Substrate polishing apparatus including main membrane and annular membrane

Abstract

The present invention provides a substrate polishing apparatus including a main membrane and an annular membrane. [Solution] A substrate polishing apparatus according to one embodiment may include a carrier head, a membrane connected to the carrier head, and a retainer ring connected to the carrier head so as to surround the outside of the membrane. The membrane may include a main membrane connected to the lower part of the carrier head, and an annular membrane connected to the lower part of the carrier head so as to be located between the carrier head and the main membrane, and formed in an annular shape. The annular membrane may be formed separately from the main membrane.

Description

Technical Field

[0001] The following embodiments relate to a substrate polishing apparatus including a main membrane and an annular membrane.

Background Art

[0002] In the manufacture of semiconductor devices, CMP (chemical mechanical polishing) operations including polishing, buffing, and cleaning are required. Semiconductor devices are in the form of a multilayer structure, and transistor elements having diffusion regions are formed in the substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming functional elements. As is well known, the patterned conductive layer is insulated from other conductive layers by an insulating material such as silicon dioxide. As more metal layers and related insulating layers are formed, the need to flatten the insulating material increases. If not flattened, due to many variations in the surface morphology, the manufacture of further metal layers becomes substantially more difficult. Also, the metal line pattern is formed of an insulating material, and excess metal is removed by metal CMP operations.

[0003] Conventionally, a substrate has been gripped using an integral membrane connected to the lower part of a carrier head. However, in the case of such an integral membrane, when a negative pressure is applied to each chamber, there has been a problem that the substrate touches the clamp portion of the carrier head to which the membrane is connected, and an impact is applied to the substrate. Therefore, in the process of gripping the substrate, there is a situation where a structure is needed to prevent the substrate from colliding with the clamp portion of the carrier head.

[0004] The above background art is what the inventors have held or acquired in the process of deriving the disclosure of the present application, and is not necessarily known art that has been publicly disclosed to the general public before the present application.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One embodiment aims to provide a membrane that can reduce the impact applied to a substrate during the process of gripping the substrate, and a substrate polishing apparatus including the same.

[0006] One embodiment aims to provide a membrane that can apply negative pressure to some chambers and positive pressure to other chambers, and a substrate polishing apparatus including the same. [Means for solving the problem]

[0007] A substrate polishing apparatus according to one embodiment may include a carrier head, a membrane connected to the carrier head, and a retainer ring connected to the carrier head so as to surround the outside of the membrane. The membrane may include a main membrane connected to the lower part of the carrier head, and an annular membrane connected to the lower part of the carrier head so as to be located between the carrier head and the main membrane, and formed in an annular shape. The annular membrane may be formed separately from the main membrane.

[0008] In one embodiment, the main membrane may include a main bottom plate and at least one main flap extending upward from the main bottom plate, at least in part, so as to form at least one basic chamber.

[0009] In one embodiment, the annular membrane may include an annular bottom plate positioned between the carrier head and the main bottom plate so as to overlap with the main bottom plate, and a pair of annular flaps extending upward from both sides of the annular bottom plate, at least in part, so as to form an annular chamber.

[0010] In one embodiment, the annular membrane can be located inside the basic chamber of the main membrane. The basic chamber can be divided into a plurality of compartment chambers by the annular flap.

[0011] In one embodiment, the partition chamber can be formed between the annular flap and the main flap, which are located adjacent to each other.

[0012] In one embodiment, the annular membrane may consist of multiple annular membranes, each of which may have a different diameter from the others.

[0013] In one embodiment, the partition chamber can be formed between two adjacent annular membranes by their respective annular flaps.

[0014] In one embodiment, the annular chamber and the plurality of compartmentalized chambers can be configured so that their internal pressures are controlled independently.

[0015] In one embodiment, in order to attract a substrate to the main bottom plate of the main membrane, negative pressure can be applied to at least some of the plurality of compartmentalized chambers, and positive pressure can be applied to the annular chamber.

[0016] In one embodiment, during the process of adsorbing the substrate onto the main bottom plate of the main membrane, the annular bottom plate of the annular membrane can be kept separated from the lower part of the carrier head.

[0017] A membrane for connection to a carrier head according to one embodiment may include a main membrane connected to the lower part of the carrier head, and an annular membrane connected to the lower part of the carrier head and formed in an annular shape, positioned between the carrier head and the main membrane. The annular membrane may be formed separately from the main membrane.

[0018] In one embodiment, the main membrane may include a main bottom plate and at least one main flap extending upward from the main bottom plate, at least in part, so as to form at least one basic chamber.

[0019] In one embodiment, the annular membrane may include an annular bottom plate positioned between the carrier head and the main bottom plate so as to overlap with the main bottom plate, and a pair of annular flaps extending upward from both sides of the annular bottom plate, at least in part, so as to form an annular chamber.

[0020] In one embodiment, the annular membrane can be located inside the basic chamber of the main membrane. The basic chamber can be divided into a plurality of compartment chambers by the annular flap.

[0021] In one embodiment, the partition chamber can be formed between the annular flap and the main flap, which are located adjacent to each other.

[0022] In one embodiment, the annular membrane may consist of multiple annular membranes, each of which may have a different diameter from the others.

[0023] In one embodiment, the partition chamber can be formed between two adjacent annular membranes by their respective annular flaps. [Effects of the Invention]

[0024] According to one embodiment of the membrane and the substrate polishing apparatus containing it, the impact applied to the substrate during the substrate gripping process can be reduced.

[0025] According to one embodiment of a membrane and a substrate polishing apparatus including the same, negative pressure can be applied to some chambers and positive pressure to other chambers.

[0026] According to a membrane according to an embodiment and a substrate polishing apparatus including the same, in the process of adsorbing a substrate to the membrane, it is possible to reduce or prevent the substrate from colliding with the lower part of the carrier head.

[0027] The effects of the membrane according to an embodiment and the substrate polishing apparatus including the same are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

Brief Description of the Drawings

[0028] [Figure 1] It is a schematic perspective view of a substrate polishing apparatus according to an embodiment. [Figure 2] It is a cross-sectional view showing a part of a substrate carrier according to an embodiment.

Modes for Carrying Out the Invention

[0029] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, various changes may be made to the embodiments, and the scope of the patent application is not limited or restricted by such embodiments. It should be understood that all changes, equivalents or alternatives to the embodiments are included in the scope of the rights.

[0030] The terms used in the embodiments are for illustrative purposes only and should not be construed as being intended to limit. Singular expressions include plural expressions unless the context clearly indicates a different meaning. In this specification, terms such as "including" or "having" are used to specify the presence of features, numbers, steps, operations, components, parts or combinations thereof described in the specification, and should not be construed as precluding the presence or addition possibility of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0031] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as those generally understood by a person of ordinary skill in the art to which the embodiments pertain. Terms defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not as ideal or overly formal unless explicitly defined herein.

[0032] Furthermore, when explaining with reference to the attached drawings, the same reference numerals will be used for the same components, regardless of the reference numerals in the drawings, and redundant explanations related thereto will be omitted. When describing embodiments, if it is determined that a specific explanation of related prior art may obscure the gist of the embodiment, such detailed explanation will be omitted.

[0033] Furthermore, when describing the components of an embodiment, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are used to distinguish a component from other components, and the terms do not limit the nature, order, or sequence of the component. When it is stated that a component is “connected,” “joined,” or “connected” to another component, it should be understood that while that component may be directly connected or connected to other components, other components may also be “connected,” “joined,” or “connected” between each component.

[0034] Components included in any one embodiment and components with common functions will be described using the same names in other embodiments. Unless otherwise stated, the descriptions in any one embodiment are applicable to other embodiments, and specific descriptions will be omitted to the extent that they overlap.

[0035] Figure 1 is a schematic perspective view of a substrate polishing apparatus according to one embodiment.

[0036] Referring to Figure 1, the substrate polishing apparatus 1 according to one embodiment may be an apparatus for polishing a substrate. For example, the substrate polishing apparatus 1 can be used in the CMP (Chemical Mechanical Polishing) process of a substrate.

[0037] In one embodiment, the substrate may be a silicon wafer for semiconductor manufacturing. However, the type of substrate is not limited thereto. For example, the substrate may include glass for flat panel display devices (FPDs) such as LCDs (liquid crystal displays) or PDPs (plasma display panels).

[0038] In one embodiment, the substrate polishing apparatus 1 may include a substrate carrier 10 and a platen 20.

[0039] In one embodiment, the substrate carrier 10 can grip a substrate. The substrate carrier 10 can chucking and grip the substrate and move the gripped substrate upward toward the polishing pad P. The substrate carrier 10 can polish the substrate by bringing the substrate, which has been moved upward toward the polishing pad P, into contact with the polishing pad P. The substrate carrier 10 can adjust the frictional force between the substrate and the polishing pad P by applying pressure to the substrate in contact with the polishing pad P, thereby adjusting the degree of polishing of the substrate.

[0040] In one embodiment, the substrate carrier 10 can adjust the position of the substrate. The substrate carrier 10 can rotate about an axis perpendicular to the surface of the polishing pad P. The substrate held by the substrate carrier 10 can be polished while rotating in contact with the polishing pad P as the substrate carrier 10 rotates.

[0041] In one embodiment, the substrate carrier 10 can move the substrate horizontally. As the substrate carrier 10 moves horizontally, the substrate can be transported to the polishing position or removed from the polishing position.

[0042] In one embodiment, the substrate carrier 10 can move the substrate vertically relative to the ground. The substrate carrier 10 can move vertically relative to the substrate support for chucking / dechucking the substrate, or vertically relative to the polishing pad P for polishing the substrate.

[0043] In one embodiment, a polishing pad P can be placed on the platen 20. For example, the polishing pad P can be placed on the top of the platen 20. The platen 20 can polish the surface of the substrate that is in contact with the polishing pad P while rotating around its axis.

[0044] Figure 2 is a cross-sectional view illustrating a portion of a substrate carrier according to one embodiment. Although only a portion of the substrate carrier 10 is shown in Figure 2 for the sake of explanation, it is obvious to any ordinary engineer that each component of the substrate carrier 10 is formed radially and symmetrically around the central axis A.

[0045] Referring to Figures 1 and 2, a substrate carrier 10 according to one embodiment may include a carrier head 11, a retainer ring 13, and a membrane 40.

[0046] In one embodiment, the carrier head 11 can form at least a portion of the appearance of the substrate carrier 10. Various components of the substrate carrier 10 can be connected to and / or positioned on the carrier head 11. The carrier head 11 can be configured to be rotatable with respect to a central axis A. A clamp 14 can be formed at the bottom of the carrier head 11 for connecting the membrane 40.

[0047] In one embodiment, the retainer ring 13 can be connected to the lower part of the carrier head 11 so as to surround the membrane 40 from the outside. The retainer ring 13 can surround the substrate W held by the membrane 40 from the outside. The retainer ring 13 can prevent the substrate W from detaching from the position in which it is held. For example, the retainer ring 13 can support the sides of the substrate W so as not to detach from the substrate carrier 10 due to vibration and / or friction that occurs during the polishing process.

[0048] In one embodiment, the membrane 40 can be connected to the lower part of the carrier head 11. The membrane 40 may be configured to grip the substrate W. The membrane 40 can be made of an elastically deformable material.

[0049] In one embodiment, the membrane 40 may include a main membrane 50 and an annular membrane 60.

[0050] In one embodiment, the main membrane 50 can be connected to the lower part of the carrier head 11. For example, the main membrane 50 can be connected to clamps (e.g., 141, 143, 144) formed on the lower part of the carrier head 11. The main membrane 50 can be made of an elastically deformable material. The main membrane 50 may include a main bottom plate 51 and a main flap 52.

[0051] In one embodiment, the main base plate 51 can be formed in a substantially disc shape. The substrate W can be in direct contact with the lower surface of the main base plate 51. For example, the main base plate 51 can be formed to a size substantially corresponding to the substrate W. However, this is illustrative, and the shape and / or size of the main base plate 51 is not limited thereto.

[0052] In one embodiment, the main flap 52 may be a portion that functions as a side wall and / or partition wall of the main membrane 50. The main flap 52 may be a portion that connects to clamps (e.g., 141, 143, 144) formed at the bottom of the carrier head 11. At least a portion of the main flap 52 may extend upward from the main bottom plate 51. For example, the main flap 52 may include a vertical portion and / or a horizontal portion. For example, the main flap 52 may include a portion that is retractably folded in the vertical and / or horizontal directions. At least one or more main flaps 52 may be formed.

[0053] In one embodiment, the main flap 52 can form at least one basic chamber 53. For example, the basic chamber 53 may include a first basic chamber 531, a second basic chamber 532, and a third basic chamber 533. The basic chamber 53 may mean a space partially enclosed by the main bottom plate 51 and / or the main flap 52. The basic chamber 53 can be substantially annular or cylindrical. For example, with the main membrane 50 connected to the carrier head 11, the basic chamber 53 may be enclosed by at least the lower part of the carrier head 11, the main flap 52, and the main bottom plate 51 (e.g., the first basic chamber 531 and the second basic chamber 532). Alternatively, with the main membrane 50 connected to the carrier head 11, the basic chamber 53 may be enclosed by at least the lower part of the carrier head 11 and the main flap 52 (e.g., the third basic chamber 533).

[0054] In one embodiment, at least one basic chamber 53 can be partitioned into a plurality of compartment chambers 54 by an annular membrane 60, which will be described later. For example, as shown in Figure 2, the second basic chamber 532 can be partitioned into a plurality of compartment chambers (e.g., 541, 542, 543) by an annular membrane 60, which will be described later. For example, the first basic chamber 531 and the third basic chamber 533 can form independent chambers separate from the annular membrane 60. However, this is illustrative, and the number of basic chambers 53 and / or the positions in which they are partitioned are not limited thereto.

[0055] In one embodiment, the annular membrane 60 can be connected to the lower part of the carrier head 11. The annular membrane 60 can be located between the carrier head 11 and the main membrane 50. The annular membrane 60 can be formed substantially in an annular shape. The annular membrane 60 can be formed separately from the main membrane 50. The annular membrane 60 can be formed from an elastically deformable material. Multiple annular membranes 60 can be provided. Each of the multiple annular membranes 60 can have a different diameter from one another. For example, the annular membrane 60 may include a first annular membrane 60-1 and a second annular membrane 60-2. However, this is illustrative, and the number of annular membranes 60 is not limited thereto.

[0056] In one embodiment, the annular membrane 60 may include an annular base plate 61 and an annular flap 62.

[0057] In one embodiment, the annular base plate 61 can be formed in a substantially annular plate shape. The annular base plate 61 can be positioned between the carrier head 11 and the main base plate 51. The annular base plate 61 can be positioned to overlap the main base plate 51. For example, the annular base plate 61 can be in close contact with the main base plate 51. For example, the lower surface of the annular base plate 61 can be in close contact with the upper surface of the main base plate 51.

[0058] In one embodiment, the annular flap 62 may be a portion that functions as a side wall of the annular membrane 60. The annular flap 62 may also be a portion for connection to clamps (e.g., 142, 143) formed at the bottom of the carrier head 11. The annular flaps 62 may be provided in pairs. A pair of annular flaps 62 may extend upward from both sides of the annular base plate 61, at least in part. For example, the annular flap 62 may include a vertical portion and / or a horizontal portion. For example, the annular flap 62 may include a portion that is expandable and contractible in the vertical and / or horizontal directions.

[0059] In one embodiment, the annular flap 62 can form an annular chamber 63. The annular chamber 63 may mean a space partially enclosed by the annular base plate 61 and / or the annular flap 62. The annular chamber 63 can be substantially annular in shape. For example, with the annular membrane 60 connected to the carrier head 11, the annular chamber 63 may be enclosed by at least the lower part of the carrier head 11, the annular flap 62 and the annular base plate 61.

[0060] In one embodiment, the annular membrane 60 can be located inside the basic chamber 53 of the main membrane 50. By positioning the annular membrane 60 inside the basic chamber 53, the basic chamber 53 can be partitioned into a plurality of compartment chambers 54. For example, the basic chamber 53 can be partitioned into a plurality of compartment chambers 54 by at least annular flaps 62. For example, as shown in Figure 2, the second basic chamber 532 can be partitioned into at least three compartment chambers 541, 542, and 543. For example, the first compartment chamber 541 and the third compartment chamber 543 can be formed between annular flaps 62 and main flaps 52 that are adjacent to each other. For example, the first compartment chamber 541 and the third compartment chamber 543 can be surrounded by annular flaps 62, main flaps 52, main bottom plate 51, and the lower part of the carrier head 11, respectively. For example, the second compartment chamber 542 can be formed by the annular flaps 62 between two adjacent annular membranes 60-1 and 60-2. For example, the second compartment chamber 542 can be enclosed by the annular flaps 62 of two adjacent annular membranes 60-1 and 60-2, the main bottom plate 51, and the lower part of the carrier head 11. However, Figure 2 is illustrative and the number and / or position of the annular membranes 60 are not limited thereto. For example, the annular membranes 60 may be located in the first basic chamber 531.

[0061] In one embodiment, the annular chamber 63 and the base chamber 53 can be configured so that their internal pressures are controlled independently. For example, the annular chamber 63 and the plurality of compartment chambers 54 can be configured so that their internal pressures are controlled independently. For example, by having the annular bottom plate 61 in close contact with the main bottom plate 51, the annular chamber 63 and the plurality of compartment chambers 54 can be separated from each other and function as independent chambers. Each of the annular chamber 63 and the plurality of compartment chambers 54 can be connected to its own pressure supply source (not shown). During the process of polishing the substrate W, the polishing profile of the substrate W can be controlled by controlling the pressure applied to each of the annular chamber 63 and the plurality of compartment chambers 54. On the other hand, this is illustrative, and the base chamber 53 may be partitioned into the plurality of compartment chambers 54, and the base chamber 53 may be controlled substantially as a single chamber. For example, the plurality of compartment chambers 541, 542, 543 may be controlled to be substantially in communication with each other and to have the same pressure.

[0062] In one embodiment, the substrate W can be adsorbed onto the main bottom plate 51 in order to chuck the substrate W onto the membrane 40. Since the annular chamber 63 and the plurality of compartment chambers 54 are controllable independently of each other, different pressures can be applied to each of the annular chamber 63 and the plurality of compartment chambers 54. For example, in order to adsorb the substrate W onto the main bottom plate 51 of the main membrane 50, negative pressure can be applied to at least some of the plurality of compartment chambers 54, and positive pressure can be applied to the annular chamber 63. With such control, during the process of adsorbing the substrate W onto the main bottom plate 51 of the main membrane 50, the positive pressure applied to the annular chamber 63 can maintain the annular bottom plate 61 of the annular membrane 60 in a state of separation from the lower part of the carrier head 11. Therefore, during the process of adsorbing the substrate W onto the main bottom plate 51 of the main membrane 50, the phenomenon of the substrate W adsorbed onto the main bottom plate 51 directly colliding with the clamp (e.g., 142, 143) can be reduced or prevented. For example, the annular chamber 63 of the annular membrane 60 can be understood as an airbag to prevent the substrate W from colliding with the lower part of the carrier head 11.

[0063] As described above, embodiments are illustrated by limited drawings, but a person with ordinary skill in the art can apply various technical modifications and variations based on the above. For example, the above techniques may be performed in a different order than the above method, and / or the above-described components such as systems, structures, devices, and circuits may be combined or assembled in a different manner than the above method, or substituted or replaced by other components or equivalents, and still achieve suitable results.

[0064] Therefore, other realizations, other embodiments, and those equivalent to the claims described below also fall within the scope of the claims. [Explanation of Symbols]

[0065] 1 Substrate polishing equipment 11 Career Head 13 Retainer Rings 40 membranes 50 Main membrane 51 Main base plate 52 Main flap 60 cyclic membrane 61 Annular base plate 62 Annular flap

Claims

1. Career head and, A membrane connected to the carrier head, The membrane includes a retainer ring connected to the carrier head so as to surround the outside of the membrane, The aforementioned membrane is A main membrane connected to the lower part of the carrier head, It includes an annular membrane, which is connected to the lower part of the carrier head and formed in an annular shape, so as to be located between the carrier head and the main membrane, A substrate polishing apparatus wherein the annular membrane is formed separately from the main membrane.

2. The main membrane is, Main base plate and The substrate polishing apparatus according to claim 1, further comprising at least one main flap extending upward from the main bottom plate, at least in part, such that at least one basic chamber is formed.

3. The aforementioned annular membrane is Between the carrier head and the main bottom plate, there is an annular bottom plate positioned so as to overlap with the main bottom plate, The substrate polishing apparatus according to claim 2, further comprising a pair of annular flaps extending upward from both sides of the annular bottom plate, at least in part, so as to form an annular chamber.

4. The substrate polishing apparatus according to claim 3, wherein the annular membrane is located inside the basic chamber of the main membrane, and the basic chamber is divided into a plurality of partition chambers by the annular flap.

5. The substrate polishing apparatus according to claim 4, wherein the partition chamber is formed between the annular flap and the main flap, which are located adjacent to each other.

6. The substrate polishing apparatus according to claim 4, wherein the annular membrane comprises a plurality of annular membranes, each of which has a different diameter from the others.

7. The substrate polishing apparatus according to claim 6, wherein the partition chamber is formed between two adjacent annular membranes by their respective annular flaps.

8. The substrate polishing apparatus according to claim 4, wherein the annular chamber and the plurality of compartmentalized chambers are configured to have their internal pressures controlled independently.

9. The substrate polishing apparatus according to claim 8, wherein, in order to attract a substrate to the main bottom plate of the main membrane, negative pressure is applied to at least some of the plurality of compartmentalized chambers and positive pressure is applied to the annular chamber.

10. The substrate polishing apparatus according to claim 9, wherein, during the process of adsorbing the substrate onto the main bottom plate of the main membrane, the annular bottom plate of the annular membrane is kept separated from the lower part of the carrier head.

11. A membrane for connecting to a carrier head, A main membrane connected to the lower part of the carrier head, It includes an annular membrane, which is connected to the lower part of the carrier head and formed in an annular shape, so as to be located between the carrier head and the main membrane, The annular membrane is a membrane formed separately from the main membrane.

12. The main membrane is, Main base plate and The membrane according to claim 11, comprising at least one main flap extending upward from the main bottom plate, at least in part, such that at least one basic chamber is formed.

13. The aforementioned annular membrane is Between the carrier head and the main bottom plate, there is an annular bottom plate positioned so as to overlap with the main bottom plate, The membrane according to claim 12, further comprising a pair of annular flaps extending upward from both sides of the annular bottom plate, at least in part, so as to form an annular chamber.

14. The membrane according to claim 13, wherein the annular membrane is located inside the basic chamber of the main membrane, and the basic chamber is divided into a plurality of compartment chambers by the annular flap.

15. The membrane according to claim 14, wherein the partition chamber is formed between the annular flap and the main flap, which are located adjacent to each other.

16. The membrane according to claim 14, wherein the annular membrane comprises a plurality of annular membranes, each of which has a different diameter from the others.

17. The membrane according to claim 16, wherein the partition chamber is formed between two adjacent annular membranes by their respective annular flaps.

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