Crimping device and crimping method for components

Abstract

To provide a parts crimping device that can improve the accuracy of crimping. [Solution] The component crimping device 10 comprises a second head 34, a second control unit 51, and a determination unit 52. The determination unit 52 determines the heating rate of the second head 34 based on the spacing between a plurality of component electrodes 302. The second control unit 51 performs the following steps: a first step of lowering the second head 34 to contact the component 300; a second step of increasing the load applied from the second head 34 to the component 300 until the magnitude of the load falls within a predetermined numerical range; a third step of maintaining the state in which the magnitude of the load is kept within the above numerical range for a first period; a fourth step of heating the second head 34 at the above heating rate so that the temperature of the second head 34 falls within a second temperature range; and a fifth step of maintaining the state in which the magnitude of the load is kept within the above numerical range and the temperature is kept within the second temperature range for a second period.

Description

Technical Field

[0001] The present disclosure relates to a component crimping device and a component crimping method for crimping a component to a substrate.

Background Art

[0002] In Patent Document 1, a mounting device for mounting components on a substrate is disclosed as a component crimping device. In the mounting device of Patent Document 1, a component is temporarily crimped on the upper surface of a substrate via an anisotropic conductive member, and the temporarily crimped component is pressed toward the substrate side with a pressing tool to perform main crimping of the component on the upper surface of the substrate, thereby mounting the component on the substrate. Further, in the mounting device of Patent Document 1, after the component is main-crimped to the substrate, the amount of deviation between the first lead of the substrate and the second lead of the component is measured, and based on the amount of deviation, the lowering speed of the pressing tool during subsequent main crimping is set.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the mounting device of Patent Document 1, for example, due to manufacturing variations of each component to be crimped, it is conceivable that the crimping accuracy deteriorates.

[0005] Therefore, the present disclosure provides a component crimping device and a component crimping method capable of improving crimping accuracy.

Means for Solving the Problems

[0006] A component crimping apparatus according to one aspect of the present disclosure comprises: a backup unit that supports a substrate from below; a thermocompression head that thermocompresses a component, which is placed on the substrate supported by the backup unit with an anisotropic conductive member in between, to the substrate; a control unit that controls the thermocompression head; and a determination unit that determines the conditions for thermocompression of the component to the substrate, wherein the determination unit determines the heating rate of the thermocompression head as the condition for thermocompression based on the spacing between a plurality of electrodes of the component, which is measured before the component is placed on the substrate; and the control unit, in controlling the thermocompression head, performs a first step of lowering the thermocompression head to contact the component while the temperature of the thermocompression head is kept within a first temperature range; and after the first step, when the temperature is within the first temperature range The process involves: a second step of increasing the load applied to the part from the thermocompression head until the magnitude of the load falls within a predetermined numerical range while maintaining the load within the numerical range; a third step of maintaining the state in which the magnitude of the load is maintained within the numerical range and the temperature is maintained within the first temperature range for a first period after the second step; a fourth step of heating the thermocompression head at the heating rate determined by the determination unit so that the temperature, which is in the first temperature range, falls within a second temperature range higher than the first temperature range, while maintaining the magnitude of the load within the numerical range after the third step; and a fifth step of maintaining the state in which the magnitude of the load is maintained within the numerical range and the temperature is maintained within the second temperature range for a second period after the fourth step.

[0007] Furthermore, the comprehensive or specific embodiment may be implemented as a system, method, integrated circuit, computer program, or recording medium such as a computer-readable CD-ROM, or as any combination of a system, method, integrated circuit, computer program, and recording medium. The recording medium may also be a non-temporary recording medium. [Effects of the Invention]

[0008] According to this disclosure, the accuracy of crimping can be improved.

[0009] Further advantages and effects of one aspect of this disclosure will be made apparent from the specification and drawings. Such advantages and / or effects are provided by several embodiments and configurations described in the specification and drawings, but not all configurations are necessarily required. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing the overall configuration of the component mounting system. [Figure 2] (a) is a diagram showing the circuit board, and (b) is a diagram showing the components. [Figure 3] Figure 1 is a schematic diagram showing the temporary crimping section of the component mounting system, where (a) shows the state in which the substrate is not placed on the first backup section, and (b) shows the state in which the substrate is placed on the first backup section. [Figure 4] Figure 1 is a schematic diagram showing the main crimping section of the component mounting system, where (a) shows the state in which the substrate is not placed on the second backup section, and (b) shows the state in which the substrate is placed on the second backup section. [Figure 5] A block diagram showing the configurations of the temporary crimping section and the permanent crimping section included in a component crimping device. [Figure 6] This flowchart shows an example of the processing operation of the decision-making unit. [Figure 7] This figure shows an example of the process by which components are heat-pressed onto the substrate by the second head. [Figure 8] This figure shows examples of changes in the height, load, and temperature of the second head when a component is thermocompressed onto the substrate by the second head. [Figure 9] This flowchart shows an example of the processing operation of the second control unit. [Modes for carrying out the invention]

[0011] A component crimping apparatus according to a first aspect of the present disclosure comprises: a backup unit that supports a substrate from below; a thermocompression head that thermocompresses a component, which is placed on the substrate supported by the backup unit with an anisotropic conductive member in between, to the substrate; a control unit that controls the thermocompression head; and a determination unit that determines the conditions for thermocompression of the component to the substrate, wherein the determination unit determines the heating rate of the thermocompression head as the condition for thermocompression based on the spacing between a plurality of electrodes of the component, which is measured before the component is placed on the substrate; and the control unit, in controlling the thermocompression head, performs a first step of lowering the thermocompression head to contact the component while the temperature of the thermocompression head is kept within a first temperature range; and after the first step, when the temperature is within the first temperature range The process involves: a second step of increasing the load applied to the part from the thermocompression head until the magnitude of the load falls within a predetermined numerical range while maintaining the load within the numerical range; a third step of maintaining the state in which the magnitude of the load is maintained within the numerical range and the temperature is maintained within the first temperature range for a first period after the second step; a fourth step of heating the thermocompression head at the heating rate determined by the determination unit so that the temperature, which is in the first temperature range, falls within a second temperature range higher than the first temperature range, while maintaining the magnitude of the load within the numerical range after the third step; and a fifth step of maintaining the state in which the magnitude of the load is maintained within the numerical range and the temperature is maintained within the second temperature range for a second period after the fourth step.

[0012] As a result, the timing at which the thermocompression head starts heating up in the fourth step is delayed from the timing at which the load increase starts in the second step. The third step is performed between the second and fourth steps. In other words, the magnitude of the load applied to the component by the thermocompression head is kept within the aforementioned numerical range, and the temperature of the thermocompression head is kept within the first temperature range, and this state is maintained for the first period only. In other words, the pressure on the component by the low-temperature thermocompression head continues for the first period only. Therefore, during this first period, because the thermocompression head pressing the component is at a low temperature, thermal deformation of the component and the substrate can be suppressed.

[0013] Here, for example, the second temperature range is predetermined to be the same for multiple identical parts. Also, the same first temperature range is usually used for multiple identical parts. Therefore, it can be said that the first and second temperature ranges are fixed for multiple identical parts. In such cases, the heating time required for the thermocompression head temperature to rise from the first temperature range to the second temperature range is adjusted by adjusting the heating rate. The longer the heating time, i.e., the slower the heating rate, the more easily the part to which the load from the thermocompression head is applied is stretched along the substrate due to thermal deformation. Conversely, the shorter the heating time, i.e., the faster the heating rate, the less easily the part is stretched along the substrate. Therefore, in the first embodiment, the heating rate when the thermocompression head is heated in the fourth step is determined based on the spacing between the multiple electrodes of the part, which is measured before the part is placed on the substrate. This allows for control of the part's elongation and the spacing between the multiple electrodes of the part. As a result, even if there are variations in the spacing between multiple electrodes during the manufacturing process of multiple identical components, determining an appropriate heating rate for each component can suppress variations in spacing when those components are thermocompressed onto the substrate. In other words, without changing the first temperature range, second temperature range, numerical load range, second period, etc., variations in spacing when components are thermocompressed onto the substrate can be suppressed by adjusting the heating rate. This allows for proper contact between the multiple electrodes on the component and the multiple electrodes on the substrate, improving the accuracy of the bonding between the component and the substrate.

[0014] Furthermore, in the component crimping device according to the second embodiment, the determination unit may determine the heating rate at a faster speed than when the distance corresponding to the interval is longer than the reference distance, compared to when the distance is less than or equal to the reference distance. The second embodiment may be subordinate to the first embodiment. The distance corresponding to the interval may be the distance between a pair of alignment marks that sandwich the multiple electrodes of the component, or it may be the distance between the multiple electrodes themselves.

[0015] Thus, when the intervals between the plurality of electrodes of the component are long, the heating rate can be increased to suppress the elongation of those intervals.

[0016] Also, in the component crimping device according to the third aspect, the determination unit may determine the heating rate to be higher than the reference rate when the distance corresponding to the interval is longer than the reference distance. Note that the third aspect may be dependent on the first aspect.

[0017] Thus, when the intervals between the plurality of electrodes of the component are long, the heating rate can be increased to suppress the elongation of those intervals.

[0018] Also, in the component crimping device according to the fourth aspect, the determination unit may determine the heating rate to be the reference rate when the distance is equal to the reference distance. Note that the fourth aspect may be dependent on the third aspect.

[0019] Thus, when the intervals between the plurality of electrodes of the component are neither long nor short, the heating rate can be set to the reference rate to limit the elongation of those intervals within an allowable range.

[0020] Also, in the component crimping device according to the fifth aspect, the determination unit may determine the heating rate to be lower than the reference rate when the distance is shorter than the reference distance. Note that the fifth aspect may be dependent on the third aspect or the fourth aspect.

[0021] Thus, when the intervals between the plurality of electrodes of the component are short, the heating rate can be decreased to stretch those intervals.

[0022] Furthermore, in the component crimping device according to the sixth embodiment, the determination unit further sets a distance corresponding to the spacing between a plurality of electrodes on the substrate as the reference distance, and the plurality of electrodes on the substrate may be a plurality of electrodes that are connected to the plurality of electrodes on the component by heat compression bonding of the component. Note that the sixth embodiment may be subordinate to any one of the second to fifth embodiments. Note that the distance corresponding to the spacing between a plurality of electrodes on the substrate may be the spacing between a pair of alignment marks that sandwich the plurality of electrodes, or it may be the spacing between the plurality of electrodes itself.

[0023] This allows the heating rate to be determined based on a comparison between the spacing of multiple electrodes on the component and the spacing of multiple electrodes on the substrate. As a result, it becomes easier to match the spacing of the multiple electrodes on the component when it is pressed onto the substrate to the spacing of multiple electrodes on the substrate.

[0024] A component crimping method according to a first aspect of the present disclosure is a component crimping method performed by a component crimping device, the component crimping device comprising: a backup unit that supports a substrate from below; and a thermocompression head that thermocompresses a component, which is placed on the substrate supported by the backup unit with an anisotropic conductive member in between, to the substrate, wherein the component crimping method includes: determining the heating rate of the thermocompression head based on the spacing between a plurality of electrodes of the component, measured before the component is placed on the substrate; a first step of lowering the thermocompression head to contact the component while the temperature of the thermocompression head is maintained within a first temperature range; and after the first step, while the temperature is maintained within the first temperature range, the thermocompression head The process involves: a second step of increasing the load applied to the component until the magnitude of the load falls within a predetermined numerical range; a third step of maintaining, after the second step, a state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the first temperature range for a first period of time; a fourth step of heating the thermocompression head at a determined heating rate after the third step, such that the temperature, which is within the first temperature range, falls within a second temperature range that is higher than the first temperature range, while the magnitude of the load is kept within the numerical range; and a fifth step of maintaining, after the fourth step, a state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the second temperature range for a second period of time.

[0025] This makes it possible to achieve the same effects and advantages as the component crimping device according to the first embodiment.

[0026] Next, embodiments of the component crimping apparatus and component crimping method relating to this disclosure will be described with reference to the drawings. Note that the embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples and are not intended to limit this disclosure. Furthermore, among the components in the following embodiments, those not described in the independent claim representing the highest-level concept will be described as optional components.

[0027] Furthermore, the drawings are schematic diagrams that have been appropriately emphasized, omitted, and proportioned to illustrate this disclosure, and may differ from the actual shapes, positions, and proportions.

[0028] (Embodiment) Figure 1 is a schematic diagram showing the overall configuration of the component mounting system 100. Figure 2(a) shows the substrate 200, and Figure 2(b) shows the components 300. Figure 3 is a schematic diagram showing the temporary crimping section 24 of the component mounting system 100 in Figure 1, where (a) shows the state in which the substrate 200 is not placed on the first backup section 32, and (b) shows the state in which the substrate 200 is placed on the first backup section 32. Figure 4 is a schematic diagram showing the main crimping section 28 of the component mounting system 100 in Figure 1, where (a) shows the state in which the substrate 200 is not placed on the second backup section 36, and (b) shows the state in which the substrate 200 is placed on the second backup section 36. The configuration of the component mounting system 100 will be described with reference to Figures 1 to 4.

[0029] The component mounting system 100 is a system for mounting components 300 onto a circuit board 200, and as shown in Figure 1, it comprises a component crimping device 10, a loader 12, a washing machine 14, an unloader 16, and a line controller 18.

[0030] As shown in Figure 2(a) and Figure 3, the substrate 200 on which the component 300 is mounted is plate-shaped. In this embodiment, the substrate 200 is exemplified as a substrate that constitutes a smartphone or the like. For example, glass or a resin such as polyimide can be used as the material that constitutes the substrate 200. The shape of the substrate 200 is not particularly limited and does not have to be plate-shaped. On one main surface, the substrate 200 has a plurality of substrate electrodes 202 provided at the edge and a pair of first alignment marks 204. The plurality of substrate electrodes 202 are conductive members such as metal provided on the surface of the substrate 200. The plurality of substrate electrodes 202 are arranged in a line in a first direction (X-axis direction in the figure). Furthermore, each of the plurality of substrate electrodes 202 is a thin, narrow plate-shaped member that extends in a second direction (Y-axis direction in the figure) perpendicular to the first direction and is exposed. The pair of first alignment marks 204 are provided on both sides of the plurality of substrate electrodes 202 in the first direction (X-axis direction in the figure), and are positioned to sandwich the plurality of substrate electrodes 202. The pair of first alignment marks 204 are cross-shaped marks and are used to obtain information regarding the arrangement of the plurality of substrate electrodes 202, and to obtain the positional relationship between the substrate 200 and the component 300, etc. The shape of the pair of first alignment marks 204 is not particularly limited and does not have to be cross-shaped.

[0031] As shown in Figure 2(b) and Figure 3, the component 300 is plate-shaped. The type of component 300 is not particularly limited, but it can be exemplified as a circuit film component in which electronic components are mounted on a flexible resin film such as TCP (Tape Carrier Package). For example, a resin such as polyimide can be used as the material that makes up the component 300. The shape of the component 300 is not particularly limited and does not have to be plate-shaped. The component 300 has a plurality of component electrodes 302 provided on one end face, and a pair of second alignment marks 304. The plurality of component electrodes 302 are conductive members such as metal provided on the surface of the component 300. The plurality of component electrodes 302 are arranged in a line in the first direction (X-axis direction in the figure). In addition, each of the plurality of component electrodes 302 is a thin, narrow plate-shaped member that extends in a second direction (Y-axis direction in the figure) perpendicular to the first direction and is exposed. The pair of second alignment marks 304 are provided on both sides of the multiple component electrodes 302 in the first direction (X-axis direction in the figure), and are positioned to sandwich the multiple component electrodes 302. The pair of second alignment marks 304 are cross-shaped marks and are used to obtain information regarding the arrangement of the multiple component electrodes 302, and to obtain the positional relationship between the substrate 200 and the component 300, etc. The shape of the pair of second alignment marks 304 is not particularly limited and does not have to be cross-shaped.

[0032] As shown in Figure 1, the loader 12 is a device that introduces the substrate 200 manufactured in another process into the component mounting system 100. On the other hand, the unloader 16 is a device that takes out the substrate 200 with the components 300 mounted on it in the component mounting system 100 and hands it over to another process.

[0033] The cleaning machine 14 is a device that receives the substrate 200 supplied by the loader 12 and cleans the portion of the substrate 200 to which the ACF (Anisotropic Conductive Film) 400 will be attached.

[0034] The component crimping device 10 is a device that mounts components 300 onto a substrate 200 by crimping together a plurality of substrate electrodes 202 on the substrate 200 and a plurality of component electrodes 302 on the component 300, and comprises an ACF attachment unit 20, a supply unit 22, a temporary crimping unit 24, and a main crimping unit 28.

[0035] The ACF attachment section 20 attaches the ACF400 to a predetermined position on the surface of the substrate 200. The predetermined position is the position where multiple substrate electrodes 202 are arranged. Here, ACF400 is a material that, when heat and pressure are applied together, can ensure electrical conductivity only in the direction of the pressure applied to the pressure applied portion (see Figures 3 and 4). In this embodiment, ACF400 corresponds to an anisotropic conductive material.

[0036] The supply unit 22 supplies components 300 to be mounted on the substrate 200. For example, the supply unit 22 sequentially punches out components 300 from a tape member on which multiple components 300 are provided at predetermined intervals, and supplies the punched-out components 300 to the temporary crimping unit 24.

[0037] The temporary crimping section 24 and the main crimping section 28 crimp together multiple substrate electrodes 202 and multiple component electrodes 302.

[0038] As shown in Figures 1 and 3, the temporary crimping unit 24 places the component 300 on the ACF 400 which has been attached to the substrate 200 by the ACF attachment unit 20, and temporarily crimps the component 300 and the substrate 200 via the ACF 400. The temporary crimping unit 24 includes a first head 30, a first backup unit 32, and an imaging unit 26.

[0039] The first head 30 uses a suction nozzle or the like to pick up and hold the component 300 supplied from the supply unit 22, and transports and positions the component 300 to a predetermined location. The first head 30 also moves in a third direction (Z-axis direction in the figure) that is perpendicular to the first direction (X-axis direction in the figure) and the second direction (Y-axis direction in the figure), thereby pressing the held component 300 toward the substrate 200 placed on the first backup unit 32, and applying a load to the component 300 and the substrate 200.

[0040] The first backup unit 32 is a member that supports the edge of the substrate 200 from below, and when the first head 30 presses the component 300 toward the substrate 200, it is a member that applies a clamping force from below to temporarily press the component 300 toward the substrate 200. The first backup unit 32 has a transparent portion, which allows the imaging unit 26 to image the substrate 200 and the component 300 from below the first backup unit 32.

[0041] Furthermore, the temporary crimping section 24 has a table (not shown) that supports the substrate 200 from below, and the substrate 200 is placed on the first backup section 32 and retracted from the first backup section 32 by this table.

[0042] As shown in Figures 1 and 3, the imaging unit 26 is provided in the temporary crimping unit 24 and images the substrate 200 and component 300 that are crimped together. Specifically, the imaging unit 26 is positioned below the first backup unit 32 in the temporary crimping unit 24 and images a pair of first alignment marks 204 on the substrate 200 and a pair of second alignment marks 304 on the component 300 from below (see the dotted arrows in Figures 3(a) and 3(b)). For example, as shown in Figure 3(a), the imaging unit 26 images a pair of second alignment marks 304 on the component 300 via the first backup unit 32 when the substrate 200 is not supported from below by the first backup unit 32. Then, as shown in Figure 3(b), the imaging unit 26 images a pair of first alignment marks 204 on the substrate 200 via the first backup unit 32 when the substrate 200 is supported from below by the first backup unit 32 and no components 300 are placed on the substrate 200. In this embodiment, the substrate 200 has a transparent portion, and the imaging unit 26 can image a pair of first alignment marks 204 on the substrate 200 from below. For example, a digital camera including a line sensor can be used as the imaging unit 26.

[0043] As shown in Figures 1 and 4, the main crimping unit 28 further presses the component 300 that has been temporarily crimped to the substrate 200, thereby ensuring electrical contact between the substrate electrode 202 and the component electrode 302, and permanently crimping the component 300 to the substrate 200. For example, the main crimping unit 28 presses the component 300 toward the substrate 200 with a greater force and at a higher temperature than the temporary crimping unit 24. For this reason, this permanent crimping is also called thermocompression. The main crimping unit 28 has a second head 34 and a second backup unit 36.

[0044] The second head 34 moves in a third direction (Z-axis direction in the figure) to press the component 300, which is temporarily crimped to the substrate 200 placed on the second backup unit 36, toward the substrate 200, thereby applying a load to the component 300 and the substrate 200. For example, when permanently crimping the substrate 200 and the component 300, the temperature of the second head 34 is set higher than the temperature of the first head 30, and the second head 34 presses the component 300 with a greater force than the first head 30. The temperature of the second head 34 is controlled by a heater.

[0045] The second backup unit 36 ​​is a member that supports the edge of the substrate 200 from below, and when the second head 34 presses the component 300 toward the substrate 200, it is a member that applies a clamping force from below to firmly press the component 300 toward the substrate 200.

[0046] Furthermore, the crimping unit 28 has a table (not shown) that supports the substrate 200 from below, and the substrate 200 is placed on the second backup unit 36 ​​and retracted from the second backup unit 36 ​​by this table.

[0047] The line controller 18 is a computer that manages and controls the overall operating status of the component mounting system 100, as well as the communication of various data. The line controller 18 is connected to each device.

[0048] Figure 5 is a block diagram showing the configurations of the temporary crimping section 24 and the main crimping section 28 included in the component crimping device 10.

[0049] The temporary crimping unit 24 includes the first head 30, imaging unit 26, and first backup unit 32 as described above, as well as a first control unit 41. The first control unit 41 controls the first head 30 and the imaging unit 26.

[0050] For example, the first control unit 41 aligns the substrate 200 and the component 300 based on two captured images obtained by the imaging unit 26. One of the two captured images, the first captured image, displays a pair of first alignment marks 204 on the substrate 200. The other of the two captured images, the second captured image, displays a pair of second alignment marks 304 on the component 300. The first control unit 41 moves at least one of the first head 30 and the table supporting the substrate 200 along the XY plane so that the pair of first alignment marks 204 and the pair of second alignment marks 304 overlap in the XY plane. This aligns the substrate 200 and the component 300.

[0051] Furthermore, the first control unit 41 transmits the two captured images described above to the main crimping unit 28. At this time, the first control unit 41 may transmit the two captured images to the main crimping unit 28 via the line controller 18.

[0052] The main crimping unit 28 includes the second head 34 and the second backup unit 36 ​​described above, as well as a second control unit 51 and a determination unit 52. The second head 34 is also called a thermocompression head. In other words, in this embodiment, the second backup unit 36 ​​is a backup unit that supports the substrate 200 from below. The second head 34 is a thermocompression head that thermocompresses the component 300, which is placed on the substrate 200 with the ACF 400 in between, onto the substrate 200, which is supported by the second backup unit 36. The second control unit 51 is a control unit that controls the second head 34, and the determination unit 52 determines the conditions for thermocompression bonding of the component 300 to the substrate 200.

[0053] Specifically, the determination unit 52 acquires the two images described above from the temporary crimping unit 24 via the second control unit 51. Then, the determination unit 52 determines the conditions for thermocompression bonding based on these two images. More specifically, the determination unit 52 calculates the distance A between a pair of first alignment marks 204 on the substrate 200 (see Figure 2(a)) by analyzing the first image. The determination unit 52 also calculates the distance B between a pair of second alignment marks 304 on the component 300 (see Figure 2(b)) by analyzing the second image. In other words, distances A and B are measured. Then, the determination unit 52 calculates the difference Δ by subtracting distance A from distance B. That is, the difference Δ is given by difference Δ = distance B - distance A. Based on this difference Δ, the determination unit 52 determines the heating rate of the second head 34 as a condition for thermocompression bonding.

[0054] Here, distance A is the distance corresponding to the spacing between multiple substrate electrodes 202 on the substrate 200, and the longer distance A is, the longer the spacing between the multiple substrate electrodes 202. For example, there is a proportional relationship between distance A and the spacing between the multiple substrate electrodes 202. Similarly, distance B is the distance corresponding to the spacing between multiple component electrodes 302 on the component 300, and the longer distance B is, the longer the spacing between the multiple component electrodes 302. For example, there is a proportional relationship between distance B and the spacing between the multiple component electrodes 302.

[0055] In other words, in this embodiment, the determination unit 52 determines the heating rate of the second head 34 as a condition for thermocompression bonding, based on the spacing between the multiple component electrodes 302 of the component 300, which is measured before the component 300 is placed on the substrate 200. Note that the heating rate means, for example, the temperature that rises per unit time.

[0056] The second control unit 51 heats the second head 34 at the heating rate determined by the determination unit 52. In other words, the second control unit 51 heats the second head 34 at that heating rate by controlling the power supplied to the heater provided in the second head 34. The second control unit 51 controls not only the temperature of the second head 34, but also the height of the second head 34 and the load applied from the second head 34 to the component 300. The control of the height and load of the second head 34 is performed by controlling actuators such as motors that raise and lower the second head 34.

[0057] Figure 6 is a flowchart showing an example of the processing operation of the decision unit 52.

[0058] First, the determination unit 52 calculates a difference Δ by subtracting distance A from distance B based on the first and second captured images (step S1). Next, the determination unit 52 determines whether the difference Δ is greater than a threshold (step S2). If the determination unit 52 determines that the difference Δ is greater than a threshold (Yes in step S2), it increases the heating rate (step S3). In other words, the determination unit 52 sets the heating rate to a speed faster than the reference speed. On the other hand, if the determination unit 52 determines that the difference Δ is less than or equal to the threshold (No in step S2), it does not increase the heating rate. In other words, the determination unit 52 sets the heating rate to the reference speed. The reference speed is, for example, a predetermined speed.

[0059] Here, the difference Δ is the distance calculated by subtracting distance A from distance B, as described above. Distance B is the distance corresponding to the spacing between multiple component electrodes 302, and distance A is the distance corresponding to the spacing between multiple substrate electrodes 202. For example, distance A may be treated as a reference distance, and the threshold may be 0.

[0060] Therefore, in this embodiment, the determination unit 52 determines the heating rate to be faster than when distance B is less than or equal to the reference distance if the distance B corresponding to the spacing between the multiple component electrodes 302 is longer than the reference distance (i.e., distance A) (Yes in step S2). In other words, in this embodiment, the determination unit 52 determines the heating rate to be faster than the reference rate if the distance B corresponding to the spacing between the multiple component electrodes 302 is longer than the reference distance (i.e., distance A) (Yes in step S2).

[0061] Furthermore, if distance B is equal to the reference distance (i.e., distance A), the determination unit 52 may determine the heating rate to be the reference rate. Also, if distance B is shorter than the reference distance (i.e., distance A), the determination unit 52 may determine the heating rate to be slower than the reference rate.

[0062] In this embodiment, the determination unit 52 sets a reference distance A corresponding to the spacing between the multiple substrate electrodes 202 on the substrate 200. The multiple substrate electrodes 202 on the substrate 200 are multiple electrodes that are connected to the multiple component electrodes 302 on the component 300 by thermocompression bonding of the component 300.

[0063] The distance A, which is treated as the reference distance, may be the distance obtained from the first image, as described above, or it may be a distance determined according to the type or model of the substrate 200. For example, if glass or the like is used as the material constituting the substrate 200, the variation in distance A for each of the multiple substrates 200, or the variation in the spacing between the multiple substrate electrodes 202 between the multiple substrates 200, will be small. Therefore, in such cases, distance A may be determined according to the type or model of the substrate 200 without using the first image. Furthermore, the reference distance may be equal to distance A, or it may be a different distance from distance A. For example, the reference distance may be a distance obtained by multiplying distance A by a coefficient, or a distance obtained by adding an offset to distance A.

[0064] Figure 7 shows an example of the process by which the component 300 is thermocompressed onto the substrate 200 by the second head 34.

[0065] First, as shown in Figure 7(a), the second control unit 51 lowers the second head 34 toward the component 300 which is mounted on the substrate 200 via the ACF 400. The multiple component electrodes 302 of the component 300 are arranged to face the multiple substrate electrodes 202 of the substrate 200 via the ACF 400 by temporary crimping by the temporary crimping unit 24. Then, as shown in Figure 7(b), the second control unit 51 brings the second head 34 into contact with the component 300 by lowering the second head 34.

[0066] Next, the second control unit 51 starts pressing the part 300 with its second head 34. That is, as shown in Figure 7(c), the second control unit 51 increases the load applied to the part 300 by the second head 34 until the magnitude of the load falls within a predetermined numerical range. At this time, the second head 34 descends further, and the part 300 is pressed into the uncured ACF 400. The second control unit 51 may determine the magnitude of the load by, for example, detecting the torque of the motor mentioned above. Also, in the state shown in Figures 7(a) to (c), the second control unit 51 maintains the temperature of the second head 34 within a low temperature range (i.e., the first temperature range). Therefore, since the part 300 is at a low temperature, thermal deformation of the part 300 is suppressed. Similarly, since the substrate 200 is also at a low temperature, thermal deformation of the substrate 200 is also suppressed. The second control unit 51 maintains the state in which the magnitude of the load is kept within the above-mentioned numerical range and the temperature of the second head 34 is kept within the first temperature range for a predetermined period (i.e., the first period). This state is also called the low-temperature load state.

[0067] Next, the second control unit 51 raises the temperature of the second head 34, as shown in Figure 7(d). At this time, the second control unit 51 raises the temperature of the second head 34 at the heating rate determined by the determination unit 52 until the temperature of the second head 34 falls within the high temperature range (i.e., the second temperature range). This heating causes the ACF400 to begin to harden. Also, this heating causes the part 300 to stretch in the X-axis and Y-axis directions due to thermal deformation. On the other hand, since a load is applied to the part 300 from the second head 34, a large frictional force is generated between the part 300 and the second head 34. Therefore, the elongation of the part 300 is suppressed or restrained by this frictional force.

[0068] Next, as shown in Figure 7(e), the second control unit 51 maintains a state in which the magnitude of the load is kept within the above-mentioned numerical range and the temperature of the second head 34 is kept within the second temperature range for a predetermined period (i.e., the second period). This state is also called the high-temperature load state. As a result, the ACF400 hardens, and the multiple conductive particles contained in the ACF400 are crushed between the multiple component electrodes 302 of the component 300 and the multiple substrate electrodes 202 of the substrate 200, causing electrical conductivity between them. In addition, because the ACF400 is hardened, thermal deformation of the component 300 and the substrate 200 is suppressed.

[0069] Figure 8 shows an example of the changes in the height, load, and temperature of the second head 34 when the component 300 is thermocompressed onto the substrate 200 by the second head 34. Figure 8(a) is a graph showing the relationship between the height H of the second head 34 and time, with the vertical axis representing the height H and the horizontal axis representing time. Figure 8(b) is a graph showing the relationship between the load W of the second head 34 and time, with the vertical axis representing the load W and the horizontal axis representing time. Figure 8(c) is a graph showing the relationship between the temperature D of the second head 34 and time, with the vertical axis representing the temperature D and the horizontal axis representing time.

[0070] First, the second head 34, the substrate 200, and the component 300 are in the state shown in Figure 4(b) and Figure 7(a). That is, the component 300 is temporarily pressed to the substrate 200 via the ACF 400, and the substrate 200 is supported from below by the second backup unit 36. Here, as shown in Figure 8(a), the second control unit 51 lowers the second head 34 from time t0 to time t1, changing the height H of the second head 34 from value h3 to value h2. When the height H of the second head 34 becomes value h2, i.e., at time t1, the second head 34 makes contact with the component 300, as shown in Figure 7(b). Subsequently, as shown in Figure 7(c), the second control unit 51 further lowers the second head 34 while pressing the component 300 against it, changing the height H of the second head 34 from value h2 to value h1.

[0071] As a result, as shown in Figure 8(b), the load W applied from the second head 34 to the part 300 begins to increase from value w1 at time t1. Value w1 is, for example, 0. The second control unit 51 then continues to increase the load W until it reaches value w2. At time t2, when the load W reaches value w2, the second control unit 51 maintains the load W at that value w2. In this way, the second head 34 is kept in a low-temperature load state as shown in Figure 7(c).

[0072] Then, as shown in Figure 8(c), the second control unit 51 starts heating the second head 34 at time t3, which is some time after time t2, that is, after the first period has elapsed. In other words, as shown in Figure 7(d), the second control unit 51 starts raising the temperature D of the second head 34. At this time, the second control unit 51 heats the second head 34 at the heating rate determined by the determination unit 52. Note that from time t0 until just before time t3, the temperature D of the second head 34 is maintained at value d1, so as the second head 34 heats up, the temperature D rises from value d1. When the temperature D rises at the aforementioned heating rate and exceeds value d3 at time t4, the second control unit 51 controls the second head 34 so that the temperature D is maintained at value d3 or higher from time t4 until just before time t5, that is, during the second period. For example, the second control unit 51 lowers the temperature D that exceeds value d3 to value d3, and maintains the temperature D at value d3. As a result, the second head 34 is kept in a high-temperature load state as shown in Figure 7(e). The value d3 is a value greater than or equal to the value d2, where the value d2 is, for example, the temperature at which ACF400 begins to harden.

[0073] Next, as shown in Figure 8(b), the second control unit 51 starts decreasing the load W, which is maintained at value w2, at time t5. At this time, as shown in Figure 8(c), the second control unit 51 starts decreasing the temperature D, which is maintained at value d3. Then, as shown in Figures 8(a) to (c), at time t6, when the load W has decreased to value w1 and the temperature D has decreased to value d1, the second control unit 51 raises the second head 34. As a result, between time t6 and time t7, the height H of the second head 34 changes from value h1 to value h3. During this time, the load W is maintained at value w1 and the temperature D is maintained at value d1.

[0074] Furthermore, the second control unit 51 changes the height H of the second head 34 by controlling the actuator for raising and lowering the second head 34, and also changes the magnitude of the load W applied from the second head 34 to the part 300. In addition, the second control unit 51 changes the temperature D of the second head 34 by controlling the power supplied to the heater provided in the second head 34.

[0075] Thus, in this embodiment, the heating of the second head 34, i.e., the rise in temperature D, begins at time t3, which is later than time t1, when the increase in load W begins. In other words, the timing of the start of heating of the second head 34 is delayed from the timing of the start of the increase in load W by the period from time t1 to time t3. During the first period from time t2 to time t3, the load W is maintained at value w2 and the temperature D is maintained at value d1. In other words, during this first period, the second head 34 continues to press down on the part 300 with a large load while at a low temperature.

[0076] Figure 9 is a flowchart showing an example of the processing operation of the second control unit 51.

[0077] First, the second control unit 51 lowers the low-temperature second head 34 and brings it into contact with the part 300 (step S11). In other words, the second control unit 51 performs the first step. In this first step, as shown in Figures 7(a) and 7(b), the second control unit 51 lowers the second head 34 and brings it into contact with the part 300 while maintaining the temperature D of the second head 34 within a first temperature range. In the first step, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​during the period from time t0 to time t1 as shown in Figure 8. The first temperature range is, for example, the range less than or equal to the value d1 shown in Figure 8(c).

[0078] Next, the second control unit 51 increases the load W applied to the part 300 from the second head 34 (step S12). In other words, the second control unit 51 performs the second step after the first step. In the second step, as shown in Figure 7(c), the second control unit 51 increases the load W applied to the part 300 from the second head 34 until the magnitude of the load W is within a predetermined numerical range, while the temperature D is maintained within the first temperature range. In the second step, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​during the period from time t1 to time t2 as shown in Figure 8. The predetermined numerical range is, for example, a range greater than or equal to the value w2 shown in Figure 8(b).

[0079] Next, the second control unit 51 maintains the low-temperature load state of the second head 34 for a first period (step S13). In other words, the second control unit 51 performs a third step after the second step. In the third step, as shown in Figure 7(c), the second control unit 51 maintains for a first period a state in which the magnitude of the load W is kept within the above-mentioned numerical range and the temperature D is kept within the first temperature range. In the third step, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​during the period from time t2 to time t3 as shown in Figure 8 (i.e., the first period).

[0080] Next, the second control unit 51 raises the temperature of the second head 34 (step S14). In other words, the second control unit 51 performs the fourth step after the third step. In the fourth step, as shown in Figure 7(d), the second control unit 51 raises the temperature of the second head 34 at a heating rate determined by the determination unit 52, so that the temperature D, which is in the first temperature range, falls within the second temperature range, which is higher than the first temperature range, while the magnitude of the load W is kept within the above-mentioned numerical range. In the fourth step, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​for the period from time t3 to time t4 as shown in Figure 8. The second temperature range is, for example, the range greater than or equal to the value d3 shown in Figure 8(c).

[0081] Next, the second control unit 51 maintains the high-temperature load state of the second head 34 for a second period (step S15). In other words, the second control unit 51 performs the fifth step after the fourth step. In the fifth step, as shown in Figure 7(e), the second control unit 51 maintains for a second period a state in which the magnitude of the load W is kept within the above-mentioned numerical range and the temperature D is kept within the second temperature range. Also, in the fifth step, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​during the period from time t4 to time t5 as shown in Figure 8 (i.e., the second period).

[0082] Next, the second control unit 51 reduces the load by lowering the temperature D of the second head 34 (step S16). At this time, the height H of the second head 34, the load W, and the temperature D are, for example, the values ​​during the period from time t5 to time t6 as shown in Figure 8.

[0083] Then, the second control unit 51 raises the low-temperature second head 34 (step S17). At this time, the height H, load W, and temperature D of the second head 34 are, for example, the values ​​during the period from time t6 to time t7 as shown in Figure 8.

[0084] Thus, in this embodiment, the timing at which the heating of the second head 34 begins in the fourth step is delayed from the timing at which the increase in load W begins in the second step. The third step is performed between the second and fourth steps. In other words, the magnitude of the load W applied to the component 300 by the second head 34 is kept within the above-mentioned numerical range, and the temperature D of the second head 34 is kept within the first temperature range, and this state is maintained for only the first period. In other words, the pressing of the component 300 by the low-temperature second head 34 continues for only the first period. Therefore, during this first period, because the second head 34 pressing the component 300 is at a low temperature, thermal deformation of the component 300 and the substrate 200 can be suppressed.

[0085] Here, for example, among multiple identical parts 300, the second temperature range is predetermined to be the same. Also, among multiple identical parts 300, the same first temperature range is usually used. Therefore, it can be said that the first and second temperature ranges are fixed among multiple identical parts 300. In such cases, the heating time required for the temperature of the second head 34 to rise from the first temperature range to the second temperature range is adjusted by adjusting the heating rate. When heating is taking place, the ACF 400 is not yet hardened and is in a soft state, making it easier for thermal deformation of the part 300 to be tolerated. Therefore, the longer the heating time, that is, the slower the heating rate, the more easily the part 300 to which the load W from the second head 34 is applied is stretched in the direction along the substrate 200 due to thermal deformation. Conversely, the shorter the heating time, that is, the faster the heating rate, the less easily the part 300 is stretched in the direction along the substrate 200. Therefore, in this embodiment, the heating rate when the second head 34 is heated in the fourth step is determined based on the spacing between the multiple component electrodes 302 of the component 300, which is measured before the component 300 is placed on the substrate 200. This allows for control of the elongation of the component 300 and control of the spacing between the multiple component electrodes 302 of the component 300. As a result, even if there is variation in the spacing between the multiple component electrodes 302 among multiple identical components 300 during the manufacturing stage of those components 300, the variation in spacing when those components 300 are thermocompressed onto the substrate 200 can be suppressed by determining a heating rate suitable for each component 300. In other words, without changing the first temperature range, second temperature range, numerical load range, second period, etc., the variation in spacing when the components 300 are thermocompressed onto the substrate 200 can be suppressed by adjusting the heating rate. This allows for proper contact between the multiple component electrodes 302 on the component 300 and the multiple substrate electrodes 202 on the substrate 200, thereby improving the accuracy of the crimping between the component 300 and the substrate 200.

[0086] Furthermore, in this embodiment, when distance B is longer than distance A, the heating rate is determined to be faster than when distance B is less than or equal to distance A. In other words, in this embodiment, when distance B is longer than distance A, the heating rate is determined to be faster than the reference rate. Therefore, when the spacing between the multiple component electrodes 302 of component 300 is long, the heating rate can be increased to suppress the expansion of that spacing. As a result, the multiple component electrodes 302 of component 300 and the multiple substrate electrodes 202 of substrate 200 can be brought into proper contact, and the accuracy of the crimping between component 300 and substrate 200 can be improved.

[0087] Furthermore, if distance B is equal to distance A, the heating rate may be set to the reference rate. This allows the heating rate to be set to the reference rate and the expansion of the spacing to an acceptable range when the spacing between the multiple component electrodes 302 of component 300 is neither long nor short. Also, if distance B is shorter than distance A, the heating rate may be set to a slower rate than the reference rate. This allows the heating rate to be slowed down and the spacing to be increased when the spacing between the multiple component electrodes 302 of component 300 is short.

[0088] Furthermore, in this embodiment, distance A, which corresponds to the spacing between the multiple substrate electrodes 202 on the substrate 200, is set as a reference distance compared with distance B in order to calculate the difference Δ. Therefore, the heating rate can be determined based on the comparison result between the spacing between the multiple component electrodes 302 on the component 300 and the spacing between the multiple substrate electrodes 202 on the substrate 200. As a result, it is possible to easily match the spacing between the multiple component electrodes 302 on the component 300 when the component 300 is pressed onto the substrate 200 to the spacing between the multiple component electrodes 302 on the substrate 200.

[0089] In this embodiment, the difference Δ is calculated by subtracting distance A from distance B, by setting distance A as the reference distance. However, the reference distance does not have to be set to distance A derived from the first captured image. In other words, the reference distance is not limited to distance A, as long as the difference Δ can be calculated by subtracting the reference distance from distance B. The reference distance may be set in advance for each type of substrate 200. Also, the threshold shown in Figure 6 is not limited to 0, and may be set to any value depending on the combination of the type of component 300 and the type of substrate 200, for example.

[0090] Although a component crimping device 10 according to one or more embodiments of the present disclosure has been described above based on embodiments, the present disclosure is not limited to these embodiments. Various modifications to the above embodiments that a person skilled in the art can conceive of may also be included in the present disclosure, as long as they do not depart from the spirit of the present disclosure.

[0091] For example, in the above embodiment, the temporary crimping unit 24 transmits the first captured image and the second captured image to the main crimping unit 28. However, the first control unit 41 of the temporary crimping unit 24 may calculate distances A and B from the captured images without transmitting the first and second captured images, and transmit information indicating these distances A and B to the main crimping unit 28. In this case, the determination unit 52 of the main crimping unit 28 can omit the process of calculating distances A and B from those images.

[0092] In the above embodiment, each component such as the second control unit 51 and the determination unit 52 may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the component crimping device 10, etc. in the above embodiment is the following program.

[0093] In other words, this program causes the computer to execute each step included in the flowcharts in Figures 6 and 9.

[0094] The following cases are also included in this disclosure.

[0095] (1) The at least one device described above is specifically a computer system consisting of a microprocessor, ROM (Read Only Memory), RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or hard disk unit. The at least one device described above achieves its function by the operation of the microprocessor in accordance with the computer program. Here, the computer program is composed of a combination of multiple instruction codes that indicate commands to the computer in order to achieve a predetermined function.

[0096] (2) Some or all of the components constituting at least one of the above-described devices may be made up of a single system LSI (Large Scale Integration). The system LSI is a multi-functional LSI manufactured by integrating multiple components onto a single chip, and specifically, it is a computer system comprising a microprocessor, ROM, RAM, etc. The RAM stores a computer program. The system LSI achieves its function by operating the microprocessor in accordance with the computer program.

[0097] (3) Some or all of the components constituting at least one of the above-described devices may consist of an IC card or a standalone module that is detachable from the device. The IC card or module is a computer system consisting of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-described multi-function LSI. The IC card or module achieves its function by the operation of the microprocessor in accordance with a computer program. The IC card or module may be tamper-resistant.

[0098] (4) The disclosure may also be the methods described above. Alternatively, it may be a computer program that implements these methods using a computer, or a digital signal consisting of a computer program.

[0099] Furthermore, this disclosure may also refer to a computer program or digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD (Compact Disc)-ROM, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray® Disc), semiconductor memory, etc. Alternatively, it may refer to a digital signal recorded on such a recording medium.

[0100] Furthermore, this disclosure may also include the transmission of computer programs or digital signals via telecommunications lines, wireless or wired communication lines, networks such as the Internet, data broadcasting, etc.

[0101] Alternatively, the program or digital signal may be carried out by another independent computer system by recording and transferring it on a recording medium, or by transferring the program or digital signal via a network or the like. [Industrial applicability]

[0102] This disclosure can be used when mounting driver ICs, etc., to flat panels used in organic EL displays and liquid crystal displays, etc. [Explanation of symbols]

[0103] 10. Crimping device for parts 12 Loader 14 Washing machine 16 Unloader 18 Line Controller 20 ACF application area 22 Supply section 24 Temporary crimping section 26 Imaging Department 28 crimped sections 30 First Head 32 First Backup Section 34. Head 2 36 Second Backup Section 41 First Control Unit 51 Second Control Unit 52 Decision Section 100-component mounting system 200 circuit boards 202 Substrate electrodes 204 First alignment mark 300 parts 302 Component electrodes 304 Second alignment mark 400 ACF

Claims

1. A backup unit that supports the circuit board from below, A thermocompression head is used to thermocompression bond a component, which is placed on the substrate supported by the backup unit with an anisotropic conductive member sandwiched between them, to the substrate. A control unit for controlling the heat-sealing head, A determination unit for determining the conditions for thermocompression bonding of the component to the substrate, Equipped with, The aforementioned determination unit, Based on the spacing between the multiple electrodes of the component, measured before the component is placed on the substrate, the heating rate of the thermocompression head is determined as a condition for the thermocompression bonding. In controlling the thermocompression head, the control unit... The first step is to lower the heat-sealing head to bring it into contact with the part while the temperature of the heat-sealing head is maintained within a first temperature range, After the first step, while the temperature is maintained within the first temperature range, the second step is to increase the load until the magnitude of the load applied from the thermocompression head to the part falls within a predetermined numerical range. A third step is to maintain, for a first period, the state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the first temperature range, after the second step, After the third step, a fourth step is to heat the thermocompression head at the heating rate determined by the determination unit so that the magnitude of the load is kept within the numerical range, and the temperature, which is in the first temperature range, falls within a second temperature range that is higher than the first temperature range. After the fourth step, a fifth step is performed to maintain for a second period the state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the second temperature range. Parts crimping device.

2. The aforementioned determination unit, If the distance corresponding to the interval is longer than the reference distance, the heating rate is determined to be faster than when the distance is less than or equal to the reference distance. The component crimping device according to claim 1.

3. The aforementioned determination unit, If the distance corresponding to the aforementioned interval is longer than the reference distance, the heating rate is determined to be faster than the reference rate. The component crimping device according to claim 1.

4. The aforementioned determination unit, If the aforementioned distance is equal to the reference distance, the heating rate is determined to be the reference rate. The component crimping device according to claim 3.

5. The aforementioned determination unit, If the aforementioned distance is shorter than the reference distance, the heating rate is determined to be slower than the reference rate. The component crimping device according to claim 4.

6. The aforementioned determination unit further, The distance corresponding to the spacing between the multiple electrodes on the substrate is set as the reference distance. The plurality of electrodes on the substrate are a plurality of electrodes for which the component is connected by thermocompression bonding of the component. A component crimping device according to any one of claims 2 to 5.

7. A component crimping method performed by a component crimping device, The component crimping device is A backup unit that supports the circuit board from below, A thermocompression head is used to thermocompression bond a component, which is placed on the substrate supported by the backup unit with an anisotropic conductive member sandwiched between them, to the substrate. Equipped with, In the aforementioned component crimping method, The heating rate of the thermocompression head is determined based on the spacing between the multiple electrodes of the component, which is measured before the component is placed on the substrate. The first step is to lower the heat-sealing head to bring it into contact with the part while the temperature of the heat-sealing head is maintained within a first temperature range, After the first step, while the temperature is maintained within the first temperature range, the second step is to increase the load until the magnitude of the load applied from the thermocompression head to the part falls within a predetermined numerical range. A third step is to maintain, for a first period, the state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the first temperature range, after the second step, After the third step, the fourth step involves heating the thermocompression head at a determined heating rate so that the temperature, which is in the first temperature range, falls within a second temperature range that is higher than the first temperature range, while the magnitude of the load is kept within the numerical range. After the fourth step, a fifth step is performed to maintain for a second period the state in which the magnitude of the load is kept within the numerical range and the temperature is kept within the second temperature range. Crimping method for components.

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