Semiconductor chip transfer device and semiconductor chip pickup method

Abstract

The present invention provides a semiconductor chip transfer device and a semiconductor chip pickup method that can improve productivity. [Solution] The third camera 13 (imaging unit) of the semiconductor chip transfer device supports the semiconductor chip C from below via the adhesive sheet 32 ​​by having a plurality of protrusions 40 on the lower receiving part contact the second surface (substrate surface 32b) of the adhesive sheet 32, and the suction part sucks the space S1 below the adhesive sheet 32, so that the adhesive sheet 32 ​​is partially peeled away from the semiconductor chip C following the surface of the protrusions 40, and the transfer head (equipped with a nozzle 11) images a plurality of semiconductor chips C, including two or more semiconductor chips C to be picked up in one work turn. The transfer head picks up two or more semiconductor chips C to be picked up in one work turn from the plurality of semiconductor chips C imaged by the third camera 13.

Description

Technical Field

[0001] The present invention relates to a transfer device for semiconductor chips that picks up semiconductor chips and transfers them to a predetermined position, and a method for picking up semiconductor chips.

Background Art

[0002] There is known a device that picks up semiconductor chips attached to an adhesive sheet in a state of being individually divided in a wafer state and transfers them to a predetermined position (for example, Patent Document 1). The pickup operation disclosed in Patent Document 1 first images a chip to be picked up among a plurality of chips attached to the sheet from above with a camera, and detects the position of the chip based on the imaging result.

[0003] Next, based on the detection result, the chip to be picked up is aligned above the ejector pins arranged below the sheet, and the ejector pins are raised in this state. As a result, the chip is pushed up by the ejector pins through the sheet and partially peeled off from the sheet, and then picked up by a pickup mechanism having a nozzle. In this way, by partially peeling off the chip from the sheet before pickup, pickup errors can be reduced.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art including Patent Document 1, since the configuration is such that one chip to be picked up is imaged and only this chip is pushed up by the ejector pins and picked up by the pickup mechanism, there is a problem of poor productivity.

[0006] Therefore, the present invention aims to provide a semiconductor chip transfer apparatus and a semiconductor chip pick-up method that can improve productivity. [Means for solving the problem]

[0007] The semiconductor chip transfer apparatus of the present invention comprises: a lower receiving section that receives an adhesive sheet on which a plurality of semiconductor chips are held by adhesive on a first surface; an imaging section that images the semiconductor chips on the adhesive sheet; and a transfer head that picks up the semiconductor chips on the adhesive sheet and transfers them to a predetermined position based on the imaging results from the imaging section, wherein the lower receiving section has a plurality of protrusions that abut against a second surface which is the surface of the adhesive sheet opposite to the first surface, intake holes formed between adjacent protrusions, and a suction section that vacuums the space below the adhesive sheet through the intake holes, and the imaging The unit has a plurality of protrusions that contact the second surface of the adhesive sheet to support the semiconductor chip through the adhesive sheet, and the suction unit sucks the space below the adhesive sheet, causing the adhesive sheet to partially peel off from the semiconductor chip following the surface of the protrusions. The transfer head then images a plurality of semiconductor chips, including two or more of the semiconductor chips to be picked up in one work turn, and the transfer head picks up two or more of the semiconductor chips to be picked up in one work turn from the plurality of semiconductor chips imaged by the imaging unit.

[0008] The semiconductor chip pickup method in the semiconductor chip transfer apparatus of the present invention comprises: a lower receiving section that receives an adhesive sheet holding a plurality of semiconductor chips by adhesive on a first surface; an imaging section that images the semiconductor chips on the adhesive sheet; and a transfer head that picks up the semiconductor chips on the adhesive sheet and transfers them to a predetermined position based on the imaging results from the imaging section, wherein the lower receiving section has a plurality of protrusions that abut against a second surface which is the surface of the adhesive sheet opposite to the first surface, intake holes formed between adjacent protrusions, and a suction section that vacuums the space below the adhesive sheet through the intake holes. A method for picking up semiconductor chips, comprising: an imaging step in which the imaging unit images at least two or more semiconductor chips to be picked up by the transfer head in one work turn, in which the adhesive sheet is partially peeled away from the semiconductor chip by the adhesive unit, with the plurality of protrusions contacting the second surface of the adhesive sheet and supporting the semiconductor chip from below via the adhesive sheet, and the adhesive sheet being partially peeled away from the semiconductor chip in accordance with the surface of the protrusions; and a pickup step in which the transfer head picks up two or more semiconductor chips to be picked up in one work turn from the plurality of semiconductor chips imaged by the imaging unit. [Effects of the Invention]

[0009] According to the present invention, productivity can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] This is a perspective view of a semiconductor chip transfer device according to one embodiment of the present invention. [Figure 2] (a)(b)(c) These are schematic cross-sectional views illustrating the configuration and operation of a semiconductor chip transfer device according to one embodiment of the present invention. [Figure 3] A support base constituting a semiconductor chip transfer device according to one embodiment of the present invention, where (a) is a schematic perspective view and (b) is a schematic perspective view of a projection. [Figure 4]This is a schematic plan view of a support base constituting a semiconductor chip transfer device in one embodiment of the present invention. [Figure 5] This is a block diagram showing the configuration of the control system for a semiconductor chip transfer device according to one embodiment of the present invention. [Figure 6] This is a flowchart showing a method for removing a semiconductor chip using a semiconductor chip transfer device according to one embodiment of the present invention. [Figure 7] (a)(b)(c) These are schematic partial cross-sectional views of a support base illustrating the process by which an adhesive sheet is peeled off in a semiconductor chip transfer device according to one embodiment of the present invention. [Figure 8] This is a flowchart showing a method for transferring a semiconductor chip using a semiconductor chip transfer apparatus according to one embodiment of the present invention. [Figure 9] (a)(b) This is an explanatory diagram illustrating the operation of a semiconductor chip transfer method performed by a semiconductor chip transfer apparatus according to one embodiment of the present invention. [Modes for carrying out the invention]

[0011] A semiconductor chip transfer apparatus according to one embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the semiconductor chip transfer apparatus and semiconductor chip supply apparatus. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted.

[0012] First, with reference to Figure 1, the configuration of the main parts of the semiconductor chip transfer device (hereinafter simply abbreviated as "transfer device") will be explained. The transfer device 1 has the function of picking up the semiconductor chip C cut from the wafer with the transfer head 10 and placing it in a predetermined position. In this specification, the series of operations from picking up the semiconductor chip C to placing it in a predetermined position is defined as "transfer".

[0013] On the upper surface of the base (not shown) provided in the transfer device 1, a supply device moving mechanism 3, a first camera 4, and a transfer object moving mechanism 5 are arranged side by side in one direction (hereinafter referred to as the "X-axis direction"). The supply device moving mechanism 3 moves a moving table 3a on which a supply device (hereinafter simply abbreviated as the "supply device") 30 of the semiconductor chip C is arranged in a direction perpendicular to the X-axis direction (hereinafter referred to as the "Y-axis direction"). By moving the moving table 3a along the Y-axis direction by the supply device moving mechanism 3, the supply device 30 moves back and forth in the Y-axis direction. The supply device 30 supplies the semiconductor chip C to the transfer head 10. The detailed structure of the supply device 30 will be described later.

[0014] The first camera 4 has an imaging surface facing upward, and when the transfer head 10 holding the semiconductor chip C with the nozzle 11 provided in the transfer head 10 passes above, the semiconductor chip C held by the nozzle 11 is imaged from below.

[0015] The transfer object moving mechanism 5 moves a transfer object holding portion 6 arranged at the upper part along the Y-axis direction. The transfer object holding portion 6 holds a transfer object T such as a tray, a printed circuit board, or a sheet onto which the semiconductor chip C supplied from the supply device 30 is transferred. In the present embodiment, an example is shown in which a flat tray is used as the transfer object T and the transfer object holding portion 6 holds the tray.

[0016] In FIG. 1, on the upper surface of the base (not shown), outside the supply device moving mechanism 3 and the transfer object moving mechanism 5 in the X-axis direction, a pair of columns 7 are provided extending upward. Between the pair of columns 7, a beam 8 extending in the X-axis direction is arranged. On the beam 8, a transfer head moving mechanism 9 which is a linear drive mechanism is arranged.

[0017] The transfer head 10 is mounted on the beam 8. The transfer head moving mechanism 9 moves the transfer head 10 along the X-axis direction within the XY plane (horizontal plane). A plurality of nozzles 11 are mounted below the transfer head 10. A vacuum suction path is formed inside the nozzle 11, and the semiconductor chip C is held by suction through the vacuum suction path by operating a vacuum suction source not shown.

[0018] The transfer head 10 moves each nozzle 11 up and down in the Z-axis direction perpendicular to the XY plane, and rotates it with the Z-axis (the axis of the nozzle) as the rotation axis (center). Then, by moving the nozzle 11 up and down and rotating it, the transfer head 10 picks up the semiconductor chip C supplied by the supply device 30 and places it on the transfer object T.

[0019] In the present embodiment, as the transfer head 10, a rotary head having a plurality of nozzles 11 that orbit on concentric circles is shown as an example. Note that the transfer head 10 may be a transfer head in which a plurality of nozzles 11 are arranged in one direction. The transfer head 10 picks up a plurality of semiconductor chips C with individual nozzles 11 in one work cycle of moving to the supply device 30. Note that the number of semiconductor chips picked up in one work cycle is not necessarily the total number of nozzles 11 mounted on the transfer head 10, and there are cases where a smaller number of semiconductor chips C than the total number of nozzles 11 are picked up according to the production plan, the number of work cycles, and the like. As used in this specification, "one work cycle" refers to a series of work cycles in which the transfer head 10 that has moved above the adhesive sheet 32 picks up a plurality of semiconductor chips C on the adhesive sheet 32 using a plurality of nozzles 11, and then moves to a predetermined position above the transfer object T and places the plurality of semiconductor chips C.

[0020] In the present embodiment, an example is shown in which the transfer head 10 is moved in the X-axis direction by the transfer head moving mechanism 9, and each of the supply device 30 and the transfer object T is moved in the Y-axis direction by the supply device moving mechanism 3 and the transfer object moving mechanism 5, but the transfer device 1 is not limited to this configuration. For example, the transfer device 1 may be an XY robot in which the positions of the supply device 30 and the transfer object T are fixed with respect to the base 2, and the transfer head moving mechanism 9 moves the transfer head 10 in two axial directions (X-axis direction and Y-axis direction) in the horizontal plane.

[0021] The transfer head 10 is equipped with a second camera 12 whose imaging surface is oriented downwards. The first camera 12 moves in the X-axis direction in conjunction with the transfer head 10 by the drive of the transfer head moving mechanism 9, and at the same time images the object to be transferred T from above. When transferring the semiconductor chip C to the object to be transferred T, the position of the nozzle 11 in the XY plane relative to the object to be transferred T is determined based on the recognition processing results of the images obtained by the first camera 4 and the second camera 12, respectively.

[0022] The beam 8 is further equipped with a camera unit 14 that is movable along the X-axis, the camera unit having a third camera 13 with its imaging surface facing downward. The third camera 13 images the semiconductor chip C on the adhesive sheet 32 ​​(Figure 2) supplied by the supply device 30 from above. The camera unit 14 can move independently of the transfer head 10 and is mounted on the side further away from the transfer head 10 than the object to be transferred T.

[0023] This allows the semiconductor chip C supplied by the supply device 30 to be imaged by the third camera 13 while the transfer head 10 moves above the object T to be transferred and places the semiconductor chip C on it. The third camera 13 is an imaging unit that images the semiconductor chip C on the adhesive sheet 32.

[0024] Next, the supply device 30 will be described with reference to Figure 2. The supply device 30 is equipped with a plurality of expandable rings 31 that hold the outer edge of a circular adhesive sheet 32 ​​(see also Figure 1). The adhesive sheet 32 ​​is stretchable, and a plurality of semiconductor chips C, which form a rectangle when viewed from above, are held in a grid arrangement on its adhesive surface 32a (first surface). The semiconductor chips C are obtained by cutting a semiconductor wafer with a laser beam or a blade.

[0025] The expandable ring 31 holds the adhesive sheet 32 ​​by sandwiching the wafer ring (not shown), which is attached to the periphery of the adhesive sheet 32, from above and below. The expandable ring 31 moves up and down in the Z-axis direction by a lifting mechanism 80 (Figure 1). The lifting mechanism 80 has a lifting rod 81 with one end fixed to the lower surface of the expandable ring 31. The expandable ring 31 moves up and down by driving a drive motor (not shown) provided in the lifting mechanism 80, which moves the lifting rod 81 in the Z-axis direction.

[0026] In Figures 2(a) and (b), a decompression chamber 33 is provided inside the expanding ring 31. The decompression chamber 33 forms a sealed space below the adhesive sheet 32 ​​held by the expanding ring 31.

[0027] The decompression chamber 33 is composed of a flat portion 34 that unfolds in the XY plane below the adhesive sheet 32 ​​held by the expanding ring 31, and a peripheral wall portion 35 that extends vertically upward from the periphery of the flat portion 34. When the adhesive sheet 32 ​​is set in the supply device 30, the adhesive sheet 32 ​​is supported from the base material surface (second surface), which is the back surface, by the edge of the peripheral wall portion 35. The flat portion 34 has a decompression port 46 to which a decompression pump 70 acting as a suction unit is connected, and a rod insertion hole 38 through which a lifting rod 37 that supports a support base 36 provided inside the decompression chamber 33 is inserted.

[0028] The support base 36 has the function of supporting the adhesive sheet 32 ​​from below. The support base 36 is composed of a base portion 39, a plurality of protrusions 40, a groove portion 41, and an air intake hole 42. The base portion 39 is formed in a rectangular shape in plan view, the same as the arrangement shape of the semiconductor chip C that is held in adhesive position on the adhesive surface 32a of the adhesive sheet 32, and an electric heating wire heater 43 is provided inside. A lifting rod 37, which is part of a lifting means 44 having a drive motor, is connected to the bottom surface of the base portion 39, and the base portion 39 can be raised and lowered by raising and lowering the lifting rod 37 in the Z-axis direction.

[0029] Multiple protrusions 40 support the semiconductor chip C from below via the adhesive sheet 32 ​​by contacting the substrate surface 32b of the adhesive sheet 32 ​​held by the expand ring 31. As shown in Figures 3 and 4, the protrusions 40 are formed in a roughly square pyramidal shape and are arranged in multiples at equal intervals vertically and horizontally on the upper surface of the base portion 39.

[0030] The size and spacing of the protrusions 40 are not particularly limited, but it is preferable that the size and spacing of the protrusions 40 be such that there are three or more contact points between the protrusions 40 and the semiconductor chip C in order to support the semiconductor chip C in a stable position. The shape of the protrusions 40 is not particularly limited, as long as they have a tip shape that minimizes the contact area so as not to damage the adhesive sheet 32.

[0031] In Figure 3(b), the groove 41 consists of gaps between multiple protrusions 40, and is arranged to form a grid when the base portion 39 is viewed from above, as shown in Figure 4. The intake holes 42 are drilled through the base portion 39 at the four corners of the protrusions 40 on the bottom surface of the groove 41, connecting the groove 41 and the bottom surface of the base portion 39.

[0032] In Figure 1, the pressurizing unit 50 is located on one end of the supply device moving mechanism 3, along the movement path of the supply device 30 in the Y-axis direction. The "one end" of the supply device moving mechanism 3 refers to the side of the supply device moving mechanism 3 that is away from the beam 8.

[0033] In Figure 2(c), the pressurizing section 50 includes a pressurizing chamber 51 that forms a sealed space above the adhesive sheet 32 ​​held by the expanding ring 31. The pressurizing chamber 51 is composed of a flat section 52 that unfolds in the XY plane above the adhesive sheet 32 ​​and a peripheral wall section 53 that extends downward from the periphery of the flat section 52.

[0034] The flat section 52 is equipped with a pressure port 54 to which a pressure pump 71 is connected, and a lamp heater 55. The pressure chamber 51 is movable up and down in the Z-axis direction by a lifting mechanism (not shown). Figure 2(c) shows the pressure chamber 51 lowered to a height position where the edge of the peripheral wall section 53 abuts against the adhesive surface 32a of the adhesive sheet 32, forming a sealed space between the pressure chamber 51 and the adhesive sheet 32.

[0035] Next, with reference to Figure 5, the configuration of the control system of the transfer device 1 will be explained. The control device 60 of the transfer device 1 is connected to a supply device 30, a supply device moving mechanism 3, a first camera 4, a second camera 12, a third camera 13, a transfer object moving mechanism 5, a transfer head moving mechanism 9, a transfer head 10, a pressurizing unit 50, and the like.

[0036] The control device 60 includes a storage unit 61, a transfer control unit 62, and a recognition processing unit 63 as internal processing functions. The storage unit 61 stores transfer data 61a and the like. The transfer data 61a stores various data necessary for picking up the semiconductor chip C and transferring it to the transfer target object T. For example, the transfer data 61a stores the number of nozzles 11 to pick up in one work turn and coordinate information on the transfer target object T on which the semiconductor chip C is placed.

[0037] The transfer control unit 62 controls the supply device 30, the supply device moving mechanism 3, the first camera 4, the object to be transferred moving mechanism 5, the transfer head moving mechanism 9, the transfer head 10, the second camera 12, the third camera 13, the pressurizing unit 50, etc., to perform various operations for transferring the semiconductor chip C supplied by the supply device 30 to the object to be transferred T.

[0038] The recognition processing unit 63 processes the images obtained by the first camera 4, the second camera 12, and the third camera 13. This allows the position of the semiconductor chip C on the adhesive sheet 32 ​​and the target position for transferring the semiconductor chip C set on the object T to be transferred to be detected. Based on the recognition results from the recognition processing unit 63, the transfer head 10 is aligned with the adhesive sheet 32 ​​and the object T to be transferred, which are set in the supply device 30.

[0039] The transfer device 1 of this embodiment is configured as described above. Next, a method for partially peeling the semiconductor chip C from the adhesive sheet 32 ​​will be described with reference to the flowchart in Figure 6. First, the supply device 30 is moved to the pressurizing section 50 by driving the supply device moving mechanism 3 (ST1: pressurizing section moving step). Then, as shown in Figure 2(b), the expand ring 31 holding the adhesive sheet 32 ​​is lowered relative to the depressurizing chamber 33 (arrow a). As a result, the contact point between the substrate surface 32b of the adhesive sheet 32 ​​and the edge of the peripheral wall 35 of the depressurizing chamber 33 acts as a fulcrum, and the adhesive sheet 32 ​​is stretched (ST2: expand step). As the adhesive sheet 32 ​​is stretched, the distance between adjacent semiconductor chips C that are held adhesively on the adhesive surface 32a is increased.

[0040] Next, as shown in Figure 2(c), the support base 36 is raised in the direction of arrow b, thereby supporting the adhesive sheet 32 ​​from below with the multiple protrusions 40 (ST3: lowering step). In this state, the tops of the multiple protrusions 40 support the semiconductor chip C from the bottom surface via the adhesive sheet 32, and a sealed space S1 is formed between the groove 41 and the adhesive sheet 32. Before raising the support base 36, the multiple protrusions 40 are heated by the electric heating element heater 43.

[0041] Next, as shown in Figure 2(c), with the lamp heater 55 pre-activated, the pressure chamber 51 is lowered to a height position where the edge of the peripheral wall portion 53 contacts the adhesive surface 32a of the adhesive sheet 32 ​​(ST4: pressure chamber lowering step). This creates a sealed space S2 between the pressure chamber 51 and the adhesive sheet 32. Note that the lowering step (ST3) and the pressure chamber lowering step (ST4) may be performed in reverse order or simultaneously.

[0042] Next, the pressure inside the depressurization chamber 33 is reduced (ST5: depressurization process). That is, by operating the depressurization pump 70, the inside of the depressurization chamber 33 is sucked in through the depressurization port 46. Consequently, the space S1 is depressurized through the intake hole 42 that penetrates to the bottom surface of the base portion 39. When the space S1 is depressurized, a downward pulling force acts on the adhesive sheet 32. At this time, the support base 36 is heated by the electric heating element heater 43, and the adhesive sheet 32 ​​is heated through the projection 40. This heat reduces the adhesive strength of the adhesive sheet 32.

[0043] Next, the inside of the pressure chamber 51 is pressurized (ST6: pressurization step). That is, the pressurizing pump 71 is activated to pressurize the space S2 inside the pressure chamber 51 through the pressurizing port 54. This applies a force that pushes down the adhesive sheet 32. At this time, the lamp heater 55 heats the adhesive sheet 32, which reduces the adhesive strength of the adhesive sheet 32 ​​and promotes the peeling of the semiconductor chip C.

[0044] The depressurization process (ST5) and the pressurization process (ST6) may be performed in reverse order or simultaneously. Next, after stopping the operation of the pressurizing pump 71, the pressurizing chamber 51 is raised to open the top of the adhesive sheet 32 ​​(ST7: pressurizing chamber raising process). After these steps, the partial peeling of the semiconductor chip C from the adhesive sheet 32 ​​is completed.

[0045] Figures 7(a) and 7(b) sequentially show the process by which the adhesive sheet 32 ​​is peeled off the semiconductor chip C by the transfer device 1. Figure 7(a) shows the state in which the projection 40 of the support base 36 is in contact with the base material surface 32b of the adhesive sheet 32 ​​and the pressure chamber 51 has been lowered. At this time, the pressure in space S1 and the pressure in space S2 have not yet been performed, and only the heating of the adhesive sheet 32 ​​by the electric heating wire heater 43 and the lamp heater 55 is being performed.

[0046] Figure 7(b) shows the state of the adhesive sheet 32 ​​when both the depressurization of space S1 and the pressurization of space S2 are performed. The adhesive sheet 32 ​​is subjected to both forces: a downward pulling force P1 from the substrate surface 32b side due to the depressurization of space S1, and a downward pushing force P2 from the adhesive surface 32a side due to the pressurization of space S2. Therefore, the adhesive force of the adhesive surface 32a on the semiconductor chip C is overcome by the action of both pressures, and the adhesive sheet 32 ​​bends to conform to the surface of the protrusion 40. As a result, the semiconductor chip C is partially peeled off from the adhesive sheet 32. Although the pressurization step (ST6) is not essential, performing this step makes it possible to more reliably peel the semiconductor chip C off from the adhesive sheet 32.

[0047] In the above configuration, the multiple protrusions 40 that abut the second surface (base material surface 32b), which is the surface opposite to the first surface (adhesive surface 32a) of the adhesive sheet 32, the intake holes 42 formed between adjacent protrusions 40, and the decompression pump 70, which acts as a suction unit that vacuums the space below the adhesive sheet 32 ​​through the intake holes 42, function as a lower support unit that supports the adhesive sheet 32, which holds the multiple semiconductor chips C by adhesion on the first surface.

[0048] As explained above, the adhesive sheet 32 ​​is stretched by the expander ring 31, and the individual semiconductor chips C are randomly arranged on the adhesive sheet 32 ​​by the predetermined pressure acting in the depressurization chamber 33 and the pressurization chamber 51.

[0049] Next, referring to the flowchart in Figure 8, a transfer method will be described in which the semiconductor chip C is partially detached from the adhesive sheet 32, and then picked up from the supply device 30 and placed on the object to be transferred T. First, the supply device 30 is moved to the supply position of the semiconductor chip C (the position of the supply device 30 shown in Figure 1) by driving the supply device moving mechanism 3 (ST11: supply position movement process). At this time, the supply device 30 is still supporting the adhesive sheet 32 ​​from which the semiconductor chip C has been partially detached with the support base 36 (multiple protrusions 40). Also, the depressurization of the space S1 by the depressurization pump 70 is kept in place (Figure 7(c)).

[0050] Next, the third camera 13 images the desired semiconductor chip C on the adhesive sheet 32 ​​(ST12: imaging step). That is, the third camera 13 images multiple semiconductor chips C that the transfer head 10 will pick up from the adhesive sheet 32 ​​in one work turn using multiple nozzles 11. For example, if three semiconductor chips C are picked up in one work turn, the three semiconductor chips C are imaged by the third camera 13, as shown in Figure 9(a). In Figure 9(a), the hatched semiconductor chips C indicate that they are the objects to be imaged.

[0051] If the imaging field of the third camera 13 is wide-angle, multiple semiconductor chips C may be imaged simultaneously. On the other hand, if the imaging field of the third camera 13 is narrow-angle, multiple semiconductor chips C to be picked up may be imaged individually while the third camera 13 and the supply device 30 are moved relative to each other in the XY direction.

[0052] In other words, during the imaging process (ST12), the multiple protrusions 40 contact the second surface of the adhesive sheet 32 ​​to support the semiconductor chip C from below via the adhesive sheet 32, and the suction unit (pressure reducing pump 70) sucks the space S1 below the adhesive sheet 32, causing the adhesive sheet 32 ​​to be partially peeled away from the semiconductor chip C following the surface of the protrusions 40. In this state, the imaging unit (third camera 13) images at least two or more semiconductor chips C to be picked up by the transfer head 10 in one work turn.

[0053] The images obtained are processed by the recognition processing unit 63. This allows for the detection of the position of each semiconductor chip C to be picked up in a single work turn relative to the adhesive sheet 32. The alignment of the third camera 13 and the adhesive sheet 32 ​​in the XY plane during imaging of the semiconductor chip C is performed by driving the supply device moving mechanism 3 and the beam 8.

[0054] Next, the transfer head 10 picks up the semiconductor chip C (ST13: Pickup process). That is, the camera unit 14 having the third camera 13 is moved away from above the supply device 30. Then, based on the position of the semiconductor chip C detected by the recognition processing unit 63, the transfer head 10 and the supply device 30 are moved a small amount in the XY plane, and each semiconductor chip C to be picked up is picked up by each nozzle 11 (Figure 9(b)).

[0055] Figure 9(b) shows how three semiconductor chips C (semiconductor chips C with hatching) that have been imaged by the third camera 13 and further processed by the recognition processing unit 63 are picked up by different nozzles 11. In this way, the transfer head 10 picks up two or more semiconductor chips C to be picked up in a single work turn from among the multiple semiconductor chips C imaged by the imaging unit (third camera 13).

[0056] Next, the first camera 4 sequentially images the multiple semiconductor chips C, each individually held by the multiple nozzles 11, as the transfer head 10 passes above the first camera 4 (ST14: imaging step). The images obtained are processed by the recognition processing unit 63. This allows the position of the semiconductor chips C held by the nozzles 11 to be detected.

[0057] Next, the object to be transferred T is imaged by the second camera 12 (ST15: imaging step). The image obtained is processed by the recognition processing unit 63. This detects the target position for transferring the semiconductor chip C set on the object to be transferred T.

[0058] Next, the semiconductor chip C held by the nozzle 11 is placed on the object to be transferred T (ST16: Placement step). That is, based on the position of the semiconductor chip C held by the nozzle 11 detected by the recognition processing unit 63 and the transfer target position on the object to be transferred T, the nozzle 11 is aligned with the object to be transferred T. Then, by lowering the nozzle 11, the semiconductor chip C is placed on the object to be transferred T. This placement step (ST16) is repeated for each nozzle 11 holding the semiconductor chip C.

[0059] As described above, in the transfer device 1 of this embodiment, multiple protrusions 40 contact the second surface of the adhesive sheet 32 ​​to support the semiconductor chip C from below via the adhesive sheet 32, and the suction unit (pressure reducing pump 70) sucks the space S1 below the adhesive sheet 32, so that the adhesive sheet 32 ​​is partially peeled away from the semiconductor chip C following the surface of the protrusions 40, and the imaging unit (third camera 13) images at least two or more semiconductor chips C to be picked up by the transfer head 10 in one work turn.

[0060] In this manner, the adhesive sheet 32 ​​supported from below by the multiple protrusions 40 is deformed into a wavy shape following the surface of the protrusions 40 by the action of at least the decompression pump 70. As a result, the positions of each semiconductor chip C on the adhesive sheet 32 ​​become random, but in this embodiment, at least two or more semiconductor chips C to be picked up in one work turn are imaged by the third camera 13, and based on the obtained image, they are picked up by multiple nozzles. Therefore, multiple semiconductor chips C on the adhesive sheet 32 ​​can be picked up accurately, quickly, and efficiently, and as a result, productivity can be improved.

[0061] The present invention is not limited to the embodiments described herein, and the design can be modified as appropriate without departing from the spirit of the invention. For example, the semiconductor chip C imaged by the third camera 13 in one work turn may include semiconductor chip C to be picked up in subsequent work turns. Alternatively, instead of the third camera 13, as shown in Figure 1, a fourth camera 90 may be placed above the supply device 30 which has moved to the semiconductor chip C supply position, and this fourth camera 90 may be used to image the semiconductor chip C on the adhesive sheet 32. In this case, it is necessary to provide a mechanism to move the fourth camera 90 in the X-axis direction, or a mechanism to move the supply device 30 in the X-axis direction. [Industrial applicability]

[0062] The present invention can improve productivity and is particularly useful in the field of industrial machinery for transferring semiconductor chips to desired objects. [Explanation of Symbols]

[0063] 1. Transfer device (semiconductor chip transfer device) 10 Transfer head 13. Third camera (imaging unit) 32 Adhesive Sheets 32a Adhesive surface (first surface) 32b Substrate surface (second surface) 40 protrusions 42 Intake ports 70 Pressure Reducing Pump C Semiconductor chip S1 space

Claims

1. A lower support portion that supports an adhesive sheet holding multiple semiconductor chips by adhesive on a first surface, An imaging unit for imaging the semiconductor chip on the adhesive sheet, The system includes a transfer head that picks up the semiconductor chip on the adhesive sheet and transfers it to a predetermined position based on the imaging results from the imaging unit, The aforementioned lower support portion is, Multiple protrusions that abut the second surface, which is the surface of the adhesive sheet opposite to the first surface, An intake vent formed between adjacent protrusions, It has a suction unit that vacuums the space below the adhesive sheet through the intake hole, The imaging unit images a plurality of semiconductor chips, including two or more of the semiconductor chips to be picked up by the transfer head in one work turn, with the plurality of protrusions contacting the second surface of the adhesive sheet to support the semiconductor chip through the adhesive sheet, and the suction unit sucking the space below the adhesive sheet so that the adhesive sheet is partially peeled away from the semiconductor chip following the surface of the protrusions. The transfer head is a semiconductor chip transfer device that picks up two or more semiconductor chips to be picked up in a single work turn from among a plurality of semiconductor chips captured by the imaging unit.

2. A lower support portion that supports an adhesive sheet holding multiple semiconductor chips by adhesive on a first surface, An imaging unit for imaging the semiconductor chip on the adhesive sheet, The system includes a transfer head that picks up the semiconductor chip on the adhesive sheet and transfers it to a predetermined position based on the imaging results from the imaging unit, The aforementioned lower support portion is, Multiple protrusions that abut the second surface, which is the surface of the adhesive sheet opposite to the first surface, An intake vent formed between adjacent protrusions, A semiconductor chip pickup method in a semiconductor chip transfer apparatus, comprising a suction unit that vacuum-suctions the space below the adhesive sheet through the aforementioned intake hole, The imaging step involves imaging at least two or more of the semiconductor chips to be picked up by the transfer head in one work turn, with the plurality of protrusions in contact with the second surface of the adhesive sheet and supporting the semiconductor chip through the adhesive sheet, and the suction unit sucking the space below the adhesive sheet so that the adhesive sheet is partially peeled away from the semiconductor chip following the surface of the protrusions, and the imaging unit imaging at least two or more of the semiconductor chips to be picked up by the transfer head in one work turn, A method for picking up semiconductor chips in a semiconductor chip transfer apparatus, comprising a pick-up step of picking up two or more semiconductor chips to be picked up in one work turn from among a plurality of semiconductor chips captured by the imaging unit using the transfer head.

Images