Mounting information management device, mounted circuit board manufacturing system, and trace information creation method

Abstract

This invention provides a mounting information management device, a mounting board manufacturing system, and a method for creating trace information, which can obtain trace information including measurement data of components mounted on a substrate. [Solution] A trace information creation method for creating information about components that have been removed from a carrier tape containing components and mounted on a circuit board involves acquiring primary trace information including information about the components mounted on the circuit board or information about the mounting position of the components on the circuit board, and measurement data obtained by measuring the components removed from the carrier tape (ST31), and creating trace information by associating the acquired measurement data with the primary trace information (ST32).

Description

Technical Field

[0001] The present disclosure relates to an implementation information management device, an implementation substrate manufacturing system, and a trace information creation method for managing information on components mounted on a substrate.

Background Art

[0002] There is known a component mounting device including a characteristic measurement unit that measures characteristics of components and taking out components housed in a carrier tape or the like and measuring them with the characteristic measurement unit (for example, Patent Document 1). In these component mounting devices, before mounting the components on the substrate, the components are taken out from the carrier tape and the electrical characteristics are measured with the characteristic measurement unit, and by determining whether the components to be mounted on the substrate are correct, it is possible to prevent the mistake of mounting the components due to, for example, an attachment mistake of the carrier tape. In Patent Document 1, device information associating the reel ID of the reel accommodating the carrier tape with the measurement result of the component is registered in the implementation management server, and when the received device information has measured information in the implementation processing device, it is disclosed that the implementation processing of the component is executed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, for quality control of the implementation substrate, information on the components mounted on the substrate is recorded as trace information. In the prior art including Patent Document 1, although the electrical characteristics of the components to be mounted on the substrate are measured, there is no disclosure regarding recording the measured electrical characteristics of the components as trace information, and there is room for further improvement in order to effectively utilize the measured electrical characteristics of the components.

[0005] Therefore, the present disclosure aims to provide an assembly information management device, an assembly substrate manufacturing system, and a method for creating trace information, which can obtain trace information including measurement data of components mounted on a substrate. [Means for solving the problem]

[0006] The mounting information management device of this disclosure is a mounting information management device that manages information about a component that has been removed from a carrier containing a component and mounted on a substrate, and comprises an information acquisition unit that acquires primary trace information including information about the component mounted on the substrate or information about the mounting position of the component on the substrate, and measurement data obtained by measuring the component removed from the carrier, and a trace information creation unit that creates trace information by associating the acquired measurement data with the primary trace information.

[0007] The printed circuit board manufacturing system of the present disclosure includes a component mounting device that removes components from a carrier containing components and mounts them on a circuit board, and is a printed circuit board manufacturing system that manufactures a printed circuit board on which components are mounted, comprising: a primary trace information recording unit that creates and records primary trace information including information about components mounted on the circuit board by the component mounting device or information about the mounting position of components on the circuit board; a measurement unit that measures components removed from the carrier by the component mounting device and creates measurement data including the measurement details; and a trace information creation unit that creates trace information relating the measurement data to the primary trace information.

[0008] The trace information creation method of this disclosure is a trace information creation method for creating information about a component that has been removed from a carrier containing a component and mounted on a substrate, and includes an information acquisition step of acquiring primary trace information including information about the component mounted on the substrate or information about the mounting position of the component on the substrate, and measurement data obtained by measuring the component removed from the carrier, and a trace information creation step of creating trace information that associates the acquired measurement data with the primary trace information. [Effects of the Invention]

[0009] According to this disclosure, trace information including measurement data of components mounted on the substrate can be obtained. [Brief explanation of the drawing]

[0010] [Figure 1] A diagram illustrating the configuration of a printed circuit board manufacturing system according to one embodiment of the present disclosure. [Figure 2] A plan view showing the configuration of a key part of a component mounting device included in a mounted substrate manufacturing system according to one embodiment of the present disclosure. [Figure 3] A diagram illustrating the configuration of a key component mounting device in a substrate manufacturing system according to one embodiment of the present disclosure. [Figure 4] A plan view showing an example of a substrate on which components are mounted in a mounting substrate manufacturing system according to one embodiment of the present disclosure. [Figure 5] A diagram illustrating the configuration of the main parts of a measurement unit mounted on a component mounting device in a substrate manufacturing system according to one embodiment of the present disclosure. [Figure 6] (a)(b)(c) Diagram illustrating a measurement process by a measurement unit attached to a component mounting device in a mounted substrate manufacturing system according to one embodiment of the present disclosure. [Figure 7] An explanatory diagram of a splicing tape feeder used in a component mounting device in a printed circuit board manufacturing system according to one embodiment of the present disclosure. [Figure 8] An explanatory diagram of a non-splicing tape feeder used in a component mounting device in a printed circuit board manufacturing system according to one embodiment of the present disclosure. [Figure 9] A block diagram showing the configuration of a printed circuit board manufacturing system according to one embodiment of the present disclosure. [Figure 10] (a) An explanatory diagram of an example of trace information used in a printed circuit board manufacturing system according to one embodiment of the present disclosure. (b) An explanatory diagram of an example of primary trace information. (c) An explanatory diagram of an example of measurement data. [Figure 11] A flowchart of a component mounting method according to one embodiment of the present disclosure. [Figure 12]A flowchart of a method for measuring parts according to one embodiment of the present disclosure. [Figure 13] A flowchart of a trace information creation method according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0011] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the mounted substrate manufacturing system, mounted information management device, mounted line, component mounting device, etc. In the following, all corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 2 and some parts described later, the X-axis in the substrate transport direction (left-right direction in Figure 2) and the Y-axis in the substrate transport direction (up-down direction in Figure 2) are shown as two mutually orthogonal axes in the horizontal plane. In Figure 3 and some parts described later, the Z-axis (up-down direction in Figure 3) is shown as the height direction perpendicular to the horizontal plane.

[0012] First, with reference to Figure 1, the configuration of the printed circuit board manufacturing system 1 will be explained. The printed circuit board manufacturing system consists of work equipment constituting one mounting line L and a mounting information management device 3 connected by a communication network 2. Note that the printed circuit board manufacturing system 1 does not need to have one mounting line L; it may have two or more. In this case, the mounting information management device 3 will be connected to two or more mounting lines L.

[0013] The assembly line L is configured by connecting work equipment that performs work on substrate B in series, from upstream (left side of the page) to downstream (right side of the page) in the substrate transport direction, including a screen printing machine M1, a first inspection machine M2, component mounting machines M3-M4, a second inspection machine M5, a reflow machine M6, and a third inspection machine M7. The assembly line L has the function of manufacturing assembled substrates with components D mounted on substrate B. Note that the assembly line L is a group of work equipment connected via a communication network 2, and the work equipment does not need to be physically connected to each other.

[0014] In FIG. 1, the screen printing device M1 performs a solder printing operation of printing paste-like solder on the substrate B conveyed from upstream through a screen mask mounted on the printing operation unit. The first inspection device M2 performs a printing inspection operation of inspecting the state of the solder printed on the substrate B by a printing inspection operation unit including a solder inspection camera and various sensors. The inspection results including the surface state of the substrate B on which the solder inspected by the first inspection device M2 is deposited are transmitted to the mounting information management device 3.

[0015] The component mounting devices M3 to M4 perform a mounting operation of taking out the component D supplied by a component supply unit such as a tape feeder or a tray feeder with a suction nozzle mounted on the mounting head and mounting it on the substrate B on which solder is printed. The mounting line L is not limited to a configuration of two component mounting devices M3 to M4, and may be one or three or more component mounting devices M3 to M4.

[0016] In FIG. 1, the second inspection device M5 performs a mounting inspection operation of inspecting the position and state of the component D mounted on the substrate B by a mounting inspection operation unit including a mounting inspection camera. The inspection results including a mounting error such that the component D is not mounted at a predetermined position of the substrate B inspected by the second inspection device M5 are transmitted to the mounting information management device 3. The reflow device M6 performs a substrate heating operation of heating the substrate B carried into the device by a substrate heating unit, melting and solidifying the solder on the substrate, and joining the electrodes (lands) of the substrate B and the terminals of the component D.

[0017] The third inspection device M7 performs a reflow inspection operation of inspecting the position and state of the component D mounted on the substrate B after reflow by a reflow inspection operation unit including a reflow inspection camera. The inspection results including the state of the component D after reflow inspected by the third inspection device M7 are transmitted to the mounting information management device 3.

[0018] Next, the configuration of component mounting devices M3 to M4 will be explained with reference to Figures 2 and 3. Component mounting devices M3 to M4 have the function of performing mounting work, which involves mounting components D supplied to the component supply unit onto the substrate B. A substrate transport unit 5 is positioned along the X-axis in the center of the base 4. The substrate transport unit 5 carries the substrate B, which has been transported from upstream, to the mounting work position, positions it, and holds it. The substrate transport unit 5 also transports the substrate B downstream after the mounting work is completed.

[0019] Component supply units 6 are located on both sides (front and rear directions along the Y-axis) of the substrate transport unit 5. Each component supply unit 6 is equipped with a trolley 8 that holds multiple tape feeders 7 along the X-axis. The trolley 8 holds a reel 10 that stores a carrier tape 9 containing components D in a wound state. The reel 10 is fitted with a reel label 11 such as a barcode or a 2D code. A reader (not shown) reads the reel label 11 to recognize a reel ID that identifies the reel 10. The recognized reel ID is transmitted to the equipment control unit 40 (Figure 9) of the component mounting devices M3 to M4. The tape feeder 7 feeds the carrier tape 9 in a pitch direction from the outside of the component supply unit 6 toward the substrate transport unit 5 (tape feeding direction), supplying components D to the component removal position 7a where the components D are removed by the mounting head 13 described below.

[0020] Thus, the carrier tape 9 is a carrier for holding parts D. The tape feeder 7 is a parts supply unit that is attached to the parts supply unit 6 and supplies the parts D stored in the carrier to the parts retrieval position 7a. The parts supply unit attached to the parts supply unit 6 may also be a tray feeder (not shown) that supplies parts D arranged on a tray (carrier) to the parts retrieval position.

[0021] In Figures 2 and 3, a mounting head movement mechanism 12 is positioned along the Y-axis on a frame section (not shown) supported by a base 4. A mounting head 13 is attached to the mounting head movement mechanism 12. A suction nozzle 14 for suctioning and holding components D is attached to the lower part of the mounting head 13. By driving the mounting head movement mechanism 12, the mounting head 13 moves in the X-axis and Y-axis directions. The mounting head 13 performs a mounting turn (arrow a in Figure 3) in which it picks up components D from the tape feeder 7 located in the component supply section 6 using the suction nozzle 14 and mounts them on the mounting positions Q1 to Q9 (Figure 4) of the substrate B positioned in the substrate transport section 5.

[0022] In Figures 2 and 3, a component camera 15 is positioned between the front component supply unit 6 and the substrate transport unit 5. When the mounting head 13, which has taken out a component D from the component supply unit 6, moves above the component camera 15, the component camera 15 captures an image of the component D held by the mounting head 13. The image captured by the component camera 15 allows for the recognition of the holding posture of the component D.

[0023] A substrate camera 16 that moves integrally with the mounting head 13 is attached. The substrate camera 16 moves integrally with the mounting head 13. As the mounting head 13 moves, the substrate camera 16 moves above the substrate B positioned in the substrate transport unit 5 and captures images of the substrate mark 17 and substrate label 18 (Figure 4) provided on the substrate B. The substrate label 18 is a barcode or a 2D code. The position of the substrate B is recognized from the image of the substrate mark 17. The substrate ID that identifies the substrate B is recognized from the image of the substrate label 18. During the mounting operation of component D onto substrate B by the mounting head 13, the mounting positions Q1 to Q9 (correction of the stopping position of the mounting head 13) are corrected by taking into account the recognition result of component D by component camera 15 and the recognition result of the substrate position by substrate camera 16.

[0024] In Figure 2, a measurement unit 20 is positioned to the side of the component camera 15. The measurement unit 20 has the function of measuring the electrical characteristics of component D (arrow b in Figure 3) that has been transferred from the component pick-up position 7a of the tape feeder 7 by the suction nozzle 14 of the mounting head 13.

[0025] Here, the configuration and function of the measurement unit 20 will be explained with reference to Figures 5 and 6. In Figure 5, two measurement electrodes 22 are arranged on the upper surface of the measurement stand 21 of the measurement unit 20. The shape and spacing of the measurement electrodes 22 are designed considering the shape of the component D to be measured and the position of terminal Dt (Figure 6). The two measurement electrodes 22 are connected to a measurement circuit 24 via a cable 23. The measurement circuit 24 measures the electrical characteristics such as resistance, capacitance, and inductance of the component D to which terminal Dt is connected by the measurement electrodes 22, and transmits the measurement results to the equipment control unit 40.

[0026] In Figure 5, a sheet-like anisotropic conductive sheet 25 is placed on the upper surface of the two measuring electrodes 22. The anisotropic conductive sheet 25 has the characteristic that when pressure is applied, its conductivity in the direction of pressure becomes high (resistance becomes low), and its conductivity in directions other than the direction of pressure remains low (resistance remains high).

[0027] When component D is placed on the measurement position Pm on the upper surface of the anisotropic conductive sheet 25 and no pressure is applied, the conductivity of the anisotropic conductive sheet 25 is low in all directions. On the other hand, when pressure is applied to component D on the anisotropic conductive sheet 25 from above toward the measurement electrode 22 (Figure 6(b)), the conductivity of the portion of the anisotropic conductive sheet 25 sandwiched between the terminal Dt of component D and the measurement electrode 22 increases (resistance decreases), and the terminal Dt of the opposing component D and the measurement electrode 22 are electrically connected. Even in this state, the conductivity remains low (resistance remains high) between the two terminals Dt of component D and between the two measurement electrodes 22. In this way, by inserting the anisotropic conductive sheet 25 between component D and the measurement electrode 22, a stable electrical connection can be made between the terminal Dt of component D and the measurement electrode 22 even if there are variations in the shape of component D.

[0028] In Figure 5, the measurement unit 20 is equipped with a pressing section 27 that includes a pressing member 26. The pressing member 26 is positioned above the measurement stand 21. The pressing section 27 moves the pressing member 26 back and forth horizontally between a standby position P1 where it does not interfere when the suction nozzle 14 moves the part D to be measured to the measurement position Pm, and a pressing position P2 (Figure 6(b)) where it presses the part D placed at the measurement position Pm (arrow c1). The pressing section 27 also moves the pressing member 26, which has moved to the pressing position P2, up and down in the Z-axis direction (arrow c2).

[0029] The measurement unit 20 has an air discharge unit 28 and a waste box 29 positioned on either side of the measurement position Pm where the part D is transferred. The air discharge unit 28 is connected to a positive pressure source that supplies compressed air via an air valve (not shown). When the air valve is opened, the air discharge unit 28 discharges compressed air from a discharge port 28a facing the waste box 29. The waste box 29 is open at the top. The waste box 29 collects the part D that has been blown away from the measurement position Pm by the compressed air discharged from the discharge port 28a.

[0030] Next, referring to Figure 6, the measurement process in which the electrical characteristics of component D are measured in the measurement unit 20 will be described. First, the component D to be measured, which has been picked up from the tape feeder 7 by the suction nozzle 14, is transferred to the measurement position Pm on the anisotropic conductive sheet 25 (arrow d1 in Figure 6(a)). Next, the pressing unit 27 moves the pressing member 26 from the standby position P1 to the pressing position P2 (arrow d2 in Figure 6(b)), and lowers the pressing member 26 to press component D in the direction of the measurement electrode 22 (arrow d3 in Figure 6(b)). As component D is pressed, the terminal Dt of component D and the measurement electrode 22 are electrically connected, and the electrical characteristics of component D are measured by the measurement circuit 24 (measurement process).

[0031] Once the measurement of electrical characteristics is complete, the pressing unit 27 moves the pressing member 26 to the standby position P1 (arrow d4 in Figure 6(c)). Next, the air discharge unit 28 discharges compressed air from the discharge port 28a (arrow d5 in Figure 6(c)), blowing the component D that was placed at the measurement position Pm to the waste box 29 for collection (disposal process). When the measurement unit 20 receives a measurement instruction from the equipment control unit 40, it executes the measurement process and the disposal process, and transmits the measured value of component D measured by the measurement circuit 24 to the equipment control unit 40. Alternatively, the disposal process may be omitted after the measurement process, and component D at the measurement position Pm may be re-adsorbed by the suction nozzle 14 and mounted on the substrate B.

[0032] Next, with reference to Figures 7 and 8, we will explain the supply of parts to the tape feeder 7. First, with reference to Figure 7, we will explain the supply of parts to the splicing type tape feeder (hereinafter simply referred to as "tape feeder 7A"). In tape feeder 7A, when the remaining amount of the carrier tape 9 supplying parts D (hereinafter simply referred to as "leading tape 9A") becomes small, a splicing operation is performed in which the leading end of the carrier tape 9 to be supplied to the end of the leading tape 9A (hereinafter simply referred to as "next tape 9B") is joined with a connecting member 30 such as a splicing tape.

[0033] In Figure 7, during the splicing process, the reel ID of the next reel 10B (hereinafter simply referred to as "next reel 10B") is read from the reel label 11 attached to the reel 10 that houses the next tape 9B. Similarly, during the splicing process of the preceding tape 9A, the reel ID of the preceding reel 10A (hereinafter simply referred to as "preceding reel 10A") is read from the reel label 11 attached to the reel that houses the preceding tape 9A. The reel ID of the preceding reel 10A allows for the reference of the part names of the parts D contained in the preceding tape 9A. Furthermore, the reel ID of the next reel 10B allows for the reference of the part names of the parts D contained in the next tape 9B.

[0034] Inside the tape feeder 7A, a coupling member detection sensor 31 is located to detect the coupling member 30. The coupling member detection sensor 31 is positioned in the path along which the carrier tape 9 is transported, prior to the component removal position 7a in the tape feeding direction. When the coupling member 30 that joins the preceding tape 9A and the next tape 9B is pitch-feeded and reaches the position of the coupling member detection sensor 31, the coupling member detection sensor 31 detects the coupling member 30. Subsequently, when a predetermined number of components D are removed from the tape feeder 7A, it is determined that the components D supplied to the component removal position 7a have switched from the preceding tape 9A to the next tape 9B.

[0035] Next, referring to Figure 8, the supply of components to the non-splicing tape feeder (hereinafter simply referred to as "tape feeder 7B") will be explained. In tape feeder 7B, while the leading tape 9A is supplying components D, the next tape insertion operation is performed to insert the next tape 9B into tape feeder 7B. In tape feeder 7B, when the end of the leading tape 9A passes a predetermined position in tape feeder 7B, tape feeding of the next tape 9B begins.

[0036] Inside the tape feeder 7B, a tape detection sensor 32 is positioned to detect the leading and trailing ends of the carrier tape 9. The tape detection sensor 32 is positioned in the path along which the carrier tape 9 is transported, prior to the component removal position 7a in the tape feeding direction. As the preceding tape 9A and the following tape 9B are fed in pitch, when the trailing end of the preceding tape 9A reaches the position of the tape detection sensor 32, the detection state of the preceding tape 9A by the tape detection sensor 32 changes from "present" to "absent," thereby detecting the trailing end of the preceding tape 9A. Subsequently, when the trailing end of the following tape 9B reaches the position of the tape detection sensor 32, the detection state of the following tape 9B by the tape detection sensor 32 changes from "absent" to "present," thereby detecting the trailing end of the following tape 9B. After the trailing end of the preceding tape 9A is detected, when a predetermined number of components D are removed from the tape feeder 7B, it is determined that the components D supplied to the component removal position 7a have switched from the preceding tape 9A to the following tape 9B.

[0037] Next, referring to Figure 9, the configuration of the control system and information processing system of the mounted circuit board manufacturing system 1 will be explained. Here, we will mainly explain the functions of the mounted circuit board manufacturing system 1, specifically the functions in which component mounting devices M3 to M4 take components D from the tape feeder 7 and measure the electrical characteristics of components D, and the mounted information management device 3 creates trace information.

[0038] The equipment control unit 40 of component mounting devices M3 to M4 is connected to a substrate transport unit 5, a tape feeder 7, a mounting head movement mechanism 12, a mounting head 13, a component camera 15, a substrate camera 16, an operation / display unit 19, and a measurement unit 20. The operation / display unit 19 includes a display unit that displays various information and screens, and an operation unit (input unit) that accepts input of various information. The equipment control unit 40 includes an equipment memory unit 41, a component mounting processing unit 47, a recognition processing unit 48, an event detection unit 49, a measurement target flag setting unit 50, a measurement processing unit 51, a primary trace information creation unit 52, etc. The equipment memory unit 41 is a memory device that stores production data 42, measurement data 43, event information 44, measurement target flag information 45, primary trace information 46, etc.

[0039] In Figure 9, the production data 42 stores information necessary for component mounting devices M3 to M4 to perform mounting work, such as the production program, component distribution data, component data, board data, and equipment data. The production program includes information about the mounting positions Q1 to Q9 of component D on board B (coordinate number, XY coordinates), mounting order, etc. The component distribution data includes information about the component supply position in the component supply unit 6 of component mounting devices M3 to M4 (set position of tape feeder 7, feeder address), etc.

[0040] The component data includes the component name and type, the size (length, width, thickness) and shape of component D, the supply method (carrier tape 9, tray, etc.), the reel ID, information regarding component replenishment (number of components fed from the preceding tape 9A to the next tape 9B after detection by the connecting member detection sensor 31 or tape detection sensor 32), whether or not it is a measurement target, and electrical characteristics (standard value, tolerance range). The board data includes the board ID, board name (model name), the size of board B, and the position of the board mark 17. The equipment data includes information regarding component mounting devices M3 to M4 (serial number, etc.), the serial number of the tape feeder 7, the management number of the suction nozzle 14, and the serial number of the measurement unit 20.

[0041] In Figure 9, the component mounting processing unit 47 controls each part based on the production data 42 to perform the mounting operation of taking component D from the carrier tape 9 (carrier) and mounting it on the substrate B. The recognition processing unit 48 performs image recognition on the substrate label 18 of the substrate B positioned in the substrate transport unit 5, the image captured by the substrate camera 16, and identifies the substrate ID of the substrate B by referring to the production data 42.

[0042] The event detection unit 49 detects various events that occur in the component mounting devices M3 to M4 during the mounting operation and stores them as event information 44 in the equipment storage unit 41. Events detected by the event detection unit 49 include, for example, the detection of the connecting member 30 in the splicing type tape feeder 7A, the detection of the leading edge of the next tape 9B in the non-splicing type tape feeder 7B, the running out of components in the tape feeder 7, the attachment and detachment of the tape feeder 7 to the component supply unit 6, the operation of the operation switch (not shown) of the tape feeder 7, the tape feeder 7 reaching a predetermined number of components D (for example, 5000), and the elapsed time (for example, 10 days) between the last component D being removed from the tape feeder 7 and the next component D being removed.

[0043] In Figure 9, when the event detection unit 49 detects an event requiring the measurement of the electrical characteristics of component D supplied by the tape feeder 7, the measurement target flag setting unit 50 creates measurement target flag information 45, which includes information about the component D to be measured (component name, reel ID, feeder number, feeder address, etc.) and the timing of measurement, and stores it in the equipment storage unit 41.

[0044] For example, when events such as the detection of the connecting member 30 in tape feeder 7A, the detection of the leading edge of the next tape 9B in tape feeder 7B, or a component shortage in tape feeder 7 occur, the first component D supplied from the new carrier tape 9 (next tape 9B) becomes the target of measurement. When events such as the attachment / detachment of tape feeder 7 to the component supply unit 6, or the operation of the tape feeder 7's control switch occur, the carrier tape 9 may have been replaced, so the first component D supplied after the event becomes the target of measurement.

[0045] When the number of components D supplied by the tape feeder 7 reaches a predetermined number, the electrical characteristics of the components D contained in the carrier tape 9 may be fluctuating within an acceptable range. Therefore, as a periodic measurement, the first component D supplied after the event occurs is the target of measurement. Also, when a predetermined time has elapsed since the last component D was removed from the tape feeder 7, it is possible that a carrier tape 9 that was not recorded has been replaced. Therefore, as a measurement for confirmation, the first component D supplied after the event occurs is the target of measurement.

[0046] In Figure 9, the measurement processing unit 51 controls the measurement unit 20 based on the measurement target flag information 45 to measure the electrical characteristics of the component D that has been moved to the measurement position Pm. The measurement processing unit 51 also creates measurement data 43 based on the information about the component D moved to the measurement position Pm contained in the production data 42 and the measurement results of the electrical characteristics, and stores it in the equipment storage unit 41. In other words, the measurement unit 20 and the measurement processing unit 51 constitute a measurement unit 53 that measures the component D that has been removed from the carrier tape 9 (carrier) by the component mounting devices M3 to M4 and creates measurement data 43 that includes the measurement details.

[0047] The measurement unit 53 generates measurement data 43 when an event occurs during the operation of the component loading devices M3 to M4 in which the carrier (carrier tape 9, tray) switches to a new carrier, such as the detection of the connecting member 30 in the tape feeder 7A, the detection of the leading edge of the next tape 9B in the tape feeder 7B, or an event of component depletion in the tape feeder 7, by measuring the component D removed from the carrier immediately afterward. In addition, the measurement unit 53 generates measurement data 43 when an event occurs that may indicate a switch to a new carrier, such as the attachment or detachment of the tape feeder 7 to the component supply unit 6, or the operation of the operation switch of the tape feeder 7, by measuring the component D removed from the carrier immediately afterward.

[0048] Furthermore, when a predetermined number of parts D are removed from the carrier (carrier tape 9, tray) while the parts mounting devices M3 to M4 are in operation, the measurement unit 53 measures the parts D immediately after they are removed from the carrier and creates measurement data 43. Also, when a predetermined amount of time has elapsed since the parts D were removed from the carrier while the parts mounting devices M3 to M4 were in operation, the measurement unit 53 measures the parts D immediately after they are removed from the carrier and creates measurement data 43.

[0049] Here, an example of measurement data 43 will be described with reference to Figure 10(c). The measurement data 43 includes part name information 72, reel ID information 73, measured part type information 79, measurement timing information 80, feeder address information 76, measurement date and time 81, measured value 82, and judgment result 83. Part name information 72 is the part name of the measured part D. Reel ID information 73 is the reel ID of the reel 10 that houses the carrier tape 9 containing the measured part D. Measured part type information 79 is the serial number of the measurement unit 20 that measured the electrical characteristics.

[0050] Measurement timing information 80 is information regarding the timing of measuring the electrical characteristics of component D. Feeder address information 76 is the set position (component supply position) of the tape feeder 7 that supplies the measured component D. Measurement date and time 81 is the date and time when the electrical characteristics were measured. Measurement date and time 81 is recorded in seconds. Measurement value 82 is the measured value of the measured electrical characteristics. Judgment result 83 is information indicating whether the measurement value 82 is within the acceptable range. A judgment result of "OK" in judgment result 83 indicates that the measurement value 82 is within the acceptable range and that component D supplied from tape feeder 7 is correct. A judgment result of "NG" in judgment result 83 indicates that the measurement value 82 is outside the acceptable range and that there is a possibility that component D supplied from tape feeder 7 is incorrect.

[0051] In Figure 9, the primary trace information creation unit 52 creates primary trace information 46 about the component D mounted on substrate B during the mounting operation, based on the production data 42 and the substrate ID of substrate B recognized by the recognition processing unit 48, and stores it in the equipment storage unit 41.

[0052] Here, an example of primary trace information 46 will be explained with reference to Figure 10(b). Primary trace information 46 typically includes substrate ID information 70, coordinate number information 71, component name information 72, reel ID information 73, nozzle number information 74, feeder number information 75, and feeder address information 76 as trace information, and correction value information 77 and retry count 78 as quality trace information. Substrate ID information 70 is the substrate ID of substrate B on which component D is mounted. Coordinate number information 71 is the coordinate number that identifies the mounting position Q1 to Q9 of component D.

[0053] Nozzle number information 74 is the management number of the suction nozzle 14 that held component D and mounted it on substrate B. Feeder number information 75 is the serial number of the tape feeder 7 that supplied component D. Correction value information 77 is the correction value of the mounting positions Q1 to Q9 used when mounting component D on substrate B. Retry count 78 is the number of retries performed to remove component D when a holding error occurred when removing component D from tape feeder 7, or the number of times component D was picked up again from tape feeder 7 for mounting on substrate B after component D was discarded due to the measurement process, i.e., the number of measurement processes.

[0054] Thus, the primary trace information creation unit 52 and the equipment storage unit 41 that stores the primary trace information 46 constitute a primary trace information recording unit 54 that creates and records primary trace information 46 which includes information about components D mounted on the substrate B by component mounting devices M3 to M4 (component name information 72, reel ID information 73, feeder number information 75, feeder address information 76, etc.) or information about the mounting positions Q1 to Q9 of components D on the substrate B (coordinate number information 71).

[0055] In Figure 9, the information processing unit 60 of the implementation information management device 3 includes a higher-level storage unit 61, an information acquisition unit 64, and a trace information creation unit 65. The higher-level storage unit 61 is a memory device that stores received data 62, trace information 63, etc. The information acquisition unit 64 acquires measurement data 43 and primary trace information 46 from component mounting devices M3 to M4 and stores them in the higher-level storage unit 61 as received data 62. The information acquisition unit 64 acquires information from component mounting devices M3 to M4 when the mounting work on one board B is completed, etc. The trace information creation unit 65 creates trace information 63 by associating the acquired measurement data 43 contained in the received data 62 with the primary trace information 46 and stores it in the higher-level storage unit 61.

[0056] Here, with reference to Figure 10(a), the creation of trace information 63 by the trace information creation unit 65 will be explained. First, the trace information creation unit 65 searches the measurement data 43 for the latest measurement value 82 and judgment result 83 of part D that match the reel ID information 73 of the primary trace information 46 (arrow e1). Next, the trace information creation unit 65 stores the latest measurement value 82 and judgment result 83 of part D whose reel ID information 73 matches, associating them with the trace information 63 (arrows e2, arrows e3).

[0057] In other words, if the trace information creation unit 65 obtains the measurement data 43 by taking measurements during the mounting process of mounting component D onto substrate B, it associates the latest measurement data 43 with the primary trace information 46 of component D or the mounting positions Q1 to Q9 of component D that have been mounted on substrate B after the measurement, and creates trace information 63. This creates trace information 63 that associates the latest measurement values ​​82 and judgment results 83 of component D taken from the carrier tape 9 stored on the same reel 10 with the substrate ID and coordinate number of substrate B. In this way, by storing the latest measurement values ​​82 and judgment results 83 of component D as a single data set (trace information 63) associated with the substrate ID and coordinate number of substrate B, it becomes easier to trace the quality control of the mounted substrate.

[0058] Next, following the flow chart in Figure 11, the component mounting process (component mounting method) in which component D is taken from the carrier tape 9 (carrier) transported by the tape feeder 7 in component mounting devices M3 to M4 and mounted on substrate B will be explained. First, the component mounting processing unit 47 controls the substrate transport unit 5 to transport and hold substrate B in the mounting work position (ST1: Substrate transport process). Next, the component mounting processing unit 47 controls the mounting head movement mechanism 12 and the substrate camera 16 to cause the substrate camera 16 to capture an image of the substrate label 18 of substrate B (ST2: Substrate label imaging process). Next, the recognition processing unit 48 obtains the substrate ID of substrate B from the captured image (ST3: Substrate ID recognition process).

[0059] Next, the component mounting processing unit 47 acquires a production program for one turn from the production data 42 (ST4: turn data acquisition process). Then, the component mounting processing unit 47 refers to the measurement target flag information 45 and determines whether or not the acquired production program for one turn includes the component D to be measured (ST5: measurement target determination process). If the component D to be measured is included (Yes in ST5), the measurement processing process (ST6) described later is executed. If the component D to be measured is not included (No in ST5), the component mounting processing unit 47 causes each of the suction nozzles 14 of the mounting head 13 to pick up the component D supplied by the tape feeder 7 of the component supply unit 6 based on the production program (ST7: component pickup process).

[0060] In Figure 11, the component mounting processing unit 47 then moves the mounting head 13 above the component camera 15, and the component camera 15 captures images of the components D held by each suction nozzle 14. The unit recognizes the holding position and holding state of the components D relative to the suction nozzle 14 from the captured images (ST8: component recognition process). Next, the component mounting processing unit 47 moves the mounting head 13 above the substrate B, corrects the position of the mounting head 13 based on the recognized holding position of the components D, and mounts the components D held by each suction nozzle 14 to mounting positions Q1 to Q9 (ST9: component mounting process). Next, the component mounting processing unit 47 determines whether or not there are any components D that are not mounted on the substrate B based on the production data 42 (ST10: unmounted component determination process). If there are unmounted components D (Yes in ST10), the unit returns to the turn data acquisition process (ST4) and the next mounting turn is executed (ST4 to ST10).

[0061] If there are no unmounted components D (No in ST10), that is, when component mounting to substrate B is complete, the component mounting processing unit 47 controls the substrate transport unit 5 to transport substrate B from the mounting work position to the downstream equipment (ST11: Substrate transport process). Next, the equipment control unit 40 outputs the acquired measurement data 43 and primary trace information 46 for one board to the mounting information management device 3 (ST12: Information output process). The information acquisition unit 64 of the mounting information management device 3 receives the outputted measurement data 43 and primary trace information 46, and the trace information creation unit 65 creates trace information 63.

[0062] Next, the measurement processing step (ST6) (measurement processing method) will be explained in accordance with the flow in Figure 12. First, the component mounting processing unit 47 takes the component D to be measured from the tape feeder 7 based on the measurement target flag information 45 and transfers it to the measurement position Pm of the measurement unit 20 (ST21: Measurement target component transfer step) (Figure 6(a)). Next, the measurement processing unit 51 sends a measurement instruction to the measurement unit 20 (ST22: Measurement instruction step). Upon receiving the measurement instruction, the measurement unit 20 executes the measurement process and measures the electrical characteristics of the component D placed at the measurement position Pm. Next, the measurement unit 20 executes the discard step and discards the component D placed at the measurement position Pm into the waste box 29. The measurement processing unit 51 acquires the electrical characteristics (measured value) of the component D to be measured measured by the measurement unit 20 (ST23: Measurement value acquisition step).

[0063] Next, the measurement processing unit 51 determines whether the part D to be measured is the part D specified in the production data 42, based on the acquired measurement value and the specified value and tolerance range of the electrical characteristics of part D included in the production data 42 (ST24: part determination step). If the measured part D is the specified part D (OK in ST24), the measurement processing unit 51 stores the measurement value (measurement result) in the measurement data 43 (ST25: measurement result storage step). Next, the measurement target flag setting unit 50 clears the information of the measured part D from the measurement target flag information 45 (ST26: measurement target flag clearing step). Next, the measurement processing unit 51 determines whether there is another part D to be measured based on the measurement target flag information 45 (ST27: measurement target part determination step).

[0064] In Figure 12, if there is a next part D to be measured (Yes in ST27), the process returns to the part transfer process (ST21) and the measurement of the next part D is performed (ST21-ST27). If there is no next part D to be measured (No in ST27), the process returns to the part mounting process and the part pickup process (ST7) is performed.

[0065] If the part D measured in the part determination process (ST24) is determined not to be the designated part D (NG in ST24), the measurement processing unit 51 causes the display unit of the operation / display unit 19 to notify that the part D supplied by the tape feeder 7 is not the designated part D (ST28: notification process). Next, the measurement processing unit 51 suspends the loading work and puts it on standby until the operator operates the operation unit of the operation / display unit 19 to issue a restart command (No in ST30) (ST29: standby process). The operator performs a replacement operation to replace the carrier tape 9 of the tape feeder 7 with the correct carrier tape 9. After that, when a restart command is input from the operation / display unit 19 (Yes in ST30), the process returns to the measurement target part transfer process (ST21), the measurement target part D is taken out from the replaced carrier tape 9 and transferred to the measurement position Pm, and the measurement is performed (ST21~ST27).

[0066] Next, following the flow chart in Figure 13, we will explain the trace information creation process (trace information creation method) for creating trace information 63 related to component D, which has been removed from the carrier (carrier tape 9, tray) containing component D and mounted on substrate B.

[0067] First, the information acquisition unit 64 acquires primary trace information 46, which includes information about components D mounted on substrate B from component mounting devices M3 to M4 or information about the mounting positions Q1 to Q9 of components D on substrate B, and measurement data 43 obtained by measuring component D removed from the carrier (ST31: Information acquisition process). Next, the trace information creation unit 65 creates trace information 63 by associating the acquired measurement data 43 with the primary trace information 46 (ST32: Trace information creation process). In the trace information creation process (ST32), trace information 63 is created by associating the measurement data 43 with the primary trace information 46 of components D mounted on substrate B after measurement or the mounting positions Q1 to Q9 of components D (see Figure 10).

[0068] As explained above, this disclosure discloses the following technical concepts.

[0069] (Technology 1) A mounting information management device 3 manages information about component D that has been removed from a carrier (carrier tape 9, tray) containing component D and mounted on a substrate B, An information acquisition unit 64 acquires primary trace information 46, which includes information about component D mounted on substrate B or information about the mounting positions Q1 to Q9 of component D on substrate B, and measurement data 43 obtained by measuring component D removed from the carrier. The implementation information management device 3 includes a trace information creation unit 65 that creates trace information 63 by associating acquired measurement data 43 with primary trace information 46.

[0070] This allows for proper management of the measurement data 43 of component D mounted on substrate B.

[0071] (Technology 2) If the measurement data 43 was obtained by taking measurements during the mounting process of component D onto substrate B, The trace information creation unit 65 creates trace information 63 by associating the measurement data 43 with the primary trace information 46 of the component D or the mounting positions Q1 to Q9 of the component D mounted on the substrate B after measurement, as described in Technical Reference 1.

[0072] This allows for proper management of measurement data 43 of component D mounted on substrate B, making it easier to trace quality control of the mounted substrate.

[0073] (Technology 3) A mounting board manufacturing system 1 for manufacturing a mounted board in which components D are mounted on a substrate B, including component mounting devices M3 to M4 that take components D from a carrier (carrier tape 9, tray) containing components D and mount them on a substrate B, A primary trace information recording unit 54 creates and records primary trace information 46 that includes information about components D mounted on substrate B by component mounting devices M3 to M4 or information about the mounting positions Q1 to Q9 of components D on substrate B, A measuring unit 53 measures the component D removed from the carrier by the component mounting devices M3 to M4 and creates measurement data 43 including the measurement details. A mounting board manufacturing system 1 includes a trace information creation unit 65 that creates trace information 63 by associating measurement data 43 with primary trace information 46.

[0074] This allows for proper management of the measurement data 43 of component D mounted on substrate B.

[0075] (Technology 4) The measurement unit 53, when an event occurs during the operation of component mounting devices M3 to M4 in which a carrier (carrier tape 9, tray) switches to a new carrier or an event that may have occurred in which a carrier has switched to a new carrier, measures the component D that has been removed from the carrier immediately thereafter and creates measurement data 43, in the mounted substrate manufacturing system 1 described in Technical 3.

[0076] This allows for the measurement of component D at each event, and enables proper management of the measurement data 43 of component D mounted on circuit board B.

[0077] (Technology 5) The measuring unit 53 measures the component D removed from the carrier (carrier tape 9, tray) immediately after a predetermined number of components are removed from the carrier while the component mounting devices M3 to M4 are in operation, and generates measurement data 43, in the mounted substrate manufacturing system 1 according to Technology 3 or 4.

[0078] This allows for the measurement of component D, which may have fluctuating electrical characteristics, and enables proper management of the measurement data 43 of component D mounted on circuit board B.

[0079] (Technology 6) The measuring unit 53 measures the component D immediately after it has been removed from the carrier (carrier tape 9, tray) during the operation of the component mounting devices M3 to M4, and after a predetermined time has elapsed, and generates measurement data 43, in the mounted substrate manufacturing system 1 according to any one of the technologies 3 to 5.

[0080] This allows for the measurement of component D, which may have undergone a carrier replacement, and enables proper management of the measurement data 43 of component D mounted on circuit board B.

[0081] (Technology 7) If the measurement data 43 was obtained by taking measurements during the mounting process of component D onto substrate B, A mounting substrate manufacturing system according to any one of the technologies 3 to 6, wherein the trace information creation unit 65 associates the measurement data 43 with the primary trace information 46 of the component D or the mounting positions Q1 to Q9 of the component D mounted on the substrate B after measurement to create trace information 63.

[0082] This allows for proper management of measurement data 43 of component D mounted on substrate B, making it easier to trace quality control of the mounted substrate.

[0083] (Technology 8) A method for creating trace information that generates information about component D after it has been removed from a carrier (carrier tape 9, tray) containing component D and mounted on a circuit board B, Information acquisition step (ST31) to acquire primary trace information 46 including information about component D mounted on substrate B or information about the mounting positions Q1 to Q9 of component D on substrate B, and measurement data 43 obtained by measuring component D removed from the carrier, A method for creating trace information, comprising: a trace information creation step (ST32) that creates trace information 63 by associating acquired measurement data 43 with primary trace information 46.

[0084] This allows for proper management of the measurement data 43 of component D mounted on substrate B.

[0085] (Technology 9) If the measurement data 43 was obtained by taking measurements during the mounting process of component D onto substrate B, The trace information creation method described in Technical Reference 8, wherein in the trace information creation step (ST32), the measurement data 43 is associated with the primary trace information 46 of the component D or the mounting positions Q1 to Q9 of the component D mounted on the substrate B after measurement to create trace information 63.

[0086] This allows for proper management of measurement data 43 of component D mounted on substrate B, making it easier to trace quality control of the mounted substrate. [Industrial applicability]

[0087] The mounting information management device, mounting substrate manufacturing system, and trace information creation method of this disclosure have the effect of being able to obtain trace information including measurement data of components mounted on a substrate, and are useful in the field of mounting components on a substrate. [Explanation of symbols]

[0088] 1. Printed circuit board manufacturing system 3. Implementation Information Management Device 9. Carrier Tape (Carrier) 53 Measuring part 54 Primary Trace Information Recording Unit B substrate D parts M3-M4 component mounting device Q1-Q9 Mounting Location

Claims

1. A mounting information management device that manages information about components that have been removed from a carrier containing components and mounted on a circuit board, An information acquisition unit that acquires primary trace information including information about components mounted on the substrate or information about the mounting position of components on the substrate, and measurement data obtained by measuring components removed from the carrier, An implementation information management device comprising: a trace information creation unit that creates trace information by associating the acquired measurement data with the primary trace information; and

2. If the aforementioned measurement data was obtained by taking measurements during the mounting process of mounting components onto the substrate, The mounting information management device according to claim 1, wherein the trace information creation unit creates the trace information by associating the measurement data with the primary trace information of the component mounted on the substrate or the mounting position of the component after measurement.

3. A mounting board manufacturing system that includes a component mounting device for removing components from a carrier containing components and mounting them onto a substrate, and for manufacturing a mounted substrate with components mounted on the substrate, A primary trace information recording unit creates and records primary trace information including information about components mounted on a substrate by the component mounting device or information about the mounting position of components on the substrate. A measuring unit that measures the parts removed from the carrier by the parts mounting device and creates measurement data including the measurement details, A mounting board manufacturing system comprising: a trace information creation unit that creates trace information by associating the measurement data with the primary trace information.

4. The mounting substrate manufacturing system according to claim 3, wherein the measuring unit, when an event occurs during the operation of the component mounting device in which the carrier switches to a new carrier or an event in which there is a possibility that the carrier has switched to a new carrier, measures the component removed from the carrier immediately thereafter and creates the measurement data.

5. The mounting substrate manufacturing system according to claim 3, wherein the measuring unit measures the components removed from the carrier immediately after a predetermined number of components are removed from the carrier while the component mounting device is in operation, and generates the measurement data.

6. The mounting substrate manufacturing system according to claim 3, wherein the measuring unit measures the component immediately after a predetermined time has elapsed since the component was removed from the carrier while the component mounting device was in operation, and generates the measurement data.

7. If the aforementioned measurement data was obtained by taking measurements in between mounting operations of components onto a circuit board, The mounting substrate manufacturing system according to any one of claims 3 to 6, wherein the trace information creation unit creates the trace information by associating the measurement data with the primary trace information of the component mounted on the substrate or the mounting position of the component after measurement.

8. A method for creating trace information that generates information about a component that has been removed from a carrier containing the component and mounted on a circuit board, An information acquisition step includes acquiring primary trace information, which includes information about components mounted on the substrate or information about the mounting position of components on the substrate, and measurement data obtained by measuring components removed from the carrier. A method for creating trace information, comprising: a step of creating trace information by associating the acquired measurement data with the primary trace information.

9. If the aforementioned measurement data was obtained by taking measurements during the mounting process of mounting components onto the substrate, The trace information creation method according to claim 8, wherein in the trace information creation step, the measurement data is associated with the primary trace information of a component mounted on the substrate after measurement or the mounting position of the component to create the trace information.

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