Sensor module and manufacturing method

Abstract

The objective is to provide a sensor module that can reduce the mounting area of ​​the first and second inertial sensors and improve the relative positional accuracy of the first and second inertial sensors. [Solution] Sensor module A1 comprises a substrate 30, a first inertial sensor 10, and a second inertial sensor 20. The first inertial sensor 10 is positioned on the first main surface 33 and detects the inertial force of an object. The second inertial sensor 20 is positioned on the second main surface 34 and detects the inertial force. Each of the first inertial sensor 10 and the second inertial sensor 20 has a rectangular shape in a plan view from the thickness direction D3 of the substrate 30. The substrate 30 has a first through hole 31 and a second through hole 32. The first inertial sensor 10 has a first corner portion 1 and a second corner portion 2 located diagonally opposite to the first corner portion 1. The first corner portion 1 is positioned to overlap with the first through hole 31 in the plan view. The second corner portion 2 is positioned to overlap with the second through hole 32 in the plan view.

Description

Technical Field

[0001] The present disclosure generally relates to a sensor module and a manufacturing method, and more particularly, to a sensor module including a first inertial sensor and a second inertial sensor, and a manufacturing method of the sensor module.

Background Art

[0002] An oscillator described in Patent Document 1 is exemplified. In the oscillator, a first vibrator is mounted on a first main surface of a base substrate, and a second vibrator is mounted on a second main surface of the base substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the oscillator described in Patent Document 1, since the first vibrator and the second vibrator are mounted (double-sided mounted) on both main surfaces of the base substrate, the mounting areas of the first vibrator and the second vibrator on each main surface of the base substrate can be reduced.

[0005] However, in the oscillator, for example, it is difficult to improve the relative positional accuracy (mounting accuracy) between the first vibrator and the second vibrator.

[0006] An object of the present disclosure is to provide a sensor module and a manufacturing method capable of reducing the mounting areas of the first inertial sensor and the second inertial sensor and improving the relative positional accuracy between the first inertial sensor and the second inertial sensor.

Means for Solving the Problems

[0007] A sensor module according to one aspect of the present disclosure comprises a substrate, a first inertial sensor, and a second inertial sensor. The substrate includes a first principal surface and a second principal surface facing each other. The first inertial sensor is positioned on the first principal surface and detects the inertial force of an object. The second inertial sensor is positioned on the second principal surface and detects the inertial force. Each of the first and second inertial sensors has a rectangular shape in a plan view from the thickness direction of the substrate. The substrate has a first through hole and a second through hole. The first through hole penetrates the substrate in the thickness direction. The second through hole is located at a different position from the first through hole and penetrates in the thickness direction. The first inertial sensor has a first corner portion in the plan view of the substrate from the thickness direction and a second corner portion located diagonally to the first corner portion in the plan view. The first corner portion is positioned to overlap with the first through hole in the plan view. The second corner portion is positioned to overlap with the second through-hole in the plan view.

[0008] A manufacturing method according to one aspect of the present disclosure is a method for manufacturing a sensor module. The manufacturing method includes a first step, a second step, and a third step. In the first step, a first through hole and a second through hole are formed in a substrate. The substrate includes a first main surface and a second main surface that are opposite to each other. In the second step, a first inertial sensor is mounted on the first main surface of the substrate. The first inertial sensor has a rectangular shape in a plan view from the thickness direction of the substrate. In the third step, a second inertial sensor is mounted on the second main surface of the substrate. The second inertial sensor has a rectangular shape in a plan view. In the first step, the first through hole is formed in the substrate such that the first through hole penetrates through the substrate in the thickness direction of the substrate. In the first step, the second through hole is formed in the substrate such that the second through hole is located at a different position from the first through hole and penetrates through the substrate in the thickness direction. In the second step, the first inertial sensor is mounted on the first main surface of the substrate such that the first corner of the first inertial sensor in a plan view coincides with the first through-hole in a plan view, and the second corner located diagonally opposite the first corner in a plan view coincides with the second through-hole in a plan view. [Effects of the Invention]

[0009] According to one aspect of this disclosure, the mounting area of ​​the first inertial sensor and the second inertial sensor can be reduced, and the relative positional accuracy between the first inertial sensor and the second inertial sensor can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is an external view of the sensor module according to Embodiment 1. [Figure 2] Figure 2 is a perspective view of the same sensor module. [Figure 3] Figure 3 is a perspective view of the sensor module shown above, with the covers for the first and second inertial sensors removed. [Figure 4]Figure 4 is an explanatory diagram illustrating the case in which the first inertial sensor is mounted on the first main surface of the substrate for the same sensor module. [Figure 5] Figure 5 is an explanatory diagram illustrating the case in which the second inertial sensor is mounted on the second main surface of the substrate for the same sensor module as described above. [Figure 6] Figure 6 is a perspective view of the sensor module according to Embodiment 2. [Figure 7] Figure 7 is an explanatory diagram illustrating the length of the diagonal connecting the first and second corners of the first inertial sensor and the length of the diagonal connecting the third and fourth corners of the second inertial sensor, with respect to the sensor module described above. [Figure 8] Figure 8 is a cross-sectional view of the sensor module according to Embodiment 3. [Figure 9] Figure 9 is an external view of the sensor module shown above, with the first and second sealing plates removed. [Modes for carrying out the invention]

[0011] The sensor modules according to Embodiments 1 to 3 will be described below with reference to the drawings. The figures described in each embodiment below are schematic diagrams, and the ratios of the size and thickness of each component do not necessarily reflect the actual dimensional ratios. Furthermore, the configurations described in each embodiment below are merely examples of this disclosure. This disclosure is not limited to the embodiments below, and various modifications are possible depending on the design, etc., as long as the effects of this disclosure can be achieved. It is also possible to combine at least some of the configurations of each embodiment below as appropriate.

[0012] (Embodiment 1) The sensor module A1 according to Embodiment 1 will be described below with reference to Figures 1 to 5.

[0013] (1) Sensor module As shown in Figure 2, the sensor module A1 comprises a substrate 30, a first inertial sensor 10, and a second inertial sensor 20.

[0014] (2) Components of the sensor module (2.1) Substrate The substrate 30 is, for example, a printed wiring board (specifically, a double-sided mounting type printed wiring board). The shape of the substrate 30 is plate-shaped (for example, rectangular plate-shaped) as shown in FIG. 1. The substrate 30 includes a first main surface 33 and a second main surface 34 that face each other. The first main surface 33 and the second main surface 34 are arranged side by side in the third direction D3 (thickness direction) of the substrate 30.

[0015] Note that the "first main surface 33" means, for example, the first surface (for example, the front surface) of the substrate 30 on which electronic components such as the first inertial sensor 10 are arranged. Also, the "second main surface 34" means, for example, the second surface (for example, the back surface) of the substrate 30 on which other electronic components such as the second inertial sensor 20 are arranged.

[0016] As shown in FIG. 4, a plurality of electrodes 8 are provided on the first main surface 33 of the substrate 30. The plurality of electrodes 8 are electrodes for electrically and mechanically connecting the first inertial sensor 10 to the substrate 30.

[0017] As shown in FIG. 5, a plurality of electrodes 9 are provided on the second main surface 34 of the substrate 30. The plurality of electrodes 9 are electrodes for electrically and mechanically connecting the second inertial sensor 20 to the substrate 30.

[0018] As shown in FIG. 1, the substrate 30 has a first through hole 31 and a second through hole 32.

[0019] The first through hole 31 penetrates the substrate 30 in the third direction D3. The first through hole 31 has, for example, a polygonal shape (for example, a rectangular shape) in a plan view from the third direction D3 of the substrate 30 (hereinafter referred to as "plan view of the substrate 30").

[0020] The second through-hole 32 penetrates the substrate 30 in the third direction D3. The second through-hole 32 has a polygonal shape (for example, rectangular) in a plan view of the substrate 30. The second through-hole 32 is located at a different position from the first through-hole 31. The first through-hole 31 and the second through-hole 32 are located, for example, on the diagonals of the substrate 30.

[0021] (2.2) Inertial Sensors The first inertial sensor 10 detects the inertial force of an object. The inertial force detected by the first inertial sensor 10 is at least one of the object's acceleration and angular velocity. For example, the first inertial sensor 10 detects both the acceleration and angular velocity of an object. The first inertial sensor 10 is positioned on the first main surface 33 of the substrate 30. The first inertial sensor 10 is electrically and mechanically connected to the substrate 30 via a plurality of solders 81 (see Figure 4) and a plurality of electrodes 8 (see Figure 4). The first inertial sensor 10 is also mechanically connected to the substrate 30 via a plurality of adhesives 91 (see Figure 4). In other words, the first inertial sensor 10 and the substrate 30 are connected by a plurality of adhesives 91 and a plurality of solders 81.

[0022] The first inertial sensor 10 has a rectangular box shape. The first inertial sensor 10 has a first corner portion 1 in a plan view of the substrate 30 and a second corner portion 2 located diagonally to the first corner portion 1 in a plan view of the substrate 30.

[0023] As shown in Figure 4, the first corner 1 includes at least one corner (first corner) 61 of the four corners on one face (e.g., mounting surface) 51 of the first inertial sensor 10 in a plan view of the substrate 30. The second corner 2 includes at least one corner (second corner) 62 located diagonally opposite to the first corner on one face 51 of the first inertial sensor 10. That is, the first corner 1 includes the first corner 61 of the two diagonally opposite corners on one face 51 of the first inertial sensor 10, and the second corner 2 includes the second corner 62 of the two diagonally opposite corners on one face 51 of the first inertial sensor 10.

[0024] As shown in Figure 1, the first corner portion 1 is positioned to overlap with the first through-hole 31 in a plan view of the substrate 30. More specifically, the tip 1a of the first corner portion 1 is located at the first through-hole 31 in a plan view of the substrate 30.

[0025] The second corner portion 2 is positioned to overlap with the second through-hole 32 in a plan view of the substrate 30. More specifically, the tip 2a of the second corner portion 2 is located at the second through-hole 32 in a plan view of the substrate 30.

[0026] The second inertial sensor 20 detects the inertial force of an object. The inertial force detected by the second inertial sensor 20 is at least one of the object's acceleration and angular velocity. For example, the second inertial sensor 20 detects both the acceleration and angular velocity of an object. The second inertial sensor 20 is located on the second main surface 34 of the substrate 30. The second inertial sensor 20 is electrically and mechanically connected to the substrate 30 via multiple solders 82 (see Figure 5) and multiple electrodes 9 (see Figure 5). The second inertial sensor 20 is also mechanically connected to the substrate 30 via multiple adhesives 92 (see Figure 5). In other words, the second inertial sensor 20 and the substrate 30 are connected by multiple adhesives 92 and multiple solders 82.

[0027] The second inertial sensor 20 has a rectangular box shape. The second inertial sensor 20 has a third corner portion 3 in a plan view of the substrate 30 and a fourth corner portion 4 located diagonally to the third corner portion 3 in a plan view of the substrate 30.

[0028] As shown in Figure 5, the third corner 3 includes at least one corner (the first corner) 63 of the four corners on one face (e.g., the mounting surface) 52 of the second inertial sensor 20 in a plan view of the substrate 30. The fourth corner 4 includes at least one corner (the second corner) 64 located diagonally opposite to the first corner on one face 52 of the second inertial sensor 20. That is, the third corner 3 includes the first corner 63 of the two diagonally opposite corners on one face 52 of the second inertial sensor 20, and the fourth corner 4 includes the second corner 64 of the two diagonally opposite corners on one face 52 of the second inertial sensor 20.

[0029] As shown in Figure 1, the third corner portion 3 is positioned to overlap with the first through-hole 31 in a plan view of the substrate 30. More specifically, the tip 3a of the third corner portion 3 is located at the first through-hole 31 in a plan view of the substrate 30.

[0030] The fourth corner portion 4 is positioned to overlap with the second through-hole 32 in a plan view of the substrate 30. More specifically, the tip 4a of the fourth corner portion 4 is located at the second through-hole 32 in a plan view of the substrate 30.

[0031] As shown in Figure 1, the first corner 1 and the third corner 3 are positioned side by side in the third direction D3 of the substrate 30. In other words, the first corner 1 and the third corner 3 are positioned to overlap in the third direction D3 of the substrate 30.

[0032] The second corner 2 and the fourth corner 4 are located side by side in the third direction D3 of the substrate 30. In other words, the second corner 2 and the fourth corner 4 are located so as to overlap in the third direction D3 of the substrate 30.

[0033] As shown in Figure 3, the first inertial sensor 10 includes a first detection element 11, a first processing unit 12, a first support substrate 13, and a first cover 14 (see Figure 2).

[0034] The first detection element 11 is an element for detecting the inertial force of an object. The first detection element 11 is configured to detect the inertial force of an object and output an electrical signal (first electrical signal) corresponding to the detected inertial force of the object.

[0035] The first processing unit 12 receives the detection result from the first detection element 11. More specifically, the first processing unit 12 receives a first electrical signal from the first detection element 11 and processes the first electrical signal. The first processing unit 12 is, for example, an ASIC (Application Specific Integrated Circuit). The shape of the first processing unit 12 is box-shaped (for example, rectangular box-shaped). The surface area of ​​the first processing unit 12 in a plan view of the substrate 30 is larger than the surface area of ​​the first detection element 11 in a plan view of the substrate 30.

[0036] The first support substrate 13 supports the first processing unit 12 and the first detection element 11. The first support substrate 13 has a rectangular plate shape.

[0037] As shown in Figure 3, the first processing unit 12 is located on one surface of the first support substrate 13. The first processing unit 12 is electrically and mechanically connected to the first support substrate 13 via, for example, connecting members (e.g., electrodes and solder). The first detection element 11 is located on one surface 12a of the first processing unit 12. The first detection element 11 is electrically and mechanically connected to the first processing unit 12 via, for example, connecting members (e.g., electrodes and solder). In other words, the first support substrate 13 supports the first processing unit 12 and also supports the first detection element 11 via the first processing unit 12. That is, the first detection element 11 and the first processing unit 12 are three-dimensionally mounted on the first support substrate 13.

[0038] The first support substrate 13 has a plurality of first electrodes on a surface (second surface) facing the first surface (first surface) in the third direction D3 of the first support substrate 13. The plurality of first electrodes are electrodes for electrically and mechanically connecting the first support substrate 13 to the substrate 30. In other words, the plurality of first electrodes are electrodes for electrically and mechanically connecting the first inertial sensor 10 to the substrate 30. The plurality of first electrodes are electrically and mechanically connected to a plurality of electrodes 8 on the substrate 30 via a plurality of solder 81 (see Figure 4).

[0039] The first cover 14 shown in Figure 2 covers the first detection element 11, the first processing unit 12, and the first support substrate 13. The shape of the first cover 14 is, for example, a rectangular box shape with one side open.

[0040] As shown in Figure 3, the second inertial sensor 20 includes a second detection element 21, a second processing unit 22, a second support substrate 23, and a second cover 24 (see Figure 2).

[0041] The second detection element 21 is an element for detecting the inertial force of an object. The second detection element 21 is configured to detect the inertial force of an object and output an electrical signal (second electrical signal) corresponding to the detected inertial force of the object. In this embodiment, the object detected by the second detection element 21 is the same object detected by the first detection element 11.

[0042] The second processing unit 22 receives the detection result from the second detection element 21. More specifically, the second processing unit 22 receives a second electrical signal from the second detection element 21 and processes the second electrical signal. The second processing unit 22 is, for example, an ASIC. The shape of the second processing unit 22 is box-shaped (for example, rectangular box-shaped). The surface area of ​​the second processing unit 22 in a plan view of the substrate 30 is larger than the surface area of ​​the second detection element 21 in a plan view of the substrate 30.

[0043] The second support substrate 23 supports the second processing unit 22 and the second detection element 21. The shape of the second support substrate 23 is a rectangular plate.

[0044] As shown in Figure 3, the second processing unit 22 is located on one side of the second support substrate 23. The second processing unit 22 is electrically and mechanically connected to the second support substrate 23 via connecting members (e.g., electrodes and solder). The second detection element 21 is located on one side of the second processing unit 22. The second detection element 21 is electrically and mechanically connected to the second processing unit 22 via connecting members (e.g., electrodes and solder). In other words, the second support substrate 23 supports the second processing unit 22 and also supports the second detection element 21 via the second processing unit 22. Thus, the second detection element 21 and the second processing unit 22 are three-dimensionally mounted on the second support substrate 23.

[0045] The second support substrate 23 has a plurality of second electrodes on the surface (second surface) facing the first surface (first surface) in the third direction D3 of the second support substrate 23. The plurality of second electrodes are electrodes for electrically and mechanically connecting the second support substrate 23 to the substrate 30. In other words, the plurality of second electrodes are electrodes for electrically and mechanically connecting the second inertial sensor 20 to the substrate 30. The plurality of second electrodes are electrically and mechanically connected to a plurality of electrodes 9 on the substrate 30 via a plurality of solder 82 (see Figure 5).

[0046] The second cover 24 shown in Figure 2 covers the second detection element 21, the second processing unit 22, and the second support substrate 23. The shape of the second cover 24 is, for example, a rectangular box shape with one side open.

[0047] As shown in Figure 3, the first detection element 11 and the second detection element 21 are arranged side by side in the third direction D3 of the substrate 30. In other words, the first detection element 11 and the second detection element 21 are arranged to overlap in the third direction D3 of the substrate 30. Specifically, the first detection element 11 and the second detection element 21 are arranged such that the position where the first detection element 11 is located on the first processing unit 12 in the third direction D3 of the substrate 30 (hereinafter referred to as "position of the first detection element 11") coincides with the position where the second detection element 21 is located on the second processing unit 22 in the third direction D3 of the substrate 30 (hereinafter referred to as "position of the second detection element 21").

[0048] The first detection element 11 is supported on the first support substrate 13 at a position eccentric to the center of gravity of the first support substrate 13 in a plan view of the substrate 30. In other words, the first detection element 11 is supported on the first support substrate 13 at a position eccentric to the center of gravity (in this embodiment, the center) of the first surface of the first support substrate 13. The second detection element 21 is supported on the second support substrate 23 at a position eccentric to the center of gravity of the second support substrate 23 in a plan view of the substrate 30. In other words, the second detection element 21 is supported on the second support substrate 23 at a position eccentric to the center of gravity (in this embodiment, the center) of the first surface of the second support substrate 23.

[0049] To explain in more detail, the first detection element 11 is located at one of the four corners 12b of one surface 12a of the first processing unit 12. The second detection element 21 is located at one of the four corners of the same surface of the second processing unit 22. In short, each of the first detection element 11 and the second detection element 21 is positioned eccentrically from the center of gravity of the first support substrate 13.

[0050] The detection direction of the inertial force detected by the first inertial sensor 10 is the same as the detection direction of the inertial force detected by the second inertial sensor 20. Note that the detection direction of the inertial force refers to the direction in which acceleration is applied when the inertial force is acceleration, and to the direction of the angular velocity detection axis when the inertial force is angular velocity. Furthermore, below, the detection direction of the inertial force detected by the first inertial sensor 10 will be abbreviated as "detection direction of the first inertial sensor 10," and the detection direction of the inertial force detected by the second inertial sensor 20 will be abbreviated as "detection direction of the second inertial sensor 20."

[0051] The detection direction of the first inertial sensor 10 coincides with the direction along at least one of the detection axes (three orthogonal axes) of the first inertial sensor 10. The detection axes of the first inertial sensor 10 include three axes along the first direction D1, second direction D2, and third direction D3 of the first inertial sensor 10.

[0052] The detection direction of the second inertial sensor 20 coincides with the direction along at least one of the detection axes (three orthogonal axes) of the second inertial sensor 20. The detection axes of the second inertial sensor 20 include the three axes along the first direction D1, second direction D2, and third direction D3 of the second inertial sensor 20, respectively.

[0053] The detection direction of the first inertial sensor 10 includes the first direction D1 of the first inertial sensor 10. The detection direction of the second inertial sensor 20 includes the first direction D1 of the second inertial sensor 20.

[0054] The detection direction of the first inertial sensor 10 includes the first direction D1 of the first inertial sensor 10, but may also include, for example, the second direction D2 of the first inertial sensor 10, or it may include both the first direction D1 and the second direction D2 of the first inertial sensor 10.

[0055] The detection direction of the second inertial sensor 20 includes the first direction D1 of the second inertial sensor 20, but may also include, for example, the second direction D2 of the second inertial sensor 20, or it may include both the first direction D1 and the second direction D2 of the second inertial sensor 20.

[0056] (3) Method for manufacturing a sensor module The manufacturing method for sensor module A1 will be described below with reference to Figures 4 and 5.

[0057] A method for manufacturing sensor module A1 includes, for example, a first step, a second step, and a third step.

[0058] In the first step, as shown in Figure 4, a first through-hole 31 and a second through-hole 32 are formed in the substrate 30.

[0059] In the second step, as shown in Figure 4, the first inertial sensor 10 is mounted on the first main surface 33 of the substrate 30. Specifically, in the second step, the first inertial sensor 10 is mounted on the first main surface 33 of the substrate 30 such that the first corner 1 of the first inertial sensor 10 coincides with the first through hole 31 in a plan view of the substrate 30, and the second corner 2 of the first inertial sensor 10 coincides with the second through hole 32 in a plan view of the substrate 30.

[0060] In this second step, the first inertial sensor 10 is positioned on the first main surface 33 of the substrate 30 with multiple adhesives 91, and then the first inertial sensor 10 is mounted on the first main surface 33 of the substrate 30 with multiple solders 81 (specifically, mounted using reflow soldering). In this embodiment, before positioning the first inertial sensor 10 on the first main surface 33 of the substrate 30 with multiple adhesives 91, multiple solders 81 (for example, claim solder) are pre-applied to multiple electrodes 8 provided on the first main surface 33 of the substrate 30.

[0061] Furthermore, in the second step, after mounting the first inertial sensor 10 on the first main surface 33 of the substrate 30, the substrate 30 on which the first inertial sensor 10 is mounted is rotated 180 degrees (see Figure 5).

[0062] In the third step, as shown in Figure 5, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30. Specifically, in the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the third corner 3 of the second inertial sensor 20 coincides with the first through hole 31 in a plan view of the substrate 30, and the fourth corner 4 of the second inertial sensor 20 coincides with the second through hole 32 in a plan view of the substrate 30.

[0063] In this third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the third corner portion 3 of the second inertial sensor 20 overlaps with the first corner portion 1 of the first inertial sensor 10 in the third direction D3 of the substrate 30. More specifically, in the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the tip 3a of the third corner portion 3 of the second inertial sensor 20 and the tip 1a of the first corner portion 1 of the first inertial sensor 10 coincide in the third direction D3 of the substrate 30. In this embodiment, in order to make the tip 1a of the first corner portion 1 and the tip 3a of the third corner portion 3 coincide, an external imaging device (for example, a camera) is used to make the tip 1a of the first corner portion 1 and the tip 3a of the third corner portion 3 coincide.

[0064] Furthermore, in the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the fourth corner 4 of the second inertial sensor 20 overlaps with the second corner 2 of the first inertial sensor 10 in the third direction D3 of the substrate 30. More specifically, in the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the tip 4a of the fourth corner 4 of the second inertial sensor 20 and the tip 2a of the second corner 2 of the first inertial sensor 10 coincide in the third direction D3 of the substrate 30. In this embodiment, in order to make the tip 2a of the second corner 2 and the tip 4a of the fourth corner 4 coincide, for example, the above-mentioned imaging device is used to make the tip 2a of the second corner 2 and the tip 4a of the fourth corner 4 coincide.

[0065] In the third step, the second inertial sensor 20 is positioned on the second main surface 34 of the substrate 30 with multiple adhesives 92, and then the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 with multiple solders 82 (specifically, mounted using reflow soldering). In this embodiment, before positioning the second inertial sensor 20 on the second main surface 34 of the substrate 30 with multiple adhesives 92, multiple solders 82 (for example, claim solder) are pre-applied to multiple electrodes 9 provided on the second main surface 34 of the substrate 30.

[0066] The above-described manufacturing method is merely one example; the order of each step may be changed as appropriate, and other steps may be added.

[0067] (4) Effects The first corner portion 1 of the first inertial sensor 10 is positioned to overlap with the first through-hole 31 in a plan view of the substrate 30, and the second corner portion 2 of the first inertial sensor 10 is positioned to overlap with the second through-hole 32 in a plan view of the substrate 30.

[0068] Therefore, in sensor module A1, when viewed from the second main surface 34 of the substrate 30, the first corner 1 of the first inertial sensor 10 is exposed through the first through-hole 31 of the substrate 30, and the second corner 2 of the first inertial sensor 10 is exposed through the second through-hole 32 of the substrate 30. That is, in sensor module A1, for example, when mounting the second inertial sensor 20 on the second main surface 34 of the substrate 30, the first corner 1 of the first inertial sensor 10 can be seen from the first through-hole 31, and the second corner 2 of the first inertial sensor 10 can be seen from the second through-hole 32. Thus, in sensor module A1, it becomes easier to align the third corner 3 and fourth corner 4 of the second inertial sensor 20 with the positions of the first corner 1 and second corner 2 of the first inertial sensor 10. As a result, sensor module A1 can improve the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20. In other words, the sensor module A1 can precisely align the detection axes of the first inertial sensor 10 and the second inertial sensor 20.

[0069] Furthermore, in sensor module A1, the first inertial sensor 10 is positioned on the first main surface 33 of the substrate 30, and the second inertial sensor 20 is positioned on the second main surface 34 of the substrate 30. In other words, in sensor module A1, the first inertial sensor 10 and the second inertial sensor 20 are mounted on both sides, which reduces the mounting area of ​​the first inertial sensor 10 and the second inertial sensor 20.

[0070] Therefore, the sensor module A1 can reduce the mounting area of ​​the first inertial sensor 10 and the second inertial sensor 20, and improve the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20.

[0071] The third corner 3 of the second inertial sensor 20 is positioned to overlap with the first through-hole 31 in a plan view of the substrate 30, and the fourth corner 4 of the second inertial sensor 20 is positioned to overlap with the second through-hole 32 in a plan view of the substrate 30. As a result, in sensor module A1, the third corner 3 and fourth corner 4 of the second inertial sensor 20 can be aligned with the positions of the first corner 1 and second corner 2 of the first inertial sensor 10, thereby improving the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20. In other words, in sensor module A1, the detection axes of the first inertial sensor 10 and the second inertial sensor 20 can be aligned with greater precision.

[0072] The first corner 1 of the first inertial sensor 10 and the third corner 3 of the second inertial sensor 20 are positioned to overlap in the third direction (thickness direction) D3 of the substrate 30. The second corner 2 of the first inertial sensor 10 and the fourth corner 4 of the second inertial sensor 20 are positioned to overlap in the third direction D3 of the substrate 30. As a result, in sensor module A1, the first corner 1 of the first inertial sensor 10 and the third corner 3 of the second inertial sensor 20 coincide in a plan view of the substrate 30, and the second corner 2 of the first inertial sensor 10 and the fourth corner 4 of the second inertial sensor 20 coincide in a plan view of the substrate 30, thus further improving the relative positional accuracy of the first inertial sensor 10 and the second inertial sensor 20. In other words, in sensor module A1, the detection axes of the first inertial sensor 10 and the second inertial sensor 20 can be aligned with even greater precision.

[0073] The first detection element 11 and the second detection element 21 are arranged to overlap in the third direction D3 of the substrate 30. This prevents the alignment of the detection axes of the first inertial sensor 10 and the second inertial sensor 20 from shifting when the first detection element 11 and the second detection element 21 move in the same direction (e.g., the third direction D3) due to bending or warping of the substrate 30, for example. In particular, since the first detection element 11 and the second detection element 21 are arranged to overlap in the third direction D3 of the substrate 30 in the sensor module A1, it is possible to further prevent the alignment of the detection axes of the first inertial sensor 10 and the second inertial sensor 20 in the third direction D3 from shifting.

[0074] The first detection element 11 is supported on the first support substrate 13 at a position eccentric to the center of gravity of the first support substrate 13. The second detection element 21 is supported on the second support substrate 23 at a position eccentric to the center of gravity of the second support substrate 23. This allows for greater design flexibility in the sensor module A1 compared to, for example, a case where the first detection element 11 is supported on the first support substrate 13 at the center of gravity of the first support substrate 13, and the second detection element 21 is supported on the second support substrate 23 at the center of gravity of the second support substrate 23.

[0075] The direction in which the inertial force detected by the first inertial sensor 10 is detected is the same as the direction in which the inertial force detected by the second inertial sensor 20 is detected. As a result, in sensor module A1, for example, even if the operation of the first inertial sensor 10 stops, the second inertial sensor 20 can still detect the inertial force of an object. Therefore, sensor module A1 can ensure redundancy of the first inertial sensor 10 and the second inertial sensor 20.

[0076] The first inertial sensor 10 and the substrate 30 are connected by multiple adhesives 91 and multiple solders 81. This allows the sensor module A1 to avoid a decrease in the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20 when, for example, the second inertial sensor 20 is reflow mounted to the second main surface 34 of the substrate 30 with multiple solders 82, by preventing the multiple solders 81 connecting the first inertial sensor 10 and the substrate 30 from melting (a so-called self-alignment effect occurring). In other words, the sensor module A1 can better avoid misalignment of the detection axes of the first inertial sensor 10 and the second inertial sensor 20.

[0077] The second inertial sensor 20 and the substrate 30 are connected by multiple adhesives 92 and multiple solders 82. This makes it possible to better avoid, for example, when reflow mounting the second inertial sensor 20 to the second main surface 34 of the substrate 30 with multiple solders 82 in the sensor module A1, melting of the multiple solders 82 connecting the second inertial sensor 20 and the substrate 30 (a so-called self-alignment effect occurring), which would reduce the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20. In other words, the sensor module A1 can better avoid misalignment of the detection axes of the first inertial sensor 10 and the second inertial sensor 20.

[0078] The manufacturing method for sensor module A1 includes a first step, a second step, and a third step. As a result, sensor module A1 can be manufactured using the above manufacturing method, thereby reducing the mounting area of ​​the first inertial sensor 10 and the second inertial sensor 20, and improving the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20.

[0079] In the above-described manufacturing method, in the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the third corner 3 of the second inertial sensor 20 coincides with the first through hole 31 in a plan view of the substrate 30, and the fourth corner 4 of the second inertial sensor 20 coincides with the second through hole 32 in a plan view of the substrate 30. This makes it possible to further improve the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20 in the above-described manufacturing method.

[0080] Furthermore, in the above-described manufacturing method, in the second step, the first inertial sensor 10 is mounted on the first main surface 33 of the substrate 30 with multiple solders 81. In the third step, the second inertial sensor 20 is positioned on the second main surface 34 of the substrate 30 with multiple adhesives 91, and then mounted on the second main surface 34 of the substrate 30 with multiple solders 82. This makes it possible to avoid a decrease in the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20 in the above-described manufacturing method.

[0081] Furthermore, in the above-described manufacturing method, in the second step, before mounting the first inertial sensor 10 to the first main surface 33 of the substrate 30 with multiple solders 81, the first inertial sensor 10 is positioned on the first main surface 33 of the substrate 30 with multiple adhesives 92. This makes it possible to better avoid a decrease in the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20 in the above-described manufacturing method.

[0082] (5) Variant Sensor module A1 is equipped with two inertial sensors (first inertial sensor 10 and second inertial sensor 20), but it may be equipped with three or more inertial sensors.

[0083] One inertial sensor (first inertial sensor 10) is placed on the first main surface 33 of the substrate 30, but multiple inertial sensors may be placed there. In other words, it is sufficient that at least one inertial sensor is placed on the first main surface 33 of the substrate 30.

[0084] One inertial sensor (second inertial sensor 20) is placed on the second main surface 34 of the substrate 30, but multiple inertial sensors may be placed there. In other words, it is sufficient that at least one inertial sensor is placed on the second main surface 34 of the substrate 30.

[0085] The substrate 30 is rectangular in shape, but may have other shapes. For example, the substrate 30 may be hexagonal. If the substrate 30 is hexagonal, the first through-hole 31 and the second through-hole 32 are provided, for example, on the diagonals of the substrate 30. Alternatively, the substrate 30 may be disc-shaped. If the substrate 30 is disc-shaped, the first through-hole 31 and the second through-hole 32 are provided, for example, on the diameter of the substrate 30.

[0086] The first through-hole 31 has a rectangular shape in a plan view of the substrate 30, but it may have a shape other than a rectangle. For example, the first through-hole 31 may have a circular or elliptical shape in a plan view of the substrate 30. The second through-hole 32 has a rectangular shape in a plan view of the substrate 30, but it may have a shape other than a rectangle. For example, the second through-hole 32 may have a circular or elliptical shape in a plan view of the substrate 30.

[0087] In this embodiment, the first inertial sensor 10 has a first cover 14, but it may not have a first cover 14. In this embodiment, the second inertial sensor 20 has a second cover 24, but it may not have a second cover 24.

[0088] The first processing unit 12 is electrically connected to the first support substrate 13 by soldering, but it may be electrically connected to the first support substrate 13 by means other than soldering. The first processing unit 12 may be electrically connected to the first support substrate 13 by means of wire bonding, for example. The first detection element 11 is electrically connected to the first processing unit 12 by soldering, but it may be electrically connected to the first processing unit 12 by means other than soldering. The first detection element 11 may be electrically connected to the first processing unit 12 by means of wire bonding, for example.

[0089] The second processing unit 22 is electrically connected to the second support substrate 23 by soldering, but it may be electrically connected to the second support substrate 23 by means other than soldering. The second processing unit 22 may be electrically connected to the second support substrate 23 by, for example, wire bonding. The second detection element 21 is electrically connected to the second processing unit 22 by soldering, but it may be electrically connected to the second processing unit 22 by means other than soldering. The second detection element 21 may be electrically connected to the second processing unit 22 by, for example, wire bonding.

[0090] The first detection element 11 is supported on the first support substrate 13 at a position eccentric to the center of gravity of the first support substrate 13, but it may also be supported on the first support substrate 13 at a position such as the center of gravity of the first support substrate 13. Similarly, the second detection element 21 is supported on the second support substrate 23 at a position eccentric to the center of gravity of the second support substrate 23, but it may also be supported on the second support substrate 23 at a position such as the center of gravity of the second support substrate 23.

[0091] In the manufacturing method of sensor module A1, the first step involves forming a first through-hole 31 and a second through-hole 32 in the substrate 30. However, the first through-hole 31 and the second through-hole 32 may be pre-formed in the substrate 30. In this case, the manufacturing method of sensor module A1 does not include the first step.

[0092] In the second step, the first inertial sensor 10 is positioned on the first main surface 33 of the substrate 30 with multiple adhesives 91, and then mounted on the first main surface 33 of the substrate 30 with multiple solders 81. However, the first inertial sensor 10 may be mounted on the first main surface 33 of the substrate 30 with multiple solders 81 without positioning it on the first main surface 33 of the substrate 30 with multiple adhesives 91.

[0093] (Embodiment 2) The sensor module A2 according to Embodiment 2 (see Figure 6) differs from the sensor module A1 according to Embodiment 1 in that the size of the second inertial sensor 20 is different. Regarding the sensor module A2 according to Embodiment 2, components similar to those in the sensor module A1 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0094] The sensor module A2 according to Embodiment 2 will be described below with reference to Figures 6 and 7.

[0095] (1) Sensor module The size of the second inertial sensor 20 is smaller than the size of the first inertial sensor 10. More specifically, the surface area of ​​the second inertial sensor 20 in a plan view of the substrate 30 is smaller than the surface area of ​​the first inertial sensor 10 in a plan view of the substrate 30.

[0096] The third corner portion 3 of the second inertial sensor 20 does not overlap with the first through-hole 31 in a plan view of the substrate 30. More specifically, the tip 3a of the third corner portion 3 is not located in the first through-hole 31 in a plan view of the substrate 30.

[0097] The fourth corner 4 of the second inertial sensor 20 does not overlap with the second through-hole 32 in a plan view of the substrate 30. More specifically, the tip 4a of the fourth corner 4 is not located in the second through-hole 32 in a plan view of the substrate 30.

[0098] In other words, in a plan view of the substrate 30, the length W1 of the diagonal connecting the first corner 1 and the second corner 2 of the first inertial sensor 10 is longer than the length W2 of the diagonal connecting the third corner 3 and the fourth corner 4 of the second inertial sensor 20 in a plan view of the substrate 30. As a result, the sensor module A2 of Embodiment 2 offers greater design flexibility than the sensor module A1 of Embodiment 1. For example, in sensor module A2, the second inertial sensor 20 and other electronic components can be arranged on the second main surface 34 of the substrate 30.

[0099] (2) Method for manufacturing the sensor module The manufacturing method for the sensor module A2 of Embodiment 2 includes a first step, a second step, and a third step, similar to the sensor module A1 of Embodiment 1. In the first step, a first through hole 31 and a second through hole 32 are formed in the substrate 30. In the second step, the first inertial sensor 10 is mounted on the first main surface 33 of the substrate 30. In the third step, the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30.

[0100] In the manufacturing method of sensor module A2, when mounting the second inertial sensor 20 of Embodiment 2 on the second main surface 34 of the substrate 30, the first mounting reference Z1 is defined as a straight line along the third direction D3 at the first corner 1 of the first inertial sensor 10, and the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the tip 3a of the third corner 3 of the second inertial sensor 20 coincides with a position Z3 at a first predetermined distance K1 away from the first mounting reference Z1 (hereinafter referred to as the "mounting position of the third corner 3").

[0101] Furthermore, in the manufacturing method of the sensor module A2, when mounting the second inertial sensor 20 on the second main surface 34 of the substrate 30, the second mounting reference Z2 is defined as a straight line along the third direction D3 at the second corner 2 of the first inertial sensor 10, and the second inertial sensor 20 is mounted on the second main surface 34 of the substrate 30 such that the tip 4a of the fourth corner 4 of the second inertial sensor 20 coincides with a position Z4 located at a second predetermined distance K2 away from the second mounting reference Z2 (hereinafter referred to as the "mounting position of the fourth corner 4").

[0102] Therefore, in the manufacturing method of sensor module A2 of Embodiment 2, even if the size of the second inertial sensor 20 is smaller than the size of the first inertial sensor 10, when mounting the second inertial sensor 20 on the second main surface 34 of the substrate 30, the first corner 1 of the first inertial sensor 10 can be seen from the first through hole 31 and the second corner 2 of the first inertial sensor 10 can be seen from the second through hole 32, similar to the manufacturing method of sensor module A1 of Embodiment 1. This improves the relative positional accuracy between the first inertial sensor 10 and the second inertial sensor 20.

[0103] (Embodiment 3) The sensor module A3 according to Embodiment 3 (see Figure 8) differs from the sensor module A1 according to Embodiment 1 in that it further includes a housing 40. Regarding the sensor module A3 according to Embodiment 3, components similar to those in the sensor module A1 according to Embodiment 1 are denoted by the same reference numerals and their descriptions are omitted.

[0104] The sensor module A3 according to Embodiment 3 will be described below with reference to Figures 8 and 9.

[0105] (1) Sensor module As shown in Figure 8, the sensor module A3 further comprises a housing 40. The housing 40 has a first housing 40a and a second housing 40b. Note that Figure 8 is a cross-sectional view taken along line AA of Figure 9.

[0106] The first housing 40a includes, for example, a first wall portion 41, a first sealing plate 44, and a plurality of first connecting portions 47. Note that in Figure 9, the first sealing plate 44 has been removed.

[0107] The first wall portion 41 surrounds the first inertial sensor 10 and is positioned on the first main surface 33 of the substrate 30. The shape of the first wall portion 41 is, for example, frame-like (for example, rectangular frame-like). The material of the first wall portion 41 is, for example, resin.

[0108] The first sealing plate 44 seals the first inertial sensor 10 together with the first wall portion 41. The shape of the first sealing plate 44 is, for example, a plate (for example, a rectangular plate). The material of the first sealing plate 44 is, for example, metal.

[0109] Multiple first connecting portions 47 are arranged on one end face 41a of the first wall portion 41 in the third direction D3. The material of each of the multiple first connecting portions 47 is, for example, metal. Each of the multiple first connecting portions 47 is connected (joined) to the first sealing plate 44 by, for example, welding. Note that the multiple first connecting portions 47 are not shown in Figure 9.

[0110] The second housing 40b includes, for example, a second wall portion 42, a second sealing plate 45, a protruding portion 43, and a plurality of second connecting portions (not shown). Note that in Figure 9, the second sealing plate 45 has been removed.

[0111] The second wall portion 42 surrounds the second inertial sensor 20 and is positioned on the second main surface 34 of the substrate 30. The shape of the second wall portion 42 is, for example, frame-like (for example, rectangular frame-like). The material of the second wall portion 42 is, for example, resin. The size of the second wall portion 42 in a plan view of the substrate 30 is the same as the size of the first wall portion 41 in a plan view of the substrate 30.

[0112] Furthermore, the statement "the size of the second wall portion 42 in a plan view of the substrate 30 is the same as the size of the first wall portion 41 in a plan view of the substrate 30" is not limited to cases where the size of the second wall portion 42 and the size of the first wall portion 41 are exactly the same, but also includes cases where the difference (absolute value of the difference) between the size of the second wall portion 42 and the size of the first wall portion 41 is less than or equal to a predetermined value (first predetermined value). For example, this also includes cases where the difference between the size of the second wall portion 42 and the size of the first wall portion 41 is 10% or less of the size of the first wall portion 41.

[0113] The second sealing plate 45 seals the second inertial sensor 20 together with the second wall portion 42. The shape of the second sealing plate 45 is, for example, plate-like (for example, rectangular plate-like). The material of the second sealing plate 45 is, for example, metal. The surface area of ​​the second sealing plate 45 in a plan view of the substrate 30 is smaller than the surface area of ​​the first sealing plate 44 in a plan view of the substrate 30.

[0114] The protruding portion 43 surrounds the periphery of the second sealing plate 45 and protrudes from the second wall portion 42. For example, the protruding portion 43 surrounds the periphery of the second sealing plate 45 and protrudes from a portion (outer peripheral surface) of one end face 46 in the third direction D3 of the second wall portion 42. The protruding portion 43 is also continuously integrated with the second wall portion 42. The shape of the protruding portion 43 is, for example, frame-shaped (for example, rectangular frame-shaped). The material of the protruding portion 43 is, for example, resin.

[0115] The protruding portion 43 has multiple electrodes 5 provided on the end face 43a opposite to the second wall portion 42. These multiple electrodes 5 are, for example, electrodes for mounting the sensor module A3 onto an external substrate (not shown).

[0116] Multiple second connecting portions are arranged on the inner circumferential surface 46a of the end face 46 of the second wall portion 42, excluding the outer circumferential surface. The material of each of the multiple second connecting portions is, for example, metal. Each of the multiple second connecting portions is connected (joined) to the second sealing plate 45 by, for example, welding. Note that the illustration of the multiple second connecting portions is omitted in Figure 9. Furthermore, the inner circumferential surface 46a of the end face 46 of the second wall portion 42 represents the portion of the end face 46 of the second wall portion 42 where no protrusions 43 exist, that is, the portion of the second wall portion 42 where no protrusions 43 are provided.

[0117] Here, the second sealing plate 45 is positioned on the end face 46 of the second wall portion 42 such that the second sealing plate 45 is in contact with the inner circumferential surface 46a of the end face 46 of the second wall portion 42. In other words, the second sealing plate 45 is positioned in the portion of the second wall portion 42 where no protrusions 43 are provided.

[0118] As shown in Figures 8 and 9, the outer edges of the substrate 30 in a plan view coincide with the first wall portion 41, the second wall portion 42, and the protruding portion 43.

[0119] The width dimension W4 in the second direction D2 of the second wall section 42 is the same as the width dimension W3 in the first wall section 41 in the second direction D2. Note that "the width dimension W4 of the second wall section 42 is the same as the width dimension W3 of the first wall section 41" does not only mean that the width dimension W4 of the second wall section 42 and the width dimension W3 of the first wall section 41 are exactly the same, but also includes cases where the difference (absolute value of the difference) between the width dimension W4 of the second wall section 42 and the width dimension W3 of the first wall section 41 is less than or equal to a predetermined value (second predetermined value). For example, this also includes cases where the difference between the width dimension W4 of the second wall section 42 and the width dimension W3 of the first wall section 41 is 10% or less of the width dimension W3 of the first wall section 41.

[0120] The width dimension W5 in the second direction D2 of the protruding portion 43 is smaller than the width dimension W4 of the second wall portion 42.

[0121] The height dimension L2 from the end face 43a of the protruding portion 43 to the second main surface 34 of the substrate 30 is greater than the height dimension L1 from the first main surface 33 of the substrate 30 to one surface (top surface) of the first sealing plate 44.

[0122] (2) Effects Sensor module A3 further comprises a housing 40. The protruding portion 43 has multiple electrodes 5 provided on the end face 43a opposite to the second wall portion 42. As a result, in sensor module A3 of embodiment 3, the first inertial sensor 10 and the second inertial sensor 20 are sealed in the housing 40, thus improving reliability compared to sensor module A1 of embodiment 1. Furthermore, in sensor module A3 of embodiment 3, since multiple electrodes 5 are provided on the end face 43a of the protruding portion 43, sensor module A3 can be mounted on the external substrate.

[0123] The second sealing plate 45 is positioned in the portion of the second wall portion 42 where the protrusion 43 is not provided (the inner circumferential surface 46a of the end face 46 of the second wall portion 42). This allows the sensor module A3 to have a smaller dimension in the third direction D3 (height direction). In other words, the sensor module A3 can be made lower in profile.

[0124] The height dimension L2 from the end face 43a of the protrusion 43 to the second main surface 34 of the substrate 30 is greater than the height dimension L1 from the first main surface 33 of the substrate 30 to the first sealing plate 44. As a result, in the sensor module A3, for example, when the sensor module A3 is mounted on the external substrate, it is possible to avoid stress being applied to the housing 40 due to the heat generated on the external substrate. In other words, the sensor module A3 can avoid the effects of heat generated on the external substrate (for example, expansion and contraction of the housing 40).

[0125] (3) Variant The shape of the first wall portion 41 is rectangular, but it may be a shape other than a rectangular frame. For example, the shape of the first wall portion 41 may be an annular shape. The shape of the first sealing plate 44 is rectangular, but it may be a shape other than a rectangular plate. For example, the shape of the first sealing plate 44 may be a disc shape. The shape of the second wall portion 42 is rectangular, but it may be a shape other than a rectangular frame. For example, the shape of the second wall portion 42 may be an annular shape. The shape of the second sealing plate 45 is rectangular, but it may be a shape other than a rectangular plate. For example, the shape of the second sealing plate 45 may be a disc shape. The shape of the protrusion portion 43 is rectangular, but it may be a shape other than a rectangular frame. For example, the shape of the protrusion portion 43 may be an annular shape.

[0126] In this embodiment, the first housing 40a includes a plurality of first connecting portions 47, but it does not have to include a plurality of first connecting portions 47. In this case, the material of the first sealing plate 44 is resin, and the first sealing plate 44 and the first wall portion 41 are formed as a continuous, integrated unit.

[0127] In this embodiment, the second housing 40b includes a plurality of second connecting parts, but it does not have to include a plurality of second connecting parts. In this case, the material of the second sealing plate 45 is resin, and the second sealing plate 45, the second wall portion 42, and the protruding portion 43 are formed as a continuous, integrated unit.

[0128] The protruding portion 43 is configured to be continuous and integral with the second wall portion 42, but for example, the protruding portion 43 and the second wall portion 42 may be configured separately and then combined to form an integral structure.

[0129] (Aspect) This specification discloses the following aspects:

[0130] The sensor modules (A1 to A3) according to the first embodiment include a substrate (30), a first inertial sensor (10), and a second inertial sensor (20). The substrate (30) includes a first main surface (33) and a second main surface (34) facing each other. The first inertial sensor (10) is positioned on the first main surface (33) and detects the inertial force of an object. The second inertial sensor (20) is positioned on the second main surface (34) and detects the above inertial force. Each of the first inertial sensor (10) and the second inertial sensor (20) has a rectangular shape when viewed from the thickness direction (D3) of the substrate (30). The substrate (30) has a first through hole (31) and a second through hole (32). The first through hole (31) penetrates the substrate (30) in the thickness direction (D3). The second through-hole (32) is located at a different position from the first through-hole (31) and penetrates in the thickness direction (D3). The first inertial sensor (10) has a first corner portion (1) in a plan view from the thickness direction (D3) of the substrate (30) and a second corner portion (2) located diagonally opposite to the first corner portion (1) in the plan view. The first corner portion (1) is positioned to overlap with the first through-hole (31) in the plan view. The second corner portion (2) is positioned to overlap with the second through-hole (32) in the plan view.

[0131] According to this embodiment, the mounting area of ​​the first inertial sensor (10) and the second inertial sensor (20) can be reduced, and the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20) can be improved.

[0132] In the second embodiment, the sensor modules (A1, A3) have, in the first embodiment, a second inertial sensor (20) having a third corner portion (3) in a plan view from the thickness direction (D3) of the substrate (30), and a fourth corner portion (4) located diagonally opposite to the third corner portion (3) in the plan view. The third corner portion (3) is positioned to overlap with the first through hole (31) in the plan view. The fourth corner portion (4) is positioned to overlap with the second through hole (32) in the plan view.

[0133] According to this embodiment, the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20) can be further improved.

[0134] In the third embodiment, the sensor modules (A1, A3) are positioned such that the first corner (1) and the third corner (3) overlap in the thickness direction (D3) of the substrate (30). The second corner (2) and the fourth corner (4) overlap in the thickness direction (D3).

[0135] According to this embodiment, the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20) can be further improved.

[0136] The sensor modules (A1 to A3) according to the fourth embodiment include, in any one of the first to third embodiments, a first inertial sensor (10) comprising a first detection element (11), a first processing unit (12), and a first support substrate (13). The first processing unit (12) receives the detection result of the first detection element (11). The first support substrate (13) supports the first processing unit (12) and the first detection element (11). The second inertial sensor (20) comprises a second detection element (21), a second processing unit (22), and a second support substrate (23). The second processing unit (22) receives the detection result of the second detection element (21). The second support substrate (23) supports the second processing unit (22) and the second detection element (21). The first detection element (11) and the second detection element (21) are arranged to overlap in the thickness direction (D3) of the substrate (30).

[0137] According to this embodiment, it is possible to avoid misalignment of the detection axes of the first inertial sensor (10) and the second inertial sensor (20).

[0138] In the fifth embodiment, the sensor modules (A1 to A3) are such that, in the fourth embodiment, the first support substrate (13) and the second support substrate (23) each have a rectangular plate shape. The first detection element (11) is supported on the first support substrate (13) at a position eccentric to the center of gravity of the first support substrate (13). The second detection element (21) is supported on the second support substrate (23) at a position eccentric to the center of gravity of the second support substrate (23).

[0139] This embodiment allows for increased design flexibility.

[0140] In the sixth embodiment, the sensor modules (A1 to A3) are configured such that, in any one of the first to fifth embodiments, the detection direction of the inertial force detected by the first inertial sensor (10) is the same as the detection direction of the inertial force detected by the second inertial sensor (20).

[0141] According to this embodiment, redundancy of the first inertial sensor (10) and the second inertial sensor (20) can be ensured.

[0142] In the sensor modules (A1 to A3) according to the seventh embodiment, in any one of the first to sixth embodiments, the first inertial sensor (10) and the substrate (30) are connected by adhesive (91) and solder (81).

[0143] According to this embodiment, it is possible to avoid a decrease in the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20).

[0144] In the sensor modules (A1 to A3) according to the eighth embodiment, the second inertial sensor (20) and the substrate (30) are connected by a second adhesive (92) which is different from the first adhesive (91), and by a second solder (82) which is different from the first solder (81), which is the solder (81).

[0145] According to this embodiment, it is possible to better avoid a decrease in the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20).

[0146] In the sensor module (A2) according to the ninth embodiment, in any one of the second to eighth embodiments, the length of the diagonal (W1) connecting the first corner (1) and the second corner (2) of the first inertial sensor (10) in a plan view from the thickness direction (D3) of the substrate (30) is longer than the length of the diagonal (W2) connecting the third corner (3) and the fourth corner (4) of the second inertial sensor (20) in the same plan view.

[0147] This configuration allows for greater design flexibility.

[0148] The sensor module (A3) according to the tenth embodiment further comprises, in any one of the first to ninth embodiments, a first wall portion (41), a first sealing plate (44), a second wall portion (42), a second sealing plate (45), and a protruding portion (43). The first wall portion (41) surrounds the first inertial sensor (10) and is located on the first main surface (33) of the substrate (30). The first sealing plate (44) seals the first inertial sensor (10) together with the first wall portion (41). The second wall portion (42) surrounds the second inertial sensor (20) and is located on the second main surface (34) of the substrate (30). The second sealing plate (45) seals the second inertial sensor (20) together with the second wall portion (42). The protruding portion (43) surrounds the periphery of the second sealing plate (45) and protrudes from the second wall portion (42). The outer edges of the first wall portion (41), the second wall portion (42), and the protruding portion (43) coincide in a plan view from the thickness direction (D3) of the substrate (30). The width dimension (W4) of the second wall portion (42) in one direction (D2) perpendicular to the thickness direction (D3) of the substrate (30) is the same as the width dimension (W3) of the first wall portion (41) in one direction (D2). The width dimension (W5) of the protruding portion (43) in one direction (D2) is smaller than the width dimension (W4) of the second wall portion (42). An electrode (5) is provided on the end face (43a) of the protruding portion (43) opposite to the second wall portion (42).

[0149] According to this embodiment, reliability can be improved.

[0150] In the 11th embodiment, the sensor module (A3) is arranged in the 10th embodiment in which the second sealing plate (45) is located in the portion (46a) of the second wall portion (42) where the protruding portion (43) is not provided.

[0151] This embodiment allows for a reduction in height.

[0152] In the sensor module (A3) according to the twelfth embodiment, in the tenth embodiment, the height dimension (L2) from the end face (43a) of the protrusion (43) to the second main surface (34) of the substrate (30) is greater than the height dimension (L1) from the first main surface (33) of the substrate (30) to the first sealing plate (44).

[0153] According to this embodiment, for example, it is possible to avoid the effects of heat generated on the external substrate.

[0154] A manufacturing method according to the 13th embodiment is a method for manufacturing sensor modules (A1 to A3). The manufacturing method includes a first step, a second step, and a third step. In the first step, a first through hole (31) and a second through hole (32) are formed in a substrate (30). The substrate (30) includes a first main surface (33) and a second main surface (34) that face each other. In the second step, a first inertial sensor (10) is mounted on the first main surface (33) of the substrate (30). The first inertial sensor (10) has a rectangular shape when viewed from the thickness direction (D3) of the substrate (30). In the third step, a second inertial sensor (20) is mounted on the second main surface (34) of the substrate (30). The second inertial sensor (20) has a rectangular shape when viewed from the above-mentioned plan view. In the first step, a first through-hole (31) is formed in the substrate (30) such that the first through-hole (31) penetrates in the thickness direction (D3) of the substrate (30). In the first step, a second through-hole (32) is formed in the substrate (30) such that the second through-hole (32) is located at a different position from the first through-hole (31) and penetrates in the thickness direction (D3). In the second step, the first inertial sensor (10) is mounted on the first main surface (33) of the substrate (30) such that the first corner portion (1) of the first inertial sensor (10) in a plan view coincides with the first through-hole (31) in the plan view, and the second corner portion (2), which is diagonally opposite the first corner portion (1) in the plan view, coincides with the second through-hole (32) in the plan view.

[0155] According to this embodiment, the mounting area of ​​the first inertial sensor (10) and the second inertial sensor (20) can be reduced, and the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20) can be improved.

[0156] The manufacturing method according to the 14th embodiment is, in the 13th embodiment, mounted on the second main surface (34) of the substrate (30) in the third step such that the third corner portion (3) of the second inertial sensor (20) in a plan view of the second inertial sensor (20) coincides with the first through hole (31) in the plan view, and the fourth corner portion (4) which is diagonally opposite to the third corner portion (3) in the plan view coincides with the second through hole (32) in the plan view.

[0157] According to this embodiment, the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20) can be further improved.

[0158] The manufacturing method according to the 15th embodiment is as follows: In the 13th or 14th embodiment, in the second step, the first inertial sensor (10) is mounted on the first main surface (33) of the substrate (30) with first solder (81). In the third step, the second inertial sensor (20) is positioned on the second main surface (34) of the substrate (30) with adhesive (92), and then the second inertial sensor (20) is mounted on the second main surface (34) of the substrate (30) with second solder (82).

[0159] According to this embodiment, it is possible to avoid a decrease in the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20).

[0160] The manufacturing method according to the 16th embodiment, in the 15th embodiment, in the second step, before mounting the first inertial sensor (10) to the first main surface (33) of the substrate (30) with the first solder (81), the first inertial sensor (10) is positioned on the first main surface (33) of the substrate (30) with a second adhesive (91) which is different from the first adhesive (92), which is the adhesive (92).

[0161] According to this embodiment, it is possible to better avoid a decrease in the relative positional accuracy between the first inertial sensor (10) and the second inertial sensor (20). [Explanation of Symbols]

[0162] 1 1st corner 2 Second corner 3 Third corner 4 4th corner 5 electrodes 10. First Inertial Sensor (Inertial Sensor) 11. Relevant to the first detection 12 First Processing Unit 13 First support board 20. Second inertial sensor (inertial sensor) 21 Second detection related 22 Second Processing Unit 23 Second support board 30 circuit boards 31 First through hole 32 Second through hole 33 First Main Surface 34 Second Main Surface 41 1st wall 42 2nd wall section 43 Protrusion 43a End face 44 1st sealing plate 45 Second sealing plate 46a Inner circumferential surface (the portion of the second wall where no protrusions are provided) 81 Solder 82 Solder 91 Adhesive 92 Adhesives A1-A3 Sensor Modules D2 Second direction (one direction perpendicular to the thickness direction) D3 Third direction (thickness direction) L1 Height Dimension L2 Height Dimension W1 Diagonal length W2 is the length of the diagonal. W3 Width Dimension W4 width dimension W5 Width Dimension

Claims

1. A substrate including a first main surface and a second main surface facing each other, A first inertial sensor is arranged on the first main surface and detects the inertial force of an object, The system comprises a second inertial sensor disposed on the second main surface for detecting the inertial force, Each of the first and second inertial sensors has a rectangular shape when viewed in plan from the thickness direction of the substrate. The aforementioned substrate is A first through-hole that penetrates the substrate in the thickness direction, It has a second through-hole provided at a different position from the first through-hole and penetrating in the thickness direction, The first inertial sensor is, The first corner portion of the substrate in the plan view from the thickness direction, In the plan view, it has a second corner located diagonally to the first corner, The first corner portion is positioned so as to overlap with the first through hole in the plan view. The second corner portion is positioned so as to overlap with the second through-hole in the plan view. Sensor module.

2. The second inertial sensor is, The third corner portion of the substrate in the plan view from the thickness direction, In the plan view, it has a fourth corner located diagonally to the third corner, The third corner portion is positioned so as to overlap with the first through hole in the plan view. The fourth corner is positioned so as to overlap with the second through-hole in the plan view. The sensor module according to claim 1.

3. The first corner and the third corner are positioned to overlap in the thickness direction of the substrate, The second corner and the fourth corner are positioned to overlap in the thickness direction. The sensor module according to claim 2.

4. The first inertial sensor is, First detection element, A first processing unit that receives the detection result of the first detection element, The first processing unit and the first support substrate supporting the first detection element are included, The second inertial sensor is, The second detection element, A second processing unit that receives the detection result of the second detection element, The second processing unit and the second support substrate supporting the second detection element are included, The first detection element and the second detection element are arranged so as to overlap in the thickness direction of the substrate. A sensor module according to any one of claims 1 to 3.

5. Each of the first support substrate and the second support substrate has a rectangular plate shape, The first detection element is supported on the first support substrate at a position eccentric to the center of gravity of the first support substrate. The second detection element is supported on the second support substrate at a position eccentric to the center of gravity of the second support substrate. The sensor module according to claim 4.

6. The detection direction of the inertial force detected by the first inertial sensor is the same as the detection direction of the inertial force detected by the second inertial sensor. A sensor module according to any one of claims 1 to 3.

7. The first inertial sensor and the substrate are connected by adhesive and solder. A sensor module according to any one of claims 1 to 3.

8. The second inertial sensor and the substrate are connected by a second adhesive different from the first adhesive, and a second solder different from the first solder. The sensor module according to claim 7.

9. In the plan view of the substrate from the thickness direction, the length of the diagonal connecting the first corner and the second corner of the first inertial sensor is longer than the length of the diagonal connecting the third corner and the fourth corner of the second inertial sensor in the plan view. A sensor module according to either claim 2 or claim 3.

10. A first wall portion surrounds the first inertial sensor and is located on the first main surface of the substrate, A first sealing plate that seals the first inertial sensor with the first wall portion, A second wall portion surrounds the second inertial sensor and is located on the second main surface of the substrate, A second sealing plate that seals the second inertial sensor with the second wall portion, The second sealing plate further comprises a projection that surrounds the periphery of the second wall and protrudes from the second wall, The first wall portion, the second wall portion, and the protruding portion each coincide with the outer peripheral edge of the substrate in the plan view from the thickness direction, The width dimension in one direction perpendicular to the thickness direction of the substrate in the second wall portion is the same as the width dimension in one direction in the first wall portion. The width dimension in one direction of the protruding portion is smaller than the width dimension of the second wall portion. The aforementioned protrusion has an electrode provided on the end face opposite to the second wall portion. A sensor module according to any one of claims 1 to 3.

11. The second sealing plate is positioned in the portion of the second wall where the protrusion is not provided. The sensor module according to claim 10.

12. The height dimension from the end face of the protrusion to the second main surface of the substrate is greater than the height dimension from the first main surface of the substrate to the first sealing plate. The sensor module according to claim 10.

13. A method for manufacturing a sensor module, A first step of forming a first through-hole and a second through-hole in a substrate including a first main surface and a second main surface facing each other, A second step involves mounting a first inertial sensor, which has a rectangular shape in a plan view from the thickness direction of the substrate, on the first main surface of the substrate. The third step includes mounting a second inertial sensor, which has a rectangular shape in plan view, on the second main surface of the substrate, In the first step described above, The first through-hole is formed in the substrate so that it penetrates in the thickness direction of the substrate. The second through-hole is formed in the substrate such that it is located at a different position from the first through-hole and that it penetrates in the thickness direction. In the second step, the first inertial sensor is mounted on the first main surface of the substrate such that the first corner of the first inertial sensor in a plan view coincides with the first through-hole in a plan view, and the second corner located diagonally opposite the first corner in a plan view coincides with the second through-hole in a plan view. Manufacturing method.

14. In the third step, the second inertial sensor is mounted on the second main surface of the substrate such that the third corner of the second inertial sensor in a plan view coincides with the first through-hole in a plan view, and the fourth corner, which is diagonally opposite the third corner in a plan view, coincides with the second through-hole in a plan view. The manufacturing method according to claim 13.

15. In the second step, the first inertial sensor is mounted on the first main surface of the substrate with first solder, In the third step, the second inertial sensor is positioned on the second main surface of the substrate with adhesive, and then the second inertial sensor is mounted on the second main surface of the substrate with second solder. The manufacturing method according to claim 13 or claim 14.

16. In the second step, before mounting the first inertial sensor to the first main surface of the substrate with the first solder, the first inertial sensor is positioned on the first main surface of the substrate with a second adhesive different from the first adhesive, which is the adhesive. The manufacturing method according to claim 15.

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