to the mouthpiece during playing, the tip of the vamp 103 (the tip of the vamp 103 in the longitudinal direction of the reed 100) is pressed towards the mouthpiece by the player's lips. Due to the continuous pressure, the viscosity of the reed 100 can cause deformation in which the vamp 103 bends toward the facing 113. When the deformed reed 100 is placed on a horizontal plane, as shown in Figure 5, a separation is created between the horizontal plane and the reed 100, particularly between the horizontal plane and the central part of the facing 113 in the longitudinal direction of the reed 100. When the deformed reed 100 is placed on a horizontal plane, the separation distance L1 is defined as the distance between the horizontal plane and the facing 113 at the point furthest from the horizontal plane on the facing 113.

[0027] Figures 6 and 7 are schematic diagrams of the lead holder 20 when the lead 100 is held in the lead holder 20. The schematic diagram in Figure 6 corresponds to the schematic diagram of the lead holder 20 shown in Figure 3, and the schematic diagram in Figure 7 corresponds to the schematic diagram of the lead holder 20 shown in Figure 4. In Figures 6 and 7, the dashed line indicates the position of the pressing portion 22 before the lead holder 20 holds the lead 100. As shown in Figures 6 and 7, when the lead 100 is held in the lead holder 20, the end portion 22c of the pressing portion 22 contacts and pushes up at least a part of the vamp 103. As the end portion 22c is pushed up in the third direction D3, the branch portion 22b undergoes elastic deformation, and the restoring force of the branch portion 22b at this time becomes a pressing force toward the bottom surface 21, pressing the vamp 103. Furthermore, when the end portion 22c of the pressing portion 22 contacts at least a part of the vamp 103, the end portion 22c is also pushed in the second direction D2 or the opposite direction to the second direction D2, causing the branch portion 22b to elastically deform. The restoring force of the branch portion 22b at this time becomes a pressing force directed toward the center of the lead 100 in the width direction, restricting the movement of the lead 100 in the second direction D2 and the opposite direction to the second direction D2, thereby fixing the position of the lead 100.

[0028] Figure 8 is a diagram illustrating the state when a deformed lead 100 is held in the lead holding part 20. In Figure 8, the lead 100 pressed by the pressing part 22 is shown by a solid line, and the lead 100 not pressed by the pressing part 22 is shown by a dashed line. Similar to the lead 100 arranged on a horizontal plane as explained in Figure 5, when not pressed by the pressing part 22, there is a gap between the bottom surface 21 and the facing 113 of the lead 100, and the distance between the bottom surface 21 and the facing 113 at the position furthest from the bottom surface 21 on the facing 113 is the gap distance L1. When not pressed by the pressing part 22, L1 ≠ 0. Note that in Figure 8, the pressing part 22 and the lead 100 pressed by the pressing part 22 are omitted from the enlarged view showing L1.

[0029] As shown in Figure 8, when the deformed lead 100 is held in the lead holding portion 20, the vamp 103 is pressed toward the bottom surface 21 by the branch portion 22b of the pressing portion 22. While the lead 100 is held in the lead holding portion 20, the separation distance L1 is smaller than the L1 when the lead is not being pressed by the pressing portion 22. Preferably, while the lead 100 is held in the lead holding portion 20, the separation distance L1 is zero (0). That is, while the lead 100 is held in the lead holding portion 20, the facing 113 is in contact with the bottom surface 21. In this way, while the lead 100 is held in the lead holding portion 20, the deformation of the vamp 103 is corrected by the pressure on the lead 100 by the pressing portion 22. Depending on the elasticity of the lead 100, the separation distance L1 may gradually decrease while the lead 100 is held in the lead holding portion 20.

[0030] The area of ​​the vamp 103 pressed by the pressing part 22 may differ depending on the type of reed 100 held by the reed holding part 20. Figure 9 is a diagram illustrating the area of ​​the vamp 103 pressed by the pressing part 22. For example, if the reed 100 is a clarinet reed, the area of ​​the vamp 103 pressed is preferably the area in the width direction of the reed 100 that includes positions where the distance d2 from the tip of the vamp 103 is approximately 15 mm to approximately 30 mm along the longitudinal direction of the reed 100, and also preferably the area in the width direction of the reed 100 that includes positions where the distance d2 is approximately 18 mm. If the reed 100 is an alto saxophone reed, the area of ​​the vamp 103 pressed is preferably the area in the width direction of the reed 100 that includes positions where the distance d2 is approximately 15 mm to approximately 30 mm, and also preferably the area in the width direction of the reed 100 that includes positions where the distance d2 is approximately 18 mm. If the reed 100 is a reed for a tenor saxophone, the area of ​​the vamp 103 that is pressed is preferably a region in the width direction of the reed 100 that includes a position where the distance d2 is approximately 15 mm to approximately 35 mm, and preferably a region in the width direction of the reed 100 that includes a position where the distance d2 is approximately 25 mm.

[0031] In this way, by holding the lead 100 with the pressing part 22 and storing the lead 100 while pressing the vamp 103, at least a portion of the vamp 103 continues to be subjected to pressure from the pressing part 22 during the storage period. As a result, deformation that occurs in the vamp 103 can be corrected.

[0032] [Second Embodiment] In the first embodiment described above, the pressing portion 22 of the lead holding portion 20 is connected to at least a part of the outermost guide 23, and the bottom surface 21 and the pressing portion 22 are integral. However, the bottom surface 21 and the pressing portion 22 do not have to be integral.

[0033] Figure 10 shows the external appearance of a lead storage device 1A according to a second embodiment of the present invention. The lead storage device 1A includes a housing 10 and a lead holding section 20A. In this embodiment, the configuration other than the lead holding section 20A is the same as that of the lead storage device 1 described in the first embodiment. Therefore, the configuration of the lead holding section 20A will be mainly described below, and the description of the configuration other than the lead holding section 20A will be omitted.

[0034] The lead holding portion 20A includes a bottom surface 21A and a pressing portion 22A. In this embodiment, the bottom surface 21A and the pressing portion 22A are not a single unit. In this embodiment, the pressing portion 22A is connected to the top cover 11 of the housing 10.

[0035] The bottom surface 21A is provided with a guide 23 that restricts the movement of the lead 100 in the width direction perpendicular to the longitudinal direction of the lead when the lead is held, as well as a guide 24 that restricts the movement of the lead 100 in the longitudinal direction (first direction D1 in Figure 8). In this embodiment, the guide 24 is a projection that extends along the second direction D2 and protrudes from the bottom surface 21 in the third direction D3, but the shape of the guide 24 is not limited to this. The bottom surface 21A also has a plurality of curved surfaces (first curved surface) 25. The curved surface 25 will be described later.

[0036] The pressing portion 22A includes an elastic member. When the lead holding portion 20A holds the lead 100, that is, when the lead 100 is positioned on the bottom surface 21A, and the top cover 11 is closed toward the bottom surface 21A so that the claw portion 15 and the opening 14 engage, the pressing portion 22A deforms in contact with at least a portion of the vamp 103 of the lead 100. The elastic member of the pressing portion 22A includes natural fibers such as felt, artificial fibers such as polyurethane, and resins such as silicone. The pressing portion 22A is provided on the surface of the top cover 11 that faces the bottom surface 21A when the lead holding portion 20A holds the lead 100. When the lead holding portion 20A holds the lead 100, the pressing portion 22A elastically deforms in contact with at least a portion of the vamp 103 of the lead 100, and its restoring force becomes a pressing force that presses the vamp 103 toward the bottom surface 21A. In Figure 11, the area PA shown by the dashed line on the bottom surface 21A represents the area where the pressing portion 22A overlaps when the lead holding portion 20A holds the lead 100.

[0037] The area of ​​the vamp 103 pressed by the pressing portion 22A is the same as the area of ​​the vamp 103 pressed by the pressing portion 22 in the first embodiment. In this embodiment, the pressing portion 22A does not have a branch portion. Therefore, the surface area of ​​the vamp 103 pressed by the pressing portion 22A is larger than the surface area of ​​the vamp 103 pressed by the pressing portion 22 in the first embodiment.

[0038] Each of the multiple curved surfaces 25 provided on the bottom surface 21A is provided such that at least a portion of it overlaps with the region PA where the pressing portion 22A overlaps, in the region defined by two adjacent guides 23. The curved surface 25 is concave in the direction of extension of the guides 23, that is, in the first direction D1. As a result, when the lead holding portion 20A holds the lead 100, a space is created between the facing 113 of the lead 100 and the curved surface 25. In the region defined by two adjacent guides 23, the width w1 in the first direction D1 and the width w2 in the second direction of the curved surface 25 may differ depending on the type of lead 100 held by the lead holding portion 20A.

[0039] For example, if reed 100 is a clarinet reed, the width w1 of the curved surface 25 may be approximately 15 mm, and the distance from the guide 24 to the curved surface 25 may be approximately 15 mm. If reed 100 is an alto saxophone reed, the width w1 of the curved surface 25 may be approximately 15 mm, and the distance from the guide 24 to the curved surface 25 may be approximately 15 mm. If reed 100 is a tenor saxophone reed, the width w1 of the curved surface 25 may be approximately 20 mm, and the distance from the guide 24 to the curved surface 25 may be approximately 15 mm. The width w2 of the curved surface 25 in the second direction D2 is preferably greater than the length (width) of the vamp 103 in the width direction of reed 100.

[0040] Figure 11 is a schematic diagram of the lead holding portion 20A as seen from the second direction D2 when the top cover 11 is closed toward the bottom surface 21A and the claw portion 15 and the opening 14 are engaged. Figure 12 is a schematic diagram of the lead 100 as seen from the second direction to explain the state in which the deformed lead 100 is placed on the bottom surface 21A with the top cover 11 open. The deformed lead 100 corresponds to the lead 100 shown in Figure 5. Figure 13 is a schematic diagram of the lead holding portion 20A and the lead 100 as seen from the second direction D2 when the deformed lead 100 is placed on the bottom surface 21A and the top cover 11 is closed toward the bottom surface 21A and the claw portion 15 and the opening 14 are engaged, that is, when the lead holding portion 20A holds the lead 100.

[0041] As shown in Figure 11, when the top cover 11 is closed toward the bottom surface 21A and the claw portion 15 and the opening 14 engage, the pressing portion 22A has a convex curved surface (second curved surface) 26 toward the bottom surface 21A. However, the shape of the pressing portion 22A is not limited to this. For example, when the top cover 11 is closed toward the bottom surface 21A and the claw portion 15 and the opening 14 engage, the pressing portion 22A may have a convex portion that does not have a curved surface toward the bottom surface 21A.

[0042] As shown in Figure 12, when a deformed lead 100 is placed on the base surface 21A, a separation is created between the base surface 21A and the lead 100, particularly between the curved surface 25 of the base surface 21A and the central portion of the longitudinal facing 113 of the lead 100. When the deformed lead 100 is placed on the base surface 21A, the separation distance L2 is defined as the distance between the curved surface 25 (base surface 21A) and the facing 113 at the point furthest from the curved surface 25 (base surface 21A) on the facing 113. Furthermore, if L3 is the distance between the curved surface 25 and the base surface 21A at the deepest point of the concave curved surface 25, then L2 > L3.

[0043] As shown in Figure 13, when the lead holding portion 20A holds the deformed lead 100, the pressing portion 22A contacts at least a portion of the vamp 103 of the lead 100 and is pushed up, undergoing elastic deformation. The restoring force of the pressing portion 22A at this time presses the vamp 103 toward the bottom surface 21A. At this time, in the region where the curved surface 25 exists, the vamp 103 can bend toward the curved surface 25. While the lead 100 is held by the lead holding portion 20A, the separation distance L2 between the curved surface 25 and the facing 113 becomes smaller than L2 when the lead is not being pressed by the pressing portion 22A. Preferably, while the lead 100 is held by the lead holding portion 20A, the size of the separation distance L2 is less than or equal to the distance L3 between the curved surface 25 and the bottom surface 21A (L2 ≤ L3). Figure 13 shows, as an example, a state in which the separation distance L2 is the same as the distance L3. In this way, while the lead 100 is held by the lead holding portion 20A, the deformation of the vamp 103 is corrected by the pressure applied to the lead 100 by the pressing portion 22A. Depending on the elasticity of the lead 100, the separation distance L2 may gradually decrease while the lead 100 is held by the lead holding portion 20A. In the deformed lead 100, it is preferable that the facing 113 is generally parallel to the bottom surface 21A, excluding the curved surface 25.

[0044] In this embodiment, as in the first embodiment, the lead holding portion 20A holds the lead 100 and the pressing portion 22A presses against the vamp 103. By storing the lead 100 in this state, the vamp 103 continues to receive pressure from the pressing portion 22A during the storage period. Furthermore, in this embodiment, as described above, the bottom surface 21A has a concave curved surface 25. Due to the pressure from the pressing portion 22A, the vamp 103 can bend toward the curved surface 25 in the region where the curved surface 25 exists, thereby improving the corrective force. As a result, deformation in the vamp 103 can be corrected more effectively.

[0045] In this embodiment, the pressing portion 22A is an elastic member attached to the top cover 11, but the pressing portion 22A may be the top cover 11 itself. In this case, the top cover 11 itself is made of an elastic member.

[0046] [Third Embodiment] In addition to the pressing force applied by the pressing portion of the lead holding portion, the lead storage device may also have a heat source for heating the lead 100 so that the deformation of the vamp 103 can be corrected more effectively when the lead holding portion holds the lead 100.

[0047] Figure 14 shows the external appearance of the lead storage device 1B according to the third embodiment. The lead storage device 1B includes a housing 10B and a lead holding section 20B. In this embodiment, the configuration other than the lead holding section 20B is the same as that of the lead storage device 1 described in the first embodiment. Therefore, the configuration of the lead holding section 20B will be mainly described below, and the description of the configuration other than the lead holding section 20B will be omitted.

[0048] The lead holding portion 20B has a heat source portion 28 provided on the bottom portion 12B of the housing 10B. The heat source portion 28 is provided on the bottom portion 12B so as to face at least a portion of the pressing portion 22 of the lead holding portion 20B when the lead holding portion 20B holds the lead 100. The heat source portion 28 is provided so as to overlap at least a portion of the vamp 103 when the lead holding portion 20B holds the lead 100. When the lead holding portion 20B holds the lead 100, the top cover 11 is closed toward the bottom surface 21 of the lead holding portion 20B, and the claw portion 15 and the opening 14 are engaged, thereby sealing the inside of the housing 10B.

[0049] The heat source unit 28 is activated when the lead holding unit 20B holds the lead 100, and heats the lead. When activated, the heat source unit 28 heats the held lead 100 in a temperature range of approximately 40°C to approximately 160°C. The heat source unit 28 includes a heating element 280. It is preferable that the heat source unit 28 contacts the bottom surface 21 of the lead holding unit 20B when the lead holding unit 20B holds the lead 100. In this case, it is preferable that at least a part of the lead holding unit 20B, particularly the bottom surface 21, contains a material such as a metal with excellent thermal conductivity.

[0050] Figure 15 shows an example of the heating element 280 of the heat source unit 28 according to this embodiment. Figure 16 is a block diagram showing an example of the configuration of the heat source unit 28. In Figure 15, the lead 100 is omitted to make the configuration of the heat source unit 28 easier to understand, and the components of the lead holding unit 20B excluding the heat source unit 28 are shown with dashed lines.

[0051] The heating element 280 is a heating wire disposed on the bottom 12B of the housing 10B. The heating element 280 is provided to heat at least a portion of the vamp 103 when the lead holding portion 20B holds the lead 100. The shape of the heating element 280 shown in Figure 15 is an example and is not limited thereto.

[0052] The heating element 280 is connected to wiring (not shown) connected to a power supply. The power supply may be located on the bottom 12B or it may be an external power supply. When an external power supply is used, the housing 10B may have a USB port (not shown). Alternatively, the housing 10B may have a battery (not shown) inside to allow heating even when not powered, and the battery may be charged by the aforementioned external power supply.

[0053] Furthermore, the heat source unit 28 may also include a temperature control unit 281. The temperature control unit 281 adjusts the temperature of the heating element 280 to adjust the temperature of the lead 100, particularly the temperature of the vamp 103, when the lead holding unit 20B holds the lead 100.

[0054] If the heat source unit 28 has a temperature control unit 281, the lead storage device 1B has an input receiving unit (not shown) that receives user input to the temperature control unit 281. The user can set a desired heating temperature for the lead 100 via the operation unit. The temperature control unit 281 heats the heating element 280 based on the temperature set by the user. The heating temperature for the lead 100 may vary depending on the material of the lead 100, and is preferably in a temperature range of about 40°C to about 160°C.

[0055] In this embodiment, when the lead holding portion 20B holds the lead 100, in addition to the pressing portion 22 of the lead holding portion 20B, the heat source portion 28 heats the lead 100 to a predetermined temperature. While the lead 100 is stored in the lead storage device 1B, the heating of the lead 100 reduces the viscoelasticity of the lead 100, making it easier to correct the deformation of the lead 100. Therefore, because the lead holding portion 20B has a heat source portion 28, in this embodiment, the deformation of the vamp 103 can be corrected more effectively and in a shorter time compared to when the lead 100 is not heated.

[0056] In this embodiment, the heating element 280 is not limited to an electric heating wire. For example, the heating element 280 may be a channel through which a heat transfer medium such as oil, water, organic fluid, or molten salt flows. If the heating element 280 is a channel containing a heat transfer medium, the heat source unit 28 may include a separate heater (not shown) for heating the heat transfer medium.

[0057] [Differentiation] This disclosure is not limited to the embodiments described above, but includes a variety of other modifications. For example, the embodiments described above are described in detail for the purpose of illustrating this disclosure and are not necessarily limited to having all the configurations described. That is, some of the configurations of each embodiment may be replaced with other configurations or deleted. Some modifications are described below. The modifications shown below can be applied to any of the first to third embodiments described above. In the following description, a given embodiment may be described as a modification of a given embodiment, but it may also be applied as a modification of a different embodiment. Furthermore, each modification may be combined to the extent that it does not cause inconsistencies and applied to a given embodiment.

[0058] (Variation 1) In the first embodiment, two branches 22b extend from the connecting portion 22a of the pressing portion 22 in the region defined by two adjacent guides 23. However, the shape of the pressing portion 22 is not limited to this.

[0059] Figure 17 shows an example of a pressing portion 22 having a different shape from that of the first embodiment. Figure 17 shows the pressing portion 22 as viewed from a third direction D3. In Figure 17, one branch portion 22b extends from the connecting portion 22a in the region defined by two adjacent guides 23. In Figure 17, the end portion 22c of the branch portion 22b is straight. However, it is not limited to this, and the end portion of the branch portion 22c may be curved. Although not shown, the pressing portion 22 in Figure 17 is inclined toward the bottom surface 21 from the connecting portion 22a to the end portion 22c.

[0060] (Modification 2) In the second embodiment, the bottom surface 21A of the lead holding portion 20A has a curved surface 25 that is concave in the direction of extension of the guide 23, i.e., toward the first direction D1. Here, the bottom surface 21A may include a recess that is concave toward the opposite side of the third direction D3 instead of the curved surface 25.

[0061] (Variation 3) Furthermore, in the second embodiment, the bottom surface 21A may have a support portion that extends in the second direction D2 and protrudes in the third direction D3, instead of the curved surface 25, in the region defined by two adjacent guides 23.

[0062] Figure 18 shows the external appearance of the lead storage device 1C according to this modified example. In the lead storage device 1C, instead of the curved surface 25, the bottom surface 21C has two support portions 27a and 27b that extend in a second direction D2 and project in a third direction D3 in a region defined by two adjacent guides 23. The two support portions 27a and 27b are separated from each other by a distance d3 in a first direction D1.

[0063] Support portions 27a and 27b are provided such that at least a portion of them overlap the region PA where the pressing portion 22A overlaps in the region defined by two adjacent guides 23. In other words, when the lead holding portion 20C holds a lead, support portions 27a and 27b each support the facing of the lead, overlapping at least a portion of the vamp. In the region defined by two adjacent guides 23, the distance d3 between support portions 27a and 27b may vary depending on the type of lead 100 held by the lead holding portion 20C.

[0064] For example, the distance d3 is the same as the width w1 in the first direction D1 of the curved surface 25 provided on the bottom surface 21A of the lead holding portion 20A in the second embodiment. Also, the distance d4 in the second direction D2 of the support portions 27a and 27b is the same as the width w2 in the second direction of the curved surface 25 provided on the bottom surface 21A of the lead holding portion 20A in the second embodiment. It is preferable that the distance d4 is less than or equal to the distance between two adjacent guides 23 and has a length sufficient to stably support the lead 100 when it is placed on the bottom surface 21.

[0065] Because the support portions 27a and 27b are provided on the bottom surface 21C, when the lead is placed on the bottom surface, a space is created between the facing of the lead and the bottom surface 21C in the region between the support portions 27a and 27b. As a result, in the region between the support portions 27a and 27b, the vamp 103 can bend toward the bottom surface 21C while the vamp is pressed by the pressing portion 22A.

[0066] (Modification 4) In the third embodiment, the heat source unit 28, including the heating element 280, was described as being provided on the bottom 12B of the housing 10B. However, the heating element 280 may also be provided on the back surface of the lead holding unit 20B, that is, on the surface opposite to the bottom surface 21 on which the lead 100 is placed when the lead holding unit 20B holds the lead 100.

[0067] (Variation 5) In the first and third embodiments, an elastic member different from the end portion 22c of the pressing portion 22 may be attached to the side facing the bottom surface 21.

[0068] (Experimental variation 6) In each of the above embodiments, the lead 100 is formed of a resin material. However, the lead 100 may be formed of a plant material. [Explanation of symbols]

[0069] 1,1A,1B,1C: Lead storage device, 10,10B: Housing, 11: Top cover, 12,12b: Bottom, 13: Hinge, 14: Opening, 15: Engaging part, 20,20A,20C: Lead holding part, 21,21A,21C: Bottom surface, 22,22A: Pressing part, 22a: Connecting part, 22b: Branch part, 22c: End part, 23: Guide, 24: Guide, 25: Curved surface, 26: Curved surface, 27a,27b: Support part, 28: Heat source part, 100: Lead, 101: Base material part, 103: Vamp, 111: Top surface part, 113: Facing, 115: Heel, 280: Heating element, 281: Temperature control part

Claims

1. Includes a lead holding section for holding the lead, The lead holding portion of the lead holding device has a bottom surface on which the facing of the lead is positioned when the lead is held, and a pressing portion for contacting at least a portion of the vamp of the lead and pressing toward the bottom surface.

2. The pressing portion presses on at least two areas of the vamp that are spaced apart from each other. The lead storage device according to claim 1, wherein the two regions are located on one end and the other end of the lead with respect to the center in the width direction perpendicular to the longitudinal direction of the lead.

3. The lead storage device according to claim 1, wherein the lead holding portion has a guide that restricts the movement of the lead in the width direction perpendicular to the longitudinal direction of the lead when the lead is held.

4. The lead storage device according to claim 1, wherein the bottom surface has a first curved surface that is concave with respect to the facing when the lead is held.

5. The lead storage device according to claim 4, wherein the pressing portion includes an elastic member that deforms in contact with at least a portion of the vamp when the lead is held.

6. The pressing portion has a convex second curved surface, The lead storage device according to claim 4, wherein the second curved surface contacts at least a portion of the vamp and presses toward the bottom surface when the lead is held.

7. The lead holding portion has a lid facing the bottom surface when holding the lead, The lid is openable and closable relative to the bottom surface around a predetermined axis of rotation. The lead storage device according to claim 4, wherein the pressing portion is connected to the lid.

8. The lead storage apparatus according to claim 1, further comprising a heat source for heating the lead when the lead holding portion holds the lead.

9. The lead storage device according to claim 8, further comprising a temperature adjustment unit that adjusts the temperature of the lead when the lead holding unit holds the lead.

10. The bottom surface has two support portions that extend in a width direction perpendicular to the longitudinal direction of the lead and protrude perpendicularly from the bottom surface. The lead storage device according to claim 1, wherein the two support portions are spaced apart from each other and support the facing of the lead, which overlaps with at least a portion of the vamp when the lead holding portion holds the lead.

11. A corrective part that corrects deformation caused by viscosity from the normal shape of a viscoelastic lead during storage, The bottom surface on which the lead is placed when the lead is stored, Equipped with, A lead storage device in which, with the lead placed on the bottom surface, the separation distance between the bottom surface and the facing of the lead is continuously shortened by the straightening section when the lead is stored.

Citation Information

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