Printed circuit boards and connectors

Abstract

To provide a printed circuit board that can achieve both strong bonding strength and precise positional accuracy for multiple terminal sections. [Solution] A printed circuit board according to one aspect of the present disclosure comprises a plurality of pad portions arranged in parallel, wherein the plurality of pad portions includes a plurality of first pads having a first area and two or more second pads having an area smaller than the first area, and at least two of the second pads are arranged with one or more of the first pads in between.

Description

Technical Field

[0005] , , [Figure 5] , [Figure 4] , [Figure 3] , [Figure 2]

[0001] The present disclosure relates to a printed wiring board and a connector.

Background Art

[0002] Printed wiring boards having a plurality of pad portions arranged in parallel are widespread (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] A printed wiring board according to one aspect of the present disclosure includes a plurality of pad portions arranged in parallel, and the plurality of pad portions include a plurality of first pads having a first area and two or more second pads having an area smaller than the first area, and at least two of the second pads are arranged with one or more of the first pads interposed therebetween.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a plan view showing a printed wiring board according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view showing a connector between the printed wiring board of FIG. 1 and an electronic component. [Figure 3] FIG. 3 is a plan view showing the arrangement relationship between the pad portion and the terminal portion in the connector of FIG. 2. [Figure 4] FIG. 4 is a cross-sectional view showing a cross-section of the IV-IV line in the connector of FIG. 2. [Figure 5] FIG. 5 is a cross-sectional view showing a cross-section of the V-V line in the connector of FIG. 2.

Modes for Carrying Out the Invention

[0006] [Issues this disclosure aims to address] Patent Document 1 describes soldering a plurality of pad portions arranged in parallel to a plurality of terminal portions provided on an electronic component in a one-to-one correspondence.

[0007] When soldering multiple pads to multiple terminals in a one-to-one ratio, increasing the size of the solder fillet is effective in increasing the strength of the joint. To increase the size of the solder fillet, one can consider increasing the contact area between the pad and the solder fillet.

[0008] However, according to this embodiment, when soldering, the terminal portion tends to move on the pad portion, reducing the positional accuracy between the pad portion and the terminal portion.

[0009] Thus, there is a trade-off relationship between the bonding strength between multiple pad sections and multiple terminal sections and the positional accuracy between multiple pad sections and multiple terminal sections.

[0010] This disclosure is made based on the circumstances described above and aims to provide a printed circuit board that can achieve both bonding strength and positional accuracy for multiple terminal sections.

[0011] [Effects of this disclosure] A printed circuit board according to one aspect of this disclosure can achieve both bonding strength and positional accuracy for multiple terminal portions.

[0012] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described.

[0013] (1) A printed circuit board according to one aspect of the present disclosure comprises a plurality of pad portions arranged in parallel, wherein the plurality of pad portions includes a plurality of first pads having a first area and two or more second pads having an area smaller than the first area, and at least two of the second pads are arranged with one or more of the first pads in between.

[0014] Since the printed circuit board has a plurality of first pads having a first area, sufficient bonding strength with multiple terminal portions can be maintained. Furthermore, since the printed circuit board has second pads with a smaller area than the first pads, the terminal portions soldered to the second pads are aligned with the second pads by a self-alignment effect. In this case, since at least two of the second pads are arranged with one or more of the first pads in between, it becomes easy to align the multiple terminal portions soldered to these pad portions with respect to the entire plurality of pad portions. Therefore, the printed circuit board can achieve both bonding strength and positional accuracy with respect to multiple terminal portions.

[0015] (2) In (1) above, the number of the second pads may be 2. According to this embodiment, the joint strength between the multiple pads and the multiple terminals can be increased while maintaining the positional accuracy between the multiple pads and the multiple terminals.

[0016] (3) In (1) or (2) above, the second pads may be arranged at both ends in the parallel direction of the plurality of pad portions. According to this embodiment, the plurality of terminal portions that are soldered to the plurality of pad portions can be easily and accurately aligned with respect to the entire plurality of pad portions.

[0017] (4) In any of (1) to (3) above, the areas of at least two of the second pads may be equal. According to this embodiment, it is easier to control the position of the multiple terminals with respect to the entirety of the multiple pads.

[0018] (5) In any one of (1) to (4) above, the plurality of pad portions are rectangular in a plan view with the parallel direction being the short side, and the long side of the second pad may be shorter than the long side of the first pad. According to this aspect, it is possible to improve the positional accuracy between the plurality of pad portions and the plurality of terminal portions while preventing the pitch of the plurality of pad portions from becoming large.

[0019] (6) In (5) above, the first short sides of the plurality of pad portions may be arranged on the same straight line. According to this aspect, it is easier to further improve the positional accuracy between the plurality of pad portions and the plurality of terminal portions.

[0020] (7) In (5) or (6) above, the lengths of the short sides in the plurality of pad portions may be equal. According to this aspect, it is easy to reduce the pitch of the plurality of pad portions, and it is possible to more easily improve the positional accuracy between the plurality of pad portions and the plurality of terminal portions.

[0021] (8) The connector according to one aspect of the present disclosure includes any one of the printed wiring boards of (1) to (7) above and an electronic component having a plurality of terminal portions that are solder - joined to the plurality of pad portions one - to - one.

[0022] [[ID=……]] Since the plurality of pad portions on the printed wiring board and the plurality of terminal portions on the electronic component are solder - joined one - to - one, the bonding strength and positional accuracy between the plurality of pad portions and the plurality of terminal portions are excellent.

[0023] (9) In (8) above, the terminal portion has a bonding surface facing the pad portion, and the areas of the bonding surfaces in the plurality of terminal portions may be equal. According to this aspect, it is possible to further improve the bonding strength and positional accuracy between the plurality of pad portions and the plurality of terminal portions.

[0024] In this disclosure, "equal areas" includes an area ratio in the range of 0.9 to 1.1. The area ratio may also be between 0.95 and 1.05. In this disclosure, "equal lengths" includes a length ratio in the range of 0.9 to 1.1. The length ratio may also be between 0.95 and 1.05. "Rectangular" is a concept that includes approximately rectangular shapes, and for example, shapes with rounded corners or shapes with irregularities due to manufacturing limitations.

[0025] [Details of the embodiments of this disclosure] Preferred embodiments of this disclosure will be described below with reference to the drawings. Note that, regarding the numerical values ​​described herein, it is possible to adopt only one of the upper and lower limits, or to combine the upper and lower limits as desired. This specification includes all possible numerical ranges that can be combined. Furthermore, the figures are schematic and may not correspond to actual shapes, dimensions, proportions, etc. Also, in this disclosure, descriptions such as "First," "Second," etc., are for distinguishing the components to which they are attached and do not limit the number, order, priority, etc.

[0026] [First Embodiment] <Printed wiring board> The printed circuit board 1 in Figure 1 comprises a plurality of pad portions 10 arranged in parallel. The plurality of pad portions 10 include a first pad 11 having a first area S1 and two or more second pads 12 having an area smaller than the first area S1. At least two of the second pads 12 are arranged with one or more first pads 11 in between them.

[0027] Since the printed circuit board 1 has a plurality of first pads 11 having a first area S1, sufficient bonding strength with multiple terminal portions can be maintained. Furthermore, since the printed circuit board 1 has second pads 12 with a smaller area than the first pads 11, the terminal portions soldered to the second pads 12 are aligned with the second pads 12 by the self-alignment effect. In this case, since at least two second pads 12 are arranged with one or more first pads 11 in between, it becomes easy to align the plurality of terminal portions soldered to the pad portions 10 with respect to the entire plurality of pad portions 10. Therefore, the printed circuit board 1 can achieve both bonding strength and positional accuracy with respect to multiple terminal portions.

[0028] The printed circuit board 1 comprises a substrate 13 and a plurality of pad portions 10 arranged on the substrate 13. The printed circuit board 1 is not particularly limited in its other structure, as long as it comprises a substrate 13 and a plurality of pad portions 10. In this disclosure, the term "on" includes both direct and indirect arrangements. For example, "on a substrate" includes cases where the printed circuit board is directly arranged on the substrate and cases where it is indirectly arranged on the substrate with other layers in between.

[0029] (substrate) The substrate 13 is insulating. The substrate 13 may or may not be flexible. If the substrate 13 is flexible, examples of its main components include polyimide, polyethylene terephthalate, liquid crystal polymer, and fluororesin. If the substrate 13 is not flexible, examples of its main components include glass epoxy, paper phenol, paper epoxy, glass composite, and glass. The printed circuit board 1 may be a flexible printed circuit board, a rigid printed circuit board, or a flex-rigid printed circuit board. In this disclosure, "main component" means the component with the largest mass content, for example, a component with a content of 50% by mass or more.

[0030] (Pad section) Multiple pad portions 10 are exposed on the substrate 13. Multiple pad portions 10 are conductive. Multiple pad portions 10 may be, for example, part of a conductive pattern arranged on the substrate 13. This conductive pattern may include one or more wirings (not shown). The pad portions 10 may be connected to the above wiring, or they may be separated from the above wiring.

[0031] The multiple pad portions 10 are mainly composed of, for example, copper. The multiple pad portions 10 may have, for example, an electroplated layer. More specifically, for example, the multiple pad portions 10 may have a two-layer structure consisting of a conductive underlayer formed by sputtering or the like and an electroplated layer, or they may have a three-layer structure consisting of a conductive underlayer, an electroless plating layer and an electroplated layer. The components of the conductive underlayer, the electroless plating layer and the electroplated layer may be the same or different.

[0032] As shown in Figure 1, the multiple pad portions 10 may be rectangular in plan view, or more specifically, rectangular in plan view. When the multiple pad portions 10 are rectangular in plan view, the short sides of the multiple pad portions 10 may extend in the parallel direction (the X-axis direction in Figure 1). That is, the multiple pad portions 10 may be rectangular in plan view with the parallel direction as the short side. According to this embodiment, it is easier to improve the positional accuracy between the multiple pad portions 10 and the multiple terminal portions soldered to the multiple pad portions 10 in the parallel direction of the multiple pad portions 10. Also, according to this embodiment, the pitch P of the multiple pad portions 10 can be reduced, which facilitates miniaturization of the printed circuit board 1. Note that "pitch" of the pad portions means the distance between the central axes of adjacent pad portions in a plan view. Also, in this disclosure, "plan view" means a view in the thickness direction of the printed circuit board (view in the Z-axis direction in Figure 1).

[0033] The pitch P between adjacent pad portions 10 in multiple pad portions 10 may be the same. According to this embodiment, it becomes easier to arrange multiple pad portions 10 closely together, which further promotes miniaturization of the printed circuit board 1.

[0034] The lower limit of the average pitch of the multiple pad portions 10 may be 150 μm or 250 μm, from the viewpoint of preventing solder bridges from forming between adjacent pad portions 10. On the other hand, the upper limit of the average pitch may be 10,000 μm or 5,000 μm, from the viewpoint of densely arranging the multiple pad portions 10. Note that "average pitch" means the average value of the pitch P between adjacent pad portions for all pad portions 10.

[0035] As shown in Figure 1, the multiple pad portions 10 may have their first short sides 11a and 12a aligned on the same straight line. That is, the first short side 11a of all first pads 11 and the first short side 12a of all second pads 12 may be aligned on a single straight line. In this embodiment, in a plan view, all first pads 11 and all second pads 12 extend in the same direction (the positive Y-axis direction in Figure 1) with their first short sides 11a and 12a at one end. As a result, the positional accuracy between the multiple pad portions 10 and the multiple terminal portions soldered to the multiple pad portions 10 can be easily improved.

[0036] The lengths of the short sides of the multiple pad portions 10 may be equal. That is, the lengths of the short sides of all the first pads 11 and all the second pads 12 may be equal. According to this embodiment, it is easy to reduce the pitch of the multiple pad portions 10, and it is easier to improve the positional accuracy between the multiple pad portions 10 and the multiple terminal portions soldered to the multiple pad portions 10.

[0037] The lower limit of the average length W of the short sides of the multiple pad portions 10 may be 75 μm or 125 μm, from the viewpoint of sufficiently forming solder fillets on the multiple pad portions 10. On the other hand, the upper limit of the average length W may be 5000 μm or 2500 μm, from the viewpoint of improving the positional accuracy with respect to the multiple terminal portions.

[0038] The heights of the multiple pad portions 10 may be equal. That is, the heights of all the first pads 11 and all the second pads 12 may be equal. According to this embodiment, the multiple pad portions 10 and the multiple terminal portions can be easily soldered together.

[0039] As described above, the multiple pad sections 10 include multiple first pads 11 and two or more second pads 12. More specifically, the multiple pad sections 10 consist of multiple first pads 11 and two or more second pads 12.

[0040] (Pad 1) The first pad 11 enhances the bonding strength between the printed circuit board 1 and the electronic component when the printed circuit board 1 and the electronic component are connected. In Figure 1, the plurality of first pads 11 are rectangular in plan view, more specifically, rectangular in plan view with the parallel direction as the shorter side. The first pad 11 has the above-mentioned first short side 11a and a second short side 11b opposite to the first short side 11a. The first pad 11 also has a bottom surface that is placed on the substrate 13 and a top surface 11c opposite to the bottom surface. The top surface 11c is formed as a bonding surface that is soldered to the terminal portion. A solder portion (not shown in Figure 1) for soldering the first pad 11 to the terminal portion is arranged on the top surface 11c.

[0041] As described above, each of the multiple first pads 11 has a first area S1. That is, the areas of each of the multiple first pads 11 are equal. In this disclosure, "first area" refers to the area of ​​the top surface of the first pad.

[0042] In Figure 1, the multiple first pads 11 are arranged at the same pitch such that their long sides are adjacent to each other. The multiple first pads 11 have their first short sides 11a aligned on the same straight line, and their second short sides 11b aligned on the same straight line.

[0043] The number of first pads 11 is determined based on the type of electronic component to be connected. The lower limit of the number of first pads 11 may be, for example, 5 or 10. On the other hand, the upper limit of the number may be 50 or 30.

[0044] (Second pad) The second pad 12 has a bottom surface that is placed on the substrate 13 and a top surface 12c that is opposite to the bottom surface. The top surface 12c is formed as a bonding surface to be soldered to the terminal portion. A solder portion (not shown in Figure 1) for soldering the second pad 12 to the terminal portion is provided on the top surface 12c. The second pad 12 limits the range of movement of the terminal portion relative to the second pad 12 by reducing the area in which a solder fillet is formed on the top surface 12c. More specifically, since the solder fillet is formed to fit within the top surface 12c, limiting the area in which the solder fillet is formed also limits the range of movement of the terminal portion on the top surface 12c. As a result, combined with the small area of ​​the top surface 12c, the terminal portion is positioned with high precision on the top surface 12c. In this disclosure, the "area" of the second pad refers to the area of ​​the top surface 12c.

[0045] The second pad 12 improves the positional accuracy between the multiple pad sections 10 and the multiple terminal sections when the printed circuit board 1 and the electronic components are connected. The printed circuit board 1 has two or more second pads 12 in all of the pad sections 10.

[0046] The number of second pads 12 is not particularly limited as long as it is 2 or more, but the upper limit may be 4, 3, or 2. The number of second pads 12 may be less if it is sufficient to improve the positional accuracy between the multiple pad sections 10 and the multiple terminal sections. Figure 1 illustrates an embodiment in which the number of second pads 12 is 2. In this printed circuit board 1, by having 2 second pads 12, the number of first pads 11 in the multiple pad sections 10 can be relatively increased. As a result, the bonding strength between the multiple pad sections 10 and the multiple terminal sections can be increased.

[0047] In the multiple pad sections 10, the second pads 12 do not have to be arranged consecutively. By not having the second pads 12 consecutively, it is easier to efficiently improve the positional accuracy between the multiple pad sections 10 and the multiple terminal sections.

[0048] The second pad 12 may be positioned on both sides, with reference to the center in the parallel direction of the entire set of pad portions 10. This configuration makes it easier to prevent twisting of the positions of the multiple terminal portions relative to the multiple pad portions 10 in a plan view.

[0049] Second pads 12 may be arranged at both ends of the parallel direction of the multiple pad portions 10. According to this embodiment, the multiple terminal portions can be easily and accurately aligned with respect to the entire set of multiple pad portions 10. For example, twisting of the positions of the multiple terminal portions in a plan view relative to the multiple pad portions 10 can be easily and reliably prevented.

[0050] The areas of two or more second pads 12 may be different. On the other hand, the areas of at least two second pads 12 may be equal. Having two or more second pads 12 with equal areas makes it easier to control the positions of multiple terminal sections relative to the entire set of pad sections 10. The planar shapes of second pads 12 with equal areas may be the same.

[0051] In Figure 1, the area of ​​all second pads 12 is equal. That is, in Figure 1, the second pad 12 has a second area S2 that is smaller than the first area S1. According to this embodiment, the functions of the first pad 11 and the second pad 12 can be clearly separated. As a result, the function of improving the bonding strength with multiple terminal parts by multiple first pads 11 and the function of improving the positional accuracy with multiple terminal parts by multiple second pads 12 can be clearly demonstrated. Therefore, it is easy to achieve both bonding strength and positional accuracy with respect to multiple terminal parts.

[0052] In Figure 1, the two second pads 12 are rectangular in plan view, more specifically, rectangular in plan view with the parallel direction as the shorter side. The second pad 12 has the first short side 12a and the second short side 12b opposite to the first short side 12a. The first short sides 12a of the two second pads 12 are arranged on the same straight line, and the second short sides 12b are also arranged on the same straight line.

[0053] The longer side of the second pad 12 is shorter than the longer side of the first pad 11. The shorter longer side of the second pad 12 compared to the first pad 11 enhances the function of preventing twisting of the position of the multiple terminal portions relative to the multiple pad portions 10 in a plan view.

[0054] Furthermore, the printed circuit board 1 has a rectangular shape in plan view, with the parallel direction of the multiple pad portions 10 being the shorter side, and the longer side of the second pad 12 being shorter than the longer side of the first pad 11. This prevents the pitch P of the multiple pad portions 10 from becoming too large, while improving the positional accuracy between the multiple pad portions 10 and the multiple terminal portions.

[0055] The lower limit of the difference (L1-L2) between the long side length L1 of the first pad 11 and the long side length L2 of the second pad 12 may be 0.05 mm or 0.5 mm, from the viewpoint of ensuring that the second pad 12 sufficiently improves the positional accuracy of the terminal portion. On the other hand, the upper limit of the above difference (L1-L2) may be 4.0 mm or 2.0 mm, from the viewpoint of preventing the length of the first pad 11 from becoming unnecessarily long and preventing the length of the second pad 12 from becoming too short. Note that the first short sides 11a and 12a of the first pad 11 and the second pad 12 are arranged on the same straight line. Therefore, the above difference (L1-L2) can be determined as the distance between the second short sides 11b and 12b in the longitudinal direction (Y-axis direction in Figure 1) of the first pad 11 and the second pad 12.

[0056] (Soldering Department) As described above, solder portions are placed on the top surface 11c of the first pad 11 and the top surface 12c of the second pad 12, respectively. These solder portions are formed, for example, by solder paste. The solder portions may also be printed on the top surfaces 11c and 12c. Known methods can be used to print the solder portions, such as screen printing. The solder portions include solder particles and flux. During reflow soldering, the solder particles in the solder portions melt and solidify, joining the first pad 11 and the second pad 12 to the terminal portions.

[0057] <connector> The connector 20 in Figures 2 and 3 comprises a printed circuit board 1 and an electronic component 30 having a plurality of terminal portions 31 that are soldered one-to-one to a plurality of pad portions 10 on the printed circuit board 1.

[0058] In this connector 20, multiple pad portions 10 on the printed circuit board 1 and multiple terminal portions 31 on the electronic component 30 are soldered together in a one-to-one ratio, resulting in excellent bonding strength and positional accuracy between the multiple pad portions 10 and the multiple terminal portions 31. In particular, in this connector 20, the length of the long side of the second pad 12 is shorter than the length of the long side of the first pad 11, making it easy to improve the positional accuracy between the multiple pad portions 10 and the multiple terminal portions 31 in the parallel direction of the multiple pad portions 10 in a plan view and in the direction perpendicular to it (the Y-axis direction in Figures 2 and 3).

[0059] As shown in Figures 4 and 5, the connector 20 is formed by joining the first pad 11 and the terminal portion 31, and the second pad 12 and the terminal portion 31, with solder fillets 41 and 42. The solder fillet 41 joining the first pad 11 and the terminal portion 31 is formed by the melting and solidification of solder that was placed on the first pad 11 on the printed circuit board 1 (printed circuit board 1 in Figure 1) before it was connected to the electronic component 30. Similarly, the solder fillet 42 joining the second pad 21 and the terminal portion 31 is formed by the melting and solidification of solder that was placed on the second pad 12 on the printed circuit board 1 before it was connected to the electronic component 30.

[0060] (Electronic components) The electronic component 30 includes a plurality of terminal portions 31 arranged in parallel. As shown in Figures 4 and 5, the terminal portions 31 have bonding surfaces 31a facing the pad portions 10 (first pad 11 and second pad 12). The bonding surfaces 31a face the top surface 11c of the first pad 11 or the top surface 12c of the second pad 12.

[0061] The area of ​​the bonding surface 31a of multiple terminal portions 31 may be equal. In other words, the bonding surface 31a of all terminal portions 31 may have a third area S3. By having a bonding surface 31a that faces the pad portion 10, and by having the area of ​​the bonding surface 31a of multiple terminal portions 31 be equal, the bonding strength and positional accuracy between the multiple pad portions 10 and the multiple terminal portions 31 can be further improved.

[0062] The shape of the bonding surfaces 31a of the multiple terminal portions 31 may be the same. Also, the third area S3 may be smaller than the second area S2. More specifically, as shown in Figure 3, when the multiple terminal portions 31 are arranged on the multiple pad portions 10, the bonding surface 31a of the terminal portion 31 located on the top surface 11c of the first pad 11 may be enclosed by the top surface 11c in a plan view, and the bonding surface 31a of the terminal portion 31 located on the top surface 12c of the second pad 12 may be enclosed by the top surface 12c in a plan view. According to this embodiment, as shown in Figures 3 to 5, annular solder fillets 41 and 42 can be formed on the top surface 11c of the first pad 11 and on the top surface 12c of the second pad 12, respectively. Therefore, the bonding strength between the multiple pad portions 10 and the multiple terminal portions 31 can be improved. Furthermore, since an annular solder fillet 42 is formed on the top surface 12c of the second pad 12 in plan view, the terminal portion 31 placed on the second pad 12 is easily positioned within the top surface 12c of the second pad 12 in plan view. As a result, the positional accuracy of the multiple pad portions 10 and the multiple terminal portions 31 can be easily and reliably improved.

[0063] The contact area between the top surface 11c of the first pad 11 and the solder fillet 41 may be larger than the contact area between the top surface 12c of the second pad 12 and the solder fillet 42. For example, in the longitudinal direction of the first pad 11, the contact length between the top surface 11c of the first pad 11 and the solder fillet 41 may be larger than the contact length between the top surface 12c of the second pad 12 and the solder fillet 42 by the difference between the long side length L1 of the first pad 11 and the long side length L2 of the second pad 12 (L1-L2). According to this embodiment, the bonding strength between the printed circuit board 1 and the electronic component 30 can be easily and reliably increased.

[0064] The type of electronic component 30 is not particularly limited and can be appropriately selected depending on the application, etc. For example, the electronic component 30 may be a connector.

[0065] <Manufacturing method for connecting components> The manufacturing method of the connector comprises, for example, the steps of: placing multiple terminal portions 31 of an electronic component 30 on multiple pad portions 10 of a printed circuit board 1 in a one-to-one ratio, with the solder portions formed on each of the multiple pad portions 10; and reflow soldering the multiple pad portions 10 and the multiple terminal portions 31, with the electronic component 30 placed on the printed circuit board 1 as a result of the placement step.

[0066] According to the manufacturing method of the connector, it is possible to manufacture a connector 20 that has excellent bonding strength and positional accuracy between the multiple pad portions 10 and the multiple terminal portions 31.

[0067] [Other embodiments] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is not limited to the configurations of the embodiments described above, but is indicated by the claims, and all modifications within the meaning and scope equivalent to the claims are intended to be included.

[0068] In the above embodiment, a configuration in which the plurality of pad sections include only the first pad and the second pad has been described. However, in the printed circuit board, the plurality of pad sections may also include pads other than the first pad and the second pad. In this case, the shape of the pads other than the first pad and the second pad is not particularly limited and can be set according to the application, etc.

[0069] In the above embodiment, a configuration was described in which second pads are arranged at both ends in the parallel direction of multiple pad sections. However, in this printed circuit board, the positional accuracy of multiple terminal sections relative to multiple pad sections can be improved by arranging the second pads with one or more first pads in between.

[0070] In the above embodiment, a configuration in which all second pads have equal areas was described. However, even when the areas of the second pads differ, the positional accuracy of multiple terminal portions relative to multiple pad portions can be improved if the area of ​​the second pads is smaller than the area of ​​the first pads.

[0071] The specific shapes of the first pad and the second pad are not limited to those described in the above embodiment. For example, the shapes of multiple first pads do not necessarily have to be the same. Similarly, the shapes of multiple second pads do not necessarily have to be the same. Furthermore, one or both of the first pad and the second pad may have a shape other than a rectangle in plan view.

[0072] If the first pad and the second pad are rectangular in shape in plan view, for example, in a direction perpendicular to the parallel direction of the multiple pad portions in plan view, the first short side of the first pad may protrude more than the first short side of the second pad, and the second short side of the first pad may protrude more than the second short side of the second pad.

[0073] In the said connector, the shapes of the multiple terminal portions of the electronic component can be appropriately set according to the application and other factors. [Explanation of Symbols]

[0074] 1 Printed circuit board 10 Pad section 11 First Pad 11a, 12a First short side 11b, 12b Second short side 11c, 12c Top surface 12 Second pad 13 circuit boards 20 connectors 30 Electronic Components 31 Terminal section 31a Joint surface 41, 42 Solder fillets L1 Longest side length of the first pad L2 Long side length of the second pad Pitch of the P pad section S1 First area S2 Second area S3 Third Area W: Average length of the short side in multiple pad sections

Claims

1. It has multiple pad sections arranged in parallel, Each of the above-mentioned multiple pad portions includes a plurality of first pads having a first area and two or more second pads having an area smaller than the first area. A printed circuit board in which at least two of the above-mentioned second pads are arranged with one or more of the above-mentioned first pads in between.

2. The printed circuit board according to claim 1, wherein the number of the second pads is 2.

3. The printed circuit board according to claim 1, wherein the second pads are arranged at both ends in the parallel direction of the plurality of pad portions described above.

4. The printed circuit board according to claim 1, wherein the areas of at least two of the second pads are equal.

5. The above-mentioned multiple pad sections are rectangular in shape when viewed from above, with the parallel direction being the shorter side. The printed circuit board according to claim 1, wherein the longer side of the second pad is shorter than the longer side of the first pad.

6. The printed circuit board according to claim 5, wherein the multiple pad portions described above have their first short sides arranged on the same straight line.

7. The printed circuit board according to claim 5, wherein the lengths of the short sides of the multiple pad portions are equal.

8. A printed circuit board according to any one of claims 1 to 7, An electronic component having multiple terminal portions that are soldered one-to-one to the above-mentioned multiple pad portions, A connector comprising:

9. The above terminal portion has a contact surface facing the above pad portion, The connector according to claim 8, wherein the area of ​​the joining surfaces at the plurality of terminal portions is equal.

Images