Processing method of workpiece
The method uses a heated resin plate to facilitate easy and quick fixation, holding, and removal of IC chips and similar workpieces with protrusions, addressing the inefficiencies of existing fixation methods.
JP2026090920APending Publication Date: 2026-06-03DISCO CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2024-11-22
- Publication Date
- 2026-06-03
AI Technical Summary
Technical Problem
Existing methods for holding IC chips and similar workpieces with protrusions on their lower surfaces require dedicated and costly jigs or chuck tables, and are time-consuming due to the need for precise fixation.
Method used
A method involving a resin plate that is heated above its softening temperature but below its melting temperature is used to fix the workpiece, allowing it to be held and processed via a chuck table, followed by separation and removal through curving the resin plate.
Benefits of technology
Enables easy and quick fixation, holding, and removal of workpieces with protrusions, reducing the need for dedicated fixtures and simplifying the processing workflow.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026090920000001_ABST
Abstract
A workpiece with protrusions can be easily held by the chuck table. [Solution] In the fixing process, the IC chip 100 having heated feet 102 can be fixed to the resin plate 110 held by the chuck table 10 of the processing apparatus 1 by pressing the resin plate 110 into the resin plate 110. Therefore, the IC chip 100 can be easily held by the chuck table 10 via the resin plate 110. Furthermore, after separating the resin plate 110 from the chuck table 10, the IC chip 100 can be easily removed from the resin plate 110 by bending the resin plate 110. Therefore, the holding and removal of the IC chip 100 can be performed easily and in a short time.
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