Compositions, electronic components, and semiconductor devices
A composition combining gallium or a gallium alloy, a thermally conductive ceramic filler, and a high-melting-point metal powder addresses the challenges of thermal interface materials, providing enhanced fluidity and thermal conductivity for efficient heat dissipation in electronic components and semiconductor devices.
Patent Information
- Application Number
- JP2024187259
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2026-05-12
AI Technical Summary
Existing thermal interface materials face challenges in achieving high thermal conductivity and maintaining fluidity due to the use of organic silicone resins and the incompatibility of gallium alloys with ceramic fillers, leading to potential leakage and separation issues.
A composition comprising gallium or a gallium alloy, a thermally conductive ceramic filler, and a metal powder with a melting point of 900°C or higher is used, enhancing fluidity and compatibility by improving wettability and preventing separation.
The composition achieves excellent fluidity and thermal conductivity, preventing separation and ensuring good workability, making it suitable for use as a thermal interface material in electronic components and semiconductor devices.