Liquid discharge head and liquid discharge device

Abstract

To provide a highly reliable liquid dispensing head. [Solution] The liquid discharge head comprises a discharge element substrate having a plurality of discharge port rows arranged with a plurality of discharge ports for discharging liquid, and a first flow channel member and a second flow channel member that form a plurality of liquid flow channels communicating with the plurality of discharge port rows, wherein the first flow channel member or the second flow channel member supports the discharge element substrate, the first flow channel member is formed using a resin material and joined to the second flow channel member, and has beam portions 301, 302 that divide a part of the liquid flow channel into a plurality of parallel flow channels, and the beam portions 301, 302 in the liquid flow channels that are adjacent to each other among the plurality of liquid flow channels are arranged with an offset.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection device.

Background Art

[0002] Among liquid ejection devices, there is an inkjet printer that ejects a liquid such as ink from a liquid ejection head to perform printing. In recent years, not only in printing, but the applications of liquid ejection devices are becoming diverse. For example, applications of liquid ejection devices for forming electrodes, manufacturing biochips, etc. are expected. For this reason, there is a demand for a liquid ejection head and a liquid ejection device that can stably eject not only ink containing a coloring material but also functional inks containing various materials. Also in the printing field, there is a demand for a long-life and highly reliable liquid ejection head that can handle a wide variety of inks and media. Further, there is a demand for an inexpensive and highly productive liquid ejection head that can cope with an increase in printing speed.

[0003] Patent Document 1 discloses a liquid ejection head provided with a discharge element substrate for discharging a liquid. The discharge element substrate has a relatively long discharge port row corresponding to an increase in printing speed. The liquid ejection head is provided with a long-hole-shaped liquid flow path that can supply a large amount and uniformly liquid to the discharge port row of the discharge element substrate. The liquid flow path is provided with a beam portion (beam-shaped member) for preventing deformation of the liquid flow path.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a liquid ejection head in which a beam portion is provided in a liquid flow path, there was a possibility that the beam portion would break due to stress concentration on the beam portion, resulting in a decrease in the reliability of the liquid ejection head.

[0006] This disclosure aims to provide a highly reliable liquid dispensing head. [Means for solving the problem]

[0007] A liquid discharge head according to one aspect of the present disclosure comprises a discharge element substrate having a plurality of discharge port rows arranged with a plurality of discharge ports for discharging liquid, and a first flow channel member and a second flow channel member forming a plurality of liquid flow channels communicating with the plurality of discharge port rows, wherein the first flow channel member or the second flow channel member supports the discharge element substrate, the first flow channel member is formed from a resin material and joined to the second flow channel member, and has a beam portion that divides a part of the liquid flow channel into a plurality of parallel flow channels, and the beam portions in adjacent liquid flow channels among the plurality of liquid flow channels are offset from each other. [Effects of the Invention]

[0008] According to this disclosure, a highly reliable liquid dispensing head can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view of a liquid dispensing device. [Figure 2] This is a perspective view of the first liquid dispensing head. [Figure 3] This is an exploded perspective view of the first liquid dispensing head. [Figure 4] This is a schematic diagram showing the circulation path of ink in a steady state. [Figure 5] This is a perspective view showing a cross-section of the ejection element substrate. [Figure 6] This is a schematic diagram showing the inside of the circulation unit. [Figure 7] This is a side view of the first liquid dispensing head. [Figure 8] This is a cross-sectional view of the first liquid dispensing head. [Figure 9] This is a side cross-sectional view of the first liquid dispensing head. [Figure 10] It is a plan view of the first liquid ejection head. [Figure 11] It is a plan view of the second liquid ejection head. [Figure 12] It is a schematic diagram showing an ink supply path. [Figure 13] It is a perspective view showing a cross section of a discharge element substrate. [Figure 14] It is a partial cross-sectional view of the second liquid ejection head. [Figure 15] It is a side cross-sectional view of the second liquid ejection head. [Figure 16] It is a plan view of the second liquid ejection head. [Figure 17] It is a plan view of the second liquid ejection head. [Figure 18] It is a schematic diagram showing the orientation of the filler.

Mode for Carrying Out the Invention

[0010] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the present disclosure, and not all combinations of features described in the following embodiments are essential for the solution means of the present disclosure. The same components will be described with the same reference numerals.

[0011] <<First Embodiment>> The liquid ejection head and the liquid ejection device in the present embodiment can be applied to various devices such as printers, copiers, facsimiles having a communication system, word processors having a printer unit, and the like. The liquid ejection head and the liquid ejection device can be applied to industrial equipment that is combined with various processing devices in a complex manner. Further, the liquid ejection head and the liquid ejection device can also be used, for example, in the manufacture of biochips, printing of electronic circuits, printing on non-absorbent media, and the like.

[0012] <Configuration of Liquid Ejection Device> FIG. 1 is a perspective view schematically showing a liquid ejection device 1. As shown in FIG. 1, the liquid ejection device 1 of the present embodiment includes a carriage 10, a supply unit 20, a supply tube 30, a first liquid ejection head 50, and a second liquid ejection head 60. The liquid ejection device 1 ejects a liquid such as ink from the first liquid ejection head 50 and the second liquid ejection head 60 to print an image on a print medium MD. The first liquid ejection head 50 and the second liquid ejection head 60 are mounted on the carriage 10. The carriage 10 reciprocates in the main scanning direction (X direction) along the guide shaft 11. The print medium MD is conveyed in the sub-scanning direction (Y direction) intersecting (orthogonal in this embodiment) with the main scanning direction by a conveyance roller not shown. The liquid ejection device 1 constitutes a serial type inkjet printing device that performs printing on the print medium MD by ejecting ink while moving the first liquid ejection head 50 and the second liquid ejection head 60 in the main scanning direction. In each figure referred to below, the Z direction indicates the vertical direction and intersects (orthogonal in this example) with the X-Y plane defined by the X direction and the Y direction.

[0013] The first liquid ejection head 50 and the second liquid ejection head 60 are fixed side by side in the main scanning direction (X direction) on the upper part of the carriage 10 by a positioning mechanism and electrical contacts provided on the carriage 10. The first liquid ejection head 50 can eject three types of ink, and the second liquid ejection head 60 can eject six types of ink. Nine types of storage tanks 21 to 29 of the supply unit 20 are connected to the first liquid ejection head 50 and the second liquid ejection head 60 via the supply tube 30.

[0014] For example, the first liquid discharge head 50 is connected to the first storage tank 21, the second storage tank 22, and the third storage tank 23. The second liquid discharge head 60 is connected to the fourth storage tank 24, the fifth storage tank 25, the sixth storage tank 26, the seventh storage tank 27, the eighth storage tank 28, and the ninth storage tank 29. The first to third storage tanks 21 to 23 store three types of ink discharged from the first liquid discharge head 50. The fourth to ninth storage tanks 24 to 29 store six types of ink discharged from the second liquid discharge head 60. The ratio of solvent contained in the ink is, for example, 20% to 25%. It is desirable that the ratio of solvent contained in the liquid (ink) discharged from the first liquid discharge head 50 or the second liquid discharge head 60 be 5% or more. The proportion of solvent contained in the liquid discharged from the first liquid discharge head 50 or the second liquid discharge head 60 may be 100% or less, or 80% or less.

[0015] Furthermore, the supply unit 20 is equipped with a supply pump for pressurizing and supplying ink stored in nine storage tanks 21 to 29 to the first liquid discharge head 50 and the second liquid discharge head 60. The ink stored in the first to third storage tanks 21 to 23 is supplied pressurized to the first liquid discharge head 50 via the supply tube 30 by the supply pump of the supply unit 20. The ink stored in the fourth to ninth storage tanks 24 to 29 is supplied pressurized to the second liquid discharge head 60 via the supply tube 30 by the supply unit 20.

[0016] Furthermore, the first liquid ejection head 50 may be configured to eject one type of ink, so that seven types of storage tanks are connected to the first liquid ejection head 50 and the second liquid ejection head 60. Alternatively, the first liquid ejection head 50 may be configured to eject two types of ink, so that eight types of storage tanks are connected to the first liquid ejection head 50 and the second liquid ejection head 60. In addition, a third liquid ejection head (not shown) capable of ejecting at least three types of ink may be mounted on the carriage 10 so that twelve or more types of storage tanks are connected to the first to third liquid ejection heads. For example, a third liquid ejection head configured similarly to the first liquid ejection head 50 may be mounted on the carriage 10 so that twelve types of storage tanks are connected to the first to third liquid ejection heads. Alternatively, a third liquid ejection head configured similarly to the second liquid ejection head 60 may be mounted on the carriage 10 so that fifteen types of storage tanks are connected to the first to third liquid ejection heads.

[0017] Furthermore, the first liquid dispensing head 50 may be capable of dispensing a reaction solution that reacts with the ink dispensed from the second liquid dispensing head 60. In this case, the first liquid dispensing head 50 may be configured to dispense one type of reaction solution, so that seven types of storage tanks are connected to the first liquid dispensing head 50 and the second liquid dispensing head 60. Also, when the third liquid dispensing head is mounted on the carriage 10, the first liquid dispensing head 50 may be capable of dispensing three types of reaction solutions that react with three of the six types of ink dispensed from the second liquid dispensing head 60. The third liquid dispensing head may be configured similarly to the first liquid dispensing head 50 and be capable of dispensing three types of reaction solutions that react with the other three types of ink dispensed from the second liquid dispensing head 60. In this case, twelve types of storage tanks may be connected to the first to third liquid dispensing heads. Thus, among the multiple liquid dispensing heads, some liquid dispensing heads may be capable of dispensing a reaction solution that reacts with the liquid dispensed from the other liquid dispensing heads, excluding those affected.

[0018] The ink may also be an aqueous ink containing a colorant dispersed by the action of anionic groups. The reaction solution may also be an aqueous reaction solution containing a water-soluble cationic resin having the structure of a quaternary ammonium salt and a polyvalent metal salt. The reaction solution reacts with the ink upon contact, causing the components in the ink (components having anionic groups such as resins, surfactants, and self-dispersing pigments) to aggregate, and contains a specific water-soluble cationic resin and a polyvalent metal salt as a reactant.

[0019] <Configuration of the liquid dispensing head> Next, the first liquid discharge head 50 in the first embodiment will be described. Figure 2 is a perspective view of the first liquid discharge head 50. Figure 3 is an exploded perspective view of the first liquid discharge head 50. As shown in Figures 2 and 3, the first liquid discharge head 50 comprises a discharge element unit 100, a circulation unit 200, a head housing unit 300, and a cover 350.

[0020] As shown in Figure 3, the ejection element unit 100 comprises an ejection element substrate 110, a support member 102, an electrical wiring tape 103, and an electrical contact substrate 104. The ejection element substrate 110 has a row of ejection ports arranged therein for ejecting ink (see Figure 5). Details of the ejection element substrate 110 will be described later.

[0021] The support member 102 supports the discharge element substrate 110 and is adhesively fixed to the lower part of the head housing unit 300. The support member 102 supports the discharge element substrate 110 while being joined to it. The support member 102 is formed in a plate shape using, for example, alumina. Alumina has high thermal conductivity and a low coefficient of linear expansion. This reduces the stress generated in the discharge element substrate 110 supported by the support member 102, and makes the temperature inside the discharge element substrate 110 uniform. The support member 102 has a supply-side connection channel 421 and a recovery-side connection channel 422 that communicate with the discharge port 115 of the discharge element substrate 110.

[0022] The electrical wiring tape 103 is electrically connected to the ejection element substrate 110 and the electrical contact substrate 104. The electrical contact substrate 104 has electrical contacts with the carriage 10. The electrical contact substrate 104 sends drive signals and electrical energy for circulating the ink to the circulation pump 203 of the circulation unit 200 via the circulation unit connector 105 and pump wiring (not shown). The electrical contact substrate 104 also sends drive signals and electrical energy for ejecting the ink to the ejection element substrate 110 via the electrical wiring tape 103.

[0023] Methods for making electrical connections include, but are not limited to, anisotropic conductive film (not shown), wire bonding, and soldering. In this embodiment, the electrical connection between the ejection element substrate 110 and the electrical wiring tape 103 is made using wire bonding. The electrical connection between the ejection element substrate 110 and the electrical wiring tape 103 is sealed with a sealing material (not shown) to protect it from corrosion by ink and external impacts.

[0024] The circulation unit 200 comprises a liquid supply port 32, a first pressure adjustment mechanism 201, a second pressure adjustment mechanism 202 (see Figure 4), and a circulation pump 203. Three circulation units 200 (liquid supply port 32, first pressure adjustment mechanism 201, second pressure adjustment mechanism 202, and circulation pump 203) are provided to correspond to three types of ink. The liquid supply port 32 is connected to a tube connection part 31 inside the head housing unit 300. The tube connection part 31 is formed on the +Y side of the head housing unit 300 and is connected to the supply tube 30. Ink stored in the corresponding storage tank among the first to third storage tanks 21 to 23 is supplied to the liquid supply port 32 via the supply tube 30 and the tube connection part 31.

[0025] The head housing unit 300 is formed in a box shape capable of housing three circulation units 200 using a resin material to which fillers have been added. The fillers added to the resin material include at least one of needle-shaped particles and plate-shaped particles. As the resin material for the head housing unit 300, for example, modified polyphenylene ether, which is a mixture of polyphenylene ether (PPE) resin and polystyrene (PS), is used. A mixture of glass filler and inorganic filler is added to the resin material at a concentration of 35%. The head housing unit 300 is formed by combining multiple parts that are injection-molded using the resin material. As a result, the head housing unit 300 has a positioning mechanism for the carriage 10 and part of the liquid flow channels for supplying ink to the ejection element substrate 110 (for example, the supply-side liquid flow channel 401 and the recovery-side liquid flow channel 402 shown in Figure 4 below). The circulation units 200 are fixed to the inside of the head housing unit 300 using screws 205 and form part of the liquid flow channels. The connection between the circulation unit 200 and the head housing unit 300 in the liquid flow path is sealed using a sealing member. Elastic materials such as rubber or elastomer are used for the sealing member. The discharge element unit 100 is adhesively fixed to the lower part of the head housing unit 300 and forms part of the liquid flow path. The connection between the head housing unit 300 and the discharge element unit 100 in the liquid flow path is sealed using an elastic material.

[0026] The cover 350 is formed in a lid shape using a resin material. The cover 350 is attached to the head housing unit 300 by covering an opening formed in the upper part of the head housing unit 300. As a result, the three circulation units 200 corresponding to the three types of ink are housed inside the head housing unit 300 to which the cover 350 is attached.

[0027] Figure 4 is a schematic diagram showing the steady-state circulation path of the ink supplied from the first storage tank 21. The circulation paths of the ink supplied from the second storage tank 22 and the third storage tank 23 are the same as those of the ink supplied from the first storage tank 21, and detailed illustration and explanation are omitted. The ink stored in the first storage tank 21 is supplied under pressure to the first liquid discharge head 50 via the supply tube 30 by the supply pump P0 of the supply unit 20. At this time, the ink stored in the first storage tank 21 is supplied to the liquid supply port 32 of the circulation unit 200 via the supply tube 30 and the tube connection part 31. After the ink supplied to the liquid supply port 32 has debris removed by the filter 204 of the circulation unit 200, it reaches the first pressure adjustment mechanism 201. In Figure 4, "L" indicated in the first pressure adjustment mechanism 201 indicates a small negative pressure. The "H" indicated in the second pressure adjustment mechanism 202 indicates a large negative pressure. The pressure levels in Figure 4 are inversely related to the pressure levels relative to positive pressure.

[0028] The first pressure adjustment mechanism 201 adjusts the pressure of the ink in the first pressure control chamber 211 to a predetermined pressure (negative pressure). The first pressure control chamber 211 is connected to the common supply channel 111 of the ejection element substrate 110 via the supply-side storage channel 411 and the supply-side connection channel 421, which constitute the supply-side liquid channel 401. The supply-side storage channel 411 is formed in the head housing unit 300. The supply-side connection channel 421 is formed in the support member 102. The supply-side liquid channel 401 communicates with the first pressure control chamber 211 of the circulation unit 200 and the ejection port row of the ejection element substrate 110.

[0029] The second pressure adjustment mechanism 202 adjusts the pressure of the ink in the second pressure control chamber 221 to a lower pressure (negative pressure) than that of the first pressure control chamber 211. The second pressure control chamber 221 is connected to the common recovery channel 112 of the discharge element substrate 110 via the recovery-side storage channel 412 and the recovery-side connecting channel 422, which constitute the recovery-side liquid channel 402. The recovery-side storage channel 412 is formed in the head housing unit 300. The recovery-side connecting channel 422 is formed in the support member 102. The recovery-side liquid channel 402 communicates with the second pressure control chamber 221 of the circulation unit 200 and the discharge port row of the discharge element substrate 110. When the first liquid discharge head 50 discharges three types of ink, the supply-side liquid channels 401 and the recovery-side liquid channels 402, three of each corresponding to the three types of ink, are arranged alternately adjacent to each other in the X direction.

[0030] The circulation pump 203 sends ink from the second pressure control chamber 221 on the low-pressure side (the side with high negative pressure) to the first pressure control chamber 211 on the high-pressure side (the side with low negative pressure). The circulation pump 203 is configured, for example, using a piezoelectric diaphragm pump. A piezoelectric diaphragm pump changes the volume inside the pump chamber by inputting a drive voltage to a piezoelectric element attached to the diaphragm, and the pressure fluctuations move two check valves alternately to send ink.

[0031] Multiple pressure chambers 113 are formed in the ejection element substrate 110, communicating with multiple ejection ports 115 (see Figure 5). A common supply channel 111 and a common recovery channel 112 are connected to the multiple pressure chambers 113. The common supply channel 111 is connected to the first pressure control chamber 211 of the circulation unit 200 via a supply-side connection channel 421 and a supply-side storage channel 411. This adjusts the ink pressure in the common supply channel 111 to the high-pressure side (low negative pressure side), and connects the common supply channel 111 to the upstream side of the pressure chamber 113. The common recovery channel 112 is connected to the second pressure control chamber 221 via a recovery-side connection channel 422 and a recovery-side storage channel 412. This adjusts the ink pressure in the common recovery channel 112 to the low-pressure side (high negative pressure side), and connects the common recovery channel 112 to the downstream side of the pressure chamber 113. Due to the pressure difference between the ink pressure in the common supply channel 111 and the ink pressure in the common recovery channel 112, an ink flow occurs in each pressure chamber 113 in the direction indicated by arrow α in Figure 4. If ink is not ejected from the discharge port 115 during standby and printing, the viscosity of the ink locally increases near the discharge port 115. The ink whose viscosity has locally increased near the discharge port 115 is recovered from the pressure chamber 113 by the ink flow generated by the aforementioned pressure difference. This makes it possible to suppress discharge failures caused by the local increase in ink viscosity near the discharge port 115.

[0032] <Configuration of the ejection element substrate> Next, the ejection element substrate 110 will be described. Figure 5 is a perspective view showing a cross-section of the ejection element substrate 110. As shown in Figure 5, the ejection element substrate 110 comprises a silicon substrate 150, a cover plate 151, an ejection port forming member 152, and an ejection element 154. The silicon substrate 150 is formed in the shape of a thin plate using silicon (Si) or the like. The ejection port forming member 152 is laminated on one side of the silicon substrate 150. The cover plate 151 is bonded to the other side of the silicon substrate 150.

[0033] The nozzle forming member 152 is formed in a thin plate shape that matches the outer periphery of the silicon substrate 150 using a photosensitive resin. For example, a nozzle forming member 152 is formed by patterning nozzles 115 and pressure chambers 113 using photolithography. Multiple nozzle rows are formed on the nozzle forming member 152, with multiple nozzles 115 arranged in the Y direction. Multiple nozzle rows are arranged in the X direction on the nozzle forming member 152. In the example shown in Figure 5, three nozzle rows corresponding to three types of ink are arranged, but two nozzle rows may be arranged, or four or more nozzle rows may be arranged. Multiple pressure chambers 113 communicating with multiple nozzle rows (noises 115) are formed on the other side of the nozzle forming member 152.

[0034] Furthermore, multiple ejection elements 154 are provided on one side of the silicon substrate 150, which generate ejection energy to eject ink from multiple ejection ports 115. The ejection elements 154 are arranged on one side of the silicon substrate 150, facing the pressure chamber 113 (discharge port 115). The ejection elements 154 eject ink by foaming the ink in the pressure chamber 113 using an electrothermal conversion element. Note that the ejection elements 154 are not limited to electrothermal conversion elements, but may also be constructed using piezoelectric elements.

[0035] Grooves are formed on the back side of the ejection element 154 in the silicon substrate 150 to form a common supply channel 111 and a common recovery channel 112. The common supply channel 111 and the common recovery channel 112 extend in the direction along the row of ejection ports (Y direction). A supply port 113a is formed in the silicon substrate 150 between the pressure chamber 113 and the common supply channel 111. The supply port 113a connects the pressure chamber 113 and the common supply channel 111. A recovery port 113b is formed in the silicon substrate 150 between the pressure chamber 113 and the common recovery channel 112. The recovery port 113b connects the pressure chamber 113 and the common recovery channel 112.

[0036] The cover plate 151 is formed in a thin plate shape that matches the outer periphery of the silicon substrate 150, for example, using silicon. The cover plate 151 functions as a lid that forms part of the wall of the common supply channel 111 and common recovery channel 112 formed in the silicon substrate 150. The cover plate 151 has a plurality of supply channel openings 121 and a plurality of recovery channel openings 122. The supply channel openings 121 are formed in an elongated shape that communicates with the common supply channel 111 and are aligned in the direction along the discharge port row (Y direction). The recovery channel openings 122 are formed in an elongated shape that communicates with the common recovery channel 112 and are aligned in the direction along the discharge port row (Y direction). The recovery channel openings 122 are also positioned offset in the Y direction from the supply channel openings 121.

[0037] <Configuration of the pressure regulation mechanism> Next, the first pressure adjustment mechanism 201 and the second pressure adjustment mechanism 202 of the circulation unit 200 will be described. Figure 6 is a schematic diagram showing the inside of the circulation unit 200. As shown in Figure 6, the first pressure adjustment mechanism 201 includes a first valve 232, a first valve spring 233, a first flexible member 231, a first pressure plate 235, and a first pressure adjustment spring 234.

[0038] When the volume of the first pressure control chamber 211 decreases due to ink discharge or other reasons, the first pressure plate 235 deforms the first flexible member 231 and the first pressure regulating spring 234 to maintain a constant ink pressure in the first pressure control chamber 211. The first pressure regulating spring 234 compresses and deforms the first valve spring 233 in a direction that compresses it via the first valve 232, thereby opening the first valve 232 and supplying ink from the liquid supply port 32 to the first pressure control chamber 211. Therefore, the first pressure regulating mechanism 201 can maintain the ink pressure in the first pressure control chamber 211 at a predetermined pressure (negative pressure). The negative pressure in the first pressure control chamber 211 is set based on the contact position of the first pressure regulating spring 234 and the first valve 232 with respect to the first pressure plate 235.

[0039] The second pressure adjustment mechanism 202 comprises a second valve 242, a second valve spring 243, a second flexible member 241, a second pressure plate 245, and a second pressure adjustment spring 244. The second pressure adjustment mechanism 202 is configured similarly to the first pressure adjustment mechanism 201, except that ink is supplied from the first pressure control chamber 211. Therefore, the second pressure adjustment mechanism 202 is capable of maintaining the ink pressure in the second pressure control chamber 221 at a lower pressure (negative pressure) than that in the first pressure control chamber 211.

[0040] As mentioned above, the circulation pump 203 sends ink from the second pressure control chamber 221 to the first pressure control chamber 211. When ink is sent from the second pressure control chamber 221 to the first pressure control chamber 211 by the circulation pump 203, the negative pressure of the ink in the first pressure control chamber 211 decreases and the negative pressure of the ink in the second pressure control chamber 221 increases. As the negative pressure of the ink in the second pressure control chamber 221 increases, the ink supplied from the first pressure control chamber 211 to the pressure chamber 113 is recovered into the second pressure control chamber 221. As a result, with the ink pressure in the first pressure control chamber 211 and the second pressure control chamber 221 kept constant, a flow of ink circulating between the first pressure control chamber 211, the pressure chamber 113, and the second pressure control chamber 221 is created. Hereinafter, the flow of ink circulating between the first pressure control chamber 211, the pressure chamber 113, and the second pressure control chamber 221 will be referred to as the circulating flow. The circulation of ink through the pressure chamber 113 allows for the removal of ink with locally increased viscosity near the discharge port 115, making it possible to stably discharge ink from the discharge port 115.

[0041] <Flow path connection in liquid discharge head> Next, the flow path connection in the first liquid ejection head 50 will be described. Figure 7 is a side view of the first liquid ejection head 50. Figure 8 is a cross-sectional view of the first liquid ejection head 50. Figure 8(a) is a cross-sectional view of Figure 7 between VIIIa and VIIIa. Figure 8(b) is a cross-sectional view of Figure 7 between VIIIb and VIIIb. The ejection element substrate 110 ejects ink vertically downward (+Z direction) from a row of ejection ports extending along the aforementioned sub-scanning direction (Y direction).

[0042] The cross-sectional view in Figure 8(a) shows the supply channel opening 121 of the discharge element substrate 110. The supply channel opening 121 is connected to the supply-side connection channel 421 formed in the support member 102. The supply-side connection channel 421 is connected to the supply-side storage channel 411 formed in the head housing unit 300. The supply-side storage channel 411 is connected to the first pressure control chamber 211 formed in the circulation unit 200. In this way, the first pressure control chamber 211 of the circulation unit 200 is connected to the common supply channel 111 of the discharge element substrate 110 (see Figure 5) via the supply-side storage channel 411, the supply-side connection channel 421, and the supply channel opening 121.

[0043] The cross-sectional view in Figure 8(b) shows the recovery channel opening 122 of the discharge element substrate 110. The recovery channel opening 122 is connected to the recovery-side connecting channel 422 formed in the support member 102. The recovery-side connecting channel 422 is connected to the recovery-side storage channel 412 formed in the head housing unit 300. The recovery-side storage channel 412 is connected to the second pressure control chamber 221 formed in the circulation unit 200. In this way, the second pressure control chamber 221 of the circulation unit 200 is connected to the common recovery channel 112 of the discharge element substrate 110 (see Figure 5) via the recovery-side storage channel 412, the recovery-side connecting channel 422, and the recovery channel opening 122.

[0044] Figure 9 is a side cross-sectional view of the first liquid discharge head 50. Figure 9(a) is a cross-sectional view of Figure 8(a) between IXa and IXa. Figure 9(b) is a cross-sectional view of Figure 8(b) between IXb and IXb. As shown in Figure 9(a), the supply-side storage channel 411 has an elongated cross-section with a narrow width in the X direction and a wide width in the Y direction, and is formed into a channel shape that is long in the Z direction. The supply-side storage channel 411 is capable of storing bubbles. Four supply-side beam sections 301 are formed on the lower (+Z direction) wall surface of the supply-side storage channel 411 in the head housing unit 300, aligned in the Y direction. The supply-side beam sections 301 are formed in a beam shape that extends along the Z direction. The four supply-side beam sections 301 divide the lower side of the supply-side storage channel 411 into five parallel channels. The supply-side beam section 301 improves the moldability of the supply-side storage channel 411 and reduces deformation of the supply-side storage channel 411. The support member 102 also has supply-side connecting channels 421 that are divided and formed in alignment with the nine supply channel openings 121 that are arranged in the direction along the discharge port row (Y direction). The nine supply-side connecting channels 421 arranged in the direction along the discharge port row (Y direction) are connected to the supply-side storage channel 411, which has an elongated hole shape in cross-section.

[0045] As shown in Figure 9(b), the recovery-side storage channel 412 has an elongated cross-section with a narrow width in the X direction and a wide width in the Y direction, and is formed into a channel shape that is long in the Z direction. The recovery-side storage channel 412 is capable of storing bubbles. Four recovery-side beam sections 302 are formed on the lower (+Z direction) wall surface of the recovery-side storage channel 412 in the head housing unit 300, aligned in the Y direction. The recovery-side beam sections 302 are formed in a beam shape that extends along the Z direction. The four recovery-side beam sections 302 divide the lower side of the recovery-side storage channel 412 into five parallel channels. The recovery-side beam sections 302 improve the moldability of the recovery-side storage channel 412 and reduce deformation of the recovery-side storage channel 412. In addition, the support member 102 has a recovery-side connecting channel 422 that is divided and formed in a positional alignment with the eight recovery channel openings 122 that are aligned in the direction along the discharge port row (Y direction). Eight recovery-side connection channels 422, arranged in the direction along the discharge port row (Y direction), are connected to a recovery-side storage channel 412 that has an elongated hole shape in cross-section.

[0046] As shown in Figure 8(a), the ink that flows out from the first pressure control chamber 211 of the circulation unit 200 flows through the supply-side storage channel 411, the supply-side connection channel 421, and the supply channel opening 121 to the common supply channel 111 of the discharge element substrate 110. A portion of the ink that flows out from the first pressure control chamber 211 flows to the second pressure adjustment mechanism 202. As shown in Figure 5, the ink that reaches the common supply channel 111 of the discharge element substrate 110 flows through the supply port 113a to the pressure chamber 113. The ink in the pressure chamber 113 that was not discharged from the discharge port 115 flows through the recovery port 113b to the common recovery channel 112. The ink that reaches the common recovery channel 112 of the discharge element substrate 110 flows through the recovery channel opening 122, the recovery-side connection channel 422, and the recovery-side storage channel 412 to the second pressure control chamber 221 of the circulation unit 200, as shown in Figure 8(b). The ink that flows into the second pressure control chamber 221 is sent to the first pressure control chamber 211 by the circulation pump 203. In this way, a circulating flow of ink is generated in the first liquid ejection head 50.

[0047] The ink circulation flow is completed within the liquid channel of the first liquid ejection head 50. Therefore, bubbles (not shown) generated within the liquid channel of the first liquid ejection head 50 are present in some part of the ink circulation flow. Bubbles are generated by factors such as ink filling, foaming due to ink flow, and a decrease in the solubility of gases in the ink due to temperature rise or pressure drop. If bubbles flow into the pressure chamber 113, ink ejection failure may occur, potentially reducing print quality. Therefore, it is desirable to store bubbles in the supply-side storage channel 411 or the recovery-side storage channel 412, which are far from the pressure chamber 113, to prevent them from flowing into the pressure chamber 113. By forming the supply-side storage channel 411 and the recovery-side storage channel 412 with a channel shape that is elongated in cross-section, it becomes possible to recover and store bubbles using buoyancy.

[0048] Figure 10 is a plan cross-sectional view of the first liquid discharge head 50. Figure 10(a) is a cross-sectional view taken between Xa and Xa in Figure 7. Figure 10(b) is a cross-sectional view taken between Xb and Xb in Figure 7. The first liquid discharge head 50 is provided with three sets of liquid flow paths (supply-side liquid flow paths 401 and recovery-side liquid flow paths 402) corresponding to three types of ink. The supply-side liquid flow path 401 is formed by connecting a supply-side storage flow path 411 and a supply-side connection flow path 421 between the circulation unit 200 and the discharge element substrate 110. The recovery-side liquid flow path 402 is formed by connecting a recovery-side storage flow path 412 and a recovery-side connection flow path 422 between the circulation unit 200 and the discharge element substrate 110. As shown in Figure 10(a), the support member 102 has rows of supply-side connection channels 421 arranged in the direction along the discharge port row (Y direction) and rows of recovery-side connection channels 422 arranged in the direction along the discharge port row, arranged alternately in the X direction. As shown in Figure 10(b), the head housing unit 300 has rows of supply-side storage channels 411 and recovery-side storage channels 412, which are elongated holes in cross-section, arranged alternately adjacent to each other in the X direction.

[0049] One way to reduce costs by miniaturizing the ejection element substrate 110 is to narrow the width of the ejection element substrate 110 in the X direction, which does not affect the printing speed. In this case, the liquid flow channels for supplying ink to the ejection element substrate 110 must be individually connected to the ejection element substrate 110 with a narrow width in the X direction, and the openings of the liquid flow channels must be formed with high precision.

[0050] As shown in Figures 8(a) and 8(b), the lower openings of the supply-side storage channel 411 and the recovery-side storage channel 412 of the head housing unit 300 are connected to the supply-side connecting channel 421 and the recovery-side connecting channel 422, which have a small pitch in the X direction to match the discharge element substrate 110. The upper openings of the supply-side storage channel 411 and the recovery-side storage channel 412 are connected to the first pressure control chamber 211 and the second pressure control chamber 221 of the circulation unit 200, which have a large pitch in the X direction. For this reason, the supply-side storage channel 411 and the recovery-side storage channel 412 have an elongated cross-section with a narrow width in the X direction and a wide width in the Y direction, forming a channel shape that is long in the Z direction. In addition, the pitch in the X direction in which the supply-side storage channel 411 and the recovery-side storage channel 412 are alternately arranged increases as you move from the discharge element substrate 110 toward the circulation unit 200. To form such a supply-side storage channel 411 and a recovery-side storage channel 412 with fewer parts, it is desirable to manufacture the head housing unit 300 by injection molding.

[0051] Furthermore, the supply-side storage channels 411 and recovery-side storage channels 412, each provided in three sections corresponding to three types of ink, are arranged alternately adjacent to each other in the X direction. Four supply-side beam sections 301, aligned in the Y direction, are formed on the lower (+Z direction) wall surface of the supply-side storage channel 411 in the head housing unit 300. Four recovery-side beam sections 302, aligned in the Y direction, are formed on the lower wall surface of the recovery-side storage channel 412 in the head housing unit 300. As a result, the moldability of the supply-side storage channels 411 and recovery-side storage channels 412 is improved, allowing the openings on the lower (+Z direction) side of the supply-side storage channels 411 and recovery-side storage channels 412 to be formed with high precision.

[0052] In this embodiment, the length of the discharge port row in the discharge element substrate 110 is 1.6 inches. The lower side of the supply-side storage channel 411 is divided into five channels having a Y-direction width of 0.25 inches to 0.4 inches by four supply-side beams 301. The lower side of the recovery-side storage channel 412 is divided into five channels having a Y-direction width of 0.25 inches to 0.4 inches by four recovery-side beams 302. It is desirable that the four supply-side beams 301 be arranged such that the Y-direction width of the channels on the lower side of the supply-side storage channel 411 is 0.5 inches (12.7 mm) or less. It is also desirable that the four recovery-side beams 302 be arranged such that the Y-direction width of the channels on the lower side of the recovery-side storage channel 412 is 0.5 inches or less. This reduces deformation of the supply-side storage channel 411 and the recovery-side storage channel 412.

[0053] Furthermore, the supply-side storage channel 411 and the recovery-side storage channel 412 are preferably applied to a liquid discharge head with a discharge port row length of 0.5 inches or more. The discharge port row length refers to the distance from a discharge port 115 located at one end of the discharge port row to a discharge port 115 located at the other end of the discharge port row. The discharge port row length can be set within a range that does not exceed the diameter of the wafer used in the manufacture of the discharge element substrate 110. For example, the discharge port row length may be 12 inches or less, or 8 inches or less. In order to suppress an increase in the manufacturing cost of the discharge element substrate 110, the discharge port row length may be 2 inches or less.

[0054] Furthermore, the support member 102 and the head housing unit 300 are joined by an adhesive (not shown). For example, a thermosetting epoxy resin adhesive is used as the adhesive. A thermosetting epoxy resin adhesive is a thermosetting adhesive that contains epoxy resin as its main component. Because thermosetting epoxy resin adhesives have high chemical resistance and bonding strength, they can be used with various types of inks. When a thermosetting epoxy resin adhesive is used, a heating process using a curing furnace or the like is performed, so stress is generated in the support member 102 and the head housing unit 300 due to the difference in thermal shrinkage after joining. The stress due to the difference in thermal shrinkage after joining increases depending on the temperature at the time of joining, the difference in the coefficient of linear expansion between the material of the head housing unit 300 and the material of the support member 102, and the length of the joint between the support member 102 and the head housing unit 300. The coefficient of linear expansion of alumina, the material of the support member 102, is 7.2 ppm / °C. The coefficient of linear expansion of filler-containing resin, the material of the head housing unit 300, is 39.0 ppm / °C. The difference between the linear expansion coefficient of the material of the head housing unit 300 and the linear expansion coefficient of the material of the support member 102 is 31.8 ppm / °C. Thus, the difference (absolute value) between the linear expansion coefficient of the material of the head housing unit 300 and the linear expansion coefficient of the material of the support member 102 is 6 ppm / °C or more. As a result, the supply-side beam section 301 and the recovery-side beam section 302 of the head housing unit 300 contract more than the support member 102, generating strong tensile stress in the supply-side beam section 301 and the recovery-side beam section 302.

[0055] If the supply-side beam 301 of the supply-side storage channel 411 and the recovery-side beam 302 of the recovery-side storage channel 412 adjacent to the supply-side storage channel 411 are positioned at the same location in the Y direction, stress will concentrate on the supply-side beam 301 and the recovery-side beam 302. As a result, the supply-side beam 301 and the recovery-side beam 302 may fracture due to stress caused by the difference in thermal expansion after joining the support member 102 and the head housing unit 300. Not only after joining the support member 102 and the head housing unit 300, but also when the operating environment of the liquid discharge device 1 becomes low, the supply-side beam 301 and the recovery-side beam 302 may fracture due to stress caused by the difference in thermal expansion at the ambient temperature. In other words, regardless of whether the support member 102 and the head housing unit 300 are bonded together, the supply-side beam 301 and the recovery-side beam 302 may fracture due to stress generated by temperature changes from the time of joining. Furthermore, even when the support member 102 and the head housing unit 300 are joined not only by adhesive bonding but also by heat welding, press-fitting, etc., the supply-side beam 301 and the recovery-side beam 302 may fracture due to stress generated by temperature changes from the time of joining. Also, even when the material of the support member 102 and the material of the head housing unit 300 are the same, the supply-side beam 301 and the recovery-side beam 302 may fracture due to stress generated by anisotropy of the coefficient of linear expansion due to the shape, differences in shrinkage due to the shape, etc.

[0056] In this embodiment, the supply-side beam portion 301 of the supply-side storage channel 411 and the recovery-side beam portion 302 of the recovery-side storage channel 412 adjacent to the supply-side storage channel 411 are offset in the direction along the discharge port row (Y direction). This allows for the relaxation of stress generated in the supply-side beam portion 301 and the recovery-side beam portion 302 after the support member 102 and the head housing unit 300 are joined, thereby suppressing fracture of the supply-side beam portion 301 and the recovery-side beam portion 302. Therefore, a highly reliable liquid discharge head that can suppress fracture of the supply-side beam portion 301 and the recovery-side beam portion 302 can be provided. Alternatively, the four supply-side beam portions 301 of the supply-side storage channel 411 and the four recovery-side beam portions 302 of the recovery-side storage channel 412 adjacent to the supply-side storage channel 411 may be offset by the same distance. This makes it less likely for bias to occur in the five lower channels of the supply-side storage channel 411, which are separated by the four supply-side beam sections 301, and in the five lower channels of the recovery-side storage channel 412, which are separated by the four recovery-side beam sections 302. Therefore, the moldability of the supply-side storage channel 411 and the recovery-side storage channel 412 is maintained, and the openings on the lower side (+Z direction side) of the supply-side storage channel 411 and the recovery-side storage channel 412 can be formed with high precision. In this case, it is desirable that the arrangement of the four supply-side beam sections 301 and the four recovery-side beam sections 302 along the direction in which the supply-side storage channel 411 and the recovery-side storage channel 412 are aligned (X direction) be in a staggered arrangement.

[0057] As described above, the first embodiment provides a highly reliable liquid discharge head. Specifically, in this embodiment, the head housing unit 300, which is the first flow path member, has a supply-side beam portion 301 that divides a part of the supply-side liquid flow path 401, specifically the lower side of the supply-side storage flow path 411, into a plurality of parallel flow paths. In addition, the head housing unit 300 has a recovery-side beam portion 302 that divides a part of the recovery-side liquid flow path 402, specifically the lower side of the recovery-side storage flow path 412, into a plurality of parallel flow paths. The supply-side beam portion 301 and the recovery-side beam portion 302 in the supply-side storage flow path 411 and the recovery-side storage flow path 412, which are adjacent to each other, are offset in the direction along the discharge port row. This makes it possible to relieve the stress generated in the supply-side beam portion 301 and the recovery-side beam portion 302 after the support member 102 and the head housing unit 300 are joined, thereby suppressing fracture of the supply-side beam portion 301 and the recovery-side beam portion 302. In this way, a highly reliable liquid discharge head can be provided.

[0058] Furthermore, the offset amount between the supply-side beam section 301 and the recovery-side beam section 302 in the supply-side storage channel 411 and the recovery-side storage channel 412, which are adjacent to each other, is the same for all four supply-side beam sections 301 and recovery-side beam sections 302. As a result, bias is less likely to occur in the five channels below the supply-side storage channel 411, which are separated by the four supply-side beam sections 301, and in the five channels below the recovery-side storage channel 412, which are separated by the four recovery-side beam sections 302. Consequently, the moldability of the supply-side storage channel 411 and the recovery-side storage channel 412 is maintained, and the openings on the lower sides of the supply-side storage channel 411 and the recovery-side storage channel 412 can be formed with high precision.

[0059] Furthermore, the support member 102, which is the second flow channel member, is formed using alumina. Alumina has high thermal conductivity and a low coefficient of linear expansion. This reduces the stress generated in the discharge element substrate 110 supported by the support member 102, and makes the temperature inside the discharge element substrate 110 uniform.

[0060] In the first embodiment described above, the supply-side beam section 301 and the recovery-side beam section 302 in the supply-side storage channel 411 and the recovery-side storage channel 412, which are adjacent to each other, are offset in the direction along the discharge port row, but the invention is not limited to this. For example, the supply-side beam section 301 and the recovery-side beam section 302 in the supply-side storage channel 411 and the recovery-side storage channel 412, which are adjacent to each other, may be offset in the direction of extension (Z direction) of the discharge port 115.

[0061] <<Second Embodiment>> Next, a second embodiment will be described. Some components in the second embodiment have the same configuration as those in the first embodiment described above, and will therefore be described using the same reference numerals as those used for each component in the first embodiment. In the second embodiment, a second liquid discharge head 60, which is configured similarly to the first liquid discharge head 50, will be described.

[0062] <Configuration of the liquid dispensing head> Figure 11 is a plan cross-sectional view of the second liquid discharge head 60. Figure 11(a) is a plan cross-sectional view showing the support member 602 in the second liquid discharge head 60. Figure 11(b) is a plan cross-sectional view showing the head housing unit 800 in the second liquid discharge head 60. The second liquid discharge head 60 is configured in the same way as the first liquid discharge head 50, except for the support member 602 and the head housing unit 800. The support member 602 of the second embodiment is configured in the same way as the support member 102 of the first embodiment, except for supporting two discharge element substrates 110. The head housing unit 800 of the second embodiment is configured in the same way as the head housing unit 300 of the first embodiment, except for being able to accommodate six circulation units 200.

[0063] As shown in Figures 11(a) and 11(b), the second liquid discharge head 60 is provided with six sets of liquid channels corresponding to six types of ink. The six sets of liquid channels include the first to sixth supply-side liquid channels 901A to 901F and the first to sixth recovery-side liquid channels 902A to 902F, and are formed by the head housing unit 800 and the support member 602. The first to sixth supply-side storage channels 911A to 911F, which constitute the first to sixth supply-side liquid channels 901A to 901F, are formed in the head housing unit 800. The first to sixth supply-side connecting channels 921A to 921F, which constitute the first to sixth supply-side liquid channels 901A to 901F, are formed in the support member 602. The first to sixth recovery side storage channels 912A to 912F, which constitute the first to sixth recovery side liquid channels 902A to 902F, are formed in the head housing unit 800. The first to sixth recovery side connecting channels 922A to 922F, which constitute the first to sixth recovery side liquid channels 902A to 902F, are formed in the support member 602.

[0064] As shown in Figure 11(b), the first to sixth supply-side storage channels 911A to 911F are formed similarly to the supply-side storage channel 411 of the first embodiment. For example, the first supply-side storage channel 911A is connected to the first pressure control chamber 211 of the circulation unit 200 to which ink is supplied from the fourth storage tank 24 (see Figure 1). The second supply-side storage channel 911B is connected to the first pressure control chamber 211 of the circulation unit 200 to which ink is supplied from the fifth storage tank 25 (see Figure 1). The third supply-side storage channel 911C is connected to the first pressure control chamber 211 of the circulation unit 200 to which ink is supplied from the sixth storage tank 26 (see Figure 1). The fourth supply-side storage channel 911D is connected to the first pressure control chamber 211 of the circulation unit 200 to which ink is supplied from the seventh storage tank 27 (see Figure 1). The fifth supply-side storage channel 911E is connected to the first pressure control chamber 211 of the circulation unit 200, which is supplied with ink from the eighth storage tank 28 (see Figure 1). The sixth supply-side storage channel 911F is connected to the first pressure control chamber 211 of the circulation unit 200, which is supplied with ink from the ninth storage tank 29 (see Figure 1).

[0065] The first to sixth recovery-side storage channels 912A to 912F are formed in the same manner as the recovery-side storage channel 412 of the first embodiment. For example, the first recovery-side storage channel 912A is connected to the second pressure control chamber 221 of the circulation unit 200 to which ink is supplied from the fourth storage tank 24. The second recovery-side storage channel 912B is connected to the second pressure control chamber 221 of the circulation unit 200 to which ink is supplied from the fifth storage tank 25. The third recovery-side storage channel 912C is connected to the second pressure control chamber 221 of the circulation unit 200 to which ink is supplied from the sixth storage tank 26. The fourth recovery-side storage channel 912D is connected to the second pressure control chamber 221 of the circulation unit 200 to which ink is supplied from the seventh storage tank 27. The fifth recovery-side storage channel 912E is connected to the second pressure control chamber 221 of the circulation unit 200, which is supplied with ink from the eighth storage tank 28. The sixth recovery-side storage channel 912F is connected to the second pressure control chamber 221 of the circulation unit 200, which is supplied with ink from the ninth storage tank 29.

[0066] The first to third supply-side storage channels 911A to 911C and the fourth to sixth supply-side storage channels 911D to 911F are arranged symmetrically with respect to the center line extending in the Y direction of the head housing unit 800. The first to third recovery-side storage channels 912A to 912C and the fourth to sixth recovery-side storage channels 912D to 912F are arranged symmetrically with respect to the center line extending in the Y direction of the head housing unit 800. Starting from the end in the X direction, the first supply-side storage channel 911A, the first recovery-side storage channel 912A, the second supply-side storage channel 911B, the second recovery-side storage channel 912B, the third supply-side storage channel 911C, and the third recovery-side storage channel 912C are arranged in that order. Thus, in the portion of the head housing unit 800 on the -X side, the first to third supply-side storage channels 911A to 911C and the first to third recovery-side storage channels 912A to 912C are formed alternately adjacent to each other in the X direction. Starting from the end side in the +X direction, the fourth supply-side storage channel 911D, the fourth recovery-side storage channel 912D, the fifth supply-side storage channel 911E, the fifth recovery-side storage channel 912E, the sixth supply-side storage channel 911F, and the sixth recovery-side storage channel 912F are arranged in that order. Thus, in the portion of the head housing unit 800 on the +X side, the fourth to sixth supply-side storage channels 911D to 911F and the fourth to sixth recovery-side storage channels 912D to 912F are formed alternately adjacent to each other in the X direction.

[0067] As shown in Figure 11(a), the first to sixth supply-side connection channels 921A to 921F are formed similarly to the supply-side connection channel 421 of the first embodiment and are connected to the supply channel opening 121 of the discharge element substrate 110. For example, the first supply-side connection channel 921A is connected to the first supply-side storage channel 911A of the head housing unit 800. The second supply-side connection channel 921B is connected to the second supply-side storage channel 911B of the head housing unit 800. The third supply-side connection channel 921C is connected to the third supply-side storage channel 911C of the head housing unit 800. The fourth supply-side connection channel 921D is connected to the fourth supply-side storage channel 911D of the head housing unit 800. The fifth supply-side connection channel 921E is connected to the fifth supply-side storage channel 911E of the head housing unit 800. The sixth supply-side connection channel 921F is connected to the sixth supply-side storage channel 911F of the head housing unit 800.

[0068] The first to sixth recovery-side connection channels 922A to 922F are formed similarly to the recovery-side connection channel 422 of the first embodiment and are connected to the recovery channel opening 122 of the discharge element substrate 110. For example, the first recovery-side connection channel 922A is connected to the first recovery-side storage channel 912A of the head housing unit 800. The second recovery-side connection channel 922B is connected to the second recovery-side storage channel 912B of the head housing unit 800. The third recovery-side connection channel 922C is connected to the third recovery-side storage channel 912C of the head housing unit 800. The fourth recovery-side connection channel 922D is connected to the fourth recovery-side storage channel 912D of the head housing unit 800. The fifth recovery-side connection channel 922E is connected to the fifth recovery-side storage channel 912E of the head housing unit 800. The sixth recovery-side connection channel 922F is connected to the sixth recovery-side storage channel 912F of the head housing unit 800.

[0069] The first to third supply-side connection channels 921A to 921C and the fourth to sixth supply-side connection channels 921D to 921F are formed symmetrically with respect to the center line extending in the Y direction of the support member 602. The first to third recovery-side connection channels 922A to 922C and the fourth to sixth recovery-side connection channels 922D to 922F are formed symmetrically with respect to the center line extending in the Y direction of the support member 602. The first supply-side connection channel 921A, the first recovery-side connection channel 922A, the second supply-side connection channel 921B, the second recovery-side connection channel 922B, the third supply-side connection channel 921C, and the third recovery-side connection channel 922C are arranged in order from the end side in the -X direction. Thus, in the portion of the support member 602 on the -X side, rows of the first to third supply-side connection channels 921A to 921C and rows of the first to third recovery-side connection channels 922A to 922C are formed alternately in the X direction. Starting from the end side in the +X direction, the fourth supply-side connection channel 921D, the fourth recovery-side connection channel 922D, the fifth supply-side connection channel 921E, the fifth recovery-side connection channel 922E, the sixth supply-side connection channel 921F, and the sixth recovery-side connection channel 922F are arranged in order. Thus, in the portion of the support member 602 on the +X side, rows of the fourth to sixth supply-side connection channels 921D to 921F and rows of the fourth to sixth recovery-side connection channels 922D to 922F are formed alternately in the X direction.

[0070] The support member 602 is formed using alumina, similar to the first embodiment. The head housing unit 800 is formed using a resin material with fillers added, similar to the first embodiment. The second liquid discharge head 60 is larger than the first liquid discharge head 50. Therefore, the stress generated by temperature changes from the time of joining the support member 602 and the head housing unit 800 is greater than the stress generated in the first liquid discharge head 50.

[0071] Four first supply-side beams 801A are formed in the Y direction on the lower (+Z direction) wall of the first supply-side storage channel 911A in the head housing unit 800. Four first recovery-side beams 802A are formed in the Y direction on the lower wall of the first recovery-side storage channel 912A in the head housing unit 800. Four second supply-side beams 801B are formed in the Y direction on the lower wall of the second supply-side storage channel 911B in the head housing unit 800. Four second recovery-side beams 802B are formed in the Y direction on the lower wall of the second recovery-side storage channel 912B in the head housing unit 800. Four third supply-side beams 801C are formed in the Y direction on the lower wall of the third supply-side storage channel 911C in the head housing unit 800. In the head housing unit 800, the wall portion of the third recovery side storage channel 912C does not have a third recovery side beam portion formed on it.

[0072] Four fourth supply-side beam sections 801D are formed in the lower wall of the fourth supply-side storage channel 911D in the head housing unit 800, aligned in the Y direction. Four fourth recovery-side beam sections 802D are formed in the lower wall of the fourth recovery-side storage channel 912D in the head housing unit 800, aligned in the Y direction. Four fifth supply-side beam sections 801E are formed in the lower wall of the fifth supply-side storage channel 911E in the head housing unit 800, aligned in the Y direction. Four fifth recovery-side beam sections 802E are formed in the lower wall of the fifth recovery-side storage channel 912E in the head housing unit 800, aligned in the Y direction. Four sixth supply-side beam sections 801F are formed in the lower wall of the sixth supply-side storage channel 911F in the head housing unit 800, aligned in the Y direction. No sixth recovery-side beam sections are formed on the wall of the sixth recovery-side storage channel 912F in the head housing unit 800.

[0073] This improves the moldability of the first to sixth supply-side storage channels 911A to 911F and the first to sixth recovery-side storage channels 912A to 912F. As a result, the openings on the lower side (+Z direction side) of the first to sixth supply-side storage channels 911A to 911F and the first to sixth recovery-side storage channels 912A to 912F can be formed with high precision.

[0074] Furthermore, beam sections are not formed on the wall surfaces of the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F in the head housing unit 800. As a result, in the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F, where beam sections are not provided, the transmission of stress generated by temperature changes from the time of joining between the support member 602 and the head housing unit 800 is interrupted. Therefore, the stress transmitted to the beam sections from the time of joining between the support member 602 and the head housing unit 800 can be reduced. By not providing beam sections in the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F, it is possible to reduce the maximum stress acting on the beam sections to less than half compared to the case where beam sections are provided in all storage channels. In addition, beam sections are not provided in the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F, which are located on the central side of the head housing unit 800. This makes it possible to reduce the stress transmitted to the beam section without affecting the formability and precision of the first to sixth supply-side storage channels 911A to 911F and the first to sixth recovery-side storage channels 912A to 912F.

[0075] As described above, in the portion of the head housing unit 800 on the -X side, the first to third supply-side storage channels 911A to 911C and the first to third recovery-side storage channels 912A to 912C are formed alternately adjacent to each other in the X direction. The first recovery-side beam section 802A and the second recovery-side beam section 802B are positioned offset from the first supply-side beam section 801A, the second supply-side beam section 801B, and the third supply-side beam section 801C in the direction along the discharge port row (Y direction). In addition, in the portion of the head housing unit 800 on the +X side, the fourth to sixth supply-side storage channels 911D to 911F and the fourth to sixth recovery-side storage channels 912D to 912F are formed alternately adjacent to each other in the X direction. The fourth recovery-side beam section 802D and the fifth recovery-side beam section 802E are positioned offset from the fourth supply-side beam section 801D, the fifth supply-side beam section 801E, and the sixth supply-side beam section 801F in the direction along the discharge port row. This allows for the relaxation of stress generated in each beam section after the support member 602 and the head housing unit 800 are joined, thereby suppressing fracture of each beam section. Consequently, a highly reliable liquid discharge head capable of suppressing fracture of each beam section can be provided.

[0076] Furthermore, the four first recovery-side beam sections 802A and second recovery-side beam sections 802B may be offset by the same distance from the four first supply-side beam sections 801A, second supply-side beam section 801B, and third supply-side beam section 801C. The four fourth recovery-side beam sections 802D and fifth recovery-side beam sections 802E may be offset by the same distance from the four fourth supply-side beam sections 801D, fifth supply-side beam section 801E, and sixth supply-side beam section 801F. This improves the moldability of the first to sixth supply-side storage channels 911A to 911F and the first to sixth recovery-side storage channels 912A to 912F, similar to the first embodiment. Therefore, the openings on the lower side (+Z direction side) of the first to sixth supply-side storage channels 911A to 911F and the first to sixth recovery-side storage channels 912A to 912F can be formed with high precision. In this case, it is desirable that the arrangement of the four first supply-side beam sections 801A, the first recovery-side beam section 802A, the second supply-side beam section 801B, the second recovery-side beam section 802B, and the third supply-side beam section 801C along the direction in which each storage channel is aligned (X direction) be staggered. It is also desirable that the arrangement of the four fourth supply-side beam sections 801D, the fourth recovery-side beam section 802D, the fifth supply-side beam section 801E, the fifth recovery-side beam section 802E, and the sixth supply-side beam section 801F along the direction in which each storage channel is aligned (X direction) be staggered.

[0077] As described above, the second embodiment provides a highly reliable liquid discharge head, similar to the first embodiment. Furthermore, in the second embodiment, no beams are formed on the walls of the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F in the head housing unit 800. This reduces the stress transmitted to the beams from the stress generated by temperature changes from the time of joining the support member 602 and the head housing unit 800.

[0078] Furthermore, among the first to third supply-side storage channels and the first and second recovery-side storage channels, the offset amount between the supply-side beam and the recovery-side beam in adjacent supply-side storage channels and recovery-side storage channels is the same for all four supply-side beams and recovery-side beams. Similarly, among the fourth to sixth supply-side storage channels and the fourth and fifth recovery-side storage channels, the offset amount between the supply-side beam and the recovery-side beam in adjacent supply-side storage channels and recovery-side storage channels is the same for all four supply-side beams and recovery-side beams. As a result, similar to the first embodiment, the lower openings of the first to sixth supply-side storage channels and the first to sixth recovery-side storage channels can be formed with high precision.

[0079] Furthermore, the support member 602, which is the second flow channel member, is formed using alumina. This makes it possible to reduce the stress generated in the discharge element substrate 110 supported by the support member 602, as in the first embodiment, and to make the temperature inside the discharge element substrate 110 uniform.

[0080] In the second embodiment described above, beams are not formed on the walls of the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F in the head housing unit 800, but the embodiment is not limited to this. For example, in addition to the walls of the third recovery-side storage channel 912C and the sixth recovery-side storage channel 912F, beams may not be formed on the walls of the second supply-side storage channel 911B and the fifth supply-side storage channel 911E in the head housing unit 800. This further reduces the stress transmitted to the beams from the stress generated by temperature changes from the time of joining of the support member 602 and the head housing unit 800. Thus, beams may not be provided in some of the storage channels (liquid channels) among the multiple storage channels (liquid channels).

[0081] Furthermore, the number of third recovery-side beam sections formed on the wall surface of the third recovery-side storage channel 912C may be less than the number of first supply-side beam sections 801A, first recovery-side beam sections 802A, etc. The number of sixth recovery-side beam sections formed on the wall surface of the sixth recovery-side storage channel 912F may be less than the number of fourth supply-side beam sections 801D, fourth recovery-side beam sections 802D, etc. In this way, the number of beam sections in some of the multiple storage channels (liquid channels) may be less than the number of beam sections in the other storage channels excluding those storage channels. Even in this way, the stress transmitted to the beam sections from the stress generated by temperature changes from the time of joining the support member 602 and the head housing unit 800 can be reduced.

[0082] Furthermore, the first recovery-side beam section 802A and the second recovery-side beam section 802B are positioned offset from the first supply-side beam section 801A, the second supply-side beam section 801B, and the third supply-side beam section 801C in the direction along the discharge port row, but are not limited to this. The fourth recovery-side beam section 802D and the fifth recovery-side beam section 802E are positioned offset from the fourth supply-side beam section 801D, the fifth supply-side beam section 801E, and the sixth supply-side beam section 801F in the direction along the discharge port row, but are not limited to this. For example, the first recovery-side beam section 802A and the second recovery-side beam section 802B may be positioned offset from the first supply-side beam section 801A, the second supply-side beam section 801B, and the third supply-side beam section 801C in the extending direction (Z direction) of the discharge port 115. The fourth recovery-side beam section 802D and the fifth recovery-side beam section 802E may be positioned offset in the direction of extension of the discharge port 115 relative to the fourth supply-side beam section 801D, the fifth supply-side beam section 801E, and the sixth supply-side beam section 801F.

[0083] <<Third Embodiment>> Next, a third embodiment will be described. Some components in the third embodiment have the same configuration as those in the first embodiment described above, and will therefore be described using the same reference numerals as those used for each component in the first embodiment. In the third embodiment, a liquid ejection head without an ink circulation path will be described.

[0084] <Configuration of the liquid dispensing head> Figure 12 is a schematic diagram showing the ink supply path in the third embodiment. As shown in Figure 12, the second liquid ejection head 1060 in the third embodiment comprises an ejection element unit 1100, a pressure adjustment unit 1200, a head housing unit 1300 (see Figure 15, described later), and a cover (not shown).

[0085] The ejection element unit 1100 comprises an ejection element substrate 1110, a support member 1102 (see Figure 14, described later), an electrical wiring tape (not shown), and an electrical contact substrate (not shown). The electrical wiring tape and electrical contact substrate of the third embodiment are configured similarly to the electrical wiring tape 103 and electrical contact substrate 104 of the first embodiment. Therefore, detailed illustrations and descriptions of the electrical wiring tape and electrical contact substrate are omitted. The electrical contact substrate sends drive signals and electrical energy for ejecting ink to the ejection element substrate 1110 via the electrical wiring tape. Details of the ejection element substrate 1110 and the support member 1102 will be described later.

[0086] The pressure adjustment unit 1200 includes a first to sixth pressure adjustment mechanism corresponding to six types of ink, and a filter 1204. For example, the first pressure adjustment mechanism 1201 is supplied with ink stored in the fourth storage tank 24, and the second pressure adjustment mechanism 1202 is supplied with ink stored in the fifth storage tank 25. The third pressure adjustment mechanism (not shown) is supplied with ink stored in the sixth storage tank 26 (see Figure 1), and the fourth pressure adjustment mechanism (not shown) is supplied with ink stored in the seventh storage tank 27 (see Figure 1). The fifth pressure adjustment mechanism (not shown) is supplied with ink stored in the eighth storage tank 28 (see Figure 1), and the sixth pressure adjustment mechanism (not shown) is supplied with ink stored in the ninth storage tank 29 (see Figure 1). The first to sixth pressure adjustment mechanisms are configured similarly to the first pressure adjustment mechanism 201 of the first embodiment. Furthermore, the ink supply routes from the 6th to 9th storage tanks 26 to 29 are the same as those from the 4th storage tank 24 and the 5th storage tank 25, and therefore detailed illustrations and explanations are omitted.

[0087] The ink stored in the fourth storage tank 24 is supplied under pressure to the second liquid discharge head 1060 via the supply tube 30 by the supply pump P0 of the supply unit 20. After debris is removed from the ink supplied from the fourth storage tank 24 to the second liquid discharge head 1060 by the filter 1204 of the pressure adjustment unit 1200, it reaches the first pressure adjustment mechanism 1201. The ink stored in the fifth storage tank 25 is supplied under pressure to the second liquid discharge head 1060 via the supply tube 30 by the supply pump P0 of the supply unit 20. After debris is removed from the ink supplied from the fifth storage tank 25 to the second liquid discharge head 1060 by the filter 1204 of the pressure adjustment unit 1200, it reaches the second pressure adjustment mechanism 1202.

[0088] The first pressure adjustment mechanism 1201 adjusts the pressure of the ink in the first pressure control chamber 1211 to a predetermined pressure (negative pressure). The first pressure control chamber 1211 is connected to the first supply path 1121 of the ejection element substrate 1110 via the first storage path 1411 and the first connecting path 1421, which constitute the first liquid flow path 1401. The first storage path 1411 is formed in the head housing unit 1300. The first connecting path 1421 is formed in the support member 1102. The first liquid flow path 1401 communicates with the first pressure control chamber 1211 of the pressure adjustment unit 1200 and the pressure chamber 1113 (discharge port row) of the ejection element substrate 1110. The ink in the first pressure control chamber 1211, whose pressure has been adjusted by the first pressure adjustment mechanism 1201, is supplied to the pressure chamber 1113 of the ejection element substrate 1110 via the first storage channel 1411, the first connecting channel 1421, and the first supply channel 1121.

[0089] The second pressure adjustment mechanism 1202 adjusts the pressure of the ink in the second pressure control chamber 1221 to the same pressure (negative pressure) as the first pressure control chamber 1211. The second pressure control chamber 1221 is connected to the second supply passage 1122 of the ejection element substrate 1110 via the second storage passage 1412 and the second connecting passage 1422, which constitute the second liquid flow path 1402. The second storage passage 1412 is formed in the head housing unit 1300. The second connecting passage 1422 is formed in the support member 1102. The second liquid flow path 1402 communicates with the second pressure control chamber 1221 of the pressure adjustment unit 1200 and the pressure chamber 1113 (discharge port row) of the ejection element substrate 1110. The ink in the second pressure control chamber 1221, whose pressure has been adjusted by the second pressure adjustment mechanism 1202, is supplied to the pressure chamber 1113 of the ejection element substrate 1110 via the second storage channel 1412, the second connection channel 1422, and the second supply channel 1122. When the second liquid ejection head 1060 ejects six types of ink, six liquid channels corresponding to the six types of ink are arranged adjacent to each other in the X direction.

[0090] <Configuration of the ejection element substrate> Next, the ejection element substrate 1110 of the third embodiment will be described. Figure 13 is a perspective view showing a cross-section of the ejection element substrate 1110 of the third embodiment. As shown in Figure 13, the ejection element substrate 1110 of the third embodiment comprises a silicon substrate 1150, an ejection port forming member 1152, and an ejection element 1154. The ejection element substrate 1110 ejects ink vertically downward (+Z direction) from a row of ejection ports extending along the aforementioned sub-scanning direction (Y direction). The silicon substrate 1150 is formed in the shape of a thin plate using silicon (Si) or the like. The ejection port forming member 1152 is laminated on one side of the silicon substrate 1150.

[0091] The nozzle forming member 1152 is formed in a thin plate shape that matches the outer periphery of the silicon substrate 1150 using a photosensitive resin. For example, a nozzle forming member 1152 is formed by patterning nozzles 1115 and pressure chambers 1113 using photolithography. Multiple nozzle rows are formed on the nozzle forming member 1152, with multiple nozzles 1115 arranged in the Y direction. Multiple nozzle rows are arranged in the X direction on the nozzle forming member 1152. For example, the nozzle forming member 1152 may have 6 rows of nozzles corresponding to 6 types of ink, or 12 rows of nozzles corresponding to 2 rows each of 6 types of ink. The nozzle forming member 1152 may also have 5 or fewer rows of nozzles, or 7 or more rows of nozzles. Multiple pressure chambers 1113 communicating with multiple nozzle rows (noises 1115) are formed on the other side of the nozzle forming member 1152.

[0092] Furthermore, multiple ejection elements 1154 are provided on one side of the silicon substrate 1150, which generate ejection energy to eject ink from multiple ejection ports 1115. The ejection elements 1154 are arranged on one side of the silicon substrate 1150, facing the pressure chamber 1113 (discharge port 1115). The ejection elements 1154 eject ink by foaming the ink in the pressure chamber 1113 using an electrothermal conversion element. Note that the ejection elements 1154 are not limited to electrothermal conversion elements, but may also be composed of piezoelectric elements.

[0093] On the back side of the ejection element 1154 in the silicon substrate 1150, supply passages such as the first supply passage 1121 and the second supply passage 1122, which communicate with the pressure chamber 1113, are formed. Each of these supply passages, such as the first supply passage 1121 and the second supply passage 1122, is formed in the shape of a groove extending in the direction along the row of ejection ports (Y direction).

[0094] <Configuration of head housing unit and support members> Next, the head housing unit 1300 and support member 1102 of the third embodiment will be described. Figure 14 is a partial cross-sectional view of the second liquid discharge head 1060 in the third embodiment. The head housing unit 1300 of the third embodiment is configured similarly to the head housing unit 300 of the first embodiment, except that it is capable of housing the pressure adjustment unit 1200. The cover (not shown) of the third embodiment is formed similarly to the cover 350 of the first embodiment. The pressure adjustment unit 1200 is housed inside the head housing unit 1300 to which the cover is attached.

[0095] As shown in Figure 14, six types of ink-corresponding liquid channels 1411 to 1416 are formed adjacent to each other in the X direction at the bottom of the head housing unit 1300. The head housing unit 1300 forms the upstream side of the first to sixth liquid channels 1401 to 1406. The first liquid channel 1411 is connected to the first pressure control chamber 1211 of the pressure adjustment unit 1200. The second liquid channel 1412 is formed adjacent to the first liquid channel 1411 on the +X direction side and is connected to the second pressure control chamber 1221 of the pressure adjustment unit 1200. The third liquid channel 1413 is formed adjacent to the second liquid channel 1412 on the +X direction side and is connected to the third pressure control chamber (not shown) of the pressure adjustment unit 1200. The fourth storage channel 1414 is formed adjacent to the third storage channel 1413 on the +X side and is connected to the fourth pressure control chamber (not shown) of the pressure adjustment unit 1200. The sixth storage channel 1416 is formed adjacent to the first storage channel 1411 on the -X side and is connected to the sixth pressure control chamber (not shown) of the pressure adjustment unit 1200. The fifth storage channel 1415 is formed adjacent to the sixth storage channel 1416 on the -X side and is connected to the fifth pressure control chamber (not shown) of the pressure adjustment unit 1200.

[0096] The support member 1102 supports the ejection element substrate 1110 and is adhesively fixed to the lower part of the head housing unit 1300. The support member 1102 supports the ejection element substrate 1110 while being joined to it. The support member 1102 is formed in a plate shape using a resin material to which a highly heat-resistant filler has been added. The filler added to the resin material may include at least one of needle-shaped particles and plate-shaped particles. When the ejection element substrate 1110 is heated to adjust the temperature according to the characteristics of the ink, the fact that the material of the support member 1102 is a resin with low thermal conductivity makes it possible to shorten the start-up time for temperature adjustment and improve energy efficiency. In addition, the coefficient of linear expansion of the resin material of the support member 1102 is smaller than the coefficient of linear expansion of the resin material of the head housing unit 1300. As a result, the difference between the coefficient of thermal expansion of the resin material of the support member 1102 and the coefficient of thermal expansion of the material of the discharge element substrate 1110 is reduced, thereby reducing the stress generated in the discharge element substrate 1110 supported by the support member 1102.

[0097] The support member 1102 has first to sixth connection channels 1421 to 1426 corresponding to six types of ink, arranged adjacently in the X direction. The support member 1102 forms the downstream side of the first to sixth liquid channels 1401 to 1406. The upstream side of the first connection channel 1421 is connected to the first storage channel 1411 formed in the head housing unit 1300, and the downstream side of the first connection channel 1421 is connected to the first supply channel 1121 formed in the ejection element substrate 1110. The second connection channel 1422 is formed adjacent to the first connection channel 1421 on the +X direction side. The upstream side of the second connection channel 1422 is connected to the second storage channel 1412 formed in the head housing unit 1300, and the downstream side of the second connection channel 1422 is connected to the second supply channel 1122 formed in the ejection element substrate 1110.

[0098] The third connecting channel 1423 is formed adjacent to the second connecting channel 1422 on the +X side. The upstream side of the third connecting channel 1423 is connected to the third storage channel 1413 formed in the head housing unit 1300, and the downstream side of the third connecting channel 1423 is connected to the third supply channel 1123 formed in the ejection element substrate 1110. The fourth connecting channel 1424 is formed adjacent to the third connecting channel 1423 on the +X side. The upstream side of the fourth connecting channel 1424 is connected to the fourth storage channel 1414 formed in the head housing unit 1300, and the downstream side of the fourth connecting channel 1424 is connected to the fourth supply channel 1124 formed in the ejection element substrate 1110. The sixth connecting channel 1426 is formed adjacent to the first connecting channel 1421 on the -X side. The upstream side of the sixth connection channel 1426 is connected to the sixth storage channel 1416 formed in the head housing unit 1300, and the downstream side of the sixth connection channel 1426 is connected to the sixth supply channel 1126 formed in the discharge element substrate 1110. The fifth connection channel 1425 is formed adjacent to the sixth connection channel 1426 on the -X direction side. The upstream side of the fifth connection channel 1425 is connected to the fifth storage channel 1415 formed in the head housing unit 1300, and the downstream side of the fifth connection channel 1425 is connected to the fifth supply channel 1125 formed in the discharge element substrate 1110.

[0099] Figure 15 is a side cross-sectional view of the second liquid discharge head 1060 in the third embodiment. Figure 15(a) is a cross-sectional view of Figure 14 from XVa to XVa. Figure 15(b) is a cross-sectional view of Figure 14 from XVb to XVb.

[0100] The cross-sectional view in Figure 15(a) shows the first storage channel 1411 of the head housing unit 1300 and the first connecting channel 1421 of the support member 1102. The first storage channel 1411 has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. The first storage channel 1411 is capable of storing bubbles. Four first upstream beam sections 1301 are formed on the lower (+Z direction) wall surface of the first storage channel 1411 in the head housing unit 1300, aligned in the Y direction. The first upstream beam sections 1301 are formed in a beam shape that extends along the Z direction. The four first upstream beam sections 1301 divide the lower side of the first storage channel 1411 into five parallel channels.

[0101] The first connecting channel 1421 has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed in a channel shape that extends in the Z direction. Five first downstream beam sections 1161 are formed on the wall surface of the first connecting channel 1421 in the support member 1102, aligned in the Y direction. The first downstream beam sections 1161 are formed in a beam shape that extends along the Z direction. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection between the first downstream beam sections 1161 and the wall surface of the first connecting channel 1421. The five first downstream beam sections 1161 divide the first connecting channel 1421, which is connected to the downstream side of the first storage channel 1411, into six parallel channels.

[0102] The cross-sectional view in Figure 15(b) shows the second storage channel 1412 of the head housing unit 1300 and the second connecting channel 1422 of the support member 1102. The second storage channel 1412 has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. The second storage channel 1412 is capable of storing bubbles. Four second upstream beam sections 1302 are formed on the lower (+Z direction) wall surface of the second storage channel 1412 in the head housing unit 1300, aligned in the Y direction. The second upstream beam sections 1302 are formed in a beam shape that extends along the Z direction. The four second upstream beam sections 1302 divide the lower side of the second storage channel 1412 into five parallel channels.

[0103] The second connecting channel 1422 has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed in a channel shape that extends in the Z direction. Five second downstream beam sections 1162 are formed on the wall surface of the second connecting channel 1422 in the support member 1102, aligned in the Y direction. The second downstream beam sections 1162 are formed in a beam shape that extends along the Z direction. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection between the second downstream beam sections 1162 and the wall surface of the second connecting channel 1422. The five second downstream beam sections 1162 divide the second connecting channel 1422, which is connected to the downstream side of the second storage channel 1412, into six parallel channels.

[0104] Furthermore, the third storage channel 1413 (see Figure 14), which constitutes the third liquid channel 1403, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. Four third upstream beam sections 1303 (see Figure 16(b) described later), similar to the first upstream beam section 1301, are formed on the lower (+Z direction) wall surface of the third storage channel 1413 in the head housing unit 1300. The third connecting channel 1423 (see Figure 14), which constitutes the third liquid channel 1403, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that extends in the Z direction. Five third downstream beam sections 1163 (see Figure 16(a) described later), similar to the first downstream beam section 1161, are formed on the wall surface of the third connecting channel 1423 in the support member 1102. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection point between the third downstream beam section 1163 and the wall surface of the third connecting channel 1423.

[0105] The fourth storage channel 1414 (see Figure 14), which constitutes the fourth liquid channel 1404, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. Four fourth upstream beam sections 1304 (see Figure 16(b) described later), similar to the second upstream beam section 1302, are formed on the lower (+Z direction) wall surface of the fourth storage channel 1414 in the head housing unit 1300. The fourth connecting channel 1424 (see Figure 14), which constitutes the fourth liquid channel 1404, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that extends in the Z direction. Five fourth downstream beam sections 1164 (see Figure 16(a) described later), similar to the second downstream beam section 1162, are formed on the wall surface of the fourth connecting channel 1424 in the support member 1102. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection point between the fourth downstream beam section 1164 and the wall surface of the fourth connecting channel 1424.

[0106] The fifth storage channel 1415 (see Figure 14), which constitutes the fifth liquid channel 1405, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. Four fifth upstream beam sections 1305 (see Figure 16(b) described later), similar to the first upstream beam section 1301, are formed on the lower (+Z direction) wall surface of the fifth storage channel 1415 in the head housing unit 1300. The fifth connecting channel 1425 (see Figure 14), which constitutes the fifth liquid channel 1405, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that extends in the Z direction. Five fifth downstream beam sections 1165 (see Figure 16(a) described later), similar to the first downstream beam section 1161, are formed on the wall surface of the fifth connecting channel 1425 in the support member 1102. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection point between the fifth downstream beam section 1165 and the wall surface of the fifth connecting channel 1425.

[0107] The sixth storage channel 1416 (see Figure 14), which constitutes the sixth liquid channel 1406, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that is long in the Z direction. Four sixth upstream beam sections 1306 (see Figure 16(b) described later), similar to the second upstream beam section 1302, are formed on the lower (+Z direction) wall surface of the sixth storage channel 1416 in the head housing unit 1300. The sixth connecting channel 1426 (see Figure 14), which constitutes the sixth liquid channel 1406, has an elongated cross-section that is narrow in the X direction and wide in the Y direction, and is formed into a channel shape that extends in the Z direction. Five sixth downstream beam sections 1166 (see Figure 16(a) described later), similar to the second downstream beam section 1162, are formed on the wall surface of the sixth connecting channel 1426 in the support member 1102. A rounded downstream corner section 1171 (see Figure 16(a) described later) is formed at the connection point between the sixth downstream beam section 1166 and the wall surface of the sixth connecting channel 1426.

[0108] Furthermore, as shown in Figure 15(a), the five first downstream beam sections 1161 are arranged to sandwich the extension line L1 that extends from the four first upstream beam sections 1301 to the first connecting channel 1421 downstream of the first liquid channel 1401. This reduces the difference in flow velocity of the ink flowing through the five channels below the first storage channel 1411, which are separated by the four first upstream beam sections 1301. As a result, minute air bubbles contained in the ink flowing through the first storage channel 1411 are dispersed in the five channels below the first storage channel 1411 and do not concentrate in any particular location. As shown in Figure 15(b), the five second downstream beam sections 1162 are arranged to sandwich the extension line L2 that extends from the four second upstream beam sections 1302 to the second connecting channel 1422 downstream of the second liquid channel 1402. As a result, the difference in ink flow velocity between the five channels below the second storage channel 1412, which are separated by the four second upstream beam sections 1302, becomes smaller. Therefore, the minute air bubbles contained in the ink flowing through the second storage channel 1412 are dispersed across the five channels below the second storage channel 1412 and do not concentrate in any particular location.

[0109] Furthermore, similar to the first downstream beam section 1161 and the second downstream beam section 1162, the third to sixth downstream beam sections 1163 to 1166 are arranged to straddle the extension line that extends from the third to sixth upstream beam sections 1303 to 1306 to the third to sixth connecting channels 1423 to 1426. This reduces the difference in ink flow velocity between the channels below the third to sixth storage channels 1413 to 1416, which are separated by the third to sixth upstream beam sections 1303 to 1306. As a result, tiny air bubbles contained in the ink flowing through the third to sixth storage channels 1413 to 1416 are dispersed throughout the channels below the third to sixth storage channels 1413 to 1416, and do not concentrate in any particular location. In this way, the dispersion of tiny air bubbles contained in the ink flowing through the first to sixth storage channels 1411 to 1416 helps to suppress a decrease in print quality. Therefore, it becomes possible to provide a liquid dispensing head that is highly robust against air bubbles generated inside the liquid dispensing head.

[0110] Figure 16 is a plan cross-sectional view of the second liquid discharge head 1060 in the third embodiment. Figure 16(a) is a cross-sectional view taken between XVIa and XVIa in Figure 15. Figure 16(b) is a cross-sectional view taken between XVIb and XVIb in Figure 15. As shown in Figure 16(b), six types of ink-corresponding first to sixth storage channels 1411 to 1416 are formed adjacent to each other in the X direction at the lower part of the head housing unit 1300. The first to sixth upstream beam sections 1301 to 1306 in the first to sixth storage channels 1411 to 1416 are arranged in the same position in the Y direction. This reduces the resistance force acting on the resin flowing through the mold during injection molding, thereby enabling stable injection molding of the head housing unit 1300.

[0111] Furthermore, the support member 1102 and the head housing unit 1300 are joined by an adhesive (not shown). For example, a thermosetting epoxy resin adhesive is used as the adhesive. When a thermosetting epoxy resin adhesive is used, a heating process using a curing furnace or the like is performed, so stress is generated in the support member 1102 and the head housing unit 1300 due to the difference in thermal shrinkage after joining. The coefficient of linear expansion of the resin material of the support member 1102 is 25 ppm / °C. The coefficient of linear expansion of the resin material of the head housing unit 1300 is 39 ppm / °C. The difference (absolute value) between the coefficient of linear expansion of the resin material of the support member 1102 and the coefficient of linear expansion of the resin material of the head housing unit 1300 is 14 ppm / °C. Thus, the difference (absolute value) between the coefficient of linear expansion of the resin material of the support member 1102 and the coefficient of linear expansion of the resin material of the head housing unit 1300 is 6 ppm / °C or more. As a result, the support member 1102 shrinks more than the head housing unit 1300, and the stress generated by temperature changes from the time of joining concentrates on the support member 1102, which has lower strength than the head housing unit 1300. Furthermore, even if the material of the support member 1102 and the material of the head housing unit 1300 are the same, the stress generated by anisotropy of the coefficient of linear expansion due to the shape, differences in shrinkage due to the shape, etc., will concentrate on the support member 1102, which has lower strength than the head housing unit 1300.

[0112] As shown in Figure 16(b), the support member 1102 has first to sixth connecting channels 1421 to 1426 corresponding to six types of ink, arranged adjacently in the X direction. The second downstream beam section 1162, the fourth downstream beam section 1164, and the sixth downstream beam section 1166 are offset in the direction along the discharge port row (Y direction) relative to the first downstream beam section 1161, the third downstream beam section 1163, and the fifth downstream beam section 1165. In other words, among the first to sixth connecting channels 1421 to 1426, the downstream beam sections of adjacent connecting channels are offset in the direction along the discharge port row. This makes it possible to alleviate the stress generated in the first to sixth downstream beam sections 1161 to 1166 after the support member 1102 is joined to the head housing unit 1300, thereby suppressing fracture of the first to sixth downstream beam sections 1161 to 1166. Therefore, a highly reliable liquid discharge head can be provided that can suppress the fracture of the first to sixth downstream beam sections 1161 to 1166.

[0113] In the third embodiment, the support member 1102 supports the ejection element substrate 1110 while being bonded to the silicon substrate 1150 of the ejection element substrate 1110 with an adhesive. The shape of the silicon substrate 1150 differs from that of the support member 1102, and the coefficient of linear expansion of the silicon substrate 1150 differs from that of the support member 1102. As a result, stress generated by temperature changes from the time of bonding between the support member 1102 and the silicon substrate 1150 is concentrated in the support member 1102, which has lower strength than the silicon substrate 1150. As described above, the second downstream beam section 1162, the fourth downstream beam section 1164, and the sixth downstream beam section 1166 are arranged offset from the first downstream beam section 1161, the third downstream beam section 1163, and the fifth downstream beam section 1165 in the direction along the ejection port row. This makes it possible to alleviate the stress generated in the first to sixth downstream beam sections 1161 to 1166 after the support member 1102 and the silicon substrate 1150 are joined, thereby suppressing the occurrence of cracks in the first to sixth downstream beam sections 1161 to 1166. It is desirable that the first to sixth downstream beam sections 1161 to 1166 be applied to a liquid discharge head having a discharge port row length of 0.5 inches or more, similar to the first embodiment. Furthermore, the discharge port row length may be 12 inches or less, 8 inches or less, or 2 inches or less.

[0114] Furthermore, the five second downstream beam sections 1162, the fourth downstream beam section 1164, and the sixth downstream beam section 1166 may be offset by the same distance from the five first downstream beam sections 1161, the third downstream beam section 1163, and the fifth downstream beam section 1165. In other words, the amount of offset of the downstream beam sections in adjacent connecting channels among the first to sixth connecting channels 1421 to 1426 may be the same for the five downstream beam sections provided in adjacent connecting channels. This makes it less likely for bias to occur in each of the first to sixth connecting channels 1421 to 1426, which are separated by the first to sixth downstream beam sections 1161 to 1166. Consequently, the moldability of the first to sixth connecting channels 1421 to 1426 is improved, and the openings of the first to sixth connecting channels 1421 to 1426 can be formed with high precision. In this case, it is desirable that the arrangement of the first to sixth downstream beam sections 1161 to 1166 along the direction in which the first to sixth connecting channels 1421 to 1426 are aligned (X direction) be staggered. Alternatively, the arrangement of the first to sixth downstream beam sections 1161 to 1166 along the direction in which the first to sixth connecting channels 1421 to 1426 are aligned may be continuously offset in the same direction (for example, the +Y direction).

[0115] In the third embodiment, a rounded downstream corner portion 1171 is formed at the connection point between the first to sixth downstream beam portions 1161 to 1166 and the wall surface of the first to sixth connecting channels 1421 to 1426. This allows for the relaxation of stress generated in the first to sixth downstream beam portions 1161 to 1166, thereby suppressing fracture of the first to sixth downstream beam portions 1161 to 1166. The radius of curvature of the downstream corner portion 1171 is preferably 0.2 mm or more. The larger the radius of curvature of the downstream corner portion 1171, the more the stress generated in the first to sixth downstream beam portions 1161 to 1166 can be relaxed. For example, in the third embodiment, the radius of curvature of the downstream corner portion 1171 is 0.4 mm. Alternatively, the radius of curvature of the downstream corner portion 1171 may be 8.0 mm or less.

[0116] As described above, the third embodiment provides a highly reliable liquid discharge head. Specifically, in this embodiment, the support member 1102, which is the first flow path member, has first to sixth downstream beam sections 1161 to 1166 formed on it, which divide the first to sixth connecting flow paths 1421 to 1426 into a plurality of parallel flow paths. Among the first to sixth connecting flow paths 1421 to 1426, the downstream beam sections of adjacent connecting flow paths are arranged offset in the direction along the discharge port row. This makes it possible to alleviate the stress generated in the first to sixth downstream beam sections 1161 to 1166 after the support member 1102 and the head housing unit 1300 are joined, thereby suppressing the fracture of the first to sixth downstream beam sections 1161 to 1166. In this way, a highly reliable liquid discharge head can be provided.

[0117] Furthermore, among the first to sixth connecting channels 1421 to 1426, the offset amount of the downstream beam section in adjacent connecting channels is the same for the five downstream beam sections provided in adjacent connecting channels. This makes it less likely for bias to occur in each of the first to sixth connecting channels 1421 to 1426, which are separated by the first to sixth downstream beam sections 1161 to 1166. Consequently, the moldability of the first to sixth connecting channels 1421 to 1426 is improved, and the openings of the first to sixth connecting channels 1421 to 1426 can be formed with high precision.

[0118] Furthermore, the coefficient of linear expansion of the resin material of the first flow channel member, the support member 1102, is smaller than the coefficient of linear expansion of the resin material of the second flow channel member, the head housing unit 1300. As a result, the difference between the coefficient of linear expansion of the resin material of the support member 1102 and the coefficient of linear expansion of the material of the discharge element substrate 1110 is reduced, thereby reducing the stress generated in the discharge element substrate 1110 supported by the support member 1102.

[0119] Furthermore, rounded downstream corner sections 1171 are formed at the connection points between the first to sixth downstream beam sections 1161 to 1166 and the walls of the first to sixth connecting channels 1421 to 1426. This allows for the relaxation of stress generated in the first to sixth downstream beam sections 1161 to 1166, thereby suppressing fracture of the first to sixth downstream beam sections 1161 to 1166.

[0120] In the third embodiment described above, a second liquid discharge head 1060 was described, but the invention is not limited thereto. The liquid discharge head in the third embodiment may be used as a first liquid discharge head capable of discharging three types of ink. In this case, the pressure adjustment unit 1200 may be equipped with first to third pressure adjustment mechanisms corresponding to the three types of ink. Three rows of discharge ports corresponding to the three types of ink may be arranged on the discharge port forming member 1152 of the discharge element substrate 1110. First to third supply passages 1121 to 1123 may be formed on the silicon substrate 1150 of the discharge element substrate 1110. First to third storage passages 1411 to 1413 constituting the first to third liquid passages 1401 to 1403 may be formed on the head housing unit 1300. First to third upstream beams 1301 to 1303 may be formed on the lower wall surface of the first to third storage passages 1411 to 1413 in the head housing unit 1300. The support member 1102 may have first to third connecting channels 1421 to 1423 that constitute the first to third liquid channels 1401 to 1403. The support member 1102 may have first to third downstream beam sections 1161 to 1163 formed on the wall surface of the first to third connecting channels 1421 to 1423.

[0121] <<Fourth Embodiment>> Next, a fourth embodiment will be described. Some components in the fourth embodiment have the same configuration as those in the third embodiment described above, and will therefore be described using the same reference numerals as those used for each component in the third embodiment. In the fourth embodiment, a liquid ejection head without an ink circulation path will be described.

[0122] <Configuration of the liquid dispensing head> Figure 17 is a plan cross-sectional view of the second liquid discharge head 2060 in the fourth embodiment. Figure 17(a) is a plan cross-sectional view showing the support member 2102 in the second liquid discharge head 2060. Figure 17(b) is a plan cross-sectional view showing the head housing unit 2300 in the second liquid discharge head 2060. The second liquid discharge head 2060 in the fourth embodiment is formed similarly to the second liquid discharge head 1060 in the third embodiment, except for the support member 2102 and a part of the head housing unit 2300.

[0123] As shown in Figure 17(a), the support member 2102 of the fourth embodiment is constructed similarly to the support member 1102 of the third embodiment, except that it is formed using alumina. Alumina has high thermal conductivity and a low coefficient of linear expansion. This reduces the stress generated in the ejection element substrate 1110 supported by the support member 2102, and makes the temperature inside the ejection element substrate 1110 uniform. In addition, the difference between the coefficient of linear expansion of the material of the support member 2102 and the coefficient of linear expansion of the material of the silicon substrate 1150 becomes small, so the stress generated by temperature changes from the time of joining of the support member 2102 and the silicon substrate 1150 can be reduced. Similar to the third embodiment, the support member 2102 has first to sixth connecting channels 1421 to 1426 and first to sixth downstream beam sections 1161 to 1166. A rounded downstream corner section 1171 is formed at the connection point between the first to sixth downstream beam sections 1161 to 1166 and the wall surfaces of the first to sixth connecting channels 1421 to 1426.

[0124] As shown in Figure 17(b), the head housing unit 2300 of the fourth embodiment is configured similarly to the head housing unit 1300 of the third embodiment, except for the arrangement of the first to sixth upstream beam sections 2301 to 2306. The head housing unit 2300 has first to sixth storage channels 1411 to 1416, similar to the third embodiment. The first to sixth upstream beam sections 2301 to 2306 are formed on the lower (+Z direction) wall surface of the first to sixth storage channels 1411 to 1416 in the head housing unit 2300, in a different arrangement than the first to sixth upstream beam sections 1301 to 1306 of the third embodiment. As mentioned above, the support member 2102 is made of alumina. Therefore, stress generated by temperature changes from the time of joining the support member 2102 and the head housing unit 2300 is concentrated in the head housing unit 2300, which has lower strength than the support member 2102.

[0125] In contrast, the second upstream beam section 2302, the fourth upstream beam section 2304, and the sixth upstream beam section 2306 are positioned offset from the first upstream beam section 2301, the third upstream beam section 2303, and the fifth upstream beam section 2305 in the direction along the discharge port row (Y direction). In other words, among the first to sixth storage channels 1411 to 1416, the upstream beam sections in adjacent storage channels are positioned offset in the direction along the discharge port row. This allows for the easing of stress generated in the first to sixth upstream beam sections 2301 to 2306 after the support member 2102 and the head housing unit 2300 are joined, thereby suppressing fracture of the first to sixth upstream beam sections 2301 to 2306. Therefore, a highly reliable liquid discharge head is provided that can suppress fracture of the first to sixth upstream beam sections 2301 to 2306.

[0126] Furthermore, the four second upstream beam sections 2302, the fourth upstream beam section 2304, and the sixth upstream beam section 2306 may be offset by the same distance from the four first upstream beam sections 2301, the third upstream beam section 2303, and the fifth upstream beam section 2305. In other words, the amount of offset of the upstream beam sections in adjacent storage channels among the first to sixth storage channels 1411 to 1416 may be the same for the four upstream beam sections provided in adjacent storage channels. This makes it less likely for bias to occur in each of the first to sixth storage channels 1411 to 1416, which are separated by the first to sixth upstream beam sections 2301 to 2306. Therefore, the moldability of the first to sixth storage channels 1411 to 1416 is improved, and the openings on the lower side (+Z direction side) of the first to sixth storage channels 1411 to 1416 can be formed with high precision. In this case, it is desirable that the arrangement of the first to sixth upstream beam sections 2301 to 2306 along the direction in which the first to sixth storage channels 1411 to 1416 are aligned (X direction) be staggered. The arrangement of the first to sixth upstream beam sections 2301 to 2306 along the direction in which the first to sixth storage channels 1411 to 1416 are aligned may also be an arrangement that is continuously offset in the same direction (for example, the +Y direction).

[0127] Furthermore, rounded upstream corner sections 2311 (see Figure 18(b)) are formed at the connection points between the first to sixth upstream beam sections 2301 to 2306 and the walls of the first to sixth storage channels 1411 to 1416. This allows for the relaxation of stress generated in the first to sixth upstream beam sections 2301 to 2306, thereby suppressing fracture of the first to sixth upstream beam sections 2301 to 2306. The radius of curvature R of the upstream corner section 2311 is preferably 0.2 mm or more. Alternatively, the radius of curvature R of the upstream corner section 2311 may be 8.0 mm or less.

[0128] Furthermore, similar to the third embodiment, the first to sixth downstream beam sections 1161 to 1166 may be arranged so as to straddle the extension lines that extend from the first to sixth upstream beam sections 2301 to 2306 to the first to sixth connecting channels 1421 to 1426. This reduces the difference in ink flow velocity between the channels below the first to sixth storage channels 1411 to 1416, which are separated by the first to sixth upstream beam sections 1301 to 1306. As a result, minute air bubbles contained in the ink flowing through the first to sixth storage channels 1411 to 1416 are dispersed in each of the channels below the first to sixth storage channels 1411 to 1416 and do not concentrate in a particular location. In this way, the dispersion of minute air bubbles contained in the ink flowing through the first to sixth storage channels 1411 to 1416 can suppress a decrease in print quality. Therefore, it becomes possible to provide a liquid dispensing head that is highly robust against air bubbles generated inside the liquid dispensing head.

[0129] <Chemical crack> Next, chemical cracks occurring in the liquid discharge head will be described. The liquid discharge head in the fourth embodiment (second liquid discharge head 2060) is used in a variety of applications. The liquid discharged from the liquid discharge head in the fourth embodiment contains various chemical substances, such as various organic solvents, inorganic acids, inorganic alkalis, ionic liquids, metal ions, surfactants, oils, and water-soluble resins. It is known that when a chemical substance comes into contact with a stressed area in a resin molded product, cracks occur in the resin molded product due to a phenomenon called chemical cracking. Chemical cracking is a phenomenon in which a chemical substance penetrates into the stressed area of ​​a resin molded product and cracks occur due to interaction with the stress. Chemical cracking is also called solvent cracking. Since the liquid discharge head in the fourth embodiment is required to handle many types of chemical substances, it is necessary to reduce the occurrence of chemical cracking. In the fourth embodiment, the head housing unit 2300 is formed by injection molding using a resin material to which fillers have been added. The filler added to the resin material contains at least one of needle-shaped particles and plate-shaped particles. Therefore, the orientation of the filler is determined by the shape and arrangement of the walls of the first to sixth storage channels 1411 to 1416 and the first to sixth upstream beam sections 2301 to 2306. In this embodiment, the orientation of the filler indicates the orientation of the needle-shaped or plate-shaped particles constituting the filler in the resin molded product (head housing unit).

[0130] Figure 18 is a schematic diagram showing the orientation of the filler near the upstream beam of the head housing unit. Figure 18(a) is a schematic diagram showing the orientation of the filler 1341 near the upstream beam of the head housing unit 1300 in the third embodiment. Figure 18(b) is a schematic diagram showing the orientation of the filler 2341 near the upstream beam of the head housing unit 2300 in the fourth embodiment. When the head housing unit is injection molded, the resin material, which is a thermoplastic resin, is filled into the mold from the gate. The resin material filled into the mold flows away from the gate along the shape of the head housing unit. If the orientation of the filler, which contains needle-shaped or plate-shaped particles, is aligned with the direction in which the resin material flows, the effect of the filler becomes difficult to obtain, so the strength in the direction along the orientation of the filler in the head housing unit is lower than the strength in the direction perpendicular to the orientation of the filler. In addition, fillers containing plate-shaped particles have the effect of inhibiting the permeation of gases, water vapor, etc. in the direction perpendicular to the orientation of the filler.

[0131] As shown in Figure 18(a), when the head housing unit 1300 of the third embodiment is injection molded, the resin material filled into the mold flows in a direction away from the gate 1340 along the shape of the head housing unit 1300. When the first to sixth upstream beam sections 1301 to 1306 are arranged in the same position in the Y direction, the orientation of the filler 1341 at the connection between each upstream beam section and the wall surface of the storage channel may be substantially the same as the direction of cracks that may occur at the connection. For this reason, cracks are more likely to occur at the connection between each upstream beam section and the wall surface of the storage channel due to a phenomenon called chemical cracking. The direction of cracks that may occur at the connection between each upstream beam section and the wall surface of the storage channel is the direction of the dashed arrow shown in Figure 18(a). Figure 18(a) shows crack-prone areas 1311 where cracks are likely to occur at the connection between the fifth upstream beam section 1305 and the wall surface of the fifth storage channel 1415, and at the connection between the sixth upstream beam section 1306 and the wall surface of the sixth storage channel 1416.

[0132] As shown in Figure 18(b), when injection molding the head housing unit 2300 of the fourth embodiment, the resin material filled into the mold flows in a direction away from the gate 2340 along the shape of the head housing unit 2300. The second upstream beam section 2302, the fourth upstream beam section 2304, and the sixth upstream beam section 2306 are offset from the first upstream beam section 2301, the third upstream beam section 2303, and the fifth upstream beam section 2305 in the direction along the discharge port row (Y direction). For example, in the sixth storage channel 1416 adjacent to the fifth storage channel 1415 (and the first storage channel 1411), the sixth upstream beam section 2306 is not positioned in the same position in the Y direction as the fifth upstream beam section 2305 (and the first upstream beam section 2301). Furthermore, rounded upstream corner sections 2311 are formed at the connection points between the first to sixth upstream beam sections 2301 to 2306 and the walls of the first to sixth storage channels 1411 to 1416. Figure 18(b) shows the upstream corner sections 2311 formed at the connection points between the fifth upstream beam section 2305 and the wall of the fifth storage channel 1415, and between the sixth upstream beam section 2306 and the wall of the sixth storage channel 1416. As a result, the orientation of the filler 2341 at the connection points between each upstream beam section and the wall of the storage channel is perpendicular to the direction of cracks that may occur at the connection points (the direction of the dashed arrows shown in Figure 18(b)). Therefore, the strength of each upstream beam section against cracks is improved, and the amount of chemical substances that penetrate into the interior of each upstream beam section is reduced, thereby reducing the occurrence of chemical cracks.

[0133] As shown in Figure 18(b), let W0 be the width of the short side of the first to sixth storage channels 1411 to 1416 that constitute the first to sixth liquid channels 1401 to 1406 (the width of the channel in the X direction). Let W1 be the thickness of the wall between adjacent storage channels 1411 to 1416. Let W2 be the thickness of the upstream beam sections 2301 to 2306 of the first to sixth storage channels 1411 to 1416 (the thickness in the Y direction). Let P be the distance between the centers of adjacent storage channels 1411 to 1416. Let S be the offset amount of the upstream beam section in adjacent storage channels 1411 to 1416.

[0134] The thicker the wall thickness W1 between adjacent storage channels, the greater the resistance of each upstream beam against cracks. The smaller the pitch between rows of discharge ports, the thinner the wall thickness W1 between adjacent storage channels becomes, making chemical cracks more likely to occur.

[0135] When the length of the discharge port row exceeds 1 inch, it is desirable that the wall thickness W1 between adjacent storage channels be greater than 1.7 mm in order to ensure the strength of the head housing unit 2300. Also, in order to ensure the strength of the mold, it is desirable that the channel width W0 on the short side of the first to sixth storage channels 1411 to 1416 be 1.5 mm or more. It is desirable that the distance P between the centers of adjacent storage channels be greater than 3.2 mm. However, in order to reduce the manufacturing cost of the discharge element substrate 1110, the distance P between the centers of adjacent storage channels is often 3.2 mm or less. In this embodiment, the distance P between the centers of adjacent storage channels is 1.9 mm, and the wall thickness W1 between adjacent storage channels is 0.9 mm. Thus, the distance P between the centers of adjacent storage channels may be 3.2 mm or less. Also, for manufacturing convenience, the distance P between the centers of adjacent storage channels may be 0.5 mm or more.

[0136] To avoid a decrease in processing accuracy due to sink marks, etc., it is desirable that the thickness W2 of the first to sixth upstream beam sections 2301 to 2306 be no more than twice the thickness W1 of the wall between adjacent storage channels. In this embodiment, the thickness W2 of the first to sixth upstream beam sections 2301 to 2306 is 1.0 mm, and the thickness W1 of the wall between adjacent storage channels is 0.9 mm. Therefore, the thickness W2 of the first to sixth upstream beam sections 2301 to 2306 is no more than twice the thickness W1 of the wall between adjacent storage channels.

[0137] Here, we will describe the case where the relationship between the width W0 of the short side of the first to sixth storage channels 1411 to 1416 and the thickness W1 of the wall between adjacent storage channels is expressed by the following equation (1). W0≧W1 ···(1)

[0138] In this case, the relationship between the offset amount S of the upstream beam section in adjacent storage channels and the distance P between the centers of adjacent storage channels is preferably expressed by the following equation (2). S≧P ···(2)

[0139] In this embodiment, the offset amount S of the upstream beam section in adjacent storage channels is 2.5 mm, and the distance P between the centers of adjacent storage channels is 1.9 mm, so the condition of equation (2) is satisfied. Also, if the channel width W0 on the short side of the first to sixth storage channels 1411 to 1416 is 0.9 mm or more, the condition of equation (1) is satisfied. By satisfying the conditions of equations (1) and (2), it is possible to increase the filler perpendicular to the direction of cracks that may occur at the connection between each upstream beam section and the wall surface of the storage channel. The distance P between the centers of adjacent storage channels may also be called the opening pitch of adjacent storage channels, or the color pitch.

[0140] Next, we will discuss the case where the relationship between the width W0 of the short side of the first to sixth storage channels 1411 to 1416 and the wall thickness W1 between adjacent storage channels is expressed by the following equation (3). W0 <W1 ···(3)

[0141] In this case, the relationship between the offset amount S of the upstream beam section in adjacent storage channels and the distance P between the centers of adjacent storage channels is preferably expressed by equation (4) below. S≧P×(W2 / W1) ···(4)

[0142] As mentioned above, the offset amount S of the upstream beam section in adjacent storage channels is 2.5 mm, and the distance P between the centers of adjacent storage channels is 1.9 mm. Furthermore, the thickness W2 of the first to sixth upstream beam sections 2301 to 2306 is 1.0 mm, and the thickness W1 of the wall section between adjacent storage channels is 0.9 mm, so the condition of equation (4) is satisfied. Also, if the width W0 of the short side of the storage channel in the first to sixth storage channels 1411 to 1416 is less than 0.9 mm, the condition of equation (3) is satisfied. By satisfying the conditions of equations (3) and (4), it is possible to increase the amount of filler perpendicular to the direction of cracks that may occur at the connection between each upstream beam section and the wall surface of the storage channel.

[0143] As described above, the fourth embodiment provides a highly reliable liquid discharge head. Specifically, in this embodiment, the head housing unit 2300, which is the first flow path member, has first to sixth upstream beam sections 2301 to 2306 that divide the first to sixth storage channels 1411 to 1416 into a plurality of parallel channels. The upstream beam sections of adjacent storage channels among the first to sixth storage channels 1411 to 1416 are offset in the direction along the discharge port row. This makes it possible to alleviate the stress generated in the first to sixth upstream beam sections 2301 to 2306 after the support member 2102 and the head housing unit 2300 are joined, thereby suppressing fracture of the first to sixth upstream beam sections 2301 to 2306. In this way, a highly reliable liquid discharge head can be provided.

[0144] Furthermore, among the first to sixth storage channels 1411 to 1416, the offset amount of the upstream beam section in adjacent storage channels is the same for the four upstream beam sections provided in adjacent storage channels. This makes it less likely for bias to occur in each of the first to sixth storage channels 1411 to 1416, which are separated by the first to sixth upstream beam sections 2301 to 2306. Consequently, the moldability of the first to sixth storage channels 1411 to 1416 is improved, and the lower openings of the first to sixth storage channels 1411 to 1416 can be formed with high precision.

[0145] Furthermore, the support member 2102, which is the second flow channel member, is formed using alumina. This reduces the stress generated in the discharge element substrate 1110 supported by the support member 2102, similar to the first embodiment, and makes the temperature inside the discharge element substrate 1110 uniform.

[0146] Furthermore, rounded upstream corner sections 2311 are formed at the connection points between the first to sixth upstream beam sections 2301 to 2306 and the walls of the first to sixth storage channels 1411 to 1416. This allows for the relaxation of stress generated in the first to sixth upstream beam sections 2301 to 2306, thereby suppressing fracture of the first to sixth upstream beam sections 2301 to 2306.

[0147] In the fourth embodiment described above, a second liquid ejection head 2060 was described, but the invention is not limited thereto. The liquid ejection head in the fourth embodiment may be used as a first liquid ejection head capable of ejecting three types of ink. In this case, as described in the third embodiment, first to third storage channels 1411 to 1413 may be formed in the head housing unit 2300. First to third upstream beam sections 2301 to 2303 may be formed on the lower wall surface of the first to third storage channels 1411 to 1413 in the head housing unit 2300. First to third connecting channels 1421 to 1423 may be formed in the support member 2102. First to third downstream beam sections 1161 to 1163 may be formed on the wall surface of the first to third connecting channels 1421 to 1423 in the support member 2102.

[0148] In the fourth embodiment described above, a rounded upstream corner portion 2311 is formed at the connection between the first to sixth upstream beam portions 2301 to 2306 and the wall surfaces of the first to sixth storage channels 1411 to 1416, but the embodiment is not limited to this. For example, a rounded corner portion may be formed at the connection between the supply-side beam portion 301 and the wall surface of the supply-side storage channel 411 in the first embodiment, and a rounded corner portion may be formed at the connection between the recovery-side beam portion 302 and the wall surface of the recovery-side storage channel 412. The radius of curvature of the corner portions in the supply-side beam portion 301 and the recovery-side beam portion 302 may be 0.2 mm or more, or 8.0 mm or less.

[0149] Furthermore, in the second embodiment, rounded corners may be formed at the connection points between the first to sixth supply-side beam sections 801A to 801F and the walls of the first to sixth supply-side storage channels 911A to 911F. Rounded corners may also be formed at the connection points between the first and second recovery-side beam sections 802A and 802B and the walls of the first and second recovery-side storage channels 912A and 912B. Rounded corners may also be formed at the connection points between the fourth and fifth recovery-side beam sections 802D and 802E and the walls of the fourth and fifth recovery-side storage channels 912D and 912E. The radius of curvature of the corners in the first to sixth supply-side beam sections 801A to 801F may be 0.2 mm or more, or 8.0 mm or less. The radius of curvature of the corners in the first and second recovery-side beam sections 802A, 802B and the fourth and fifth recovery-side beam sections 802D, 802E may be 0.2 mm or more, or 8.0 mm or less.

[0150] In the fourth embodiment described above, the upstream beam sections of adjacent storage channels among the first to sixth storage channels 1411 to 1416 are offset in the direction along the discharge port row, but the invention is not limited to this. For example, the upstream beam sections of adjacent storage channels among the first to sixth storage channels 1411 to 1416 may be offset in the direction of extension of the discharge port 1115 (Z direction).

[0151] In the first, second, and fourth embodiments described above, the support member is formed using alumina, but is not limited thereto. Similarly, the head housing unit is formed using a resin material with added fillers, but is not limited thereto. For example, the support member may be formed using silicon. The head housing unit may be formed using a resin material without added fillers (e.g., polyethylene). The coefficient of thermal expansion of silicon is approximately 3 ppm / °C. The coefficient of thermal expansion of polyethylene without added fillers is approximately 150 ppm / °C. In this case, the difference between the coefficient of thermal expansion of the head housing unit material and the coefficient of thermal expansion of the support member material is approximately 147 ppm / °C. Therefore, the difference (absolute value) between the coefficient of thermal expansion of the head housing unit material and the coefficient of thermal expansion of the support member material may be 147 ppm / °C or less.

[0152] In each of the embodiments described above, the first liquid ejection head and the second liquid ejection head are so-called serial type liquid ejection heads that eject liquid such as ink while moving in the main scanning direction, but are not limited to this. The first liquid ejection head and the second liquid ejection head may also be so-called full-line type liquid ejection heads that are capable of ejecting liquid over the entire width of the printing medium MD without moving in the main scanning direction.

[0153] <<Other Embodiments>> The disclosure of this embodiment includes configurations represented by the following examples of liquid dispensing heads and liquid dispensing devices.

[0154] <Configuration 1> A discharge element substrate having multiple rows of discharge ports arranged for discharging liquid, A first flow channel member and a second flow channel member that form a plurality of liquid flow channels communicating with the plurality of discharge port rows, Equipped with, The first flow channel member or the second flow channel member supports the discharge element substrate, The first flow channel member is formed using a resin material and joined to the second flow channel member, and has a beam portion that divides a part of the liquid flow channel into a plurality of parallel flow channels. A liquid discharge head characterized in that, among a plurality of liquid flow paths, the beam portions in adjacent liquid flow paths are arranged in an offset manner.

[0155] <Configuration 2> The liquid discharge head according to configuration 1, wherein the beam portions in the adjacent liquid flow paths are arranged offset in a direction along the row of discharge ports.

[0156] <Structure 3> The first flow channel member has a plurality of beam portions arranged in the direction along the row of discharge ports in the liquid flow channel, The liquid discharge head according to configuration 2, wherein the offset amount of the beam portion in the adjacent liquid flow paths is the same for multiple beam portions.

[0157] <Structure 4> The liquid discharge head according to configuration 2 or 3, wherein the arrangement of the beams along the direction in which the multiple liquid flow paths are aligned is in a staggered arrangement.

[0158] <Composition 5> A liquid discharge head according to any one of configurations 1 to 4, wherein the coefficient of linear expansion of the material of the first flow channel member is different from the coefficient of linear expansion of the material of the second flow channel member.

[0159] <Composition 6> The liquid discharge head according to configuration 5, wherein the difference between the linear expansion coefficient of the material of the first flow channel member and the linear expansion coefficient of the material of the second flow channel member is 6 ppm / °C or more.

[0160] <Composition 7> A liquid discharge head according to any one of configurations 1 to 6, wherein a rounded corner portion is formed at the connection between the beam portion and the wall surface of the liquid flow path.

[0161] <Structure 8> The liquid discharge head according to configuration 7, wherein the radius of curvature of the corner portion is 0.2 mm or more.

[0162] <Composition 9> A liquid discharge head according to any one of configurations 1 to 8, wherein the second flow channel member supports the discharge element substrate.

[0163] <Composition 10> The second flow channel member is a liquid discharge head according to configuration 9, formed using alumina.

[0164] <Composition 11> The beams in the adjacent liquid flow channels are offset in the direction along the row of discharge ports, The relationship between the width of the shorter side of the liquid channel and the thickness of the wall between adjacent liquid channels is expressed by the following equation: W0≧W1 However, W0: the width of the flow path on the short side in the liquid flow path. W1: Thickness of the wall between adjacent liquid flow channels. The liquid discharge head according to configuration 9 or 10, wherein the relationship between the offset amount of the beam portion in adjacent liquid flow paths and the distance between the centers of adjacent liquid flow paths is expressed by the following formula. S≧P However, S: offset amount of the beam portion in the adjacent liquid flow channels. P: Distance between the centers of adjacent liquid flow channels.

[0165] <Composition 12> The beams in the adjacent liquid flow channels are offset in the direction along the row of discharge ports, The relationship between the width of the shorter side of the liquid channel and the thickness of the wall between adjacent liquid channels is expressed by the following equation: W0 <W1 However, W0: the width of the flow path on the short side in the liquid flow path. W1: Thickness of the wall between adjacent liquid flow channels. The liquid discharge head according to configuration 9 or 10, wherein the relationship between the offset amount of the beam portion in adjacent liquid flow paths and the distance between the centers of adjacent liquid flow paths is expressed by the following formula. S≧P×(W2 / W1) However, S: offset amount of the beam portion in the adjacent liquid flow channels. P: Distance between the centers of adjacent liquid flow channels. W2: Thickness of the beam section

[0166] <Composition 13> The first flow channel member forms the upstream side of the liquid flow channel, and the second flow channel member forms the downstream side of the liquid flow channel. A portion of the liquid flow path is on the upstream side of the liquid flow path, The second flow channel member has a downstream beam portion that divides the downstream side of the liquid flow channel into a plurality of parallel flow channels, The first flow channel member has a plurality of beam portions arranged in a direction along the discharge port row on the upstream side of the liquid flow channel, The second flow channel member has a plurality of downstream beam portions arranged in a direction along the discharge port row on the downstream side of the liquid flow channel, A liquid discharge head according to any one of configurations 9 to 12, wherein the plurality of downstream beam sections are arranged on either side of an extension line extending downstream from the plurality of beam sections to the liquid flow path.

[0167] <Composition 14> A liquid discharge head according to configuration 9 or 10, wherein the beam portion is not arranged in some of the liquid flow paths among the multiple liquid flow paths.

[0168] <Composition 15> The first flow channel member has a plurality of beam portions arranged in the direction along the row of discharge ports in the liquid flow channel, A liquid discharge head according to configuration 9 or 10, wherein, among the multiple liquid flow paths, the number of beams in some of the liquid flow paths is less than the number of beams in the other liquid flow paths excluding those liquid flow paths.

[0169] <Composition 16> A liquid discharge head according to any one of configurations 1 to 8, wherein the first flow channel member supports the discharge element substrate.

[0170] <Composition 17> The second flow channel member is formed using a resin material, The liquid discharge head according to configuration 16, wherein the coefficient of linear expansion of the material of the first flow channel member is smaller than the coefficient of linear expansion of the material of the second flow channel member.

[0171] <Composition 18> The first flow channel member forms the downstream side of the liquid flow channel, and the second flow channel member forms the upstream side of the liquid flow channel. A portion of the liquid flow path is located downstream of the liquid flow path. The second flow channel member has an upstream beam portion that divides the upstream side of the liquid flow channel into a plurality of parallel flow channels, The first flow channel member has a plurality of beam portions arranged in a direction along the discharge port row on the downstream side of the liquid flow channel, The second flow channel member has a plurality of upstream beam portions arranged in a direction along the discharge port row on the upstream side of the liquid flow channel, The liquid discharge head according to configuration 16 or 17, wherein the plurality of beam sections are arranged on either side of an extension line extending downstream from the plurality of upstream beam sections to the liquid flow path.

[0172] <Composition 19> The liquid discharge head according to any one of configurations 1 to 18, wherein the first flow channel member is joined to the second flow channel member using a thermosetting adhesive.

[0173] <Composition 20> The liquid discharge head according to any one of configurations 1 to 19, wherein the first flow channel member is formed using a resin material to which a filler has been added.

[0174] <Composition 21> The liquid dispensing head according to configuration 20, wherein the filler includes at least one of needle-shaped particles and plate-shaped particles.

[0175] <Composition 22> A liquid dispensing head according to any one of configurations 1 to 21, wherein the length of the row of discharge ports is 0.5 inches or more.

[0176] <Composition 23> A liquid dispensing head according to any one of the configurations 1 to 22, wherein the proportion of solvent contained in the liquid discharged from the plurality of discharge ports is 5% or more.

[0177] <Composition 24> A liquid dispensing device comprising a liquid dispensing head as described in any one of configurations 1 to 23.

[0178] <Composition 25> Multiple liquid dispensing heads, A carriage on which multiple liquid discharge heads are mounted, Equipped with, The liquid dispensing device according to configuration 24, wherein some of the multiple liquid dispensing heads dispens a reaction liquid that reacts with the liquid dispensed from the other liquid dispensing heads, excluding the aforementioned liquid dispensing heads. [Explanation of Symbols]

[0179] 102 Support member 300 Head Housing Unit 301 Supply side beam 302 Recovery side beam section 401 Supply side liquid flow path 402 Recovery side liquid flow path

Claims

1. A discharge element substrate having multiple rows of discharge ports arranged for discharging liquid, A first flow channel member and a second flow channel member that form a plurality of liquid flow channels communicating with the plurality of discharge port rows, Equipped with, The first flow channel member or the second flow channel member supports the discharge element substrate, The first flow channel member is formed using a resin material and joined to the second flow channel member, and has a beam portion that divides a part of the liquid flow channel into a plurality of parallel flow channels. A liquid discharge head characterized in that, among a plurality of liquid flow paths, the beam portions in adjacent liquid flow paths are arranged in an offset manner.

2. The liquid discharge head according to claim 1, wherein the beam portions in the adjacent liquid flow paths are arranged offset in a direction along the row of discharge ports.

3. The first flow channel member has a plurality of beam portions arranged in the direction along the row of discharge ports in the liquid flow channel, The liquid discharge head according to claim 2, wherein the offset amount of the beam portion in the adjacent liquid flow path is the same for multiple beam portions.

4. The liquid discharge head according to claim 2, wherein the arrangement of the beams along the direction in which the multiple liquid flow paths are aligned is in a staggered arrangement.

5. The liquid discharge head according to claim 1, wherein the coefficient of linear expansion of the material of the first flow channel member is different from the coefficient of linear expansion of the material of the second flow channel member.

6. The liquid discharge head according to claim 5, wherein the difference between the coefficient of thermal expansion of the material of the first flow channel member and the coefficient of thermal expansion of the material of the second flow channel member is 6 ppm / °C or more.

7. The liquid discharge head according to claim 1, wherein a rounded corner portion is formed at the connection between the beam portion and the wall surface of the liquid flow path.

8. The liquid discharge head according to claim 7, wherein the radius of curvature of the corner portion is 0.2 mm or more.

9. The liquid discharge head according to claim 1, wherein the second flow channel member supports the discharge element substrate.

10. The liquid discharge head according to claim 9, wherein the second flow channel member is formed using alumina.

11. The beams in the adjacent liquid flow channels are offset in the direction along the row of discharge ports, The relationship between the width of the shorter side of the liquid channel and the thickness of the wall between adjacent liquid channels is expressed by the following equation: W0 ≥ W1 However, W0: width of the flow path on the short side in the liquid flow path. W1: Thickness of the wall between adjacent liquid flow channels. The liquid discharge head according to claim 9, wherein the relationship between the offset amount of the beam portion in adjacent liquid flow paths and the distance between the centers of adjacent liquid flow paths is expressed by the following formula. S≧P However, S: offset amount of the beam portion in the adjacent liquid flow channels. P: Distance between the centers of adjacent liquid flow channels

12. The beams in the adjacent liquid flow channels are offset in the direction along the row of discharge ports, The relationship between the width of the shorter side of the liquid channel and the thickness of the wall between adjacent liquid channels is expressed by the following equation: W0 < W1 However, W0: width of the flow path on the short side in the liquid flow path. W1: Thickness of the wall between adjacent liquid flow channels. The liquid discharge head according to claim 9, wherein the relationship between the offset amount of the beam portion in adjacent liquid flow paths and the distance between the centers of adjacent liquid flow paths is expressed by the following formula. S≧P×(W2 / W1) However, S: offset amount of the beam portion in the adjacent liquid flow channels. P: Distance between the centers of adjacent liquid flow channels W2: Thickness of the beam section

13. The first flow channel member forms the upstream side of the liquid flow channel, and the second flow channel member forms the downstream side of the liquid flow channel. A portion of the liquid flow path is on the upstream side of the liquid flow path, The second flow channel member has a downstream beam portion that divides the downstream side of the liquid flow channel into a plurality of parallel flow channels, The first flow channel member has a plurality of beam portions arranged in a direction along the discharge port row on the upstream side of the liquid flow channel, The second flow channel member has a plurality of downstream beam portions arranged in a direction along the discharge port row on the downstream side of the liquid flow channel, The liquid discharge head according to claim 9, wherein the plurality of downstream beam portions are arranged on either side of an extension line extending downstream from the plurality of beam portions to the liquid flow path.

14. The liquid discharge head according to claim 9, wherein the beam portion is not arranged in some of the liquid flow paths among the plurality of liquid flow paths.

15. The first flow channel member has a plurality of beam portions arranged in the direction along the row of discharge ports in the liquid flow channel, The liquid discharge head according to claim 9, wherein the number of beams in some of the liquid passages is less than the number of beams in the other liquid passages excluding the said liquid passages.

16. The liquid discharge head according to claim 1, wherein the first flow channel member supports the discharge element substrate.

17. The second flow channel member is formed using a resin material, The liquid discharge head according to claim 16, wherein the coefficient of linear expansion of the material of the first flow channel member is smaller than the coefficient of linear expansion of the material of the second flow channel member.

18. The first flow channel member forms the downstream side of the liquid flow channel, and the second flow channel member forms the upstream side of the liquid flow channel. A portion of the liquid flow path is located downstream of the liquid flow path. The second flow channel member has an upstream beam portion that divides the upstream side of the liquid flow channel into a plurality of parallel flow channels, The first flow channel member has a plurality of beam portions arranged in a direction along the discharge port row on the downstream side of the liquid flow channel, The second flow channel member has a plurality of upstream beam portions arranged in a direction along the discharge port row on the upstream side of the liquid flow channel, The liquid discharge head according to claim 16, wherein the plurality of beam portions are arranged on either side of an extension line extending downstream from the plurality of upstream beam portions to the liquid flow path.

19. The liquid discharge head according to claim 1, wherein the first flow channel member is joined to the second flow channel member using a thermosetting adhesive.

20. The liquid discharge head according to claim 1, wherein the first flow channel member is formed using a resin material to which a filler has been added.

21. The liquid dispensing head according to claim 20, wherein the filler comprises at least one of needle-shaped particles and plate-shaped particles.

22. The liquid dispensing head according to claim 1, wherein the length of the row of discharge ports is 0.5 inches or more.

23. The liquid dispensing head according to claim 1, wherein the proportion of solvent contained in the liquid discharged from the plurality of discharge ports is 5% or more.

24. A liquid dispensing device comprising a liquid dispensing head according to any one of claims 1 to 23.

25. Multiple liquid dispensing heads, A carriage on which multiple liquid discharge heads are mounted, Equipped with, The liquid dispensing apparatus according to claim 24, wherein some of the liquid dispensing heads dispens a reaction liquid that reacts with the liquid dispensed from the other liquid dispensing heads, excluding the aforementioned liquid dispensing heads.

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