ACF application device and ACF application method

The ACF bonding apparatus with imaging and determination units addresses the issue of detecting tape feeding mechanism abnormalities, ensuring precise ACF attachment to substrates.

JP2026070695APending Publication Date: 2026-04-28PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2024-10-16
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing ACF attaching devices fail to accurately detect abnormalities in the tape feeding mechanism, leading to improper attachment of ACF to substrates.

Method used

An ACF bonding apparatus equipped with a supply unit, cutting unit, tape feeding mechanism, pressing unit, imaging unit, and determination unit to detect abnormalities in the tape feeding mechanism by imaging the cut portions of the ACF layer and analyzing the captured images.

Benefits of technology

Enables accurate detection of abnormalities in the tape feeding mechanism, ensuring proper attachment of ACF to substrates and preventing defects in the manufacturing process.

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Abstract

The present invention provides an ACF (Acoustic Fiber Cover) application device that can accurately detect abnormalities in the tape feeding mechanism. [Solution] The ACF application device 10 includes a supply unit 21 for supplying tape, a cutting unit 22 for cutting the ACF layer contained in the tape supplied from the supply unit 21 to form ACF slices supported on a base material layer, a tape feeding mechanism 23 for feeding the tape containing the ACF slices supported on the base material layer, a pressing unit 24 for peeling the ACF slices supported on the base material layer contained in the tape fed by the tape feeding mechanism 23 from the base material layer and pressing them onto a substrate, an imaging unit 25 for generating an image by imaging the cut locations in the ACF layer supported on the base material layer contained in the tape fed by the tape feeding mechanism 23 that have been cut by the cutting process, and a determination unit 32 for determining whether or not there is an abnormality in the tape feeding mechanism 23 based on the image.
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Description

Technical Field

[0001] The present invention relates to an ACF (Anisotropic Conductive Film) attaching device and an ACF attaching method for attaching an ACF to a substrate.

Background Art

[0002] Conventionally, there is a device for attaching an ACF as an adhesive member for adhering components to a substrate (see, for example, Patent Document 1). The device conveys the ACF by a tape conveyance unit, for example, and attaches the ACF to the substrate by a pressing tool provided in a sticking head.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, when an abnormality occurs in a tape feeding mechanism, which is a mechanism for feeding an ACF such as the above-described tape conveyance unit, the ACF is not fed to an appropriate position and the ACF cannot be appropriately attached to the substrate. Therefore, a device that can detect an abnormality in the tape feeding mechanism is required.

[0005] The present invention provides an ACF attaching device that can accurately detect an abnormality in a tape feeding mechanism.

Means for Solving the Problems

[0006] An ACF bonding apparatus according to one aspect of the present invention comprises: a supply unit for supplying a tape including a base layer and an ACF (Anisotropic Conductive Film) layer; a cutting unit for performing a cutting process to form an ACF slice supported by the base layer by cutting the ACF layer contained in the tape supplied from the supply unit; a tape feeding mechanism for performing a tape feeding process to feed the tape including the ACF slice supported by the base layer; a pressing unit for performing a pressing process to peel the ACF slice supported by the base layer contained in the tape fed by the tape feeding mechanism from the base layer and press it onto a substrate; an imaging unit for performing an imaging process to generate an image by imaging the cut portion of the ACF layer supported by the base layer contained in the tape fed by the tape feeding mechanism that has been cut by the cutting process; and a determination unit for determining whether or not there is an abnormality in the tape feeding mechanism based on the image.

[0007] Furthermore, in one aspect of the present invention, the ACF application method involves a cutting unit performing a cutting process to form an ACF slice supported by the base layer by cutting the ACF layer contained in a tape supplied from a supply unit, which includes a base layer and an ACF layer; a tape feeding mechanism performing a tape feeding process to feed the tape containing the ACF slice supported by the base layer; a crimping unit performing a crimping process to peel the ACF slice supported by the base layer contained in the tape fed by the tape feeding mechanism from the base layer and crimp it onto a substrate; an imaging unit performing an imaging process to generate an image by imaging the cut portion of the ACF layer supported by the base layer contained in the tape fed by the tape feeding mechanism that was cut by the cutting process; and a determination unit determining whether or not there is an abnormality in the tape feeding mechanism based on the image. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an ACF application device that can accurately detect abnormalities in the tape feeding mechanism. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 shows the configuration of an ACF application device according to an embodiment. [Figure 2] Figure 2 is a front view showing the ACF attachment mechanism according to an embodiment. [Figure 3] Figure 3 is a side view showing the ACF attachment mechanism according to an embodiment. [Figure 4] Figure 4 is a top view showing the ACF attachment mechanism according to an embodiment. [Figure 5] Figure 5 is a partial cross-sectional view showing a guide roller according to an embodiment. [Figure 6] Figure 6 is a flowchart showing the processing procedure of the ACF application device according to the embodiment. [Figure 7] Figure 7 is a diagram illustrating the specific processing steps of the pasting process and imaging process in the ACF pasting apparatus according to the embodiment. [Figure 8] Figure 8 is a flowchart showing a first example of the determination process of the ACF application device according to the embodiment. [Figure 9] Figure 9 shows a first example of an image captured according to the embodiment. [Figure 10] Figure 10 is a flowchart showing a second example of the determination process of the ACF application device according to the embodiment. [Figure 11] Figure 11 shows a second example of an image captured according to the embodiment. [Figure 12] Figure 12 is a flowchart showing a third example of the determination process of the ACF application device according to the embodiment. [Figure 13] Figure 13 shows a third example of an image captured according to the embodiment. [Figure 14] Figure 14 shows a fourth example of an image captured according to the embodiment. [Figure 15] Figure 15 shows a fifth example of an image captured according to the embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangements and connection forms of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Thus, among the components in the following embodiments, components not described in the independent claims are described as optional components.

[0011] Also, each figure is a schematic diagram and is not necessarily drawn precisely. Also, in each figure, the same constituent members are denoted by the same reference numerals.

[0012] Also, in the following embodiments, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The vertical direction is referred to as the Z-axis direction or the up-and-down direction, one direction in the plane perpendicular to the vertical direction is referred to as the Y-axis direction or the depth direction, and the direction perpendicular to the Y-axis direction in that perpendicular plane is referred to as the X-axis direction, the left-and-right direction, or the lateral direction. Also, in the following embodiments, the plus side in the Z-axis direction is upward or above, and the minus side in the Z-axis direction is downward or below. Also, in the following embodiments, the plus side in the Y-axis direction is the back side or the back, and the minus side in the Y-axis direction is the front side or the front. Also, in the following embodiments, the plus side in the X-axis direction is the right side or the right, and the minus side in the X-axis direction is the left side or the left.

[0013] Also, in the following embodiments, the coordinates in the captured image are represented by a three-axis orthogonal coordinate system of the X1-axis, Y1-axis, and Z1-axis. For example, the X1-axis is an axis corresponding to the X-axis, the Y1-axis is an axis corresponding to the Y-axis, and the Z1-axis is an axis corresponding to the Z-axis. Also, the plus and minus sides of the X1-axis, Y1-axis, and Z1-axis correspond to the plus and minus sides of the X-axis, Y-axis, and Z-axis.

[0014] In the following embodiments, the terms "upper" and "lower" do not refer to the upward (vertically upward) and downward (vertically downward) directions in absolute space recognition, but are used as terms defined by relative positional relationships.

[0015] Also, the numerical values in the following embodiments are all examples, and other numerical values may also be used.

[0016] In this specification, ordinal numbers such as "first" and "second" do not mean the number or order of components, unless otherwise specified, but are used for the purpose of avoiding confusion and distinguishing between components of the same kind.

[0017] Also, in the following embodiments, for example, when described in contrast to "above a threshold value" and "below a threshold value", it means being distinguished by the threshold value, and may respectively mean greater than the threshold value and less than or equal to the threshold value.

[0018] (Embodiment) [Configuration] First, the configuration of the ACF pasting device according to the embodiment will be described.

[0019] FIG. 1 is a diagram showing the configuration of an ACF pasting device 10 according to the embodiment. FIGS. 2 to 4 are diagrams showing the specific configuration of an ACF pasting mechanism 20 according to the embodiment. Specifically, FIG. 2 is a front view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 3 is a side view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 4 is a top view showing the ACF pasting mechanism 20 according to the embodiment. In FIG. 4, a part of the ACF pasting mechanism 20 is shown.

[0020] The ACF bonding apparatus 10 is a device for bonding components to a substrate 3 using ACF (more specifically, ACF segments tp3 (see Figure 7) peeled off from the tape tp). Specifically, the ACF bonding apparatus 10 uses a bonding head 223 to bond segments (ACF segments tp3) of the ACF layer tp2 (see Figure 7) contained in the tape tp to the substrate 3 placed on the stage 214.

[0021] The ACF bonding apparatus 10 is part of a component mounting system for producing, for example, display panels. In this component mounting system, for example, the ACF bonding apparatus 10 attaches ACF slices tp3 to electrode portions 4 provided on a substrate 3, and a component crimping device (not shown) heat-presses the substrate 3 and the component via the ACF slices tp3. The ACF bonding apparatus 10 attaches ACF slices tp3 to a substrate 3 that has been transported from an upstream device by a transport unit that transports the substrate 3. The substrate 3 with the ACF slices tp3 attached is then transported by the transport unit to a component crimping device located downstream of the ACF bonding apparatus 10.

[0022] The tape tp includes a base layer tp1 (see Figure 7) and an ACF layer tp2. The base layer tp1 is a separator for supporting the ACF layer tp2. The base layer tp1 is a tape-shaped film made of, for example, a resin such as polyethylene terephthalate. The ACF layer tp2 is a tape-shaped layer made of ACF. The ACF section tp3 is a section formed by cutting the ACF layer tp2.

[0023] The ACF bonding apparatus 10 forms an ACF section tp3 by cutting (half-cutting) the ACF layer tp2 to a predetermined size so that it remains held in place by the base layer tp1 by the cutting unit 22. Furthermore, the ACF bonding apparatus 10 peels the ACF section tp3 from the base layer tp1 by moving the base layer tp1 while holding it between two peeling pins. Finally, the ACF bonding apparatus 10 adjusts the position of the substrate 3 placed on the stage 214 and uses the bonding head 223 to bond the ACF section tp3, which has been cut to a predetermined size, to the substrate 3.

[0024] An example of substrate 3 is a flexible film-like substrate formed from resin or the like. However, substrate 3 may also be a rigid substrate such as a glass substrate.

[0025] Examples of components that can be attached to the substrate 3 via the ACF section tp3 include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0026] The ACF application device 10 comprises an ACF application mechanism 20 and a control device 30.

[0027] The ACF attachment mechanism 20 is a mechanism that attaches ACF sections tp3 to substrates 3 brought in from upstream and then transports them downstream.

[0028] The ACF application mechanism 20 includes a supply unit 21, a cutting unit 22, a tape feeding mechanism 23, a crimping unit 24, and an imaging unit 25.

[0029] The supply unit 21 is a mechanism for supplying tape tp, which includes a base layer tp1 and an ACF layer tp2. For example, the supply unit 21 includes a tape supply reel 221.

[0030] The tape supply reel 221 is a reel that holds the tape tp. Specifically, the tape supply reel 221 is a reel around which the tape tp is wound. The tape tp is unwound from the tape supply reel 221 by the driving of one or more rollers. For example, the tape tp held on the tape supply reel 221 is fed to a predetermined position by the tape feeding mechanism 23. In this way, for example, the supply unit 21 supplies the tape tp in cooperation with the tape feeding mechanism 23.

[0031] The cutting unit 22 is a mechanism that performs a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21. For example, the cutting unit 22 includes a tape cutting unit 225.

[0032] The tape cutting unit 225 is a mechanism for cutting the ACF layer tp2 contained in the tape tp. For example, the tape cutting unit 225 comprises a backing plate 225a and a cutter 225b. For example, the tape cutting unit 225 cuts the ACF layer tp2 of the tape tp unwound from the tape supply reel 221 by moving the cutter 225b in the vertical direction. In other words, the tape cutting unit 225 performs a half-cut on the tape tp. This cut forms an ACF segment tp3. Specifically, the cutter 225b cuts the ACF layer tp2 in the tape tp by a drive mechanism having a guide and motor (not shown) driven by the control device 30. More specifically, the cutter 225b, by rising, sandwiches the tape tp between itself and the backing plate 225a and cuts through the ACF layer tp2 of the tape tp. When the substrate 3 is supported by the adhesive backup stage 224, the peripheral edge of the substrate 3 is positioned between the adhesive head 223, the backing plate 225a, the tape tp, and the adhesive backup stage 224.

[0033] The tape feeding mechanism 23 is a mechanism that feeds the tape tp held in the supply unit 21. Specifically, the tape feeding mechanism 23 performs a tape feeding process that feeds the tape tp, which includes an ACF section tp3 supported by a base layer tp1. For example, the tape is supplied from the supply unit 21 when the tape feeding mechanism 23 performs the tape feeding process. For example, the tape feeding mechanism 23 includes a feed roller 232, a press roller 233, a guide roller 234, and a tape retrieval unit 222.

[0034] The feed roller 232 is a roller for feeding the tape tp. For example, the feed roller 232 comprises a roller and a motor that rotates the roller. The motor is, for example, a servo motor, but any type of roller may be used.

[0035] The retaining roller 233 is a roller for feeding the tape tp. In this embodiment, the tape tp is supported by being sandwiched between the feed roller 232 and the retaining roller 233, and the tape tp is fed in a predetermined direction by the rotation of the feed roller 232. The feed roller 232 and the retaining roller 233 are, for example, pinch rollers. Thus, for example, the tape feeding mechanism 23 is equipped with rollers for feeding the tape tp by rotating in contact with the tape tp.

[0036] The guide roller 234 is a roller that restricts the movement of the tape tp. Specifically, the guide roller 234 restricts the movement of the tape tp in the width direction of the tape (in this embodiment, the Y-axis direction).

[0037] Figure 5 is a partial cross-sectional view showing a guide roller 234 according to an embodiment.

[0038] The guide roller 234 includes, for example, a shaft 235, a bearing 236, a guide 237, an adjustment guide 238, and a fixing screw 239.

[0039] The shaft 235 is a columnar member that rotatably supports the guide 237 and the adjustment guide 238. For example, one end of the shaft 235 is supported by a base on which the tape supply reel 221 and the adhesive head 223 are supported.

[0040] The bearing 236 is positioned between the shaft 235 and the guide 237 and the adjustment guide 238, and is a bearing that allows the guide 237 and the adjustment guide 238 to rotate.

[0041] Guide 237 and adjustment guide 238 are rollers that restrict the movement of the tape tp in the width direction. By restricting the position of the tape tp in the width direction with guides 237 and adjustment guide 238, the tape tp remains in a predetermined position in the width direction even when it is fed by the tape feeding mechanism 23.

[0042] The fixing screw 239 is used to secure the adjustment guide 238 to the guide 237. The fixing screw 239 secures the adjustment guide 238 so that its relative position to the guide 237 does not change.

[0043] Refer again to Figures 1 to 4. The tape retrieval unit 222 is a mechanism for retrieving the tape tp. For example, the tape retrieval unit 222 has a suction mechanism for sucking up the tape tp, and retrieves the tape tp by sucking it up. Specifically, the tape retrieval unit 222 retrieves the base material layer tp1 that remains after the ACF layer tp2 has been attached to the substrate 3. The tape retrieval unit 222 may also be a mechanism that is rotated by a motor (not shown) to wind up the tape tp.

[0044] The crimping unit 24 is a mechanism that performs a crimping process in which it peels off the ACF section tp3, which is supported by the base material layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, from the base material layer tp1 and crimps it onto the substrate 3. For example, the crimping unit 24 includes a bonding head 223 and a bonding backup stage 224.

[0045] The adhesion head 223 is a head that peels the ACF section tp3 from the base layer tp1 and presses it onto the substrate 3. Below the adhesion head 223 is an adhesion backup stage 224. For example, the adhesion head 223 moves up and down, driven by a control device 30, through a drive mechanism having a guide and motor (not shown), thereby pressing the ACF section tp3 onto the substrate 3.

[0046] The adhesion backup stage 224 is a backup stage that supports the edge (in other words, the peripheral edge) of the substrate 3 from below. The substrate 3 is carried from upstream to the ACF attachment mechanism 20 by the substrate moving mechanism 210, and its edge is placed on the adhesion backup stage 224. Subsequently, the ACF section tp3 is attached to the substrate 3 by the attachment head 223. The substrate moving mechanism 210 moves the substrate 3 with the ACF section tp3 attached downstream.

[0047] The substrate moving mechanism 210 is a mechanism for moving the substrate 3. The substrate moving mechanism 210 comprises an X-axis table 211, a Y-axis table 212, a Z-axis table 213, and a stage 214.

[0048] The X-axis table 211 is a mechanism for moving the stage 214 in the X-axis direction. The Y-axis table 212 is a mechanism for moving the stage 214 in the Y-axis direction. The Z-axis table 213 is a mechanism for moving the stage 214 in the Z-axis direction. The X-axis table 211, Y-axis table 212, and Z-axis table 213 are equipped with drive mechanisms such as guides and motors for moving the stage 214, and the stage 214 can be moved arbitrarily in these three axes by the control of these drive mechanisms by the control device 30.

[0049] Stage 214 is the stage on which the substrate 3 is placed. The substrate 3 is placed such that its edges protrude from the stage 214 when viewed from above. These edges are supported from below by the attachment backup stage 224 when the ACF section tp3 is attached to the substrate 3.

[0050] The X-axis table 211 is, for example, rail-shaped and is positioned along the X-axis direction on the adhesive base 229. The Y-axis table 212 is, for example, rail-shaped and is positioned on the X-axis table 211 parallel to the Y-axis direction and moves freely in the X-axis direction. The Z-axis table 213 is positioned on the Y-axis table 212 and moves freely in the Y-axis direction, raising and lowering the stage 214 provided on top of it in the Z-axis direction and rotating it around the Z-axis.

[0051] The substrate 3 is placed on the stage 214 and held in place by suction. This substrate moving mechanism 210 moves the substrate 3, which is held in place by suction on the stage 214, in the X, Y, and Z directions, and further rotates the substrate 3 around the Z axis.

[0052] For example, the substrate moving mechanism 210 rotates and moves the substrate 3 such that the peripheral edge of the substrate 3, which is held by suction on its stage 214, is placed on the adhesive backup stage 224 and supported from below by the adhesive backup stage 224.

[0053] As the adhesive head 223 descends, it presses the tape tp, which is passed between it and the adhesive backup stage 224, against the peripheral edge of the substrate 3 supported by the adhesive backup stage 224. In other words, the adhesive head 223 presses the tape tp against the peripheral edge of the substrate 3 and the adhesive backup stage 224. At this time, ACF sections tp3 are formed on the underside of the base material layer tp1 of the tape tp being pressed. In addition, multiple electrode portions 4 are formed on the peripheral edge of the substrate 3. Therefore, the ACF sections tp3 are pressed against and adhered to the electrode portions 4 of the substrate 3 and peeled off from the base material layer tp1. The base material layer tp1 from which the ACF sections tp3 have been peeled off is collected by the tape recovery unit 222.

[0054] The imaging unit 25 is a camera that performs imaging processing to generate an image by imaging the cut portions of the ACF layer tp2, which is supported by the base material layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, that have been cut by the cutting process. For example, the imaging unit 25 includes a camera 230 and a camera 231.

[0055] Camera 230 is a camera that generates an image by capturing the cut portion of the ACF layer tp2, which is supported by the substrate layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, that has been cut by the cutting process. After the ACF layer tp2 is cut by the cutting unit 22, the tape tp is fed by the tape feeding mechanism 23 from the position where the ACF layer tp2 was cut (also called the first position) to the position where the cut portion is captured by the camera 230 (also called the second position). Camera 230, for example, has a fixed position and captures the cut portion of the tape tp that has been fed to the second position. After that, for example, the tape tp is moved from the second position to the position where the ACF section tp3 is attached (pressed) to the substrate 3 by the attachment head 223 (also called the third position).

[0056] Note that the second and third positions may be the same or different. In this embodiment, the second and third positions are the same. The first, second, and third positions are, for example, located in this order along the X-axis, and are the same in the Y-axis and Z-axis directions.

[0057] Camera 231 is a camera that generates an image by imaging the ACF section tp3 attached to the substrate 3. Specifically, camera 231 images the cut portion of the ACF section tp3 attached to the substrate 3.

[0058] The images captured (generated) by cameras 230 and 231 are used, for example, to determine abnormalities in each mechanism of the ACF pasting device 10, or they are displayed on a display device (not shown) so that an operator can determine whether or not there is an abnormality. In this embodiment, the images generated by camera 230 are used to determine whether or not there is an abnormality in the tape feeding mechanism 23. Details of the process for determining whether or not there is an abnormality in the tape feeding mechanism 23 will be described later.

[0059] In this embodiment, the ACF attachment mechanism 20 comprises two attachment mechanism units 220L and 220R, an X-axis rail mechanism 228, an attachment base 229, and a camera 231.

[0060] The adhesive base 229 is a base for supporting two adhesive mechanism units 220L and 220R.

[0061] The X-axis rail mechanism 228 is positioned along the X-axis direction on the upper surface of the adhesive base 229. Two adhesive mechanism units 220L and 220R are mounted on this X-axis rail mechanism 228, side by side, so as to be movable along the X-axis direction. The X-axis rail mechanism 228 also includes a mechanism for changing the distance between the two adhesive mechanism units 220L and 220R.

[0062] The two attachment mechanism units 220L and 220R are mechanisms for attaching the ACF section tp3 to the substrate 3, and each has the same configuration.

[0063] For example, the adhesive mechanism units 220L and 220R each include a tape supply reel 221, a tape retrieval unit 222, an adhesive head 223, an adhesive backup stage 224, a tape cutting unit 225, a camera 230, a feed roller 232, a press roller 233, and a guide roller 234.

[0064] For example, after multiple ACF sections tp3 are attached to the substrate 3 by the attachment mechanism units 220L and 220R, the substrate 3 is moved by the substrate moving mechanism 210 to a position where the camera 231 takes an image, and the camera 231 takes an image.

[0065] The adhesive mechanism unit 220L and the adhesive mechanism unit 220R may each attach ACF segments tp3 to the same substrate 3, or they may each attach ACF segments tp3 to different substrates 3. Furthermore, the ACF adhesive mechanism 20 may consist of one or three or more adhesive mechanism units.

[0066] The control device 30 is a computer that controls each component of the ACF application device 10 (specifically, each component of the ACF application mechanism 20). For example, these components, or the drive mechanisms for driving these components, are communicated with the control device 30 by wireless or control lines, and perform predetermined tasks under the control of the control device 30.

[0067] The control device 30 is implemented, for example, by a communication interface for communicating with each component of the ACF pasting device 10, a non-volatile memory where the program is stored, a volatile memory which is a temporary storage area for executing the program, input / output ports for sending and receiving signals, and a processor such as a CPU (Central Processing Unit) for executing the program.

[0068] The control device 30 comprises a control unit 31, a determination unit 32, and a storage unit 33.

[0069] The control unit 31 is a processing unit that controls various operations (various tasks) of each component of the ACF application mechanism 20, such as the supply unit 21, cutting unit 22, tape feeding mechanism 23, crimping unit 24, and imaging unit 25. For example, the control unit 31 controls the operation of the crimping unit 24 based on the determination result of the determination unit 32.

[0070] For example, the control unit 31 repeatedly performs the cutting process by the cutting unit 22, the tape feeding process by the tape feeding mechanism 23, the crimping process by the crimping unit 24, and the imaging process by the imaging unit 25, thereby repeatedly imaging the cut area and repeatedly attaching the ACF section tp3 to the substrate 3.

[0071] The determination unit 32 is a processing unit that detects abnormalities in the tape feed mechanism 23 based on the captured image obtained by the imaging unit 25. Specifically, the determination unit 32 determines whether or not there is an abnormality in the tape feed mechanism 23 based on the captured image generated by the imaging unit 25 (specifically, the camera 230).

[0072] For example, the determination unit 32 determines whether there is wear on the retaining roller 233 based on the position of the cut in the captured image, which is the position of the cut in a first direction corresponding to the direction in which the tape feeding mechanism 23 feeds the tape tp, thereby determining whether there is an abnormality in the tape feeding mechanism 23. For example, if the determination unit 32 determines that there is wear on the retaining roller 233, it determines that there is an abnormality in the tape feeding mechanism 23, and if it determines that there is no wear on the retaining roller 233, it determines that there is no abnormality in the tape feeding mechanism 23.

[0073] The direction in which the tape feed mechanism 23 feeds the tape tp is, for example, the X-axis direction. The first direction is the direction in the captured image, for example, the X1 axis direction (see, for example, Figure 9), which will be described later.

[0074] Furthermore, the presence or absence of wear may be determined based on two cutting locations. For example, the control unit 31 (i) causes the cutting unit 22 to perform a first cutting process to cut the ACF layer tp2. The control unit 31 also (ii) after (i) causes the tape feeding mechanism 23 to feed the tape tp by a predetermined distance by issuing a command to the tape feeding mechanism 23. The control unit 31 also (iii) causes the cutting unit 22 to perform a second cutting process to cut the ACF layer tp2. The control unit 31 also (iv) causes the imaging unit 25 to image the first cutting location in the ACF layer tp2 cut by the first cutting process and the second cutting location in the ACF layer tp2 cut by the second cutting process to generate an image. When such processing is performed, for example, the determination unit 32 determines whether or not there is wear on the press roller 233 based on the distance between the first cutting point and the second cutting point in the captured image and a predetermined distance, thereby determining whether or not there is an abnormality in the tape feeding mechanism 23.

[0075] The determination unit 32 may also determine if there is an abnormality in the guide roller 234.

[0076] For example, the determination unit 32 determines whether or not there is a problem with the tape feeding mechanism 23 by determining whether or not the adjustment guide 238 is loose, based on the position of the cutting point in the captured image, in a second direction that is perpendicular to the first direction corresponding to the direction in which the tape feeding mechanism 23 feeds the tape tp. In other words, the determination unit 32 determines whether or not the adjustment guide 238 is loose and not properly fixed by the fixing screw 239, causing the tape tp to move in the width direction of the tape (in this embodiment, the Y-axis direction). For example, if the determination unit 32 determines that the adjustment guide 238 is loose, it determines that there is a problem with the tape feeding mechanism 23, and if it determines that the adjustment guide 238 is not loose, it determines that there is no problem with the tape feeding mechanism 23. For example, if the determination unit 32 determines that the adjustment guide 238 is loose, it determines that the adjustment guide 238 is loose if the amount of deviation (distance) from a predetermined position of the cutting point in the second direction is greater than or equal to a first threshold. On the other hand, for example, the determination unit 32 determines that the adjustment guide 238 is not loose if the amount of deviation of the cutting point from a predetermined position in the second direction is less than the first threshold.

[0077] The predetermined position and the first threshold can be arbitrarily determined and are not particularly limited. Information indicating the predetermined position and the first threshold is stored in advance in the memory unit 33, for example. The adjustment guide 238 is an example of a regulating member. The second direction is the direction in the captured image, for example, the Y1 axis direction (see Figure 13, for example), which will be described later.

[0078] Furthermore, in this embodiment, the tape tp is moved in the X-axis direction (in other words, the direction of tape extension) so as to pass through the first position, the second position, and the third position described above. At this time, if the adjustment guide 238 is loose, the tape tp may tilt with respect to the X-axis direction when fed by the tape feeding mechanism 23. In this embodiment, the cutting portion 22 cuts in a direction perpendicular to the direction of tape extension of the tape tp. Therefore, the shape of the cutting portion in the ACF layer tp2 is linear in a direction perpendicular to the direction of tape extension of the tape tp. In other words, if the tape tp does not tilt with respect to the X-axis direction when fed by the tape feeding mechanism 23, the straight line along the shape of this cutting portion will be parallel to the Y-axis direction. In other words, if the tape tp tilts with respect to the X-axis direction when fed by the tape feeding mechanism 23, the straight line along the shape of this cutting portion will be tilted in a direction parallel to the Y-axis direction.

[0079] Therefore, the determination unit 32 may determine whether or not there is an abnormality in the tape feed mechanism 23 by determining whether or not the adjustment guide 238 is loose based on the direction of extension of the straight line when the shape of the cut portion in the captured image is approximated by the straight line. For example, the determination unit 32 determines that the adjustment guide 238 is loose if the angle between the direction of extension of the straight line and the second direction in the captured image is greater than or equal to the second threshold. On the other hand, for example, the determination unit 32 determines that the adjustment guide 238 is not loose if the angle between the direction of extension of the straight line and the second direction in the captured image is less than the second threshold.

[0080] The second threshold can be determined arbitrarily and is not particularly limited. Information indicating the second threshold is stored in advance in the storage unit 33, for example.

[0081] Furthermore, the determination unit 32 may determine whether or not there is an abnormality in the tape feeding mechanism 23 based on a plurality of captured images. For example, the determination unit 32 may determine whether or not there is an abnormality in the tape feeding mechanism 23 (for example, whether or not the press roller 233 is worn) based on the position of the cutting location in the first direction in each of the plurality of captured images generated by repeatedly performing the cutting process by the cutting unit 22, the tape feeding process by the tape feeding mechanism 23, the crimping process by the crimping unit 24, and the imaging process by the imaging unit 25.

[0082] For example, the determination unit 32 may calculate the average value of the amount of deviation from a reference position for each of the multiple images, and determine whether or not the press roller 233 is worn based on the calculated average value and a predetermined threshold.

[0083] Note that instead of the mean, the median, maximum, or minimum value may also be used.

[0084] Furthermore, the number of captured images can be two, three or more.

[0085] Furthermore, the control unit 31 may output the captured image and the judgment result of the judgment unit 32 (specifically, information indicating the judgment result) to an external device. For example, the control unit 31 may notify the operator of the judgment result by image and / or sound by outputting the judgment result to a notification device such as a display and / or speaker. If the judgment unit 32 determines that there is an abnormality, the control unit 31 may output information to a display device indicating that the crimping unit 24 should stop operating.

[0086] The processing units, such as the control unit 31 and the determination unit 32, are implemented, for example, by a processor and a control program stored in memory or the like that is executed by the processor.

[0087] The memory unit 33 is a storage device that stores various data such as the size of the substrate 3, the attachment position and attachment direction of the ACF section tp3, the operation of each component, the timing of said operation, the timing for transferring the substrate 3 to a component crimping device located downstream of the ACF attachment device 10, a control program executed by the processing unit, and information used by the determination unit 32 to determine whether or not there is an abnormality. The memory unit 33 can be implemented by, for example, flash memory or an HDD (Hard Disk Drive).

[0088] [Processing Procedure] Next, the processing procedure of the ACF application device 10 according to the embodiment will be described in detail.

[0089] Figure 6 is a flowchart illustrating the processing procedure of the ACF application apparatus 10 according to the embodiment. Figure 7 is a diagram illustrating the specific processing procedures of the application process and imaging process in the ACF application apparatus 10 according to the embodiment. Note that in Figure 7, only the components for illustrative purposes are shown, and some components of the ACF application mechanism 20, such as the application backup stage 224, are not shown.

[0090] First, the substrate moving mechanism 210 moves the substrate 3 (S110). Specifically, the control unit 31 controls the substrate moving mechanism 210 to place the edge of the substrate 3 onto the adhesive backup stage 224. More specifically, as shown in Figure 7(a), the substrate 3 is moved so that the first adhesive position, which is the position on the substrate 3 where the ACF section tp3 is to be attached, is located below the adhesive head 223. The first adhesive position is the position on the substrate 3 where the electrode section 4 is located, and from this position the ACF section tp3 will be attached.

[0091] Next, the cutting unit 22 performs a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21, which includes a base layer tp1 and an ACF layer tp2 (S120). Specifically, the control unit 31 controls the cutting unit 22 to form the ACF section tp3 supported by the base layer tp1. More specifically, as shown in Figure 7(b), the ACF section tp3 is formed when the ACF layer tp2 is cut by the tape cutting unit 225.

[0092] Next, the tape feeding mechanism 23 performs a tape feeding process to feed the tape tp containing the ACF section tp3 supported by the substrate layer tp1, thereby positioning the cutting location (also simply called the cutting position) within the imaging area (within the imaging range) of the imaging unit 25 (specifically, the camera 230) (S130). Specifically, the control unit 31 controls the tape feeding mechanism 23 to feed the tape tp so that the cutting position is located within the imaging area of ​​the imaging unit 25. More specifically, as shown in Figure 7(c), the tape tp is moved so that the cutting location (the boundary between the ACF layer tp2 and the ACF section tp3 in Figure 7(c)) is located above the camera 230. The imaging area is, for example, the area within the field of view of the camera 230.

[0093] Next, the control unit 31 causes the imaging unit 25 (specifically, the camera 230) to image the cutting position (S140). Specifically, the imaging unit 25 performs imaging processing to generate an image by imaging the cutting location in the ACF layer tp2 supported by the base material layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, which has been cut by the cutting process.

[0094] Next, the determination unit 32 determines whether or not there is an abnormality in the tape feeding mechanism 23 based on the captured image (S150).

[0095] If the determination unit 32 determines that there is an abnormality in the tape feeding mechanism 23 (Yes in S160), the control unit 31 notifies the operator of the abnormality (S170). For example, the control unit 31 notifies the operator of the determination result by outputting the determination result to the notification device and terminates the process. For example, the control unit 31 stops the operation of the ACF pasting mechanism 20.

[0096] On the other hand, if the determination unit 32 determines that there is no abnormality in the tape feeding mechanism 23 (No in S160), the tape feeding mechanism 23 further performs a tape feeding process to feed the tape tp including the ACF segment tp3 supported by the substrate layer tp1, thereby positioning the ACF segment tp3 at the pressing position (S180). Specifically, the control unit 31 controls the tape feeding mechanism 23 to feed the tape tp so that the ACF segment tp3 moves to a position where it is pressed onto the substrate 3. More specifically, as shown in Figure 7(d), the ACF segment tp3 is moved between the adhesive head 223 and the first adhesive position.

[0097] In this example, the position of the ACF intercept tp3 shown in Figure 7(c) and the position of the ACF intercept tp3 shown in Figure 7(d) are the same. If the position of the ACF intercept tp3 when step S140 is performed is the same as the position of the ACF intercept tp3 when step S190, which will be described later, is performed, then step S180 may not be performed.

[0098] Next, the crimping unit 24 performs a crimping process (S190) to peel off the ACF section tp3, which is supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, from the base layer tp1 and crimp it onto the substrate 3. Specifically, the control unit 31 controls the crimping unit 24 to peel off the ACF section tp3, which is supported by the base layer tp1, from the base layer tp1 and crimp it onto the substrate 3. More specifically, as shown in Figure 7(e), the ACF section tp3 is attached to the first attachment position on the substrate 3. Also, for example, as shown in Figure 7(f), the substrate 3 is moved so that the ACF section tp3 attached to the substrate 3 is positioned below the camera 231, and imaging is performed by the camera 231.

[0099] Next, the control unit 31 determines whether all of the ACF sections tp3 have been attached to the substrate 3 (S200).

[0100] The control unit 31 terminates the process when it determines that all of the ACF segments tp3 have been attached to the substrate 3 (Yes in S200). For example, the control unit 31 controls the substrate moving mechanism 210 to transport the substrate 3 with the ACF segments tp3 attached downstream, brings in a new substrate 3 from upstream, and executes the process again from step S110.

[0101] On the other hand, if the control unit 31 determines that the attachment of all ACF segments tp3 on the substrate 3 has not been completed (No in S200), it returns the process to step S110 and moves the substrate 3 to a position where new ACF segments tp3 will be attached. For example, the substrate 3 is moved so that the second attachment position shown in Figure 7(f) is located below the attachment head 223. The second attachment position is the position on the substrate 3 where the electrode portion 4 is located, and from this position the ACF segments tp3 will be attached.

[0102] If the answer to step S160 is Yes, then step S170 is executed and processing may continue. For example, thresholds may be defined for determining that there is no abnormality, for determining that an abnormality is notified but processing continues, and for determining that an abnormality is notified and processing stops. For example, if the above deviation amount is less than threshold A, no abnormality is notified and processing continues; if the above deviation amount is greater than or equal to threshold A and less than threshold B, an abnormality is notified but processing continues; and if the above deviation amount is greater than or equal to threshold B, an abnormality is notified and processing stops. Thresholds A and B can be determined arbitrarily and are not particularly limited. Threshold B is, for example, a value greater than threshold A. Information indicating thresholds A and B is stored in advance in, for example, the storage unit 33.

[0103] Furthermore, the order of processing in each step is just an example and can be rearranged at will. For example, step S160 may be executed after step S140, after step S190, or at any time. For example, if the answer to step S160 is No, the currently running process will continue; if the answer to step S160 is Yes, step S170 will be executed, and the process may continue or stop.

[0104] Furthermore, steps S150 and S160 may be performed if step S140 has been performed a predetermined number of times. In this case, for example, if step S140 has not been performed a predetermined number of times, step S180 may be performed after step S140.

[0105] Next, we will describe specific examples of the determination process of the determination unit 32. Specifically, we will describe specific examples of the processes in steps S150 and S160 shown in Figure 6.

[0106] Figure 8 is a flowchart showing a first example of the determination process of the ACF application device 10 according to the embodiment. Figure 9 is a diagram showing a first example of an captured image according to the embodiment. Specifically, Figure 9 is a first example of an captured image generated by the camera 230 in step S140.

[0107] As shown in Figure 8, after step S140, the determination unit 32 determines whether the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is greater than the first reference value (S210).

[0108] As shown in Figure 9, for example, a reference position is predetermined by a reference line at the center of the X1 axis direction in the captured image. Also, for example, the determination unit 32 calculates a cutting line, which is a virtual line indicating the position of the cutting point (cutting position). For example, the determination unit 32 calculates the cutting line as a straight line when the shape of the cutting point in the captured image is approximated by a straight line. For example, the cutting point is the edge located on the ACF layer tp2 side of the ACF intercept tp3. In other words, the cutting position is the location of the edge located on the ACF layer tp2 side of the ACF intercept tp3. In this example, the cutting point is the edge located on the negative side of the X1 axis in the ACF intercept tp3 shown in Figure 9. The cutting line is, for example, the boundary line of this boundary.

[0109] For example, the determination unit 32 calculates the distance in the X1 direction between the reference line and the cutting line as the amount of displacement.

[0110] As shown in Figure 8, if the determination unit 32 determines that the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is greater than the first reference value (Yes in S210), it determines that there is wear on the press roller 233, that is, the press roller 233 is worn (S220). In the case of step S220, the determination unit 32 determines Yes in step S160 shown in Figure 6 and proceeds to step S170.

[0111] On the other hand, if the determination unit 32 determines that the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is less than or equal to the first reference value (No in S210), it determines that there is no wear on the press roller 233, that is, the press roller 233 is not worn (S230). In the case of step S230, the determination unit 32 determines No in step S160 shown in Figure 6 and proceeds to step S180.

[0112] The first reference value can be determined arbitrarily and is not particularly limited. Information indicating the first reference value is stored in advance in the storage unit 33, for example.

[0113] Figure 10 is a flowchart showing a second example of the determination process of the ACF application device 10 according to the embodiment. Figure 11 is a diagram showing a second example of an captured image according to the embodiment. Specifically, Figure 11 is a second example of an captured image generated by the camera 230 in step S140.

[0114] In the flowchart shown in Figure 10, for example, in step S120, the control unit 31 causes the cutting unit 22 to perform a first cutting process to cut the ACF layer tp2, and then issues a command to the tape feeding mechanism 23 to advance the tape tp by a predetermined distance, thereby causing the tape feeding mechanism 23 to advance the tape tp, and further causing the cutting unit 22 to perform a second cutting process to cut the ACF layer tp2. In this case, for example, in step S130, the control unit 31 causes the tape feeding mechanism 23 to advance the tape tp, thereby positioning the first cutting location in the ACF layer tp2 cut by the first cutting process and the second cutting location in the ACF layer tp2 cut by the second cutting process within the imaging area. Furthermore, in this case, for example in step S140, the control unit 31 generates an image by causing the imaging unit 25 to image the first cut location in the ACF layer tp2 cut by the first cutting process and the second cut location in the ACF layer tp2 cut by the second cutting process. Figure 11 shows a specific example of an image generated in this way that shows the two cut locations.

[0115] Based on the image captured in this manner, the determination unit 32 performs step S310 shown in Figure 10. Specifically, the determination unit 32 determines whether the distance between the position of the first cutting location (first cutting position shown in Figure 11) and the second cutting location (second cutting position shown in Figure 11) in the captured image is less than the second reference value (S310). More specifically, the determination unit 32 determines whether the distance in the X1 axis direction between the first cutting line calculated from the shape of the first cutting location and the second cutting line calculated from the shape of the second cutting location is less than the second reference value. In this example, this distance is the width in the X1 axis direction of the ACF section tp4 formed by the two cutting locations. The second reference value is a value set based on the predetermined distance described above. For example, the second reference value is a value indicating a predetermined distance, but it may also be a value obtained by performing any processing, such as multiplying the value indicating the predetermined distance by a predetermined constant.

[0116] If the determination unit 32 determines that the distance between the first cutting position and the second cutting location is less than the second reference value (Yes in S310), it determines that there is wear on the press roller 233, that is, the press roller 233 is worn (S320). In the case of step S320, the determination unit 32 determines Yes in step S160 shown in Figure 6 and proceeds to step S170.

[0117] On the other hand, if the determination unit 32 determines that the distance between the first cutting position and the second cutting location is greater than or equal to the second reference value (No in S310), it determines that there is no wear on the press roller 233, that is, the press roller 233 is not worn (S330). In the case of step S330, the determination unit 32 determines No in step S160 shown in Figure 6 and proceeds to step S180.

[0118] The flowchart shown in Figure 10 may be used to determine whether or not there is an abnormality in the tape feeding mechanism 23. For example, the ACF section tp4 is attached to the substrate 3, but it may also be discarded without being attached to the substrate 3. Alternatively, step S120 may be performed to form a new ACF section to be attached to the substrate 3.

[0119] Furthermore, the second reference value can be arbitrarily determined and is not particularly limited. Information indicating the second reference value is stored in advance in the storage unit 33, for example. Also, the second reference value may be calculated from a predetermined distance. The predetermined distance can be arbitrarily determined and is not particularly limited. Information indicating the predetermined distance is stored in advance in the storage unit 33, for example.

[0120] Figure 12 is a flowchart showing a third example of the determination process of the ACF application device 10 according to the embodiment. Figures 13 to 15 show the third to fifth examples of captured images according to the embodiment. Specifically, Figures 13 to 15 are concrete examples of captured images generated by the camera 230 in step S140.

[0121] As shown in Figure 12, the determination unit 32 determines, after step S140, whether or not the cutting position in the captured image is located outside the reference range in the Y1 axis direction (S410).

[0122] As shown in Figures 13 and 14, for example, two reference positions (first reference position and second reference position) are predetermined by reference lines (first reference line and second reference line) in a direction parallel to the Y1 axis direction in the captured image. In the examples shown in Figures 13 and 14, the first reference position is determined by the first reference line, and the second reference position is determined by the second reference line. In the example shown in Figure 13, one end of the cutting position in the Y1 axis direction coincides with the first reference position. In the example shown in Figure 13, the other end of the cutting position in the Y1 axis direction coincides with the second reference position. The reference range is, for example, between the first reference line and the second reference line in the Y1 axis direction. For example, in step S410, the determination unit 32 determines whether or not the cutting location is located between the first reference line and the second reference line. For example, in the example shown in Figure 13, it is determined that the cutting position in the captured image is located within the reference range in the Y axis direction. On the other hand, in the example shown in Figure 14, for example, one end of the cutting position in the Y1 axis direction is not located between the first reference position and the second reference position. Therefore, in the example shown in Figure 14, for example, it is determined that the cutting position in the captured image is located outside the reference range in the Y1 axis direction. The reference range is an example of a predetermined position.

[0123] As shown in Figure 12, if the determination unit 32 determines that the cutting position in the captured image is located within the reference range in the Y1 axis direction (No in S410), it determines whether the inclination angle of the cutting line with respect to the reference line is greater than or equal to the reference angle (S420).

[0124] As shown in Figure 15, for example, the slope angle is the absolute value of the angle between the reference line and the cutting line. In other words, the slope angle is, for example, the absolute value of the angle between the Y1 axis and the cutting line. Note that the reference angle is an example of a second threshold.

[0125] As shown in Figure 12, if the determination unit 32 determines that the angle of inclination of the cutting line with respect to the reference line is less than the reference angle (No in S420), it determines that there is no looseness in the adjustment guide 238, that is, the movement of the tape tp in the width direction is appropriately restricted by the adjustment guide 238 (S430). In the case of step S430, the determination unit 32 determines No in step S160 shown in Figure 6 and proceeds to step S180.

[0126] On the other hand, if the determination unit 32 determines that the cutting position in the captured image is located outside the reference range in the Y1 axis direction (Yes in S410), or if the determination unit 32 determines that the inclination angle of the cutting line with respect to the reference line is greater than or equal to the reference angle (Yes in S420), it determines that there is looseness in the adjustment guide 238, that is, that the movement of the tape tp in the width direction is not properly restricted by the adjustment guide 238 (S440). In the case of step S440, the determination unit 32 determines Yes in step S160 shown in Figure 6 and proceeds to step S170.

[0127] In the above example, the determination unit 32 determined whether the cutting point was located within the reference range or outside the reference range in the Y1 axis direction. However, it may also determine the amount of deviation of the cutting point from the reference range in the Y1 axis direction. For example, if the amount of deviation of the cutting point from the reference range in the Y1 axis direction is greater than or equal to a first threshold, the determination unit 32 determines that the adjustment guide 238 is loose. On the other hand, for example, if the amount of deviation of the cutting point from the reference range in the Y1 axis direction is less than the first threshold, the determination unit 32 determines that the adjustment guide 238 is not loose.

[0128] The reference range (first reference position and second reference position) can be arbitrarily determined and is not particularly limited. Information indicating the reference range is stored in advance in the storage unit 33, for example. Similarly, the reference angle can be arbitrarily determined and is not particularly limited. Information indicating the reference angle is stored in advance in the storage unit 33, for example.

[0129] Furthermore, the order in which steps S410 and S420 are executed can be determined arbitrarily and is not particularly limited. For example, step S420 may be executed before step S410.

[0130] (Effects, etc.) The following describes examples of technologies that can be obtained from the disclosures in this specification, and explains the effects that can be obtained from these examples.

[0131] Technology 1 is an ACF bonding apparatus 10 comprising: a supply unit 21 for supplying a tape tp including a base layer tp1 and an ACF layer tp2; a cutting unit 22 for performing a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21; a tape feeding mechanism 23 for performing a tape feeding process to feed the tape tp including the ACF section tp3 supported by the base layer tp1; a pressing unit 24 for performing a pressing process to peel the ACF section tp3 supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23 from the base layer tp1 and press it onto the substrate 3; an imaging unit 25 for performing an imaging process to generate an image by imaging the cut location in the ACF layer tp2 supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23 that has been cut by the cutting process; and a determination unit 32 for determining whether or not there is an abnormality in the tape feeding mechanism 23 based on the image.

[0132] According to this, it is possible to determine whether or not the tape tp is being fed properly based on the position of the cut in the captured image (the cut position mentioned above). Therefore, according to this, it is possible to accurately detect abnormalities in the tape feeding mechanism 23 based on the captured image.

[0133] Technology 2 is an ACF application apparatus as described in Technology 1, wherein the tape feeding mechanism 23 is equipped with a roller for feeding the tape tp by rotating in contact with the tape tp, and the determination unit 32 determines whether there is wear on the roller based on the position of the cutting point in the captured image, which is the position of the cutting point in a first direction corresponding to the direction in which the tape feeding mechanism 23 feeds the tape tp, thereby determining whether there is an abnormality in the tape feeding mechanism 23.

[0134] The direction in which the tape feeding mechanism 23 feeds the tape tp is, for example, the X-axis direction as described above. The first direction is, for example, the X1-axis direction as described above.

[0135] Furthermore, the roller referred to here is, for example, a pinch roller consisting of a feed roller 232 and a press roller 233. For example, the roller referred to here is the press roller 233, which is considered to be particularly prone to wear.

[0136] Because pinch rollers are structured to feed tape tp by gripping it between two rollers, the rotation of one roller is likely to cause wear on the other roller. When the rollers wear down, they may not be able to grip the tape tp with the appropriate strength, which can cause the tape tp to slip or the rollers to spin freely, resulting in improper feeding of the tape tp. Therefore, by determining the position of the tape after it has been fed by the tape feeding mechanism 23 using the position of the cutting point, it is possible to determine whether the tape tp is being fed properly, that is, whether the rollers are worn down.

[0137] Technology 3 is an ACF adhesive apparatus as described in Technology 2, wherein the determination unit 32 determines whether or not the roller is worn based on the position of the cutting location in each of a plurality of captured images generated by repeatedly performing the cutting process, tape feeding process, pressure processing and imaging process, and the position of the cutting location in the first direction.

[0138] According to this method, the presence or absence of roller wear is determined by multiple captured images, thus suppressing the occurrence of misjudgments such as determining that a roller is worn when it is not.

[0139] Technology 4 is an ACF application apparatus according to any one of Technology 1 to 3, further comprising a control unit 31 that controls a cutting unit 22, a tape feeding mechanism 23, and an imaging unit 25, wherein the tape feeding mechanism 23 is equipped with rollers for feeding the tape tp by rotating in contact with the tape tp, and the control unit 31 causes the cutting unit 22 to perform a first cutting process to cut the ACF layer tp2, and further causes the tape feeding mechanism 23 to feed the tape tp by a predetermined distance, thereby causing the tape feeding mechanism 23 to feed the tape tp The tape is sent forward, and then the cutting unit 22 is made to perform a second cutting process to cut the ACF layer tp2. Furthermore, the imaging unit 25 is made to image the first cut location in the ACF layer tp2 cut by the first cutting process and the second cut location in the ACF layer tp2 cut by the second cutting process to generate an image. The determination unit 32 determines whether or not there is wear on the roller based on the distance between the first cut location and the second cut location in the image and a predetermined distance, thereby determining whether or not there is an abnormality in the tape feeding mechanism 23.

[0140] According to this, an abnormality in the tape feeding mechanism 23 can be detected from the distance between the position of the first cut point and the position of the second cut point as seen in the captured image. Furthermore, by using the captured image, it is possible to compare a predetermined distance, which is the amount of tape tp fed by the command processing (length of tape tp), with the distance the tape tp has actually been fed, thereby allowing for a more accurate determination of the extent of the abnormality in the tape feeding mechanism 23.

[0141] Technology 5 is an ACF application apparatus according to any of Technologies 1 to 4, wherein the tape feeding mechanism 23 is equipped with a regulating member that restricts the position of the tape tp in the width direction, and the determination unit 32 determines whether or not there is an abnormality in the tape feeding mechanism 23 by determining whether or not the regulating member is loose based on the position of the cutting point in the captured image, which is the position of the cutting point in a second direction that is perpendicular to a first direction corresponding to the direction in which the tape feeding mechanism 23 feeds the tape tp.

[0142] The second direction is, for example, the Y1 axis direction as described above. Also, for example, the regulating member is the adjustment guide 238 as described above. For example, a state in which the regulating member is loose is a state in which the positional relationship between the guide 237 and the adjustment guide 238 is not appropriate, and the tape tp moves in the width direction of the tape tp.

[0143] When the regulating member is loose, the tape tp moves in the width direction of the tape tp, causing the tape tp to shift in a second direction from its predetermined position in the captured image. Therefore, based on this, it is possible to appropriately determine whether or not the regulating member is loose based on the captured image.

[0144] Technology 6 is an ACF application device as described in Technology 5, wherein the determination unit 32 determines that the regulating member is loose if the amount of deviation of the cutting point from a predetermined position in the second direction is greater than or equal to a first threshold.

[0145] According to this, it is possible to appropriately determine whether or not the regulating member is loose based on the captured image.

[0146] Technology 7 is an ACF application device according to any of Technology 1 to 6, wherein the tape feeding mechanism 23 is equipped with a regulating member that restricts the position of the tape tp in the width direction, and the determination unit 32 determines whether or not there is an abnormality in the tape feeding mechanism 23 by determining whether or not the regulating member is loose based on the direction of extension of the straight line when the shape of the cut portion in the captured image is approximated by a straight line.

[0147] As described above, when the restricting member is loose, the tape tp moves in the width direction of the tape tp, causing the tape tp to shift in a second direction from its predetermined position in the captured image. Depending on the position where the imaging unit 25 images the tape tp, the tape tp may be shifted entirely in the second direction in the captured image, or the extension direction of the tape tp may be tilted with respect to the first direction. Also, normally, the cutting unit 22 cuts the ACF layer tp2 of the tape tp in a direction perpendicular to the extension direction of the tape tp. Therefore, normally, the shape of the cut area in the captured image is a straight line in a direction perpendicular to the first direction, or in other words, parallel to the second direction. Thus, the determination unit 32 can appropriately determine whether or not the restricting member is loose by using the extension direction of the straight line when the shape of the cut area in the captured image is approximated by a straight line.

[0148] Technology 8 is an ACF application apparatus as described in Technology 7, wherein the determination unit 32 determines that the regulating member is loose if the angle between the extending direction and a second direction that is perpendicular to the first direction in the captured image, which corresponds to the direction in which the tape feeding mechanism 23 feeds the tape tp, is greater than or equal to a second threshold.

[0149] According to this, it is possible to appropriately determine whether or not the regulating member is loose.

[0150] Technology 9 involves the cutting unit 22 performing a cutting process to form an ACF segment tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21, which includes a base layer tp1 and an ACF layer tp2 (S120), the tape feeding mechanism 23 performing a tape feeding process to feed the tape tp containing the ACF segment tp3 supported by the base layer tp1 (S130), and the crimping unit 24 being supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23. This is an ACF attachment method, in which an ACF section tp3 is peeled off from the base layer tp1 and pressed onto the substrate 3 in a pressing process (S190), an imaging unit 25 performs an imaging process to generate an image by imaging the cut portion of the ACF layer tp2, which is supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, that has been cut by the cutting process (S140), and a determination unit 32 determines whether or not there is an abnormality in the tape feeding mechanism 23 based on the image (S150 and S160).

[0151] According to this, it will have the same effect as the ACF application device 10 related to Technology 1.

[0152] (Other embodiments) Although the ACF application device and the like according to this embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0153] For example, the processing steps in the above embodiment do not necessarily have to be processed chronologically in the order described in the flowchart, and may include processes that are executed in parallel or individually.

[0154] Furthermore, for example, all or part of the components of the processing unit, such as the determination unit, of the ACF pasting device may be made up of dedicated hardware, or they may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as an HDD or semiconductor memory.

[0155] Furthermore, the components of the processing unit of the ACF application device may consist of one or more electronic circuits. Each of these one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0156] One or more electronic circuits may include, for example, semiconductor devices, ICs, or LSIs (Large Scale Integrations). ICs or LSIs may be integrated on a single chip or on multiple chips. While referred to here as ICs or LSIs, the terminology may vary depending on the degree of integration; they might also be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). Field Programmable Gate Arrays (FPGAs), which are programmed after the LSI is manufactured, can also be used for the same purpose.

[0157] Furthermore, the present invention can be implemented not only as an ACF pasting device, but also as a program that includes the processing performed by each component of the ACF pasting device as steps, and as a recording medium such as a computer-readable DVD (Digital Versatile Disc) on which the program is recorded. In other words, the comprehensive or specific embodiments described above may be implemented as a system, device, integrated circuit, computer program, or computer-readable non-temporary recording medium, or as any combination of a system, device, integrated circuit, computer program, and recording medium.

[0158] Furthermore, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of the present invention. [Industrial applicability]

[0159] This invention can be used in an ACF bonding apparatus for bonding ACF to a substrate. [Explanation of Symbols]

[0160] 3 circuit boards 4 Electrode part 10 ACF application device 20 ACF adhesive mechanism 21 Supply section 22 Cut section 23 Tape feed mechanism 24 Crimping section 25 Imaging Department 30 Control device 31 Control Unit 32 Judgment section 33 Storage section 210 Substrate moving mechanism 211 X-axis table 212 Y-axis table 213 Z-axis table 214 stages 220L, 220R Adhesion Mechanism Unit 221 Tape supply reel 222 Tape retrieval unit 223 Adhesive head 224 Adhesive backup stage 225 Tape Cutting Unit 225a backing plate 225b Cutter 228 X-axis rail mechanism 229 Adhesive base 230, 231 Camera 232 Feed roller 233 Pressing roller 234 Guide roller 235 shaft 236 Bearings 237 Guide 238 Adjustment Guide 239 Fixing screws TP tape tp1 base material layer tp2 ACF layer TP3 and TP4 ACF slices

Claims

1. A supply unit for supplying a tape including a base layer and an ACF (Anisotropic Conductive Film) layer, A cutting unit performs a cutting process to form an ACF section supported on the base layer by cutting the ACF layer contained in the tape supplied from the supply unit, A tape feeding mechanism that performs tape feeding processing to feed the tape containing the ACF section supported by the substrate layer, A crimping unit that performs a crimping process to peel off the ACF section, which is supported by the base material layer contained in the tape fed by the tape feeding mechanism, from the base material layer and press it onto a substrate, An imaging unit that performs imaging processing to generate an image by imaging the cut portion cut by the cutting process in the ACF layer supported by the substrate layer contained in the tape fed by the tape feeding mechanism, The system includes a determination unit that determines whether or not there is an abnormality in the tape feeding mechanism based on the captured image. ACF application device.

2. The tape feeding mechanism includes a roller for feeding the tape by rotating in contact with the tape, The determination unit determines whether or not there is wear on the roller based on the position of the cutting point in the captured image, which is in a first direction corresponding to the direction in which the tape feeding mechanism feeds the tape, thereby determining whether or not there is an abnormality in the tape feeding mechanism. The ACF application device according to claim 1.

3. The determination unit determines whether or not the roller is worn based on the position of the cutting location in each of the multiple captured images generated by repeatedly performing the cutting process, the tape feeding process, the crimping process, and the imaging process, and the position of the cutting location in the first direction. The ACF application apparatus according to claim 2.

4. Furthermore, it includes a control unit that controls the cutting unit, the tape feeding mechanism, and the imaging unit. The tape feeding mechanism includes a roller for feeding the tape by rotating in contact with the tape, The control unit, The cutting section is subjected to a first cutting process that cuts the ACF layer. Furthermore, by issuing a command to the tape feeding mechanism to advance the tape by a predetermined distance, the tape feeding mechanism is made to advance the tape. Furthermore, a second cutting process is performed on the cutting section to cut the ACF layer. Furthermore, the imaging unit is made to capture the first cut location in the ACF layer cut by the first cutting process and the second cut location in the ACF layer cut by the second cutting process, thereby generating the captured image. The determination unit determines whether or not there is wear on the roller based on the distance between the first cutting point and the second cutting point in the captured image and the predetermined distance, thereby determining whether or not there is an abnormality in the tape feeding mechanism. The ACF application device according to claim 1.

5. The tape feeding mechanism includes a regulating member that restricts the position of the tape in the width direction, The determination unit determines whether or not the regulating member is loose based on the position of the cutting point in the captured image, in a second direction perpendicular to the first direction corresponding to the direction in which the tape feeding mechanism feeds the tape, thereby determining whether or not there is an abnormality in the tape feeding mechanism. The ACF application device according to claim 1.

6. The determination unit determines that the regulating member is loose if the amount of deviation of the cutting point from a predetermined position in the second direction is greater than or equal to a first threshold. The ACF application apparatus according to claim 5.

7. The tape feeding mechanism includes a regulating member that restricts the position of the tape in the width direction, The determination unit determines whether the regulating member is loose based on the direction of extension of the straight line when the shape of the cut portion in the captured image is approximated by a straight line, thereby determining whether there is an abnormality in the tape feeding mechanism. The ACF application device according to claim 1.

8. The determination unit determines that the regulating member is loose if the angle between the extending direction and the second direction, which is perpendicular to the first direction in the captured image corresponding to the direction in which the tape feeding mechanism feeds the tape, is greater than or equal to the second threshold. The ACF application apparatus according to claim 7.

9. The cutting unit performs a cutting process to form an ACF slice supported by the base layer by cutting the ACF layer contained in a tape supplied from the supply unit, which includes a base layer and an ACF layer. The tape feeding mechanism performs a tape feeding process that feeds the tape, which includes the ACF section supported on the substrate layer. The crimping section performs a crimping process in which it peels the ACF section, which is supported by the base material layer contained in the tape fed by the tape feeding mechanism, from the base material layer and crimps it onto the substrate. The imaging unit performs an imaging process to generate an image by imaging the cut portion of the ACF layer, which is supported by the substrate layer contained in the tape fed by the tape feeding mechanism, that has been cut by the cutting process. The determination unit determines whether or not there is an abnormality in the tape feeding mechanism based on the captured image. ACF application method.

Citation Information

Patent Citations

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    JP2016164584A