Semiconductor manufacturing equipment

Abstract

The present invention provides a semiconductor manufacturing apparatus that can determine whether or not the upper surface of a semiconductor substrate is in contact with the lower surface of a photomask, without being affected by the aging of the lifting mechanism. [Solution] The ratio of a physical quantity to a reference value, which is a physical quantity when the semiconductor substrate 70 moves downward from the photomask 62, is compared with a predetermined threshold. When the ratio and the threshold have a predetermined relationship, it is determined that the upper surface of the semiconductor substrate, which has been raised by the lifting mechanism, has come into contact with the lower surface of the photomask.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing apparatus.

Background Art

[0002] There is known a semiconductor manufacturing apparatus capable of performing an exposure process using a photomask on a semiconductor substrate (semiconductor wafer). As an example of such a semiconductor manufacturing apparatus, there is one including a support member disposed directly below a photomask and an elevating mechanism for moving the support member in the vertical direction. The elevating mechanism operates using the driving force of an electric motor. A support concave portion having a shape forming a part of a sphere is formed on the upper surface of the support member. Further, a rotating portion constituted by at least a part of a sphere is rotatably housed in the support concave portion, and a stage portion fixed to the rotating portion so as to be positioned above the rotating portion supports the semiconductor substrate.

[0003] In such a semiconductor manufacturing apparatus, before irradiating the semiconductor substrate with light from an exposure light source disposed above the photomask through the photomask, a process of making the upper surface of the semiconductor substrate supported by the stage portion parallel to the photomask is executed. That is, the elevating mechanism is operated using the driving force of the electric motor, and thereby the support member is moved upward. When the upper surface of the semiconductor substrate supported by the stage portion that has moved upward together with the support member contacts the lower surface of the photomask, the rotating portion rotates with respect to the support concave portion by the force received from the photomask. As a result, the entire upper surface of the semiconductor substrate contacts the lower surface of the photomask, and the upper surface of the semiconductor substrate becomes parallel to the lower surface of the photomask.

[0004] When the upper surface of the semiconductor substrate contacts the lower surface of the photomask, the torque (load) of the electric motor changes. Therefore, the control device connected to the electric motor determines that the upper surface of the semiconductor substrate has contacted the lower surface of the photomask when the torque of the electric motor becomes equal to or greater than a reference value, reverses the electric motor, and restricts the rotation of the rotating portion with respect to the support concave portion using a locking mechanism. Thereby, the upper surface of the semiconductor substrate is held in a state parallel to the lower surface of the photomask.

Prior Art Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 2003-273168 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] When the multiple components that make up the lifting mechanism operate, frictional resistance is generated between each component. As a result, each component of the lifting mechanism may wear down over time. In addition, the amount of lubricant supplied to each component of the lifting mechanism may decrease over time. In other words, the condition of the lifting mechanism changes over time. To put it another way, even if the lifting mechanism is operated in the same way at two different times, there is a possibility that the torque of the electric motor at the two times will differ due to the aging of the lifting mechanism.

[0007] Therefore, if the determination of whether the upper surface of the semiconductor substrate has come into contact with the lower surface of the photomask is based on the magnitude of the torque of the electric motor, as described above, there is a risk that it may not be possible to accurately determine whether or not the upper surface of the semiconductor substrate has come into contact with the lower surface of the photomask.

[0008] In consideration of the above facts, the present invention aims to provide a semiconductor manufacturing apparatus that can determine whether or not the upper surface of a semiconductor substrate has come into contact with the lower surface of a photomask, without being affected by the aging of the lifting mechanism. [Means for solving the problem]

[0009] A semiconductor manufacturing apparatus according to a first aspect of the present disclosure includes: a support member; a lifting mechanism for moving the support member vertically; a support recess formed on the upper surface of the support member and having the shape of a part of a sphere; a rotating part rotatably housed in the support recess and composed of at least a part of a sphere having a smaller radius of curvature than the sphere; a stage part fixed to the rotating part so as to be located above the rotating part and capable of supporting a semiconductor substrate; a photomask provided above the stage part; a flow channel connected to the gap between the inner surface of the support recess and the outer surface of the rotating part; a fluid source capable of supplying fluid to the gap via the flow channel; a detection unit provided in the flow channel for detecting a predetermined physical quantity relating to the fluid flowing through the flow channel; and a determination unit that compares the ratio of the physical quantity to a reference value, which is the physical quantity when the semiconductor substrate moves downward from the photomask, with a predetermined threshold, and determines that the upper surface of the semiconductor substrate, which has been raised by the lifting mechanism, has come into contact with the lower surface of the photomask when the ratio and the threshold are in a predetermined relationship.

[0010] In the semiconductor manufacturing apparatus according to the first aspect of this disclosure, when the semiconductor substrate is positioned below the photomask, fluid flows easily through the gap between the support recess and the rotating part. On the other hand, when the upper surface of the semiconductor substrate comes into contact with the lower surface of the photomask, the rotating part is pressed against the inner surface of the support recess, making it difficult for fluid to flow through the gap between the support recess and the rotating part. As a result, a predetermined physical quantity related to the fluid changes when the upper surface of the semiconductor substrate comes into contact with the lower surface of the photomask. For example, if the physical quantity is the fluid flow rate per unit time, the flow rate decreases. Also, if the physical quantity is the fluid pressure, the pressure increases. This change in physical quantity occurs independently of the aging of the lifting mechanism. Therefore, the semiconductor manufacturing apparatus according to the first aspect of this disclosure can determine whether or not the upper surface of the semiconductor substrate has come into contact with the lower surface of the photomask without being affected by the aging of the lifting mechanism.

[0011] A semiconductor manufacturing apparatus according to a second aspect of the present disclosure, in the configuration described in the first aspect, is provided with a locking mechanism for allowing or restricting the rotation of the rotating part relative to the support recess, wherein the locking mechanism restricts the rotation of the rotating part relative to the support recess when the determination unit determines that the ratio and the threshold have reached a predetermined relationship.

[0012] In the semiconductor manufacturing apparatus according to the second aspect of this disclosure, when the determination unit determines that the ratio of a physical quantity and a threshold have reached a predetermined relationship, the locking mechanism restricts the rotation of the rotating part relative to the support recess. As a result, the stage can be held in a state where the upper surface of the semiconductor substrate is parallel to the lower surface of the photomask.

[0013] A semiconductor manufacturing apparatus according to a third aspect of the present disclosure, in the configuration described in the first or second aspect, wherein the fluid source is capable of supplying air as the fluid to the flow path and is capable of drawing in air in the flow path, and the fluid source, which is a locking mechanism, applies negative pressure to the space of the support recess via the flow path, thereby pressing the rotating part against the support recess and restricting the rotation of the rotating part relative to the support recess.

[0014] In the semiconductor manufacturing apparatus according to the third aspect of this disclosure, the rotation of the rotating part relative to the support recess can be restricted by using a fluid source that acts as a locking mechanism. As a result, the structure of the semiconductor manufacturing apparatus is simplified compared to the case where the locking mechanism and the fluid source are separate components. [Effects of the Invention]

[0015] As described above, the semiconductor manufacturing apparatus according to the present invention has the excellent effect of being able to determine whether or not the upper surface of the semiconductor substrate is in contact with the lower surface of the photomask without being affected by the aging of the lifting mechanism. [Brief explanation of the drawing]

[0016] [Figure 1] This is a perspective view of the semiconductor manufacturing apparatus according to the embodiment, as seen from above. [Figure 2] This is a front view of a semiconductor manufacturing device, partially shown in cross-section. [Figure 3] It is a control block diagram of a control device. [Figure 4] It is a functional block diagram of a control device. [Figure 5] It is a schematic cross-sectional view seen from the front of a semiconductor manufacturing apparatus when a support plate is in an initial position. [Figure 6] It is a cross-sectional view similar to FIG. 5 when a semiconductor substrate contacts a photomask. [Figure 7] It is a cross-sectional view similar to FIG. 5 when the lower end of a rotating part contacts the bottom surface of a support recess. [Figure 8] It is a flowchart showing the processing executed by the CPU of a control device.

Mode for Carrying Out the Invention

[0017] Hereinafter, a semiconductor manufacturing apparatus 10 according to an embodiment will be described with reference to the accompanying drawings. In each figure, the symbol UP indicates the upper side in the vertical direction, LH indicates the left side in the left-right direction, and FR indicates the front side in the front-rear direction.

[0018] As shown in FIGS. 1 and 2, the semiconductor manufacturing apparatus 10 includes a flat plate-shaped moving body 12. The lower surface of the moving body 12 is supported by a lifting mechanism 14. The lifting mechanism 14 includes a plurality of movable members that are linked to each other, and an electric motor 15 capable of applying a driving force to the movable members. The movable members include, for example, a screw shaft extending in the vertical direction and having a male screw groove formed on the outer peripheral surface, and a rotating member having a female screw hole that engages with the screw shaft and whose vertical movement is restricted. The upper end of the screw shaft is fixed to the lower surface of the moving body 12. The electric motor 15 applies a driving force to the rotating member via a power transmission mechanism. Therefore, when the electric motor 15 rotates forward, the moving body 12 rises, and when the electric motor 15 rotates backward, the moving body 12 descends.

[0019] The semiconductor manufacturing apparatus 10 includes a flat support plate 17 positioned above the moving body 12. The support plate 17 is supported on the upper surface of the moving body 12 via a plurality of support columns 19. Therefore, the support plate 17 rises and falls integrally with the moving body 12. A through hole 18 is formed in the central portion of the support plate 17.

[0020] A rocking stage 20 is provided on the upper surface of the support plate 17. The rocking stage 20 includes a support member 22, a stage portion 30, and a stopper member 40.

[0021] The outer shape of the metal support member 22 is substantially a rectangular parallelepiped. A substantially hemispherical support recess 24 is formed on the upper surface of the support member 22. That is, the outer shape of the support recess 24 is substantially the same as a part of a sphere. Further, an internal flow path (flow path) 26 extending in the vertical direction is formed on the lower surface of the support member 22 so as to connect the lower surface of the support member 22 and the lower end portion (central portion) of the support recess 24. The lower surface of the support member 22 is fixed to the upper surface of the support plate 17, and the through hole 18 of the support plate 17 and the internal flow path 26 of the support member 22 communicate with each other in an airtight state.

[0022] The metal stage portion 30 has a rotating portion 32, a shaft portion 34, and a stage portion 36. The rotating portion 32 is a substantially spherical part. The rotating portion 32 is constituted by all or part of a sphere. The radius of curvature of the rotating portion 32 is smaller than the radius of curvature of the support recess 24. The lower end portion of the shaft portion 34 extending along a straight line is fixed to the upper portion of the rotating portion 32. Further, the lower surface of the disk-shaped stage portion 36 is fixed to the upper end portion of the shaft portion 34. As shown in FIG. 2, the portion located below the center 32C of the rotating portion 32 is rotatably housed in the support recess 24 of the support member 22.

[0023] A circular hole 42 is formed in the center of the retaining member 40, which is a flat plate with a planar shape substantially identical to that of the support member 22. The radius of the circular hole 42 is smaller than the radius of curvature of the rotating part 32. As shown in Figure 2, the shaft 34 passes through the circular hole 42 of the retaining member 40. Furthermore, the retaining member 40 is fixed to the support member 22 in such a manner that a portion (upper part) of the rotating part 32 located above its center 32C is positioned within the circular hole 42. As shown in Figure 2, a gap is formed between the upper surface of the support member 22 and the lower surface of the retaining member 40. Note that the members that fix the support member 22 and the retaining member 40 are not shown.

[0024] As shown in Figure 2, the semiconductor manufacturing apparatus 10 includes an intake and exhaust device (fluid source) (locking mechanism) 45 located away from the movable body 12, the support plate 17, and the tilting stage 20. The intake and exhaust device 45 is capable of discharging compressed air (fluid) and drawing in air. One end of a metal pipe material (flow channel) 47 is airtightly connected to the intake and exhaust device 45. The other end of the pipe material 47 extends through the space between the movable body 12 and the support plate 17 to a through hole 18, where it is airtightly connected to the lower end of the internal flow channel 26 of the support member 22.

[0025] As shown in Figure 2, a flow sensor (detection unit) 49 is provided inside the pipe material 47. The flow sensor 49 can detect the flow rate of air flowing inside the pipe material 47. More specifically, the flow sensor 49 can detect the flow rate (physical quantity) of air flowing inside the pipe material 47 per unit time.

[0026] As shown in Figure 3, the control device 52 is composed of a CPU (Central Processing Unit: processor) 53, ROM (Read Only Memory) 54, RAM (Random Access Memory) 55, storage 56, communication interface 57, and input / output interface 58. The CPU 53, ROM 54, RAM 55, storage 56, communication interface 57, and input / output interface 58 are connected to each other via a bus 59 so that they can communicate with one another. The control device 52 can obtain date and time information from a timer (not shown).

[0027] The CPU 53 is a central processing unit that executes various programs and controls various components. Specifically, the CPU 53 reads programs from the ROM 54 or storage 56 and executes them using the RAM 55 as its working area. The CPU 53 controls each component and performs various calculations (information processing) according to the programs recorded in the ROM 54 or storage 56.

[0028] ROM 54 stores various programs and data. RAM 55 temporarily stores programs or data as a working area. Storage 56 consists of a storage device such as an HDD (Hard Disk Drive) or SSD (Solid State Drive) and stores various programs and data. Communication I / F 57 is an interface that enables communication with devices other than the semiconductor manufacturing equipment 10. Communication standards such as Bluetooth (registered trademark) and Wi-Fi (registered trademark) are used for communication I / F 57. Furthermore, communication I / F 57 can communicate with other control devices via an external bus. Input / Output I / F 58 is an interface for communicating with various devices. For example, an electric motor 15, an intake / exhaust device 45, and a flow sensor 49 are connected to input / output I / F 58.

[0029] As shown in Figure 4, the CPU 53 of the control device 52 has a functional configuration that includes a determination unit 531, a motor control unit 532, an exhaust control unit 533, and a suction lock control unit 534. The determination unit 531, motor control unit 532, exhaust control unit 533, and suction lock control unit 534 are realized when the CPU 53 of the control device 52 reads and executes a program stored in the ROM 54.

[0030] The determination unit 531 compares the ratio of the detected value of the flow sensor 49 to a reference value with the threshold value, based on the detection result of the flow sensor 49 and the threshold data recorded in the ROM 54. Here, the reference value of the detected value of the flow sensor 49 is the detected value of the flow sensor 49 when the semiconductor substrate 70, described later, is separated from the photomask 62 and the intake / exhaust device 45 is performing an exhaust operation. For example, the detected value of the flow sensor 49 when the semiconductor substrate 70 is separated from the photomask 62 and the intake / exhaust device 45 is performing an exhaust operation can be acquired multiple times, and the average value of each detected value can be calculated and used as the reference value. Information regarding this reference value is recorded in the ROM 54. When the determination unit 531 determines that the ratio of the detected value of the flow sensor 49 to the reference value has fallen below the threshold, it determines that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62. The threshold value is, for example, 0.4. However, a value less than 1 and different from 0.4 can be used as the threshold value.

[0031] The motor control unit 532 transmits a forward rotation signal to the electric motor 15 when an input device (not shown) connected to the control device 52 transmits a predetermined parallel alignment processing signal to the control device 52. When a user of the semiconductor manufacturing equipment 10 performs a predetermined operation on the input device, the input device transmits a parallel alignment processing signal to the control device 52. The motor control unit 532 continues to transmit a forward rotation signal to the electric motor 15 until the determination unit 531 determines that the ratio of the detected value of the flow sensor 49 to the reference value has fallen below a threshold. When the determination unit 531 determines that the ratio of the detected value of the flow sensor 49 to the reference value has fallen below a threshold, the motor control unit 532 stops transmitting the forward rotation signal and instead transmits a reverse rotation signal to the electric motor 15 for a predetermined period of time.

[0032] When the input device transmits a parallel alignment processing signal to the control device 52, the exhaust control unit 533 transmits an exhaust signal to the intake and exhaust device 45 until it determines that the ratio of the detected value of the flow sensor 49 to the reference value falls below a threshold. Upon receiving the exhaust signal, the intake and exhaust device 45 performs an exhaust operation. That is, the intake and exhaust device 45 supplies compressed air to the internal space of the pipe material 47. The amount of air supplied to the pipe material 47 per unit time by the intake and exhaust device 45 is constant. The compressed air supplied to the pipe material 47 flows through the internal passage 26 into the gap S (see Figures 5 to 7) between the inner surface of the support recess 24 of the support member 22 and the outer surface of the rotating part 32. As a result, the inner surface of the support recess 24 and the outer surface of the rotating part 32 are in a non-contact state, enabling smooth relative rotation of the rotating part 32 with respect to the support member 22 (support recess 24). That is, the compressed air flowing into the gap S functions as an air bearing.

[0033] The suction lock control unit 534 transmits an intake signal to the intake / exhaust device 45 when the input device has not transmitted a parallel alignment processing signal to the control device 52, and when it is determined that the ratio of the detected value of the flow sensor 49 to the reference value has fallen below a threshold after the parallel alignment processing signal has been transmitted. Upon receiving the intake signal, the intake / exhaust device 45 performs an intake operation. That is, the intake / exhaust device 45 exerts negative pressure on the internal space of the pipe material 47. As a result, negative pressure is exerted on the gap S between the inner surface of the support recess 24 of the support member 22 and the outer surface of the rotating part 32, so that the rotating part 32 is pulled towards the upper end opening of the internal flow path 26 of the support recess 24, and the lower end of the rotating part 32 comes into airtight contact with the bottom of the inner surface of the support recess 24 and the upper end opening of the internal flow path 26. This restricts the relative rotation of the rotating part 32 with respect to the support member 22 (support recess 24). That is, the angles of the shaft part 34 and the stage part 36 with respect to the support plate 17 in a side view are fixed. In other words, the intake and exhaust device 45 performs a suction lock operation.

[0034] Furthermore, as shown in Figure 2, the semiconductor manufacturing apparatus 10 has an exposure light source 60 and a photomask 62 located above the tilting stage 20. The photomask 62 is located between the exposure light source 60 and the stage section 36. The photomask 62 comprises a light-transmitting substrate and a grid-shaped light-shielding film provided on the lower surface of the substrate. The lower surface of the photomask 62 is a plane substantially perpendicular to the vertical direction.

[0035] (Mechanism of action and effect) Next, the operation and effects of this embodiment will be described.

[0036] Next, the exposure process on the semiconductor substrate (semiconductor wafer) 70 using the semiconductor manufacturing apparatus 10 will be explained with reference to the flowchart in Figure 8. The CPU 53 of the control device 52 repeatedly executes the process shown in the flowchart in Figure 8 after a predetermined amount of time has elapsed.

[0037] First, in step S10 (the word "step" will be omitted hereafter), it is determined whether or not a parallel output processing signal has been received from the input device.

[0038] If the CPU 53 determines Yes in S10, it proceeds to S11 and causes the semiconductor manufacturing apparatus 10 to perform the parallel alignment preparation process. That is, the CPU 53 controls the electric motor 15 to position the support plate 17 in the initial position shown in Figures 2 and 5. When the support plate 17 is in the initial position, the stage section 36 moves downward away from the photomask 62.

[0039] Furthermore, in S11, the CPU 53 transmits an intake signal to the intake / exhaust device 45. As a result, the intake / exhaust device 45 performs a suction lock operation. Furthermore, as shown in Figure 5, the CPU 53 controls the transport device (not shown) to place the semiconductor substrate 70, which has a circular planar shape, onto the upper surface of the stage unit 36, and activates the suction means provided on the stage unit 36 ​​to suction the semiconductor substrate 70 onto the upper surface of the stage unit 36.

[0040] Next, the CPU 53 proceeds to S12 and sends a forward rotation signal to the electric motor 15. As a result, the support plate 17 and the tilting stage 20 rise relative to the moving body 12. Furthermore, the CPU 53 stops sending an intake signal to the intake and exhaust device 45 and instead sends an exhaust signal to the intake and exhaust device 45. As a result, the rotating part 32 can rotate relative to the support member 22 (support recess 24).

[0041] Next, CPU 53 proceeds to S13, where it determines whether the ratio of the detected value from the flow sensor 49 to the reference value has fallen below a threshold.

[0042] As shown in Figure 5, when the upper surface of the semiconductor substrate 70 separates from the lower surface of the photomask 62, causing the entire rotating part 32 to float above the inner surface of the support recess 24, compressed air flows through the gap S between the support recess 24 of the support member 22 and the rotating part 32. The compressed air then flows from the upper end of the gap S between the upper surface of the support member 22 and the lower surface of the retaining member 40, and is then discharged to the outside of the support member 22 and the retaining member 40. In this case, when the entire rotating part 32 is floating above the inner surface of the support recess 24, the flow of compressed air from the internal space and internal flow path 26 of the pipe material 47 to the gap S is not obstructed by the rotating part 32, so the ratio of the detected value of the flow sensor 49 to the reference value becomes higher. That is, in this case, this ratio does not fall below the threshold.

[0043] As shown in Figure 6, when the upper surface of the semiconductor substrate 70, which is raised by the driving force of the forward-rotating electric motor 15, comes into contact with the lower surface of the photomask 62, the semiconductor substrate 70 and the stage section 36 receive a reaction force from the photomask 62, which is supported by the support device (not shown) of the semiconductor manufacturing apparatus 10. Therefore, the entire rotating section 32 is rotated relative to the support member 22 (support recess 24) so ​​that the entire upper surface of the semiconductor substrate 70 comes into contact with the lower surface of the photomask 62. When the entire upper surface of the semiconductor substrate 70 comes into contact with the lower surface of the photomask 62, the photomask 62 and the semiconductor substrate 70 become substantially parallel.

[0044] As shown in Figure 7, if the electric motor 15 continues to rotate in the forward direction from the state in Figure 6, the semiconductor substrate 70 and the stage portion 36, which receive a reaction force from the photomask 62, are pushed downward, and the lower end of the rotating portion 32 is pressed against the lower end of the inner surface of the support recess 24 while the entire upper surface of the semiconductor substrate 70 remains in contact with the lower surface of the photomask 62. As a result, at least a portion of the upper opening of the internal flow path 26 is blocked by the lower end of the rotating portion 32. That is, at least a portion of the flow of compressed air from the internal space of the pipe material 47 and the internal flow path 26 to the gap S is obstructed by the rotating portion 32. Therefore, the air pressure in the internal space of the pipe material 47 increases, and the amount of air flowing around the flow sensor 49 per unit time decreases. Therefore, the ratio of the detected value of the flow sensor 49 to the reference value decreases. That is, the ratio of the detected value of the flow sensor 49 to the reference value falls below the threshold.

[0045] When the CPU 53 determines "Yes" in S13, it proceeds to S14 and sends a reverse signal to the electric motor 15. As a result, the support plate 17 and the tilting stage 20 descend relative to the moving body 12, and descend until the support plate 17 returns to its initial position. When the support plate 17 returns to its initial position, the CPU 53 stops sending the reverse signal to the electric motor 15. Furthermore, the CPU 53 stops sending the exhaust signal to the intake / exhaust device 45 and instead sends an intake signal to the intake / exhaust device 45. As a result, the intake / exhaust device 45 performs an intake lock operation. Thus, the stage unit 30 maintains a substantially parallel state between the photomask 62 and the semiconductor substrate 70.

[0046] Next, the CPU 53 proceeds to S15 and executes the exposure process. Specifically, the semiconductor manufacturing apparatus 10, controlled by the CPU 53, forms an etchable film over the entire upper surface of the semiconductor substrate 70, and then applies a photoresist to the entire upper surface of the etchable film. Furthermore, the exposure light source 60 irradiates light downwards. As a result, the light that has passed through the photomask 62 forms an image on the upper surface of the photoresist. This creates numerous exposed areas on the photoresist, which are the parts that have been irradiated with light. Furthermore, the semiconductor manufacturing apparatus 10 applies a phenotyping solution to the photoresist to remove each exposed area from the photoresist. This patterns the photoresist.

[0047] The semiconductor manufacturing apparatus 10 of this embodiment, as described above, determines whether the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62 based on the amount of air flowing per unit time through the internal space of the pipe material 47, which fluctuates depending on whether the rotating part 32 comes into contact with the inner surface of the support recess 24. This amount of air changes independently of the aging of the lifting mechanism 14. Therefore, the semiconductor manufacturing apparatus 10 can determine whether the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62 without being affected by the aging of the lifting mechanism 14.

[0048] Furthermore, the semiconductor manufacturing apparatus 10 utilizes the intake and exhaust system 45 as a locking mechanism. Therefore, the structure of the semiconductor manufacturing apparatus 10 is simpler compared to a case where the semiconductor manufacturing apparatus 10 has a separate locking mechanism from the intake and exhaust system 45.

[0049] Although the semiconductor manufacturing apparatus 10 according to the embodiment has been described above, the semiconductor manufacturing apparatus 10 can be modified as appropriate without departing from the spirit of the present invention.

[0050] For example, the semiconductor manufacturing apparatus 10 may be equipped with a pressure sensor instead of a flow sensor 49. In this case, the determination unit 531 determines whether the ratio of the pressure (physical quantity) of the compressed air flowing inside the pipe material 47 to a predetermined reference value has become greater than a threshold value recorded in the ROM 54. In other words, if the ratio of the pressure of the compressed air flowing inside the pipe material 47 to a reference value becomes greater than a threshold value, the determination unit 531 determines that at least a part of the upper opening of the internal flow path 26 has been blocked by the lower end of the rotating part 32. That is, in this case, the determination unit 531 determines that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62. Here, the reference value of the pressure sensor's detection value is the detection value of the pressure sensor when the semiconductor substrate 70 is moving downward from the photomask 62 and the intake / exhaust device 45 is performing an exhaust operation. For example, the detection value of the pressure sensor when the semiconductor substrate 70 is moving downward from the photomask 62 and the intake / exhaust device 45 is performing an exhaust operation can be acquired multiple times, and the average value of each detection value can be used as the reference value. In this case, the threshold is, for example, 1.4. However, the threshold in this case may be a number greater than 1 and different from 1.4.

[0051] Incidentally, the manner in which the rotating part 32, which receives a reaction force from the photomask 62, begins to contact the inner surface of the support recess 24 varies. Furthermore, the area of ​​the upper opening of the internal flow path 26 that is blocked by the rotating part 32 changes depending on the manner of contact. That is, for each manner of contact, the amount of air per unit time flowing through the internal space of the pipe material 47 when the rotating part 32 begins to contact the inner surface of the support recess 24, and the air pressure in the internal space of the pipe material 47 when the rotating part 32 begins to contact the inner surface of the support recess 24 are different.

[0052] For example, the amount of air per unit time flowing through the internal space of the pipe material 47 when the rotating part 32 closes the upper end opening of the internal flow path 26 in a predetermined first mode is defined as the first flow rate, and the amount of air per unit time flowing through the internal space of the pipe material 47 when the rotating part 32 closes the upper end opening of the internal flow path 26 in a predetermined second mode different from the first mode is defined as the second flow rate. In this case, the first flow rate < the second flow rate. In this case, it is also possible to use the ratio of the first flow rate to the reference value as the threshold. However, in this case, when the rotating part 32 closes the upper end opening of the internal flow path 26 in the second mode, the determination unit 531 does not determine that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62, and the electric motor 15 continues to rotate in the forward direction. Therefore, in this case, it is preferable to use the ratio of the second flow rate to the reference value as the threshold. In this way, regardless of whether the rotating part 32 blocks the upper opening of the internal flow path 26 in the first or second mode, the determination unit 531 determines that the upper surface of the semiconductor substrate 70 is in contact with the lower surface of the photomask 62.

[0053] Similarly, the atmospheric pressure in the internal space of the pipe material 47 when the rotating part 32 closes the upper end opening of the internal flow path 26 in a predetermined first mode is defined as the first atmospheric pressure, and the atmospheric pressure in the internal space of the pipe material 47 when the rotating part 32 closes the upper end opening of the internal flow path 26 in a predetermined second mode different from the first mode is defined as the second atmospheric pressure. In this case, the first atmospheric pressure < the second atmospheric pressure. In this case, it is also possible to use the ratio of the second atmospheric pressure to the reference value as the threshold. However, in this case, when the rotating part 32 closes the upper end opening of the internal flow path 26 in the first mode, the determination unit 531 does not determine that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62, and the electric motor 15 continues to rotate in the forward direction. Therefore, in this case, it is preferable to use the ratio of the first atmospheric pressure to the reference value as the threshold. In this way, the determination unit 531 determines that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62 regardless of whether the rotating part 32 closes the upper end opening of the internal flow path 26 in the first mode or the second mode.

[0054] The intake and exhaust device 45 may also discharge and draw in a gas (fluid) other than air.

[0055] The semiconductor manufacturing apparatus 10 may be equipped with a device capable of discharging and sucking in liquid (fluid) instead of the intake and exhaust device 45, with one end of the pipe material 47 connected to this device in a liquid-tight manner, and the other end of the pipe material 47 connected in a liquid-tight manner to the lower end of the internal flow path 26. In this case, when the device is performing a liquid discharge operation, the fluid flows into the gap S between the inner surface of the support recess 24 of the support member 22 and the outer surface of the rotating part 32, so that the inner surface of the support recess 24 and the outer surface of the rotating part 32 are in a non-contact state, enabling smooth relative rotation of the rotating part 32 with respect to the support member 22.

[0056] The intake and exhaust device 45 provided in the semiconductor manufacturing apparatus 10 may only perform exhaust operations and not suction operations. Alternatively, the semiconductor manufacturing apparatus 10 may be equipped with a liquid discharge device capable of discharging liquid into a pipe material 47. Furthermore, in these cases, the semiconductor manufacturing apparatus 10 is equipped with a mechanical locking device (not shown). The actuator of this mechanical locking device is connected to the control device 52. When the semiconductor manufacturing apparatus 10 performs the parallel alignment preparation process and when the determination unit 531 determines that the upper surface of the semiconductor substrate 70 has come into contact with the lower surface of the photomask 62, the locking device becomes locked by the actuator operated under the control of the control device 52. As a result, the rotation of the rotating part 32 relative to the support member 22 (support recess 24) is restricted by the locking device. Also, when the support plate 17 rises due to the forward rotation of the electric motor 15, the locking device is unlocked under the control of the control device 52. As a result, the rotation of the rotating part 32 relative to the support member 22 (support recess 24) becomes possible. [Explanation of Symbols]

[0057] 10 Semiconductor manufacturing equipment 14. Lifting mechanism 22 Support member 24 Support recess 26 Internal flow path (flow path) 32 Rotating part 36 Stage Section 45. Intake and exhaust system (fluid source) (locking mechanism) 47. Pipe material (flow channel) 49 Flow sensor (detection unit) 531 Judgment section 62 Photomasks 70 Semiconductor substrates S Gap

Claims

1. Support member and A lifting mechanism for moving the support member in the vertical direction, A support recess formed on the upper surface of the support member, which is shaped like a part of a sphere, A rotating part is housed in the support recess so as to be rotatable, and is composed of at least a portion of a sphere having a smaller radius of curvature than the sphere, A stage portion is fixed to the rotating portion so as to be located above the rotating portion and capable of supporting a semiconductor substrate, A photomask provided above the aforementioned stage section, A flow channel connected to the gap between the inner surface of the support recess and the outer surface of the rotating part, A fluid source capable of supplying fluid to the gap via the aforementioned flow path, A detection unit provided in the flow path for detecting a predetermined physical quantity relating to the fluid flowing through the flow path, A determination unit compares the ratio of a physical quantity to a reference value, which is the physical quantity when the semiconductor substrate moves downward from the photomask, with a predetermined threshold, and determines that when the ratio and the threshold have a predetermined relationship, the upper surface of the semiconductor substrate, which has been raised by the lifting mechanism, has come into contact with the lower surface of the photomask. Semiconductor manufacturing equipment equipped with the following features.

2. The rotating part is provided with a locking mechanism that allows or restricts rotation of the rotating part relative to the support recess, The semiconductor manufacturing apparatus according to claim 1, wherein when the determination unit determines that the ratio and the threshold have reached a predetermined relationship, the locking mechanism restricts the rotation of the rotating part relative to the support recess.

3. The fluid source is capable of supplying air as the fluid to the flow path and is capable of drawing in air present in the flow path. The semiconductor manufacturing apparatus according to claim 2, wherein the fluid source, which is the locking mechanism, applies negative pressure to the space of the support recess via the flow path, thereby pressing the rotating part against the support recess and restricting the rotation of the rotating part relative to the support recess.

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