Sensor Die
Silicon-based sensor dies with interdigital electrodes and solid polymer electrolyte layers on silicon substrates address technical challenges, enabling efficient vapor detection by measuring impedance variations.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- HONEYWELL INTERNATIONAL INC
- Filing Date
- 2025-10-23
- Publication Date
- 2026-05-26
AI Technical Summary
Existing sensor dies with interdigital electrodes on glass substrates face technical challenges that are addressed by developing silicon-based solid polymer electrolyte sensor dies with specific configurations and materials.
The sensor dies incorporate a silicon substrate with thin silicon oxide film, interdigital electrodes, and a solid polymer electrolyte sensing layer, along with retaining rings to contain the electrolyte, enabling detection of vapor by measuring impedance variations.
The configuration allows for effective detection of vapor presence by accurately measuring impedance changes, suitable for applications such as detecting steam leaks in electric vehicle batteries.
Smart Images
Figure 2026086356000001_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure generally relate to sensor dies, and more particularly to silicon-based solid polymer electrolyte sensor dies.
Background Art
[0002] Some sensor dies include interdigital electrodes (IDEs) disposed on a glass substrate. The applicant recognizes many technical problems and difficulties associated with such sensor dies. Through the efforts, ingenuity, and innovations applied, many of these identified problems are solved by developing the solutions included in the embodiments of the present disclosure, and many of their examples are described in detail herein.
Summary of the Invention
[0003] Various exemplary embodiments described herein relate to sensor dies, and more particularly to silicon-based solid polymer electrolyte sensor dies.
[0004] According to various embodiments of the present disclosure, an apparatus for detecting vapor is provided. The apparatus includes (i) a substrate, (ii) a plurality of interdigital electrodes (IDEs) made of metal disposed proximate to a surface of the substrate, and (iii) a solid polymer electrolyte (SPE) sensing layer disposed proximate to the plurality of IDEs.
[0005] In some embodiments, the substrate is made of bulk silicon having a thin film of silicon oxide.
[0006] In some embodiments, the apparatus further includes one or more retaining rings that define one or more regions configured to contain at least a certain volume of SPE therebetween.
[0007] In some embodiments, the plurality of IDEs includes one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.
[0008] In some embodiments, the multiple IDEs comprise one or more electrodes of a second width, where the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, and the first and second widths are different.
[0009] In some embodiments, multiple IDEs include one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially enclose at least one region having one or more electrodes.
[0010] In some embodiments, the device is configured to detect the presence of vapor by measuring impedance variations through multiple IDEs and sensing layers.
[0011] A system is provided according to various embodiments of the present disclosure. The system comprises (i) a lithium-ion battery and (ii) a sensor die for detecting vapor. The sensor die includes (a) a substrate, (b) a plurality of comb-shaped electrodes (IDEs) made of metal disposed in close proximity to the surface of the substrate, and (c) a solid polymer electrolyte (SPE) sensing layer disposed in close proximity to the plurality of IDEs.
[0012] In some embodiments, the substrate consists of bulk silicon having a thin film of silicon oxide.
[0013] In some embodiments, the sensor die further includes one or more retaining rings that define one or more regions configured to contain at least one volume of SPE.
[0014] In some embodiments, multiple IDEs include one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.
[0015] In some embodiments, multiple IDEs comprise one or more electrodes of a second width, where the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, and the first and second widths are different.
[0016] In some embodiments, multiple IDEs comprise one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially enclose at least one region comprising one or more electrodes.
[0017] In some embodiments, the sensor die is configured to detect the presence of vapor by measuring impedance variations through multiple IDEs and sensing layers.
[0018] Various embodiments of this disclosure provide a method for constructing an apparatus for detecting vapor. The method includes (i) depositing a plurality of comb electrodes (IDEs) made of metal on the surface of a substrate, and (ii) depositing a sensing layer made of a solid polymer electrolyte (SPE) in close proximity to the plurality of IDEs such that the sensing layer covers at least a plurality of IDEs.
[0019] In some embodiments, the substrate consists of bulk silicon having a thin film of silicon oxide.
[0020] In some embodiments, the method further includes fabricating one or more retaining rings that define one or more regions between which are configured to include at least one volume of SPE.
[0021] In some embodiments, a plurality of IDEs comprises one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width.
[0022] In some embodiments, multiple IDEs include one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially enclose at least one region having one or more electrodes.
[0023] In some embodiments, the method further includes configuring a sensor die to detect the presence of vapor by measuring impedance variations through multiple IDEs and sensing layers. [Brief explanation of the drawing]
[0024] The description of the illustrated embodiments can be read in conjunction with the accompanying figures. It should be understood that, unless otherwise specified, for the sake of simplicity and clarity of the figures, the elements shown in the figures are not necessarily drawn to scale. For example, unless otherwise specified, the dimensions of some of the elements may be exaggerated relative to other elements. Embodiments incorporating the teachings of the present disclosure are shown and described in connection with the figures presented herein. [Figure 1A] A first perspective view of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 1B] A second perspective view of the sensor die of FIG. 1A is shown. [Figure 2] A cross-sectional view of the sensor die of FIG. 1B is shown. [Figure 3A] A top view of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 3B] A top view of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 4] A top view of a sensor die having exemplary boundaries according to one or more embodiments of the present disclosure is shown. [Figure 5A] A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 5B] A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 5C] A top view of a portion of a sensor die according to one or more embodiments of the present disclosure is shown. [Figure 6] A flowchart of an exemplary method of constructing a sensor die according to one or more embodiments of the present disclosure is shown.
Embodiments for Carrying Out the Invention
[0025] Next, some embodiments of this disclosure will be described in more detail below with reference to the accompanying drawings, which show some, but not all, embodiments of this disclosure. In fact, these disclosures may be embodied in many different forms and should not be construed as being limited to the embodiments described herein, but rather these embodiments are provided so that this disclosure may satisfy applicable legal requirements. Similar figures refer to similar elements throughout.
[0026] Where used herein, terms such as “front,” “rear,” “top,” “bottom,” “left,” and “right” are used for illustrative purposes in the examples provided below to describe the relative position of a particular component or part of a component. Furthermore, as will be apparent to those skilled in the art from the viewpoint of this disclosure, the terms “substantially” and “approximately” indicate that the referenced element or related description is accurate within applicable engineering tolerances.
[0027] As used herein, the term “comprising” means including but not limiting, and should be interpreted as it typically is in a patent context. It should be understood that the use of broader terms such as “comprises,” “includes,” and “having” supports narrower terms such as “consisting of,” “consisting essentially of,” and “comprised substantially of.”
[0028] The phrases “in one embodiment,” “according to one embodiment,” and “in some embodiments,” and similar phrases, generally mean that a particular feature, structure, or characteristic following such phrase may be included in at least one embodiment of the Disclosure, and may be included in two or more embodiments of the Disclosure (importantly, such phrases do not necessarily refer to the same embodiment).
[0029] The phrases “In one embodiment,” “According to one embodiment,” “In some embodiments,” and similar phrases generally mean that a particular feature, structure, or characteristic following such phrase may be included in at least one embodiment of the Disclosure, and may be included in two or more embodiments of the Disclosure (importantly, such phrases do not necessarily refer to the same embodiment).
[0030] Where this specification states that a particular component or feature is included or has characteristics, it is not required that that particular component or feature be included or have characteristics. Such components or features may be included or excluded in some embodiments at their discretion.
[0031] As used herein, the terms “example” or “exemplary” mean “serving as an example, case, or illustration.” Any embodiment described herein as “example” or “exemplary” is not necessarily construed to be preferable or advantageous to other embodiments.
[0032] In this disclosure, the terms “electrically coupled,” “electrically connected,” “electrically connected,” “electrically connected,” “electrically connected,” “electrically connected,” “communicate,” or “communicate electronically” refer to two or more elements or components connected via wired and / or wireless means so that signals, voltages / currents, data and / or information can be transmitted to and / or received from these elements or components.
[0033] The term “component” may refer to an article, device, or apparatus that may comprise one or more surfaces, parts, layers, and / or elements. For example, an exemplary component may comprise one or more substrates that may provide an underlying layer to the component, one or more elements that may form part of the substrates, and / or one or more elements that are placed on the substrates. In this disclosure, the term “element” may refer to an article, device, or apparatus that may provide one or more functions.
[0034] Embodiments of this disclosure provide apparatus, systems, and methods for sensor dies. Various embodiments provide silicon-based solid polymer electrolyte sensor dies.
[0035] In various embodiments, the sensor die may be used to detect steam. The sensor dies described herein can be used in a variety of applications. In an exemplary application, a battery in an electric vehicle may leak, generating steam. The sensor die may be used to detect steam generated from or originating from the battery.
[0036] In various embodiments, the sensor die may include a substrate, a plurality of electrodes (e.g., comb electrodes), one or more contact pads, one or more regions containing a polymer, and / or other components. The substrate may be a silicon-based substrate consisting of silicon oxide on silicon. One or more contact pads are configured to be electrically connected to or in an electrically connected state to one or more external devices so that measurements using the sensor die can be provided to external devices. Examples of external devices include printed circuit board assemblies (PCBAs), processors, and the like. In some embodiments, a solid polymer electrolyte is used in combination with comb electrodes (IDEs) to measure one or more properties, such as impedance or impedance variation. Measurements of impedance or impedance variation may indicate the presence of vapor or other substances, such as the presence of leakage in a battery.
[0037] Figure 1A shows a first perspective view of a sensor die 100 according to one or more embodiments of the present disclosure. The first perspective view of the sensor die 100 shown in Figure 1A omits the sensing layer 110, which consists of a solid polymer electrolyte (SPE) as shown in Figure 1B. As shown in Figure 1, the sensor die 100 comprises a first substrate layer 102, a second substrate layer 104, one or more buses 106 (e.g., a first bus 106A and a second bus 106B), and one or more retaining rings 108 (e.g., a first retaining ring 108A and a second retaining ring 108B). The example in Figure 1A shows one first substrate layer 102, one second substrate layer 104, two buses 106, two retaining rings 108, and one region for the sensing layer 110, but it will be understood that in various embodiments of the sensor die 100, any number of such components may be present. For example, another embodiment of the present disclosure omits the retaining ring 108.
[0038] The first substrate layer 102 may lie beneath the second substrate layer 104. The first substrate layer 102 and the second substrate layer 104 together may be referred to as the “substrate” 102+104. The substrate 102+104 may consist of a variety of materials, and the first substrate layer 102 may be made of a different material than the second substrate layer 104. For example, the substrate 102+104 may consist of insulating materials including glass, Kapton, quartz, composite epoxy materials, ceramics such as alumina, polytetrafluoroethylene (PTFE), and / or other insulating materials. In some embodiments, the substrate may consist of a silicon-based material. For example, the substrate 102+104 may consist of a film of silicon oxide (e.g., SiO2) on silicon (Si), the first substrate layer 102 may consist of bulk silicon, and the second substrate layer 104 may consist of a silicon oxide film. The bulk silicon may be independent of the dopant level. In some embodiments, the substrate may be a Si / SiO2 wafer. In various embodiments, the first substrate layer 102 may be a metallic or semiconductor layer, and the second substrate layer may be an insulating or dielectric layer. In various embodiments, the substrate 102+104 may consist of a single material (e.g., Kapton) that is flexible and can be referred to as a single substrate layer. Alternatively, the first substrate layer 102 may be of the first material, and the second substrate layer 104 may be a film or foil (e.g., having a dielectric on the film). The substrate may be configured so that the sensor die 100 performs various operations and measurements, such as measuring impedance and / or impedance fluctuations.
[0039] One or more buses 106 may consist of various shapes extending from one or more contact pads 120. For example, one or more buses 106 may extend from one or more contact pads 120 and form at least a portion of the outer perimeter surrounding a plurality of IDEs. In some embodiments, one or more buses 106 may include a first bus 106A and a second bus 106B configured in a semicircular shape. Thus, the two corresponding buses 106A, 106B form a substantially circular shape. The first bus 106A may extend from or be electrically connected to the first contact pad 120A. The second bus 106B may extend from or be electrically connected to the second contact pad 120B. In various embodiments, one or more gaps may exist in or between one or more buses 106. For example, the substantially circular shapes of buses 106A and 106B may include one or more gaps. One or more baths 106 may consist of a metal such as gold (Au), platinum (Pt), and / or other metals. The metal of one or more baths 106 can be deposited (e.g., defined by photolithography).
[0040] One or more retaining rings 108 can take on various shapes and configurations. For example, one or more retaining rings 108 may be substantially rounded and / or have other shapes. In the embodiment of Figure 1A, two retaining rings are shown: a first retaining ring 108A and a second retaining ring 108B. The first retaining ring 108A is inside or within the second retaining ring 108B. The distance between the first retaining ring 108A and the second retaining ring 108B forms a gap 200 (shown in Figure 2). The gap 200 may be called a pool or outer pool. In various embodiments, constructing the sensor die 100 may involve depositing a sensing layer 110 consisting of a solid polymer electrolyte (SPE) which may be liquid or viscous. During this deposition, the SPE is deposited in an internal pool bounded by the internal first retaining ring 108A and may spread to fill this internal pool. Up to a certain extent, the gap 200 between the internal first retaining ring 108A and the external second retaining ring 108B forms an outer pool from which excess SPE (or other type of electrolyte) can overflow from the internal pool formed by the first retaining ring 108A. Thus, the gap 200 or outer pool can hold any additional electrolyte that overflows from the internal pool, which prevents the electrolyte from coating other parts of the sensor die 100 (e.g., the contact pad 120).
[0041] One or more retaining rings 108 may be composed of polyimide, SU-8 (negative photoresist material), and / or other materials. One or more retaining rings 108 may be defined by photolithography, etching, and / or other techniques. For example, one or more polyimide retaining rings 108 may be defined by (i) deposition of a layer of polyimide on at least a portion of the surface of the sensor die 100, (ii) deposition of a layer of photoresist on the polyimide layer, (iii) photolithography of the photoresist defining the region where the polyimide is desired (e.g., two substantially concentric rings), (iv) polyimide etching to remove at least a portion (e.g., all) of the polyimide layer not covered by the remaining photoresist, (v) removal of the photoresist covering the polyimide retaining rings, and / or other steps.
[0042] Alternatively, various embodiments do not include a retaining ring. For example, various embodiments may deposit the SPE (or another electrolyte) such that the SPE does not spread or is not viscous enough to cause overflow. An example of such a deposition operation is by printing. Such embodiments may omit the retaining ring 108.
[0043] Figure 1B shows a second perspective view of the sensor die 100 of Figure 1A. Figure 1B shows a sensing layer 110 made of a solid polymer electrolyte (SPE). The SPE can take on various shapes and / or configurations to conform to the shape of the underlying comb-shaped electrode (IDE). The SPE can be deposited to form a substantially circular thin film. The edges and / or base of the SPE can extend beyond one or more buses 106 so that one or more buses 106 (and multiple IDEs) are covered by the SPE. In some embodiments, the SPE is configured to work in conjunction with multiple IDEs to provide measurement of one or more properties, such as impedance and / or impedance variation.
[0044] The SPE can be deposited on the sensor die 100. The SPE may be an ink, and deposition may be via inkjet printing, aerosol printing, and / or other techniques. In some embodiments, deposition of the SPE may depend on an ink having a viscosity outside the operating range of one or more respective printing techniques, which may present challenges in printing precise amounts of ink. In such examples with excess and / or overflowing ink, the SPE and / or other materials may be captured by one or more pools as described herein. For example, a pool is defined by a gap between two or more retaining rings 108.
[0045] Figure 2 shows a cross-sectional view of the sensor die 100 of Figure 1B. In the embodiment of Figure 2, the sensor die 100 comprises a first substrate layer 102, a second substrate layer 104, first retaining rings 108A and 2 retaining rings 108B forming a gap 200 or pool, a sensing layer 110 of solid polymer electrolyte (SPE), and a plurality of comb electrodes (IDEs) (e.g., 202, 208). IDEs 202 or 208 are described further herein. The sensor die 100 of Figure 2 shows one first substrate layer 102, one second substrate layer 104, two retaining rings 108, one sensing layer 110 of SPE, one gap 200 or pool, and a plurality of IDEs 202, 208, but any number of such components may be present in the sensor die 100.
[0046] The sensing layer 110 of the SPE can have various shapes and / or configurations. For example, the SPE may be deposited to form a substantially cylindrical shape or film. The height of the substantially cylindrical shape is substantially less than the diameter of the cylindrical shape. In various embodiments, the shape may be defined by retaining rings 108 (e.g., a first retaining ring 108A). The SPE may extend beyond one or more buses 106 (and a plurality of IDEs 202, 208 surrounded by the buses 106) so that the SPE covers them. In some embodiments, the SPE is configured to work in conjunction with a plurality of IDEs 202, 208 to measure one or more characteristics such as impedance and / or impedance variation.
[0047] In some embodiments, a polymer layer is added above the electrode layers (e.g., 202, 208) in the openings above the IDE structure, and further within the open region of the sensor die 100, which can function as an additional retaining pool for material deposited on top of the IDE structure that may overflow from the IDE region. Such a retaining pool may contain an excess volume of material without affecting the electrical properties of the sensor die 100 and / or the device comprising the sensor die 100.
[0048] Multiple IDEs 202, 208 can be deposited on the substrate before SPE deposition. Multiple IDEs and their various configurations are further described herein.
[0049] In some embodiments, a plurality of IDEs 202, 208, one or more buses 106, contact pads 120, and one or more elongated paths and / or portions (e.g., readouts) between the buses 106 and the contact pads 120 may consist of the same layer of deposited metal (e.g., Au, Pt, and / or other metals). This metal layer may be defined by photolithography. For example, a layer of metal may be deposited on the sensor die, or a layer of photoresist may be deposited on the layer of metal and then partially removed to define a desired area (e.g., a plurality of IDEs, one or more readouts, one or more buses, and / or one or more contact pads), or the layer of metal may be etched such that only the area having the remaining photoresist is etched away, and / or the remaining photoresist is removed.
[0050] Figure 3A shows a top view of a sensor die 300A according to one or more embodiments of the present disclosure. The sensor die 300A may be configured to measure impedance and / or impedance fluctuations, for example, to detect the presence of vapor. The sensor die 300A comprises a substrate 102+104, one or more buses 106, and a plurality of comb electrodes (IDEs) 202. As shown, one or more buses 106 include a first bus 106A and a second bus 106B. The sensor die 300A may comprise other components not shown.
[0051] As described herein, one or more buses 106 can have various shapes. In Figure 3A, each of the first bus 106A and the second bus 106B is composed of semicircular shapes so as to collectively form a circular shape. This circular shape has one or more gaps between the first bus 106A and the second bus 106B. Each of the two substantially semicircular buses 106 extends from one or more contact pads via one or more elongated paths and / or portions.
[0052] A plurality of IDEs 202, 208 may comprise a first plurality of elongated electrodes 202 and a second plurality of elongated electrodes 208. The first plurality of elongated electrodes 202 are electrically connected to and extend from a first bus 106A. The second plurality of elongated electrodes 208 are electrically connected to and extend from a second bus 106B. The first plurality of electrodes 202 and / or the second plurality of electrodes 208 may extend from one or more inner edges of each of the one or more buses 106, where the “inner edge” of each bus 106 can be defined as the edge of one or more buses 106 (e.g., 106A) that is closer to the opposite bus (e.g., 106B). Each of the first plurality of electrodes 202 and the second plurality of electrodes 208 extends from the opposing bus and is configured to interlock with each other to form a plurality of comb-shaped electrodes 202, 208. Multiple IDE202, 208 electrodes may consist of metals such as metal films. The metal film may be a gold film, a platinum film, and / or other types of metal films.
[0053] Figure 3B shows a top view of a sensor die 300B according to one or more embodiments of the present disclosure. The sensor die 300B may be configured to measure impedance and / or impedance fluctuations, for example, to detect the presence of vapor. The sensor die 300B comprises a substrate 102+104, one or more buses 106, and a plurality of comb electrodes (IDEs) 202, 208. As shown, one or more buses 106 include a first bus 106A and a second bus 106B. The sensor die 300B may comprise other components not shown.
[0054] As described herein, one or more buses 106 can have various shapes. In Figure 3B, each of the first bus 106A and the second bus 106B is configured to extend from their respective contact pads and form at least a portion of the outer perimeter surrounding a plurality of IDEs 202, 208. The first bus 106A and the second bus 106B are substantially semi-quadrilaterals such that the two corresponding buses form a substantially quadrilateral shape (e.g., rectangle, square, etc.). This substantially quadrilateral shape may include one or more gaps between one or more buses 106 and / or other parts of the sensor die 300B.
[0055] Multiple IDEs 202, 208 may comprise a first plurality of elongated electrodes 202 and a second plurality of elongated electrodes 208. The first plurality of elongated electrodes 202 are electrically connected to and extend from the first bus 106A. The second plurality of elongated electrodes 208 are electrically connected to and extend from the second bus 106B. The first plurality of electrodes 202 and / or the second plurality of electrodes 208 extend from one or more inner edges of one or more respective buses 106, are arranged in an interlocking configuration, and may be made of metal as described herein.
[0056] Figure 4 shows a top view of a sensor die 400 having a boundary 402 according to one or more embodiments of the present disclosure. The sensor die 400 comprises a substrate 102+104, two buses 106A, 106B, and a plurality of comb-shaped electrodes 202, 208. An exemplary boundary 402 surrounds these components.
[0057] The boundary 402 encloses the illustrated components of the sensor die 400 and defines an exemplary circular boundary 402 having a shape substantially the same as or similar to the combined bus 106. For example, in the case of a sensor die 400 having two semicircular buses 106A and 106B, the boundary 402 is a circle. The boundary 402 may define a region where SPE may exist. During the construction of the sensor die 400, the boundary 402 may define a region where SPE or another electrolyte is deposited.
[0058] The sensor die 400 may include other components not shown. Additionally or alternatively, as shown in the embodiment of Figure 4, the sensor die 400 may omit the retaining ring 108 described herein. Alternatively, in some embodiments, the boundary 402 may define the region inside the first retaining ring 108.
[0059] Figure 5A shows a top view of a portion of a sensor die according to one or more embodiments of the present disclosure. In various embodiments, the portion of the sensor die shown in Figure 5A is the same as the portion of the sensor die shown in Figure 3A. The portion of the sensor die shown in Figure 5A includes a portion of a substantially semicircular bus 106 (e.g., 106A), a portion of a first plurality of IDEs 202, and a portion of a second plurality of IDEs 208. The semicircular bus 106 may have a width 502, which can be a consistent width. The first plurality of IDEs 202 are electrically connected to the bus 106. In various embodiments, the first plurality of IDEs 202 may include one or more portions of the first plurality of IDEs 202 that are superimposed on the bus 106 and / or electrically connected to the bus 106 at their ends or edges. The second plurality of IDEs 208 are arranged to interlock or mesh with the first plurality of IDEs 202. The second set of IDEs 208 are not electrically connected to the illustrated bus 106. Instead, as described herein, the second set of IDEs 208 are electrically connected to a corresponding bus (e.g., 106B) not shown in Figure 5A. Each of the second set of IDEs 208 is spaced a distance 504 from bus 106. Distance 504 is a consistent distance that isolates the second set of IDEs from bus 106 (the same consistent distance that isolates the first set of IDEs from the second bus 106B, which is not shown). The spacing of distance 504 may allow for additional impedance changes when steam is present. It will be understood that the first set of IDEs 202, not shown, are also spaced a similar distance from the second bus (e.g., 106B).
[0060] Each of the individual electrodes of a plurality of IDE202,208 may have a first width W1. Each individual electrode may be spaced apart from each adjacent electrode by the same width W1. Additionally or alternatively, adjacent electrodes may have different lengths.
[0061] Figure 5B is a top view of a portion of a sensor die according to one or more embodiments of the present disclosure. In various embodiments, the portion of the sensor die shown in Figure 5B is the same as the portion of the sensor die shown in Figure 3B. The portion of the sensor die shown in Figure 5B comprises a substantially semi-quadrilateral bus 106, a portion of a first plurality of IDEs 202, and a portion of a second plurality of IDEs 208. The bus 106 may have a width 502, which may be a consistent width. The first plurality of IDEs 202 are electrically connected to the bus 106. In various embodiments, the first plurality of IDEs 202 may include one or more portions of the first plurality of IDEs 202 that are superimposed on the bus 106 and / or electrically connected to the bus 106 at their ends or edges. The second plurality of IDEs 208 are arranged to interlock or mesh with the first plurality of IDEs 202. The second plurality of IDEs 208 are not electrically connected to the illustrated bus 106. Instead, as described herein, the second plurality of IDE208s are electrically connected to a corresponding bus (e.g., 106B) not shown in Figure 5A. Each of the second plurality of IDE208s is spaced 504 units away from bus 106. Although not shown, it will be understood that the first plurality of IDE202s are also spaced a similar distance away from the second bus (e.g., 106B).
[0062] Figure 5C shows a top view of a portion of a sensor die according to one or more embodiments of the present disclosure. In various embodiments, the portion of the sensor die shown in Figure 5C is the same as the portion of the sensor die shown in Figure 4. The portion of the sensor die shown in Figure 5C includes a portion of a substantially semicircular bus 106 (e.g., 106A), a portion of a first plurality of IDEs 202, and a portion of a second plurality of IDEs 208. The plurality of electrodes 202, 208 in Figure 5C are similar to those in Figure 5A, except that each of the plurality of IDEs 202, 208 in Figure 5C may have a second width W2. The second width W2 may be smaller than the first width W1. Each individual electrode may be spaced apart from adjacent electrodes by the second width W1.
[0063] Figure 6 shows a flowchart of an exemplary method 600 for constructing a sensor die according to one or more embodiments of the present disclosure. In some embodiments, the sensor die may be a silicon die, such as a silicon-based SPE sensor die.
[0064] In process / operation 602, at least one comb-shaped electrode (IDE) 202, 208 may be fabricated on the surface of the substrate 102+104. In some embodiments, at least one comb-shaped electrode 202, 208 may consist of a metal film. In some embodiments, the metal film may consist of gold, platinum, and / or other materials. At least one IDE 202, 208 may comprise one or more electrodes 202, 208 of a first width spaced apart from each other by a distance equal to the first width. Alternatively or additionally, at least one IDE 202, 208 may comprise one or more electrodes of a second width spaced apart from each other by a distance equal to the first width. At least one IDE 202, 208 comprises one or more electrodes electrically connected to one or more buses 106 (e.g., 106A or 106B). In some embodiments, one or more buses 106 are configured to substantially enclose at least one region containing one or more electrodes 202, 208.
[0065] In process / operation 604, one or more retaining rings may be fabricated that define one or more regions configured to contain at least a certain volume of material. One or more retaining rings 108 may be fabricated to define a volume or region. In a subsequent process / operation, SPE or another electrolyte may be deposited in this volume, thereby allowing the SPE or electrolyte to flow into the volume and fill it.
[0066] In various embodiments, step / operation 604 may be omitted. For example, in embodiments where one or more retaining rings 108 are not required to define the volume containing the SPE or electrolyte when depositing the SPE or electrolyte, the retaining rings 108 may be omitted, and step / operation 604 may be omitted. In such embodiments, step / operation 606 may follow step / operation 602.
[0067] In process / operation 606, the sensing layer may be positioned in close proximity to at least one IDE 202, 208 such that the sensing layer covers at least one comb-shaped electrode. In some embodiments, the sensing layer 110 is made of a metal and / or other material.
[0068] In process / operation 608, the sensor die is configured to measure impedance variations via a plurality of IDEs 202, 208 and a sensing layer 110 that detect the presence of material. In various embodiments, the material may be vapor, such as vapor leaked from a battery. The presence of vapor can change the impedance of the sensing layer, which may be measured at the contact pad 120.
[0069] The operations and processes described herein support combinations of means for performing a specified function and combinations of operations for performing a specified function. It will be understood that one or more operations, and combinations of operations, may be performed by a dedicated hardware-based computer system or a combination of dedicated hardware and computer instructions for performing the specified function.
[0070] In some exemplary embodiments, certain operations of the Specified Operation may be modified or further extended as described below. Furthermore, in some embodiments, additional optional operations may also be included. It should be understood that each of the modifications, optional additions, or extensions described herein may be included with the Operations of the Specified Operation either alone or in combination with any other feature of the Features described herein.
[0071] The descriptions of the methods and processes described herein are provided merely as examples and are not intended to require or suggest that the steps of the various embodiments must be performed in the order presented. As those skilled in the art will understand, the order of the steps in the embodiments described herein may be performed in any order. Words such as “then,” “next,” and similar words are not intended to limit the order of the steps. These words are simply used to guide the reader through the description of the methods. Furthermore, any reference to a claim element in the singular form using, for example, the articles “a,” “a,” or “the” should not be interpreted as limiting the element to the singular form, and in some cases may be interpreted as plural.
[0072] Various embodiments of the principles disclosed herein have been shown and described above, and modifications thereof can be made by those skilled in the art without departing from the teachings of this disclosure. The embodiments described herein are merely representative and are not intended to be limiting. Many variations, combinations, and modifications are possible and within the scope of this disclosure. Alternative embodiments resulting from combining, integrating, and / or omitting features of the embodiments are also within the scope of this disclosure. Accordingly, the scope of protection is not limited by the above description but is defined by the claims that follow, which include all equivalents of the subject matter of the claims. Each and all of the claims are incorporated herein as further disclosures, and the claims are embodiments of this disclosure. Furthermore, any of the above advantages and features may relate to a particular embodiment, but the application of such issued claims is not limited to processes and structures that achieve any or all of the above advantages or have any or all of the above features.
[0073] In addition, the section headings used herein are provided to be consistent with the suggestions under 37, Section 1.77 of the Code of Federal Regulations, or to provide a structural implication. These headings are not intended to limit or characterize the disclosures described in any claims that may be issued from this disclosure. For example, the description of the technology in “Background Art” should not be construed as acknowledging that a particular technology is prior art to any disclosure in this disclosure. Similarly, “Summary of the Invention” should not be considered a limiting feature of the disclosures described in any claims that may be issued. Furthermore, no reference in this disclosure to the singular “Disclosure” or “Embodiment” should be used to assert that there is only one point of novelty in this disclosure. Multiple embodiments of this disclosure may be described in accordance with the limitations of multiple claims that may be issued from this disclosure, and such claims will therefore define this disclosure and their equivalents protected thereby. In all cases, the claims should be considered on their own merit in light of this disclosure, but should not be limited by the headings described herein.
[0074] Furthermore, the systems, subsystems, apparatus, techniques, and methods described and illustrated individually or separately in various embodiments may be combined with or integrated with other systems, modules, techniques, or methods without departing from the scope of this disclosure. Other devices or components shown or described as being coupled to or communicating with one another may be indirectly coupled, whether electrically, mechanically, or otherwise, through several intermediate devices or components. Other embodiments of modifications, substitutions, and alterations are readily apparent to those skilled in the art and can be made without departing from the scope disclosed herein.
[0075] Many modifications and other embodiments of the disclosure described herein will be conceived by those skilled in the art who are interested in these embodiments and who benefit from the teachings presented in the foregoing description and the accompanying drawings. The drawings show only certain components of the apparatus and systems described herein, but various other components may be used in conjunction with the components and structures disclosed herein. It should be understood that this disclosure is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. For example, various elements or components may be combined, rearranged, or integrated in another system, or certain features may be omitted or not implemented. Furthermore, the steps in any of the methods described above do not necessarily have to be performed in the order depicted in the appended drawings, and in some cases one or more of the depicted steps may be performed substantially simultaneously or may involve additional steps. Certain terms are used herein, but they are used in a general and descriptive sense only and not for limiting purposes.
Claims
1. A device for detecting steam, A substrate made of bulk silicon having a thin film of silicon oxide, Multiple comb-shaped electrodes (IDEs) made of metal are arranged in close proximity to the surface of the substrate, A solid polymer electrolyte (SPE) sensing layer is positioned in close proximity to the plurality of IDEs, A device comprising: one or more retaining rings defining one or more regions between which are configured to include at least one volume of SPE, The plurality of IDEs each comprises one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width. The plurality of IDEs each comprises one or more electrodes of a second width, and the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, and the first width and the second width are different. The apparatus wherein the plurality of IDEs each comprises one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially surround at least one region encompassing the one or more electrodes.
2. A system for detecting steam, Lithium-ion battery, A sensor die for detecting steam based on measuring impedance fluctuations, A substrate made of bulk silicon having a thin film of silicon oxide, Multiple comb-shaped electrodes (IDEs) made of metal are arranged in close proximity to the surface of the substrate, A solid polymer electrolyte (SPE) sensing layer is positioned in close proximity to the plurality of IDEs, A sensor die comprising: one or more retaining rings defining one or more regions between which are configured to include at least one volume of SPE; The plurality of IDEs each comprises one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width. The plurality of IDEs each comprises one or more electrodes of a second width, and the one or more electrodes of the second width are spaced apart from each other by a distance equal to the first width, and the first width and the second width are different. A system in which the plurality of IDEs each comprises one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially surround at least one region encompassing the one or more electrodes.
3. A method for constructing a device for detecting steam, The method involves depositing multiple comb-shaped electrodes (IDEs) made of metal onto the surface of a substrate, wherein the substrate is made of bulk silicon having a thin film of silicon oxide. The plurality of IDEs each comprises one or more electrodes of a first width, and the one or more electrodes of the first width are spaced apart from each other by a distance equal to the first width. The plurality of IDEs each comprises one or more electrodes electrically connected to one or more buses, and the one or more buses are configured to substantially enclose at least one region encompassing the one or more electrodes. A sensing layer made of a solid polymer electrolyte (SPE) is deposited in close proximity to the plurality of IDEs such that the sensing layer covers at least the plurality of IDEs. To fabricate one or more retaining rings that define one or more regions between them, configured to include at least one volume of SPE, A method comprising configuring a sensor die to detect the presence of the vapor by measuring impedance fluctuations through the plurality of IDEs and the sensing layer.