Etching endpoint determination method

The dual-channel image processing approach using HV and AI modules addresses the challenge of precise etching endpoint detection in wet etching, improving efficiency and yield by accurately determining the endpoint.

JP2026091240APending Publication Date: 2026-06-03CHIPBOND TECH
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
CHIPBOND TECH
Filing Date
2025-10-09
Publication Date
2026-06-03

AI Technical Summary

Technical Problem

Accurately determining the etching end point in wet etching processes is challenging due to numerous variables affecting the chemical reaction, leading to potential over- or under-etching issues, which affect the thin film quality and efficiency.

Method used

Employing an HV determination module and an AI determination module in a dual-channel mode to process semiconductor images, utilizing image processing techniques like gradient boosting, adaptive histogram equalization, and Gaussian blurring to enhance feature detection, and combining these with an AI module for precise endpoint determination.

Benefits of technology

Improves the accuracy of etching endpoint determination, enhancing efficiency and yield by reducing erroneous determinations and optimizing the etching process.

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Abstract

This provides a method for determining the etching endpoint. [Solution] The etching endpoint determination method 10 according to the present invention includes: etching a semiconductor device by an etching system 11; capturing a semiconductor image by an optical system 12; receiving a semiconductor image by a computing device, the HV determination module of the computing device extracts an HV channel value, the HV determination module outputs an HV channel etching endpoint determination signal, the AI ​​determination module of the computing device performs image processing on the semiconductor image to obtain a feature-enhanced image, and the AI ​​determination module outputs an AI etching endpoint determination signal; and a determination module of the computing device receives the HV channel etching endpoint determination signal and the AI ​​etching endpoint determination signal, and the determination module determines whether the etching endpoint has been reached based on the HV channel etching endpoint determination signal and the AI ​​etching endpoint determination signal.
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