Connection structure and waveguide

Abstract

To provide a connection structure and waveguide that can improve characteristics. [Solution] According to the embodiment, the connection structure is provided between the first and second resonant parts. The connection structure includes a first structure. The first structure includes first and second conductive pillars, a first stripline, and a first partial conductive layer. The first conductive pillar includes a first part and a first other part and is oriented in a first direction. The second conductive pillar includes a second part and a second other part and is oriented in a first direction. The second direction from the second conductive pillar to the first conductive pillar intersects with the first direction. The direction from the first resonant part to the second resonant part is oriented in a second direction. The first stripline is electrically connected to the first other part and the second other part and is oriented in a second direction. The first partial conductive layer is electrically connected to the first part and the second part.

Description

Technical Field

[0001] Embodiments of the present invention relate to a connection structure and a waveguide.

Background Art

[0002] For example, in a high-frequency circuit, a connection structure and a waveguide are used. In the connection structure and the waveguide, improvement of characteristics is required.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of the present invention provide a connection structure and a waveguide capable of improving characteristics.

Means for Solving the Problems

[0005] According to an embodiment of the present invention, the connection structure is configured to be provided between a first resonance portion and a second resonance portion. The connection structure includes a first structure. The first structure includes a first conductive pillar, a second conductive pillar, a first strip line, and a first partial conductive layer. The first conductive pillar includes a first portion and a first other portion and extends along a first direction. The direction from the first portion to the first other portion is along the first direction. The second conductive pillar includes a second portion and a second other portion and extends along the first direction. The direction from the second portion to the second other portion is along the first direction. A second direction from the second conductive pillar to the first conductive pillar intersects the first direction. The direction from the first resonance portion to the second resonance portion is along the second direction. The first strip line is electrically connected to the first other portion and the second other portion and extends along the second direction. The first partial conductive layer is electrically connected to the first portion and the second portion. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a schematic transparent perspective view illustrating a connection structure according to the first embodiment. [Figure 2] Figure 2 is a schematic transparent plan view illustrating a connection structure according to the first embodiment. [Figure 3] Figure 3 is a schematic transparent side view illustrating a connection structure according to the first embodiment. [Figure 4] Figure 4 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. [Figure 5] Figure 5 is a schematic transparent perspective view illustrating the connection structure. [Figure 6] Figure 6 is a schematic diagram illustrating the simulation results. [Figure 7] Figure 7 is a schematic diagram illustrating the simulation results. [Figure 8] Figure 8 is a schematic diagram illustrating the simulation results. [Figure 9] Figure 9 is a schematic diagram illustrating the simulation results. [Figure 10] Figure 10 is a schematic transparent perspective view illustrating a connection structure according to the first embodiment. [Figure 11] Figure 11 is a schematic transparent plan view illustrating a connection structure according to the first embodiment. [Figure 12] Figure 12 is a schematic transparent side view illustrating a connection structure according to the first embodiment. [Figure 13] Figure 13 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. [Figure 14] Figure 14 is a schematic transparent plan view illustrating a connection structure in a reference example. [Figure 15] Figure 15 is a graph illustrating the characteristics of the connection structure in the reference example. [Figure 16] Figure 16 is a schematic transparent plan view illustrating the connection structure. [Figure 17]FIG. 17 is a schematic transparent plan view illustrating a connection structure. [Figure 18] FIG. 18 is a graph illustrating the characteristics of the connection structure according to the first embodiment. [Figure 19] FIG. 19 is a graph illustrating the characteristics of the connection structure according to the first embodiment. [Figure 20] FIG. 20 is a schematic cross-sectional view illustrating the connection structure according to the first embodiment. [Figure 21] FIG. 21 is a schematic cross-sectional view illustrating the connection structure according to the first embodiment. [Figure 22] FIG. 22 is a schematic cross-sectional view illustrating the connection structure according to the first embodiment. [Figure 23] FIG. 23 is a schematic transparent plan view illustrating the connection structure according to the second embodiment. [Figure 24] FIG. 24 is a schematic cross-sectional view illustrating the connection structure according to the second embodiment. [Figure 25] FIG. 25 is a schematic cross-sectional view illustrating the connection structure according to the second embodiment. [Figure 26] FIG. 26 is a schematic cross-sectional view illustrating the connection structure according to the second embodiment. [Figure 27] FIG. 27 is a schematic cross-sectional view illustrating the connection structure according to the second embodiment. [Figure 28] FIG. 28 is a schematic cross-sectional view illustrating the connection structure according to the second embodiment. [Figure 29] FIG. 29 is a schematic diagram illustrating the waveguide of the reference example. [Figure 30] FIG. 30 is a schematic diagram illustrating the waveguide of the reference example. [Figure 31] FIG. 31 is a schematic diagram illustrating the waveguide of the reference example. [Figure 32] FIG. 32 is a schematic diagram illustrating the resonator of the reference example. [Figure 33] FIG. 33 is a schematic diagram illustrating the characteristics of the resonator of the reference example. [Figure 34] FIG. 34 is a schematic transparent plan view illustrating the waveguide of the reference example. [Modes for carrying out the invention]

[0007] Embodiments of the present invention will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. In this specification and in each figure, elements similar to those described above are denoted by the same reference numerals with respect to previously shown figures, and detailed explanations are omitted as appropriate.

[0008] (First Embodiment) Figure 1 is a schematic transparent perspective view illustrating a connection structure according to the first embodiment. Figure 2 is a schematic transparent plan view illustrating a connection structure according to the first embodiment. Figure 3 is a schematic transparent side view illustrating a connection structure according to the first embodiment. Figure 4 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. As shown in Figures 1 to 4, the connection structure 110 according to this embodiment is provided between the first resonant section 50A and the second resonant section 50B.

[0009] For example, a first resonant section 50A is provided between the first waveguide section 58A and the second waveguide section 58B. A second resonant section 50B is provided between the first resonant section 50A and the second waveguide section 58B.

[0010] The connection structure 110 includes a first structure 11S. The first structure 11S includes a first conductive pillar 11, a second conductive pillar 12, and a first stripline 21. The first structure 11S may further include a first partial conductive layer 11L.

[0011] The first conductive pillar 11 is aligned with the first direction D1. The first direction D1 is defined as the Y-axis direction. One direction intersecting the Y-axis direction is defined as the Z-axis direction. The direction perpendicular to the Y-axis direction and the Z-axis direction is defined as the X-axis direction.

[0012] The second direction D2 from the second conductive pillar 12 to the first conductive pillar 11 intersects with the first direction D1. The second direction D2 may be, for example, the Z-axis direction. The direction from the first resonant section 50A to the second resonant section 50B follows the second direction D2.

[0013] In one example, a signal (e.g., an electromagnetic wave) supplied to the first waveguide 58A propagates to the second waveguide 58B via the first resonant section 50A, the connection structure 110, and the second resonant section 50B.

[0014] As shown in Figure 4, the first conductive pillar 11 includes a first portion 11a and a first other portion 11b. The direction from the first portion 11a to the first other portion 11b is along the first direction D1. In this example, the first conductive pillar 11 includes a first opposing portion 11A. The first other portion 11b is located between the first portion 11a and the first opposing portion 11A in the first direction D1.

[0015] The second conductive pillar 12 includes a second portion 12a and a second other portion 12b. The second conductive pillar 12 is aligned with the first direction D1. The direction from the second portion 12a to the second other portion 12b is aligned with the first direction D1.

[0016] The first stripline 21 is electrically connected to the first other portion 11b and the second other portion 12b. The first stripline 21 is aligned with the second direction D2. The first partial conductive layer 11L is electrically connected to the first portion 11a and the second portion 12a.

[0017] For example, a first conductive loop 15a is formed by a part of the first conductive pillar 11, the first stripline 21, the second conductive pillar 12, and the first partial conductive layer 11L. The part of the first conductive pillar 11 is the portion between the first portion 11a and the first other portion 11b. In the first conductive loop 15a, for example, the magnetic field in the connection structure 110 is canceled out. This allows the first resonant portion 50A and the second resonant portion 50B to be connected while suppressing coupling between them.

[0018] For example, in a resonator with a substrate integrated waveguide (SIW) structure, one possible example is to increase the number of rows of conductive pillars provided at the connecting parts in order to suppress coupling between multiple resonant sections. In this example, the overall size of the circuit increases because the number of rows of conductive pillars increases. In particular, in high-frequency circuit applications, the distance between two conductive layers in the SIW structure is increased to reduce losses. When the distance between two conductive layers increases, the conductive pillars connecting them become longer. If the conductive pillars are thin, manufacturing becomes difficult. If thick conductive pillars are used, manufacturing becomes easier, but the size increases.

[0019] In this embodiment, a portion of the first conductive pillar 11, a first stripline 21, a second conductive pillar 12, and a first partial conductive layer 11L are provided, which are electrically connected to each other. This cancels out the magnetic field in the connection structure 110. The first resonant section 50A and the second resonant section 50B are connected by a simple structure while suppressing coupling between them. According to this embodiment, a connection structure that can improve characteristics can be provided.

[0020] In this embodiment, coupling can be suppressed while keeping the circuit size from increasing. The connection structure 110 according to this embodiment can be applied to high-frequency circuits. For example, coupling can be suppressed while keeping losses down. According to this embodiment, a connection structure that can improve characteristics can be provided.

[0021] Thus, the connection structure 110 is provided between the first resonant section 50A and the second resonant section 50B. The connection structure 110 includes a first structure 11S which includes a first conductive loop 15a. The first conductive loop 15a is aligned with a first direction D1 and a second direction D2 which intersects the first direction D1. The direction from the first resonant section 50A to the second resonant section 50B is aligned with the second direction D2.

[0022] As shown in Figure 1, the first resonant portion 50A may include a first conductive layer 51, a first opposing conductive layer 51A, and a plurality of first resonant portion conductive pillars 51P. The direction from the first conductive layer 51 to the first opposing conductive layer 51A is along the first direction D1. The plurality of first resonant portion conductive pillars 51P electrically connect the first opposing conductive layer 51A to the first conductive layer 51.

[0023] The second resonant section 50B includes a second conductive layer 52, a second opposing conductive layer 52A, and a plurality of second resonant section conductive pillars 52P. The direction from the second conductive layer 52 to the second opposing conductive layer 52A is along the first direction D1. The plurality of second resonant section conductive pillars 52P electrically connect the second opposing conductive layer 52A to the second conductive layer 52.

[0024] Some of the multiple first resonant conductive pillars 51P are aligned along the second direction D2. Another part of the multiple first resonant conductive pillars 51P is aligned along the second direction D2. The direction from the above part of the multiple first resonant conductive pillars 51P to the above part of the multiple first resonant conductive pillars 51P is along the third direction D3. The third direction D3 intersects the plane containing the first direction D1 and the second direction D2. The third direction D3 may be, for example, the X-axis direction.

[0025] For example, the second conductive layer 52 may be configured to be electrically connected to the first conductive layer 51. The second opposing conductive layer 52A may be configured to be electrically connected to the first opposing conductive layer 51A. The second opposing conductive layer 52A may be continuous with the first opposing conductive layer 51A. The boundary between the second opposing conductive layer 52A and the first opposing conductive layer 51A may be unclear.

[0026] As shown in Figures 3 and 4, for example, the first partial conductive layer 11L may be configured to be continuous with the first conductive layer 51. The boundary between the first partial conductive layer 11L and the first conductive layer 51 may be unclear. The first partial conductive layer 11L may be configured to be continuous with the second conductive layer 52. The boundary between the first partial conductive layer 11L and the second conductive layer 52 may be unclear. In this way, the first partial conductive layer 11L may be electrically connected to the first conductive layer 51 included in the first resonant section 50A. The first partial conductive layer 11L may be electrically connected to the second conductive layer 52 included in the second resonant section 50B.

[0027] As shown in Figure 4, for example, a first substrate 81 and a second substrate 82 may be provided. A first conductive film, which will be a first conductive layer 51, a first partial conductive layer 11L, and a second conductive layer 52, may be provided on one surface of the first substrate 81. A second conductive film, which will be a first opposing conductive layer 51A and a second opposing conductive layer 52A, may be provided on one surface of the second substrate 82.

[0028] The first substrate 81 is provided between the first conductive film and the second substrate 82. The second substrate 82 is provided between the first substrate 81 and the second conductive film. A first stripline 21 is provided at a position between the first substrate 81 and the second substrate 82. The first stripline 21 may be provided on one of the surfaces of the first substrate 81 and the second substrate 82.

[0029] For example, the second conductive pillar 12 penetrates the first substrate 81 along the first direction D1. The first conductive pillar 11 penetrates the first substrate 81 and the second substrate 82 along the first direction D1. For example, the portion between the first portion 11a and the first other portion 11b penetrates the first substrate 81 along the first direction D1. For example, the portion between the first other portion 11b and the first opposing portion 11A penetrates the second substrate 82 along the first direction D1. The portion between the first portion 11a and the first other portion 11b, and the portion between the first other portion 11b and the first opposing portion 11A, may be formed separately and then electrically connected.

[0030] As shown in Figure 4, in this example, the first opposing portion 11A is configured to be electrically connected to the first opposing conductive layer 51A. The first opposing portion 11A is configured to be electrically connected to the second opposing conductive layer 52A.

[0031] As shown in Figures 1 and 2, a plurality of first structures 11S may be provided. A third direction D3 from one of the plurality of first structures 11S to another of the plurality of first structures 11S intersects a plane containing the first direction D1 and the second direction D2.

[0032] The connection structure 110 may further include a first connecting conductive layer 28. The first connecting conductive layer 28 is aligned with the third direction D3. The first connecting conductive layer 28 extends along the third direction D3. The first connecting conductive layer 28 electrically connects a plurality of first structures 11S.

[0033] Multiple first conductive loops 15a, based on multiple first structures 11S, are aligned along the third direction D3. The multiple first conductive loops 15a effectively cancel out the magnetic field. Coupling is effectively suppressed.

[0034] As shown in Figure 2, the length (width) of one of the multiple first resonant conductive pillars 51P along the second direction D2 is defined as length Lz1. In one example, length Lz1 is, for example, 0.1 mm or more and 1.0 mm or less (for example, 0.3 mm). Length Lz1 can be in any direction perpendicular to the first direction D1.

[0035] As shown in Figure 2, let distance Lz2 be the distance between one of the multiple first resonant conductive pillars 51P and another of the multiple first resonant conductive pillars 51P. The aforementioned one of the multiple first resonant conductive pillars 51P is adjacent to the aforementioned other of the multiple first resonant conductive pillars 51P in the second direction D2. In one example, distance Lz2 is, for example, between 0.1 mm and 1.0 mm (for example, 0.3 mm).

[0036] As shown in Figure 2, distance dw1 is defined as the distance along the third direction D3 between a row of multiple first resonant conductive pillars 51P aligned along the second direction D2 and another row of multiple first resonant conductive pillars 51P aligned along the second direction D2. In one example, distance dw1 is between 3 mm and 10.0 mm (for example, 4.99 mm).

[0037] The above description regarding the multiple first resonant conductive pillars 51P may also be applied to the multiple second resonant conductive pillars 52P.

[0038] As shown in Figure 3, the thickness of the first conductive layer 51 along the first direction D1 is defined as the first conductive layer thickness t51. The thickness of the first opposing conductive layer 51A along the first direction D1 is defined as the first opposing conductive layer thickness t51A. At least one of the first conductive layer thickness t51 and the first opposing conductive layer thickness t51A may be, for example, 5 μm or more and 50 μm or less (for example, 18 μm). The distance along the first direction D1 between the first conductive layer thickness t51 and the first opposing conductive layer thickness t51A is defined as distance dy1. In one example, distance dy1 is, for example, 0.5 mm or more and 4 mm or less (for example, 2 mm).

[0039] As shown in Figure 4, the length of the first conductive pillar 11 in the first direction D1 is denoted as the first length L1. The length of the second conductive pillar 12 in the first direction D1 is denoted as the second length L2. In this example, the first length L1 is longer than the second length L2. The first length L1 may be, for example, 1.1 times or more and 3 times or less of the second length L2. In this example, the first length L1 is, for example, substantially twice the second length L2. In one example, the second length L2 is, for example, 0.5 mm or more and 1.5 mm or less (for example, 1 mm).

[0040] As shown in Figure 4, the first distance d1 is the distance in the second direction D2 between the center of the first conductive pillar 11 in the second direction D2 (first center) and the center of the second conductive pillar 12 in the second direction D2 (second center). In one example, the first distance d1 may be between 0.7 mm and 1.2 mm. The wavelength of the signal propagating through the first resonant section 50A is denoted as wavelength λ. The first distance d1 may be, for example, between 0.07 and 0.12 times the wavelength λ. An example of the relationship between the first distance d1 and the characteristics will be described later.

[0041] As shown in Figure 2, the pitch pt1 is defined as the pitch of the multiple first structures 11S in the third direction D3. Pitch pt1 corresponds, for example, to the distance along the third direction D3 between the center of one of the multiple first conductive pillars 11 in the third direction D3 and the center of another of the multiple first conductive pillars 11 in the third direction D3. The aforementioned one of the multiple first conductive pillars 11 is adjacent to the aforementioned other one of the multiple first conductive pillars 11. Pitch pt1 may be, for example, between 0.3 mm and 1.1 mm. Pitch pt1 may be, for example, less than or equal to 0.11 times the wavelength λ of the signal propagating through the first resonant section 50A. An example of the relationship between pitch pt1 and characteristics will be described later.

[0042] As shown in Figures 1 and 2, the first resonant section 50A may include a plurality of third resonant conductive pillars 53P. The plurality of third resonant conductive pillars 53P are aligned along the third direction D3. The positions of the plurality of third resonant conductive pillars 53P in the second direction D2 are between the position of the first resonant conductive pillar 51P included in the first resonant section 50A in the second direction D2 and the position of the first waveguide section 58A in the third direction D3.

[0043] As shown in Figures 1 and 2, the second resonant section 50B may include a plurality of fourth resonant conductive pillars 54P. The plurality of fourth resonant conductive pillars 54P are aligned along the third direction D3. The positions of the plurality of fourth resonant conductive pillars 54P in the second direction D2 are between the position of the second resonant conductive pillar 52P included in the second resonant section 50B in the second direction D2 and the position of the second waveguide section 58B in the third direction D3.

[0044] The first waveguide section 58A may include a conductive layer continuous with the first conductive layer 51 and a conductive layer continuous with the first opposing conductive layer 51A. The first waveguide section 58A may include conductive pillars similar to the plurality of first resonant conductive pillars 51P included in the first resonant section 50A.

[0045] The second waveguide section 58B may include a conductive layer continuous with the second conductive layer 52 and a conductive layer continuous with the second opposing conductive layer 52A. The second waveguide section 58B may include conductive pillars similar to the plurality of second resonant conductive pillars 52P included in the second resonant section 50B.

[0046] As shown in Figure 1, for example, the resonant structure 210 according to the embodiment includes a first resonant section 50A, a second resonant section 50B, and a connecting structure 110.

[0047] The following describes an example of simulation results regarding the characteristics of the connection structure 110. Figure 5 is a schematic transparent perspective view illustrating the connection structure. Figure 5 shows a simulation model. In the simulation model, a conductive layer 11PX is provided instead of multiple first conductive pillars 11. The conductive layer 11PX is aligned with the XY plane. In the simulation model, two first structures 11S are provided, that is, two second conductive pillars 12 are provided. One of the two second conductive pillars 12 is electrically connected to the conductive layer 11PX by one of the two first striplines 21. The second conductive pillar 12, the first striplines 21, the conductive layer 11PX, and the first partial conductive layer 11L form one of the two first conductive loops 15a.

[0048] Figures 6 to 9 are schematic diagrams illustrating the simulation results. These figures show the magnetic field strength. In these figures, the magnetic field strength in the region of the bright image is higher than the magnetic field strength in the region of the dark image. Figure 6 corresponds to the characteristics of the ZY plane between the two first structures 11S. Figure 7 corresponds to the characteristics of the ZY plane containing one of the two first structures 11S. Figure 6 corresponds to the characteristics of the ZX plane (upper position in Figure 5) that does not contain the two first structures 11S. Figure 7 corresponds to the characteristics of the ZX plane containing the two first structures 11S.

[0049] As shown in Figures 6 to 9, the magnetic field strength is low inside the first conductive loop 15a. This is thought to be because the magnetic field generated by the current flowing through the multiple conductive members contained in the first conductive loop 15a acts to cancel out the magnetic field present in the first resonant section 50A.

[0050] For example, in the example in Figure 4, the direction of the current flowing in the portion between the first part 11a and the first other part 11b of the first conductive pillar 11 is opposite to the direction of the current flowing in the second conductive pillar 12. The direction of the current flowing in the first stripline 21 is opposite to the direction of the current flowing in the first partial conductive layer 11L. The magnetic fields based on these currents act to cancel out the magnetic field generated within the resonant region. This is thought to suppress coupling.

[0051] Figure 10 is a schematic transparent perspective view illustrating a connection structure according to the first embodiment. Figure 11 is a schematic transparent plan view illustrating a connection structure according to the first embodiment. Figure 12 is a schematic transparent side view illustrating a connection structure according to the first embodiment. Figure 13 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. As shown in Figures 10 to 13, in the connection structure 111 according to the embodiment, the first structure 11S includes the third conductive pillar 13. The configuration of the connection structure 111, excluding the pillar, may be the same as that of the connection structure 110.

[0052] The third conductive pillar 13 is aligned with the first direction D1. As shown in Figures 12 and 13, in this example, the first structure 11S includes a second partial conductive layer 12L.

[0053] As shown in Figure 13, the third conductive pillar 13 includes a third portion 13a and a third other portion 13b. The direction from the third portion 13a to the third other portion 13b is along the first direction D1. The direction from the first conductive pillar 11 to the third conductive pillar 13 is along the second direction D2. For example, the position of the first conductive pillar 11 in the second direction D2 (first position) is between the position of the second conductive pillar 12 in the second direction D2 (second position) and the position of the third conductive pillar 13 in the second direction D2 (third position).

[0054] The first stripline 21 is electrically connected to the second other portion 12b and, in addition to the second other portion 12b, to the third portion 13a.

[0055] The second partial conductive layer 12L is electrically connected to the first opposing portion 11A and the third other portion 13b. The second partial conductive layer 12L is configured to be electrically connected to the first opposing conductive layer 51A. The second partial conductive layer 12L is configured to be electrically connected to the second opposing conductive layer 52A. The second partial conductive layer 12L may be continuous with the first opposing conductive layer 51A. The boundary between the second partial conductive layer 12L and the first opposing conductive layer 51A may be unclear. The second partial conductive layer 12L may be continuous with the second opposing conductive layer 52A. The boundary between the second partial conductive layer 12L and the second opposing conductive layer 52A may be unclear. The first opposing conductive layer 51A, the second partial conductive layer 12L, and the second opposing conductive layer 52A may be a single continuous conductive layer.

[0056] In the connection structure 111, a second conductive loop 15b is formed by a part of the first conductive pillar 11, a part of the first stripline 21, a third conductive pillar 13, and a second partial conductive layer 12L. In the second conductive loop 15b, for example, the magnetic field in the connection structure 111 is canceled out. This allows the first resonant section 50A and the second resonant section 50B to be connected while further suppressing coupling between them.

[0057] In the connection structure 111, a plurality of first structures 11S, including a first conductive pillar 11, a second conductive pillar 12, and a third conductive pillar 13, may be provided. The plurality of first structures 11S are arranged along the third direction D3.

[0058] In the connection structure according to the embodiment (connection structure 110 or connection structure 111), for example, 2 × 10 -3 The following coupling coefficients can be obtained. According to the embodiment, for example, 1 × 10 -3 The following coupling coefficients are obtained.

[0059] Figure 14 is a schematic transparent plan view illustrating a connection structure in a reference example. As shown in Figure 14, the reference example connection structure 119 includes a plurality of conductive pillars 18 and does not include the first structure 11S described in relation to the embodiment. The plurality of conductive pillars 18 are arranged along the third direction D3. In the connection structure 119, neither the first conductive loop 15a nor the second conductive loop 15b is provided. In the connection structure 119, the first conductive layer 51 and the first opposing conductive layer 51A are electrically connected by the plurality of conductive pillars 18. The second conductive layer 52 and the second opposing conductive layer 52A are electrically connected by the plurality of conductive pillars 18.

[0060] Figure 15 is a graph illustrating the characteristics of the connection structure in the reference example. Figure 15 illustrates the simulation results of the characteristics of the connection structure 119. In this simulation, the distance dy1 (see Figure 3) between the first conductive layer 51 and the first opposing conductive layer 51A is 2 mm. The diameter of one of the multiple conductive pillars 18 is 0.6 mm. The distance between the multiple conductive pillars 18 is 0.6 mm. Figure 15 shows the transmission parameter S21 related to the transmission characteristics and the reflection parameter S11 related to the reflection characteristics. The horizontal axis of Figure 15 is frequency fr1.

[0061] As shown in Figure 15, in this example, the pass-through parameter S21 has a peak when the frequencies fr1 are 28.088 GHz and 28.154 GHz. At this frequency fr1, the reflection parameter S11 decreases locally. From the characteristics in Figure 15, the coupling coefficient is 2.34 × 10⁻⁶. -3 This is calculated. According to this embodiment, a lower coupling coefficient is obtained than in the reference example.

[0062] The following describes an example of the simulation results of the characteristics in the embodiment. Figures 16 and 17 are schematic transparent plan views illustrating the connection structure. As shown in Figure 16, the structure of the connection structure 111 is symmetrical with respect to an axis (the dashed line in Figures 16 and 17) that passes through the midpoint of the first conductive pillar 11 and the second conductive pillar 12 and is aligned with the second direction D2.

[0063] As shown in Figure 16, in this embodiment, the distance in the second direction D2 between the center of the first conductive pillar 11 in the second direction D2 (first center) and the center of the second conductive pillar 12 in the second direction D2 (second center) is defined as the first distance d1. As shown in Figure 17, the pitch of the multiple first structures 11S in the third direction D3 is defined as pitch pt1. Pitch pt1 corresponds to the pitch of the multiple first conductive pillars 11 in the third direction D3.

[0064] The following describes examples of simulation results for characteristics when the first distance d1 or pitch pt1 is changed. In the simulation model, the distance dy1 (see Figure 3) between the first conductive layer 51 and the first opposing conductive layer 51A is 2 mm. The diameters of the first conductive pillar 11, the second conductive pillar 12, and the third conductive pillar 13 are 0.3 mm each.

[0065] Figure 18 is a graph illustrating the characteristics of the connection structure according to the first embodiment. In Figure 18, the horizontal axis represents the first distance d1, and the vertical axis represents the coupling coefficient CC1. In Figure 18, the pitch pt1 is 1 mm. As shown in Figure 18, a low coupling coefficient CC1 is obtained when the first distance d1 is between approximately 0.72 mm and 1.23 mm. For example, in this range, the coupling coefficient CC1 is 1 × 10⁻⁶. -3 The following applies:

[0066] Figure 19 is a graph illustrating the characteristics of the connection structure according to the first embodiment. In Figure 19, the horizontal axis represents the pitch pt1, and the vertical axis represents the coupling coefficient CC1. In Figure 19, the first distance d1 is 1 mm. As shown in Figure 19, a low coupling coefficient CC1 is obtained when the pitch pt1 is approximately 1.09 mm or less. For example, in this range, the coupling coefficient CC1 is 1 × 10⁻⁶. -3 The following applies:

[0067] In the simulations shown in Figures 18 and 19, the wavelength λ of the signal propagating through the first resonant section 50A is 10 mm. The wavelength λ corresponds to the waveguide wavelength. From the results in Figure 18, it is preferable that the first distance d1 is between 0.07 and 0.12 times the wavelength λ. From the results in Figure 19, it is preferable that the pitch pt1 is 0.11 times or less the wavelength λ. A low coupling coefficient CC1 can be effectively obtained.

[0068] The following describes some examples of connection structures according to the first embodiment. Figure 20 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. As shown in Figure 20, in the connection structure 112 according to the embodiment, the first conductive pillar 11 includes a first intermediate portion 11c and a first opposing portion 11A, in addition to the first portion 11a and the first other portion 11b. The configuration of the connection structure 112, excluding these, may be the same as that of the connection structure 111.

[0069] The first other portion 11b is located between the first portion 11a and the first opposing portion 11A in the first direction D1. The first intermediate portion 11c is located between the first other portion 11b and the first opposing portion 11A in the first direction D1.

[0070] The first structure 11S includes a third conductive pillar 13 aligned with a first direction D1, a second stripline 22, and a second partial conductive layer 12L. The third conductive pillar 13 includes a third portion 13a and a third other portion 13b. The direction from the third portion 13a to the third other portion 13b is aligned with the first direction D1. The direction from the first conductive pillar 11 to the third conductive pillar 13 is aligned with the second direction D2.

[0071] For example, the position of the first conductive pillar 11 in the second direction D2 (first position) lies between the position of the second conductive pillar 12 in the second direction D2 (second position) and the position of the third conductive pillar 13 in the second direction D2 (third position).

[0072] The second stripline 22 is electrically connected to the first intermediate portion 11c and the third portion 13a, and extends along the second direction D2.

[0073] The second partial conductive layer 12L is electrically connected to the first opposing portion 11A and the third other portion 13b. The second partial conductive layer 12L is configured to be electrically connected to the first opposing conductive layer 51A. The second partial conductive layer 12L is electrically connected to the second opposing conductive layer 52A.

[0074] The second partial conductive layer 12L may be continuous with the first opposing conductive layer 51A. The second partial conductive layer 12L may be continuous with the second opposing conductive layer 52A. The boundary between the second partial conductive layer 12L and the first opposing conductive layer 51A may be unclear. The boundary between the second partial conductive layer 12L and the second opposing conductive layer 52A may be unclear.

[0075] In the connection structure 112, a first conductive loop 15a and a second conductive loop 15b are provided. The magnetic fields cancel each other out. The first resonant section 50A and the second resonant section 50B can be connected while suppressing coupling between the first resonant section 50A and the second resonant section 50B.

[0076] In the connection structure 112, a third base 83 may be provided in addition to the first base 81 and the second base 82.

[0077] Figure 21 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. As shown in Figure 21, in the connection structure 113 according to this embodiment, a third conductive pillar 13 and a fourth conductive pillar 14 are provided. The configuration of the connection structure 113, excluding these, may be the same as that of the connection structure 112.

[0078] In the connection structure 113, the first structure 11S includes a third conductive pillar 13, a fourth conductive pillar 14, a second stripline 22, and a second partial conductive layer 12L. The third conductive pillar 13 and the fourth conductive pillar 14 are aligned with the first direction D1.

[0079] The third conductive pillar 13 includes a third portion 13a and a third other portion 13b. The direction from the third portion 13a to the third other portion 13b is along the first direction D1. The fourth conductive pillar 14 includes a fourth portion 14a and a fourth other portion 14b. The direction from the fourth portion 14a to the fourth other portion 14b is along the first direction D1. The direction from the fourth conductive pillar 14 to the third conductive pillar 13 is along the second direction D2.

[0080] The second stripline 22 is electrically connected to the third portion 13a and the fourth portion 14a. The second portion conductive layer 12L is electrically connected to the third other portion 13b and the fourth other portion 14b.

[0081] The second partial conductive layer 12L is configured to be electrically connected to the first opposing conductive layer 51A. The second partial conductive layer 12L is electrically connected to the second opposing conductive layer 52A.

[0082] The second partial conductive layer 12L may be continuous with the first opposing conductive layer 51A. The second partial conductive layer 12L may be continuous with the second opposing conductive layer 52A. The boundary between the second partial conductive layer 12L and the first opposing conductive layer 51A may be unclear. The boundary between the second partial conductive layer 12L and the second opposing conductive layer 52A may be unclear.

[0083] In the connection structure 112, a first conductive loop 15a and a second conductive loop 15b are provided. The magnetic fields cancel each other out. The first resonant section 50A and the second resonant section 50B can be connected while suppressing coupling between the first resonant section 50A and the second resonant section 50B.

[0084] In the connection structure 113, the position of the first conductive pillar 11 in the second direction D2 (first position) lies between the position of the second conductive pillar 12 in the second direction D2 (second position) and the position of the third conductive pillar 13 in the second direction D2 (third position). The fourth position of the fourth conductive pillar 14 in the second direction D2 lies between the second position and the third position.

[0085] The distance d14 between the first conductive pillar 11 and the fourth conductive pillar 14 may be, for example, 1 / 10 or less of the length L11 along the first direction D1 of the first conductive pillar 11. The distance d14 may be, for example, 1 / 10 or less of the first distance d1. As already explained, the first distance d1 is the distance in the second direction D2 between the center of the first conductive pillar 11 in the second direction D2 (first center) and the center of the second conductive pillar 12 in the second direction D2 (second center). The distance d14 may be, for example, 1 / 4 or less of the wavelength λ of the signal propagating through the first resonant section 50A. The distance d14 may be, for example, 1 / 10 or less of the wavelength λ.

[0086] Figure 22 is a schematic cross-sectional view illustrating a connection structure according to the first embodiment. As shown in Figure 22, in the connection structure 114 according to the embodiment, the first conductive pillar 11 includes a first intermediate portion 11c and a second intermediate portion 11d. The configuration of the connection structure 114, excluding these, may be the same as that of the connection structure 111 and the like.

[0087] In the connection structure 114, the connection structure 114 is provided between the first resonant portion 50A and the second resonant portion 50B. The connection structure 114 includes a first structure 11S. The first structure 11S includes a first conductive pillar 11, a second conductive pillar 12, a first stripline 21, and a second stripline 22.

[0088] The first conductive pillar 11 includes a first portion 11a, a first other portion 11b, a first intermediate portion 11c, and a second intermediate portion 11d. The first conductive pillar 11 is aligned with a first direction D1. The direction from the first portion 11a to the first other portion 11b is aligned with the first direction D1. The first intermediate portion 11c is located between the first portion 11a and the first other portion 11b in the first direction D1. The second intermediate portion 11d is located between the first intermediate portion 11c and the first other portion 11b in the first direction D1.

[0089] The second conductive pillar 12 includes a second portion 12a and a second other portion 12b. The second conductive pillar 12 is aligned with the first direction D1. The direction from the second portion 12a to the second other portion 12b is aligned with the first direction D1. The second direction D2 from the second conductive pillar 12 to the first conductive pillar 11 intersects with the first direction D1. The direction from the first resonant portion 50A to the second resonant portion 50B is aligned with the second direction D2.

[0090] The first stripline 21 is electrically connected to the second portion 12a and the first intermediate portion 11c and lies along the second direction D2. The second stripline 22 is electrically connected to the second other portion 12b and the second intermediate portion 11d and lies along the second direction D2.

[0091] In the connection structure 114, the first conductive pillar 11, the second conductive pillar 12, the first stripline 21, and the second stripline 22 form a first conductive loop 15a. The magnetic fields are canceled out. The first resonant section 50A and the second resonant section 50B can be connected while suppressing coupling between them.

[0092] For example, the first conductive pillar 11 is configured to be electrically connected to the first conductive layer 51 included in the first resonant section 50A. For example, the first conductive pillar 11 is configured to be electrically connected to the second conductive layer 52 included in the second resonant section 50B. The first conductive pillar 11 is electrically connected to the first opposing conductive layer 51A. The first conductive pillar 11 is electrically connected to the second opposing conductive layer 52A.

[0093] (Second Embodiment) Figure 23 is a schematic transparent plan view illustrating a connection structure according to the second embodiment. Figure 24 is a schematic cross-sectional view illustrating a connection structure according to the second embodiment. As shown in Figures 23 and 24, the waveguide 220 according to the embodiment includes a first conductive layer 51, a second conductive layer 52, a plurality of first waveguide conductive pillars 61P, a plurality of second waveguide conductive pillars 62P, and a plurality of first structures 11S.

[0094] The direction from the first conductive layer 51 to the second conductive layer 52 is along the first direction D1. Multiple first waveguide conductive pillars 61P are electrically connected to the first conductive layer 51 and the second conductive layer 52. Multiple second waveguide conductive pillars 62P are electrically connected to the first conductive layer 51 and the second conductive layer 52. Multiple first waveguide conductive pillars 61P and multiple second waveguide conductive pillars 62P are along the first direction D1.

[0095] The direction from multiple first waveguide conductive pillars 61P to multiple second waveguide conductive pillars 62P follows the second direction D2, which intersects the first direction D1. The multiple first waveguide conductive pillars 61P are aligned along the third direction D3. The third direction D3 intersects the plane containing the first direction D1 and the second direction D2. The multiple second waveguide conductive pillars 62P are aligned along the third direction D3. The multiple first structures 11S are aligned along the third direction D3.

[0096] One of the multiple first structures 11S includes a first conductive pillar 11, a second conductive pillar 12, and a first stripline 21.

[0097] The first conductive pillar 11 includes a first portion 11a and a first other portion 11b. The first conductive pillar 11 is aligned with a first direction D1. The direction from the first portion 11a to the first other portion 11b is aligned with the first direction D1.

[0098] The second conductive pillar 12 includes a second portion 12a and a second other portion 12b. The second conductive pillar 12 is aligned with the first direction D1. The direction from the second portion 12a to the second other portion 12b is aligned with the first direction D1. The direction from the second conductive pillar 12 to the first conductive pillar 11 is aligned with the second direction D2.

[0099] The first stripline 21 is electrically connected to the first other portion 11b and the second other portion 12b. The first stripline 21 is aligned with the second direction D2. The first conductive pillar 11 is electrically connected to at least one of the first conductive layer 51 and the second conductive layer 52.

[0100] In waveguide 220, the region between the multiple first waveguide conductive pillars 61P and the multiple first structures 11S functions as a first waveguide 51W. The region between the multiple second waveguide conductive pillars 62P and the multiple first structures 11S functions as a second waveguide 52W. Signals (e.g., electromagnetic waves) propagate through these waveguides along a third direction D3. The isolation structure 120, which includes the multiple first structures 11S, has the function of isolating these waveguides.

[0101] In the waveguide 220, a first conductive loop 15a is formed by the second conductive pillar 12, a part of the first conductive pillar 11, the first stripline 21, and a part of the first conductive layer 51. Coupling in multiple waveguides is suppressed. According to this embodiment, a waveguide with improved characteristics can be provided.

[0102] In the waveguide 220, the second conductive pillar 12 may be electrically connected to at least one of the first conductive layer 51 and the second conductive layer 52.

[0103] In this example, one of the multiple first structures 11S includes a third conductive pillar 13. The third conductive pillar 13 includes a third portion 13a and a third other portion 13b. The direction from the third portion 13a to the third other portion 13b is along the first direction D1. The first conductive pillar 11 includes a first opposing portion 11A. The first stripline 21 is further electrically connected to the third portion 13a. The third other portion 13b is electrically connected to the second conductive layer 52.

[0104] The third conductive pillar 13, a portion of the first conductive pillar 11, the first stripline 21, and a portion of the second conductive layer 52 form the second conductive loop 15b. Coupling in the multiple waveguides is further suppressed. According to this embodiment, a waveguide with improved characteristics can be provided.

[0105] Figures 25 to 28 are schematic cross-sectional views illustrating a connection structure according to the second embodiment. As shown in Figure 25, the waveguide 221 may include the configuration described with respect to the connection structure 110. The configuration of the waveguide 221, excluding this, may be the same as the configuration of the waveguide 220.

[0106] As shown in Figure 26, the waveguide 222 may include the configuration described with respect to the connection structure 112. The configuration of the waveguide 222, excluding this, may be the same as the configuration of the waveguide 220.

[0107] As shown in Figure 27, waveguide 223 may include the configuration described with respect to connection structure 113. The configuration of waveguide 223 other than this may be the same as the configuration of waveguide 220.

[0108] As shown in Figure 28, the waveguide 224 may include the configuration described with respect to the connection structure 114. The configuration of the waveguide 224, excluding this, may be the same as the configuration of the waveguide 220.

[0109] In embodiments, at least one of the first conductive pillar 11, the second conductive pillar 12, the third conductive pillar 13, and the fourth conductive pillar 14 may contain a metal. The metal may include, for example, at least one selected from the group consisting of copper, silver, aluminum, and gold.

[0110] At least one of the first resonant section conductive pillar 51P, the second resonant section conductive pillar 52P, the third resonant section conductive pillar 53P, the fourth resonant section conductive pillar 54P, the first waveguide conductive pillar 61P, and the second waveguide conductive pillar 62P may contain the above-mentioned metal.

[0111] A conductive pillar may be formed, for example, by filling a conductive material into a hole provided in a substrate. For example, a conductive pillar may be obtained by a method such as plating.

[0112] At least one of the first conductive layer 51, the first opposing conductive layer 51A, the second conductive layer 52, and the second opposing conductive layer 52A may contain the above-mentioned metal.

[0113] The first substrate 81, the second substrate 82, and the third substrate 83 may contain a dielectric. At least one of these substrates may contain at least one selected from the group consisting of oxides, glass cloth, and resins. The oxide may include, for example, aluminum oxide. The resin may include, for example, PTFE. At least one of the thickness and dielectric constant of the first substrate 81, the second substrate 82, and the third substrate 83 may differ from one another.

[0114] Figures 29 to 31 are schematic diagrams illustrating example waveguides. Figure 29 is a transparent perspective view. Figure 30 is a transparent plan view. Figure 31 is a transparent side view. These figures illustrate an SIW waveguide. In the SIW resonator, a first conductive layer 51, a first opposing conductive layer 51A, and a plurality of conductive pillars 65P are provided. The plurality of conductive pillars 65P are aligned along the second direction D2.

[0115] Figure 32 is a schematic diagram illustrating an example of a resonator. As shown in Figure 32, the SIW structure is provided with rows containing multiple conductive pillars 66P aligned along the third direction D3. By shortening the distance between the rows in the second direction D2, the SIW structure functions as a resonator.

[0116] Figure 33 is a schematic diagram illustrating the characteristics of a reference example resonator. As shown in Figure 33, the characteristics of the resonator illustrated in Figure 32 are illustrated when the distance between the first conductive layer 51 and the first opposing conductive layer 51A is varied. The horizontal axis is the distance dy1 (see Figure 31) along the first direction D1 between the thickness t51 of the first conductive layer and the thickness t51A of the first opposing conductive layer. The vertical axis is the no-load Q value.

[0117] As shown in Figure 33, the no-load Q value increases as the distance dy1 increases. For example, increasing the distance dy1 can reduce losses in an SIW resonator. However, in an SIW structure with a long distance dy1, the conductive pillars 65P become longer, making manufacturing difficult. In a configuration with a long distance dy1, one possible method to easily form the conductive pillars 65P is to increase the diameter of the conductive pillars 65P and the pitch of the multiple conductive pillars 65P. However, in this case, unwanted coupling or unwanted radiation is more likely to occur between the multiple resonators.

[0118] Figure 34 is a schematic transmission plan view illustrating a reference example waveguide. As shown in Figure 34, multiple rows are provided, each containing multiple conductive pillars 66P aligned along the third direction D3. It is believed that increasing the number of rows can reduce unwanted coupling or radiation as described above. However, increasing the number of rows of conductive pillars 66P will increase the size of the circuit.

[0119] In the embodiment, by applying the first structure 11S described above, it is possible to suppress unwanted coupling and radiation while keeping the circuit small. In the above example, in an embodiment where the conductive loop (such as the first conductive loop 15a) is along a plane including the first direction D1 and the second direction D2, for example, the conductive loop may be along a plane that is inclined with respect to the plane including the first direction D1 and the second direction D2. The angle of inclination may be, for example, 45 degrees or less.

[0120] The embodiments may include the following technical proposals. (Technical proposal 1) A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure, The first structure is, A first conductive pillar comprising a first part and a first other part and along a first direction, wherein the direction from the first part to the first other part is along the first direction, and the first conductive pillar is A second conductive pillar comprising a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, the second direction from the second conductive pillar to the first conductive pillar intersects the first direction, and the direction from the first resonant part to the second resonant part is along the second direction, A first stripline electrically connected to the first other part and the second other part and along the second direction, A first partial conductive layer electrically connected to the first and second portions, A connection structure that includes this.

[0121] (Technical proposal 2) The connection structure according to Technical Proposal 1, wherein the first partial conductive layer is electrically connected to the first conductive layer included in the first resonant portion.

[0122] (Technical proposal 3) The first resonant portion includes a first conductive layer, a first opposing conductive layer, and a plurality of first resonant portion conductive pillars. The direction from the first conductive layer to the first opposing conductive layer is along the first direction, The plurality of first resonant conductive pillars electrically connect the first opposing conductive layer to the first conductive layer, The second resonant portion includes a second conductive layer, a second opposing conductive layer, and a plurality of second resonant portion conductive pillars. The direction from the second conductive layer to the second opposing conductive layer is along the first direction, The plurality of second resonant conductive pillars electrically connect the second opposing conductive layer to the second conductive layer, The connection structure according to Technical Proposal 1, wherein the first partial conductive layer is configured to be continuous with the first conductive layer.

[0123] (Technical proposal 4) The first conductive pillar includes a first opposing portion, The aforementioned first other portion is located between the first portion and the first opposing portion in the first direction. The connection structure according to technical proposal 3, wherein the first opposing portion is configured to be electrically connected to the first opposing conductive layer.

[0124] (Technical proposal 5) The first structure is, A third conductive pillar along the first direction, The second partial conductive layer, It further includes, The third conductive pillar includes a third part and a third other part, The direction from the third part to the other third part is along the first direction, The direction from the first conductive pillar to the third conductive pillar is along the second direction, The first stripline is further electrically connected to the third portion, The second partial conductive layer is electrically connected to the first opposing portion and the third other portion. The connection structure according to Technical Proposal 4, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

[0125] (Technical proposal 6) The first conductive pillar includes a first intermediate portion and a first opposing portion, The aforementioned first other portion is located between the first portion and the first opposing portion in the first direction. The first intermediate portion is located between the first other portion and the first opposing portion in the first direction. The first structure is, A third conductive pillar along the first direction, The second stripline and The second partial conductive layer, It further includes, The third conductive pillar includes a third part and a third other part, The direction from the third part to the other third part is along the first direction, The direction from the first conductive pillar to the third conductive pillar is along the second direction, The second stripline is electrically connected to the first intermediate portion and the third portion, and extends along the second direction. The second partial conductive layer is electrically connected to the first opposing portion and the third other portion. The connection structure according to Technical Proposal 3, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

[0126] (Technical proposal 7) The first structure is, A third conductive pillar along the first direction, A fourth conductive pillar along the first direction, The second stripline and The second partial conductive layer, It further includes, The third conductive pillar includes a third part and a third other part, The direction from the third part to the other third part is along the first direction, The fourth conductive pillar includes a fourth part and a fourth other part, The direction from the fourth part to the other fourth part is along the first direction, The direction from the fourth conductive pillar to the third conductive pillar is along the second direction, The second stripline is electrically connected to the third and fourth portions, The second partial conductive layer is electrically connected to the third and fourth other parts. The connection structure according to Technical Proposal 3, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

[0127] (Technical proposal 8) The first position of the first conductive pillar in the second direction is between the second position of the second conductive pillar in the second direction and the third position of the third conductive pillar in the second direction. The fourth position of the fourth conductive pillar in the second direction is located between the second position and the third position. The connection structure according to Technical Proposal 7, wherein the distance between the first conductive pillar and the fourth conductive pillar is 1 / 10 or less the length of the first conductive pillar along the first direction.

[0128] (Technical proposal 9) A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure, The first structure is, A first conductive pillar comprising a first part, a first other part, a first intermediate part, and a second intermediate part, and extending along a first direction, wherein the direction from the first part to the first other part is along the first direction, the first intermediate part is located between the first part and the first other part in the first direction, and the second intermediate part is located between the first intermediate part and the first other part in the first direction, the first conductive pillar and A second conductive pillar comprising a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, the second direction from the second conductive pillar to the first conductive pillar intersects the first direction, and the direction from the first resonant part to the second resonant part is along the second direction, A first stripline electrically connected to the second portion and the first intermediate portion and along the second direction, A second stripline electrically connected to the second other portion and the second intermediate portion and along the second direction, A connection structure that includes this.

[0129] (Technical proposal 10) The connection structure according to Technical Proposal 9, wherein the first conductive pillar is configured to be electrically connected to the first conductive layer included in the first resonant portion.

[0130] (Technical proposal 11) Multiple first structures are provided, A connection structure according to any one of the technical proposals 1 to 10, wherein the third direction from one of the plurality of first structures to another of the plurality of first structures intersects a plane including the first direction and the second direction.

[0131] (Technical proposal 12) Further comprising a first connecting conductive layer, The first connecting conductive layer is along the third direction, The connection structure according to technical proposal 11, wherein the first connecting conductive layer electrically connects the plurality of first structures.

[0132] (Technical proposal 13) The connection structure according to Technical Proposal 11 or 12, wherein the pitch of the plurality of first structures in the third direction is 0.11 times or less the wavelength of the signal propagating through the first resonant part.

[0133] (Technical proposal 14) The connection structure according to any one of Technical Proposals 1 to 13, wherein the first distance in the second direction between the first center of the first conductive pillar in the second direction and the second center of the second conductive pillar in the second direction is 0.07 times or more and 0.12 times or less the wavelength of the signal propagating through the first resonant part.

[0134] (Technical proposal 15) The first position of the first conductive pillar in the second direction is between the second position of the second conductive pillar in the second direction and the third position of the third conductive pillar in the second direction. The fourth position of the fourth conductive pillar in the second direction is located between the second position and the third position. The connection structure according to Technical Proposal 7, wherein the distance between the first conductive pillar and the fourth conductive pillar is 1 / 4 or less of the wavelength of the signal propagating through the first resonant part.

[0135] (Technical proposal 16) Some of the plurality of first resonant conductive pillars are arranged along the second direction, Another portion of the plurality of first resonant conductive pillars is aligned along the second direction, The connection structure according to Technical Proposal 3, wherein the direction from one part of the plurality of first resonant conductive pillars to another part of the plurality of first resonant conductive pillars is along a third direction that intersects a plane including the first direction and the second direction.

[0136] (Technical proposal 17) The second conductive layer is configured to be electrically connected to the first conductive layer, The connection structure according to Technical Proposal 3, wherein the second opposing conductive layer is configured to be electrically connected to the first opposing conductive layer.

[0137] (Technical proposal 18) A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure including a first conductive loop, The first conductive loop is along a first direction and a second direction intersecting the first direction, The connection structure is such that the direction from the first resonant section to the second resonant section is along the second direction.

[0138] (Technical proposal 19) First conductive layer and A second conductive layer, wherein the direction from the first conductive layer to the second conductive layer is along the first direction, A plurality of first waveguide conductive pillars electrically connected to the first conductive layer and the second conductive layer, A plurality of second waveguide conductive pillars electrically connected to the first conductive layer and the second conductive layer, Multiple first structures, Equipped with, The direction from the plurality of first waveguide conductive pillars to the plurality of second waveguide conductive pillars is along the second direction intersecting the first direction, The plurality of first waveguide conductive pillars are arranged along a third direction that intersects a plane including the first and second directions. The plurality of second waveguide conductive pillars are arranged along the third direction, The plurality of first structures are arranged along the third direction, One of the plurality of first structures is A first conductive pillar comprising a first part and a first other part and along the first direction, wherein the direction from the first part to the first other part is along the first direction, and the first conductive pillar is A second conductive pillar comprising a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, and the direction from the second conductive pillar to the first conductive pillar is along the second direction, A first stripline electrically connected to the first other part and the second other part and along the second direction, Includes, A waveguide in which the first conductive pillar is electrically connected to at least one of the first conductive layer and the second conductive layer.

[0139] (Technical proposal 20) The waveguide according to Technical Proposal 19, wherein the second conductive pillar is electrically connected to at least one of the first conductive layer and the second conductive layer.

[0140] According to the embodiment, a connection structure and waveguide that can improve characteristics are provided.

[0141] Embodiments of the present invention have been described above with reference to examples. However, the present invention is not limited to these examples. For example, the specific configuration of each element such as conductive layers, conductive pillars, striplines, and substrates included in the connection structure or waveguide is included within the scope of the present invention as long as those skilled in the art can appropriately select from the known scope to implement the present invention in a similar manner and obtain similar effects.

[0142] Combinations of two or more elements from each example, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention.

[0143] All connection structures and waveguides that a person skilled in the art can implement by appropriately modifying the design based on the connection structure and waveguide described above as embodiments of the present invention also fall within the scope of the present invention, insofar as they encompass the gist of the present invention.

[0144] Within the scope of the concept of this invention, a person skilled in the art would be able to conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of this invention.

[0145] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0146] 11-14: 1st-4th conductive pillars, 11A: 1st opposing section, 11L, 12L: 1st and 2nd partial conductive layers, 11PX: conductive layer, 11S: 1st structure, 11a-14a: 1st-4th sections, 11b-14b: 1st-4th other sections, 11c: 1st intermediate section, 11d: 2nd intermediate section, 15a, 15b: 1st and 2nd conductive loops, 18: conductive pillar, 21, 22: 1st and 2nd striplines, 28: 1st connecting conductive layer, 50A, 50B: 1st and 2nd resonant sections, 51, 52: 1st and 2nd conductive layers, 51A, 52A: 1st and 2nd opposing conductive layers, 51P-54P: 1st-4th resonant section conductive pillars, 51W, 52W: First and second waveguides, 58A, 58B: First and second waveguide sections, 61P, 62P: First and second waveguide conductive pillars, 65P, 66P: Conductive pillars, 81-83: First to third substrates, 110-114, 119: Connection structure, 120: Separation structure, 210: Resonant structure, 220-224: Waveguides, CC1: Coupling coefficient, D1-D3: First to third directions, L1, L2: First and second lengths, Lz1: Length, Lz2: Distance, Q: Unloaded Q value, S11: Reflection parameter, S21: Through-parameter parameter, d1: First distance, d14, dw1, dy1: Distance, fr1: Frequency, pt1: Pitch, t51: Thickness of the first conductive layer, t51A: Thickness of the first opposing conductive layer

Claims

1. A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure, The first structure is, A first conductive pillar including a first part and a first other part, along a first direction, wherein the direction from the first part to the first other part is along the first direction, and the first conductive pillar is along the first direction. A second conductive pillar including a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, the second direction from the second conductive pillar to the first conductive pillar intersects the first direction, and the direction from the first resonant part to the second resonant part is along the second direction, A first stripline electrically connected to the first other part and the second other part and along the second direction, A first partial conductive layer electrically connected to the first and second portions, A connection structure that includes this.

2. The connection structure according to claim 1, wherein the first partial conductive layer is electrically connected to the first conductive layer included in the first resonant portion.

3. The first resonant portion includes a first conductive layer, a first opposing conductive layer, and a plurality of first resonant portion conductive pillars. The direction from the first conductive layer to the first opposing conductive layer is along the first direction, The plurality of first resonant conductive pillars electrically connect the first opposing conductive layer to the first conductive layer, The second resonant portion includes a second conductive layer, a second opposing conductive layer, and a plurality of second resonant portion conductive pillars. The direction from the second conductive layer to the second opposing conductive layer is along the first direction, The plurality of second resonance conductive pillars electrically connect the second opposing conductive layer to the second conductive layer, The connection structure according to claim 1, wherein the first partial conductive layer is configured to be continuous with the first conductive layer.

4. The first conductive pillar includes a first opposing portion, The first other portion is located between the first portion and the first opposing portion in the first direction. The connection structure according to claim 3, wherein the first opposing portion is configured to be electrically connected to the first opposing conductive layer.

5. The first structure is, A third conductive pillar along the first direction, The second partial conductive layer, It further includes, The third conductive pillar includes a third portion and a third other portion, The direction from the third part to the other third part is along the first direction, The direction from the first conductive pillar to the third conductive pillar is along the second direction, The first stripline is further electrically connected to the third portion, The second partial conductive layer is electrically connected to the first opposing portion and the third other portion. The connection structure according to claim 4, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

6. The first conductive pillar includes a first intermediate portion and a first opposing portion, The first other portion is located between the first portion and the first opposing portion in the first direction. The first intermediate portion is located between the first other portion and the first opposing portion in the first direction. The first structure is, A third conductive pillar along the first direction, The second stripline and The second partial conductive layer, It further includes, The third conductive pillar includes a third portion and a third other portion, The direction from the third part to the other third part is along the first direction, The direction from the first conductive pillar to the third conductive pillar is along the second direction, The second stripline is electrically connected to the first intermediate portion and the third portion, and extends along the second direction. The second partial conductive layer is electrically connected to the first opposing portion and the third other portion. The connection structure according to claim 3, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

7. The first structure is, A third conductive pillar along the first direction, A fourth conductive pillar along the first direction, The second stripline and The second partial conductive layer, It further includes, The third conductive pillar includes a third portion and a third other portion, The direction from the third part to the other third part is along the first direction, The fourth conductive pillar includes a fourth part and a fourth other part, The direction from the fourth part to the other fourth part is along the first direction, The direction from the fourth conductive pillar to the third conductive pillar is along the second direction, The second stripline is electrically connected to the third and fourth portions, The second partial conductive layer is electrically connected to the third and fourth other parts. The connection structure according to claim 3, wherein the second partial conductive layer is configured to be electrically connected to the first opposing conductive layer.

8. The first position of the first conductive pillar in the second direction is located between the second position of the second conductive pillar in the second direction and the third position of the third conductive pillar in the second direction. The fourth position of the fourth conductive pillar in the second direction is located between the second position and the third position. The connection structure according to claim 7, wherein the distance between the first conductive pillar and the fourth conductive pillar is 1 / 10 or less the length of the first conductive pillar along the first direction.

9. A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure, The first structure is, A first conductive pillar comprising a first part, a first other part, a first intermediate part, and a second intermediate part, and extending along a first direction, wherein the direction from the first part to the first other part is along the first direction, the first intermediate part is located between the first part and the first other part in the first direction, and the second intermediate part is located between the first intermediate part and the first other part in the first direction, the first conductive pillar, A second conductive pillar including a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, the second direction from the second conductive pillar to the first conductive pillar intersects the first direction, and the direction from the first resonant part to the second resonant part is along the second direction, A first stripline electrically connected to the second portion and the first intermediate portion and along the second direction, A second stripline electrically connected to the second other portion and the second intermediate portion and along the second direction, A connection structure that includes this.

10. The connection structure according to claim 9, wherein the first conductive pillar is configured to be electrically connected to the first conductive layer included in the first resonant portion.

11. Multiple first structures are provided, The connection structure according to any one of claims 1 to 10, wherein the third direction from one of the plurality of first structures to another of the plurality of first structures intersects a plane including the first direction and the second direction.

12. Further comprising a first connecting conductive layer, The first connecting conductive layer is aligned along the third direction, The connection structure according to claim 11, wherein the first connecting conductive layer electrically connects the plurality of first structures.

13. The connection structure according to claim 11, wherein the pitch of the plurality of first structures in the third direction is 0.11 times or less the wavelength of the signal propagating through the first resonant portion.

14. The connection structure according to any one of claims 1 to 10, wherein the first distance in the second direction between the first center of the first conductive pillar in the second direction and the second center of the second conductive pillar in the second direction is 0.07 times or more and 0.12 times or less the wavelength of the signal propagating through the first resonant portion.

15. The first position of the first conductive pillar in the second direction is located between the second position of the second conductive pillar in the second direction and the third position of the third conductive pillar in the second direction. The fourth position of the fourth conductive pillar in the second direction is located between the second position and the third position. The connection structure according to claim 7, wherein the distance between the first conductive pillar and the fourth conductive pillar is 1 / 4 or less of the wavelength of the signal propagating through the first resonant portion.

16. Some of the plurality of first resonant conductive pillars are arranged along the second direction, Another portion of the plurality of first resonant conductive pillars is arranged along the second direction, The connection structure according to claim 3, wherein the direction from one part of the plurality of first resonant conductive pillars to another part of the plurality of first resonant conductive pillars is along a third direction that intersects a plane including the first direction and the second direction.

17. The second conductive layer is configured to be electrically connected to the first conductive layer, The connection structure according to claim 3, wherein the second opposing conductive layer is configured to be electrically connected to the first opposing conductive layer.

18. A connecting structure configured to be provided between a first resonant section and a second resonant section, The aforementioned connection structure comprises a first structure including a first conductive loop, The first conductive loop is along a first direction and a second direction intersecting the first direction, The connection structure is such that the direction from the first resonant section to the second resonant section is along the second direction.

19. First conductive layer and A second conductive layer, wherein the direction from the first conductive layer to the second conductive layer is along the first direction, A plurality of first waveguide conductive pillars electrically connected to the first conductive layer and the second conductive layer, A plurality of second waveguide conductive pillars electrically connected to the first conductive layer and the second conductive layer, Multiple first structures, Equipped with, The direction from the plurality of first waveguide conductive pillars to the plurality of second waveguide conductive pillars is along the second direction intersecting the first direction. The plurality of first waveguide conductive pillars are arranged along a third direction that intersects a plane including the first and second directions. The plurality of second waveguide conductive pillars are arranged along the third direction, The plurality of first structures are arranged along the third direction, One of the plurality of first structures is A first conductive pillar comprising a first part and a first other part and along the first direction, wherein the direction from the first part to the first other part is along the first direction, and the first conductive pillar is A second conductive pillar comprising a second part and a second other part, along the first direction, wherein the direction from the second part to the second other part is along the first direction, and the direction from the second conductive pillar to the first conductive pillar is along the second direction, A first stripline electrically connected to the first other part and the second other part and along the second direction, Includes, A waveguide in which the first conductive pillar is electrically connected to at least one of the first conductive layer and the second conductive layer.

20. The waveguide according to claim 19, wherein the second conductive pillar is electrically connected to at least one of the first conductive layer and the second conductive layer.

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