Light-emitting device

Abstract

To provide a display device with a high manufacturing yield. A display device in which color mixing between adjacent pixels is suppressed. To provide. [Solution] A first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, The first insulating layer has an adhesive layer, and the second insulating layer has a first opening, and the second insulating layer has a second opening The first and second openings are located between the first and second pixel electrodes. In a top view, the outer periphery of the second opening is located inward from the outer periphery of the first opening. The adhesive layer has a region that overlaps with the second insulating layer below the second insulating layer. Let it be placed there.

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the technical field is semiconductor devices, display devices, light-emitting devices, energy storage devices, and memory devices. Electronic equipment, lighting equipment, input devices, input / output devices, methods for driving them, or methods for manufacturing them. Law can be cited as one example.

[0003] In this specification, a semiconductor device is defined as a device that can function by utilizing semiconductor properties. This refers to all types of devices. Transistors, semiconductor circuits, computing units, and memory devices are all types of semiconductor devices. It appears that... Also, imaging devices, electro-optical devices, power generation devices (thin-film solar cells, organic thin-film solar cells) (including, etc.), and electronic devices may have semiconductor devices. [Background technology]

[0004] Organic EL (Electro-Luminescence) elements and liquid crystal elements are used. A display device is known. In addition, there are other devices such as light-emitting diodes (LEDs). Light-emitting devices equipped with light-emitting elements such as Emitting Diodes, electrophoretic methods, etc. Electronic paper displays can also be cited as an example of a display device.

[0005] The basic structure of an organic EL element involves sandwiching a layer containing a light-emitting organic compound between a pair of electrodes. This element is constructed by applying a voltage to it, thereby obtaining light emission from a light-emitting organic compound. This is possible. Display devices to which such organic EL elements are applied are thin, lightweight, and high-performance. A display device that is reliable and has low power consumption can be realized.

[0006] Patent Document 1 discloses a flexible light-emitting device to which an organic EL element is applied. .

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] One aspect of the present invention aims to provide a display device with a high production yield. Or , one aspect of the problem is to provide a display device in which color mixing between adjacent pixels is suppressed. Or, color reproduction One aspect of the problem is to provide a display device with high performance. Or, to provide a display device with a thin thickness . Or, one aspect of the problem is to provide a display device that is easy to manufacture. Or, to provide a display device with reduced power consumption . Or, one aspect of the problem is to provide a display device with high reliability.

[0009] Note that the description of these problems does not prevent the existence of other problems. One aspect of the present invention is not required to solve all of these problems. Also, problems other than those described above can be extracted from the description in the detailed specification and the like.

Means for Solving the Problems

[0010] One aspect of the present invention includes a first pixel electrode, a second pixel electrode, a first insulating layer, and a second insulating The device has an edge layer and an adhesive layer, and the first pixel electrode and the second pixel electrode are provided on the first insulating layer. The second insulating layer is provided on the first insulating layer, the first pixel electrode, and the second pixel electrode. The adhesive layer is provided on the first insulating layer, the second insulating layer, the first pixel electrode, and the second pixel electrode. The first insulating layer has a first opening, and the bottom surface of the first opening is the first insulating layer Located above the bottom surface, the second insulating layer has a second opening, and the second opening is a second By penetrating the insulating layer, it becomes one with the first opening, and the first opening and the second opening are , provided between the first pixel electrode and the second pixel electrode, and in a top view, the second aperture The outer periphery is located inside the outer periphery of the first opening, and the adhesive layer is located below the second insulating layer. This is a display device having a region that overlaps with a second insulating layer.

[0011] Furthermore, in the above, the length of the portion of the second insulating layer that protrudes in an overhang shape on the first insulating layer is A display device having a particle size of 0.05 μm or more and 5.0 μm or less is also one embodiment of the present invention.

[0012] Furthermore, in the above, the width of the short side of the second opening in the top view is 0.5 μm or more. A display device with a particle size of μm or less is also one embodiment of the present invention.

[0013] Furthermore, the first pixel electrode, the second pixel electrode, the first insulating layer, the second insulating layer, and bonding The device has a layer, and the first pixel electrode and the second pixel electrode are provided on the first insulating layer, and the second The insulating layer is provided on the first insulating layer, the first pixel electrode and the second pixel electrode, and the adhesive layer is , a second insulating layer, a first pixel electrode and provided on the second pixel electrode, the first insulating layer is It has an opening, the surface of which the first opening is covered with a second insulating layer, and the first opening The bottom surface is located above the bottom surface of the first insulating layer, and the first opening is connected to the first pixel electrode, The second insulating layer is provided between the second pixel electrodes, and the second insulating layer is located at the first opening. It has a first projection that protrudes in an overhang shape at the upper part of the side, and the adhesive layer is located below the first projection. A display device having a region superimposed on a second insulating layer is also one embodiment of the present invention.

[0014] Furthermore, in the above, the length of the first protrusion is 0.05 μm or more and 5.0 μm or less. A display device is also one aspect of the present invention.

[0015] Furthermore, in the above, the first insulating layer contains an organic resin material, and the second insulating layer contains an inorganic insulating material. A display device containing materials is also one aspect of the present invention.

[0016] Furthermore, in the above, the first insulating layer contains acrylic, and the second insulating layer contains silicone oxide nitride. A display device containing is also one aspect of the present invention. [Effects of the Invention]

[0017] According to one aspect of the present invention, a display device with a high manufacturing yield can be provided. Or, between adjacent pixels This can provide a display device in which color mixing is suppressed, or a display device with high color reproducibility. Alternatively, a thin display device can be provided. Alternatively, an easy-to-manufacture display device can be provided. Alternatively, a display device with reduced power consumption can be provided. Alternatively, a highly reliable display device can be provided. Cut.

[0018] Furthermore, one aspect of the present invention does not necessarily have to possess all of these effects. Other effects can be extracted from descriptions in the specification, drawings, claims, etc. [Brief explanation of the drawing]

[0019] [Figure 1] An example of the configuration of a display device according to an embodiment. [Figure 2] An example of the configuration of a display device according to an embodiment. [Figure 3] An example of the configuration of a display device according to an embodiment. [Figure 4] An example of the configuration of a display device according to an embodiment. [Figure 5] An example of the configuration of a display device according to an embodiment. [Figure 6] An example of the configuration of a display device according to an embodiment. [Figure 7] An example of the configuration of a display device according to an embodiment. [Figure 8] An example of the configuration of a display device according to an embodiment. [Figure 9] An example of the configuration of a display device according to an embodiment. [Figure 10] An example of the configuration of a display device according to an embodiment. [Figure 11] An example of the configuration of a display device according to an embodiment. [Figure 12] An example of the configuration of a display device according to an embodiment. [Figure 13] An example of the configuration of a display device according to an embodiment. [Figure 14] An example of the configuration of a display device according to an embodiment. [Figure 15] An example of the configuration of a display device according to an embodiment. [Figure 16] An example of the configuration of an input device according to an embodiment. [Figure 17] An example of the configuration of electrodes in an input device according to an embodiment. [Figure 18] An example of the configuration of a display device according to an embodiment. [Figure 19] An example of the configuration of a display device according to an embodiment. [Figure 20] An example of the configuration of a display device according to an embodiment. [Figure 21] An example of the configuration of a display device according to an embodiment. [Figure 22] An example of the configuration of a display device according to an embodiment. [Figure 23] An example of the configuration of a display device according to an embodiment. [Figure 24] A diagram illustrating an example of a driving method for an input device according to an embodiment. [Figure 25] An example of transistor configuration according to an embodiment. [Figure 26] An example of transistor configuration according to an embodiment. [Figure 27] An example of transistor configuration according to an embodiment. [Figure 28] A diagram illustrating a display module according to an embodiment. [Figure 29] A diagram illustrating an electronic device according to an embodiment. [Figure 30] A diagram illustrating an electronic device according to an embodiment. [Figure 31] A diagram illustrating an electronic device according to an embodiment. [Figure 32] A diagram illustrating an electronic device according to an embodiment. [Figure 33] A diagram illustrating an electronic device according to an embodiment. [Modes for carrying out the invention]

[0020] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Not specified, and without departing from the spirit and scope of the present invention, its form and details may vary. Those skilled in the art will readily understand that modifications are possible. Therefore, the present invention is as follows: This should not be interpreted as being limited to the contents described in the embodiments.

[0021] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0022] In the figures described herein, the size of each component, the thickness of the layer, or the area is clearly indicated. It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. .

[0023] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0024] (Embodiment 1) This embodiment describes an example of the configuration of a display device according to one aspect of the present invention.

[0025] A display device according to one aspect of the present invention has a plurality of pixels (sub-pixels). Each pixel includes a pixel electrode. It has a display element. The pixel electrode is provided on a first insulating layer, and the second insulating layer is provided on the pixel electrode and It is provided on the first insulating layer. Furthermore, on the first insulating layer, the pixel electrode and the second insulating layer An adhesive layer is provided.

[0026] Furthermore, between adjacent pixels, the first insulating layer and the second insulating layer each have an opening. The opening provided in the first insulating layer (referred to as the first opening) has a bottom surface that is the first It is located above the bottom surface of the insulating layer. Also, the opening (second opening) provided in the second insulating layer The opening (which is referred to as the mouth) is integrated with the first opening by penetrating the second insulating layer.

[0027] A display device, for example, has a display element, insulating layers, and an adhesive layer sandwiched between a pair of substrates. This configuration can be achieved. For example, one substrate may be provided with pixel electrodes for display elements, and the other The substrate and these components can be bonded together with an adhesive layer.

[0028] In a top view, the outer circumference of the second opening is located inward from the outer circumference of the first opening. Furthermore, the adhesive layer has a region that overlaps with the second insulating layer below the second insulating layer. Preferably, the interiors of the first and second openings are filled with an adhesive layer. In a cross-sectional view between adjacent pixels, the first and second openings appear as a single integrated opening. The structure involves a wedge-shaped (or anchor-shaped or double-ended hammer-shaped) adhesive layer fitting into the opening.

[0029] This configuration improves the adhesion between the first insulating layer, the second insulating layer, and the adhesive layer. It can be improved. For example, if a display device has an EL element as a display element, the pixel electricity An EL layer and a conductive film are provided between the electrode, the first insulating layer, the second insulating layer, and the adhesive layer. Because the adhesion between the EL layer and the conductive film is low, the EL layer and the conductive film face each other. When a force opposite to the direction is applied, delamination of the film may occur starting from the interface. This can occur, especially when manufacturing a display device that is flexible, but the display The device has the above configuration, which suppresses the peeling of the film. Therefore, reliability It can be used as a high-performance display device.

[0030] Furthermore, with this configuration, the EL layer in the first opening and the second opening Because they are cut or become extremely thin, leakage current between adjacent EL elements can be suppressed. Yes, it is possible. That is, the first aperture and / or the second aperture suppress color mixing between adjacent pixels. It can be said that it has the function of being able to display with high color reproduction. Cut.

[0031] Display elements include LEDs and OLEDs (Organic Light Emitting Devices). g Diode) or QLED(Quantum-dot Light Emitti) Elements such as ng Diodes, which can control the brightness of light emitted by the element by current or voltage. You can use it.

[0032] Below, we will explain more specific configuration examples with reference to the drawings.

[0033] [Configuration Example 1] Figure 1(A) is a schematic perspective view of a display device 10 according to one embodiment of the present invention. The display device 10 is The substrate 21 and substrate 31 are bonded together. In Figure 1(A), substrate 31 is shown as a dashed line. It is explicitly stated there.

[0034] The display device 10 has a display unit 32, a circuit 34, wiring 35, etc. The substrate 21 has, for example Circuit 34, wiring 35, and display unit 32, pixel electrode 23 (see Figure 1(B)), etc. are provided. Furthermore, Figure 1(A) shows an example in which IC43 and FPC42 are mounted on the substrate 21. It is showing.

[0035] Circuit 34 can be, for example, a circuit that functions as a scan line driving circuit.

[0036] The wiring 35 has the function of supplying signals and power to the display unit 32 and the circuit 34. Power is supplied to the wiring 35 via FPC42 from an external source or from IC43.

[0037] Furthermore, in Figure 1(A), the substrate 2 is formed using the COG (Chip On Glass) method, etc. This shows an example where IC43 is provided in 1. IC43 is, for example, a scan line drive circuit. Alternatively, an IC that functions as a signal line drive circuit or the like can be applied. Note that the display device 10 When a circuit is provided that functions as both a scan line drive circuit and a signal line drive circuit, or when a scan line drive circuit An external circuit is provided that functions as a signal line drive circuit, and the display device 10 is transmitted via the FPC42. In cases where a signal for driving is input, the configuration may be made without IC43. Furthermore, IC43 is mounted on FPC42 using the COF (Chip On Film) method, etc. You may do so.

[0038] [Pixel configuration example 1] [Pixel configuration example 1-1] Figure 1(B) shows the region 32A, which is part of the display unit 32 enclosed by a dashed circle in Figure 1(A). This is an enlarged top view. Figure 1(B) shows only the components of the display unit 32 that are necessary for explanation. It is.

[0039] The display unit 32 has a matrix arrangement of pixel electrodes 23, which are part of multiple display elements. Furthermore, apertures 11 and 12 are positioned between two adjacent pixel electrodes 23. The outer perimeter of opening 12 is located inside the outer perimeter of opening 11. In Figure 1(B), The outer periphery of the opening 11, which is covered by an insulating layer 82 (not shown), is indicated by a dashed line, and the opening 12 The outer perimeter is shown with a solid line. The outer perimeter of the pixel electrode 23, which is covered by the insulating layer 82, is shown with a dashed line. This is shown, and the areas of the pixel electrode 23 not covered by the insulating layer 82 are indicated by hatching.

[0040] In this specification, "outer perimeter of the opening" refers to the area of ​​the opening as viewed from above. This refers to the outline cut out by a larger plane. For example, a cavity that widens from the top to the bottom. The outer circumference of an opening of this shape is the contour of the bottom surface of the opening.

[0041] Apertures 11 and 12 are two pixel electrodes, one for each of two pixels corresponding to different colors. It is preferable that they be positioned between 23. Also, openings 11 and 12 should be the same color. They may be positioned between the two pixel electrodes 23 of two corresponding pixels.

[0042] Figure 2(A) shows an example of a cross-section corresponding to the cutting line A1-A2 in Figure 1(B). A) shows a cross-section of a region containing two adjacent pixels. Also, here, the display element As an example, an example is shown in which a top-emission type light-emitting element 40 is applied. So, the side with circuit board 31 becomes the display side.

[0043] The display device 10 has a configuration in which a substrate 21 and a substrate 31 are bonded together with an adhesive layer 39. The light-emitting element 40 can also be said to be sealed by the adhesive layer 39. Substrate 21 and substrate 31 may be flexible. In this case, the display device 10 is a flexible display device It is placed there.

[0044] A transistor 70, a light-emitting element 40, etc. are provided on the substrate 21. On the surface of 1, insulating layers 73, 81, 82, etc. are provided. On the other hand, the substrate 31 On the side facing the substrate 21, a colored layer 51a, a colored layer 51b, and a light-shielding layer 52 are provided. The colored layer 51a and the colored layer 51b transmit different wavelength ranges of light.

[0045] The transistor 70 consists of a conductive layer 71 that functions as a gate, a semiconductor layer 72, and a gate insulating layer. An insulating layer 73 that functions as a source, a conductive layer 74a that functions as either a source or a drain, It has a conductive layer 74b, etc., which functions as either a drain or the other.

[0046] An insulating layer 81 is provided covering the transistor 70. Furthermore, pixel electricity is placed on the insulating layer 81. A pole 23 is provided. The pixel electrode 23 and the conductive layer 74b are separated by an opening provided in the insulating layer 81. They are electrically connected via the opening.

[0047] An insulating layer 82 is provided covering the end of the pixel electrode 23. The insulating layer 82 has a tapered shape. It is preferable to have it.

[0048] An EL layer 24 and a conductive layer 25 are provided on the pixel electrode 23, forming a light-emitting element 40. A portion of the conductive layer 25 functions as a common electrode for the light-emitting element 40. By creating a potential difference between the pixel electrode 23 and the conductive layer 25, and passing a current through the EL layer 24, It shines.

[0049] The insulating layer 81 is provided with an opening 11, and the insulating layer 82 is provided with an opening 12. The bottom surface of the opening 11 is located above the bottom surface of the insulating layer 81. The opening 12 is the insulating layer It penetrates through 82 and is integrated with the opening 11.

[0050] In a top view, the outer circumference of the opening 12 is inward from the outer circumference of the opening 11 (Figure 1(B) (See reference.) In cross-sectional view, the insulating layer 82 has a shape that protrudes like an overhang on the insulating layer 81. (See Figure 2(A)). Also, the inside of the opening 11 is filled with adhesive layer 39. The adhesive layer 39 has a region that overlaps with the insulating layer 82 below the insulating layer 82. As shown in Figure 2(A), in cross-sectional view, the adhesive layer 39 has openings 11 and 12. It has a wedge-shaped region 15 that fits into a single opening.

[0051] The adhesive layer 39 has region 15, so that the insulating layer 81 and insulating layer 82 and the adhesive layer 39 Adhesion can be improved. Furthermore, the inside of the opening 11 is filled with the adhesive layer 39. It is preferable that the adhesive layer 39 overlaps with the insulating layer 82 in the region below the insulating layer 82. The present invention is not limited to this, and a portion of the opening 11 may be hollow.

[0052] Here, an example of a method for manufacturing a flexible display device 10 will be described. For example, the process includes the following steps: First, a transistor 70 or the like is placed on one of the support substrates. Next, a colored layer (for example, colored layer 51a, colored layer 51b, etc.) is provided on the other support substrate. A processed member is manufactured by bonding one support substrate to the other support substrate via an adhesive layer 39. Then, after peeling the support substrate from the processed member, a flexible substrate is bonded to it. The procedure is performed on both the one support substrate and the other support substrate.

[0053] In the process of peeling the support substrate from the processed material, two films with weak adhesion to each other come into contact. When a processed member has a laminated structure, the interface between the two films peels off (and so on). This can also be referred to as delamination of the film. For example, the EL layer 24 and the conductive layer 25 Since the elements have weak adhesion to each other, the display device 10 having the light-emitting element 40 is manufactured using the above manufacturing method. This can lead to delamination between the EL layer 24 and the conductive layer 25, resulting in a low production yield. The downside is a concern.

[0054] A display device 10 according to one aspect of the present invention has two pixel electrodes 23 that are located on two adjacent pixels. It has a region 15 in between. Therefore, the EL layer 24 and the conductive layer 25 are sandwiched from above and below. The insulating layer 81, the insulating layer 82, and the adhesive layer 39 have high adhesion, and the display device has the flexibility described above. In the fabrication method of 10, the EL layer 24 and the conductive layer 25 are each in the opposite direction to the direction in which they face each other. This invention can suppress film peeling that occurs when a force is applied in a specific direction. In one embodiment, a display device 10 with a high manufacturing yield can be provided.

[0055] The magnitude of the effect of suppressing the above-mentioned film peeling is due to the insulating layer 82 protruding in an overhang shape on the insulating layer 81. It can be defined by the length d1 (see Figures 1(B) and 2(A)). The greater the resolution, the greater the effect, but if the display device 10 is a display device with high resolution, It is preferable to make d1 smaller.

[0056] Therefore, for example, the length d1 is 0.05 μm or more and 5.0 μm or less, preferably 0.1 μm. By keeping the thickness below 1.0 μm, the above-mentioned film peeling can be effectively suppressed.

[0057] Furthermore, the magnitude of the effect of suppressing the above-mentioned film peeling is determined by the short side of the opening 12 in a top view. It can be defined by the width d2 (see Figures 1(B) and 2(A)). Display device 10 When making it a display device with high resolution, it is preferable to make d2 smaller. On the other hand, d If 2 is too small, the support substrate in the manufacturing method of the display device 10 described above will peel off from the processed member. In the process, the region 15 peels off from the adhesive layer 39 above the opening 12, The effect may be lost.

[0058] Therefore, for example, the width d2 is 0.5 μm or more and 20 μm or less, preferably 2.0 μm or more. By making the thickness 0 μm or less, the above-mentioned film peeling can be effectively suppressed.

[0059] Note that in Figure 1(B), openings 11 and 12 are two adjacent openings corresponding to different colors. The pixels that do this, that is, the two pixel electrodes of two adjacent pixels in the X direction in Figure 1(B) An example of an opening between 23 is shown, but is not limited to this. The openings 11 and 12 are shown in Figure It may be provided between two adjacent pixel electrodes 23 in the Y direction of 1(B) (Figure 3(A ) See also. ) Also, openings 11 and 12 are adjacent to each other in the X direction, and each In contrast, between two adjacent pixel electrodes 23 on the same side in the Y direction, a total of four pixel electrodes 23 are provided. This is also acceptable (see Figure 3(B)).

[0060] Furthermore, the upper surface shapes of openings 11 and 12 are not limited to rectangles. The opening 12 may be a polygon, or any closed shape such as a zigzag, meander, circle, or ellipse. It may also be a curve. Figures 4(A) and 4(B) show two adjacent points in the X direction and their respective... Between each of the two adjacent pixel electrodes 23 on the same side in the Y direction, for a total of four, is provided. Examples are shown where the upper surface shapes of openings 11 and 12 are cross-shaped and circular, respectively. (See Figure 4) (A) and Figure 4(B) show examples of how to define d1 and d2 in the configuration shown in Figure 4(B), respectively. It is showing.

[0061] Figure 5(A) shows the two pixel electrodes 23 of two adjacent pixels in the X direction. This example shows two rectangular openings 11 and 12 arranged side by side. Figure 5(B) shows a device provided between two pixel electrodes 23 of two adjacent pixels in the X direction. An example is shown in which the upper surface shapes of the openings 11 and 12 are meander shapes. By doing so, the area required for openings 11 and 12 is increased compared to Figure 1(B). Without doing so, the area of ​​the eaves portion of the insulating layer 82 (the outer circumference of the opening 11 and the opening 1 in Figure 1(B), etc.) The area enclosed by the outer perimeter of 2 can be increased. Therefore, the effect of suppressing film peeling is increased. It can be made even larger.

[0062] Figure 2(A) shows an example where the EL layer 24 and the conductive layer 25 are formed across multiple pixels. This shows that the EL layer 24, in addition to the exposed portion of the pixel electrode 23, has an insulating layer 82 and an insulating layer. It is provided on the edge layer 81. Furthermore, the conductive layer 25 is provided covering the EL layer 24. .

[0063] Here, in a display device having an EL layer including an EL layer, the EL layer spans multiple pixels. When formed in this way, if the EL layer has a highly conductive layer, the adjacent layers will be separated by this highly conductive layer. In some cases, current may flow to the light-emitting element of the adjacent pixel. Alternatively, the EL layer may be a donor material. The same applies when there is a layer containing both the cubit and the cubit material. As a result, it does not emit light. When the light-emitting elements of adjacent pixels emit light, color mixing occurs between adjacent pixels, and the display device... This can lead to a decrease in color reproduction accuracy. This phenomenon is also called crosstalk. It can be done.

[0064] A display device 10 according to one aspect of the present invention has an opening (opening 11 and It has an opening 12), and in the opening (specifically, in the shape of the eaves of the insulating layer 82 over the opening 11) (On the lower surface of the protruding portion and on the side surface of the insulating layer 81), provided across the two pixel electrodes 23 The EL layer 24 is discontinuous. Therefore, color mixing between adjacent pixels is suppressed. Therefore, the display device 10 can display with high color reproducibility.

[0065] Furthermore, as shown in Figure 2(A), the EL layer 24 and / or conductive layer 2 are located near the light-emitting element 40. If there is a discontinuity in 5, moisture and other substances can penetrate into the EL layer 24 from that point, The reliability of the display device 10 may decrease. Therefore, the intrusion of moisture, etc., into the EL layer 24 should be suppressed. It is preferable to provide the insulating layer 83 on the conductive layer 25 so as to cover the discontinuous portion mentioned above. (See Figure 2(B)). The insulating layer 83 is composed of, for example, openings 11 and 12. Even for processed parts with deep irregularities, the film-forming material can be applied by wrapping it around the irregularities. It is preferable to form it using atomic layer deposition (ALD) method.

[0066] The magnitude of the effect of suppressing color mixing between adjacent pixels can be determined, for example, by placing a filter between two adjacent pixels. It can be adjusted by the size of the opening. In Figure 1(B), the long side of the opening 12 is Length L1 is the region not covered by the insulating layer 82 of the pixel electrode 23 (in Figure 1(B), The example shown is smaller than the length L2 of the longer side of the region indicated by the check, but it is not limited to this example. For example, L1 may be greater than L2 (see Figure 6(A)). Also, in Figure 1(B) The multiple openings 11 and 12 shown are connected in the longitudinal direction (Y direction in Figure 1(B)). It's fine to leave it as is (see Figure 6(B)).

[0067] Furthermore, opening 11 is provided as shown in Figure 3(B), and opening 12 is provided as shown in Figure 6(B). Alternatively, the openings 11 may be arranged in two adjacent directions in the X direction, and in the Y direction relative to each of them. It is provided between two adjacent pixel electrodes 23 on the same side, for a total of four, and the opening 12 extends in the Y direction. It may also be designed to extend (see Figure 7(A)).

[0068] Figure 7(B) shows an example of a cross-section corresponding to the cutting line B1-B2 in Figure 7(A). B) differs from Figure 2(A) in that it does not have an opening 11. As shown in Figures 7(A) and 7(B). In this configuration, an EL layer 24 and a conductive layer 2 are located between two adjacent pixel electrodes 23 in the X direction. Each of the 5 is connected. Therefore, compared to the configuration shown in Figure 2(A), the display device 10 This can increase its reliability.

[0069] In this case, the display device 10 has an active element such as a transistor 70. This explanation will focus on the case of a passive matrix display device, but will also cover the case of a passive matrix display device that does not have active elements. It can also be a TRIX-type display device. In that case, without providing transistor 70, for example, For example, a configuration can be adopted in which the element located between the pixel electrode 23 and the substrate 21 is omitted.

[0070] [Pixel configuration example 1-2] Figure 8(A) shows a region 32B, which is part of the display unit 32 with a configuration that differs in part from that of Figure 1(B). An enlarged view is shown. Also, Figure 8(B) shows the cross-section corresponding to the cutting line C1-C2 in Figure 8(A). Here is an example. The configuration shown in Figure 8(A) has different sizes of openings in the insulating layer 81. This configuration differs from the one shown in Figure 1(B) in that it does not have an opening in the insulating layer 82. For configurations similar to those in Figure 1(B) among those shown in Figure 8(A), see the explanation in Figure 1(B). You can refer to this.

[0071] Note that in Figure 8(A), the insulating layer 82 is shown with hatching, and the insulating layer 82 has a step. The parts shown are indicated by solid lines. Also, the outer circumference of the pixel electrode 23 covered by the insulating layer 82 is shown in the figure. It is not shown.

[0072] The display unit 32 has a matrix arrangement of pixel electrodes 23, which are part of multiple display elements. An aperture 11A is positioned between two adjacent pixel electrodes 23. This is formed when the insulating layer 82 covers the opening provided in the insulating layer 81. 82 is provided covering the end of the pixel electrode 23 (see Figure 8(B)). In Figure 8(A), The outer perimeter of opening 11A is shown by a dashed line.

[0073] A portion of the outer circumference of the opening provided in the insulating layer 81 is, in a top view, the end of the pixel electrode 23. It is located further inside than that. Therefore, the display device 10 shown in Figures 8(A) and 8(B) has pixels The insulating layer 82 covering the end of the electrode 23 has an overhang at the top of the side surface of the insulating layer 82 in the opening 11A. It has a protruding portion (the protruding portion 82A shown in Figure 8(B)).

[0074] Since the inside of the opening 11A is filled with adhesive layer 39, the adhesive layer 39 is not connected to the protruding portion 82A. In the lower part, there is a region that overlaps with the insulating layer 82. Therefore, as shown in Figure 8(B), In cross-sectional view, the adhesive layer 39 has a wedge-shaped region 15A that fits into the opening 11A. The layer 39 having region 15A enhances the adhesion between the insulating layer 82 and the adhesive layer 39. can.

[0075] Furthermore, the insulating layer 82 and adhesive layer 39 sandwich the EL layer 24 and the conductive layer 25 from above and below. Due to its high adhesion, the film peeling in the above-mentioned method for manufacturing a flexible display device is reduced This can be suppressed. In other words, according to one aspect of the present invention, a display device with a high manufacturing yield is produced. We can provide this.

[0076] The magnitude of the effect of suppressing the above-mentioned film peeling is determined by the length d3 of the protruding portion 82A. This is possible (see Figures 8(A) and 8(B)). For example, if the length d3 is 0.05 μm or greater. By setting the film thickness to 5.0 μm or less, preferably 0.1 μm to 1.0 μm, the above film peeling This can be effectively suppressed.

[0077] Furthermore, in the opening 11A (specifically, inside the opening 11A, below the protruding portion 82A) The EL layer 24 provided on the two pixel electrodes 23 (on the surface and side) is discontinuous. Therefore, since color mixing between adjacent pixels can be suppressed, the display device 10 has high color reproducibility. It is possible to display this information.

[0078] Furthermore, a portion of the outer periphery of the opening 11A roughly coincides with the end of the pixel electrode 23 when viewed from above. Alternatively, the outer circumference of the opening 11A may be located outside the end of the pixel electrode 23. It may be there. Figure 9(A) shows an opening 11 where the end of the pixel electrode 23 and a part of the outer circumference roughly coincide. An example of a top view with B provided is shown. Also, Figure 9(B) shows the cutting line D1-D2 in Figure 9(A). An example of a corresponding cross-section is shown. In Figure 9(A), the outer circumference of the pixel electrode 23 and the aperture 11B Each outer perimeter is indicated by a different dashed line.

[0079] With this configuration, the opening 11B provided between the two pixel electrodes 23 Therefore, the EL layer 24 can eliminate discontinuities, thus increasing the reliability of the display device 10. It can be used as a display device.

[0080] Furthermore, the aperture is between two adjacent pixel electrodes in the X direction, and / or two adjacent pixels in the Y direction. The above describes an example of placing it between the pixel electrodes, but it is not limited to this. Figure 10(A) shows In section 32, an opening 11A is provided in a region where the pixel electrode 23 of the insulating layer 81 is not provided. An example of a top view is shown. Also, in Figure 10(B), the display unit 32 shows the drawing of the insulating layer 81. An example of a top view is shown in which an opening 11B is provided in a region where no primary electrode 23 is provided.

[0081] In the configuration shown in Figures 10(A) and 10(B), openings 11A and 11B are These can be formed by etching using the pixel electrode 23 as a mask. This configuration reduces the number of steps involved in the manufacturing of the display device 10. The cutting lines shown in Figures 10(A) and 10(B) (cutting line C1-C2, cutting line D1-D2) The corresponding cross-sectional views are the same as those in Figures 8(B) and 9(B), respectively.

[0082] [Pixel configuration example 2] The following describes a more detailed example of the cross-sectional configuration of the display device 10 according to one aspect of the present invention. This section will specifically discuss the case where a top-emission type light-emitting element is applied to the display element. I will reveal it.

[0083] [Pixel configuration example 2-1] Figure 11 is a schematic cross-sectional view of the display device 10. In Figure 11, the FPC in Figure 1(A) The region including 42, the region including circuit 34, the region including display unit 32, and the outer periphery of the display device 10 This shows an example of a cross-section of the included region.

[0084] Substrate 21 and substrate 31 are bonded together by an adhesive layer 141. A portion of 41 has the function of sealing the light-emitting element 40. Also, on the outer surface of the substrate 31, It is preferable to have a polarizing plate 130.

[0085] The substrate 21 contains a light-emitting element 40, transistor 201, transistor 202, and transistor A 205 element, a 203 capacitive element, a 204 terminal section, wiring 35, etc. are provided. Also, a circuit board 31 On the side, a colored layer 131a, a light-shielding layer 132, etc. are provided. The light-emitting element 40 has a conductive layer 1 11, It has a structure in which an EL layer 112 and a conductive layer 113 are laminated. The part functions as a pixel electrode, and a portion of the conductive layer 113 functions as a common electrode. (Light-emitting element 4) 0 is a top-emission type light-emitting element that emits light towards the substrate 31.

[0086] Figure 11 shows a cross-section of the display unit 32, including one subpixel, as an example. For example, The sub-pixel consists of transistor 202, capacitive element 203, transistor 205, and light-emitting element. It has 40 and a colored layer 131a. For example, transistor 202 is a switching It is a transistor (selection transistor), and transistor 205 supplies current to the light-emitting element 40. This is a transistor (driving transistor) used to control current.

[0087] Furthermore, Figure 11 shows a cross-section of circuit 34 including transistor 201 as an example. .

[0088] The colored layers (including the colored layer 131a) of the display device 10 are each of different colors Multiple light-transmitting materials can be used. For example, a sub-pixel that exhibits red light, and a sub-pixel that exhibits green light. By arranging subpixels that emit blue light and subpixels that emit blue light, full-color display can be achieved. ru.

[0089] On the substrate 21, there are insulating layers 211, 212, 213, 214, and 214. 81, an insulating layer such as an insulating layer 82 is provided. A portion of the insulating layer 211 is each transient Gate insulation of transistors (transistor 201, transistor 202, transistor 205, etc.) It functions as a layer, with the other part acting as the dielectric of the capacitive element 203. Insulating layer 212, The edge layer 213 and the insulating layer 214 are provided to cover each transistor, capacitive element 203, etc. The insulating layer 214 functions as a planarization layer. Note that here, a transistor When the insulating layer covering the above has three layers: insulating layer 212, insulating layer 213, and insulating layer 214. This indicates that there may be four or more layers, or even a single or two layers. That's good. Also, the insulating layer 214, which functions as a planarization layer, does not need to be provided if it is not required. The insulating layer 81 is provided covering the conductive layer 224. The insulating layer 81 is a planarizing layer. It may have a function. The insulating layer 82 is at the edge of the conductive layer 111, or between the conductive layer 111 and the conductive layer It is provided covering the contact parts and other components that electrically connect to 224.

[0090] Furthermore, the insulating layer 81 and the insulating layer 82 are provided with openings 11 and 12, respectively. In a top view, the outer perimeter of opening 12 is inward from the outer perimeter of opening 11. 11 and the opening 12 are integrated, forming a wedge-shaped opening in cross-sectional view. The inside of the opening is filled with adhesive layer 141.

[0091] It is preferable to use different insulating materials for the insulating layer 81 and the insulating layer 82. Specifically, the insulating layer 81 and insulating layer 82 are defined by the etching selectivity (per unit time). It is preferable to select a combination of insulating materials with different film thinning amounts. More specifically, for example, For example, the insulating layer 81 contains organic resin materials such as acrylic or polyimide, and the insulating layer 82 contains nitrogen oxides. This includes inorganic insulating materials such as silicon dioxide and silicon nitride.

[0092] After forming the opening 12 in the insulating layer 82, etching proceeds not only in the depth direction but also in the surface direction. By performing etching that has a high selectivity ratio of organic resin material to inorganic material, openings are created. An opening 11 with a larger outer circumference than part 12 can be formed in the insulating layer 81. An example of the etching is One example is ashing using oxygen plasma.

[0093] Furthermore, it is preferable that the etching is isotropic. This allows the opening 11, which has a larger outer circumference than the opening 12, to be formed at a smaller depth. Therefore, the thickness of the insulating layer 81 can be reduced.

[0094] Furthermore, transistors 201, 202, and 205 are partially A conductive layer 221 functions as a gate electrode, with a portion of it functioning as a source electrode or drain electrode. It has a conductive layer 222 and a semiconductor layer 231. Here, it is obtained by processing the same conductive film. The same hatching pattern is applied to multiple layers.

[0095] In Figure 11, the capacitive element 203 functions as the gate electrode of the transistor 205. A portion of layer 221, a portion of insulating layer 211, and the source electrode or drain of transistor 205 This shows an example where a portion of the conductive layer 222, which functions as an electrode, is included.

[0096] Of the pair of conductive layers 222 of transistor 202, the capacitive element 203 is electrically connected The non-conductive layer 222 functions as part of the signal line. Also, transistor 202 The conductive layer 221, which functions as the gate electrode, functions as part of the scan line.

[0097] Figure 11 shows an example of transistor 202, which has one gate electrode. This indicates that transistors 201 and 205 have a channel region. The formed semiconductor layer 231 is sandwiched between two gate electrodes (conductive layer 221 and conductive layer 223). This shows a transistor. Thus, a transistor with two gate electrodes is This allows for more reliable control of the threshold voltage. Also, by connecting the two gate electrodes... The transistor may be driven by supplying the same signal to these components. Transistors like this can increase the on-current compared to other transistors. This allows for increased field-effect mobility. As a result, it becomes possible to create circuits capable of high-speed operation. This can be done. Furthermore, the circuit footprint can be reduced. By applying a generator, the number of wires increases when the display device is made larger or higher resolution. Even if this is done, it is possible to reduce signal delay in each wiring. This can improve display inconsistencies.

[0098] Furthermore, the transistors (transistor 201, etc.) in circuit 34 and the display unit 32 Even though transistors (transistor 202, transistor 205, etc.) have the same structure... Good. Also, the multiple transistors in circuit 34 may all have the same structure. A combination of transistors with different structures may be used. Also, the display unit 32 may have multiple The transistors may all have the same structure, or they may be a combination of transistors with different structures. They may be used together.

[0099] Of the insulating layers 212 and 213 covering each transistor, at least one is protected from water and It is preferable to use a material that does not easily allow impurities such as hydrogen to diffuse. Such an insulating layer is It can function as a rear film. This allows each transistor to be controlled from the outside. This effectively suppresses the diffusion of impurities, resulting in a highly reliable display device 10. can.

[0100] The conductive layer 224 provided on the insulating layer 214 functions as wiring. 4 is transmitted through openings provided in the insulating layer 214, insulating layer 213, and insulating layer 212. It is electrically connected to either the source or drain of the ZISTA 205. Also, the insulating layer 81 A conductive layer 111, which functions as a pixel electrode, is provided on top. The conductive layer 111 is an insulating layer It is electrically connected to one of the conductive layers 224 through an opening provided in 81. Figure 11 Then, the conductive layer 111 is connected to the source or drain of the transistor 205 via the conductive layer 224. It is electrically connected to one side.

[0101] An insulating layer 82 is provided covering the edges of the conductive layer 111. The EL layer 112 is a conductive layer 111, is provided on insulating layer 81 and insulating layer 82. Also, conductive layer 113 is EL layer It is provided covering 112. Also, an EL layer is provided across the two conductive layers 111. Each of the components 112 and the conductive layer 113 is discontinuous at the opening 11.

[0102] In the light-emitting element 40, the conductive layer 111 is made of a material that reflects visible light, and the conductive layer 113 A material that transmits visible light is used. With this configuration, light is emitted from the substrate 31 side. It can be a top-emission type light-emitting element. Therefore, it is possible to place elements such as transistors and capacitive elements on the lower side, The efficiency can be increased. Furthermore, both conductive layer 111 and conductive layer 113 transmit visible light. By using this material, a dual emission system is created that emits light from both the substrate 31 side and the substrate 21 side. It may also be used as an N-shaped light-emitting element.

[0103] Furthermore, a light-emitting element that exhibits white light can preferably be used as the light-emitting element 40. This eliminates the need to create different light-emitting elements 40 for subpixels corresponding to different colors. An extremely high-definition display device 10 can be realized. At this time, the light from the light-emitting element 40 is directed to the colored layer When light passes through 131a, etc., light outside of a specific wavelength range is absorbed. As a result, extraction The resulting light will, for example, be red in color.

[0104] Furthermore, a material that reflects visible light is used for the conductive layer 111, and a material that reflects half of the visible light is used for the conductive layer 113. Using a material that is transparent and semi-reflective, and further between the conductive layer 111 and the conductive layer 113, visible light By providing an optical adjustment layer that transmits light, the light-emitting element 40 having a microcavity structure and This may be done. In this case, optical adjustment is performed for each of the multiple subpixels corresponding to different colors. The thickness of the layer can be adjusted. Also, there are subpixels with an optical adjustment layer and subpixels without an optical adjustment layer. Sub-pixels may be mixed in.

[0105] A light-shielding layer 132 is provided on the surface of the substrate 31 that faces the substrate 21, and the edges of the light-shielding layer 132 and light-shielding A colored layer 131a, etc., is provided to cover the opening of layer 132. Each is arranged in overlap with the light-emitting element 40. In addition, a part of the light-shielding layer 132 is in region 15 They are arranged in overlapping positions.

[0106] Figure 11 shows an example where the polarizing plate 130 is provided on the side of the substrate 31 opposite to the substrate 21 side. It is preferable to use a circular polarizer as the polarizer 130. For example, a device consisting of a linear polarizer and a quarter-wavelength phase difference plate can be used. Therefore, the reflection of ambient light from the reflective material (for example, the conductive layer 111, etc.) provided on the display unit 32 is It can be suppressed.

[0107] Figure 11 shows an example in which the light-emitting element 40 is sealed with an adhesive layer 141. By using a material with a refractive index greater than that of air, a space is created between the light-emitting element 40 and the substrate 31. Compared to the case where [the element] is present, the efficiency of light extraction from the light-emitting element 40 can be increased.

[0108] Furthermore, a so-called hollow sealing structure may be used, in which the adhesive layer 141 is arranged around the display section 32. i. At this time, the space formed by the substrate 21, substrate 31, and adhesive layer 141 is filled with air. It is acceptable for it to be filled, but it is preferable that it be filled with an inert gas such as a noble gas or nitrogen gas. It seems so. Also, if the space is under reduced pressure relative to atmospheric pressure in a steady state, the operating environment (for example) This suppresses the expansion of the space due to atmospheric pressure and temperature, which would cause the substrate 21 or substrate 31 to bulge. It is possible. On the other hand, if the space is under positive pressure relative to atmospheric pressure, impurities such as moisture will be absorbed into the substrate 21, the substrate 31, the adhesive layer 141, or the gaps between them can be prevented from diffusing into the space.

[0109] A terminal portion 204 is provided in the region near the edge of the substrate 21. The terminal portion 204 is connected It is electrically connected to the FPC42 via the subsequent layer 242. In the configuration shown in Figure 11, the wiring This shows an example of forming the terminal portion 204 by laminating a part of 35 with the conductive layer 111.

[0110] Furthermore, Figure 11 shows an example of a cross-section of the region including the outer periphery of the display device 10. Openings 219 are provided in the insulating layer 214 and the insulating layer 81 on the outer periphery of the device 10. The opening 219 is provided so as to surround the display unit 32 when viewed from above.

[0111] Organic resins such as acrylic and polyimide can be formed by coating them onto a substrate with a coater. Therefore, a film with high flatness can be obtained. For this reason, the organic resin is used as an insulating layer 214 and It can be suitably used in the insulating layer 81. On the other hand, compared to inorganic insulating materials, this organic resin Therefore, it has high water permeability. By providing an opening 219 so as to surround the display unit 32, the display unit This prevents impurities such as water from entering the interior of 32, and ensures the reliability of the display device 10. It can be used as a high-performance display device.

[0112] Furthermore, if the above-mentioned organic resin material is used as the insulating layer 82, the insulating layer 82 will also have openings 2 It is preferable to provide an opening in the region that overlaps with 19. Also, for example, insulating layer 214, If a material with low water permeability is used as the edge layer 81, it is not necessary to provide the opening 219.

[0113] The above is an explanation of the pixel configuration example 2-1.

[0114] [Pixel configuration example 2-2] Figure 12 shows a display device using flexible substrates 171 and 181 as a pair of substrates. An example of the cross-sectional configuration of the device 10 is shown. The display device 10 shown in Figure 12 can bend a part of its display surface. can.

[0115] The display device 10 shown in Figure 12 has a substrate 171 instead of the substrate 21 in Figure 11, and an adhesive layer 1 It has 72 and an insulating layer 173. Also, instead of substrate 31, it has substrate 181, adhesive layer 182, and has an insulating layer 183.

[0116] The insulating layers 173 and 183 are made of materials that do not easily allow impurities such as water to diffuse. preferable.

[0117] The display device 10 shown in Figure 12 is provided with insulating layers 173 and 183 to protect each transistor. Transistors (transistor 201, transistor 202, transistor 205, etc.) and light-emitting elements 40 It has a configuration in which substrate 171, substrate 181, adhesive layer 172, and Even if a material that easily diffuses impurities such as water and hydrogen is used in the deposition layer 182, this Insulating layers 173 and 183 are located further inside (towards each transistor and light-emitting element 40). This suppresses the diffusion of these impurities into the interior of the insulating layer 173 and insulating layer 183. Therefore, the reliability of the display device 10 can be improved. Also, substrates 171 and 181 When selecting materials such as adhesive layer 172 and adhesive layer 182, it is necessary to consider the diffusion properties of impurities. Because there is no constraint, a variety of materials can be used.

[0118] Furthermore, Figure 12 shows an example in which the display device 10 does not have an opening 219 on its outer periphery.

[0119] [Example of manufacturing method] Here, we will describe a method for manufacturing a flexible display device.

[0120] For convenience, here we will refer to the optical parts, such as the stacked structure including pixels and circuits, and the colored layer (color filter). A laminated structure including materials, a laminated structure including electrodes and wirings constituting a touch sensor, etc. are collectively referred to as an element layer. The element layer includes, for example, a display element, and in addition to the display element, it may also include wirings electrically connected to the display element, elements such as transistors used in pixels and circuits, etc. is also acceptable.

[0121] Also, here, a member (for example, the substrates 171, 181, etc. shown in FIG. 12) that finally supports the element layer and has flexibility is referred to as a substrate. For example, the substrate includes an extremely thin film with a thickness of 10 nm or more and 200 μm or less.

[0122] As a method of forming an element layer on a substrate having a flexible insulating surface, typically there are the following two methods. One is a method of directly forming an element layer on the substrate . The other is a method of forming an element layer on a support substrate different from the substrate, then peeling the element layer and the support substrate apart, and transferring the peeled element layer onto the substrate.

[0123] When the material constituting the substrate has heat resistance against the heat involved in the element layer formation process it is preferable to directly form the element layer on the substrate because the process is simplified. At this time, when forming the element layer while fixing the substrate to the support substrate it is preferable because conveyance within the apparatus and between apparatuses becomes easy.

[0124] Also, when using the method of transferring the element layer onto the substrate after forming it on the support substrate, first a release layer and an insulating layer are laminated on the support substrate, and the element layer is formed on the insulating layer. Subsequently, the support substrate and the element layer are peeled apart and transferred onto the substrate. At this time, the interface between the support substrate and the release layer, the release layer and A material in which peeling occurs at the interface of the insulating layer or in the peeling layer may be selected. In this method , by using a material with high heat resistance for the support substrate and the peeling layer, the upper limit of the temperature applied when forming the element layer can be increased, and an element layer with a more reliable element can be formed, which is preferable.

[0125] For example, as the peeling layer, a layer containing a high melting point metal material such as tungsten and a layer containing an oxide of the metal material are laminated and used. As the insulating layer on the peeling layer, a layer in which a plurality of silicon nitride, silicon oxynitride, silicon nitride oxide, etc. are laminated is preferably used. In this specification, oxynitride refers to a material in which the oxygen content is higher than nitrogen in its composition, and nitride oxide refers to a material in which the nitrogen content is higher than oxygen in its composition.

[0126] Examples of the method for peeling the element layer from the support substrate include applying mechanical force, etching the peeling layer, or infiltrating a liquid into the peeling interface. Alternatively, peeling may be performed by heating or cooling using the difference in thermal expansion between the two layers forming the peeling interface.

[0127] Also, when peeling is possible at the interface between the support substrate and the insulating layer, the peeling layer may not be provided.

[0128] For example, glass can be used as the support substrate and an organic resin such as polyimide can be used as the insulating layer. At this time, peeling may be performed by locally heating a part of the organic resin using laser light or the like, or by physically cutting or penetrating a part of the organic resin with a sharp member to form a peeling starting point at the interface between the glass and the organic resin.

[0129] Alternatively, a heating layer is provided between the support substrate and an insulating layer made of organic resin, and the heating layer is heated. This may cause delamination at the interface between the heating layer and the insulating layer. The heating layer is a layer that allows current to flow. Materials that generate heat when flowing, materials that generate heat when absorbing light, and materials that generate heat when a magnetic field is applied. Various materials can be used, such as materials that generate heat. For example, the heating layer can be Semiconductors, metals, and insulators can be selected and used.

[0130] In the method described above, the insulating layer made of organic resin is used as a substrate after peeling. It is possible.

[0131] For example, in the configuration shown in Figure 12, a first release layer and an insulating layer 173 are placed on the first support substrate. After forming them in order, the upper layers of the structure are formed. In addition, separately from this, the second support After sequentially forming a second delamination layer and an insulating layer 183 on the substrate, the structure above them is formed Formed. Subsequently, the structure on the first support substrate and the structure on the second support substrate are bonded together with adhesive layer 14 The two are bonded together according to step 1. Then, the second support substrate and the second release layer are insulated from the second release layer. The insulating layer 183 is removed by peeling at the interface, and the substrate 181 is bonded to the adhesive layer 18 The first support substrate and the first release layer are bonded together by the first release layer and the insulating layer. The insulating layer 173 and the substrate 171 are removed by peeling at the interface 173, and the adhesive layer 172 The two parts are bonded together by [method]. Note that peeling and bonding are performed on the first support substrate side and the second support substrate side. You can go to either side first.

[0132] The above describes a method for manufacturing a flexible display device.

[0133] [Pixel configuration example 2-3] FIG. 13 shows a cross-sectional configuration example of a display device 10 having a configuration partially different from that of FIG. 11. FIG. 1 The display device 10 shown in FIG. 13 is different from the display device 10 shown in FIG. 11 in that it uses flexible substrates 171 and 181 as a pair of substrates, does not have a polarizing plate 130, and has a structure 135.

[0134] The manufacturing method of the display device 10 includes a step of bonding a first support substrate provided with an element layer between the adhesive layer 141 and the substrate 21 and a second support substrate provided with an element layer between the adhesive layer 141 and the substrate 31 side through the adhesive layer 141. The bonding is performed by applying an adhesive that cures to become the adhesive layer 141 to the surface of the element layer provided on the first support substrate or the surface of the element layer provided on the second support substrate, overlapping the surfaces of both element layers, filling the adhesive between the first support substrate and the second support substrate, and then curing the adhesive.

[0135] When filling the adhesive between the first support substrate and the second support substrate, if the surface of the element layer provided on the first support substrate or the surface of the element layer provided on the second support substrate has a concavo-convex shape with a large step such as the opening 219, the adhesive may not uniformly fill the space formed by the concavo-convex shape, and a gap may occur between the concavo-convex shape and the adhesive. If there is such a gap, when peeling the support substrate described in the above manufacturing method example, film peeling starting from the gap may occur.

[0136] In the display device 10 shown in FIG. 13, the structure 135 is provided at a position overlapping the opening 219 on the substrate 171. In a top view, the outer periphery of the structure 135 is the opening 219. ​​​​​​​​​​​​​​It is preferable that it be positioned inside the outer circumference. Also, the height t of the structure 135 1 is preferably greater than half the depth t2 of the opening 219 and less than t2.

[0137] This configuration allows for a cell gap of the display device 10 near the opening 219. This can suppress rapid changes in the distance between opposing surfaces of substrate 171 and substrate 181. Therefore, adhesive can be filled into the opening 219. Thus, the display device 10 can be manufactured. It can be used as a display device with high retention.

[0138] The material of the structure 135 is not particularly limited, but examples include acrylic, polyimide, and epoxy. Resins such as the above can be used.

[0139] Furthermore, the structure 135 may be covered with a material with low water permeability, or the structure 135 may be covered with a material with low water permeability. By forming it with this material, the amount of moisture that penetrates into the EL layer 112 via the adhesive layer 141 is reduced. This is possible. Therefore, a highly reliable display device 10 can be made. Figure 14 shows the structure. An example of a cross-sectional view of a display device 10 in which part 135 is covered with an insulating layer 136 is shown. The insulating layer 136 and Therefore, the same material as that used for insulating layer 212 or insulating layer 213 can be used.

[0140] Alternatively, instead of the structure 135, a colored layer may be provided at a position overlapping with the opening 219. Figure 15 shows that colored layers 131a and 131b are provided in positions that overlap with the opening 219. An example is shown. With this configuration, in the process of forming a colored layer on the display unit 32, A structure having the same function as the structure 135 can be formed at a position overlapping with the opening 219. Therefore, the manufacturing process for the display device 10 can be reduced. The colored layer 131b is part of the display unit 3 In 2, the coloring used for subpixels that exhibit a different color from subpixels that have a colored layer 131a. It is a layer.

[0141] [Regarding each component] The following sections will explain each of the components listed above.

[0142] 〔substrate〕 A substrate having a flat surface can be used for the display device 10. The substrate that extracts the light from the source uses a material that transmits the light. For example, glass or quartz. Materials such as ceramics, sapphires, and organic resins can be used.

[0143] By using a thin substrate, the display device 10 can be made lighter and thinner. Furthermore, by using a substrate of sufficient thickness to be flexible, a flexible display device 10 This can be achieved.

[0144] Furthermore, the substrate on the side from which light is not extracted does not need to be translucent, as mentioned above. In addition to substrate materials, metal substrates can also be used. Metal substrates have high thermal conductivity, and Because heat can be easily conducted across the entire plate, localized temperature rises of the display device 10 can be suppressed. Possible and preferable. In order to obtain flexibility and bendability, the thickness of the metal substrate should be 10 μm or more. A particle size of 0 μm or less is preferred, and a particle size of 20 μm or more and 50 μm or less is more preferred.

[0145] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, and nickel are used. Preferably, metals such as buckle, or alloys such as aluminum alloy or stainless steel are used. It is possible.

[0146] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating layer on the surface. A substrate that has been treated may be used. For example, it may be left in an oxygen atmosphere or heated, or an anodized acid An oxide film may be formed on the substrate surface by chemical processes, or by spin coating or dip coating. An insulating layer is formed using coating methods such as electrodeposition, vapor deposition, or sputtering. That's good too.

[0147] Materials that are flexible and transparent to visible light include, for example, materials that are flexible to a certain degree. Glass of varying thicknesses, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resin, polyimide resin, polymer Chill methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE) S) Resins, polyamide resins, cycloolefin resins, polystyrene resins, polyamide resins Examples include plastic resins, polyvinyl chloride resins, and polytetrafluoroethylene (PTFE) resins. It is preferable to use a material with a low coefficient of thermal expansion, for example, a material with a coefficient of thermal expansion of 30 ×10 -6 Polyamide-imide resins, polyimide resins, PET, etc. with a K of 0.1 or less are preferably used. It is possible to have a substrate made of glass fiber impregnated with organic resin, or an inorganic filler made of organic resin. It is also possible to use substrates in which the thermal expansion coefficient has been reduced by mixing with resin. Because the circuit board is lightweight, the display device using it can also be made lightweight.

[0148] If the above material contains fibrous material, the fibrous material may be an organic compound or an inorganic compound. High-strength fibers are used. Specifically, high-strength fibers have a high tensile modulus or Young's modulus. This refers to fibers, with typical examples being polyvinyl alcohol-based fibers and polyester fibers. Polyamide fibers, polyethylene fibers, aramid fibers, poly(p-phenylenebenzo) Examples include bisoxazole fibers, glass fibers, or carbon fibers. Glass fibers include: Examples include glass fibers using E-glass, S-glass, D-glass, Q-glass, etc. A structure made by using a woven or nonwoven fabric, impregnating the fibrous material with resin, and then curing the resin. The flexible substrate may be made of fibrous material and resin. Using a structure made of this material improves reliability against damage caused by bending and localized pressure. ,preferable.

[0149] Alternatively, a thin glass, metal, or other material that is flexible can be used as the substrate. Alternatively, a composite material may be used in which glass and resin materials are bonded together by an adhesive layer.

[0150] A hard coat layer is applied to a flexible substrate to protect the surface of the touch panel from scratches, etc. (Example) For example, silicon nitride, aluminum oxide, etc.) or a layer of material that can distribute pressure (for example, Aramid resin, etc., may be laminated. Also, moisture may reduce the lifespan of the display element. To suppress the effects of other factors, a flexible substrate may be laminated with a low-permeability insulating layer. For example, silicon nitride, silicon oxide nitride, silicon oxide nitride, aluminum oxide, Inorganic insulating materials such as aluminum nitride can be used.

[0151] The substrate can also be constructed by stacking multiple layers. In particular, it can be configured to include a glass layer. This improves barrier properties against water and oxygen, resulting in a highly reliable display device 10. ru.

[0152] [Transistor] A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer. The above shows the case where a bottom-gate transistor is applied. It is.

[0153] Furthermore, the structure of the transistors in the touch panel according to one aspect of the present invention is not particularly limited. It is not possible. For example, it could be a planar transistor, or a staggered transistor. Alternatively, it may be a top-gate type or a bottom-gate type transistor. Any of the luminous gate type transistor structures may be used. Alternatively, above and below the channel formation region A gate electrode may be provided.

[0154] [Semiconductor layer] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the deterioration of the electrical characteristics of the zista.

[0155] Furthermore, the semiconductor layer of the transistor contains, for example, elements from Group 14 (silicon, germanium). Semiconductor materials such as compound semiconductors or oxide semiconductors (e.g., 100%) can be used. This includes semiconductors containing silicon, semiconductors containing gallium arsenide, or oxide semiconductors containing indium. It can be applied to the body, etc.

[0156] In particular, it is preferable to use oxide semiconductors with a larger band gap than silicon. Using semiconductor materials with a larger band gap and lower carrier density than silicon. This is preferable because it reduces the current when the transistor is off.

[0157] In particular, the semiconductor layer of the transistor has multiple crystalline parts, and the c-axis of the crystalline part is A crystalline portion oriented substantially perpendicular to the surface on which the semiconductor layer is formed, or to the upper surface of the semiconductor layer, and adjacent to it. It is preferable to use an oxide semiconductor in which grain boundaries are difficult to confirm.

[0158] Because such oxide semiconductors do not have grain boundaries, when the display panel is curved... This suppresses the occurrence of cracks in the oxide semiconductor film due to stress. Such oxide semiconductors are suitable for touch panels and other applications that are flexible and can be bent. It can be used for this purpose.

[0159] Furthermore, using an oxide semiconductor with such crystalline properties as the semiconductor layer of a transistor... This suppresses fluctuations in the electrical characteristics of the transistor, resulting in a highly reliable transistor. can.

[0160] Furthermore, transistors that use oxide semiconductors with a larger band gap than silicon as the semiconductor layer... Due to its low off-current, the transistor stores electricity in the capacitor connected in series with it. It is possible to hold a load for a long period of time. Applying such a transistor to a pixel. This allows the drive circuit to be stopped while maintaining the gradation of the image displayed in each display area. This becomes possible. As a result, a display device 10 with extremely reduced power consumption can be realized.

[0161] The semiconductor layer of the transistor is, for example, made of at least indium, zinc, and M(aluminium). Umium, Titanium, Gallium, Germanium, Yttrium, Zirconium, Lanthanum, Cereal It is expressed as an In-M-Zn oxide containing metals such as um, tin, neodymium, or hafnium. It is preferable that the film contains a film. Furthermore, the electrical characteristics of the transistor using the oxide semiconductor are To reduce variability, it is preferable to include a stabilizer along with them.

[0162] As stabilizers, metals included in M ​​above, for example, gallium, tin, Examples include hafnium, aluminum, or zirconium. Also, other stabilizers are used. These are lanthanides: lanthanum, cerium, praseodymium, neodymium, and samarium. Europium, gadolinium, terbium, dysprosium, holmium, erbium Examples include thulium, ytterbium, and lutetium.

[0163] For example, an In-Ga-Zn system is used as an oxide semiconductor to constitute the semiconductor layer of a transistor. Oxides, In-Al-Zn oxides, In-Sn-Zn oxides, In-Hf-Zn acids In-La-Zn oxides, In-Ce-Zn oxides, In-Pr-Zn oxides Materials, In-Nd-Zn oxides, In-Sm-Zn oxides, In-Eu-Zn oxides In-Gd-Zn oxides, In-Tb-Zn oxides, In-Dy-Zn oxides, In-Ho-Zn oxides, In-Er-Zn oxides, In-Tm-Zn oxides, I n-Yb-Zn oxides, In-Lu-Zn ​​oxides, In-Sn-Ga-Zn oxides In-Hf-Ga-Zn oxides, In-Al-Ga-Zn oxides, In-Sn-A l-Zn oxides, In-Sn-Hf-Zn oxides, In-Hf-Al-Zn oxides You can use it.

[0164] In this context, In-Ga-Zn oxides are those that have In, Ga, and Zn as their main components. It means an oxide, and the ratio of In, Ga, and Zn is not specified. Other metal elements besides n may be present.

[0165] Furthermore, the semiconductor layer and conductive layer of the transistor have the same metal element among the above oxides. It may also be possible to have the semiconductor layer and the conductive layer have the same metal element, thereby lowering manufacturing costs. It can be reduced. For example, a metal acid with the same metal composition can be used to deposit the semiconductor layer and the conductive layer. By using a synthetic target, manufacturing costs can be reduced. When processing the body layer and the conductive layer, the etching gas or etching solution is used in common. Yes, it is possible. However, even if the semiconductor layer and the conductive layer have the same metal element, if their compositions are different... In some cases, metal elements may be removed from the film during the manufacturing process of transistors and capacitive devices. Separation can result in different metal compositions.

[0166] The oxide semiconductor that makes up the semiconductor layer of a transistor has a band gap of 2 eV or more. Furthermore, a value of 2.5 eV or higher is preferred, and a value of 3 eV or higher is more preferred. By using oxide semiconductors with a large gap in the semiconductor layer of a transistor, This can reduce the off-current of the sta.

[0167] When the oxide semiconductor constituting the semiconductor layer of a transistor is In-M-Zn oxide, - The raw materials of the metal elements contained in the sputtering target used to deposit M-Zn oxide films The ratio of particles is preferably such that In≧M and Zn≧M. As the atomic ratio of the metal elements in the getter, In:M:Zn = 1:1:1, In:M:Zn = 1 :1:1.2, In:M:Zn = 3:1:2, 4:2:4.1, etc. are preferable. In addition, the atomic ratio of the semiconductor layer to be formed is, respectively, as an error, plus or minus 40% variation of the atomic ratio of the metal elements contained in the above sputtering target included.

[0168] As the semiconductor layer of the transistor, an oxide semiconductor film with a low carrier density is used. For example the semiconductor layer has a carrier density of 1×10 17 / cm 3 or less, preferably 1×10 1 5 / cm 3 or less, more preferably 1×10 13 / cm 3 or less, even more preferably 1×10 11 / cm 3 or less, even more preferably 1×10 10 / cm 3 less than, and oxides with a carrier density of 1×10 -9 / cm 3 or more can be used. Such an oxide semiconductor is called a high-purity genuine or substantially high-purity genuine oxide semiconductor. Since the oxide semiconductor has a low impurity concentration and a low density of defect levels, it can be said that it is an oxide semiconductor that provides stable electrical characteristics of the transistor.

[0169] In addition, the oxide semiconductors that can be used as the semiconductor layer of the transistor are not limited to these, and depending on the required electrical characteristics of the transistor (field-effect mobility, threshold voltage, etc.), appropriate compositions can be used. Also, in order to obtain the required electrical characteristics of the transistor The carrier density, impurity concentration, defect density, and the origin of metal elements and oxygen in the semiconductor layer of a transistor. It is preferable to set appropriate atom ratios, interatomic distances, densities, etc.

[0170] In oxide semiconductors that constitute the semiconductor layer of a transistor, one of the Group 14 elements is When silicon or carbon is included, oxygen vacancies increase in the semiconductor layer, causing it to become n-type. Therefore, the concentration of silicon and carbon in the semiconductor layer (by secondary ion mass spectrometry) The concentration obtained is 2 × 10 18 atoms / cm 3 The following is preferably 2 × 10 17 a toms / cm 3 The following applies:

[0171] Furthermore, alkali metals and alkaline earth metals generate carriers when they bond with oxide semiconductors. This can occur, and the off-current of a transistor using the oxide semiconductor in its semiconductor layer may increase. This can happen. Therefore, secondary ion mass spectrometry in the semiconductor layer of a transistor can be performed. The concentration of alkali metals or alkaline earth metals obtained by the law is 1 × 10⁻⁶ 18 atoms / cm 3 The following is preferably 2 × 10 16 atoms / cm 3 Do the following:

[0172] Furthermore, if nitrogen is present in the oxide semiconductor that makes up the semiconductor layer of the transistor, Electrons are generated, increasing the carrier density and making it easier to convert to n-type. As a result, nitrogen is included. Transistors using oxide semiconductors as the semiconductor layer exhibit normally-on characteristics. Therefore, the nitrogen concentration obtained by secondary ion mass spectrometry in the semiconductor layer is , 5×10 18 atoms / cm3 The following is preferable:

[0173] Furthermore, the semiconductor layer of the transistor may have a non-single-crystal structure, for example. For example, CAAC-OS(C-Axis Aligned Crystalline O xide Semiconductor or C-Axis Aligned and AB-plane Anchored Crystalline Oxide Se Includes a crystalline structure, polycrystalline structure, or amorphous structure (non-single crystal). In terms of structure, amorphous structures have the highest defect level density, and CAAC-OS has the highest defect level density. The degree is low.

[0174] Amorphous oxide semiconductor films, for example, have a disordered atomic arrangement and do not possess crystalline components. i. Alternatively, an amorphous oxide semiconductor film is, for example, a completely amorphous structure, and the crystalline portion is I do not have it.

[0175] Furthermore, the semiconductor layer of a transistor has regions with an amorphous structure, regions with a microcrystalline structure, and regions with a polycrystalline structure. A mixed film having two or more of the following regions: the region of CAAC-OS, the region of single crystal structure, and the region of single crystal structure. It is also acceptable. The mixed film may include, for example, two or more of the regions described above. It may have a layered or laminated structure.

[0176] Alternatively, silicon can be used in the semiconductor layer where the channel region of the transistor is formed. Preferred. Amorphous silicon may be used as the silicon, but crystalline silicon is particularly preferred. It is preferable to use silicon such as microcrystalline silicon, polycrystalline silicon, or single crystal silicon. It is preferable to use silicon or the like. In particular, polycrystalline silicon is preferable to single-crystal silicon. It can be formed at low temperatures and has higher field-effect mobility and higher reliability compared to amorphous silicon. It is equipped with such a polycrystalline semiconductor. By applying such a polycrystalline semiconductor to a pixel, for example, the aperture ratio of the pixel can be increased. It can be improved. Also, even when there are extremely dense pixels, the gate drive cycle This makes it possible to form the path and source drive circuits on the same substrate as the pixels, thus enabling the construction of electronic devices. The number of parts can be reduced.

[0177] The bottom-gate transistor exemplified in this embodiment can reduce the manufacturing process. It is preferable. Also, by using amorphous silicon in the semiconductor layer of the transistor, Because it can be formed at a lower temperature than crystalline silicon, it can be used as a material for wiring and electrodes in the layers below the semiconductor layer. Furthermore, it is possible to use materials with low heat resistance as substrate materials, broadening the range of material selection. This allows for the use of, for example, extremely large-area glass substrates. On the other hand, top-gate transistors tend to form impurity regions in a self-aligned manner. This is preferable because it can reduce variations in electrical characteristics. For this reason, especially, This is suitable when using polycrystalline silicon or single-crystal silicon for the semiconductor layer of the ZISTA.

[0178] [Conductive layer] In addition to the gate, source, and drain of the transistor, various wirings that constitute the display device 10 and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tung Examples include metals such as stainless steel, or alloys in which these are the main component. A film containing can be used as a single layer or as a multilayer structure. For example, a film containing silicon. Single-layer structure of aluminum film, double-layer structure of aluminum film laminated on titanium film, tungsten A two-layer structure in which an aluminum film is laminated on top of a copper-magnesium-aluminum alloy film. A two-layer structure in which a copper film is laminated on a titanium film, a two-layer structure in which a copper film is laminated on a tungsten film A two-layer structure consisting of a copper film, a titanium film or titanium nitride film, and an aluminum film layered on top of it. Alternatively, a three-layer structure is formed by laminating copper films and then forming a titanium film or titanium nitride film on top of them, A butene film or molybdenum nitride film is laminated with an aluminum film or copper film on top of it, Furthermore, there are three-layer structures in which a molybdenum film or molybdenum nitride film is formed on top of it. Oxides such as indium oxide, tin oxide, or zinc oxide may be used. Alternatively, copper containing manganese may be used. Using this method is preferable because it improves the controllability of the shape through etching.

[0179] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium or Lafen can be used. Alternatively, gold, silver, platinum, magnesium, nickel, tungsten, etc. Metal materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Materials or alloy materials containing the metal material can be used. Alternatively, nitrides of the metal material (e.g.) For example, titanium nitride may be used. Furthermore, metal materials, alloy materials (or their nitrides) may be used. When using the material, it should be thinned to a degree that allows light to pass through. For example, a silver-magnesium alloy and indium tin can be used as a conductive layer. Using oxide multilayer films, etc., is preferable because it can improve conductivity. Conductive layers such as various wirings and electrodes that constitute the display device 10, and conductive layers (image) of the display element It can also be used as a conductive layer that functions as a primary electrode or common electrode.

[0180] [Insulating layer] Examples of insulating materials that can be used for each insulating layer include acrylic, epoxy, etc. In addition to resins containing siloxane bonds such as silicone, silicon oxide and silicon nitride are also used. Inorganic insulating materials such as silicon nitride, silicon oxide, and aluminum oxide are used. It is possible to stay there.

[0181] Furthermore, it is preferable that the light-emitting element is provided between a pair of insulating layers with low water permeability. This prevents impurities such as water from entering the light-emitting element, thus improving the reliability of the display device 10. This can suppress the decline.

[0182] Examples of insulating layers with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen, and films containing nitrogen and aluminum, such as aluminum nitride films. Alternatively, silicon oxide films, silicon oxide-nitride films, aluminum oxide films, etc., may be used.

[0183] For example, the amount of water vapor transmitted through an insulating layer with low water permeability is 1 × 10⁻⁶ -5 [g / (m 2 ·day) ] Preferably 1 × 10 -6 [g / (m 2 ·day)] Below, more preferably 1×1 0 -7 [g / (m 2 (day) More preferably 1 x 10 -8 [g / (m 2 ·d (ay) and below.

[0184] [Light-emitting element] As the light-emitting element, a self-emitting element can be used, and it will light up when current or voltage is applied. This category includes elements whose degree of control is managed. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc., can be used.

[0185] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. Either of the above is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. stomach.

[0186] The EL layer has at least an emissive layer. The EL layer has a hole injection layer as a layer other than the emissive layer. Materials with high hole transport properties, materials with high hole transport properties, hole-blocking materials, materials with high electron transport properties, electron Substances with high injectability, or bipolar substances (substances with high electron transport and hole transport properties), etc. It may further have layers containing [the specified element].

[0187] The EL layer can use either low-molecular-weight compounds or high-molecular-weight compounds, and mineralization It may contain composites. Each layer constituting the EL layer is made by a vapor deposition method (including vacuum deposition). .) It can be formed by methods such as transfer, printing, inkjet, and coating.

[0188] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer on the anode side... Holes are injected from the cathode side, and electrons are injected from the cathode side. The injected electrons and holes are then transferred to the EL layer. They recombine, and the light-emitting material contained in the EL layer emits light.

[0189] When using a white light-emitting element as the light-emitting element, two or more types of light-emitting elements are used in the EL layer. It is preferable to have a composition that includes substances. For example, the emission of light from two or more light-emitting substances is of complementary colors. By selecting a light-emitting material in such a way that it is related, white light emission can be obtained. These are light-emitting objects that emit light in the following colors: R (red), G (green), B (blue), Y (yellow), O (orange), etc. Among luminescent materials that exhibit emission containing two or more spectral components of R, G, and B, Preferably, it contains 2 or more. Also, the spectrum of emission from the light-emitting element is in the visible light region. An emission having two or more peaks within a wavelength range (for example, between 350 nm and 750 nm) It is preferable to apply an optical element. Also, the emission of a material having a peak in the yellow wavelength region is preferable. The Pectol is preferably a material that also has spectral components in the green and red wavelength regions. It's nice.

[0190] The EL layer includes an emissive layer containing an emissive material that emits one color, and an emissive material that emits another color. It is preferable to have a structure in which multiple light-emitting layers are stacked. For example, multiple light-emitting layers in the EL layer The layers may be stacked in contact with each other, or they may be separated by regions that do not contain any light-emitting material. They may be laminated. For example, between the fluorescent emitting layer and the phosphorescent emitting layer, the fluorescent emitting layer or It contains the same material as the phosphorescent layer (e.g., host material, assist material), and either emission The configuration may also include a region that does not contain any optical material. This makes it easier to fabricate the light-emitting element. This also results in a reduction in the drive voltage.

[0191] Furthermore, the light-emitting element may be a single element having one EL layer, or it may have multiple EL layers These may be tandem elements stacked with charge generation layers in between.

[0192] Examples of conductive films that transmit visible light include indium oxide, indium tin oxide, and indium It can be formed using zinc oxide, zinc oxide, or zinc oxide with added gallium. Also, gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum Metal materials such as iron, cobalt, copper, palladium, or titanium, and alloys containing these metal materials. Alternatively, nitrides of these metal materials (for example, titanium nitride) may also be made transparent to a certain extent. It can be used by forming it into a thin layer. Furthermore, the laminated film of the above material can be used as a conductive layer. This is possible. For example, by using a multilayer film of a silver-magnesium alloy and indium tin oxide. It is preferable to include this because it can improve conductivity. Alternatively, graphene or the like may be used. .

[0193] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, Metal materials such as tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium. Alternatively, alloys containing these metal materials can be used. Lanthanum, neodymium, or germanium may be added. Also, titanium, ni You may also use an alloy containing buckel or neodymium and aluminum (aluminum alloy). Alternatively, an alloy containing copper, palladium, magnesium, and silver may be used. Alloys are preferred because they have high heat resistance. Furthermore, an aluminum film or an aluminum alloy film By laminating a metal film or metal oxide film in contact with it, oxidation can be suppressed. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. Alternatively, a conductive film that transmits visible light and a film made of a metal material may be laminated together. For example, silver and Multilayer films of indium tin oxide, multilayer films of silver and magnesium alloy and indium tin oxide. You can use these.

[0194] The electrodes can be formed using methods such as vapor deposition or sputtering. Formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0195] Furthermore, the above-mentioned light-emitting layer, and materials with high hole injection potential, materials with high hole transport potential, and electron transport potential A layer containing a material with high electron-transfer properties, as well as a material with high electron-injection properties, a bipolar material, etc. These include inorganic compounds such as quantum dots, and polymer compounds (oligomers, dendrimers, polymers) - may have (etc.). For example, by using quantum dots as the light-emitting layer, the light-emitting material may be It can also be made to function.

[0196] Furthermore, quantum dot materials include colloidal quantum dot materials, alloy-type quantum dot materials, Core-shell type quantum dot materials, core-type quantum dot materials, etc., can be used. Materials containing elemental groups 12 and 16, 13 and 15, or 14 and 16 are used. It may be present. Or, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead, Quantum dot materials containing elements such as gallium, arsenic, and aluminum may also be used.

[0197] [Liquid crystal element] Examples of liquid crystal elements include vertical alignment (VA). A liquid crystal element to which the ) mode is applied can be used. As for the vertical alignment mode, MVA (Multi-Domain Vertical Alignment) mode, PVA (Patterned Vertical Alignment) mode, ASV (Ad Features such as Vanced Super View mode can be used.

[0198] Furthermore, liquid crystal elements with various modes applied can be used. For example, In addition to VA mode, there are also TN (Twisted Nematic) mode and IPS (In -Plane-Switching) mode, FFS (Fringe Field Switch) itching) mode, ASM(Axially Symmetric aligne) d Micro-cell) mode, OCB (Optically Compensated) (ed Birefringence) mode, FLC (Ferroelectric L iquix Crystal mode, AFLC (AntiFerroelectric) Liquid crystal elements with modes such as Liquid Crystal applied can be used. .

[0199] Furthermore, a liquid crystal element is an element that controls the transmission or non-transmission of light through the optical modulation effect of liquid crystals. That is the case. Furthermore, the optical modulation effect of liquid crystals is due to the electric field acting on the liquid crystal (horizontal electric field, vertical electric field) It is controlled by (including an electric field in the field or oblique direction). Note that the liquid crystal used in the liquid crystal element is For example, thermotropic liquid crystals, low molecular weight liquid crystals, polymer liquid crystals, polymer dispersed liquid crystals (PDLCs): Polymer Dispersed Liquid Crystal (Ferroelectric Liquid Crystal) Antiferroelectric liquid crystals can be used. Depending on the conditions, these liquid crystal materials can be cholesterol-free. It exhibits phases such as the Lick phase, smectic phase, cubic phase, chiral nematic phase, and isotropic phase.

[0200] Furthermore, either a positive-type liquid crystal or a negative-type liquid crystal may be used as the liquid crystal material. The most suitable liquid crystal material should be used depending on the application mode and design.

[0201] Furthermore, an alignment film can be provided to control the orientation of the liquid crystal. If adopted, a liquid crystal exhibiting a blue phase without an alignment layer may be used. The blue phase is the liquid crystal phase. One such example is when a cholesteric liquid crystal is heated, and it transitions from the cholesteric phase to the isotropic phase. This phase appears just before transfer. The blue phase only appears within a narrow temperature range. To improve the properties, a liquid crystal composition containing several weight percent or more of a chiral agent is used in the liquid crystal layer. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response speed and optical isotropy. It has properties. Furthermore, a liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent is subjected to an alignment treatment. It is unnecessary and has low viewing angle dependence. Also, since an alignment layer does not need to be provided, rubbing treatment is not required. Since this is also unnecessary, electrostatic discharge damage caused by rubbing can be prevented. This can reduce defects and damage to liquid crystal display devices during the manufacturing process.

[0202] Furthermore, the liquid crystal elements include transmissive liquid crystal elements, reflective liquid crystal elements, or semi-transmissive liquid crystal elements. Children, etc., can be used.

[0203] When using transmissive or semitransmissive liquid crystal elements, two polarizing plates are placed so as to sandwich a pair of substrates. A backlight will be provided. Furthermore, a backlight will be provided outside the polarizing plate. The backlight will be: It can be a direct-lit backlight or an edge-lit backlight. Direct-lit backlight equipped with LED (Light Emitting Diode). Using this method makes local dimming easier and allows you to increase contrast. It is preferable. Also, if edge-lit backlights are used, the touch including the backlight This is preferable because it allows for a reduction in the thickness of the panel module.

[0204] When using reflective liquid crystal elements, a polarizing plate is provided on the display surface side. In addition, Placing a light diffuser on the display surface side is preferable because it improves visibility.

[0205] [Adhesive layer] The adhesive layer can be a photocuring adhesive such as an UV-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Mido resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, Examples include EVA (ethylene vinyl acetate) resin. In particular, moisture-permeable epoxy resins. Materials with low properties are preferred. Two-component resins may also be used. Adhesive sheets, etc. You may also use [this].

[0206] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (acid Using substances that adsorb moisture by chemical adsorption, such as calcium carbonate or barium oxide. It is possible to absorb moisture through physical adsorption, such as with zeolite or silica gel. A desiccant may be used. If a desiccant is included, impurities such as moisture will penetrate the element. This is preferable because it can suppress the occurrence of certain behaviors and improve the reliability of the display panel.

[0207] Furthermore, by mixing a filler or light scattering material with a high refractive index into the above resin, light can be extracted. This can improve efficiency. For example, titanium dioxide, barium oxide, zeolite, and Aquatic plants such as ruconium can be used.

[0208] [Connection layer] As a connecting layer, an anisotropic conductive film (ACF) is used. (Active Film) and anisotropic conductive paste (ACP: Anisotropic C) You can use inductive pastels, etc.

[0209] [Colored layer] Materials that can be used for the colored layer include metal materials, resin materials, pigments, or dyes. Examples include resin materials.

[0210] [Light blocking layer] Materials that can be used as a light-shielding layer include carbon black, metals, and metal oxides. Examples include composite oxides containing solid solutions of multiple metal oxides. In addition, a colored layer is added to the light-shielding layer. A laminated film containing the material can also be used. For example, a colored layer that transmits light of a certain color A laminated structure consisting of a film containing the material to be used and a film containing the material to be used for the colored layer that transmits light of other colors. This can be used. By using the same materials for the colored layer and the light-shielding layer, the equipment can be standardized. Furthermore, it is preferable because it simplifies the process.

[0211] The above is a description of each component.

[0212] [Configuration Example 2] In the following, as an example of a display device 10 according to one aspect of the present invention, an input / output device (touch panel) is provided. This section describes an example configuration of an input device (touch sensor), etc.

[0213] Here, in this specification, a display panel which is one embodiment of the display device 10 has a display surface. It has the function of displaying (outputting) images, etc. Therefore, the display panel is an output device. This is one aspect of the situation.

[0214] Furthermore, in this specification, the substrate of the display panel may be, for example, FPC (Flexible Printed Circuit). (Pinted Circuit) or TCP (Tape Carrier Pack) A board with connectors such as age attached, or a board with COG (Chip On) A display panel module is a device on which an IC (integrated circuit) is mounted using methods such as glass. It may also be called a display module, or simply a display panel.

[0215] Furthermore, in this specification, etc., a touch sensor is defined as a sensor that is touched by an object to be detected, such as a finger or stylus. Or it has a function to detect proximity. Therefore, the touch sensor is an input This is one aspect of the apparatus.

[0216] Furthermore, in this specification, etc., a substrate having a touch sensor is referred to as a touch sensor panel, or simply It is sometimes called a touch sensor. Also, in this specification, etc., the substrate of the touch sensor panel For example, a connector such as FPC or TCP is attached to it, or the circuit board ICs mounted using COG (Center of Graving) or similar methods are referred to as touch sensor panel modules and touch sensors. It may be called a sensor module, touch sensor, or simply a touch sensor.

[0217] In this specification, a touch panel, which is one embodiment of the display device 10, has a display surface. The function displays (outputs) images, etc., and detects when a detected object such as a finger or stylus touches the display surface, or It has the function of a touch sensor that detects proximity. Therefore, touch Nell is one form of an input / output device.

[0218] A touch panel is, for example, a display panel (or display device) with a touch sensor. It can also be called a display panel (or display device) with a sub-function.

[0219] A touch panel can also be configured to include a display panel and a touch sensor panel. Alternatively, the display panel can be configured to have a touch sensor function built into its interior. .

[0220] Furthermore, in this specification, etc., connectors such as TCP are attached to the substrate of the touch panel. A touch panel is a device that has an IC mounted on it, or on a circuit board using the COG method or similar. It may be called a display module, a touch panel, or simply a touch panel.

[0221] [Example of touch sensor configuration] The following describes an example configuration of an input device (touch sensor) with reference to the diagrams.

[0222] Figure 16(A) shows a schematic top view of the input device 150. The input device 150 is located on the circuit board 160. It has multiple electrodes 151, multiple electrodes 152, multiple wires 155, and multiple wires 156 on top. Furthermore, the substrate 160 is electrically connected to each of the multiple electrodes 151 and the multiple electrodes 152. A subsequent FPC (Flexible Printed Circuit) 157 is provided. Furthermore, Figure 16(A) shows an example in which IC158 is provided on FPC157. It is.

[0223] Figure 16(B) shows a magnified view of the area enclosed by the dashed line in Figure 16(A). Electrode 151 It has a shape in which multiple rhombus-shaped electrode patterns are connected in the horizontal direction of the paper. The diamond-shaped electrode patterns are each electrically connected. Similarly, electrode 152 is also electrically connected. The electrode pattern has multiple rhombus-shaped electrodes arranged in a row in the vertical direction of the paper, with the rhombus shape being connected in a row. The electrode patterns are electrically connected to each other. Also, electrode 151 and electrode 152 and These parts overlap and intersect with each other. At this intersection, electrode 151 and electrode 1 An insulator is sandwiched between 52 and the other component to prevent an electrical short circuit.

[0224] Furthermore, as shown in Figure 16(C), a plurality of rhombic-shaped electrodes 152 form a bridge. The configuration may be connected by electrodes 153. The island-shaped electrodes 152 are arranged in a vertical direction. The two adjacent electrodes 152 are electrically connected by the bridge electrode 153. Yes. With this configuration, electrode 151 and electrode 152 are processed using the same conductive film. This allows for simultaneous formation. Therefore, variations in these film thicknesses can be suppressed. This allows for the suppression of variations in the resistance and light transmittance of each electrode depending on the location. Note that, in this case, electrode 152 is configured to have a bridge electrode 153, but electrode 151 However, this configuration is also acceptable.

[0225] Furthermore, as shown in Figure 16(D), the electrodes 151 and 152 shown in Figure 16(B) Alternatively, the inside of the rhombus-shaped electrode pattern may be hollowed out, leaving only the outline. In this case, when the width of electrodes 151 and 152 is so narrow that it is not visible to the user. As described later, electrodes 151 and 152 use light-shielding materials such as metals or alloys. It is also possible that the electrode 151 or electrode 152 shown in Figure 16(D) is the bridge electrode 1. A configuration having 53 is also possible.

[0226] One electrode 151 is electrically connected to one wire 155. Also, one electrode 1 52 is electrically connected to one wire 156. Here, wires 155 and 156 One of them corresponds to row wiring, and the other corresponds to column wiring.

[0227] IC158 has the function of driving the touch sensor. Signal output from IC158 This is supplied to either electrode 151 or electrode 152 via wiring 155 or wiring 156. Furthermore, the current (or potential) flowing through either electrode 151 or electrode 152 is determined by the wiring 1 It is input to IC158 via 55 or wiring 156.

[0228] In this case, when the input device 150 is superimposed on the display surface of the display panel to form a touch panel. In this case, it is preferable to use a light-transmitting conductive material for electrodes 151 and 152. Furthermore, electrodes 151 and 152 are made of a light-transmitting conductive material, and light from the display panel is electrically charged When extracting via electrode 151 or electrode 152, between electrode 151 and electrode 152, It is preferable to arrange a conductive film containing the same conductive material as these as a dummy pattern. In this way, a portion of the gap between electrode 151 and electrode 152 is filled with a dummy pattern. By doing so, variations in light transmittance within the input device 150 can be reduced. This reduces the brightness unevenness of the light transmitted through the input device 150.

[0229] Examples of light-transmitting conductive materials include indium oxide, indium tin oxide, and indium Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium are used. This can be done. Furthermore, a film containing graphene can also be used. Examples of films containing graphene include... For example, it can be formed by reducing a film containing graphene oxide that has been formed in a film-like structure. Methods for achieving this include applying heat.

[0230] Alternatively, a thin metal or alloy that is translucent can be used. For example, gold, silver. Platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, Metals such as copper, palladium, or titanium, or alloys containing such metals, can be used. For example, a nitride of the metal or alloy (for example, titanium nitride) may be used. A laminated film may be used, which consists of two or more conductive films containing the material.

[0231] Furthermore, electrodes 151 and 152 are processed to be so thin that they are not visible to the user. A conductive film may be used. For example, such a conductive film may be processed into a grid (mesh) shape. This allows for high conductivity and high visibility of the display device. At this time, the conductive film is 30 nm to 100 μm, preferably 50 nm to 50 μm, and more preferably 50 nm or more. It is more preferable to have portions with a width of 20 μm or less. In particular, patterns with a width of 10 μm or less. A conductive film with a certain width is preferable because it is extremely difficult for the user to see.

[0232] As an example, Figures 17(A) to 17(D) show an enlarged view of a portion of electrode 151 or electrode 152. A rough schematic diagram is shown. Figure 17(A) shows an example using a lattice-shaped conductive film 146. This is shown. At this time, the conductive film 146 is positioned so as not to overlap with the display elements of the display device. This arrangement is preferable because it does not block light from the display device. In that case, the direction of the grid The orientation of the grid is the same as that of the display element array, and the period of the grid is an integer multiple of the period of the display element array. It is preferable to do so.

[0233] Furthermore, Figure 17(B) shows a lattice-shaped conductive film processed to form triangular openings. 147 examples are shown. With this configuration, the conductive film 1 shown in Figure 17(A) Compared to 46, it becomes possible to achieve a lower resistance.

[0234] Furthermore, as shown in Figure 17(C), the conductive film 14 has a pattern shape that does not have periodicity. It may also be set to 8. With this configuration, when it is superimposed on the display unit of the display device, more This can suppress the occurrence of ne.

[0235] Furthermore, conductive nanowires may be used for electrodes 151 and 152. Figure 17(D The following shows an example using nanowire 149. By distributing them at an appropriate density so that they come into contact with each other, a two-dimensional network is formed. This allows it to function as a highly transparent conductive film. For example, the average value of the diameter The wavelength is 1 nm to 100 nm, preferably 5 nm to 50 nm, more preferably 5 nm. Nanowires of n or more and 25 nm or less can be used. As for nanowire 149, A Metal nanowires such as g nanowires, Cu nanowires, Al nanowires, or carbon Nanotubes and the like can be used. For example, in the case of Ag nanowires, the light transmittance is 8 A sheet resistance of 9% or more can be achieved, with a sheet resistance value of 40Ω / □ to 100Ω / □.

[0236] The above is an explanation of an example of a touch sensor configuration.

[0237] [Example of touch panel configuration] Below, as an example of a display device 10 according to one aspect of the present invention, an example of the configuration of a touch panel will be described. I will explain this by referring to the drawings.

[0238] Figure 18(A) is a schematic perspective view of the touch panel 100. Figure 18(B) is a schematic perspective view of the touch panel 100. This is a schematic perspective view of 18(A) unfolded. For clarity, only representative components are shown. This is shown. Also, in Figure 18(B), only the outline of the substrate 31 is indicated by a dashed line.

[0239] The touch panel 100 has a circuit board 31 and a circuit board 21 on which an input device 150 is provided. These are arranged in layers. Regarding the configuration of the substrate 21, refer to the above configuration example 1, etc. It is possible.

[0240] The configuration of the input device 150 can be based on the example configuration of the touch sensor described above. Figure 18(A), Figure In 18(B), the input device 150 has multiple electrodes 151, multiple electrodes 152, and multiple wiring 155 shows the case where there are multiple wires 156.

[0241] For example, a capacitive touch sensor can be used as the input device 150. Quantitative methods include surface capacitance and projected capacitance. Capacity methods include self-capacity methods and mutual capacity methods. When using the mutual capacity method, This is preferable because it enables multi-point detection. Below, a projected capacitive touch sensor is described. Let's explain when this applies.

[0242] Furthermore, this is not limited to detecting the proximity or contact of an object to be detected, such as a finger or stylus. Various sensors capable of this can also be applied to the input device 150.

[0243] The touch panel 100 shown in Figures 18(A) and 18(B) has an input device 150 on the circuit board 31. A connection is provided. In addition, the wiring 155 and wiring 156 of the input device 150 are connected to the connection part 16 The FPC42 connected to the substrate 21 is electrically connected via 9.

[0244] By using this configuration, the FPC connected to the touch panel 100 is located on one board side ( Here, it can be placed only on the circuit board 21 side. Also, 2 or more touch panels 100 The above FPC can be attached in this configuration, but as shown in Figures 18(A) and 18(B) The touch panel 100 is provided with one FPC 42, and the FPC 42 is connected to the substrate 21 side and the substrate By configuring the system to supply signals to both sides of board 31, the number of components can be further reduced, simplifying the configuration. This is preferable because it allows for this.

[0245] The connection portion 169 is configured to include, for example, a connector having anisotropic conductivity. This is possible. For example, conductive particles can be used as the connector. As for the particles, those made by coating the surface of organic resin or silica particles with a metal material are used. This is possible. Using nickel or gold as the metallic material is preferable because it can reduce contact resistance. It seems that way. Also, two or more metal materials are coated in layers, such as nickel being further coated with gold. It is preferable to use particles that have undergone this process. Furthermore, the connecting body is elastically deformable or plastically deformable. It is preferable to use a material. In this case, the conductive particles will have a shape that is flattened in the vertical direction. In some cases, this can be done. By doing so, the contact area between the connector and the conductive layer to which it is electrically connected is This increases the contact resistance, reducing it and suppressing the occurrence of problems such as connection failures.

[0246] Furthermore, the connector is covered with an adhesive layer 141 (not shown) that bonds the substrate 21 and the substrate 31. It is preferable to arrange them so that they are dispersed in the adhesive layer 141 before curing. It is fine to leave it there. By positioning the connecting part 169 in the area where the adhesive layer 141 is provided, The connection portion 169 is configured such that the adhesive layer 141 is also placed on the display portion 32 (also known as a solid sealing structure). Not only for ., but also for example, light-emitting devices with hollow sealing structures, liquid crystal display devices, etc., adhesive layer This can also be applied to configurations that use 141 in the peripheral area.

[0247] Furthermore, in Figures 18(A) and 18(B), unlike in Figure 1, IC168 is actually connected to FPC42. An example of the configuration is shown. In this case, IC168 has the function of driving the input device 150. It may also have an IC that drives the input device 150 on board 21, board 31, or FP It may be provided separately in C42, etc.

[0248] [Example of cross-sectional configuration] Next, we will explain an example of the cross-sectional configuration of the touch panel 100. Figure 19 shows the touch panel This is a schematic cross-sectional view of the 100. Figure 19 shows that, compared to Figure 11, the substrate 3 is larger than the adhesive layer 141. The main difference lies in the configuration of side 1.

[0249] On the surface of substrate 31 facing substrate 21, insulating layer 161, insulating layer 162, insulating layer 163, insulating layer Layers 164 and others are arranged in a laminated manner. Between insulating layer 161 and insulating layer 162 is a light-shielding layer 133 A structure is provided. Between the insulating layer 162 and the insulating layer 163, electrodes 151, 152, etc. are provided. A bridge electrode 153 is provided between insulating layer 163 and insulating layer 164. The surface of the insulating layer 164 facing the adhesive layer 141 is provided with a colored layer 131a, a light-shielding layer 132, etc. It is being done.

[0250] Figure 19 clearly shows the intersection of electrodes 151 and 152. The bridge electrode 153 is Through the opening provided in the insulating layer 163, the two electrodes 151 sandwiching electrode 152 are electrically connected. Connected.

[0251] Electrodes 151 and 152 are positioned to overlap with the light-shielding layer 132. Also, see Figure 1. Figure 9 shows an example where the electrode 151 is positioned so as not to overlap with the light-emitting element 40. In other words, the electrode 151 has a mesh shape with an opening that overlaps with the light-emitting element 40. With this configuration, the electrode 151 is positioned on the path of the light emitted by the light-emitting element 40. Therefore, the placement of the electrode 151 does not result in any reduction in brightness, and visibility is high. Furthermore, a touch panel 100 with reduced power consumption can be realized. The electrode 152 is also the same. It can be configured in a certain way.

[0252] Furthermore, since electrodes 151 and 152 do not overlap with the light-emitting element 40, a light-transmitting guide is provided for them. It is not necessary to use electrically conductive materials, and metal materials with lower resistance than the conductive materials can be used. Therefore, compared to the case where a light-transmitting conductive material is used for electrodes 151 and 152, This can improve the sensitivity of the touch sensor.

[0253] Furthermore, in Figure 19, the substrate 3 is greater than electrodes 151 and 152 (and bridge electrode 153). The image shows an example where a light-shielding layer 133 is provided on side 1 in addition to these. Therefore, even when metal materials are used for electrodes 151, etc., these external light reflections can be suppressed. Therefore, a touch panel 100 with higher visibility can be realized. Note that here, the light-shielding layer 132 An example was shown in which two light-shielding layers, the first and the second light-shielding layer 133, are provided, but a configuration in which only one of them is provided is also shown. That is also acceptable.

[0254] Furthermore, without providing a polarizing plate 130 on the substrate 31, the substrate 31 can be used to detect a finger or stylus. It may be used as a substrate that comes into direct contact with the body. In this case, a protective layer (ceramic coating) is applied to the substrate 31. It is preferable to provide a protective layer (such as a tread). The protective layer can be, for example, silicon oxide or aluminum oxide. Inorganic insulating materials such as yttrium oxide and yttria-stabilized zirconia (YSZ) are used. It is possible to use tempered glass for the substrate 31. Tempered glass is ion Physical or chemical treatments are applied to the surface through methods such as replacement or air-cooling strengthening, thereby applying compressive stress. The added components can be used. A touch sensor is placed on one side of the tempered glass, and on the opposite side. By placing this surface, for example, on the outermost surface of an electronic device and using it as a touch surface, the entire device The thickness can be reduced.

[0255] As shown in Figure 19, the light-emitting element 40, multiple transistors, and touch sensor are configured. By placing electrodes and the like between substrate 21 and substrate 31, the number of components is reduced. It is possible to achieve Nel100.

[0256] The configuration of the touch panel 100 is not limited to this; for example, an input device 150 may be provided. The prepared substrate is then stacked with, for example, the display device 10 shown in Figure 1, to form a touch panel 100. That's good too.

[0257] Figure 20 shows the electrodes 151 and 152, etc., that constitute the touch sensor, on substrate 31. This shows an example formed on the opposite side from side 1. Such a configuration is used in on-cell type touch panels. It can be called "Ru".

[0258] Electrodes 151 and 152 are formed on the substrate 31, and an insulating layer 163 covers them. It is provided. In addition, a bridge electrode 153 is provided on the insulating layer 163.

[0259] The substrate 170 is a substrate that functions as a touch surface, and for example, it powers the touch panel 100. It functions as part of the casing or protective glass when incorporated into a sub-device. Circuit board 170 and The substrate 31 is bonded to the adhesive layer 165.

[0260] Here, in Figure 20, not only the region where electrode 151 overlaps with light-shielding layer 132, but also the light-emitting element 4 This shows an example where the electrodes are also placed in a region that overlaps with the colored layer 131a, etc. For 151, a material that transmits visible light can be used. For example, a film containing a metal oxide. or a film containing graphene, or a thin film containing metal or alloy that transmits visible light, etc. It can be used for electrode 151. The same applies to electrode 152. A similar visible light-transmitting material may be used for the ridge electrode 153, but the bridge electrode 15 When 3 is placed in overlap with the light-shielding layer 132, or when the area of ​​the bridge electrode 153 is extremely small In some cases, materials that block visible light, such as metals or alloys, may be used.

[0261] The above is a description of an example of the cross-sectional configuration of the touch panel 100.

[0262] [Configuration Example 3] In the following, as an example of a display device 10 according to one aspect of the present invention, a reflective liquid crystal element and a light-emitting element are described. A display device (display) that has both and can display in both transmissive and reflective modes. An example of a display panel will be explained. Such a display panel is called TR-hybrid display. ay(Transmissive OLED and Reflective LC H It can also be called a hybrid display.

[0263] One example of such a display panel is a liquid crystal element equipped with electrodes that reflect visible light, and One example is a configuration in which optical elements are stacked and arranged. In this case, the electrodes that reflect visible light are open. It is preferable that the opening and the light-emitting element are arranged in overlapping positions. In transient mode, the device can be driven to emit light from the light-emitting element through the aperture. It is possible. Also, the transistors that drive the liquid crystal elements and the transistors that constitute the light-emitting elements are It is preferable that they be arranged on the same plane. Furthermore, an insulating layer separates the light-emitting element and the liquid crystal element. It is preferable that the layers are stacked via a barrier.

[0264] Such display panels should be displayed in reflective mode in bright locations such as outdoors. This allows for operation with extremely low power consumption. Also, in dimly lit environments such as at night or indoors... In certain locations, displaying in transparency mode allows for optimal image display with the desired brightness. Furthermore, by displaying in both transmission and reflection modes, extremely ambient light Even in bright environments, it consumes less power and offers higher contrast compared to conventional display panels. It can display a high level of performance.

[0265] [Example Configuration] Figure 21(A) is a block diagram showing an example of the configuration of the display device 200. 0 has multiple pixels 210 arranged in a matrix on the display unit 32. 200 has circuit GD and circuit SD. Also, multiple pixels 210 arranged in direction R. and multiple wires G1, multiple wires G2, and multiple wires ANO that are electrically connected to circuit GD. and has multiple wiring CSCOM. Also has multiple pixels 210 arranged in direction C, and It has multiple wirings S1 and multiple wirings S2 that are electrically connected to the circuit SD.

[0266] Pixel 210 has a reflective liquid crystal element and a light-emitting element. In pixel 210, the liquid crystal element The child and the light-emitting element have overlapping portions.

[0267] Figure 21(B1) shows an example of the configuration of the conductive layer 191 of the pixel 210. The conductive layer 191 is It functions as a reflective electrode for the liquid crystal element in pixel 210. In addition, the conductive layer 191 has an open An opening 251 is provided.

[0268] In Figure 21(B1), the light-emitting element 40 located in the region overlapping with the conductive layer 191 is shown by a dashed line. The light-emitting element 40 is positioned in overlap with the opening 251 of the conductive layer 191. As a result, the light emitted by the light-emitting element 40 is emitted towards the display surface through the aperture 251.

[0269] In Figure 21(B1), the pixel 210 adjacent to the direction R is a pixel corresponding to a different color. At this time, as shown in Figure 21(B1), in two pixels adjacent to each other in direction R, an aperture is formed. The portions 251 are provided at different positions on the conductive layer 191 so that they are not arranged in a single line. This is preferable. This makes it possible to separate the two light-emitting elements 40, and the light-emitting elements 40 emit The phenomenon in which light from one pixel enters the colored layer of the adjacent pixel 210 (also known as crosstalk). This can suppress ( ). Also, by arranging the two adjacent light-emitting elements 40 apart, Therefore, when the EL layer of the light-emitting element 40 is created differently using a shadow mask or the like, However, this makes it possible to achieve a display device 200 with high resolution.

[0270] Furthermore, the pixels 210 may be arranged as shown in Figure 21(B2).

[0271] In the conductive layer 191 of the pixel 210, the aperture 251 is relative to the total area of ​​the non-aperture area. If the ratio of the total area is too large, the display using liquid crystal elements will become dim. If the ratio of the total area of ​​the opening 251 to the total area of ​​the mouth is too small, the light-emitting element 40 will not be used. The display becomes dim.

[0272] Furthermore, the area of ​​the opening 251 provided in the conductive layer 191, which functions as a reflective electrode, is too small. This reduces the efficiency of the light that can be extracted from the light emitted by the light-emitting element 40.

[0273] The shape of the opening 251 may be, for example, a polygon, a square, an ellipse, a circle, or a cross. It can also be in the shape of elongated stripes, slits, or checkerboard patterns. The aperture 251 may be positioned close to the adjacent pixels. Preferably, the aperture 251 They are positioned close to other pixels that display the same color. This suppresses crosstalk. .

[0274] [Example of circuit configuration] Figure 22 is a circuit diagram showing an example configuration of pixel 210. In Figure 22, two adjacent pixels It shows 210.

[0275] Pixel 210 consists of switch SW1, capacitive element C1, liquid crystal element 60, switch SW2, and a transistor. It has an inverter M, a capacitive element C2, and a light-emitting element 40, etc. Also, the pixel 210 has wiring G1, wiring G2, wiring ANO, wiring CSCOM, wiring S1, and wiring S2 are electrically connected. In addition, Figure 22 shows the wiring VCOM1 that electrically connects to the liquid crystal element 60, and The wiring VCOM2 is shown to be electrically connected to the light-emitting element 40.

[0276] Figure 22 shows an example where transistors are used for switches SW1 and SW2. It is showing.

[0277] Switch SW1 has its gate connected to wiring G1, and either its source or drain connected to wiring S Connected to 1, with the source or drain being one electrode of the capacitive element C1, and liquid crystal element 6 One electrode of 0 is connected to the other electrode of the capacitive element C1, which is connected to the wiring CSCOM. The liquid crystal element 60 has its other electrode connected to the wiring VCOM1.

[0278] Furthermore, switch SW2 has its gate connected to wiring G2, and either the source or the drain is Connected to wiring S2, the other of the source or drain is one electrode of the capacitive element C2, transit It is connected to the gate of transistor M. Capacitive element C2 has its other electrode connected to the socket of transistor M. One of the drains or the source is connected to wiring ANO. Transistor M is the source. Alternatively, the other end of the drain is connected to one electrode of the light-emitting element 40. One of the electrodes is connected to the wiring VCOM2.

[0279] In Figure 22, transistor M has two gates that sandwich the semiconductor forming the channel region. This shows an example of how these are connected. This allows transistor M to conduct electricity. This allows for an increase in the current that can be generated.

[0280] Wiring G1 is used to provide a signal that controls switch SW1 to either a conductive or non-conductive state. This is possible. A predetermined potential can be applied to the wiring VCOM1. The wiring S1 can be liquid crystal A signal can be provided to control the orientation state of the liquid crystal in element 60. Wiring CSCOM A predetermined potential can be applied to it.

[0281] Wiring G2 is used to provide a signal that controls switch SW2 to either a conductive or non-conductive state. This is possible. A potential difference is generated between wiring VCOM2 and wiring ANO, causing the light-emitting element 40 to emit light. A potential can be applied to each. Wiring S2 controls the conduction state of transistor M. It can provide a signal.

[0282] Pixel 210 shown in Figure 22, for example, when displaying in reflection mode, wiring G1 and It is driven by a signal supplied to wiring S1 and displays using optical modulation by the liquid crystal element 60. This is possible. Also, when displaying in transparent mode, the signal to wiring G2 and wiring S2 It is driven by a motor, and the light-emitting element 40 can be illuminated to display information. Also, both modes When displaying, the following will be given to each of the wires G1, G2, S1 and S2. It is driven by a signal and can display information using both the liquid crystal element 60 and the light-emitting element 40.

[0283] [Example of cross-sectional configuration of a display device] Figure 23 shows a schematic cross-sectional view of the display device 200.

[0284] The display device 200 has an insulating layer 220 between substrate 21 and substrate 31. Between 1 and the insulating layer 220, there is a light-emitting element 40, transistor 205, transistor 206, It has a color layer 134, etc. Also, between the insulating layer 220 and the substrate 31, there is a liquid crystal element 60 and a color layer 1 31, It has a structure 244, etc.

[0285] The substrate 21 and the insulating layer 82, etc. are bonded together by the adhesive layer 141. Also, the substrate 31 and The insulating layer 220 is bonded to the liquid crystal by the adhesive layer 142 that seals the liquid crystal.

[0286] The liquid crystal element 60 is a reflective liquid crystal element. The liquid crystal element 60 consists of a conductive layer 192 and liquid crystal 19 3. It has a laminated structure of conductive layer 194. Also, the conductive layer 192 is in contact with the substrate 21 side. A conductive layer 191 is provided. The conductive layer 191 functions as a reflective electrode of the liquid crystal element 60. Furthermore, the conductive layer 191 has an opening 251. Also, the conductive layer 192 transmits visible light. Contains materials that may cause overconsumption.

[0287] The light-emitting element 40 is a bottom-emission type light-emitting element. The light-emitting element 40 has an insulating layer 2 The structure has a layered arrangement from the 20 side in the order of conductive layer 111, EL layer 112, and conductive layer 113. The conductive layer 113 contains a material that reflects visible light, and the conductive layer 111 contains a material that transmits visible light. Includes. The light emitted by the light-emitting element 40 is transmitted through the colored layer 134, the insulating layer 220, the aperture 251, and the conductive It is injected towards the substrate 31 via layer 192, etc.

[0288] Furthermore, the insulating layer 81 and the insulating layer 82 are provided with openings 11 and 12, respectively. In a top view, the outer periphery of opening 12 is inward from the outer periphery of opening 11. The part 11 and the opening 12 are integrated, forming a wedge-shaped opening in cross-sectional view. The inside of the opening is filled with adhesive layer 141.

[0289] Either the source or drain of transistor 205 is connected to the conductive layer 111 of light-emitting element 40. They are electrically connected. For example, transistor 205 is connected to transistor M in Figure 22. It corresponds to.

[0290] One of the sources or drains of transistor 206 is connected to the conductive layer 19 via terminal portion 207. 1 and the conductive layer 192 are electrically connected. The terminal portion 207 is located within the display portion 32. Through openings provided in the insulating layer 220, the conductive layers provided on both sides of the insulating layer 220 communicate with each other. It has the function of electrically connecting the transistors. For example, transistor 206 is the same as the switch in Figure 22. Compatible with switch SW1.

[0291] Terminal portion 204 is provided in the area of ​​substrate 21 that does not overlap with substrate 31. 04, similar to the terminal portion 207, electrically connects the conductive layers provided on both sides of the insulating layer 220. Connect. The upper surface of the terminal portion 204 is made of a conductive film identical to the conductive layer 192. The layer is exposed. This allows the terminal portion 204 and the FPC 42 to be connected via the connecting layer 242. It can be electrically connected.

[0292] A colored layer 131 and a light-shielding layer 132 are provided on the substrate 21 side of the substrate 31. An insulating layer 195 is provided that covers the color layer 131 and the light-shielding layer 132. The insulating layer 195 is It functions as an overcoat. In addition, a conductive layer 194 is placed on the substrate 21 side of the insulating layer 195. A system is in place.

[0293] Furthermore, a connecting portion 252 is provided in a part of the area where the adhesive layer 142 is provided. In the continuation portion 252, a conductive layer obtained by processing the same conductive film as the conductive layer 192, and a conductive layer A portion of 194 is electrically connected by the connector 243. Therefore, the substrate 31 The conductive layer 194 formed on the side receives signals input from the FPC 42 connected to the substrate 21 side. Alternatively, the potential can be supplied via the connection part 252.

[0294] A structure 244 is provided between the conductive layer 192 and the conductive layer 194. The structure 244 is It has the function of maintaining the cell gap of the liquid crystal element 60.

[0295] Although not shown in the diagram here, the space between the conductive layer 194 and the liquid crystal 193, and the space between the conductive layer 192 and the liquid crystal An alignment film may be provided between the crystals 193 to control the orientation of the liquid crystal 193. Furthermore, a portion of the alignment film may be provided covering the surface of the structure 244.

[0296] An example of a method for manufacturing the display device 200 will be described. For example, a support having a release layer A conductive layer 192, a conductive layer 191, and an insulating layer 220 are formed sequentially on the substrate, and then a transient After forming the sta 205 and light-emitting element 40, etc., the substrate 21 and support substrate are bonded together using the adhesive layer 141. The sides on which each element is formed are bonded together. Then, the release layer and the insulating layer 220, and the release layer and the conductive layer The support substrate and the release layer are removed by peeling at each interface of the electrode layer 192. In addition, a colored layer 131, a light-shielding layer 132, a structure 244, etc., are formed in advance. Prepare substrate 31. Then, place liquid crystal 193 on the side of substrate 21 or substrate 31 where each element is formed. The adhesive is dropped onto the substrate 21 and the substrate 31, and the sides on which each element is formed are bonded together by the adhesive layer 142. By combining these components, a display device 200 can be manufactured.

[0297] As the release layer, a material that causes delamination at the interface with the insulating layer 220 and the conductive layer 192 is appropriately selected. It can be selected. In particular, a layer containing a high melting point metal material such as tungsten can be used as the release layer. The layers containing the oxide of the metal material are laminated and used, and the insulating layer 220 on the release layer is nitrided It is preferable to use layers made of multiple layers of silicon, silicon oxide or silicon nitride, silicon nitride or silicon oxide, etc. Using a high-melting-point metal material for the delamination layer raises the formation temperature of the layers formed later. This makes it possible to reduce the concentration of impurities in the layer, resulting in a highly reliable display device 200. It can be expressed.

[0298] The conductive layer 192 may be a metal oxide, a metal nitride, or a low-resistance oxide semiconductor, etc. It is preferable to use an oxide. When using an oxide semiconductor, hydrogen, boron, and phosphorus are used. At least one of the concentrations of nitrogen and other impurities, and the amount of oxygen deficiency, is a transistor A material with improved performance compared to the semiconductor layer used can be used for the conductive layer 192.

[0299] The above is an explanation of Configuration Example 3.

[0300] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0301] (Embodiment 2) In this embodiment, an input applicable to the display device 10 or display device 200 according to one aspect of the present invention is provided. This section describes an example of a method for driving a force device (touch sensor).

[0302] Figure 24(A) is a block diagram showing the configuration of a mutually capacitive touch sensor. (A) shows the pulse voltage output circuit 601 and the current detection circuit 602. Note that Figure 2 In 4(A), the electrode 621 to which the pulse is applied and the electrode 622 to which the change in current is detected are positioned separately. These are shown as six wires, X1 through X6 and Y1 through Y6. The number of electrodes is not limited to this. Also, Figure 24(A) shows electrodes 621 and 622. The volume formed by superimposing or by placing electrodes 621 and 622 in close proximity is formed. The volume 603 is illustrated. Note that electrodes 621 and 622 have interchangeable functions. You may do so.

[0303] For example, the electrode 151 illustrated in Embodiment 1 is connected to one of the electrodes 621 and 622. Accordingly, electrode 152 corresponds to the other of electrode 621 and electrode 622.

[0304] The pulse voltage output circuit 601, for example, inputs pulse voltages sequentially to wiring X1 to wiring X6. This is a circuit for that purpose. The current detection circuit 602 detects, for example, each of the wirings Y1 to Y6 This is a circuit for detecting the current flowing through it.

[0305] When a pulse voltage is applied to one of the wires X1 through X6, capacitance 603 is formed. An electric field is generated between the electrodes 621 and 622, and a current flows through electrode 622. A portion of the electric field generated between electrodes is shielded by the proximity or contact of the object being detected, such as a finger or pen. As a result, the strength of the electric field generated between the electrodes changes. Consequently, the magnitude of the current flowing through electrode 622 changes. The size changes.

[0306] For example, if there is no proximity or contact with the object to be detected, the current flowing through wiring Y1 to Y6 The size will be a value corresponding to the size of the 603 capacity. On the other hand, when the object to be detected is nearby or in contact with it... If a portion of the electric field is shielded, the magnitude of the current flowing through wiring Y1 to Y6 decreases. The current detection circuit 602 then detects this change. This allows the tap shown in Figure 24(A) The sensor can detect the proximity or contact of an object to be detected.

[0307] The current detection circuit 602 detects the (time-dependent) integral of the current flowing through a single wire. This is also possible. In that case, for example, detection can be performed using an integrating circuit or the like. Alternatively, the current The peak value may also be detected. In that case, for example, the current is converted to voltage, and the peak value of the voltage is detected. It may be detected as a - value.

[0308] Figure 24(B) shows the input and output waves of the mutual capacitance type touch sensor shown in Figure 24(A). An example of a timing chart for the shape is shown. In Figure 24(B), the detection of each matrix in one sensing period. The system shall perform the following actions. Also, in Figure 24(B), in cases where contact or proximity of the object to be detected is not detected, There are two cases: when the object being detected is not touched, and when contact or proximity of the object is detected (when touched). These are shown side by side. Here, for wiring Y1 to Y6, the magnitude of the detected current is The waveform of the corresponding voltage is shown.

[0309] As shown in Figure 24(B), pulse voltages are sequentially applied to wiring X1 to wiring X6. In response, current flows through wiring Y1 to Y6. When not in contact, wiring X1 In response to the pulse voltage applied to wiring X6, a similar current flows through wirings Y1 to Y6. Therefore, wiring Y1 to Y6 all show the same output waveform. On the other hand, when touched... Among the wirings Y1 to Y6, the current flows through the wiring located at the point where the object to be detected is in contact with or near. As the current decreases, the output waveform at that point changes, as shown in Figure 24(B). do.

[0310] In Figure 24(B), the object to be detected is located at or near the point where wiring X3 and wiring Y3 intersect. Examples of contact or proximity are shown.

[0311] Thus, in the mutual capacitance method, the electric field generated between the pair of electrodes is shielded. By detecting changes in the current, the position information of the object being detected can be obtained. If the detection sensitivity is high, the object to be detected will move away from the detection surface (e.g., the surface of a touch panel). Even if it's not there, its coordinates can be detected.

[0312] Furthermore, in the case of a touch panel, there is a display period for the display unit and a sensing period for the touch sensor. By using a drive method with a staggered timing, the detection sensitivity of the touch sensor can be increased. For example, if you separate the display period and the sensing period within the duration of one display frame... Good. Furthermore, it is preferable to include two or more sensing periods within a single frame. It is possible to increase detection sensitivity by increasing the sensing frequency.

[0313] Furthermore, the pulse voltage output circuit 601 and the current detection circuit 602 are, for example, one IC chip It is preferable that it is formed inside a . The IC is mounted, for example, in a touch panel. It is preferable that it be mounted on a circuit board inside the housing of an electronic device. When using a touch panel, parasitic capacitance increases in the curved portion, and the impact of noise becomes greater. Because there is a risk of this happening, ICs that employ a driving method less susceptible to noise should be used. It is preferable to use such a method. For example, a driving method that increases the signal-to-noise ratio (S / N ratio) is suitable. It is preferable to use the IC used.

[0314] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0315] (Embodiment 3) In this embodiment, it is used in place of each transistor shown in the above embodiment. An example of a transistor that can be created will be explained using a diagram.

[0316] A display device 10 or display device 200 according to one aspect of the present invention includes a bottom-gate transistor and It can be fabricated using various types of transistors, such as top-gate transistors. Yes, it is possible. Therefore, the semiconductor layer materials and transistors used can be adjusted to match the existing manufacturing line. The structure can be easily replaced.

[0317] [Bottom-gate transistor] Figure 25(A1) shows a channel-protected bottom-gate transistor, a type of transistor. This is a cross-sectional view of transistor 810. In Figure 25(A1), transistor 810 is a base It is formed on the board 771. Also, the transistor 810 has an insulating layer 77 on the substrate 771. It has an electrode 746 via 2. Also, a semiconductor layer 7 via an insulating layer 726 is placed on the electrode 746. It has 42. Electrode 746 can function as a gate electrode. Insulating layer 726 is a gate insulating layer. It can function as such.

[0318] Furthermore, an insulating layer 741 is provided on the channel formation region of the semiconductor layer 742. Electrodes 744a and 744b are located on the insulating layer 726, in contact with a portion of 742. Electrode 744a can function as either the source electrode or the drain electrode. Electrode 744b is a source electrode. It can function as either a drain electrode or the other of a electrode. Part of electrode 744a, and electrode 74 A portion of 4b is formed on the insulating layer 741.

[0319] The insulating layer 741 can function as a channel protection layer. The insulating layer 741 is placed on the channel formation region. By providing 1, the dew on the semiconductor layer 742 that occurs when forming electrodes 744a and 744b This prevents leakage. Therefore, when forming electrodes 744a and 744b, the semiconductor layer 7 This prevents the 42 channel formation regions from being etched. According to one embodiment of the invention, a transistor with good electrical characteristics can be realized.

[0320] Furthermore, the transistor 810 has an insulating layer 741 on electrode 744a, electrode 744b and insulating layer 741. It has a layer 728, and an insulating layer 729 on top of the insulating layer 728.

[0321] For example, the insulating layer 772 is made using the same materials and methods as the insulating layer 173 and the insulating layer 220. It can be formed. Furthermore, the insulating layer 772 may be a laminate of multiple insulating layers. For example, the semiconductor layer 742 is formed using the same materials and methods as the semiconductor layer 231. This is possible. Furthermore, the semiconductor layer 742 may be a stack of multiple semiconductor layers. For example, the electrode 746 can be formed using the same materials and methods as the conductive layer 221. The electrode 746 may be a laminate of multiple conductive layers. For example, the insulating layer 7 Layer 26 can be formed using the same materials and methods as the insulating layer 211. Layer 726 may be a lamination of multiple insulating layers. Also, for example, electrode 744a and electrode 744b can be formed using the same materials and methods as the wiring 35 or conductive layer 222. It can be done. Furthermore, electrodes 744a and 744b may be made up of multiple conductive layers. For example, the insulating layer 741 may be formed using the same materials and methods as the insulating layer 726. This is possible. Note that the insulating layer 741 may be a lamination of multiple insulating layers. Also, for example, The insulating layer 728 can be formed using the same materials and methods as the insulating layer 212. The insulating layer 728 may be a lamination of multiple insulating layers. Also, for example, insulating layer 729 The insulating layer 7 can be formed using the same materials and methods as the insulating layer 213. 29 may be a lamination of multiple insulating layers.

[0322] The electrodes, semiconductor layer, insulating layer, etc. that constitute the transistor disclosed in this embodiment are different from other It can be formed using the materials and methods disclosed in the embodiments.

[0323] When an oxide semiconductor is used for the semiconductor layer 742, the number of electrodes 744a and 744b is small. However, in the area in contact with semiconductor layer 742, oxygen is removed from a part of semiconductor layer 742, resulting in an oxygen deficiency. It is preferable to use a material capable of causing oxygen vacancies in the semiconductor layer 742. The resulting region has an increased carrier concentration, and the region becomes n-type, creating an n-type region (n + It becomes a layer. Therefore, the region can function as either a source region or a drain region. When an oxide semiconductor is used for the body layer 742, oxygen is removed from the semiconductor layer 742, creating an oxygen vacancy. Examples of materials that can be used to achieve this include tungsten and titanium. .

[0324] By forming a source region and a drain region in the semiconductor layer 742, the electrode 744a Furthermore, the contact resistance between electrode 744b and semiconductor layer 742 can be reduced. Therefore, The goal is to improve the electrical characteristics of the transistor, such as field-effect mobility and threshold voltage. can.

[0325] When a semiconductor such as silicon is used for the semiconductor layer 742, the semiconductor layer 742 and the electrode 744 Between a, and between semiconductor layer 742 and electrode 744b, an n-type semiconductor or p-type semiconductor is used. It is preferable to provide a layer that can perform the function. The layer that functions as an n-type semiconductor or p-type semiconductor is It can function as the source or drain region of an inverter.

[0326] The insulating layer 729 has the function of preventing or reducing the intrusion of impurities into the transistor from the outside. It is preferable to form it using a material that has the properties of [material name]. The insulating layer 729 may be omitted if necessary. It is also possible.

[0327] Furthermore, when an oxide semiconductor is used for the semiconductor layer 742, before or after the formation of the insulating layer 729 Alternatively, heat treatment may be performed before or after the formation of the insulating layer 729. By performing heat treatment, Oxygen contained in the insulating layer 729 and other insulating layers is diffused into the semiconductor layer 742, and the semiconductor layer 7 The oxygen deficiency in 42 can be compensated for. Alternatively, the insulating layer 729 can be formed while heating. This makes it possible to fill in the oxygen vacancies in the semiconductor layer 742.

[0328] Generally speaking, CVD methods utilize plasma CVD (Pla CVD). SMA Enhanced CVD method, Thermal CVD (TCVD) which utilizes heat It can be classified into methods such as the al CVD method. Furthermore, depending on the raw material gas used, it can be classified into metal CVD (M CVD:Metal CVD) method, MOCVD:Metal Orga It can be classified into methods such as the NIC CVD method.

[0329] Furthermore, generally speaking, evaporation methods include resistance heating evaporation, electron beam evaporation, and MBE (Molecula r Beam Epitaxy) method, PLD (Pulsed Laser Deposit) tion) method, IBAD (Ion Beam Assisted Deposition) It can be classified into methods such as the ) method and the ALD (Atomic Layer Deposition) method. .

[0330] Plasma CVD can produce high-quality films at relatively low temperatures. MOCVD and vapor deposition are also available. When using deposition methods that do not use plasma during film formation, such as the method described above, damage occurs to the surface to be formed. This method produces a film that is less prone to defects and has fewer defects.

[0331] Furthermore, generally speaking, sputtering methods include DC sputtering and magnetron sputtering. Sputtering method, RF sputtering method, ion beam sputtering method, ECR (Electr (on Cyclotron Resonance) Sputtering method, opposing targets This can be classified into methods such as the puttering method.

[0332] In the opposing target sputtering method, the plasma is confined between the targets. This reduces plasma damage to the substrate. Also, depending on the tilt of the target This allows for a shallower incidence angle of sputtering particles onto the substrate, thus improving step coverage. It can be improved.

[0333] The transistor 811 shown in Figure 25(A2) has a back gate electrode on the insulating layer 729. It differs from the transistor 810 in that it has an electrode 723 that can function. It can be formed using the same materials and methods as for the 746.

[0334] Generally, the back gate electrode is formed of a conductive layer, and the gate electrode and the back gate electrode are connected. It is positioned so as to sandwich the channel formation region of the semiconductor layer. Therefore, the back gate electrode is It can be made to function similarly to a gate electrode. The potential of the back gate electrode is the same as that of the gate electrode. It can be an electric potential, or it can be the ground potential (GND potential), or any other potential. By changing the potential of the gate electrode independently of the gate electrode, the transient The threshold voltage of the sta can be changed.

[0335] Both electrodes 746 and 723 can function as gate electrodes. The insulating layer 726, insulating layer 728, and insulating layer 729 are each gate insulating layers. It can function in this way. The electrode 723 is provided between the insulating layer 728 and the insulating layer 729. That's fine.

[0336] Note that when one of the electrodes 746 or 723 is referred to as the "gate electrode," the other is referred to as the "battery electrode." It is called the "gate electrode." For example, in transistor 811, electrode 723 is called the "gate electrode." When referring to "pole," electrode 746 is called the "back gate electrode." Also, electrode 723 is called the "gate electrode." When used as a "top-gate electrode," transistor 811 is one of the top-gate type transistors. It can be considered a species. Also, either electrode 746 or electrode 723 is considered the "first Sometimes, one is called the "gate electrode," and the other is called the "second gate electrode."

[0337] By providing electrodes 746 and 723 with the semiconductor layer 742 in between, further, electrode 7 By setting 46 and electrode 723 to the same potential, the carrier flow region in semiconductor layer 742 As the region becomes larger in the film thickness direction, the amount of carrier movement increases. As a result, As the on-current of the transistor 811 increases, the field-effect mobility also increases.

[0338] Therefore, transistor 811 has a large on-current relative to its occupied area. It is a transistor. That is, the area occupied by transistor 811 relative to the required on-current. This can be made smaller. According to one aspect of the present invention, the occupied area of ​​the transistor can be reduced. Therefore, according to one aspect of the present invention, a semiconductor device with a high degree of integration can be realized. It is possible.

[0339] Furthermore, since the gate electrode and back gate electrode are formed of a conductive layer, the outside of the transistor A function that prevents the electric field generated in the region from acting on the semiconductor layer in which the channel region is formed. It has an electric field shielding function against static electricity, etc. Furthermore, the back gate electrode is made of a semiconductor layer By forming a larger structure and covering the semiconductor layer with a back gate electrode, the electric field shielding function is enhanced. It is possible.

[0340] Furthermore, electrodes 746 and 723 each have the function of shielding against external electric fields. Therefore, the charge of charged particles etc. generated on the insulating layer 772 side or above the electrode 723 is transferred to the semiconductor layer 74 It does not affect the channel formation region of 2. As a result, stress tests (e.g., ge Applying a negative potential to the terminals - GBT (Gate Bias-Temperature) Degradation due to the TRES test is suppressed. Also, the on-current is affected by the magnitude of the drain voltage. This can reduce the phenomenon of changes in the gate voltage (start-up voltage) at which current begins to flow. This effect occurs when electrodes 746 and 723 are at the same potential or different potentials. To do.

[0341] Note that the BT stress test is a type of accelerated test that shows the effects of long-term use. This allows for the rapid evaluation of changes in the characteristics of the ZISTA (changes over time). In particular, it is useful for BT stress testing. The change in the transistor's threshold voltage before and after testing is an important indicator for examining reliability. Yes. The smaller the fluctuation in the threshold voltage, the more reliable the transistor is considered to be.

[0342] Furthermore, it has electrodes 746 and 723, and electrodes 746 and 723 are at the same potential. This reduces the fluctuation in the transistor's threshold voltage. Therefore, multiple transistors Variations in electrical characteristics in the t are also reduced at the same time.

[0343] Furthermore, transistors with a back gate electrode have a positive potential applied to the gate (+GB). The threshold voltage fluctuations before and after the T-stress test were also observed in transistors without a back gate electrode. It's smaller than a ta.

[0344] Furthermore, by forming the back gate electrode with a light-shielding conductive film, the back gate electrode This prevents light from entering the semiconductor layer from the polar side. Therefore, photodegradation of the semiconductor layer is prevented. This prevents degradation of electrical characteristics, such as a shift in the transistor's threshold voltage.

[0345] According to one aspect of the present invention, a transistor with good reliability can be realized. This enables the realization of highly reliable semiconductor devices.

[0346] Figure 25(B1) shows a channel-protected bottom-gate transistor. A cross-sectional view of transistor 820 is shown. Transistor 820 is almost identical to transistor 810. It has a similar structure, but differs in that the insulating layer 741 covers the edge of the semiconductor layer 742. Furthermore, an opening is formed by selectively removing a portion of the insulating layer 741 that overlaps with the semiconductor layer 742. In this configuration, the semiconductor layer 742 and the electrode 744a are electrically connected. In another opening formed by selectively removing a portion of the insulating layer 741 that overlaps with 42, a semiconductor The body layer 742 and the electrode 744b are electrically connected. Channel formation region of the insulating layer 741 The region overlapping with the channel can function as a channel protection layer.

[0347] The transistor 821 shown in Figure 25(B2) has a back gate electrode on the insulating layer 729. It differs from transistor 820 in that it has an electrode 723 that can function.

[0348] By providing the insulating layer 741, the semiconductor generated during the formation of electrodes 744a and 744b is eliminated. This prevents the exposure of layer 742. Therefore, when forming electrodes 744a and 744b This prevents the channel formation region of the semiconductor layer 742 from being etched.

[0349] Furthermore, transistors 820 and 821 are transistors 810 and 821. The distance between electrode 744a and electrode 746, and between electrode 744b and electrode 74 The distance between 6 increases. Therefore, the distance between electrode 744a and electrode 746 increases by that amount. The parasitic volume can be reduced. Also, the parasitic volume that occurs between electrode 744b and electrode 746 The capacity can be reduced. According to one aspect of the present invention, a transistor with good electrical characteristics It can be achieved.

[0350] The transistor 825 shown in Figure 25(C1) is a bottom-gate type transistor. This is a channel-etched transistor. Transistor 825 has an insulating layer 74 Without using 1, electrodes 744a and 744b are formed. Therefore, electrodes 744a and A portion of the semiconductor layer 742 that is exposed during the formation of electrode 744b may be etched. On the other hand, since the insulating layer 741 is not provided, the productivity of transistors can be increased.

[0351] The transistor 826 shown in Figure 25(C2) has a back gate electrode on the insulating layer 729. It differs from transistor 825 in that it has an electrode 723 that can function.

[0352] [Top-gate transistor] Figure 26(A1) shows transistor 830, a type of top-gate transistor. A cross-sectional view is shown. Transistor 830 has a semiconductor layer 742 on top of an insulating layer 772, and semiconductor On the body layer 742 and the insulating layer 772, there is an electrode 744a that is in contact with a part of the semiconductor layer 742, and a semiconductor It has an electrode 744b that is in contact with a part of the conductive layer 742, and the semiconductor layer 742, electrode 744a, and The electrode 744b has an insulating layer 726, and the insulating layer 726 has an electrode 746.

[0353] Transistor 830 has electrodes 746 and 744a, and electrodes 746 and 744b Because they do not overlap, the parasitic capacitance generated between electrode 746 and electrode 744a, and the electrode The parasitic capacitance between 746 and electrode 744b can be reduced. Also, electrode 7 After forming 46, the electrode 746 is used as a mask to remove impurities 755 from the semiconductor layer 742 By introducing it, impurity regions are self-aligned within semiconductor layer 742. This can form (see Figure 26(A3)). According to one aspect of the present invention, electrical characteristics This allows for the creation of high-quality transistors.

[0354] The introduction of impurity 755 is performed using an ion implantation device, an ion doping device, or plasma treatment. This can be done using a scientific device.

[0355] For example, impurity 755 may be at least one of the elements from Group 13 or Group 15. Various elements can be used. Also, when an oxide semiconductor is used for the semiconductor layer 742 As impurity 755, at least one element from among noble gases, hydrogen, and nitrogen is used. It is also possible to do so.

[0356] The transistor 831 shown in Figure 26(A2) has an electrode 723 and an insulating layer 727. This is different from transistor 830. Transistor 831 is formed on the insulating layer 772. It has an electrode 723 and an insulating layer 727 formed on the electrode 723. It can function as a gate electrode. Therefore, the insulating layer 727 is a gate insulating layer and It can function in the same way. The insulating layer 727 is made of the same materials and in the same way as the insulating layer 726. It can be formed.

[0357] Similar to transistor 811, transistor 831 has a large on-voltage relative to its occupied area. It is a transistor that has current. That is, for the required on-current, the transistor The occupied area of ​​831 can be reduced. According to one aspect of the present invention, the transistor The occupied area can be reduced. Therefore, according to one aspect of the present invention, a semi-integrated area with a high density can be formed. A conductive device can be realized.

[0358] The transistor 840 shown in Figure 26(B1) is a top-gate type transistor. There are two. Transistor 840 is a semiconductor after forming electrodes 744a and 744b. The difference from transistor 830 is that it forms layer 742. Furthermore, as illustrated in Figure 26(B2)... The transistor 841 has an electrode 723 and an insulating layer 727, which is the same as transistor 84 It is different from 0. In transistors 840 and 841, one of the semiconductor layers 742 The portion is formed on electrode 744a, and the other portion of the semiconductor layer 742 is formed on electrode 744b. ru.

[0359] Similar to transistor 811, transistor 841 has a large ON-voltage relative to its occupied area. It is a transistor that has current. That is, for the required on-current, the transistor The occupied area of ​​841 can be reduced. According to one aspect of the present invention, the transistor The occupied area can be reduced. Therefore, according to one aspect of the present invention, a semi-integrated area with a high density can be formed. A conductive device can be realized.

[0360] The transistor 842 shown in Figure 27(A1) is a top-gate type transistor. There are two. Transistor 842 has an insulating layer 729 formed, and then electrodes 744a and 7 The point forming 44b differs from transistors 830 and 840. Electrode 744 a and electrode 744b are semiconducting at the openings formed in the insulating layer 728 and insulating layer 729. It is electrically connected to body layer 742.

[0361] Furthermore, a portion of the insulating layer 726 that does not overlap with electrode 746 is removed, and electrode 746 and the remaining insulating layer are removed. By using layer 726 as a mask and introducing impurity 755 into semiconductor layer 742, Impurity regions can be formed in the body layer 742 through self-alignment. (See Figure 27(A3).) Transistor 842 has an insulating layer 726 that connects to the end of electrode 746. It has a region that extends beyond. When introducing impurity 755 into semiconductor layer 742, the semiconductor layer The impurity concentration in the region where impurity 755 is introduced via insulating layer 726 is in insulating layer 7 The region is lower than the region where impurity 755 was introduced without going through 26. Therefore, semiconductor layer 742 This involves LDD (Lightly Doped Drain) in a region that does not overlap with electrode 746. A region is formed.

[0362] The transistor 843 shown in Figure 27(A2) has an electrode 723, which is a transistor It is different from 842. Transistor 843 has electrodes 723 formed on substrate 771. It overlaps with the semiconductor layer 742 via the insulating layer 772. The electrode 723 is a back gate electrode. It can function.

[0363] Also, transistor 844 shown in Figure 27(B1) and transistor shown in Figure 27(B2) As in the case of TA845, the entire insulating layer 726 in the region that does not overlap with electrode 746 may be removed. Also, transistor 846 shown in Figure 27(C1) and transistor shown in Figure 27(C2) As in case 847, the insulating layer 726 may be left intact.

[0364] Transistors 842 through 847 also form electrodes 746 after the electrode 74 By using 6 as a mask and introducing impurity 755 into semiconductor layer 742, semiconductor layer 7 An impurity region can be formed in 42 in a self-aligned manner. According to one aspect of the present invention, A transistor with good thermal characteristics can be realized. Furthermore, according to one aspect of the present invention, This enables the realization of highly integrated semiconductor devices.

[0365] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0366] (Embodiment 4) In this embodiment, a display module having a display device 10 or display device 200 according to one aspect of the present invention Joule and electronic equipment will be explained using diagrams.

[0367] The display module 8000 shown in Figure 28 consists of an upper cover 8001 and a lower cover 8002. In between, the touch panel 8004 connected to the FPC8003, the frame 8009, and the print It has a circuit board 8010 and a battery 8011.

[0368] A display panel, touch panel, or touch panel module according to one embodiment of the present invention is, for example, It can be used with the touch panel 8004.

[0369] The upper cover 8001 and lower cover 8002 are sized to fit the touch panel 8004. Furthermore, the shape and dimensions can be changed as needed.

[0370] The touch panel 8004 uses a resistive or capacitive touch panel as a display panel. It can be used superimposed on the touch panel 8004. It is also possible to incorporate touch panel functionality. It is also possible to install a light sensor in each of the four pixels to create an optical touch panel.

[0371] Furthermore, when a transmissive or semi-transmissive liquid crystal element is used, the touch panel 8004 and A backlight may be provided between frames 8009. The backlight has a light source. Oh, it would also be good to have a configuration where the light source is placed on the backlight, or the light source is placed at the edge of the backlight. The arrangement may also include a configuration using a light diffuser plate. When using light-emitting elements or reflective panels, etc., a backlight is not provided. It can also be used as a composition.

[0372] Frame 8009 provides protection for the touch panel 8004, as well as for the printed circuit board 8010. It functions as an electromagnetic shield to block electromagnetic waves generated by operation. The frame 8009 may also function as a heat sink.

[0373] The printed circuit board 8010 contains power supply circuits and signals for outputting video and clock signals. It has a power processing circuit. The power supply that provides power to the power supply circuit is an external commercial power supply. Alternatively, a separate battery 8011 may be used as the power source. This can be omitted when using commercial power.

[0374] Additionally, the touch panel 8004 includes components such as polarizing plates, phase difference plates, and prism sheets. They may be provided as such.

[0375] Display panel, light-emitting panel, sensor panel, touch panel, touch panel according to one embodiment of the present invention Electronic equipment and lighting devices are created using modules, input devices, display devices, or input / output devices. It can be manufactured. Using an input device, display device, or input / output device according to one embodiment of the present invention, a curved surface can be manufactured. This enables the manufacture of highly reliable electronic devices and lighting devices. Furthermore, an input device, a table according to one embodiment of the present invention Using a display device or input / output device, a flexible and highly reliable electronic device or lighting device can be created. It can be manufactured. Furthermore, using an input device or input / output device according to one embodiment of the present invention, a touch sensor can be manufactured. This allows for the creation of electronic devices and lighting equipment with improved detection sensitivity.

[0376] Examples of electronic devices include television equipment (also known as televisions or television receivers). (To say.) Monitors for computers, digital cameras, digital video cameras, digital Photo frames, mobile phones (also called mobile phones or mobile phone devices), portable games Examples include machines, mobile information terminals, sound playback devices, and large game machines such as pachinko machines.

[0377] Furthermore, if an electronic device or lighting device according to one aspect of the present invention is flexible, it can be used inside houses and buildings. It can also be incorporated along curved surfaces of walls or exterior walls, or the interior or exterior of automobiles. be.

[0378] Furthermore, an electronic device according to one aspect of the present invention may have a secondary battery and contactless power transmission It is preferable that the secondary battery can be charged using this method.

[0379] Examples of secondary batteries include lithium polymer batteries (lithium-ion batteries) that use a gel-like electrolyte. Lithium-ion batteries such as polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, organic radio-ion batteries Examples include lead-acid batteries, air batteries, nickel-zinc batteries, and silver-zinc batteries.

[0380] An electronic device according to one aspect of the present invention may have an antenna. The antenna receives a signal. This allows the display unit to show images, information, etc. Also, electronic devices can use secondary batteries. If it has this feature, the antenna may be used for contactless power transmission.

[0381] Figures 29(A) through 29(H), and Figures 30(A) and 30(B) show electronic equipment. This is a diagram. These electronic devices consist of a housing 5000, a display unit 5001, a speaker 5003, and L LED lamp 5004, operation key 5005 (including power switch or operation switch), Connection terminal 5006, sensor 5007 (force, displacement, position, velocity, acceleration, angular velocity, rotational speed, Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation Includes functions for measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared radiation. It may have a Krophone 5008, etc.

[0382] Figure 29(A) shows a mobile computer, and in addition to the above, it has a switch 5009 It may have an infrared port 5010, etc.

[0383] Figure 29(B) shows a portable image playback device (for example, a DVD player) equipped with a recording medium. In addition to the above, it also has a second display unit 5002, a recording medium reading unit 5011, etc. It is possible.

[0384] Figure 29(C) shows a television setup, and in addition to the above-mentioned components, stand 5012, etc. It can be provided. In addition, the television equipment is operated by the operating switches provided in the housing 5000. This can be done via the switch or by a separate remote control unit 5013. Remote control unit 501 The control keys on unit 3 allow you to operate the channel and volume, and the display unit 5001 The video displayed on the screen can be controlled. Furthermore, the remote control unit 5013 can be controlled by the remote control unit. The configuration may also include a display unit that displays information output from the control unit 5013.

[0385] Figure 29(D) shows a portable gaming machine, and in addition to the above, it includes a recording medium reading unit 5011, It may have the following:

[0386] Figure 29(E) shows a digital camera with television receiving capabilities, and in addition to the above, an It may have a tenter 5014, a shutter button 5015, an image receiving unit 5016, etc.

[0387] Figure 29(F) shows a portable gaming machine, which, in addition to the above-mentioned features, includes a second display unit 5002 and a recorder. It may have a media reading unit 5011, etc.

[0388] Figure 29(G) shows a portable television receiver, and in addition to the above, it also transmits and receives signals. It may have a charger 5017, etc.

[0389] Figure 29(H) shows a wristwatch-type information terminal, and in addition to the above, it includes a band 5018 and a clasp. It may have gold 5019, etc. The display mounted on the housing 5000 which also serves as the bezel The display unit 5001 has a non-rectangular display area. The display unit 5001 displays the time using an eye icon. You can display icons such as 5020 and other icons like 5021.

[0390] Figure 30(A) shows a digital signage (electronic signboard). Yes, there is. Figure 30(B) shows a digital signage display mounted on a cylindrical column.

[0391] The electronic devices shown in Figures 29(A) to 29(H), and Figures 30(A) and 30(B) are It can have various functions. For example, various types of information (still images, videos, text images, etc.) Features that display (such as date, time, etc.) on the display unit, touch panel function, calendar, date or time display. Functions that control processing through various software (programs), wireless communication devices A function that connects to various computer networks using wireless communication capabilities, a wireless communication device. A function that uses technology to transmit or receive various types of data, and a program recorded on a recording medium. It may have functions such as reading out data or other information and displaying it on the display unit. Furthermore, multiple In electronic devices having a display unit, one display unit is primarily used to display image information. Another display unit is primarily used to display text information, or multiple display units are used to consider parallax. By displaying a carefully considered image, it can have functions such as displaying a three-dimensional image. Furthermore, electronic devices having an image receiving unit may have functions for taking still images and functions for taking videos. Functions to automatically or manually correct captured images, and to record captured images on a recording medium (external or cartridge). It has a built-in camera function to save images, a function to display captured images on the display unit, etc. This is possible. Note that this is shown in Figures 29(A) to 29(H), and Figures 30(A) and 30(B). The functions that electronic devices can have are not limited to these, and they can have a variety of functions. can.

[0392] Figures 31(A) to 31(E) show an example of an electronic device having a curved display unit 7000. The display unit 7000 has a curved display surface, and displays along the curved display surface. This can be done. The display unit 7000 may also be flexible.

[0393] The display unit 7000 is a functional panel, display panel, light-emitting panel, and sensor panel according to one embodiment of the present invention. It is manufactured using a panel, touch panel, display device, or input / output device, etc. One aspect of the present invention This makes it possible to provide highly reliable electronic devices equipped with curved displays.

[0394] Figure 31(A) shows an example of a mobile phone. The mobile phone 7100 consists of a housing 7101 and a display Unit 7000, operation button 7103, external connection port 7104, speaker 7105, microphone It has 7106, etc.

[0395] The mobile phone 7100 shown in Figure 31(A) is equipped with a touch sensor on the display unit 7000. All operations, such as making phone calls or typing text, are performed using your finger or a stylus. This can be done by touching the indicator part 7000.

[0396] Furthermore, the power can be turned ON or OFF by operating the operation button 7103, and the display unit 7000 You can switch the type of image displayed. For example, from the email composition screen, You can switch to the menu screen.

[0397] Figure 31(B) shows an example of a television system. The television system 7200 consists of a housing 7 The display unit 7000 is incorporated into 201. Here, the stand 7203 is used for the enclosure. This shows the configuration that supported 7201.

[0398] The operation of the television device 7200 shown in Figure 31(B) is performed using the operating system provided on the housing 7201. This can be done via a switch or a separate remote control unit 7211. Alternatively, the display unit 700 0 may have a touch sensor, and can be operated by touching the display unit 7000 with a finger, etc. Good. The remote control unit 7211 displays the information output from the remote control unit 7211. It may have a display unit. The remote control operator 7211 may have operation keys or touch panels. The channel and volume can be controlled via the dial, and the image displayed on the display unit 7000... The image can be manipulated.

[0399] The television system 7200 will consist of a receiver, modem, and other components. This allows for the reception of general television broadcasts. Furthermore, it is possible to receive signals via a modem using either a wired or wireless connection. By connecting to a line communication network, one-way (sender to receiver) or two-way communication is possible. It is also possible to communicate information in a direction (between a sender and a receiver, or between receivers, etc.). ru.

[0400] Figures 31(C1) to 31(E) show examples of personal digital assistants (PADs). Each PAD is a personal digital assistant. It has a housing 7301 and a display unit 7000. Furthermore, it has operation buttons, an external connection port, and a speaker. It may have a microphone, antenna, or battery, etc. The display unit 7000 has a It is equipped with a touch sensor. The mobile information terminal is operated by touching the display unit 7000 with a finger or stylus. It can be done by doing this.

[0401] Figure 31(C1) is a perspective view of the mobile information terminal 7300, and Figure 31(C2) is a perspective view of the mobile information Figure 31(D) is a top view of terminal 7300. Figure 31(E) is a perspective view of the personal digital assistant 7320.

[0402] The portable information terminal illustrated in this embodiment may be, for example, a telephone, a notebook, or an information viewing device. It has one or more selected functions. Specifically, it can be used as a smartphone. It is possible. The portable information terminal exemplified in this embodiment is, for example, a mobile phone, an electronic mail Types of activities include reading and creating documents, playing music, internet communication, and playing computer games. It can run various applications.

[0403] The personal digital assistant (PDAs) 7300, 7310, and 7320 are capable of displaying text and images. Image information can be displayed on multiple surfaces. For example, Figure 31(C1), Figure 31(D) As shown, three operation buttons 7302 are displayed on one side, and information 7303 is shown in rectangles. It can be displayed on other sides. In Figures 31(C1) and 31(C2), the mobile information terminal Figure 31(D) shows an example where information is displayed on the top, and in this example, the information is displayed on the side of the mobile device. An example of this is shown. Furthermore, information may be displayed on three or more sides of the mobile device, as shown in Figure 31(E). So, information 7304, information 7305, and information 7306 are displayed on different sides. Here is an example.

[0404] For example, notifications from social networking services (SNS) are an example of this type of information. , a display indicating incoming emails or phone calls, the subject or sender's name of emails, etc., This includes the time, battery level, and antenna signal strength. Or, the information displayed is Instead of information, you may display operation buttons, icons, etc., in that location.

[0405] For example, a user of the personal digital assistant 7300 would carry the personal digital assistant 7300 in the breast pocket of their clothing. With the device stored, you can check its display (in this case, information 7303).

[0406] Specifically, the phone number or name of the caller of the incoming call is recorded on the mobile information terminal 7300. It will be displayed in a position where it can be observed from above. The user will take the 7300 personal information terminal out of their pocket. Without having to step out, you can check the display and decide whether or not to answer the call.

[0407] Figures 31(F) to 31(H) show an example of a lighting device having a curved light-emitting section. ru.

[0408] The light-emitting part of each lighting device shown in Figures 31(F) to 31(H) is one embodiment of the present invention. Function panel, display panel, light-emitting panel, sensor panel, touch panel, display device, or input It is manufactured using an output device, etc. According to one aspect of the present invention, it has a curved light-emitting part and We can provide highly reliable lighting equipment.

[0409] The lighting device 7400 shown in Figure 31(F) includes a light-emitting section 7402 having a wave-shaped light-emitting surface. Therefore, it is a lighting fixture with a highly aesthetic design.

[0410] The light-emitting section 7412 of the lighting device 7410 shown in Figure 31(G) has two convexly curved parts The light-emitting parts are arranged symmetrically. Therefore, the lighting device 7410 is the central component. It can illuminate in all directions.

[0411] The lighting device 7420 shown in Figure 31(H) includes a concavely curved light-emitting section 7422. Therefore, in order to concentrate the light emitted from the light-emitting unit 7422 onto the front of the lighting device 7420, This is suitable for brightly illuminating a wide area. Furthermore, this shape creates shadows. It has the effect of making it difficult to do.

[0412] Furthermore, the light emission provided by each of the lighting devices 7400, 7410, and 7420 The part may be flexible. The light-emitting part may be made of a plastic material or a movable frame or other material. The light-emitting surface of the light-emitting part may be configured to be freely curved, depending on the application.

[0413] Lighting devices 7400, 7410, and 7420 each have an operating switch. It has a base portion 7401 equipped with a component 7403, and a light-emitting portion supported by the base portion 7401.

[0414] In this example, we have shown a lighting device in which the light-emitting part is supported by a base, but light emission The enclosure, which includes the component, can also be fixed to the ceiling or suspended from the ceiling. Because the light-emitting surface can be curved, it is possible to curve the light-emitting surface into a concave shape to illuminate a specific area. It can illuminate a room with a light source, or the light-emitting surface can be curved into a convex shape to brightly illuminate the entire room.

[0415] Figures 32(A1) to 32(I) show a portable information display unit 7001 having a flexible display section. An example of a terminal is shown.

[0416] The display unit 7001 is a functional panel, display panel, light-emitting panel, and sensor panel according to one embodiment of the present invention. It is manufactured using a panel, touch panel, display device, or input / output device, etc. For example, a half-curvature panel. A display device or input / output device, etc., that can be bent to a diameter of 0.01 mm or more and 150 mm or less. Applicable. Furthermore, the display unit 7001 may also be equipped with a touch sensor, and the display unit 7 By touching 001, the mobile information terminal can be operated. According to one aspect of the present invention, This enables the provision of highly reliable electronic equipment equipped with a flexible display unit.

[0417] Figure 32(A1) is a perspective view showing an example of a portable information terminal, and Figure 32(A2) is a mobile This is a side view showing an example of an information terminal. The portable information terminal 7500 consists of a housing 7501 and a display unit 7 It includes 001, a drawer member 7502, an operation button 7503, etc.

[0418] The portable information terminal 7500 has a flexible display unit wound in a roll inside the housing 7501. It has 7001.

[0419] Furthermore, the 7500 portable information terminal is capable of receiving video signals via its built-in control unit. The transmitted video can be displayed on the display unit 7001. In addition, the portable information terminal 7500 has It has a built-in battery. Furthermore, the housing 7501 is equipped with terminals for connecting a connector. Alternatively, the video signal and power may be supplied directly from an external source via a wired connection.

[0420] Additionally, the 7503 control button allows you to turn the power on and off, and switch the displayed image. Replacements can be made. Note that in Figures 32(A1) to 32(B), the mobile information terminal This example shows the operation button 7503 placed on the side of the 7500, but it is not limited to this, and mobile information It may be placed on the same side as the display surface of the terminal 7500 (the front side) or on the back side.

[0421] Figure 32(B) shows the display unit 7001 pulled out by the pull-out member 7502. This shows the information terminal 7500. In this state, video can be displayed on the display unit 7001. Furthermore, the state in Figure 32(A1) where a part of the display unit 7001 is rolled up, and the display unit 7 Figure 32(B) shows the state in which 001 is pulled out by the pull-out member 7502, and the portable information terminal. 7500 may be configured to display different information. For example, when in the state shown in Figure 32(A1) By making the rolled portion of the display unit 7001 invisible, the portable information terminal 750 It is possible to reduce the power consumption of 0.

[0422] Furthermore, when the display unit 7001 is pulled out, the display surface of the display unit 7001 becomes flat. To secure it in place, a reinforcing frame may be provided on the side of the display unit 7001.

[0423] In addition to this configuration, a speaker is installed in the enclosure, and the audio signal received along with the video signal is used. This could also be configured to output sound.

[0424] Figures 32(C) to 32(E) show an example of a foldable portable information terminal. Figure 3 Figure 2(C) shows the unfolded state, and Figure 32(D) shows the unfolded or folded state. Figure 32(E) shows the state in the process of changing from one to the other, with the mobile information terminal in a folded state. The last number is 7600. The 7600 portable information terminal is highly portable when folded, and when unfolded... In this configuration, the seamless, wide display area provides excellent readability.

[0425] The display unit 7001 is supported by three housings 7601 connected by hinges 7602. It is designed to bend between the two housings 7601 via the hinge 7602, allowing for portability. The 7600 information terminal can be reversibly transformed from an unfolded state to a folded state. .

[0426] Figures 32(F) and 32(G) show examples of foldable portable information terminals. Figure 32 In (F), the display unit 7001 is folded inwards, and in Figure 32(G), This shows the portable information terminal 7650 in a folded state with the display unit 7001 facing outwards. The mobile information terminal 7650 has a display unit 7001 and a non-display unit 7651. When not using 650, the display unit 7001 is folded inward, It can prevent dirt and scratches on the 7001.

[0427] Figure 32(H) shows an example of a flexible portable information terminal. Portable information terminal 7700 is It has a housing 7701 and a display unit 7001. Furthermore, it has an input means, a button 7703a , button 7703b, speaker 7704a which is an audio output means, speaker 7704b, external It may also have a connection port 7705, a microphone 7706, etc. Furthermore, the portable information terminal 77 00 can be equipped with a flexible battery 7709. The battery 7709 is For example, it may be placed on top of the display unit 7001.

[0428] The housing 7701, the display unit 7001, and the battery 7709 are flexible. Therefore, To curve the personal digital assistant 7700 into a desired shape, or to twist the personal digital assistant 7700 It is easy to add. For example, the portable information terminal 7700 has a display unit 7001 on the inside or It can be folded outwards for use. Alternatively, the mobile information terminal 7700 can be used with a low It can also be used in a rolled-up state. In this way, the housing 7701 and the display unit 700 Because it is possible to freely deform 1, the mobile information terminal 7700, if dropped, It has the advantage of being less prone to damage even when unintended external forces are applied.

[0429] Furthermore, because the 7700 portable information terminal is lightweight, the top of the 7701 casing can be held with a clip or similar. It can be used by holding it and hanging it, or by fixing the 7701 enclosure to a wall with magnets or the like. It can be used conveniently in a variety of situations.

[0430] Figure 32(I) shows an example of a wristwatch-type personal information terminal. The personal information terminal 7800 is a van. It has a dome 7801, a display unit 7001, input / output terminals 7802, operation buttons 7803, etc. The 7801 has the function of a housing. The portable information terminal 7800 has flexibility. The battery 7805 can be installed. The battery 7805 is used, for example, in the display unit It can also be placed in conjunction with 7001 or Band 7801.

[0431] The band 7801, the display unit 7001, and the battery 7805 are flexible. Furthermore, the 7800 portable information terminal can be easily bent into a desired shape.

[0432] The 7803 control button is used for setting the time, turning the power on and off, and turning wireless communication on and off. It has various functions such as operation, silent mode activation and deactivation, and power saving mode activation and deactivation. This can be done. For example, the operating system built into the mobile information terminal 7800 The stem allows you to freely configure the functions of the 7803 control button.

[0433] Furthermore, by touching the icon 7804 displayed on the display unit 7001 with your finger, etc., the application You can start the application.

[0434] Furthermore, the 7800 portable information terminal can perform short-range wireless communication compliant with communication standards. It is possible. For example, by communicating with a wireless headset, hands You can also make free calls.

[0435] Furthermore, the personal information terminal 7800 may also have an input / output terminal 7802. If a 7802 is present, data can be exchanged directly with other information terminals via a connector. It is possible to charge it via the input / output terminal 7802. The charging operation of the portable information terminal, as illustrated by the implementation example, uses contactless power transmission without input / output terminals. You may do so.

[0436] Figures 33(A) to 33(C) show an example of a foldable wristwatch-type personal information terminal. The personal digital information terminal 7900 consists of a display unit 7901, a housing 7902, a housing 7903, and band 7 It has 904, operation buttons 7905, etc.

[0437] As shown in Figure 33(A), the portable information terminal 7900 has a housing 7902 on top of housing 7903. From the stacked state, as shown in Figure 33(B), the housing 7902 is lifted. Furthermore, as shown in Figure 33(C), the display unit 7901 is reversibly deformed into an unfolded state. Therefore, the portable information terminal 7900 can, for example, normally fold the display unit 7901. It can be used in a folded state, and by unfolding the display unit 7901, the display The display area can be expanded for use.

[0438] Furthermore, since the display unit 7901 has the functionality of a touch panel, the display unit 7901 The 7900 personal digital assistant can be operated by touching it. Also, the 7905 operation button... By pressing, rotating, or sliding it up / down, forward, or backward, you can carry it. The information terminal 7900 can be operated.

[0439] As shown in Figure 33(A), when housing 7902 and housing 7903 are stacked on top of each other, It is preferable that the body 7902 and the housing 7903 have a locking mechanism to prevent them from separating unintentionally. At this time, the lock state can be released by performing an operation such as pressing operation button 7905. It is preferable to have a configuration that allows for removal. Furthermore, the lock state can be maintained by utilizing the restoring force of a spring or the like. When released, it automatically transforms from the state shown in Figure 33(A) to the state shown in Figure 33(C). It may have a mechanism to lock the housing 7902 and the housing. Alternatively, a magnet may be used instead of the locking mechanism. The relative position of 7903 may be fixed. By using magnets, the housing 7902 and The casing 7903 and the other parts can be detached.

[0440] In Figures 33(A) to 33(C), the direction is approximately perpendicular to the bending direction of band 7904. The configuration shown allows the display unit 7901 to be unfolded, as shown in Figures 33(D) and 33(E). The configuration allows the display unit 7901 to be deployed in a direction approximately parallel to the bending direction of the band 7904. You may also do this. At this time, wrap the display unit 7901 around the band 7904. It may be used in a curved form.

[0441] The electronic device described in this embodiment has a display unit for displaying some kind of information. The display unit is characterized by having a display panel, touch panel, or touch panel according to one embodiment of the present invention. Display devices such as touch panel modules can be applied.

[0442] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of symbols]

[0443] 10 Display device 11 Opening 11A opening 11B opening 12 Openings 15 areas 15A area 21 circuit boards 23 Pixel electrodes 24 EL layer 25 Conductive layer 31 circuit boards 32 Display section 32A area 32B area 34 circuits 35 Wiring 39 Adhesive layer 40 light-emitting elements 42 FPC 43 IC 51a Colored layer 51b Colored layer 52 Light blocking layer 60 Click the LCD button 70 transistors 71 Conductive layer 72 Semiconductor layer 73 Insulating layer 74a Conductive layer 74b Conductive layer 81 Insulating layer 82 Insulating layer 82A Protrusion 83 Insulating layer 100 Touch Panels 111 Conductive layer 112 EL layer 113 Conductive layer 130 Polarizing plate 131 Colored layer 131a Colored layer 131b Colored layer 132 Light blocking layer 133 Light blocking layer 134 Colored layer 135 Structure 136 Insulating layer 141 Adhesive layer 142 Adhesive layer 146 Conductive film 147 Conductive film 148 Conductive film 149 nanowires 150 Input Devices 151 Electrode 152 Electrode 153 Bridge electrode 155 Wiring 156 Wiring 157 FPC 158 IC 160 circuit boards 161 Insulating layer 162 Insulating layer 163 Insulating layer 164 Insulating layer 165 Adhesive layer 168 IC 169 Connection part 170 circuit boards 171 circuit boards 172 Adhesive layer 173 Insulating layer 181 circuit boards 182 Adhesive layer 183 Insulating layer 191 Conductive layer 192 Conductive layer 193 LCD 194 Conductive layer 195 Insulating layer 200 Display device 201 Transistors 202 transistors 203 Capacitive element 204 Terminal section 205 transistors 206 transistors 207 Terminal section 210 pixels 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 219 Opening 220 Insulating layer 221 Conductive layer 222 Conductive layer 223 Conductive layer 224 Conductive layer 231 Semiconductor layer 242 Connecting Layer 243 Connectors 244 Structure 251 Opening 252 Connection part 601 Pulse voltage output circuit 602 Current detection circuit 603 capacity 621 Electrode 622 Electrode 723 Electrode 726 Insulating layer 727 Insulating layer 728 Insulating layer 729 Insulating layer 741 Insulating layer 742 Semiconductor layer 744a electrode 744b electrode 746 Electrode 755 Impurities 771 circuit board 772 Insulating layer 810 transistors 811 Transistors 820 transistors 821 Transistors 825 Transistors 826 transistors 830 transistors 831 Transistors 840 transistors 841 Transistors 842 transistors 843 Transistors 844 transistors 845 transistors 846 transistors 847 transistors 5000 cabinets 5001 Display section 5002 Display section 5003 Speaker 5004 LED Lamp 5005 Operation Keys 5006 Connection terminal 5007 Sensor 5008 Microphone 5009 Switch 5010 Infrared Port 5011 Recording medium reading unit 5012 Stand 5013 Remote Control Unit 5014 Antenna 5015 Shutter button 5016 Image receiving unit 5017 charger 5018 Band 5019 Clasp 5020 Icons 5021 Icons 7000 Display 7001 Display section 7100 Mobile Phone 7101 enclosure 7103 Operation Buttons 7104 External connection port 7105 Speaker 7106 Microphone 7200 Television equipment 7201 enclosure 7203 Stand 7211 Remote Control Unit 7300 Mobile Information Terminal 7301 enclosure 7302 Operation Buttons 7303 Information 7304 Information 7305 Information 7306 Information 7310 Mobile Information Terminal 7320 Mobile Information Terminal 7400 Lighting device 7401 Daibu 7402 Light-emitting part 7403 Operation switch 7410 Lighting device 7412 Light-emitting part 7420 Lighting device 7422 Light-emitting part 7500 Mobile Information Terminals 7501 enclosure 7502 Drawer component 7503 Operation Buttons 7600 Mobile Information Terminal 7601 enclosure 7602 Hinge 7650 Mobile Information Terminal 7651 Hidden part 7700 Mobile Information Terminal 7701 enclosure 7703a button 7703b button 7704a speaker 7704b speaker 7705 External connection port 7706 Mike 7709 Battery 7800 Mobile Information Terminal 7801 Band 7802 Input / output terminal 7803 Operation Buttons 7804 Icon 7805 Battery 7900 Mobile Information Terminal 7901 Display section 7902 enclosure 7903 cabinet 7904 Band 7905 Operation Buttons 8000 Display Module 8001 Top cover 8002 Lower cover 8003 FPC 8004 Touch Panel 8009 Frame 8010 Printed Circuit Board 8011 Battery

Claims

1. The first insulating layer, The pixel electrode on the first insulating layer, A second insulating layer covering the end of the pixel electrode, The EL layer on the first insulating layer, on the pixel electrode, and on the second insulating layer, The EL layer has a conductive layer, The second insulating layer has an opening, The EL layer has a region in the opening that is placed on the first insulating layer, A light-emitting device wherein the conductive layer has regions located on the first insulating layer and the EL layer at the opening.

2. The first insulating layer, On the first insulating layer, a first pixel electrode and a second pixel electrode, A second insulating layer covering the ends of the first pixel electrode and the ends of the second pixel electrode, An EL layer on the first insulating layer, on the first pixel electrode, on the second pixel electrode, and on the second insulating layer, The EL layer has a conductive layer, The EL layer has a region in the opening that is placed on the first insulating layer, A light-emitting device wherein the conductive layer has regions located on the first insulating layer and the EL layer at the opening.

3. In claim 1 or claim 2, The light-emitting device wherein the EL layer has a region in the opening that is in contact with the first insulating layer.

Images