Semiconductor processing system including a process module with an independently controllable exhaust assembly

The dual-chamber process module addresses throughput limitations in semiconductor processing by allowing simultaneous epitaxial deposition on multiple substrates with independent control, enhancing efficiency in high-temperature processes.

JP2026093360APending Publication Date: 2026-06-08ASM IP HLDG BV
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ASM IP HLDG BV
Filing Date
2025-11-21
Publication Date
2026-06-08

AI Technical Summary

Technical Problem

Existing semiconductor processing systems face limitations in throughput due to the time required for high-temperature epitaxial deposition processes, which affect substrate throughput and tool efficiency, especially in complex device structures with multiple layers.

Method used

A dual-chamber process module with independent chamber bodies and exhaust control is introduced, allowing simultaneous epitaxial deposition on multiple substrates within a common housing, featuring independent temperature and pressure control, and a cooling system to enhance throughput.

Benefits of technology

The dual-chamber process module increases substrate throughput by enabling parallel epitaxial deposition processes, improving efficiency and reducing the time required for high-temperature deposition.

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Abstract

A process module configured to perform simultaneous epitaxial deposition of material layers is disclosed. [Solution] The process module comprises a common chamber housing, within which two chamber bodies are arranged. Each chamber body includes a ceramic welded joint with an upper and lower wall, injection and exhaust chamber flanges, and an exhaust flange with inner and outer sealing surfaces. A cover plate forms a seal with the outer sealing surface of the exhaust flange. The module also features a pressure cylinder having a piston that applies compressive force between the exhaust flange and the injection chamber flange.
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